Ebara Corporation

Japan

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2024 July (MTD) 11
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IPC Class
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting 281
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components 258
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating 168
C25D 17/06 - Suspending or supporting devices for articles to be coated 157
B24B 37/005 - Control means for lapping machines or devices 153
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07 - Machines and machine tools 65
09 - Scientific and electric apparatus and instruments 48
37 - Construction and mining; installation and repair services 43
42 - Scientific, technological and industrial services, research and design 35
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1.

SUBSTRATE POLISHING APPARATUS, SUBSTRATE PROCESSING APPARATUS, METHOD, AND STORAGE MEDIUM

      
Application Number 18395059
Status Pending
Filing Date 2023-12-22
First Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Kabasawa, Masashi
  • Shiokawa, Yoichi
  • Yagi, Keita
  • Sasaki, Toshimitsu
  • Egawa, Kohei

Abstract

An object of the present disclosure is to more appropriately control the moving speed of a dresser. A substrate polishing apparatus includes a dresser that moves in a plurality of scan areas set on a polishing member, and a moving speed calculation unit that calculates a moving speed of the dresser in each of the scan areas based on an evaluation index including a deviation from a stay time of the dresser in each of the scan areas on a basis of a previous recipe.

IPC Classes  ?

  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
  • B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

2.

PLATING APPARATUS AND CONTACT CLEANING METHOD

      
Application Number 17923412
Status Pending
Filing Date 2021-11-04
First Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamamoto, Kentaro
  • Tomita, Masaki
  • Tsuji, Kazuhito

Abstract

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.

IPC Classes  ?

  • C25D 21/08 - Rinsing
  • C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D 17/02 - Tanks; Installations therefor
  • C25D 17/06 - Suspending or supporting devices for articles to be coated

3.

SUBSTRATE POLISHING DEVICE, SUBSTRATE PROCESSING APPARATUS, METHOD, AND STORAGE MEDIUM

      
Application Number 18395191
Status Pending
Filing Date 2023-12-22
First Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Kabasawa, Masashi
  • Yagi, Keita
  • Shiokawa, Yoichi
  • Sasaki, Toshimitsu
  • Egawa, Kohei

Abstract

A substrate polishing device includes a height detection unit configured to measure a surface height of a polishing member, and a cutting rate calculation unit configured to calculate a cutting rate of the polishing member based on the surface height. The cutting rate calculation unit corrects the current cutting rate based on the cutting rate calculated in the past when the calculated current cutting rate falls outside a search range.

IPC Classes  ?

  • B24B 49/03 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
  • B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation

4.

SUBSTRATE SUCTION MEMBER, TOP RING, AND SUBSTRATE PROCESSING DEVICE

      
Application Number JP2023042611
Publication Number 2024/142725
Status In Force
Filing Date 2023-11-28
Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Yoshida, Atsushi
  • Ono, Koji

Abstract

The present invention prevents breakage at the peripheral edges of a substrate and holds the substrate stably. A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334 for suctioning a substrate WF, and a depressurization section 334b that communicates with a depressurization means 31; a shielding member 332 that shields the surface 334c of the porous member 334 on the reverse side from the substrate suction surface 334a; and a bag member 336 that is disposed so as to enclose the porous member 334 and communicates with a gas supply source 331.

IPC Classes  ?

  • B24B 37/30 - Work carriers for single side lapping of plane surfaces
  • B24B 37/12 - Lapping plates for working plane surfaces
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

5.

PLASMA TREATMENT DEVICE AND SUBSTRATE TREATMENT DEVICE

      
Application Number JP2023042575
Publication Number 2024/142723
Status In Force
Filing Date 2023-11-28
Publication Date 2024-07-04
Owner
  • EBARA CORPORATION (Japan)
  • NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY (Japan)
Inventor
  • Shamoto, Mitsuhiro
  • Ando, Atsushi
  • Fujikata, Jumpei
  • Higashi, Takaaki
  • Sakue, Daiki
  • Ishijima, Tatsuo

Abstract

Provided is a technology that enables liquid plasma treatment of a substrate surface at low power. A plasma treatment device (10) comprises: a chamber (20) that stores a liquid Lq; a substrate holder (50) that holds a substrate Wf while the substrate is disposed in the liquid; a gas chamber (60) which accommodates a gas Ga, which has an opening (64) in an area opposing the substrate, and in which at least the opening is disposed inside the liquid of the chamber and is spaced apart from the substrate; a microwave generation device (80) that generates microwaves; a waveguide (82) that has a prescribed area (84) disposed inside the gas chamber and that transmits, to the prescribed area, the microwaves generated by the microwave generation device; and an antenna (90) that is disposed in the prescribed area of the waveguide and that induces plasma by projecting the microwaves into the gas chamber.

IPC Classes  ?

  • H05H 1/30 - Plasma torches using applied electromagnetic fields, e.g. high-frequency or microwave energy
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • H05H 1/24 - Generating plasma

6.

PROCESSING APPARATUS

      
Application Number 18396359
Status Pending
Filing Date 2023-12-26
First Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Mizuno, Toshio
  • Himori, Yosuke

Abstract

Provided is a technique allowing an effective process of a bevel portion of a workpiece. A processing apparatus 1 includes a workpiece table 10 configured to hold a workpiece Wf, and a processing head 30 configured to hold a processing pad Pd. The processing pad includes a pad surface 120 provided with at least one groove 130 having an inner circumferential groove wall 131 and an outer circumferential groove wall 132. The processing apparatus 1 is configured to rotate the workpiece table and the processing head, and bring an edge 133 of the inner circumferential groove wall and an edge 134 of the outer circumferential groove wall in contact with a bevel portion 100 of the workpiece during a process of the workpiece.

IPC Classes  ?

  • B24B 5/16 - Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding peculiarly profiled surfaces, e.g. bulged
  • B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
  • B24B 27/00 - Other grinding machines or devices
  • B24B 27/04 - Grinding machines or devices in which the grinding tool is supported on a swinging arm

7.

PLATING APPARATUS

      
Application Number 17923080
Status Pending
Filing Date 2021-06-04
First Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Shimoyama, Masashi
  • Masuda, Yasuyuki
  • Tsuji, Kazuhito
  • Hiwatashi, Ryosuke

Abstract

An objective of the present invention is to provide a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, an anode disposed, in the plating tank, facing the substrate held by the substrate holder, and a film thickness measuring module including a sensor that detects a parameter related to a plating film formed on a surface to be plated of the substrate, the film thickness measuring module measuring a film thickness of the plating film based on a detection value of the sensor during a plating treatment.

IPC Classes  ?

  • C25D 21/12 - Process control or regulation
  • C25D 5/02 - Electroplating of selected surface areas
  • C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D 17/06 - Suspending or supporting devices for articles to be coated
  • C25D 21/10 - Agitating of electrolytes; Moving of racks

8.

POLISHING METHOD, POLISHING DEVICE AND RECORDING MEDIUM

      
Application Number JP2023043096
Publication Number 2024/142757
Status In Force
Filing Date 2023-12-01
Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor Ishii, Yu

Abstract

The present invention pertains to a polishing method, a polishing device, and a recording medium. The polishing method is configured as follows: an output waveform which was measured and an estimation detection time are input to a model constructed using a machine learning algorithm; and the model outputs a waveform processing recipe that includes a waveform processing parameter for determining the simulation detection time with which the difference with the estimation detection time becomes the smallest value possible.

IPC Classes  ?

  • B24B 37/013 - Devices or means for detecting lapping completion
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
  • G05B 23/02 - Electric testing or monitoring
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

9.

SUBSTRATE HOLDER AND SUBSTRATE PROCESSING APPARATUS

      
Application Number JP2022048546
Publication Number 2024/142367
Status In Force
Filing Date 2022-12-28
Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamasaki, Gaku
  • Ogata, Shoichiro

Abstract

The present disclosure provides a substrate holder which is configured such that a mechanism for affixing a first holding material and a second holding material to each other can be operated in a non-contact manner. A substrate holder according to the present disclosure is provided with: a first holding material; a second holding material for holding a substrate together with the first holding material by having the substrate sandwiched therebetween; an engaging member which is provided on one of the first holding material and the second holding material; and a member to be engaged, which is affixed to the other of the first holding material and the second holding material. The engaging member comprises a magnet and is configured to be movable between a locked position in which the engaging member and the member to be engaged are engaged with each other by the magnetic force acting on the magnet, whereby the first holding material and the second holding material are affixed to each other, and an unlocked position in which the engagement between the engaging member and the member to be engaged is released, whereby the fixation of the first holding material and the second holding material is released.

IPC Classes  ?

  • C25D 17/06 - Suspending or supporting devices for articles to be coated

10.

POLISHING METHOD, POLISHING DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM

      
Application Number JP2023040890
Publication Number 2024/142632
Status In Force
Filing Date 2023-11-14
Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor Satori, Hirotaka

Abstract

The present invention relates to a polishing method for polishing a substrate such as a wafer or a panel. In this polishing method: a polishing pad (polishing implement) (1) having a polishing surface (1a) is caused to rotate; a substrate (W) is pressed against the polishing surface (1a) to polish the substrate (W); an assessment is made, during polishing of the substrate (W), as to whether each of a plurality of measurement data points measured by a sensor (30) is valid; and a representative measured value of a physical quantity is determined, each time the polishing table (3) rotates, on the basis of measured values of the measurement data points that are assessed to be valid. In the assessment as to whether the measurement data points are valid, the number of measurement data points within a search region is counted, and the measurement data points being assessed are assessed to be valid if the number of measurement data points within the search region is equal to or greater than a threshold value.

IPC Classes  ?

  • B24B 37/013 - Devices or means for detecting lapping completion
  • B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
  • B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
  • B24B 49/14 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

11.

POLISHING HEAD AND POLISHING DEVICE

      
Application Number JP2023040939
Publication Number 2024/142636
Status In Force
Filing Date 2023-11-14
Publication Date 2024-07-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Uchiyama, Keisuke
  • Yamamoto, Satoru

Abstract

The present invention relates to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also relates to a polishing device for polishing a substrate with such a polishing head. A polishing head (10) for polishing a substrate (W) comprises: a pressing member (12) that presses a polishing tape (2) against the substrate (W); and an actuator (15) that is connected to the pressing member (12), and imparts a pressing force to the pressing member (12). The pressing member (12) has a plurality of protruding parts (50), and the plurality of protruding parts (50) are arranged along a longitudinal direction of the pressing member (12), and arranged along a traveling direction (Z) of the polishing tape (2).

IPC Classes  ?

  • B24B 41/047 - Grinding heads for working on plane surfaces
  • B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

12.

PLATING PROCESS METHOD

      
Application Number 17910977
Status Pending
Filing Date 2021-10-18
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Masuda, Yasuyuki
  • Tomita, Masaki

Abstract

Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane. Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane. A plating process method includes a step of guiding an anode liquid to a second region R2 positioned below a membrane 40 and above a first region R1 to decrease a concentration of gas bubbles contained in the anode liquid in the second region below a concentration of gas bubbles contained in the anode liquid in the first region; a step of discharging the anode liquid from the first region; a step of discharging the anode liquid from the second region; a step of supplying a cathode liquid to a cathode chamber 12 in which a substrate Wf is disposed; and a step of flowing electricity between the substrate Wf and an anode 13 to electroplate a metal on the substrate.

IPC Classes  ?

  • C25D 21/04 - Removal of gases or vapours
  • C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating

13.

PLATING METHOD AND PLATING APPARATUS

      
Application Number 17802447
Status Pending
Filing Date 2021-12-06
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Tsuji, Kazuhito
  • Nagai, Mizuki

Abstract

Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element. Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element. A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).

IPC Classes  ?

14.

SEMICONDUCTOR WAFER DETECTION DEVICE AND DROPLET GUIDE MEMBER

      
Application Number 18389669
Status Pending
Filing Date 2023-12-19
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Fujimoto, Tomoaki
  • Matsushita, Kunimasa

Abstract

A semiconductor wafer detection device detects a semiconductor wafer. The semiconductor wafer detection device includes a light sensor, a detector, and a droplet guide member. The light sensor includes a light emitter having a light emitting surface that emits light, and a light receiver having a light receiving surface that receives the light from the light emitter. The detector detects the semiconductor wafer based on the light received by the light receiver. The droplet guide member causes a droplet adhering to the light emitting surface to flow down. The droplet guide member includes a liquid guide part of a plate shape. The liquid guide part is arranged with a tip facing the center of the light emitting surface when viewed in a direction of an optical axis of the light emitting surface.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

15.

