A manufacturing method for a circuit board connection structure, comprising the steps: providing a circuit board module, the circuit board module comprising a first outer circuit layer, and the first outer circuit layer comprising a plurality of welding pads; forming a first thermal release adhesive layer and an inner circuit layer on the first outer circuit layer, the first thermal release adhesive layer being located between the first outer circuit layer and the inner circuit layer; forming a second thermal release adhesive layer and a second copper foil layer on the inner circuit layer, the second thermal release adhesive layer being located between the inner circuit layer and the second copper foil layer; providing a plurality of through holes penetrating through the second copper foil layer, the second thermal release adhesive layer, the inner circuit layer and the first thermal release adhesive layer, each through hole being used for exposing a welding pad; forming a copper plating layer on the second copper foil layer, the through holes being filled with the copper plating layer to form conductive pillars; etching the copper plating layer and the second copper foil layer to form a second outer circuit layer so as to obtain an intermediate; and heating the intermediate and cleaning same, so as to remove the first thermal release adhesive layer and the second thermal release adhesive layer. The present application further provides a circuit board connection structure.
The present application provides a circuit board and a manufacturing method therefor. The manufacturing method comprises: providing a stack board, the stack board comprising a third conductive line, a second substrate, a first conductive line, a first substrate, and a second conductive line that are stacked in sequence; forming multiple through holes in the surface of the stack board along the stacking direction of the stack board; and manufacturing antenna conductors in the through holes. According to the present application, the through holes are formed in the surface of the stack board; the antenna conductors are provided in the through holes; the antenna conductors located at different layers are connected to corresponding conductive lines; and compared with a blind hole connection mode, some of the antenna conductors are directly connected by means of the conductive lines, thereby reducing loss during signal transmission. Meanwhile, the circuit board comprising an antenna structure is changed from an up-down structure to a left-right structure, such that the thickness of the board is decreased.
A manufacturing method for an embedded circuit board. The manufacturing method comprises the following steps: providing an inner circuit board, and forming a through groove; attaching a loading plate to the inner circuit board so as to seal one end of the through groove; providing an electronic assembly module, wherein the electronic assembly module comprises a body, at least one electronic assembly, a first adhesive layer and a second adhesive layer, a groove is formed in the body, the at least one electronic assembly is fixed to a bottom wall of the groove by means of the first adhesive layer, and the second adhesive layer is filled in the groove and wraps the at least one electronic assembly together with the first adhesive layer; placing the electronic assembly module in the through groove; pressing a first base layer on one side of the inner circuit board; removing the loading plate; and pressing a second base layer on the other side of the inner circuit board, wherein the first base layer and the second base layer are filled in the through groove and together wrap the electronic assembly module. Further provided in the present application is an embedded circuit board prepared by using the method.
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de structures soudées
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
4.
CAMERA MODULE HAVING OPTICAL IMAGE STABILIZATION FUNCTION, AND PREPARATION METHOD THEREFOR
A camera module having an optical image stabilization function, and a preparation method therefor. The camera module comprises a housing and an optical component arranged in the housing. The camera module further comprises a circuit board arranged in the housing, the circuit board comprising a first board and a second board arranged on the first board, wherein the first board is a flexible circuit board; and the first board comprises, in the extension direction of the first board, a first portion, a second portion and a third portion, which are connected to each other in sequence; the second portion is provided with a slot, the second board is arranged on the third portion, and the optical component is mounted on the second board. The first portion comprises a fixed end connected to the second portion and a free end opposite to the fixed end, the housing is provided with a through hole, the first portion passes through the slot to form a bent portion, and the first portion further extends out of the through hole such that the free end is located outside the housing.
The present application provides an anti-shake assembly. The anti-shake assembly comprises a circuit board, a photosensitive chip and a magnetic element. The circuit board comprises a first hard board, a second hard board, a plurality of connectors and a plurality of coils. The first hard board is provided with an accommodating space. The second hard board is movably accommodated in the accommodating space. The connectors are flexibly connected between the first hard board and the second hard board. The photosensitive chip and the coils are disposed on the second hard board. The magnetic element comprises a base and a plurality of magnets. The base comprises a main board and side boards. The side boards are arranged around the periphery of the main board so as to form the accommodating space. The magnets are disposed on the side of the main board facing the accommodating space, and the magnets are arranged opposite to the coils. In addition, the present application also provides a fabrication method for the anti-shake assembly and a camera module.
A pressure-sensitive circuit board (100), comprising a dielectric layer (12), a circuit layer (145), a strain layer (30) and a protective layer (40), wherein the circuit layer (145) is located on a surface of the dielectric layer (12); the strain layer (30) is located on the surface of the dielectric layer (12) that is on the same side as the circuit layer (145); and the protective layer (40) is located on surfaces of the circuit layer (145) and the strain layer (30). The pressure-sensitive circuit board (100) comprises a first copper area (I), a second copper area (II) and a copper-free area (III), which are connected in sequence, wherein the circuit layer (145) is located in the first copper area (I) and the second copper area (II); in the direction in which the circuit layer (145) is stacked on the dielectric layer (12), the circuit layer (145) located in the first copper area (I) is thicker than that located in the second copper area (II), and the circuit layer (145) located in the second copper area (II) is in the shape of a grid; the strain layer (30) is located in the copper-free area (III) and is connected to the circuit layer (145); and the protective layer (40) is located on a surface of the circuit layer (145) located in the second copper area (II) and covers the strain layer (30). The present application further provides a manufacturing method for the pressure-sensitive circuit board (100).
