The present invention relates to a shunt resistor and a shunt resistor manufacturing method. A shunt resistor (1) comprises a pair of electrodes (6, 7) connected to both ends of a resistor element (5). The pair of electrodes (6, 7) has a pair of voltage detection units (20, 21), and a hole (70) is provided in the resistor element (5) between the pair of voltage detection units (20, 21).
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
H01C 17/232 - Ajustement du coefficient de température; Ajustement de la valeur de la résistance par ajustement du coefficient de température
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
The present invention provides: a temperature sensor which enables further simplification of a step for connecting a terminal; and a current detection device. This temperature sensor for measuring the temperature of a shunt resistor is provided with: a resin film which has a first surface and a second surface; a first conductive pattern which is provided on the first surface side of the resin film and serves as a temperature sensing part; and a pair of second conductive patterns which are provided on the first surface side or the second surface side of the resin film for the purpose of detecting the voltage of the shunt resistor.
G01K 7/16 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs
G01K 1/14 - Supports; Dispositifs de fixation; Dispositions pour le montage de thermomètres en des endroits particuliers
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
G01R 19/00 - Dispositions pour procéder aux mesures de courant ou de tension ou pour en indiquer l'existence ou le signe
G01R 19/32 - Compensation des variations de température
A resistor 10, which is an electronic component that provides suppression of thermal effects on a circuit board, has a structure in which an exterior member 5 encloses, inter alia: a resistor body 7 formed in a central area 6 of a first surface of an insulating substrate 2 and internal electrodes 8a to 8d that are formed in opposing edge areas 9a, 9b that sandwich the central area 6, wherein, at an upper surface portion of the exterior member 5, a second surface of the insulating substrate 2 is close-contactably exposed to an outer metal member 14. In addition, within a lower surface portion of the exterior member 5, protrusions 5a, 5b, which distance the resistor 10 from a circuit substrate 12, are formed at locations that contain a lead-out section of a lead terminal 3a to 3d and a corresponding region in the thickness direction of the exterior member.
H01C 1/084 - Dispositions de réfrigération, de chauffage ou de ventilation par refroidissement naturel, p.ex. ailettes, dissipateurs thermiques
H01C 1/028 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe l'élément résistif étant enrobé dans un matériau isolant pourvu d'une gaine extérieure
H01C 1/034 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
The present invention relates to a resistor, particularly to a surface-mount resistor. A resistor (1) comprises protrusions (10, 10) that are formed on side surfaces (3c, 3c) of a pair of cap-like electrodes (3, 3).
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
5.
ALL-SOLID-STATE POTASSIUM ION SELECTIVE ELECTRODE, AND METHOD FOR PRODUCING SAME
x6y22O, at least a portion of the Prussian blue analog particles has a monoclinic crystal structure, x is a number of 1.5-2, y is a number greater than 0 and less than or equal to 1, and n is a number greater than or equal to 0.
The present invention provides a chip resistor which has excellent corrosion resistance. A chip resistor 1 according to the present invention is provided with: a rectangular parallelopiped insulating substrate 2; a pair of front electrodes 3 that are formed on opposite ends of the front surface of the insulating substrate 2; a pair of back electrodes 4 that are formed on opposite ends of the back surface of the insulating substrate 2; a resistor 5 that bridges the pair of front electrodes 3; a second insulating layer (protective film) 7 that is formed from a resin material and covers the resistor 5; a third insulating layer (auxiliary film) 8 that is formed from a resin material and is superposed on the second insulating layer 7; a pair of auxiliary electrode layers 9 that are formed from a resin material containing conductive particles and are superposed on the front electrodes 3; a pair of end-face electrodes 10 that extend on opposite end faces of the insulating substrate 2 and enable electrical conduction between the auxiliary electrode layers 9 and the back electrodes 4; and a pair of outer plated layers 11 that are arranged so as to cover the surfaces of the auxiliary electrode layers 9 and the end-face electrodes 10. The auxiliary electrode layers 9 are formed to positions at which end surfaces of the third insulating layer 8 are covered; and the second insulating layer 7 contains a larger amount of an inorganic filler than the third insulating layer 8.
H01C 1/032 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe avec plusieurs couches entourant l'élément résistif
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The present invention pertains to a shunt resistor and a shunt resistance device. A shunt resistor (1) comprises at least two stacked elements (50) which are each attached to an electrode member (10) and have a resistor (5). The electrode member (10) has at least two contact parts (10a) that come in contact with the at least two stacked elements (50).
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
The present invention relates to a shunt resistor and a current detection device. A current detection unit (2) includes voltage detection terminals (8A, 8B) provided at first characteristic positions on electrodes (6, 7) where the temperature coefficient of resistance of a shunt resistor (1) is a first coefficient, and voltage detection terminals (8C, 8D) provided at second characteristic positions on the electrodes (6, 7) where the temperature coefficient of resistance of the shunt resistor (1) is a second coefficient. The first coefficient and the second coefficient are different numerical values.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
This load sensor element comprises: a substrate; an inorganic layer which is a first layer that is provided on a surface, which is one surface of the substrate, and that covers a section of the substrate; and a thin film resistor that is provided on the surface. The thin film resistor includes: a body section that is sandwiched between the substrate and the inorganic layer; and a first end section and a second end section that are mounted at an exposed section of the substrate that is not covered by the inorganic layer. The load sensor element also comprises a reinforcing layer which is a second layer that is provided on an underside surface, which is the other surface of the substrate, so as to sandwich the substrate together with the inorganic layer. In the load sensor element, the inorganic layer and the reinforcing layer are disposed so that one edge of the inorganic layer which contacts the surface and one edge of the reinforcing layer which contacts the underside surface are aligned in the thickness direction of the substrate.
G01L 1/22 - Mesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c. à d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte en utilisant des jauges de contrainte à résistance
G01L 1/26 - Mesures auxiliaires prises, ou dispositifs utilisés en liaison avec le mesurage des forces, p.ex. pour empêcher l'influence des composantes transversales de la force, pour empêcher la surcharge
This load sensor element comprises a substrate, and an inorganic layer which has an accepting surface for accepting a load and which is provided so as to cover a portion of a top surface, which is one surface of the substrate. The load sensor element is provided with a thin-film resistor configured from a resistor having a resistance value that varies in accordance with the load accepted by the inorganic layer. The thin-film resistor includes a main body portion sandwiched between the substrate and the inorganic layer, and one end portion and an other end portion, which are two end portions placed on exposed portions of the substrate that are not covered by the inorganic layer. The load sensor element is provided with a first temperature compensation resistor which is independent of the thin-film resistor and which is disposed on an exposed portion 28 of the top surface, which is said one surface of the substrate. The load sensor element is provided with a second temperature compensation resistor which is disposed on a rear surface, being another surface of the substrate, and which exhibits the same behavior as the first temperature compensation resistor.
G01L 1/22 - Mesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c. à d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte en utilisant des jauges de contrainte à résistance
G01L 1/26 - Mesures auxiliaires prises, ou dispositifs utilisés en liaison avec le mesurage des forces, p.ex. pour empêcher l'influence des composantes transversales de la force, pour empêcher la surcharge
Provided is a chip resistor that is capable of ensuring low TCR while increasing electric power even with low resistance. This chip resistor 1 comprises an insulation substrate 2, a pair of obverse electrodes 3 provided to the two obverse-surface end parts of the insulation substrate 2, a resistor body 5 connecting the two obverse electrodes 3, a glass body 6 provided on the resistor body 5, a low-resistance-value-adjusting trimming groove 5a formed in the resistor body 5 through the glass body 6; a first protection layer 7 formed so as to cover the trimming groove 5a in a region that is further inward than the pair of obverse electrodes 3, a second protection layer 8 formed so as to cover the first protection layer 7, a pair of end-surface electrodes 9 that extend to the two end surfaces of the insulation substrate 2 and are connected to the obverse electrodes 3, and a pair of external plating layers 10 that cover the end-surface electrodes 9. The first protection layer 7 comprises a resin material containing a heat-dissipating filler, and the second protection layer 8 comprises a resin material.
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 1/032 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe avec plusieurs couches entourant l'élément résistif
This gas sensor is provided with a base material, a first electrode and a second electrode both arranged on the base material, and a gas detection unit connected to the first electrode and the second electrode, in which the gas detection unit is composed of a semiconductor oxide containing calcium ferrite and zirconium as essential components and also containing at least one metal element selected from aluminum, silver and tin.
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
14.
