This data processing system: acquires processing data as new collection data from a processing data transmission source, which is an external device, at a predetermined monitoring cycle; when a collection communication unit is not connected to a management communication unit, stores the new collection data as storage data in a collection and storage unit; and, after the collection communication unit has been connected to the management communication unit, transmits, to a data management device, collection data which is a combination of new collection data that has been newly acquired from the processing data transmission source at the next monitoring cycle and the storage data stored in the collection and storage unit.
G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
The present invention relates to a pump device for transferring an ultracold liquefied gas such as liquefied hydrogen or liquefied natural gas, and in particular to a pump device having an electric motor as a pump drive source. The pump device comprises a pump (1) having an impeller (2), a rotation shaft (5) to which the impeller (2) is fixed, and an electric motor (7) for rotating the rotation shaft (5) and the impeller (1). A rotor assembly (21) of the electric motor (7) comprises a motor rotor (40) fixed to the rotation shaft (5), a side ring (41) disposed on both sides of the motor rotor (40), and a sealed cover (42) fixed to the outer circumferential surface of the side ring (41). The sealed cover (42) is made of glass fiber.
The present invention relates to a substrate processing method and a substrate processing apparatus, with which cracking and chipping of a multilayer substrate obtained by bonding a plurality of substrates are suppressed, and more specifically to a technology for applying a filler to a gap formed between edge parts of the plurality of substrates that constitute the multilayer substrate. This substrate processing apparatus (1) is provided with: an application device (3) which applies a filler (F) to a gap (G) between an edge part (E1) of a first substrate (W1) and an edge part (E2) of a second substrate (W2); a thermographic camera (5) which produces a thermal image (40) from the infrared light irradiated from the filler (F) applied to the gap (G); and an image processing unit (30) which determines the state of the filler (F) applied to the gap (G) on the basis of the thermal image (40).
The present invention relates to a pump for a liquid and particularly relates to a pump having a mechanical seal disposed on a rotating shaft. A pump (P) includes: a retainer (41) held by a spring (33) that presses a rotating ring (31) of a mechanical seal (20) against a stationary ring (32) thereof; and a retainer holder (50) attached to a back side of an impeller (2). The retainer holder (50) has: a peripheral wall (52) inside which the retainer (41) is fitted; and a bottom wall (53) that extends radially inward from the peripheral wall (52). The peripheral wall (52) protrudes from the bottom wall (53) toward the mechanical seal (20). The peripheral wall (52) has a tapered surface (54) formed at an edge thereof. The tapered surface (54) has a truncated cone shape in which the inner diameter of the peripheral wall (52) increases with increasing the distance from the bottom wall (53).
This data processing system comprises a data collection device and a data management device. The data collection device has: a collection storage unit which stores specific information for identifying information pertaining to processing data generated by physical quantity measurement devices that measure physical quantities; a collection communication unit which is connected to the physical quantity measurement devices; and a collection control unit which collects, on the basis of the specific information, processing data for each of the physical quantity measurement devices. The data management device has: a management storage unit which stores the specific data and the processing data; and a management communication unit which transmits the specific information stored in the management storage unit to the data collection device and receives the processing data from the data collection device.
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
G08C 15/00 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path
G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member having a substrate suctioning surface for suctioning a substrate and a pressure reducing part communicating with a pressure reducing means; and a first pressure assembly that is disposed between the base member and the substrate suctioning member and has a plurality of first pressure means disposed on the side of the substrate suctioning member opposite to the substrate suctioning surface, the first pressure assembly being configured such that the first pressure means are capable of applying a pressing force to the substrate suctioning member completely independently of each other.
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
7.
OUTPUT SIGNAL PROCESSING DEVICE FOR EDDY-CURRENT SENSOR
A retainer holds reference data for identifying a first AC generated signal corresponding to an output signal output in a reference state from a detection coil. When a film thickness of a conductor is to be measured, an AC signal generator generates the first AC generated signal based on the reference data and outputs it as a reference signal. When a film thickness of a conductor is to be measured, a difference circuitry receives input of an output signal and a reference signal output from the AC signal generator and acquires and outputs a film thickness amplitude that is a difference between the amplitude of the film thickness signal and the amplitude of the reference signal. The data generator in the reference state measures an amplitude of the output signal and generates the reference data.
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
B24B 37/013 - Devices or means for detecting lapping completion
A polishing apparatus 1 includes a control device 90. The control device 90 performs: a cleaning process of causing a cleaning solution to flow in a flow channel 70a and then causing a polishing solution to flow in the flow channel 70a when the number of substrates Wf polished by a polishing machine 10 reaches a predetermined number; and a clogging detecting process of detecting whether clogging has occurred in the flow channel based on a pressure or a flow rate of the cleaning solution detected by sensors 60 and 61 when the cleaning solution flows in the flow channel.
B24B 37/005 - Control means for lapping machines or devices
9.
DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, DATA PRESENTATION METHOD, AND DATA STRUCTURE
This data processing structure is made up of a plurality of physical quantity measurement devices and a data collection device. Upon accepting a data request including an object identification index from the data collection device, the physical quantity measurement devices transmit, to the data collection device, a physical quantity data array made up of physical quantity data associated with an index of which the measurement order is later than the object identification index and an index therefor, out of a plurality of physical quantity data and indices stored in a storage unit. When a predetermined collection condition is satisfied, the data collection device transmits a data request including the object identification index to the physical quantity measurement devices, receives a physical quantity data array as a response thereto, and identifies and manages an index of which the measurement order is last when receiving the physical quantity data array the previous time, as the object identification index.
An exhaust-gas treatment apparatus capable of efficiently making a harmful gas containing in an exhaust gas harmless without increasing a size of the apparatus is disclosed. The exhaust-gas treatment apparatus includes a main body in which a flow passage is formed for a liquid to flow, an exhaust-gas supply line to be coupled to the main body, and for supplying the exhaust gas to the flow passage through which the liquid flows, a suction device configured to suck the exhaust gas from the exhaust-gas supply line into the flow passage, a low-temperature plasma generator for generating low-temperature plasma in the flow passage to decompose the harmful gas, and a discharge line for discharging the exhaust gas, which has passed through the low-temperature plasma generator, from the main body.
B01D 53/32 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by electrical effects other than those provided for in group
The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one polishing head (10) arranged near a flat portion of the substrate (W), wherein the polishing head (10) has a fluid pressing structure (12) configured to press the polishing tape (3) with fluid against the flat portion of the substrate, and the fluid pressing structure (12) has a fluid supply port (13) arranged so as to face a back surface of the polishing tape (3).
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
13.
DATA PROCESSING SYSTEM, PHYSICAL QUANTITY MEASURING DEVICE, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, DATA PROVISION METHOD, AND DATA COLLECTION METHOD
This data processing system includes a physical quantity measuring device and a data collection device. This physical quantity measuring device transmits a physical quantity data string constituted by a plurality of physical quantity data, which are obtained when the physical quantity is measured by a physical quantity sensor under sampling conditions, so that the measurement order thereof can be determined, and a time elapsed since the last measurement, which is obtained by measuring, with a timer count unit, the time elapsed after the physical quantity was measured last time by the physical quantity sensor, to the data collection device. The data collection device specifies a measurement time for each of the plurality of physical quantity data, which constitute the physical quantity data string, on the basis of the current time measured by a time measurement unit and the time elapsed since the last measurement.
