Abrégé

An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A preparation method for a circuit board connection structure includes: providing a circuit board module that including a first outer wiring layer, and the first outer wiring layer including solder pads; forming a first pyrolytic adhesive layer and an inner wiring layer on the first outer wiring layer; forming a second pyrolytic adhesive layer and a second copper foil layer on the inner wiring layer; defining a plurality of through holes each configured to expose one of the solder pads; forming a copper plating layer on the second copper foil layer; etching the copper plating layer and the second copper foil layer to form a second outer wiring layer, thereby obtaining an intermediate body; heating and washing the intermediate body to remove the first pyrolytic adhesive layer and the second pyrolytic adhesive layer. The present application also provides a circuit board connection structure.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A manufacturing method for a circuit board connection structure, comprising the steps: providing a circuit board module, the circuit board module comprising a first outer circuit layer, and the first outer circuit layer comprising a plurality of welding pads; forming a first thermal release adhesive layer and an inner circuit layer on the first outer circuit layer, the first thermal release adhesive layer being located between the first outer circuit layer and the inner circuit layer; forming a second thermal release adhesive layer and a second copper foil layer on the inner circuit layer, the second thermal release adhesive layer being located between the inner circuit layer and the second copper foil layer; providing a plurality of through holes penetrating through the second copper foil layer, the second thermal release adhesive layer, the inner circuit layer and the first thermal release adhesive layer, each through hole being used for exposing a welding pad; forming a copper plating layer on the second copper foil layer, the through holes being filled with the copper plating layer to form conductive pillars; etching the copper plating layer and the second copper foil layer to form a second outer circuit layer so as to obtain an intermediate; and heating the intermediate and cleaning same, so as to remove the first thermal release adhesive layer and the second thermal release adhesive layer. The present application further provides a circuit board connection structure.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01Q 1/22 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets

Abrégé

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché

Abrégé

The present application provides a circuit board and a manufacturing method thereof. The manufacturing method includes: providing a stacked board; the stacked board includes a third conducting circuit, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; defining several through holes on a surface of the stacked board along a stacked direction of the stacked board; and manufacturing antenna conductors in the through holes. The antenna conductors are disposed in the through holes on a surface of the stacked board, the antenna conductors on different layers are connected to corresponding conducting circuits, some of the antenna conductors are directly connected with the conducting circuit. A loss of signals while transmitting is reduced, and the circuit board including the antenna structure is changed from an up-down structure into a left-right structure for reducing a board thickness.

Classes IPC  ?

• H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H01Q 1/36 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie
• H05K 3/42 - Trous de passage métallisés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

The present application provides a pressure-sensitive circuit board, including a circuit substrate, a number of conductive convex blocks, and a strain member. The circuit substrate includes a dielectric layer and a conductive wiring layer on the dielectric layer. The conductive convex blocks are spaced from each other on the conductive wiring layer. A receiving space is defined between adjacent conductive convex blocks. The strain member is formed on the conductive convex blocks and covers the receiving space. The strain member can be deformed under an external force. The receiving space can receive at least a portion of the strain member. The present application further provides a manufacturing method for the pressure-sensitive circuit board. The present application further provides a pressure sensor.

Classes IPC  ?

• G01L 1/22 - Mesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c. à d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte en utilisant des jauges de contrainte à résistance

Abrégé

A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H01L 35/16 - Emploi d'un matériau spécifié pour les bras de la jonction utilisant des compositions inorganiques comprenant du tellure, du sélénium, ou du soufre
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.

Classes IPC  ?

• H04N 23/68 - Commande des caméras ou des modules de caméras pour une prise de vue stable de la scène, p. ex. en compensant les vibrations du boîtier de l'appareil photo
• G03B 5/00 - Réglage du système optique relatif à l'image ou à la surface du sujet, autre que pour la mise au point présentant un intérêt général pour les appareils photographiques, les appareils de projection ou les tireuses
• H04N 23/51 - Boîtiers
• H04N 23/54 - Montage de tubes analyseurs, de capteurs d'images électroniques, de bobines de déviation ou de focalisation

Abrégé

A method for manufacturing a photoelectric composite circuit board, includes providing a copper-clad carrier and an intermediate circuit, the copper-clad carrier includes a substrate layer and a bottom copper layer, a first groove is defined on the intermediate circuit. Forming an optical fiber in the first groove. Forming a first accommodating groove and a second accommodating groove at each end the optical fiber. Accommodating a first coupling element in the first accommodating groove. Removing the substrate layer. Removing the bottom copper layer corresponding to the optical fiber, the intermediate circuit on one side of the optical fiber and the bottom copper layer forming a first circuit substrate, the intermediate circuit on another side of the optical fiber and the bottom copper layer forming a second circuit substrate. Electrically connecting a chip to the first circuit substrate, and electrically connecting an electronic component to the second circuit substrate.

Classes IPC  ?