CURRENT DETECTING DEVICE, AND METHOD FOR MANUFACTURING SAME
The present invention relates to a current detecting device and a method for manufacturing the same, and more particularly relates to a current detecting device provided with a shunt resistor, and a method for manufacturing the current detecting device. A current detecting unit (2) comprises: a plurality of pairs of voltage detection contacts (8A to 8H) electrically connected to a pair of electrodes (6, 7) of a shunt resistor (1); a plurality of pairs of voltage signal lines (9A to 9H) connected respectively to the plurality of voltage detection contacts (8A to 8H); a plurality of pairs of conductor element connection terminals (15A to 15H) connected respectively to the plurality of pairs of voltage signal lines (9A to 9H); and a pair of conductor elements (20, 21) attached to any one pair of conductor element connection terminals among the plurality of pairs of conductor element connection terminals (15A to 15H). The pair of conductor element connection terminals is selected in advance on the basis of an actual measurement result of a temperature coefficient of resistance of the shunt resistor (1).
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
The present invention relates to a shunt resistor and a current detection device. A shunt resistor (1) comprises a first protrusion (11) and a second protrusion (12). The first protrusion (11) includes a part of a resistive body (5) and a part of a pair of electrodes (6, 7). The second protrusion (12) includes a part of the resistive body (5) and a part of the pair of electrodes (6, 7).
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
H01C 3/00 - Résistances métalliques fixes en fil ou en ruban, p.ex. bobinées, tressées ou en forme de grille
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
[Problem] To provide an electronic component capable of maintaining the creepage distance between electrode terminals. [Solution] The present invention has a structure obtained forming an upper surface section having a prescribed thickness and having a rectangular shape when seen from a plan view, a resistor element housing section which is formed in the center on the bottom surface side of the upper surface section, and a first projection 3, a second projection 4 and a third projection 5 which function as legs and project in the vertical direction from the bottom surface of the upper surface section. The present invention maintains a long creepage distance between the electrode terminals formed on projections 3 and 4 via recesses of a prescribed depth which are formed on the bottom surface side so as to extend from one side in the short direction thereof across said housing section to the other side in said short direction between the first and third projections and also between the second and third projections on the bottom surface of the upper surface section.
H01C 1/028 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe l'élément résistif étant enrobé dans un matériau isolant pourvu d'une gaine extérieure
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The present invention provides a resistive material and a method for producing the same wherein a high-temperature pressing step is not required. Provided is a method for producing a resistive material, the resistive material containing insulating powder and a three-dimensional network metal body surrounding the insulating powder, the production method comprising: a step for coating the insulating powder with a metal film to prepare metal-coated powder; a step for mixing the metal-coated powder with an electrically conductive metal powder to obtain a mixed powder; and a step for sintering the mixed powder at a temperature lower than the melting point of the metal film and the melting point of the metal powder.
H01C 17/30 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés à la cuisson
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
A circuit protection element (10) is provided with: a pair of electrode parts (12, 14); an element part (16) provided between the electrode parts (12, 14); a plate body (18) that is disposed along the element part (16) and that comprises an insulation body; and an exterior member (20) that covers the element part (16) and the plate body (18). In this configuration, transmission of heat when melting and cutting the element part (16) because of overcurrent is blocked by the plate body (18). Accordingly, since transmission of heat to the exterior member (20) at the time of being melted and cut is suppressed, deformation of the exterior member (20) caused by heat at the time of being melted and cut can be suppressed. Therefore, a change in the external shape of the circuit protection element (10) can be suppressed.
H01H 85/045 - Construction ou structure générales de fusibles basse tension, c. à d. au-dessous de 1000 V, ou de fusibles pour lesquels la tension applicable n'est pas spécifiée du type cartouche
H01H 85/06 - Eléments fusibles caractérisés par le matériau fusible
H01H 85/10 - Eléments fusibles caractérisés par la configuration ou la forme de l'élément fusible comportant un étranglement pour fusion localisée
In the present invention, a shunt resistor 10 comprises a resistor 14, and electrodes 16, 18 joined to the resistor 14 and formed using aluminum as a main component. The shunt resistor 10 also comprises a plated section 30 that covers at least junctions 20, 22 of the resistor 14 and the electrodes 16, 18, and that is formed of a plating of higher specific resistance than the resistor 14.
x6y22O, where x is a number greater than 0 but less than or equal to 2, y is a number greater than 0 but less than or equal to 1, and n is a number greater than or equal to 0.
The present invention relates to a resistor for high voltages for use in a circuit such as a power supply circuit, and to a method for manufacturing a resistor. A resistor (1) comprises electrodes (3, 4) and a resistive element (10). The resistive element (10) includes a first meandering resistive section (11) and a second meandering resistive section (12), and a trimming resistive section (13) having a trimming groove (20) for adjusting the resistance value.
H01C 17/24 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en supprimant ou en ajoutant du matériau résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 7/22 - Elément résistif allongé plié ou courbé, p.ex. sinusoïdal ou en hélice
22.
CHIP-TYPE RESISTOR FOR INTEGRATION IN SUBSTRATE, MODULE HAVING INTEGRATED RESISTOR, METHOD FOR PRODUCING MODULE HAVING INTEGRATED RESISTOR, AND TRIMMING METHOD
This metal plate resistor, which is a chip-type resistor for integration in a substrate, is in plate form and comprises a resistive element, a first electrode which is joined to one end of the resistive element by a first cladding joining part, and a second electrode which is joined to the other end of the resistive element by a second cladding joining part.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The present invention provides a temperature sensor which has more easily enhanced strength. This temperature sensor is provided with a resin film, and a titanium metal foil that is bonded to the resin film. The titanium metal foil constitutes a conductive pattern. With respect to one embodiment of the present invention, a surface of the titanium metal foil, the surface facing the resin film, has been subjected to a surface modification treatment. With respect to one embodiment of the present invention, the thickness of the titanium metal foil is within the range of 3 to 10 µm. With respect to one embodiment of the present invention, the resin film contains a thermoplastic resin, and the thickness of the resin film is within the range of 20 to 80 µm.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
G01K 7/16 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs
24.
OXYGEN SENSOR ELEMENT AND METHOD FOR MANUFACTURING SAME
237-δ25237-δ7-δ is added to said composition. As a result, interlayer peeling and cracking can be prevented from occurring due to the sinter behavior of the heat insulation layer approaching the sinter behavior of the sensing layer, and by adopting a sandwiched structure in which the sensing layer is interposed between heat insulation layers, the conservation of electric power is made possible by reducing the amount of heat dissipated from the sensing layer.
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
25.
RESISTANCE TYPE OXYGEN GAS SENSOR AND OXYGEN SENSOR DEVICE
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
The present invention relates to a current detection device, particularly to a current detection device using a shunt resistor. A current detection device (30) is provided with a resistive body (5) and a pair of electrodes (6, 7). The electrodes (6, 7) have detecting regions (24a, 25a) defined by first slits (16, 17), second slits (26, 27), and contact surfaces (6a, 7a) at least partly contacting the resistive body (5). The electrodes (6, 7) further include voltage detecting portions (20, 21) disposed in the detecting regions (24a, 25a).
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
The objective of the present invention is to provide a sensor element with which it is possible to obtain a wide sensing area, and with which it is possible to obtain a substantially constant sensor sensitivity by suppressing an uneven temperature distribution in the sensing area. A sensor element (1) according to the present invention includes a base body (2), a temperature-sensitive film (3) which is formed over the entire surface of the base body and of which an electrical resistance value changes in accordance with a change in temperature, and wiring members (4, 5) connected to both ends of the temperature-sensitive film, characterized in that: the temperature-sensitive film includes areas of contact with the wiring members, and a pattern extending from the areas of contact toward the center of the base body; and the cross-sectional area of the pattern is formed to be smaller on the area of contact side than at the center of the base body.
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
A resistor comprising a resistor body and electrodes provided on the resistor body, wherein the resistor body has an oxide film on the front surface thereof.
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 17/02 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés à la fabrication de résistances avec enveloppe ou carter
Provided is a mounting structure for a chip component having high heat-shock resistance. In the mounting structure for a chip resistor 1 according to the present invention, the separation distance L1 between a pair of rear-surface electrodes 3 formed on an insulation substrate 2 of a chip resistor 20 is set lower than the separation distance L2 between a pair of lands 31 provided to a circuit substrate 30. Thick-walled sections (first electrode sections 3a) are formed in the rear-surface electrodes 3. External electrodes 9 bonded to the rear-surface electrodes 3 are connected to the corresponding lands 31 via solder 32 in a state in which the tops of the thick-walled sections are positioned directly above inner-side ends of the lands 31.