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
G01L 9/06 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent en faisant usage des variations de la résistance ohmique, p.ex. de potentiomètre de dispositifs piézo-résistants
7.
PRESSURE SENSOR, PRESSURE-SENSITIVE CIRCUIT BOARD, AND FABRICATION METHOD FOR PRESSURE-SENSITIVE CIRCUIT BOARD
The present application provides a pressure-sensitive circuit board, comprising a circuit substrate, a plurality of conductive bumps and a strain body. The circuit substrate comprises a dielectric layer and a conductive line that is disposed on the dielectric layer; the plurality of conductive bumps are arranged at intervals on the conductive line, and an accommodating space is provided between every two adjacent conductive bumps; the strain body is disposed on the plurality of conductive bumps and covers the accommodating spaces; the strain body is used for generating deformation under the action of an external force; and the accommodating spaces are used for accommodating at least part of the deformed strain body. In addition, the present application further provides a fabrication method for a pressure-sensitive circuit board. Furthermore, the present application also provides a pressure sensor.
G01L 1/18 - Mesure des forces ou des contraintes, en général en utilisant des propriétés des matériaux piézo-résistants, c. à d. des matériaux dont la résistance ohmique varie suivant les modifications de la grandeur ou de la direction de la force appliquée au matériau
8.
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD FOR CIRCUIT BOARD ASSEMBLY
A circuit board assembly (100), comprising an inner layer circuit substrate (10), a first outer layer circuit substrate (30), a second outer layer circuit substrate (40), a thermal conduction block (20), an electronic component (70), and a reinforcing plate (90); the first outer layer circuit substrate (30) is positioned on a surface of the inner layer circuit substrate (10); the second outer layer circuit substrate (40) is positioned on a surface of the inner layer circuit substrate (10) facing away from the first outer layer circuit substrate (30); the thermal conduction block (20) penetrates through the inner layer circuit substrate (10) and is connected to the first outer layer circuit substrate (30) and the second outer layer circuit substrate (40), the thermal conduction block (20) comprises an accommodating groove (60) with an opening facing the first outer layer circuit substrate (30), and the material of the thermal conduction block (20) is aluminium nitride; at least part of the electronic component (70) is accommodated in the accommodating groove (60) and is electrically connected to the first outer layer circuit substrate (30); and the reinforcing plate (90) is positioned on a surface of the second outer layer circuit substrate (40) corresponding to the electronic component (70) and facing away from the electronic component (70). Also provided in the present application is a manufacturing method for the circuit board assembly (100).
A battery assembly (100), comprising a circuit board (10) and a cell (70). The circuit board (10) comprises a first dielectric layer (22), a second dielectric layer (32), a film (40), a busbar (242), a first heat dissipation copper block (245), a fuse (342), and a second heat dissipation copper block (345). The film (40) is located between the first dielectric layer (22) and the second dielectric layer (32) and has a plurality of spaced cavities (45a). The first heat dissipation copper block (245) and the busbar (242) are located on the surface of the first dielectric layer (22). The second heat dissipation copper block (345) and the fuse (342) are located on the surface of the second dielectric layer (32). The circuit board (10) comprises successive heat dissipation regions (I) and bending regions (II). The heat dissipation regions (I) and the bending regions (II) define an accommodation slot (60). The busbar (242), the first heat dissipation copper block (245), the fuse (342), and the second heat dissipation copper block (345) are all located in the heat dissipation regions (I). The busbar (242) and the first heat dissipation copper block (245) are arranged facing the accommodation slot (60). The cell (70) is located in the accommodation slot (60) and is electrically connected to the circuit board (10) by means of the busbar (242). The present application further provides a battery module (200) and a method for manufacturing the battery assembly (100).
H01M 10/60 - Chauffage ou refroidissement; Commande de la température
H01M 10/613 - Refroidissement ou maintien du froid
H01M 50/284 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports comprenant l’insertion de cartes de circuits, p.ex. de cartes de circuits imprimés
10.
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREFOR
Disclosed in the present application is a circuit board assembly. The circuit board assembly comprises a first circuit board, and a second circuit board arranged on the first circuit board. The first circuit board comprises a first insulating layer, and a first conductive circuit layer arranged on the first insulating layer; the first conductive circuit layer comprises a first contact pad; the position where the first contact pad is located on the first circuit board is provided with a stamping protrusion facing the second circuit board; the second circuit board is arranged on the first circuit board, and comprises a second insulating layer and a second conductive circuit layer arranged on the second insulating layer; the second conductive circuit layer comprises a second contact pad; and the second contact pad comes into contact with the first contact pad located on the stamping protrusion. Further disclosed in the present application is a manufacturing method for the circuit board.
