Abstract

Proposed is an antenna module in which a partial area, which overlaps with a magnet mounted on an antenna sheet, of the entire area of a shielding sheet is punched out to prevent the shielding sheet from being magnetically saturated (magnetized) by the magnet. The proposed antenna module comprises: the antenna sheet having a radiation pattern formed thereon and having a magnet array formed along the outer circumference of the radiation pattern inserted thereto; and the shielding sheet laminated on the antenna sheet, and having an anti-overlapping hole formed in the area overlapping with the magnet array.

IPC Classes  ?

• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling

Abstract

The present invention has a circular or arc-shaped magnet array disposed around a receiving coil and transmitting coil for wireless power transmission, thereby increasing the alignment accuracy of the receiving coil and transmitting coil, and preventing the deterioration of properties such as inductance, charging efficiency, etc.

IPC Classes  ?

• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power

Abstract

Provided is a wireless ear module having a UWB antenna to easily obtain location information of a wireless ear module case and ear modules. The wireless ear module comprises: ear modules for receiving and playing a sound source signal from an electronic device; and a case comprising an upper housing and a lower housing which are rotatably coupled, and for storing the ear modules. The ear modules and/or the case transmit a location positioning signal, and the location positioning signal is a signal for sensing the distance and direction from the electronic device to the ear modules or the case.

IPC Classes  ?

• H04R 1/10 - Earpieces; Attachments therefor
• H01Q 5/25 - Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems
• H01Q 5/28 - Arrangements for establishing polarisation or beam width over two or more different wavebands
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling

Abstract

The present invention provides a plurality of floor-type pedestrian signals, in which a control signal and voltage control power are applied, the voltage control power is converted into constant current power in each floor-type pedestrian signal, and the constant current power is applied to an LED array according to the control signal. Through this, the present invention prevents the brightness of the floor-type pedestrian signal from lowering as the distance from a controller increases, and maintains a constant lighting time of the plurality of floor-type pedestrian signals, so that even if the width of a crosswalk increases, the visibility of the floor-type pedestrian signal is kept constant.

IPC Classes  ?

• G08G 1/005 - Traffic control systems for road vehicles including pedestrian guidance indicator
• H05B 47/17 - Operational modes, e.g. switching from manual to automatic mode or prohibiting specific operations
• H05B 47/175 - Controlling the light source by remote control

Abstract

Proposed is a hybrid communication device which enables multiple indoor and outdoor communications in association with an access point (AP) without a separate network construction. The proposed device is a hybrid communication device connected to an access point, the hybrid communication device comprising: a first communication module which receives a first signal from an external device by using a first communication scheme and transmits the received first signal to the access point by using the first communication scheme; a second communication module which receives a second signal from the external device by using a second communication scheme and transmits the received second signal to the access point by using the second communication scheme; and a third communication module which receives a third signal from the external device by using a third communication scheme and transmits the received third signal to the access point by using the third communication scheme, wherein the hybrid communication device is in the form of a USB-type dongle.

IPC Classes  ?

• H04L 69/18 - Multiprotocol handlers, e.g. single devices capable of handling multiple protocols
• H04W 88/10 - Access point devices adapted for operation in multiple networks, e.g. multi-mode access points
• G06F 13/38 - Information transfer, e.g. on bus

Abstract

The present invention relates to a wireless power supply device for a vehicle seat, capable of wirelessly supplying power to a vehicle seat that is moved along a moving line. The wireless power supply device for a vehicle seat, according to the present invention, comprises: a pair of rail frames having a first opening formed so that a seat connection portion connected to a vehicle seat can move linearly; a motor coupled to the seat connection portion and installed to allow linear movement within the rail frames; a wireless power transmission board fixed to the inside of the rail frames and comprising a plurality of transmission coils connected to a power supply inside a vehicle to wirelessly transmit power; a wireless power reception board which is disposed at a position opposite to the wireless power transmission board, comprises a plurality of reception coils for receiving power wirelessly transmitted from the transmission coils, and linearly moves in conjunction with the motor, wherein the wireless power transmission board and the wireless power reception board are installed perpendicularly to the bottom surface of the rail frames, at positions horizontally spaced apart from the motor.

IPC Classes  ?

• B60N 2/07 - Slide construction
• B60N 2/02 - Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles the seat or part thereof being movable, e.g. adjustable
• B60R 16/03 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems

Abstract

A method for manufacturing an antenna module ceramic substrate is provided. Provided is a method for manufacturing an antenna module ceramic substrate, according to one embodiment of the present invention, the method comprising the steps of: stacking a first base material layer and a second base material layer so that each of a radiation pattern formed between the first and second base material layers and a connection pattern formed inside the second base material layer to be electrically connected with the radiation pattern are provided; compressing the first and second base material layers; and calcinating the compressed first and second base material layers.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles

Abstract

A wireless power reception module including an antenna unit which includes a circuit board including a first surface and a second surfaces which are opposite to each other, a wireless power reception antenna formed as an antenna pattern on the first surface of the circuit board, a terminal pattern extending to a predetermined length from the wireless power reception antenna on the first surface, and a first coverlay attached to the first surface and a shielding unit which includes a magnetic sheet formed of a magnetic material to shield a magnetic field and having a side surface exposed to the outside and disposed on one surface of the antenna unit to be positioned at a position corresponding to the wireless power reception antenna, the first coverlay attached to the first surface, covering both the wireless power reception antenna and part of the total length of the terminal pattern.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• A61B 5/024 - Measuring pulse rate or heart rate

Abstract

An antenna module comprises a plurality of directors provided to be spaced apart from each other on the top surface of a first base layer; a second base layer disposed under the first base layer; a plurality of radiation patterns spaced apart from each other at positions corresponding to the respective directors on the top surface of the second base layer and functioning as antennas; an RF chipset disposed on bottom surface of the second base layer to transmit and receive RF signals; a connection pattern comprising a power feeding via electrode penetrating the second base layer and connecting the RF chipset and the radiation pattern; and a grounding via electrode that penetrates a part of the second base layer, is spaced apart from a side surface of the power feeding via electrode, and surrounds at least a portion of the side surface of the power feeding via electrode.

IPC Classes  ?

• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
• H01Q 1/48 - Earthing means; Earth screens; Counterpoises

Abstract

An antenna module is provided. An antenna module includes a radiation pattern that functions as an antenna; a base layer disposed on one side of the radiation pattern and implemented by stacking a plurality of low-temperature co-fired ceramic (LTCC) substrates to have a connection pattern electrically connected to the radiation pattern; an RF chipset electrically connected to the radiation pattern through the connection pattern to generate an RF signal to be transmitted from the radiation pattern or to process an RF signal received from the antenna; a thermal interface material (TIM) disposed at one side of the RF chipset to transfer heat generated from the RF chipset; a heat sink disposed at one side of the TIM to spread heat transferred from the TIM; and a fan disposed at one side of the heat sink to cool the heat sink by introducing outside air.

IPC Classes  ?