G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
14.
DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASURING DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD
This data processing device comprises: an arithmetic operation unit that repeatedly acquires the physical quantity to be measured, as physical quantity data, and performs a prescribed arithmetic operation on the physical quantity data so as to generate process data; and a communication processing unit that sequentially transmits process data each time process data is generated. The arithmetic operation unit executes a first arithmetic operation on the physical quantity data of a prescribed number of data points and generates first process data when a prescribed start condition is satisfied, and executes a second arithmetic operation until an end condition is satisfied, on physical quantity data for a number of data points comprising physical quantity data at the most recent time and physical quantity data at a past time and generates second process data after the elapse of a prescribed wait time when a prescribed end condition is not satisfied after executing the first arithmetic operation.
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
The present disclosure provides a structure for replenishing a powder material to a material supply device during fabrication using the AM technique. According to one aspect, an AM apparatus is provided. This AM apparatus includes a DED nozzle configured to eject a powder material, a gantry mechanism configured to move the DED nozzle, and a powder supply device configured to supply the powder material to the DED nozzle. The gantry mechanism includes a Y-axis member movable in a horizontal X direction and extending in a horizontal Y direction perpendicular to the X direction. The DED nozzle and the material supply device are mounted on the Y-axis member of the gantry mechanism. The gantry mechanism includes a Y-axis movement mechanism for moving the DED nozzle and the material supply device along the Y direction on the Y-axis member.
B22F 12/55 - Two or more means for feeding material
B22F 12/00 - Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
B22F 12/90 - Means for process control, e.g. cameras or sensors
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
16.
METHOD OF DETECTING ABNORMALITY IN MEASURING OF FILM THICKNESS OF WORKPIECE, OPTICAL FILM-THICKNESS MEASURING APPARATUS, AND STORAGE MEDIUM STORING PROGRAM
A technique of detecting an abnormality in measuring of a film thickness of a workpiece, such as a wafer, is disclosed. A method includes: generating multiple spectra of reflected light from multiple measurement points on a workpiece over a predetermined period of time during polishing of the workpiece; classifying the multiple spectra into a plurality of groups including at least a first group and a second group according to feature of each of the multiple spectra; determining a monitoring index value based on at least the number of spectra included in the first group; and detecting an abnormality in measuring of the film thickness of the at least one workpiece based on comparison of the monitoring index value with a threshold value.
G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
This detection device (1) comprises: a detection unit (2) attached to an apparatus (100) to be measured; a power supply unit (3) that supplies power to the detection unit (2); and a cable (4) that connects the detection unit (2) and the power supply unit (3). The detection unit (2) has a detection part (10) that detects the state of the apparatus (100) to be measured, a communication part (11) that transmits a detection result of the detection part (10), and a substrate (12) on which the detection part (10) and the communication part (11) are both mounted.
The present invention enables data of interest to be found quickly from among multiple sets of measured data in a polishing device. Provided is a method for displaying measured data relating to a polishing device as a graph. The method includes: a step for acquiring, from the polishing device, a plurality of series of measured data measured in the polishing device; a step for creating graphs corresponding to each of the plurality of series of measured data; a step for classifying the plurality of created graphs into a plurality of groups on the basis of a similarity of the graph shapes; and a step for displaying the plurality of graphs in an overlaid manner, using a different display mode for each group.
This threshold value setting device comprises: an input unit for inputting a period of data to be extracted from acquired data; a data extraction unit for extracting data for the period inputted by the input unit; a reference value determination unit for determining a reference value from the data extracted by the data extraction unit; and a threshold value calculation unit for calculating a threshold value from the reference value determined by the reference value determination unit.
A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 21/10 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
B24B 37/005 - Control means for lapping machines or devices
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
21.
DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD
This data processing device comprises: a data acquisition unit which acquires a sequence of physical quantity data individually measured at a prescribed sampling frequency and the number of sampling points; a first data generation unit which generates a first time data sequence by extracting physical quantity data of a first analysis point number continuously measured at the first analysis point of a number smaller than the number of sampling points; a first frequency analysis unit which converts the first time data sequence into a first frequency data sequence through a frequency analysis; a second data generation unit which generates a second time data sequence by thinning the physical quantity sequence into physical quantity data of a second analysis point number smaller than the number of sampling points; and a second frequency analysis unit which converts the second time data sequence into a second frequency data sequence through the frequency analysis.
An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.
The present disclosure provides a substrate processing apparatus and a protective layer forming method that can protect surfaces of metal regions after a polishing process from oxidation and adhesion of cutting chips and particles caused in a process after polishing. The substrate processing apparatus according to the present disclosure includes a polishing device for polishing a semiconductor substrate, a protective layer forming device for forming a protective layer on a surface of the substrate using a silane coupling agent or a resin protective film agent, and a control device. The control device controls the polishing device and the protective layer forming device such that the protective layer forming device forms the protective layer on the substrate after the polishing device finishes polishing the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
24.
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.
A substrate clamping apparatus includes a substrate holding part which is movable between a closed state in which a substrate is clamped and an open state in which clamping of the substrate is released, a support column part which supports the substrate holding part and is capable of being raised and lowered, and an interlocking mechanism which interlocks a raising and lowering operation of the support column part with an opening and closing operation of the substrate holding part, in which an opening and closing operation range A of the substrate holding part in an up-and-down stroke S of the support column part includes at least a part of an intermediate region M of the up-and-down stroke S.
A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.
A magnetic bearing apparatus capable of correcting inclination of a rotating element with a small magnetic attractive force and capable of stably supporting the rotating element is disclosed. The magnetic bearing apparatus includes: a non-magnetic ring made of non-magnetic material; and at least three axial magnetic poles arranged along a circumferential direction of the non-magnetic ring. Each axial magnetic pole has an arc-shaped coil and a coil housing that accommodates the coil therein. The at least three axial magnetic poles are fixed to the non-magnetic ring.
[Problem] To provide an information processing device that enables the appropriate prediction of the effect of electromagnetic waves generated from an AC power line when substrate treatment is performed. [Solution] An information processing device 5 includes: a current value information generation unit 501 that generates current value information of AC current supplied to an AC device when substrate treatment is performed by a substrate treatment device which is provided with the AC device connected to an AC power supply via an AC power line, and which is provided with a control board that controls the AC device in order to perform substrate treatment for supplying a treatment fluid to a substrate or a treatment member while bringing the treatment member into contact with the substrate; and an electromagnetic wave effect information generation unit 502 that generates, on the basis of the current value information generated by the current value information generation unit 501, electromagnetic wave effect information indicating an effect of electromagnetic waves generated from the AC power line.
A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B08B 1/02 - Cleaning travelling work, e.g. a web or articles on a conveyor
B08B 3/04 - Cleaning involving contact with liquid
30.
SURFACE PROPERTY MEASURING APPARATUS FOR POLISHING PAD, SURFACE PROPERTY MEASURING METHOD FOR POLISHING PAD, AND SURFACE PROPERTY JUDGING METHOD FOR POLISHING PAD
The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).
An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
32.