Provided in the present application is a circuit board, comprising a circuit substrate, magnetizers, a plurality of first conductive lines and a plurality of second conductive lines, wherein the circuit substrate comprises a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are respectively disposed on the upper and lower sides of each magnetizer; and the plurality of first conductive lines and the plurality of second conductive lines are respectively disposed on the left and right sides of each magnetizer. The plurality of first conductive lines, a plurality of first circuits, the plurality of second conductive lines and a plurality of second circuits, which are adjacent to each magnetizer, are spirally and progressively connected in sequence to form an induction coil. At least two magnetizers and at least two induction coils wound around outer sides of the magnetizers form a transformer. According to the circuit board provided by the present application, the transformer is provided inside the circuit board, such that the space of the circuit board itself is fully utilized, and the risk of damage caused by exposure of the transformer is reduced. In addition, further provided in the present application is a manufacturing method for a circuit board.
The present application provides a manufacturing method for a circuit board, comprising the following steps: providing an inner laminated structure, wherein the inner laminated structure comprises a conductive circuit and a cover layer, the cover layer is provided at the outermost side of the inner laminated structure, and the conductive circuit comprises a first connection terminal; providing a mask at the side of the cover layer distant from the conductive circuit, wherein a plurality of first openings penetrating through the mask are formed on the mask; using a laser etching mode to etch the cover layer by means of the mask so as to form a second opening, so that the first connection terminal is exposed by the second opening; performing surface treatment on the inner laminated structure; and providing an electronic element, so that the electronic element is electrically connected to the first connection terminal. The present application further provides a circuit board manufactured by the foregoing manufacturing method.
The present invention provides an embedded circuit board, comprising: an inner stackup, comprising a first body portion, a first surface, a second surface, a first recess, and a first opening, the first surface and the second surface being arranged on two opposite sides of the first body portion, the first recess being formed by recessing the first surface towards the first body portion, the first recess not extending to the second surface, and the first opening passing through the second surface and being communicated with the first recess; an embedded element, arranged in the first recess; a first insulating portion, covering the first surface and the side of the embedded element distant from the second surface; and a second insulating portion, covering the second surface and contacting the embedded element by means of the first opening. The present invention also provides a manufacturing method for the embedded circuit board.
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
A lens module (100), comprising: a substrate (10), the substrate (10) being provided with an accommodating hole (11); a photosensitive chip (20), the photosensitive chip (20) being arranged on the substrate (10) and being opposite the accommodating hole (11); a mounting support (30), the mounting support (30) being arranged on the substrate (10), the mounting support (30) being provided with a through hole (31), an inner wall of the through hole (31) extending in the direction of the central axis of the through hole (31) to form a carrying table (32), the side of the mounting support (30) close to the carrying table (32) extending outwards to form a connecting part (33), and the mounting support (30) surrounding the through hole (31) to form a plurality of layers of coils (35), capacitors (36) and resistors (37) by means of laser direct structuring (LDS), and the coils (35) being composed of a plurality of layers of surrounding inductors, which surround the through hole (31) from the inside out, on the mounting support (30); an optical filter (40), the optical filter (40) being arranged on the carrying table (32) and being accommodated in the through hole (31); a lens (50), the lens (50) being mounted in the through hole (31); and a circuit board (60), the circuit board (60) being connected to the mounting support (30) by means of the connecting part (33). Further disclosed is a manufacturing method for the lens module (100).
G02B 7/04 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement
A camera module (100), comprising a support (10), a camera lens (20), a plurality of magnets (25), and a circuit board assembly (30). The support (10) has an inner cavity (11) and an outer wall (12); the camera lens (20) is accommodated in the inner cavity (11); the magnets (25) are arranged on the outer wall (12); the circuit board assembly (30) comprises an outer circuit board (323), a first inner circuit board (321), and a second inner circuit board (351); the first inner circuit board (321) is provided on the surface of the outer circuit board (323) facing the support (10); the first inner circuit board (321) comprises a first dielectric layer (3211) and a first inner circuit layer (3212); the first inner circuit layer (3212) comprises a plurality of coils (3213) formed by winding a conductive circuit; each coil (3213) is provided corresponding to a magnet (25); the second inner circuit board (351) and the first inner circuit board (321) are located on the same surface of the outer circuit board (323); a first opening (34) is formed between the second inner circuit board (351) and the first inner circuit board (321); the second inner circuit board (351) comprises a second inner circuit layer (3512); and the thickness of the coil (3213) is greater than that of the second inner circuit layer (3512). Further provided is a manufacturing method for a camera module (100).
H02K 33/02 - Moteurs avec un aimant, un induit ou un système de bobines à mouvement alternatif, oscillant ou vibrant avec des induits entraînés dans un sens par application d'énergie à un système à une seule bobine et ramenés par une force d'origine mécanique, p.ex. par des ressorts
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
G02B 7/04 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement
A manufacturing method for a circuit board, comprising: providing a first double-sided copper-clad plate comprising a dielectric layer and a first copper foil layer and a copper-plated layer which are formed on two opposite surfaces of the dielectric layer, a trench being formed in the dielectric layer, and the copper-plated layer comprising a first copper-plated portion and a second copper-plated portion other than the first copper-plated portion which are formed in the trench; providing a double-sided circuit substrate comprising a base material layer and two first conductive circuit layers formed on two opposite surfaces of the base material layer, each of the first conductive circuit layers comprising a signal line, two conductive paste blocks being provided in the base material layer, and the two conductive paste blocks being located on both sides of the signal line; respectively stacking the first double-sided copper-clad plate on both sides of the double-sided circuit substrate, such that each of the signal lines is located in the trench; and performing lamination, such that the conductive paste blocks are electrically connected to the second copper-plated portion located on both sides of the base material layer. The present application further provides a circuit board.