• G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
• G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A buried thermistor includes a lower substrate, an upper substrate, and a number of thermistor stacks. Each thermistor stack includes two resistor subjects. Each resistor subject includes a base layer, a medium layer, a metal layer, a resistor layer, a nanometal layer, and a conductive layer. Applicable material of the resistor layer becomes more diverse by disposing the number of thermistor stacks, and the buried thermistor shows variable thermal sensitivity.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant
• H01C 17/00 - Appareils ou procédés spécialement adaptés à la fabrication de résistances
• H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif

Abrégé

A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

Classes IPC  ?

• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/34 - Connexions soudées
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes

Abrégé

A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pressing a first substrate onto a surface of the inner circuit substrate; removing the support plate; pressing a second substrate onto another surface of the inner circuit substrate, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate. A multilayer circuit board is also disclosed.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés

Abrégé

A wiring substrate includes a first insulating layer with a first opening, a second insulating layer with a second opening, a high-frequency wiring layer, a first wiring layer, a second wiring layer, and a plurality of conductive pillars. The high-frequency wiring layer including a high-frequency trace is sandwiched between the first insulating layer and the second insulating layer. The first opening and the second opening expose two sides of the high-frequency trace respectively. The high-frequency trace has a smooth surface which is not covered by the first insulating layer and the second insulating layer and has the roughness ranging between 0.1 and 2 μm. The first insulating layer and the second insulating layer are all located between the first wiring layer and the second wiring layer. The conductive pillars are disposed in the second insulating layer and connected to the high-frequency trace.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p.ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• C25D 7/06 - Fils; Bandes; Feuilles

Abrégé

A circuit board with embedded components and a method of fabricating the same are provided. The method includes coating an adhesive layer over a substrate, and disposing electronic components on the adhesive layer. Subsequently, after disposing a dielectric layer over the electronic components and the adhesive layer, the substrate and the adhesive layer are removed to form an embedded layer. Then, a wiring layer is formed on the electronic components, and conductive connecting components are formed within the dielectric layer. A cover layer is laminated over the dielectric layer and the wiring layer. Therefore, the electronic components are embedded within the dielectric layer, and the wiring layer electrically connecting to the electronic components are precisely located on a surface of the embedded layer.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/05 - Substrat en métal isolé
• H05K 3/34 - Connexions soudées
• H05K 3/42 - Trous de passage métallisés

Abrégé

A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H01P 3/02 - Guides d'ondes; Lignes de transmission du type guide d'ondes à deux conducteurs longitudinaux
• H01P 3/00 - Guides d'ondes; Lignes de transmission du type guide d'ondes
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché

Abrégé

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H01L 23/552 - Protection contre les radiations, p.ex. la lumière

Abrégé

A circuit board assembly includes a first circuit board and a second circuit board. The first circuit board includes a first contact pad and defines a stamped protrusion being correspondingly positioned relative to a position of the first contact pad, the first contact pad being outside the stamped protrusion. The second circuit board includes a second contact pad. The first contact pad on the stamping protrusion is in contact with the second contact pad to achieve electronic connections between the first circuit board and the second circuit board. A method for manufacturing the circuit board assembly is further disclosed.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés

Abrégé

An anti-shake assembly with reduced size is disclosed which includes a circuit board, a photosensitive chip, and a magnetic component. The circuit board includes a first rigid board, a second rigid board, a plurality of connectors, and a plurality of coils. The first rigid board has a housing space. The second rigid board is movably housed in the housing space. The connectors are flexibly connected between the first rigid board and the second rigid board. The photosensitive chip and the coils are provided on the second rigid board. The magnetic component includes a base and a plurality of magnets. The base includes a central plate and a side plate. The side plate is arranged around a periphery of the central plate to form a housing space. The magnets are provided on the central plate facing the housing space. The magnets are arranged opposite to the coils.

Classes IPC  ?

• H04N 23/68 - Commande des caméras ou des modules de caméras pour une prise de vue stable de la scène, p. ex. en compensant les vibrations du boîtier de l'appareil photo
• H02K 41/035 - Moteurs à courant continu; Moteurs unipolaires
• G02B 27/64 - Systèmes pour donner des images utilisant des éléments optiques pour la stabilisation latérale et angulaire de l'image

Abrégé

A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.

Classes IPC  ?

• G01L 1/22 - Mesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c. à d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte en utilisant des jauges de contrainte à résistance

Abrégé

A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

A battery assembly includes a circuit board and a battery cell. The circuit board includes a first dielectric layer, a second dielectric layer, an adhesive film, a bus bar, a first copper block, a fuse, and a second copper block. The adhesive film is located between the first dielectric layer and the second dielectric layer and includes cavities. The first copper block and the bus bar are on the first dielectric layer. The second copper block and the fuse are on the second dielectric layer. The circuit board is divided into heat dissipation areas and bending areas which are connected and alternately arranged, the heat dissipation areas and the bending areas enclose a holding groove. The bus bar and the first block copper are accommodated in the holding groove. The battery cell is accommodated in the holding groove. A battery module and a manufacturing method are also disclosed.