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, PROGRAM, SUBSTRATE PROCESSING APPARATUS, CRITERION DATA DETERMINATION APPARATUS, AND CRITERION DATA DETERMINATION METHOD
An information processing apparatus detecting presence or absence of abnormality of a vacuum pump derived from a product produced within a target vacuum pump, including: a determination unit configured to determine a normal variation range or a normal time variation behavior of a target state quantity which is a state quantity varying depending on a load of gas flowing into the vacuum pump, based on at least one of past target state quantities of the target vacuum pump or another vacuum pump; and a comparison unit configured to compare a current target state quantity of the target vacuum pump with the normal variation range or the normal time variation behavior and output the comparison result.
A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/08 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
There is provided a gas solution supply apparatus capable of preventing bubbles from being generated in use at a point-of-use even if gas solution to be provided to a point-of-use has a high concentration. The gas solution supply apparatus 1 includes: a gas dissolving unit 4 that dissolves a source gas in a source liquid to produce a first gas solution; a first gas-liquid separator 10 that stores the first gas solution produced and produces a second gas solution through gas-liquid separation of the first gas solution; a pressure reducer 17 that depressurizes the second gas solution produced in the first gas-liquid separator 10; and a second gas-liquid separator 12 that stores the depressurized second gas solution and produces a third gas solution through gas-liquid separation of the second gas solution. The third gas solution is supplied to a point-of-use.
A tilt pad journal bearing for supporting a rotating shaft includes an annular support ring and a plurality of arcuate pads tiltably mounted in the annular support ring and circumferentially spaced apart from each other. The tilt pad journal bearing further has a lubrication arrangement disposed between each pair of the plurality of arcuate pads. The lubrication arrangement includes a lubrication manifold connected to the annular support ring and recessed relative to a shaft support surface of adjacent arcuate pads to define an oil mixing cavity, and a plurality of lubrication nozzles protruding from the lubrication manifold into the oil mixing cavity. A cross-sectional flow area of at least one of the plurality of lubrication nozzles positioned toward a center of the lubrication manifold is larger than a cross-sectional flow area of a remainder of the plurality of nozzles.
A tilt pad journal bearing for supporting a rotating shaft includes an annular support ring and a plurality of arcuate pads tiltably mounted in the annular support ring and circumferentially spaced apart from each other. The tilt pad journal bearing further has a lubrication arrangement disposed between each pair of the plurality of arcuate pads. The lubrication arrangement includes a lubrication manifold connected to the annular support ring and recessed relative to a shaft support surface of adjacent arcuate pads to define an oil mixing cavity, and a plurality of lubrication nozzles protruding from the lubrication manifold into the oil mixing cavity. A cross-sectional flow area of at least one of the plurality of lubrication nozzles positioned toward a center of the lubrication manifold is larger than a cross- sectional flow area of a remainder of the plurality of nozzles.
A polishing-head system capable of precisely controlling a polishing rate for a substrate, such as a wafer, and more particularly a polishing rate at an edge portion is disclosed. The polishing-head system includes a polishing head, a head shaft, a head rotating mechanism, a multi-path rotary joint, a fluid supply line, and a pressure regulator, wherein the polishing head has a substrate pressing surface, a retainer ring, and pressure chambers arranged along a circumferential direction of the retainer ring, the head shaft has shaft flow-passages communicating with the pressure chambers, respectively, and the multi-path rotary joint is configured to sequentially provide a communication between the fluid supply line and the shall flow-passages each time the head shaft makes one revolution.
To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed layer, and rotate; at least one white confocal sensor for measuring the plate surface of the substrate supported by the stage; and a state measurement module for measuring the state of a power supply member contact region, which is a region of the substrate that comes into contact with a power supply member, on the basis of detection, by the white confocal sensor, of the power supply member contact region.
This hearth component is provided with an in-incinerator exposed surface that is exposed to the inside of an incinerator. The in-incinerator exposed surface comprises a front surface and an upper surface, and at least the front surface is provided with a protective layer having grooves formed on the surface thereof.
An information processing apparatus includes: an information acquisition part, acquiring recipe information indicating processing content of polishing processing and finishing processing, and transfer time information indicating a transfer time required for each transfer processing; and a schedule creation part, based on the recipe information and the transfer time information, creating a substrate processing schedule by determining a start timing of each processing so that a final processing end time during which a final substrate after the finishing processing is carried out to a substrate carry-out position is shortest.
A plating device comprising: a plating tank configured so as to accommodate a plating solution; a substrate holder configured so as to hold a substrate to be plated; a rotating mechanism which rotates the substrate holder; a raising/lowering mechanism which raises/lowers the substrate holder; and a control unit. The substrate holder is equipped with: a contact member configured so as to come into contact with the substrate to enable power supply; a seal member configured so as to fill the gap between the substrate holder and the substrate; a liquid-holding part having the contact member inside and configured so as to hold a liquid when the gap between the substrate holder and the substrate is filled by the seal member; and an ejection port which is open to the liquid-holding part or to a space lying inside the substrate holder and communicating with the liquid-holding part or can be disposed on a lateral side of the substrate holder and which has been configured so that the liquid is ejected.
The present disclosure provides a substrate holder having a centering pin that does not push the substrate any farther toward the center than the design position even if a first holding member deviates from the design position with respect to a second holding member when positioning the substrate. The substrate holder according to the present disclosure has a first holding member and a second holding member. The second holding member has a positioning member for positioning the substrate at a predetermined position and a stopper. The positioning member has a centering pin that can move between a first position and a second position. The centering pin is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first holding member has a drive member configured to bias the centering pin to the first position when the substrate is held by the first holding member and second holding member. The stopper is configured to contact the centering pin and stop the centering pin at the first position.
To suppress damage to a surface to be polished of a substrate and improve a polishing rate. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, a nozzle 228 for supplying a polishing liquid around the pad holder 226, and a pad rotation mechanism for rotating the pad holder 226. The pad holder 226 includes a discharge hole 221-2a formed in the center of a holding surface 221-2c configured to hold the polishing pad 222 and a discharge passage 221-2b communicated with an outside of the pad holder 226 from the discharge hole 221-2a.
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
44.
CLEANING APPARATUS FOR CLEANING MEMBER, CLEANING METHOD FOR CLEANING MEMBER, AND SUBSTRATE CLEANING METHOD
A cleaning apparatus for cleaning member has a member cleaning part 30 that cleans a cleaning member 10 that cleans a substrate W; and a measurement part 20 that measures a degree of cleanliness of the cleaning member 10 cleaned by the member cleaning part 30.
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
B08B 1/02 - Cleaning travelling work, e.g. a web or articles on a conveyor
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B08B 3/04 - Cleaning involving contact with liquid
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
45.
PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET METHOD
A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.
B08B 3/02 - Cleaning by the force of jets or sprays
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
The present invention achieves a small pre-wet module that is capable of performing different pre-processes. This pre-wet module 200 includes: a stage 220 configured so as to hold a rear surface of a substrate WF having a surface WF-a to be processed that faces upward; a rotating mechanism 224 configured so as to rotate the stage 220; a cleaning liquid supply member 260 that has nozzles 262 disposed above the stage 220 and is configured so as to supply a cleaning liquid in the direction of the stage 220 via the nozzles 262; and a degassed liquid supply member 250 that is configured so as to supply a degassed liquid to the surface WF-a to be processed of the base plate WF held on the stage 220, wherein the degassed liquid supply member 250 is configured so as to be able to move between a supply position between the nozzles 262 and the surface WF-a to be processed of the substrate WF and a retreat position to which to retreat between the nozzles 262 and the surface WF-a to be processed of the substrate WF.
