This charging/discharging test system comprises: a bidirectional AC/DC converter (12) connected to an alternating current power source (AC power source (9)); an isolated bidirectional DC/DC converter (22) connected to a first direct current bus (14) at one end and connected to a second direct current bus (24) at the other end; a plurality of non-isolated bidirectional DC/DC converters (26) each connected to the second direct current bus (24) at one end and connected to a charging/discharging body (battery (6)) at the other end, the charging/discharging bodies being different from each other; and a charging/discharging control unit (ET control unit (28)). Power output by the charging/discharging control unit from at least one of the charging/discharging bodies via the non-isolated bidirectional DC/DC converter (26) is charged to at least one of the charging/discharging bodies via the second direct current bus (24) and at least one of the non-isolated bidirectional DC/DC converters (26).
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
H02M 3/155 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 3/28 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire
The present invention is provided with: a plurality of charge/discharge test devices (12) for performing charge/discharge with respect to charge/discharge targets (9); a switching circuit (14) capable of switching a combination for electrically connecting the one or more charge/discharge test devices (12) to the one or more charge/discharge targets (9); and a control unit (16) which controls the switching circuit (14) to perform switching of the combination.
G01R 31/385 - Dispositions pour mesurer des variables des batteries ou des accumulateurs
G01R 31/00 - Dispositions pour tester les propriétés électriques; Dispositions pour la localisation des pannes électriques; Dispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
G01R 31/382 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p.ex. état de charge
3.
RETRACTION MECHANISM AND DIMENSION-MEASURING DEVICE PROVIDED WITH SAME
Provided is a pneumatic-cylinder-type retraction mechanism having a cylinder and a piston that is capable of reciprocating inside the cylinder, the retraction mechanism causing the piston to reciprocate using air pressure, wherein the retraction mechanism is characterized in that a sealing means, which prevents pressurized air that operates the piston from leaking from within the cylinder, is provided to the inner periphery of the cylinder facing the outer periphery of the piston to form a stationary sealing means. The retraction mechanism can exhibit at least one effect among reducing starting resistance, improving measurement accuracy of a measuring device, and shortening measurement time.
F15B 15/14 - Dispositifs actionnés par fluides pour déplacer un organe d'une position à une autre; Transmission associée à ces dispositifs caractérisés par la structure de l'ensemble moteur le moteur étant du type à cylindre droit
G01B 13/00 - Dispositions pour la mesure caractérisées par l'utilisation de fluides
G01B 13/08 - Dispositions pour la mesure caractérisées par l'utilisation de fluides pour mesurer des diamètres
4.
METHOD FOR DETECTING ATTACHED STATE OF TOOL HOLDER, DEVICE FOR DETECTING ATTACHED STATE OF TOOL HOLDER, DISPLACEMENT DETECTION METHOD, DISPLACEMENT DETECTION DEVICE, AND MACHINE TOOL
According to a method of the present invention for detecting an attached state of a tool holder, during setup, a tool holder 11 is attached to a spindle 26 in a state without chuck errors, counting of cutouts 11C formed in a flange 11B is started after starting rotation of a tool 9, and a time T taken to obtain measurement data from the last detected cutout 11C and a count N until that time are stored, and, during machining, the measurement data is obtained by matching the count N with the time T by the same procedure as in setup. Therefore, regardless of sensor types, the number of cutouts, shape precision, environment, etc., this method easily and highly accurately matches the phases of measurement data during setup and machining, and improves the accuracy of detecting chuck errors.
Provided are: a laser optical system in which laser light can be adjusted so as to satisfy criteria for laser machining; an adjustment method for the laser optical system; and a laser machining device and method. Provided is a laser optical system (14) comprising a plurality of optical element units (U1–U3) arranged in series on an optical path of laser light. Each optical element unit includes a half-wave plate (WB1–WB3) and a Wollaston prism (WP1–WP3). Also provided is an adjustment method for a laser optical system in which laser light enters a Wollaston prism via a half-wave plate to branch into two branched laser light beams. Said method includes: a step in which the half-wave plate is rotated around an optical path to adjust the branching ratio of the branched laser light beams; and a step in which the Wollaston prism is rotated around the optical path to adjust the branching directions of the branched laser light beams.
B23K 26/067 - Division du faisceau en faisceaux multiples, p.ex. foyers multiples
B23K 26/00 - Travail par rayon laser, p.ex. soudage, découpage ou perçage
B23K 26/062 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser
B23K 26/064 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p.ex lentilles, miroirs ou prismes
Provided is a dicing device that can perform a maintenance task well even when a workpiece is large. This dicing device (10) comprises a housing (52) which accommodates in the interior thereof a work table (12) that holds and moves a workpiece (W) and a spindle (18) that can rotate while holding a blade (14), wherein: the housing (52) has an end surface, which is provided in the movement direction of the work table (12) and which serves as the side of the dicing device (10) that performs the maintenance task, and comprises a slider (54) which constitutes part of the end surface; and the slider (54) is configured to be freely slidable in the direction in which the distance from the end surface to the spindle (18) lessens.
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 55/06 - Equipement d'enlèvement des poussières sur les machines à meuler ou à polir
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
7.
METHOD AND DEVICE FOR ADJUSTING OPTICAL AXIS OF LASER LIGHT
Provided are a method and a device which are for adjusting the optical axis of laser light and are capable of accurately grasping a change in the state of the laser light to maintain the quality of laser processing. This method for adjusting the optical axis of laser light involves: detecting the position of the laser light by means of a position detection sensor disposed at at least two places in the optical path of the laser light output from a laser light source toward a workpiece; and adjusting at least one of the positions or angles of optical elements at at least two places in the optical path of the laser light on the basis of the detected position of the laser light, thereby performing the adjustment of the optical axis of the laser light.
Provided is a laser light correction method capable of accurately performing correction of the positions of a split laser and a line laser. The laser light correction method comprises: a step for performing an edge-cutting process in which, while a laser optical system (14) is moved in a processing feed direction relative to a position-alignment workpiece (W2) of which at least a laser irradiation surface comprises a material that facilitates detection of a laser irradiation mark, a split laser is focused on the laser irradiation surface via the laser optical system to form two parallel lines of first grooves along the processing feed direction, and performing a hollowing-out process for forming a second groove by focusing a line laser on the laser irradiation surface via the laser optical system; a step for detecting the first grooves and the second groove by means of a microscope (20); and a step for correcting the focused positions of the split laser and the line laser on the basis of the result of detection of the first grooves and the second groove.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23K 26/03 - Observation, p.ex. surveillance de la pièce à travailler
B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p.ex. en utilisant la lumière rétrodiffusée
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
Provided is an expanded retaining ring capable of achieving both the retainment of the annular shape of a ring body and the flexibility of a ring-like lip. This expanded retaining ring comprises: a ring body (12); and a ring-like lip (14) which is formed by a softer material than the ring body (12), is capable of being freely detachably mounted on an outer circumferential surface (12A) of the ring body (12), and protrudes toward the outside from the outer circumferential surface (12A) of the ring body (12).
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
10.
SURFACE SHAPE MEASUREMENT DEVICE AND SURFACE SHAPE MEASUREMENT METHOD
The present invention provides a surface shape measurement device and a surface shape measurement method which make it possible to reduce errors caused by the effects of vibrations that occur during measurement. This surface shape measurement device for measuring the surface shape of an object to be measured comprises: a first imaging system that captures images of the object to be measured at prescribed imaging intervals while scanning relative to a perpendicular direction with respect to the object to be measured; a second imaging system that is separate from the first imaging system and that images, in synchronization with the first imaging system, the object to be measured or an object supporting the object to be measured; a computation unit that calculates the surface shape of the object to be measured on the basis of a plurality of first captured images captured by the first imaging system; a storage unit that stores coordinate system conversion information for converting a second coordinate system of the second imaging system to a first coordinate system of the first imaging system; a displacement detection unit that, on the basis of a plurality of second captured images captured by the second imaging system, detects displacement of the object to be measured during imaging by the first imaging system; and a correction unit that, on the basis of the coordinate system conversion information and the displacement detection result by the displacement detection unit, corrects the surface shape calculated by the computation unit.
Provided are a three-dimensional shape measuring device and a three-dimensional shape measuring method capable of reducing time and effort for an examiner and capable of easily improving measuring accuracy of a three-dimensional shape of a surface being measured. The three-dimensional shape measuring device comprises: an interference objective lens including an interference unit which splits a portion of measurement light emitted by a light source unit from the measurement light as reference light, and generates a combined light beam of the measurement light returning from the surface being measured and the reference light returning from a reference surface, and an objective lens which condenses the measurement light onto the surface being measured; a scanning unit which causes the interference objective lens to scan relatively in a scanning direction parallel to an optical axis of the objective lens, relative to the surface being measured; an imaging unit which repeatedly images the combined light generated by the interference unit, during the scanning by the scanning unit, and outputs a plurality of captured images containing interference fringes; and a first signal processing unit which calculates a degree of focus of each pixel in the plurality of captured images output from the imaging unit, and calculates a three-dimensional shape of the surface being measured on the basis of a result obtained by comparing the degree of focus of each pixel having the same coordinates in the plurality of captured images.
[Solution] According to the present invention, a shape measurement device, for acquiring a plurality of surface images while scanning a surface of a measurement object 1 that is plate-like, and measuring a shape of the measurement object 1, includes an image-capturing system 10 that irradiates the measurement object 1 by parallel light and acquires surface images, a stage system 30 that holds the measurement object 1 and adjusts an orientation of the measurement object 1 as to the image-capturing system 10, and a control device 20. The control device 20 includes an orientation adjusting unit 21 that controls the image-capturing system 10 and the stage system 30 so as to scan the surface while adjusting the orientation, and acquire the plurality of surface images, and an image processing unit 22 that generates a three-dimensional shape restoration model of the measurement object 1 from the plurality of surface images that are acquired. When acquiring the surface images, the orientation adjusting unit 21 adjusts the orientation such that an incident angle of the parallel light to the surface is within a range that is set in advance. According to this shape measurement device, shape measurement of measurement objects that are plate-like, and in particular even notch portions of wafers that have complicated shapes, can be performed with higher precision.