Classes IPC  ?

• H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
• H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
• H01M 10/653 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des matériaux électriquement isolants ou thermiquement conducteurs
• H01M 50/583 - Dispositifs ou dispositions pour l’interruption du courant en réponse au courant, p.ex. fusibles
• H01M 10/04 - Structure ou fabrication en général
• H01M 10/613 - Refroidissement ou maintien du froid
• H01M 10/6551 - Surfaces spécialement adaptées à la dissipation de la chaleur ou à la radiation, p.ex. nervures ou revêtements

Abrégé

A method of manufacturing a display module which is able to present a split-screen display without a black line prominent at the boundary includes: providing a first circuit substrate including a plurality of first pads, providing a second circuit substrate including a plurality of second pads; bonding the first circuit substrate and the second circuit sub state onto a surface of a heat dissipation plate through a first heat conductive adhesive; and mounting a plurality of light emitting diodes onto the first conductive wiring layer and the third conductive wiring layer, where one light emitting diodes is electrically connected to two first pad, one light emitting diode is electrically connected to one first pad and one second pad, and one light emitting diode is electrically connected to two second pads. A display module including light emitting diodes is also disclosed.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
• H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement

Abrégé

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/24 - Renforcement du parcours conducteur

Abrégé

The present application provides a circuit board and a manufacturing method therefor. The manufacturing method comprises: providing a stack board, the stack board comprising a third conductive line, a second substrate, a first conductive line, a first substrate, and a second conductive line that are stacked in sequence; forming multiple through holes in the surface of the stack board along the stacking direction of the stack board; and manufacturing antenna conductors in the through holes. According to the present application, the through holes are formed in the surface of the stack board; the antenna conductors are provided in the through holes; the antenna conductors located at different layers are connected to corresponding conductive lines; and compared with a blind hole connection mode, some of the antenna conductors are directly connected by means of the conductive lines, thereby reducing loss during signal transmission. Meanwhile, the circuit board comprising an antenna structure is changed from an up-down structure to a left-right structure, such that the thickness of the board is decreased.

Classes IPC  ?

• H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A wiring substrate includes a first insulating layer with a first opening, a second insulating layer with a second opening, a high-frequency wiring layer, a first wiring layer, a second wiring layer, and a plurality of conductive pillars. The high-frequency wiring layer including a high-frequency trace is sandwiched between the first insulating layer and the second insulating layer. The first opening and the second opening expose two sides of the high-frequency trace respectively. The high-frequency trace has a smooth surface which is not covered by the first insulating layer and the second insulating layer and has the roughness ranging between 0.1 and 2 μm. The first insulating layer and the second insulating layer are all located between the first wiring layer and the second wiring layer. The conductive pillars are disposed in the second insulating layer and connected to the high-frequency trace.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A manufacturing method for an embedded circuit board. The manufacturing method comprises the following steps: providing an inner circuit board, and forming a through groove; attaching a loading plate to the inner circuit board so as to seal one end of the through groove; providing an electronic assembly module, wherein the electronic assembly module comprises a body, at least one electronic assembly, a first adhesive layer and a second adhesive layer, a groove is formed in the body, the at least one electronic assembly is fixed to a bottom wall of the groove by means of the first adhesive layer, and the second adhesive layer is filled in the groove and wraps the at least one electronic assembly together with the first adhesive layer; placing the electronic assembly module in the through groove; pressing a first base layer on one side of the inner circuit board; removing the loading plate; and pressing a second base layer on the other side of the inner circuit board, wherein the first base layer and the second base layer are filled in the through groove and together wrap the electronic assembly module. Further provided in the present application is an embedded circuit board prepared by using the method.

Classes IPC  ?

• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
• H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de structures soudées
• H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements

Abrégé

A method for manufacturing a circuit board with a heat dissipation structure comprises: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board with a heat dissipation structure.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés

Abrégé

A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

Classes IPC  ?

• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1=3˜65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2=0.02˜3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3=0.02˜1.0 W/m.K. A circuit board and its manufacturing method are also provided.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat

Abrégé

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

Classes IPC  ?

• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/38 - Dispositifs de refroidissement utilisant l'effet Peltier
• H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
• H01L 23/528 - Configuration de la structure d'interconnexion
• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
• H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
• H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
• H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/24 - Renforcement du parcours conducteur

Abrégé

A manufacturing method of a circuit board includes: providing a first double-sided copper laminate including a dielectric layer, a first copper foil layer and a copper plating layer wherein the dielectric layer, wherein the dielectric layer defines a groove, the copper plating layer includes a first copper plating portion in the groove and a second copper plating portion beside the first copper plating portion. A double-sided circuit substrate including base layer and two first wiring layers is provided, wherein each first wiring layer includes a signal line. Conductive paste blocks are disposed in the base layer and on both sides of the signal line; and a first double-sided copper laminate is stacked on each side of the double-sided circuit substrate, disposing the signal line in the groove. The conductive paste blocks are pressed electrically connect same to the second copper plating portions. The present disclosure further provides a circuit board.

