Ebara Corporation

Japon

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Type PI
        Brevet 1 985
        Marque 89
Juridiction
        États-Unis 1 333
        International 704
        Canada 28
        Europe 9
Propriétaire / Filiale
[Owner] Ebara Corporation 1 973
Elliott Company 88
Hyosung GoodSprings, Inc. 6
Ebara International Corporation 5
Elliott Ebara Turbomachinery Corporation 2
Date
Nouveautés (dernières 4 semaines) 23
2024 juin (MACJ) 14
2024 mai 17
2024 avril 13
2024 mars 22
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Classe IPC
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe 273
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants 253
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique 164
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage 153
C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir 152
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Classe NICE
07 - Machines et machines-outils 64
09 - Appareils et instruments scientifiques et électriques 48
37 - Services de construction; extraction minière; installation et réparation 42
42 - Services scientifiques, technologiques et industriels, recherche et conception 35
11 - Appareils de contrôle de l'environnement 34
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Statut
En Instance 254
Enregistré / En vigueur 1 820
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1.

CLEANING APPARATUS AND POLISHING APPARATUS

      
Numéro d'application 18444981
Statut En instance
Date de dépôt 2024-02-19
Date de la première publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Miyazaki, Mitsuru
  • Fujimoto, Tomoaki
  • Fukaya, Koichi
  • Oikawa, Fumitoshi
  • Inoue, Takuya

Abrégé

A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

Classes IPC  ?

  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
  • B08B 1/32 - utilisant des éléments de nettoyage rotatifs
  • B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
  • B24B 7/22 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière des objets non métalliques à meuler pour meuler de la matière inorganique, p.ex. de la pierre, des céramiques, de la porcelaine
  • H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces

2.

PLATING DEVICE

      
Numéro d'application JP2022045415
Numéro de publication 2024/122043
Statut Délivré - en vigueur
Date de dépôt 2022-12-09
Date de publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Seki, Masaya

Abrégé

The present invention suppresses sagging of a central section of a paddle in a cup-type plating device. The present invention includes: a plating bath 410 for accommodating a plating liquid; an anode disposed within the plating bath 410; a substrate holder configured so as to retain a substrate Wf in a state in which a surface to be plated Wf-a is facing downward; a paddle 460 disposed between the anode and the substrate Wf; a drive mechanism 462 configured so as to support a base section 460A of the paddle 460 and cause the paddle 460 to move reciprocally along the surface to be plated Wf-a of the substrate Wf; a first magnet 464 provided on the paddle 460; and a second magnet 468 provided so as to face the first magnet 464. The first magnet 464 and the second magnet 468 are configured so as to mutually exert magnetic force so that a central section 460C of the paddle 460 between the base section 460A and a tip section 460B approaches the surface to be plated Wf-a of the substrate Wf.

Classes IPC  ?

  • C25D 21/10 - Agitation des électrolytes; Déplacement des claies
  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 7/12 - Semi-conducteurs
  • H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique

3.

SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023041941
Numéro de publication 2024/122339
Statut Délivré - en vigueur
Date de dépôt 2023-11-22
Date de publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yamanobe Hokuto
  • Kobayashi Kenichi
  • Yazawa Akihiro
  • Ishikawa Sho

Abrégé

This substrate processing device comprises a plurality of polishing modules for polishing a substrate, and a transport unit for moving the substrate between the plurality of polishing modules. The plurality of polishing modules include a first module group and a second module group. In plan view, the transport unit is positioned between the first module group and the second module group. The first module group has a first upper-side lane and a first lower-side lane in which at least two polishing modules are arranged adjacent to one another. The second module group has a second upper-side lane and a second lower-side lane in which at least two polishing modules are arranged adjacent to one another.

Classes IPC  ?

  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 7/00 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet
  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail

4.

METHOD OF DETECTING LEAKAGE

      
Numéro d'application 18494563
Statut En instance
Date de dépôt 2023-10-25
Date de la première publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Nagasawa, Yosuke
  • Sato, Tensei
  • Koizumi, Ryuya

Abrégé

There is provided a method of detecting a leakage of a substrate holder in an apparatus for plating. The method of detecting the leakage comprises: placing the substrate holder that holds a substrate, into a tank that is filled with a liquid; supplying a gas into an internal space of the substrate holder that seals an outer circumferential portion of the substrate; and taking an image of the liquid surrounding the substrate holder in a state that the internal space of the substrate holder is pressurized by the gas and analyzing one or a plurality of taken images to determine presence or absence of gas bubbles in the liquid and thereby detect a leakage of the substrate holder.

Classes IPC  ?

  • G01M 3/06 - Examen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite par observation de bulles dans un bassin empli de liquide

5.

POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD

      
Numéro d'application 18553127
Statut En instance
Date de dépôt 2022-02-17
Date de la première publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Namiki, Keisuke

Abrégé

The present invention relates to a polishing pad and a polishing apparatus for use in polishing of a substrate, such as a wafer. Further, the present invention relates to a method of polishing a substrate, such as a wafer. At least a part of the polishing pad (30) is made of a light transmissive material (34) and a light reactive material (35). The light reactive material (35) is mixed into the light transmissive material (34).

Classes IPC  ?

  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 37/20 - Tampons de rodage pour travailler les surfaces planes

6.

TRANSPORT DEVICE AND SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2022045030
Numéro de publication 2024/121960
Statut Délivré - en vigueur
Date de dépôt 2022-12-07
Date de publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Seki, Masaya
  • Yamada, Nobuya
  • Tomita, Masaki

Abrégé

The present invention increases a transport speed of a substrate and suppress attachment of particles to a processed surface of the substrate. This transport device configured to transport the substrate in an elevation direction and a travel direction orthogonal to the elevation direction comprises a mounting member 710-1 that is fixed to a side surface of a first module frame 402A for installing a plating module having substrate loading/unloading ports 404-1 to 404-8. The mounting member 710-1 includes plurality of travel rails 714-1 to 714-3 disposed on both sides of the substrate loading/unloading ports 404-1 to 404-8 in the elevation direction and extending in the travel direction. The transport device includes an elevation rail 716 extending in the elevation direction crossing over the plurality of travel rails 714-1 to 714-3 and being movable along the plurality of travel rails 714-1 to 714-3 and a transport robot 718 capable of being elevated along the elevation rail 716 and having a hand for holding the substrate.

Classes IPC  ?

  • H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail

7.

METHOD OF ADJUSTING PLATING MODULE

      
Numéro d'application 17781363
Statut En instance
Date de dépôt 2021-03-05
Date de la première publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Masuda, Yasuyuki
  • Hiwatashi, Ryosuke
  • Shimoyama, Masashi

Abrégé

There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

Classes IPC  ?

  • C25D 21/12 - Commande ou régulation
  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 17/08 - Claies
  • C25D 21/10 - Agitation des électrolytes; Déplacement des claies

8.

PLATING APPARATUS AND RINSE PROCESS METHOD

      
Numéro d'application 17781356
Statut En instance
Date de dépôt 2021-09-10
Date de la première publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Tsuji, Kazuhito

Abrégé

Provided is a technique that allows suppressing an entrance of a large amount of a rinse solution into a plating solution in a plating tank. Provided is a technique that allows suppressing an entrance of a large amount of a rinse solution into a plating solution in a plating tank. A plating apparatus 1000 includes a rinse module 40 configured to perform a rinse process. The rinse module includes: a rinse nozzle 41 configured to discharge the rinse solution to a member to be rinsed 25 while the rinse process is performed; a blow nozzle 42 disposed below the rinse nozzle and blowing out a gas such that the gas crosses a space between the plating tank and a substrate holder 20 while the rinse process is performed; and a collection member 50 disposed at downstream of the gas blown out from the blow nozzle and collecting the rinse solution dropping from the member to be rinsed and entrained in a flow of the gas blown out from the blow nozzle.

Classes IPC  ?

9.

SAFETY ASSISTANCE DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, SAFETY ASSISTANCE METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023037506
Numéro de publication 2024/116625
Statut Délivré - en vigueur
Date de dépôt 2023-10-17
Date de publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Murata Seiji

Abrégé

[Problem] To provide a safety assistance device that can improve operation efficiency of an operator while appropriately securing safety of the operator. [Solution] A safety assistance device 5 assists safety of an operator U who performs, with at least one portion of the body positioned within a prescribed movable range, a prescribed operation to a processing device that performs prescribed processing by moving a movable unit having the movable range. The safety assistance device 5 comprises: an image data acquisition unit 500 that acquires image data 110 captured by an image capturing unit 63 disposed so as to face the front of the operator U when the operator U wears an operator device 6; and an interlock information generation unit 501 that generates interlock information indicating an interlock state of the movable unit on the basis of the image data 110 acquired by the image data acquisition unit 500.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

10.

POLISHING INFORMATION PROCESSING DEVICE, PREDICTION DEVICE, AND MACHINE LEARNING DEVICE

      
Numéro d'application JP2023039383
Numéro de publication 2024/116700
Statut Délivré - en vigueur
Date de dépôt 2023-11-01
Date de publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Midorikawa, Shugo

Abrégé

The present invention relates to a polishing information processing device provided to a polishing device that polishes a peripheral edge section of a substrate. A polishing information processing device (112) comprises: an information acquisition unit (241) that acquires a polishing condition, and a profile before and after polishing of a peripheral edge section of a wafer (W); a state prediction unit (240b) that inputs, into a trained model, information including the newly acquired polishing condition and the profile of the peripheral edge section of a substrate before polishing, and predicts the profile of the peripheral edge section of the substrate after polishing; and a correction unit (242) that corrects the polishing condition on the basis of a target profile of the peripheral edge section of the wafer (W) and the profile of the peripheral edge section of the wafer (W) after polishing, as predicted by the state prediction unit (240b).

Classes IPC  ?

  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

11.

PLATING APPARATUS

      
Numéro d'application 17781365
Statut En instance
Date de dépôt 2021-11-09
Date de la première publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Tomita, Masaki

Abrégé

Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. A plating apparatus includes a plating tank configured to house a plating solution, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, and an elevating mechanism configured to move up and down the substrate holder. The substrate holder includes a supporting mechanism 460 configured to support an outer peripheral portion of the surface to be plated Wf-a of the substrate Wf, a back plate assembly 470 arranged on a back surface side of the surface to be plated Wf-a of the substrate Wf and configured to sandwich the substrate Wf with the supporting mechanism 460, and a removing mechanism 471 configured to provide a force that removes the substrate Wf from the back plate assembly 470 to a back surface of the surface to be plated Wf-a of the substrate Wf.

Classes IPC  ?

  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir
  • C25D 21/10 - Agitation des électrolytes; Déplacement des claies

12.

POLISHING METHOD, AND POLISHING APPARATUS

      
Numéro d'application 18554643
Statut En instance
Date de dépôt 2022-01-17
Date de la première publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kabasawa, Masashi
  • Sasaki, Toshimitsu
  • Shiokawa, Yoichi
  • Yagi, Keita
  • Watanabe, Yuki
  • Chauhan, Nachiketa

Abrégé

The present application relates to a polishing method and a polishing apparatus for polishing a substrate, such as a wafer, while pressing the substrate against a polishing surface of a polishing pad, and more particularly to a polishing method and a polishing apparatus for polishing a substrate while regulating a polishing load based on measurement values of a film-thickness measuring device. The polishing method includes: controlling a temperature of a polishing surface of a polishing pad to a predetermined temperature by use of a pad-temperature regulating apparatus; and polishing a substrate while controlling a polishing load for pressing the substrate against the polishing surface based on measurement values from a film-thickness measuring device provided in the polishing pad.

Classes IPC  ?

  • B24B 37/015 - Commande de la température
  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
  • B24B 49/14 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la température pendant le meulage

13.

PLATING APPARATUS

      
Numéro d'application 17797030
Statut En instance
Date de dépôt 2021-09-28
Date de la première publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Nakahama, Shigeyuki
  • Nagai, Mizuki

Abrégé

Provided is a technique that allows ensuring an in-plane uniformity of film thickness of a substrate. Provided is a technique that allows ensuring an in-plane uniformity of film thickness of a substrate. A plating apparatus 1 includes auxiliary anodes 60a, 606, 60c, 60d. End portion proximal regions in an extending direction of the auxiliary anode are covered by resistive elements 65 having electrical conduction rates larger than zero, and the electrical conduction rates are lower than an electrical conduction rate of a plating solution. A region closer to a center than the end portion proximal regions of the auxiliary anode is not covered by the resistive element, and a surface of the region closer to the center than the end portion proximal regions of the auxiliary anode is exposed.

Classes IPC  ?

14.