Provided are a shape measuring device and a shape measuring method capable of reducing errors in a measured shape of a surface to be measured. The shape measuring device comprises: a relative movement unit (14) for scanning measurement light (LA) over a surface to be measured (W), by causing a probe (24) to move relatively along the surface to be measured (W); a detecting unit (light detector (28)) for repeatedly detecting combined light (LC) generated by a light combining unit (beam splitter (22)), for each of a plurality of measurement points (Pm) on the surface to be measured (W) on which the measurement light (LA) is incident, during the relative movement; a distance calculating unit (32) for detecting a beat frequency from a detection signal (29) of the combined light (LC) detected by the detecting unit for each measurement point (Pm), and calculating a distance from the probe (24) to the measurement point (Pm) on the basis of the beat frequency; a position calculating unit (34) for calculating a position of each measurement point (Pm); and a position adjusting unit (38) for adjusting the position of the measurement point (Pm) on the basis of a Doppler shift amount (fd) of the measurement light (LA) reflected by the measurement point (Pm), for each measurement point (Pm).
A first objective of the present invention is to provide a three-dimensional shape measuring device and a three-dimensional shape measuring device reference surface position adjustment method with which a measurement optical path length and a reference optical path length are matched with a high degree of accuracy at low cost, regardless of an installation environment temperature, and a second objective is to provide a three-dimensional shape measuring device and a three-dimensional shape measuring device measurement mode switching method capable of switching between three-dimensional shape measurement of a surface to be measured by means of white light interferometry (WFI) and three-dimensional shape measurement of the surface to be measured by means of focus variation (FV). In order to achieve the first objective, a three-dimensional shape measuring device is provided with a holder (24) for changing a reference optical path length in accordance with a change in temperature, and a temperature adjusting unit (26) for adjusting a temperature of the holder (24) to a target temperature. In order to achieve the second objective, the three-dimensional shape measuring device is provided with the temperature adjusting unit (26) for adjusting the temperature of the holder (24), and a temperature control unit (100) which controls the temperature adjusting unit (26), and which is capable of switching selectively between a first measurement mode in which the reference optical path length is matched to the measurement optical path length, and a second measurement mode in which the reference optical path length is made to differ from the measurement optical path length.
Provided is a shape measuring device adjustment method with which it is possible for adjustments to a white-light interference microscope to be carried out easily. This adjustment method for a shape measuring device which emits light from a light source as measurement light and reference light onto an adjustment master and a reference surface respectively, and measures the shape of a surface to be measured of an object being measured, using combined light of the measurement light and the reference light reflected respectively by the adjustment master and the reference surface, includes: a step for measuring the adjustment master in an adjusted state in which a focus position and an interference position match, and calculating and saving a matching degree parameter indicating a degree of matching between the focus position and the interference position as a matching degree parameter when adjusted; and, when measuring the object being measured, a step for measuring the adjustment master, calculating the matching degree parameter, and comparing the matching degree parameter and the matching degree parameter when adjusted, to check the degree of matching.
Provided is a surface shape measurement device and a surface shape measurement method with which it is possible to minimize the effect due to vibration produced during measurement and increase the measurement accuracy. This surface shape measurement device for acquiring an observation image of an object to be measured while scanning an optical head vertically relative to the object to be measured comprises: a camera for imaging an observation image acquired by the optical head; a drive unit for scanning the optical head vertically relative to the object to be measured; an encoder for calculating the scan-direction position of the optical head relative to the object to be measured; an imaging command unit for commanding the camera to image an observation image on the basis of a position signal outputted at prescribed intervals from the encoder; a frame-drop occurrence rate calculation unit for calculating the frame-drop occurrence rate indicating the rate at which frame-drop occurs in the camera; and a measurement-condition-setting unit for setting, on the basis of the frame-drop occurrence rate, a measurement condition for measuring the surface shape of the object to be measured.
Provided is an auto balancer that is shorter in an axial direction of an axis of rotation than in the past. This auto balancer comprises a balance head which rotates integrally with a rotating body about an axis of rotation of the rotating body, and which includes an electric-powered balance correcting mechanism for correcting unbalance of the rotating body and a case that has a cylindrical outer circumferential surface parallel to the axis of rotation and that accommodates the balance correcting mechanism, a stator which is provided separately from the balance head, has a shape that follows a circumferential direction of the outer circumferential surface, spaced apart from the outer circumferential surface across a gap, and is electrically connected to a controller of the balance head, and a rotor unit which is provided in a position facing the stator on the outer circumferential surface, rotates integrally with the balance head, has a shape that follows the circumferential direction of the outer circumferential surface, and is electrically connected to the balance correcting mechanism, wherein wireless transmission is possible between the stator and a rotor.
Provided are a wafer test system, a method for replacing a probe card, and a prober that make it possible to automate the replacing of a probe card inexpensively while minimizing any increase in installation space. The invention comprises: a prober providing a chuck for holding a semiconductor wafer, and a probe card having a probe needle, the prober being configured to inspect a plurality of semiconductor chips formed on the semiconductor wafer by bringing the probe needle into contact with the semiconductor chips; an overhead traveling unmanned carrier configured to load a cassette accommodating a plurality of uninspected semiconductor wafers into the prober and to retrieve a cassette accommodating a plurality of inspected semiconductor wafers from the prober; a carrying control unit that controls the overhead traveling unmanned carrier to carry probe cards between a predetermined probe card replacement position in the prober and a probe card storage location in a separate location from the prober; and a card-carrying mechanism for carrying the probe card between a holding position and the replacement position in the prober.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
Provided is a cost- and space-saving chiller system that has high-withstand-voltage performance. A chiller system (1) is provided with an internal circulation pathway (C1), an external circulation pathway (C2), and a control device (40). Provided to the internal circulation pathway (C1) are a refrigerant tank (17), an internal circulation pump (11), and a refrigerator (12). The external circulation pathway (C2) has a feeding pathway (20) and a return pathway (25). An external circulation pump (21) and a temperature sensor (23) are provided to the feeding pathway (20). A throttling means (28) is provided to a communication pathway creating communication between the return pathway (25) and the refrigerant tank (17). An on-off control valve (16) is provided to the internal circulation pathway (C1), and a pressurization pathway (30) has one end connected further upstream than the on-off control valve (16) in the internal circulation pathway (C1) and another end connected further upstream than the throttling means (28) in the communication pathway. The control device (40) controls operation of the on-off control valve (16) on the basis of a measurement result of the temperature sensor (23).
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided are a housing for a prober and a prober to which the housing is applied, which can effectively reduce the influence of vibrations generated at each level without lowering inspection throughput. A housing (1) for a prober having a multilevel structure in which a plurality of measurement units (30) is stacked in multiple stages includes floor bases (10) that constitute a floor surface at each level of the multilevel structure, and side frame bodies (20) each being disposed between the floor base (10) at one level among the plurality of levels and the floor base (10) at another level positioned above the one level, and being positioned at both sides of the measurement unit (30), wherein the side frame body (20) has a first side frame (21) that is erected at the floor base (10) at the one level and supports the lower surface side of the floor base at the other level, and a second side frame (22) that is erected at the floor base (10) at the one level at a position different from that of the first side frame (21) and supports a measurement unit constituent member disposed in the measurement unit (30).
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
[Problem] To provide a workpiece processing apparatus in which a decline in the processing capability of the processing apparatus due to a peeling unit for peeling a protection sheet from a workpiece is suppressed. [Solution] A workpiece processing apparatus 1 comprises an affixing unit 2 for affixing a dicing tape DT to a workpiece W and to a dicing frame DF, and a plurality of peeling units 3 for peeling a protection sheet S previously affixed to the workpiece W that has been integrated with the dicing frame DF with the dicing tape DT therebetween.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
[Problem] To provide a sheet release apparatus for stably releasing a protective sheet from an adherend without damaging the adherend. [Solution] This sheet release apparatus 1 comprises a transport table 2 that holds a workpiece W and that can move in a prescribed movement direction, and a heat stamp 41 for bonding a release tape T to a protective sheet S, the heat stamp 41 being provided with a plurality of stamp heads 43, 44, 45 for respectively contacting the release tape T and pressing the release tape T toward the protective sheet S.
B65H 41/00 - Machines pour séparer des bandes superposées
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
23.
PROBER CONTROL DEVICE, PROBER CONTROL METHOD, AND PROBER
Provided are a prober control device, a prober control method, and a prober that enable more accurate prediction of the position of a probe needle tip. The prober control device for bringing a probe needle into contact with a semiconductor chip comprises: an input data acquisition unit that acquires input data including temperature data of a probe card and/or a card holder; a prediction unit that, on the basis of the input data acquired by the input data acquisition unit, predicts the position of a probe needle tip by using a prediction model that takes the input data as input and outputs the probe needle tip position; and a determination unit that, prior to the prediction by the prediction unit, determines whether the prediction unit is to execute prediction on the basis of input data used as training data in machine learning of the prediction model, and the input data acquired by the input data acquisition unit.
[Problem] To provide a workpiece holding device with which it is possible to precisely process a workpiece. [Solution] A holding unit 3 in a processing apparatus 1 is a workpiece holding device that rotatably holds a workpiece W being processed using a grindstone 21, the workpiece holding device comprising: a base 34; a chuck 33 composed of a material exhibiting a lower thermal expansion coefficient than the base 34, the chuck 33 being disposed on the base 34 and being capable of holding the workpiece W by chucking; and a clamp member 40 attached to the base 34 with gaps G1, G2 between the clamp member 40 and the chuck 33 in the diameter direction D of the base 34, the clamp member 40 pressing a flange 36a of the chuck 33 toward the base 34.
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
[Problem] To provide a processing apparatus that flattens a workpiece so as to have a desired thickness. [Solution] A processing apparatus 1 flattens a non-circular shape workpiece W with a grinding stone 21 and is provided with: a suction member 33 capable of suction-holding the workpiece W; and an attachment 37 that is provided on the outer peripheral side of the suction member 33, is formed from a material harder to grind than the suction member 33, and can be in contact with the grinding stone 21 during self-grinding for grinding the suction member 33.