Disclosed is an embedded circuit board (100). The embedded circuit board comprises a circuit board (10) provided with a mounting groove (101), and a plurality of components (20), wherein the plurality of components (20) are arranged in the mounting groove (101) and are electrically connected to the circuit board (10). The circuit board (10) comprises a plurality of layers of circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), and the plurality of layers of circuit substrates (11, 12, 13, 14) are arranged in a stacked manner. The embedded circuit board (100) comprises a conductive member (30), wherein the conductive member (30) is arranged in the mounting groove (101), and is electrically connected to the plurality of components (20) and the plurality of layers of circuit substrates (11, 12, 13, 14), and at least two of the components (20) are electrically connected by means of the conductive member (30), which is advantageous for the functional performance of the components and reduces wear.
Provided in the present application is a fabrication method for a plate-to-plate connection structure. The method comprises: providing a first through hole in a first circuit board, accommodating a first connector within the first through hole by means of a first conductive paste, and connecting same to a second circuit board on which a second connector is installed, thereby implementing the connection of the two circuit boards, and reducing the height of the two circuit boards after connection, i.e., reducing the height of a plate-to-plate connection structure. Additionally, since the first connector is accommodated within the first through hole, the first connector is not prone to damage and oxidation. Further provided in the present application is a plate-to-plate connection structure fabricated by the described method.
Disclosed is a rigid-flexible printed circuit board (100), comprising a circuit substrate (10), an adhesive layer (35) and two outer conductive circuit layers (330). At least one opening (101) penetrating the circuit substrate (10) is provided in the circuit substrate (10); the two outer conductive circuit layers (330) are respectively stacked on two opposite sides of the circuit substrate (10) in the penetrating direction of the opening (101); the adhesive layer (35) is bonded between the circuit substrate (10) and each of the outer conductive circuit layers (330) and fills the opening (101). The rigid-flexible printed circuit board (100) is convenient to manufacture. Further disclosed is a manufacturing method for the rigid-flexible printed circuit board (100).
A circuit board (100) and a manufacturing method therefor. The circuit board (100) comprises a substrate (10) and a plurality of conductive wires (20) arranged at intervals on the substrate (10). Each of the conductive wires (20) comprises a seed layer (22) located on one surface of the substrate (10), a first copper layer (24) located on the surface of the seed layer (22) away from the substrate (10), and a second copper layer (26) plated on one surface of the substrate (10). The second copper layer (26) covers the seed layer (22) and the first copper layer (24). The ratio of the thickness of each of the conductive wires (20) to the space between any two adjacent conductive wires (20) is greater than 1. The thickness of the second copper layer (26) in the thickness direction of the substrate (10) is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate (10).
A circuit board, comprising an electromagnetic shielding film, an insulating adhesive portion, a first signal line and a second signal line; the electromagnetic shielding film comprises a first surface and a second surface opposite to each other, the electromagnetic shielding film is divided into a body portion, a first bending portion, and a second bending portion, the first signal line and the second signal line are spaced apart on the first surface in a first direction, the first bending portion and the second bending portion are connected to two opposite sides of the body portion respectively in the first direction, the first bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the first signal line, the second bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the second signal line, the first bending portion and the second bending portion separate the first signal line and the second signal line from each other, and the insulating adhesive portion fills a gap between the first bending portion and the body portion and a gap between the second bending portion and the body portion. The present application further provides a method for manufacturing a circuit board.
Virtual reality gloves (100). Each virtual reality glove (100) comprises a wrist area (130). The virtual reality glove (100) comprises: a substrate (10), the substrate (10) being glove-shaped and flexible; a plurality of conductive lines (20) formed on the substrate (10), each of the conductive lines (20) being curved; a plurality of tactile feedback units (40), each of the tactile feedback units (40) being located on each of the conductive lines (20) and electrically connected to each of the conductive lines (20); and a data processing unit (70), the plurality of conductive lines (20) being separately electrically connected to the data processing unit (70), and the data processing unit (70) being disposed in the wrist area (130). Also provided is a manufacturing method for the virtual reality gloves (100). According to the provided virtual reality gloves (100) and manufacturing method therefor, fingers are freely movable and the gloves are relatively light and thin.
A covering film (100). The covering film (100) comprises a first covering layer (10), a first adhesive layer (20), and a heat conducting layer (30) provided between the first covering layer (10) and the first adhesive layer (20). The heat conductivity of the heat conducting layer (30) is K1, and K1=3-65 W/m.K; the heat conductivity of the first covering layer (10) is K2, and K2=0.02-3.0 W/m.K; the heat conductivity of the first adhesive layer (20) is K3, and K3=0.02-1.0 W/m.K. A circuit board and a manufacturing method therefor. The covering film (100) is provided; the covering film is in contact with a heat source by means of the first covering layer (10) and heat is transferred from the heat source to the heat conducting layer (30) along the thickness direction of the covering film (100); the heat is rapidly transferred in the heat conducting layer (30) along an extension direction of the covering film (100) to avoid local accumulation, thereby reducing the heat transferred to the first adhesive layer (20) and ultimately mitigating the problem of poor signal transmission quality caused by heat absorption and temperature rise of a line layer. According to the circuit board and the manufacturing method, a circuit board having excellent heat insulation performance can be provided, so as to reduce the adverse effect of a high temperature on high-frequency signal transmission.
A manufacturing method of a circuit board (100) comprises: providing a first single-sided circuit base board (20) comprising an insulation substrate (11) and a conductive circuit layer (13); forming, in the insulation substrate (11), multiple first conductive posts (111) electrically connected to the conductive circuit layer (13) to obtain a second single-sided circuit base board (30); providing a first adhesive layer (40), and forming multiple second conductive portions (401); providing the second single-sided circuit base board (30), and providing a through accommodation recess (31) to obtain a third single-sided circuit base board (50); providing another one of the first single-sided circuit board (20), and mounting an electronic component (14) on the conductive circuit layer (13) to obtain a patch circuit base board (60); sequentially stacking the first single-sided circuit base board (20), the first adhesive layer (40), the second single-sided circuit base board (30), and at least one of the third single-sided circuit base board (50), and the patch circuit base board (60); and laminating to obtain an intermediate product (70). Further provided is a circuit board (100). The overall manufacturing process of the invention comprises only one lamination operation, thereby alleviating circuit board warping caused by multiple lamination operations in the prior art.
A circuit board and a fabrication method therefor. The fabrication method comprises the following steps: providing an insulation substrate (10); providing at least one through hole (101) in the insulation substrate (10); forming patterned first conductive layers (20) on two oppositely disposed surfaces of the insulation substrate (10), wherein the first conductive layers (20) are further formed at an internal wall of the through hole (101) so as to form a conductive hole (102); forming a phase change material layer (30) on a surface of each of the first conductive layers (20) away from the insulation substrate (10), wherein the phase change material layer (30) further fills the conductive hole (102); forming a seed layer (43) on the surface of the first conductive layers (20) having the phase change material layer (30) thereon, and forming a second conductive layer (40) on a surface of the seed layer (43); and etching a conductive portion (433), the first conductive layers (20), and the second conductive layer (40), and accordingly forming a first conductive circuit layer (41) and a second conductive circuit layer (42) on the two oppositely disposed surfaces of the insulation substrate (10), such that the phase change material layer (30) is embedded in the first conductive circuit layer (41) and the second conductive circuit layer (42).
A stretchable smart fabric (100, 200), comprising: a fabric body (110, 210), the fabric body (110, 210) comprising at least two sewing seams (111, 211). The stretchable smart fabric (100, 200) also comprises: at least two signal collection portions (120, 220), the at least two signal collection portions (120, 220) being respectively sewed at the at least two sewing seams (111, 211) of the fabric body (110, 210). Each signal collection portion (120, 220) comprises: a plurality of first signal transmission lines (14) and at least one signal processing element (13), the plurality of first signal transmission lines (14) being electrically connected to the signal processing element (13), respectively; and a plurality of second signal transmission lines (140, 240), the plurality of second signal transmission lines (140, 240) being electrically connected to the plurality of first signal transmission lines (14) inside the signal collection portions (120, 220), respectively, to form a circuit. Both the first signal transmission lines (14) and the second signal transmission lines (140, 240) are elastic. The signal processing element (13) is used for collecting and analyzing the changes in resistance values of the second signal transmission lines (140, 240) to determine movement postures of a wearer. The stretchable smart fabric (100, 200) has good stretchability and a nice appearance.
A stretchable sensing structure (100) and a manufacturing method therefor. The stretchable sensing structure (100) comprises a stretchable sensing array (110). The stretchable sensing array (110) comprises: at least two first sensing electrodes (10) arranged in an array, wherein the first sensing electrodes (10) are used for sensing different physiological signals, each first sensing electrode (10) comprises: a first stretchable substrate layer, a pre-stretched pattern layer formed on the first stretchable substrate layer, and an electrode sheet formed on the first stretchable substrate layer and in electrical contact with the pre-stretched pattern layer, and the electrode sheet is made of a carbon paste; and a plurality of signal transmission lines (20), every two adjacent first sensing electrodes (10) being electrically connected by means of the signal transmission lines (20). The stretchable sensing structure further comprises a signal processing element (130), the first sensing electrodes (10) being electrically connected to the signal processing element (130) by means of the signal transmission lines (20). The stretchable sensing structure (100) has good stretchability, diverse sensing functions and variable resistance.
A manufacturing method for a high-frequency transmission circuit board, comprising: providing a first circuit board (20), a second circuit board (40), at least one third circuit board (50), a fourth circuit board (60), a fifth circuit board (61), and a sixth circuit board (62); stacking the first circuit board (20), the second circuit board (40), and the third circuit board (50) in sequence, and stacking the fourth circuit board (60), the sixth circuit board (62) and the fifth circuit board (61) on the third circuit board (50); and pressing same together to obtain a high-frequency transmission circuit board. The proposed manufacturing method for a high-frequency transmission circuit board can reduce the width of transmission lines. Further provided is a high-frequency transmission circuit board which is manufactured using the manufacturing method.
The present application proposes a manufacturing method for a multi-layer circuit board, the method comprising the following steps: providing one or more single-sided circuit boards, each of the single-sided circuit boards comprising a first insulation layer and a first conductive circuit layer that are arranged as a stack, and the first insulation layer being provided with at least one first conductive paste block therein; providing a double-sided circuit board comprising a second conductive circuit layer, a second insulation layer, and a third conductive circuit layer that are sequentially arranged as a stack, the second conductive circuit layer comprising a connection pad; stacking at least one of the single-sided circuit boards on one side of the second conductive circuit layer to obtain an intermediate product; and laminating the intermediate product, such that the first conductive paste block is adhered to a second conductive paste block, thereby obtaining a multi-layer circuit board. The manufacturing method for a multi-layer circuit board provided in the present application alleviates overflow and misalignment between conductive paste blocks. The present application further provides a multi-layer circuit board manufactured by the manufacturing method.
Provided by the present application is a fabrication method for a vapor chamber, comprising: providing a copper-clad substrate having a copper foil layer; pressing a photoresist layer, exposing and developing so as to form an outer side opening and a plurality of inner side openings; electroplating in the plurality of inner side openings to form a plurality of heat conducting bumps; electroplating in the outer side opening to form a connecting bump, the connecting bump surrounding the plurality of heat conducting bumps; removing the photoresist layer so as to obtain an intermediate; stacking two intermediates such that a connecting bump of one of the intermediates corresponds to a connecting bump of another intermediate; and then welding the two corresponding connecting bumps so as to produce a sealed cavity between the two intermediates, vacuumizing, and injecting a working fluid into the sealed cavity so as to obtain a vapor chamber. The formation of conductive bumps on a copper foil layer by means of electroplating provided in the present application can significantly enhance heat conduction efficiency between the copper foil layer and the conductive bumps and reduce thermal resistance. Also provided in the present application is a vapor chamber.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p.ex. tubes caloporteurs avec des tubes ayant une structure capillaire
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
31.
MULTI-SURFACE LIGHT-EMITTING CIRCUIT BOARD AND FABRICATION METHOD THEREFOR
The present invention relates to a multi-surface light-emitting circuit board, comprising: a transparent substrate layer and a first conductive circuit layer that is located on at least one surface of the transparent substrate layer; the first conductive circuit layer comprises a plurality of conductive portions disposed at intervals; a metal piece is formed at a surface of each conductive portion far from the transparent substrate layer; an accommodating space is formed between adjacent metal pieces; the accommodating space is provided with a light-emitting chip; each light-emitting chip comprises two electrodes and the two electrodes are located at two opposite ends thereof, respectively; the electrodes make electrical contact with two adjacent metal pieces, respectively, so as to turn on; a sealant layer is also formed at a surface of the first conductive circuit layer; and the sealant layer covers and encapsulates the metal pieces and the light-emitting chip. The present invention also relates to a fabrication method for a multi-surface light-emitting circuit board.
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
F21S 2/00 - Systèmes de dispositifs d'éclairage non prévus dans les groupes principaux ou , p.ex. à construction modulaire
F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
32.
THIN CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
A thin circuit board (100) and a manufacturing method therefor. The thin circuit board (100) comprises: a dielectric layer (40); an inner layer circuit substrate (30); and a metal layer (50) provided on at least one side of the inner layer circuit substrate (30). The metal layer (50) is covered by the dielectric layer (40), the dielectric layer (40) comprises an insulation layer (11) located at the outermost side and a bonding structure (20) sandwiched between the inner layer circuit substrate (30) and the metal layer (50), and the metal layer (50) is covered by the insulation layer (11) and the bonding structure (20).
An encapsulation structure (100), comprising: a dielectric layer (60); at least one inner-layer line layer (70) buried in the dielectric layer (60); at least two outer-layer line layers (80) located on two sides of the at least one inner-layer line layer (70) and combined with the dielectric layer (60); and at least one electronic element (30) buried in the dielectric layer (60). Each inner-layer line layer (70) comprises at least two support pads (71) arranged at an interval, and each support pad (71) comprises a body (713) and a protruding portion (715) that extends outwards from the periphery of the body (713). The encapsulation structure (100) further comprises at least two positioning columns (20) arranged at an interval, wherein each positioning column (20) is correspondingly connected to one body (713); and each electronic element (30) is located between the at least two positioning columns (20), and an end of each electronic element (30) is in contact with the protruding portions (715) of the at least two support pads (71), such that the electronic element (30) is precisely encapsulated. Further provided is a manufacturing method for the encapsulation structure (100).
An interposer for connecting two circuit boards, comprising: an inner layer (10), an outer layer (20) and a protective layer (50). The inner layer (10) comprises a first base layer (11) and a first circuit layer (131) formed on a surface of the first base layer (11). The outer layer (20) comprises a second base layer (21) and a second circuit layer (231) formed on a surface of the second base layer (21). The second base layer (21) overlays the first circuit layer (131). An end of at least one circuit of the first circuit layer (131) and the second circuit layer (231) extends to a side of the interposer (100), and an end of another circuit extends to the other side of the interposer (100). The first circuit layer (131) is electrically connected to the second circuit layer (231) by means of a conductive blind hole (41), forming a communication path from one side of the interposer (100) to the other side thereof so as to connect two circuit boards. The protective layer (50) overlays an outer side of the second circuit layer (231).
A circuit board (100), comprising at least one first circuit substrate (10) and at least one second wiring substrate (20) overlapped with the first wiring substrate (10), wherein each first wiring substrate (10) comprises: a first substrate layer (11), a first wiring layer (12) arranged on the first substrate layer (11), and a plurality of first conductors (13); the first conductors (13) are formed by means of an electroplating process; the first wiring layer (12) comprises a hot-pressing area (121) and a non-hot-pressing area (122) apart from the hot-pressing area (121); one end of each first conductor (13) is electrically connected to the hot-pressing area (121), and the other end thereof is exposed from the first substrate layer (11); each second wiring substrate (20) comprises: a second substrate layer (21), a second wiring layer (22) arranged on the second substrate layer (21), and a plurality of second conductors (23); each second conductor (23) comprises a conductive paste; one end of the second conductor (23) is electrically connected to the second wiring layer (22), and the other end thereof is exposed from the second substrate layer (21); and the first conductor (13) is in electrical conduction with the second conductor (23). Further provided are a method for manufacturing a circuit board (100) and a method for manufacturing a circuit board assembly.
A preparation method for a circuit board (100, 200) having a heat-dissipation structure, comprising: providing at least one circuit substrate (30), the circuit substrate (30) comprising a first conductive circuit layer (20), an insulation layer (102), and an alloy layer (103) sequentially stacked; forming a solder paste layer (32) at one side of the alloy layer (103), a part of the alloy layer (103) being exposed on the solder paste layer (32) to form a heat transfer surface (40); providing a core layer (31); and attaching the two circuit substrates (30) at two opposite sides of the core layer (31) and laminating same, so that the solder paste layers (32) of the two circuit substrates (30) are fitted to each other, and a sealing heat-dissipation cavity (33) is formed between the heat transfer surfaces (40) of the two circuit substrates (30); the heat-dissipation cavity (33) comprising a heat transfer medium, so as to obtain the circuit board (100, 200) having a heat-dissipation structure. The preparation method for the circuit board (100, 200) having a heat-dissipation structure can prevent the collapse of the heat-dissipation cavity (33) and ensure the heat-dissipation effect. The preparation process of the circuit board (100, 200) is simplified. Also provided is a circuit board (100, 200) having a heat-dissipation structure.
A transparent circuit board, comprising a conductive circuit, and a transparent insulating layer and a cover film that are stacked. The conductive circuit penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive circuit. The surface of the conductive circuit combined with the cover film is provided with a blackening layer. The surface of the conductive circuit that is not provided with the blackening layer is provided with a carbon black layer. Therefore, the light transmittance of the transparent circuit is improved. The present invention also provides a manufacturing method for the transparent circuit board.
A package structure, comprising an inner circuit layer, a first dielectric layer, a first outer circuit layer, and an electronic assembly. The first dielectric layer comprises a first surface and a second surface opposite to the first surface; the inner circuit layer and the electronic assembly are embedded in the first dielectric layer from the first surface, and the first outer circuit layer is provided on the second surface; the electronic assembly comprises a first electronic element and a second electronic element; the second electronic element is provided close to the second surface, and an electrical connection end of the second electronic element faces the second surface; the first electronic element is provided on the side of the second electronic element distant from the second surface, and the first electronic element is exposed from the first surface; the first outer circuit layer is electrically connected to the electrical connection end of the second electronic element, and the inner circuit layer. The present invention necessarily further provides a manufacturing method for the package structure.
Disclosed is a flexible circuit board (100, 200, 300, 400, 500, 600, 700, 800). The flexible circuit board (100, 200, 300, 400, 500, 600, 700, 800) comprises at least one insulating base material layer (11, 21, 31, 41, and 51) and at least one circuit layer (12, 22, 32, 42, 52), the flexible circuit board (100, 200, 300, 400, 500, 600, 700, 800) further comprises a cable area (1001) and at least one antenna area (1002), and the cable area (1001) is provided with a cable ( 110). The cable (110) comprises at least one cable base material layer and at least one cable line layer formed on a surface of the cable base material layer. The antenna area (1002) is provided with at least one antenna (120), and each antenna (120) comprises at least one antenna area base material (11b, 21b, 41b, 51b) and at least one antenna area line (122, 222, 323, 422, 522) formed on a surface of the antenna area base material (11b, 21b, 41b, 51b). The antenna area base matrial (11b, 21b, 41b, 51b) and the cable base material layer on the same plane are different parts of the same insulating base material layer (11, 21, 31, 41, 51), and the antenna area lines (122, 222, 323, 422, 522) and the cable line layer on the same plane are made at the same time and are different parts of the same line layer (12, 22, 32, 42, 52). Further provided is a manufacture method for a flexible circuit board (100, 200, 300, 400, 500, 600, 700, 800).
