Abstract

Proposed is a hybrid communication device which enables multiple indoor and outdoor communications in association with an access point (AP) without a separate network construction. The proposed device is a hybrid communication device connected to an access point, the hybrid communication device comprising: a first communication module which receives a first signal from an external device by using a first communication scheme and transmits the received first signal to the access point by using the first communication scheme; a second communication module which receives a second signal from the external device by using a second communication scheme and transmits the received second signal to the access point by using the second communication scheme; and a third communication module which receives a third signal from the external device by using a third communication scheme and transmits the received third signal to the access point by using the third communication scheme, wherein the hybrid communication device is in the form of a USB-type dongle.

IPC Classes  ?

• H04L 69/18 - Multiprotocol handlers, e.g. single devices capable of handling multiple protocols
• H04W 88/10 - Access point devices adapted for operation in multiple networks, e.g. multi-mode access points
• G06F 13/38 - Information transfer, e.g. on bus

Abstract

The present invention relates to a wireless power supply device for a vehicle seat, capable of wirelessly supplying power to a vehicle seat that is moved along a moving line. The wireless power supply device for a vehicle seat, according to the present invention, comprises: a pair of rail frames having a first opening formed so that a seat connection portion connected to a vehicle seat can move linearly; a motor coupled to the seat connection portion and installed to allow linear movement within the rail frames; a wireless power transmission board fixed to the inside of the rail frames and comprising a plurality of transmission coils connected to a power supply inside a vehicle to wirelessly transmit power; a wireless power reception board which is disposed at a position opposite to the wireless power transmission board, comprises a plurality of reception coils for receiving power wirelessly transmitted from the transmission coils, and linearly moves in conjunction with the motor, wherein the wireless power transmission board and the wireless power reception board are installed perpendicularly to the bottom surface of the rail frames, at positions horizontally spaced apart from the motor.

IPC Classes  ?

• B60N 2/07 - Slide construction
• B60N 2/02 - Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles the seat or part thereof being movable, e.g. adjustable
• B60R 16/03 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems

Abstract

An injection-molding-type magnetic field shielding member is provided. The injection-molding-type magnetic field shielding member according to one embodiment of the present invention comprises: a base part including an arrangement hole that penetrates the center so as to have a predetermined area; a ring-shaped first shielding part, which protrudes a predetermined height from the base part along the edge of the arrangement hole; and an antenna accommodation part which is defined by one surface of the first shielding part and one surface of the base part, and which is formed on the one surface of the base part in the circumferential direction of the first shielding part, wherein the base part and the first shielding part can be integrated through injection molding by using any one material from among ferrite powder, sandust, and nano-grain alloy powder.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 1/03 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
• H01F 1/10 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites
• H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
• H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment

Abstract

Disclosed are an airbag system for a vehicle and an operating method thereof. Disclosed is the airbag system of a vehicle, including an airbag module, the system comprising: a transmitting unit main module that, in response to receiving an airbag operating signal, generates information for generating a second voltage different from a first voltage to be supplied to other electronic components of a vehicle seat excluding the airbag module and outputs the generated information; a power transmitting unit that receives the information, converts power from a vehicle battery into an electric signal indicating the second voltage on the basis of the received information, and wirelessly transmits same; and a power receiving unit that wirelessly receives the electric signal indicating the second voltage, generates airbag driving power on the basis of the wirelessly received electric signal, and supplies the airbag driving power to the airbag module to operate the airbag module.

IPC Classes  ?

• B60R 21/017 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents including arrangements for providing electric power to the safety arrangements
• B60R 16/033 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems characterised by the use of electrical cells or batteries
• B60R 21/01 - Electrical circuits for triggering safety arrangements in case of vehicle accidents or impending vehicle accidents

Abstract

A wireless power transmission system is provided. The wireless power transmission system, according to an embodiment of the present invention, comprises: a transmission unit including a first shielding sheet and an antenna for transmitting wireless power, which is arranged on one surface of the first shielding sheet; and a reception unit including a second shielding sheet and an antenna for receiving wireless power, which is arranged on one surface of the second shielding sheet to face the antenna for transmitting wireless power, wherein the antenna for transmitting wireless power may include a first transmission antenna portion arranged on one surface of a first horizontal portion and a second transmission antenna portion arranged on one surface of a first wing portion, and the antenna for receiving wireless power may include a first reception antenna portion arranged on one surface of a second horizontal portion to face the first transmission antenna portion and a second reception antenna portion arranged on one side of a second wing portion to face the second transmission antenna portion.

IPC Classes  ?

• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 38/14 - Inductive couplings
• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 5/00 - Coils
• H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• H01F 5/02 - Coils wound on non-magnetic supports, e.g. formers

Abstract

A wireless power transmission module is provided. The wireless power transmission module, according to an embodiment of the present invention, comprises: a wireless power transmission antenna for transmitting wireless power; a shielding member that is made of a ferrite material to shield a magnetic field generated from the wireless power transmission antenna and includes an accommodation groove drawn in from one surface to a certain depth to accommodate the wireless power transmission antenna; and a separation prevention member that is provided in the shielding member to prevent a portion of the shielding member surrounding the outer edge of the wireless power transmission antenna, which is arranged in the accommodation groove while forming the accommodation groove, from being separated from the shielding member.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 1/10 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites
• H02J 50/90 - Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
• C09J 1/00 - Adhesives based on inorganic constituents
• C09J 7/00 - Adhesives in the form of films or foils

Abstract

The present invention relates to a ceramic substrate unit and a manufacturing method therefor. The ceramic substrate unit comprises: a ceramic substrate having metal layers on the upper and lower surfaces of the ceramic substrate; a heat dissipation spacer bonded to the upper metal layer of the ceramic substrate; and a heat sink bonded to the lower metal layer of the ceramic substrate, wherein the heat dissipation spacer is provided with an electrode in a region to which a semiconductor chip is bonded, so that the semiconductor chip may be bonded in the form of a flip chip.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/367 - Cooling facilitated by shape of device
• H05K 1/03 - Use of materials for the substrate

Abstract

The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Abstract

The present invention relates to a phased array antenna module. The phased array antenna module comprises: a package antenna having a plurality of patch antennas formed on an upper surface thereof; and a substrate having the package antenna mounted thereon and having a connection pattern electrically connected to the package antenna, wherein the package antenna includes a plurality of package antennas. The plurality of package antennas are arranged on the top surface of the substrate in a 2N × 2N array arrangement and are mounted without a gap by making one side surface come into contact with each other. N is a natural number. The present invention has advantages capable of providing a high yield, and replacing only a corresponding portion when a defect occurs, and stably implementing a fast speed of 5G due to a low dielectric constant, and a low loss material and structure.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 9/04 - Resonant antennas
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture

Abstract

A wireless power transmission system is provided. A wireless power transmission system according to one embodiment of the present invention comprises: a first power transmission unit including a first shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a first coil wound a plurality of times in the longitudinal direction of the first shielding sheet so as to encompass the outer circumferential surface of the first shielding sheet; and a second power transmission unit including a second shielding sheet, which has both ends open, is formed in a hollow shape with a predetermined length, and has a closed-loop-shaped cross section in the direction perpendicular to the longitudinal direction, and a second coil wound a plurality of times in the longitudinal direction of the second shielding sheet so as to encompass the inner circumferential surface of the second shielding sheet, wherein any one of the first coil and the second coil is a transmission coil for transmitting wireless power, and the other one is a reception coil for receiving wireless power, and the first power transmission unit and the second power transmission unit can perform wireless power transmission in a state in which the first power transmission unit is inserted into the second shielding sheet.

IPC Classes  ?

• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• H01F 38/14 - Inductive couplings
• H01F 27/36 - Electric or magnetic shields or screens
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

Provided is a magnetic field shielding module for an electric vehicle. The magnetic field shielding module for an electric vehicle according to an embodiment of the present invention is utilized in a wireless power transmission module for an electric vehicle, and comprises: a shielding layer including a plurality of unit blocks which are made of ferrite materials so as to be able to block a magnetic field generated from a flat coil in which a conductive member is wound multiple times; and a coil accommodation groove recessed to a certain depth from one surface of the shielding layer so as to be able to accommodate the thickness of the flat coil. The shielding layer is formed in a plate shape having a certain area by arranging the plurality of unit blocks adjacent to each other. At least some of the plurality of unit blocks include unit accommodation grooves for accommodating a portion of the flat coil, and the unit accommodation grooves respectively formed in the at least some of the unit blocks may be connected to each other in a state in which the plurality of unit blocks are arranged adjacent to each other, and thereby form the coil accommodation groove having a shape corresponding to the flat coil.

IPC Classes  ?

• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 27/36 - Electric or magnetic shields or screens
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• B60L 53/12 - Inductive energy transfer

Abstract

A magnetic field shielding module for an electric vehicle is provided. A magnetic field shielding module for an electric vehicle according to an embodiment of the present invention may comprise: a main shielding layer including a plurality of unit blocks made of a ferrite material to shield a magnetic field generated from a planar coil in which a conductive member is wound multiple times, the main shielding layer being formed in a plate shape having a predetermined area by the plurality of unit blocks arranged adjacent to each other; and an auxiliary shielding layer made of a magnetic material containing a metal component to supplement the main shielding layer, disposed on one surface of the main shielding layer, and including a penetrating portion formed in a shape corresponding to that of the planar coil.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
• H01F 27/30 - Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
• H01F 38/14 - Inductive couplings
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• B60L 53/12 - Inductive energy transfer

Abstract

The present invention pertains to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same. By forming a protruding electrode integrated with an electrode pattern, the ceramic substrate can improve electrical conductivity when bonded to an electrode of a semiconductor device, can stably convert rated voltage and current while eliminating electrical hazards that can occur during wire bonding, and can improve reliability and efficiency when used in high power applications.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A data logger device capable of checking abnormal conditions of logistics is provided. According to an embodiment of the present invention, a data logger device capable of checking abnormal conditions of logistics is arranged outside the logistics, and may periodically store internal state information of the logistics and display whether or not abnormal conditions have occurred within the logistics, the device comprising: a temperature sensor mounted on one side of a flexible circuit board to measure the internal temperature of the logistics; a temperature label arranged around the temperature sensor and irreversibly changed in color in response to the internal temperature of the logistics; a circuit unit which is mounted on the flexible circuit board to drive the temperature sensor, store information measured by the temperature sensor, and transmit the stored information to the outside; a power supply unit which supplies driving power to the circuit unit; and a cover member which prevents exposure of the flexible printed circuit board, the circuit unit, and the power supply unit to the outside.

IPC Classes  ?

• G06F 11/30 - Monitoring
• G06Q 10/08 - Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
• G01K 11/12 - Measuring temperature based on physical or chemical changes not covered by group , , , or using changes in colour, translucency or reflectance
• G01K 1/024 - Means for indicating or recording specially adapted for thermometers for remote indication
• H01M 50/284 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
• H01M 6/40 - Printed batteries

Abstract

The present invention relates to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same, the power module electrically connecting, by means of a conductive spacer, an electrode of a semiconductor device and a metal layer pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk factors, which may be generated during wire bonding, and increasing reliability and efficiency when used with high power.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/03 - Use of materials for the substrate
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 1/02 - Printed circuits - Details
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat-dissipating magnetic field shielding sheet is provided. A magnetic field shielding sheet according to an embodiment of the present invention is implemented by including: a plurality of magnetic layers having at least one eddy current reduction pattern unit formed thereon; and a heat-dissipating magnetic field shielding unit including heat-dissipating adhesive members arranged between adjacent magnetic layers to improve the heat transfer in the thickness direction of the magnetic field shielding unit. By the magnetic field shielding sheet, the occurrence of eddy currents can be reduced, a high magnetic permeability of 2000 or more can be implemented while having a very thin thickness, and eddy currents that increase by selectively forming an eddy current reduction pattern locally in the area corresponding to the antenna among the entire area and the heat generated by the increase in eddy currents due to the thinner thickness according to the recent trend of being light, thin, short and miniaturized and the resulting decrease in resistance can be quickly discharged to the outside.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H01F 1/14 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
• H01F 27/22 - Cooling by heat conduction through solid or powdered fillings
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields

Abstract

Disclosed in the present disclosure is an antenna module for positioning, capable of measuring omnidirectional (that is, the X direction, Y direction and Z direction) positions while resolving shaded areas. The disclosed antenna module for positioning comprises a pair of transmission/reception antennas and a pair of reception antennas arranged to be orthogonal to each other, wherein: a UWB positioning signal is transmitted through one of the pair of transmission/reception antennas; a first UWB reception signal is received through one of the pair of reception antennas; a second UWB reception signal is received through the other one of the pair of transmission/reception antennas; and the position of an object to be measured is measured on the basis of the first and second UWB reception signals.

IPC Classes  ?

• H01Q 3/24 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching
• G01S 13/06 - Systems determining position data of a target
• G01S 13/02 - Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems

Abstract

An electromagnetic wave- and magnetic field-absorbing-and-shielding sheet is provided. An electromagnetic wave- and magnetic field-absorbing-and-shielding sheet according to one embodiment of the present invention is implemented by comprising: a plurality of magnetic layers stacked in order to block electromagnetic waves and magnetic fields; and an electromagnetic wave- and magnetic field-absorbing-and-shielding unit, which is arranged between the adjacent magnetic layers so as to absorb electromagnetic waves that have transmitted the magnetic layers or are reflected from the magnetic layers, and includes an electromagnetic wave-absorbing adhesive member for fixing the adjacent magnetic layers. Therefore, together with an electromagnetic wave- and magnetic field-shielding function, the present invention has a function of enabling most of the electromagnetic waves reflected during shielding to be absorbed to minimize influence on surrounding electronic components, electronic devices, or a user of the electronic devices, caused by the electromagnetic waves reflected during shielding and the magnetic field shielding, and thus can be widely applied to various electronic devices and the like.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01Q 17/00 - Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems

Abstract

Disclosed is an antenna performance test system for testing the performance of a UWB antenna and a BLE antenna by reflecting a loss of a cable without changing test conditions. The disclosed antenna performance test system comprises a tester, which: responds to an input of a first test mode setting signal so as to output, to a first antenna, a fist test signal, which is a UWB band signal, and then generate a UWB communication performance measurement value of a test terminal on the basis of a first response signal received from the first antenna and a second antenna with respect to the first test signal; and responds to an input of a second test mode setting signal so as to output, to the first antenna, a second test signal, which is a BLE band signal, and then generate a BLE communication performance measurement value of the test terminal on the basis of a second response signal received from the first antenna with respect to the second test signal.

IPC Classes  ?

• H04B 17/19 - Self-testing arrangements
• H04B 17/29 - Performance testing
• G01R 23/165 - Spectrum analysis; Fourier analysis using filters
• G01R 29/10 - Radiation diagrams of antennas
• G01R 29/08 - Measuring electromagnetic field characteristics

Abstract

The present invention relates to a heatsink-integrated ceramic substrate and a method for manufacturing same, the heatsink-integrated ceramic substrate comprising: a ceramic substrate including metal layers on the upper and lower surfaces of a ceramic base; and a heatsink bonded to one surface of a metal layer, wherein the heatsink may include a flat portion having one surface in contact with the metal layer, and a plurality of heat dissipation fins formed to protrude from the other surface of the flat portion to be spaced apart from each other and contacting a liquid-type refrigerant.

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements

Abstract

A voice processing device for generating translation results for voices of speakers is disclosed. The voice processing device comprises: a microphone for generating voice signals associated with voices of speakers in response to the voices of the speakers; a memory for storing location-language information indicating languages corresponding to sound source locations of the voices of the speakers; and a processor which uses the voice signals and the location-language information so as to generate translation results obtained by translating the languages of the voices of each speaker, and which uses the translation results so as to generate translation conference minutes including the voice contents of each speaker expressed in different languages.

IPC Classes  ?

• G10L 17/22 - Interactive procedures; Man-machine interfaces
• G10L 15/26 - Speech to text systems
• G10L 15/00 - Speech recognition
• H04R 3/00 - Circuits for transducers
• G06F 40/40 - Processing or translation of natural language

Abstract

The present invention relates to a ceramic substrate and a manufacturing method thereof, the ceramic substrate comprising: a ceramic base material; a first metal sheet attached to an upper portion of the ceramic base material and provided in the form of a circuit pattern; and a second metal sheet attached to a lower portion of the ceramic base material. The second metal sheet may include a flat portion in contact with the lower surface of the ceramic base material and a plurality of heat dissipation fins that are spaced apart from each other and protrude from a lower portion of the flat portion, wherein the heat dissipation fins are in contact with a liquid refrigerant.

IPC Classes  ?

• H01L 23/15 - Ceramic or glass substrates
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a silicon carbide (SiC) surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material

Abstract

The present invention relates to a power module comprising: a base plate; a ceramic substrate bonded to the top surface of the base plate; a semiconductor chip bonded to the top surface of the ceramic substrate; a spacer bonded to the top surface of the ceramic substrate so as to be spaced apart from the semiconductor chip; a connection pin provided at an electrode layer formed on the top surface of the spacer; and a wire bonding for connecting a terminal of the semiconductor chip to the electrode layer of the spacer.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Abstract

The present invention provides a plurality of floor-type pedestrian signals, in which a control signal and voltage control power are applied, the voltage control power is converted into constant current power in each floor-type pedestrian signal, and the constant current power is applied to an LED array according to the control signal. Through this, the present invention prevents the brightness of the floor-type pedestrian signal from lowering as the distance from a controller increases, and maintains a constant lighting time of the plurality of floor-type pedestrian signals, so that even if the width of a crosswalk increases, the visibility of the floor-type pedestrian signal is kept constant.