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
26.
CLEANING DEVICE FOR WAFER-SUCTIONING CHUCK STRUCTURE
[Problem] To provide a cleaning device for a wafer-suctioning chuck structure, said device being able to automatically and simply perform a cleaning process on a chuck surface for suctioning and holding a wafer and a cleaning process on a frame suctioning and holding part. [Solution] A cleaning device is configured so as to comprise: a scraper 17 and flange 18 that press a frame suction holder cleaning means 10B for removing sludge on a frame suction holder 11B on the frame suction holder 11B; and a water nozzle 19 for discharging and supplying water on the frame suction holder 11B.
[Problem] To provide a cleaning device for a wafer back surface, said device preventing the re-adhesion of contaminants and the like to the rear surface of a wafer W during and after cleaning. [Solution] This cleaning device for a wafer back surface comprises: a hand H1 that receives a wafer W that has been cleaned at a cleaning position, and transports the wafer W to the next process; a hand H2 that transports the pre-polished wafer W to a cleaning position, and hands the cleaned wafer W over to the hand H1 with the front surface of the wafer at the top side; and a cleaning pad 13 that is positioned at the cleaning position, and a cleaning water supply nozzle 14 that supplies cleaning water to the cleaning pad 13 and discharges the cleaning water on the back surface of the wafer W. The hand H2 performs a scrub cleaning process on the wafer back surface by bringing the back surface of the wafer W, which has been transported to the cleaning position, into contact with the cleaning pad 13, and after being scrub cleaned, the wafer back surface receives discharged cleaning water from the cleaning water supply nozzle 14 to undergo a rinse cleaning process, and then the wafer W is handed over to the hand H1.
B08B 1/04 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues utilisant des éléments actifs rotatifs
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is a calibration method for an optical rotation probe, whereby the emission direction of measurement light emitted from the optical rotation probe can be calibrated with high accuracy. The calibration method comprises: a changing step in which the emission direction of the measurement light emitted from the optical rotation probe is changed by a minute angle Δs from a preset reference direction; an acquisition step in which, after the changing step is performed, a shape error of a reference object is acquired by emitting the measurement light from the optical rotation probe toward the reference object while changing the relative positions of the optical rotation probe and the reference object while rotating the emission direction of the measurement light about an S axis; and an adjustment error calculation step in which an adjustment error of the emission direction of the measurement light with respect to the reference direction is calculated on the basis of a theoretical value of the shape error of the reference object and the measurement value, obtained in the acquisition step, of the shape error of the reference object, wherein the theoretical value is obtained when the emission direction of the measurement light coincides with the reference direction.
[Problem] To provide a processing system that can process a workpiece with good precision. [Solution] A processing system 1 is configured so as to comprise: a tilting device that can tilt a rotational axis 3a of a chuck 3 retaining a workpiece W; a film thickness measurement device 7 that measures, in a contactless manner, the film thickness of the workpiece W after fine grinding; and a control device 8 that computes the shape of the post-fine grinding workpiece W on the basis of the measured value from the film thickness measurement device 7, calculates a tilt angle of the tilting device such that the difference between the maximum thickness and the minimum thickness in the post-fine grinding workpiece W will be reduced, and causes the chuck 3 to be tilted by said tilt angle, wherein the post-fine grinding workpiece W is reprocessed, in the order of rough grinding, intermediate grinding, and then fine grinding, while the chuck 3 is in the condition of being tilted by said tilt angle.
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
Provided are a particle measurement device, a three-dimensional shape measurement device, a prober device, a particle measurement system, and a particle measurement method with which it is possible to manage the particle generation amount. This particle measurement device comprises: an acquisition unit (252) for acquiring pad surface shape data indicating the surface shape of an electrode pad (P) including a probe needle mark resulting from a probe needle (141) contacting the electrode pad (P); a detection unit (253) for detecting a pad reference surface (R), which is a reference for particle measurement, on the basis of the pad surface shape data; a recess and projection calculation unit (254) for calculating, on the basis of the pad surface shape data, the volume (VMR) of recesses that are recessed from the pad reference surface (R) and the volume (VMP) of projections that project from the pad reference surface (R) in the surface shape of the electrode pad (P); and a particle generation amount calculation unit (255) for calculating a particle generation amount from a volume difference between the volume (VMR) of the recesses and the volume (VMP) of the projections.
[Problem] To provide a tape affixing apparatus and a tape magazine capable of automatically switching and replacing dicing tape. [Solution] A tape affixing apparatus 3 is equipped with: a base 31 where a tape magazine 4 for storing dicing tape DT in a state where part of the dicing tape DT wound in a roll shape is drawn out is installed in a replaceable manner; and movable guide rollers 32a, 32b, fixed guide rollers 33a, 33b and a knife plate 35 that can move so as to restrict a draw-out area R where part of the dicing tape DT is drawn out to a predetermined track.
B65H 19/12 - Levage, transport ou insertion de la bobine; Enlèvement du noyau vide
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
[Problem] To provide a tape adhesion system capable of automatically carrying out switching and replacing of a dicing tape. [Solution] A tape adhesion system 1 comprising: a stocker 5 that stores a plurality of tape magazines 4 which each accommodate a dicing tape DT wound into a roll; an adhesion device 3 that is provided with movable guide rollers 32a, 32b which restrict a reel-out region R of the dicing tape DT to a prescribed track, fixed guide rollers 33a, 33b, and a knife plate 35, and adheres the dicing tape DT to a dicing frame DF and a workpiece W in a manner that allows replacement of the tape magazines 4; and a first conveyance robot 6 that passes the tape magazines 4 back and forth between the stocker 5 and the adhesion device 3.
B65H 19/12 - Levage, transport ou insertion de la bobine; Enlèvement du noyau vide
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
[Problem] To provide a tape-affixing device that affixes dicing tape to a workpiece and a dicing frame with appropriate tensile force. [Solution] A tape-affixing device 1 affixes dicing tape DT to a workpiece W and a dicing frame DF along an affixing direction D1. The tape-affixing device 1 comprises: a pressing roller 34 that presses the dicing tape DT to the workpiece W and the dicing frame DF; and a support pin 4 that stretches the dicing tape DT in a width direction D2.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
34.
DEVICE AND METHOD FOR DETECTING TENSION ABNORMALITY IN DICING TAPE
[Problem] To provide a device and method for detecting tension abnormality in dicing tape in which it is possible to accurately detect any tension abnormality in dicing tape by quantitatively evaluating the suitability of dicing tape tension. [Solution] This device for detecting tension abnormality 4 comprises: an air micrometer 41 that, on the basis of the displacement of dicing tape DT when air is blown at a measurement point P of the dicing tape DT at which a workpiece W has not been affixed, measures the tension of the dicing tape DT at the measurement point P; and an evaluation unit (42) for evaluating that the tension of the dicing tape (DT) is appropriate when the tension of the dicing tape (DT) at the measurement point (P) is within a predetermined appropriate range for the tension of the dicing tape (DT), and evaluating that the tension of the dicing tape (DT) is abnormal when the tension of the dicing tape (DT) at the measurement point (P) is not within the appropriate range.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
35.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method which can both maintain the processing quality of a processed groove and prevent an increase in tact time. The present invention comprises: a branching element which branches second laser light into a plurality of branched light along a processing feed direction; and a second condenser lens which condenses the plurality of branched light branched by the branching element into a street to be processed, wherein, when defining a branching distance as L, which is the interval between a mutually adjacent preceding spot and following spot in spots for each branched light condensed onto the street by the second condenser lens, the processing speed as V, which is the speed of relative movement, and the time until the following spot overlaps a processing position of the preceding spot as τ, time is expressed by τ=L/V, and when the threshold value of a time at which a worsening of the processing quality of the second groove occurs is defined as τ1, τ>τ1 is satisfied.
B23K 26/067 - Division du faisceau en faisceaux multiples, p.ex. foyers multiples
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
[Problem] To provide a flycutting device for safely processing a workpiece having bumps formed on a surface thereof. [Solution] This flycutting device 1 cuts an upper surface 75c of a BG film 75 affixed to a workpiece 7 that includes a bump region 73 in which bumps 71 are formed on a surface 72 and an outer peripheral region 74 surrounding the bump region 73, wherein: the flycutting device 1 comprises a flycutting tool 21, a tool spindle 22 in which the flycutting tool 21 is attached to the lower end thereof and which can be raised and lowered in a state in which the flycutting tool 21 is rotated, and a chuck 3 that holds the workpiece 7 in a rotatable manner; and the flycutting tool 21 cuts the upper surface 75c of the BG film 75 from the center toward the outer periphery.
B23D 5/00 - Machines à raboter ou à mortaiser taillant autrement que par déplacement relatif de l'outil et de la pièce à usiner selon une ligne droite
B23Q 11/10 - Dispositions pour le refroidissement ou la lubrification des outils ou des pièces travaillées
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23Q 17/20 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer les caractéristiques de la pièce, p.ex. contour, dimensions, dureté
37.
LASER MACHINING DEVICE, WAFER PROCESSING SYSTEM, AND METHOD FOR CONTROLLING LASER MACHINING DEVICE
duringmachinedmachined groove; and a machined state assessment unit that assesses the machined state by referring to the correspondence information on the basis of the luminance and the known energy of the laser light, each time the luminance detection unit detects the luminance.
B23K 26/00 - Travail par rayon laser, p.ex. soudage, découpage ou perçage
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
[Problem] To provide a processing device and method for safely processing a wafer having bumps formed on a surface thereof. [Solution] A processing device 10 is provided with: a chuck 40 capable of holding a bump region 24 of a wafer 20; a support ring 30 having a support surface 32 for supporting a bend region 26 which extends from the bump region 24 to an outer peripheral region 25 and in which a film 20 is bent, the support ring 30 capable of supporting the outer peripheral region 25 of the wafer 20; and a chuck table 16 in which the chuck 40 is housed substantially centrally and the support ring 30 is housed around the chuck 40.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
39.