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
Provided is a chip resistor having excellent corrosion resistance. A chip resistor 1 according to the present invention is provided with: a rectangular parallelopiped insulating substrate 2; a pair of front electrodes 3 formed on opposite ends of the front surface of the insulating substrate 2; a pair of back electrodes 4 formed on opposite ends of the back surface of the insulating substrate 2; a resistor 5 that straddles over the pair of front electrodes; a first insulating layer 6 that is formed from a glass material and that covers the resistor 5; a second insulating layer 7 that is formed from a resin material and that is laid on the first insulating layer 6; a pair of auxiliary electrode layers 8 that are each formed from a highly sulfur-resistant material and that are laid on the front electrodes 3; a pair of end-face electrodes 9 that extend on opposite end faces of the insulating substrate 2 and that enable electrical conduction between the auxiliary electrode layers 8 and the back electrodes 4; and outer plated layers 10 that cover the auxiliary electrode layers 8, the end-face electrodes 9, and the back electrodes 4. The first insulating layer 6 has projection parts 6a that are not covered with the second insulating layer 7 and that overlap the upper surfaces of the front electrodes 3. The auxiliary electrode layers 8 are formed so as to cover the front electrodes 3 and the projection parts 6a and to reach the upper surface of the second insulating layer 7.
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The purpose of the present invention is to provide a sensor device with which it is possible to highly accurately perform flow rate sensing around 360° in the radial direction with respect to a first sensor device provided with a resistance element for flow rate sensing. The sensor device (1) according to the present invention is characterized in having a substrate (2), a first sensor element (3) provided with a resistance element for flow rate sensing, and a second sensor element (4) provided with a resistance element for temperature compensation, the first sensor element and the second sensor element being supported via lead wires (6, 8) respectively so as to be set away from the surface (2a) of the substrate, and the first sensor element being disposed at a position higher than that of the second sensor element.
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
Provided is a chip component having high heat shock resistance. A chip resistor 1 according to the present invention comprises: a cuboidal insulating substrate 2; a pair of rear surface electrodes 3 provided to both longitudinal direction ends of the rear surface of the insulating substrate 2; a pair of front surface electrodes 4 provided to both longitudinal direction ends of the front surface of the insulating substrate 2; a resistor 5 provided between the pair of front surface electrodes 4; and a pair of end surface electrodes 6 provided in a cross-sectional U shape to both longitudinal direction end surfaces of the insulating substrate 2 so as to bridge the gap between the rear surface electrodes 3 and the front surface electrodes 4, wherein the rear surface electrodes 3 are formed by a first electrode part 3a positioned on the inner side separated from the end surface of the insulating substrate 2, and two second electrode parts 3b arranged in the widthwise direction of the insulating substrate 2 across a cutout part 3c present between the end surface of the insulating substrate 2 and the first electrode part 3a, and the maximum height of the first electrode part 3a is set to be higher than the maximum height of the second electrode part 3b.
H01C 1/016 - Montage; Support avec compensation de la dilatation ou de la contraction de la résistance
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
33.
CHIP RESISTOR AND METHOD FOR PRODUCING CHIP RESISTOR
The present invention provides a chip resistor which is suitable for the achievement of electric power improvement. A chip resistor 1 according to the present invention is provided with: an insulating substrate 2 that has a cuboidal shape; a pair of front electrodes 3 that are provided on both end parts of the front surface of the insulating substrate 2 in the longitudinal direction; two resistors 4 that are connected in parallel between the pair of front electrodes 3; a precoat layer 5 that is formed on the resistors 4; a pair of back electrodes 6 that are provided on both end parts of the back surface of the insulating substrate 2 in the longitudinal direction; a pair of end face electrodes 7 that are provided on both end faces of the insulating substrate 2 in the longitudinal direction; and a protective coat layer 8 that is formed so as to cover the precoat layer 5. Each of the resistors 4 has an incision part 10 at a position where the resistor 4 is connected to a front electrode 3; and a trimming groove (trimming mark) 9 is linearly formed in the inter-electrode direction starting from the incision part 10.
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 17/242 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en supprimant ou en ajoutant du matériau résistif par laser
The purpose of the present invention is to provide: a shunt resistor that is compact, is compatible with a large current, and can detect the current with good precision; and a mounting structure for the shunt resistor. A shunt resistor (1) of the present invention is mounted to a printed wiring board (3), and is characterized in that a plurality of rod-shaped resistive elements (4), which serve as current paths, are integrally connected in a substantially parallel form. A mounting structure of the shunt resistor of the present invention mounts the shunt resistor to the printed wiring board, wherein: the printed wiring board (3) comprises a board body (6) having an opposing front surface (6a) and a rear surface (6b), a front surface electrode (7) formed on the front surface, a rear surface electrode (8) formed on the rear surface, and a plurality of through-holes that pass through the board body from the front surface electrode to the rear surface electrode; and each rod-shaped resistive element of the shunt resistor is inserted through each through-hole, and the shunt resistor is supported by the printed wiring board.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
The present invention simplifies the shape of a shunt resistor, and facilitates securing the shunt resistor to a busbar or the like and connecting a voltage detection circuit. A shunt resistor comprising a plurality of resistive elements, and a first current terminal plate and a second current terminal plate, each being connected to an end of the plurality of resistive elements, and further comprising a resin molded body that has a plurality of through-holes through which the plurality of resistive elements is inserted, and secures the plurality of resistors to the first current terminal plate and the second current terminal plate.
H01C 1/02 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
The present invention pertains to a shunt resistor and a shunt resistance device. The shunt resistor (1) comprises an electrode member (10). The electrode member (10) comprises: a contact portion making contact with a resistive body (5); and a slit (20) formed in the contact portion (10a).
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
37.
JUMPER ELEMENT, SHUNT RESISTOR DEVICE AND METHOD FOR ADJUSTING CHARATERISTICS OF SHUNT RESISTOR DEVICE FOR CURRENT DETECTION
The present invention relates to: a jumper element; a shunt resistor device; and a method for adjusting characteristics of a shunt resistor device for current detection. According to the present invention, a jumper element (10) for constituting a shunt resistor device for current detection is composed of a conductive metal material. This jumper element (10) is provided with: a main body part (11) which is able to be connected to a resistor (5) that constitutes a part of a shunt resistor device; and a projected part (12) that is formed on a lateral part of the main body part (11). The projected part (12) is positioned so as not to overlap with the resistor (5).
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
38.
RESISTANCE ALLOY USED IN SHUNT RESISTOR, USE OF RESISTANCE ALLOY FOR SHUNT RESISTOR, AND SHUNT RESISTOR USING RESISTANCE ALLOY
According to the present invention, a current detecting resistor such as a shunt resistor achieves a low resistivity while maintaining a low TCR, and achieves a small thermoelectromotive force against copper. A resistor alloy used in a shunt resistor for current detection comprises 4.5-5.5 mass% of manganese, 0.05-0.30 mass% of silicon, and 0.10-0.30 mass% of iron, with the balance being copper, and has a resistivity of 15-25 μΩ•cm.
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
39.
RESISTANCE ALLOY TO BE USED IN SHUNT RESISTOR, USE OF RESISTANCE ALLOY IN SHUNT RESISTOR, AND SHUNT RESISTOR USING RESISTANCE ALLOY
The present invention provides a resistance alloy which is capable of reducing the TCR of a shunt resistor that is used for a current detection device that is capable of detecting a large current. A copper-manganese system resistance alloy which is used in a shunt resistor, said resistance alloy additionally containing tin and nickel, while having a TCR of -36 × 10-6/K or less at 100°C with a reference temperature of 25°C.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The purpose of the present invention is to provide a flow rate sensor element that has excellent omnidirectional sensor sensitivity. A flow rate sensor element (1) of the present invention is characterized by being equipped with a spherical substrate (2), and a temperature-sensitive film pattern (3) which has been formed on the entire surface of the substrate and has an electrical resistance value that changes as the temperature changes. In the present invention, the temperature-sensitive film pattern is preferably formed by trimming a temperature-sensitive film that has been formed on the surface of the substrate. In this flow rate sensor element, the temperature-sensitive film pattern can be arranged over the entire surface of the spherical substrate, thus making it possible to obtain a constant sensor sensitivity irrespective of the fluid direction and to improve the flow rate detection accuracy.
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
This resistor comprises a plurality of resistor components 12A, 12B, 12C, 12D each of which comprises electrodes 24, 26 extending from both sides of a resistor 22 and is thus formed in a plate shape, the plurality of resistor components 12A, 12B, 12C, 12D being stacked on top of each other in a thickness direction. The resistor comprises protrusions 20A, 20B, 20C, 20D, 20E which are provided between the electrodes 24, 26 of the resistor components 12A, 12B, 12C, 12D proximate to each other, form gaps 50 between the resistors 22 of the resistor components, electrically connect the electrodes of the resistor components, and connect the resistor components in parallel. The electrodes 24, 26 of the resistor components are provided with detecting portions 60 for detecting voltage which are disposed in positions closer to the resistors 22 than current-flowing energizing portions.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
The present invention pertains to a shunt resistor for detecting a current, and particularly pertains to a voltage detection terminal of a shunt resistor. This shunt resistor (1) comprises a resistive body (3), a first electrode (5A) and a second electrode (5B) connected to both sides of the resistive body (3), and a first voltage detection terminal (6A) and a second voltage detection terminal (6B) electrically connected to the first electrode (5A) and the second electrode (5B), respectively. The distance (S) from the center line (CL) of the resistive body (3) to the first voltage detection terminal (6A) and the second voltage detection terminal (6B) is within the range of 21 to 29% of the width of the resistive body (3).