• H01Q 1/02 - Arrangements for de-icing; Arrangements for drying-out
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 9/04 - Resonant antennas

Abstract

A magnetic shielding sheet for a wireless power reception module is provided. A magnetic shielding sheet for a wireless power reception module according to an exemplary embodiment of the present invention, which is applied to a wireless power reception module capable of a wireless power share (WPS) function and has an overall thickness of 150 μm or less. The magnetic shielding sheet includes a first sheet made of a magnetic material to shield a magnetic field, and a second sheet laminated as a monolayer on one surface of the first sheet by means of a bonding adhesive layer, wherein the second sheet is provided to have a smaller thickness than a thickness of the first sheet while having a saturation magnetic flux density twice or more than a saturation magnetic flux density of the first sheet.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01F 38/14 - Inductive couplings
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

An injection-molding-type magnetic field shielding member is provided. The injection-molding-type magnetic field shielding member according to one embodiment of the present invention comprises: a base part including an arrangement hole that penetrates the center so as to have a predetermined area; a ring-shaped first shielding part, which protrudes a predetermined height from the base part along the edge of the arrangement hole; and an antenna accommodation part which is defined by one surface of the first shielding part and one surface of the base part, and which is formed on the one surface of the base part in the circumferential direction of the first shielding part, wherein the base part and the first shielding part can be integrated through injection molding by using any one material from among ferrite powder, sandust, and nano-grain alloy powder.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 1/03 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
• H01F 1/10 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites
• H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
• H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment

Abstract

Disclosed is a wireless power transmitting module comprising: a coil unit provided with a coil body in which a conductive member having a predetermined length is wound in one direction, and with a planar coil including a pair of terminal portions extending from the coil body by a predetermined length for electrical connection; a main shielding sheet arranged on one surface of the coil unit to shield a magnetic field generated from the coil unit; an accommodating portion formed through the main shielding sheet so as to accommodate the thickness of at least one of the pair of terminal portions; and an auxiliary shielding sheet attached to one surface of the main shielding sheet so as to cover the accommodating portion in order to shield a magnetic field leaking through the accommodating portion, wherein the auxiliary shielding sheet has a relatively thinner thickness than the main shielding sheet.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries

Abstract

Disclosed is an magnetic field shielding sheet for an antenna module is applied to an antenna module comprising an antenna unit operating in a predetermined frequency band and a magnet for position alignment, and comprises: a main shielding sheet made of a magnetic material so as to be able to shield a magnetic field generated from the antenna unit; and at least one magnetic saturation-prevention member stacked on one side of the main shielding sheet so as to be able to prevent magnetic saturation of the main shielding sheet by inducing a direct magnetic field generated from the magnet, wherein the magnetic saturation-prevention member is provided in a number corresponding to the number of magnets provided in the antenna module and is positioned on one side of the main shielding sheet so as to be positioned at a position corresponding to the magnets provided in the antenna module.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

Disclosed are an airbag system for a vehicle and an operating method thereof. Disclosed is the airbag system of a vehicle, including an airbag module, the system comprising: a transmitting unit main module that, in response to receiving an airbag operating signal, generates information for generating a second voltage different from a first voltage to be supplied to other electronic components of a vehicle seat excluding the airbag module and outputs the generated information; a power transmitting unit that receives the information, converts power from a vehicle battery into an electric signal indicating the second voltage on the basis of the received information, and wirelessly transmits same; and a power receiving unit that wirelessly receives the electric signal indicating the second voltage, generates airbag driving power on the basis of the wirelessly received electric signal, and supplies the airbag driving power to the airbag module to operate the airbag module.

IPC Classes  ?

• B60R 21/017 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents including arrangements for providing electric power to the safety arrangements
• B60R 16/033 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems characterised by the use of electrical cells or batteries
• B60R 21/01 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents

Abstract

Disclosed is a waveguide having a first vertical transfer path formed at a lower plate coupled to a signal processing substrate, and having a horizontal transfer path and a second vertical transfer that are formed at an upper plate coupled to a radar antenna, and thus minimizing tolerance during assembly. The disclosed waveguide is constructed by stacking the upper plate on the upper surface of the lower plate, a first vertical through-hole is formed in the lower plate, a second vertical through-hole and a horizontal groove are formed in the upper plate, and the horizontal groove connects the first vertical through-hole and the second vertical through-hole to form a radio wave transfer path.

IPC Classes  ?

• H01P 3/12 - Hollow waveguides
• H05K 1/02 - Printed circuits - Details

Abstract

Disclosed is a radar antenna having an antenna and a waveguide that are coupled using a jig on which a plurality of alignment pins are arranged, and thus minimizing tolerance during assembly. The disclosed radar antenna comprises: an alignment jig having a plurality of alignment pins; a circuit board having a plurality of first alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the alignment jig; a waveguide having a plurality of second alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the circuit board; and an antenna having a plurality of third alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the waveguide.

IPC Classes  ?

• H01Q 13/06 - Waveguide mouths
• H01P 3/12 - Hollow waveguides
• G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver

Abstract

Disclosed is a radar antenna which has a shielding space corresponding to each antenna of an antenna body by using an accommodation hole of a shielding member to prevent mutual coupling between antennas. The disclosed radar antenna comprises an antenna body which has a first surface and a second surface and in which a plurality first slot groups are formed to be spaced apart from each other on the first surface, and a shielding member which is stacked on the first surface of the antenna body and in which a plurality of accommodation holes are formed to respectively overlap the plurality of first slot groups.

IPC Classes  ?

• H01Q 13/10 - Resonant slot antennas
• G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

A voice processing device is disclosed. The voice processing device comprises: a voice processing circuit configured to generate an isolated voice signal associated with respective voices spoken at a plurality of sound source locations in a vehicle by isolating, and output an interpretation result for the respective voices on the basis of the isolated voice signal; a memory configured to store source language information indicating a source language and target language information indicating a target language in order to interpret the voice associated with the isolation voice signal; and a communication circuit configured to output the interpretation result, wherein the voice processing circuit generates the interpretation result in which the language of the voice corresponding to the isolated voice signal is interpreted from the source language into the target language.

IPC Classes  ?

• G10L 21/0272 - Voice signal separating
• G10L 15/00 - Speech recognition
• H04R 5/027 - Spatial or constructional arrangements of microphones, e.g. in dummy heads

Abstract

A mobile terminal is disclosed. The mobile terminal comprises: a microphone configured to generate a voice signal in response to voices of speakers; a processor configured to generate a separated voice signal associated with each of the voices by separating the voice signal from a sound source on the basis of a sound source location of each of the voices, and output the result of translation for each of the voices, on the basis of the separated voice signal; and a memory configured to store source language information indicating source languages that are uttered languages of the voices of the speakers. The processor outputs the results of translations in which the languages of the voices of the speakers have been translated from the source languages into a target language, on the basis of the source language information and the separated voice signal.

IPC Classes  ?

• G10L 21/0272 - Voice signal separating
• G10L 15/00 - Speech recognition
• H04R 5/027 - Spatial or constructional arrangements of microphones, e.g. in dummy heads

Abstract

Disclosed is a speech processing device. The speech processing device comprises: a speech reception circuit configured to receive a speech signal associated with speech uttered by speakers; a speech processing circuit configured to perform sound source separation for the speech signal on the basis of a sound source position of the speech so as to generate a separated speech signal associated with the speech and generate a translation result for the speech by using the separated speech signal; a memory; and an output circuit configured to output the translation result for the speech, wherein the sequence in which transmission results are output is determined on the basis of an utterance time point of the speech.

IPC Classes  ?

• G10L 21/0272 - Voice signal separating
• G10L 15/00 - Speech recognition
• G10L 25/87 - Detection of discrete points within a voice signal

Abstract

A wireless power transmission system is provided. The wireless power transmission system, according to an embodiment of the present invention, comprises: a transmission unit including a first shielding sheet and an antenna for transmitting wireless power, which is arranged on one surface of the first shielding sheet; and a reception unit including a second shielding sheet and an antenna for receiving wireless power, which is arranged on one surface of the second shielding sheet to face the antenna for transmitting wireless power, wherein the antenna for transmitting wireless power may include a first transmission antenna portion arranged on one surface of a first horizontal portion and a second transmission antenna portion arranged on one surface of a first wing portion, and the antenna for receiving wireless power may include a first reception antenna portion arranged on one surface of a second horizontal portion to face the first transmission antenna portion and a second reception antenna portion arranged on one side of a second wing portion to face the second transmission antenna portion.