SUBSTRATE PROCESSING METHOD, PROCESSING HEAD, AND SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023039854
Numéro de publication 2024/116731
Statut Délivré - en vigueur
Date de dépôt 2023-11-06
Date de publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kashiwagi, Makoto
  • Fujisawa, Mao

Abrégé

The present invention relates to a substrate processing method for processing a substrate. The substrate processing method includes processing a processed surface (5a) of a substrate (W) by rotating the substrate (W) about an axis thereof, pressing a processing tape (2A) against the processed surface (5a) of the substrate (W) by means of a pressing member (12) of a processing head (10A) while feeding the processing tape (2A) in a longitudinal direction thereof, in a state in which the pressing member (12) is inclined in a first direction (D1) relative to a prescribed pressing direction (CL), and then pressing the processing tape (2A) against the processed surface (5a) by means of the pressing member (12) in a state in which the pressing member (12) is inclined relative to the pressing direction (CL) in a second direction (D2) opposite to the first direction (D1), the first direction (D1) and the second direction (D2) being directions in the longitudinal direction of the processing tape (2A) on the pressing member (12).

Classes IPC  ?

  • B24B 21/06 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet pour meuler des surfaces planes munis d'organes à surface de contact limitée pour pousser la courroie contre la pièce à travailler, p.ex. munis de sabots qui balaient complètement la surface à meuler
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 21/08 - Sabots de pression; Bandes d'appui
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

15.

PLATING APPARATUS

      
Numéro d'application 17792079
Statut En instance
Date de dépôt 2021-10-28
Date de la première publication 2024-05-30
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tomita, Masaki
  • Masuda, Yasuyuki

Abrégé

Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane. Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane. A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, and a membrane module 40. The membrane module includes a first membrane 41 and a second membrane 42. The second membrane has an inflow port 42c for causing a plating solution in a first region R1 below the second membrane to flow into a second region R2 above the second membrane and below the first membrane, and an inclined portion 42b inclining relative to a horizontal direction and inclining so as to be positioned upward as heading from a center side of an anode chamber to an outer edge side of the anode chamber.

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir
  • C25D 21/04 - Enlèvement des gaz ou des vapeurs
  • C25D 21/12 - Commande ou régulation

16.

MOTOR PUMP, PUMP UNIT, AND METHOD OF BALANCING IMPELLER OF MOTOR PUMP

      
Numéro d'application 18282747
Statut En instance
Date de dépôt 2022-01-05
Date de la première publication 2024-05-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Konishi, Yasutaka
  • Kawasaki, Hiroyuki

Abrégé

The present invention relates to a motor pump, a pump unit, and a method of balancing an impeller of the motor pump. The motor pump includes an impeller (1), a rotor (2), a stator (3), and a bearing (5). The rotor (2) and the bearing (5) are arranged in a suction side region (Ra) of the impeller (1).

Classes IPC  ?

  • F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
  • F04D 1/08 - Pompes multiétagées les étages étant concentriques
  • F04D 29/041 - Equilibrage des poussées axiales
  • F04D 29/046 - Paliers
  • F04D 29/60 - Montage; Assemblage; Démontage

17.

SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, APPARATUS FOR CLEANING CLEANING MEMBER, AND METHOD FOR CLEANING CLEANING MEMBER

      
Numéro d'application 18514511
Statut En instance
Date de dépôt 2023-11-20
Date de la première publication 2024-05-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Himori, Yosuke
  • Fukaya, Koichi

Abrégé

According to one embodiment, provided is a substrate cleaning apparatus including: a cleaning member configured to clean a substrate; a plate having a horizontal plane provided with a hole; and a pressing mechanism configured to press the cleaning member vertically downward against the plate, wherein the hole penetrates the plate, and a liquid discharged from the cleaning member is discharged below via the hole, whereby absorption of the liquid discharged from the cleaning member into the cleaning member is suppressed.

Classes IPC  ?

  • B08B 1/40 - Outils de nettoyage avec moyens intégrés de distribution de fluides, p.ex. d'eau, de vapeur ou de détergents (nettoyage par la force de jets ou de pulvérisations B08B 3/02)
  • B08B 1/36 - en rotation autour d'un axe orthogonal à la surface

18.

SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023039880
Numéro de publication 2024/106248
Statut Délivré - en vigueur
Date de dépôt 2023-11-06
Date de publication 2024-05-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Miyazaki, Mitsuru
  • Sotozaki, Hiroshi
  • Takebuchi, Kenichi
  • Inoue, Takuya
  • Takahashi, Shozo
  • Ishii, Ryohei

Abrégé

A substrate processing device comprises: a plurality of polishing modules (1A-1D) that are disposed in a polishing level and that polish a substrate; a post-processing lane (2A, 2B) that is disposed in a post-processing level and that performs post-processing, which includes washing and drying, on the polished substrate; and a lifting/lowering conveyance device (5) that extracts the polished substrate from one of the plurality of polishing modules (1A-1D) and conveys the substrate directly to the post-processing lane (2A, 2B). The post-processing level is an upper level positioned above the polishing level or a lower level positioned below the polishing level. The lifting/lowering conveyance device (5) is disposed equidistantly from the plurality of polishing modules (1A-1D). The lifting/lowering conveyance device (5) has a holding hand (40) that enables lifting/lowering between the polishing level and the post-processing level.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail

19.

POLISHING DEVICE

      
Numéro d'application JP2023039986
Numéro de publication 2024/106263
Statut Délivré - en vigueur
Date de dépôt 2023-11-07
Date de publication 2024-05-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kodera, Kenji
  • Hong, Kuo-Wei
  • Ohashi, Hirotaka
  • Yamanobe, Hokuto
  • Ishikawa, Sho

Abrégé

The present invention pertains to a polishing device. This polishing device comprises a sensor structure (100) for detecting a polishing amount of a peripheral edge section of a substrate (W). The sensor structure (100) comprises: a sensor head (102) having a contact surface (102a); and a displacement sensor (101) for detecting the polishing amount of the peripheral edge section of the substrate (W) by means of the displacement of the sensor head (102).

Classes IPC  ?

  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

20.

WORKPIECE PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD

      
Numéro d'application 18547889
Statut En instance
Date de dépôt 2022-02-09
Date de la première publication 2024-05-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kashiwagi, Makoto
  • Izawa, Mao

Abrégé

The present invention relates to a workpiece processing apparatus and a workpiece processing method for processing a workpiece, such as a wafer, a substrate, or a panel. The workpiece processing apparatus (1) includes: a workpiece supporting device (10) configured to support the workpiece (W); and a processing head (20) configured to process the surface of the workpiece (W). The workpiece supporting device (10) has a fluid supply line (15) for passing fluid therethrough, and a Bernoulli chuck (12) coupled to the fluid supply line (15), the Bernoulli chuck (12) is configured to attract the surface of the workpiece (W) by emitting the fluid, and at least part of the Bernoulli chuck (12) is made of a conductive material and is grounded.

Classes IPC  ?

  • B23Q 3/06 - Moyens de fixation de la pièce
  • B23Q 3/08 - Moyens de fixation de la pièce autres que les moyens actionnés mécaniquement

21.

POLISHING APPARATUS

      
Numéro d'application 18358811
Statut En instance
Date de dépôt 2023-07-25
Date de la première publication 2024-05-16
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Yun, Seungho

Abrégé

A polishing apparatus capable of measuring a surface temperature of a substrate while suppressing shielding by a polishing liquid is disclosed. The polishing apparatus includes a microwave detection sensor configured to generate microwave detection data by detecting microwaves, and a controller configured to determine the surface temperature of the substrate based on the microwave detection data.

Classes IPC  ?

  • B24B 37/015 - Commande de la température
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques

22.

CULTIVATION MANAGEMENT DEVICE AND CULTIVATION MANAGEMENT SYSTEM

      
Numéro d'application JP2023032080
Numéro de publication 2024/100972
Statut Délivré - en vigueur
Date de dépôt 2023-09-01
Date de publication 2024-05-16
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tanaka Hideaki
  • Kato Masashi
  • Deguchi Tatsuya
  • Koyama Hirohisa

Abrégé

A cultivation management device 10 according to one aspect of the present invention manages the cultivation of aquatic organisms in a fish tank. This cultivation management device 10 comprises: a body length measurement unit for measuring the body length of an aquatic organism; and an activity estimation unit which estimates the activity of the aquatic organism on the basis of the measured body length.

Classes IPC  ?

  • A01K 61/10 - NÉCESSITÉS COURANTES DE LA VIE ÉLEVAGE; CHASSE; PIÉGEAGE; PÊCHE ÉLEVAGE; AVICULTURE; APICULTURE; PISCICULTURE; PÊCHE; OBTENTION D'ANIMAUX, NON PRÉVUE AILLEURS; NOUVELLES RACES D'ANIMAUX Élevage des animaux aquatiques des poissons
  • A01K 61/95 - Triage, classement, comptage ou marquage des animaux vivants, p.ex. identification de leur sexe spécialement adaptés aux poissons
  • A01K 63/04 - Agencements pour traiter l'eau spécialement conçus pour les récipients pour poissons vivants

23.

SUBSTRATE-CLEANING DEVICE AND SUBSTRATE-CLEANING METHOD

      
Numéro d'application JP2023037874
Numéro de publication 2024/101107
Statut Délivré - en vigueur
Date de dépôt 2023-10-19
Date de publication 2024-05-16
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Kashiwagi, Makoto

Abrégé

The present invention relates to a substrate-cleaning device and a substrate-cleaning method, in which a cleaning tool is brought into contact with the front or back surface of a substrate, e.g., a wafer, to clean the front or back surface of the substrate. This substrate-cleaning device comprises: a substrate-holding part (41) which holds and rotates a peripheral edge portion of a substrate (W); and at least one substrate-cleaning tool (42) which comes into contact with the front or back surface of the substrate (W) held by the substrate-holding part (41) and cleans the front or back surface of the substrate (W). The substrate-cleaning tool (42) comprises a Bernoulli chuck (55), which ejects a fluid to generate suction power for suction-holding the front or back surface of the substrate (W), and a cleaning member (56) attached to the Bernoulli chuck (55). The cleaning member (56) is pressed against the front or back surface of the substrate (W) in accordance with the suction power of the Bernoulli chuck (55).

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

24.

POLISHING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM

      
Numéro d'application JP2023039209
Numéro de publication 2024/095997
Statut Délivré - en vigueur
Date de dépôt 2023-10-31
Date de publication 2024-05-10
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Suzuki Yuta
  • Takahashi Taro
  • Otaki Hirofumi

Abrégé

This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the polishing device by inputting state-reflective information reflecting the state of the polishing pad of the polishing device, into a machine learning model that has learned, by machine learning, a correlation between state-reflective information reflecting the state of another polishing pad and the polishing index of the other polishing pad.

Classes IPC  ?

  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 37/015 - Commande de la température
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
  • B24B 53/12 - Outils à dresser; Leurs porte-outils
  • G05B 23/02 - Test ou contrôle électrique
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

25.

SEMICONDUCTOR MANUFACTURING APPARATUS

      
Numéro d'application 18280137
Statut En instance
Date de dépôt 2022-03-03
Date de la première publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Nagasawa, Yosuke
  • Sato, Tensei
  • Wakabayashi, Hideki

Abrégé

The present invention correctly identifies the size and shape of a substrate in order to avoid damage to a substrate holder and wasteful disposal of a substrate. Provided is a semiconductor manufacturing device for processing a rectangular substrate. This semiconductor manufacturing device: comprises a first sensor pair, which is used to measure a first length of the rectangular substrate along a first line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the first line and a sensor configured to detect the position of the other end of the rectangular substrate on the first line, and a second sensor pair, which is used to measure a second length of the rectangular substrate along a second line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the second line and a sensor configured to detect the position of the other end of the rectangular substrate on the second line; and identifies the size or shape of the rectangular substrate on the basis of the first length and the second length.

Classes IPC  ?

  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
  • H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
  • H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces

26.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Numéro d'application JP2023036223
Numéro de publication 2024/090159
Statut Délivré - en vigueur
Date de dépôt 2023-10-04
Date de publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Uchida Takuma
  • Iwamoto Hideyuki

Abrégé

A data processing system according to the present invention comprises: a physical quantity measurement device that measures a physical quantity for each predetermined monitoring cycle; a data collection device that has a collection communication unit which is connected to the physical quantity measurement device and a collection control unit which causes the collection communication unit to provide an external notification of the physical quantity acquired via the collection communication unit; and a data management device that has a management communication unit which is connected to the data collection device, a management control unit which determines that an anomaly has occurred when the physical quantity acquired from the data collection device via the management communication unit has exceeded a predetermined threshold, and a management storage unit which, for each monitoring cycle, stores determination data indicative of the occurrence of the anomaly, wherein when the management storage unit has acquired determination data indicative of the occurrence of an anomaly a predetermined number of times or more consecutively, the management control unit yields a determination result and causes the management communication unit to notify a terminal device of the determination result.

Classes IPC  ?

27.

SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD

      
Numéro d'application JP2023038215
Numéro de publication 2024/090384
Statut Délivré - en vigueur
Date de dépôt 2023-10-23
Date de publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Satori, Hirotaka

Abrégé

Provided is a technology by which a chemical can be effectively fixed to the surface of a substrate. A substrate treatment device 1 comprises: an activating device 40 configured so that, in a state where a liquid is supplied to a surface of a substrate Wf and a glass plate 100 is disposed on the surface of the substrate, the activating device activates the surface of a substrate by projecting light onto the surface of the substrate from the side of the glass plate opposite the substrate; a liquid chemical supply device 50 that supplies a liquid chemical to the surface of the substrate in a state where the glass plate is removed from the surface of the substrate; and a chemical fixing device that fixes the chemical to the surface of the substrate by drying and heating the liquid chemical on the surface of the substrate. A flow path 110 through which liquid can flow is provided to an opposing surface of the glass plate, said surface facing the surface of the substrate.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides

28.

SUBSTRATE PROCESSING APPARATUS

      
Numéro d'application 18461520
Statut En instance
Date de dépôt 2023-09-06
Date de la première publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Miyamoto, Matsutaro

Abrégé

The substrate processing apparatus according to the disclosure is a substrate processing apparatus for processing a substrate. The substrate processing apparatus includes a swing module, which includes a base portion, an arm which is supported by the base portion and is rotatable about the base portion, and a cover which covers an upper surface of the arm. The cover has an elongated shape in plan view and has a protrusion formed on an outer peripheral portion of an upper surface of the cover to protrude upward. The protrusion is provided to be continuous to a distal end which is an end on the side farther from the base portion of the upper surface of the cover in a longitudinal direction and both ends of the upper surface of the cover in a transverse direction.

Classes IPC  ?

  • B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
  • B24B 37/04 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes

29.

SUBSTRATE PROCESSING DEVICE, POLISHING DEVICE, AND SUBSTRATE PROCESSING METHOD

      
Numéro d'application 18490727
Statut En instance
Date de dépôt 2023-10-19
Date de la première publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sato, Kohei
  • Fukaya, Koichi
  • Takahashi, Hiroki
  • Kondo, Daichi

Abrégé

Provided are a substrate processing device, a polishing device, and a substrate processing method. The substrate processing device includes a processing module for processing the substrate with a liquid, and a gas-liquid separation tank connected to the exhaust outlet of the processing module, which separates the liquid from the exhaust received from the processing module and releases the exhaust into an exhaust duct. The gas-liquid separation tank includes a tank body, a heat exchanger arranged inside the tank body and cools the exhaust, and an air nozzle arranged inside the tank body and supplies air to cool the exhaust.

Classes IPC  ?

  • B08B 3/14 - Enlèvement des déchets, p.ex. des étiquettes, se trouvant dans le liquide de nettoyage
  • B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage

30.

SUBSTRATE CLEANING APPARATUS, SUBSTRATE DRYING APPARATUS, SUBSTRATE TRANSPORT APPARATUS, SUBSTRATE PLACING APPARATUS, SUBSTRATE PROCESSING APPARATUS, CHARGE AMOUNT CONTROL METHOD, AND CHARGE AMOUNT CONTROL PROGRAM

      
Numéro d'application 18497324
Statut En instance
Date de dépôt 2023-10-30
Date de la première publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Himori, Yosuke

Abrégé

Provided is a substrate cleaning apparatus including: a substrate holding and rotating mechanism configured to hold and rotate a substrate; a cleaning liquid supplier configured to supply a cleaning liquid to the substrate; a cleaning member configured to come into contact with the substrate to clean the substrate; a charge amount adjustment apparatus capable of increasing and decreasing a charge amount of the substrate; a charge amount measuring instrument configured to measure the charge amount of the substrate; and a controller configured to control the charge amount adjustment apparatus according to the charge amount measured by the charge amount measuring instrument.

Classes IPC  ?

  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
  • B08B 1/14 - Lingettes; Éléments absorbants, p.ex. écouvillons ou éponges (avec moyens intégrés de distribution de fluides B08B 1/40)
  • B08B 1/20 - Nettoyage d'articles en mouvement, p.ex. de bandes en mouvement ou d’objets sur un transporteur
  • B08B 1/34 - en rotation autour d'un axe parallèle à la surface
  • B08B 3/04 - Nettoyage impliquant le contact avec un liquide
  • H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces
  • H05F 1/00 - Prévention de la formation des charges électrostatiques

31.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Numéro d'application JP2023036409
Numéro de publication 2024/090168
Statut Délivré - en vigueur
Date de dépôt 2023-10-05
Date de publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Uchida Takuma

Abrégé

This data processing system comprises a terminal device and a data management device comprising: a management and communication unit which can connect to the terminal device; a management and storage unit which stores notification item data including specifications of at least one machine to serve as a target; and a management and control unit which causes a notification of the notification item data stored in the management and storage unit to be provided by the management and communication unit to the terminal device, acquires, from the management and communication unit, notification item data in which selection or non-selection has been indicated using the terminal device, and causes the notification item data to be stored in the management and storage unit.

Classes IPC  ?

32.

Motor

      
Numéro d'application 29865747
Numéro de brevet D1024963
Statut Délivré - en vigueur
Date de dépôt 2022-08-10
Date de la première publication 2024-04-30
Date d'octroi 2024-04-30
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Ochiai, Akihiro
  • Nishimura, Kazuma
  • Oishi, Yohei
  • Ozawa, Takahide
  • Nagai, Masayuki
  • Takahashi, Shin
  • Shinchi, Yuhei

33.

PUMP AND PUMP ASSEMBLY METHOD

      
Numéro d'application JP2023030303
Numéro de publication 2024/084798
Statut Délivré - en vigueur
Date de dépôt 2023-08-23
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kawabata, Junya
  • Miya, Kenta

Abrégé

The present invention relates to a pump for a liquid and particularly relates to a pump having a mechanical seal disposed on a rotating shaft. A pump (P) includes: a retainer (41) held by a spring (33) that presses a rotating ring (31) of a mechanical seal (20) against a stationary ring (32) thereof; and a retainer holder (50) attached to a back side of an impeller (2). The retainer holder (50) has: a peripheral wall (52) inside which the retainer (41) is fitted; and a bottom wall (53) that extends radially inward from the peripheral wall (52). The peripheral wall (52) protrudes from the bottom wall (53) toward the mechanical seal (20). The peripheral wall (52) has a tapered surface (54) formed at an edge thereof. The tapered surface (54) has a truncated cone shape in which the inner diameter of the peripheral wall (52) increases with increasing the distance from the bottom wall (53).

Classes IPC  ?

  • F04D 29/12 - Joints d'étanchéité pour arbre utilisant des bagues
  • F04D 29/08 - Joints d'étanchéité
  • F04D 29/60 - Montage; Assemblage; Démontage
  • F04D 29/62 - Montage; Assemblage; Démontage des pompes radiales ou hélicocentrifuges
  • F16J 15/34 - Joints d'étanchéité entre deux surfaces mobiles l'une par rapport à l'autre par bague glissante pressée contre la face plus ou moins radiale d'une des deux parties

34.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, AND DATA COLLECTION METHOD

      
Numéro d'application JP2023035401
Numéro de publication 2024/084917
Statut Délivré - en vigueur
Date de dépôt 2023-09-28
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Uchida Takuma

Abrégé

This data processing system: acquires processing data as new collection data from a processing data transmission source, which is an external device, at a predetermined monitoring cycle; when a collection communication unit is not connected to a management communication unit, stores the new collection data as storage data in a collection and storage unit; and, after the collection communication unit has been connected to the management communication unit, transmits, to a data management device, collection data which is a combination of new collection data that has been newly acquired from the processing data transmission source at the next monitoring cycle and the storage data stored in the collection and storage unit.

Classes IPC  ?

  • G05B 23/02 - Test ou contrôle électrique
  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps
  • H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou

35.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Numéro d'application JP2023037016
Numéro de publication 2024/085061
Statut Délivré - en vigueur
Date de dépôt 2023-10-12
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Satake, Masayuki

Abrégé

The present invention relates to a substrate processing method and a substrate processing apparatus, with which cracking and chipping of a multilayer substrate obtained by bonding a plurality of substrates are suppressed, and more specifically to a technology for applying a filler to a gap formed between edge parts of the plurality of substrates that constitute the multilayer substrate. This substrate processing apparatus (1) is provided with: an application device (3) which applies a filler (F) to a gap (G) between an edge part (E1) of a first substrate (W1) and an edge part (E2) of a second substrate (W2); a thermographic camera (5) which produces a thermal image (40) from the infrared light irradiated from the filler (F) applied to the gap (G); and an image processing unit (30) which determines the state of the filler (F) applied to the gap (G) on the basis of the thermal image (40).

Classes IPC  ?

  • G01J 5/48 - Thermographie; Techniques utilisant des moyens entièrement visuels
  • G01N 25/72 - Recherche de la présence de criques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

36.

PUMP DEVICE FOR LIQUEFIED GAS

      
Numéro d'application JP2023037825
Numéro de publication 2024/085216
Statut Délivré - en vigueur
Date de dépôt 2023-10-19
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Matake, Kozo

Abrégé

The present invention relates to a pump device for transferring an ultracold liquefied gas such as liquefied hydrogen or liquefied natural gas, and in particular to a pump device having an electric motor as a pump drive source. The pump device comprises a pump (1) having an impeller (2), a rotation shaft (5) to which the impeller (2) is fixed, and an electric motor (7) for rotating the rotation shaft (5) and the impeller (1). A rotor assembly (21) of the electric motor (7) comprises a motor rotor (40) fixed to the rotation shaft (5), a side ring (41) disposed on both sides of the motor rotor (40), and a sealed cover (42) fixed to the outer circumferential surface of the side ring (41). The sealed cover (42) is made of glass fiber.

Classes IPC  ?

  • H02K 1/22 - Parties tournantes du circuit magnétique
  • F04D 13/00 - Installations ou systèmes de pompage
  • F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
  • F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
  • F04D 29/00 - POMPES À DÉPLACEMENT NON POSITIF - Parties constitutives, détails ou accessoires
  • H02K 7/14 - Association structurelle à des charges mécaniques, p.ex. à des machines-outils portatives ou des ventilateurs

37.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Numéro d'application JP2023023776
Numéro de publication 2024/079949
Statut Délivré - en vigueur
Date de dépôt 2023-06-27
Date de publication 2024-04-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Uchida Takuma

Abrégé

This data processing system comprises a data collection device and a data management device. The data collection device has: a collection storage unit which stores specific information for identifying information pertaining to processing data generated by physical quantity measurement devices that measure physical quantities; a collection communication unit which is connected to the physical quantity measurement devices; and a collection control unit which collects, on the basis of the specific information, processing data for each of the physical quantity measurement devices. The data management device has: a management storage unit which stores the specific data and the processing data; and a management communication unit which transmits the specific information stored in the management storage unit to the data collection device and receives the processing data from the data collection device.

Classes IPC  ?

  • H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
  • G05B 23/02 - Test ou contrôle électrique
  • G08C 15/00 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune
  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps

38.

TOP RING AND SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023036057
Numéro de publication 2024/080189
Statut Délivré - en vigueur
Date de dépôt 2023-10-03
Date de publication 2024-04-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Kashiwagi, Makoto

Abrégé

Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member having a substrate suctioning surface for suctioning a substrate and a pressure reducing part communicating with a pressure reducing means; and a first pressure assembly that is disposed between the base member and the substrate suctioning member and has a plurality of first pressure means disposed on the side of the substrate suctioning member opposite to the substrate suctioning surface, the first pressure assembly being configured such that the first pressure means are capable of applying a pressing force to the substrate suctioning member completely independently of each other.

Classes IPC  ?

  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

39.

OUTPUT SIGNAL PROCESSING DEVICE FOR EDDY-CURRENT SENSOR

      
Numéro d'application 18376168
Statut En instance
Date de dépôt 2023-10-03
Date de la première publication 2024-04-11
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Minatozaki, Katsuya

Abrégé

A retainer holds reference data for identifying a first AC generated signal corresponding to an output signal output in a reference state from a detection coil. When a film thickness of a conductor is to be measured, an AC signal generator generates the first AC generated signal based on the reference data and outputs it as a reference signal. When a film thickness of a conductor is to be measured, a difference circuitry receives input of an output signal and a reference signal output from the AC signal generator and acquires and outputs a film thickness amplitude that is a difference between the amplitude of the film thickness signal and the amplitude of the reference signal. The data generator in the reference state measures an amplitude of the output signal and generates the reference data.

Classes IPC  ?

  • G01B 7/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage

40.

POLISHING APPARATUS

      
Numéro d'application 18475188
Statut En instance
Date de dépôt 2023-09-26
Date de la première publication 2024-04-11
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Ito, Masayoshi
  • Moriura, Takuya

Abrégé

A polishing apparatus 1 includes a control device 90. The control device 90 performs: a cleaning process of causing a cleaning solution to flow in a flow channel 70a and then causing a polishing solution to flow in the flow channel 70a when the number of substrates Wf polished by a polishing machine 10 reaches a predetermined number; and a clogging detecting process of detecting whether clogging has occurred in the flow channel based on a pressure or a flow rate of the cleaning solution detected by sensors 60 and 61 when the cleaning solution flows in the flow channel.

Classes IPC  ?