SHAPE MEASUREMENT DEVICE AND METHOD FOR CONTROLLING SAME
Provided are a shape measurement device which can easily detect the cause of occurrence of an abnormality in measuring the shape of a measurement target, and a method for controlling the same. The invention involves: a displacement detection device for detecting a displacement of a contactor; a relative movement mechanism for relatively moving the displacement detection device with respect to a measurement target to allow the contactor to trace a surface to be measured of the measurement target; a position detection sensor for detecting a relative position of the displacement detection device with respect to the measurement target; a camera for capturing an image of the contactor and outputting the image of the contactor; and a synchronization control unit for allowing three operations to synchronize with one another and to be repeatedly carried out while the relative movement by the relative movement mechanism is performed, the three operations comprising detecting the relative position by the position detection sensor, detecting the displacement by the displacement detection device, and capturing an image by the camera.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
G01B 21/30 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la rugosité ou l'irrégularité des surfaces
Provided is a measurement device capable of suppressing the influence of the ambient temperature on measurement results. This measurement device (10, 10-1, 10-2) comprises a probe part (14) that is provided with a probe (12) for measuring the surface of an object under measurement and is attached so as to be capable of oscillating around an oscillation center according to the shape of the surface of the object under measurement, a scale for measuring displacement resulting from the oscillation of the probe part, a scale head (26) for reading the scale marks of the scale, and an arm part (16) that the probe part and scale are attached to and is attached so as to be capable of oscillating around the oscillation center integrally with the probe part. The condition (α + γ) – 1/2α ≤ β ≤ (α + γ) + 1/2α is satisfied, where α, β, and γ are the thermal expansion coefficients of the probe part, arm part, and scale, respectively.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 21/30 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la rugosité ou l'irrégularité des surfaces
41.
INNER SURFACE SHAPE MEASUREMENT DEVICE, ALIGNMENT METHOD FOR INNER SURFACE SHAPE MEASUREMENT DEVICE, AND MAGNIFICATION CALIBRATION METHOD
Provided are an inner surface shape measurement device which can properly align the position of a probe, and an alignment method for the inner surface shape measurement device. This inner surface shape measurement device is for measuring an inner surface shape of a small hole H formed in a workpiece W, the device comprising: a rotary body 16 and a direct acting tilt stage 18 for rotating the workpiece W about a rotation axis; an elongated probe 30 which can be inserted into the small hole H of the workpiece; a probe direct acting tilt mechanism 28 which can adjust the orientation of the probe; a camera 32 which is configured to be rotatable integrally with the rotary body 16 and captures an image of the probe 30 from at least three circumferential positions on a rotation trajectory about a rotation axis C; and a control device 50 for adjusting the orientation of the probe through the probe direct acting tilt mechanism 28 on the basis of a captured image captured by the camera 32 at each of the circumferential positions.
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
42.
INNER SURFACE SHAPE MEASUREMENT APPARATUS, AND ALIGNMENT METHOD FOR INNER SURFACE SHAPE MEASUREMENT APPARATUS
Provided are an inner surface shape measurement apparatus that suitably aligns the positions of holes, and an alignment method for the inner surface shape measurement apparatus. A first position of a fine hole in a workpiece that is fixed to a direct-acting inclining stage at a first rotational angle of a rotating body and rotates together with the rotating body, and a second position different from the first position, are observed by a camera, and a first position and a second position of the fine hole in the workpiece at a second rotational angle of the rotating body different from the first rotational angle are also observed by the camera. The position and inclination of the fine hole are calculated from the coordinates of each of the observed positions, and fine hole information including the position and inclination of the fine hole is outputted.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 7/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer des contours ou des courbes
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
43.
WORKPIECE DIAMETER MEASUREMENT METHOD AND WORKPIECE CIRCULARITY MEASUREMENT MACHINE
Provided are a workpiece diameter measurement method and a workpiece circularity measurement machine that can perform diameter measurement of a workpiece having a large diameter without using a masterpiece and a horizontal arm in a long stroke. The present invention includes: a first detection step for, in a state where a probe is in contact with the circumferential surface of a non-calibrated standard from one direction side in a displacement direction of the probe, detecting the position of the probe while relatively rotating the standard and a detector about the rotation center; a second detection step for, in a state where the probe is in contact with the circumferential surface of the standard from another direction side in the displacement direction, detecting the position of the probe while relatively rotating the standard and the detector about the rotation center; a rotation center calculation step for calculating the position of the rotation center on the basis of the position of the probe detected in the first detection step and the second detection step; a third detection step for, in a state where the probe is in contact with a workpiece from the other direction side, relatively rotating the workpiece and the detector about the rotation center; and a diameter calculation step for calculating the diameter of the circumferential surface of the workpiece.
Provided is a dicing device capable of controlling the height of a blade highly accurately in real time using a simple configuration. A dicing device (10) is provided with: a work table (CT); a cutting unit (12) including a blade (16) and a spindle (14); an XY-direction driving unit (50); a Z-direction driving unit (50); a first measuring instrument (18) that measures a position in the Z-direction of a surface of a workpiece held on a holding face of the work table; a second measuring instrument (20) that measures displacement in the Z-direction of the holding face of the work table; a table displacement map indicating displacement in the Z-direction of the holding face of the work table in each position, measured in advance by the second measuring instrument; a correction amount calculation unit that calculates a correction amount of the position of the cutting unit in the Z-direction on the basis of the position in the Z-direction of the surface of the workpiece measured by the first measuring instrument; and a control unit (100) that, when the workpiece is cut with the blade, controls the Z-direction driving unit on the basis of the correction amount.
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
45.
SURFACE SHAPE MEASURING DEVICE AND SURFACE SHAPE MEASURING METHOD
The present invention provides a surface shape measuring device with which it is possible to suppress any reduction in measurement precision when an index table is installed on a rotating table and the surface shape of a workpiece is measured, and a surface shape measuring method. This surface shape measuring device comprises: a rotating table on which a workpiece is placed and which freely rotates about a rotational center; and a detector having a measuring element that is brought into contact with the workpiece placed on the rotating table, the detector detecting displacement of the measuring element. The rotating table is provided with an index table having a centering mechanism for regulating the center of the workpiece and the center of rotation, the index table being detachably installed on the rotating table. The index table is configured so as to enable index feeding along a first axis and a second axis that are orthogonal to the rotational center, and is provided with an eccentric-load-offsetting means that offsets an eccentric load associated with the index feeding of the index table.
Provided are: a dicing device and method capable of preventing interference between a blade and a jig when performing dicing processing and also capable of securing throughput. The dicing method comprises: a form measurement step for measuring a form of a work (W); an alignment step of acquiring measurement results of the form of the work, and performing, on the basis of the acquired measurement result, alignment between the work and the jig such that a line (CT1) that follows an intended dividing line (CL1) of the work and that has a breadth corresponding to a blade width of a blade (32) for performing dicing processing of the work, fits within a jig groove (G1) of a jig (J1); and a step of adsorption holding of the work with a jig and for performing dicing processing of the work along the intended dividing line.
B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
A problem of the present invention is to provide a measurement apparatus in which load torques are similar when ascending and descending by using a mechanism that does not require a complicated structure, is completed with a rigid body of only the weight of a driven body, is driven by the moment of inertia of only the weight of the driven body, is not limited in acceleration, and is free of disturbances such as coupled forces. The abovementioned problem is solved by a measurement device comprising: a detector that detects a surface position of a measurement target; a driven body that supports the detector; a movement support mechanism that is provided with a rotary shaft, causes the driven body to descend through rotation of the rotary shaft in a first direction, and causes the driven body to ascend through rotation of the rotary shaft in a second direction, which is a direction opposite the first direction; a motor that rotates the rotary shaft in the first direction or the second direction; and a load device that applies a load torque to the rotary shaft, and applies a larger load torque to rotation in the first direction than rotation in the second direction of the rotary shaft.
F16D 63/00 - Freins non prévus ailleurs; Freins combinant plusieurs des types mentionnés dans les groupes
F16H 25/22 - Mécanismes à vis avec billes, rouleaux ou organes similaires entre pièces travaillant en conjugaison; Eléments essentiels pour l'utilisation de ces organes
G12B 5/00 - Réglage de la position ou de l'attitude, p.ex. niveau d'instruments ou d'autres appareils, ou de leurs parties constitutives; Compensation des effets d'inclinaison ou d'accélération, p.ex. pour appareils d'optique
G01B 5/008 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer les coordonnées de points en utilisant des machines de mesure de coordonnées
48.
DISPLACEMENT DETECTOR, SURFACE TEXTURE MEASUREMENT INSTRUMENT, AND ROUNDNESS MEASUREMENT INSTRUMENT
Provided are a displacement detector, surface texture measurement instrument, and roundness measurement instrument that make it possible to measure displacement in a plurality of directions, have simple structures, and make highly accurate measurement possible. A displacement measurement instrument (20) comprises: a detector body (30); a roughly L-shaped stylus (40) having a contactor (44) for touching a surface under measurement of an object (W) under measurement; a stylus holding part (33) that is provided in the detector body (30) and holds the stylus (40) such that the same can pivot in a pivoting plane including a first direction and second direction that are orthogonal to each other; and a displacement detection unit that is provided in the detector body (30) and detects displacement of the contactor (44) accompanying contact between the contactor (44) and the surface under measurement.
Provided are a three-dimensional measuring system and a three-dimensional measuring method having improved measuring accuracy and measuring efficiency. This three-dimensional measuring system is provided with: a platen 18; a robot arm 50 that holds a workpiece W, which is an object being measured, and that is capable of varying the attitude of the workpiece W; and a probe 22 which is configured to be capable of moving relative to the platen 18 and which performs three-dimensional measurement of the workpiece W.
