Proposed is a hybrid communication device which enables multiple indoor and outdoor communications in association with an access point (AP) without a separate network construction. The proposed device is a hybrid communication device connected to an access point, the hybrid communication device comprising: a first communication module which receives a first signal from an external device by using a first communication scheme and transmits the received first signal to the access point by using the first communication scheme; a second communication module which receives a second signal from the external device by using a second communication scheme and transmits the received second signal to the access point by using the second communication scheme; and a third communication module which receives a third signal from the external device by using a third communication scheme and transmits the received third signal to the access point by using the third communication scheme, wherein the hybrid communication device is in the form of a USB-type dongle.
The present invention relates to a wireless power supply device for a vehicle seat, capable of wirelessly supplying power to a vehicle seat that is moved along a moving line. The wireless power supply device for a vehicle seat, according to the present invention, comprises: a pair of rail frames having a first opening formed so that a seat connection portion connected to a vehicle seat can move linearly; a motor coupled to the seat connection portion and installed to allow linear movement within the rail frames; a wireless power transmission board fixed to the inside of the rail frames and comprising a plurality of transmission coils connected to a power supply inside a vehicle to wirelessly transmit power; a wireless power reception board which is disposed at a position opposite to the wireless power transmission board, comprises a plurality of reception coils for receiving power wirelessly transmitted from the transmission coils, and linearly moves in conjunction with the motor, wherein the wireless power transmission board and the wireless power reception board are installed perpendicularly to the bottom surface of the rail frames, at positions horizontally spaced apart from the motor.
B60N 2/02 - Sièges spécialement adaptés aux véhicules; Agencement ou montage des sièges dans les véhicules le siège ou l'une de ses parties étant mobile, p.ex. réglable
B60R 16/03 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique
3.
INJECTION-MOLDING-TYPE MAGNETIC FIELD SHIELDING MEMBER AND WIRELESS POWER RECEPTION MODULE COMPRISING SAME
An injection-molding-type magnetic field shielding member is provided. The injection-molding-type magnetic field shielding member according to one embodiment of the present invention comprises: a base part including an arrangement hole that penetrates the center so as to have a predetermined area; a ring-shaped first shielding part, which protrudes a predetermined height from the base part along the edge of the arrangement hole; and an antenna accommodation part which is defined by one surface of the first shielding part and one surface of the base part, and which is formed on the one surface of the base part in the circumferential direction of the first shielding part, wherein the base part and the first shielding part can be integrated through injection molding by using any one material from among ferrite powder, sandust, and nano-grain alloy powder.
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H01F 27/36 - Blindages ou écrans électriques ou magnétiques
H01F 1/03 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité
H01F 1/10 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs substances non métalliques, p.ex. ferrites
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p.ex. ferrites
H02J 50/90 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la détection ou l'optimisation de la position, p.ex. de l'alignement
4.
AIRBAG SYSTEM FOR VEHICLE AND OPERATING METHOD THEREOF
Disclosed are an airbag system for a vehicle and an operating method thereof. Disclosed is the airbag system of a vehicle, including an airbag module, the system comprising: a transmitting unit main module that, in response to receiving an airbag operating signal, generates information for generating a second voltage different from a first voltage to be supplied to other electronic components of a vehicle seat excluding the airbag module and outputs the generated information; a power transmitting unit that receives the information, converts power from a vehicle battery into an electric signal indicating the second voltage on the basis of the received information, and wirelessly transmits same; and a power receiving unit that wirelessly receives the electric signal indicating the second voltage, generates airbag driving power on the basis of the wirelessly received electric signal, and supplies the airbag driving power to the airbag module to operate the airbag module.
B60R 21/017 - Circuits électriques pour déclencher le fonctionnement des dispositions de sécurité en cas d'accident, ou d'accident imminent, de véhicule comportant des dispositions pour alimenter les dispositions de sécurité en courant électrique
B60R 16/033 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique caractérisé par l'utilisation de cellules électriques ou de batteries
B60R 21/01 - Circuits électriques pour déclencher le fonctionnement des dispositions de sécurité en cas d'accident, ou d'accident imminent, de véhicule
A wireless power transmission system is provided. The wireless power transmission system, according to an embodiment of the present invention, comprises: a transmission unit including a first shielding sheet and an antenna for transmitting wireless power, which is arranged on one surface of the first shielding sheet; and a reception unit including a second shielding sheet and an antenna for receiving wireless power, which is arranged on one surface of the second shielding sheet to face the antenna for transmitting wireless power, wherein the antenna for transmitting wireless power may include a first transmission antenna portion arranged on one surface of a first horizontal portion and a second transmission antenna portion arranged on one surface of a first wing portion, and the antenna for receiving wireless power may include a first reception antenna portion arranged on one surface of a second horizontal portion to face the first transmission antenna portion and a second reception antenna portion arranged on one side of a second wing portion to face the second transmission antenna portion.
H02J 50/00 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H01F 27/36 - Blindages ou écrans électriques ou magnétiques
A wireless power transmission module is provided. The wireless power transmission module, according to an embodiment of the present invention, comprises: a wireless power transmission antenna for transmitting wireless power; a shielding member that is made of a ferrite material to shield a magnetic field generated from the wireless power transmission antenna and includes an accommodation groove drawn in from one surface to a certain depth to accommodate the wireless power transmission antenna; and a separation prevention member that is provided in the shielding member to prevent a portion of the shielding member surrounding the outer edge of the wireless power transmission antenna, which is arranged in the accommodation groove while forming the accommodation groove, from being separated from the shielding member.
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H01F 27/36 - Blindages ou écrans électriques ou magnétiques
H01F 1/10 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs substances non métalliques, p.ex. ferrites
H02J 50/90 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la détection ou l'optimisation de la position, p.ex. de l'alignement
C09J 1/00 - Adhésifs à base de constituants inorganiques
C09J 7/00 - Adhésifs sous forme de films ou de pellicules
7.
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
The present invention relates to a ceramic substrate unit and a manufacturing method therefor. The ceramic substrate unit comprises: a ceramic substrate having metal layers on the upper and lower surfaces of the ceramic substrate; a heat dissipation spacer bonded to the upper metal layer of the ceramic substrate; and a heat sink bonded to the lower metal layer of the ceramic substrate, wherein the heat dissipation spacer is provided with an electrode in a region to which a semiconductor chip is bonded, so that the semiconductor chip may be bonded in the form of a flip chip.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
8.
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
The present invention relates to a phased array antenna module. The phased array antenna module comprises: a package antenna having a plurality of patch antennas formed on an upper surface thereof; and a substrate having the package antenna mounted thereon and having a connection pattern electrically connected to the package antenna, wherein the package antenna includes a plurality of package antennas. The plurality of package antennas are arranged on the top surface of the substrate in a 2N × 2N array arrangement and are mounted without a gap by making one side surface come into contact with each other. N is a natural number. The present invention has advantages capable of providing a high yield, and replacing only a corresponding portion when a defect occurs, and stably implementing a fast speed of 5G due to a low dielectric constant, and a low loss material and structure.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01Q 3/26 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante
10.
WIRELESS POWER TRANSMISSION SYSTEM AND KITCHEN APPLIANCE ACCESSORIES COMPRISING SAME
A wireless power transmission system is provided. A wireless power transmission system according to one embodiment of the present invention comprises: a first power transmission unit including a first shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a first coil wound a plurality of times in the longitudinal direction of the first shielding sheet so as to encompass the outer circumferential surface of the first shielding sheet; and a second power transmission unit including a second shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a second coil wound a plurality of times in the longitudinal direction of the second shielding sheet so as to encompass the inner circumferential surface of the second shielding sheet, wherein any one of the first coil and the second coil is a transmission coil for transmitting wireless power, and the other one is a reception coil for receiving wireless power, and the first power transmission unit and the second power transmission unit can perform wireless power transmission in a state in which the first power transmission unit is inserted into the second shielding sheet.
H02J 50/00 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H02J 50/10 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif
H02J 50/80 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre l’échange de données, concernant l’alimentation ou la distribution d’énergie électrique, entre les dispositifs de transmission et les dispositifs de réception
Provided is a magnetic field shielding module for an electric vehicle. The magnetic field shielding module for an electric vehicle according to an embodiment of the present invention is utilized in a wireless power transmission module for an electric vehicle, and comprises: a shielding layer including a plurality of unit blocks which are made of ferrite materials so as to be able to block a magnetic field generated from a flat coil in which a conductive member is wound multiple times; and a coil accommodation groove recessed to a certain depth from one surface of the shielding layer so as to be able to accommodate the thickness of the flat coil. The shielding layer is formed in a plate shape having a certain area by arranging the plurality of unit blocks adjacent to each other. At least some of the plurality of unit blocks include unit accommodation grooves for accommodating a portion of the flat coil, and the unit accommodation grooves respectively formed in the at least some of the unit blocks may be connected to each other in a state in which the plurality of unit blocks are arranged adjacent to each other, and thereby form the coil accommodation groove having a shape corresponding to the flat coil.
H01F 27/36 - Blindages ou écrans électriques ou magnétiques
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
A magnetic field shielding module for an electric vehicle is provided. A magnetic field shielding module for an electric vehicle according to an embodiment of the present invention may comprise: a main shielding layer including a plurality of unit blocks made of a ferrite material to shield a magnetic field generated from a planar coil in which a conductive member is wound multiple times, the main shielding layer being formed in a plate shape having a predetermined area by the plurality of unit blocks arranged adjacent to each other; and an auxiliary shielding layer made of a magnetic material containing a metal component to supplement the main shielding layer, disposed on one surface of the main shielding layer, and including a penetrating portion formed in a shape corresponding to that of the planar coil.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre eux; Fixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
The present invention pertains to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same. By forming a protruding electrode integrated with an electrode pattern, the ceramic substrate can improve electrical conductivity when bonded to an electrode of a semiconductor device, can stably convert rated voltage and current while eliminating electrical hazards that can occur during wire bonding, and can improve reliability and efficiency when used in high power applications.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
14.