  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage

41.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, DATA PRESENTATION METHOD, AND DATA STRUCTURE

      
Numéro d'application JP2023031690
Numéro de publication 2024/075444
Statut Délivré - en vigueur
Date de dépôt 2023-08-31
Date de publication 2024-04-11
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing structure is made up of a plurality of physical quantity measurement devices and a data collection device. Upon accepting a data request including an object identification index from the data collection device, the physical quantity measurement devices transmit, to the data collection device, a physical quantity data array made up of physical quantity data associated with an index of which the measurement order is later than the object identification index and an index therefor, out of a plurality of physical quantity data and indices stored in a storage unit. When a predetermined collection condition is satisfied, the data collection device transmits a data request including the object identification index to the physical quantity measurement devices, receives a physical quantity data array as a response thereto, and identifies and manages an index of which the measurement order is last when receiving the physical quantity data array the previous time, as the object identification index.

Classes IPC  ?

  • G08C 19/00 - Systèmes de transmission de signaux électriques
  • G05B 23/02 - Test ou contrôle électrique
  • G06F 16/901 - Indexation; Structures de données à cet effet; Structures de stockage
  • G08C 15/00 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune

42.

Elastic membrane

      
Numéro d'application 29874375
Numéro de brevet D1021832
Statut Délivré - en vigueur
Date de dépôt 2023-04-19
Date de la première publication 2024-04-09
Date d'octroi 2024-04-09
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Akazawa, Kenichi
  • Nabeya, Osamu
  • Togashi, Shingo
  • Yamaki, Satoru
  • Owada, Tomoko
  • Cheng, Cheng
  • Kato, Yuichi

43.

EXHAUST GAS TREATMENT APPARATUS

      
Numéro d'application 18476588
Statut En instance
Date de dépôt 2023-09-28
Date de la première publication 2024-04-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shamoto, Mitsuhiro
  • Kyotani, Takashi

Abrégé

An exhaust-gas treatment apparatus capable of efficiently making a harmful gas containing in an exhaust gas harmless without increasing a size of the apparatus is disclosed. The exhaust-gas treatment apparatus includes a main body in which a flow passage is formed for a liquid to flow, an exhaust-gas supply line to be coupled to the main body, and for supplying the exhaust gas to the flow passage through which the liquid flows, a suction device configured to suck the exhaust gas from the exhaust-gas supply line into the flow passage, a low-temperature plasma generator for generating low-temperature plasma in the flow passage to decompose the harmful gas, and a discharge line for discharging the exhaust gas, which has passed through the low-temperature plasma generator, from the main body.

Classes IPC  ?

  • B01D 53/32 - SÉPARATION Épuration chimique ou biologique des gaz résiduaires, p.ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par effets électriques autres que ceux prévus au groupe

44.

POLISHING APPARATUS AND POLISHING METHOD

      
Numéro d'application 18276391
Statut En instance
Date de dépôt 2022-01-14
Date de la première publication 2024-04-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yamamoto, Satoru
  • Uchiyama, Keisuke
  • Izawa, Mao
  • Kashiwagi, Makoto

Abrégé

The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one polishing head (10) arranged near a flat portion of the substrate (W), wherein the polishing head (10) has a fluid pressing structure (12) configured to press the polishing tape (3) with fluid against the flat portion of the substrate, and the fluid pressing structure (12) has a fluid supply port (13) arranged so as to face a back surface of the polishing tape (3).

Classes IPC  ?

  • B24B 21/08 - Sabots de pression; Bandes d'appui
  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet

45.

DATA PROCESSING SYSTEM, PHYSICAL QUANTITY MEASURING DEVICE, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, DATA PROVISION METHOD, AND DATA COLLECTION METHOD

      
Numéro d'application JP2023023997
Numéro de publication 2024/070099
Statut Délivré - en vigueur
Date de dépôt 2023-06-28
Date de publication 2024-04-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing system includes a physical quantity measuring device and a data collection device. This physical quantity measuring device transmits a physical quantity data string constituted by a plurality of physical quantity data, which are obtained when the physical quantity is measured by a physical quantity sensor under sampling conditions, so that the measurement order thereof can be determined, and a time elapsed since the last measurement, which is obtained by measuring, with a timer count unit, the time elapsed after the physical quantity was measured last time by the physical quantity sensor, to the data collection device. The data collection device specifies a measurement time for each of the plurality of physical quantity data, which constitute the physical quantity data string, on the basis of the current time measured by a time measurement unit and the time elapsed since the last measurement.

Classes IPC  ?

  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps

46.

DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASURING DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD

      
Numéro d'application JP2023020803
Numéro de publication 2024/062690
Statut Délivré - en vigueur
Date de dépôt 2023-06-05
Date de publication 2024-03-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing device comprises: an arithmetic operation unit that repeatedly acquires the physical quantity to be measured, as physical quantity data, and performs a prescribed arithmetic operation on the physical quantity data so as to generate process data; and a communication processing unit that sequentially transmits process data each time process data is generated. The arithmetic operation unit executes a first arithmetic operation on the physical quantity data of a prescribed number of data points and generates first process data when a prescribed start condition is satisfied, and executes a second arithmetic operation until an end condition is satisfied, on physical quantity data for a number of data points comprising physical quantity data at the most recent time and physical quantity data at a past time and generates second process data after the elapse of a prescribed wait time when a prescribed end condition is not satisfied after executing the first arithmetic operation.

Classes IPC  ?

  • H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
  • G05B 23/02 - Test ou contrôle électrique
  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps

47.

AM APPARATUS

      
Numéro d'application 18264802
Statut En instance
Date de dépôt 2022-02-04
Date de la première publication 2024-03-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Asai, Junki

Abrégé

The present disclosure provides a structure for replenishing a powder material to a material supply device during fabrication using the AM technique. According to one aspect, an AM apparatus is provided. This AM apparatus includes a DED nozzle configured to eject a powder material, a gantry mechanism configured to move the DED nozzle, and a powder supply device configured to supply the powder material to the DED nozzle. The gantry mechanism includes a Y-axis member movable in a horizontal X direction and extending in a horizontal Y direction perpendicular to the X direction. The DED nozzle and the material supply device are mounted on the Y-axis member of the gantry mechanism. The gantry mechanism includes a Y-axis movement mechanism for moving the DED nozzle and the material supply device along the Y direction on the Y-axis member.

Classes IPC  ?

  • B22F 12/55 - Moyens multiples d’alimentation en matériau
  • B22F 12/00 - Appareils ou dispositifs spécialement adaptés à la fabrication additive; Moyens auxiliaires pour la fabrication additive; Combinaisons d’appareils ou de dispositifs pour la fabrication additive avec d’autres appareils ou dispositifs de traitement ou de fabrication
  • B22F 12/52 - Trémies
  • B22F 12/53 - Buses
  • B22F 12/70 - Moyens d’écoulement des gaz
  • B22F 12/90 - Moyens de commande ou de régulation des opérations, p.ex. caméras ou capteurs
  • B33Y 30/00 - Appareils pour la fabrication additive; Leurs parties constitutives ou accessoires à cet effet
  • B33Y 50/02 - Acquisition ou traitement de données pour la fabrication additive pour la commande ou la régulation de procédés de fabrication additive

48.

METHOD OF DETECTING ABNORMALITY IN MEASURING OF FILM THICKNESS OF WORKPIECE, OPTICAL FILM-THICKNESS MEASURING APPARATUS, AND STORAGE MEDIUM STORING PROGRAM

      
Numéro d'application 18371357
Statut En instance
Date de dépôt 2023-09-21
Date de la première publication 2024-03-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Nakamura, Akira

Abrégé

A technique of detecting an abnormality in measuring of a film thickness of a workpiece, such as a wafer, is disclosed. A method includes: generating multiple spectra of reflected light from multiple measurement points on a workpiece over a predetermined period of time during polishing of the workpiece; classifying the multiple spectra into a plurality of groups including at least a first group and a second group according to feature of each of the multiple spectra; determining a monitoring index value based on at least the number of spectra included in the first group; and detecting an abnormality in measuring of the film thickness of the at least one workpiece based on comparison of the monitoring index value with a threshold value.

Classes IPC  ?

  • G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques

49.

DETECTION DEVICE

      
Numéro d'application JP2023031226
Numéro de publication 2024/062855
Statut Délivré - en vigueur
Date de dépôt 2023-08-29
Date de publication 2024-03-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sekiguchi Takashi
  • Yamada Yasumasa
  • Tamura Hiromi

Abrégé

This detection device (1) comprises: a detection unit (2) attached to an apparatus (100) to be measured; a power supply unit (3) that supplies power to the detection unit (2); and a cable (4) that connects the detection unit (2) and the power supply unit (3). The detection unit (2) has a detection part (10) that detects the state of the apparatus (100) to be measured, a communication part (11) that transmits a detection result of the detection part (10), and a substrate (12) on which the detection part (10) and the communication part (11) are both mounted.

Classes IPC  ?

  • G01D 11/30 - Supports spécialement adaptés à un instrument; Supports spécialement adaptés à un ensemble d'instruments
  • G01H 17/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores non prévue dans les autres groupes de la présente sous-classe
  • G01K 1/14 - Supports; Dispositifs de fixation; Dispositions pour le montage de thermomètres en des endroits particuliers

50.

GRAPH DISPLAY METHOD FOR POLISHING DEVICE, AND COMPUTER PROGRAM

      
Numéro d'application JP2023028049
Numéro de publication 2024/057749
Statut Délivré - en vigueur
Date de dépôt 2023-08-01
Date de publication 2024-03-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shimizu, Yuko
  • Watanabe, Hiromitsu
  • Sugita, Ryuji
  • Yanai, Akio
  • Watanabe, Daichi

Abrégé

The present invention enables data of interest to be found quickly from among multiple sets of measured data in a polishing device. Provided is a method for displaying measured data relating to a polishing device as a graph. The method includes: a step for acquiring, from the polishing device, a plurality of series of measured data measured in the polishing device; a step for creating graphs corresponding to each of the plurality of series of measured data; a step for classifying the plurality of created graphs into a plurality of groups on the basis of a similarity of the graph shapes; and a step for displaying the plurality of graphs in an overlaid manner, using a different display mode for each group.

Classes IPC  ?

  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B23Q 17/00 - Agencements sur les machines-outils pour indiquer ou mesurer
  • B23Q 17/24 - Agencements sur les machines-outils pour indiquer ou mesurer utilisant des moyens optiques
  • B24B 37/00 - Machines ou dispositifs de rodage; Accessoires
  • G06T 11/60 - Edition de figures et de texte; Combinaison de figures ou de texte
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

51.

THRESHOLD VALUE SETTING DEVICE, ABNORMALITY DETERMINATION DEVICE, THRESHOLD VALUE SETTING METHOD, AND ABNORMALITY DETERMINATION METHOD

      
Numéro d'application JP2023030527
Numéro de publication 2024/057864
Statut Délivré - en vigueur
Date de dépôt 2023-08-24
Date de publication 2024-03-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tamura Hiromi
  • Yamada Yasumasa

Abrégé

This threshold value setting device comprises: an input unit for inputting a period of data to be extracted from acquired data; a data extraction unit for extracting data for the period inputted by the input unit; a reference value determination unit for determining a reference value from the data extracted by the data extraction unit; and a threshold value calculation unit for calculating a threshold value from the reference value determined by the reference value determination unit.

Classes IPC  ?

  • G01M 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
  • G05B 23/02 - Test ou contrôle électrique

52.

POLISHING APPARATUS

      
Numéro d'application 18521813
Statut En instance
Date de dépôt 2023-11-28
Date de la première publication 2024-03-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kobayashi, Kenichi
  • Nakanishi, Masayuki
  • Kashiwagi, Makoto
  • Hoshina, Manao

Abrégé

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Classes IPC  ?

  • B24B 37/04 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes
  • B24B 7/22 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière des objets non métalliques à meuler pour meuler de la matière inorganique, p.ex. de la pierre, des céramiques, de la porcelaine
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 21/10 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet pour meuler des surfaces planes munis d'un organe rigide, p.ex. d'une barre de pression, d'une table de pression, qui pousse ou supporte la courroie pratiquement sur tout son empattement
  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
  • H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces

53.

DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD

      
Numéro d'application JP2023021022
Numéro de publication 2024/057635
Statut Délivré - en vigueur
Date de dépôt 2023-06-06
Date de publication 2024-03-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing device comprises: a data acquisition unit which acquires a sequence of physical quantity data individually measured at a prescribed sampling frequency and the number of sampling points; a first data generation unit which generates a first time data sequence by extracting physical quantity data of a first analysis point number continuously measured at the first analysis point of a number smaller than the number of sampling points; a first frequency analysis unit which converts the first time data sequence into a first frequency data sequence through a frequency analysis; a second data generation unit which generates a second time data sequence by thinning the physical quantity sequence into physical quantity data of a second analysis point number smaller than the number of sampling points; and a second frequency analysis unit which converts the second time data sequence into a second frequency data sequence through the frequency analysis.

Classes IPC  ?

  • G01H 17/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores non prévue dans les autres groupes de la présente sous-classe
  • G01M 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
  • G05B 23/02 - Test ou contrôle électrique

54.