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
The present invention provides a workpiece processing device and method capable of grooving, with high precision, the surface of workpieces having various shapes and sizes and a cylindrical surface. The workpiece processing device is provided with: a workpiece support part for supporting a workpiece in a manner rotatable around a first axis that is parallel to the central axis of the workpiece when the workpiece has a cylindrical surface; a cutting part provided with a blade for cutting the surface of the workpiece supported by the workpiece support part; a detection unit for calculating the position of the vertex of the surface of the workpiece in a direction along a second axis that is perpendicular to the first axis and parallel to the blade; and a control unit for controlling the workpiece support part so that a cutting position on the surface of the workpiece is located at the vertex in the direction along the second axis, and forming a groove at the cutting position by relatively moving the workpiece support part and the cutting part so that the cutting direction of the blade is on a plane defined by the central axis of the workpiece and the cutting position on the surface of the workpiece.
B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
B24B 19/02 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux pour meuler des gorges, p.ex. sur des arbres, dans des gaines, des tubes, des éléments de joint homocinétique
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
[Problem] To reduce the time for transporting a wafer to a sheet cleaning unit from peeling work by means of a delivery device and improve overall efficiency without imparting damage to the wafers. [Solution] In this wafer peeling and cleaning device, a wafer peeling slicing unit 100 has first and second suctioning pads 200, 201 for peeling, an overturn prevention plate 214, and a two-sheet pick-up preventing plate 216 having a slit 216a formed in an upper portion of the overturn prevention plate 214. A delivery device 118 has a suctioning pad 300 for delivery, and a pressure switch that detects that the wafer W has been suctioned and held by the suctioning pad 300 for delivery. In response to the detection signal from the pressure switch, the vacuum suctioning of the first and second suctioning pads 200, 201 for peeling is released and the retraction of the suctioning pad 300 for delivery and the lowering of the first and second suctioning pads 200, 201 for peeling are started.
[Problem] To improve efficiency as a whole by shortening the time taken from peeling work to the transfer to a single wafer cleaning unit by means of a delivery device without damaging a wafer. [Solution] In a wafer peeling and cleaning apparatus, a wafer peeling single-wafer unit 100 has: first and second peeling suction pads 200, 201; a reverse prevention plate 214; and a two-sheet taking prevention plate 216 in which a slit 216a is formed at an upper portion of the reverse prevention plate 214. A delivery device 118 has a delivery suction pad 300, and a pressure switch that detects that a wafer W is suctioned and held on the delivery suction pad 300. By means of a detection signal from the pressure switch, while vacuum suction of the first and second peeling suction pads 200, 201 is released, the delivery suction pad 300 starts to be retracted, and the first and second peeling suction pads 200, 201 start to be lowered.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
[Problem] To obtain a wafer peeling and cleaning device that effectively peels off one wafer at a time to slice the wafer without imparting damage to the wafer. [Solution] This wafer peeling and cleaning device is provided with: first and second suctioning pads 200, 201 for peeling that suction and hold an end surface on one side of a wafer W; a first feeding motor 148 that moves the first and second suctioning pads 200, 201 for peeling along a first guide rail 136; a raising and lowering rotary actuator 204 for raising and lowering the first and second suctioning pads 200, 201 for peeling vertically upward; and air nozzles 80, 81 provided to the side surface of the wafer W. When the end surface of the wafer W is suctioned and held by the first and second suctioning pads 200, 201 for peeling to peel off one wafer W at a time, air is blown onto the side surface of the wafer W by the air nozzles 80, 81.
[Problem] To peel off one wafer at a time with a small force and reliably transport the peeled wafers to a delivery device or to a sheet cleaning unit. [Solution] In this wafer peeling and cleaning device, a wafer peeling slicing unit 100 is provided with: a workpiece holding unit 122 that is installed inside a hot water tank 112 and holds a wafer W; a first suctioning pad 200 for peeling that is disposed so that the center axis thereof coincides with the center axis of the wafer W while the wafer W is held; a second suctioning pad 201 for peeling that is disposed below the first suctioning pad 200 for peeling and that expands and contracts in the axial direction; a first feeding motor 148 that moves the first and second suctioning pads 200, 201 for peeling in the longitudinal direction of the hot water tank 112 along a first guide rail 136; and a raising and lowering rotary actuator 204 for raising and lowering the first and second suctioning pads 200, 201 for peeling vertically upward.
Provided are a laser machining device and a control method therefor, with which high precision laser machining of a wafer can be easily carried out. The present invention comprises: a detection control unit that detects the positions of a plurality of scheduled division lines of a wafer; a laser machining control unit that executes laser machining on the basis of the scheduled division line position detection result obtained by the detection control unit and positional relationship information of a first optical axis and a second optical axis; an image capture control unit that causes image capture of a second capture image of the scheduled division lines to be executed by an infrared image capture optical system in a state where the infrared image capture optical system is focused on a second surface of the wafer on the side opposite a first surface thereof; a calculation unit that calculates, on the basis of the positional relationship information and the second capture image, a positional deviation between a theoretical value and a measured value of a reforming region formation position; and a correction unit that corrects the positional relationship information on the basis of the calculation result of the calculation unit. The reforming region is formed within a focusing range of the infrared image capture optical system in a state where the infrared image capture optical system is focused on the second surface in the thickness direction of the wafer.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
Provided are a laser machining device and a laser machining method that make it possible to stably execute an autofocus function without the occurrence of undesirable phenomena such as overshoot. In this laser machining device and laser machining method, normal AF control is performed when the scan position of machining laser light and detection laser light is at a workpiece center part, and reduced-follow AF control, in which displacement of a main surface of a workpiece is followed less than in normal AF control, is performed when the scan position of the machining laser light and the detection laser light is at a workpiece end part.
Provided are a laser machining device and a laser machining method that make it possible to stably execute an autofocus function without the occurrence of undesirable phenomena such as overshoot. In this laser machining device and laser machining method, normal AF control is performed when the scan position of machining laser light and detection laser light is at a workpiece center part, and reduced-follow AF control, in which displacement of a main surface of a workpiece is followed less than in normal AF control, is performed when the scan position of the machining laser light and the detection laser light is at a workpiece end part.
Provided is a wafer machining method that is capable of dividing, accurately, assuredly, and efficiently, a wafer that includes a laminate of a Low-k film, TEG, etc., in a device layer formed on the surface of a substrate, along a planned division line without reducing productivity. This method comprises: a modified region forming step for forming modified regions 20 along the planned division line inside a substrate of a wafer 10 by irradiating the wafer 10 with a laser beam L with the light-condensing-point set inside the substrate; and a breaking step for pressing a break bar against the wafer 10 from the rear surface 10b thereof along the planned division line to warp the wafer 10, and causing cracks generated from the modified regions 20 to extend to the device layer, thereby breaking the wafer 10, wherein, in the modified region forming step, a plurality of the modified regions 20 are formed in the thickness direction of the wafer 10 so that a plurality of unmodified regions 24 exist in the thickness direction of the wafer 10.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p.ex. pour faire des fissures d'amorce de rupture
B28D 5/00 - Travail mécanique des pierres fines, pierres précieuses, cristaux, p.ex. des matériaux pour semi-conducteurs; Appareillages ou dispositifs à cet effet
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
Provided is a surface shape measurement device capable of simultaneously measuring the surface roughness of a surface to be measured and a surface shape feature other than the surface roughness of the surface to be measured and preventing probe damage. The present invention comprises a detector; a first elastic support member for supporting the detector such that the same can pivot freely in a first rotation direction and a second rotation direction that is the reverse direction from the first rotation direction; a drive unit for moving the first elastic support member along a drive direction that is orthogonal to the axial direction of a pivot support point and parallel to the surface to be measured; a linear detector guide for guiding the detector, which is driven by the drive unit via the first elastic support member, along the surface to be measured; a guide support member that has one or more first contact points in contact with the surface to be measured and supports the detector guide at a position facing the reverse side of the detector from the side of the detector facing the surface to be measured; and a detector support member that is provided on the detector and allows the detector guide to support the detector such that the detector can move freely along the detector guide.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
G01B 21/30 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la rugosité ou l'irrégularité des surfaces
A dicing device 10 in which a work table 12 and a blade 18 that is made to rotate by a spindle 20 are moved relative to each other and dicing is performed in a state in which a workpiece W is held on the work table 12 with a dicing tape T interposed therebetween, wherein the dicing device 10 comprises: a cutting mark detection unit 52 that detects cutting mark information formed on a surface region of the dicing tape T to which a workpiece W is not affixed; and a control unit 56 that, on the basis of the cutting mark information detected by the cutting mark detection unit 52, controls the height of the blade 18 so that the depth to which the dicing tape T is cut is uniform.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
61.
LINEAR DRIVE MECHANISM AND SHAPE MEASURING MACHINE
Provided are: a linear drive mechanism in which a reduction in the measuring accuracy of a detector can be prevented; and a shape measuring machine provided with the linear drive mechanism. This liner drive mechanism is configured so that a contact or non-contact detector having sensitivity in a first axial direction is moved relative to a workpiece in a second axial direction perpendicular to the first axial direction. The liner drive mechanism is provided with: a drive shaft which extends in the second axial direction; a mover which is supported by the drive shaft without contact and which moves along the drive shaft together with the detector or the workpiece; a guide which is provided at a position offset relative to the drive shaft in a third axial direction perpendicular to both the first axial direction and the second axial direction, and which is parallel to the drive shaft; and a resistance force generation section which is provided on either the mover or the guide, is in contact with the other of the mover and the guide, and generates resistance force acting against the movement of the mover.
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
H02P 7/02 - Dispositions pour réguler ou commander la vitesse ou le couple de moteurs électriques à courant continu les moteurs à courant continu étant du type linéaire
Provided is a method for processing a wafer, which is capable of simplifying the wafer processing steps, while enabling the achievement of chips of stable quality with high efficiency. This method for processing a wafer comprises: a tape bonding step wherein a back grind tape B is bonded to the front surface of a wafer W; a modified region formation step wherein a modified region is formed inside the wafer W by having laser light enter into the wafer W from the back surface along a cut line CL; a back surface processing step wherein the thickness of the wafer W is reduced by processing the back surface of the wafer W, in which the modified region has been formed; and a dividing step wherein the wafer W is divided into separate chips T by dividing the wafer W along the cut line CL by applying a load to the cut line CL from the back surface of the wafer W in a state where the back grind tape B is bonded to the front surface of the wafer W.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p.ex. pour faire des fissures d'amorce de rupture
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
63.
DETECTOR, SURFACE PROPERTY MEASUREMENT INSTRUMENT, AND ROUNDNESS MEASUREMENT INSTRUMENT
Provided are a detector, surface property measurement instrument, and roundness measurement instrument for addressing the problem of automatically measuring a plurality of surfaces and reducing the time required for the measurement. This problem is addressed by a detector provided with a stylus for supporting a contact for touching the surface of an object of measurement, a holding part for holding the stylus, a measurement part for holding the holding part such that the same can freely pivot around a rotation axis and for detecting the displacement of the holding part, and a body part for accommodating the measurement part, wherein the holding part holds the stylus such that a stylus axis, which is the axis of the stylus, and a body axis, which is the axis of the body, are parallel and the stylus axis and body axis are offset in a first direction orthogonal to the body axis and rotation axis.
Provided is a detector for a surface measuring machine which makes it possible for high-resolution adjustment of a measuring force in an arbitrarily defined adjustment range and a large maximum measuring force to be obtained simultaneously. This detector is provided with an arm (32) having a contact (34) provided at a distal end thereof, a rotating shaft (30) which rotatably supports the arm, and an inclination adjusting portion (50) provided with: a transmission portion (42) one end (42A) of which is connected to a position on the arm on the opposite side to the contact, relative to the rotating shaft; a resilient portion (44) one end (44A) of which is connected to the other end (42B) of the transmission portion, and which generates a measuring force to be imparted to the contact; a position adjusting portion (46) which is connected to the other end (44B) of the resilient portion and causes the position of said other end of the resilient portion to move in a movement direction; and a contacting portion (54) which is connected to the arm and is disposed in a position allowing contact with the transmission portion.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
65.
HUB-TYPE BLADE AND HUB-TYPE BLADE MANUFACTURING METHOD
This hub-type blade rotates about an axis (O1), and is characterized by being provided with: a hub (110) on which a blade attachment surface (111A) made from an aluminum alloy is formed; a blade main body (130) which is arranged on the blade attachment surface (111A) and which comprises diamond superabrasive grains dispersed in a metal base material made from nickel or a nickel alloy; and a double-sided adhesive tape (120) which is arranged between the hub (110) and the blade main body (130) and which connects the hub (110) and the blade main body (130).
B28D 5/02 - Travail mécanique des pierres fines, pierres précieuses, cristaux, p.ex. des matériaux pour semi-conducteurs; Appareillages ou dispositifs à cet effet par outils rotatifs, p.ex. par forets
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B24B 45/00 - Moyens utilisés pour fixer les meules sur les arbres rotatifs
66.
WORKPIECE DIVIDING DEVICE AND WORKPIECE DIVIDING METHOD
Provided are a workpiece dividing device and a workpiece dividing method that are capable of solving a problem in which division is not performed along a scheduled division line and which occurs when the chip size is small. A frame 4 of a wafer unit 2 is fixed by means of a frame fixing section 12 of an expansion restricting ring 16. Next, an expand ring 14 is moved upward so as to start the expansion of the whole area of an annular area 3B. Next, when the upward movement amount of the expand ring 14 exceeds the thickness of the frame 4, the annular area 3B makes contact with an expansion restriction section 17, and the expansion of an outer circumferential area 3E located on the outer circumferential side of the annular area 3B is restricted. Next, upward movement of the expand ring 14 is continued and expansion of an inner circumferential area 3F excluding the outer circumferential area 3E in the annular area 3B is continuously performed, so that a wafer 1 is divided into individual chips 6.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
67.
PROCESSING DEVICE AND METHOD FOR SETTING PROCESSING DEVICE
[Problem] To provide a processing device for uniformly grinding wafers held by a plurality of chucks, and a method for setting the processing device. [Solution] A processing device 1 includes a coarse grinding means 5 and a fine grinding means 6 that are provided in a column 4 straddling over a holding means 2. The holding means 2 includes: an index table 21; chucks 22 concentrically disposed about a rotation shaft 2a; a first movable support unit 24 disposed on the outer peripheral side of the chuck 22 in the radial direction of the index table; and a first fixed support unit 25 disposed on the inner peripheral side of the chuck 22 in the radial direction of the index table. The first movable support unit 24 is interposed between the index table 21 and the chuck 22, and can be freely expanded and contracted in a vertical direction.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
Provided is a workpiece supporting device with which deflection of a workpiece can be decreased at low cost. The workpiece supporting device is provided with: a horizontal table; three first fulcrums provided on an upper surface of the table; a first arm pivotally supported at each of the first fulcrums, the first arm having a central portion in an arm longitudinal direction which is pivotally supported about a horizontal axis by the first fulcrum; and a plurality of first abutting portions which are pivotally provided on an upper surface of the first arm for each first fulcrum, and which are distributed in different directions from the first fulcrum, the first abutting portions abutting on a workpiece.
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
Provided is a prober and a prober operation method for preventing collision between a probe and a probe position detection camera. The prober 10 for performing inspection by causing a probe 25 to contact an electrode of a wafer W is provided with: a probe position detection camera 18 which detects a tip-end position of the probe 25 for relative positioning of the electrode of the wafer W and the probe 25; a probe height detector 20 which is provided separately from the probe position detection camera 18 and which detects the height of a tip-end of the probe from a reference surface serving as a reference for the height of the probe position detection camera 18; and a first height adjustment mechanism 21 which changes the height of the probe position detection camera 18 from the reference surface on the basis of the result of detection by the probe height detector 20.
Provided are a surface shape measuring device and a surface shape measuring method with which it is simple to improve the measuring accuracy of the surface shape of a workpiece. This surface shape measuring device is provided with a detector which detects displacement of a probe, and a relative movement unit which causes the workpiece to move relative to the detector, wherein with the probe brought into contact with the workpiece, the surface shape of the workpiece is measured on the basis of a result of detecting the displacement of the probe using the detector, while the workpiece is moved relative to the detector by means of the relative movement unit, and wherein the surface shape measuring device is additionally provided with a weight detecting unit which detects the weight of the workpiece.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
G01G 19/52 - Appareils de pesée combinés avec d'autres objets, p.ex. avec de l'ameublement
A prober provided with: a plurality of measurement units provided with a device to be maintained and a draw-out mechanism for drawing out the device to be maintained; and a transport unit which moves to a position providing access to the measurement unit as a transport destination of a transport item, and transports the transport item into the measurement unit as the transport destination. In the prober, Abbe errors, which need to be considered for accurate positioning of the device to be maintained, are suppressed. The prober 10 is provided with a measurement unit 14, a transport unit 16, and a loading unit 70 for loading the transport item into the measurement unit from a maintenance area A2 side, wherein a draw-out direction of the device to be maintained and a transport item transport direction are on a straight line. The measurement unit 14 enables the loading of the transport item from a transport area A1 side and the maintenance area A2 side.
The invention provides a prober and a transport unit such that throughput at each measurement unit can be increased in a prober equipped with a transport unit moving between a transport object housing unit and a plurality of measurement units, and transporting transport objects (for instance, a wafer and/or a probe card) to the transport object housing unit or each of the measurement units. The prober 10 comprises: the transport object housing unit 12 housing a plurality of transport objects; the plurality of measurement units 14; the transport unit 16 moving between the plurality of measurement units 14 and the transport object housing unit 12 housing the plurality of transport objects, and transporting transport objects into the transport object housing unit 12 or into each of the measurement units 14; and a moving device 22. The transport unit 16 comprises environment control means 16d for controlling the internal environment of the casing 16a, and air-curtain forming means 42 causing the interior of the casing 16a to become a sealed or a substantially sealed space.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
73.
ULTRASONIC DISPLACEMENT SENSOR AND WORKPIECE IDENTIFICATION APPARATUS USING SAME
[Problem] To enable a more precise identification operation for a plurality of device types, in a conveyance line on which types of workpieces having different specifications are mixed, especially, a conveyance line for cylinder blocks in a manufacturing plant for automobile engines, and thereby achieve improved reliability. [Solution] An ultrasonic displacement sensor 1, 2, which transmits ultrasonic waves to an object, which receives the reflection waves, and which measures a time period from the transmission to the reception, is provided with: a body case 41 having an ultrasonic element 31, 32 set at one end thereof; a transparent case 42 attached to the body case 41; a photoreflector 44 provided at the position of the transparent case 42 and having a light emitting unit and a light receiving unit; and a switching unit that switches, in accordance with output from the photoreflector 44, between a setting mode in which an attachment position of the body case 41 is adjusted and a measurement mode in which the object is measured.
This method for manufacturing a cutting blade is provided with: a mixing step for adding a liquid dispersion medium to a powder mixture containing a resin powder made of a thermocompression-bondable resin, abrasive grains, and a fibrous filler; a compression step for cold-pressing, in a mold, the powder mixture to which the dispersion medium has been added, and forming an original plate of a blade body; and a sintering step for hot-pressing and sintering the original plate.
B24D 3/02 - Propriétés physiques des corps ou feuilles abrasives, p.ex. surfaces abrasives de nature particulière; Corps ou feuilles abrasives caractérisés par leurs constituants les constituants étant utilisés comme agglomérants
B24D 3/00 - Propriétés physiques des corps ou feuilles abrasives, p.ex. surfaces abrasives de nature particulière; Corps ou feuilles abrasives caractérisés par leurs constituants
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
B24B 7/00 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet
Provided is a grinding machine in which brittle-mode grinding is suppressed so as to achieve stable grinding of a wafer. This grinding machine (1) is provided with: a rotatable spindle (23) that has a grind stone (21) attached to a lower end thereof; a linear guide (24) that supports the spindle (23) in such a manner as to be slidable with respect to a column (22); a spindle feed mechanism (25) that feeds the spindle (23) in a vertical direction (V); and a constant-pressure feed mechanism (26) that is interposed between the spindle feed mechanism (25) and the column (22) so as to suspend the spindle feed mechanism (25). The constant-pressure feed mechanism (26) causes an elevation of the spindle feed mechanism (25) in the vertical direction (V) when the friction force acting on the grind stone (21) becomes greater than a prescribed value.
B24B 47/14 - MACHINES, DISPOSITIFS OU PROCÉDÉS POUR MEULER OU POUR POLIR; DRESSAGE OU REMISE EN ÉTAT DES SURFACES ABRASIVES; ALIMENTATION DES MACHINES EN MATÉRIAUX DE MEULAGE, DE POLISSAGE OU DE RODAGE Équipement à cet effet pour entraîner dans leur mouvement de rotation ou de va-et-vient les arbres porte-meules ou les arbres porte-pièces par la pression d'un gaz ou d'un liquide
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
Provided are a surface shape measuring method, a misalignment amount calculating method and a surface shape measuring device with which it is possible to measure the diameter of a workpiece with high precision and good repeatability, and which make it possible to perform measurements with excellent versatility. This surface shape measuring method is provided with: a first acquisition step in which a detector is disposed on one side of a workpiece and first shape data are acquired, the first shape data indicating the surface shape of the workpiece when displacements in the surface of the workpiece are detected using the detector while the workpiece and the detector are caused to rotate relative to one another about a center of rotation; and a second acquisition step in which the detector is disposed on the other side of the workpiece and second shape data are acquired, the second shape data indicating the surface shape of the workpiece when displacements in the surface of the workpiece are detected using the detector while the workpiece and the detector are caused to rotate relative to one another about the center of rotation.
G01B 5/08 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des diamètres
G01B 21/10 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des diamètres
Provided are a prober with which enhanced reliability of electrical contact can be obtained between an electrode pad on a wafer and a probe, and a probe contact method. The prober is provided with: a wafer chuck 16; a probe card 18; a ring-shaped seal member 40 with which the wafer chuck 16 is fitted; a Z-axis movement/rotation portion 52 for lifting and lowering the wafer chuck 16 detachably attached to a wafer chuck fixing portion; a depressurization means for depressurizing an internal space S formed by the probe card 18, the wafer chuck 16, and the ring-shaped seal member 40; a lift control means for controlling the Z-axis movement/rotation portion 52 so as to cause the probe 28 to contact the electrode pad in an over-drive state; and a depressurization control means for controlling the depressurization means so as to cause the wafer chuck 16 to be drawn toward the probe card 18 by depressurization of the internal space S.
The first purpose of the present invention is to achieve reduced burden of measurement work, improved measurement efficiency, and the like by effectively using, for surface roughness measurement, data obtained by roundness measurement, and the second purpose thereof is to achieve improved measurement efficiency of roundness measurement and surface roughness measurement, and improved measurement accuracy and the like by effectively using data obtained by roundness measurement and surface roughness measurement for each other. To accomplish the first purpose, a measurement condition for surface roughness measurement is set on the basis of data relating to an object to be measured and obtained by roundness measurement. To accomplish the second purpose, a shape measurement device is provided with: a first measurement unit that performs roundness measurement of an object to be measured, and a second measurement unit that performs surface roughness measurement of the object to be measured at a position on the circumferentially opposite side to the first measurement unit, and performs the roundness measurement by the first measurement unit and the surface roughness measurement by the second measurement unit at the same time.
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
Provided is a prober with which it is possible to maintain parallelism between a probe card and a wafer and to perform a wafer level inspection to a high degree of accuracy. A test head 54 is held on a test head holding part 80. The test head 54 and a probe card 56 are securely held by suction to a pogo frame 58 attached to a head stage 52. A wafer chuck 50 moves toward the probe card 56 while detachably fixed to a Z-axis moving and rotating unit 72. The pressure in a sealed space formed between the wafer chuck 50 and the probe card 56 is reduced by a pressure reduction means. The wafer chuck 50 is thereby pulled toward the probe card 56, and the wafer W is electrically inspected while the test head 54, the pogo frame 58, the probe card 56, and the wafer chuck 50 are formed into a unified unit with reference to the head stage 52.
A roundness measurement device 1 according to the present invention has a base 10, a stage 12 that is provided on the base 10 and on which a workpiece W is placed, a column 14 made to stand on the base 10, a carriage 16 supported so as to be capable of moving along the column 14, a turning arm 18 supported by the carriage 16 so as to be capable of turning around a turning axis in the radial direction (left-right direction), a radial direction movement arm 20 supported so as to be capable of moving in the radial direction, and a detector holder 22 fixed to the leading end of the radial direction movement arm 20. A detector 24 is fixed to the detector holder 22, and the position of the detector in the radial direction is adjusted through the movement of the radial direction movement arm 20 in the radial direction.
G01B 21/30 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
Provided is a laser dicing device capable of stably and highly accurately detecting the height position of a laser beam irradiation surface of a wafer without being affected by nonuniformity of a thin film formed on the laser beam irradiation surface of the wafer. An AF device 110 (height position detection means) irradiates the surface of a wafer W with an AF laser beam L2 (synthesized beam of a plurality of AF laser beams L2a and L2b having different wavelengths) outputted from a light source unit 200, and detects reflection light thereof by each wavelength by means of a detection optical system 400. On the basis of detection results obtained from the detection optical system 400, an AF signal processing unit 500 transmits a displacement signal to a control unit 50, said displacement signal indicating displacement of the laser beam irradiation surface of the wafer W. Furthermore, the AF device 110 is provided with a focusing optical system 310 that is disposed on an irradiation optical path, i.e., an optical path to a light collecting lens 106 from the light source unit 200. The focusing optical system 310 adjusts a light collecting point of the AF laser beam L2 in the wafer thickness direction.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23K 26/00 - Travail par rayon laser, p.ex. soudage, découpage ou perçage
B23K 26/046 - Focalisation automatique du faisceau laser
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p.ex. pour faire des fissures d'amorce de rupture
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
Provided is a three-dimensional coordinate measurement apparatus with which swing of a Y carriage can be inhibited, and measurement accuracy improved. A groove 40 is formed in the Y axis direction in a right side part of a platens 10 of stone, and a Y guide 42 that supports a portal-type Y carriage movably in the Y axis direction is formed between the groove 40 and the right side surface 10R of the platen 10. A support part 50 is provided to the bottom end part of a right Y carriage 16 at the right side of the Y carriage, and the support part 50 supports the platen 10 through the agency of air pads 62F, 64F, 66F, 68F … arranged in sets of two at front and back on each of the upper surface 10T, right side surface 10R, and lower surface 10B of the platen 10, and on the right side surface 40R of the groove 40.
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
G01B 5/008 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer les coordonnées de points en utilisant des machines de mesure de coordonnées
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
84.
SEMICONDUCTOR WAFER INSPECTION APPARATUS AND SEMICONDUCTOR WAFER INSPECTION METHOD
Provided are a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method, whereby warping of a semiconductor wafer due to a temperature difference between a placing surface of a table and the semiconductor wafer can be suppressed. A prober (10) of the present invention heats, in a preheating step wherein an oven (54) is used, a semiconductor wafer W to a second temperature that is equal to or lower than a first temperature, and then places the semiconductor wafer W on a placing surface (18) of a table (20) heated to the first temperature. Consequently, since a temperature difference between the placing surface (18) of the table (20) and the semiconductor wafer W is reduced, the prober (10) can suppress semiconductor wafer warping generated just after the semiconductor wafer is placed on the placing surface (18).
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is a non-contact measurement device that uses white light interferometry and can be used even in a radioactive environment. A dimension measurement device (10) has a measurement light irradiation member (16) that does not use electronic components and is composed from a radiation-resistant quartz lens (60) and a metallic lens holder (62), and non-contact measurement is thus possible even in an intensely radioactive environment (82). In addition, optical fiber (26) exposed to an intensely radioactive environment (82) is also made from quartz, and thus there is no problem using the same in the radioactive environment (82). Further, because the lens (60) and optical fiber (26) are made from quartz, reliable and highly accurate measurement is possible even in a location such as a nuclear power plant where reliable monitoring over a long period of time is necessary.
The purpose of the invention is to provide a two-color interference measurement device that is capable of highly accurate distance and angle measurement using a two-color interference method, has a low price, and is thus suitable as a practical device. The present invention is provided with two types of laser light sources (12, 14) having different wavelengths, a light splitting and combination means (16) for generating reference light and measurement light by splitting the two types of laser light toward both a fixed reflector (20) and a moving reflector (18) to which an object to be measured is attached and generating interference light by combining the measurement light reflected by the mobile reflector (18) and the reference light reflected by the fixed reflector, a wedge prism (22) for causing the wavefronts of the two types of laser light to be inclined in relation to the optical axes thereof, light detection means (24, 26) having four parts, and a signal processing device (28) for calculating the movement amount, movement direction, and fluctuation direction of the mobile reflector (18) from the interference signals of the two types of laser light detected by the light detection means (24, 26) and calculating the distance to the object being measured. The present invention is configured as a two-optical-axis-system light interference mechanism in which the two types of laser light split by the light splitting and combination means (16) have optical axes that are parallel and adjacent until the two light detection means.
[Problem] To provide a wafer inspection method whereby inspection accuracy and operation efficiency can be improved. [Solution] In this wafer inspection method for performing electrical inspection by bringing, at one time, a plurality of probes into contact with a plurality of pads in chips on a wafer, said probes being provided in a probe card, the inspection is performed through: a chuck step S1 for heating the wafer to an inspection temperature by holding the wafer by means of a wafer chuck; a first position recognition step S2 for recognizing all the positions of the pads of the chips in the wafer; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the positions of the pads for the purpose of recognizing the positional shifts of the pads due to thermal expansion generated when the wafer chuck is heated; and a correction step S4 for correcting contact positions with respect to the probes, said contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.
A shape measuring device is provided which can measure the three-dimensional shape of a surface with high speed and high accuracy. A low-coherence beam emitted from a low-coherence light source (12) enters a beam splitter (18) via a collimator (16) and is divided into a measurement beam and a reference beam by the beam splitter (18). The measurement beam is magnified and collimated by a telecentric optic system (20) and is irradiated onto the measurement object (O). By means of the bream splitter (18), the measurement beam reflected on the measurement object (O) and the reference beam reflected on a CCP (40) are combined into one, interfere, and enter an optical detector (24). The optical detector (24) is configured from a matrix arrangement of light receiving elements (30). The three-dimensional shape of the area irradiated by the measurement beam is measured on the basis of the light intensity of the interference beam detected by the light receiving elements (30) of the optical detector (24).
A white light interference device and a method of detecting position and displacement by means of a white light interference device are provided. In the white light interference device (101), a first measurement beam (104) is irradiated onto an object to be measured (156), and at the same time, a second measurement beam (110) is irradiated onto a fixed reference target (140). Initially, the difference between measured values of the object to be measured (156) and measured values of the reference target (140) is acquired and error due to external disturbances is eliminated. Next, a comparison is made using the measured values, from which external disturbance error has been eliminated, and calibration data. Specifically, from the measured values, from which external disturbance error has been eliminated, operation error data of the averaged pitching and yawing of a linear stage (126) is eliminated and true measured data is acquired.
The present invention provides a shape measurement apparatus for which it is possible to easily and stably exchange a plurality of measurement elements. In one embodiment of the present invention, in a shape measurement apparatus for measuring the roughness and/or contour of the surface of a workpiece by sliding a sensing pin provided on the leading end side of an arm on the workpiece in the axial direction of the arm, the arm has an engagement mechanism that makes the sensing pin side of the arm capable of being freely attached to and detached from the proximal side of the arm. The engagement mechanism has two engagement surfaces that oppose each other so as to be perpendicular to the workpiece surface and parallel to the axial direction of the arm and are made to adhere to each other by a magnet and magnetized material in corresponding positions within the engagement surfaces. One of the engagement surfaces has a linear first groove that is parallel to the arm axis and an engagement part that is separate from the first groove. The other engagement surface has a first fitting pin positioned so as to fit into the first groove and a second fitting pin that fits into the separate engagement part.
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
91.
DISTANCE MEASUREMENT DEVICE AND DISTANCE MEASUREMENT METHOD
This distance measurement device is provided with the following: an emission unit that emits first light and second light of a different wavelength from the first light; a splitting unit whereby incident light that was emitted by the emission unit and contains the aforementioned first light and the aforementioned second light is split into measuring light and reference light; an exposure unit that exposes a subject of measurement to the measuring light; a combining unit whereby measuring light reflected from the subject of measurement and the reference light are combined, yielding interfering light; and a reflecting member that emits incident light via reflection, is provided from the light source for the first light to a detection unit that detects the interfering light, and either reflects incident parallel light rays as converging light rays or reflects incident diverging light rays as parallel light rays.
With minimal increases in installation footprint and device cost, this invention improves throughput without compromising the movement-position precision of an alignment device that is shared by a number of measurement units. This prober is provided with the following: a plurality of measurement units 14, each of which has a probe card 18 that is electrically connected to a test head 22; a wafer chuck 16 that holds a wafer W on which a plurality of chips are formed; an alignment device 50 that sets the relative positions of the wafer W held by the wafer chuck 16 and the probe cards 18; a movement device 100 that moves the alignment device 50 between the measurement units 14; and a positioning/fixing device, provided for each measurement unit 14, that positions the alignment device 50 and fixes the alignment device 50 in place when the alignment device 50 moves to that measurement unit 14.
A laser dicing device (10) equipped with: a laser light source (21) that emits processing laser light (L1); an AF light source (31) that emits AF laser light (L2) which shares a portion of the light path of the processing laser light (L1); a collecting lens (24) arranged in the shared light path of the first and second laser lights (L1, L2); an AF signal processing unit (40) that generates a focus error signal on the basis of the AF laser light (L2) reflected by the surface of a wafer; a control unit (50) that, on the basis of the focus error signal, moves the collecting lens (24) in the wafer thickness direction so as to achieve a constant distance between the collecting lens (24) and the wafer surface; and a focus lens group (37) that adjusts the focal point position of the AF laser light (L2) in the wafer thickness direction while the focal point position of the processing laser light (L1) is fixed. Thus, it is possible to provide a laser dicing device and a laser dicing method which have a high degree of freedom with respect to changes in the processing depth of a modified region, and with which a modified region can be formed with good precision in the interior of a wafer.
B23K 26/046 - Focalisation automatique du faisceau laser
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p.ex. pour faire des fissures d'amorce de rupture
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
A bidirectional displacement detector (10) according to the present invention is provided with a displacement detection means (3) including a first detection element and a second detection element, a base (4) provided with the first detection element, an arm (5) that is coupled to the base so as to freely rotate around an arm rotation axis (A) and is provided with the second detection element, and a probe (6) that is coupled to the base so as to freely rotate around a measurement probe rotation axis (M) that is perpendicular to the arm rotation axis. The probe has a contact part (7) that is provided at a position removed from the probe rotation axis and a pair of abutment parts (13a, 13B) that follow the direction of the arm rotation axis, are disposed on both sides surrounding the measurement probe rotation axis, and removably abut the arm. The arm is urged toward one side of the base in the peripheral direction circling the arm rotation axis and urges each of the pair of abutment parts from both sides in the peripheral direction circling the measurement probe rotation axis.
Provided is a wafer processing method by which a wafer of good processed quality can be divided into individual chips, while improving productivity and reducing cost. This wafer processing method is a method by which a wafer (W) in which are formed regions demarcating a plurality of chips by predetermined dividing lines (14) in a device layer (12) formed on the surface of a semiconductor substrate (10) is divided into individual chips along the predetermined dividing lines, wherein the method includes: a groove formation step for irradiating the wafer, from the side of the surface thereof on which the device layer is formed, with laser light induced by a liquid beam, doing so along the predetermined dividing lines, to eliminate the device layer in the predetermined dividing lines as well as to form grooves (16) in the semiconductor substrate; and a back surface processing step for processing the back surface of the wafer, and reducing the thickness of the wafer.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23K 26/00 - Travail par rayon laser, p.ex. soudage, découpage ou perçage
B23K 26/146 - Travail par rayon laser, p.ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p.ex. un jet de gaz, associé au faisceau laser; Buses à cet effet l'écoulement de fluide contenant un liquide
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
Provided are a dicing device and a dicing method which are capable of cutting even a workpiece composed of a brittle material stably and accurately in a ductile mode without causing cracks and breakage. A dicing device for cutting a workpiece is provided with: a dicing blade (26) which is formed into a disc shape from a diamond sintered compact (80) formed by sintering diamond abrasive grains, and has minute cutting edges continuous along the circumferential direction of an outer peripheral part; a spindle (rotation mechanism) which rotates the dicing blade (26); and a movement mechanism which moves the workpiece relatively with respect to the dicing blade (26) while a depth of cut is given to the workpiece by the dicing blade (26).
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B24D 3/00 - Propriétés physiques des corps ou feuilles abrasives, p.ex. surfaces abrasives de nature particulière; Corps ou feuilles abrasives caractérisés par leurs constituants
Provided is a dicing blade capable of cutting even a workpiece composed of a brittle material stably and accurately in a ductile mode without causing cracks and breakage. This dicing blade (26) is attached to a rotatable spindle, and while rotating about the rotation axis of the rotatable spindle, cuts or grooves a flat plate-shaped workpiece to a constant depth of cut while the workpiece is relatively slid. This dicing blade (26) is integrally formed into a disc shape or a ring shape from a diamond sintered compact formed by sintering diamond abrasive grains, and is provided with, at the outer periphery of the dicing blade (26), a cutting edge part (40) in which minute cutting edges formed on the surface of the diamond sintered compact are provided continuously along a circumferential direction.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B24D 3/00 - Propriétés physiques des corps ou feuilles abrasives, p.ex. surfaces abrasives de nature particulière; Corps ou feuilles abrasives caractérisés par leurs constituants
B24D 3/06 - Propriétés physiques des corps ou feuilles abrasives, p.ex. surfaces abrasives de nature particulière; Corps ou feuilles abrasives caractérisés par leurs constituants les constituants étant utilisés comme agglomérants et étant essentiellement inorganiques métalliques
B24D 5/00 - Meules agglomérées, ou meules comportant des segments abrasifs rapportés, conçues pour travailler uniquement par leur périphérie; Bagues ou accessoires pour le montage des ces meules
B28D 5/02 - Travail mécanique des pierres fines, pierres précieuses, cristaux, p.ex. des matériaux pour semi-conducteurs; Appareillages ou dispositifs à cet effet par outils rotatifs, p.ex. par forets
[Problem] To provide a shape measurement device that can measure both contours over a wide measurement range, and tiny asperities. [Solution] The shape measurement device is designed to measure surface contours and surface roughness of a measured surface, and is provided with an arm that swings about a support part as the fulcrum point; a sensing pin positioned contacting the measured surface, and experiencing vertical displacement according to the surface profile of the measured surface; and a displacement sensor and a scale type detector for detecting displacement due to swinging of the arm. The sensing pin is situated at a first end at one end of the arm, the displacement sensor and the scale type detector are at least partly situated at a second at the other end portion of the arm, and the support part is situated closer towards the second end side, with respect to the center of the arm.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
This probe device measures the position of all chips in a wafer of a measurement body and obtains same as actual measurement data. The probe device then calculates the variation in the actual measured position of each chip and the variation in the position at which the probe comes in contact with each chip in the wafer, on the basis of the actual measurement data; and displays, on a monitor, a variation precision display image (100) that visually displays these variation amounts. A square area (102) corresponding to each chip is displayed in this image (100) and a dot (104) is displayed in each square area (102), at a position displaced from the center position in accordance with the variation amount.
A probe device comprising an alignment utility function. In a simulation that, when a user inputs (step S30) a condition value relating to the variation amount (variation precision) of a contact position when a probe is brought in contact with each chip, uses actual measurement data (step S32) obtained by measuring the position of all chips in one wafer, the variation precision of each chip is calculated (step S42) while changing the measurement point at which alignment is implemented (steps S38, S46, S48, and S50), and the settings are calculated (steps S44, S52) for optimum measurement points such that the variation precision is no more than the condition value and the number of measurement points is minimized. This information is then provided to the user (step S50).
brevets