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
A shunt resistor (1) comprises: a resistive element (3); a first electrode (5A) and a second electrode (5B) that are connected to both sides of the resistive element (3); a first fusion material (6A) and a second fusion material (6B) that are electrically conductive and electrically connected to the first electrode (5A) and the second electrode (5B), respectively; and a substrate (10) that is connected to the first electrode (5A) and the second electrode (5B) by the first fusion material (6A) and the second fusion material (6B). The first fusion material (6A) is disposed in a first through-hole (7A) that is formed in the first electrode (5A) or the substrate (10), and the second fusion material (6B) is disposed in a second through-hole (7B) that is formed in the second electrode (5B) or the substrate (10).
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
The purpose of the present invention is to provide a current detection device capable of detecting a non-connection state of a connector. A current detection device (10) according to the present invention is provided with a shunt resistor (1) and a circuit part (2) that is connected to the shunt resistor in an attachable/detachable manner. The current detection device is characterized in that the circuit part has an AD converter (7) and a power supply part for supplying a voltage to the AD converter and that a first ground terminal (T7) connected to the AD converter and a second ground terminal (T8) connected to the power supply part are separately disposed between the shunt resistor and the circuit part.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
This resistor 100 comprises: a resistor element 1; a pair of electrodes (first electrode body 2, second electrode body 3) connected to the resistor element 1; and a terminal part disposed on the electrodes (first electrode body 2, second electrode body 3), wherein the terminal part includes an attachment part (press-fit part 42) attached to the electrodes (first electrode body 2, second electrode body 3), and a fixing part 41 which protrudes from the electrodes (first electrode body 2, second electrode body 3) when the attachment part (press-fit part 42) is attached to the electrodes (first electrode body 2, second electrode body 3) and to which a terminal (press-fit terminal 5) for detection is fixed.
The present invention increases the strength of a shunt resistor and reduces the electric resistance between a resistive body and a terminal in the shunt resistor. The shunt resistor comprises a first terminal and a second terminal which are made of an electrically conductive metal material, and a resistive body disposed between the first terminal and the second terminal. The first terminal and the second terminal each have a through-hole formed therein, and the resistive body is received in the through-holes of the first terminal and the second terminal in the depth direction thereof. In a connected region between the resistive body and the first terminal and the second terminal, an alloy-formed portion is formed along an internal peripheral surface of the through-holes.
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
47.
SHUNT RESISTOR, SHUNT RESISTOR MANUFACTURING METHOD, AND CURRENT DETECTING DEVICE
The present invention relates to a shunt resistor and a shunt resistor manufacturing method. The present invention also relates to a current detecting device provided with a shunt resistor. A shunt resistor (1) is provided with a resistor (5) and a pair of electrodes (6, 7) connected to the ends (5a, 5b) of the resistor (5) in a first direction. The shunt resistor (1) includes a protruding portion (11) formed on a side surface (1a) of the shunt resistor (1) parallel to the first direction, and a recess (12) formed in a side surface (1b) of the shunt resistor (1) opposite the side surface (1a), the recess (12) extending in the same direction as the protruding portion (11). The protruding portion (11) includes a part of the resistor (5) and parts of the pair of electrodes (6, 7). The recess (12) includes a side surface (5d) of the resistor (5) parallel to the first direction.
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
A current detection device (30) is provided with a resistor (5) and a pair of electrodes (6, 7). The current detection device (30) includes a protruding portion (11). The protruding portion (11) includes a part of the resistor (5) and parts of the pair of electrodes (6, 7). The electrodes (6, 7) each has a first wall portion (66b, 67b) forming a part of the protruding portion (11), and a second wall portion (66a, 67a) forming a part of the protruding portion (11). The electrodes (6, 7) each have a detecting region (66, 67) defined by the first wall portion (66b, 67b), the second wall portion (66a, 67a), a start-end portion (66c, 67c), and a contact surface (6a, 7a). The electrodes (6, 7) each have a voltage detecting portion (20, 21) disposed in the detecting region (66, 67) with a gap from the start-end portion (66c, 67c).
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
The present invention pertains to a shunt resistor. A shunt resistor (1) is provided with a resistance (5) and electrodes (6, 7). Each of the electrodes (6, 7) is provided with: a first protrusion and a second protrusion that are disposed at both sides of the resistance (5) in a second direction perpendicular to a first direction; and a voltage detection terminal (15) formed in the first protrusion and/or the second protrusion.
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
H01C 7/06 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant présentant des moyens pour réduire au minimum les variations de résistance dépendantes des variations de température
The present invention relates to a shunt resistor for current detection. A shunt resistor (1) has a plate-shaped resistor body (5) and electrodes (6, 7) that are connected to opposite end surfaces (5a, 5b) of the resistor body (5), wherein the electrodes (6, 7) have respective slits (11, 12) that extend in parallel to joining parts (8, 9) between the resistor body (5) and the electrodes (6, 7), and wherein the slits (11, 12) are located at respective positions at which a relation of Y≤0.80X-1.36 holds, where Y is the distance from the joining parts (8, 9) to the slits (11, 12), and X is the length of the joining parts (8, 9) in the width direction of the electrodes (6, 7).
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
Provided is an electronic component comprising a terminal electrode structure with which it is possible to ensure thermal resistance during solder-mounting and under a use environment. A chip resistor 10 comprises: an insulating substrate (component body) 1 having a resistive body 3 formed thereon; connection terminals (a front electrode 2, an end-face electrode 6, and a back electrode 5) formed at either end of the insulating substrate 1; an underlayer 7 formed by electroplating so as to cover the connection terminals; a barrier layer 8 formed by electroplating so as to cover the underlayer 7; and an outer connection layer 9 formed on a surface of the barrier layer 8 from tin as a main component. The barrier layer 8 is formed of an alloy plating comprising nickel as a main component and containing 3% to 15% of phosphorus, and the underlayer 7 is formed of a copper plating layer having more malleability and/or ductility than the barrier layer 8.
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The present invention reduces the mounting area between an electronic component and a resistor for current detection. Provided is a current detecting resistor for detecting current, the current detecting resistor comprising a plate-like resistive body, and a first electrode and an opposite second electrode which are stacked in the thickness direction of the resistive body and are disposed with the resistive body therebetween. The first electrode has a groove portion.
Provided is a copper-manganese-nickel-based alloy having characteristics close to those of a nickel-chromium-based alloy (particularly in terms of resistivity). An additional purpose of the present invention is to provide an alloy having workability superior to that of a nickel-chromium-based alloy. An alloy for a resistor, the alloy containing copper, manganese, and nickel, wherein the manganese constitutes 33-38 mass% and the nickel constitutes 8-15 mass%.
This current detection device includes: an insulating resin substrate; a current detection element that is disposed inside the resin substrate; current-use wiring that is disposed via the current detection element and an insulation layer and that flows current to the current detection element; a plurality of current-use through vias that connect, by penetrating the insulation layer, the current detection element and the current-use wiring; and a voltage detection-use through via that is connected to the current detection element and that is for measuring a drop in voltage.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
The present invention provides a sulfurization detection sensor capable of accurately detecting a degree of sulfurization. A sulfurization detection sensor 10 is provided with: an insulated substrate 1 which has a rectangular parallelepiped shape; a pair of front electrodes 2 respectively provided at opposite ends of the surface of the insulated substrate 1; and a first sulfurization detection conductor 3 and second sulfurization detection conductors 4 which are disposed in series between the pair of front electrodes 2. The first sulfurization detection conductor is formed in a rectangular shape between the pair of front electrodes 2 using a material in which silver is the main component, and is configured so as to undergo a break depending on the cumulative sulfurization amount. The second sulfurization detection conductors 4 are formed using a material in which copper is the main component so as to be between the pair of front electrodes 2 and to be opposite each other with a gap G therebetween, and are configured to conduct electricity by a short via the gap G depending on the cumulative sulfurization amount.
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
G01N 27/00 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
A resistor 1 equipped with a resistive element 10 and a pair of electrodes (first electrode body 11, second electrode body 12) connected to the resistive element 10, and having at least the resistive element 10 thereof positioned at a distance from the substrate (circuit board) when mounting onto a substrate (circuit board), wherein an oxide film 5 is positioned on the resistive element 10 and/or the electrodes (first electrode body 11, second electrode body 12) at the location of the boundaries (joining section 13, joining section 14) between the resistive element 10 and the electrodes (first electrode body 11, second electrode body 12) on the resistor 1 mounting surface.