AHEAD, BEYOND

      
Numéro de série 79395494
Statut En instance
Date de dépôt 2024-03-19
Propriétaire EBARA CORPORATION (Japon)
Classes de Nice  ?
  • 07 - Machines et machines-outils
  • 09 - Appareils et instruments scientifiques et électriques
  • 11 - Appareils de contrôle de l'environnement
  • 37 - Services de construction; extraction minière; installation et réparation
  • 42 - Services scientifiques, technologiques et industriels, recherche et conception

Produits et services

Metalworking machines and tools; construction machines and apparatus; loading-unloading machines and apparatus; chemical processing machines and apparatus; pulp making, papermaking or paper-working machines and apparatus; plastic processing machines and apparatus; semiconductor manufacturing machines and systems; non-electric prime movers [not for land vehicles]; turbines [not for land vehicles]; pneumatic or hydraulic machines and instruments; pumps [not for specified purposes]; vacuum pumps [not for specified purposes]; blowers [not for specified purposes]; compressors [not for specified purposes]; electric wax-polishing machines; vacuum cleaners; power-operated sprayers for disinfecting, insecticides and deodorants [not for agricultural purposes]; machine elements [not for land vehicles]; waste compacting machines and apparatus; waste crushing machines; starters for motors and engines; AC motors and DC motors [not including those for land vehicles but including "parts" for any AC motors and DC motors]; AC generators [alternators]; DC generators. Ozonisers [ozonators]; electrolysers [electrolytic cells]; fire extinguishers; fire hose nozzles; sprinkler systems for fire protection; fire alarms; gas alarms; laboratory apparatus and instruments; optical machines and apparatus; measuring or testing machines and instruments; power distribution or control machines and apparatus; rotary converters; phase modifiers; solar batteries; batteries and cells; electric or magnetic meters and testers; electric wires and cables; telecommunication machines and apparatus; electronic machines, apparatus and their parts; magnetic cores; resistance wires; electrodes for laboratory research. Drying apparatus [for chemical processing]; recuperators [for chemical processing]; steamers [for chemical processing]; evaporators [for chemical processing]; distillers [for chemical processing]; heat exchangers [for chemical processing]; industrial furnaces; nuclear reactors [atomic piles]; boilers for non-electric prime movers and engines; air-conditioning apparatus [for industrial purposes]; freezing machines and apparatus; tap water faucets; level controlling valves for tanks; pipe line cocks; waste water treatment tanks [for industrial purposes]; septic tanks [for industrial purposes]; garbage incinerators; solar water heaters; water purifying apparatus; household electrothermic appliances; washers for water taps; bath fittings; waste water treatment tanks for household purposes; septic tanks for household purposes; fire hydrants. Construction; construction consultancy; installation and maintenance of building equipment; shipbuilding; repair or maintenance of vessels; repair or maintenance of optical machines and instruments; repair or maintenance of photographic machines and apparatus; repair or maintenance of loading-unloading machines and apparatus; repair or maintenance of fire alarms; repair or maintenance of air-conditioning apparatus [for industrial purposes]; repair or maintenance of burners; repair or maintenance of boilers; repair or maintenance of pumps; repair or maintenance of freezing machines and apparatus; repair or maintenance of electronic machines and apparatus; repair or maintenance of telecommunication machines and apparatus; repair or maintenance of construction machines and apparatus; repair or maintenance of consumer electric appliances; repair or maintenance of electric lighting apparatus; repair or maintenance of power distribution or control machines and apparatus; repair or maintenance of power generators; repair or maintenance of electric motors; repair or maintenance of laboratory apparatus and instruments; repair or maintenance of measuring and testing machines and instruments; repair or maintenance of medical apparatus and instruments; repair or maintenance of chemical processing machines and apparatus; repair or maintenance of glassware manufacturing machines and apparatus; repair or maintenance of metalworking machines and tools; repair or maintenance of industrial furnaces; repair or maintenance of mining machines and apparatus; repair or maintenance of rubber-goods manufacturing machines and apparatus; repair or maintenance of integrated circuits manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems; repair or maintenance of machines and apparatus for processing foods or beverages; repair or maintenance of machines and apparatus for lumbering, woodworking, or veneer or plywood making; repair or maintenance of agricultural machines and implements; repair or maintenance of machines and apparatus for pulp-making, papermaking or paper-working; repair or maintenance of plastic processing machines and apparatus; repair or maintenance of reservoirs; repair or maintenance of dishwashers for industrial purposes; repair or maintenance of cooking equipment for industrial purposes; repair or maintenance of vehicle washing installations; repair or maintenance of power-driven floor cleaning machines; repair or maintenance of water pollution control equipment; repair or maintenance of water purifying apparatus; repair or maintenance of waste compacting machines and apparatus; repair or maintenance of waste crushing machines; repair or maintenance of nuclear power plants; repair or maintenance of chemical plants; repair or maintenance of gas water heaters; repair or maintenance of non-electric cooking heaters; repair or maintenance of bath fittings; chimney sweeping; cleaning of building exterior surfaces; window cleaning; carpet and rug cleaning; floor polishing; septic tank cleaning; bathtub and bath boiler cleaning; street cleaning; reservoirs cleaning; sterilization of medical machines and apparatus; rental of construction machines and apparatus; rental of floor cleaning machines; rental of car-washing apparatus; rental of mining machines and apparatus; rental of drainage pumps. Architectural design; surveying; geological surveys or research; designing of machines, apparatus, instruments [including their parts] or systems composed of such machines, apparatus and instruments; designing; computer software design, computer programming, or maintenance of computer software; providing technical advice relating to computers, automobiles and industrial machines; research on building construction or city planning; testing or research on prevention of pollution; testing or research on electricity; testing or research on civil engineering; testing, inspection or research on agriculture, livestock breeding or fisheries; testing or research on machines, apparatus and instruments; rental of measuring apparatus; rental of computers; providing computer programs on data network; rental of laboratory apparatus and instrument; rental of technical drawing instruments.

55.

PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APPARATUS, AND POLISHING APPARATUS

      
Numéro d'application 18311421
Statut En instance
Date de dépôt 2023-05-03
Date de la première publication 2024-03-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Miyakawa, Toshiki
  • Saito, Kenichiro
  • Fukushima, Makoto

Abrégé

An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

Classes IPC  ?

  • B24B 37/20 - Tampons de rodage pour travailler les surfaces planes
  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage

56.

SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD

      
Numéro d'application 18458866
Statut En instance
Date de dépôt 2023-08-30
Date de la première publication 2024-03-14
Propriétaire Ebara Corporation (Japon)
Inventeur(s) Fujikata, Jumpei

Abrégé

The present disclosure provides a substrate processing apparatus and a protective layer forming method that can protect surfaces of metal regions after a polishing process from oxidation and adhesion of cutting chips and particles caused in a process after polishing. The substrate processing apparatus according to the present disclosure includes a polishing device for polishing a semiconductor substrate, a protective layer forming device for forming a protective layer on a surface of the substrate using a silane coupling agent or a resin protective film agent, and a control device. The control device controls the polishing device and the protective layer forming device such that the protective layer forming device forms the protective layer on the substrate after the polishing device finishes polishing the substrate.

Classes IPC  ?

  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

57.

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

      
Numéro d'application 18505194
Statut En instance
Date de dépôt 2023-11-09
Date de la première publication 2024-03-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Fukunaga, Akira
  • Watanabe, Katsuhide
  • Kobata, Itsuki
  • Tsujimura, Manabu

Abrégé

To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.

Classes IPC  ?

  • H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
  • B24B 37/015 - Commande de la température
  • B24B 37/04 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes
  • H01L 21/321 - Post-traitement

58.

SUBSTRATE CLAMPING APPARATUS

      
Numéro d'application 18508536
Statut En instance
Date de dépôt 2023-11-14
Date de la première publication 2024-03-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kondo, Daichi
  • Nakano, Hisajiro
  • Miyazaki, Mitsuru

Abrégé

A substrate clamping apparatus includes a substrate holding part which is movable between a closed state in which a substrate is clamped and an open state in which clamping of the substrate is released, a support column part which supports the substrate holding part and is capable of being raised and lowered, and an interlocking mechanism which interlocks a raising and lowering operation of the support column part with an opening and closing operation of the substrate holding part, in which an opening and closing operation range A of the substrate holding part in an up-and-down stroke S of the support column part includes at least a part of an intermediate region M of the up-and-down stroke S.

Classes IPC  ?

  • B25B 5/16 - Presses ou serre-joints - Parties constitutives, p.ex. mâchoires, fixations des mâchoires

59.

SUBSTRATE CLEANING DEVICE AND METHOD OF CLEANING SUBSTRATE

      
Numéro d'application 18511727
Statut En instance
Date de dépôt 2023-11-16
Date de la première publication 2024-03-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Oikawa, Fumitoshi
  • Fukaya, Koichi
  • Baba, Erina
  • Suemasa, Shuichi
  • Nakano, Hisajiro

Abrégé

A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

Classes IPC  ?

  • B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
  • B08B 1/04 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues utilisant des éléments actifs rotatifs

60.

MAGNETIC BEARING APPARATUS

      
Numéro d'application 18321814
Statut En instance
Date de dépôt 2023-05-23
Date de la première publication 2024-03-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kakesu, Yu
  • Tanaka, Kunihiko
  • Barada, Toshimitsu

Abrégé

A magnetic bearing apparatus capable of correcting inclination of a rotating element with a small magnetic attractive force and capable of stably supporting the rotating element is disclosed. The magnetic bearing apparatus includes: a non-magnetic ring made of non-magnetic material; and at least three axial magnetic poles arranged along a circumferential direction of the non-magnetic ring. Each axial magnetic pole has an arc-shaped coil and a coil housing that accommodates the coil therein. The at least three axial magnetic poles are fixed to the non-magnetic ring.

Classes IPC  ?

  • F16C 32/04 - Paliers non prévus ailleurs faisant usage de moyens de support magnétiques ou électriques

61.

INFORMATION PROCESSING DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023024292
Numéro de publication 2024/053221
Statut Délivré - en vigueur
Date de dépôt 2023-06-29
Date de publication 2024-03-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Murata Seiji
  • Sasaya Yusuke
  • Sakata Keisuke

Abrégé

[Problem] To provide an information processing device that enables the appropriate prediction of the effect of electromagnetic waves generated from an AC power line when substrate treatment is performed. [Solution] An information processing device 5 includes: a current value information generation unit 501 that generates current value information of AC current supplied to an AC device when substrate treatment is performed by a substrate treatment device which is provided with the AC device connected to an AC power supply via an AC power line, and which is provided with a control board that controls the AC device in order to perform substrate treatment for supplying a treatment fluid to a substrate or a treatment member while bringing the treatment member into contact with the substrate; and an electromagnetic wave effect information generation unit 502 that generates, on the basis of the current value information generated by the current value information generation unit 501, electromagnetic wave effect information indicating an effect of electromagnetic waves generated from the AC power line.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • G06N 20/00 - Apprentissage automatique
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

62.

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

      
Numéro d'application 18261697
Statut En instance
Date de dépôt 2021-12-14
Date de la première publication 2024-03-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Oikawa, Fumitoshi
  • Fukaya, Koichi
  • Miyazaki, Mitsuru

Abrégé

A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.

Classes IPC  ?

  • B08B 1/04 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues utilisant des éléments actifs rotatifs
  • B08B 1/02 - Nettoyage d'un ouvrage en mouvement, p.ex. d'une bande ou d'objets sur un transporteur
  • B08B 3/04 - Nettoyage impliquant le contact avec un liquide

63.

SURFACE PROPERTY MEASURING APPARATUS FOR POLISHING PAD, SURFACE PROPERTY MEASURING METHOD FOR POLISHING PAD, AND SURFACE PROPERTY JUDGING METHOD FOR POLISHING PAD

      
Numéro d'application 18272941
Statut En instance
Date de dépôt 2022-01-05
Date de la première publication 2024-03-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Ohshima, Kohei
  • Matsuo, Hisanori
  • Kimba, Toshifumi
  • Takada, Nobuyuki

Abrégé

The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).

Classes IPC  ?

  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage

64.

OUTPUT SIGNAL PROCESSING CIRCUIT FOR EDDY CURRENT SENSOR AND OUTPUT SIGNAL PROCESSING METHOD FOR EDDY CURRENT SENSOR

      
Numéro d'application 18504301
Statut En instance
Date de dépôt 2023-11-08
Date de la première publication 2024-03-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yamada, Hiroto
  • Takahashi, Taro
  • Shibue, Hiroaki
  • Abe, Atsushi
  • Tokunaga, Shinpei

Abrégé

An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

Classes IPC  ?

  • G01B 7/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

65.

INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, PROGRAM, SUBSTRATE PROCESSING APPARATUS, CRITERION DATA DETERMINATION APPARATUS, AND CRITERION DATA DETERMINATION METHOD

      
Numéro d'application 18508671
Statut En instance
Date de dépôt 2023-11-14
Date de la première publication 2024-03-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Maishigi, Keiji
  • Sugiura, Tetsuro
  • Usui, Katsuaki
  • Hatakeyama, Masahiro
  • Honma, Chikako
  • Osuga, Toru
  • Iwasaki, Koichi
  • Lin, Jie Yuan

Abrégé

An information processing apparatus detecting presence or absence of abnormality of a vacuum pump derived from a product produced within a target vacuum pump, including: a determination unit configured to determine a normal variation range or a normal time variation behavior of a target state quantity which is a state quantity varying depending on a load of gas flowing into the vacuum pump, based on at least one of past target state quantities of the target vacuum pump or another vacuum pump; and a comparison unit configured to compare a current target state quantity of the target vacuum pump with the normal variation range or the normal time variation behavior and output the comparison result.

Classes IPC  ?

  • F04C 28/28 - Dispositions de sécurité; Surveillance
  • F04D 27/00 - Commande, p.ex. régulation, des pompes, des installations ou des systèmes de pompage spécialement adaptés aux fluides compressibles
  • G06F 9/54 - Communication interprogramme
  • G06F 17/18 - Opérations mathématiques complexes pour l'évaluation de données statistiques

66.

GAS SOLUTION SUPPLY APPARATUS

      
Numéro d'application 18363815
Statut En instance
Date de dépôt 2023-08-02
Date de la première publication 2024-03-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Ozawa, Suguru
  • Araki, Yuji
  • Nakagawa, Yoichi
  • Watanabe, Toshifumi
  • Kimura, Risa
  • Kato, Ryuta

Abrégé

There is provided a gas solution supply apparatus capable of preventing bubbles from being generated in use at a point-of-use even if gas solution to be provided to a point-of-use has a high concentration. The gas solution supply apparatus 1 includes: a gas dissolving unit 4 that dissolves a source gas in a source liquid to produce a first gas solution; a first gas-liquid separator 10 that stores the first gas solution produced and produces a second gas solution through gas-liquid separation of the first gas solution; a pressure reducer 17 that depressurizes the second gas solution produced in the first gas-liquid separator 10; and a second gas-liquid separator 12 that stores the depressurized second gas solution and produces a third gas solution through gas-liquid separation of the second gas solution. The third gas solution is supplied to a point-of-use.

Classes IPC  ?

67.

SURFACE PROPERTY MEASURING SYSTEM, SURFACE PROPERTY MEASURING METHOD, POLISHING APPARATUS, AND POLISHING METHOD

      
Numéro d'application 18137280
Statut En instance
Date de dépôt 2023-04-20
Date de la première publication 2024-03-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kimba, Toshifumi
  • Ohshima, Kohei
  • Ota, Kohei

Abrégé

A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.

Classes IPC  ?

  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
  • B24B 49/08 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs à liquides ou pneumatiques
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques

68.

TILT PAD JOURNAL BEARING WITH LUBRICATION ARRANGEMENT

      
Numéro d'application 17899792
Statut En instance
Date de dépôt 2022-08-31
Date de la première publication 2024-02-29
Propriétaire Elliott Company (USA)
Inventeur(s)
  • Li, Wei
  • Thorat, Manish Rambhau
  • Pettinato, Brian Christopher
  • Braman, Christopher Joseph

Abrégé

A tilt pad journal bearing for supporting a rotating shaft includes an annular support ring and a plurality of arcuate pads tiltably mounted in the annular support ring and circumferentially spaced apart from each other. The tilt pad journal bearing further has a lubrication arrangement disposed between each pair of the plurality of arcuate pads. The lubrication arrangement includes a lubrication manifold connected to the annular support ring and recessed relative to a shaft support surface of adjacent arcuate pads to define an oil mixing cavity, and a plurality of lubrication nozzles protruding from the lubrication manifold into the oil mixing cavity. A cross-sectional flow area of at least one of the plurality of lubrication nozzles positioned toward a center of the lubrication manifold is larger than a cross-sectional flow area of a remainder of the plurality of nozzles.

Classes IPC  ?

  • F16C 17/03 - Paliers à contact lisse pour mouvement de rotation exclusivement pour charges radiales uniquement avec segments supportés obliquement, p.ex. paliers Michell
  • F16C 33/10 - Structures relatives à la lubrification

69.

TILT PAD JOURNAL BEARING WITH LUBRICATION ARRANGEMENT

      
Numéro de document 03209422
Statut En instance
Date de dépôt 2023-08-14
Date de disponibilité au public 2024-02-29
Propriétaire ELLIOTT COMPANY (USA)
Inventeur(s)
  • Li, Wei
  • Thorat, Manish Rambhau
  • Pettinato, Brian Christopher
  • Braman, Christopher Joseph

Abrégé

A tilt pad journal bearing for supporting a rotating shaft includes an annular support ring and a plurality of arcuate pads tiltably mounted in the annular support ring and circumferentially spaced apart from each other. The tilt pad journal bearing further has a lubrication arrangement disposed between each pair of the plurality of arcuate pads. The lubrication arrangement includes a lubrication manifold connected to the annular support ring and recessed relative to a shaft support surface of adjacent arcuate pads to define an oil mixing cavity, and a plurality of lubrication nozzles protruding from the lubrication manifold into the oil mixing cavity. A cross-sectional flow area of at least one of the plurality of lubrication nozzles positioned toward a center of the lubrication manifold is larger than a cross- sectional flow area of a remainder of the plurality of nozzles.

Classes IPC  ?

  • F16C 33/10 - Structures relatives à la lubrification
  • F01D 25/16 - Aménagement des paliers; Support ou montage des paliers dans les stators
  • F16C 17/03 - Paliers à contact lisse pour mouvement de rotation exclusivement pour charges radiales uniquement avec segments supportés obliquement, p.ex. paliers Michell

70.

POLISHING HEAD SYSTEM AND POLISHING METHOD

      
Numéro d'application 18237263
Statut En instance
Date de dépôt 2023-08-23
Date de la première publication 2024-02-29
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Nabeya, Osamu

Abrégé

A polishing-head system capable of precisely controlling a polishing rate for a substrate, such as a wafer, and more particularly a polishing rate at an edge portion is disclosed. The polishing-head system includes a polishing head, a head shaft, a head rotating mechanism, a multi-path rotary joint, a fluid supply line, and a pressure regulator, wherein the polishing head has a substrate pressing surface, a retainer ring, and pressure chambers arranged along a circumferential direction of the retainer ring, the head shaft has shaft flow-passages communicating with the pressure chambers, respectively, and the multi-path rotary joint is configured to sequentially provide a communication between the fluid supply line and the shall flow-passages each time the head shaft makes one revolution.

Classes IPC  ?

  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
  • B24B 37/04 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes
  • B24B 37/32 - Bagues de retenue

71.

SUBSTRATE STATE MEASUREMENT DEVICE, PLATING DEVICE, AND SUBSTRATE STATE MEASUREMENT METHOD

      
Numéro d'application JP2022032188
Numéro de publication 2024/042700
Statut Délivré - en vigueur
Date de dépôt 2022-08-26
Date de publication 2024-02-29
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shimoyama, Masashi
  • Masuda, Yasuyuki
  • Hiwatashi, Ryosuke

Abrégé

To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed layer, and rotate; at least one white confocal sensor for measuring the plate surface of the substrate supported by the stage; and a state measurement module for measuring the state of a power supply member contact region, which is a region of the substrate that comes into contact with a power supply member, on the basis of detection, by the white confocal sensor, of the power supply member contact region.

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 5/02 - Dépôt sur des surfaces déterminées
  • C25D 7/12 - Semi-conducteurs
  • H01L 21/66 - Test ou mesure durant la fabrication ou le traitement

72.

HEARTH COMPONENT, HEARTH COMPONENT PRODUCTION METHOD

      
Numéro d'application JP2023029843
Numéro de publication 2024/043187
Statut Délivré - en vigueur
Date de dépôt 2023-08-18
Date de publication 2024-02-29
Propriétaire
  • EBARA ENVIRONMENTAL PLANT CO., LTD. (Japon)
  • EBARA CORPORATION (Japon)
Inventeur(s)
  • Murasue So
  • Ishikawa Eiji
  • Koshima Masamitsu
  • Takigawa Shunsuke
  • Uyama Kenta
  • Fukushi Yusuke
  • Go Tetsu

Abrégé

This hearth component is provided with an in-incinerator exposed surface that is exposed to the inside of an incinerator. The in-incinerator exposed surface comprises a front surface and an upper surface, and at least the front surface is provided with a protective layer having grooves formed on the surface thereof.

Classes IPC  ?

  • F23H 17/12 - Barreaux à feu
  • B23K 26/342 - Soudage de rechargement
  • C22C 19/05 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel avec du chrome
  • C22C 30/02 - Alliages contenant moins de 50% en poids de chaque constituant contenant du cuivre

73.

INFORMATION PROCESSING APPARATUS AND MACHINE LEARNING APPARATUS

      
Numéro d'application 18451109
Statut En instance
Date de dépôt 2023-08-17
Date de la première publication 2024-02-22
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Huang, Ching Wei
  • Otaki, Hirofumi
  • Nakamura, Takamasa

Abrégé

An information processing apparatus includes: an information acquisition part, acquiring recipe information indicating processing content of polishing processing and finishing processing, and transfer time information indicating a transfer time required for each transfer processing; and a schedule creation part, based on the recipe information and the transfer time information, creating a substrate processing schedule by determining a start timing of each processing so that a final processing end time during which a final substrate after the finishing processing is carried out to a substrate carry-out position is shortest.

Classes IPC  ?

  • G06N 3/084 - Rétropropagation, p.ex. suivant l’algorithme du gradient

74.

PLATING DEVICE AND PLATING METHOD

      
Numéro d'application JP2022030375
Numéro de publication 2024/033999
Statut Délivré - en vigueur
Date de dépôt 2022-08-09
Date de publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Tsuji, Kazuhito

Abrégé

A plating device comprising: a plating tank configured so as to accommodate a plating solution; a substrate holder configured so as to hold a substrate to be plated; a rotating mechanism which rotates the substrate holder; a raising/lowering mechanism which raises/lowers the substrate holder; and a control unit. The substrate holder is equipped with: a contact member configured so as to come into contact with the substrate to enable power supply; a seal member configured so as to fill the gap between the substrate holder and the substrate; a liquid-holding part having the contact member inside and configured so as to hold a liquid when the gap between the substrate holder and the substrate is filled by the seal member; and an ejection port which is open to the liquid-holding part or to a space lying inside the substrate holder and communicating with the liquid-holding part or can be disposed on a lateral side of the substrate holder and which has been configured so that the liquid is ejected.

Classes IPC  ?

  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir

75.

SUBSTRATE HOLDER, PLATING DEVICE, AND SUBSTRATE POSITIONING METHOD

      
Numéro d'application JP2022030545
Numéro de publication 2024/034047
Statut Délivré - en vigueur
Date de dépôt 2022-08-10
Date de publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Tomita, Masaki

Abrégé

The present disclosure provides a substrate holder having a centering pin that does not push the substrate any farther toward the center than the design position even if a first holding member deviates from the design position with respect to a second holding member when positioning the substrate. The substrate holder according to the present disclosure has a first holding member and a second holding member. The second holding member has a positioning member for positioning the substrate at a predetermined position and a stopper. The positioning member has a centering pin that can move between a first position and a second position. The centering pin is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first holding member has a drive member configured to bias the centering pin to the first position when the substrate is held by the first holding member and second holding member. The stopper is configured to contact the centering pin and stop the centering pin at the first position.

Classes IPC  ?

  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir

76.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Numéro d'application 18257898
Statut En instance
Date de dépôt 2021-11-09
Date de la première publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Ota, Kohei
  • Takada, Nobuyuki

Abrégé

To suppress damage to a surface to be polished of a substrate and improve a polishing rate. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, a nozzle 228 for supplying a polishing liquid around the pad holder 226, and a pad rotation mechanism for rotating the pad holder 226. The pad holder 226 includes a discharge hole 221-2a formed in the center of a holding surface 221-2c configured to hold the polishing pad 222 and a discharge passage 221-2b communicated with an outside of the pad holder 226 from the discharge hole 221-2a.

Classes IPC  ?

  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 37/04 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes
  • H01L 21/306 - Traitement chimique ou électrique, p.ex. gravure électrolytique

77.

CLEANING APPARATUS FOR CLEANING MEMBER, CLEANING METHOD FOR CLEANING MEMBER, AND SUBSTRATE CLEANING METHOD

      
Numéro d'application 18266774
Statut En instance
Date de dépôt 2021-12-14
Date de la première publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Uno, Megumi
  • Fukunaga, Akira
  • Takatoh, Chikako
  • Nakamura, Yumiko

Abrégé

A cleaning apparatus for cleaning member has a member cleaning part 30 that cleans a cleaning member 10 that cleans a substrate W; and a measurement part 20 that measures a degree of cleanliness of the cleaning member 10 cleaned by the member cleaning part 30.

Classes IPC  ?