IPC Classes  ?

• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 38/14 - Inductive couplings
• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 5/00 - Coils
• H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• H01F 5/02 - Coils wound on non-magnetic supports, e.g. formers

Abstract

The present invention relates to a waveguide comprising: a first body and a second body which are injected-molded, have metal-coated surfaces, and are connected in the up-down or left-right direction so as to form a transmission space in which radio waves can move in the longitudinal direction; and a first coupling surface and a second coupling surface which come into surface contact with each other when the first body and the second body are coupled, wherein the coupling surfaces are coupled through a coupling body, or by forming a bending structure in which protrusions and grooves formed on the coupling surfaces are engaged with each other.

IPC Classes  ?

• H01P 3/12 - Hollow waveguides
• H01P 1/04 - Fixed joints

Abstract

A wireless power transmission module is provided. The wireless power transmission module, according to an embodiment of the present invention, comprises: a wireless power transmission antenna for transmitting wireless power; a shielding member that is made of a ferrite material to shield a magnetic field generated from the wireless power transmission antenna and includes an accommodation groove drawn in from one surface to a certain depth to accommodate the wireless power transmission antenna; and a separation prevention member that is provided in the shielding member to prevent a portion of the shielding member surrounding the outer edge of the wireless power transmission antenna, which is arranged in the accommodation groove while forming the accommodation groove, from being separated from the shielding member.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 1/10 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites
• H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
• C09J 1/00 - Adhesives based on inorganic constituents
• C09J 7/00 - Adhesives in the form of films or foils

Abstract

The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate; an upper ceramic substrate which is disposed spaced apart from the upper portion of the lower ceramic substrate, and on the lower surface of which a semiconductor chip is mounted; spacers each having one end bonded to the lower ceramic substrate and the other end bonded to the upper ceramic substrate; first bonding layers each bonding the one end of each spacer to the lower ceramic substrate; and second bonding layers each bonding the other end of each spacer to the upper ceramic substrate. The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 23/373 - Cooling facilitated by selection of materials for the device

Abstract

A voice processing device is disclosed. The voice processing device comprises: a voice data receiving circuit receives input voice data associated with voices of speakers; a memory stores starting language data; a voice data output circuit outputs output voice data associated with the voices of the speakers; and a processor generates a control command for outputting the output voice data, wherein the processor uses the input voice data to generate first speaker position data indicating a position of a first speaker of the speakers and first output voice data associated with a voice of the first speaker, reads first source language data corresponding to the first speaker position data with reference to the memory, and transmits, to the voice data output circuit, a control command for outputting the first output voice data to a translation environment for translating a first source language indicated by the first starting language data.

IPC Classes  ?

• G06F 40/47 - Machine-assisted translation, e.g. using translation memory
• G10L 17/22 - Interactive procedures; Man-machine interfaces
• H04R 3/00 - Circuits for transducers
• G10L 17/02 - Preprocessing operations, e.g. segment selection; Pattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal components; Feature selection or extraction
• H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
• G10L 21/028 - Voice signal separating using properties of sound source
• H04R 1/10 - Earpieces; Attachments therefor

Abstract

The present invention relates to a power module and a manufacturing method therefor, the power module comprising: a base plate having recessed grooves formed on the upper surface thereof; brazing filler layers arranged in the recessed grooves; and a ceramic substrate brazed to the upper surface of the base plate by means of the brazing filler layers. The present invention solves an existing soldering problem, enables reliable joining to various base plates, and can simplify processes.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device

Abstract

A folding plate according to an embodiment of the present invention has first and second support portions located on both sides of a folding portion that is foldable, and is formed as a multilayer structure in which first and second metal sheets of different metal materials are braze-bonded, and thus, is thin and lightweight, has excellent flexibility, and easily dissipates heat.

IPC Classes  ?

• H04M 1/02 - Constructional features of telephone sets
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• B32B 15/02 - Layered products essentially comprising metal in a form other than a sheet, e.g. wire, particles
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a power source-less sensor device. A power source-less sensor device according to an exemplary embodiment of the present invention comprises: a sensor module which includes a sensing unit including at least one sensor and includes a communication unit for transmitting, to the outside, information sensed from the sensing unit; a capacitor for providing driving power to the sensor module; and an NFC antenna module for generating an induced current so as to charge the capacitor during NFC tagging. The sensor module is periodically driven by using power charged in the capacitor.

IPC Classes  ?

• G06K 7/00 - Methods or arrangements for sensing record carriers
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling

Abstract

Disclosed is a voice processing device. The voice processing device comprises a memory and a processor configured to perform sound source isolation on voice signals associated with the voices of speakers on the basis of the sound source positions of the respective voices. The processor is configured to: generate sound source position information indicating the sound source positions of the respective voices using the voice signals associated with the voices; generate isolated voice signals associated with the voices of the respective speakers from the voice signals on the basis of the sound source position information; and match the isolated voice signals and the voice source position information and store the same in the memory.

IPC Classes  ?

• G10L 17/06 - Decision making techniques; Pattern matching strategies
• G10L 25/78 - Detection of presence or absence of voice signals
• G10L 15/00 - Speech recognition

Abstract

An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: a circuit board; a radiation pattern formed on at least one surface of the circuit board and formed in a loop shape to have an empty space part formed at a central part thereof; a first shielding sheet stacked on the upper surface of the circuit board to include an area corresponding to the empty space part; and a second shielding sheet stacked on the lower surface of the circuit board to include an area corresponding to the empty area part, wherein the first shielding sheet and the second shielding sheet are disposed such that the areas corresponding to the empty space part on the opposite surfaces of the circuit board overlap each other.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) which is disposed above the lower ceramic substrate (200) and has a semiconductor chip (G) mounted on the lower surface thereof; a PCB substrate (400) disposed above the upper ceramic substrate (300); and a connection pin (800) which extends through through holes (320 and 420) formed in the upper ceramic substrate (300) and the PCB substrate (400), and vertically connects electrode patterns (a, b, c, and d) formed on the upper ceramic substrate (300) and the PCB substrate (400). The present invention provides a shortened electrical connection distance between the upper ceramic substrate and the PCB substrate, and thus can minimize a current path and enhance the moving efficiency of a high-speed current.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups

Abstract

The present invention relates to a hybrid base plate and a manufacturing method therefor. Metal sheets of different materials having excellent thermal conductivity can be joined to have a thickness favorable for heat dissipation, and by arranging a metal sheet of a material with a low coefficient of thermal expansion between metal sheets with a high coefficient of thermal expansion, there is an effect of preventing warpage when manufacturing a large-area heat sink.

IPC Classes  ?

• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic

Abstract

Disclosed is a voice processing device. The voice processing device comprises: a voice data reception circuit configured to receive input voice data associated with the voice of a speaker; a wireless signal reception circuit configured to receive a wireless signal including a terminal ID from a speaker terminal of the speaker; a memory; and a processor configured to generate terminal location data indicating the location of the speaker terminal on the basis of the wireless signal, and match and store the generated terminal location data and the terminal ID in the memory, wherein the processor uses the input voice data to generate first speaker location data and first output voice data associated with a first voice spoken at the first location and matches a first terminal ID corresponding to the first speaker location data and the first output voice data.

IPC Classes  ?