IPC Classes  ?

• G08G 1/07 - Controlling traffic signals
• E01F 9/582 - Traffic lines illuminated
• E01F 9/615 - Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings illuminated
• H05B 45/30 - Driver circuits

Abstract

The present invention relates to a laser diode package comprising: a ceramic substrate (110) formed in a cube shape; and a laser diode (120) mounted on one surface of the ceramic substrate (110), wherein the ceramic substrate (110) is mounted on a base circuit board (130) such that the light output direction of the laser diode (120) is vertical. The present invention has the advantage of increased efficiency, reduced number of processes and reducible size.

IPC Classes  ?

• H01S 5/02 - Structural details or components not essential to laser action

Abstract

The present invention relates to an inverter power module, comprising: a ceramic substrate (110); an LTCC substrate (120) disposed to be spaced apart from the upper portion of the ceramic substrate (110); and a semiconductor chip (130) having a lower surface bonded to a metal pattern (112) on the upper surface of the ceramic substrate (110) and an upper surface bonded to an external electrode (123) of the LTCC substrate (120). The present invention has the advantage of being able to provide an inverter power module having improved functions and operational reliability by applying a ceramic substrate and an LTCC substrate.

IPC Classes  ?

• H02M 7/00 - Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
• H02M 7/44 - Conversion of dc power input into ac power output without possibility of reversal by static converters
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
• H01L 23/62 - Protection against overcurrent or overload, e.g. fuses, shunts
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Disclosed is a voice processing apparatus for processing voices of a plurality of speakers. The voice processing apparatus comprises: a microphone configured to generate voice signals in response to the voices of the plurality of speakers; a communication circuit configured to transmit and receive data; memory; and a processor, wherein the processor, on the basis of instructions stored in the memory, performs sound source separation of the voice signals on the basis of sound source positions of each of the voices, generates separate voice signals associated with each of the voices according to the sound source separation, determines output modes corresponding to the sound source positions of each of the voices, and uses the communication circuit to output the separate voice signals according to the determined output modes.

IPC Classes  ?

• H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
• H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers

Abstract

An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base

Abstract

According to the present invention: in order to track an accurate location of an asset, an asset location, which is a location of an asset terminal installed in the asset to be tracked, is measured; a relative location of the asset terminal, which is based on a reference terminal, is measured through communication between the reference terminal and the asset terminal; and the asset location is corrected using the relative location. Based on this, the present invention minimizes a measurement error of an asset location, compared to a scheme of measuring an asset location by using only GPS communication.

IPC Classes  ?

• G01S 5/02 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations using radio waves
• G01S 5/00 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations
• G01S 19/24 - Acquisition or tracking of signals transmitted by the system
• G01S 13/02 - Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
• G01S 13/76 - Systems using reradiation of radio waves, e.g. secondary radar systems; Analogous systems wherein pulse-type signals are transmitted
• H04W 4/029 - Location-based management or tracking services

Abstract

The present invention provides a floor-type walking signal device for installation in which the device is buried in the ground between a road and a sidewalk, comprising a reflector having a plurality of reflective surfaces respectively corresponding to a plurality of LED elements. The present invention can prevent the luminance from being lowered by using the reflector, even if the distance between light-exiting surfaces and the LED elements is relatively long, and can improve the luminance uniformity on the light exit surfaces.

IPC Classes  ?

• G08G 1/095 - Traffic lights
• E01F 9/582 - Traffic lines illuminated
• E01F 9/615 - Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings illuminated
• F21S 8/00 - Lighting devices intended for fixed installation
• F21V 7/10 - Construction
• F21Y 115/10 - Light-emitting diodes [LED]

Abstract

Proposed is a radar antenna to which detachable modules including one or more antennas are coupled. The proposed radar antenna comprises: a first detachable module in which one or more antennas are formed; and a second detachable module in which one or more antennas are formed, wherein a first side surface of the second detachable module is bonded to a first side surface of the first detachable module.

IPC Classes  ?

• H01Q 1/32 - Adaptation for use in or on road or rail vehicles
• H01Q 13/10 - Resonant slot antennas

Abstract

Provided are a magnetic field shielding sheet and a wireless power transmission module including same. The magnetic field shielding sheet according to an embodiment of the present invention is attached to a wireless power transmission antenna and a wireless communication antenna, and comprises: a shielding part made of a magnetic material so as to be able to shield against a magnetic field; and at least one eddy current-reducing pattern part which is formed in the shielding part to increase the resistance of the shielding part and thereby reduce the generation of eddy currents. The eddy current-reducing pattern part includes: a first eddy current-reducing pattern part that intersects with both the wireless power transmission antenna and the wireless communication antenna; and a second eddy current-reducing pattern part that intersects with the wireless communication antenna.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

The present invention suggests a radar antenna in which a rounded edge surface is formed in a receiving hole formed by an antenna body and a shielding frame. The suggested radar antenna comprises: an antenna body having a plurality of first slots formed on a first surface thereof; and a shielding frame through which reception holes for receiving the plurality of first slots are formed, the reception holes being arranged on the first surface of the antenna body to receive the plurality of first slots, wherein a corner at which the inner wall surface of the shielding frame is connected to the first surface of the antenna body is formed to have a round structure.

IPC Classes  ?

• H01Q 13/10 - Resonant slot antennas
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

The present invention relates to a power module and a manufacturing method therefor, the power module using a conductive spacer to electrically connect an electrode of a semiconductor chip and an electrode pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk elements, which can be generated during wire bonding, and increasing reliability and efficiency when used with high power.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/492 - Bases or plates
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

Abstract

A coil manufacturing apparatus is provided. The coil manufacturing apparatus according to an embodiment of the present invention comprises: a wire mounting part having an outer circumferential surface on which a wire can be wound; a first winding plate part rotatably supporting the wire mounting part; a second winding plate part disposed opposite to the first winding plate part; and a pressure part disposed between the first winding plate part and the second winding plate part and pressing the wire toward the wire mounting part while the wire is wound on the wire mounting part.

IPC Classes  ?

• H01F 41/06 - Coil winding
• H01F 5/00 - Coils

Abstract

The present invention relates to a method of manufacturing a power module. The method involves joining a base plate and a ceramic substrate by brazing while pressing same with an upper jig and a lower jig, and thus can suppress bending, improve joint reliability, and increase heat dissipation.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/367 - Cooling facilitated by shape of device
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided are a magnetic field shielding sheet and a manufacturing method therefor. The magnetic field shielding sheet, according to one embodiment of the present invention, comprises: a sheet main body formed from a magnetic material so as to be capable of shielding a magnetic field; a first protection layer disposed so as to cover one surface of the sheet main body; a second protection layer disposed so as to cover the other surface, opposite from the one surface, of the sheet main body; a third protection layer interposed between the first protection layer and the second protection layer so as to cover the side surface of the sheet main body in the thickness direction of the sheet main body; and a sealing part formed on the side portion of the sheet main body so that the sheet main body is sealed, wherein a stepped portion formed between the sheet main body and the sealing part is reduced by means of the third protection layer.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01F 27/36 - Electric or magnetic shields or screens

Abstract

The present invention relates to a power module and a method for producing same, in which the bottom electrode layer of a ceramic substrate is inserted into recesses of a base plate, and, with the ceramic substrate stacked on the base plate, adhesion via brazing is carried out, thus improving adhesion reliability, preventing flexure, and provides highly efficient heat dissipation.

IPC Classes  ?

• H01L 23/15 - Ceramic or glass substrates
• H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group

Abstract

An electrostatic chuck is provided. An electrostatic chuck according to one embodiment of the present invention is implemented by comprising a silicon nitride sintered body and an electrostatic electrode embedded in the silicon nitride sintered body. Therefore, the present invention includes a ceramic sintered body, which is silicon nitride, to have excellent plasma resistance, chemical resistance and thermal shock resistance while exhibiting heat dissipation performance of a level equivalent or similar to that of an aluminum nitride ceramic sintered body, which has been conventionally and widely used, and thus can be widely used in a semiconductor process.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material

Abstract

Disclosed is an electrostatic chuck sheet included in an electrostatic chuck for chucking a substrate by using electrostatic force. The electrostatic chuck sheet comprises: a first dielectric layer comprising a polymer material; a first electrode layer, which is arranged on the first dielectric layer and comprises first electrodes made of a conductive metal material; a second electrode layer, which is arranged on the second electrode layer and comprises second electrodes made of a conductive metal material; an interlayer dielectric layer, which is arranged between the first electrode layer and the second electrode layer and comprises a polymer material; and a protective layer, which is arranged on the second electrode layer and comprises a polymer material, wherein the first electrodes and the second electrodes are arranged so as not to overlap each other in the direction perpendicular to the electrostatic chuck sheet.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• B23Q 3/15 - Devices for holding work using magnetic or electric force acting directly on the work
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups

Abstract

Provided is a wireless ear module having a UWB antenna to easily obtain location information of a wireless ear module case and ear modules. The wireless ear module comprises: ear modules for receiving and playing a sound source signal from an electronic device; and a case comprising an upper housing and a lower housing which are rotatably coupled, and for storing the ear modules. The ear modules and/or the case transmit a location positioning signal, and the location positioning signal is a signal for sensing the distance and direction from the electronic device to the ear modules or the case.

IPC Classes  ?

• H04R 1/10 - Earpieces; Attachments therefor
• H01Q 5/25 - Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems
• H01Q 1/12 - Supports; Mounting means

Abstract

Proposed is an antenna module in which a partial area, which overlaps with a magnet mounted on an antenna sheet, of the entire area of a shielding sheet is punched out to prevent the shielding sheet from being magnetically saturated (magnetized) by the magnet. The proposed antenna module comprises: the antenna sheet having a radiation pattern formed thereon and having a magnet array formed along the outer circumference of the radiation pattern inserted thereinto; and the shielding sheet laminated on the antenna sheet, and having an anti-overlapping hole formed in the area overlapping with the magnet array.

IPC Classes  ?

• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

The present invention has a circular or arc-shaped magnet array disposed around a receiving coil and transmitting coil for wireless power transmission, thereby increasing the alignment accuracy of the receiving coil and transmitting coil, and prevents the deterioration of properties such as inductance, charging efficiency, etc.

IPC Classes  ?

• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

A wireless power reception module is provided. A wireless power reception module according to an exemplary embodiment of the present invention comprises: an antenna unit which comprises a circuit board comprising first and second surfaces opposite to each other, a wireless power reception antenna formed in an antenna pattern on the first surface of the circuit board, a terminal pattern formed on the first surface of the circuit board and extending from the wireless power reception antenna by a predetermined length, and a first coverlay attached to the first surface of the circuit board; and a shielding unit comprising a magnetic sheet which is formed of a magnetic material so as to shield a magnetic field and has a side surface exposed to the outside, the shielding unit being disposed on one surface of the antenna unit so as to be placed in a position corresponding to the wireless power reception antenna, wherein the first coverlay is attached to the first surface so as to cover both the wireless power reception antenna, formed on the first surface, and a part of the entire length of the terminal pattern formed on the first surface.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

An antenna module is provided. The antenna module according to one embodiment of the present invention comprises: a plurality of directors provided so as to be distanced from one another on the upper surface of a first base layer; a second base layer disposed below the first base layer; a plurality of radiation patterns provided so as to be distanced from one another at positions corresponding to respective directors on the upper surface of the second base layer to function as antennas; an RF chipset disposed on the lower surface of the second base layer to transmit and receive RF signals; a connection pattern comprising a power-feeding via electrode passing through the second base layer, and electrically connecting the RF chipset and radiation patterns; and a grounding via electrode passing through one part of the second base layer and provided to be distanced from the side surface of the power-feeding via electrode and surround at least a portion of the side surface of same.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 5/335 - Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching

Abstract

The present invention relates to a method of manufacturing a power semiconductor module and a power semiconductor module manufactured thereby, the method comprising the steps of: removing thermal stress by annealing a base plate; disposing a brazing filler layer on the upper surface of the base plate; and laminating and brazing a ceramic substrate onto the base plate having the brazing filler layer disposed thereon.

IPC Classes  ?

• H01L 23/15 - Ceramic or glass substrates
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
• H01L 23/34 - Arrangements for cooling, heating, ventilating or temperature compensation
• H01L 23/498 - Leads on insulating substrates
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A method for manufacturing an antenna module ceramic substrate is provided. Provided is a method for manufacturing an antenna module ceramic substrate, according to one embodiment of the present invention, the method comprising the steps of: stacking a first base material layer and a second base material layer so that each of a radiation pattern formed between the first and second base material layers and a connection pattern formed inside the second base material layer to be electrically connected with the radiation pattern are provided; compressing the first and second base material layers; and calcinating the compressed first and second base material layers.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set

Abstract

An antenna module is provided. The antenna module according to an embodiment of the present invention includes: a radiation pattern having an antenna function; a substrate layer in which a plurality of low-temperature co-fired ceramic (LTCC) substrates are stacked and implemented so as to have a connection pattern arranged on one side of the radiation pattern to be electrically connected to the radiation pattern; an RF chipset electrically connected to the radiation pattern through the connection pattern to generate an RF signal to be transmitted from the radiation pattern or to process an RF signal received from the antenna; a thermal interface material (TIM) arranged on one side of the RF chipset to transfer heat generated by the RF chipset; a heat sink arranged on one side of the TIM to diffuse the heat transferred from the TIM; and a fan arranged on one side of the heat sink to cool the heat sink by introducing external air.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/02 - Arrangements for de-icing; Arrangements for drying-out

Abstract

Disclosed is a smart tracker for communicating with a parent terminal by Bluetooth communication and communicating with the parent terminal by ultra-wide band communication during positioning. The disclosed smart tracker comprises: a first housing; a second housing coupled to the first housing to form an inner space; a circuit board arranged in the inner space formed by the first housing and the second housing; a buzzer mounted on the lower surface of the circuit board; a battery mounted on a surface of the circuit board; a first antenna arranged on the upper surface of the circuit board and spaced from the areas on which the buzzer and the battery are mounted; and a second antenna arranged on the upper surface of the circuit board and spaced from the areas on which the buzzer and the battery are mounted and from the first antenna.

IPC Classes  ?

• G08B 21/02 - Alarms for ensuring the safety of persons
• G08B 21/24 - Reminder alarms, e.g. anti-loss alarms
• G08B 13/14 - Mechanical actuation by lifting or attempted removal of hand-portable articles
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set

Abstract

A data logger device is provided. A data logger device according to an embodiment of the present invention is fixed to the outer surface of freight and comprises: a memory unit for storing information regarding the freight; a communication unit for transmitting the information stored in the memory unit to the outside at the time of tagging; a sensing unit including a sensor for detecting an internal state of the freight so as to enable storing information regarding the internal state of the freight in the memory; a control unit for controlling an overall drive; and a power supply unit for supplying driving power to the control unit.

IPC Classes  ?

• G06K 7/10 - Methods or arrangements for sensing record carriers by corpuscular radiation
• G06Q 10/08 - Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

A data logger device is provided. A data logger device according to one embodiment of the present invention is arranged on the outer surface of a product to detect information about the product, and comprises: a main body including a case in which a circuit board is embedded and a circuit unit which is mounted on the circuit board so as to store the information about the product and transmit at least a part of the stored information to the outside; and a sensor connection member extending a predetermined length from the case toward the outside so that a sensing unit for detecting the state of the product can be attachably/detachably coupled thereto.

IPC Classes  ?

• G06K 7/10 - Methods or arrangements for sensing record carriers by corpuscular radiation
• G06Q 10/08 - Logistics, e.g. warehousing, loading or distribution; Inventory or stock management

Abstract

A data logger device is provided. The data logger device according to an embodiment of the present invention is fixed in logistics, and comprises: a first communication unit that includes a memory unit in which information regarding logistics has been stored, and, when being tagged by an RFID reader, communicates with the RFID reader so as to transmit, to a server via the RFID reader, information which has been acquired from the memory unit; and a second communication unit that, when being NFC tagged, transmits, to the outside, at least some of information which has been stored in the memory unit, wherein the first communication unit may be an RFID communication module including a first driving chip including the memory unit in which the information regarding the logistics has been stored, and an RFID antenna for wireless communication with the RFID reader, and the second communication unit may be an NFC antenna module including a second driving chip, and an NFC antenna for the NFC tagging.

IPC Classes  ?

• G06K 7/10 - Methods or arrangements for sensing record carriers by corpuscular radiation
• G06Q 10/08 - Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power

Abstract

Disclosed is a waveguide having a first vertical transfer path formed at a lower plate coupled to a signal processing substrate, and having a horizontal transfer path and a second vertical transfer that are formed at an upper plate coupled to a radar antenna, and thus minimizing tolerance during assembly. The disclosed waveguide is constructed by stacking the upper plate on the upper surface of the lower plate, a first vertical through-hole is formed in the lower plate, a second vertical through-hole and a horizontal groove are formed in the upper plate, and the horizontal groove connects the first vertical through-hole and the second vertical through-hole to form a radio wave transfer path.

IPC Classes  ?

• H01P 1/207 - Hollow waveguide filters

Abstract

A mobile terminal is disclosed. The mobile terminal comprises: a microphone configured to generate a voice signal in response to voices of speakers; a processor configured to generate a separated voice signal associated with each of the voices by separating the voice signal from a sound source on the basis of a sound source location of each of the voices, and output the result of translation for each of the voices, on the basis of the separated voice signal; and a memory configured to store source language information indicating source languages that are uttered languages of the voices of the speakers. The processor outputs the results of translations in which the languages of the voices of the speakers have been translated from the source languages into a target language, on the basis of the source language information and the separated voice signal.

IPC Classes  ?

• G06F 40/47 - Machine-assisted translation, e.g. using translation memory
• G10L 15/00 - Speech recognition
• G10L 21/0272 - Voice signal separating
• H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
• H04R 3/00 - Circuits for transducers

Abstract

Disclosed is a radar antenna which has a shielding space corresponding to each antenna of an antenna body by using an accommodation hole of a shielding member to prevent mutual coupling between antennas. The disclosed radar antenna comprises an antenna body which has a first surface and a second surface and in which a plurality of first slot groups are formed to be spaced apart from each other on the first surface, and a shielding member which is stacked on the first surface of the antenna body and in which a plurality of accommodation holes are formed to respectively overlap the plurality of first slot groups.

IPC Classes  ?

• H01Q 13/10 - Resonant slot antennas
• G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

Disclosed is a radar antenna having an antenna and a waveguide that are coupled using a jig on which a plurality of alignment pins are arranged, and thus minimizing tolerance during assembly. The disclosed radar antenna comprises: an alignment jig having a plurality of alignment pins; a circuit board having a plurality of first alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the alignment jig; a waveguide having a plurality of second alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the circuit board; and an antenna having a plurality of third alignment holes through which the plurality of alignment pins penetrate, and being stacked on the upper surface of the waveguide.

IPC Classes  ?

• H01Q 13/06 - Waveguide mouths
• G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver

Abstract

A magnetic field shielding sheet for an antenna module is provided. According to an exemplary embodiment of the present invention, the magnetic field shielding sheet for an antenna module is applied to an antenna module comprising an antenna unit operating in a predetermined frequency band and a magnet for position alignment, and comprises: a main shielding sheet made of a magnetic material so as to be able to shield a magnetic field generated from the antenna unit; and at least one magnetic saturation-prevention member stacked on one side of the main shielding sheet so as to be able to prevent magnetic saturation of the main shielding sheet by inducing a direct magnetic field generated from the magnet, wherein the magnetic saturation-prevention member is provided in a number corresponding to the number of magnets provided in the antenna module and is positioned on one side of the main shielding sheet so as to be positioned at a position corresponding to the magnets provided in the antenna module.

IPC Classes  ?

• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
• H04B 5/00 - Near-field transmission systems, e.g. inductive loop type
• G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code

Abstract

A wireless power transmitting module is provided. The wireless power transmitting module according to an exemplary embodiment of the present invention comprises: a coil unit provided with a coil body in which a conductive member having a predetermined length is wound in one direction, and with a planar coil including a pair of terminal portions extending from the coil body by a predetermined length for electrical connection; a main shielding sheet arranged on one surface of the coil unit to shield a magnetic field generated from the coil unit; an accommodating portion formed through the main shielding sheet so as to accommodate the thickness of at least one of the pair of terminal portions; and an auxiliary shielding sheet attached to one surface of the main shielding sheet so as to cover the accommodating portion in order to shield a magnetic field leaking through the accommodating portion, wherein the auxiliary shielding sheet has a relatively thinner thickness than the main shielding sheet.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H01F 38/14 - Inductive couplings
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H01F 27/36 - Electric or magnetic shields or screens
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

A voice processing device is disclosed. The voice processing device comprises: a voice processing circuit configured to generate an isolated voice signal associated with respective voices spoken at a plurality of sound source locations in a vehicle by isolating, on the basis of the respective sound source locations of the voices, sound sources from a voice signal associated with the voices, and output an interpretation result for the respective voices on the basis of the isolated voice signal; a memory configured to store source language information indicating a source language and target language information indicating a target language in order to interpret the voice associated with the isolated voice signal; and a communication circuit configured to output the interpretation result, wherein the voice processing circuit generates, with reference to the memory, the interpretation result in which the language of the voice corresponding to the isolated voice signal is interpreted from the source language into the target language.

IPC Classes  ?

• G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
• G06F 40/58 - Use of machine translation, e.g. for multi-lingual retrieval, for server-side translation for client devices or for real-time translation
• G10L 15/00 - Speech recognition
• H04R 1/32 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
• H04R 3/00 - Circuits for transducers
• G01S 3/808 - Systems for determining direction or deviation from predetermined direction using transducers spaced apart and measuring phase or time difference between signals therefrom, i.e. path-difference systems
• G06F 3/16 - Sound input; Sound output
• G10L 15/02 - Feature extraction for speech recognition; Selection of recognition unit
• G10L 15/26 - Speech to text systems
• G10L 13/08 - Text analysis or generation of parameters for speech synthesis out of text, e.g. grapheme to phoneme translation, prosody generation or stress or intonation determination

Abstract

Disclosed is a speech processing device. The speech processing device comprises: a speech reception circuit configured to receive a speech signal associated with speech uttered by speakers; a speech processing circuit configured to perform sound source separation for the speech signal on the basis of a sound source position of the speech so as to generate a separated speech signal associated with the speech and generate a translation result for the speech by using the separated speech signal; a memory; and an output circuit configured to output the translation result for the speech, wherein the sequence in which transmission results are output is determined on the basis of an utterance time point of the speech.

IPC Classes  ?

• G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
• G10L 17/02 - Preprocessing operations, e.g. segment selection; Pattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal components; Feature selection or extraction
• G10L 21/0272 - Voice signal separating
• G06F 40/40 - Processing or translation of natural language
• G10L 15/26 - Speech to text systems
• G10L 15/28 - Constructional details of speech recognition systems
• H04R 3/00 - Circuits for transducers
• G01S 3/808 - Systems for determining direction or deviation from predetermined direction using transducers spaced apart and measuring phase or time difference between signals therefrom, i.e. path-difference systems
• G10L 15/00 - Speech recognition
• G06F 3/16 - Sound input; Sound output

Abstract

Provided is a power source-less sensor device. A power source-less sensor device according to an exemplary embodiment of the present invention comprises: a sensor module which includes a sensing unit including at least one sensor and includes a communication unit for transmitting, to the outside, information sensed from the sensing unit; a capacitor for providing driving power to the sensor module; and an NFC antenna module for generating an induced current so as to charge the capacitor during NFC tagging. The sensor module is periodically driven by using power charged in the capacitor.

IPC Classes  ?

• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
• H04W 4/80 - Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
• H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• G01D 21/02 - Measuring two or more variables by means not covered by a single other subclass

Abstract

An electronic device is disclosed. An electronic device comprises: an image data receiving circuit configured to receive, from a camera, input image data associated with an image captured by the camera; a voice data receiving circuit configured to receive input voice data associated with the voices of speakers; a memory configured to store transform parameters for projecting a space coordinate system onto an image coordinate system on the image; and a processor, which determines a speaker's spatial location from the input voice data, converts same into the speaker's image location on the image, and inserts, into an input image, text associated with the speaker's voice according to the image location, so as to generate output image data.

IPC Classes  ?

• G10L 17/02 - Preprocessing operations, e.g. segment selection; Pattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal components; Feature selection or extraction
• G10L 15/26 - Speech to text systems
• G06T 7/70 - Determining position or orientation of objects or cameras
• H04R 3/00 - Circuits for transducers
• G01S 3/808 - Systems for determining direction or deviation from predetermined direction using transducers spaced apart and measuring phase or time difference between signals therefrom, i.e. path-difference systems

Abstract

The present invention relates to a power module and a manufacturing method therefor, the power module comprising: a base plate (100) having recessed grooves (101) formed on the upper surface thereof; brazing filler layers (200) arranged in the recessed grooves (101); and a ceramic substrate (300) brazed to the upper surface of the base plate (100) by means of the brazing filler layers (200). The present invention solves an existing soldering problem, enables reliable joining to various base plates, and can simplify processes.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
• H01L 23/528 - Layout of the interconnection structure
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape

Abstract

A voice processing device is disclosed. The voice processing device comprises: a voice data receiving circuit configured to receive input voice data associated with voices of speakers; a memory configured to store starting language data; a voice data output circuit configured to output output voice data associated with the voices of the speakers; and a processor configured to generate a control command for outputting the output voice data, wherein the processor uses the input voice data to generate first speaker position data indicating a position of a first speaker of the speakers and first output voice data associated with a voice of the first speaker, reads first starting language data corresponding to the first speaker position data with reference to the memory, and transmits, to the voice data output circuit, a control command for outputting the first output voice data to a translation environment for translating the first starting language indicated by the first starting language data.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• G10L 17/02 - Preprocessing operations, e.g. segment selection; Pattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal components; Feature selection or extraction
• G06F 40/40 - Processing or translation of natural language
• G01S 3/808 - Systems for determining direction or deviation from predetermined direction using transducers spaced apart and measuring phase or time difference between signals therefrom, i.e. path-difference systems
• G10L 15/00 - Speech recognition
• G10L 17/22 - Interactive procedures; Man-machine interfaces
• H04W 4/02 - Services making use of location information
• G06F 40/58 - Use of machine translation, e.g. for multi-lingual retrieval, for server-side translation for client devices or for real-time translation
• H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers

Abstract

Disclosed is a voice processing device. The voice processing device comprises: a voice data reception circuit configured to receive input voice data associated with the voice of a speaker; a wireless signal reception circuit configured to receive a wireless signal including a terminal ID from a speaker terminal of the speaker; a memory; and a processor configured to generate terminal location data indicating the location of the speaker terminal on the basis of the wireless signal, and match and store the generated terminal location data and the terminal ID in the memory, wherein the processor uses the input voice data to generate first speaker location data indicating a first location and first output voice data associated with a first voice spoken at the first location, reads a first terminal ID corresponding to the first speaker location data by referring to the memory, and matches and stores the first terminal ID and the first output voice data.

IPC Classes  ?

• G10L 21/0272 - Voice signal separating
• B60R 16/037 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for occupant comfort
• G10L 15/28 - Constructional details of speech recognition systems
• G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
• H04W 4/02 - Services making use of location information
• H04R 3/00 - Circuits for transducers
• G10L 15/06 - Creation of reference templates; Training of speech recognition systems, e.g. adaptation to the characteristics of the speaker's voice
• G10L 15/04 - Segmentation; Word boundary detection

Abstract

An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: a circuit board; a radiation pattern formed on at least one surface of the circuit board and formed in a loop shape to have an empty space part formed at a central part thereof; a first shielding sheet stacked on the upper surface of the circuit board to include an area corresponding to the empty space part; and a second shielding sheet stacked on the lower surface of the circuit board to include an area corresponding to the empty area part, wherein the first shielding sheet and the second shielding sheet are disposed such that the areas corresponding to the empty space part on the opposite surfaces of the circuit board overlap each other.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 7/04 - Screened antennas
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code

Abstract

A magnetic shielding sheet for a wireless power reception module, and a wireless power reception module including same are provided. A magnetic shielding sheet for a wireless power reception module, according to an exemplary embodiment of the present invention, is applied to a wireless power reception module capable of a wireless power share (WPS) function and has an overall thickness of 150㎛ or less. The magnetic shielding sheet comprises: a first sheet which is made of a magnetic material so as to be able to shield a magnetic field; and a second sheet which is laminated as a monolayer on one surface of the first sheet by means of a bonding adhesive layer, wherein the second sheet has a relatively smaller thickness than the first sheet while having a saturation magnetic flux density which is two times or more the saturation magnetic flux density of the first sheet.

IPC Classes  ?

• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
• H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H04B 5/00 - Near-field transmission systems, e.g. inductive loop type
• H01F 27/36 - Electric or magnetic shields or screens
• H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power

Abstract

The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) which is disposed above the lower ceramic substrate (200) and has a semiconductor chip (G) mounted on the lower surface thereof; a PCB substrate (400) disposed above the upper ceramic substrate (300); and a connection pin (800) which extends through through holes (320 and 420) formed in the upper ceramic substrate (300) and the PCB substrate (400), and vertically connects electrode patterns (a, b, c, and d) formed on the upper ceramic substrate (300) and the PCB substrate (400). The present invention provides a shortened electrical connection distance between the upper ceramic substrate and the PCB substrate, and thus can minimize a current path and enhance the moving efficiency of a high-speed current.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/02 - Printed circuits - Details
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/498 - Leads on insulating substrates
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/367 - Cooling facilitated by shape of device

Abstract

Disclosed is a voice processing device. The voice processing device comprises a memory and a processor configured to perform sound source isolation on voice signals associated with the voices of speakers on the basis of the sound source positions of the respective voices. The processor is configured to: generate sound source position information indicating the sound source positions of the respective voices by using the voice signals associated with the voices; generate isolated voice signals associated with the voices of the respective speakers from the voice signals on the basis of the sound source position information; and match the isolated voice signals and the voice source position information and store the same in the memory.

IPC Classes  ?

• G10L 17/02 - Preprocessing operations, e.g. segment selection; Pattern representation or modelling, e.g. based on linear discriminant analysis [LDA] or principal components; Feature selection or extraction
• H04R 3/00 - Circuits for transducers
• G01S 3/808 - Systems for determining direction or deviation from predetermined direction using transducers spaced apart and measuring phase or time difference between signals therefrom, i.e. path-difference systems
• G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
• H04N 7/15 - Conference systems
• H05B 47/12 - Controlling the light source in response to determined parameters by determining the presence or movement of objects or living beings by detecting audible sound
• G06F 40/47 - Machine-assisted translation, e.g. using translation memory
• G10L 15/00 - Speech recognition
• G10L 21/0272 - Voice signal separating
• H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers

Abstract

The present invention relates to a power module, in which a ceramic substrate (200) comprises: a ceramic substrate (201); a metal layer (202) formed on at least one of the top and bottom surfaces of the ceramic substrate (201); and an anti-oxidation layer (920) formed to surround the top and side surfaces of the metal layer (202) to prevent external exposure of the metal layer (202). In the present invention, since an anti-oxidation layer is formed to surround the top and side surfaces of a metal layer to prevent external exposure of the metal layer, the shelf life of a ceramic substrate can be extended, and the condition of the metal layer to be soldered can be maintained to increase adhesion between the metal layer and a component.

IPC Classes  ?

• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 23/492 - Bases or plates
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/498 - Leads on insulating substrates

Abstract

A disposable electronic thermometer is provided. The disposable electronic thermometer, according to an exemplary embodiment of the present invention, comprises: a base substrate including an adhesive layer formed on one surface to be attached to a body of a user; a control unit including a circuit board arranged on one surface of the base substrate and at least one driving chip mounted on the circuit board; a temperature sensor arranged on one surface of the base substrate and electrically connected to the circuit board, to thus measure a body temperature of a user; an NFC antenna electrically connected to the circuit board and arranged on one surface of the base substrate to surround the circuit board; and a cover member attached to one surface of the base substrate to prevent external exposure of the circuit board, the temperature sensor, and the NFC antenna.

IPC Classes  ?

• A61B 5/01 - Measuring temperature of body parts
• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
• G01K 13/20 - Clinical contact thermometers for use with humans or animals
• G01K 13/25 - Protective devices therefor, e.g. sleeves preventing contamination

Abstract

The present invention relates to a power module and a method for manufacturing a ceramic substrate included therein, wherein the power module comprises a ceramic substrate (300) and a semiconductor chip (G) mounted on the ceramic substrate (300), and the ceramic substrate (300) comprises: a ceramic base substrate (301); a plurality of via holes (330) vertically formed through the ceramic base substrate (301); a metal filler (P) filled in the via holes (330); and electrode patterns (a, b, c) formed on the upper surface and the lower surface of the ceramic base substrate (301) and vertically connected by the metal filler (P). By electrically connecting the electrode patterns on the upper surface and the lower surface of the ceramic substrate through the via holes, the present invention can remarkably improve efficiency and achieve excellent conductivity.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 1/03 - Use of materials for the substrate
• H05K 1/02 - Printed circuits - Details
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/498 - Leads on insulating substrates
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape

Abstract

The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate (200); an upper ceramic substrate (300) which is disposed spaced apart from the upper portion of the lower ceramic substrate (200), and on the lower surface of which a semiconductor chip (G) is mounted; spacers (220, 230) each having one end bonded to the lower ceramic substrate (200) and the other end bonded to the upper ceramic substrate (300); first bonding layers (221, 231) each bonding the one end of each spacer (220, 230) to the lower ceramic substrate (200); and second bonding layers (223, 233) each bonding the other end of each spacer (220, 230) to the upper ceramic substrate (300). The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H05K 1/03 - Use of materials for the substrate
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape

Abstract

The present invention relates to a power module comprising: an upper ceramic substrate (300); a first electrode pattern (a) formed on the upper ceramic substrate (300); a second electrode pattern (b) formed on the upper ceramic substrate (300), the second electrode pattern (b) being disposed spaced apart from and on the same plane as the first electrode pattern (a); a semiconductor chip (G) disposed to connect the first electrode pattern (a) and the second electrode pattern (b) and including a drain electrode joined to the first electrode pattern (a) and a source electrode joined to the second electrode pattern (b); and a solder layer (350) that joins the drain electrode to the first electrode pattern (a) and joins the source electrode to the second electrode pattern (b). The present invention has an advantage in that the semiconductor chip is prevented from moving in position while being joined to the upper ceramic substrate, and thus can be stably joined to the upper ceramic substrate.

IPC Classes  ?

• H01L 23/528 - Layout of the interconnection structure
• H01L 23/492 - Bases or plates
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

The present invention relates to a power module comprising: a lower ceramic substrate (200) including a ceramic base material (201) and metal layers (202, 203) formed on the top surface and the bottom surface of the ceramic base material (201); a heat-dissipation plate (500) bonded to the bottom surface of the lower ceramic substrate (200); and a solder preform layer (550) disposed between and bonded to the bottom surface of the lower ceramic substrate (200) and the top surface of the heat-dissipation plate (500). The present invention has the following advantageous effects: the entrapment of volatile material is minimized due to the solder preform used when the heat-dissipation plate and the ceramic substrate are bonded to each other, thereby preventing air bubble generation; and the high-temperature reliability can be improved due to the Sb based-solder used as the solder preform.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H05K 1/03 - Use of materials for the substrate

Abstract

Presented is a system for testing antenna performance, in which antenna performance is tested by reflecting the loss of a cable used in the antenna performance test. The presented system for testing antenna performance comprises a tester having a test port, the test port being connected, via a cable, to an antenna that communicates with a terminal to be tested, in a shield box, when a test mode is set, wherein the tester outputs a test signal to the test port, receives a response signal corresponding to the test signal via the test port, and obtains a value, as a communication performance measurement value, by adding a calibration value to a reception signal strength of the response signal.

IPC Classes  ?

• G01R 29/10 - Radiation diagrams of antennas
• G01R 29/08 - Measuring electromagnetic field characteristics
• G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
• G01R 23/15 - Indicating that frequency of pulses is either above or below a predetermined value or within or outside a predetermined range of values, by making use of non-linear or digital elements
• G01R 23/00 - Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
• G08B 21/18 - Status alarms

Abstract

The present invention relates to a hybrid base plate and a manufacturing method therefor. Metal sheets of different materials having excellent thermal conductivity can be joined to have a thickness favorable for heat dissipation, and by arranging a metal sheet of a material with a low coefficient of thermal expansion between metal sheets with a high coefficient of thermal expansion, there is an effect of preventing warpage when manufacturing a large-area heat sink.

IPC Classes  ?

• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
• C23C 14/16 - Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
• C23C 14/02 - Pretreatment of the material to be coated

Abstract

An antenna module is provided. An antenna module according to an exemplary embodiment of the present invention comprises: an antenna unit including an antenna pattern, which has a pattern portion and a lead portion formed, respectively, on both surfaces of a circuit board; a magnetic field shielding sheet including a sheet body made of a magnetic material to block a magnetic field, and a plurality of eddy current reducing pattern portions formed on the sheet body to reduce the generation of eddy current by increasing the resistance of the sheet body; and an insulation member arranged between the antenna unit and the magnetic field shielding sheet, wherein the antenna unit is provided in an asymmetric form in which the pattern portion and the lead portion respectively formed on both surfaces of the circuit board have different thicknesses.

IPC Classes  ?

• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set

Abstract

An earphone usable for measuring body temperature and a body temperature control system using same are provided. An earphone usable for measuring body temperature, according to one embodiment of the present invention, comprises: a case including a head part which is partially inserted into a user's ear; a temperature sensor provided at one end of the head part to measure the user's body temperature; and a control unit, embedded in the case, for interlocking with a smart device, outputting a voice signal received from the smart device, and performing control to periodically transmit body temperature information measured by the temperature sensor to the smart device.

IPC Classes  ?

• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
• A61B 5/01 - Measuring temperature of body parts
• H04R 1/10 - Earpieces; Attachments therefor

Abstract

A non-face-to-face body temperature change management platform service system and method are provided. The non-face-to-face body temperature change management platform service system according to one embodiment of the present invention comprises: an electronic device that is located around a user and collects and transmits body temperature information of the user and location information thereof; and a data server that receives the body temperature information and the location information from the electronic device and monitors an amount of change (Δ) in body temperature compared to the average body temperature of the user.

IPC Classes  ?

• G16H 50/80 - ICT specially adapted for medical diagnosis, medical simulation or medical data mining; ICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for detecting, monitoring or modelling epidemics or pandemics, e.g. flu
• G16H 10/60 - ICT specially adapted for the handling or processing of patient-related medical or healthcare data for patient-specific data, e.g. for electronic patient records
• G16H 50/20 - ICT specially adapted for medical diagnosis, medical simulation or medical data mining; ICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for computer-aided diagnosis, e.g. based on medical expert systems
• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
• H04W 4/02 - Services making use of location information
• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
• A61B 5/01 - Measuring temperature of body parts

Abstract

Proposed are a radar antenna configured to form a waveguide through a partition wall on a plate having a plurality of slots, and a method for manufacturing same. The proposed radar antenna comprises: a first plate having an inner surface; and a second plate stacked so as to have an inner surface facing the inner surface of the first plate, wherein the first plate includes a partition wall extending in the direction of the second plate from the inner surface of the first plate, and the partition wall abuts against the inner surface of the second plate to form a waveguide between the inner surface of the first plate and the inner surface of the second plate.

IPC Classes  ?

• H01Q 13/22 - Longitudinal slot in boundary wall of waveguide or transmission line
• H01Q 19/15 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces wherein the surfaces are concave the primary radiating source being a line source, e.g. leaky waveguide antennas
• G01S 13/931 - Radar or analogous systems, specially adapted for specific applications for anti-collision purposes of land vehicles

Abstract

Disclosed is a flexible PCB RF cable having a ground pattern that is divided into two ground patterns, which are connected through a connection pattern arranged in an area overlapped with a signal line pattern, and thus cracks are minimized during bending. The disclosed flexible PCB RF cable comprises: a signal line pattern interposed between a first dielectric sheet and a second dielectric sheet; first and second lower ground patterns, which are mesh patterns arranged to be spaced from each other below the first dielectric sheet; a lower connection pattern connected to the first and second lower ground patterns; first and second upper ground patterns, which are mesh patterns arranged to be spaced from each other above the second dielectric sheet; and an upper connection pattern connected to the first and second ground patterns.

IPC Classes  ?

• H01B 11/18 - Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
• H01B 7/04 - Flexible cables, conductors, or cords, e.g. trailing cables
• H01B 7/18 - Protection against damage caused by external factors, e.g. sheaths or armouring by wear, mechanical force or pressure

Abstract

The present invention relates to a power module comprising: an upper ceramic substrate (300); a PCB substrate (400) disposed spaced apart from the upper ceramic substrate (300); a plurality of semiconductor chips (G1, G2, G3, G4) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic substrate (300); and a plurality of capacitors (410) mounted on the top surface of the PCB substrate (400) to correspond to positions between the semiconductor chips (G1, G2, G3, G4). The present invention has the advantage of forming a short current path through which the semiconductor chips and the capacitors are connected, thereby increasing a circuit stabilization effect.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H05K 1/03 - Use of materials for the substrate
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits - Details

Abstract

The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) disposed at an interval on the upper part of the lower ceramic substrate (200), and having a semiconductor chip mounted on the lower surface thereof; a temperature sensor (210) mounted on the upper surface of the lower ceramic substrate (200); and a cutting unit (310) formed on the upper ceramic substrate (300) and having the temperature sensor (210) disposed so as to pass therethrough. The present invention has the cutting unit, having the temperature sensor disposed so as to pass therethrough, formed on the upper ceramic substrate, and thus the problem where the interval between the upper ceramic substrate and the lower ceramic substrate is shorter than the thickness of the temperature sensor may be solved, and an advantage is gained by which a silicone liquid may be evenly filled, without bubbles forming, in a space between the substrates through an injection hole and a vent hole.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/04 - Containers; Seals characterised by the shape
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks

Abstract

The present invention relates to a power module comprising: a ceramic board (300) which includes a ceramic base material and electrode patterns formed on the top surface and the bottom surface of the ceramic base material; a housing (100) to which the ceramic board (300) is mounted and which has terminals disposed at both ends; and bus bars (700) for connecting the electrode patterns of the ceramic board (300) and the terminals through surface-to-surface bonding. The present invention has the advantage of minimizing resistance and heat generation by using the bus bars having a structure that passes high current or low resistance of voltage.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/047 - Containers; Seals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

The present invention relates to a power module comprising: a housing (100) which has a vertically open empty space formed in the middle; a heat dissipating plate (500), the edge of which is bonded to the bottom surface of the housing (100) and the top surface of which is exposed through the empty space of the housing (100); a lower ceramic board (200) bonded to the top surface of the heat dissipating plate (500); an upper ceramic board (300) disposed above the lower ceramic board (200) and having a semiconductor chip (G) mounted to the bottom surface; and a PCB board (400) disposed above the upper ceramic board (300). The present invention has advantages in that stepped portions in the heat dissipating plate make it easy to adjust the distances between internal components mounted to the board, when required, and the heat dissipating performance can be enhanced by increasing the thickness of portions requiring superior heat dissipating performance.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/04 - Containers; Seals characterised by the shape
• H01L 23/06 - Containers; Seals characterised by the material of the container or its electrical properties
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/492 - Bases or plates
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) disposed above the lower ceramic substrate (200) and having a semiconductor chip (G) mounted on the lower surface thereof; and a heat sink (500) bonded to the lower surface of the lower ceramic substrate (200) and having slots (510, 520, 530) formed therein. The present invention has slots formed in the heat sink, and thus has the advantages of preventing deterioration between components with different coefficients of thermal expansion and preventing warping of the heat sink.

IPC Classes  ?

• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/492 - Bases or plates
• H01L 23/15 - Ceramic or glass substrates
• H05K 1/03 - Use of materials for the substrate
• H05K 1/02 - Printed circuits - Details
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate (300) including a ceramic base material and an electrode pattern formed on the upper and lower surfaces of the ceramic base material; a PCB substrate (400) disposed above the ceramic substrate (300) and including an electrode pattern; a plurality of through-holes (320) formed in at least one of the ceramic substrate (300) and the PCB substrate (400); and a connection pin (900) coupled to the through-holes (320) and connecting the electrode pattern of the ceramic substrate (300) and the electrode pattern of the PCB substrate (400) to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/492 - Bases or plates
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The present invention relates to a power module comprising: a housing (100) which has an empty space that is open in the vertical direction of the center thereof and which is made of an injection material; and terminals (610, 620) which are located at both sides of the housing (100) and which are insert-injected into the housing (100). The present invention can simplify the shape of the housing since the terminals are integrally formed with the housing by means of insert-injection, and the housing is formed by injecting the material of the housing as the material suitable for a heat dissipation structure, and thus heat dissipation efficiency can be increased and the operational reliability of the power module can be increased.

IPC Classes  ?

• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements

Abstract

An artificially intelligent air purification system is provided. An artificially intelligent air purification system according to an embodiment of the present invention comprises: a ventilation system which senses indoor air state information, discharges indoor air to the outside, and purifies outdoor air and allows same to flow to an indoor space; a web service server which receives the indoor air state information collected by the ventilation system and provides a user terminal with the indoor air state information and procedure information in accordance with same; and an AI server which receives the indoor air state information from the web service server and controls the ventilation system on the basis of the received indoor air state information and current outdoor air state information to manage the state of indoor air by means of artificial intelligence.

IPC Classes  ?

• F24F 11/58 - Remote control using Internet communication
• F24F 7/007 - Ventilation with forced flow
• F24F 13/28 - Arrangement or mounting of filters
• F24F 11/00 - Control or safety arrangements
• F24F 11/64 - Electronic processing using pre-stored data
• H04M 1/72403 - User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
• G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
• G10L 17/22 - Interactive procedures; Man-machine interfaces
• H04L 12/28 - Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
• F24F 110/50 - Air quality properties

Abstract

A remote body temperature monitoring system is provided. A remote body temperature monitoring system according to an embodiment of the present invention comprises: a patch-type thermometer attached to the body of a user so as to periodically measure body temperature; a web service server for collecting information about the body temperature measured by the patch-type thermometer and notifying a manager terminal of a suspected fever; a collection device for receiving the information about the measured body temperature from the patch-type thermometer and transmitting same to the web service server; and an AI server for receiving the information about the body temperature from the web service server to manage a health status by using artificial intelligence.

IPC Classes  ?

• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
• A61B 5/01 - Measuring temperature of body parts
• G16H 50/80 - ICT specially adapted for medical diagnosis, medical simulation or medical data mining; ICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for detecting, monitoring or modelling epidemics or pandemics, e.g. flu
• G16H 80/00 - ICT specially adapted for facilitating communication between medical practitioners or patients, e.g. for collaborative diagnosis, therapy or health monitoring
• G01K 13/20 - Clinical contact thermometers for use with humans or animals

Abstract

The present invention relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing a Ag sintering paste in the form of a film. The present invention can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.

IPC Classes  ?

• C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 1/00 - Adhesives based on inorganic constituents
• C09D 1/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
• B41M 5/382 - Contact transfer or sublimation processes
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• C08L 101/00 - Compositions of unspecified macromolecular compounds

Abstract

A folding plate according to an embodiment of the present invention has first and second support portions located on both sides of a folding portion that is foldable, and is formed as a multilayer structure in which first and second metal sheets of different metal materials are braze-bonded, and thus, is thin and lightweight, has excellent flexibility, and easily dissipates heat.

IPC Classes  ?

• F16C 11/04 - Pivotal connections
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
• H04M 1/02 - Constructional features of telephone sets
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• B32B 15/02 - Layered products essentially comprising metal in a form other than a sheet, e.g. wire, particles
• B23K 20/02 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press

Abstract

An electronic thermometer is provided. The electronic thermometer according to an exemplary embodiment of the present invention is for periodically measuring a body temperature by being attached to a body of a user, and comprises: at least one temperature sensor mounted on the one surface of a flexible circuit board; a memory unit for storing information obtained via the temperature sensor; a communication unit for externally transmitting the information stored in the memory unit; a control unit for controlling the operations of the temperature sensor, memory unit, and communication unit; a power supply unit arranged on the one surface of the flexible circuit board such that driving power can be provided; and a protection member surrounding the flexible circuit board such that external exposure of the temperature sensor, memory unit, communication unit, control unit, and power supply unit can be prevented.

IPC Classes  ?

• G01K 13/20 - Clinical contact thermometers for use with humans or animals
• A61B 5/01 - Measuring temperature of body parts
• A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons

Abstract

A magnetic shielding sheet for a reception antenna, and a wireless power reception module including same are provided. A magnetic shielding sheet for a reception antenna, according to an exemplary embodiment of the present invention, blocks the magnetic field induced in a reception antenna, and comprises: a planar first shielding sheet including a through-hole penetratively formed with a predetermined area in a region corresponding to a hollow portion of the reception antenna; and a second shielding sheet arranged to come in contact with one surface of the first shielding sheet, so as to block the magnetic field leaking through the through-hole.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01F 38/14 - Inductive couplings
• H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields

Abstract

A data logger device is provided. The data logger device according to an example embodiment of the present invention comprises: a sensing unit mounted on one surface of a flexible printed circuit board, and including a sensor that detects at least one piece of information; a display unit that, when an abnormal state is detected on the basis of information measured via the sensing unit, irreversibly displays the abnormal state; a control unit that controls driving of the sensing unit and the display unit; a power supply unit that provides driving power to the control unit; and a cover member that prevents the outside exposure of the sensing unit, the display unit, the control unit, and the power supply unit.

IPC Classes  ?

• G01D 9/28 - Producing one or more recordings, each recording being of the values of two or more different variables
• G01D 7/00 - Indicating measured values
• H04W 4/80 - Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
• G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code

Abstract

A magnetic shielding sheet and a manufacturing method therefor are provided. The magnetic shielding sheet according to an embodiment of the present invention, which is placed on one surface of an antenna comprising a hollow part disposed at the center thereof and having a predetermined area and a pattern part surrounding the hollow part, may comprise: a sheet body which is made of a magnetic material so as to be able to shield a magnetic field; and at least one eddy current-reducing pattern part which is formed in the sheet body so as to increase the resistance of the sheet body so that the occurrence of eddy current can be reduced.

IPC Classes  ?

• H01F 27/36 - Electric or magnetic shields or screens
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling

Abstract

Disclosed is an antenna module for wireless power transmission and reception, wherein a loop-shaped coil for wireless power transmission and reception is formed using two wires having different diameters, so that a reduction in charging efficiency is prevented. The disclosed antenna module for wireless power transmission and reception may comprise: a first coil which is wound around a first winding shaft to form a first loop and has a first coil diameter; a second coil which is wound around the outer periphery of the first coil to form a second loop and has a second coil diameter thicker than the first coil diameter; a base substrate disposed to overlap portions of the first coil and the second coil; and a coil connection pattern formed on one surface of the base substrate and connected to the first coil and the second coil.

IPC Classes  ?

• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set

Abstract

Provided are a ceramic back cover for a mobile device, and a method for manufacturing same. A method for manufacturing a ceramic back cover for a mobile device, according to the present invention, comprises: a first step of preparing a planar ceramic sheet; a second step of sintering the ceramic sheet; a third step of processing the sintered ceramic sheet; and a fourth step of molding, into a curved shape, a portion of the edge of the processed ceramic sheet. The method is effective at controlling the ceramic shape since the planar ceramic sheet is sintered, can control a dielectric constant, and has excellent processability due to the fact that the planar ceramic sheet is processed.

IPC Classes  ?

• C04B 35/622 - Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
• C04B 35/645 - Pressure sintering
• C04B 35/638 - Removal thereof
• C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
• C04B 41/80 - After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
• H04M 1/02 - Constructional features of telephone sets