  • B08B 1/00 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues
  • B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
  • B08B 1/02 - Nettoyage d'un ouvrage en mouvement, p.ex. d'une bande ou d'objets sur un transporteur
  • B08B 1/04 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues utilisant des éléments actifs rotatifs
  • B08B 3/04 - Nettoyage impliquant le contact avec un liquide
  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

78.

PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET METHOD

      
Numéro d'application 18494501
Statut En instance
Date de dépôt 2023-10-25
Date de la première publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Seki, Masaya
  • Yahagi, Mitsutoshi
  • Yamada, Nobuya

Abrégé

A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.

Classes IPC  ?

  • B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
  • C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement; Dépôt par contact par réduction ou par substitution, p.ex. dépôt sans courant électrique
  • C23C 18/18 - Pré-traitement du matériau à revêtir

79.

PRE-WET MODULE

      
Numéro d'application JP2022030266
Numéro de publication 2024/033966
Statut Délivré - en vigueur
Date de dépôt 2022-08-08
Date de publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Yahagi, Mitsutoshi

Abrégé

The present invention achieves a small pre-wet module that is capable of performing different pre-processes. This pre-wet module 200 includes: a stage 220 configured so as to hold a rear surface of a substrate WF having a surface WF-a to be processed that faces upward; a rotating mechanism 224 configured so as to rotate the stage 220; a cleaning liquid supply member 260 that has nozzles 262 disposed above the stage 220 and is configured so as to supply a cleaning liquid in the direction of the stage 220 via the nozzles 262; and a degassed liquid supply member 250 that is configured so as to supply a degassed liquid to the surface WF-a to be processed of the base plate WF held on the stage 220, wherein the degassed liquid supply member 250 is configured so as to be able to move between a supply position between the nozzles 262 and the surface WF-a to be processed of the substrate WF and a retreat position to which to retreat between the nozzles 262 and the surface WF-a to be processed of the substrate WF.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • C25D 7/12 - Semi-conducteurs
  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique

80.

DED NOZZLE FOR USE WITH AN AM APPARATUS AND ADAPTER DETACHABLY ATTACHABLE TO A DED NOZZLE

      
Numéro d'application 18258828
Statut En instance
Date de dépôt 2021-11-18
Date de la première publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Shinozaki, Hiroyuki

Abrégé

The present disclosure provides a technique for carrying out fabrication on a powder material bedded in advance using a DED nozzle. According to one aspect, a DED nozzle for use with an AM apparatus is provided. This DED nozzle includes a DED nozzle main body, a laser port provided at a distal end of the DED nozzle main body and configured to emit laser light, a laser passage provided in communication with the laser port and configured to allow the laser light to pass through inside the DED nozzle main body, a powder port provided at the distal end of the DED nozzle main body and configured to eject a powder material, and a powder passage provided in communication with the powder port and configured to allow the powder material to pass through inside the DED nozzle main body. Directions of the powder passage and the powder port are determined based on a distance from the powder port to a fabrication point, a velocity of the powder material ejected from the powder port, and a gravitational acceleration.

Classes IPC  ?

  • B22F 12/53 - Buses
  • B22F 12/41 - Moyens de rayonnement caractérisés par le type, p.ex. laser ou faisceau d’électrons

81.

PREWET MODULE AND PREWET METHOD

      
Numéro d'application 17761841
Statut En instance
Date de dépôt 2021-05-31
Date de la première publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Seki, Masaya

Abrégé

Efficiency of a cleaning process and a degassing process for a surface to be processed of a substrate is improved. Efficiency of a cleaning process and a degassing process for a surface to be processed of a substrate is improved. A pre-wet module 200 includes a stage 220, a rotation mechanism 224, a pre-wet chamber 260, an elevating mechanism 230, a degassing liquid supply member 204, a nozzle 268, and a cleaning liquid supply member 202. The stage 220 is configured to hold a back surface of a substrate WF with a surface to be processed WF-a facing upward. The rotation mechanism 224 is configured to rotate the stage 220. The pre-wet chamber 260 includes a lid member 262 and a tubular member 264. The lid member 262 has an opposed surface 262a opposed to the surface to be processed WF-a of the substrate WF. The tubular member 264 is installed on an outer edge portion of the opposed surface 262a of the lid member 262. The elevating mechanism 230 is configured to move up and down the pre-wet chamber 260. The degassing liquid supply member 204 is configured to supply a degassing liquid to a pre-wet space 269 formed between the pre-wet chamber 260 and the surface to be processed WF-a of the substrate WF. The nozzle 268 is installed on the opposed surface 262a of the lid member 262. The cleaning liquid supply member 202 is configured to supply a cleaning liquid to the surface to be processed WF-a of the substrate WF via the nozzle 268.

Classes IPC  ?

  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
  • C25D 7/12 - Semi-conducteurs

82.

SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER READABLE MEDIUM

      
Numéro d'application 18358953
Statut En instance
Date de dépôt 2023-07-26
Date de la première publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Sugiyama, Mitsunori

Abrégé

A control device of a substrate processing apparatus is configured to execute: calculating patterns for changing an order of loading to the substrate processing apparatus for multiple substrates loaded to the substrate processing apparatus; generating, for each obtained pattern, a time table in which process end times in the polishing device, the cleaning device, and the transport device are associated, so that an idling state does not occur from a time when the substrates are loaded to the substrate processing apparatus until a cleaning process ends; selecting a time table with a shortest time from a time when a process of a substrate initially loaded to the substrate processing apparatus starts until a process of a lastly loaded substrate ends in the obtained time tables; and controlling timings of loading the substrates to the substrate processing apparatus based on the selected time table.

Classes IPC  ?

  • G05B 19/4155 - Commande numérique (CN), c.à d. machines fonctionnant automatiquement, en particulier machines-outils, p.ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'u caractérisée par le déroulement du programme, c.à d. le déroulement d'un programme de pièce ou le déroulement d'une fonction machine, p.ex. choix d'un programme

83.

PLATING METHOD AND PLATING APPARATUS

      
Numéro d'application JP2022029628
Numéro de publication 2024/028973
Statut Délivré - en vigueur
Date de dépôt 2022-08-02
Date de publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tsuji, Kazuhito
  • Yamamoto, Kentaro

Abrégé

A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction, the plating method including: a step for rotating the substrate holder at a first rotation speed in a state in which the substrate holder is inclined; a step for discharging a liquid towards the substrate holder rotating at the first rotation speed so that the liquid is fed to the contact member; a step for stopping the discharging of the liquid; a step for beginning, before or within a prescribed time after the discharging of the liquid is stopped, to reduce the incline of the substrate holder towards a horizontal position; a step for rotating the substrate holder at a second rotation speed higher than the first rotation speed, in a state in which the substrate holder is in the horizontal position; and a step for performing the plating process on the substrate after the substrate has been mounted on the substrate holder.

Classes IPC  ?

  • C25D 21/00 - Procédés pour l'entretien ou la conduite des cellules pour revêtement électrolytique
  • C25D 7/12 - Semi-conducteurs
  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir

84.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023023932
Numéro de publication 2024/029236
Statut Délivré - en vigueur
Date de dépôt 2023-06-28
Date de publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Mitani, Ryuichiro

Abrégé

[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-point detection function for detecting that a chemical mechanical polishing process has reached the end point. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires reliability decrease cause state information during a chemical mechanical polishing process being performed on a substrate by a substrate processing device 2, the reliability decrease cause state information including at least one of wear state information indicating the state of wear of a constituent element of the substrate processing device 2, and processing state information indicating processing state during the polishing process; and a state prediction unit 501 that inputs the reliability decrease cause state information acquired by the information acquisition unit 500 into a learning model that has learned, by machine learning, the correlation between the reliability decrease cause state information and reliability information of a polishing end-point detection function indicating the reliability of an end-point detection function for detecting that the chemical mechanical polishing process has reached an end point, thereby predicting the reliability information of the polishing end-point detection function with respect to the reliability decrease cause state information.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques

85.

FILLER APPLICATION DEVICE

      
Numéro d'application JP2023024142
Numéro de publication 2024/029244
Statut Délivré - en vigueur
Date de dépôt 2023-06-29
Date de publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Satake, Masayuki
  • Tajima, Kazuhiro

Abrégé

The present invention relates to a filler application device that applies a filler to a gap formed between the edge parts of a plurality of boards that constitute a laminated board. This filler application device (100) comprises: a board holding unit (33) that holds and rotates a laminated board (Ws) manufactured by joining a first board (W1) and a second board (W2); an application device (39) that is disposed away from the laminated board (Ws) held by the board holding unit (33), and discharges a filler (F) toward a gap (G) formed between the peripheral edge of the first board (W1) and the peripheral edge of the second board (W2); and a protector (12) that prevents the attachment of liquid splash (Fs) of the filler (F) that occurs when the filler (F) discharged from the application device (39) collides with the gap (G) on the top surface and/or the bottom surface of the laminated board (Ws).

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

86.

POLISHING APPARATUS

      
Numéro d'application 18352325
Statut En instance
Date de dépôt 2023-07-14
Date de la première publication 2024-02-01
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Miura, Shumpei
  • Suzuki, Kenichi
  • Kobata, Itsuki
  • Motoshima, Yasuyuki
  • Ito, Ban
  • Yun, Seungho

Abrégé

A polishing apparatus is disclosed, which is capable of heating and maintaining a temperature distribution of a polishing pad at a predetermined temperature distribution with a simple structure. The polishing apparatus has a pad-temperature regulating apparatus for regulating a temperature of a polishing surface, and the pad-temperature regulating apparatus includes a heating-fluid nozzle arranged above and spaced apart from the polishing surface. The heating-fluid nozzle includes: a nozzle body; a slit formed along a longitudinal direction of the nozzle body for ejecting a heating fluid toward the polishing surface; a header tube which is formed within the nozzle body and into which the heating fluid is supplied; a buffer tube which is formed within the nozzle body and communicates with the slit, and a plurality of branch tubes for coupling the header tube to the buffer tube.

Classes IPC  ?

87.

BEARING APPARATUS AND LASER APPARATUS COMPRISING BEARING APPARATUS

      
Numéro d'application 18357356
Statut En instance
Date de dépôt 2023-07-24
Date de la première publication 2024-02-01
Propriétaire
  • EBARA CORPORATION (Japon)
  • Gigaphoton Inc. (Japon)
Inventeur(s)
  • Satoh, Ichiju
  • Niizuma, Motoi
  • Hirasawa, Kazuki
  • Ishii, Takuya

Abrégé

An object of the invention is to provide a bearing apparatus which is superior in corrosion resistance against a fluorine gas, and superior in dimensional accuracy and durability. For achieving the object, a bearing apparatus for use in an environment where a fluorine gas exists is provided. The bearing apparatus comprises: a magnetic bearing comprising a magnetic member and an electromagnetic coil; and a touchdown bearing for protecting the magnetic bearing, wherein the touchdown bearing comprises an inner ring, an outer ring, and plural rolling members arranged between the inner ring and the outer ring, wherein the inner ring and the outer ring in the touchdown bearing are constructed by using a NiCrAl alloy.

Classes IPC  ?

  • F16C 32/04 - Paliers non prévus ailleurs faisant usage de moyens de support magnétiques ou électriques
  • H01S 3/036 - Moyens pour obtenir ou maintenir la pression désirée du gaz à l'intérieur du tube, p.ex. au moyen d'un getter ou d'une réactivation; Moyens pour faire circuler le gaz, p.ex. pour uniformiser la pression à l'intérieur du tube

88.

SUBSTRATE HOLDER, APPARATUS FOR PLATING, METHOD OF PLATING AND STORAGE MEDIUM

      
Numéro d'application 18016663
Statut En instance
Date de dépôt 2021-01-08
Date de la première publication 2024-02-01
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Takahashi, Naoto

Abrégé

One object of the present disclosure is to suppress or prevent a plating solution from entering a sealed space of a substrate holder and to detect entry of the plating solution promptly. There is provided a substrate holder configured to hold a substrate and cause the substrate to come into contact with a plating solution and to be plated. The substrate holder comprises an internal space configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside of the substrate holder, in a state that the substrate is held by the substrate holder; a first passage configured to connect the outside of the substrate holder with the internal space and to introduce a liquid into the internal space; and a detector placed in the internal space and configured to monitor an electric current flowing in the liquid or an electric resistance of the liquid during plating in a state that the liquid is introduced into the internal space and thereby detect a leakage of the plating solution to the internal space.

Classes IPC  ?

89.

INFORMATION PROCESSING DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023024389
Numéro de publication 2024/024391
Statut Délivré - en vigueur
Date de dépôt 2023-06-30
Date de publication 2024-02-01
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Wakiyama, Takeshi
  • Murata, Seiji

Abrégé

The present invention relates to an information processing device, a machine learning device, an information processing method, and a machine learning method. An information processing device (5) comprises: a fluid supply information acquisition unit (500) for, in a substrate process performed by a substrate processing device provided with a processing member which is to be brought into contact with a substrate and which performs a prescribed substrate process thereon and a processing fluid supply unit for supplying a processing fluid to the substrate or to the processing member, acquiring fluid supply information that includes processing fluid state information indicating the supply state of the processing fluid to be supplied from the processing fluid supply unit; and a fluid distribution information generation unit (501) for generating, on the basis of the fluid supply information acquired by the fluid supply information acquisition unit (500), fluid distribution information indicating the distribution state when the processing fluid supplied from the processing fluid supply unit is distributed while passing through a position of contact between the substrate and the processing member.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • G06N 20/00 - Apprentissage automatique

90.

Pump casing

      
Numéro d'application 29783034
Numéro de brevet D1012975
Statut Délivré - en vigueur
Date de dépôt 2021-05-11
Date de la première publication 2024-01-30
Date d'octroi 2024-01-30
Propriétaire Ebara Corporation (Japon)
Inventeur(s)
  • Ogawa, Soichiro
  • Nakamura, Yoichi
  • Kyo, Seigo

91.

SURFACE PROPERTY JUDGING METHOD AND SURFACE PROPERTY JUDGING SYSTEM

      
Numéro d'application 18223360
Statut En instance
Date de dépôt 2023-07-18
Date de la première publication 2024-01-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kimba, Toshifumi
  • Ohshima, Kohei

Abrégé

A surface property judging method and a surface property judging system for a polishing pad capable of appropriately judging a surface property of the polishing pad are disclosed. The surface property judging method includes: rotating a polishing table together with a polishing pad which is supported by the polishing table; generating surface data by a surface data generator, the surface data containing a plurality of shape index values representing a surface property of the polishing pad; producing a histogram indicating a distribution of the plurality of shape index values based on the surface data; and judging the surface property of the polishing pad based on the histogram.

Classes IPC  ?

  • G01B 21/30 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la rugosité ou l'irrégularité des surfaces

92.

POLISHING METHOD AND POLISHING APPARATUS

      
Numéro d'application 18223326
Statut En instance
Date de dépôt 2023-07-18
Date de la première publication 2024-01-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Nabeya, Osamu

Abrégé

A polishing method for a wafer using a polishing head having a plurality of pressure chambers formed by an elastic membrane is disclosed. The polishing method includes: forming a positive pressure in a first pressure chamber and forming a negative pressure in a second chamber to move fluid present between an upper surface of the wafer and the first pressure chamber outward; then forming a positive pressure in the second chamber and forming a negative pressure in a third pressure chamber to move the fluid present between the upper surface of the wafer and the second pressure chamber outward; then forming a positive pressure in outermost pressure chamber of the plurality of pressure chambers to move the fluid present between the upper surface of the wafer and the outermost pressure chamber outward to thereby cause the fluid to flow out from the upper surface of the wafer; and then pressing a lower surface of the wafer against a polishing surface with the elastic membrane to polish the lower surface of the wafer.

Classes IPC  ?

  • B24B 37/04 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes
  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage

93.

METHOD AND APPARATUS FOR CLEANING WASHING TOOL, SUBSTRATE WASHING DEVICE, AND METHOD FOR MANUFACTURING WASHING TOOL

      
Numéro d'application 18041579
Statut En instance
Date de dépôt 2021-07-28
Date de la première publication 2024-01-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Uno, Megumi
  • Fukunaga, Akira
  • Takatoh, Chikako
  • Nakamura, Yumiko

Abrégé

A cleaning apparatus performing cleaning treatment for a washing tool used for substrate washing by causing the washing tool to contact with a cleaning member while supplying a washing liquid to the washing tool includes a liquid extraction unit that extracts the washing liquid remaining in the washing tool or the washing liquid flowing out from the washing tool in the cleaning treatment, a color reaction unit that applies an iodine color reaction to the washing liquid extracted by the liquid extraction unit, and a determination unit that detects a coloration degree of the washing liquid subjected to the iodine color reaction and determines whether or not cleaning of the washing tool is completed based on the detected coloration degree.

Classes IPC  ?

  • B08B 3/08 - Nettoyage impliquant le contact avec un liquide le liquide ayant un effet chimique ou dissolvant
  • B08B 1/00 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues
  • B08B 1/04 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues utilisant des éléments actifs rotatifs
  • B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage

94.

SUBSTRATE PRODUCTION METHOD AND SUBSTRATE PRODUCTION APPARATUS

      
Numéro d'application JP2023022221
Numéro de publication 2024/014221
Statut Délivré - en vigueur
Date de dépôt 2023-06-15
Date de publication 2024-01-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Satake, Masayuki

Abrégé

The present invention relates to a substrate production method and a substrate production apparatus. A substrate production method according to the present invention comprises: a step in which a filler (F) is applied to a space between a bevel part of a first substrate (W1) and a bevel part of a second substrate (W2); and a step in which air bubbles are removed from the filler (F) that has been applied to the space.

Classes IPC  ?

  • H01L 23/12 - Supports, p.ex. substrats isolants non amovibles

95.

SUBSTRATE HOLDING DEVICE, SUBSTRATE MANUFACTURING DEVICE, AND SUBSTRATE MANUFACTURING METHOD

      
Numéro d'application JP2023022255
Numéro de publication 2024/014223
Statut Délivré - en vigueur
Date de dépôt 2023-06-15
Date de publication 2024-01-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Satake, Masayuki
  • Nakanishi, Masayuki

Abrégé

The present invention relates to a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method. A substrate holding device (1) comprises a holding roller (51) and a fluid blowing device (60) that blows pressurized fluid out to a bevel section (B) held by the holding roller (51).

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

96.

POLISHING APPARATUS AND POLISHING METHOD

      
Numéro d'application 18034517
Statut En instance
Date de dépôt 2021-08-19
Date de la première publication 2024-01-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yazawa, Akihiro
  • Miyasawa, Yasuyuki

Abrégé

To provide a technique that allows accurately measuring a polishing state of a substrate. To provide a technique that allows accurately measuring a polishing state of a substrate. A polishing apparatus 100 includes: a sensor head 40 that includes a projector configured to project incident light, a condenser configured to condense the incident light projected from the projector and cause the incident light to be incident on a substrate Wf, and an optical receiver configured to receive reflected light reflected by the substrate; a displacement mechanism 60 configured to relatively displace the condenser with respect to the substrate to change a distance between the condenser and the substrate; an abrade amount measurement device 70 configured to measure an abrade amount of a polishing pad 90; and a control device 80. The control device is configured to measure a polishing state of the substrate based on a light amount parameter of the reflected light received by the optical receiver and control the displacement mechanism based on the abrade amount of the polishing pad measured by the abrade amount measurement device such that the distance between the condenser and the substrate is maintained at a preliminarily set reference distance.

Classes IPC  ?

  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
  • B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage

97.

FLUID-PATH SWITCHING APPARATUS AND METHOD OF PREVENTING IDLING ROTATION OF SUBMERSIBLE PUMP

      
Numéro d'application 18253610
Statut En instance
Date de dépôt 2021-08-27
Date de la première publication 2024-01-11
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Kasatani, Tetsuji
  • Ikeda, Hayato
  • Iwami, Mitsutaka

Abrégé

The present invention relates to a technique of preventing idling rotation of a submersible pump used for delivering liquefied gas, such as liquefied ammonia, liquid hydrogen, liquid nitrogen, liquefied natural gas, liquefied ethylene gas, or liquefied petroleum gas. A fluid-path switching apparatus (5) includes: a flow-passage structure (45) having a first flow passage (41), a second flow passage (42), and a third flow passage (43); and a valve element (47) for allowing the third flow passage (43) to selectively communicate with the first flow passage (41) or the second flow passage (42). The first flow passage (41) communicates with a discharge outlet (1b) of the submersible pump (1), the second flow passage (42) communicates with an interior of the suction vessel (2), and the third flow passage (43) communicates with a discharge port (8) of the suction vessel (2).

Classes IPC  ?

  • F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
  • F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
  • F04D 29/44 - Moyens de guidage du fluide, p.ex. diffuseurs

98.

MACHINE LEARNING APPARATUS, SLIDING-SURFACE DIAGNOSIS APPARATUS, INFERENCE APPARATUS, MACHINE LEARNING METHOD, MACHINE LEARNING PROGRAM, SLIDING-SURFACE DIAGNOSIS METHOD, SLIDING-SURFACE DIAGNOSIS PROGRAM, INFERENCE METHOD, AND INFERENCE PROGRAM

      
Numéro d'application 18246648
Statut En instance
Date de dépôt 2021-09-24
Date de la première publication 2024-01-11
Propriétaire
  • EBARA CORPORATION (Japon)
  • UNIVERSITY OF FUKUI (Japon)
Inventeur(s)
  • Takatoh, Chikako
  • Nakamura, Yumiko
  • Sugiyama, Kazuhiko
  • Honda, Tomomi

Abrégé

A machine learning apparatus (4) generates a learning model (6) to be used in a sliding-surface diagnosis apparatus (1A) for diagnosing a condition of sliding surfaces of a fixed-side sliding member and a rotation-side sliding member. The machine learning apparatus (4) includes: a learning-data memory (41) configured to store learning data including input data containing at least data on motor current value in a predetermined period, data on contact electric resistance in the predetermined period, and data on vibration (AE wave or acceleration) in the predetermined period; a machine learning section (42) configured to input the learning data to the learning model (6) to cause the learning model (6) to learn a correlation between the input data and diagnostic information of the sliding surfaces; and a learned-model memory (43) configured to store the learning model (6) that has learned by the machine learning section (42).

Classes IPC  ?

  • G01H 1/00 - Mesure des vibrations dans des solides en utilisant la conduction directe au détecteur
  • G06N 20/20 - Techniques d’ensemble en apprentissage automatique
  • F16N 29/04 - Dispositifs particuliers dans les installations ou systèmes de lubrification indiquant ou détectant des conditions indésirables; Utilisation des dispositifs sensibles à ces conditions dans les installations ou systèmes de lubrification permettant d'arrêter des pièces en mouvement
  • F16C 17/24 - Paliers à contact lisse pour mouvement de rotation exclusivement caractérisés par des particularités sans rapport avec la direction de la charge avec dispositifs affectés par des conditions anormales ou indésirables, p.ex. pour empêcher un surchauffement, pour la sécurité

99.

BUFFER CHAMBER AND AM SYSTEM INCLUDING A BUFFER CHAMBER

      
Numéro d'application 18248091
Statut En instance
Date de dépôt 2021-09-14
Date de la première publication 2024-01-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shinozaki, Hiroyuki
  • Asai, Junki
  • Mukaiyama, Yoshitaka

Abrégé

The present invention constructs, in an AM system, such an environment that fine particles are prevented from scattering from an area where the fine particles such as a powder material can be present to another area. According to one aspect, an AM system configured to manufacture a fabrication object is provided. This AM system includes a fabrication chamber in which an AM apparatus is disposed, and a buffer chamber in communication with the fabrication chamber. The buffer chamber includes an entrance in communication with a surrounding environment, an exit in communication with the fabrication chamber, a grating floor, and an exhaust port. The AM system further includes a first gate configured to be able to open and close the entrance of the buffer chamber, and a second gate configured to be able to open and close the exit of the buffer chamber.

Classes IPC  ?

  • B22F 12/00 - Appareils ou dispositifs spécialement adaptés à la fabrication additive; Moyens auxiliaires pour la fabrication additive; Combinaisons d’appareils ou de dispositifs pour la fabrication additive avec d’autres appareils ou dispositifs de traitement ou de fabrication
  • B22F 10/28 - Fusion sur lit de poudre, p.ex. fusion sélective par laser [FSL] ou fusion par faisceau d’électrons [EBM]
  • B22F 10/322 - Commande ou régulation des opérations de l’atmosphère, p.ex. de la composition ou de la pression dans une chambre de fabrication d’un écoulement de gaz, p.ex. du débit ou de la direction
  • B22F 12/70 - Moyens d’écoulement des gaz
  • B33Y 30/00 - Appareils pour la fabrication additive; Leurs parties constitutives ou accessoires à cet effet

100.

RETAINER, TOP RING, AND SUBSTRATE PROCESSING APPARATUS

      
Numéro d'application 18268082
Statut En instance
Date de dépôt 2021-10-22
Date de la première publication 2024-01-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Ishii, Yu

Abrégé

A retainer is disposed around a holding region 39 of a polygonal substrate WF in a top ring for holding the polygonal substrate WF with a surface to be polished facing downward. The retainer 30 includes a plurality of retainer main bodies 3 disposed around the holding region 39 independently along respective sides of the polygonal substrate WF. At least one of the plurality of retainer main bodies 3 includes a first securing surface (first surface 3a), a first opposed surface (second surface 3b), a second securing surface (third surface 3c), and a second opposed surface (fourth surface 3d). The first securing surface is securable to a retainer holding member 37 of the top ring, the first opposed surface is opposed to the holding region 39 in a first state where the first securing surface is secured to the retainer holding member 37, the second securing surface is securable to the retainer holding member 37 in a second state where the retainer main body 3 is rotated by 180 degrees from the first state, and the second opposed surface is opposed to the holding region 39 in a state where the second securing surface is secured to the retainer holding member 37.

Classes IPC  ?

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