H01C 1/034 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
A manufacturing method for a resistor 1 that comprises a resistance body 10 and a pair of electrodes (first electrode body 11, second electrode body 12) connected to the resistance body 10, and in which the resistance value can be adjusted by trimming a section of the resistance body 10. In this manufacturing method, the resistance body 10 is trimmed at the boundary sites (junction section 13, junction section 14) of the resistance body 10 and the electrodes (first electrode body 11, second electrode body 12), and recesses 6 are formed.
H01C 17/242 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en supprimant ou en ajoutant du matériau résistif par laser
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
This resistor manufacturing method includes: stacking an electrode material, a resistance material, and the electrode material in this order; applying pressure to these materials in the stacking direction and joining the materials so as to form a resistor base material; causing the resistor base material to pass through a die in which an opening part having a dimension smaller than the external dimension of the resistor base material is formed; and obtaining an individual resistor from the resistor base material having passed through the die.
A resistor 1 comprising a resistive body 10 and a pair of electrodes (a first electrode body 11 and a second electrode body 12) connected to the resistive body 10, wherein: the resistive body 10 has end faces butt-joined with end faces of the electrodes (the first electrode body 11 and the second electrode body 12); the electrodes (the first electrode body 11 and the second electrode body 12) each include a body portion 21, 31 and a leg portion 22, 32 protruding from the body portion 21, 31 onto a mounting surface; and the resistor 1 has a length dimension of less than or equal to 3.2 mm.
The purpose of the present invention is to provide a flowrate sensor that enables flowrate detection in all flow directions on the surface of an insulating substrate. A flowrate sensor (1) according to the present invention is characterized by having: an insulating substrate (2); a first heat conduction part (5) that passes through in the thickness direction of the insulating substrate; a flowrate detection resistive element (3) disposed on the opposite side of a flowrate detection surface of the first heat conduction part; and a temperature compensation resistive element (4) disposed on the same surface side as the flowrate detection resistive element. Accordingly, it is possible to detect the flowrate of a fluid flowing along the flowrate detection surface over 360º.
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
The purpose of the present invention is to provide a shunt resistance module which allows easy drawing out of a voltage signal pattern, and which can provide stable connection with an electrode. A shunt resistance module (1) according to the present invention is characterized by comprising: a shunt resistor (2) including a first electrode (5) and a second electrode (6) facing each other in the height direction, and a columnar resistor (4) connected between the electrodes; and a wiring substrate (3) including a plurality of voltage signal patterns (8a, 8b) which are electrically connected to the respective electrodes and detect a voltage between the electrodes. The shunt resistance module is also characterized in that the second electrode includes an extension part (6a) which extends in the planar direction beyond the first electrode, and the wiring substrate is mounted on the surface of the extension part.
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
62.
SHUNT RESISTANCE MODULE, AND IMPLEMENTATION STRUCTURE OF SHUNT RESISTANCE MODULE
The purpose of the present invention is to provide a shunt resistance module that makes it possible to detect current with excellent precision. This shunt resistance module (1) is characterized in comprising: a shunt resistor (2) provided with a resistor body (5), a first electrode (6) provided to one end part of the resistor body, and a second electrode (7) provided to the other end part of the resistor body; and an electroconductive member (4) that is electrically connected to the first electrode and is positioned so that a gap is formed between the electroconductive member and each of the second electrode and the resistor body, the electroconductive member constituting a current channel (C1) that allows a flow to the shunt resistor and a current channel (C2) having the opposite orientation.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
63.
NOISE PREVENTION RESISTOR AND MANUFACTURING METHOD THEREOF
In this noise prevention resistor 10, an electromagnetic shield member 8a, which covers a part of the outer peripheral surface of a resistance element 2 without interruption around the axis of the resistance element 2, is disposed at a position on the outer peripheral surface of the resistance element 2 where the resonance frequency of a resonance circuit is different. Thus, the electromagnetic shield member 8a magnetically separates the resonance circuit of a resistor. As a result, since a plurality of resonance equivalent circuits are provided in a single resistor element and the resonance peak of the resistor has a width, noise can be suppressed in a wider band than before while maintaining the length dimension and the like.
H01C 3/00 - Résistances métalliques fixes en fil ou en ruban, p.ex. bobinées, tressées ou en forme de grille
H01C 3/20 - Résistances métalliques fixes en fil ou en ruban, p.ex. bobinées, tressées ou en forme de grille l'élément résistif étant formé de plusieurs spires ou boucles enroulées en spirale, en hélice ou en forme de tore enroulées sur un élément de base cylindrique ou prismatique
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional element, formed thereon; a pair of internal electrodes (each composed of a front surface electrode 2, an end surface electrode 6, and a reverse surface electrode 5) that connect to the resistive element 3 and are formed so as to cover both end portions of the insulation substrate 1; a barrier layer 8 formed on the surface of each internal electrode and having nickel as a main ingredient; and an external connection layer 9 formed on the surface of each barrier layer 8 and having tin as a main ingredient. The barrier layers 8 are composed of a nickel and phosphorus (Ni-P) alloy plating formed via electrolytic plating, and the barrier layers 8 are made magnetic by setting the phosphorus content relative to the nickel content in the range of 0.5% to 5%.
C25D 5/12 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p.ex. couches doubles ou triples
C25D 7/00 - Dépôt électrochimique caractérisé par l'objet à revêtir
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
65.
CHIP COMPONENT AND CHIP COMPONENT PRODUCTION METHOD
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional element, formed thereon; a pair of internal electrodes (each composed of a front surface electrode 2, an end surface electrode 6, and a reverse surface electrode 5) that connect to the resistive element 3 and are formed so as to cover both end portions of the insulation substrate 1; a barrier layer 8 that is formed on the surface of each of the internal electrodes and has nickel as a main ingredient; and an external connection layer 9 that is formed on the surface of each of the barrier layers 8 and has tin as a main ingredient. The barrier layers 8 are composed of a nickel and phosphorus (Ni-P) alloy plating formed via electrolytic plating, and at least an inner region of each of the barrier layers 8 is made magnetic by differentiating the phosphorus content of the alloy plating in the inner region from the phosphorous content of the alloy plating in an outer region.
C25D 5/12 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p.ex. couches doubles ou triples
C25D 7/00 - Dépôt électrochimique caractérisé par l'objet à revêtir
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The purpose of the present invention is to provide a shunt resistance module that is reduced in size, can support high current, makes it possible to detect current with excellent precision. This shunt resistance module (1) is characterized by being equipped with: shunt resistor devices (2) provided with a plurality of columnar resistors, and electrodes at both ends of each resistor; and a substrate provided with a plurality of through-holes (7) in which the resistors can be accommodated, and a plurality of voltage detection terminals (8a, 8b) for detecting the voltage between the electrodes of the shunt resistor devices inserted into the through-holes, the voltage detection terminals being aggregated near the center of gravity (O1) of the shunt resistor device.
H01C 13/02 - Combinaisons structurelles de résistances
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
67.
RESISTIVE ELEMENT MATERIAL, METHOD FOR PRODUCING RESISTIVE ELEMENT MATERIAL , AND RESISTOR FOR CURRENT DETECTION
H01C 1/032 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe avec plusieurs couches entourant l'élément résistif
H01C 17/02 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés à la fabrication de résistances avec enveloppe ou carter
68.
GAS SENSOR AND ALKALINE EARTH FERRITE PRODUCTION METHOD
This gas sensor is provided with: a base material; first and second electrodes disposed on the base material; and a gas detection unit connected to the first and second electrodes, wherein the gas detection unit includes flake-like alkaline earth ferrite particles.
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
One purpose of the present invention is to provide a flow rate sensor device in which weather resistance and pest resistance are improved. This flow rate sensor device (1) is characterized by comprising: a cover member (2); a cap member (3) positioned below the cover member; a foreign-matter-intrusion-preventing net (4) that surrounds the area between the cover member and the cap member; a light-emitting element (13) positioned in an accommodation space (25) that is surrounded by the cover member, the cap member, and the foreign-matter-intrusion-preventing net; and a sensor element (11) provided with a temperature-sensitive resistance element, the sensor element being positioned inside the foreign-matter-intrusion-preventing net and within the accommodating space.