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

      
Application Number 18394735
Status Pending
Filing Date 2023-12-22
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor Ishibashi, Tomoatsu

Abstract

A substrate cleaning apparatus according to the present invention comprises a cleaning member that contacts with a substrate to clean the substrate; and a supply mechanism that provides an organic solvent for dissolution to the substrate after the substrate is cleaned by the cleaning member. The organic solvent for dissolution can dissolve a foreign substance generation factor caused by the cleaning member.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 1/12 - Brushes
  • B08B 1/20 - Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
  • B08B 1/34 - rotating about an axis parallel to the surface
  • B08B 1/36 - rotating about an axis orthogonal to the surface
  • B08B 3/04 - Cleaning involving contact with liquid
  • B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect

16.

SUBSTRATE POLISHING APPARATUS

      
Application Number 18396256
Status Pending
Filing Date 2023-12-26
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Hiroo, Yasumasa
  • Kinoshita, Masaki

Abstract

To remove or reduce the influence on the measurement accuracy due to a difference of the relative velocity between a substrate and a polishing table in an optical surface monitoring system. A substrate polishing apparatus includes a polishing table, a motor, a substrate holding head, a light source, an optical head, an optical detector, a shutter, and a control device. The motor is for rotating the polishing table. The substrate holding head is configured to hold a substrate. The optical head is disposed inside the polishing table. The optical head includes a light projection port and a light reception port. The light projection port is disposed to project light from the light source toward the substrate held by the substrate holding head. The light reception port is disposed to receive light reflected from the substrate held by the substrate holding head. The optical detector is for detecting the light received at the light reception port. The shutter is for controlling an exposure time during which the light is captured in the optical detector. The control device is for controlling the operation of the shutter so as to change the exposure time based on the polishing condition of the substrate.

IPC Classes  ?

  • B24B 37/013 - Devices or means for detecting lapping completion

17.

POLISHING DEVICE AND METHOD FOR ADJUSTING PRESSURE CONTROL UNIT

      
Application Number 18528713
Status Pending
Filing Date 2023-12-04
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor Kitagawa, Yoshitaka

Abstract

A polishing device is capable of reducing variations in responsiveness of multiple pressure regulators. The polishing device includes multiple buffer tanks T1 to T6. Each of the buffer tanks T1 to T6 includes a tank section 120 made of a rigid body and a volume adjustment device 122 which adjusts a volume of the buffer tank.

IPC Classes  ?

  • B24B 37/005 - Control means for lapping machines or devices
  • B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces

18.

LIGHT INTENSITY ADJUSTMENT METHOD FOR OPTICAL FILM THICKNESS MEASURING DEVICE AND POLISHING APPARATUS

      
Application Number 18541797
Status Pending
Filing Date 2023-12-15
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor Kinoshita, Masaki

Abstract

A light intensity adjustment method for an optical film thickness measuring device that can improve an operational efficiency of a light source and extend a life of the light source is disclosed. The light intensity adjustment method for an optical film thickness measuring device monitors a light intensity of the light source, and adjusts a voltage applied to the light source based on the monitored light intensity.

IPC Classes  ?

19.

MULTILAYER STRUCTURE PRODUCTION DEVICE AND METHOD FOR PRODUCING MULTILAYER STRUCTURE

      
Application Number JP2023041587
Publication Number 2024/135195
Status In Force
Filing Date 2023-11-20
Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Tajima, Kazuhiro
  • Satake, Masayuki

Abstract

The present invention relates to a technology for applying a filler to a gap between edges of a plurality of substrates constituting a multilayer substrate produced by bonding the substrates. This multilayer structure production device comprises: a substrate holder (2) which holds and rotates a multilayer substrate (Ws); an applicator (3) which has a filler ejection port (21a) for ejecting a filler (F) and applies the filler (F) to a gap (G) between an edge (E1) of a first substrate (W1) and an edge (E2) of a second substrate (W2); a relative-movement mechanism (30) for moving the applicator (3) and/or the substrate holder (2); a position detector (5) which detects position information on an application-target point (Tp) within the gap (G); and a movement control unit (10) which makes the relative-movement mechanism (30) regulate the relative positions of the filler ejection port (21a) and the application-target point (Tp) on the basis of the detected position information.

IPC Classes  ?

  • B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
  • B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
  • B05C 11/00 - Component parts, details or accessories not specifically provided for in groups
  • B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
  • B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
  • B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
  • B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials

20.

GAS GENERATION DEVICE

      
Application Number JP2023044762
Publication Number 2024/135507
Status In Force
Filing Date 2023-12-14
Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Ozawa Suguru
  • Araki Yuji
  • Nakagawa Yoichi
  • Kimura Risa

Abstract

A plurality of trench grooves (8) are formed in a first electrode (6) of a gas generation device (1). A discharge space (12) formed between a first electrode surface (7) and a second electrode surface (11) is connected to a gas introduction space (17) for introducing a material gas from a material gas supply port (4). The ratio P/D of the pitch P of the trench grooves (8) to the diameter D of the first electrode (7) is set at 0.0020-0.0150, and the ratio VT/VG of the volume VT of the trench space formed by the trench grooves (8) to the volume VG of the gas introduction space (17) is set at 0.016-0.203.

IPC Classes  ?

  • C01B 13/11 - Preparation of ozone by electric discharge

21.

PLATING APPARATUS

      
Application Number 17911044
Status Pending
Filing Date 2021-10-28
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Tomita, Masaki
  • Hiwatashi, Ryosuke

Abstract

An occurrence of a varied power feeding to a contact member is suppressed. An occurrence of a varied power feeding to a contact member is suppressed. A substrate holder includes: a frame-shaped supporting mechanism configured to be suspended and held by a plurality of support pillars and to support an outer peripheral portion of a surface to be plated of a substrate; a back plate assembly configured to be arranged on a back surface side of the surface to be plated of the substrate and to sandwich the substrate with the supporting mechanism; a contact member 468 arranged on the supporting mechanism; and a plurality of power source line members 461. The contact member 468 has a power feeding contact point in contact with the outer peripheral portion of the surface to be plated of the substrate and a plurality of power source connecting portions 469b connected to a power source. The plurality of power source line members 461 are connected from the power source to the plurality of power source connecting portions 469b through the plurality of support pillars, and are routed such that distances from the power source to the plurality of power source connecting portions 469b become equal.

IPC Classes  ?

  • C25D 17/06 - Suspending or supporting devices for articles to be coated

22.

PLATING APPARATUS AND SUBSTRATE CLEANING METHOD

      
Application Number 17802400
Status Pending
Filing Date 2021-11-04
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamamoto, Kentaro
  • Tomita, Masaki
  • Tsuji, Kazuhito

Abstract

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

IPC Classes  ?

  • C25D 17/06 - Suspending or supporting devices for articles to be coated
  • C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D 17/02 - Tanks; Installations therefor
  • C25D 21/08 - Rinsing

23.

POLISHING APPARATUS AND POLISHING METHOD

      
Application Number 18393077
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Kinoshita, Masaki
  • Yagi, Keita

Abstract

A polishing apparatus that polishes a substrate includes a polishing table for holding a polishing pad and a polishing head configured to press a surface of the substrate against the polishing pad. A plurality of first optical heads detect a signal concerning a film thickness of the substrate while moving across the substrate. One spectrometer receives and processes signals output by at least two first sensor heads among the plurality of first sensor heads. An optical switch selectively connects the sensor heads to the spectrometer. A processor controls the optical switch to switch, at timing when the plurality of sensor heads simultaneously face the substrate, the connection to the spectrometer from one sensor head to another sensor head.

IPC Classes  ?

  • B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
  • B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping

24.

SUBSTRATE POLISHING APPARATUS

      
Application Number 18393232
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor Isono, Shintaro

Abstract

To relatively easily allow monitoring of the operation of a switching device even when the switching device is employed in an optical surface monitoring system of a substrate polishing apparatus. A substrate polishing apparatus includes a polishing table, a substrate holding head, a light source, a first optical head, a switching device, a first optical line, a second optical line, a third optical line, a first optical filter, a spectroscope, and a control device. The substrate holding head is configured to hold a substrate. The first optical head is configured to project light from the light source toward the substrate held by the substrate holding head and receive light reflected from the substrate, the first optical head being disposed inside the polishing table. The switching device includes a plurality of channels. The first optical line optically connects the light source to the first optical head. The second optical line optically connects the first optical head to one channel of the plurality of channels of the switching device. The third optical line optically connects the middle of the first optical line to the middle of the second optical line. The first optical filter is disposed in the third optical line. The spectroscope is optically connected to a downstream side of the switching device. The control device is configured to receive measurement data of the intensity of a wavelength dispersed by the spectroscope. The control device is configured to monitor the operation of the switching device based on the measurement data.

IPC Classes  ?

  • B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

25.

SUBSTRATE ROTATION PROCESSING DEVICE AND SUBSTRATE POLISHING DEVICE

      
Application Number 18518570
Status Pending
Filing Date 2023-11-23
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor Miyamoto, Hiroki

Abstract

A substrate drying device as a substrate rotation processing device includes: a substrate holding mechanism, holding a substrate horizontally; a rotating cover, configured to surround the substrate and having a side wall part surrounding the substrate and a bottom surface part in an inner side of the side wall part; a rotation mechanism, rotating the substrate held by the substrate holding mechanism and the rotating cover; and a gas supply nozzle, supplying gas with respect to a back surface of the substrate held by the substrate holding mechanism through the bottom surface part of the rotating cover. Multiple discharge holes for discharging gas supplied from the gas supply nozzle are formed on the bottom surface part of the rotating cover. The discharge holes have inclined surfaces formed inclined with respect to a rotating surface of the rotating cover.

IPC Classes  ?

  • B24B 37/30 - Work carriers for single side lapping of plane surfaces

26.

METHOD FOR CALCULATING THROUGHPUT IN SEMICONDUCTOR MANUFACTURING APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND COMPUTER PROGRAM PRODUCT

      
Application Number 18525309
Status Pending
Filing Date 2023-11-30
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor Kagaya, Shunsuke

Abstract

An object is to obtain a throughput of a semiconductor manufacturing apparatus precisely. A method for calculating a throughput in a semiconductor manufacturing apparatus, which comprises plural units, is provided, and the method comprises steps for: obtaining a process parameter relating to processing of a substrate in the semiconductor manufacturing apparatus; obtaining, from a memory, maintenance information with respect to each unit in the plural units, wherein the maintenance information comprises timing of maintenance of each unit in the plural units and the length of time required for the maintenance, wherein the maintenance is that planned to be performed in a period that ends when processing of the substrate in the semiconductor manufacturing apparatus is completed; and calculating a throughput of the semiconductor manufacturing apparatus, based on the process parameter and the maintenance information.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control (DNC), flexible manufacturing systems (FMS), integrated manufacturing systems (IMS), computer integrated manufacturing (CIM)

27.

EDDY CURRENT SENSOR, POLISHING APPARATUS, AND FILM THICKNESS DETECTION METHOD

      
Application Number 18545448
Status Pending
Filing Date 2023-12-19
First Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Takahashi, Taro
  • Tokunaga, Shinpei

Abstract

The eddy current sensor includes a first detector that detects an eddy current generated in a semiconductor wafer WH and a second detector that detects the eddy current. The first detector includes a first exciting coil configured to generate the eddy current and a first detecting coil configured to detect the eddy current. The first exciting coil and the first detecting coil are air-core coils. The second detector includes second exciting coil configured to generate the eddy current and second detecting coil configured to detect the eddy current. The second exciting coil and the second detecting coil are coils with a magnetic core.

IPC Classes  ?

  • G01N 27/90 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
  • G01N 27/02 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
  • H01L 21/66 - Testing or measuring during manufacture or treatment

28.

PLATING DEVICE AND PLATING DEVICE OPERATION METHOD

      
Application Number JP2022046758
Publication Number 2024/134741
Status In Force
Filing Date 2022-12-20
Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Hiwatashi, Ryosuke
  • Tomita, Masaki
  • Masuda, Yasuyuki
  • Shimoyama, Masashi

Abstract

The present invention efficiently removes bubbles from the entirety of a resistor. The present invention comprises: a plating bath 410 that is configured to accommodate a plating solution; a substrate holder 440 that is configured to hold a substrate Wf such that a surface to be plated faces downward; an anode 430 that is disposed in the plating bath 410; a resistor 450 that is disposed between the substrate Wf and the anode 430; a mixing member 480 that is disposed between the substrate Wf and the resistor 450; and a driving mechanism 482 that is configured to cause the mixing member 480 to reciprocate along the surface of the substrate Wf to be plated, wherein the driving mechanism 482 is configured to perform, during a bubble removal process for removing bubbles that have adhered to the resistor 450, a first bubble removal operation in which the mixing member 480 is caused to reciprocate using a first position as a center, and a second bubble removal operation in which the mixing member 480 is caused to reciprocate using a second position that differs from the first position as a center.

IPC Classes  ?

  • C25D 21/10 - Agitating of electrolytes; Moving of racks

29.

POWDER SUPPLY DEVICE

      
Application Number JP2023027310
Publication Number 2024/134955
Status In Force
Filing Date 2023-07-26
Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Asai, Junki
  • Shinozaki, Hiroyuki

Abstract

Provided is a technique whereby the amount of a powder discharged from a discharge port of a powder supply device can be easily adjusted. A powder supply device 30 comprises: a storage member 31 having a storage chamber 38; a discharge member 33 having a discharge port that discharges a powder; an introduction member 32, the introduction member being disposed lower than the storage member and higher than the discharge member and configured so as to introduce powder in the storage chamber to the discharge port, and a plurality of introduction chambers 40, 41 having mutually different volumes being provided inside the introduction member so as to be layered in a vertical direction in the introduction member; an inlet shutter 34 that is configured so as to open and close an inlet opening 42 for introducing the powder in the storage chamber to the introduction member; an outlet shutter 35 that is configured so as to open and close an outlet opening 43 for introducing the powder in the introduction member to the discharge port; and an intermediate shutter 36 that is configured so as to open and close an intermediate opening 44 that communicates one introduction chamber with another introduction chamber which are adjacent to each other among the plurality of introduction chambers.

IPC Classes  ?

  • B65G 65/40 - Devices for emptying otherwise than from the top
  • B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
  • B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
  • B29C 64/255 - Enclosures for the building material, e.g. powder containers
  • B29C 64/329 - Feeding using hoppers
  • B29C 64/343 - Metering
  • B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
  • B22F 12/50 - Means for feeding of material, e.g. heads
  • B22F 12/52 - Hoppers
  • B22F 12/53 - Nozzles

30.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Application Number JP2023039425
Publication Number 2024/135111
Status In Force
Filing Date 2023-11-01
Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamamoto, Satoru
  • Uchiyama, Keisuke
  • Yamanobe, Hokuto

Abstract

The present invention relates to: a substrate processing apparatus which cleans a substrate after polishing; and a substrate processing method. According to the present invention, a substrate cleaning apparatus is provided with a cleaning device (131) which cleans a polished substrate. The cleaning device (131) is provided with a microbubble water module (90) that cleans the surface of a substrate (W), which is held by a substrate cleaning holding part (52), by spraying microbubble water onto the surface of the substrate (W). The microbubble water module (90) is provided with: a spray nozzle (91) for spraying microbubble water onto a target region (TR) which is a long region extending from the center (Cr) of the substrate (W) to the outermost circumferential part (Ci) of the substrate (W); and a microbubble water supply device (93) which supplies microbubble water to the spray nozzle (91).

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • B08B 3/02 - Cleaning by the force of jets or sprays
  • B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
  • B24B 55/06 - Dust extraction equipment on grinding or polishing machines
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

31.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Application Number JP2023040518
Publication Number 2024/135150
Status In Force
Filing Date 2023-11-10
Publication Date 2024-06-27
Owner EBARA CORPORATION (Japan)
Inventor
  • Ishikawa Sho
  • Yamanobe Hokuto

Abstract

[Problem] To provide an information processing device that enables appropriate prediction of the state of a driven roller in accordance with the operation state of a substrate processing device. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires operation state information including driving roller state information indicating the state of a driving roller as the operation state of a substrate processing device provided with a polishing tape conveyance part which conveys a polishing tape for polishing a peripheral part of a substrate along a conveyance path in which the driving roller and a driven roller are disposed, and with a polishing head part which is disposed midway of the conveyance path and which can press the polishing tape to the peripheral part, the substrate processing device being configured to perform a polishing process of the peripheral part; and a state prediction unit 501 that inputs the operation state information acquired by the information acquisition unit 500 to trained models 12A, 12B which have learned, through machine learning, the correlation between the operation state information and driven roller state information indicating the state of the driven roller when the substrate processing device performs the polishing process in the operation state indicated by the operation state information, to thereby predict driven roller state information with respect to the operation state information.

IPC Classes  ?

  • B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
  • B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

32.

PLATING DEVICE AND PLATING METHOD

      
Application Number JP2022046409
Publication Number 2024/127636
Status In Force
Filing Date 2022-12-16
Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor
  • Shimoyama, Masashi
  • Masuda, Yasuyuki
  • Hiwatashi, Ryosuke
  • Yasuda, Shingo
  • Hayase, Masanori

Abstract

The present invention forms a plurality of bumps at a uniform height on a substrate. The present invention provides a plating device for forming bumps on a substrate. This plating device comprises: a substrate holder that is configured so as to hold the substrate; a plating tank that is configured so as to accommodate the substrate holder along with a plating fluid; an anode that is positioned within the plating tank so as to face the substrate which is held by the substrate holder; a power source that is configured so as to supply a current between the substrate and the anode; and a control unit, wherein the control unit is configured so as to cause a current to be outputted from the power source, said current having a first period, during which a positive direction current for depositing a metal onto the substrate from the plating fluid is supplied, a second period, during which at least one reverse current pulse flowing in the opposite direction from the positive direction current is supplied, and a third period, during which the supply of current is stopped in the midst of transitioning from the reverse current pulse to the positive direction current.

IPC Classes  ?

  • C25D 5/18 - Electroplating using modulated, pulsed or reversing current
  • C25D 7/12 - Semiconductors
  • C25D 21/10 - Agitating of electrolytes; Moving of racks

33.

JOINT DEVICE FOR RECIPROCATING PUMP

      
Application Number JP2022046431
Publication Number 2024/127640
Status In Force
Filing Date 2022-12-16
Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor
  • Kim, Hoechun
  • Kawasaki, Hiroyuki
  • Kasatani, Tetsuji
  • Honda, Shuichiro

Abstract

The present invention relates to a joint device used for driving a reciprocating pump such as a plunger pump or a piston pump. A joint device (1) for coupling a drive source and a reciprocating pump comprises a first thrust member (3) having a first recessed surface (3a), a second thrust member (5) having a second recessed surface (5a), a spherical body (7) sandwiched between the first recessed surface (3a) and the second recessed surface (5a), and a housing (11) having an internal space (10) for accommodating the first thrust member (3), the second thrust member (5), and the spherical body (6). The first thrust member (3) and the second thrust member (5) are disposed along a center axis line CL of the housing (11) and the width of the internal space (10) is longer than the widths of the first thrust member (3), the second thrust member (5), and the spherical body (7).

IPC Classes  ?

  • F16C 11/06 - Ball-joints; Other joints having more than one degree of angular freedom, i.e. universal joints
  • F16D 3/16 - Universal joints in which flexibility is produced by means of pivots or sliding or rolling connecting parts

34.

LIQUEFIED GAS TRANSPORTATION SYSTEM

      
Application Number JP2022046440
Publication Number 2024/127643
Status In Force
Filing Date 2022-12-16
Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor
  • Kim, Hoechun
  • Miyata, Hiromasa
  • Kawasaki, Hiroyuki
  • Kasatani, Tetsuji
  • Honda, Shuichiro

Abstract

This liquefied gas transportation system is provided with a reciprocating pump device (3) for pressurizing boil-off gas and a liquefied gas in a storage tank (1). The reciprocating pump device (3) is provided with a cylinder (14) having therein a gas pressurization chamber (10) and a liquid pressurization chamber (11), a piston (17) disposed in the cylinder (14), and an actuator (18) that is connected to the piston (17) and is for reciprocating the piston (17). The piston (17) is positioned between the gas pressurization chamber (10) and the liquid pressurization chamber (11). The piston (17) has a gas pressurization surface (21) facing the gas pressurization chamber (10) and a liquid pressurization surface (22) facing the liquid pressurization chamber (11).

IPC Classes  ?

  • F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
  • F17C 9/00 - Methods or apparatus for discharging liquefied or solidified gases from vessels not under pressure

35.

METHOD OF CREATING RESPONSIVE PROFILE OF POLISHING RATE OF WORKPIECE, POLISHING METHOD, AND POLISHING APPARATUS

      
Application Number 18519827
Status Pending
Filing Date 2023-11-27
First Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamaki, Satoru
  • Yagi, Keita
  • Nakamura, Akira
  • Shirakawa, Kodai

Abstract

A method capable of accurately obtaining polishing-rate responsiveness to a change in pressure for pressing a workpiece, such as a wafer, against a polishing pad is disclosed. The method includes: creating an estimated polishing-rate responsiveness profile using simulation, the estimated polishing-rate responsiveness profile indicating a distribution of polishing-rate responsiveness to pressure change in the first pressure chamber; creating an actual polishing-rate responsiveness profile using polishing results of a workpiece, the actual polishing-rate responsiveness profile indicating a distribution of polishing-rate responsiveness to pressure change in the second pressure chamber, and creating a hybrid polishing-rate responsiveness profile by combining the estimated polishing-rate responsiveness profile and the actual polishing-rate responsiveness profile.

IPC Classes  ?

  • B24B 49/05 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
  • B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

36.

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR CONTROLLING OPERATION OF SEMICONDUCTOR MANUFACTURING APPARATUS

      
Application Number 18527118
Status Pending
Filing Date 2023-12-01
First Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor Ideguchi, Kazuma

Abstract

When a failure has occurred in a semiconductor manufacturing apparatus, lowering of throughput thereof is suppressed. A method for controlling operation of a semiconductor manufacturing apparatus, which comprises one or plural processing modules and each processing module comprises plural submodules, comprises steps for: judging whether a failure has occurred in at least one of the plural submodules; judging whether at least one submodule which is not in a failed state exists in a processing module to which the failed submodule belongs; obtaining throughput in a state that the one or plural processing modules are controlled to perform operation while the failed submodule is controlled to stop its operation; judging whether the throughput is larger than a predetermined threshold; and continuing operation of the one or plural processing modules while controlling the failed submodule to stop its operation, in the case that the throughput is larger than the predetermined threshold.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/66 - Testing or measuring during manufacture or treatment

37.

PLATING DEVICE

      
Application Number JP2022046435
Publication Number 2024/127641
Status In Force
Filing Date 2022-12-16
Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor
  • Hiwatashi, Ryosuke
  • Ishii, Tsubasa
  • Masuda, Yasuyuki
  • Shimoyama, Masashi

Abstract

Provided is a plating device with which it is possible to detect, during a plating process, the film thickness of a plating film formed on a substrate. This plating device is provided with: a plating bath; a substrate holder for holding a substrate; an anode disposed in the plating bath so as to face the substrate held by the substrate holder; a resistor that is disposed between the substrate and the anode and that is for adjusting electrical field; a first sensing electrode disposed in a region between the anode and the surface of the substrate subject to plating, the tip of the first sensing electrode being disposed at a first position in the resistor; a second sensing electrode disposed at a second position, at which there is less potential change than at the first position, in the plating bath; and a control module for measuring the potential difference between the first sensing electrode and the second sensing electrode and estimating the plating thickness of the substrate on the basis of the potential difference.

IPC Classes  ?

38.

POLISHING DEVICE

      
Application Number JP2023041207
Publication Number 2024/127900
Status In Force
Filing Date 2023-11-16
Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor Matsugu, Asagi

Abstract

Provided is a technology with which an increase in size of a polishing table can be suppressed, and with which a polishing pad can be dressed while preventing a dresser from contacting a top ring during polishing of a substrate. A polishing device 1 comprises a top ring 30 and at least one dressing mechanism 40. In plan view, the value of 1/2 of a maximum outer dimension of a polishing table 20 is smaller than a maximum outer dimension of the top ring. The top ring has, above a substrate retaining member 31, an expanded area 34 that is expanded farther outward than the substrate retaining member in a plan view. The at least one dressing mechanism comprises: a dresser 41; and a raising/lowering device 43 that is fixed to the expanded area of the top ring, and that is configured to raise/lower the dresser so as to switch between a state in which the dresser is in contact with a polishing pad Pd and a state in which the dresser is not in contact with the polishing pad. The raising/lowering device brings the dresser into contact with the polishing pad during polishing of a substrate Wf.

IPC Classes  ?

  • B24B 37/30 - Work carriers for single side lapping of plane surfaces
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
  • B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

39.

TRANSFER MACHINE AND SUBSTRATE PROCESSING DEVICE

      
Application Number JP2023044560
Publication Number 2024/128241
Status In Force
Filing Date 2023-12-13
Publication Date 2024-06-20
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamanobe Hokuto
  • Ishikawa Sho
  • Hong Kuo-Wei
  • Yazawa Akihiro

Abstract

A transfer machine 80 comprises: an arm 810; a holding unit 830 provided on the arm 810 to hold a substrate W; a turning unit 100 that turns the arm 810 about a turning axis A; and a control unit 50 that adjusts the position in an in-plane direction of the substrate W by turning the arm 810 by means of the turning unit 100 on the basis of the position, measured by a measuring unit 110, in the in-plane direction of the substrate W being held by the holding unit 830.

IPC Classes  ?

  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
  • B25J 15/08 - Gripping heads having finger members
  • H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment

40.

FLEX-OP

      
Serial Number 98601676
Status Pending
Filing Date 2024-06-14
Owner Elliott Company ()
NICE Classes  ?
  • 07 - Machines and machine tools
  • 37 - Construction and mining; installation and repair services

Goods & Services

Centrifugal compressors; centrifugal compressor connection adaptors for connecting centrifugal compressors to one another Centrifugal compressor construction services

41.

CLEANING APPARATUS AND POLISHING APPARATUS

      
Application Number 18444981
Status Pending
Filing Date 2024-02-19
First Publication Date 2024-06-13
Owner EBARA CORPORATION (Japan)
Inventor
  • Miyazaki, Mitsuru
  • Fujimoto, Tomoaki
  • Fukaya, Koichi
  • Oikawa, Fumitoshi
  • Inoue, Takuya

Abstract

A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 1/32 - using rotary cleaning members
  • B08B 3/02 - Cleaning by the force of jets or sprays
  • B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

42.

PLATING DEVICE

      
Application Number JP2022045415
Publication Number 2024/122043
Status In Force
Filing Date 2022-12-09
Publication Date 2024-06-13
Owner EBARA CORPORATION (Japan)
Inventor Seki, Masaya

Abstract

The present invention suppresses sagging of a central section of a paddle in a cup-type plating device. The present invention includes: a plating bath 410 for accommodating a plating liquid; an anode disposed within the plating bath 410; a substrate holder configured so as to retain a substrate Wf in a state in which a surface to be plated Wf-a is facing downward; a paddle 460 disposed between the anode and the substrate Wf; a drive mechanism 462 configured so as to support a base section 460A of the paddle 460 and cause the paddle 460 to move reciprocally along the surface to be plated Wf-a of the substrate Wf; a first magnet 464 provided on the paddle 460; and a second magnet 468 provided so as to face the first magnet 464. The first magnet 464 and the second magnet 468 are configured so as to mutually exert magnetic force so that a central section 460C of the paddle 460 between the base section 460A and a tip section 460B approaches the surface to be plated Wf-a of the substrate Wf.

IPC Classes  ?

  • C25D 21/10 - Agitating of electrolytes; Moving of racks
  • C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D 7/12 - Semiconductors
  • H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition

43.

SUBSTRATE PROCESSING DEVICE

      
Application Number JP2023041941
Publication Number 2024/122339
Status In Force
Filing Date 2023-11-22
Publication Date 2024-06-13
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamanobe Hokuto
  • Kobayashi Kenichi
  • Yazawa Akihiro
  • Ishikawa Sho

Abstract

This substrate processing device comprises a plurality of polishing modules for polishing a substrate, and a transport unit for moving the substrate between the plurality of polishing modules. The plurality of polishing modules include a first module group and a second module group. In plan view, the transport unit is positioned between the first module group and the second module group. The first module group has a first upper-side lane and a first lower-side lane in which at least two polishing modules are arranged adjacent to one another. The second module group has a second upper-side lane and a second lower-side lane in which at least two polishing modules are arranged adjacent to one another.

IPC Classes  ?

  • B24B 41/06 - Work supports, e.g. adjustable steadies
  • B24B 7/00 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
  • B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
  • B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

44.

METHOD OF DETECTING LEAKAGE

      
Application Number 18494563
Status Pending
Filing Date 2023-10-25
First Publication Date 2024-06-13
Owner EBARA CORPORATION (Japan)
Inventor
  • Nagasawa, Yosuke
  • Sato, Tensei
  • Koizumi, Ryuya

Abstract

There is provided a method of detecting a leakage of a substrate holder in an apparatus for plating. The method of detecting the leakage comprises: placing the substrate holder that holds a substrate, into a tank that is filled with a liquid; supplying a gas into an internal space of the substrate holder that seals an outer circumferential portion of the substrate; and taking an image of the liquid surrounding the substrate holder in a state that the internal space of the substrate holder is pressurized by the gas and analyzing one or a plurality of taken images to determine presence or absence of gas bubbles in the liquid and thereby detect a leakage of the substrate holder.

IPC Classes  ?

  • G01M 3/06 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point by observing bubbles in a liquid pool

45.

POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD

      
Application Number 18553127
Status Pending
Filing Date 2022-02-17
First Publication Date 2024-06-13
Owner EBARA CORPORATION (Japan)
Inventor Namiki, Keisuke

Abstract

The present invention relates to a polishing pad and a polishing apparatus for use in polishing of a substrate, such as a wafer. Further, the present invention relates to a method of polishing a substrate, such as a wafer. At least a part of the polishing pad (30) is made of a light transmissive material (34) and a light reactive material (35). The light reactive material (35) is mixed into the light transmissive material (34).

IPC Classes  ?

  • B24B 37/013 - Devices or means for detecting lapping completion
  • B24B 37/20 - Lapping pads for working plane surfaces

46.

TRANSPORT DEVICE AND SUBSTRATE PROCESSING DEVICE

      
Application Number JP2022045030
Publication Number 2024/121960
Status In Force
Filing Date 2022-12-07
Publication Date 2024-06-13
Owner EBARA CORPORATION (Japan)
Inventor
  • Seki, Masaya
  • Yamada, Nobuya
  • Tomita, Masaki

Abstract

The present invention increases a transport speed of a substrate and suppress attachment of particles to a processed surface of the substrate. This transport device configured to transport the substrate in an elevation direction and a travel direction orthogonal to the elevation direction comprises a mounting member 710-1 that is fixed to a side surface of a first module frame 402A for installing a plating module having substrate loading/unloading ports 404-1 to 404-8. The mounting member 710-1 includes plurality of travel rails 714-1 to 714-3 disposed on both sides of the substrate loading/unloading ports 404-1 to 404-8 in the elevation direction and extending in the travel direction. The transport device includes an elevation rail 716 extending in the elevation direction crossing over the plurality of travel rails 714-1 to 714-3 and being movable along the plurality of travel rails 714-1 to 714-3 and a transport robot 718 capable of being elevated along the elevation rail 716 and having a hand for holding the substrate.

IPC Classes  ?

  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

47.

PLATING APPARATUS AND RINSE PROCESS METHOD

      
Application Number 17781356
Status Pending
Filing Date 2021-09-10
First Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor Tsuji, Kazuhito

Abstract

Provided is a technique that allows suppressing an entrance of a large amount of a rinse solution into a plating solution in a plating tank. Provided is a technique that allows suppressing an entrance of a large amount of a rinse solution into a plating solution in a plating tank. A plating apparatus 1000 includes a rinse module 40 configured to perform a rinse process. The rinse module includes: a rinse nozzle 41 configured to discharge the rinse solution to a member to be rinsed 25 while the rinse process is performed; a blow nozzle 42 disposed below the rinse nozzle and blowing out a gas such that the gas crosses a space between the plating tank and a substrate holder 20 while the rinse process is performed; and a collection member 50 disposed at downstream of the gas blown out from the blow nozzle and collecting the rinse solution dropping from the member to be rinsed and entrained in a flow of the gas blown out from the blow nozzle.

IPC Classes  ?

48.

METHOD OF ADJUSTING PLATING MODULE

      
Application Number 17781363
Status Pending
Filing Date 2021-03-05
First Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor
  • Masuda, Yasuyuki
  • Hiwatashi, Ryosuke
  • Shimoyama, Masashi

Abstract

There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

IPC Classes  ?

  • C25D 21/12 - Process control or regulation
  • C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D 17/08 - Racks
  • C25D 21/10 - Agitating of electrolytes; Moving of racks

49.

SAFETY ASSISTANCE DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, SAFETY ASSISTANCE METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Application Number JP2023037506
Publication Number 2024/116625
Status In Force
Filing Date 2023-10-17
Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor Murata Seiji

Abstract

[Problem] To provide a safety assistance device that can improve operation efficiency of an operator while appropriately securing safety of the operator. [Solution] A safety assistance device 5 assists safety of an operator U who performs, with at least one portion of the body positioned within a prescribed movable range, a prescribed operation to a processing device that performs prescribed processing by moving a movable unit having the movable range. The safety assistance device 5 comprises: an image data acquisition unit 500 that acquires image data 110 captured by an image capturing unit 63 disposed so as to face the front of the operator U when the operator U wears an operator device 6; and an interlock information generation unit 501 that generates interlock information indicating an interlock state of the movable unit on the basis of the image data 110 acquired by the image data acquisition unit 500.

IPC Classes  ?

  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

50.

POLISHING INFORMATION PROCESSING DEVICE, PREDICTION DEVICE, AND MACHINE LEARNING DEVICE

      
Application Number JP2023039383
Publication Number 2024/116700
Status In Force
Filing Date 2023-11-01
Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor Midorikawa, Shugo

Abstract

The present invention relates to a polishing information processing device provided to a polishing device that polishes a peripheral edge section of a substrate. A polishing information processing device (112) comprises: an information acquisition unit (241) that acquires a polishing condition, and a profile before and after polishing of a peripheral edge section of a wafer (W); a state prediction unit (240b) that inputs, into a trained model, information including the newly acquired polishing condition and the profile of the peripheral edge section of a substrate before polishing, and predicts the profile of the peripheral edge section of the substrate after polishing; and a correction unit (242) that corrects the polishing condition on the basis of a target profile of the peripheral edge section of the wafer (W) and the profile of the peripheral edge section of the wafer (W) after polishing, as predicted by the state prediction unit (240b).

IPC Classes  ?

  • B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
  • B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
  • B24B 49/02 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

51.

PLATING APPARATUS

      
Application Number 17797030
Status Pending
Filing Date 2021-09-28
First Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor
  • Nakahama, Shigeyuki
  • Nagai, Mizuki

Abstract

Provided is a technique that allows ensuring an in-plane uniformity of film thickness of a substrate. Provided is a technique that allows ensuring an in-plane uniformity of film thickness of a substrate. A plating apparatus 1 includes auxiliary anodes 60a, 606, 60c, 60d. End portion proximal regions in an extending direction of the auxiliary anode are covered by resistive elements 65 having electrical conduction rates larger than zero, and the electrical conduction rates are lower than an electrical conduction rate of a plating solution. A region closer to a center than the end portion proximal regions of the auxiliary anode is not covered by the resistive element, and a surface of the region closer to the center than the end portion proximal regions of the auxiliary anode is exposed.

IPC Classes  ?

52.

PLATING APPARATUS

      
Application Number 17781365
Status Pending
Filing Date 2021-11-09
First Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor Tomita, Masaki

Abstract

Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. A plating apparatus includes a plating tank configured to house a plating solution, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, and an elevating mechanism configured to move up and down the substrate holder. The substrate holder includes a supporting mechanism 460 configured to support an outer peripheral portion of the surface to be plated Wf-a of the substrate Wf, a back plate assembly 470 arranged on a back surface side of the surface to be plated Wf-a of the substrate Wf and configured to sandwich the substrate Wf with the supporting mechanism 460, and a removing mechanism 471 configured to provide a force that removes the substrate Wf from the back plate assembly 470 to a back surface of the surface to be plated Wf-a of the substrate Wf.

IPC Classes  ?

  • C25D 17/06 - Suspending or supporting devices for articles to be coated
  • C25D 21/10 - Agitating of electrolytes; Moving of racks

53.

POLISHING METHOD, AND POLISHING APPARATUS

      
Application Number 18554643
Status Pending
Filing Date 2022-01-17
First Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor
  • Kabasawa, Masashi
  • Sasaki, Toshimitsu
  • Shiokawa, Yoichi
  • Yagi, Keita
  • Watanabe, Yuki
  • Chauhan, Nachiketa

Abstract

The present application relates to a polishing method and a polishing apparatus for polishing a substrate, such as a wafer, while pressing the substrate against a polishing surface of a polishing pad, and more particularly to a polishing method and a polishing apparatus for polishing a substrate while regulating a polishing load based on measurement values of a film-thickness measuring device. The polishing method includes: controlling a temperature of a polishing surface of a polishing pad to a predetermined temperature by use of a pad-temperature regulating apparatus; and polishing a substrate while controlling a polishing load for pressing the substrate against the polishing surface based on measurement values from a film-thickness measuring device provided in the polishing pad.

IPC Classes  ?

  • B24B 37/015 - Temperature control
  • B24B 37/013 - Devices or means for detecting lapping completion
  • B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
  • B24B 49/14 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

54.

SUBSTRATE PROCESSING METHOD, PROCESSING HEAD, AND SUBSTRATE PROCESSING DEVICE

      
Application Number JP2023039854
Publication Number 2024/116731
Status In Force
Filing Date 2023-11-06
Publication Date 2024-06-06
Owner EBARA CORPORATION (Japan)
Inventor
  • Kashiwagi, Makoto
  • Fujisawa, Mao

Abstract

The present invention relates to a substrate processing method for processing a substrate. The substrate processing method includes processing a processed surface (5a) of a substrate (W) by rotating the substrate (W) about an axis thereof, pressing a processing tape (2A) against the processed surface (5a) of the substrate (W) by means of a pressing member (12) of a processing head (10A) while feeding the processing tape (2A) in a longitudinal direction thereof, in a state in which the pressing member (12) is inclined in a first direction (D1) relative to a prescribed pressing direction (CL), and then pressing the processing tape (2A) against the processed surface (5a) by means of the pressing member (12) in a state in which the pressing member (12) is inclined relative to the pressing direction (CL) in a second direction (D2) opposite to the first direction (D1), the first direction (D1) and the second direction (D2) being directions in the longitudinal direction of the processing tape (2A) on the pressing member (12).

IPC Classes  ?

  • B24B 21/06 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
  • B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
  • B24B 21/08 - Pressure shoes; Backing belts
  • B24B 41/06 - Work supports, e.g. adjustable steadies
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

55.

PLATING APPARATUS

      
Application Number 17792079
Status Pending
Filing Date 2021-10-28
First Publication Date 2024-05-30
Owner EBARA CORPORATION (Japan)
Inventor
  • Tomita, Masaki
  • Masuda, Yasuyuki

Abstract

Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane. Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane. A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, and a membrane module 40. The membrane module includes a first membrane 41 and a second membrane 42. The second membrane has an inflow port 42c for causing a plating solution in a first region R1 below the second membrane to flow into a second region R2 above the second membrane and below the first membrane, and an inclined portion 42b inclining relative to a horizontal direction and inclining so as to be positioned upward as heading from a center side of an anode chamber to an outer edge side of the anode chamber.

IPC Classes  ?

  • C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D 17/06 - Suspending or supporting devices for articles to be coated
  • C25D 21/04 - Removal of gases or vapours
  • C25D 21/12 - Process control or regulation

56.

MOTOR PUMP, PUMP UNIT, AND METHOD OF BALANCING IMPELLER OF MOTOR PUMP

      
Application Number 18282747
Status Pending
Filing Date 2022-01-05
First Publication Date 2024-05-23
Owner EBARA CORPORATION (Japan)
Inventor
  • Konishi, Yasutaka
  • Kawasaki, Hiroyuki

Abstract

The present invention relates to a motor pump, a pump unit, and a method of balancing an impeller of the motor pump. The motor pump includes an impeller (1), a rotor (2), a stator (3), and a bearing (5). The rotor (2) and the bearing (5) are arranged in a suction side region (Ra) of the impeller (1).

IPC Classes  ?

  • F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
  • F04D 1/08 - Multi-stage pumps the stages being situated concentrically
  • F04D 29/041 - Axial thrust balancing
  • F04D 29/046 - Bearings
  • F04D 29/60 - Mounting; Assembling; Disassembling

57.

SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, APPARATUS FOR CLEANING CLEANING MEMBER, AND METHOD FOR CLEANING CLEANING MEMBER

      
Application Number 18514511
Status Pending
Filing Date 2023-11-20
First Publication Date 2024-05-23
Owner EBARA CORPORATION (Japan)
Inventor
  • Himori, Yosuke
  • Fukaya, Koichi

Abstract

According to one embodiment, provided is a substrate cleaning apparatus including: a cleaning member configured to clean a substrate; a plate having a horizontal plane provided with a hole; and a pressing mechanism configured to press the cleaning member vertically downward against the plate, wherein the hole penetrates the plate, and a liquid discharged from the cleaning member is discharged below via the hole, whereby absorption of the liquid discharged from the cleaning member into the cleaning member is suppressed.

IPC Classes  ?

  • B08B 1/40 - Cleaning tools with integrated means for dispensing fluids, e.g. water, steam or detergents (cleaning by the force of jets or sprays B08B 3/02)
  • B08B 1/36 - rotating about an axis orthogonal to the surface

58.

SUBSTRATE PROCESSING DEVICE

      
Application Number JP2023039880
Publication Number 2024/106248
Status In Force
Filing Date 2023-11-06
Publication Date 2024-05-23
Owner EBARA CORPORATION (Japan)
Inventor
  • Miyazaki, Mitsuru
  • Sotozaki, Hiroshi
  • Takebuchi, Kenichi
  • Inoue, Takuya
  • Takahashi, Shozo
  • Ishii, Ryohei

Abstract

A substrate processing device comprises: a plurality of polishing modules (1A-1D) that are disposed in a polishing level and that polish a substrate; a post-processing lane (2A, 2B) that is disposed in a post-processing level and that performs post-processing, which includes washing and drying, on the polished substrate; and a lifting/lowering conveyance device (5) that extracts the polished substrate from one of the plurality of polishing modules (1A-1D) and conveys the substrate directly to the post-processing lane (2A, 2B). The post-processing level is an upper level positioned above the polishing level or a lower level positioned below the polishing level. The lifting/lowering conveyance device (5) is disposed equidistantly from the plurality of polishing modules (1A-1D). The lifting/lowering conveyance device (5) has a holding hand (40) that enables lifting/lowering between the polishing level and the post-processing level.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
  • B24B 41/06 - Work supports, e.g. adjustable steadies
  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

59.

POLISHING DEVICE

      
Application Number JP2023039986
Publication Number 2024/106263
Status In Force
Filing Date 2023-11-07
Publication Date 2024-05-23
Owner EBARA CORPORATION (Japan)
Inventor
  • Kodera, Kenji
  • Hong, Kuo-Wei
  • Ohashi, Hirotaka
  • Yamanobe, Hokuto
  • Ishikawa, Sho

Abstract

The present invention pertains to a polishing device. This polishing device comprises a sensor structure (100) for detecting a polishing amount of a peripheral edge section of a substrate (W). The sensor structure (100) comprises: a sensor head (102) having a contact surface (102a); and a displacement sensor (101) for detecting the polishing amount of the peripheral edge section of the substrate (W) by means of the displacement of the sensor head (102).

IPC Classes  ?

  • B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
  • B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

60.

WORKPIECE PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD

      
Application Number 18547889
Status Pending
Filing Date 2022-02-09
First Publication Date 2024-05-23
Owner EBARA CORPORATION (Japan)
Inventor
  • Kashiwagi, Makoto
  • Izawa, Mao

Abstract

The present invention relates to a workpiece processing apparatus and a workpiece processing method for processing a workpiece, such as a wafer, a substrate, or a panel. The workpiece processing apparatus (1) includes: a workpiece supporting device (10) configured to support the workpiece (W); and a processing head (20) configured to process the surface of the workpiece (W). The workpiece supporting device (10) has a fluid supply line (15) for passing fluid therethrough, and a Bernoulli chuck (12) coupled to the fluid supply line (15), the Bernoulli chuck (12) is configured to attract the surface of the workpiece (W) by emitting the fluid, and at least part of the Bernoulli chuck (12) is made of a conductive material and is grounded.

IPC Classes  ?

  • B23Q 3/06 - Work-clamping means
  • B23Q 3/08 - Work-clamping means other than mechanically-actuated

61.

POLISHING APPARATUS

      
Application Number 18358811
Status Pending
Filing Date 2023-07-25
First Publication Date 2024-05-16
Owner EBARA CORPORATION (Japan)
Inventor Yun, Seungho

Abstract

A polishing apparatus capable of measuring a surface temperature of a substrate while suppressing shielding by a polishing liquid is disclosed. The polishing apparatus includes a microwave detection sensor configured to generate microwave detection data by detecting microwaves, and a controller configured to determine the surface temperature of the substrate based on the microwave detection data.

IPC Classes  ?

  • B24B 37/015 - Temperature control
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

62.

CULTIVATION MANAGEMENT DEVICE AND CULTIVATION MANAGEMENT SYSTEM

      
Application Number JP2023032080
Publication Number 2024/100972
Status In Force
Filing Date 2023-09-01
Publication Date 2024-05-16
Owner EBARA CORPORATION (Japan)
Inventor
  • Tanaka Hideaki
  • Kato Masashi
  • Deguchi Tatsuya
  • Koyama Hirohisa

Abstract

A cultivation management device 10 according to one aspect of the present invention manages the cultivation of aquatic organisms in a fish tank. This cultivation management device 10 comprises: a body length measurement unit for measuring the body length of an aquatic organism; and an activity estimation unit which estimates the activity of the aquatic organism on the basis of the measured body length.

IPC Classes  ?

  • A01K 61/10 - Culture of aquatic animals of fish
  • A01K 61/95 - Sorting, grading, counting or marking live aquatic animals, e.g. sex determination specially adapted for fish
  • A01K 63/04 - Arrangements for treating water specially adapted to receptacles for live fish

63.

SUBSTRATE-CLEANING DEVICE AND SUBSTRATE-CLEANING METHOD

      
Application Number JP2023037874
Publication Number 2024/101107
Status In Force
Filing Date 2023-10-19
Publication Date 2024-05-16
Owner EBARA CORPORATION (Japan)
Inventor Kashiwagi, Makoto

Abstract

The present invention relates to a substrate-cleaning device and a substrate-cleaning method, in which a cleaning tool is brought into contact with the front or back surface of a substrate, e.g., a wafer, to clean the front or back surface of the substrate. This substrate-cleaning device comprises: a substrate-holding part (41) which holds and rotates a peripheral edge portion of a substrate (W); and at least one substrate-cleaning tool (42) which comes into contact with the front or back surface of the substrate (W) held by the substrate-holding part (41) and cleans the front or back surface of the substrate (W). The substrate-cleaning tool (42) comprises a Bernoulli chuck (55), which ejects a fluid to generate suction power for suction-holding the front or back surface of the substrate (W), and a cleaning member (56) attached to the Bernoulli chuck (55). The cleaning member (56) is pressed against the front or back surface of the substrate (W) in accordance with the suction power of the Bernoulli chuck (55).

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

64.

POLISHING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM

      
Application Number JP2023039209
Publication Number 2024/095997
Status In Force
Filing Date 2023-10-31
Publication Date 2024-05-10
Owner EBARA CORPORATION (Japan)
Inventor
  • Suzuki Yuta
  • Takahashi Taro
  • Otaki Hirofumi

Abstract

This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the polishing device by inputting state-reflective information reflecting the state of the polishing pad of the polishing device, into a machine learning model that has learned, by machine learning, a correlation between state-reflective information reflecting the state of another polishing pad and the polishing index of the other polishing pad.

IPC Classes  ?

  • B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
  • B24B 37/015 - Temperature control
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • B24B 53/12 - Dressing tools; Holders therefor
  • G05B 23/02 - Electric testing or monitoring
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

65.

SEMICONDUCTOR MANUFACTURING APPARATUS

      
Application Number 18280137
Status Pending
Filing Date 2022-03-03
First Publication Date 2024-05-02
Owner EBARA CORPORATION (Japan)
Inventor
  • Nagasawa, Yosuke
  • Sato, Tensei
  • Wakabayashi, Hideki

Abstract

The present invention correctly identifies the size and shape of a substrate in order to avoid damage to a substrate holder and wasteful disposal of a substrate. Provided is a semiconductor manufacturing device for processing a rectangular substrate. This semiconductor manufacturing device: comprises a first sensor pair, which is used to measure a first length of the rectangular substrate along a first line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the first line and a sensor configured to detect the position of the other end of the rectangular substrate on the first line, and a second sensor pair, which is used to measure a second length of the rectangular substrate along a second line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the second line and a sensor configured to detect the position of the other end of the rectangular substrate on the second line; and identifies the size or shape of the rectangular substrate on the basis of the first length and the second length.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

66.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Application Number JP2023036223
Publication Number 2024/090159
Status In Force
Filing Date 2023-10-04
Publication Date 2024-05-02
Owner EBARA CORPORATION (Japan)
Inventor
  • Uchida Takuma
  • Iwamoto Hideyuki

Abstract

A data processing system according to the present invention comprises: a physical quantity measurement device that measures a physical quantity for each predetermined monitoring cycle; a data collection device that has a collection communication unit which is connected to the physical quantity measurement device and a collection control unit which causes the collection communication unit to provide an external notification of the physical quantity acquired via the collection communication unit; and a data management device that has a management communication unit which is connected to the data collection device, a management control unit which determines that an anomaly has occurred when the physical quantity acquired from the data collection device via the management communication unit has exceeded a predetermined threshold, and a management storage unit which, for each monitoring cycle, stores determination data indicative of the occurrence of the anomaly, wherein when the management storage unit has acquired determination data indicative of the occurrence of an anomaly a predetermined number of times or more consecutively, the management control unit yields a determination result and causes the management communication unit to notify a terminal device of the determination result.

IPC Classes  ?

67.

SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD

      
Application Number JP2023038215
Publication Number 2024/090384
Status In Force
Filing Date 2023-10-23
Publication Date 2024-05-02
Owner EBARA CORPORATION (Japan)
Inventor Satori, Hirotaka

Abstract

Provided is a technology by which a chemical can be effectively fixed to the surface of a substrate. A substrate treatment device 1 comprises: an activating device 40 configured so that, in a state where a liquid is supplied to a surface of a substrate Wf and a glass plate 100 is disposed on the surface of the substrate, the activating device activates the surface of a substrate by projecting light onto the surface of the substrate from the side of the glass plate opposite the substrate; a liquid chemical supply device 50 that supplies a liquid chemical to the surface of the substrate in a state where the glass plate is removed from the surface of the substrate; and a chemical fixing device that fixes the chemical to the surface of the substrate by drying and heating the liquid chemical on the surface of the substrate. A flow path 110 through which liquid can flow is provided to an opposing surface of the glass plate, said surface facing the surface of the substrate.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • G03F 7/30 - Imagewise removal using liquid means

68.

SUBSTRATE PROCESSING APPARATUS

      
Application Number 18461520
Status Pending
Filing Date 2023-09-06
First Publication Date 2024-05-02
Owner EBARA CORPORATION (Japan)
Inventor Miyamoto, Matsutaro

Abstract

The substrate processing apparatus according to the disclosure is a substrate processing apparatus for processing a substrate. The substrate processing apparatus includes a swing module, which includes a base portion, an arm which is supported by the base portion and is rotatable about the base portion, and a cover which covers an upper surface of the arm. The cover has an elongated shape in plan view and has a protrusion formed on an outer peripheral portion of an upper surface of the cover to protrude upward. The protrusion is provided to be continuous to a distal end which is an end on the side farther from the base portion of the upper surface of the cover in a longitudinal direction and both ends of the upper surface of the cover in a transverse direction.

IPC Classes  ?

  • B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
  • B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces

69.

SUBSTRATE PROCESSING DEVICE, POLISHING DEVICE, AND SUBSTRATE PROCESSING METHOD

      
Application Number 18490727
Status Pending
Filing Date 2023-10-19
First Publication Date 2024-05-02
Owner EBARA CORPORATION (Japan)
Inventor
  • Sato, Kohei
  • Fukaya, Koichi
  • Takahashi, Hiroki
  • Kondo, Daichi

Abstract

Provided are a substrate processing device, a polishing device, and a substrate processing method. The substrate processing device includes a processing module for processing the substrate with a liquid, and a gas-liquid separation tank connected to the exhaust outlet of the processing module, which separates the liquid from the exhaust received from the processing module and releases the exhaust into an exhaust duct. The gas-liquid separation tank includes a tank body, a heat exchanger arranged inside the tank body and cools the exhaust, and an air nozzle arranged inside the tank body and supplies air to cool the exhaust.

IPC Classes  ?

  • B08B 3/14 - Removing waste, e.g. labels, from cleaning liquid
  • B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning

70.

SUBSTRATE CLEANING APPARATUS, SUBSTRATE DRYING APPARATUS, SUBSTRATE TRANSPORT APPARATUS, SUBSTRATE PLACING APPARATUS, SUBSTRATE PROCESSING APPARATUS, CHARGE AMOUNT CONTROL METHOD, AND CHARGE AMOUNT CONTROL PROGRAM

      
Application Number 18497324
Status Pending
Filing Date 2023-10-30
First Publication Date 2024-05-02
Owner EBARA CORPORATION (Japan)
Inventor Himori, Yosuke

Abstract

Provided is a substrate cleaning apparatus including: a substrate holding and rotating mechanism configured to hold and rotate a substrate; a cleaning liquid supplier configured to supply a cleaning liquid to the substrate; a cleaning member configured to come into contact with the substrate to clean the substrate; a charge amount adjustment apparatus capable of increasing and decreasing a charge amount of the substrate; a charge amount measuring instrument configured to measure the charge amount of the substrate; and a controller configured to control the charge amount adjustment apparatus according to the charge amount measured by the charge amount measuring instrument.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 1/14 - Wipes; Absorbent members, e.g. swabs or sponges (with integrated means for dispensing fluids B08B 1/40)
  • B08B 1/20 - Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
  • B08B 1/34 - rotating about an axis parallel to the surface
  • B08B 3/04 - Cleaning involving contact with liquid
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H05F 1/00 - Preventing the formation of electrostatic charges

71.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Application Number JP2023036409
Publication Number 2024/090168
Status In Force
Filing Date 2023-10-05
Publication Date 2024-05-02
Owner EBARA CORPORATION (Japan)
Inventor Uchida Takuma

Abstract

This data processing system comprises a terminal device and a data management device comprising: a management and communication unit which can connect to the terminal device; a management and storage unit which stores notification item data including specifications of at least one machine to serve as a target; and a management and control unit which causes a notification of the notification item data stored in the management and storage unit to be provided by the management and communication unit to the terminal device, acquires, from the management and communication unit, notification item data in which selection or non-selection has been indicated using the terminal device, and causes the notification item data to be stored in the management and storage unit.

IPC Classes  ?

72.

Motor

      
Application Number 29865747
Grant Number D1024963
Status In Force
Filing Date 2022-08-10
First Publication Date 2024-04-30
Grant Date 2024-04-30
Owner EBARA CORPORATION (Japan)
Inventor
  • Ochiai, Akihiro
  • Nishimura, Kazuma
  • Oishi, Yohei
  • Ozawa, Takahide
  • Nagai, Masayuki
  • Takahashi, Shin
  • Shinchi, Yuhei

73.

PUMP AND PUMP ASSEMBLY METHOD

      
Application Number JP2023030303
Publication Number 2024/084798
Status In Force
Filing Date 2023-08-23
Publication Date 2024-04-25
Owner EBARA CORPORATION (Japan)
Inventor
  • Kawabata, Junya
  • Miya, Kenta

Abstract

The present invention relates to a pump for a liquid and particularly relates to a pump having a mechanical seal disposed on a rotating shaft. A pump (P) includes: a retainer (41) held by a spring (33) that presses a rotating ring (31) of a mechanical seal (20) against a stationary ring (32) thereof; and a retainer holder (50) attached to a back side of an impeller (2). The retainer holder (50) has: a peripheral wall (52) inside which the retainer (41) is fitted; and a bottom wall (53) that extends radially inward from the peripheral wall (52). The peripheral wall (52) protrudes from the bottom wall (53) toward the mechanical seal (20). The peripheral wall (52) has a tapered surface (54) formed at an edge thereof. The tapered surface (54) has a truncated cone shape in which the inner diameter of the peripheral wall (52) increases with increasing the distance from the bottom wall (53).

IPC Classes  ?

  • F04D 29/12 - Shaft sealings using sealing-rings
  • F04D 29/08 - Sealings
  • F04D 29/60 - Mounting; Assembling; Disassembling
  • F04D 29/62 - Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
  • F16J 15/34 - Sealings between relatively-moving surfaces with slip-ring pressed against a more or less radial face on one member

74.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, AND DATA COLLECTION METHOD

      
Application Number JP2023035401
Publication Number 2024/084917
Status In Force
Filing Date 2023-09-28
Publication Date 2024-04-25
Owner EBARA CORPORATION (Japan)
Inventor Uchida Takuma

Abstract

This data processing system: acquires processing data as new collection data from a processing data transmission source, which is an external device, at a predetermined monitoring cycle; when a collection communication unit is not connected to a management communication unit, stores the new collection data as storage data in a collection and storage unit; and, after the collection communication unit has been connected to the management communication unit, transmits, to a data management device, collection data which is a combination of new collection data that has been newly acquired from the processing data transmission source at the next monitoring cycle and the storage data stored in the collection and storage unit.

IPC Classes  ?

  • G05B 23/02 - Electric testing or monitoring
  • G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
  • H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

75.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Application Number JP2023037016
Publication Number 2024/085061
Status In Force
Filing Date 2023-10-12
Publication Date 2024-04-25
Owner EBARA CORPORATION (Japan)
Inventor Satake, Masayuki

Abstract

The present invention relates to a substrate processing method and a substrate processing apparatus, with which cracking and chipping of a multilayer substrate obtained by bonding a plurality of substrates are suppressed, and more specifically to a technology for applying a filler to a gap formed between edge parts of the plurality of substrates that constitute the multilayer substrate. This substrate processing apparatus (1) is provided with: an application device (3) which applies a filler (F) to a gap (G) between an edge part (E1) of a first substrate (W1) and an edge part (E2) of a second substrate (W2); a thermographic camera (5) which produces a thermal image (40) from the infrared light irradiated from the filler (F) applied to the gap (G); and an image processing unit (30) which determines the state of the filler (F) applied to the gap (G) on the basis of the thermal image (40).

IPC Classes  ?

  • G01J 5/48 - Thermography; Techniques using wholly visual means
  • G01N 25/72 - Investigating presence of flaws
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

76.

PUMP DEVICE FOR LIQUEFIED GAS

      
Application Number JP2023037825
Publication Number 2024/085216
Status In Force
Filing Date 2023-10-19
Publication Date 2024-04-25
Owner EBARA CORPORATION (Japan)
Inventor
  • Honda, Shuichiro
  • Matake, Kozo

Abstract

The present invention relates to a pump device for transferring an ultracold liquefied gas such as liquefied hydrogen or liquefied natural gas, and in particular to a pump device having an electric motor as a pump drive source. The pump device comprises a pump (1) having an impeller (2), a rotation shaft (5) to which the impeller (2) is fixed, and an electric motor (7) for rotating the rotation shaft (5) and the impeller (1). A rotor assembly (21) of the electric motor (7) comprises a motor rotor (40) fixed to the rotation shaft (5), a side ring (41) disposed on both sides of the motor rotor (40), and a sealed cover (42) fixed to the outer circumferential surface of the side ring (41). The sealed cover (42) is made of glass fiber.

IPC Classes  ?

  • H02K 1/22 - Rotating parts of the magnetic circuit
  • F04D 13/00 - Pumping installations or systems
  • F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
  • F04D 13/08 - Units comprising pumps and their driving means the pump being electrically driven for submerged use
  • F04D 29/00 - NON-POSITIVE-DISPLACEMENT PUMPS - Details, component parts, or accessories
  • H02K 7/14 - Structural association with mechanical loads, e.g. with hand-held machine tools or fans

77.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Application Number JP2023023776
Publication Number 2024/079949
Status In Force
Filing Date 2023-06-27
Publication Date 2024-04-18
Owner EBARA CORPORATION (Japan)
Inventor Uchida Takuma

Abstract

This data processing system comprises a data collection device and a data management device. The data collection device has: a collection storage unit which stores specific information for identifying information pertaining to processing data generated by physical quantity measurement devices that measure physical quantities; a collection communication unit which is connected to the physical quantity measurement devices; and a collection control unit which collects, on the basis of the specific information, processing data for each of the physical quantity measurement devices. The data management device has: a management storage unit which stores the specific data and the processing data; and a management communication unit which transmits the specific information stored in the management storage unit to the data collection device and receives the processing data from the data collection device.

IPC Classes  ?

  • H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
  • G05B 23/02 - Electric testing or monitoring
  • G08C 15/00 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path
  • G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division

78.

TOP RING AND SUBSTRATE PROCESSING DEVICE

      
Application Number JP2023036057
Publication Number 2024/080189
Status In Force
Filing Date 2023-10-03
Publication Date 2024-04-18
Owner EBARA CORPORATION (Japan)
Inventor Kashiwagi, Makoto

Abstract

Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member having a substrate suctioning surface for suctioning a substrate and a pressure reducing part communicating with a pressure reducing means; and a first pressure assembly that is disposed between the base member and the substrate suctioning member and has a plurality of first pressure means disposed on the side of the substrate suctioning member opposite to the substrate suctioning surface, the first pressure assembly being configured such that the first pressure means are capable of applying a pressing force to the substrate suctioning member completely independently of each other.

IPC Classes  ?

  • B24B 37/30 - Work carriers for single side lapping of plane surfaces
  • B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

79.

OUTPUT SIGNAL PROCESSING DEVICE FOR EDDY-CURRENT SENSOR

      
Application Number 18376168
Status Pending
Filing Date 2023-10-03
First Publication Date 2024-04-11
Owner EBARA CORPORATION (Japan)
Inventor Minatozaki, Katsuya

Abstract

A retainer holds reference data for identifying a first AC generated signal corresponding to an output signal output in a reference state from a detection coil. When a film thickness of a conductor is to be measured, an AC signal generator generates the first AC generated signal based on the reference data and outputs it as a reference signal. When a film thickness of a conductor is to be measured, a difference circuitry receives input of an output signal and a reference signal output from the AC signal generator and acquires and outputs a film thickness amplitude that is a difference between the amplitude of the film thickness signal and the amplitude of the reference signal. The data generator in the reference state measures an amplitude of the output signal and generates the reference data.

IPC Classes  ?

  • G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
  • B24B 37/013 - Devices or means for detecting lapping completion

80.

POLISHING APPARATUS

      
Application Number 18475188
Status Pending
Filing Date 2023-09-26
First Publication Date 2024-04-11
Owner EBARA CORPORATION (Japan)
Inventor
  • Ito, Masayoshi
  • Moriura, Takuya

Abstract

A polishing apparatus 1 includes a control device 90. The control device 90 performs: a cleaning process of causing a cleaning solution to flow in a flow channel 70a and then causing a polishing solution to flow in the flow channel 70a when the number of substrates Wf polished by a polishing machine 10 reaches a predetermined number; and a clogging detecting process of detecting whether clogging has occurred in the flow channel based on a pressure or a flow rate of the cleaning solution detected by sensors 60 and 61 when the cleaning solution flows in the flow channel.

IPC Classes  ?

  • B24B 37/005 - Control means for lapping machines or devices

81.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, DATA PRESENTATION METHOD, AND DATA STRUCTURE

      
Application Number JP2023031690
Publication Number 2024/075444
Status In Force
Filing Date 2023-08-31
Publication Date 2024-04-11
Owner EBARA CORPORATION (Japan)
Inventor
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abstract

This data processing structure is made up of a plurality of physical quantity measurement devices and a data collection device. Upon accepting a data request including an object identification index from the data collection device, the physical quantity measurement devices transmit, to the data collection device, a physical quantity data array made up of physical quantity data associated with an index of which the measurement order is later than the object identification index and an index therefor, out of a plurality of physical quantity data and indices stored in a storage unit. When a predetermined collection condition is satisfied, the data collection device transmits a data request including the object identification index to the physical quantity measurement devices, receives a physical quantity data array as a response thereto, and identifies and manages an index of which the measurement order is last when receiving the physical quantity data array the previous time, as the object identification index.

IPC Classes  ?

  • G08C 19/00 - Electric signal transmission systems
  • G05B 23/02 - Electric testing or monitoring
  • G06F 16/901 - Indexing; Data structures therefor; Storage structures
  • G08C 15/00 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path

82.

Elastic membrane

      
Application Number 29874375
Grant Number D1021832
Status In Force
Filing Date 2023-04-19
First Publication Date 2024-04-09
Grant Date 2024-04-09
Owner EBARA CORPORATION (Japan)
Inventor
  • Akazawa, Kenichi
  • Nabeya, Osamu
  • Togashi, Shingo
  • Yamaki, Satoru
  • Owada, Tomoko
  • Cheng, Cheng
  • Kato, Yuichi

83.

EXHAUST GAS TREATMENT APPARATUS

      
Application Number 18476588
Status Pending
Filing Date 2023-09-28
First Publication Date 2024-04-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Shamoto, Mitsuhiro
  • Kyotani, Takashi

Abstract

An exhaust-gas treatment apparatus capable of efficiently making a harmful gas containing in an exhaust gas harmless without increasing a size of the apparatus is disclosed. The exhaust-gas treatment apparatus includes a main body in which a flow passage is formed for a liquid to flow, an exhaust-gas supply line to be coupled to the main body, and for supplying the exhaust gas to the flow passage through which the liquid flows, a suction device configured to suck the exhaust gas from the exhaust-gas supply line into the flow passage, a low-temperature plasma generator for generating low-temperature plasma in the flow passage to decompose the harmful gas, and a discharge line for discharging the exhaust gas, which has passed through the low-temperature plasma generator, from the main body.

IPC Classes  ?

  • B01D 53/32 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by electrical effects other than those provided for in group

84.

POLISHING APPARATUS AND POLISHING METHOD

      
Application Number 18276391
Status Pending
Filing Date 2022-01-14
First Publication Date 2024-04-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Yamamoto, Satoru
  • Uchiyama, Keisuke
  • Izawa, Mao
  • Kashiwagi, Makoto

Abstract

The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one polishing head (10) arranged near a flat portion of the substrate (W), wherein the polishing head (10) has a fluid pressing structure (12) configured to press the polishing tape (3) with fluid against the flat portion of the substrate, and the fluid pressing structure (12) has a fluid supply port (13) arranged so as to face a back surface of the polishing tape (3).

IPC Classes  ?

  • B24B 21/08 - Pressure shoes; Backing belts
  • B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor

85.

DATA PROCESSING SYSTEM, PHYSICAL QUANTITY MEASURING DEVICE, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, DATA PROVISION METHOD, AND DATA COLLECTION METHOD

      
Application Number JP2023023997
Publication Number 2024/070099
Status In Force
Filing Date 2023-06-28
Publication Date 2024-04-04
Owner EBARA CORPORATION (Japan)
Inventor
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abstract

This data processing system includes a physical quantity measuring device and a data collection device. This physical quantity measuring device transmits a physical quantity data string constituted by a plurality of physical quantity data, which are obtained when the physical quantity is measured by a physical quantity sensor under sampling conditions, so that the measurement order thereof can be determined, and a time elapsed since the last measurement, which is obtained by measuring, with a timer count unit, the time elapsed after the physical quantity was measured last time by the physical quantity sensor, to the data collection device. The data collection device specifies a measurement time for each of the plurality of physical quantity data, which constitute the physical quantity data string, on the basis of the current time measured by a time measurement unit and the time elapsed since the last measurement.

IPC Classes  ?

  • G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division

86.

DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASURING DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD

      
Application Number JP2023020803
Publication Number 2024/062690
Status In Force
Filing Date 2023-06-05
Publication Date 2024-03-28
Owner EBARA CORPORATION (Japan)
Inventor
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abstract

This data processing device comprises: an arithmetic operation unit that repeatedly acquires the physical quantity to be measured, as physical quantity data, and performs a prescribed arithmetic operation on the physical quantity data so as to generate process data; and a communication processing unit that sequentially transmits process data each time process data is generated. The arithmetic operation unit executes a first arithmetic operation on the physical quantity data of a prescribed number of data points and generates first process data when a prescribed start condition is satisfied, and executes a second arithmetic operation until an end condition is satisfied, on physical quantity data for a number of data points comprising physical quantity data at the most recent time and physical quantity data at a past time and generates second process data after the elapse of a prescribed wait time when a prescribed end condition is not satisfied after executing the first arithmetic operation.

IPC Classes  ?

  • H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
  • G05B 23/02 - Electric testing or monitoring
  • G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division

87.

AM APPARATUS

      
Application Number 18264802
Status Pending
Filing Date 2022-02-04
First Publication Date 2024-03-28
Owner EBARA CORPORATION (Japan)
Inventor Asai, Junki

Abstract

The present disclosure provides a structure for replenishing a powder material to a material supply device during fabrication using the AM technique. According to one aspect, an AM apparatus is provided. This AM apparatus includes a DED nozzle configured to eject a powder material, a gantry mechanism configured to move the DED nozzle, and a powder supply device configured to supply the powder material to the DED nozzle. The gantry mechanism includes a Y-axis member movable in a horizontal X direction and extending in a horizontal Y direction perpendicular to the X direction. The DED nozzle and the material supply device are mounted on the Y-axis member of the gantry mechanism. The gantry mechanism includes a Y-axis movement mechanism for moving the DED nozzle and the material supply device along the Y direction on the Y-axis member.

IPC Classes  ?

  • B22F 12/55 - Two or more means for feeding material
  • B22F 12/00 - Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
  • B22F 12/52 - Hoppers
  • B22F 12/53 - Nozzles
  • B22F 12/70 - Gas flow means
  • B22F 12/90 - Means for process control, e.g. cameras or sensors
  • B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
  • B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes

88.

METHOD OF DETECTING ABNORMALITY IN MEASURING OF FILM THICKNESS OF WORKPIECE, OPTICAL FILM-THICKNESS MEASURING APPARATUS, AND STORAGE MEDIUM STORING PROGRAM

      
Application Number 18371357
Status Pending
Filing Date 2023-09-21
First Publication Date 2024-03-28
Owner EBARA CORPORATION (Japan)
Inventor Nakamura, Akira

Abstract

A technique of detecting an abnormality in measuring of a film thickness of a workpiece, such as a wafer, is disclosed. A method includes: generating multiple spectra of reflected light from multiple measurement points on a workpiece over a predetermined period of time during polishing of the workpiece; classifying the multiple spectra into a plurality of groups including at least a first group and a second group according to feature of each of the multiple spectra; determining a monitoring index value based on at least the number of spectra included in the first group; and detecting an abnormality in measuring of the film thickness of the at least one workpiece based on comparison of the monitoring index value with a threshold value.

IPC Classes  ?

  • G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
  • B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

89.

DETECTION DEVICE

      
Application Number JP2023031226
Publication Number 2024/062855
Status In Force
Filing Date 2023-08-29
Publication Date 2024-03-28
Owner EBARA CORPORATION (Japan)
Inventor
  • Sekiguchi Takashi
  • Yamada Yasumasa
  • Tamura Hiromi

Abstract

This detection device (1) comprises: a detection unit (2) attached to an apparatus (100) to be measured; a power supply unit (3) that supplies power to the detection unit (2); and a cable (4) that connects the detection unit (2) and the power supply unit (3). The detection unit (2) has a detection part (10) that detects the state of the apparatus (100) to be measured, a communication part (11) that transmits a detection result of the detection part (10), and a substrate (12) on which the detection part (10) and the communication part (11) are both mounted.

IPC Classes  ?

  • G01D 11/30 - Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
  • G01H 17/00 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the other groups of this subclass
  • G01K 1/14 - Supports; Fastening devices; Arrangements for mounting thermometers in particular locations

90.

GRAPH DISPLAY METHOD FOR POLISHING DEVICE, AND COMPUTER PROGRAM

      
Application Number JP2023028049
Publication Number 2024/057749
Status In Force
Filing Date 2023-08-01
Publication Date 2024-03-21
Owner EBARA CORPORATION (Japan)
Inventor
  • Shimizu, Yuko
  • Watanabe, Hiromitsu
  • Sugita, Ryuji
  • Yanai, Akio
  • Watanabe, Daichi

Abstract

The present invention enables data of interest to be found quickly from among multiple sets of measured data in a polishing device. Provided is a method for displaying measured data relating to a polishing device as a graph. The method includes: a step for acquiring, from the polishing device, a plurality of series of measured data measured in the polishing device; a step for creating graphs corresponding to each of the plurality of series of measured data; a step for classifying the plurality of created graphs into a plurality of groups on the basis of a similarity of the graph shapes; and a step for displaying the plurality of graphs in an overlaid manner, using a different display mode for each group.

IPC Classes  ?

  • B24B 37/013 - Devices or means for detecting lapping completion
  • B23Q 17/00 - Arrangements for indicating or measuring on machine tools
  • B23Q 17/24 - Arrangements for indicating or measuring on machine tools using optics
  • B24B 37/00 - Lapping machines or devices; Accessories
  • G06T 11/60 - Editing figures and text; Combining figures or text
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

91.

THRESHOLD VALUE SETTING DEVICE, ABNORMALITY DETERMINATION DEVICE, THRESHOLD VALUE SETTING METHOD, AND ABNORMALITY DETERMINATION METHOD

      
Application Number JP2023030527
Publication Number 2024/057864
Status In Force
Filing Date 2023-08-24
Publication Date 2024-03-21
Owner EBARA CORPORATION (Japan)
Inventor
  • Tamura Hiromi
  • Yamada Yasumasa

Abstract

This threshold value setting device comprises: an input unit for inputting a period of data to be extracted from acquired data; a data extraction unit for extracting data for the period inputted by the input unit; a reference value determination unit for determining a reference value from the data extracted by the data extraction unit; and a threshold value calculation unit for calculating a threshold value from the reference value determined by the reference value determination unit.

IPC Classes  ?

  • G01M 99/00 - Subject matter not provided for in other groups of this subclass
  • G05B 23/02 - Electric testing or monitoring

92.

POLISHING APPARATUS

      
Application Number 18521813
Status Pending
Filing Date 2023-11-28
First Publication Date 2024-03-21
Owner EBARA CORPORATION (Japan)
Inventor
  • Kobayashi, Kenichi
  • Nakanishi, Masayuki
  • Kashiwagi, Makoto
  • Hoshina, Manao

Abstract

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

IPC Classes  ?

  • B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
  • B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
  • B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
  • B24B 21/10 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
  • B24B 37/005 - Control means for lapping machines or devices
  • B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
  • B24B 37/30 - Work carriers for single side lapping of plane surfaces
  • B24B 41/06 - Work supports, e.g. adjustable steadies
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

93.

DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD

      
Application Number JP2023021022
Publication Number 2024/057635
Status In Force
Filing Date 2023-06-06
Publication Date 2024-03-21
Owner EBARA CORPORATION (Japan)
Inventor
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abstract

This data processing device comprises: a data acquisition unit which acquires a sequence of physical quantity data individually measured at a prescribed sampling frequency and the number of sampling points; a first data generation unit which generates a first time data sequence by extracting physical quantity data of a first analysis point number continuously measured at the first analysis point of a number smaller than the number of sampling points; a first frequency analysis unit which converts the first time data sequence into a first frequency data sequence through a frequency analysis; a second data generation unit which generates a second time data sequence by thinning the physical quantity sequence into physical quantity data of a second analysis point number smaller than the number of sampling points; and a second frequency analysis unit which converts the second time data sequence into a second frequency data sequence through the frequency analysis.

IPC Classes  ?

  • G01H 17/00 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the other groups of this subclass
  • G01M 99/00 - Subject matter not provided for in other groups of this subclass
  • G05B 23/02 - Electric testing or monitoring

94.

AHEAD, BEYOND

      
Serial Number 79395494
Status Pending
Filing Date 2024-03-19
Owner EBARA CORPORATION (Japan)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 11 - Environmental control apparatus
  • 37 - Construction and mining; installation and repair services
  • 42 - Scientific, technological and industrial services, research and design

Goods & Services

Metalworking machines and tools; construction machines and apparatus; loading-unloading machines and apparatus; chemical processing machines and apparatus; pulp making, papermaking or paper-working machines and apparatus; plastic processing machines and apparatus; semiconductor manufacturing machines and systems; non-electric prime movers [not for land vehicles]; turbines [not for land vehicles]; pneumatic or hydraulic machines and instruments; pumps [not for specified purposes]; vacuum pumps [not for specified purposes]; blowers [not for specified purposes]; compressors [not for specified purposes]; electric wax-polishing machines; vacuum cleaners; power-operated sprayers for disinfecting, insecticides and deodorants [not for agricultural purposes]; machine elements [not for land vehicles]; waste compacting machines and apparatus; waste crushing machines; starters for motors and engines; AC motors and DC motors [not including those for land vehicles but including "parts" for any AC motors and DC motors]; AC generators [alternators]; DC generators. Ozonisers [ozonators]; electrolysers [electrolytic cells]; fire extinguishers; fire hose nozzles; sprinkler systems for fire protection; fire alarms; gas alarms; laboratory apparatus and instruments; optical machines and apparatus; measuring or testing machines and instruments; power distribution or control machines and apparatus; rotary converters; phase modifiers; solar batteries; batteries and cells; electric or magnetic meters and testers; electric wires and cables; telecommunication machines and apparatus; electronic machines, apparatus and their parts; magnetic cores; resistance wires; electrodes for laboratory research. Drying apparatus [for chemical processing]; recuperators [for chemical processing]; steamers [for chemical processing]; evaporators [for chemical processing]; distillers [for chemical processing]; heat exchangers [for chemical processing]; industrial furnaces; nuclear reactors [atomic piles]; boilers for non-electric prime movers and engines; air-conditioning apparatus [for industrial purposes]; freezing machines and apparatus; tap water faucets; level controlling valves for tanks; pipe line cocks; waste water treatment tanks [for industrial purposes]; septic tanks [for industrial purposes]; garbage incinerators; solar water heaters; water purifying apparatus; household electrothermic appliances; washers for water taps; bath fittings; waste water treatment tanks for household purposes; septic tanks for household purposes; fire hydrants. Construction; construction consultancy; installation and maintenance of building equipment; shipbuilding; repair or maintenance of vessels; repair or maintenance of optical machines and instruments; repair or maintenance of photographic machines and apparatus; repair or maintenance of loading-unloading machines and apparatus; repair or maintenance of fire alarms; repair or maintenance of air-conditioning apparatus [for industrial purposes]; repair or maintenance of burners; repair or maintenance of boilers; repair or maintenance of pumps; repair or maintenance of freezing machines and apparatus; repair or maintenance of electronic machines and apparatus; repair or maintenance of telecommunication machines and apparatus; repair or maintenance of construction machines and apparatus; repair or maintenance of consumer electric appliances; repair or maintenance of electric lighting apparatus; repair or maintenance of power distribution or control machines and apparatus; repair or maintenance of power generators; repair or maintenance of electric motors; repair or maintenance of laboratory apparatus and instruments; repair or maintenance of measuring and testing machines and instruments; repair or maintenance of medical apparatus and instruments; repair or maintenance of chemical processing machines and apparatus; repair or maintenance of glassware manufacturing machines and apparatus; repair or maintenance of metalworking machines and tools; repair or maintenance of industrial furnaces; repair or maintenance of mining machines and apparatus; repair or maintenance of rubber-goods manufacturing machines and apparatus; repair or maintenance of integrated circuits manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems; repair or maintenance of machines and apparatus for processing foods or beverages; repair or maintenance of machines and apparatus for lumbering, woodworking, or veneer or plywood making; repair or maintenance of agricultural machines and implements; repair or maintenance of machines and apparatus for pulp-making, papermaking or paper-working; repair or maintenance of plastic processing machines and apparatus; repair or maintenance of reservoirs; repair or maintenance of dishwashers for industrial purposes; repair or maintenance of cooking equipment for industrial purposes; repair or maintenance of vehicle washing installations; repair or maintenance of power-driven floor cleaning machines; repair or maintenance of water pollution control equipment; repair or maintenance of water purifying apparatus; repair or maintenance of waste compacting machines and apparatus; repair or maintenance of waste crushing machines; repair or maintenance of nuclear power plants; repair or maintenance of chemical plants; repair or maintenance of gas water heaters; repair or maintenance of non-electric cooking heaters; repair or maintenance of bath fittings; chimney sweeping; cleaning of building exterior surfaces; window cleaning; carpet and rug cleaning; floor polishing; septic tank cleaning; bathtub and bath boiler cleaning; street cleaning; reservoirs cleaning; sterilization of medical machines and apparatus; rental of construction machines and apparatus; rental of floor cleaning machines; rental of car-washing apparatus; rental of mining machines and apparatus; rental of drainage pumps. Architectural design; surveying; geological surveys or research; designing of machines, apparatus, instruments [including their parts] or systems composed of such machines, apparatus and instruments; designing; computer software design, computer programming, or maintenance of computer software; providing technical advice relating to computers, automobiles and industrial machines; research on building construction or city planning; testing or research on prevention of pollution; testing or research on electricity; testing or research on civil engineering; testing, inspection or research on agriculture, livestock breeding or fisheries; testing or research on machines, apparatus and instruments; rental of measuring apparatus; rental of computers; providing computer programs on data network; rental of laboratory apparatus and instrument; rental of technical drawing instruments.

95.

PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APPARATUS, AND POLISHING APPARATUS

      
Application Number 18311421
Status Pending
Filing Date 2023-05-03
First Publication Date 2024-03-14
Owner EBARA CORPORATION (Japan)
Inventor
  • Miyakawa, Toshiki
  • Saito, Kenichiro
  • Fukushima, Makoto

Abstract

An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

IPC Classes  ?

  • B24B 37/20 - Lapping pads for working plane surfaces
  • B24B 37/005 - Control means for lapping machines or devices

96.

SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD

      
Application Number 18458866
Status Pending
Filing Date 2023-08-30
First Publication Date 2024-03-14
Owner Ebara Corporation (Japan)
Inventor Fujikata, Jumpei

Abstract

The present disclosure provides a substrate processing apparatus and a protective layer forming method that can protect surfaces of metal regions after a polishing process from oxidation and adhesion of cutting chips and particles caused in a process after polishing. The substrate processing apparatus according to the present disclosure includes a polishing device for polishing a semiconductor substrate, a protective layer forming device for forming a protective layer on a surface of the substrate using a silane coupling agent or a resin protective film agent, and a control device. The control device controls the polishing device and the protective layer forming device such that the protective layer forming device forms the protective layer on the substrate after the polishing device finishes polishing the substrate.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

97.

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

      
Application Number 18505194
Status Pending
Filing Date 2023-11-09
First Publication Date 2024-03-14
Owner EBARA CORPORATION (Japan)
Inventor
  • Fukunaga, Akira
  • Watanabe, Katsuhide
  • Kobata, Itsuki
  • Tsujimura, Manabu

Abstract

To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.

IPC Classes  ?

  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • B24B 37/005 - Control means for lapping machines or devices
  • B24B 37/015 - Temperature control
  • B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
  • H01L 21/321 - After-treatment

98.

SUBSTRATE CLAMPING APPARATUS

      
Application Number 18508536
Status Pending
Filing Date 2023-11-14
First Publication Date 2024-03-14
Owner EBARA CORPORATION (Japan)
Inventor
  • Kondo, Daichi
  • Nakano, Hisajiro
  • Miyazaki, Mitsuru

Abstract

A substrate clamping apparatus includes a substrate holding part which is movable between a closed state in which a substrate is clamped and an open state in which clamping of the substrate is released, a support column part which supports the substrate holding part and is capable of being raised and lowered, and an interlocking mechanism which interlocks a raising and lowering operation of the support column part with an opening and closing operation of the substrate holding part, in which an opening and closing operation range A of the substrate holding part in an up-and-down stroke S of the support column part includes at least a part of an intermediate region M of the up-and-down stroke S.

IPC Classes  ?

  • B25B 5/16 - Clamps - Details, e.g. jaws, jaw attachments

99.

SUBSTRATE CLEANING DEVICE AND METHOD OF CLEANING SUBSTRATE

      
Application Number 18511727
Status Pending
Filing Date 2023-11-16
First Publication Date 2024-03-14
Owner EBARA CORPORATION (Japan)
Inventor
  • Oikawa, Fumitoshi
  • Fukaya, Koichi
  • Baba, Erina
  • Suemasa, Shuichi
  • Nakano, Hisajiro

Abstract

A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

IPC Classes  ?

  • B08B 3/02 - Cleaning by the force of jets or sprays
  • B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members

100.

MAGNETIC BEARING APPARATUS

      
Application Number 18321814
Status Pending
Filing Date 2023-05-23
First Publication Date 2024-03-14
Owner EBARA CORPORATION (Japan)
Inventor
  • Kakesu, Yu
  • Tanaka, Kunihiko
  • Barada, Toshimitsu

Abstract

A magnetic bearing apparatus capable of correcting inclination of a rotating element with a small magnetic attractive force and capable of stably supporting the rotating element is disclosed. The magnetic bearing apparatus includes: a non-magnetic ring made of non-magnetic material; and at least three axial magnetic poles arranged along a circumferential direction of the non-magnetic ring. Each axial magnetic pole has an arc-shaped coil and a coil housing that accommodates the coil therein. The at least three axial magnetic poles are fixed to the non-magnetic ring.

IPC Classes  ?

  • F16C 32/04 - Bearings not otherwise provided for using magnetic or electric supporting means
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