HONG HENG SHENG ELECTRONICAL TECHNOLOGY (HUAIAN) CO., LTD. (Chine)
AVARY HOLDING (SHENZHEN) CO., LIMITED. (Chine)
Inventeur(s)
Li, Zuai
He, Sihong
Huang, Meihua
Hou, Ning
Abrégé
Provided is a circuit board (100), comprising: a substrate (11); a first conductive circuit layer (40) formed on a surface of the substrate (11); a solder mask layer (60) covering a surface, away from the substrate (11), of the first conductive circuit layer (40), wherein the solder mask layer (60) is provided with a groove (601), the groove (601) is used for exposing part of the first conductive circuit layer (40), the exposed part of the first conductive circuit layer (40) forms a welding pad (401), and the solder mask layer (60) comprises a side wall (602) at the position where the groove (601) is formed; and a covering film (70) covering a surface, away from the first conductive circuit layer (40), of the solder mask layer (60), wherein the covering film (70) comprises a first light diffusion material, the covering film (70) is provided with a window (701), the window (701) corresponds to the groove (601) in position and is used for exposing the welding pad (401), the covering film (70) comprises a covering part (74) and a side reflection part (75), the covering part (74) is formed on the solder mask layer (60), and the side reflection part (75) is connected to the covering part (74) and covers the side wall (602). Further provided are a preparation method for the circuit board (100), and a backlight plate (200) having the circuit board (100).
An adapter plate (100) and a manufacturing method therefor. Said method comprises: providing a mould which is internally provided with a plurality of first fixing plates (210) and second fixing plates (220), the first fixing plates (210) being provided with a plurality of first fixing holes (2101), and the second fixing plates (220) being provided with a plurality of second fixing holes (2201); providing a plurality of wires (30), the plurality of wires (30) sequentially passing through the plurality of first fixing plates (210) and second fixing plates (220); pouring a non-conductive material into a moulding cavity to form a green body (300); cutting the green body (300) along two sides of the first fixing plates (210) and the second fixing plates (220) respectively to obtain a plurality of plate bodies (10), the plate bodies (10) comprising a first surface (101) and a second surface (102) which are arranged opposite each other; and forming a plurality of first connection pads (11) on the first surface (101), and forming a plurality of second connection pads (12) on the second surface (102).
H01L 23/60 - Protection contre les charges ou les décharges électrostatiques, p.ex. écrans Faraday
H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de structures soudées
Provided are a circuit board (100, 300) and a fabricating method therefor. The method comprises: (1) providing a substrate (10) and forming a through hole in the substrate (10); (2) filling a through hole (11) with a conductor (111) to form a conductive hole (12); (3) providing a peelable film (13) and covering same on the substrate (10); (4) forming a groove (15) by means of laser, wherein the groove (15) comprises a recess (151); (5) carrying out surface treatment on a wall of the groove (15); (6) removing the peelable film (13); (7) forming a seed layer (16); (8) fabricating a circuit layer (20) to obtain a circuit board unit (100), wherein the circuit layer (20) comprises a connecting pad (21), the connecting pad (21) being in the form of a conductive bump and electrically connected to the conductor (111) in a surrounding manner; (9) repeating steps (1) to (8) at least once; and (10) laminating the circuit board unit (100).
A manufacturing method for a rigid-flex circuit board, comprising the following steps: providing a first wiring board and a first substrate, and pressing the first substrate on the surface of the first wiring board by means of a first adhesive layer, the first substrate comprising a second base layer pressed on the surface of the first adhesive layer, a protection layer formed on the surface of the second base layer, and a first copper layer formed on the surface of the protection layer; causing the first copper layer to form a third conductive wiring layer; partially covering the protection layer exposed by the third conductive wiring layer and removing the protection layer exposed by the third conductive wiring layer and a covered region; providing a second copper layer, and pressing the second copper layer on the surface of the third conductive wiring layer by means of a second adhesive layer, the second copper layer and the second adhesive layer both being subjected to a pre-windowing process to form a window region, the window region being located at the remaining protection layer; removing the protection layer at the window region; and causing the second copper layer to form a fifth conductive wiring layer. The present invention further provides a rigid-flex circuit board.
The present invention provides a manufacturing method for an embedded circuit board, comprising: providing an inner laminate (10), which is a dual-sided circuit board; providing a third circuit board (103) and a fourth circuit board (104), and respectively press-fitting same onto two sides of the inner laminate (10); providing two spaced through holes (30) on a structure obtained in the previous step; electroplating the outer side surfaces of the third circuit board (103) and the four circuit board (104) and the inner side surfaces of the through holes (30), so as to form a first electroplated layer (50); removing a structure between the two through holes (30) to form a slotted hole (40) having the two through holes (30) as two ends; receiving an electronic element (200) and fixing same in a middle part of the slotted hole (40), so that electrodes (201) of the electronic element (200) respectively face towards the two ends of the slotted hole (40) and are electrically connected to the first electroplated layer (50); providing a first circuit board (101) and a second circuit board (102), and respectively press-fitting same onto two sides of a structure obtained in the previous step so as to embed the electronic element (200); and performing surface treatment on a structure obtained in the previous step to obtain an embedded circuit board (100). The present invention further provides an embedded circuit board (100) made with the manufacturing method.
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