DATA LOGGER DEVICE CAPABLE OF CHECKING ABNORMAL CONDITIONS OF LOGISTICS
A data logger device capable of checking abnormal conditions of logistics is provided. According to an embodiment of the present invention, a data logger device capable of checking abnormal conditions of logistics is arranged outside the logistics, and may periodically store internal state information of the logistics and display whether or not abnormal conditions have occurred within the logistics, the device comprising: a temperature sensor mounted on one side of a flexible circuit board to measure the internal temperature of the logistics; a temperature label arranged around the temperature sensor and irreversibly changed in color in response to the internal temperature of the logistics; a circuit unit which is mounted on the flexible circuit board to drive the temperature sensor, store information measured by the temperature sensor, and transmit the stored information to the outside; a power supply unit which supplies driving power to the circuit unit; and a cover member which prevents exposure of the flexible printed circuit board, the circuit unit, and the power supply unit to the outside.
G06Q 10/08 - Logistique, p.ex. entreposage, chargement ou distribution; Gestion d’inventaires ou de stocks
G01K 11/12 - Mesure de la température basée sur les variations physiques ou chimiques, n'entrant pas dans les groupes , , ou utilisant le changement de couleur, de translucidité ou de réflectance
G01K 1/024 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres pour l’indication à distance
H01M 50/284 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports comprenant l’insertion de cartes de circuits, p.ex. de cartes de circuits imprimés
The present invention relates to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same, the power module electrically connecting, by means of a conductive spacer, an electrode of a semiconductor device and a metal layer pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk factors, which may be generated during wire bonding, and increasing reliability and efficiency when used with high power.
A heat-dissipating magnetic field shielding sheet is provided. A magnetic field shielding sheet according to an embodiment of the present invention is implemented by including: a plurality of magnetic layers having at least one eddy current reduction pattern unit formed thereon; and a heat-dissipating magnetic field shielding unit including heat-dissipating adhesive members arranged between adjacent magnetic layers to improve the heat transfer in the thickness direction of the magnetic field shielding unit. By the magnetic field shielding sheet, the occurrence of eddy currents can be reduced, a high magnetic permeability of 2000 or more can be implemented while having a very thin thickness, and eddy currents that increase by selectively forming an eddy current reduction pattern locally in the area corresponding to the antenna among the entire area and the heat generated by the increase in eddy currents due to the thinner thickness according to the recent trend of being light, thin, short and miniaturized and the resulting decrease in resistance can be quickly discharged to the outside.
H01F 27/36 - Blindages ou écrans électriques ou magnétiques
H01F 1/14 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriés; Emploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages
H01F 27/22 - Refroidissement par conduction de chaleur à travers des éléments de remplissage solides ou en poudre
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01Q 1/22 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets
H01Q 1/52 - Moyens pour réduire le couplage entre les antennes; Moyens pour réduire le couplage entre une antenne et une autre structure
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p.ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
Disclosed in the present disclosure is an antenna module for positioning, capable of measuring omnidirectional (that is, the X direction, Y direction and Z direction) positions while resolving shaded areas. The disclosed antenna module for positioning comprises a pair of transmission/reception antennas and a pair of reception antennas arranged to be orthogonal to each other, wherein: a UWB positioning signal is transmitted through one of the pair of transmission/reception antennas; a first UWB reception signal is received through one of the pair of reception antennas; a second UWB reception signal is received through the other one of the pair of transmission/reception antennas; and the position of an object to be measured is measured on the basis of the first and second UWB reception signals.
H01Q 3/24 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier l'orientation, par commutation de l'énergie fournie, d'un élément actif rayonnant à un autre, p.ex. pour commutation du lobe
G01S 13/06 - Systèmes déterminant les données relatives à la position d'une cible
G01S 13/02 - Systèmes utilisant la réflexion d'ondes radio, p.ex. systèmes du type radar primaire; Systèmes analogues
18.
ELECTROMAGNETIC WAVE- AND MAGNETIC FIELD-ABSORBING-AND-SHIELDING SHEET, AND ELECTRONIC DEVICE COMPRISING SAME
An electromagnetic wave- and magnetic field-absorbing-and-shielding sheet is provided. An electromagnetic wave- and magnetic field-absorbing-and-shielding sheet according to one embodiment of the present invention is implemented by comprising: a plurality of magnetic layers stacked in order to block electromagnetic waves and magnetic fields; and an electromagnetic wave- and magnetic field-absorbing-and-shielding unit, which is arranged between the adjacent magnetic layers so as to absorb electromagnetic waves that have transmitted the magnetic layers or are reflected from the magnetic layers, and includes an electromagnetic wave-absorbing adhesive member for fixing the adjacent magnetic layers. Therefore, together with an electromagnetic wave- and magnetic field-shielding function, the present invention has a function of enabling most of the electromagnetic waves reflected during shielding to be absorbed to minimize influence on surrounding electronic components, electronic devices, or a user of the electronic devices, caused by the electromagnetic waves reflected during shielding and the magnetic field shielding, and thus can be widely applied to various electronic devices and the like.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenne; Combinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
19.
UWB ANTENNA AND BLE ANTENNA PERFORMANCE TEST SYSTEM
Disclosed is an antenna performance test system for testing the performance of a UWB antenna and a BLE antenna by reflecting a loss of a cable without changing test conditions. The disclosed antenna performance test system comprises a tester, which: responds to an input of a first test mode setting signal so as to output, to a first antenna, a fist test signal, which is a UWB band signal, and then generate a UWB communication performance measurement value of a test terminal on the basis of a first response signal received from the first antenna and a second antenna with respect to the first test signal; and responds to an input of a second test mode setting signal so as to output, to the first antenna, a second test signal, which is a BLE band signal, and then generate a BLE communication performance measurement value of the test terminal on the basis of a second response signal received from the first antenna with respect to the second test signal.
The present invention relates to a heatsink-integrated ceramic substrate and a method for manufacturing same, the heatsink-integrated ceramic substrate comprising: a ceramic substrate including metal layers on the upper and lower surfaces of a ceramic base; and a heatsink bonded to one surface of a metal layer, wherein the heatsink may include a flat portion having one surface in contact with the metal layer, and a plurality of heat dissipation fins formed to protrude from the other surface of the flat portion to be spaced apart from each other and contacting a liquid-type refrigerant.
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
A voice processing device for generating translation results for voices of speakers is disclosed. The voice processing device comprises: a microphone for generating voice signals associated with voices of speakers in response to the voices of the speakers; a memory for storing location-language information indicating languages corresponding to sound source locations of the voices of the speakers; and a processor which uses the voice signals and the location-language information so as to generate translation results obtained by translating the languages of the voices of each speaker, and which uses the translation results so as to generate translation conference minutes including the voice contents of each speaker expressed in different languages.
The present invention relates to a ceramic substrate and a manufacturing method thereof, the ceramic substrate comprising: a ceramic base material; a first metal sheet attached to an upper portion of the ceramic base material and provided in the form of a circuit pattern; and a second metal sheet attached to a lower portion of the ceramic base material. The second metal sheet may include a flat portion in contact with the lower surface of the ceramic base material and a plurality of heat dissipation fins that are spaced apart from each other and protrude from a lower portion of the flat portion, wherein the heat dissipation fins are in contact with a liquid refrigerant.
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/40 - Supports ou moyens de fixation pour les dispositifs de refroidissement ou de chauffage amovibles
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a silicon carbide (SiC) surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H02N 13/00 - Embrayages ou dispositifs de maintien utilisant l'attraction électrostatique, p.ex. utilisant l'effet Johnson-Rahbek
B23Q 3/15 - Dispositifs pour tenir les pièces magnétiquement ou électriquement
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H05B 3/14 - Eléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
H05B 3/28 - Eléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p.ex. plaques chauffantes non flexibles le conducteur chauffant enrobé dans un matériau isolant
The present invention relates to a power module comprising: a base plate; a ceramic substrate bonded to the top surface of the base plate; a semiconductor chip bonded to the top surface of the ceramic substrate; a spacer bonded to the top surface of the ceramic substrate so as to be spaced apart from the semiconductor chip; a connection pin provided at an electrode layer formed on the top surface of the spacer; and a wire bonding for connecting a terminal of the semiconductor chip to the electrode layer of the spacer.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
25.
SYSTEM FOR CONTROLLING FLOOR-TYPE PEDESTRIAN SIGNALS
The present invention provides a plurality of floor-type pedestrian signals, in which a control signal and voltage control power are applied, the voltage control power is converted into constant current power in each floor-type pedestrian signal, and the constant current power is applied to an LED array according to the control signal. Through this, the present invention prevents the brightness of the floor-type pedestrian signal from lowering as the distance from a controller increases, and maintains a constant lighting time of the plurality of floor-type pedestrian signals, so that even if the width of a crosswalk increases, the visibility of the floor-type pedestrian signal is kept constant.
E01F 9/615 - Aménagement des panneaux de signalisation routière ou des signaux de trafic routier; Dispositions pour imposer la prudence Éléments dressés, p.ex. poteaux indicateurs ou balises de signalisation; Supports pour les panneaux de signalisation routière spécialement adaptés à des fins de signalisation particulières, p.ex. pour indiquer des virages, des travaux sur la route ou des passages pour piétons éclairés
The present invention relates to a laser diode package comprising: a ceramic substrate (110) formed in a cube shape; and a laser diode (120) mounted on one surface of the ceramic substrate (110), wherein the ceramic substrate (110) is mounted on a base circuit board (130) such that the light output direction of the laser diode (120) is vertical. The present invention has the advantage of increased efficiency, reduced number of processes and reducible size.
The present invention relates to an inverter power module, comprising: a ceramic substrate (110); an LTCC substrate (120) disposed to be spaced apart from the upper portion of the ceramic substrate (110); and a semiconductor chip (130) having a lower surface bonded to a metal pattern (112) on the upper surface of the ceramic substrate (110) and an upper surface bonded to an external electrode (123) of the LTCC substrate (120). The present invention has the advantage of being able to provide an inverter power module having improved functions and operational reliability by applying a ceramic substrate and an LTCC substrate.
H02M 7/00 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continu; Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif
H02M 7/44 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif sans possibilité de réversibilité par convertisseurs statiques
Disclosed is a voice processing apparatus for processing voices of a plurality of speakers. The voice processing apparatus comprises: a microphone configured to generate voice signals in response to the voices of the plurality of speakers; a communication circuit configured to transmit and receive data; memory; and a processor, wherein the processor, on the basis of instructions stored in the memory, performs sound source separation of the voice signals on the basis of sound source positions of each of the voices, generates separate voice signals associated with each of the voices according to the sound source separation, determines output modes corresponding to the sound source positions of each of the voices, and uses the communication circuit to output the separate voice signals according to the determined output modes.
H04R 1/24 - Combinaisons structurelles de transducteurs séparés ou de parties du même transducteur et sensibles respectivement à plusieurs bandes de fréquences
H04R 1/40 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en combinant plusieurs transducteurs identiques
An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H02N 13/00 - Embrayages ou dispositifs de maintien utilisant l'attraction électrostatique, p.ex. utilisant l'effet Johnson-Rahbek
B23Q 3/15 - Dispositifs pour tenir les pièces magnétiquement ou électriquement
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H05B 3/14 - Eléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
H05B 3/26 - Eléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p.ex. plaques chauffantes non flexibles le conducteur chauffant monté sur une base isolante
According to the present invention: in order to track an accurate location of an asset, an asset location, which is a location of an asset terminal installed in the asset to be tracked, is measured; a relative location of the asset terminal, which is based on a reference terminal, is measured through communication between the reference terminal and the asset terminal; and the asset location is corrected using the relative location. Based on this, the present invention minimizes a measurement error of an asset location, compared to a scheme of measuring an asset location by using only GPS communication.
G01S 5/02 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de position; Localisation par coordination de plusieurs déterminations de distance utilisant les ondes radioélectriques
G01S 5/00 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de position; Localisation par coordination de plusieurs déterminations de distance
G01S 19/24 - Acquisition ou poursuite des signaux émis par le système
G01S 13/02 - Systèmes utilisant la réflexion d'ondes radio, p.ex. systèmes du type radar primaire; Systèmes analogues
G01S 13/76 - Systèmes utilisant la reradiation d'ondes radio, p.ex. du type radar secondaire; Systèmes analogues dans lesquels des signaux de type pulsé sont transmis
H04W 4/029 - Services de gestion ou de suivi basés sur la localisation
The present invention provides a floor-type walking signal device for installation in which the device is buried in the ground between a road and a sidewalk, comprising a reflector having a plurality of reflective surfaces respectively corresponding to a plurality of LED elements. The present invention can prevent the luminance from being lowered by using the reflector, even if the distance between light-exiting surfaces and the LED elements is relatively long, and can improve the luminance uniformity on the light exit surfaces.
E01F 9/615 - Aménagement des panneaux de signalisation routière ou des signaux de trafic routier; Dispositions pour imposer la prudence Éléments dressés, p.ex. poteaux indicateurs ou balises de signalisation; Supports pour les panneaux de signalisation routière spécialement adaptés à des fins de signalisation particulières, p.ex. pour indiquer des virages, des travaux sur la route ou des passages pour piétons éclairés
F21S 8/00 - Dispositifs d'éclairage destinés à des installations fixes
Proposed is a radar antenna to which detachable modules including one or more antennas are coupled. The proposed radar antenna comprises: a first detachable module in which one or more antennas are formed; and a second detachable module in which one or more antennas are formed, wherein a first side surface of the second detachable module is bonded to a first side surface of the first detachable module.
Provided are a magnetic field shielding sheet and a wireless power transmission module including same. The magnetic field shielding sheet according to an embodiment of the present invention is attached to a wireless power transmission antenna and a wireless communication antenna, and comprises: a shielding part made of a magnetic material so as to be able to shield against a magnetic field; and at least one eddy current-reducing pattern part which is formed in the shielding part to increase the resistance of the shielding part and thereby reduce the generation of eddy currents. The eddy current-reducing pattern part includes: a first eddy current-reducing pattern part that intersects with both the wireless power transmission antenna and the wireless communication antenna; and a second eddy current-reducing pattern part that intersects with the wireless communication antenna.
The present invention suggests a radar antenna in which a rounded edge surface is formed in a receiving hole formed by an antenna body and a shielding frame. The suggested radar antenna comprises: an antenna body having a plurality of first slots formed on a first surface thereof; and a shielding frame through which reception holes for receiving the plurality of first slots are formed, the reception holes being arranged on the first surface of the antenna body to receive the plurality of first slots, wherein a corner at which the inner wall surface of the shielding frame is connected to the first surface of the antenna body is formed to have a round structure.
The present invention relates to a power module and a manufacturing method therefor, the power module using a conductive spacer to electrically connect an electrode of a semiconductor chip and an electrode pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk elements, which can be generated during wire bonding, and increasing reliability and efficiency when used with high power.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
36.
COIL MANUFACTURING APPARATUS AND COIL MANUFACTURING SYSTEM COMPRISING SAME
A coil manufacturing apparatus is provided. The coil manufacturing apparatus according to an embodiment of the present invention comprises: a wire mounting part having an outer circumferential surface on which a wire can be wound; a first winding plate part rotatably supporting the wire mounting part; a second winding plate part disposed opposite to the first winding plate part; and a pressure part disposed between the first winding plate part and the second winding plate part and pressing the wire toward the wire mounting part while the wire is wound on the wire mounting part.
The present invention relates to a method of manufacturing a power module. The method involves joining a base plate and a ceramic substrate by brazing while pressing same with an upper jig and a lower jig, and thus can suppress bending, improve joint reliability, and increase heat dissipation.
Provided are a magnetic field shielding sheet and a manufacturing method therefor. The magnetic field shielding sheet, according to one embodiment of the present invention, comprises: a sheet main body formed from a magnetic material so as to be capable of shielding a magnetic field; a first protection layer disposed so as to cover one surface of the sheet main body; a second protection layer disposed so as to cover the other surface, opposite from the one surface, of the sheet main body; a third protection layer interposed between the first protection layer and the second protection layer so as to cover the side surface of the sheet main body in the thickness direction of the sheet main body; and a sealing part formed on the side portion of the sheet main body so that the sheet main body is sealed, wherein a stepped portion formed between the sheet main body and the sealing part is reduced by means of the third protection layer.
The present invention relates to a power module and a method for producing same, in which the bottom electrode layer of a ceramic substrate is inserted into recesses of a base plate, and, with the ceramic substrate stacked on the base plate, adhesion via brazing is carried out, thus improving adhesion reliability, preventing flexure, and provides highly efficient heat dissipation.
H01L 25/11 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
An electrostatic chuck is provided. An electrostatic chuck according to one embodiment of the present invention is implemented by comprising a silicon nitride sintered body and an electrostatic electrode embedded in the silicon nitride sintered body. Therefore, the present invention includes a ceramic sintered body, which is silicon nitride, to have excellent plasma resistance, chemical resistance and thermal shock resistance while exhibiting heat dissipation performance of a level equivalent or similar to that of an aluminum nitride ceramic sintered body, which has been conventionally and widely used, and thus can be widely used in a semiconductor process.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H02N 13/00 - Embrayages ou dispositifs de maintien utilisant l'attraction électrostatique, p.ex. utilisant l'effet Johnson-Rahbek
B23Q 3/15 - Dispositifs pour tenir les pièces magnétiquement ou électriquement
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H05B 3/14 - Eléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
H05B 3/28 - Eléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p.ex. plaques chauffantes non flexibles le conducteur chauffant enrobé dans un matériau isolant
41.
ELECTROSTATIC CHUCK SHEET AND ELECTROSTATIC CHUCK COMPRISING SAME
Disclosed is an electrostatic chuck sheet included in an electrostatic chuck for chucking a substrate by using electrostatic force. The electrostatic chuck sheet comprises: a first dielectric layer comprising a polymer material; a first electrode layer, which is arranged on the first dielectric layer and comprises first electrodes made of a conductive metal material; a second electrode layer, which is arranged on the second electrode layer and comprises second electrodes made of a conductive metal material; an interlayer dielectric layer, which is arranged between the first electrode layer and the second electrode layer and comprises a polymer material; and a protective layer, which is arranged on the second electrode layer and comprises a polymer material, wherein the first electrodes and the second electrodes are arranged so as not to overlap each other in the direction perpendicular to the electrostatic chuck sheet.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H02N 13/00 - Embrayages ou dispositifs de maintien utilisant l'attraction électrostatique, p.ex. utilisant l'effet Johnson-Rahbek
B23Q 3/15 - Dispositifs pour tenir les pièces magnétiquement ou électriquement
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
Provided is a wireless ear module having a UWB antenna to easily obtain location information of a wireless ear module case and ear modules. The wireless ear module comprises: ear modules for receiving and playing a sound source signal from an electronic device; and a case comprising an upper housing and a lower housing which are rotatably coupled, and for storing the ear modules. The ear modules and/or the case transmit a location positioning signal, and the location positioning signal is a signal for sensing the distance and direction from the electronic device to the ear modules or the case.
Proposed is an antenna module in which a partial area, which overlaps with a magnet mounted on an antenna sheet, of the entire area of a shielding sheet is punched out to prevent the shielding sheet from being magnetically saturated (magnetized) by the magnet. The proposed antenna module comprises: the antenna sheet having a radiation pattern formed thereon and having a magnet array formed along the outer circumference of the radiation pattern inserted thereinto; and the shielding sheet laminated on the antenna sheet, and having an anti-overlapping hole formed in the area overlapping with the magnet array.
H01Q 7/06 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre avec un noyau en matière ferromagnétique
H01Q 1/52 - Moyens pour réduire le couplage entre les antennes; Moyens pour réduire le couplage entre une antenne et une autre structure
H01Q 1/24 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
44.
ANTENNA MODULE, WIRELESS POWER TRANSMISSION SYSTEM, AND CASE FOR PORTABLE TERMINAL
The present invention has a circular or arc-shaped magnet array disposed around a receiving coil and transmitting coil for wireless power transmission, thereby increasing the alignment accuracy of the receiving coil and transmitting coil, and prevents the deterioration of properties such as inductance, charging efficiency, etc.
H01Q 7/06 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre avec un noyau en matière ferromagnétique
H01Q 1/52 - Moyens pour réduire le couplage entre les antennes; Moyens pour réduire le couplage entre une antenne et une autre structure
H01Q 1/24 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
A wireless power reception module is provided. A wireless power reception module according to an exemplary embodiment of the present invention comprises: an antenna unit which comprises a circuit board comprising first and second surfaces opposite to each other, a wireless power reception antenna formed in an antenna pattern on the first surface of the circuit board, a terminal pattern formed on the first surface of the circuit board and extending from the wireless power reception antenna by a predetermined length, and a first coverlay attached to the first surface of the circuit board; and a shielding unit comprising a magnetic sheet which is formed of a magnetic material so as to shield a magnetic field and has a side surface exposed to the outside, the shielding unit being disposed on one surface of the antenna unit so as to be placed in a position corresponding to the wireless power reception antenna, wherein the first coverlay is attached to the first surface so as to cover both the wireless power reception antenna, formed on the first surface, and a part of the entire length of the terminal pattern formed on the first surface.
H01F 27/36 - Blindages ou écrans électriques ou magnétiques
H02J 50/10 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif
H02J 50/00 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H01Q 1/52 - Moyens pour réduire le couplage entre les antennes; Moyens pour réduire le couplage entre une antenne et une autre structure
An antenna module is provided. The antenna module according to one embodiment of the present invention comprises: a plurality of directors provided so as to be distanced from one another on the upper surface of a first base layer; a second base layer disposed below the first base layer; a plurality of radiation patterns provided so as to be distanced from one another at positions corresponding to respective directors on the upper surface of the second base layer to function as antennas; an RF chipset disposed on the lower surface of the second base layer to transmit and receive RF signals; a connection pattern comprising a power-feeding via electrode passing through the second base layer, and electrically connecting the RF chipset and radiation patterns; and a grounding via electrode passing through one part of the second base layer and provided to be distanced from the side surface of the power-feeding via electrode and surround at least a portion of the side surface of same.
H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
H01Q 5/335 - Dispositions permettant un fonctionnement sur différentes gammes d’ondes Éléments rayonnants individuels ou couplés, chaque élément étant alimenté d’une façon non précisée utilisant des circuits ou des composants dont la réponse dépend de la fréquence, p.ex. des circuits bouchon ou des condensateurs au point d’alimentation, p.ex. aux fins d’adaptation d’impédance
47.
METHOD OF MANUFACTURING POWER SEMICONDUCTOR MODULE, AND POWER SEMICONDUCTOR MODULE MANUFACTURED THEREBY
The present invention relates to a method of manufacturing a power semiconductor module and a power semiconductor module manufactured thereby, the method comprising the steps of: removing thermal stress by annealing a base plate; disposing a brazing filler layer on the upper surface of the base plate; and laminating and brazing a ceramic substrate onto the base plate having the brazing filler layer disposed thereon.
H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
48.
METHOD FOR MANUFACTURING ANTENNA MODULE CERAMIC SUBSTRATE
A method for manufacturing an antenna module ceramic substrate is provided. Provided is a method for manufacturing an antenna module ceramic substrate, according to one embodiment of the present invention, the method comprising the steps of: stacking a first base material layer and a second base material layer so that each of a radiation pattern formed between the first and second base material layers and a connection pattern formed inside the second base material layer to be electrically connected with the radiation pattern are provided; compressing the first and second base material layers; and calcinating the compressed first and second base material layers.
An antenna module is provided. The antenna module according to an embodiment of the present invention includes: a radiation pattern having an antenna function; a substrate layer in which a plurality of low-temperature co-fired ceramic (LTCC) substrates are stacked and implemented so as to have a connection pattern arranged on one side of the radiation pattern to be electrically connected to the radiation pattern; an RF chipset electrically connected to the radiation pattern through the connection pattern to generate an RF signal to be transmitted from the radiation pattern or to process an RF signal received from the antenna; a thermal interface material (TIM) arranged on one side of the RF chipset to transfer heat generated by the RF chipset; a heat sink arranged on one side of the TIM to diffuse the heat transferred from the TIM; and a fan arranged on one side of the heat sink to cool the heat sink by introducing external air.
Disclosed is a smart tracker for communicating with a parent terminal by Bluetooth communication and communicating with the parent terminal by ultra-wide band communication during positioning. The disclosed smart tracker comprises: a first housing; a second housing coupled to the first housing to form an inner space; a circuit board arranged in the inner space formed by the first housing and the second housing; a buzzer mounted on the lower surface of the circuit board; a battery mounted on a surface of the circuit board; a first antenna arranged on the upper surface of the circuit board and spaced from the areas on which the buzzer and the battery are mounted; and a second antenna arranged on the upper surface of the circuit board and spaced from the areas on which the buzzer and the battery are mounted and from the first antenna.
A data logger device is provided. A data logger device according to an embodiment of the present invention is fixed to the outer surface of freight and comprises: a memory unit for storing information regarding the freight; a communication unit for transmitting the information stored in the memory unit to the outside at the time of tagging; a sensing unit including a sensor for detecting an internal state of the freight so as to enable storing information regarding the internal state of the freight in the memory; a control unit for controlling an overall drive; and a power supply unit for supplying driving power to the control unit.
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
G06Q 10/08 - Logistique, p.ex. entreposage, chargement ou distribution; Gestion d’inventaires ou de stocks
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
A data logger device is provided. A data logger device according to one embodiment of the present invention is arranged on the outer surface of a product to detect information about the product, and comprises: a main body including a case in which a circuit board is embedded and a circuit unit which is mounted on the circuit board so as to store the information about the product and transmit at least a part of the stored information to the outside; and a sensor connection member extending a predetermined length from the case toward the outside so that a sensing unit for detecting the state of the product can be attachably/detachably coupled thereto.
A data logger device is provided. The data logger device according to an embodiment of the present invention is fixed in logistics, and comprises: a first communication unit that includes a memory unit in which information regarding logistics has been stored, and, when being tagged by an RFID reader, communicates with the RFID reader so as to transmit, to a server via the RFID reader, information which has been acquired from the memory unit; and a second communication unit that, when being NFC tagged, transmits, to the outside, at least some of information which has been stored in the memory unit, wherein the first communication unit may be an RFID communication module including a first driving chip including the memory unit in which the information regarding the logistics has been stored, and an RFID antenna for wireless communication with the RFID reader, and the second communication unit may be an NFC antenna module including a second driving chip, and an NFC antenna for the NFC tagging.
Disclosed is a waveguide having a first vertical transfer path formed at a lower plate coupled to a signal processing substrate, and having a horizontal transfer path and a second vertical transfer that are formed at an upper plate coupled to a radar antenna, and thus minimizing tolerance during assembly. The disclosed waveguide is constructed by stacking the upper plate on the upper surface of the lower plate, a first vertical through-hole is formed in the lower plate, a second vertical through-hole and a horizontal groove are formed in the upper plate, and the horizontal groove connects the first vertical through-hole and the second vertical through-hole to form a radio wave transfer path.
A mobile terminal is disclosed. The mobile terminal comprises: a microphone configured to generate a voice signal in response to voices of speakers; a processor configured to generate a separated voice signal associated with each of the voices by separating the voice signal from a sound source on the basis of a sound source location of each of the voices, and output the result of translation for each of the voices, on the basis of the separated voice signal; and a memory configured to store source language information indicating source languages that are uttered languages of the voices of the speakers. The processor outputs the results of translations in which the languages of the voices of the speakers have been translated from the source languages into a target language, on the basis of the source language information and the separated voice signal.
H04R 1/40 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en combinant plusieurs transducteurs identiques
Disclosed is a radar antenna which has a shielding space corresponding to each antenna of an antenna body by using an accommodation hole of a shielding member to prevent mutual coupling between antennas. The disclosed radar antenna comprises an antenna body which has a first surface and a second surface and in which a plurality of first slot groups are formed to be spaced apart from each other on the first surface, and a shielding member which is stacked on the first surface of the antenna body and in which a plurality of accommodation holes are formed to respectively overlap the plurality of first slot groups.
G01S 7/03 - DÉTERMINATION DE LA DIRECTION PAR RADIO; RADIO-NAVIGATION; DÉTERMINATION DE LA DISTANCE OU DE LA VITESSE EN UTILISANT DES ONDES RADIO; LOCALISATION OU DÉTECTION DE LA PRÉSENCE EN UTILISANT LA RÉFLEXION OU LA RERADIATION D'ONDES RADIO; DISPOSITIONS ANALOGUES UTILISANT D'AUTRES ONDES - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe - Détails de sous-ensembles HF spécialement adaptés à ceux-ci, p.ex. communs à l'émetteur et au récepteur
H01Q 1/52 - Moyens pour réduire le couplage entre les antennes; Moyens pour réduire le couplage entre une antenne et une autre structure
Disclosed is a radar antenna having an antenna and a waveguide that are coupled using a jig on which a plurality of alignment pins are arranged, and thus minimizing tolerance during assembly. The disclosed radar antenna comprises: an alignment jig having a plurality of alignment pins; a circuit board having a plurality of first alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the alignment jig; a waveguide having a plurality of second alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the circuit board; and an antenna having a plurality of third alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the waveguide.
G01S 7/03 - DÉTERMINATION DE LA DIRECTION PAR RADIO; RADIO-NAVIGATION; DÉTERMINATION DE LA DISTANCE OU DE LA VITESSE EN UTILISANT DES ONDES RADIO; LOCALISATION OU DÉTECTION DE LA PRÉSENCE EN UTILISANT LA RÉFLEXION OU LA RERADIATION D'ONDES RADIO; DISPOSITIONS ANALOGUES UTILISANT D'AUTRES ONDES - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe - Détails de sous-ensembles HF spécialement adaptés à ceux-ci, p.ex. communs à l'émetteur et au récepteur
58.
MAGNETIC SHIELDING SHEET FOR ANTENNA MODULE AND ANTENNA MODULE COMPRISING SAME
A magnetic field shielding sheet for an antenna module is provided. According to an exemplary embodiment of the present invention, the magnetic field shielding sheet for an antenna module is applied to an antenna module comprising an antenna unit operating in a predetermined frequency band and a magnet for position alignment, and comprises: a main shielding sheet made of a magnetic material so as to be able to shield a magnetic field generated from the antenna unit; and at least one magnetic saturation-prevention member stacked on one side of the main shielding sheet so as to be able to prevent magnetic saturation of the main shielding sheet by inducing a direct magnetic field generated from the magnet, wherein the magnetic saturation-prevention member is provided in a number corresponding to the number of magnets provided in the antenna module and is positioned on one side of the main shielding sheet so as to be positioned at a position corresponding to the magnets provided in the antenna module.
H01Q 7/06 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre avec un noyau en matière ferromagnétique
H01Q 1/22 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets
H04B 5/00 - Systèmes de transmission à induction directe, p.ex. du type à boucle inductive
G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p.ex. forme, nature, code
A wireless power transmitting module is provided. The wireless power transmitting module according to an exemplary embodiment of the present invention comprises: a coil unit provided with a coil body in which a conductive member having a predetermined length is wound in one direction, and with a planar coil including a pair of terminal portions extending from the coil body by a predetermined length for electrical connection; a main shielding sheet arranged on one surface of the coil unit to shield a magnetic field generated from the coil unit; an accommodating portion formed through the main shielding sheet so as to accommodate the thickness of at least one of the pair of terminal portions; and an auxiliary shielding sheet attached to one surface of the main shielding sheet so as to cover the accommodating portion in order to shield a magnetic field leaking through the accommodating portion, wherein the auxiliary shielding sheet has a relatively thinner thickness than the main shielding sheet.
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H02J 50/10 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif
A voice processing device is disclosed. The voice processing device comprises: a voice processing circuit configured to generate an isolated voice signal associated with respective voices spoken at a plurality of sound source locations in a vehicle by isolating, on the basis of the respective sound source locations of the voices, sound sources from a voice signal associated with the voices, and output an interpretation result for the respective voices on the basis of the isolated voice signal; a memory configured to store source language information indicating a source language and target language information indicating a target language in order to interpret the voice associated with the isolated voice signal; and a communication circuit configured to output the interpretation result, wherein the voice processing circuit generates, with reference to the memory, the interpretation result in which the language of the voice corresponding to the isolated voice signal is interpreted from the source language into the target language.
G10L 15/22 - Procédures utilisées pendant le processus de reconnaissance de la parole, p.ex. dialogue homme-machine
G06F 40/58 - Utilisation de traduction automatisée, p.ex. pour recherches multilingues, pour fournir aux dispositifs clients une traduction effectuée par le serveur ou pour la traduction en temps réel
H04R 1/32 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement
G01S 3/808 - Systèmes pour déterminer une direction ou une déviation par rapport à une direction prédéterminée utilisant des transducteurs espacés et mesurant la différence de phase ou de temps entre les signaux provenant de ces transducteurs, c. à d. systèmes à différence de parcours
G10L 15/02 - Extraction de caractéristiques pour la reconnaissance de la parole; Sélection d'unités de reconnaissance
G10L 15/26 - Systèmes de synthèse de texte à partir de la parole
G10L 13/08 - Analyse de texte ou génération de paramètres pour la synthèse de la parole à partir de texte, p.ex. conversion graphème-phonème, génération de prosodie ou détermination de l'intonation ou de l'accent tonique
61.
SPEECH PROCESSING DEVICE AND OPERATION METHOD THEREOF
Disclosed is a speech processing device. The speech processing device comprises: a speech reception circuit configured to receive a speech signal associated with speech uttered by speakers; a speech processing circuit configured to perform sound source separation for the speech signal on the basis of a sound source position of the speech so as to generate a separated speech signal associated with the speech and generate a translation result for the speech by using the separated speech signal; a memory; and an output circuit configured to output the translation result for the speech, wherein the sequence in which transmission results are output is determined on the basis of an utterance time point of the speech.
G10L 15/22 - Procédures utilisées pendant le processus de reconnaissance de la parole, p.ex. dialogue homme-machine
G10L 17/02 - Opérations de prétraitement, p.ex. sélection de segment; Représentation ou modélisation de motifs, p.ex. fondée sur l’analyse linéaire discriminante [LDA] ou les composantes principales; Sélection ou extraction des caractéristiques
G01S 3/808 - Systèmes pour déterminer une direction ou une déviation par rapport à une direction prédéterminée utilisant des transducteurs espacés et mesurant la différence de phase ou de temps entre les signaux provenant de ces transducteurs, c. à d. systèmes à différence de parcours
Provided is a power source-less sensor device. A power source-less sensor device according to an exemplary embodiment of the present invention comprises: a sensor module which includes a sensing unit including at least one sensor and includes a communication unit for transmitting, to the outside, information sensed from the sensing unit; a capacitor for providing driving power to the sensor module; and an NFC antenna module for generating an induced current so as to charge the capacitor during NFC tagging. The sensor module is periodically driven by using power charged in the capacitor.
H02J 50/00 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique
H02J 50/10 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
H04W 4/80 - Services utilisant la communication de courte portée, p.ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
H02J 50/80 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre l’échange de données, concernant l’alimentation ou la distribution d’énergie électrique, entre les dispositifs de transmission et les dispositifs de réception
G01D 21/02 - Mesure de plusieurs variables par des moyens non couverts par une seule autre sous-classe
63.
ELECTRONIC DEVICE AND OPERATING METHOD FOR ELECTRONIC DEVICE
An electronic device is disclosed. An electronic device comprises: an image data receiving circuit configured to receive, from a camera, input image data associated with an image captured by the camera; a voice data receiving circuit configured to receive input voice data associated with the voices of speakers; a memory configured to store transform parameters for projecting a space coordinate system onto an image coordinate system on the image; and a processor, which determines a speaker's spatial location from the input voice data, converts same into the speaker's image location on the image, and inserts, into an input image, text associated with the speaker's voice according to the image location, so as to generate output image data.
G10L 17/02 - Opérations de prétraitement, p.ex. sélection de segment; Représentation ou modélisation de motifs, p.ex. fondée sur l’analyse linéaire discriminante [LDA] ou les composantes principales; Sélection ou extraction des caractéristiques
G10L 15/26 - Systèmes de synthèse de texte à partir de la parole
G06T 7/70 - Détermination de la position ou de l'orientation des objets ou des caméras
G01S 3/808 - Systèmes pour déterminer une direction ou une déviation par rapport à une direction prédéterminée utilisant des transducteurs espacés et mesurant la différence de phase ou de temps entre les signaux provenant de ces transducteurs, c. à d. systèmes à différence de parcours
The present invention relates to a power module and a manufacturing method therefor, the power module comprising: a base plate (100) having recessed grooves (101) formed on the upper surface thereof; brazing filler layers (200) arranged in the recessed grooves (101); and a ceramic substrate (300) brazed to the upper surface of the base plate (100) by means of the brazing filler layers (200). The present invention solves an existing soldering problem, enables reliable joining to various base plates, and can simplify processes.
H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
H01L 23/13 - Supports, p.ex. substrats isolants non amovibles caractérisés par leur forme
65.
VOICE PROCESSING DEVICE FOR PROCESSING VOICE SIGNAL AND VOICE PROCESSING SYSTEM COMPRISING SAME
A voice processing device is disclosed. The voice processing device comprises: a voice data receiving circuit configured to receive input voice data associated with voices of speakers; a memory configured to store starting language data; a voice data output circuit configured to output output voice data associated with the voices of the speakers; and a processor configured to generate a control command for outputting the output voice data, wherein the processor uses the input voice data to generate first speaker position data indicating a position of a first speaker of the speakers and first output voice data associated with a voice of the first speaker, reads first starting language data corresponding to the first speaker position data with reference to the memory, and transmits, to the voice data output circuit, a control command for outputting the first output voice data to a translation environment for translating the first starting language indicated by the first starting language data.
G10L 17/02 - Opérations de prétraitement, p.ex. sélection de segment; Représentation ou modélisation de motifs, p.ex. fondée sur l’analyse linéaire discriminante [LDA] ou les composantes principales; Sélection ou extraction des caractéristiques
G06F 40/40 - Traitement ou traduction du langage naturel
G01S 3/808 - Systèmes pour déterminer une direction ou une déviation par rapport à une direction prédéterminée utilisant des transducteurs espacés et mesurant la différence de phase ou de temps entre les signaux provenant de ces transducteurs, c. à d. systèmes à différence de parcours
H04W 4/02 - Services utilisant des informations de localisation
G06F 40/58 - Utilisation de traduction automatisée, p.ex. pour recherches multilingues, pour fournir aux dispositifs clients une traduction effectuée par le serveur ou pour la traduction en temps réel
H04R 1/40 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en combinant plusieurs transducteurs identiques
66.
VOICE PROCESSING DEVICE FOR PROCESSING VOICES OF SPEAKERS
Disclosed is a voice processing device. The voice processing device comprises: a voice data reception circuit configured to receive input voice data associated with the voice of a speaker; a wireless signal reception circuit configured to receive a wireless signal including a terminal ID from a speaker terminal of the speaker; a memory; and a processor configured to generate terminal location data indicating the location of the speaker terminal on the basis of the wireless signal, and match and store the generated terminal location data and the terminal ID in the memory, wherein the processor uses the input voice data to generate first speaker location data indicating a first location and first output voice data associated with a first voice spoken at the first location, reads a first terminal ID corresponding to the first speaker location data by referring to the memory, and matches and stores the first terminal ID and the first output voice data.
B60R 16/037 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour le confort des occupants
G10L 15/28 - Reconnaissance de la parole - Détails de structure des systèmes de reconnaissance de la parole
G10L 15/22 - Procédures utilisées pendant le processus de reconnaissance de la parole, p.ex. dialogue homme-machine
H04W 4/02 - Services utilisant des informations de localisation
G10L 15/06 - Création de gabarits de référence; Entraînement des systèmes de reconnaissance de la parole, p.ex. adaptation aux caractéristiques de la voix du locuteur
G10L 15/04 - Segmentation; Détection des limites de mots
An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: a circuit board; a radiation pattern formed on at least one surface of the circuit board and formed in a loop shape to have an empty space part formed at a central part thereof; a first shielding sheet stacked on the upper surface of the circuit board to include an area corresponding to the empty space part; and a second shielding sheet stacked on the lower surface of the circuit board to include an area corresponding to the empty area part, wherein the first shielding sheet and the second shielding sheet are disposed such that the areas corresponding to the empty space part on the opposite surfaces of the circuit board overlap each other.
H01Q 1/24 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p.ex. forme, nature, code
68.
MAGNETIC SHIELDING SHEET FOR WIRELESS POWER RECEPTION MODULE, AND WIRELESS POWER RECEPTION MODULE INCLUDING SAME
A magnetic shielding sheet for a wireless power reception module, and a wireless power reception module including same are provided. A magnetic shielding sheet for a wireless power reception module, according to an exemplary embodiment of the present invention, is applied to a wireless power reception module capable of a wireless power share (WPS) function and has an overall thickness of 150㎛ or less. The magnetic shielding sheet comprises: a first sheet which is made of a magnetic material so as to be able to shield a magnetic field; and a second sheet which is laminated as a monolayer on one surface of the first sheet by means of a bonding adhesive layer, wherein the second sheet has a relatively smaller thickness than the first sheet while having a saturation magnetic flux density which is two times or more the saturation magnetic flux density of the first sheet.
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
H02J 50/12 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif du type couplage à résonance
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01Q 1/52 - Moyens pour réduire le couplage entre les antennes; Moyens pour réduire le couplage entre une antenne et une autre structure
H04B 5/00 - Systèmes de transmission à induction directe, p.ex. du type à boucle inductive
H01F 27/36 - Blindages ou écrans électriques ou magnétiques
H02J 50/00 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique
The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) which is disposed above the lower ceramic substrate (200) and has a semiconductor chip (G) mounted on the lower surface thereof; a PCB substrate (400) disposed above the upper ceramic substrate (300); and a connection pin (800) which extends through through holes (320 and 420) formed in the upper ceramic substrate (300) and the PCB substrate (400), and vertically connects electrode patterns (a, b, c, and d) formed on the upper ceramic substrate (300) and the PCB substrate (400). The present invention provides a shortened electrical connection distance between the upper ceramic substrate and the PCB substrate, and thus can minimize a current path and enhance the moving efficiency of a high-speed current.
H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
H01L 23/367 - Refroidissement facilité par la forme du dispositif
70.
DEVICE FOR PROCESSING VOICE AND OPERATION METHOD THEREOF
Disclosed is a voice processing device. The voice processing device comprises a memory and a processor configured to perform sound source isolation on voice signals associated with the voices of speakers on the basis of the sound source positions of the respective voices. The processor is configured to: generate sound source position information indicating the sound source positions of the respective voices by using the voice signals associated with the voices; generate isolated voice signals associated with the voices of the respective speakers from the voice signals on the basis of the sound source position information; and match the isolated voice signals and the voice source position information and store the same in the memory.
G10L 17/02 - Opérations de prétraitement, p.ex. sélection de segment; Représentation ou modélisation de motifs, p.ex. fondée sur l’analyse linéaire discriminante [LDA] ou les composantes principales; Sélection ou extraction des caractéristiques
G01S 3/808 - Systèmes pour déterminer une direction ou une déviation par rapport à une direction prédéterminée utilisant des transducteurs espacés et mesurant la différence de phase ou de temps entre les signaux provenant de ces transducteurs, c. à d. systèmes à différence de parcours
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
H05B 47/12 - Commande de la source lumineuse en réponse à des paramètres détectés en détectant la présence ou le mouvement d'objets ou d'êtres vivants en détectant un son audible
G06F 40/47 - Traduction assistée par ordinateur, p.ex. utilisant des mémoires de traduction
H04R 1/40 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en combinant plusieurs transducteurs identiques
The present invention relates to a power module, in which a ceramic substrate (200) comprises: a ceramic substrate (201); a metal layer (202) formed on at least one of the top and bottom surfaces of the ceramic substrate (201); and an anti-oxidation layer (920) formed to surround the top and side surfaces of the metal layer (202) to prevent external exposure of the metal layer (202). In the present invention, since an anti-oxidation layer is formed to surround the top and side surfaces of a metal layer to prevent external exposure of the metal layer, the shelf life of a ceramic substrate can be extended, and the condition of the metal layer to be soldered can be maintained to increase adhesion between the metal layer and a component.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
A disposable electronic thermometer is provided. The disposable electronic thermometer, according to an exemplary embodiment of the present invention, comprises: a base substrate including an adhesive layer formed on one surface to be attached to a body of a user; a control unit including a circuit board arranged on one surface of the base substrate and at least one driving chip mounted on the circuit board; a temperature sensor arranged on one surface of the base substrate and electrically connected to the circuit board, to thus measure a body temperature of a user; an NFC antenna electrically connected to the circuit board and arranged on one surface of the base substrate to surround the circuit board; and a cover member attached to one surface of the base substrate to prevent external exposure of the circuit board, the temperature sensor, and the NFC antenna.
The present invention relates to a power module and a method for manufacturing a ceramic substrate included therein, wherein the power module comprises a ceramic substrate (300) and a semiconductor chip (G) mounted on the ceramic substrate (300), and the ceramic substrate (300) comprises: a ceramic base substrate (301); a plurality of via holes (330) vertically formed through the ceramic base substrate (301); a metal filler (P) filled in the via holes (330); and electrode patterns (a, b, c) formed on the upper surface and the lower surface of the ceramic base substrate (301) and vertically connected by the metal filler (P). By electrically connecting the electrode patterns on the upper surface and the lower surface of the ceramic substrate through the via holes, the present invention can remarkably improve efficiency and achieve excellent conductivity.
The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate (200); an upper ceramic substrate (300) which is disposed spaced apart from the upper portion of the lower ceramic substrate (200), and on the lower surface of which a semiconductor chip (G) is mounted; spacers (220, 230) each having one end bonded to the lower ceramic substrate (200) and the other end bonded to the upper ceramic substrate (300); first bonding layers (221, 231) each bonding the one end of each spacer (220, 230) to the lower ceramic substrate (200); and second bonding layers (223, 233) each bonding the other end of each spacer (220, 230) to the upper ceramic substrate (300). The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/485 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de couches conductrices inséparables du corps semi-conducteur sur lequel elles ont été déposées formées de structures en couches comprenant des couches conductrices et isolantes, p.ex. contacts planaires
H01L 23/482 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de couches conductrices inséparables du corps semi-conducteur sur lequel elles ont été déposées
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H01L 23/13 - Supports, p.ex. substrats isolants non amovibles caractérisés par leur forme
The present invention relates to a power module comprising: an upper ceramic substrate (300); a first electrode pattern (a) formed on the upper ceramic substrate (300); a second electrode pattern (b) formed on the upper ceramic substrate (300), the second electrode pattern (b) being disposed spaced apart from and on the same plane as the first electrode pattern (a); a semiconductor chip (G) disposed to connect the first electrode pattern (a) and the second electrode pattern (b) and including a drain electrode joined to the first electrode pattern (a) and a source electrode joined to the second electrode pattern (b); and a solder layer (350) that joins the drain electrode to the first electrode pattern (a) and joins the source electrode to the second electrode pattern (b). The present invention has an advantage in that the semiconductor chip is prevented from moving in position while being joined to the upper ceramic substrate, and thus can be stably joined to the upper ceramic substrate.
The present invention relates to a power module comprising: a lower ceramic substrate (200) including a ceramic base material (201) and metal layers (202, 203) formed on the top surface and the bottom surface of the ceramic base material (201); a heat-dissipation plate (500) bonded to the bottom surface of the lower ceramic substrate (200); and a solder preform layer (550) disposed between and bonded to the bottom surface of the lower ceramic substrate (200) and the top surface of the heat-dissipation plate (500). The present invention has the following advantageous effects: the entrapment of volatile material is minimized due to the solder preform used when the heat-dissipation plate and the ceramic substrate are bonded to each other, thereby preventing air bubble generation; and the high-temperature reliability can be improved due to the Sb based-solder used as the solder preform.
H01L 23/13 - Supports, p.ex. substrats isolants non amovibles caractérisés par leur forme
H01L 23/482 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de couches conductrices inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
Presented is a system for testing antenna performance, in which antenna performance is tested by reflecting the loss of a cable used in the antenna performance test. The presented system for testing antenna performance comprises a tester having a test port, the test port being connected, via a cable, to an antenna that communicates with a terminal to be tested, in a shield box, when a test mode is set, wherein the tester outputs a test signal to the test port, receives a response signal corresponding to the test signal via the test port, and obtains a value, as a communication performance measurement value, by adding a calibration value to a reception signal strength of the response signal.
G01R 29/08 - Mesure des caractéristiques du champ électromagnétique
G01R 35/00 - Test ou étalonnage des appareils couverts par les autres groupes de la présente sous-classe
G01R 23/15 - Indication de ce qu'une fréquence d'impulsions est, soit supérieure ou inférieure à une valeur prédéterminée, soit à l'intérieur ou à l'extérieur d'une plage de valeurs prédéterminée, en utilisant des éléments non linéaires ou numériques
G01R 23/00 - Dispositions pour procéder aux mesures de fréquences; Dispositions pour procéder à l'analyse de spectres de fréquences
The present invention relates to a hybrid base plate and a manufacturing method therefor. Metal sheets of different materials having excellent thermal conductivity can be joined to have a thickness favorable for heat dissipation, and by arranging a metal sheet of a material with a low coefficient of thermal expansion between metal sheets with a high coefficient of thermal expansion, there is an effect of preventing warpage when manufacturing a large-area heat sink.
B32B 15/01 - Produits stratifiés composés essentiellement de métal toutes les couches étant composées exclusivement de métal
B32B 37/06 - Procédés ou dispositifs pour la stratification, p.ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par le procédé de chauffage
C23C 14/16 - Matériau métallique, bore ou silicium sur des substrats métalliques, en bore ou en silicium
An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: an antenna unit including an antenna pattern, which has a pattern portion and a lead portion formed, respectively, on both surfaces of a circuit board; a magnetic field shielding sheet including a sheet body made of a magnetic material to block a magnetic field, and a plurality of eddy current reducing pattern portions formed on the sheet body to reduce the generation of eddy current by increasing the resistance of the sheet body; and an insulation member arranged between the antenna unit and the magnetic field shielding sheet, wherein the antenna unit is provided in an asymmetric form in which the pattern portion and the lead portion respectively formed on both surfaces of the circuit board have different thicknesses.
An earphone usable for measuring body temperature and a body temperature control system using same are provided. An earphone usable for measuring body temperature, according to one embodiment of the present invention, comprises: a case including a head part which is partially inserted into a user's ear; a temperature sensor provided at one end of the head part to measure the user's body temperature; and a control unit, embedded in the case, for interlocking with a smart device, outputting a voice signal received from the smart device, and performing control to periodically transmit body temperature information measured by the temperature sensor to the smart device.
A non-face-to-face body temperature change management platform service system and method are provided. The non-face-to-face body temperature change management platform service system according to one embodiment of the present invention comprises: an electronic device that is located around a user and collects and transmits body temperature information of the user and location information thereof; and a data server that receives the body temperature information and the location information from the electronic device and monitors an amount of change (Δ) in body temperature compared to the average body temperature of the user.
G16H 50/80 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicales; TIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour la détection, le suivi ou la modélisation d’épidémies ou des pandémies, p.ex. de la grippe
G16H 10/60 - TIC spécialement adaptées au maniement ou au traitement des données médicales ou de soins de santé relatives aux patients pour des données spécifiques de patients, p.ex. pour des dossiers électroniques de patients
G16H 50/20 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicales; TIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour le diagnostic assisté par ordinateur, p.ex. basé sur des systèmes experts médicaux
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
H02J 50/10 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif
H04W 4/02 - Services utilisant des informations de localisation
A61B 5/00 - Mesure servant à établir un diagnostic ; Identification des individus
A61B 5/01 - Mesure de la température de parties du corps
Proposed are a radar antenna configured to form a waveguide through a partition wall on a plate having a plurality of slots, and a method for manufacturing same. The proposed radar antenna comprises: a first plate having an inner surface; and a second plate stacked so as to have an inner surface facing the inner surface of the first plate, wherein the first plate includes a partition wall extending in the direction of the second plate from the inner surface of the first plate, and the partition wall abuts against the inner surface of the second plate to form a waveguide between the inner surface of the first plate and the inner surface of the second plate.
H01Q 13/22 - Fente longitudinale dans la paroi limite du guide d'onde ou d'une ligne de transmission
H01Q 19/15 - Combinaisons d'éléments actifs primaires d'antennes avec des dispositifs secondaires, p.ex. avec des dispositifs quasi optiques, pour donner à une antenne une caractéristique directionnelle désirée utilisant des surfaces réfléchissantes où les surfaces sont concaves la source rayonnante primaire étant une source linéaire, p.ex. une antenne à ondes de fuite
G01S 13/931 - Radar ou systèmes analogues, spécialement adaptés pour des applications spécifiques pour prévenir les collisions de véhicules terrestres
Disclosed is a flexible PCB RF cable having a ground pattern that is divided into two ground patterns, which are connected through a connection pattern arranged in an area overlapped with a signal line pattern, and thus cracks are minimized during bending. The disclosed flexible PCB RF cable comprises: a signal line pattern interposed between a first dielectric sheet and a second dielectric sheet; first and second lower ground patterns, which are mesh patterns arranged to be spaced from each other below the first dielectric sheet; a lower connection pattern connected to the first and second lower ground patterns; first and second upper ground patterns, which are mesh patterns arranged to be spaced from each other above the second dielectric sheet; and an upper connection pattern connected to the first and second ground patterns.
H01B 7/18 - Protection contre les dommages provoqués par des facteurs extérieurs, p.ex. gaines ou armatures par l'usure, la contrainte mécanique ou la pression
The present invention relates to a power module comprising: an upper ceramic substrate (300); a PCB substrate (400) disposed spaced apart from the upper ceramic substrate (300); a plurality of semiconductor chips (G1, G2, G3, G4) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic substrate (300); and a plurality of capacitors (410) mounted on the top surface of the PCB substrate (400) to correspond to positions between the semiconductor chips (G1, G2, G3, G4). The present invention has the advantage of forming a short current path through which the semiconductor chips and the capacitors are connected, thereby increasing a circuit stabilization effect.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) disposed at an interval on the upper part of the lower ceramic substrate (200), and having a semiconductor chip mounted on the lower surface thereof; a temperature sensor (210) mounted on the upper surface of the lower ceramic substrate (200); and a cutting unit (310) formed on the upper ceramic substrate (300) and having the temperature sensor (210) disposed so as to pass therethrough. The present invention has the cutting unit, having the temperature sensor disposed so as to pass therethrough, formed on the upper ceramic substrate, and thus the problem where the interval between the upper ceramic substrate and the lower ceramic substrate is shorter than the thickness of the temperature sensor may be solved, and an advantage is gained by which a silicone liquid may be evenly filled, without bubbles forming, in a space between the substrates through an injection hole and a vent hole.
H01L 23/13 - Supports, p.ex. substrats isolants non amovibles caractérisés par leur forme
H01L 23/04 - Conteneurs; Scellements caractérisés par la forme
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
The present invention relates to a power module comprising: a ceramic board (300) which includes a ceramic base material and electrode patterns formed on the top surface and the bottom surface of the ceramic base material; a housing (100) to which the ceramic board (300) is mounted and which has terminals disposed at both ends; and bus bars (700) for connecting the electrode patterns of the ceramic board (300) and the terminals through surface-to-surface bonding. The present invention has the advantage of minimizing resistance and heat generation by using the bus bars having a structure that passes high current or low resistance of voltage.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/047 - Conteneurs; Scellements caractérisés par la forme le conteneur étant une structure creuse ayant une base conductrice qui sert de support et en même temps de connexion électrique pour le corps semi-conducteur les autres connexions étant parallèles à la base
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
The present invention relates to a power module comprising: a housing (100) which has a vertically open empty space formed in the middle; a heat dissipating plate (500), the edge of which is bonded to the bottom surface of the housing (100) and the top surface of which is exposed through the empty space of the housing (100); a lower ceramic board (200) bonded to the top surface of the heat dissipating plate (500); an upper ceramic board (300) disposed above the lower ceramic board (200) and having a semiconductor chip (G) mounted to the bottom surface; and a PCB board (400) disposed above the upper ceramic board (300). The present invention has advantages in that stepped portions in the heat dissipating plate make it easy to adjust the distances between internal components mounted to the board, when required, and the heat dissipating performance can be enhanced by increasing the thickness of portions requiring superior heat dissipating performance.