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
G01F 1/684 - Dispositions de structure; Montage des éléments, p.ex. relativement à l'écoulement de fluide
The computer-readable recording medium has recorded thereon a thermal analysis program for causing a computer that analyzes the temperature of a resistor provided with an intermediate portion which is separated from a base board, and, on both sides thereof, terminal portions which are connected to wiring on the base board, to execute: a procedure for preparing a thermal analysis model; a procedure for setting a predetermined amount as the amount of heat generated by an intermediate node that simulates the intermediate portion in the thermal analysis program; and a procedure for analyzing the temperature of the resistor using the thermal analysis model. The thermal analysis model includes: the intermediate node; a terminal node which simulates at least one of the terminal portions on both sides, and which serves as a starting point of a first pathway that transfers heat from said one terminal portion toward the base board that is in contact with the wiring; and a thermal resistance connecting the terminal node to the intermediate node. The thermal analysis model includes a split node that simulates a boundary splitting the wiring into a joined part to which said one of the terminal portions is joined, and another wiring part, and that serves as the end point of a second pathway conducting heat from said one terminal portion to the wiring boundary, wherein the second pathway connects the terminal node and the split node.
G06F 30/398 - Vérification ou optimisation de la conception, p.ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
Provided is a chip-type current fuse which makes it possible to stabilize the blowout timing of a fuse element. This chip-type current fuse is configured so that a fuse element 5 formed between a first front electrode 3 and a second front electrode 4 comprises: a first rectilinear section 5a that has the first front electrode 3 as a connecting end and extends in the direction of the second front electrode 4; a second rectilinear section 5b that has the second front electrode 4 as a connecting end and extends in the direction of the first front electrode 3 in parallel with the first rectilinear section 5a; and an inclined rectilinear section 5c that joins together the first rectilinear section 5a and the second rectilinear section 5b. The inclined rectilinear section 5c is connected at an acute angle to the first rectilinear section 5a and the second rectilinear section 5b.
A load sensor element according to the present invention is provided with: a substrate which is formed of a ceramic material; a rectangular inorganic layer which has a pressure receiving surface that receives a load, and which is arranged so as to cover a covered part of one surface of the substrate; a thin film resistor, the resistance of which changes in accordance with the load received by the inorganic layer, and which comprises a main body part that is mounted on the covered part of the one surface of the substrate so as to be sandwiched between the substrate and the inorganic layer, and both end parts that are mounted on exposed parts of the one surface of the substrate, said exposed parts being not covered by the inorganic layer; and a pair of electrodes which are electrically connected to the both end parts of the thin film resistor so as to be at a distance from the inorganic layer, and which are arranged on one surface of the substrate.
G01L 1/20 - Mesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c. à d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte
This computer-readable recording medium records a thermal analysis program for a resistor, for causing a computer that analyzes a temperature of the resistor to execute a process for preparing a thermal analysis model for the resistor, a process for setting a specific value as the amount of heat generated by the resistor, and a process for analyzing the temperature of the resistor by using the thermal analysis model, wherein: the resistor comprises an insulating base member, a resistance body formed on the upper surface of the insulating base member, and a pair of electrodes formed on the outer surface of the insulating base member and electrically connected to the substrate; the resistor also has an intermediate part, which is a portion of the insulating base member that is separate from the substrate, and a pair of terminal parts connected to the substrate on both sides of the intermediate part; and the thermal analysis model of the resistor has a resistance body node simulating the resistance body, an intermediate node simulating the intermediate part, a pair of terminal part nodes simulating the respective terminal parts and serving as the origin of the heat path between the substrate and the terminal parts, a first thermal resistor connected between the intermediate node and the resistance body node, and a pair of second thermal resistors connected between the intermediate node and the respective terminal part nodes.
G06F 30/20 - Optimisation, vérification ou simulation de l’objet conçu
G06F 30/398 - Vérification ou optimisation de la conception, p.ex. par vérification des règles de conception [DRC], vérification de correspondance entre géométrie et schéma [LVS] ou par les méthodes à éléments finis [MEF]
The present invention provides a sulfurization detection sensor capable of accurately detecting a degree of sulfurization. A sulfurization detection sensor 10 is provided with an insulating substrate 1 having the shape of a rectangular parallelepiped, a pair of front electrodes 2 provided at both longitudinal ends of a front surface of the insulating substrate 1, a sulfurization detection conductor 3 connected to the front electrodes 2, a pair of protective films 4 for partially covering the sulfurization detection conductor 3 and the front electrodes 2, a pair of back electrodes 5 provided at both longitudinal ends of a back surface of the insulating substrate 1, a pair of end-face electrodes 6 provided at both longitudinal ends of the insulating substrate 1, and an external electrode 7 provided on a front surface of the end-face electrode 6. The sulfurization detection conductor 3: has a sulfurization detection part 3A which is exposed from the pair of protective films 4; and is formed with a specific region 3b in which, when the inter-electrode direction of the pair of front electrodes 2 is an X direction and the direction orthogonal to this X direction is a Y direction, it is difficult for current to flow at both Y-direction ends of the sulfurization detection part 3A.
G01N 17/00 - Recherche de la résistance des matériaux aux intempéries, à la corrosion ou à la lumière
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
The purpose of the present invention is to provide a resistor in which cracking is less likely to develop in a solder joint portion, an insulating substrate and the like. For this purpose, the following configuration is provided. Lead terminals 7a, 7b each include a first crank portion CR1 which, at a position not overlapping internal electrodes 17a, 17b in plan view, is bent from where a tip-end portion of the lead terminal is joined to the internal electrodes 17a, 17b, in a direction away from a resistive substrate. Accordingly, when the tip-end portion of the lead terminal 7a, 7b and the internal electrodes 17a, 17b are joined by soldering, no solder fillet (back-fillet) is formed in the first crank portion, thus mitigating or preventing generation of thermal stress in the crank portion.
H01C 1/144 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant soudés ou brasés
76.
PRODUCTION METHOD FOR SULFIDATION DETECTION SENSOR
Provided is a sulfidation detection sensor that can achieve high-sensitivity detection and can also prevent separation of outer electrodes. According to the present invention, after a sulfidation detection conductor (2) has been formed on the surface of a large-sized substrate (10A), a pair of first protective films (3) that comprise an insoluble material are formed at prescribed locations on the sulfidation detection conductor (2), a second protective film (7) that comprises a soluble material is formed to cover the sulfidation detection conductor (2) between the first protective films (3), and then end surface electrodes (5) are formed at division surfaces of a strip-shaped substrate (10B) that is obtained by performing a primary division on the large-sized substrate (10A). Then, after outer electrodes (6) have been plated onto a chip substrate (10C) that is obtained by performing a secondary division on the strip-shaped substrate (10B), the second protective film (7) is removed to expose a sulfidation detection part (2a) to the outside and thereby produce a sulfidation detection sensor (10).
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
H01C 17/02 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés à la fabrication de résistances avec enveloppe ou carter
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p.ex. sérigraphie
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
A shunt resistor 10, 110 is provided with: a flat resistive element 11; a first electrode block 12 that is formed from a conductive metal material and layered on a lower surface 11a of the resistive element 11; and a second electrode block 13, 113 that is formed from a conductive metal material and layered on an upper surface 11b of the resistive element 11. The second electrode block 13, 113 is a block element having an electrode portion 14 that is connected to the resistive element 11, and an extended portion 15, 115 that extends downward from a side surface of the electrode portion 14.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
78.
MOUNTING STRUCTURE FOR CURRENT DETECTION RESISTOR, AND CURRENT DETECTION RESISTOR
A mounting structure 100 for mounting, upon wiring, a shunt resistor 10 provided with a flat resistive element 11, a first electrode block 12 that is layered on a lower surface 11a of the resistive element 11, and a second electrode block 13 that is layered on an upper surface 11b of the resistive element 11, said mounting structure 100 comprising a first wiring pattern 43 to which the first electrode block 12 is connected, and a second wiring pattern 44 to which the second electrode block 13 is connected, wherein the second electrode block 13 has, between a section connected to the upper surface 11b of the resistive element 11 and a section connected to the second wiring pattern 44, an extended first facing portion 15 that faces the first wiring pattern 43.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
Provided is a sulfidation detection resistor that can accurately detect degree of sulfidation. A sulfidation detection resistor (100) that comprises a rectangular insulating substrate (1), a sulfidation detection conductor (2) that is provided on the surface of the insulating substrate (1), a pair of rear electrodes (4) that are provided at either longitudinal-direction end part of a rear surface of the insulating substrate (1), a resistor (5) that connects the pair of rear electrodes (4), a second protection layer (6) that covers the resistor (5), a pair of end surface electrodes (7) that electrically connect either end of the sulfidation detection conductor (2) and the rear electrodes (4), and a pair of outer electrodes (8) that cover either longitudinal-direction end part of the sulfidation detection conductor (2), the end surface electrodes (7), and the rear electrodes (4). A center part of the sulfidation detection conductor (2) that is not covered by the pair of outer electrodes (8) is a sulfidation detection part (2a) that can contact sulfidizing gas.