• G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
• G10L 17/04 - Training, enrolment or model building
• B60W 50/08 - Interaction between the driver and the control system

Abstract

A disposable electronic thermometer is provided. The disposable electronic thermometer, according to an exemplary embodiment of the present invention, comprises: a base substrate including an adhesive layer formed on one surface to be attached to a body of a user; a control part including a circuit board arranged on one surface of the base substrate and at least one driving chip mounted on the circuit board; a temperature sensor arranged on one surface of the base substrate and electrically connected to the circuit board, to thus measure a body temperature of a user; an NFC antenna electrically connected to the circuit board and arranged on one surface of the base substrate to surround the circuit board; and a cover member attached to one surface of the base substrate to prevent external exposure of the circuit board, the temperature sensor, and the NFC antenna.

IPC Classes  ?

• A61B 5/01 - Measuring temperature of body parts
• G01K 13/20 - Clinical contact thermometers for use with humans or animals
• H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons

Abstract

An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: an antenna unit including an antenna pattern, which has a pattern portion and a lead portion formed, respectively, on both surfaces of a circuit board; a magnetic field shielding sheet including a sheet body made of a magnetic material to block a magnetic field, and a plurality of eddy current reducing pattern portions formed on the sheet body to reduce the generation of eddy current by increasing the resistance of the sheet body; and an insulation member arranged between the antenna unit and the magnetic field shielding sheet, wherein the antenna unit is provided in an asymmetric form in which the pattern portion and the lead portion respectively formed on both surfaces of the circuit board have different thicknesses.

IPC Classes  ?

• H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

Disclosed is a flexible PCB RF cable having a ground pattern that is divided into two ground patterns, which are connected through a connection pattern arranged in an area overlapped with a signal line pattern, and thus cracks are minimized during bending. The disclosed flexible PCB RF cable comprises: a signal line pattern interposed between a first dielectric sheet and a second dielectric sheet; first and second lower ground patterns, which are mesh patterns arranged to be spaced from each other below the first dielectric sheet; a lower connection pattern connected to the first and second lower ground patterns; first and second upper ground patterns, which are mesh patterns arranged to be spaced from each other above the second dielectric sheet; and an upper connection pattern connected to the first and second ground patterns.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details
• H05K 1/14 - Structural association of two or more printed circuits

Abstract

Proposed are a radar antenna configured to form a waveguide through a partition wall on a plate having a plurality of slots, and a method for manufacturing same. The proposed radar antenna comprises: a first plate having an inner surface; and a second plate stacked so as to have an inner surface facing the inner surface of the first plate, wherein the first plate includes a partition wall extending in the direction of the second plate from the inner surface of the first plate, and the partition wall contacts the inner surface of the second plate to form a waveguide between the inner surface of the first plate and the inner surface of the second plate.

IPC Classes  ?

• H01Q 13/10 - Resonant slot antennas
• G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver

Abstract

The present invention relates to a ceramic substrate unit and a manufacturing method therefor. The ceramic substrate unit comprises: a ceramic substrate having metal layers on the upper and lower surfaces of the ceramic substrate; a heat dissipation spacer bonded to the upper metal layer of the ceramic substrate; and a heat sink bonded to the lower metal layer of the ceramic substrate, wherein the heat dissipation spacer is provided with an electrode in a region to which a semiconductor chip is bonded, so that the semiconductor chip may be bonded in the form of a flip chip.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/367 - Cooling facilitated by shape of device
• H05K 1/03 - Use of materials for the substrate

Abstract

The present invention relates to a power module comprising: an upper ceramic substrate (300); a PCB substrate (400) disposed spaced apart from the upper ceramic substrate (300); a plurality of semiconductor chips (G1, G2, G3, G4) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic substrate (300); and a plurality of capacitors (310) mounted on the top surface of the PCB substrate (400) to correspond to locations between the semiconductor chips (G1, G2, G3, G4). The present invention has the advantage of forming a short current path through which the semiconductor chips and the capacitors are connected, thereby increasing a circuit stabilization effect.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Abstract

The present disclosure relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing an Ag sintering paste in the form of a film. The present disclosure can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.

IPC Classes  ?

• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• C09J 5/06 - Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 135/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another ; Adhesives based on derivatives of such polymers
• C09J 11/04 - Non-macromolecular additives inorganic
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 23/498 - Leads on insulating substrates

Abstract

The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.

IPC Classes  ?

• H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
• H01R 4/02 - Soldered or welded connections
• H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
• H01R 4/70 - Insulation of connections
• H01R 12/58 - Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits

Abstract

A remote body temperature monitoring system is provided. A remote body temperature monitoring system according to an embodiment of the present invention comprises: a patch-type thermometer attached to the body of a user so as to periodically measure body temperature; a web service server for collecting information about the body temperature measured by the patch-type thermometer and notifying a manager terminal of a suspected fever; a collection device for receiving the information about the measured body temperature from the patch-type thermometer and transmitting same to the web service server; and an AI server for receiving the information about the body temperature from the web service server to manage a health status by using artificial intelligence.

IPC Classes  ?

• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
• A61B 5/01 - Measuring temperature of body parts
• H04W 4/14 - Short messaging services, e.g. short message service [SMS] or unstructured supplementary service data [USSD]
• H04W 4/80 - Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication

Abstract

The present invention relates to a phased array antenna module. The phased array antenna module comprises: a package antenna having a plurality of patch antennas formed on an upper surface thereof; and a substrate having the package antenna mounted thereon and having a connection pattern electrically connected to the package antenna, wherein the package antenna includes a plurality of package antennas. The plurality of package antennas are arranged on the top surface of the substrate in a 2N × 2N array arrangement and are mounted without a gap by making one side surface come into contact with each other. N is a natural number. The present invention has advantages capable of providing a high yield, and replacing only a corresponding portion when a defect occurs, and stably implementing a fast speed of 5G due to a low dielectric constant, and a low loss material and structure.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 9/04 - Resonant antennas
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture

Abstract

A wireless power transmission system is provided. A wireless power transmission system according to one embodiment of the present invention comprises: a first power transmission unit including a first shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a first coil wound a plurality of times in the longitudinal direction of the first shielding sheet so as to encompass the outer circumferential surface of the first shielding sheet; and a second power transmission unit including a second shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a second coil wound a plurality of times in the longitudinal direction of the second shielding sheet so as to encompass the inner circumferential surface of the second shielding sheet, wherein any one of the first coil and the second coil is a transmission coil for transmitting wireless power, and the other one is a reception coil for receiving wireless power, and the first power transmission unit and the second power transmission unit can perform wireless power transmission in a state in which the first power transmission unit is inserted into the second shielding sheet.

IPC Classes  ?

• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• H01F 38/14 - Inductive couplings
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

An electronic thermometer is provided. The electronic thermometer according to an exemplary embodiment of the present invention is for periodically measuring a body temperature by being attached to a body of a user, and comprises: at least one temperature sensor mounted on the one surface of a flexible circuit board; a memory unit for storing information obtained via the temperature sensor; a communication unit for externally transmitting the information stored in the memory unit; a control unit for controlling the operations of the temperature sensor, memory unit, and communication unit; a power supply unit arranged on the one surface of the flexible circuit board such that driving power can be provided; and a protection member surrounding the flexible circuit board such that external exposure of the temperature sensor, memory unit, communication unit, control unit, and power supply unit can be prevented.

IPC Classes  ?