Classes IPC  ?

• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A camera module having an optical image stabilization function, and a preparation method therefor. The camera module comprises a housing and an optical component arranged in the housing. The camera module further comprises a circuit board arranged in the housing, the circuit board comprising a first board and a second board arranged on the first board, wherein the first board is a flexible circuit board; and the first board comprises, in the extension direction of the first board, a first portion, a second portion and a third portion, which are connected to each other in sequence; the second portion is provided with a slot, the second board is arranged on the third portion, and the optical component is mounted on the second board. The first portion comprises a fixed end connected to the second portion and a free end opposite to the fixed end, the housing is provided with a through hole, the first portion passes through the slot to form a bent portion, and the first portion further extends out of the through hole such that the free end is located outside the housing.

Classes IPC  ?

• H04N 5/225 - Caméras de télévision

Abrégé

The present application provides an anti-shake assembly. The anti-shake assembly comprises a circuit board, a photosensitive chip and a magnetic element. The circuit board comprises a first hard board, a second hard board, a plurality of connectors and a plurality of coils. The first hard board is provided with an accommodating space. The second hard board is movably accommodated in the accommodating space. The connectors are flexibly connected between the first hard board and the second hard board. The photosensitive chip and the coils are disposed on the second hard board. The magnetic element comprises a base and a plurality of magnets. The base comprises a main board and side boards. The side boards are arranged around the periphery of the main board so as to form the accommodating space. The magnets are disposed on the side of the main board facing the accommodating space, and the magnets are arranged opposite to the coils. In addition, the present application also provides a fabrication method for the anti-shake assembly and a camera module.

Classes IPC  ?

• H04N 5/225 - Caméras de télévision

Abrégé

A multi-layer circuit board with embedded components (100) in multiple layers and miniaturized form, with embedded electronic elements in a higher element density and shorter voltage paths includes a circuit board (10) provided with a mounting groove (101), and a plurality of elements (20). The elements (20) are arranged in the mounting groove (101), and the circuit board (10) includes several vertically-stacked circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), The multi-layer circuit board with embedded components circuit board (100) includes a conductive member (30) arranged in the mounting groove (101) and electrically connecting the elements (20) and the layers of conductive circuits.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A pressure-sensitive circuit board (100), comprising a dielectric layer (12), a circuit layer (145), a strain layer (30) and a protective layer (40), wherein the circuit layer (145) is located on a surface of the dielectric layer (12); the strain layer (30) is located on the surface of the dielectric layer (12) that is on the same side as the circuit layer (145); and the protective layer (40) is located on surfaces of the circuit layer (145) and the strain layer (30). The pressure-sensitive circuit board (100) comprises a first copper area (I), a second copper area (II) and a copper-free area (III), which are connected in sequence, wherein the circuit layer (145) is located in the first copper area (I) and the second copper area (II); in the direction in which the circuit layer (145) is stacked on the dielectric layer (12), the circuit layer (145) located in the first copper area (I) is thicker than that located in the second copper area (II), and the circuit layer (145) located in the second copper area (II) is in the shape of a grid; the strain layer (30) is located in the copper-free area (III) and is connected to the circuit layer (145); and the protective layer (40) is located on a surface of the circuit layer (145) located in the second copper area (II) and covers the strain layer (30). The present application further provides a manufacturing method for the pressure-sensitive circuit board (100).

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• G01L 9/06 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent en faisant usage des variations de la résistance ohmique, p.ex. de potentiomètre de dispositifs piézo-résistants

Abrégé

The present application provides a pressure-sensitive circuit board, comprising a circuit substrate, a plurality of conductive bumps and a strain body. The circuit substrate comprises a dielectric layer and a conductive line that is disposed on the dielectric layer; the plurality of conductive bumps are arranged at intervals on the conductive line, and an accommodating space is provided between every two adjacent conductive bumps; the strain body is disposed on the plurality of conductive bumps and covers the accommodating spaces; the strain body is used for generating deformation under the action of an external force; and the accommodating spaces are used for accommodating at least part of the deformed strain body. In addition, the present application further provides a fabrication method for a pressure-sensitive circuit board. Furthermore, the present application also provides a pressure sensor.

Classes IPC  ?