The present disclosure provides a technique for carrying out fabrication on a powder material bedded in advance using a DED nozzle. According to one aspect, a DED nozzle for use with an AM apparatus is provided. This DED nozzle includes a DED nozzle main body, a laser port provided at a distal end of the DED nozzle main body and configured to emit laser light, a laser passage provided in communication with the laser port and configured to allow the laser light to pass through inside the DED nozzle main body, a powder port provided at the distal end of the DED nozzle main body and configured to eject a powder material, and a powder passage provided in communication with the powder port and configured to allow the powder material to pass through inside the DED nozzle main body. Directions of the powder passage and the powder port are determined based on a distance from the powder port to a fabrication point, a velocity of the powder material ejected from the powder port, and a gravitational acceleration.
Efficiency of a cleaning process and a degassing process for a surface to be processed of a substrate is improved.
Efficiency of a cleaning process and a degassing process for a surface to be processed of a substrate is improved.
A pre-wet module 200 includes a stage 220, a rotation mechanism 224, a pre-wet chamber 260, an elevating mechanism 230, a degassing liquid supply member 204, a nozzle 268, and a cleaning liquid supply member 202. The stage 220 is configured to hold a back surface of a substrate WF with a surface to be processed WF-a facing upward. The rotation mechanism 224 is configured to rotate the stage 220. The pre-wet chamber 260 includes a lid member 262 and a tubular member 264. The lid member 262 has an opposed surface 262a opposed to the surface to be processed WF-a of the substrate WF. The tubular member 264 is installed on an outer edge portion of the opposed surface 262a of the lid member 262. The elevating mechanism 230 is configured to move up and down the pre-wet chamber 260. The degassing liquid supply member 204 is configured to supply a degassing liquid to a pre-wet space 269 formed between the pre-wet chamber 260 and the surface to be processed WF-a of the substrate WF. The nozzle 268 is installed on the opposed surface 262a of the lid member 262. The cleaning liquid supply member 202 is configured to supply a cleaning liquid to the surface to be processed WF-a of the substrate WF via the nozzle 268.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A control device of a substrate processing apparatus is configured to execute: calculating patterns for changing an order of loading to the substrate processing apparatus for multiple substrates loaded to the substrate processing apparatus; generating, for each obtained pattern, a time table in which process end times in the polishing device, the cleaning device, and the transport device are associated, so that an idling state does not occur from a time when the substrates are loaded to the substrate processing apparatus until a cleaning process ends; selecting a time table with a shortest time from a time when a process of a substrate initially loaded to the substrate processing apparatus starts until a process of a lastly loaded substrate ends in the obtained time tables; and controlling timings of loading the substrates to the substrate processing apparatus based on the selected time table.
G05B 19/4155 - Numerical control (NC), i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction, the plating method including: a step for rotating the substrate holder at a first rotation speed in a state in which the substrate holder is inclined; a step for discharging a liquid towards the substrate holder rotating at the first rotation speed so that the liquid is fed to the contact member; a step for stopping the discharging of the liquid; a step for beginning, before or within a prescribed time after the discharging of the liquid is stopped, to reduce the incline of the substrate holder towards a horizontal position; a step for rotating the substrate holder at a second rotation speed higher than the first rotation speed, in a state in which the substrate holder is in the horizontal position; and a step for performing the plating process on the substrate after the substrate has been mounted on the substrate holder.
[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-point detection function for detecting that a chemical mechanical polishing process has reached the end point. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires reliability decrease cause state information during a chemical mechanical polishing process being performed on a substrate by a substrate processing device 2, the reliability decrease cause state information including at least one of wear state information indicating the state of wear of a constituent element of the substrate processing device 2, and processing state information indicating processing state during the polishing process; and a state prediction unit 501 that inputs the reliability decrease cause state information acquired by the information acquisition unit 500 into a learning model that has learned, by machine learning, the correlation between the reliability decrease cause state information and reliability information of a polishing end-point detection function indicating the reliability of an end-point detection function for detecting that the chemical mechanical polishing process has reached an end point, thereby predicting the reliability information of the polishing end-point detection function with respect to the reliability decrease cause state information.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
The present invention relates to a filler application device that applies a filler to a gap formed between the edge parts of a plurality of boards that constitute a laminated board. This filler application device (100) comprises: a board holding unit (33) that holds and rotates a laminated board (Ws) manufactured by joining a first board (W1) and a second board (W2); an application device (39) that is disposed away from the laminated board (Ws) held by the board holding unit (33), and discharges a filler (F) toward a gap (G) formed between the peripheral edge of the first board (W1) and the peripheral edge of the second board (W2); and a protector (12) that prevents the attachment of liquid splash (Fs) of the filler (F) that occurs when the filler (F) discharged from the application device (39) collides with the gap (G) on the top surface and/or the bottom surface of the laminated board (Ws).
A polishing apparatus is disclosed, which is capable of heating and maintaining a temperature distribution of a polishing pad at a predetermined temperature distribution with a simple structure. The polishing apparatus has a pad-temperature regulating apparatus for regulating a temperature of a polishing surface, and the pad-temperature regulating apparatus includes a heating-fluid nozzle arranged above and spaced apart from the polishing surface. The heating-fluid nozzle includes: a nozzle body; a slit formed along a longitudinal direction of the nozzle body for ejecting a heating fluid toward the polishing surface; a header tube which is formed within the nozzle body and into which the heating fluid is supplied; a buffer tube which is formed within the nozzle body and communicates with the slit, and a plurality of branch tubes for coupling the header tube to the buffer tube.
One object of the present disclosure is to suppress or prevent a plating solution from entering a sealed space of a substrate holder and to detect entry of the plating solution promptly. There is provided a substrate holder configured to hold a substrate and cause the substrate to come into contact with a plating solution and to be plated. The substrate holder comprises an internal space configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside of the substrate holder, in a state that the substrate is held by the substrate holder; a first passage configured to connect the outside of the substrate holder with the internal space and to introduce a liquid into the internal space; and a detector placed in the internal space and configured to monitor an electric current flowing in the liquid or an electric resistance of the liquid during plating in a state that the liquid is introduced into the internal space and thereby detect a leakage of the plating solution to the internal space.
An object of the invention is to provide a bearing apparatus which is superior in corrosion resistance against a fluorine gas, and superior in dimensional accuracy and durability. For achieving the object, a bearing apparatus for use in an environment where a fluorine gas exists is provided. The bearing apparatus comprises: a magnetic bearing comprising a magnetic member and an electromagnetic coil; and a touchdown bearing for protecting the magnetic bearing, wherein the touchdown bearing comprises an inner ring, an outer ring, and plural rolling members arranged between the inner ring and the outer ring, wherein the inner ring and the outer ring in the touchdown bearing are constructed by using a NiCrAl alloy.
F16C 32/04 - Bearings not otherwise provided for using magnetic or electric supporting means
H01S 3/036 - Means for obtaining or maintaining the desired gas pressure within the tube, e.g. by gettering or replenishing; Means for circulating the gas, e.g. for equalising the pressure within the tube
56.
INFORMATION PROCESSING DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, AND MACHINE LEARNING METHOD
The present invention relates to an information processing device, a machine learning device, an information processing method, and a machine learning method. An information processing device (5) comprises: a fluid supply information acquisition unit (500) for, in a substrate process performed by a substrate processing device provided with a processing member which is to be brought into contact with a substrate and which performs a prescribed substrate process thereon and a processing fluid supply unit for supplying a processing fluid to the substrate or to the processing member, acquiring fluid supply information that includes processing fluid state information indicating the supply state of the processing fluid to be supplied from the processing fluid supply unit; and a fluid distribution information generation unit (501) for generating, on the basis of the fluid supply information acquired by the fluid supply information acquisition unit (500), fluid distribution information indicating the distribution state when the processing fluid supplied from the processing fluid supply unit is distributed while passing through a position of contact between the substrate and the processing member.
A surface property judging method and a surface property judging system for a polishing pad capable of appropriately judging a surface property of the polishing pad are disclosed. The surface property judging method includes: rotating a polishing table together with a polishing pad which is supported by the polishing table; generating surface data by a surface data generator, the surface data containing a plurality of shape index values representing a surface property of the polishing pad; producing a histogram indicating a distribution of the plurality of shape index values based on the surface data; and judging the surface property of the polishing pad based on the histogram.
G01B 21/30 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
59.
METHOD AND APPARATUS FOR CLEANING WASHING TOOL, SUBSTRATE WASHING DEVICE, AND METHOD FOR MANUFACTURING WASHING TOOL
A cleaning apparatus performing cleaning treatment for a washing tool used for substrate washing by causing the washing tool to contact with a cleaning member while supplying a washing liquid to the washing tool includes a liquid extraction unit that extracts the washing liquid remaining in the washing tool or the washing liquid flowing out from the washing tool in the cleaning treatment, a color reaction unit that applies an iodine color reaction to the washing liquid extracted by the liquid extraction unit, and a determination unit that detects a coloration degree of the washing liquid subjected to the iodine color reaction and determines whether or not cleaning of the washing tool is completed based on the detected coloration degree.
A polishing method for a wafer using a polishing head having a plurality of pressure chambers formed by an elastic membrane is disclosed. The polishing method includes: forming a positive pressure in a first pressure chamber and forming a negative pressure in a second chamber to move fluid present between an upper surface of the wafer and the first pressure chamber outward; then forming a positive pressure in the second chamber and forming a negative pressure in a third pressure chamber to move the fluid present between the upper surface of the wafer and the second pressure chamber outward; then forming a positive pressure in outermost pressure chamber of the plurality of pressure chambers to move the fluid present between the upper surface of the wafer and the outermost pressure chamber outward to thereby cause the fluid to flow out from the upper surface of the wafer; and then pressing a lower surface of the wafer against a polishing surface with the elastic membrane to polish the lower surface of the wafer.
The present invention relates to a substrate production method and a substrate production apparatus. A substrate production method according to the present invention comprises: a step in which a filler (F) is applied to a space between a bevel part of a first substrate (W1) and a bevel part of a second substrate (W2); and a step in which air bubbles are removed from the filler (F) that has been applied to the space.
The present invention relates to a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method. A substrate holding device (1) comprises a holding roller (51) and a fluid blowing device (60) that blows pressurized fluid out to a bevel section (B) held by the holding roller (51).
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
To provide a technique that allows accurately measuring a polishing state of a substrate.
To provide a technique that allows accurately measuring a polishing state of a substrate.
A polishing apparatus 100 includes: a sensor head 40 that includes a projector configured to project incident light, a condenser configured to condense the incident light projected from the projector and cause the incident light to be incident on a substrate Wf, and an optical receiver configured to receive reflected light reflected by the substrate; a displacement mechanism 60 configured to relatively displace the condenser with respect to the substrate to change a distance between the condenser and the substrate; an abrade amount measurement device 70 configured to measure an abrade amount of a polishing pad 90; and a control device 80. The control device is configured to measure a polishing state of the substrate based on a light amount parameter of the reflected light received by the optical receiver and control the displacement mechanism based on the abrade amount of the polishing pad measured by the abrade amount measurement device such that the distance between the condenser and the substrate is maintained at a preliminarily set reference distance.
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
64.
FLUID-PATH SWITCHING APPARATUS AND METHOD OF PREVENTING IDLING ROTATION OF SUBMERSIBLE PUMP
The present invention relates to a technique of preventing idling rotation of a submersible pump used for delivering liquefied gas, such as liquefied ammonia, liquid hydrogen, liquid nitrogen, liquefied natural gas, liquefied ethylene gas, or liquefied petroleum gas. A fluid-path switching apparatus (5) includes: a flow-passage structure (45) having a first flow passage (41), a second flow passage (42), and a third flow passage (43); and a valve element (47) for allowing the third flow passage (43) to selectively communicate with the first flow passage (41) or the second flow passage (42). The first flow passage (41) communicates with a discharge outlet (1b) of the submersible pump (1), the second flow passage (42) communicates with an interior of the suction vessel (2), and the third flow passage (43) communicates with a discharge port (8) of the suction vessel (2).
A machine learning apparatus (4) generates a learning model (6) to be used in a sliding-surface diagnosis apparatus (1A) for diagnosing a condition of sliding surfaces of a fixed-side sliding member and a rotation-side sliding member. The machine learning apparatus (4) includes: a learning-data memory (41) configured to store learning data including input data containing at least data on motor current value in a predetermined period, data on contact electric resistance in the predetermined period, and data on vibration (AE wave or acceleration) in the predetermined period; a machine learning section (42) configured to input the learning data to the learning model (6) to cause the learning model (6) to learn a correlation between the input data and diagnostic information of the sliding surfaces; and a learned-model memory (43) configured to store the learning model (6) that has learned by the machine learning section (42).
F16N 29/04 - Special means in lubricating arrangements or systems providing for the indication or detection of undesired conditions; Use of devices responsive to conditions in lubricating arrangements or systems enabling moving parts to be stopped
F16C 17/24 - Sliding-contact bearings for exclusively rotary movement characterised by features not related to the direction of the load with devices affected by abnormal or undesired conditions, e.g. for preventing overheating, for safety
66.
TRANSFER APPARATUS, CLEANING MODULE, AND SUBSTRATE PROCESSING APPARATUS
To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.
To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.
A cleaning module includes a first transfer mechanism 210-1, an ultrasonic cleaning tank 440, a transfer machine 420, and a second transfer mechanism 210-2. The first transfer mechanism 210-1 is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release position 418 on a downstream side along a transfer passage 405. The ultrasonic cleaning tank 440 is disposed at a position spaced apart from the transfer passage 405 and is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machine 420 is for transferring the substrate WF between the substrate grip or release position 418 of the transfer passage 405 and the ultrasonic cleaning tank 440. The second transfer mechanism 210-2 is for transferring the substrate WF transferred to the substrate grip or release position 418 from the ultrasonic cleaning tank 440 by the transfer machine 420 to further downstream along the transfer passage 405.
B08B 1/02 - Cleaning travelling work, e.g. a web or articles on a conveyor
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
There is provided a substrate holder configured to hold a substrate such that the substrate is exposed to and is brought into contact with a plating solution to be plated. The substrate holder comprises a contact that comes into contact with a seed layer formed on a surface of the substrate to feed electricity; a protective electrode that is biased to a higher potential side relative to the contact or that comprises a material having a lower spontaneous potential than a spontaneous potential of the seed layer and that is electrically connected with the seed layer directly or via an electrical conductor; and a holder main body provided with an internal space being configured to place therein an outer circumferential portion of the substrate, the contact and the protective electrode such as to be sealed from outside of the substrate holder in a state that the substrate is held by the substrate holder and configured to store therein a liquid that covers at least part of the protective electrode and at least a contact location between the seed layer and the contact.
The present invention constructs, in an AM system, such an environment that fine particles are prevented from scattering from an area where the fine particles such as a powder material can be present to another area. According to one aspect, an AM system configured to manufacture a fabrication object is provided. This AM system includes a fabrication chamber in which an AM apparatus is disposed, and a buffer chamber in communication with the fabrication chamber. The buffer chamber includes an entrance in communication with a surrounding environment, an exit in communication with the fabrication chamber, a grating floor, and an exhaust port. The AM system further includes a first gate configured to be able to open and close the entrance of the buffer chamber, and a second gate configured to be able to open and close the exit of the buffer chamber.
B22F 12/00 - Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
B22F 10/322 - Process control of the atmosphere, e.g. composition or pressure in a building chamber of the gas flow, e.g. rate or direction
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
69.
RETAINER, TOP RING, AND SUBSTRATE PROCESSING APPARATUS
A retainer is disposed around a holding region 39 of a polygonal substrate WF in a top ring for holding the polygonal substrate WF with a surface to be polished facing downward. The retainer 30 includes a plurality of retainer main bodies 3 disposed around the holding region 39 independently along respective sides of the polygonal substrate WF. At least one of the plurality of retainer main bodies 3 includes a first securing surface (first surface 3a), a first opposed surface (second surface 3b), a second securing surface (third surface 3c), and a second opposed surface (fourth surface 3d). The first securing surface is securable to a retainer holding member 37 of the top ring, the first opposed surface is opposed to the holding region 39 in a first state where the first securing surface is secured to the retainer holding member 37, the second securing surface is securable to the retainer holding member 37 in a second state where the retainer main body 3 is rotated by 180 degrees from the first state, and the second opposed surface is opposed to the holding region 39 in a state where the second securing surface is secured to the retainer holding member 37.
Provided is a structure that reduces a risk of affecting a mounting mechanism of a retainer member when a substrate collides with the retainer member.
Provided is a structure that reduces a risk of affecting a mounting mechanism of a retainer member when a substrate collides with the retainer member.
According to one embodiment, a head for holding a polygonal substrate is provided. The head includes a substrate support surface, a retainer member, and a retainer guide. The substrate support surface has a shape corresponding to a shape of the polygonal substrate. The retainer member is disposed outside each side of the substrate support surface. The retainer guide is configured to support the retainer member. The retainer member has an engaging surface extending in a direction perpendicular to the substrate support surface, and the engaging surface of the retainer member engages with the retainer guide.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present invention improves the in-plane uniformity of a plating film that is formed on a polygonal substrate. A plating apparatus according to the present invention is provided with: a plating bath; a substrate holder which is configured so as to hold a polygonal substrate; an anode which is arranged within the plating bath so as to face the substrate that is held by the substrate holder; and an anode mask which delimits an opening that corresponds to the outer shape of the polygonal substrate. The anode mask comprises: a first mask member that delimits a first projection, which protrudes toward the center of the opening, at the central part of a first opening side of the opening, the first opening side corresponding to a first side of the polygonal substrate; and a second mask member that delimits a second projection, which protrudes toward the center of the opening, at the central part of a second opening side of the opening, the second opening side corresponding to a second side of the polygonal substrate. Meanwhile, the anode mask is configured such that the distance between the first mask member and the second mask member is able to be adjusted.
This water detecting device, for detecting a state of generation of water present on a surface of a target object which is installed in an ambient environment and through the interior of which water flows, comprises: a target object temperature and humidity sensor for detecting a temperature and humidity of the target object; an environmental temperature and humidity sensor for detecting a temperature and humidity of the ambient environment; and a determining unit for determining whether or not water has been generated, and the cause of generation of the water, on the basis of target object temperature and humidity information indicating a change over time in the temperature and humidity detected by the target object temperature and humidity sensor, and ambient environment temperature and humidity information indicating a change over time in the temperature and humidity detected by the environmental temperature and humidity sensor.
A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.
B24B 37/16 - Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
B24B 1/04 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
B24B 17/08 - Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving fluid transmission means only
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
74.
ANODE CHAMBER LIQUID MANAGEMENT METHOD, AND PLATING APPARATUS
An anode chamber liquid management method comprising: a step for preparing a plating tank in which an anode and a diaphragm in contact with or attached firmly to the upper surface of the anode are arranged, and which is provided with a cathode chamber and an anode chamber partitioned above and below by the diaphragm, and an exhaust passage that is connected to the anode chamber and that is for discharging air bubbles from the anode chamber to the outside of the plating tank; a step for holding a plating liquid in the anode chamber and the cathode chamber such that the liquid level that is of the plating liquid in the exhaust passage and that is equal to the liquid level of the plating liquid in the anode chamber becomes lower than the liquid level of the plating liquid in the cathode chamber; a step for determining whether the height of the liquid level of the plating liquid in the exhaust passage is lower than a prescribed height, on the basis of an output of a liquid level sensor disposed in the exhaust passage; and a step for feeding pure water or an electrolytic solution to the anode chamber when the height of the liquid level of the plating liquid in the exhaust passage is determined as being lower than the prescribed height.
With the present invention, a pre-treatment of a substrate is efficiently performed, and also adhesion of air bubbles to a surface to be treated of the substrate is suppressed. This pre-wetting module 200 includes a deaeration tank 210 which is configured to accommodate a deaeration liquid, a cleaning device 260 which is disposed above the deaeration tank 210 and configured to supply a cleaning liquid downward, a substrate holder 220 which is disposed between the deaeration tank 210 and the cleaning device 260 and has a first holding member 222 configured to hold a first substrate WF-1 and a second holding member 224 configured to hold a second substrate WF-2, and a drive mechanism 230 which is configured to rotate and raise/lower the substrate holder 220, wherein the first holding member 222 and the second holding member 224 are configured to be able to hold the first substrate WF-1 and the second substrate WF-2 in such a manner that when a surface to be treated WF-1a of the first substrate WF-1 is tilted with respect to a horizontal plane to face the surface of the deaeration liquid in the deaeration tank 210, a surface to be treated WF-2a of the second substrate WF-2 horizontally faces the cleaning device 260 at the same time.
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A steam turbine includes a high pressure stage, a low pressure stage, and a controller operatively connected to at least the low pressure stage. The low pressure stage includes a first low pressure section having a sensor configured for detecting operation data of the first low pressure section, and at least one second low pressure section. The controller is programmed or configured to receive the operation data from the first sensor during operation of the first low pressure section and determine at least one performance characteristic of the first low pressure section based on the operation data. The controller is further programmed or configured to turn off the first low pressure section when the at least one performance characteristic of the first low pressure section is outside a predetermined performance threshold, and turn on the second low pressure section. A method of operating the steam turbine is also disclosed.
F01K 13/02 - Controlling, e.g. stopping or starting
F01K 7/16 - Steam engine plants characterised by the use of specific types of engine; Plants or engines characterised by their use of special steam systems, cycles or processes; Control means specially adapted for such systems, cycles or processes; Use of withdrawn or exhaust steam for feed-water heating the engines being only of turbine type
F01K 3/18 - Plants characterised by the use of steam or heat accumulators, or intermediate steam heaters, therein having heaters
F01D 17/00 - Regulating or controlling by varying flow
F01D 19/00 - Starting of machines or engines; Regulating, controlling, or safety means in connection therewith
Provided is a plating device with which it is possible to clean a contact cleaning member. The plating device includes: a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate in which the surface to be plated is facing downwards, the substrate holder having a contact member for supplying power to the substrate; a contact cleaning member 482 for discharging a cleaning solution towards the contact member when at a cleaning position between the plating tank and the substrate holder; a drive mechanism 476 configured to move the contact cleaning member 482 between a cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover the upper part of the contact cleaning member 482 when the contact cleaning member 482 is at the retracted position.
An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid to a contact member of a substrate holder, after a substrate held by the substrate holder is immersed in a plating liquid to perform plating; a measuring step 122 for measuring the electrical conductivity of the washing liquid after the contact member is washed; and a determination step 128 for determining the presence or absence of a plating liquid leak to the region where the contact member is disposed, on the basis of a comparison between a first electrical conductivity of the washing liquid, measured in advance for a reference substrate holder, and a second electrical conductivity of the washing liquid, measured in the measurement step 122.
The present invention pertains to a pump operation assistance method and a pump operation assistance device. This pump operation assistance method comprises: a performance characteristic acquisition step for acquiring a flowrate-total head representative performance curve and a rated rotational speed during a rated operation as performance characteristics of a device to be assisted and identified by a model number of a pump device; an installation state acquisition step for acquiring a real head as an installation state of the device to be assisted; an operation state acquisition step for acquiring an operation frequency, suction pressure, and discharge pressure as an operation state of the device to be assisted; and a first operation assistance step for calculating an operation condition during a reference operation when the device to be assisted is operated in the installation state and the operation state. In the first operation assistance step, the flowrate and the total head during the reference operation are calculated on the basis of the performance characteristics, the installation state, and the operation state.
The present invention pertains to a pump device for raising the pressure of liquid hydrogen, and particularly, to a pump device comprising a thrust balance mechanism for canceling axial thrust applied to an impeller. This pump device comprises: a rotary shaft (1); a plurality of impellers (2a-2h) fixed to the rotary shaft (1); bearings (5, 6) which rotatably support the rotary shaft (1); a pump casing (7) which accommodates the plurality of impellers (2a-2h); and a first thrust balance mechanism (20) and a second thrust balance mechanism (40) which cancel the own weight of a rotary body including the rotary shaft (1) and the plurality of impellers (2a-2h), and the axial thrust acting on the plurality of impellers (2a-2h).
The present invention provides a powder supply apparatus. According to one aspect, a powder supply apparatus is provided. The powder supply apparatus includes a container configured to store powder therein, a supply passage configured to supply the powder to the container therethrough, and a valve mechanism configured to open and close the supply passage thereby. The valve mechanism includes a valve main body movable between a first position, at which the valve main body closes the supply passage, and a second position, at which the valve main body opens the supply passage, and further includes a valve seat configured in such a manner that the valve main body is seated thereon. The valve main body includes a first seal portion and a second seal portion. The valve seat includes a first seat portion on which the first seal portion is seated, and a second seat portion on which the second seal portion is seated. The valve mechanism defines a space sealingly closed when the first seal portion is seated on the first seat portion and the second seal portion is seated on the second seat portion. The valve mechanism includes an exhaust passage configured to exhaust gas from the sealingly closed space therethrough and a pressure monitoring passage configured to be used to monitor a pressure in the sealingly closed space.
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
Provided are a plating apparatus and a plating method for preventing or mitigating electric field diversion irrespective of the physical or mechanical structure. According to one embodiment, provided is a plating apparatus comprising: a substrate holder configured so as to hold a substrate; a plating bath configured so as to accommodate the substrate holder which holds the substrate, and provided with a first tank on a first surface side of the substrate and a second tank on a second surface side of the substrate, the first tank and the second tank communicating with each other with a gap therebetween; a first anode electrode arranged in the first tank of the plating bath; a first power source configured so as to supply a plating current between the substrate and the first anode electrode; an auxiliary anode electrode arranged on the first tank side of the gap; an auxiliary cathode electrode arranged on the second tank side of the gap; and an auxiliary power source configured so as to supply an auxiliary current between the auxiliary anode electrode and the auxiliary cathode electrode.
Provided is a method of evaluating a deviation of a trajectory of a primary electron beam in a primary optical system in an electron beam observation device including the primary optical system that irradiates a sample with the primary electron beam including a plurality of primary electrons and a secondary optical system that detects, by a detector, a secondary electron beam including a plurality of secondary electrons emitted from the sample irradiated with the primary electron beam.
G01N 23/2251 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by measuring secondary emission from the material using electron or ion microprobes using incident electron beams, e.g. scanning electron microscopy [SEM]
To provide a technology with which it is possible to suppress uneven film thickness of the outer edge of a substrate. This plating device 1 comprises a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a-60d, a bus bar 61 having a power supply portion 62 to which electricity is supplied and a plurality of connection portions 63 connected to the at least one auxiliary anode and arranged in the extending direction of the auxiliary anode, and at least one ion resistor 80a-80d. The ion resistor is configured such that the resistivity of the ion resistor increases with proximity to the power supply portion in the extending direction of the ion resistor.
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing head (1).
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
87.
RESISTOR FOR PLATING APPARATUSES, AND PLATING APPARATUS
The present invention provides: a resistor which makes it possible to improve the uniformity of a plating film that is formed on a substrate; and the like. The present invention provides a resistor for plating apparatuses for electric field control, the resistor being arranged between an anode and a holder, which holds an object to be plated, in a plating apparatus. This resistor for plating apparatuses comprises: a first resistive member which has a first surface and a plurality of first through holes that open to the first surface; and a second resistive member which has a second surface and a plurality of second through holes that open to the second surface. The first resistive member and the second resistive member are arranged such that the first surface and the second surface face each other; and this resistor for plating apparatuses is configured such that the size of overlappings of the plurality of first through holes and the plurality of second through holes is variable.
This machine learning method includes performing: dataset splitting processing for dividing a period into a learning period and a validation period, and splitting a dataset into learning data and validation data; learning candidate period division processing for dividing a learning candidate period into a plurality of split learning periods; learning period evaluation processing for generating a learning period evaluation model for each split learning period, using a learning model corresponding to the split learning period, and using the verification data to calculate an evaluation index of the learning period evaluation model for each split learning period; learning period selection processing for repeating the learning candidate period division processing and the learning period evaluation processing until a predetermined end condition is satisfied, and when the end condition is satisfied, selecting a split learning period having a high evaluation index as a learning target period; and model output processing for outputting a learning model obtained by performing machine learning employing the learning data corresponding to the learning target period.
This dry-up method introduces a purge gas into a suction container (2A) of a pump device (100A), causes the purge gas to pass through a flow path switching device (5A) within the suction container (2A) while causing the purge gas to bypass a submerged pump (1A) within the suction container (2A), introduces, into a suction container (2B) of a pump device (100B), the purge gas that has been passed through the flow path switching device (5A), and causes the purge gas to pass through a flow path switching device (5B) within the suction container (2B) while causing the purge gas to bypass a submerged pump (1B) within the suction container (2B).
F04D 13/08 - Units comprising pumps and their driving means the pump being electrically driven for submerged use
F04D 7/02 - Pumps adapted for handling specific fluids, e.g. by selection of specific materials for pumps or pump parts of centrifugal type
F04D 13/14 - Combinations of two or more pumps the pumps being all of centrifugal type
F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
90.
SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURING APPARATUS FOR PLATING
There is provided a substrate holder configured to hold a substrate in an apparatus for plating. The substrate holder comprises a seal configured to seal an outer peripheral part of the substrate and provided with a first opening which a surface to be plated or a plating surface of the substrate is exposed on; and a seal ring holder configured to hold the seal and provided with a second opening which the plating surface of the substrate is exposed on, wherein an opening diameter ratio that is a ratio of an opening diameter of the second opening to an opening diameter of the first opening is in a range of not lower than 99.32% and not higher than 99.80%.
A substrate polishing method capable of reducing an influence of variation in spectrum of reflected light from a substrate, such as a wafer, and determining an accurate film thickness is disclosed. The method includes: polishing a surface of a substrate by pressing the substrate against a polishing pad on a rotating polishing table; producing a spectrum of reflected light from the surface of the substrate each time the polishing table makes one rotation; creating a three-dimensional data containing a plurality of spectra arranged along polishing time; and determining a film thickness of the substrate based on the three-dimensional data.
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 37/013 - Devices or means for detecting lapping completion
One object is to suppress a substrate from being dried in the course of releasing the substrate from a substrate holding member in an apparatus for polishing. There is provided the apparatus for polishing, comprising: a polishing table configured to support a polishing pad; a substrate holding member having a substrate holding surface and a pressure chamber, which are made of an elastic membrane, wherein the pressure chamber has a plurality of areas arranged concentrically and a substrate is pressed against the polishing pad by a pressure in the pressure chamber; a pressure regulator configured to regulate a pressure of a gas that is supplied to the pressure chamber of the substrate holding member; one or a plurality of release nozzles configured to inject a pressurized fluid; and a control device configured to perform a substrate release process of releasing the substrate from the elastic membrane, the substrate release process controlling the pressure regulator to pressurize entirety of the elastic membrane by pressurizing all the areas in the pressure chamber and subsequently pressurize a center portion of the elastic membrane by pressurizing the pressure chamber such as to make a pressure in one or multiple areas on a center side, which include an area at a center of the pressure chamber, higher than pressures in other areas, wherein meanwhile the substrate release process controls the one or plurality of release nozzles to inject the pressurized fluid to a contact location between the elastic membrane and the substrate.
A method for estimating a life of a polishing pad includes: polishing a workpiece by pressing the workpiece against a polishing surface of a polishing pad with an elastic membrane forming a pressure chamber provided in a polishing head; controlling a pressure in the pressure chamber on the basis of a measured value of a film thickness of the workpiece while measuring the film thickness during the polishing of the workpiece; inputting time-series pressure data representing a change in the pressure in the pressure chamber during the polishing of the workpiece into a learned model; and outputting a life index of the polishing pad from the learned model.
The present invention relates to a start-up method for submerged pumps used for transferring liquefied gas. In the present method, a submerged pump (1A) disposed in an intake container (2A) of a pump device (100A) is started up, liquefied gas is transferred to an intake container (2B) of a pump device (100B) via a flow path switching device (5A) in the intake container (2A), the liquefied gas is made to bypass a submerged pump (1B) disposed in the intake container (2B) and to pass through a flow path switching device (5B) in the intake container (2B), and thereafter, the submerged pump (1B) is started up.
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a polishing surface; a top ring for holding a substrate and pressing the substrate against the polishing surface; and a vertical movement mechanism for vertically moving the top ring. The method includes: an acquisition step for acquiring information relating to a thickness of the substrate; a position adjustment step for adjusting a height position of the top ring relative to the polishing table on the basis of the acquired information relating to the thickness of the substrate; and a polishing step for polishing the substrate by supplying a pressurized fluid to a pressure chamber of the top ring to press the substrate against the polishing surface.
B24B 37/005 - Control means for lapping machines or devices
B24B 37/013 - Devices or means for detecting lapping completion
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 47/22 - Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
An objective of the present invention is to provide a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a first potential sensor disposed at a first position in a region between a substrate held by a substrate holder and an anode, a second potential sensor disposed at a second position outside the region between the substrate held by the substrate holder and the anode, and a third potential sensor disposed at a third position different from the second position and outside the region between the substrate held by the substrate holder and the anode. The plating apparatus measures a first potential difference that is a potential difference between the first position and the second position, and a second potential difference that is a potential difference between the second position and the third position and measures a film thickness of the plating film based on a difference between the first potential difference and the second potential difference.
The present invention makes it possible to clean the bottom surface of a substrate. Provided is a substrate cleaning device comprising: a first scrub-cleaning member that scrub-cleans the bottom surface of a substrate to be cleaned; a first single-tube nozzle that supplies a cleaning liquid to the vicinity of the center of the bottom surface of the substrate; and a first spray nozzle that supplies the cleaning liquid to the bottom surface of the substrate.
An information processing device includes: an information acquiring part configured to acquire plating process information including operational motion information including target paddle motion information indicating an agitating motion of a target paddle corresponding to a paddle to be processed, plating solution motion information indicating a motion of supplying a plating solution to a plating tank, and carrier machine motion information indicating a motion of carrying a substrate and operational-motion paddle vibration information indicating vibration characteristics of the target paddle when an operational motion is performed, the motions being operational motions performed by a substrate plating device; and an information generating part configured to generate agitating-motion paddle vibration information in response to the plating process information by inputting the plating process information acquired by the information acquiring part to a learning model which has learned a correlation between the plating process information and the agitating-motion paddle vibration information using machine learning.
The present invention relates to a technique of determining a time to replace a polishing pad used in a polishing apparatus for polishing a workpiece, such as wafer, substrate, or panel. A polishing apparatus (1) includes: a polishing table (5) configured to support a polishing pad (2); a polishing head (7) configured to press a workpiece (W) against a polishing surface (2a) of the polishing pad (2); a dresser (40) configured to dress the polishing surface (2a) of the polishing pad (2); a detection sensor (60) configured to detect friction between the dresser (40) and the polishing pad (2), the detection sensor (60) being fixed to the dresser (40); and a wear monitoring device (63) configured to determine a wear index value from a plurality of output values of the detection sensor (60) and generate an alarm signal when the wear index value is smaller than a predetermined lower limit.