• G01K 13/25 - Protective devices therefor, e.g. sleeves preventing contamination
• A61B 5/01 - Measuring temperature of body parts
• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons

Abstract

Provided is a magnetic field shielding module for an electric vehicle. The magnetic field shielding module for an electric vehicle according to an embodiment of the present invention is utilized in a wireless power transmission module for an electric vehicle, and comprises: a shielding layer including a plurality of unit blocks which are made of ferrite materials so as to be able to block a magnetic field generated from a flat coil in which a conductive member is wound multiple times; and a coil accommodation groove recessed to a certain depth from one surface of the shielding layer so as to be able to accommodate the thickness of the flat coil. The shielding layer is formed in a plate shape having a certain area by arranging the plurality of unit blocks adjacent to each other. At least some of the plurality of unit blocks include unit accommodation grooves for accommodating a portion of the flat coil, and the unit accommodation grooves respectively formed in the at least some of the unit blocks may be connected to each other in a state in which the plurality of unit blocks are arranged adjacent to each other, and thereby form the coil accommodation groove having a shape corresponding to the flat coil.

IPC Classes  ?

• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 27/36 - Electric or magnetic shields or screens
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• B60L 53/12 - Inductive energy transfer

Abstract

A magnetic field shielding module for an electric vehicle is provided. A magnetic field shielding module for an electric vehicle according to an embodiment of the present invention may comprise: a main shielding layer including a plurality of unit blocks made of a ferrite material to shield a magnetic field generated from a planar coil in which a conductive member is wound multiple times, the main shielding layer being formed in a plate shape having a predetermined area by the plurality of unit blocks arranged adjacent to each other; and an auxiliary shielding layer made of a magnetic material containing a metal component to supplement the main shielding layer, disposed on one surface of the main shielding layer, and including a penetrating portion formed in a shape corresponding to that of the planar coil.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
• H01F 38/14 - Inductive couplings
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• B60L 53/12 - Inductive energy transfer

Abstract

A magnetic shielding sheet for a reception antenna, and a wireless power reception module including same are provided. A magnetic shielding sheet for a reception antenna, according to an exemplary embodiment of the present invention, blocks the magnetic field induced in a reception antenna, and comprises: a planar first shielding sheet including a through-hole penetratively formed with a predetermined area in a region corresponding to a hollow portion of the reception antenna; and a second shielding sheet arranged to come in contact with one surface of the first shielding sheet, so as to block the magnetic field leaking through the through-hole.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

The present invention pertains to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same. By forming a protruding electrode integrated with an electrode pattern, the ceramic substrate can improve electrical conductivity when bonded to an electrode of a semiconductor device, can stably convert rated voltage and current while eliminating electrical hazards that can occur during wire bonding, and can improve reliability and efficiency when used in high power applications.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A data logger device capable of checking abnormal conditions of logistics is provided. According to an embodiment of the present invention, a data logger device capable of checking abnormal conditions of logistics is arranged outside the logistics, and may periodically store internal state information of the logistics and display whether or not abnormal conditions have occurred within the logistics, the device comprising: a temperature sensor mounted on one side of a flexible circuit board to measure the internal temperature of the logistics; a temperature label arranged around the temperature sensor and irreversibly changed in color in response to the internal temperature of the logistics; a circuit unit which is mounted on the flexible circuit board to drive the temperature sensor, store information measured by the temperature sensor, and transmit the stored information to the outside; a power supply unit which supplies driving power to the circuit unit; and a cover member which prevents exposure of the flexible printed circuit board, the circuit unit, and the power supply unit to the outside.

IPC Classes  ?

• G06F 11/30 - Monitoring
• G06Q 10/08 - Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
• G01K 11/12 - Measuring temperature based on physical or chemical changes not covered by group , , , or using changes in colour, translucency or reflectance
• G01K 1/024 - Means for indicating or recording specially adapted for thermometers for remote indication
• H01M 50/284 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
• H01M 6/40 - Printed batteries

Abstract

A data logger device is provided. The data logger device according to an example embodiment of the present invention comprises: a sensing unit mounted on one surface of a flexible printed circuit board, and including a sensor that detects at least one piece of information; a display unit that, when an abnormal state is detected on the basis of information measured via the sensing unit, irreversibly displays the abnormal state; a control unit that controls driving of the sensing unit and the display unit; a power supply unit that provides driving power to the control unit; and a cover member that prevents the outside exposure of the sensing unit, the display unit, the control unit, and the power supply unit.

IPC Classes  ?

• G08B 21/18 - Status alarms
• G01D 9/00 - Recording measured values
• G08B 5/00 - Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied

Abstract

Disclosed is an antenna module for wireless power transmission and reception, wherein a loop-shaped coil for wireless power transmission and reception is formed using two wires having different diameters, so that a reduction in charging efficiency is prevented. The disclosed antenna module for wireless power transmission and reception may comprise: a first coil which is wound around a first winding shaft to form a first loop and has a first coil diameter; a second coil which is wound around the outer periphery of the first coil to form a second loop and has a second coil diameter thicker than the first oil diameter; a base substrate disposed to overlap portions of the first coil and the second coil; and a coil connection pattern formed on one surface of the base substrate and connected to the first coil and the second coil.

IPC Classes  ?

• H02J 50/20 - Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power

Abstract

The present invention relates to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same, the power module electrically connecting, by means of a conductive spacer, an electrode of a semiconductor device and a metal layer pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk factors, which may be generated during wire bonding, and increasing reliability and efficiency when used with high power.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/03 - Use of materials for the substrate
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 1/02 - Printed circuits - Details
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat-dissipating magnetic field shielding sheet is provided. A magnetic field shielding sheet according to an embodiment of the present invention is implemented by including: a plurality of magnetic layers having at least one eddy current reduction pattern unit formed thereon; and a heat-dissipating magnetic field shielding unit including heat-dissipating adhesive members arranged between adjacent magnetic layers to improve the heat transfer in the thickness direction of the magnetic field shielding unit. By the magnetic field shielding sheet, the occurrence of eddy currents can be reduced, a high magnetic permeability of 2000 or more can be implemented while having a very thin thickness, and eddy currents that increase by selectively forming an eddy current reduction pattern locally in the area corresponding to the antenna among the entire area and the heat generated by the increase in eddy currents due to the thinner thickness according to the recent trend of being light, thin, short and miniaturized and the resulting decrease in resistance can be quickly discharged to the outside.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H01F 1/14 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
• H01F 27/22 - Cooling by heat conduction through solid or powdered fillings
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields

Abstract

Disclosed in the present disclosure is an antenna module for positioning, capable of measuring omnidirectional (that is, the X direction, Y direction and Z direction) positions while resolving shaded areas. The disclosed antenna module for positioning comprises a pair of transmission/reception antennas and a pair of reception antennas arranged to be orthogonal to each other, wherein: a UWB positioning signal is transmitted through one of the pair of transmission/reception antennas; a first UWB reception signal is received through one of the pair of reception antennas; a second UWB reception signal is received through the other one of the pair of transmission/reception antennas; and the position of an object to be measured is measured on the basis of the first and second UWB reception signals.

IPC Classes  ?

• H01Q 3/24 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching
• G01S 13/06 - Systems determining position data of a target
• G01S 13/02 - Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems

Abstract

An electromagnetic wave- and magnetic field-absorbing-and-shielding sheet is provided. An electromagnetic wave- and magnetic field-absorbing-and-shielding sheet according to one embodiment of the present invention is implemented by comprising: a plurality of magnetic layers stacked in order to block electromagnetic waves and magnetic fields; and an electromagnetic wave- and magnetic field-absorbing-and-shielding unit, which is arranged between the adjacent magnetic layers so as to absorb electromagnetic waves that have transmitted the magnetic layers or are reflected from the magnetic layers, and includes an electromagnetic wave-absorbing adhesive member for fixing the adjacent magnetic layers. Therefore, together with an electromagnetic wave- and magnetic field-shielding function, the present invention has a function of enabling most of the electromagnetic waves reflected during shielding to be absorbed to minimize influence on surrounding electronic components, electronic devices, or a user of the electronic devices, caused by the electromagnetic waves reflected during shielding and the magnetic field shielding, and thus can be widely applied to various electronic devices and the like.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01Q 17/00 - Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems

Abstract

Disclosed is an antenna performance test system for testing the performance of a UWB antenna and a BLE antenna by reflecting a loss of a cable without changing test conditions. The disclosed antenna performance test system comprises a tester, which: responds to an input of a first test mode setting signal so as to output, to a first antenna, a fist test signal, which is a UWB band signal, and then generate a UWB communication performance measurement value of a test terminal on the basis of a first response signal received from the first antenna and a second antenna with respect to the first test signal; and responds to an input of a second test mode setting signal so as to output, to the first antenna, a second test signal, which is a BLE band signal, and then generate a BLE communication performance measurement value of the test terminal on the basis of a second response signal received from the first antenna with respect to the second test signal.