The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) disposed above the lower ceramic substrate (200) and having a semiconductor chip (G) mounted on the lower surface thereof; and a heat sink (500) bonded to the lower surface of the lower ceramic substrate (200) and having slots (510, 520, 530) formed therein. The present invention has slots formed in the heat sink, and thus has the advantages of preventing deterioration between components with different coefficients of thermal expansion and preventing warping of the heat sink.
The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate (300) including a ceramic base material and an electrode pattern formed on the upper and lower surfaces of the ceramic base material; a PCB substrate (400) disposed above the ceramic substrate (300) and including an electrode pattern; a plurality of through-holes (320) formed in at least one of the ceramic substrate (300) and the PCB substrate (400); and a connection pin (900) coupled to the through-holes (320) and connecting the electrode pattern of the ceramic substrate (300) and the electrode pattern of the PCB substrate (400) to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
The present invention relates to a power module comprising: a housing (100) which has an empty space that is open in the vertical direction of the center thereof and which is made of an injection material; and terminals (610, 620) which are located at both sides of the housing (100) and which are insert-injected into the housing (100). The present invention can simplify the shape of the housing since the terminals are integrally formed with the housing by means of insert-injection, and the housing is formed by injecting the material of the housing as the material suitable for a heat dissipation structure, and thus heat dissipation efficiency can be increased and the operational reliability of the power module can be increased.
An artificially intelligent air purification system is provided. An artificially intelligent air purification system according to an embodiment of the present invention comprises: a ventilation system which senses indoor air state information, discharges indoor air to the outside, and purifies outdoor air and allows same to flow to an indoor space; a web service server which receives the indoor air state information collected by the ventilation system and provides a user terminal with the indoor air state information and procedure information in accordance with same; and an AI server which receives the indoor air state information from the web service server and controls the ventilation system on the basis of the received indoor air state information and current outdoor air state information to manage the state of indoor air by means of artificial intelligence.
F24F 11/00 - Aménagements de commande ou de sécurité
F24F 11/64 - Traitement électronique utilisant des données mémorisées au préalable
H04M 1/72403 - Interfaces utilisateur spécialement adaptées aux téléphones sans fil ou mobiles avec des moyens de soutien local des applications accroissant la fonctionnalité
G10L 15/22 - Procédures utilisées pendant le processus de reconnaissance de la parole, p.ex. dialogue homme-machine
H04L 12/28 - Réseaux de données à commutation caractérisés par la configuration des liaisons, p.ex. réseaux locaux [LAN Local Area Networks] ou réseaux étendus [WAN Wide Area Networks]
F24F 110/50 - Propriétés liées à la qualité de l’air
A remote body temperature monitoring system is provided. A remote body temperature monitoring system according to an embodiment of the present invention comprises: a patch-type thermometer attached to the body of a user so as to periodically measure body temperature; a web service server for collecting information about the body temperature measured by the patch-type thermometer and notifying a manager terminal of a suspected fever; a collection device for receiving the information about the measured body temperature from the patch-type thermometer and transmitting same to the web service server; and an AI server for receiving the information about the body temperature from the web service server to manage a health status by using artificial intelligence.
A61B 5/00 - Mesure servant à établir un diagnostic ; Identification des individus
A61B 5/01 - Mesure de la température de parties du corps
G16H 50/80 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicales; TIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour la détection, le suivi ou la modélisation d’épidémies ou des pandémies, p.ex. de la grippe
G16H 80/00 - TIC spécialement adaptées pour faciliter la communication entre les professionnels de la santé ou les patients, p.ex. pour le diagnostic collaboratif, la thérapie collaborative ou la surveillance collaborative de l’état de santé
G01K 13/20 - Thermomètres médicaux par contact pour les humains ou les animaux
93.
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE BY USING SAME
The present invention relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing a Ag sintering paste in the form of a film. The present invention can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.
C09J 7/25 - Matières plastiques; Matières plastiques métallisées à base de composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09J 1/00 - Adhésifs à base de constituants inorganiques
C09D 1/00 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, à base de substances inorganiques
B41M 5/382 - Procédés de transfert ou de sublimation par contact
H01L 23/482 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de couches conductrices inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
A folding plate according to an embodiment of the present invention has first and second support portions located on both sides of a folding portion that is foldable, and is formed as a multilayer structure in which first and second metal sheets of different metal materials are braze-bonded, and thus, is thin and lightweight, has excellent flexibility, and easily dissipates heat.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
G09F 9/30 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels dans lesquels le ou les caractères désirés sont formés par une combinaison d'éléments individuels
H04M 1/02 - Caractéristiques de structure des appareils téléphoniques
B32B 15/01 - Produits stratifiés composés essentiellement de métal toutes les couches étant composées exclusivement de métal
B32B 15/02 - Produits stratifiés composés essentiellement de métal autrement que sous forme de feuille, p.ex. en fils, en parcelles
B23K 20/02 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p.ex. revêtement ou placage au moyen d'une presse
An electronic thermometer is provided. The electronic thermometer according to an exemplary embodiment of the present invention is for periodically measuring a body temperature by being attached to a body of a user, and comprises: at least one temperature sensor mounted on the one surface of a flexible circuit board; a memory unit for storing information obtained via the temperature sensor; a communication unit for externally transmitting the information stored in the memory unit; a control unit for controlling the operations of the temperature sensor, memory unit, and communication unit; a power supply unit arranged on the one surface of the flexible circuit board such that driving power can be provided; and a protection member surrounding the flexible circuit board such that external exposure of the temperature sensor, memory unit, communication unit, control unit, and power supply unit can be prevented.
A magnetic shielding sheet for a reception antenna, and a wireless power reception module including same are provided. A magnetic shielding sheet for a reception antenna, according to an exemplary embodiment of the present invention, blocks the magnetic field induced in a reception antenna, and comprises: a planar first shielding sheet including a through-hole penetratively formed with a predetermined area in a region corresponding to a hollow portion of the reception antenna; and a second shielding sheet arranged to come in contact with one surface of the first shielding sheet, so as to block the magnetic field leaking through the through-hole.
H02J 50/70 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique mettant en œuvre la réduction des champs de fuite électriques, magnétiques ou électromagnétiques
A data logger device is provided. The data logger device according to an example embodiment of the present invention comprises: a sensing unit mounted on one surface of a flexible printed circuit board, and including a sensor that detects at least one piece of information; a display unit that, when an abnormal state is detected on the basis of information measured via the sensing unit, irreversibly displays the abnormal state; a control unit that controls driving of the sensing unit and the display unit; a power supply unit that provides driving power to the control unit; and a cover member that prevents the outside exposure of the sensing unit, the display unit, the control unit, and the power supply unit.
G01D 9/28 - Enregistrement de valeurs mesurées produisant un ou plusieurs enregistrements, chaque enregistrement étant celui des valeurs de plusieurs variables différentes
H04W 4/80 - Services utilisant la communication de courte portée, p.ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p.ex. forme, nature, code
98.
MAGNETIC SHIELDING SHEET AND MANUFACTURING METHOD THEREFOR
A magnetic shielding sheet and a manufacturing method therefor are provided. The magnetic shielding sheet according to an embodiment of the present invention, which is placed on one surface of an antenna comprising a hollow part disposed at the center thereof and having a predetermined area and a pattern part surrounding the hollow part, may comprise: a sheet body which is made of a magnetic material so as to be able to shield a magnetic field; and at least one eddy current-reducing pattern part which is formed in the sheet body so as to increase the resistance of the sheet body so that the occurrence of eddy current can be reduced.
Disclosed is an antenna module for wireless power transmission and reception, wherein a loop-shaped coil for wireless power transmission and reception is formed using two wires having different diameters, so that a reduction in charging efficiency is prevented. The disclosed antenna module for wireless power transmission and reception may comprise: a first coil which is wound around a first winding shaft to form a first loop and has a first coil diameter; a second coil which is wound around the outer periphery of the first coil to form a second loop and has a second coil diameter thicker than the first coil diameter; a base substrate disposed to overlap portions of the first coil and the second coil; and a coil connection pattern formed on one surface of the base substrate and connected to the first coil and the second coil.
H01Q 7/06 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre avec un noyau en matière ferromagnétique
H01Q 1/24 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
100.
CERAMIC BACK COVER FOR MOBILE DEVICE, AND METHOD FOR MANUFACTURING SAME
Provided are a ceramic back cover for a mobile device, and a method for manufacturing same. A method for manufacturing a ceramic back cover for a mobile device, according to the present invention, comprises: a first step of preparing a planar ceramic sheet; a second step of sintering the ceramic sheet; a third step of processing the sintered ceramic sheet; and a fourth step of molding, into a curved shape, a portion of the edge of the processed ceramic sheet. The method is effective at controlling the ceramic shape since the planar ceramic sheet is sintered, can control a dielectric constant, and has excellent processability due to the fact that the planar ceramic sheet is processed.
C04B 37/00 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage
C04B 41/80 - Post-traitement des mortiers, du béton, de la pierre artificielle ou des céramiques; Traitement de la pierre naturelle de céramiques uniquement
H04M 1/02 - Caractéristiques de structure des appareils téléphoniques
brevets