H01C 1/034 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 13/02 - Combinaisons structurelles de résistances
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
Provided are a sulfurization detection sensor capable of accurately detecting a degree of sulfurization and a manufacturing method and mounting method for such a sulfurization detection sensor. This sulfurization detection sensor (10) comprises: a sulfurization detection conductor (2) and a pair of internal electrodes (7) provided on the surface of an insulating substrate (1); a sulfide-gas-transmitting protective layer (3) that covers the sulfurization detection conductor (2); a pair of rear electrodes (4) provided at both longitudinal-direction ends of the rear surface of the insulating substrate (1); a pair of end face electrodes (5) provided on both longitudinal-direction end faces of the insulating substrate (1); a pair of heat-resistant-barrier layers (6) that comprise a Ni material and are provided on the surfaces of the internal electrodes (7), rear electrodes (4), and end face electrodes (5); and an external electrode (8) that comprises a Sn material and continuously covers the surfaces of the pair of heat-resistant-barrier layers (6) and the protective layer (3). When this sulfurization detection sensor (10) is joined to a circuit board (11) through soldering, the external electrode (8) covering the protective layer (3) leaches into the solder and disappears, and this causes the protective layer (3) covering the sulfurization detection conductor (2) to be exposed to the outside.
H01C 1/034 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
81.
RESISTIVE MATERIAL, RESISTOR, AND METHOD FOR MANUFACTURING RESISTIVE MATERIAL
A resistive material 11a for detecting current and including: metal particles selected from the group consisting of nichrome, copper manganese, and copper nickel; insulating particles selected from the group consisting of alumina, aluminum nitride, silicon nitride, and zirconia; and titanium oxide.
C22C 1/05 - Mélanges de poudre métallique et de poudre non métallique
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
Provided is a resistor, in which cap terminals are attached to both ends of a cylindrical resistive element, and the entirety thereof, excluding the cap terminal on both the ends of the resistive element, is covered by an exterior body, wherein the exterior body is provided with: a prismatic exterior part that covers the central portion of the resistive element; and a cylindrical exterior part that is integrally formed with the prismatic exterior part and is in contact with the cap terminals.
H01C 1/034 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 17/24 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en supprimant ou en ajoutant du matériau résistif
Provided is a shunt resistor mounting structure in which a shunt resistor is mounted on a pattern-containing substrate containing a voltage signal lead-out pattern. The shunt resistor mounting structure comprises an accommodating portion which is defined by a through-hole formed in a thickness direction of the pattern-containing substrate, and in which at least a part of a resistive body is accommodated, the resistive body being provided between a first terminal and a second terminal which are provided successively from the side opposite to a shunt resistor mounting side.
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
84.
SULFURIZATION DETECTION SENSOR AND MANUFACTURING METHOD THEREOF
Provided are a sulfurization detection sensor capable of accurately and easily detecting the degree of sulfurization, and a method for manufacturing such a sulfurization detection sensor. The sulfurization detection sensor 10 includes an insulating substrate 1 in the form of a rectangular parallelepiped, a first conductor 2 and a second conductor 3 provided on both ends of the front surface of the insulating substrate 1 in the longitudinal direction, a first back electrode 4 and a second back electrode 5 provided on both ends of the back surface of the insulating substrate 1 in the longitudinal direction, a first end face electrode 6 and a second end face electrode 7 provided on both end faces of the insulating substrate 1 in the longitudinal direction, and a first outer electrode 8 and a second outer electrode 9 provided on the front surface of these end face electrodes 6 and 7, wherein the first conductor 2 and the second conductor 3 which are formed of a material containing copper as a main component have sulfurization detection portions 2a and 3a that are exposed to the outside, and these sulfurization detection portions 2a and 3a face each other with a gap G therebetween at the center of the front surface of the insulating substrate 1.
G01N 27/00 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
Provided is a sulfurization detection resistor capable of accurately and simply detecting a degree of sulfurization. A sulfurization detection resistor 10 includes a rectangular parallelepiped insulating substrate 1; a first surface electrode 2 and a second surface electrode 3 formed on both end portions of a main surface of the insulating substrate 1; a plurality of sulfurization detection conductors 4 connected in parallel to the first surface electrode 2; a plurality of resistors 5 connected between each sulfurization detection conductor 4 and the second surface electrode 3; and a protective film 6 formed so as to cover a portion of the sulfurization detection conductors 4 and the entirety of the resistors 5. Each of the sulfurization detection conductors 4 includes a sulfurization detection section 4a that is not covered by the protective film 6 and that faces another sulfurization detection section across a predetermined gap G. Each of the sulfurization detection conductors 4 is formed from a material having a different copper content, and the gaps G formed between the sulfurization detection conductors 4 are configured to conduct at timings that differ in response to increases in the cumulative sulfurization amount.
G01N 27/00 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
86.
SULFURIZATION DETECTION RESISTOR AND MANUFACTURING METHOD THEREFOR
Provided are a sulfurization detection resistor that can accurately and easily detect a degree of sulfurization, and a manufacturing method for such a sulfurization detection resistor. This sulfurization detection resistor 10 comprises: a rectangular parallelepiped-shaped insulation substrate 1; a first front electrode 2 and a second front electrode 3 that are formed at both ends of a main surface of the insulation substrate 1; a plurality of sulfurization detection conductors 4 that are connected in parallel to the first front electrode 2; a plurality of resistors 5 that are connected between each sulfurization detection conductor 4 and the second front electrode 3; and a protective film 6 that is formed to cover a portion of each sulfurization detection conductor 4 and the entirety of each resistor 5, wherein each sulfurization detection conductor 4 has a sulfurization detection part 4a that is exposed from the protective film 6, and a disconnection timing is set to be different depending on the cumulative sulfurization amounts of these sulfurization detection units 4a.
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 17/23 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en ouvrant ou en fermant des pistes résistantes d'une valeur prédéterminée
H01C 17/26 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour ajuster la valeur de la résistance en transformant le matériau résistif
G01N 27/00 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
87.
THERMAL CONDUCTANCE DISTRIBUTION DATA GENERATION DEVICE, THERMAL CONDUCTANCE DISTRIBUTION DATA GENERATION METHOD, AND THERMAL CONDUCTANCE DISTRIBUTION DATA GENERATION PROGRAM
This data generation device is for generating thermal conductance distribution data for a touching surface where two components touch. The data generation device comprises an acquisition unit for acquiring pressure distribution data for the touching surface, a smoothing unit for dividing the pressure distribution data acquired by the acquisition unit into a plurality of cells of the same size and carrying out smoothing such that each of the divided cells has one pressure value therein, and a data generation unit for generating thermal conductance distribution data by converting the pressures in the cells subjected to the smoothing by the smoothing unit into thermal conductances.
The present invention improves the visibility of light. A flow rate sensor device (1) of the present invention is configured so as to comprise: a substrate (2); sensor elements (3, 4) electrically connected to the substrate; light-emitting elements (8a, 8b) positioned to the rear of the sensor elements and disposed on a surface of the substrate; and light-transmissive cases (6a, 6f) where the light-emitting elements are accommodated therein between the substrate and the light-transmissive cases. In the light-transmissive cases, light diffusion members (7a, 7e) project, from ceiling sections (C), towards the light-emitting elements. The light diffusion members are configured so as to have a light-incident surface opposing the light-emitting elements, and a wall surface connecting the light-incident surface and the ceiling section. At least a portion of the wall surface is formed by an inclined surface for which the dimension between opposing wall surfaces gradually widens from the light incident surface towards the ceiling section.
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
G01F 1/00 - Mesure du débit volumétrique ou du débit massique d'un fluide ou d'un matériau solide fluent, dans laquelle le fluide passe à travers un compteur par un écoulement continu
G01F 1/68 - Mesure du débit volumétrique ou du débit massique d'un fluide ou d'un matériau solide fluent, dans laquelle le fluide passe à travers un compteur par un écoulement continu en utilisant des effets thermiques
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
Provided are a gas sensor and a method for manufacturing the same, the gas sensor being provided with insulating and waterproof properties. An oxygen sensor 1 in which a self-heating oxygen sensor element 3 comprising a ceramic sintered compact is accommodated in a case 2 is insulation-coated with an exterior resin material 15 comprising an insulating resin, and breathable waterproof fabrics 5a, 5b are affixed by resin adhesives 6a, 6b so as to cover openings connected to ventilation holes 8a, 8b in a case end part. A gas sensor 10 for both in-air and in-liquid use is thereby obtained, provided with insulating properties, waterproof properties, and thermal safety.
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
90.
NOISE PREVENTION RESISTOR AND METHOD FOR MANUFACTURING SAME
Provided are a noise prevention resistor having prescribed noise suppression characteristics and a method for manufacturing the noise prevention resistor. This noise prevention resistor is provided with: a glass-fiber-only part 13 which includes a magnetic body material (ferrite) 15 allocated at or near the center, in the axial direction, of a core material 5 and which does not include a fixing agent outward in the circumferential direction of the magnetic body material 15; and a glass-fiber fixing agent-impregnated part 14 outward on the circumference of the part 13. By having this configuration, inductance for ensuring a noise suppression effect is acquired within a prescribed frequency range, and the noise prevention resistor functions as a noise filter which has a resonance frequency or a cutoff frequency within the prescribed frequency range.
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01C 3/20 - Résistances métalliques fixes en fil ou en ruban, p.ex. bobinées, tressées ou en forme de grille l'élément résistif étant formé de plusieurs spires ou boucles enroulées en spirale, en hélice ou en forme de tore enroulées sur un élément de base cylindrique ou prismatique
91.
RESIN COMPOSITION FOR GENERATING ALLYL PHENOL-MALEIMIDE COPOLYMER FOR ELECTRONIC COMPONENT PROTECTIVE FILM, AND ELECTRONIC COMPONENT PROTECTIVE FILM COMPRISING THIS COPOLYMER
OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Japon)
KOA CORPORATION (Japon)
Inventeur(s)
Ohtsuka Keiko
Yonekawa Morio
Kimura Hajime
Yoshioka Ken
Kanamaru Nobuhiro
Suwa Masaki
Machida Kazumi
Abrégé
A resin composition for generating an allyl phenol-maleimide copolymer for an electronic component protective film, containing (A) an allyl group-containing phenol compound having a rigid structure, (B) an N-aromatic maleimide group-containing compound having a rigid structure, and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle ; Compositions contenant des dérivés de tels polymères
H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The purpose of the present invention is to provide a noise-preventing resistor in which conduction between a cap terminal and a resistance wire is ensured, and a method of manufacturing the same. To achieve the purpose, a noise-preventing resistor 10 has a configuration in which a resistance wire 7 is wound on a peripheral surface of the core material 5, cap terminals 3a, 3b are mounted to both ends of the core material 5, and abraded regions 15a to 15c, 16a to 16c are provided at a plurality of locations in regions of the peripheral surface covered with the cap terminals, wherein the abraded regions 15a to 15c, 16a to 16c, which are formed by cutting an insulating coating (resin coating) 6 covering the resistance wire 7 and parts of the resistance wire 7 underneath the insulating coating 6, expose the resistance wire 7.
H01C 3/20 - Résistances métalliques fixes en fil ou en ruban, p.ex. bobinées, tressées ou en forme de grille l'élément résistif étant formé de plusieurs spires ou boucles enroulées en spirale, en hélice ou en forme de tore enroulées sur un élément de base cylindrique ou prismatique
F02P 15/00 - Allumage par étincelle électrique ayant des caractéristiques non couvertes dans les groupes ou présentant un intérêt autre que celui visé par ces groupes
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
H01C 3/00 - Résistances métalliques fixes en fil ou en ruban, p.ex. bobinées, tressées ou en forme de grille
H01C 3/14 - Résistances métalliques fixes en fil ou en ruban, p.ex. bobinées, tressées ou en forme de grille l'élément résistif étant formé de plusieurs spires ou boucles enroulées en spirale, en hélice ou en forme de tore
The purpose of the present invention is to provide a strain sensor resistor capable of being mounted by soldering on a circuit board. To this end, this strain sensor resistor 10 is formed so as to have an overall chip shape, a resistor (thin-film strain resistance layer) 11 is formed in approximately the center of the top surface of an insulation substrate 20 which serves as a base, and top surface electrodes 15a, 15b are layered on both ends of the resistor 11 so as to be electrically connected to the resistor 11. Subsequently, end surface electrodes 21a, 21b and bottom surface electrodes 17a, 17b are formed so as to extend from the top surface electrodes 15a, 15b over both ends of the insulation substrate 20 and to the bottom surface thereof, thereby forming an electrode pattern for electrically connecting, at the bottom surface of the insulation substrate, the resistor 11 to a conductor pattern on a circuit board top surface. The entire top part of the resistor 11 and a portion of the top surface electrodes 15a, 15b are covered with a protective film (protective coating) 19. Due to this configuration, mounting by soldering on a circuit board, etc. is made possible.
H01C 10/10 - Résistances variables variables par pression ou force mécanique
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
The purpose of the present invention is to provide a flow rate sensor device which has improved sensor responsiveness in comparison to the prior art. This flow rate sensor device (1) is provided with sensor elements (3, 4) which detect flow rate, and is characterized in that a sensor unit (10) to which the sensor elements (3, 4) are mounted, and a drive substrate (11) provided with a drive control circuit are coupled via a coupling part (12) which is narrower than the width of the drive substrate (11). Accordingly, the heat source of the drive substrate (11) and the heat source of the sensor unit (10) can be separated by the narrow coupling part (12), and thermal effects on the sensor unit (10) from the side of the drive substrate (11) can be suppressed, and thus excellent sensor responsiveness can be maintained.
G01F 1/684 - Dispositions de structure; Montage des éléments, p.ex. relativement à l'écoulement de fluide
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
The purpose of the present invention is to provide a flow rate sensor device which has improved sensor responsiveness in comparison to the prior art. This flow rate sensor device (1) is provided with sensor elements (3, 4) which detect flow rate, and is characterized by being provided with: a unit main body (2) provided with a sensor unit (10) to which the sensor elements (3, 4) are mounted; and a case (6) for accommodating the unit main body (2). The flow rate sensor device is further characterized in that the sensor unit (10) is supported in a state of being away from a bottom surface of the case (6). Accordingly, the sensor unit (10) is supported in a state of being suspended above the bottom surface of the case (6), and a space is formed between the sensor unit and the bottom surface. As a result, heat generated by the sensor unit (10) can be isolated from the outside, and excellent sensor responsiveness can be maintained.
G01F 1/684 - Dispositions de structure; Montage des éléments, p.ex. relativement à l'écoulement de fluide
G01P 5/12 - Mesure de la vitesse des fluides, p.ex. d'un courant atmosphérique; Mesure de la vitesse de corps, p.ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
This current detection device comprises: a stack formed by stacking a plurality of insulating layers; a current detection element provided to an inner layer of the stack; a current wiring that is provided with the current detection element, with an interlayer insulating layer therebetween, and that allows a current to flow to the current detection element; a plurality of current vias penetrating the interlayer insulating layer to connect the current detection element and the current wiring; and voltage detection vias electrically connected to the current detection element to obtain a voltage drop in the current detection element.
G01R 15/00 - MESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES - Détails des dispositions pour procéder aux mesures des types prévus dans les groupes , ou
G01R 19/00 - Dispositions pour procéder aux mesures de courant ou de tension ou pour en indiquer l'existence ou le signe
A resistive material 11a for detecting a current includes particles that have insulating properties and a three-dimensional mesh-form metal body that surrounds the particles, the proportion of the metal body with respect to the resistive material 11a being 30-80 vol%.
H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
The present invention relates to a shunt device that is obtained by connecting lead-out terminals to a shunt resistor for large current applications, which is obtained by bonding electrodes that are formed of a metal to both ends of a resistor element that is formed of a resistive alloy, said lead-out terminals detecting the voltage generated between the both ends of the resistor element. This shunt device (1) is provided with: a shunt resistor (2) which is provided with a resistor element (5) that is formed of a resistive alloy and a pair of electrodes (6, 7) that are bonded to both ends of the resistor element (5), while being formed of a high-conductivity metal; and a pair of wide metal frame terminals (3, 4) which are connected to the shunt resistor (2). The electrodes (6, 7) are provided with first height differences (12, 13) in bonding surfaces that are bonded with the resistor element (5); and the frame terminals (3, 4) are connected to the electrodes (6, 7) in such a manner that contact parts (3a, 4a) thereof are adjacent to the first height differences (12, 13).
Provided is a shunt resistor which uses, as a resistor material for a shunt resistance that comprises a single resistor, a Cu-Ni-Zn alloy that mainly comprises copper and further includes nickel and zinc.
This shunt resistor is provided with: a first terminal and a second terminal which comprise a conductive metal material and are each provided with a first plane and a second plane; and support members facing the respective first planes of the first terminal and the second terminal, connected to each of the first planes, and each comprising a resistance body and a metal material connected to the first terminal and the second terminal, wherein the coupling plane areas between the resistance body and the support members and the respective first planes are smaller than the plane areas of the first planes, and a hole section is formed in the first terminal and the second terminal so as to penetrate from the first plane to the second plane.
H01C 1/148 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes enveloppant ou entourant l'élément résistif
brevets