IPC Classes  ?

• H04B 17/19 - Self-testing arrangements
• H04B 17/29 - Performance testing
• G01R 23/165 - Spectrum analysis; Fourier analysis using filters
• G01R 29/10 - Radiation diagrams of antennas
• G01R 29/08 - Measuring electromagnetic field characteristics

Abstract

The present invention relates to a heatsink-integrated ceramic substrate and a method for manufacturing same, the heatsink-integrated ceramic substrate comprising: a ceramic substrate including metal layers on the upper and lower surfaces of a ceramic base; and a heatsink bonded to one surface of a metal layer, wherein the heatsink may include a flat portion having one surface in contact with the metal layer, and a plurality of heat dissipation fins formed to protrude from the other surface of the flat portion to be spaced apart from each other and contacting a liquid-type refrigerant.

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements

Abstract

An antenna module is proposed in which a slit and a through-hole for grounding are additionally formed in a single radiator such that the antenna module resonates in two frequency bands or expands the bandwidth around a reference resonant frequency. The proposed antenna module includes a radiator having a first slit, and the radiator is divided into a first region and a second region with respect to the first slit, wherein a plurality of first through-holes and a second slit are formed in the first region, a second through-hole is formed in the second region, and a power feeding pattern is connected to a region between the first slit and the second slit in the first region.

IPC Classes  ?

• H01Q 13/10 - Resonant slot antennas
• H01Q 5/30 - Arrangements for providing operation on different wavebands

Abstract

A ceramic substrate according to the present invention includes: a ceramic base material; an electrode pattern formed on the ceramic base material; and at least one spacer arranged in any one of regions in the ceramic base material and the electrode pattern, in which a semiconductor chip is mounted.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H05K 1/02 - Printed circuits - Details
• H05K 1/03 - Use of materials for the substrate

Abstract

A voice processing device for generating translation results for voices of speakers is disclosed. The voice processing device comprises: a microphone for generating voice signals associated with voices of speakers in response to the voices of the speakers; a memory for storing location-language information indicating languages corresponding to sound source locations of the voices of the speakers; and a processor which uses the voice signals and the location-language information so as to generate translation results obtained by translating the languages of the voices of each speaker, and which uses the translation results so as to generate translation conference minutes including the voice contents of each speaker expressed in different languages.

IPC Classes  ?

• G10L 17/22 - Interactive procedures; Man-machine interfaces
• G10L 15/26 - Speech to text systems
• G10L 15/00 - Speech recognition
• H04R 3/00 - Circuits for transducers
• G06F 40/40 - Processing or translation of natural language

Abstract

A semiconductor package of the present invention comprises a base plate, an insulating substrate, and a lead frame, wherein the base plate is made of a metallic material including Cu and Be—Cu. The present invention can ensure bonding reliability and thus prevent performance degradation of semiconductor devices.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/498 - Leads on insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Abstract

The present invention relates to a ceramic substrate and a manufacturing method thereof, the ceramic substrate comprising: a ceramic base material; a first metal sheet attached to an upper portion of the ceramic base material and provided in the form of a circuit pattern; and a second metal sheet attached to a lower portion of the ceramic base material. The second metal sheet may include a flat portion in contact with the lower surface of the ceramic base material and a plurality of heat dissipation fins that are spaced apart from each other and protrude from a lower portion of the flat portion, wherein the heat dissipation fins are in contact with a liquid refrigerant.

IPC Classes  ?

• H01L 23/15 - Ceramic or glass substrates
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a silicon carbide (SiC) surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material

Abstract

A wireless power receiving device for an electric vehicle is provided. A wireless power receiving device for an electric vehicle, according to an exemplary embodiment of the present invention, comprises: a wireless power receiving coil for receiving wireless power to be transmitted from the outside; a coil support member which has a position fixing means formed at a position corresponding to the wireless power receiving coil so as to fix the wireless power receiving coil, and which is made of a material including a magnetic substance so as to shield the magnetic field; a ferrite core including a plurality of ferrite block bodies which have predetermined areas and which are arranged on one surface of the coil support member so as to be adjacent to each other; and a plate-shaped metal plate for covering one surface of the ferrite core by having a predetermined area.

IPC Classes  ?

• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• B60L 53/12 - Inductive energy transfer
• H01F 27/24 - Magnetic cores
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields

Abstract

The present invention relates to a power module comprising: a base plate; a ceramic substrate bonded to the top surface of the base plate; a semiconductor chip bonded to the top surface of the ceramic substrate; a spacer bonded to the top surface of the ceramic substrate so as to be spaced apart from the semiconductor chip; a connection pin provided at an electrode layer formed on the top surface of the spacer; and a wire bonding for connecting a terminal of the semiconductor chip to the electrode layer of the spacer.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Abstract

The present invention provides a plurality of floor-type pedestrian signals, in which a control signal and voltage control power are applied, the voltage control power is converted into constant current power in each floor-type pedestrian signal, and the constant current power is applied to an LED array according to the control signal. Through this, the present invention prevents the brightness of the floor-type pedestrian signal from lowering as the distance from a controller increases, and maintains a constant lighting time of the plurality of floor-type pedestrian signals, so that even if the width of a crosswalk increases, the visibility of the floor-type pedestrian signal is kept constant.

IPC Classes  ?

• G08G 1/07 - Controlling traffic signals
• E01F 9/582 - Traffic lines illuminated
• E01F 9/615 - Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings illuminated
• H05B 45/30 - Driver circuits

Abstract

The present invention relates to a laser diode package comprising: a ceramic substrate (110) formed in a cube shape; and a laser diode (120) mounted on one surface of the ceramic substrate (110), wherein the ceramic substrate (110) is mounted on a base circuit board (130) such that the light output direction of the laser diode (120) is vertical. The present invention has the advantage of increased efficiency, reduced number of processes and reducible size.

IPC Classes  ?

• H01S 5/02 - Structural details or components not essential to laser action

Abstract

The present invention relates to an inverter power module, comprising: a ceramic substrate (110); an LTCC substrate (120) disposed to be spaced apart from the upper portion of the ceramic substrate (110); and a semiconductor chip (130) having a lower surface bonded to a metal pattern (112) on the upper surface of the ceramic substrate (110) and an upper surface bonded to an external electrode (123) of the LTCC substrate (120). The present invention has the advantage of being able to provide an inverter power module having improved functions and operational reliability by applying a ceramic substrate and an LTCC substrate.

IPC Classes  ?

• H02M 7/00 - Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
• H02M 7/44 - Conversion of dc power input into ac power output without possibility of reversal by static converters
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
• H01L 23/62 - Protection against overcurrent or overload, e.g. fuses, shunts
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Disclosed is a voice processing apparatus for processing voices of a plurality of speakers. The voice processing apparatus comprises: a microphone configured to generate voice signals in response to the voices of the plurality of speakers; a communication circuit configured to transmit and receive data; memory; and a processor, wherein the processor, on the basis of instructions stored in the memory, performs sound source separation of the voice signals on the basis of sound source positions of each of the voices, generates separate voice signals associated with each of the voices according to the sound source separation, determines output modes corresponding to the sound source positions of each of the voices, and uses the communication circuit to output the separate voice signals according to the determined output modes.

IPC Classes  ?

• H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
• H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers

Abstract

An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base

Abstract

The present invention comprises: a circuit board; a laser diode mounted on the circuit board; a photodiode mounted on the circuit board; and a drive integrated circuit which is mounted on the circuit board and drives the laser diode and the photodiode, wherein the circuit board includes a circuit forming unit in which wiring layers for electrically connecting the drive integrated circuit to the laser diode are stacked. The present invention has an advantage in that the drive integrated circuit is included in a distance sensor module so as to be manufactured as a single module, and a ferrite chip bead is included in the module so as to reduce noise.

IPC Classes  ?

• G01S 7/481 - Constructional features, e.g. arrangements of optical elements

Abstract

According to the present invention: in order to track an accurate location of an asset, an asset location, which is a location of an asset terminal installed in the asset to be tracked, is measured; a relative location of the asset terminal, which is based on a reference terminal, is measured through communication between the reference terminal and the asset terminal; and the asset location is corrected using the relative location. Based on this, the present invention minimizes a measurement error of an asset location, compared to a scheme of measuring an asset location by using only GPS communication.

IPC Classes  ?

• G01S 5/02 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations using radio waves
• G01S 5/00 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations
• G01S 19/24 - Acquisition or tracking of signals transmitted by the system
• G01S 13/02 - Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
• G01S 13/76 - Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems wherein pulse-type signals are transmitted
• H04W 4/029 - Location-based management or tracking services

Abstract

Proposed is an antenna module for a small device, wherein the antenna module is expanded to a ground area through a metal plate, a metal wire, or a connector FPCB and the like to improve antenna gain. The proposed antenna module for a small device is provided with an antenna, and comprises: a circuit board mounted inside a housing of a small device; and a ground expansion member which is mounted inside the housing, comprises one of the metal plate, the metal wire, or the connector FPCB, and has a first end connected to a ground line of the antenna.

IPC Classes  ?

• H01Q 1/27 - Adaptation for use in or on movable bodies
• H01Q 1/48 - Earthing means; Earth screens; Counterpoises

Abstract

The present invention provides a floor-type walking signal device for installation in which the device is buried in the ground between a road and a sidewalk, comprising a reflector having a plurality of reflective surfaces respectively corresponding to a plurality of LED elements. The present invention can prevent the luminance from being lowered by using the reflector, even if the distance between light-exiting surfaces and the LED elements is relatively long, and can improve the luminance uniformity on the light exit surfaces.

IPC Classes  ?

• G08G 1/095 - Traffic lights
• E01F 9/582 - Traffic lines illuminated
• E01F 9/615 - Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings illuminated
• F21S 8/00 - Lighting devices intended for fixed installation
• F21V 7/10 - Construction
• F21Y 115/10 - Light-emitting diodes [LED]

Abstract

Provided is a magnetic field shielding sheet. A magnetic field shielding sheet according to an exemplary embodiment of the present invention is a magnetic field shielding sheet for an antenna, which includes a hollow portion having a predetermined area in a central portion thereof and a pattern portion configured to surround the hollow portion, includes a sheet body formed as a ribbon sheet including at least one selected from an amorphous alloy and a nanocrystalline alloy, a plurality of through-portions formed in a region of the sheet body corresponding to the pattern portion, and a plurality of cracks formed to extend from the through-portions.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H02J 50/20 - Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H04B 5/00 - Near-field transmission systems, e.g. inductive loop type

Abstract

Proposed is a radar antenna to which detachable modules including one or more antennas are coupled. The proposed radar antenna comprises: a first detachable module in which one or more antennas are formed; and a second detachable module in which one or more antennas are formed, wherein a first side surface of the second detachable module is bonded to a first side surface of the first detachable module.

IPC Classes  ?

• H01Q 1/32 - Adaptation for use in or on road or rail vehicles
• H01Q 13/10 - Resonant slot antennas

Abstract

Provided are a magnetic field shielding sheet and a wireless power transmission module including same. The magnetic field shielding sheet according to an embodiment of the present invention is attached to a wireless power transmission antenna and a wireless communication antenna, and comprises: a shielding part made of a magnetic material so as to be able to shield against a magnetic field; and at least one eddy current-reducing pattern part which is formed in the shielding part to increase the resistance of the shielding part and thereby reduce the generation of eddy currents. The eddy current-reducing pattern part includes: a first eddy current-reducing pattern part that intersects with both the wireless power transmission antenna and the wireless communication antenna; and a second eddy current-reducing pattern part that intersects with the wireless communication antenna.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

The present invention suggests a radar antenna in which a rounded edge surface is formed in a receiving hole formed by an antenna body and a shielding frame. The suggested radar antenna comprises: an antenna body having a plurality of first slots formed on a first surface thereof; and a shielding frame through which reception holes for receiving the plurality of first slots are formed, the reception holes being arranged on the first surface of the antenna body to receive the plurality of first slots, wherein a corner at which the inner wall surface of the shielding frame is connected to the first surface of the antenna body is formed to have a round structure.

IPC Classes  ?

• H01Q 13/10 - Resonant slot antennas
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

The present invention relates to a power module and a manufacturing method therefor, the power module using a conductive spacer to electrically connect an electrode of a semiconductor chip and an electrode pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk elements, which can be generated during wire bonding, and increasing reliability and efficiency when used with high power.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/492 - Bases or plates
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Abstract

A coil manufacturing apparatus is provided. The coil manufacturing apparatus according to an embodiment of the present invention comprises: a wire mounting part having an outer circumferential surface on which a wire can be wound; a first winding plate part rotatably supporting the wire mounting part; a second winding plate part disposed opposite to the first winding plate part; and a pressure part disposed between the first winding plate part and the second winding plate part and pressing the wire toward the wire mounting part while the wire is wound on the wire mounting part.

IPC Classes  ?

• H01F 41/06 - Coil winding
• H01F 5/00 - Coils

Abstract

The present invention is a method of manufacturing a ceramic substrate, the method including forming a mask on one surface of a metal layer, forming an inclined protrusion by etching the metal layer exposed by the mask, and bonding the metal layer on which the inclined protrusion is formed to a ceramic base material, and according to the present invention, the inclined protrusion is formed on an outer perimeter of the metal layer bonded to the ceramic base material to increase a bonding strength between the ceramic base material and the metal layer and facilitate a metal layer etching process.

IPC Classes  ?

• C23F 1/02 - Local etching
• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B23K 103/00 - Materials to be soldered, welded or cut

Abstract

The present invention relates to a method of manufacturing a power module. The method involves joining a base plate and a ceramic substrate by brazing while pressing same with an upper jig and a lower jig, and thus can suppress bending, improve joint reliability, and increase heat dissipation.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/367 - Cooling facilitated by shape of device
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided are a magnetic field shielding sheet and a manufacturing method therefor. The magnetic field shielding sheet, according to one embodiment of the present invention, comprises: a sheet main body formed from a magnetic material so as to be capable of shielding a magnetic field; a first protection layer disposed so as to cover one surface of the sheet main body; a second protection layer disposed so as to cover the other surface, opposite from the one surface, of the sheet main body; a third protection layer interposed between the first protection layer and the second protection layer so as to cover the side surface of the sheet main body in the thickness direction of the sheet main body; and a sealing part formed on the side portion of the sheet main body so that the sheet main body is sealed, wherein a stepped portion formed between the sheet main body and the sealing part is reduced by means of the third protection layer.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01F 27/36 - Electric or magnetic shields or screens

Abstract

The present invention relates to a power module and a method for producing same, in which the bottom electrode layer of a ceramic substrate is inserted into recesses of a base plate, and, with the ceramic substrate stacked on the base plate, adhesion via brazing is carried out, thus improving adhesion reliability, preventing flexure, and provides highly efficient heat dissipation.

IPC Classes  ?

• H01L 23/15 - Ceramic or glass substrates
• H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group

Abstract

An electrostatic chuck is provided. An electrostatic chuck according to one embodiment of the present invention is implemented by comprising a silicon nitride sintered body and an electrostatic electrode embedded in the silicon nitride sintered body. Therefore, the present invention includes a ceramic sintered body, which is silicon nitride, to have excellent plasma resistance, chemical resistance and thermal shock resistance while exhibiting heat dissipation performance of a level equivalent or similar to that of an aluminum nitride ceramic sintered body, which has been conventionally and widely used, and thus can be widely used in a semiconductor process.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material

Abstract

Presented is a position-measuring device using UWB antenna, the position-measuring device distinguishing measurement targets positioned indoors from measurement targets positioned outdoors on the basis of UWB signals received from a plurality of UWB antennas. The presented position-measuring device includes: a first UWB antenna; a second UWB antenna; a third UWB antenna; a signal processing module which outputs a signal received from the first UWB antenna and a UWB signal received from at least one among the second UWB antenna and the third UWB antenna; and a position-measuring module which measures the position of the measurement target on the basis of the UWB signals output from the signal processing module.

IPC Classes  ?

• G01S 13/87 - Combinations of radar systems, e.g. primary radar and secondary radar
• G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
• H01Q 5/25 - Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems
• H01Q 23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

Disclosed is an electrostatic chuck sheet included in an electrostatic chuck for chucking a substrate by using electrostatic force. The electrostatic chuck sheet comprises: a first dielectric layer comprising a polymer material; a first electrode layer, which is arranged on the first dielectric layer and comprises first electrodes made of a conductive metal material; a second electrode layer, which is arranged on the second electrode layer and comprises second electrodes made of a conductive metal material; an interlayer dielectric layer, which is arranged between the first electrode layer and the second electrode layer and comprises a polymer material; and a protective layer, which is arranged on the second electrode layer and comprises a polymer material, wherein the first electrodes and the second electrodes are arranged so as not to overlap each other in the direction perpendicular to the electrostatic chuck sheet.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups

Abstract

Provided are a magnetic field shield sheet for a wireless charger, a method of manufacturing the sheet, and a receiver for the wireless charger by using the sheet. The sheet includes at least one layer thin magnetic sheet made of an amorphous ribbon separated into a plurality of fine pieces; a protective film that is adhered on one surface of the thin magnetic sheet via a first adhesive layer provided on one side of the protective film; and a double-sided tape that is adhered on the other surface of the thin magnetic sheet via a second adhesive layer provided on one side of the double-sided adhesive tape, wherein gaps among the plurality of fine pieces are filled by some parts of the first and second adhesive layers, to thereby isolate the plurality of fine pieces.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
• H01F 27/36 - Electric or magnetic shields or screens
• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01F 38/14 - Inductive couplings
• B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
• B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
• B32B 38/00 - Ancillary operations in connection with laminating processes
• H04B 5/00 - Near-field transmission systems, e.g. inductive loop type
• H01Q 7/08 - Ferrite rod or like elongated core

Abstract

A magnetic field shielding sheet according to one embodiment is a magnetic field shielding sheet for an antenna that includes a hollow portion formed in a central region and having a predetermined area and a pattern portion surrounding the hollow portion. The magnetic field shielding sheet includes a sheet body formed as a multi-layer sheet in which a plurality of sheets are stacked in multiple layers with adhesive layers therebetween, wherein the sheet body is a multi-layer sheet in which the plurality of sheets having a relatively lower magnetic permeability while having a relatively higher surface resistance along a stacking direction are sequentially stacked.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
• H02J 50/20 - Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields

Abstract

Provided is a wireless ear module having a UWB antenna to easily obtain location information of a wireless ear module case and ear modules. The wireless ear module comprises: ear modules for receiving and playing a sound source signal from an electronic device; and a case comprising an upper housing and a lower housing which are rotatably coupled, and for storing the ear modules. The ear modules and/or the case transmit a location positioning signal, and the location positioning signal is a signal for sensing the distance and direction from the electronic device to the ear modules or the case.

IPC Classes  ?

• H04R 1/10 - Earpieces; Attachments therefor
• H01Q 5/25 - Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems
• H01Q 1/12 - Supports; Mounting means

Abstract

Proposed is an antenna module in which a partial area, which overlaps with a magnet mounted on an antenna sheet, of the entire area of a shielding sheet is punched out to prevent the shielding sheet from being magnetically saturated (magnetized) by the magnet. The proposed antenna module comprises: the antenna sheet having a radiation pattern formed thereon and having a magnet array formed along the outer circumference of the radiation pattern inserted thereinto; and the shielding sheet laminated on the antenna sheet, and having an anti-overlapping hole formed in the area overlapping with the magnet array.

IPC Classes  ?

• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

The present invention has a circular or arc-shaped magnet array disposed around a receiving coil and transmitting coil for wireless power transmission, thereby increasing the alignment accuracy of the receiving coil and transmitting coil, and prevents the deterioration of properties such as inductance, charging efficiency, etc.

IPC Classes  ?

• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

A magnetic shielding sheet and a manufacturing method therefor are provided. The magnetic shielding sheet according to an embodiment of the present invention, which is placed on one surface of an antenna comprising a hollow part disposed at the center thereof and having a predetermined area and a pattern part surrounding the hollow part, may comprise: a sheet body which is made of a magnetic material so as to be able to shield a magnetic field; and at least one eddy current-reducing pattern part which is formed in the sheet body so as to increase the resistance of the sheet body so that the occurrence of eddy current can be reduced.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets

Abstract

A facial mask for skin care is provided. According to the present invention, provided is a facial mask for skin care, comprising: a mask member applied to the facial area of the human body; one or more vibrators provided in the mask member so as to transmit vibration to the skin; an actuating unit for transmitting the vibration of the vibrators toward the skin, and blocking the vibration transmitted to the mask member; and a control unit for individually controlling the plurality of vibrators.

IPC Classes  ?

• A61H 23/02 - Percussion or vibration massage, e.g. using supersonic vibration; Suction-vibration massage; Massage with moving diaphragms with electric or magnetic drive
• A61N 5/06 - Radiation therapy using light
• A41D 13/11 - Protective face masks, e.g. for surgical use, or for use in foul atmospheres
• A45D 44/00 - Other cosmetic or toiletry articles, e.g. for hairdressers' rooms

Abstract

Disclosed is a UWB antenna module arranged in the lateral direction of a portable terminal so as to prevent deterioration of communication performance while minimizing a mounting space. The disclosed UWB antenna module comprises: a planar base substrate; a plurality of radiation patterns arranged on the upper surface of the base substrate, and arranged so as to be spaced from each other; a switching element arranged on the lower surface of the base substrate and connected to the plurality of radiation patterns; and a communication chipset arranged to be spaced from the switching element on the lower surface of the base substrate, and connected to one of the plurality of radiation patterns through a switching operation of the switching element.

IPC Classes  ?

• H01Q 3/24 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching
• H01Q 21/30 - Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles