A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
3.
COUPLING DEVICE FOR COUPLING ROTATING BODY TO ROTATING SHAFT, AND DEVICE FOR ATTACHING AND DETACHING ROTATING BODY
The present invention relates to a coupling device for coupling a rotating body such as such as a polishing head and dresser to a rotating shaft. The present invention further relates to a device for attaching and detaching the rotating body coupled to the rotating shaft via this coupling device. A coupling device (40) is used to couple a rotating body (7) to a rotating shaft (23). The coupling device (40) comprises: a flange (45) which is attached to the rotating body (7) and has a coupling shaft (45a); and a fastening structure (50) which fastens the rotating body (7) to the rotating shaft (23) via the coupling shaft (45a).
F16D 1/00 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements
F16D 1/04 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for connecting two abutting shafts or the like with hub and longitudinal key
F16D 1/06 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for attachment of a member on a shaft or on a shaft-end
F16D 1/092 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for attachment of a member on a shaft or on a shaft-end with hub and longitudinal key with radial clamping due to axial loading of at least one pair of conical surfaces the pair of conical mating surfaces being provided on the coupled hub and shaft
F16D 1/093 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for attachment of a member on a shaft or on a shaft-end with hub and longitudinal key with radial clamping due to axial loading of at least one pair of conical surfaces using one or more elastic or segmented conical rings forming at least one of the conical surfaces, the rings being expanded or contracted to effect clamping
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention pertains to a polishing method and a polishing device for polishing a peripheral portion of a substrate such as a wafer. The polishing method includes: holding a substrate (W) and rotating the substrate (W) by means of a substrate-holding unit (5); and polishing a second polishing area in a peripheral portion of the substrate (W) by moving or tilting a second polishing head (10B) in a second direction (D2) in a state where a second polishing tape (2B) is pressed against the peripheral portion of the substrate (W) by the second polishing head (10B) while polishing a first polishing area in the peripheral portion of the substrate (W) by moving or tilting a first polishing head (10A) in a first direction (D1) in a state where a first polishing tape (2A) is pressed against the peripheral portion of the substrate (W) by the first polishing head (10A), wherein the first direction (D1) and the second direction (D2) are opposite directions.
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the first grinding member are disposed, a polishing module including a polishing member, and a control device that controls the grinding module and the polishing module. The control device controls the grinding module so as to perform first grinding on a part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member, and controls the polishing module so as to polish the processing surface that has been subjected to the first grinding and the second grinding.
B24B 37/005 - Control means for lapping machines or devices
B24B 7/00 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 37/013 - Devices or means for detecting lapping completion
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
6.
PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS
Provided is a technique that ensures the suppressed deterioration of plating quality of a substrate due to air bubbles that remain on a surface to be plated of the substrate.
Provided is a technique that ensures the suppressed deterioration of plating quality of a substrate due to air bubbles that remain on a surface to be plated of the substrate.
A plating apparatus 1000 includes a plating tank 10, a substrate holder 30, a rotation mechanism 40, and an elevating mechanism 50. The plating tank 10 is configured to accumulate a plating solution and include an anode 11 arranged inside the plating tank. The substrate holder 30 is arranged above the anode and configured to hold a substrate as a cathode such that a surface to be plated of the substrate faces downward. The substrate holder includes a ring 31 projecting below an outer peripheral edge of the surface to be plated of the substrate. The rotation mechanism 40 is configured to rotate the substrate holder. The elevating mechanism 50 is configured to elevate the substrate holder. The ring has a lower surface, and at least one protrusion 35 projecting toward a lower side is arranged on a part of the lower surface.
A polishing method capable of stabilizing a polishing process of a substrate is disclosed. In the polishing method, a fine bubble liquid is supplied onto a polishing pad after finishing polishing the substrate.
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/005 - Control means for lapping machines or devices
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
The present invention relates to a pump casing and a pump apparatus. The pump casing (5) includes a suction nozzle (100) with formed a suction port (12). The suction nozzle (100) slopes downward toward the suction port (12).
F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps
F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
9.
METAL-SUPPORTING NONWOVEN FABRIC AND PRODUCTION METHOD THEREOF, CATALYST, UNSATURATED COMPOUND HYDROGENATION METHOD, AND CARBON-CARBON BOND FORMING METHOD
A metal-supported nonwoven fabric is provided which enables effective synthesis of a target product when used as a catalyst in a flow reaction. The metal-supported nonwoven fabric comprises a nonwoven fabric containing polyolefin fibers or PET fibers, and metal particles. The nonwoven fabric has grafted side chains bound thereto formed of polyvinylpyrrolidone, polyacrylic acid, or a polymer containing functional groups with unshared electron pairs. The metal particles are supported by the grafted side chains via pyrrolidone groups of the polyvinylpyrrolidone, carboxy groups of the polyacrylic acid, or the functional groups with unshared electron pairs.
C07C 5/03 - Preparation of hydrocarbons from hydrocarbons containing the same number of carbon atoms by hydrogenation of non-aromatic carbon-to-carbon double bonds
D06M 14/28 - Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics or fibrous goods made from such materials using wave energy or particle radiation on to materials of synthetic origin of macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
D06M 11/83 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
D06M 23/08 - Processes in which the treating agent is applied in powder or granular form
The present invention relates to a method for polishing a substrate such as a wafer. This method for polishing a substrate involves rotating a substrate (W) about the axis while moving the substrate(W) and a polishing head (10C) in a relative circular motion, pressing, with the polishing head (10C), a polishing tape (2B) against a surface (5a) to be polished while feeding the polishing tape (2B) in the longitudinal direction, and polishing a center region including a center (O1) of the substrate (W) and an outer region adjacent to the center region. The step for polishing the center region and the outer region includes at least two polishing steps that are performed under different polishing conditions. The at least two polishing steps include a low polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is lower than that of the outer region, and a high polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is higher than that of the outer region.
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 21/06 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention relates to a pump system and an engine system. Provided is a pump system (PS) appliable to an engine system (ES) mounted in a space navigation body. The pump system (PS) is provided with: a motor (M); a first pump (P1) that includes a first impeller (IM1) fixed to a rotational shaft (RS) and supplies an oxidizing agent; and a second pump (P2) that includes a second impeller (IM2) fixed to the rotational shaft (RS) and supplies a fuel material.
Provided is a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, and an anode disposed in the plating tank to oppose the substrate held by the substrate holder. The plating apparatus also includes a conduit having a first portion including an opening end disposed in a region between the substrate held by the substrate holder and the anode, and a second portion apart from the region between the substrate held by the substrate holder and the anode, the conduit having at least a part filled with a plating solution, and a potential sensor that is disposed in the second portion of the conduit and that is configured to measure a potential of the plating solution.
Provided is a technique capable of improving the throughput of pre-wet processing. This substrate pre-wet processing method comprises: a step for placing a substrate Wf, in which a recess Wfb for wiring formation is formed on a surface Wfa, inside a chamber 10, and supplying a gas Ga having a higher solubility in water than air into the chamber 10 to replace the air inside the chamber with the gas; and a step for supplying a processing liquid PL containing water as a main component to the surface Wfa of the substrate after replacing the air inside the chamber with the gas to wet the surface with the processing liquid.
The present invention pertains to a filter structure and a liquid circulation system. This filter structure (10) comprises a filtering unit (11). The filtering unit (11) comprises a fine mesh filter (15), a coarse mesh filter (16), and a block frame (17). The block frame (17) comprises a first foreign substance reservoir (20) and a second foreign substance reservoir (21).
B01D 35/02 - Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
B01D 29/50 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups ; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. A polishing head (10) comprises a pressing member (12) that presses a polishing tape (2) against a substrate (W), an actuator (15) that moves the pressing member (12) in a predetermined pressing direction (CL) and applies a pressing force to the pressing member (12), and a tilt adjusting mechanism (40) that adjusts the tilt of the pressing member (12) with respect to the pressing direction (CL). The tilt adjusting mechanism (40) is configured to tilt the pressing member (12) with respect to the pressing direction (CL) and keep the angle of the tilted pressing member (12).
An information processing device (5) comprises: an information acquisition unit (500) for acquiring a finishing process condition including substrate holding unit state information indicating the state of a substrate holding unit for holding a substrate as well as finishing fluid supply unit state information indicating the state of a finishing fluid supply unit for supplying a substrate finishing fluid to the substrate in a substrate finishing process performed by a substrate processing device provided with the substrate holding unit and the finishing fluid supply unit; and a state prediction unit (501) for inputting the finishing process condition acquired by the information acquisition unit (500) into learning models (10A, 10B) that have been trained by machine learning with a correlation between the finishing process condition and substrate state information indicating a state of the substrate having been subjected to the finishing process under the finishing process condition, so as to predict substrate state information for the substrate having been subjected to the finishing process under the finishing process condition.
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) for polishing the substrate (W) comprises: a pressing member (12) for pressing the polishing tape (2) against the substrate (W); a pressing member holder (30) for holding the pressing member (12); and an actuator (15) connected to the pressing member holder (30) and imparting a pressing force to the pressing member (12). The pressing member (12) is formed in a rod-shape having both ends (12a), and the pressing member (12) is fitted to a groove (50) formed in a pressing surface (30a) of the pressing member holder (30).
The present invention accurately detects the end point of polishing. This polishing device comprises: a polishing table for holding a polishing pad; a holder for holding an object to be polished so as to face the polishing pad; at least one of a motor for rotationally driving the polishing table, a motor for rotating the holder holding the object, and a motor for rocking the holder holding the object; one or more drivers that are configured so as to supply drive current to the at least one motor and further output a digital signal according to the load of the at least one motor; and an end point detection unit that detects a polishing end point, which indicates the end of polishing of the object, on the basis of the digital signal output from the drivers.
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
19.
POLISHING ENDPOINT DETECTION METHOD, POLISHING ENDPOINT DETECTION SYSTEM, POLISHING DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM
The present invention pertains to a method and system for detecting the polishing endpoint of a workpiece which is used in the production of a semiconductor device such as a wafer, a substrate or a panel. This method involves: obtaining a polishing monitoring value which expresses the degree of workpiece (W) polishing progress when polishing a workpiece (W); generating time-series data which expresses a change in the polishing monitoring value which corresponds to the workpiece (W) polishing time; inputting polishing monitoring values (VF1, VF2) and polishing times (TF1, TF2), which constitute characteristic data points (FP1, FP2) included in the time-series data, into a trained model (34); and outputting a polishing endpoint prediction time from the trained model (34).
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention pertains to a substrate polishing device for polishing a substrate such as a wafer, and particularly to a substrate polishing device for polishing a notch section of the substrate, a bevel section of the substrate, a device surface of the substrate, and the back surface of the substrate. This substrate polishing device includes a first polishing module, a second polishing module, and a third polishing module, and the first polishing module, the second polishing module, and the third polishing module are polishing modules respectively polishing different areas of the substrate.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
One object of this application is to provide an advanced substrate holder including a clamper. A substrate holder for holding a substrate by interposing the substrate between frames is disclosed. The substrate holder includes a front frame, a rear frame, and one or a plurality of clampers. Each of the clampers includes a hook portion including a hook base and a hook main body, and a plate including at least one claw. At least one of the clampers includes the plate including a first claw for a lock and a second claw for a semi-lock.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
C25D 17/06 - Suspending or supporting devices for articles to be coated
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
The present invention proposes a plating apparatus and the like that can improve uniformity of plated films formed on substrates. The plating apparatus comprises: a plating tank; a substrate holder for holding a substrate; and an anode holder that is disposed in the plating tank so as to face the substrate held on the substrate holder, and that is configured to hold a soluble anode; an anode mask that is attached to the anode holder and that has an opening through which electric current flowing between the anode and the substrate passes; an adjustment mechanism configured so as to adjust the dimension of the opening of the anode mask; and a controller for controlling the adjustment mechanism on the basis of the electrolyzed amount of the anode while the anode is being used.
A substrate processing apparatus for polishing a substrate by pressing the substrate against a polishing pad, comprises: an acoustic sensor having a sensor body that detects polishing sound of the substrate and outputs the polishing sound as an acoustic signal, and a cover member that houses the sensor body; an end point detection unit that detects an end point of polishing of the substrate from the acoustic signal; and a gas supply device that supplies a gas into the cover member so as to prevent adhesion of moisture (water droplets and water vapor) to the sensor body. The gas supply device is connected to the sensor body on an opposite side of a detection surface for the polishing sound, a groove for passing the gas from the gas supply device is formed in the cover member, and a plurality of micro openings for passing the gas from the gas supply device are formed on a waterproof sheet.
H01L 21/461 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
Provided is a thermal spraying apparatus that forms a film on a target by thermally spraying a conductive powder by plasma, the thermal spraying apparatus including: a first electrode provided with a first cavity through which the conductive powder from a powder supplier passes; and a second electrode provided with a second cavity through which the conductive powder from the first electrode passes, in which the plasma is generated between the first electrode and the second electrode.
B05B 5/06 - Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means using electric arc
B05B 5/08 - Plant for applying liquids or other fluent materials to objects
B05B 12/00 - Arrangements for controlling delivery; Arrangements for controlling the spray area
Provided is a technology for uniformly supplying powder as a material to a DED nozzle. An embodiment provides an AM device for manufacturing a molded product, the AM device comprising a DED nozzle. The DED nozzle includes: a powder opening for injecting a powder material, provided in a fore end of a DED nozzle body; and a powder channel for letting the powder material through the DED nozzle body, communicatively connected to the powder opening. The AM device further comprises: a first pipe; a separator wall extending from an end of the first pipe to an upstream side inside the first pipe; and a plurality of second pipes coupled to the end of the first pipe. The separator wall partitions the end of the first pipe into a plurality of regions. The plurality of second pipes are coupled respectively to the plurality of regions of the first pipe. The second pipes are coupled to the powder channel of the DED nozzle.
B22F 10/25 - Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
26.
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
An information processing device (5) includes: an information acquisition unit (500) that in a chemical mechanical polishing process of a substrate performed by a substrate processing apparatus including a polishing table rotatably supporting a polishing pad and a top ring for pushing the polishing pad against the substrate, acquires polishing process state information including top-ring vibration information indicating vibration of the top ring during polishing and top-ring sound information indicating sound generated from the top ring during polishing: and a state prediction unit (501) that inputs the polishing process state information acquired by the information acquisition unit (500) to a learning model (10A) that has learned, through machine learning, correlation between the polishing process state information and substrate slipping-out information indicating occurrence of slipping out of the substrate subjected to the chemical mechanical polishing process, to predict the substrate slipping-out information relative to the polishing process state information.
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/30 - Work carriers for single side lapping of plane surfaces
The present invention relates to a pump unit. A pump unit (PU) is provided with a connector (400) that connects a plurality of motor pumps (MP). The connector (400) connects a front-stage-side ejection casing (22) and a rear-stage-side suction casing (21).
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) comprises: a pressing mechanism (12) which presses a polishing tape (2) against a substrate W; and a tape hook (40) which restricts the movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape-positioning surface (47) that faces the polishing surface of the edge of the polishing tape (2).
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 21/06 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
The present invention provides a plating apparatus having a shielding member, wherein the uniformity of the plating film thickness distribution is improved by arranging a resistor close to a surface to be plated of a substrate. A plating apparatus according to the present invention comprises: a plating bath 410 which is configured so as to contain a plating solution; a substrate holder 440 which holds a substrate Wf, with a surface Wf-a to be plated facing down; an anode 430 which is arranged within the plating bath 410; a resistor 450 which is arranged between the substrate Wf and the anode 430 and has a facing surface 450-a that faces the surface Wf-a to be plated, wherein the facing surface 450-a has a first facing surface 450-a1 and a second facing surface 450-a2 that is more distant from the surface Wf-a to be plated than the first facing surface 450-a1; and a shielding member 481 which is arranged in a recessed region β of the resistor 450 and is used for the purpose of shielding an electric field, the recessed region β being formed by the second facing surface 450-a2.
The present invention relates to a motor pump and a motor pump assembly. The motor pump (MP) has a rotation-side grip structure (100) by which an impeller (1) can grip a rotation-side bearing structure (11).
An information processing device (5) comprises: an information acquisition unit (500) that acquires substrate processing fluid supply information including substrate processing fluid supply state information which indicates the state of supply of a substrate processing fluid that is supplied from a substrate processing fluid supply unit (222, 242a, 245a), in processing of a substrate (W) which is performed by a substrate processing device (2); and a state prediction unit (501) that predicts substrate processing fluid supply position information corresponding to the substrate processing fluid supply information by inputting the substrate processing fluid supply information to a learning model which has learned, by machine learning, correlations between substrate processing fluid supply information and substrate processing fluid supply position information, said substrate processing fluid supply position information indicating the supply position of the fluid that is supplied by the substrate processing fluid supply unit when the substrate processing device operates.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/00 - Lapping machines or devices; Accessories
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
32.
CHEMICAL SUPPLY APPARATUS, CLEANING SYSTEM, AND CHEMICAL SUPPLY METHOD
The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles.
The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles.
A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.
The present disclosure provides a plating device and a drying method that make it possible to keep an electrical contact dry. This plating device comprises a blow module and a substrate holder that holds a substrate and has an electrical contact for supplying power to the substrate. The blow module has a substrate holder stage for supporting the substrate holder, a drying nozzle assembly that has a nozzle for spraying a gas at the substrate and the substrate holder, and an actuator for moving the drying nozzle assembly such that the nozzle moves in a plane along the surface of the substrate.
This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including an operation state when a substrate processing device (2) including a substrate holding unit (241) operates; and a state prediction unit (501) which predicts substrate holding mechanism part state information for the operation state information by inputting the operation state information to a training model for which a correlation between the operation state information and the substrate holding mechanism part state information is trained through machine learning, the substrate holding mechanism part state information indicating the states of substrate holding mechanism parts (241a, 241c, 241e) when the substrate processing device (2) operates in the operation state indicated by the operation state information.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
The present invention enables specific parts of a substrate to be shielded at a desired timing and improves uniformity in plating film thickness. In this invention, a plating module includes: a plating bath 410 for accommodating a plating solution; an anode 430 disposed inside the plating bath 410; a substrate holder 440 for holding a substrate Wf with a surface Wf-a to be plated facing downward; a rotating mechanism 447 configured to cause the substrate holder 440 to rotate in a first direction and in a second direction which is opposite to the first direction; and a shielding mechanism 485 for causing a shielding member 481 to move to a position between the anode 430 and the substrate Wf in accordance with a rotation angle of the substrate holder 440.
A substrate cleaning method and a substrate cleaning apparatus are provided. The substrate cleaning method includes a first step of applying a chemical solution to a lower surface of a substrate, and a second step of subsequently applying a bubble-containing liquid to the lower surface of the substrate.
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B01F 23/23 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
B01F 23/2373 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media for obtaining fine bubbles, i.e. bubbles with a size below 100 µm
B01F 23/237 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
37.
PUSHER, TRANSFER DEVICE, AND SUBSTRATE PROCESSING APPARATUS
A pusher that holds a substrate includes: a pusher body, and a plurality of seating members that is attached to the pusher body and on which a substrate is seated. Each of the plurality of seating members includes: a pedestal member including a seating portion on which the substrate is seated and a magnet disposed at a position different from the seating portion, and supported by the pusher body such that the position of the magnet is moved according to seating or leaving of the substrate; a seating sensor configured to detect movement of the magnet; and a magnetic member disposed to shield a portion between a movable region of the magnet and the seating sensor.
B24B 41/00 - Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
38.
METHOD OF MANUFACTURING BARRIER-METAL-FREE METAL INTERCONNECT STRUCTURE, AND BARRIER-METAL-FREE METAL INTERCONNECT STRUCTURE
The present invention relates to a metal interconnect structure containing no barrier metal and a method of manufacturing the metal interconnect structure. The method includes: filling at least a first interconnect trench with an intermetallic compound by depositing the intermetallic compound on an insulating layer having the first interconnect trench and a second interconnect trench formed in the insulating layer, the second interconnect trench being wider than the first interconnect trench; performing a planarization process of polishing the intermetallic compound until the insulating layer is exposed; and then performing a height adjustment process of polishing the intermetallic compound and the insulating layer until a height of the intermetallic compound in the first interconnect trench reaches a predetermined height.
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
39.
SUBSTRATE PROCESSING APPARATUS, COMPUTER-READABLE STORAGE MEDIUM STORING A PROGRAM, AND SUBSTRATE PROCESSING METHOD
The present invention relates to a substrate processing apparatus for processing a substrate. The substrate processing apparatus (1) includes a controller (90). The controller (90) rotates the substrate (W) at a second speed, after rotating the substrate (W) at a first speed. The controller (90) supplies a dry fluid from a dry fluid nozzle (30) onto the substrate (W) for predetermined time after rotating the substrate (W) at the second speed, and while rotating the substrate (W) at a third speed. The controller (90) moves a dry fluid nozzle (30) from a center of the substrate (W) toward a peripheral portion of the substrate (W) while continuing to supply the dry fluid from the dry fluid nozzle (30).
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
40.
SUBSTRATE CONVEYANCE METHOD, SUBSTRATE PROCESSING DEVICE, AND RECORDING MEDIUM
A substrate conveyance method, a substrate processing device, and a recording medium are provided. The substrate conveyance method includes: conveying a substrate into a receiving unit and confirming that the substrate is present in the receiving unit by detecting that light irradiated from an optical sensor is blocked by the substrate conveyed to the receiving unit; and stopping light irradiation from the optical sensor before the substrate is conveyed out from the receiving unit.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
41.
POWER CABLE FOR SUBMERSIBLE PUMP, PUMP CARRY-IN METHOD, AND PUMP PULL-UP METHOD
The present invention relates to a power cable for supplying power to a submersible pump for raising the pressure of a liquefied gas such as liquefied ammonia, liquefied natural gas (LNG), or liquid hydrogen. The present invention further relates to: a method for carrying a submersible pump into a pump column by using such a power cable; and to a method for pulling up the submersible pump from the pump column. A power cable (36) is for supplying power to a submersible pump (2) disposed inside a pump column (3) in order to transfer liquefied gas, the power cable comprising: a plurality of split power cables (36A); and a plurality of cable connectors (36B) electrically connecting the plurality of split power cables (36A).
The present invention provides a container capable of increasing the temperature of a liquid hydrogen pump during maintenance and a system including such a container. Provided is a maintenance system used for the maintenance of the liquid hydrogen pump, the maintenance system comprising: a hollow container main body which allows the liquid hydrogen pump to pass therethrough during maintenance and which has one or more inlets and one outlet; a circulation flow path connecting the outlet and the one or more inlets; a blower which is provided on the circulation flow path and which guides helium gas from the outlet into the one or more inlets to thereby circulate the helium gas in the circulation flow path; and a heat exchanger which increases, by the atmosphere, the temperature of the helium gas passing through the circulation flow path.
F17C 9/00 - Methods or apparatus for discharging liquefied or solidified gases from vessels not under pressure
F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
Provided is a container capable of preventing gas from leaking from a cable penetration hole. Hollow containers 3, 4 are provided above a hollow column 2 provided around a liquefied gas pump P. The center parts of the containers 3, 4 are penetrated from the bottom toward the top by a cable 8 for installing and pulling out the liquefied gas pump P. The containers 3, 4 comprise: lower plate members 5, 6 having, in center parts, cable through holes 9, 10 that can be penetrated by the cable 8; and stuffing box members 12 provided around the cable through holes 9, 10 in the center parts of the lower plate members 5, 6 and having center parts with cable insertion holes 13 through which the cable 8 is inserted. The stuffing box members 12 comprise opening diameter adjustment mechanisms 14, 20 that adjust the sizes of the opening diameters of the cable insertion holes 13.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A display system is provided that includes: a rotary machine device including a rotary machine and a drive machine causing the rotary machine to rotate; a display device capable of displaying a state of the rotary machine device; a detection section acquiring plural state quantities indicating the state of the rotary machine device; and a display control section displaying a chart on the display device on the basis of the plural state quantities acquired by the detection section, the chart being configured as a multidimensional chart in which the plural state quantities of the rotary machine device at specific time are plotted and the plural state quantities are set as values, each of which corresponds to each axis.
Provided is a technique for fabricating a powder material bedded in advance using a DED nozzle. According to one embodiment, there is provided an AM apparatus for manufacturing a fabricated object. The AM apparatus includes a DED nozzle. The DED nozzle includes: a DED nozzle main body; a laser port disposed at a distal end of the DED nozzle main body and for emitting a laser beam, and a laser passage configured to communicate with the laser port and for allowing the laser beam to pass through the DED nozzle main body; and a powder port disposed at the distal end of the DED nozzle main body and for emitting a powder material, and a powder passage configured to communicate with the powder port and for allowing the powder material to pass through the DED nozzle main body. The AM apparatus further includes a cover configured to surround a peripheral area of the laser port and the powder port of the DED nozzle. The cover is configured to have an opened downstream side in an emission direction of the laser beam. The cover includes a gas supply passage for supplying a gas inside the cover. The gas supply passage is configured to be oriented so as to guide the gas toward the DED nozzle main body.
A polishing method capable of terminating polishing of a substrate, such as a wafer, at a preset polishing time is disclosed. The polishing method includes: polishing a substrate by pressing the substrate against a polishing surface of a polishing pad, while regulating a temperature of the polishing surface by a heat exchanger; calculating a target polishing rate required for an actual polishing time to coincide with a target polishing time, the actual polishing time being a time duration from start of polishing the substrate until a film thickness of the substrate reaches a target thickness; determining a target temperature of the polishing surface that can achieve the target polishing rate; and during polishing of the substrate, changing a temperature of the polishing surface to the target temperature by the heat exchanger.
The present disclosure provides a plating apparatus that can determine an acceleration at the time of an inappropriate deceleration of a transfer device that may cause contact between a substrate holder and a processing tank, a control method for a plating apparatus, and a storage medium storing a program. The plating apparatus according to the present disclosure includes a transfer device including an imaging device, the processing tank having an opening, a reference mark, and a control device, the control device is configured to be able to execute a test at a test acceleration, and the test includes: controlling, by the control device, the imaging device to capture a reference image when the transfer device is located at a determination position directly above the processing tank; moving the transfer device from a reference position to the determination position; controlling the imaging device to capture a comparison video when and after the transfer device stops; and determining, based on the reference image and the comparison video, whether the lower end portion of the substrate holder protrudes outside a region where the opening is extended in a vertical direction, to determine that the test acceleration has an inappropriate value when the lower end portion protrudes outside the region.
A polishing apparatus capable of preventing condensation on an inner surface of a transparent window provided in a polishing pad and capable of achieving accurate measuring of a film thickness is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface; a polishing head configured to press a workpiece against the polishing surface; a transparent window disposed in the polishing pad; a polishing table configured to support the polishing pad; an optical sensor head located below the transparent window and configured to direct light to the workpiece through the transparent window and receive reflected light from the workpiece through the transparent window; and a cooling device configured to cool a space between the transparent window and the optical sensor head.
The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in a circular motion by bringing rollers (11a, 11b), which are fixed to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b), into contact with a peripheral edge of the substrate (W) and moving the rollers (11a, 11b) in a circular motion, and a processing tool (201) is brought into contact with the substrate (W) to process the substrate (W). During the processing of the substrate (W), a rotation speed of the substrate (W) is calculated on the basis of a measured value of a notch detection sensor (77) for detecting passage of the notch (Nw) through the movable shaft (13b), and, if the rotation speed of the substrate (W) deviates from an allowable range set for a theoretical rotation speed of the substrate (W), an alert is given.
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
Uniformity in plated film thickness in a plating apparatus is improved. A plating apparatus for plating a substrate by making electric current flow from an anode to the substrate is provided. The plating apparatus comprises: plural anode-side electric wires which are electrically connected to the anode via plural electric contacts on the anode; plural substrate-side electric wires which are electrically connected to the substrate via plural electric contacts on the substrate; plural variable resistors positioned, in at least one of the anode side and the substrate side, in middle positions in the plural anode-side electric wires or the plural substrate-side electric wires; and a controller constructed to adjust each of resistance values of the plural variable resistors.
An abatement apparatus capable of treating exhaust gas with less wet treatment devices than a conventional abatement apparatus is disclosed. The abatement apparatus includes: a pre-wet treatment device; a combustion treatment device; gas introduction lines coupled to process chambers of a film forming device; first flow-path switching devices coupled to the plurality of gas it lines, respectively; a first gas delivery line extending from the first flow-path switching devices to the pre-wet treatment device; a second gas delivery line extending from the first flow-path switching devices to the combustion treatment device; and an operation controller configured to control operations of the first flow-path switching devices to deliver the process gas to the pre-wet treatment device and deliver the cleaning gas to the combustion treatment device.
A film-thickness measuring method capable of substantially extending a wavelength range of a spectrum of reflected light from a workpiece, and accurately measuring a film thickness is disclosed. The film-thickness measuring method includes: pressing a workpiece against a polishing pad, while rotating a polishing table that supports the polishing pad, to polish the workpiece; during the polishing of the workpiece, directing light to the workpiece from a liquid-seal sensor and a transparent-window sensor disposed in the polishing table and receiving reflected light from the workpiece by the liquid-seal sensor and the transparent-window sensor; and determining a film thickness of the workpiece based on a spectrum of the reflected light from the workpiece.
An element which limits throughput of a plating apparatus is identified. A method for identifying an element which limits throughput of a plating apparatus is provided. The method comprises: a step for creating a time chart which represents process schedules of plural processing units and one or plural transfer apparatuses; a step for calculating, based on the time chart, at least one of an operation rate and a degree of freedom of taking-out with respect to each of elements comprising the plural processing units and the one or plural transfer apparatuses, wherein the degree of freedom of taking-out represents a degree of freedom with respect to timing when the substrate which has been processed can be taken out of one of the processing units; and a step for displaying, with respect to each of the elements comprising the plural processing units and the one or plural transfer apparatuses, at least one of the calculated operation rate and the calculated degree of freedom of taking-out.
G05B 19/4155 - Numerical control (NC), i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
A substrate processing apparatus includes: a first module used in a substrate processing process; a second module used in a substrate processing process after the first module; a nozzle provided in the second module and configured to supply a target treatment liquid; a temperature detector that detects a temperature of a treatment liquid inside the nozzle or a temperature of the nozzle; a substrate detection sensor that detects a position of a substrate; and a controller that controls discharge of the target treatment liquid from the nozzle performed before the substrate is conveyed to the second module according to the temperature of the treatment liquid detected by the temperature detector and the position of the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
Provided is a technology with which it is possible to inhibit deformation of a film disposed inside of a plating tank. This maintenance method for a plating device includes: returning an anolyte in an anodic chamber to an anolyte tank and then circulating the anolyte between the anolyte tank and the anodic chamber (step S10e); and returning a catholyte in a cathodic chamber to a catholyte tank and then circulating the catholyte between the catholyte tank and the cathodic chamber after the circulation of the anolyte between the anolyte tank and the anodic chamber has been initiated (step S10f).
This hollow container (13) is provided above a hollow column (11) which surrounds a liquefied gas pump (P). The container (13) is equipped with: a lower plate member (22a, b) capable of opening and closing the lower section of the container (13); a manual opening/closing device (34a, b) operated in order to open and close the lower plate member (22a, b) inside the container (13); a glovebox (35a, b) configured in a manner such that a user can insert a hand therein from outside the container (13) in order to operate the manual opening/closing device (34a, b) inside the container (13); and an operation window (33a, b) positioned near the glovebox (35a, b) and the manual opening/closing device (34a, b) in a manner such that the glovebox (35a, b) and the manual opening/closing device (34a, b) are visible from outside the container (13).
F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
To improve uniformity of a plating film-thickness formed on a substrate.
To improve uniformity of a plating film-thickness formed on a substrate.
A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.
A cleaning device includes: a substrate rotation mechanism that holds and rotates a substrate around center axis thereof; a first single-tube nozzle that discharges first cleaning liquid toward a top surface of the substrate; and a second single-tube nozzle that discharges second cleaning liquid toward the top surface of the substrate. The first single-tube nozzle and the second single-tube nozzle are disposed such that the second single-tube nozzle discharges the second cleaning liquid in a forward direction of a rotation direction of the substrate at a position farther away from the center of the substrate than a landing position of the first cleaning liquid, and a part is generated in which liquid flow on the top surface of the substrate after landing of the first cleaning liquid and liquid flow on the top surface of the substrate after landing of the second cleaning liquid are combined.
A method in which an acoustic sensor disposed in a polishing apparatus can be accurately calibrated is disclosed. In this method, polishing sounds of a substrate are acquired using an acoustic sensor; and then at least two distinctive sounds, having distinctive frequencies respectively, are selected from the acquired polishing sounds. Further, the at least two distinctive sounds are output from a sound source coupled to any of a polishing table, the acoustic sensor, and a substrate holder to cause the at least two distinctive sounds to be input to the acoustic sensor. Next, output values of the acoustic sensor are calibrated, such that the output values of the acoustic sensor relative to the at least two distinctive sounds come within an allowable range.
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
62.
METHOD OF RAISING POLISHING HEAD AFTER POLISHING OF WORKPIECE, POLISHING APPARATUS FOR WORKPIECE, AND COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM
A method of raising a polishing head capable of preventing a workpiece from bending and preventing an excessive stress from generating in the workpiece by avoiding contact between the workpiece and a retainer ring when the polishing head is raised from a polishing pad after polishing of the workpiece is disclosed. The method includes: polishing the workpiece by pressing the workpiece against the polishing pad while rotating the polishing head and the polishing pad; stopping the rotations of the polishing pad and the polishing head; raising the retainer ring of the polishing head relative to the workpiece to separate the retainer ring from the polishing pad and moving the retainer ring to a position higher than the workpiece; and then raising the polishing head with the workpiece held on the polishing head.
The present invention relates to a method for polishing a substrate by pressing an abrasive tape against a substrate such as a wafer. This method for polishing a substrate: stores in a database (21a) an actual polishing condition for a substrate previously polished and an actual used amount of the abrasive tape in the actual polishing condition in association with each other; prior to polishing a substrate to be polished, searches from the database (21a) the actual polishing condition corresponding to a preset polishing condition for the substrate to be polished; determines the actual used amount of the abrasive tape associated with the actual polishing condition corresponding to the preset polishing condition as an estimated used amount of the abrasive tape necessary for polishing of the substrate to be polished; and compares a remaining amount of the abrasive tape used for polishing of the substrate to be polished and the determined estimated used amount, and polishes the substrate to be polished with polishing modules (4A, 4B) when the remaining amount of the abrasive tape is at least the estimated used amount.
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the substrate (W); a static pressure plate (9) with a fluid supporting face (9a) opposed to the suction holding face (5a); and a fluid feeding line (10) connected to the static pressure plate (9) and feeding a fluid to a space between the fluid supporting face (9a) and a second face (2b) of the substrate (W). The second face (2b) is opposite to the first face (2a) of the substrate (W). The fluid supporting face (9a) is larger than the suction holding face (5a).
An information processing device (5) comprises: an information acquisition unit (500) that acquires a polishing process condition including top ring state information, polishing table state information, and polishing fluid supply nozzle state information in a chemical mechanical polishing process carried out for a substrate by a substrate processing device comprising a polishing table that rotatably supports a polishing pad, a top ring that presses the substrate against the polishing pad, and a polishing fluid supply nozzle that supplies polishing fluid to the polishing pad; and a state prediction unit (501) that inputs the polishing process condition acquired by the information acquisition unit (500) into a learning model (10A) that has been trained by machine learning with a correlation between the polishing process condition and substrate state information indicating a state of the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition, to thereby predict substrate state information for the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition.
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 49/14 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
B24B 55/03 - Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
A drainage pump device (2) comprises a pump control unit (20) that controls operation of a pump unit (25) on the basis of the water level detected by a water level detection unit (24). The pump control unit (20) comprises: a weather information acquisition unit (201) that acquires weather information of a monitoring location; an anomaly determination unit (202) that determines whether or not an anomaly has occurred in the water level detection unit (24) or the pump unit (25); a water level detection unit anomaly processing unit (203) that controls operation of the pump unit (25) on the basis of the weather information when it is determined that the anomaly has occurred in the water level detection unit (24); and a pump unit anomaly processing unit (204) that, when it is determined that the anomaly has occurred in the pump unit (25), outputs, on the basis of the water level detected by the water level detection unit (24) and/or the weather information, support request information for requesting support for drainage work performed by a drainage pump vehicle and a worker.
A substrate cleaning device and a substrate polishing device are provided. The substrate cleaning device is provided in a substrate polishing device, which includes a polishing table having a polishing surface for polishing a substrate and a top ring holding the substrate with a membrane while surrounding an outer peripheral part of the substrate with a retainer ring, and cleaning the surface after polishing. The top ring is freely movable between a substrate polishing position above the table and a substrate handover position at a side of the table. The substrate cleaning device is provided corresponding to a cleaning position between the polishing and handover positions, and includes a first spray unit including cleaning nozzles for spraying cleaning liquid on the substrate, membrane, and retainer ring at the cleaning position; and a second spray unit including a substrate rinse nozzle spraying rinse liquid onto the substrate at the cleaning position.
Provided is a technology that enables the removal of air bubbles that have adhered to holes of an ion resistor. A plating method comprises: stirring a plating liquid by driving a paddle disposed above an ion resistor in a state in which the ion resistor and an anode are immersed in the plating liquid (step S20); immersing a substrate, which serves as a cathode, into the plating liquid in a state in which the stirring of the plating liquid by the paddle is stopped (step S40); restarting, in a state in which the substrate is immersed in the plating liquid, the stirring of the plating liquid by the paddle which is disposed above the ion resistor and below the substrate (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state in which the stirring of the plating liquid by the paddle has been restarted (step S60).
Provided is a technique for appropriately handling a substrate holder depending on a use state of the substrate holder. The substrate holder for holding a substrate that is a plating target in a plating apparatus is suggested. The substrate holder includes an RFID tag, and the RFID tag includes a storage region in which a use attribute is stored, the use attribute including an attribute indicating a state of being used for plating processing.
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 7/10 - Methods or arrangements for sensing record carriers by corpuscular radiation
The present invention relates to a volute pump that does not have a rotating shaft coupled to an impeller. A casing (6) of a pump (1) comprises: at least three tongue portions (21A, 21B, 21C) arranged at equal intervals around an impeller (7); and at least three side walls (22A, 22B, 22C) connected respectively to the tongue portions (21A, 21B, 21C). The side walls (22A, 22B, 22C) form at least three flow passages (23A, 23B, 23C) for a fluid. Each of the side walls (22A, 22B, 22C) has a volute side surface (30A, 30B, 30C) which extends from one of the tongue portions (21A, 21B, 21C) to a position beyond another adjacent tongue portion. The pump (1) is not provided with a radial bearing for supporting the impeller (7).
APPARATUS FOR PROCESSING SUBSTRATE, DEVICE OF CONTROLLING APPARATUS FOR PROCESSING SUBSTRATE, METHOD OF CONTROLLING APPARATUS FOR PROCESSING SUBSTRATE, AND STORAGE MEDIUM THAT STORES PROGRAM
One object of the present disclosure is to flexibly and promptly save a processing solution in an apparatus for processing a substrate. An apparatus for processing a substrate is configured to change over a transfer time table between an ordinary mode that has a maximum throughput of the apparatus for processing the substrate and a processing solution saving mode that saves a processing solution in at least one of processing tanks. The apparatus for processing the substrate determines whether or not the apparatus for processing the substrate is in a slack period that has a small demand output by the apparatus for processing the substrate, based on a rate-controlling point that limits a processing speed of the entire apparatus for processing the substrate, and sets the transfer time table to the processing solution saving mode when it is determined that the apparatus for processing the substrate is in the slack period, while setting the transfer time table to the ordinary mode when it is determined that the apparatus for processing the substrate is not in the slack period.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
C25D 21/10 - Agitating of electrolytes; Moving of racks
G05B 19/18 - Numerical control (NC), i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
74.
METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP
To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.
Provided is a wetting method for substrate that allows reducing an amount of air bubbles attached to a surface to be plated with a simple structure.
Provided is a wetting method for substrate that allows reducing an amount of air bubbles attached to a surface to be plated with a simple structure.
The wetting method for substrate includes a holding step 102 of holding a back surface of a substrate with a back plate such that a surface to be plated of the substrate is opposed to a liquid surface of a plating solution housed in a plating tank, a supplying step 104 of supplying the plating solution to the plating tank such that the plating solution upwardly flows through a plurality of through-holes in a center part of an ionically resistive element arranged inside the plating tank to raise a center part of the liquid surface of the plating solution, a first lowering step 106 of lowering a supporting member for supporting an outer edge portion of the surface to be plated of the substrate held by the holding member toward the liquid surface of the plating solution, and a second lowering step 108 of lowering the holding member such that the substrate is sandwiched by the supporting member lowered in the first lowering step 106 and the holding member while the center part of the liquid surface of the plating solution is raised in the supplying step 104.
A technique capable of preventing bubbles from being accumulated on a lower surface of an electric field shield plate is provided. A plating apparatus includes: a plating tank in which a plating solution is retained, and an anode is arranged: a substrate holder that is arranged above the anode, and holds a substrate serving as a cathode such that a surface to be plated of the substrate faces the anode; a diaphragm that partitions an inside of the plating tank into an anode region where the anode is arranged, and a cathode region where the substrate is arranged; and a supporting member that is in contact with a lower surface of the diaphragm and supports the diaphragm, and includes a plurality of beam components extending over regions between the anode and the substrate along the lower surface of the diaphragm, the beam components including bubble guide paths for guiding bubbles from the regions between the anode and the substrate to an outside.
A substrate polishing device comprising an optical sensor for detecting the state of a substrate surface, wherein the accuracy of detection by the optical sensor is improved. Proposed is a polishing pad for a substrate polishing device comprising an optical sensor. This polishing pad comprises: a pad body of which the surface constitutes a polishing surface, the pad body having a through-hole formed therein; and a window member for allowing passage of sensing light from the optical sensor, the window member being accommodated in the through-hole. The pad body has a surrounding recess that surrounds an edge section defining the through-hole, the surrounding recess being recessed into the polishing surface from the edge section. The surrounding recess communicates with a groove extending in the outer peripheral surface of the polishing pad.
B24B 37/20 - Lapping pads for working plane surfaces
B24B 37/12 - Lapping plates for working plane surfaces
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
78.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
The present invention pertains to a substrate processing device for processing substrates such as a wafer, and particularly to a substrate processing method and a substrate processing device which polish a bevel section of a substrate and perform a CMP process on a flat surface section of the substrate. The substrate processing method involves: polishing, with a polishing tool, bevel sections (B) of a plurality of substrates (W) so that the tilt angles (α) of tilt surfaces (S) of bevel sections (B) of the plurality of substrates (W) are equal to each other; and performing a CMP process on planar sections (P) of the plurality of substrates (W) in which the bevel sections (B) have been polished.
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 49/02 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
A polishing apparatus and a polishing method capable of accurately measuring a film thickness of a workpiece, such as wafer, substrate, or panel, used in manufacturing of semiconductor devices during polishing of the workpiece are disclosed. The processing system is configured to determine a film thickness of the workpiece based on relative reflectance data calculated by a calculation formula expressed as: the relative reflectance data=MD1/[BD1·k], where MD1 represents first intensity measurement data indicating intensity of the reflected light from the workpiece measured by the first spectrometer, BD1 represents the first base intensity data, and k represents a rate of change in second intensity measurement data with respect to the second base intensity data. The second intensity measurement data is indicative of intensity of the light of the light source measured by the second spectrometer during polishing of the workpiece.
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
H01L 21/66 - Testing or measuring during manufacture or treatment
G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
80.
APPARATUS FOR PLATING AND METHOD OF CONTROLLING APPARATUS FOR PLATING
An object is to reduce the field shielding effect of a paddle during plating. There is provided an apparatus for plating that is configured to plate a substrate and comprises a plating tank; an anode placed in the plating tank; a rotation mechanism configured to rotate the substrate in a first direction and in a second direction that is opposite to the first direction; and a control device configured to control the rotation mechanism, such that a time period when the substrate is rotated in the first direction becomes equal to a time period when the substrate is rotated in the second direction or such that a time integrated value of a rotation speed in the first direction becomes equal to a time integrated value of a rotation speed in the second direction.
In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.
B24B 37/013 - Devices or means for detecting lapping completion
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
The purpose of the present invention is to suppress the adhesion of a wafer to a back plate assembly. This plating apparatus comprises: a plating bath configured so as to accommodate a plating solution; a wafer holder configured so as to hold a wafer Wf such that a surface to be plated Wf-a thereof is oriented downward; and a raising/lowering mechanism configured so as to raise and lower the wafer holder. The wafer holder comprises: a support mechanism 460 configured so as to support the outer periphery of the surface to be plated Wf-a of the substrate Wf; a back plate assembly 470 that is disposed on the reverse surface side of the wafer Wf from the surface to be plated Wf-a, and is configured so as to sandwich the wafer Wf together with the support mechanism 460; and a separation mechanism 471 configured so as to apply force for separating the wafer Wf from the back plate assembly 470 to the reverse surface of the wafer Wf from the surface to be plated Wf-a.
This load adjustment system comprises: a bevel polishing device having a polishing head that polishes a bevel portion of a substrate; and a control device. The control device acquires, from a load measuring device that measures a pressing load from the polishing head, measurement data obtained by the measurement, calculates an adjustment value for adjusting the pressing load, on the basis of the measurement data and a setting parameter set for the polishing head, and controls a pressing operation of the polishing head on the basis of the adjustment value.
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention relates to a substrate processing device that processes a substrate. A substrate processing device (10) that comprises: at least one first processing module (21a, 21b) that uses a fluid and processes a substrate W; at least one second processing module (31) that treats the substrate processed by the first processing module (21a, 21b); a conveying robot (22) that is disposed in a conveying area (28) and conveys the substrate W from the first processing module (21a, 21b) to the second processing module (31); a pair of gutters (53, 54) that are disposed above the floor (51) of the conveying area (28) and are connected to a drain line (58); and at least one inclined plate (56) that spans the pair of gutters (53, 54). The upper surface of the inclined plate (56) extends at an angle relative to the horizontal direction, from one of the gutters (53, 54) in the pair to the other.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
85.
PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE
Provided is a technique that allows measuring a film thickness of a substrate in a plating process.
Provided is a technique that allows measuring a film thickness of a substrate in a plating process.
A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
G01R 15/12 - Circuits for multi-testers, e.g. for measuring voltage, current, or impedance at will
G01R 15/18 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
Provided is a technique that ensures suppressed invasion of particles generated at a bearing of a rotation mechanism into a plating tank.
Provided is a technique that ensures suppressed invasion of particles generated at a bearing of a rotation mechanism into a plating tank.
A plating apparatus 1000 includes a labyrinth seal member 50. The labyrinth seal member includes an inner labyrinth seal 53 arranged below a bearing 33 to seal the bearing, an outer labyrinth seal 54 arranged outside in a radial direction of the rotation shaft 32 with respect to the inner labyrinth seal, a delivery port 55configured to supply air to an inner seal space 60 formed inside in the radial direction with respect to the inner labyrinth seal, and a suction port 56 configured to suction air in an outer seal space 65 formed outside in the radial direction with respect to the inner labyrinth seal and inside in the radial direction with respect to the outer labyrinth seat
Provided is a technique that allows a removal of air bubbles that remain on an ionically resistive element.
Provided is a technique that allows a removal of air bubbles that remain on an ionically resistive element.
A plating apparatus 1000 includes a plating tank 10 configured to accumulate a plating solution Ps and including an ionically resistive element 12 arranged in the plating tank, a substrate holder 30 arranged above the ionically resistive element and configured to hold a dummy substrate Wfx, a rotation mechanism 40 configured to rotate the substrate holder, and an elevating mechanism 50 configured to elevate the substrate holder. At least one projecting portion is disposed on a lower surface of the dummy substrate. The at least one projecting portion 60 projects downward from the lower surface. The substrate holder includes a ring 31 projecting below an outer peripheral edge of the lower surface of the dummy substrate. The projecting portion has a lower surface positioned below a lower surface of the ring. The plating apparatus is configured to cause the rotation mechanism to rotate the substrate holder in a state where the elevating mechanism moves down the substrate holder to allow the projecting portion of the dummy substrate to be positioned above the ionically resistive element and to be immersed in the plating solution of the plating tank.
One object of the present disclosure is to improve the accuracy of detection of an abnormality of various devices, and/or to advance the timing of detection of an abnormality. There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; an electric field regulating member placed between the substrate and the anode, provided with an opening, and equipped with an opening adjustment member configured to change a dimension of the opening; a motor configured to drive the opening adjustment member; and a control device configured to obtain an electric current value or a load factor of the motor, to calculate an amount of change in the load factor of the motor per unit time from the obtained electric current value or the obtained load factor of the motor, and to detect an abnormality of the electric field regulating member when it is detected that the amount of change in the load factor of the motor per unit time exceeds a predetermined threshold value.
The present invention facilitates maintenance of a component disposed at the bottom of a face-down type plating device. The plating device is equipped with: a plating tank for holding a plating solution; a substrate holder that holds a substrate with a surface to be plated facing downward; a drawer unit that is attached to the plating tank so as to be capable of being freely pulled out in a horizontal direction, and that has an anode disposed so as to face the substrate in the plating tank, and a variable anode mask which has an opening exposing the anode and which is capable of adjusting the opening dimension of the opening.
The purpose of the present invention is to efficiently clean a substrate. This plating module 400 includes a plating tank 410 configured to accommodate a plating solution, a substrate holder 440 configured to hold a substrate Wf in which a surface Wf-a to be plated is facing downwards, a rotation mechanism 446 configured to rotate the substrate holder 440, a tilting mechanism 447 configured to tilt the substrate holder 440, and a substrate-cleaning member 472 for cleaning the surface Wf-a to be plated of the substrate Wf held by the substrate holder 440. The substrate-cleaning member 472 is configured to discharge a cleaning solution onto the surface Wf-a to be plated of the substrate Wf rotated by the rotation mechanism 446, from a position corresponding to the lower edge towards a position corresponding to the upper edge of the substrate Wf tilted by the tilting mechanism 447.
Provided is a technique for achieving both of the cleaning of a substrate and the prevention of the release of a plating solution atmosphere in a plating vessel into a plating module. The plating module includes: a plating vessel 410 that is so configured as to accommodate a plating solution therein; a substrate holder that is so configured as to hold a substrate Wf with the plating surface of the substrate Wf downward; a lifting and lowering mechanism that is so configured as to lift and lower the substrate holder; a cover member 460 that is positioned above the plating vessel 410 and has a side wall 461 surrounding a lifting and lowering route for the substrate holder; an opening and closing mechanism that is so configured as to open and close an opening 461a formed in the side wall 461 of the cover member 460; a substrate cleaning member 472 for ejecting a cleaning solution toward the plating surface of the substrate Wf held by the substrate holder; and a driving mechanism 476 that is so configured as to move the substrate cleaning member 472 between a cleaning position located between the plating vessel 410 and the substrate holder and an evacuation position evacuated from an area between the plating vessel 410 and the substrate holder via the opening 461a.
Provided is a plating module comprising: a plating vessel which is so configured as to accommodate a plating solution therein; a substrate holder which is so configured as to hold a substrate with a plating surface of the substrate downward; a rotation mechanism which is so configured as to rotate the substrate holder; a contact member 494-4 which has a substrate contacting point 494-4a that comes into contact with the outer peripheral part of the plating surface of the substrate held by the substrate holder and a main body part 494-4b that extends upward relative to the substrate contacting point 494-4a and which is attached to the substrate holder; and a contact cleaning member 482 for ejecting a cleaning solution toward the main body part 494-4b of the contact member 494-4 from under the substrate holder.
The present invention provides a technology that is capable of suppressing the degradation in substrate plating quality caused by air bubbles that remain on the entire lower surface of a membrane. A plating device 1000 equipped with a plating tank 10, a substrate holder 20, and a membrane module 40, wherein the membrane module is equipped with a first membrane 41 and a second membrane 42, and the second membrane includes an inflow port 42c for allowing plating liquid in a first region R1 below the second membrane to flow into a second region R2 above the second membrane and below the first membrane, and an inclined part 42b that is inclined with respect to the horizontal direction, and that is inclined so as to be upwards from the center-side of an anode chamber towards the outer edge of the anode chamber.
The present invention relates to a polishing method and a polishing apparatus for polishing a substrate, such as a wafer. The present invention further relates to a computer-readable storage medium storing a program for causing the polishing apparatus to perform the polishing method. The polishing method includes: rotating a polishing table (3); and polishing a substrate (W) by pressing the substrate (W) against a polishing surface (2a). Polishing the substrate (W) includes a film-thickness profile adjustment process and a polishing-end-point detection process. The film-thickness profile adjustment process includes adjusting pressing forces on the substrate (W) against the polishing surface (2a) based on a plurality of film thicknesses, and determining a point in time at which a film-thickness index value has reached a film-thickness threshold value. The film-thickness index value is determined from at least one of the plurality of film thicknesses. The polishing-end-point detection process includes measuring a torque for rotating the polishing table (3) and determining a polishing end point based on the torque.
The purpose of the present invention is to suppress variations in the supply of power to a contact member. In the present invention, a wafer holder comprises: a frame-shaped support mechanism that is suspended and held by a plurality of support columns, and is configured so as to support the outer periphery of a surface to be plated of a wafer; a back plate assembly that is disposed on the reverse surface side of the wafer from the surface to be plated, and is configured so as to sandwich the wafer together with the support mechanism; a contact member 468 that is disposed on the support mechanism; and a plurality of power source line members 461. The contact member 468 has a power supply contact that contacts the outer periphery of the surface to be plated of the wafer, and a plurality of power source connection parts 469b that are connected to a power source. The plurality of power source line members 461 are respectively connected from the power source to the plurality of power source connection parts 469b through the plurality of support columns, and are arranged such that the distances from from the power source to the respective power source connection parts 469b are equal.
The present invention relates to a fixed bearing structure and a motor pump. The fixed bearing structure (12) comprises a fixed bearing body (40) and a blocking body (41) of a size that enables a circulation flow path (R2) of a motor casing (30) to be blocked.
The present invention relates to a polishing device and a polishing method. This polishing device comprises a holding stage (4), a polishing head (14), and a control device (1). The control device (1) comprises a determination unit (1d) that determines the removal of a film (F). The determination unit (1d) decides to remove the film (F) when the rotational torque value is stable at a set torque value.
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
98.
HYDROGEN PRODUCTION METHOD AND HYDROGEN PRODUCTION DEVICE
C01B 3/40 - Production of hydrogen or of gaseous mixtures containing hydrogen by reaction of gaseous or liquid organic compounds with gasifying agents, e.g. water, carbon dioxide, air by reaction of hydrocarbons with gasifying agents using catalysts characterised by the catalyst
C01B 3/56 - Separation of hydrogen or hydrogen containing gases from gaseous mixtures, e.g. purification by contacting with solids; Regeneration of used solids
H01M 8/04 - Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids
H01M 8/0612 - Combination of fuel cells with means for production of reactants or for treatment of residues with means for production of gaseous reactants from carbon-containing material
B01J 23/83 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups with rare earths or actinides
One purpose of the present invention is to provide technology for suppressing the degradation of a seed layer of a substrate. Provided is a plating method comprising: a step in which a substrate is held by a substrate holder, and, in a state where the substrate holder is holding the substrate, a sealing space is formed that protects a contact for supplying electricity to the substrate from a plating solution, and in the sealing space, sites where the substrate and the contact make contact are locally covered with a liquid; a step in which the substrate held by the substrate holder is immersed in the plating solution and made to face an anode; and a step in which, in a state where the sites where the substrate and the contact make contact are locally covered with the liquid, a current is supplied between the substrate and the anode so as to plate the substrate.
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer, in particular to a substrate processing apparatus that presses a processing tool against a surface of the substrate while holding the peripheral edge of the substrate with a rotary roller, to process the surface of the substrate. This substrate processing apparatus comprises: a plurality of rollers (11A-11D) arranged around a reference center point (CP) and disposed in contact with the peripheral edge of a substrate W; a pressing member (21A) that presses a processing tool (3) against an outer peripheral portion of the surface of the substrate W; and an actuator (22A) that provides the pressing member (21A) with a pressing force. Two (11A, 11B) of the plurality of rollers (11A-11D) are disposed adjacent to the pressing member (21A) on both sides of the pressing member (21A).
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 41/06 - Work supports, e.g. adjustable steadies
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