• G01L 1/18 - Mesure des forces ou des contraintes, en général en utilisant des propriétés des matériaux piézo-résistants, c. à d. des matériaux dont la résistance ohmique varie suivant les modifications de la grandeur ou de la direction de la force appliquée au matériau

Abrégé

A circuit board assembly (100), comprising an inner layer circuit substrate (10), a first outer layer circuit substrate (30), a second outer layer circuit substrate (40), a thermal conduction block (20), an electronic component (70), and a reinforcing plate (90); the first outer layer circuit substrate (30) is positioned on a surface of the inner layer circuit substrate (10); the second outer layer circuit substrate (40) is positioned on a surface of the inner layer circuit substrate (10) facing away from the first outer layer circuit substrate (30); the thermal conduction block (20) penetrates through the inner layer circuit substrate (10) and is connected to the first outer layer circuit substrate (30) and the second outer layer circuit substrate (40), the thermal conduction block (20) comprises an accommodating groove (60) with an opening facing the first outer layer circuit substrate (30), and the material of the thermal conduction block (20) is aluminium nitride; at least part of the electronic component (70) is accommodated in the accommodating groove (60) and is electrically connected to the first outer layer circuit substrate (30); and the reinforcing plate (90) is positioned on a surface of the second outer layer circuit substrate (40) corresponding to the electronic component (70) and facing away from the electronic component (70). Also provided in the present application is a manufacturing method for the circuit board assembly (100).

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A battery assembly (100), comprising a circuit board (10) and a cell (70). The circuit board (10) comprises a first dielectric layer (22), a second dielectric layer (32), a film (40), a busbar (242), a first heat dissipation copper block (245), a fuse (342), and a second heat dissipation copper block (345). The film (40) is located between the first dielectric layer (22) and the second dielectric layer (32) and has a plurality of spaced cavities (45a). The first heat dissipation copper block (245) and the busbar (242) are located on the surface of the first dielectric layer (22). The second heat dissipation copper block (345) and the fuse (342) are located on the surface of the second dielectric layer (32). The circuit board (10) comprises successive heat dissipation regions (I) and bending regions (II). The heat dissipation regions (I) and the bending regions (II) define an accommodation slot (60). The busbar (242), the first heat dissipation copper block (245), the fuse (342), and the second heat dissipation copper block (345) are all located in the heat dissipation regions (I). The busbar (242) and the first heat dissipation copper block (245) are arranged facing the accommodation slot (60). The cell (70) is located in the accommodation slot (60) and is electrically connected to the circuit board (10) by means of the busbar (242). The present application further provides a battery module (200) and a method for manufacturing the battery assembly (100).

Classes IPC  ?

• H01M 10/60 - Chauffage ou refroidissement; Commande de la température
• H01M 10/613 - Refroidissement ou maintien du froid
• H01M 50/284 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports comprenant l’insertion de cartes de circuits, p.ex. de cartes de circuits imprimés

Abrégé

Disclosed in the present application is a circuit board assembly. The circuit board assembly comprises a first circuit board, and a second circuit board arranged on the first circuit board. The first circuit board comprises a first insulating layer, and a first conductive circuit layer arranged on the first insulating layer; the first conductive circuit layer comprises a first contact pad; the position where the first contact pad is located on the first circuit board is provided with a stamping protrusion facing the second circuit board; the second circuit board is arranged on the first circuit board, and comprises a second insulating layer and a second conductive circuit layer arranged on the second insulating layer; the second conductive circuit layer comprises a second contact pad; and the second contact pad comes into contact with the first contact pad located on the stamping protrusion. Further disclosed in the present application is a manufacturing method for the circuit board.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

Provided in the present application is a circuit board, comprising a circuit substrate, magnetizers, a plurality of first conductive lines and a plurality of second conductive lines, wherein the circuit substrate comprises a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are respectively disposed on the upper and lower sides of each magnetizer; and the plurality of first conductive lines and the plurality of second conductive lines are respectively disposed on the left and right sides of each magnetizer. The plurality of first conductive lines, a plurality of first circuits, the plurality of second conductive lines and a plurality of second circuits, which are adjacent to each magnetizer, are spirally and progressively connected in sequence to form an induction coil. At least two magnetizers and at least two induction coils wound around outer sides of the magnetizers form a transformer. According to the circuit board provided by the present application, the transformer is provided inside the circuit board, such that the space of the circuit board itself is fully utilized, and the risk of damage caused by exposure of the transformer is reduced. In addition, further provided in the present application is a manufacturing method for a circuit board.

Classes IPC  ?

• H01F 27/28 - Bobines; Enroulements; Connexions conductrices

Abrégé

A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

Classes IPC  ?

• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/42 - Trous de passage métallisés

Abrégé

A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 1/02 - Circuits imprimés - Détails
• B82Y 40/00 - Fabrication ou traitement des nanostructures

Abrégé

A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/34 - Connexions soudées
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

Classes IPC  ?

• G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
• G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
• H01L 23/498 - Connexions électriques sur des substrats isolants
• G02B 6/10 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/05 - Substrat en métal isolé
• H05K 3/34 - Connexions soudées

Abrégé

The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H01R 12/58 - Connexions fixes pour circuits imprimés rigides ou structures similaires caractérisées par les bornes bornes pour insertion dans des trous
• H05K 3/42 - Trous de passage métallisés

Abrégé

An interposer, which is used to connect two circuit boards, includes an inner structure (10), an outer structure (20), and a protective layer (50). The inner structure (10) includes a first base layer (11) and a first wiring layer (131) formed on the first base layer (11). The outer structure (20) includes a second base layer (21) and a second wiring layer (231) formed on the second base layer (21). An end portion of at least wiring line of the first wiring layer (131) and the second wiring layer (231) extends to a sidewall of the interposer (100). An end of another wiring line extends to the other sidewall of the interposer (100). The first wiring layer (131) is electrically connected to the second wiring layer (231) by a conductive blind hole (41).

Classes IPC  ?

• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/42 - Trous de passage métallisés

Abrégé

A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing the intermediate body (70).

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.

Classes IPC  ?

• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
• B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
• H05K 1/02 - Circuits imprimés - Détails
• C09J 9/02 - Adhésifs conducteurs de l'électricité
• C09J 163/00 - Adhésifs à base de résines époxy; Adhésifs à base de dérivés des résines époxy
• B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives

Abrégé

A system for effectively curing dry film ink throughout its thickness on circuit boards being made applies an exposure system, a circuit board, and a method for making the circuit board. The exposure system includes a plurality of mixed light sources with different wavelengths within a range of 365 nm to 440 nm, the mixed light sources can output at least three different wavelengths of light each of substantially a single wavelength and a fourth source of light able to output light of a spectrum of wavelengths, the ranges of light being between 365 nm and 440 nm.

Classes IPC  ?

• H05K 3/34 - Connexions soudées
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• G02F 1/13357 - Dispositifs d'éclairage

Abrégé

A virtual reality glove includes a gloved shaped substrate including a palm area and a finger area connected with the palm area, a plurality of conductive circuits disposed on the glove shaped substrate, a plurality of tactile feedback units disposed on and electrically connected with the plurality of conductive circuits respectively, and a data processing unit installed on an end of the palm area away from the finger area and electrically connected with the plurality of conductive circuits. The glove shaped substrate is flexible, and the conductive circuits are curved. A method for manufacturing the virtual reality glove is also disclosed.

Classes IPC  ?

• G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur

Abrégé

A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires

Abrégé

A packaging structure, includes: a dielectric layer; at least one inner wiring layer embedded in the dielectric layer; at least two outer wiring layers arranged two sides of the at least one inner wiring layer and combined with the dielectric layer; and at least one electronic component embedded in the dielectric layer; each inner wiring layer including at least two spaced supporting pads, and each supporting pad including a main body and a protruding portion extending outward from a periphery of the main body, the packaging structure further including at least two spaced positioning pillars, and each positioning pillar correspondingly connected to one main body, each electronic component arranged between at least two positioning pillars, and an end of each electronic component being in contact with protruding portions of at least two supporting pads, thereby packaging the electronic component accurately.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• G02B 6/36 - Moyens de couplage mécaniques
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/34 - Connexions soudées
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal

Abrégé

A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.

Classes IPC  ?

• H01L 23/552 - Protection contre les radiations, p.ex. la lumière
• H01L 23/66 - Adaptations pour la haute fréquence
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes

Abrégé

A circuit board includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and a plurality of spaced conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and at least two spaced second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. At least one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.

Classes IPC  ?

• H04N 23/55 - Pièces optiques spécialement adaptées aux capteurs d'images électroniques; Leur montage
• H04N 23/54 - Montage de tubes analyseurs, de capteurs d'images électroniques, de bobines de déviation ou de focalisation

Abrégé

A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (20), a second circuit board (40), at least one third circuit board (50), a fourth circuit board (60), a fifth circuit board (61), and a sixth circuit board (62); stacking the first circuit board (20), the second circuit board (40), and third circuit board (50) in that order, and stacking the fourth circuit board (60), the sixth circuit board (62), and the fifth circuit board (61) on the third circuit board (50), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A rigid-flexible circuit board which can be simply and easily manufactured includes a wiring substrate, two adhesive layers, and two outer conductive wiring layers. The wiring substrate defines an opening penetrating and splitting the wiring substrate. The two outer conductive wiring layers are stacked on opposite surfaces of the wiring substrate. Each of the two adhesive layers is bonded between one of the two outer conductive wiring layers and the wiring substrate and infills the opening. A simplified method for manufacturing the rigid-flexible circuit board is also disclosed.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A clothing-type fabric capable of heating itself and cooling itself for the bodily comfort of a wearer includes a fabric body, at least two first electrodes, a second electrode, and a processor. The fabric body includes an inner surface and an outer surface opposite to the inner surface. The at least two first electrodes are disposed above the inner surface and the outer surface. The first electrode disposed above the inner surface can sense a body temperature of a wearer (first temperature value). The first electrode disposed above the outer surface can sense temperature of ambient environment (second temperature value). The second electrode is disposed above the inner surface, and can release heat and absorb heat. The processor can receive the first and the second temperature values, and control the second electrode to release or absorb heat by reference to the first temperature value and the second temperature value.

Classes IPC  ?

• A41D 13/005 - Vêtements protecteurs de travail ou de sport, p.ex. blouses de chirurgien ou vêtements protégeant des coups ou des chocs avec des conditions d'environnement interne qui sont commandées avec une température commandée
• A41D 1/00 - Vêtements

Abrégé

A method for manufacturing a circuit board is disclosed. An inner laminated structure with a conductive wiring layer and an outermost cover layer is provided. The conductive wiring layer includes a connection pad. A mask is disposed on a side of the cover layer away from the conductive wiring layer, and the mask defines a plurality of first openings penetrating the mask. A second opening is formed on the cover layer by laser etching through the mask to expose the connection pad. A surface treatment is applied to the connection pad and an electronic component is electrically connected with the connection pad. A circuit board is also disclosed.

Classes IPC  ?

• H05K 3/34 - Connexions soudées
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/42 - Trous de passage métallisés
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.

Classes IPC  ?

• H04N 5/54 - Réglage automatique du gain pour des signaux d'image à modulation positive
• H04N 5/225 - Caméras de télévision
• H04N 23/54 - Montage de tubes analyseurs, de capteurs d'images électroniques, de bobines de déviation ou de focalisation
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H04N 23/55 - Pièces optiques spécialement adaptées aux capteurs d'images électroniques; Leur montage

Abrégé

A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/28 - Application de revêtements de protection non métalliques

Abrégé

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

Classes IPC  ?

• H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/34 - Connexions soudées
• G02B 6/36 - Moyens de couplage mécaniques

Abrégé

A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H01L 23/06 - Conteneurs; Scellements caractérisés par le matériau du conteneur ou par ses propriétés électriques
• H01F 27/22 - Refroidissement par conduction de chaleur à travers des éléments de remplissage solides ou en poudre
• H01F 27/29 - Bornes; Aménagements de prises
• H01F 27/32 - Isolation des bobines, des enroulements, ou de leurs éléments
• H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur

Abrégé

A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/22 - Traitement secondaire des circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

Abrégé

A method for manufacturing a board-to-board connecting structure, including providing a first circuit board, including a first dielectric layer, a second dielectric layer stacked on the first dielectric layer, and a first wiring layer sandwiched between the first dielectric layer and the second dielectric layer. A second circuit board is provided, including a third dielectric layer, a fourth dielectric layers stacked on the third dielectric layer, and a second wiring layer sandwiched between the third dielectric layer and the fourth dielectric layer. The first step and the fourth dielectric layer are bonded through a first adhesive layer. The third step and the dielectric layer are bonded through a second adhesive layer. The second step and the fourth step are bonded through the conductive layer.

Classes IPC  ?

• H01R 13/40 - Fixation des pièces de contact dans ou sur un socle ou un boîtier; Isolement des pièces de contact
• H01R 12/58 - Connexions fixes pour circuits imprimés rigides ou structures similaires caractérisées par les bornes bornes pour insertion dans des trous
• H01R 12/52 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à d'autres circuits imprimés rigides ou à des structures similaires
• H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance

Abrégé

A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A circuit board includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and a plurality of spaced conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and at least two spaced second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. At least one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.

Classes IPC  ?

• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
• H05K 1/02 - Circuits imprimés - Détails

Abrégé

A stretchable sensing structure includes a stretchable sensing array, signal transmission lines, and a signal processing element. The stretchable sensing array includes at least two first sensing electrodes arranged in an array. The first sensing electrodes sense different physiological signals. Each first sensing electrode includes a first stretchable substrate layer, a pre-stretched pattern layer formed on the first stretchable substrate layer, and an electrode sheet formed on the first stretchable substrate layer and in electrical contact with the pre-stretched pattern layer. A material of the electrode sheet is carbon paste. The first sensing electrode senses different physiological signals. Two adjacent first sensing electrodes are electrically connected through the signal transmission line. The first sensing electrode is electrically connected to the signal processing element through the signal transmission line.

Classes IPC  ?

• H05K 1/14 - Association structurale de plusieurs circuits imprimés
• D03D 1/00 - Tissus conçus pour faire des articles particuliers
• D03D 15/56 - Tissus caractérisés par la matière, la structure ou les propriétés des fibres, des filaments, des filés, des fils ou des autres éléments utilisés en chaîne ou en trame caractérisés par les propriétés des filés ou des fils élastiques
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• G01L 1/20 - Mesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c. à d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte

Abrégé

A circuit board with inbuilt heat dissipating structure includes a stacked structure and the heat dissipation structure. The stacked structure includes first and second copper layers and a cover plate. The embedded heat dissipation structure includes a base body, a thermally conductive adhesive, and a phase changing liquid. The base body penetrates the first copper layer and the first substrate layer, is connected to the second copper layer, and defines grooves. The grooves contain the phase changing liquid. The thermally conductive adhesive seals the ends of the grooves and the cover plate is located on a surface of the stacked structure and covers the thermally conductive adhesive. A method for manufacturing the circuit board is further disclosed.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p.ex. tubes caloporteurs

Abrégé

A method for manufacturing such multilayer printed circuit board includes providing a metal laminated structure including a first type metal layer and a second type metal layer, pressing a patterned dry film layer and a protective film layer on two surfaces of the metal laminated structure, the dry film layer exposing the second type metal layer; etching the second type metal layer to form a first conductive circuit layer; etching a first type metal layer to form a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer defining an inner circuit laminated structure; removing the dry film layer; and forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner laminated structure.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

Classes IPC  ?

• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
• H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
• H01L 23/13 - Supports, p.ex. substrats isolants non amovibles caractérisés par leur forme
• H01L 23/60 - Protection contre les charges ou les décharges électrostatiques, p.ex. écrans Faraday
• H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes formées de structures soudées
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.

Classes IPC  ?

• H01L 23/552 - Protection contre les radiations, p.ex. la lumière
• H01L 23/66 - Adaptations pour la haute fréquence
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes

Abrégé

A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/04 - Elimination du matériau conducteur par voie mécanique, p.ex. par poinçonnage
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché

Abrégé

A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.

Classes IPC  ?

• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires

Abrégé

A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.

Classes IPC  ?

• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés

Abrégé

A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.

Classes IPC  ?

• H01Q 1/38 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
• H01Q 1/22 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets

Abrégé

A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H01L 23/13 - Supports, p.ex. substrats isolants non amovibles caractérisés par leur forme
• H05K 1/02 - Circuits imprimés - Détails
• H05K 3/46 - Fabrication de circuits multi-couches

Abrégé

A board-to-board connection structure includes a first circuit board, a second circuit board, and a connector. The first circuit board includes a first base layer and a first outer circuit layer. The second circuit board includes a second base layer and a second outer circuit layer. The connector electrically couples the first circuit board and the second circuit board. The connector includes a housing, a first electrical connection portion, and a second electrical connection portion. A side surface of the first circuit board includes a first conductive layer electrically coupled to the first outer circuit layer. The connector is coupled to the first conductive layer through the first electrical connection portion. The second circuit board is located in the housing, and the second electrical connection portion is electrically coupled to the second outer circuit layer.

Classes IPC  ?

• H01R 12/72 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires se couplant avec la bordure des circuits imprimés rigides ou des structures similaires
• H01R 43/26 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour engager ou séparer les deux pièces d'un dispositif de couplage
• H01R 43/20 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour assembler les pièces de contact avec le socle isolant, le boîtier ou le manchon ou pour les en désassembler

Abrégé

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

Classes IPC  ?

• H05K 1/00 - Circuits imprimés
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
• H05K 3/28 - Application de revêtements de protection non métalliques
• H05K 3/42 - Trous de passage métallisés
• H05K 3/46 - Fabrication de circuits multi-couches
• G03F 7/20 - Exposition; Appareillages à cet effet
• G03F 7/32 - Compositions liquides à cet effet, p.ex. développateurs
• H05K 3/24 - Renforcement du parcours conducteur
• H05K 3/06 - Elimination du matériau conducteur par voie chimique ou électrolytique, p.ex. par le procédé de photo-décapage
• H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A package circuit structure includes a metal board including a first surface and a second surface, a plurality of embedded components, an insulating layer, and two antenna circuit boards. At least one first groove is recessed from the first surface. At least one second groove is recessed from the second surface. The first groove and the second groove are spaced with each other along a first direction perpendicular to a thickness direction of the metal board. Each embedded component is mounted in the first groove or the second groove. The insulating layer covers the first surface and the second surface and fills the first groove and the second groove. The antenna circuit boards are respectively stacked on two opposite sides of the insulating layer. Each antenna circuit board includes at least one antenna and at least one ground wiring. The metal board is electrically connected to each ground wiring.

Classes IPC  ?

• H01L 23/66 - Adaptations pour la haute fréquence
• H01L 23/552 - Protection contre les radiations, p.ex. la lumière
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
• H01Q 1/22 - Supports; Moyens de montage par association structurale avec d'autres équipements ou objets

Abrégé

A circuit board includes a multilayer wiring board including a first wiring board and a second wiring board. A receiving cavity penetrates the second wiring board and corresponds to at least one connecting pad of the first wiring board. The receiving cavity includes a receiving portion penetrating the second wiring board and a plurality of recessed portions. Each recessed portion penetrates the second wiring board and is recessed from an inner wall defining the receiving portion. A width of each recessed portion gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board. An electronic component is received in the receiving cavity and electrically connected to the at least one connecting pad. An adhesive fills in a gap between the electronic component and the second wiring board.

Classes IPC  ?

• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p.ex. une résistance, un condensateur, une inductance imprimés
• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
• H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance