A tape affixing system capable of automatically switching or replacing a dicing tape. A tape affixing system 1 includes a stocker 5 that stores tape magazines 4 each accommodating a dicing tape DT wound in a roll shape, an affixing apparatus 3 which includes movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that regulate a reel-out region R of the dicing tape DT to a predetermined track, on which each of the tape magazines 4 is replaceably mountable, and which affixes the dicing tape DT to a dicing frame DT and a workpiece W, and a first conveyance robot 6 that delivers the tape magazine 4 between the stocker 5 and the affixing apparatus 3.
B65H 35/00 - Délivrance d'articles à partir de machines à découper ou à perforer linéairement; Appareils délivrant des articles ou des bandes, comportant des dispositifs pour couper ou perforer linéairement, p.ex. distributeurs de bande adhésive
B65H 19/12 - Levage, transport ou insertion de la bobine; Enlèvement du noyau vide
2.
CHARGING/DISCHARGING TEST SYSTEM AND METHOD FOR CONTROLLING CHARGING/DISCHARGING TEST SYSTEM
This charging/discharging test system comprises: a bidirectional AC/DC converter (12) connected to an alternating current power source (AC power source (9)); an isolated bidirectional DC/DC converter (22) connected to a first direct current bus (14) at one end and connected to a second direct current bus (24) at the other end; a plurality of non-isolated bidirectional DC/DC converters (26) each connected to the second direct current bus (24) at one end and connected to a charging/discharging body (battery (6)) at the other end, the charging/discharging bodies being different from each other; and a charging/discharging control unit (ET control unit (28)). Power output by the charging/discharging control unit from at least one of the charging/discharging bodies via the non-isolated bidirectional DC/DC converter (26) is charged to at least one of the charging/discharging bodies via the second direct current bus (24) and at least one of the non-isolated bidirectional DC/DC converters (26).
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
H02M 3/155 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 3/28 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire
The present invention is provided with: a plurality of charge/discharge test devices (12) for performing charge/discharge with respect to charge/discharge targets (9); a switching circuit (14) capable of switching a combination for electrically connecting the one or more charge/discharge test devices (12) to the one or more charge/discharge targets (9); and a control unit (16) which controls the switching circuit (14) to perform switching of the combination.
G01R 31/385 - Dispositions pour mesurer des variables des batteries ou des accumulateurs
G01R 31/00 - Dispositions pour tester les propriétés électriques; Dispositions pour la localisation des pannes électriques; Dispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
G01R 31/382 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p.ex. état de charge
4.
RETRACTION MECHANISM AND DIMENSION-MEASURING DEVICE PROVIDED WITH SAME
Provided is a pneumatic-cylinder-type retraction mechanism having a cylinder and a piston that is capable of reciprocating inside the cylinder, the retraction mechanism causing the piston to reciprocate using air pressure, wherein the retraction mechanism is characterized in that a sealing means, which prevents pressurized air that operates the piston from leaking from within the cylinder, is provided to the inner periphery of the cylinder facing the outer periphery of the piston to form a stationary sealing means. The retraction mechanism can exhibit at least one effect among reducing starting resistance, improving measurement accuracy of a measuring device, and shortening measurement time.
F15B 15/14 - Dispositifs actionnés par fluides pour déplacer un organe d'une position à une autre; Transmission associée à ces dispositifs caractérisés par la structure de l'ensemble moteur le moteur étant du type à cylindre droit
G01B 13/00 - Dispositions pour la mesure caractérisées par l'utilisation de fluides
G01B 13/08 - Dispositions pour la mesure caractérisées par l'utilisation de fluides pour mesurer des diamètres
5.
PROBER CONTROLLING DEVICE, PROBER CONTROLLING METHOD, AND PROBER
A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces
A tape affixing apparatus that affixes a dicing tape to a workpiece and a dicing frame with appropriate tension. A tape affixing apparatus 1 affixes a dicing tape DT—to a workpiece W and a dicing frame DF in an affixing direction D1. The tape affixing apparatus 1 includes a pressing roller 34 that presses the dicing tape DT against the workpiece W and the dicing frame DF and a support pin 4 that stretches the dicing tape DT in a width direction D2.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
7.
ALIGNMENT METHOD, SHAPE MEASURING METHOD AND SHAPE MEASURING APPARATUS
The alignment method includes detecting an extending direction of a groove formed on a wafer, based on an image of the wafer picked up by a camera, and performing alignment so as to adjust the extending direction of the groove to be parallel to an array direction of pixels of the camera by relatively rotating the wafer and the camera.
A measuring device includes a table on which a workpiece is to be mounted, a first imaging unit configured to image the surface of the workpiece on the table, a second imaging unit configured to image the surface of the workpiece on the table, the second imaging unit allowing measurement of a shape and/or roughness of the surface of the workpiece according to a plurality of images taken by scanning the surface of the workpiece in a Z-axis direction, and an image processing unit configured to process the image of the surface of the workpiece taken by the first imaging unit and the plurality of images taken by scanning the surface of the workpiece in the Z-axis direction by the second imaging unit, so as to measure the shape and/or the roughness of the surface of the workpiece.
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01B 5/008 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer les coordonnées de points en utilisant des machines de mesure de coordonnées
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
The calibration method includes changing the emission direction of the measurement light to be emitted from the optical rotation probe by a minute angle from a reference direction set in advance, acquiring a shape error for a reference object after changing the emission direction by emitting the measurement light from the optical rotation probe toward the reference object while rotating the emission direction of the measurement light around an S axis and varying a relative position between the optical rotation probe and the reference object, and calculating an adjustment error of the emission direction of the measurement light with respect to the reference direction based on a theoretical value of the shape error for the reference object to be obtained in a case where the emission direction of the measurement light matches the reference direction and a measurement value of the acquired shape error for the reference object.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Measuring or testing machines and instruments for
manufacturing semi-conductors; precision measuring
apparatus; temperature sensors; gauges; measurement heads;
measuring or testing machines and instruments; optical
machines and instruments for manufacturing semi-conductors;
optical machines and instruments; laboratory apparatus and
instruments; power distribution or control machines and
apparatus; batteries and cells; electric or magnetic meters
and testers; photographic machines and apparatus;
cinematographic machines and apparatus; eyeglasses;
processed glasses, not for building; life-saving apparatus
and equipment; telecommunication machines and apparatus;
phonograph records; computers; computer programs for
precision measuring apparatus; thermal printers; ozonisers
[ozonators]; electrolysers [electrolytic cells]; sports
training simulators; simulators for the steering and control
of vehicles; rotary converters; phase modifiers; electric
buzzers; railway signal apparatus, luminous or mechanical;
vehicle breakdown warning triangles; road signs, luminous or
mechanical; fire alarms; gas alarms; gloves for protection
against accidents; fire extinguishers; fire hose nozzles;
fire engines; fire boats; sprinkler systems for fire
protection; anti-theft warning apparatus; safety helmets;
fireproof garments; dust masks; gas masks; welding masks;
exposed cinematographic films; exposed slide films; slide
film mounts; recorded video discs and video tapes;
mechanisms for coin-operated car parking gates; cash
registers; slide-rules; coin counting or sorting machines;
job recording devices; photo-copying machines; manual
calculators; mathematical instruments; time and date
stamping machines; time clocks [time recording devices];
electrical calculators; punched card office machines; voting
machines; billing machines; postage stamp checking
apparatus; weight belts for scuba diving; wet suits; air
tanks for scuba diving; regulators for scuba diving;
egg-candlers; metronomes.
A method of forming a truer in a truing where a groove of a grinding wheel used for grinding a chamfer portion of a wafer is formed by a truer having a disc-shape, wherein the method comprising: a process A for adjusting a diameter and a rough shape of the truer by a master grinding wheel for forming the truer; and a process B for forming an edge of the truer into a target shape, wherein the process A and the process B are performed by a plurality of master grooves having different shapes from each other, the plurality of master grooves being provided with the master grinding wheel or the process A and the process B are performed by a plurality of portions having different shapes from each other in at least one of the plurality of master grooves provided with the master grinding wheel.
B24B 9/06 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière propre aux objets à meuler de matière inorganique non métallique, p.ex. de la pierre, des céramiques, de la porcelaine
B24B 51/00 - Systèmes pour la commande automatique d'une série d'opérations successives du meulage d'une pièce
The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.
A tape affixing apparatus and a tape magazine capable of automatically switching or replacing a dicing tape. An affixing apparatus 3 includes a base section 31 on which a tape magazine 4 accommodating a dicing tape DT wound in a roll shape with a part of the dicing tape DT reeled out is installed to be replaceably mountable, movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that are movable to regulate a reel-out region R where the part of the dicing tape DT is reeled out to a predetermined track.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
B65H 35/00 - Délivrance d'articles à partir de machines à découper ou à perforer linéairement; Appareils délivrant des articles ou des bandes, comportant des dispositifs pour couper ou perforer linéairement, p.ex. distributeurs de bande adhésive
14.
METHOD FOR DETECTING ATTACHED STATE OF TOOL HOLDER, DEVICE FOR DETECTING ATTACHED STATE OF TOOL HOLDER, DISPLACEMENT DETECTION METHOD, DISPLACEMENT DETECTION DEVICE, AND MACHINE TOOL
According to a method of the present invention for detecting an attached state of a tool holder, during setup, a tool holder 11 is attached to a spindle 26 in a state without chuck errors, counting of cutouts 11C formed in a flange 11B is started after starting rotation of a tool 9, and a time T taken to obtain measurement data from the last detected cutout 11C and a count N until that time are stored, and, during machining, the measurement data is obtained by matching the count N with the time T by the same procedure as in setup. Therefore, regardless of sensor types, the number of cutouts, shape precision, environment, etc., this method easily and highly accurately matches the phases of measurement data during setup and machining, and improves the accuracy of detecting chuck errors.
Provided are: a laser optical system in which laser light can be adjusted so as to satisfy criteria for laser machining; an adjustment method for the laser optical system; and a laser machining device and method. Provided is a laser optical system (14) comprising a plurality of optical element units (U1–U3) arranged in series on an optical path of laser light. Each optical element unit includes a half-wave plate (WB1–WB3) and a Wollaston prism (WP1–WP3). Also provided is an adjustment method for a laser optical system in which laser light enters a Wollaston prism via a half-wave plate to branch into two branched laser light beams. Said method includes: a step in which the half-wave plate is rotated around an optical path to adjust the branching ratio of the branched laser light beams; and a step in which the Wollaston prism is rotated around the optical path to adjust the branching directions of the branched laser light beams.
B23K 26/067 - Division du faisceau en faisceaux multiples, p.ex. foyers multiples
B23K 26/00 - Travail par rayon laser, p.ex. soudage, découpage ou perçage
B23K 26/062 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser
B23K 26/064 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p.ex lentilles, miroirs ou prismes
Provided is a dicing device that can perform a maintenance task well even when a workpiece is large. This dicing device (10) comprises a housing (52) which accommodates in the interior thereof a work table (12) that holds and moves a workpiece (W) and a spindle (18) that can rotate while holding a blade (14), wherein: the housing (52) has an end surface, which is provided in the movement direction of the work table (12) and which serves as the side of the dicing device (10) that performs the maintenance task, and comprises a slider (54) which constitutes part of the end surface; and the slider (54) is configured to be freely slidable in the direction in which the distance from the end surface to the spindle (18) lessens.
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 55/06 - Equipement d'enlèvement des poussières sur les machines à meuler ou à polir
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
17.
METHOD AND DEVICE FOR ADJUSTING OPTICAL AXIS OF LASER LIGHT
Provided are a method and a device which are for adjusting the optical axis of laser light and are capable of accurately grasping a change in the state of the laser light to maintain the quality of laser processing. This method for adjusting the optical axis of laser light involves: detecting the position of the laser light by means of a position detection sensor disposed at at least two places in the optical path of the laser light output from a laser light source toward a workpiece; and adjusting at least one of the positions or angles of optical elements at at least two places in the optical path of the laser light on the basis of the detected position of the laser light, thereby performing the adjustment of the optical axis of the laser light.
Provided is a laser light correction method capable of accurately performing correction of the positions of a split laser and a line laser. The laser light correction method comprises: a step for performing an edge-cutting process in which, while a laser optical system (14) is moved in a processing feed direction relative to a position-alignment workpiece (W2) of which at least a laser irradiation surface comprises a material that facilitates detection of a laser irradiation mark, a split laser is focused on the laser irradiation surface via the laser optical system to form two parallel lines of first grooves along the processing feed direction, and performing a hollowing-out process for forming a second groove by focusing a line laser on the laser irradiation surface via the laser optical system; a step for detecting the first grooves and the second groove by means of a microscope (20); and a step for correcting the focused positions of the split laser and the line laser on the basis of the result of detection of the first grooves and the second groove.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23K 26/03 - Observation, p.ex. surveillance de la pièce à travailler
B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p.ex. en utilisant la lumière rétrodiffusée
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
Provided is an expanded retaining ring capable of achieving both the retainment of the annular shape of a ring body and the flexibility of a ring-like lip. This expanded retaining ring comprises: a ring body (12); and a ring-like lip (14) which is formed by a softer material than the ring body (12), is capable of being freely detachably mounted on an outer circumferential surface (12A) of the ring body (12), and protrudes toward the outside from the outer circumferential surface (12A) of the ring body (12).
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A processing device that alleviates the influence of rough grinding and performs fine grinding and processes the work with a satisfactory precision. An index table includes a plurality of chucks for holding a work and transports the work to a rough grinding stage with a rough grinding means for rough grinding the work, a medium grinding stage with a medium grinding means for medium grinding the work, and a fine grinding stage with a fine grinding means for fine grinding the work. A first column extends over the index table and one of the rough grinding means or the fine grinding means is installed. A second column extends over the index table and is independent from the first column, and the medium grinding means is installed and the other one of the rough grinding means or the fine grinding means is arranged parallel to the medium grinding means.
B24B 27/00 - Autres machines ou dispositifs à meuler
B24B 7/22 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière des objets non métalliques à meuler pour meuler de la matière inorganique, p.ex. de la pierre, des céramiques, de la porcelaine
B24B 49/00 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage
21.
SURFACE SHAPE MEASUREMENT DEVICE AND SURFACE SHAPE MEASUREMENT METHOD
The present invention provides a surface shape measurement device and a surface shape measurement method which make it possible to reduce errors caused by the effects of vibrations that occur during measurement. This surface shape measurement device for measuring the surface shape of an object to be measured comprises: a first imaging system that captures images of the object to be measured at prescribed imaging intervals while scanning relative to a perpendicular direction with respect to the object to be measured; a second imaging system that is separate from the first imaging system and that images, in synchronization with the first imaging system, the object to be measured or an object supporting the object to be measured; a computation unit that calculates the surface shape of the object to be measured on the basis of a plurality of first captured images captured by the first imaging system; a storage unit that stores coordinate system conversion information for converting a second coordinate system of the second imaging system to a first coordinate system of the first imaging system; a displacement detection unit that, on the basis of a plurality of second captured images captured by the second imaging system, detects displacement of the object to be measured during imaging by the first imaging system; and a correction unit that, on the basis of the coordinate system conversion information and the displacement detection result by the displacement detection unit, corrects the surface shape calculated by the computation unit.
Provided are a three-dimensional shape measuring device and a three-dimensional shape measuring method capable of reducing time and effort for an examiner and capable of easily improving measuring accuracy of a three-dimensional shape of a surface being measured. The three-dimensional shape measuring device comprises: an interference objective lens including an interference unit which splits a portion of measurement light emitted by a light source unit from the measurement light as reference light, and generates a combined light beam of the measurement light returning from the surface being measured and the reference light returning from a reference surface, and an objective lens which condenses the measurement light onto the surface being measured; a scanning unit which causes the interference objective lens to scan relatively in a scanning direction parallel to an optical axis of the objective lens, relative to the surface being measured; an imaging unit which repeatedly images the combined light generated by the interference unit, during the scanning by the scanning unit, and outputs a plurality of captured images containing interference fringes; and a first signal processing unit which calculates a degree of focus of each pixel in the plurality of captured images output from the imaging unit, and calculates a three-dimensional shape of the surface being measured on the basis of a result obtained by comparing the degree of focus of each pixel having the same coordinates in the plurality of captured images.
[Solution] According to the present invention, a shape measurement device, for acquiring a plurality of surface images while scanning a surface of a measurement object 1 that is plate-like, and measuring a shape of the measurement object 1, includes an image-capturing system 10 that irradiates the measurement object 1 by parallel light and acquires surface images, a stage system 30 that holds the measurement object 1 and adjusts an orientation of the measurement object 1 as to the image-capturing system 10, and a control device 20. The control device 20 includes an orientation adjusting unit 21 that controls the image-capturing system 10 and the stage system 30 so as to scan the surface while adjusting the orientation, and acquire the plurality of surface images, and an image processing unit 22 that generates a three-dimensional shape restoration model of the measurement object 1 from the plurality of surface images that are acquired. When acquiring the surface images, the orientation adjusting unit 21 adjusts the orientation such that an incident angle of the parallel light to the surface is within a range that is set in advance. According to this shape measurement device, shape measurement of measurement objects that are plate-like, and in particular even notch portions of wafers that have complicated shapes, can be performed with higher precision.
Provided are a shape measuring device and a shape measuring method capable of reducing errors in a measured shape of a surface to be measured. The shape measuring device comprises: a relative movement unit (14) for scanning measurement light (LA) over a surface to be measured (W), by causing a probe (24) to move relatively along the surface to be measured (W); a detecting unit (light detector (28)) for repeatedly detecting combined light (LC) generated by a light combining unit (beam splitter (22)), for each of a plurality of measurement points (Pm) on the surface to be measured (W) on which the measurement light (LA) is incident, during the relative movement; a distance calculating unit (32) for detecting a beat frequency from a detection signal (29) of the combined light (LC) detected by the detecting unit for each measurement point (Pm), and calculating a distance from the probe (24) to the measurement point (Pm) on the basis of the beat frequency; a position calculating unit (34) for calculating a position of each measurement point (Pm); and a position adjusting unit (38) for adjusting the position of the measurement point (Pm) on the basis of a Doppler shift amount (fd) of the measurement light (LA) reflected by the measurement point (Pm), for each measurement point (Pm).
An image processing device acquires a plurality of images of an object to be measured by an imaging device, the plurality of images being taken while varying a focal position, and corrects blurring in the acquired plurality of images based on a point spread function for each focal position of an image forming optical system in the imaging device. The image processing device also calculates, for the plurality of images after correction of the blurring, an evaluation value for a focusing degree for each pixel, and generates three-dimensional shape data of the object to be measured based on the calculated evaluation value for the focusing degree for each pixel.
H04N 23/67 - Commande de la mise au point basée sur les signaux électroniques du capteur d'image
G06T 17/00 - Modélisation tridimensionnelle [3D] pour infographie
G06T 5/10 - Amélioration ou restauration d'image en utilisant le filtrage dans le domaine non spatial
G06T 7/62 - Analyse des attributs géométriques de la superficie, du périmètre, du diamètre ou du volume
G06V 10/60 - Extraction de caractéristiques d’images ou de vidéos relative aux propriétés luminescentes, p.ex. utilisant un modèle de réflectance ou d’éclairage
26.
LASER MACHINING APPARATUS AND LASER MACHINING METHOD
A branching element configured to branch a second laser light into a plurality of beams of branch light along a machining feed direction, and a second condenser lens configured to focus the plurality of beams of branch light branched by a branching element onto a street to be machined are provided, and a time period τ is expressed as τ=L/V, where L is a branch distance, which corresponds to spacing between adjacent leading and trailing spots for each of branch lights focused on the street by the second condenser lens, V is a machining speed, which corresponds to a speed of relative movement, and τ is the time period taken until the trailing spot overlaps a machining position of the leading spot, and τ>τ1 is satisfied, where τ1 is a threshold value of the time period when deterioration of the machining quality of the second groove occurs.
B23K 26/067 - Division du faisceau en faisceaux multiples, p.ex. foyers multiples
B23K 26/0622 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/06 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples
B23K 26/073 - Détermination de la configuration du spot laser
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
A first objective of the present invention is to provide a three-dimensional shape measuring device and a three-dimensional shape measuring device reference surface position adjustment method with which a measurement optical path length and a reference optical path length are matched with a high degree of accuracy at low cost, regardless of an installation environment temperature, and a second objective is to provide a three-dimensional shape measuring device and a three-dimensional shape measuring device measurement mode switching method capable of switching between three-dimensional shape measurement of a surface to be measured by means of white light interferometry (WFI) and three-dimensional shape measurement of the surface to be measured by means of focus variation (FV). In order to achieve the first objective, a three-dimensional shape measuring device is provided with a holder (24) for changing a reference optical path length in accordance with a change in temperature, and a temperature adjusting unit (26) for adjusting a temperature of the holder (24) to a target temperature. In order to achieve the second objective, the three-dimensional shape measuring device is provided with the temperature adjusting unit (26) for adjusting the temperature of the holder (24), and a temperature control unit (100) which controls the temperature adjusting unit (26), and which is capable of switching selectively between a first measurement mode in which the reference optical path length is matched to the measurement optical path length, and a second measurement mode in which the reference optical path length is made to differ from the measurement optical path length.
Provided is a shape measuring device adjustment method with which it is possible for adjustments to a white-light interference microscope to be carried out easily. This adjustment method for a shape measuring device which emits light from a light source as measurement light and reference light onto an adjustment master and a reference surface respectively, and measures the shape of a surface to be measured of an object being measured, using combined light of the measurement light and the reference light reflected respectively by the adjustment master and the reference surface, includes: a step for measuring the adjustment master in an adjusted state in which a focus position and an interference position match, and calculating and saving a matching degree parameter indicating a degree of matching between the focus position and the interference position as a matching degree parameter when adjusted; and, when measuring the object being measured, a step for measuring the adjustment master, calculating the matching degree parameter, and comparing the matching degree parameter and the matching degree parameter when adjusted, to check the degree of matching.
Provided is a surface shape measurement device and a surface shape measurement method with which it is possible to minimize the effect due to vibration produced during measurement and increase the measurement accuracy. This surface shape measurement device for acquiring an observation image of an object to be measured while scanning an optical head vertically relative to the object to be measured comprises: a camera for imaging an observation image acquired by the optical head; a drive unit for scanning the optical head vertically relative to the object to be measured; an encoder for calculating the scan-direction position of the optical head relative to the object to be measured; an imaging command unit for commanding the camera to image an observation image on the basis of a position signal outputted at prescribed intervals from the encoder; a frame-drop occurrence rate calculation unit for calculating the frame-drop occurrence rate indicating the rate at which frame-drop occurs in the camera; and a measurement-condition-setting unit for setting, on the basis of the frame-drop occurrence rate, a measurement condition for measuring the surface shape of the object to be measured.
Provided is an auto balancer that is shorter in an axial direction of an axis of rotation than in the past. This auto balancer comprises a balance head which rotates integrally with a rotating body about an axis of rotation of the rotating body, and which includes an electric-powered balance correcting mechanism for correcting unbalance of the rotating body and a case that has a cylindrical outer circumferential surface parallel to the axis of rotation and that accommodates the balance correcting mechanism, a stator which is provided separately from the balance head, has a shape that follows a circumferential direction of the outer circumferential surface, spaced apart from the outer circumferential surface across a gap, and is electrically connected to a controller of the balance head, and a rotor unit which is provided in a position facing the stator on the outer circumferential surface, rotates integrally with the balance head, has a shape that follows the circumferential direction of the outer circumferential surface, and is electrically connected to the balance correcting mechanism, wherein wireless transmission is possible between the stator and a rotor.
A processing device and method for safely processing a wafer having bumps formed on a surface thereof. A processing device is provided with: a chuck capable of holding a bump region of a wafer; a support ring having a support surface for supporting a bend region which extends from the bump region to an outer peripheral region and in which a film is bent, the support ring capable of supporting the outer peripheral region of the wafer; and a chuck table in which the chuck is housed substantially centrally and the support ring is housed around the chuck.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p.ex. mandrins, pièces de serrage, pinces
32.
WAFER TEST SYSTEM, METHOD FOR REPLACING PROBE CARD, AND PROBER
Provided are a wafer test system, a method for replacing a probe card, and a prober that make it possible to automate the replacing of a probe card inexpensively while minimizing any increase in installation space. The invention comprises: a prober providing a chuck for holding a semiconductor wafer, and a probe card having a probe needle, the prober being configured to inspect a plurality of semiconductor chips formed on the semiconductor wafer by bringing the probe needle into contact with the semiconductor chips; an overhead traveling unmanned carrier configured to load a cassette accommodating a plurality of uninspected semiconductor wafers into the prober and to retrieve a cassette accommodating a plurality of inspected semiconductor wafers from the prober; a carrying control unit that controls the overhead traveling unmanned carrier to carry probe cards between a predetermined probe card replacement position in the prober and a probe card storage location in a separate location from the prober; and a card-carrying mechanism for carrying the probe card between a holding position and the replacement position in the prober.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
Provided is a cost- and space-saving chiller system that has high-withstand-voltage performance. A chiller system (1) is provided with an internal circulation pathway (C1), an external circulation pathway (C2), and a control device (40). Provided to the internal circulation pathway (C1) are a refrigerant tank (17), an internal circulation pump (11), and a refrigerator (12). The external circulation pathway (C2) has a feeding pathway (20) and a return pathway (25). An external circulation pump (21) and a temperature sensor (23) are provided to the feeding pathway (20). A throttling means (28) is provided to a communication pathway creating communication between the return pathway (25) and the refrigerant tank (17). An on-off control valve (16) is provided to the internal circulation pathway (C1), and a pressurization pathway (30) has one end connected further upstream than the on-off control valve (16) in the internal circulation pathway (C1) and another end connected further upstream than the throttling means (28) in the communication pathway. The control device (40) controls operation of the on-off control valve (16) on the basis of a measurement result of the temperature sensor (23).
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines and their parts and
fittings; machines for detecting defective products for
semiconductor manufacturing machines and systems;
positioning devices for semiconductor manufacturing machines
and their parts. Measuring or testing machines and instruments; electronic
testing apparatus for use in the field of manufacturing of
semiconductors and their component parts and fittings;
semiconductor testing machines and their component parts and
fittings; computers; computer software that visualizes and
displays the collected data; computer software for data
analysis.
Provided are a housing for a prober and a prober to which the housing is applied, which can effectively reduce the influence of vibrations generated at each level without lowering inspection throughput. A housing (1) for a prober having a multilevel structure in which a plurality of measurement units (30) is stacked in multiple stages includes floor bases (10) that constitute a floor surface at each level of the multilevel structure, and side frame bodies (20) each being disposed between the floor base (10) at one level among the plurality of levels and the floor base (10) at another level positioned above the one level, and being positioned at both sides of the measurement unit (30), wherein the side frame body (20) has a first side frame (21) that is erected at the floor base (10) at the one level and supports the lower surface side of the floor base at the other level, and a second side frame (22) that is erected at the floor base (10) at the one level at a position different from that of the first side frame (21) and supports a measurement unit constituent member disposed in the measurement unit (30).
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines and their parts and fittings; machines for detecting defective products for semiconductor manufacturing machines and systems; positioning devices for semiconductor manufacturing machines and their parts Measuring or testing machines and instruments; electronic testing apparatus for use in the field of manufacturing of semiconductors and their component parts and fittings; semiconductor testing machines and their component parts and fittings; computers; computer software that visualizes and displays the collected data; computer software for data analysis
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines and their parts and fittings; machines for detecting defective products for semiconductor manufacturing machines and systems; positioning devices for semiconductor manufacturing machines and their parts Measuring or testing machines and instruments; electronic testing apparatus for use in the field of manufacturing of semiconductors and their component parts and fittings; semiconductor testing machines and their component parts and fittings; computers; computer software that visualizes and displays the collected data; computer software for data analysis
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines and their parts and fittings; machines for detecting defective products for semiconductor manufacturing machines and systems; positioning devices for semiconductor manufacturing machines and their parts. Measuring or testing machines and instruments; electronic testing apparatus for use in the field of manufacturing of semiconductors and their component parts and fittings; semiconductor testing machines and their component parts and fittings; computers; computer software that visualizes and displays the collected data; computer software for data analysis.
39.
LASER MACHINING DEVICE, WAFER PROCESSING SYSTEM, AND METHOD FOR CONTROLLING LASER MACHINING DEVICE
The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.
A spherical aberration adjustment method for an objective optical system having an objective lens, and a diopter adjusting optical system arranged on an opposite side of a medium with respect to the objective lens, including changing an emittance or convergence of a luminous flux of laser light by the diopter adjusting optical system, and changing a depth of a focal point inside the medium with a diffraction limit of the objective optical system kept.
G02B 27/00 - Systèmes ou appareils optiques non prévus dans aucun des groupes ,
G02B 15/14 - Objectifs optiques avec moyens de faire varier le grossissement par déplacement axial d'au moins une lentille ou de groupes de lentilles relativement au plan de l'image afin de faire varier de façon continue la distance focale équivalente de l'objectif
An optical system that relays light to a machining lens to be used for machining on a workpiece includes a spatial light modulator and a second lens arranged between the spatial light modulator and the machining lens, a distance D from the second lens to a machining lens pupil is D = f2 - Mf2, and a distance D1 from the spatial light modulator to the second lens is D1 = f2 - f2/M, and the spatial light modulator has a conjugate relation with the machining lens pupil of the machining lens, where f2 is a focal length of the second lens, and M is a projection magnification from the spatial light modulator to the machining lens pupil of the machining lens.
[Problem] To provide a workpiece processing apparatus in which a decline in the processing capability of the processing apparatus due to a peeling unit for peeling a protection sheet from a workpiece is suppressed. [Solution] A workpiece processing apparatus 1 comprises an affixing unit 2 for affixing a dicing tape DT to a workpiece W and to a dicing frame DF, and a plurality of peeling units 3 for peeling a protection sheet S previously affixed to the workpiece W that has been integrated with the dicing frame DF with the dicing tape DT therebetween.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
[Problem] To provide a sheet release apparatus for stably releasing a protective sheet from an adherend without damaging the adherend. [Solution] This sheet release apparatus 1 comprises a transport table 2 that holds a workpiece W and that can move in a prescribed movement direction, and a heat stamp 41 for bonding a release tape T to a protective sheet S, the heat stamp 41 being provided with a plurality of stamp heads 43, 44, 45 for respectively contacting the release tape T and pressing the release tape T toward the protective sheet S.
B65H 41/00 - Machines pour séparer des bandes superposées
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
44.
SHAPE MEASUREMENT DEVICE AND METHOD FOR CONTROLLING SAME
A shape measurement device includes: a displacement detector configured to detect displacement of a contact; a relative movement mechanism configured to relatively move the displacement detector with respect to the measurement object, and allow the contact to trace a surface to be measured of the measurement object; a position detecting sensor configured to detect a relative position of the displacement detector with respect to the measurement object; a camera configured to image the contact, and output a captured image of the contact; and a synchronization controller configured to repetitively execute three actions in synchronization together while the relative movement is being performed by the relative movement mechanism, the actions including detection of the relative position by the position detecting sensor, detection of the displacement by the displacement detector, and imaging by the camera.
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p.ex. des franges de moiré, sur l'objet
A measurement device includes: a probe part including a probe configured to measure a surface of an object to be measured and is attached so as to swing around a swing center according to a shape of the surface of the object to be measured; a scale configured to measure displacement by swinging of the probe part; a scale head configured to read a scale mark of the scale; and an arm part to which the probe part is attached, the arm part is attached so as to swing around the swing center integrally with the probe part, and the scale is attached to the arm part. When thermal expansion coefficients of the probe part, the arm part and the scale are α, β and γ respectively, the measurement device satisfies a condition of (α+γ)−1/2α≤β≤(α+γ)+1/2α.
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
G01B 3/00 - Instruments de mesure caractérisés par l'utilisation de techniques mécaniques
G01B 3/56 - Calibres pour mesurer des angles ou des conicités, p.ex. compas à calibrer conique
G01B 5/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer une distance ou une marge entre des objets ou des ouvertures espacés
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
46.
Inner surface shape measurement device, and alignment method for inner surface shape measurement device
The following are observed using a camera: a first position of a small hole of a workpiece, which is fixed to a linear-and-tilting-motion stage and rotating with a rotating body, and a second position thereof different from the first position, at a first rotation angle of the rotating body; and the first position and the second position of the small hole of the workpiece at a second rotation angle different from the first rotation angle of the rotating body. A position and a tilt of the small hole are calculated from coordinates of the respective observed positions, and small hole information, which includes the position and the tilt of the small hole, is outputted.
The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.
G01B 11/12 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des diamètres des diamètres intérieurs
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01B 21/04 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la longueur, la largeur ou l'épaisseur en mesurant les coordonnées de points
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
48.
PROBER CONTROL DEVICE, PROBER CONTROL METHOD, AND PROBER
Provided are a prober control device, a prober control method, and a prober that enable more accurate prediction of the position of a probe needle tip. The prober control device for bringing a probe needle into contact with a semiconductor chip comprises: an input data acquisition unit that acquires input data including temperature data of a probe card and/or a card holder; a prediction unit that, on the basis of the input data acquired by the input data acquisition unit, predicts the position of a probe needle tip by using a prediction model that takes the input data as input and outputs the probe needle tip position; and a determination unit that, prior to the prediction by the prediction unit, determines whether the prediction unit is to execute prediction on the basis of input data used as training data in machine learning of the prediction model, and the input data acquired by the input data acquisition unit.
A dicing device includes: a workpiece table; a cutting unit including a blade and a spindle; an XY-direction drive unit; a Z-direction drive unit; a first measuring instrument for measuring a Z-direction position of a surface of a workpiece held on a holding surface of the workpiece table; a second measuring instrument for measuring a Z-direction displacement of the holding surface; a correction amount calculation unit for calculating a correction amount for the Z-direction position of the cutting unit based on a table displacement map showing the Z-direction displacement at each position on the holding surface, the Z-direction displacement having been measured in advance by the second measuring instrument and based on the Z-direction position of the surface of the workpiece, measured by the first measuring instrument; and a control unit for controlling, when the workpiece is cut by a blade, the Z-direction drive unit based on the correction amount.
B26D 3/22 - Coupe d'une pièce caractérisée par la nature de la coupe; Appareillage à cet effet pour obtenir des dés ou des éléments similaires à l'aide de couteaux rotatifs
B26D 1/18 - Coupe d'une pièce caractérisée par la nature ou par le mouvement de l'élément coupant; Appareils ou machines à cet effet; Eléments coupants à cet effet comportant un élément qui ne suit pas le mouvement de la pièce ayant un élément coupant se déplaçant autour d'un axe avec un élément circulaire, p.ex. un disque tournant autour d'un axe mobile monté sur un chariot mobile
B26D 5/00 - Dispositions pour manœuvrer et commander les machines ou les dispositifs de coupe, découpage, poinçonnage, perforation ou séparation autrement que par coupe
50.
Workpiece diameter measurement method and workpiece circularity measurement machine
A workpiece diameter measurement method includes: detecting positions of a probe while relatively rotating an uncalibrated standard and a detector around a rotation center in a state where the probe is in contact with a circumferential face of the standard from one side in a displacement direction of the probe, detecting the positions of the probe while relatively rotating the standard and the detector around the rotation center in a state where the probe is in contact with the circumferential face from another side in the displacement direction, calculating the position of the rotation center based on the detected positions, relatively rotating a workpiece and the detector around the rotation center in a state where the probe is in contact with the workpiece from the other side, and calculating a diameter of a circumferential face of the workpiece.
[Problem] To provide a workpiece holding device with which it is possible to precisely process a workpiece. [Solution] A holding unit 3 in a processing apparatus 1 is a workpiece holding device that rotatably holds a workpiece W being processed using a grindstone 21, the workpiece holding device comprising: a base 34; a chuck 33 composed of a material exhibiting a lower thermal expansion coefficient than the base 34, the chuck 33 being disposed on the base 34 and being capable of holding the workpiece W by chucking; and a clamp member 40 attached to the base 34 with gaps G1, G2 between the clamp member 40 and the chuck 33 in the diameter direction D of the base 34, the clamp member 40 pressing a flange 36a of the chuck 33 toward the base 34.
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
[Problem] To provide a processing apparatus that flattens a workpiece so as to have a desired thickness. [Solution] A processing apparatus 1 flattens a non-circular shape workpiece W with a grinding stone 21 and is provided with: a suction member 33 capable of suction-holding the workpiece W; and an attachment 37 that is provided on the outer peripheral side of the suction member 33, is formed from a material harder to grind than the suction member 33, and can be in contact with the grinding stone 21 during self-grinding for grinding the suction member 33.
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
55.
CLEANING DEVICE FOR WAFER-SUCTIONING CHUCK STRUCTURE
[Problem] To provide a cleaning device for a wafer-suctioning chuck structure, said device being able to automatically and simply perform a cleaning process on a chuck surface for suctioning and holding a wafer and a cleaning process on a frame suctioning and holding part. [Solution] A cleaning device is configured so as to comprise: a scraper 17 and flange 18 that press a frame suction holder cleaning means 10B for removing sludge on a frame suction holder 11B on the frame suction holder 11B; and a water nozzle 19 for discharging and supplying water on the frame suction holder 11B.
[Problem] To provide a cleaning device for a wafer back surface, said device preventing the re-adhesion of contaminants and the like to the rear surface of a wafer W during and after cleaning. [Solution] This cleaning device for a wafer back surface comprises: a hand H1 that receives a wafer W that has been cleaned at a cleaning position, and transports the wafer W to the next process; a hand H2 that transports the pre-polished wafer W to a cleaning position, and hands the cleaned wafer W over to the hand H1 with the front surface of the wafer at the top side; and a cleaning pad 13 that is positioned at the cleaning position, and a cleaning water supply nozzle 14 that supplies cleaning water to the cleaning pad 13 and discharges the cleaning water on the back surface of the wafer W. The hand H2 performs a scrub cleaning process on the wafer back surface by bringing the back surface of the wafer W, which has been transported to the cleaning position, into contact with the cleaning pad 13, and after being scrub cleaned, the wafer back surface receives discharged cleaning water from the cleaning water supply nozzle 14 to undergo a rinse cleaning process, and then the wafer W is handed over to the hand H1.
B08B 1/04 - Nettoyage par des procédés impliquant l'utilisation d'outils, de brosses ou d'éléments analogues utilisant des éléments actifs rotatifs
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is a calibration method for an optical rotation probe, whereby the emission direction of measurement light emitted from the optical rotation probe can be calibrated with high accuracy. The calibration method comprises: a changing step in which the emission direction of the measurement light emitted from the optical rotation probe is changed by a minute angle Δs from a preset reference direction; an acquisition step in which, after the changing step is performed, a shape error of a reference object is acquired by emitting the measurement light from the optical rotation probe toward the reference object while changing the relative positions of the optical rotation probe and the reference object while rotating the emission direction of the measurement light about an S axis; and an adjustment error calculation step in which an adjustment error of the emission direction of the measurement light with respect to the reference direction is calculated on the basis of a theoretical value of the shape error of the reference object and the measurement value, obtained in the acquisition step, of the shape error of the reference object, wherein the theoretical value is obtained when the emission direction of the measurement light coincides with the reference direction.
[Problem] To provide a processing system that can process a workpiece with good precision. [Solution] A processing system 1 is configured so as to comprise: a tilting device that can tilt a rotational axis 3a of a chuck 3 retaining a workpiece W; a film thickness measurement device 7 that measures, in a contactless manner, the film thickness of the workpiece W after fine grinding; and a control device 8 that computes the shape of the post-fine grinding workpiece W on the basis of the measured value from the film thickness measurement device 7, calculates a tilt angle of the tilting device such that the difference between the maximum thickness and the minimum thickness in the post-fine grinding workpiece W will be reduced, and causes the chuck 3 to be tilted by said tilt angle, wherein the post-fine grinding workpiece W is reprocessed, in the order of rough grinding, intermediate grinding, and then fine grinding, while the chuck 3 is in the condition of being tilted by said tilt angle.
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
Provided are a particle measurement device, a three-dimensional shape measurement device, a prober device, a particle measurement system, and a particle measurement method with which it is possible to manage the particle generation amount. This particle measurement device comprises: an acquisition unit (252) for acquiring pad surface shape data indicating the surface shape of an electrode pad (P) including a probe needle mark resulting from a probe needle (141) contacting the electrode pad (P); a detection unit (253) for detecting a pad reference surface (R), which is a reference for particle measurement, on the basis of the pad surface shape data; a recess and projection calculation unit (254) for calculating, on the basis of the pad surface shape data, the volume (VMR) of recesses that are recessed from the pad reference surface (R) and the volume (VMP) of projections that project from the pad reference surface (R) in the surface shape of the electrode pad (P); and a particle generation amount calculation unit (255) for calculating a particle generation amount from a volume difference between the volume (VMR) of the recesses and the volume (VMP) of the projections.
When an index table is installed on a rotary table in a surface shape measuring device, deterioration in measurement accuracy can be suppressed. The surface shape measuring device includes: a rotary table which is configured to place a workpiece thereon and to be freely rotatable around a rotation center axis; and a detector configured to detect a displacement of a probe brought into contact with the workpiece. The rotary table has a centering mechanism configured to align a center axis of the workpiece and the rotation center axis. An index table freely detachably mounted on the rotary table is provided, the index table configured so as to be able to perform indexing along a first axis and a second axis which are perpendicular to the rotation center axis. Eccentric load cancelling means configured to cancel an eccentric load caused by the indexing of the index table is provided.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 3/00 - Instruments de mesure caractérisés par l'utilisation de techniques mécaniques
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
G01B 5/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour tester l'alignement des axes pour tester l'alignement des axes
[Problem] To provide a tape affixing apparatus and a tape magazine capable of automatically switching and replacing dicing tape. [Solution] A tape affixing apparatus 3 is equipped with: a base 31 where a tape magazine 4 for storing dicing tape DT in a state where part of the dicing tape DT wound in a roll shape is drawn out is installed in a replaceable manner; and movable guide rollers 32a, 32b, fixed guide rollers 33a, 33b and a knife plate 35 that can move so as to restrict a draw-out area R where part of the dicing tape DT is drawn out to a predetermined track.
B65H 19/12 - Levage, transport ou insertion de la bobine; Enlèvement du noyau vide
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
[Problem] To provide a tape adhesion system capable of automatically carrying out switching and replacing of a dicing tape. [Solution] A tape adhesion system 1 comprising: a stocker 5 that stores a plurality of tape magazines 4 which each accommodate a dicing tape DT wound into a roll; an adhesion device 3 that is provided with movable guide rollers 32a, 32b which restrict a reel-out region R of the dicing tape DT to a prescribed track, fixed guide rollers 33a, 33b, and a knife plate 35, and adheres the dicing tape DT to a dicing frame DF and a workpiece W in a manner that allows replacement of the tape magazines 4; and a first conveyance robot 6 that passes the tape magazines 4 back and forth between the stocker 5 and the adhesion device 3.
B65H 19/12 - Levage, transport ou insertion de la bobine; Enlèvement du noyau vide
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
09 - Appareils et instruments scientifiques et électriques
Produits et services
Measuring or testing machines and instruments, namely, instruments for measuring dimensions and diameter of metal workpieces and other workpieces while being processed; measuring heads being probes for measuring instruments for measuring dimensions and diameter of metal workpieces and other workpieces while being processed; inner diameter measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed; outer diameter measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed; end face measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed; thickness measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed
09 - Appareils et instruments scientifiques et électriques
Produits et services
Measuring or testing machines and instruments, namely, instruments for measuring dimensions and diameter of metal workpieces and other workpieces while being processed; measuring heads being probes for measuring instruments for measuring dimensions and diameter of metal workpieces and other workpieces while being processed; inner diameter measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed; outer diameter measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed; end face measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed; thickness measuring heads, namely, measuring heads being probes for measuring instruments for measuring dimensions of metal workpieces and other workpieces while being processed
65.
TEMPERATURE CONTROL DEVICE FOR SEMICONDUCTOR WAFER AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR WAFER
A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
[Problem] To provide a tape-affixing device that affixes dicing tape to a workpiece and a dicing frame with appropriate tensile force. [Solution] A tape-affixing device 1 affixes dicing tape DT to a workpiece W and a dicing frame DF along an affixing direction D1. The tape-affixing device 1 comprises: a pressing roller 34 that presses the dicing tape DT to the workpiece W and the dicing frame DF; and a support pin 4 that stretches the dicing tape DT in a width direction D2.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
67.
DEVICE AND METHOD FOR DETECTING TENSION ABNORMALITY IN DICING TAPE
[Problem] To provide a device and method for detecting tension abnormality in dicing tape in which it is possible to accurately detect any tension abnormality in dicing tape by quantitatively evaluating the suitability of dicing tape tension. [Solution] This device for detecting tension abnormality 4 comprises: an air micrometer 41 that, on the basis of the displacement of dicing tape DT when air is blown at a measurement point P of the dicing tape DT at which a workpiece W has not been affixed, measures the tension of the dicing tape DT at the measurement point P; and an evaluation unit (42) for evaluating that the tension of the dicing tape (DT) is appropriate when the tension of the dicing tape (DT) at the measurement point (P) is within a predetermined appropriate range for the tension of the dicing tape (DT), and evaluating that the tension of the dicing tape (DT) is abnormal when the tension of the dicing tape (DT) at the measurement point (P) is not within the appropriate range.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
68.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method which can both maintain the processing quality of a processed groove and prevent an increase in tact time. The present invention comprises: a branching element which branches second laser light into a plurality of branched light along a processing feed direction; and a second condenser lens which condenses the plurality of branched light branched by the branching element into a street to be processed, wherein, when defining a branching distance as L, which is the interval between a mutually adjacent preceding spot and following spot in spots for each branched light condensed onto the street by the second condenser lens, the processing speed as V, which is the speed of relative movement, and the time until the following spot overlaps a processing position of the preceding spot as τ, time is expressed by τ=L/V, and when the threshold value of a time at which a worsening of the processing quality of the second groove occurs is defined as τ1, τ>τ1 is satisfied.
B23K 26/067 - Division du faisceau en faisceaux multiples, p.ex. foyers multiples
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
[Problem] To provide a flycutting device for safely processing a workpiece having bumps formed on a surface thereof. [Solution] This flycutting device 1 cuts an upper surface 75c of a BG film 75 affixed to a workpiece 7 that includes a bump region 73 in which bumps 71 are formed on a surface 72 and an outer peripheral region 74 surrounding the bump region 73, wherein: the flycutting device 1 comprises a flycutting tool 21, a tool spindle 22 in which the flycutting tool 21 is attached to the lower end thereof and which can be raised and lowered in a state in which the flycutting tool 21 is rotated, and a chuck 3 that holds the workpiece 7 in a rotatable manner; and the flycutting tool 21 cuts the upper surface 75c of the BG film 75 from the center toward the outer periphery.
B23D 5/00 - Machines à raboter ou à mortaiser taillant autrement que par déplacement relatif de l'outil et de la pièce à usiner selon une ligne droite
B23Q 11/10 - Dispositions pour le refroidissement ou la lubrification des outils ou des pièces travaillées
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
B23Q 17/20 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer les caractéristiques de la pièce, p.ex. contour, dimensions, dureté
70.
LASER MACHINING DEVICE, WAFER PROCESSING SYSTEM, AND METHOD FOR CONTROLLING LASER MACHINING DEVICE
duringmachinedmachined groove; and a machined state assessment unit that assesses the machined state by referring to the correspondence information on the basis of the luminance and the known energy of the laser light, each time the luminance detection unit detects the luminance.
B23K 26/00 - Travail par rayon laser, p.ex. soudage, découpage ou perçage
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p.ex. pour tracer une rainure d'amorce de rupture
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines and systems; machines
for detecting defective products for semiconductor
manufacturing machines and systems. Electronic testing apparatus for use in the field of
manufacturing of semiconductors and their component parts
and fittings; semiconductor testing machines and their
component parts and fittings.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines and systems; machines
for detecting defective products for semiconductor
manufacturing machines and systems. Electronic testing apparatus for use in the field of
manufacturing of semiconductors and their component parts
and fittings; semiconductor testing machines and their
component parts and fittings.
[Problem] To provide a processing device and method for safely processing a wafer having bumps formed on a surface thereof. [Solution] A processing device 10 is provided with: a chuck 40 capable of holding a bump region 24 of a wafer 20; a support ring 30 having a support surface 32 for supporting a bend region 26 which extends from the bump region 24 to an outer peripheral region 25 and in which a film 20 is bent, the support ring 30 capable of supporting the outer peripheral region 25 of the wafer 20; and a chuck table 16 in which the chuck 40 is housed substantially centrally and the support ring 30 is housed around the chuck 40.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
74.
SHAPE MEASUREMENT DEVICE AND METHOD FOR CONTROLLING SAME
Provided are a shape measurement device which can easily detect the cause of occurrence of an abnormality in measuring the shape of a measurement target, and a method for controlling the same. The invention involves: a displacement detection device for detecting a displacement of a contactor; a relative movement mechanism for relatively moving the displacement detection device with respect to a measurement target to allow the contactor to trace a surface to be measured of the measurement target; a position detection sensor for detecting a relative position of the displacement detection device with respect to the measurement target; a camera for capturing an image of the contactor and outputting the image of the contactor; and a synchronization control unit for allowing three operations to synchronize with one another and to be repeatedly carried out while the relative movement by the relative movement mechanism is performed, the three operations comprising detecting the relative position by the position detection sensor, detecting the displacement by the displacement detection device, and capturing an image by the camera.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
G01B 21/30 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la rugosité ou l'irrégularité des surfaces
Provided is a measurement device capable of suppressing the influence of the ambient temperature on measurement results. This measurement device (10, 10-1, 10-2) comprises a probe part (14) that is provided with a probe (12) for measuring the surface of an object under measurement and is attached so as to be capable of oscillating around an oscillation center according to the shape of the surface of the object under measurement, a scale for measuring displacement resulting from the oscillation of the probe part, a scale head (26) for reading the scale marks of the scale, and an arm part (16) that the probe part and scale are attached to and is attached so as to be capable of oscillating around the oscillation center integrally with the probe part. The condition (α + γ) – 1/2α ≤ β ≤ (α + γ) + 1/2α is satisfied, where α, β, and γ are the thermal expansion coefficients of the probe part, arm part, and scale, respectively.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 21/30 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la rugosité ou l'irrégularité des surfaces
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines Electronic testing apparatus for use in the field of manufacturing of semiconductors and their component parts and fittings, namely, probes for testing semiconductors; semiconductor testing apparatus and their component parts and fittings
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines Electronic testing apparatus for use in the field of manufacturing of semiconductors and their component parts and fittings, namely, probes for testing semiconductors; semiconductor testing apparatus and their component parts and fittings
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Custom manufacture of semiconductor manufacturing machines
and systems for others; custom manufacture of measuring and
testing machines and instruments for others; custom
manufacture of semiconductor elements for others; custom
manufacture of electronic circuits, not including those
recorded with computer programs for others; rental of
semiconductor manufacturing machines and systems; removal of
radiation rays; treatment or processing of cloth, clothing
or fur, including drying; tailoring or dressmaking;
embroidery [embroidering]; metal treating; processing of
rubber; processing of plastics; ceramic processing;
woodworking; paper treating and working; stone treating;
taxidermy; processing of bamboo, tree barks, rattan, vines
or other mineral vegetable materials (other than processing
of ingredients); food processing; processing of artificial
limbs or dental prostheses, including processing of medical
materials; processing of cinematographic films; photographic
enlarging; photographic printing; photographic film
development; bookbinding; water treating; recycling of waste
and trash; nuclear fuel reprocessing; engraving of sealing
stamps; photogravure; rental of textile machines and
apparatus; rental of machines and apparatus for film
development, photograph printing, photograph enlargement or
photograph finishing; rental of metal treating machines and
tools; rental of bookbinding machines; rental of machines
and apparatus for processing foods or beverages; rental of
machines and apparatus for lumbering, wood-working, or
veneering or plywood making; rental of machines and
apparatus for pulp-making, papermaking or paper-working;
rental of water purifying apparatus; rental of waste
compacting machines and apparatus; rental of waste crushing
machines; rental of chemical processing machines and
apparatus; rental of glassware manufacturing machines and
apparatus; rental of shoe making machines; rental of tobacco
processing machines; providing material treatment
information; printing; sorting and disposal of waste and
trash; rental of knitting machines; rental of sewing
machines; rental of printing machines and apparatus. Design or development of semiconductor manufacturing
machines and systems; advisory services relating to design
or development of semiconductor manufacturing machines and
systems; design or development of measuring and testing
machines and instruments; advisory services relating to
design or development of measuring and testing machines and
instruments; testing, inspection or research of
semi-conductor chips for others; calibration of machines,
apparatus, instruments and parts thereof for others;
providing meteorological information; architectural design;
surveying; geological surveys or research; designing of
machines, apparatus, instruments [including their parts] or
systems composed of such machines, apparatus and
instruments; design services; computer software design,
computer programming, or maintenance of computer software;
creating or maintaining web sites for others; technological
advice relating to computers, automobiles and industrial
machines; testing, inspection or research of
pharmaceuticals, cosmetics or foodstuffs; research on
building construction or city planning; testing or research
on prevention of pollution; testing or research on
electricity; testing or research on civil engineering;
testing, inspection or research on agriculture, livestock
breeding or fisheries; testing or research on machines,
apparatus and instruments; rental of measuring apparatus;
rental of computers; providing computer programs on data
networks; rental of laboratory apparatus and instruments;
rental of technical drawing instruments; rental of measuring
and testing machines and instruments.
79.
Three-dimensional measuring system, and three-dimensional measuring method
The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.
G06F 17/00 - TRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des fonctions spécifiques
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
B25J 13/08 - Commandes pour manipulateurs au moyens de dispositifs sensibles, p.ex. à la vue ou au toucher
B25J 19/00 - Accessoires adaptés aux manipulateurs, p.ex. pour contrôler, pour observer; Dispositifs de sécurité combinés avec les manipulateurs ou spécialement conçus pour être utilisés en association avec ces manipulateurs
G01B 5/008 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer les coordonnées de points en utilisant des machines de mesure de coordonnées
80.
INNER SURFACE SHAPE MEASUREMENT DEVICE, ALIGNMENT METHOD FOR INNER SURFACE SHAPE MEASUREMENT DEVICE, AND MAGNIFICATION CALIBRATION METHOD
Provided are an inner surface shape measurement device which can properly align the position of a probe, and an alignment method for the inner surface shape measurement device. This inner surface shape measurement device is for measuring an inner surface shape of a small hole H formed in a workpiece W, the device comprising: a rotary body 16 and a direct acting tilt stage 18 for rotating the workpiece W about a rotation axis; an elongated probe 30 which can be inserted into the small hole H of the workpiece; a probe direct acting tilt mechanism 28 which can adjust the orientation of the probe; a camera 32 which is configured to be rotatable integrally with the rotary body 16 and captures an image of the probe 30 from at least three circumferential positions on a rotation trajectory about a rotation axis C; and a control device 50 for adjusting the orientation of the probe through the probe direct acting tilt mechanism 28 on the basis of a captured image captured by the camera 32 at each of the circumferential positions.
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
81.
INNER SURFACE SHAPE MEASUREMENT APPARATUS, AND ALIGNMENT METHOD FOR INNER SURFACE SHAPE MEASUREMENT APPARATUS
Provided are an inner surface shape measurement apparatus that suitably aligns the positions of holes, and an alignment method for the inner surface shape measurement apparatus. A first position of a fine hole in a workpiece that is fixed to a direct-acting inclining stage at a first rotational angle of a rotating body and rotates together with the rotating body, and a second position different from the first position, are observed by a camera, and a first position and a second position of the fine hole in the workpiece at a second rotational angle of the rotating body different from the first rotational angle are also observed by the camera. The position and inclination of the fine hole are calculated from the coordinates of each of the observed positions, and fine hole information including the position and inclination of the fine hole is outputted.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 7/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer des contours ou des courbes
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 51/00 - Systèmes pour la commande automatique d'une série d'opérations successives du meulage d'une pièce
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B26D 3/06 - Rainurage, impliquant un enlèvement de matière à la surface de la pièce
B23C 3/04 - Fraisage de surfaces de révolution avec rotation de la pièce à usiner
B26D 5/00 - Dispositions pour manœuvrer et commander les machines ou les dispositifs de coupe, découpage, poinçonnage, perforation ou séparation autrement que par coupe
B24B 19/02 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux pour meuler des gorges, p.ex. sur des arbres, dans des gaines, des tubes, des éléments de joint homocinétique
83.
Displacement detector, surface shape measuring apparatus, and roundness measuring apparatus
Provided are a displacement detector, a surface shape measuring apparatus, and a roundness measuring apparatus capable of measuring displacement in a plurality of directions, having a simple configuration, and capable of highly accurate measurement. A displacement measurer includes: a detector body; a substantially L-shaped stylus having a contactor to be in contact with a measuring surface of an object to be measured; a stylus holding part that is provided in the detector body and holds the stylus in a swingable manner, with a swing plane being a plane including a first direction and a second direction that are perpendicular to each other; and a displacement detecting unit that is provided in the detector body and detects displacement of the contactor associated with contact between the contactor and the measuring surface.
G01B 5/016 - Têtes de contact de palpeurs pour de telles machines - Détails de structure des contacts
G01B 21/04 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer la longueur, la largeur ou l'épaisseur en mesurant les coordonnées de points
84.
Laser machining device and control method therefor
A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.
B23K 26/03 - Observation, p.ex. surveillance de la pièce à travailler
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p.ex. pour faire des fissures d'amorce de rupture
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
85.
WORKPIECE DIAMETER MEASUREMENT METHOD AND WORKPIECE CIRCULARITY MEASUREMENT MACHINE
Provided are a workpiece diameter measurement method and a workpiece circularity measurement machine that can perform diameter measurement of a workpiece having a large diameter without using a masterpiece and a horizontal arm in a long stroke. The present invention includes: a first detection step for, in a state where a probe is in contact with the circumferential surface of a non-calibrated standard from one direction side in a displacement direction of the probe, detecting the position of the probe while relatively rotating the standard and a detector about the rotation center; a second detection step for, in a state where the probe is in contact with the circumferential surface of the standard from another direction side in the displacement direction, detecting the position of the probe while relatively rotating the standard and the detector about the rotation center; a rotation center calculation step for calculating the position of the rotation center on the basis of the position of the probe detected in the first detection step and the second detection step; a third detection step for, in a state where the probe is in contact with a workpiece from the other direction side, relatively rotating the workpiece and the detector about the rotation center; and a diameter calculation step for calculating the diameter of the circumferential surface of the workpiece.
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
B23C 3/04 - Fraisage de surfaces de révolution avec rotation de la pièce à usiner
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B24B 51/00 - Systèmes pour la commande automatique d'une série d'opérations successives du meulage d'une pièce
B26D 3/06 - Rainurage, impliquant un enlèvement de matière à la surface de la pièce
B26D 5/00 - Dispositions pour manœuvrer et commander les machines ou les dispositifs de coupe, découpage, poinçonnage, perforation ou séparation autrement que par coupe
B24B 19/02 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux pour meuler des gorges, p.ex. sur des arbres, dans des gaines, des tubes, des éléments de joint homocinétique
87.
DICING DEVICE, BLADE HEIGHT CORRECTION METHOD FOR DICING DEVICE, AND WORKPIECE PROCESSING METHOD
Provided is a dicing device capable of controlling the height of a blade highly accurately in real time using a simple configuration. A dicing device (10) is provided with: a work table (CT); a cutting unit (12) including a blade (16) and a spindle (14); an XY-direction driving unit (50); a Z-direction driving unit (50); a first measuring instrument (18) that measures a position in the Z-direction of a surface of a workpiece held on a holding face of the work table; a second measuring instrument (20) that measures displacement in the Z-direction of the holding face of the work table; a table displacement map indicating displacement in the Z-direction of the holding face of the work table in each position, measured in advance by the second measuring instrument; a correction amount calculation unit that calculates a correction amount of the position of the cutting unit in the Z-direction on the basis of the position in the Z-direction of the surface of the workpiece measured by the first measuring instrument; and a control unit (100) that, when the workpiece is cut with the blade, controls the Z-direction driving unit on the basis of the correction amount.
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
B24B 51/00 - Systèmes pour la commande automatique d'une série d'opérations successives du meulage d'une pièce
B26D 3/06 - Rainurage, impliquant un enlèvement de matière à la surface de la pièce
B26D 5/00 - Dispositions pour manœuvrer et commander les machines ou les dispositifs de coupe, découpage, poinçonnage, perforation ou séparation autrement que par coupe
B26D 7/01 - Moyens pour maintenir ou mettre en position la pièce
B24B 19/02 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux pour meuler des gorges, p.ex. sur des arbres, dans des gaines, des tubes, des éléments de joint homocinétique
B23Q 15/26 - Commande ou régulation de la position de l'outil ou de la pièce de la position angulaire
B23Q 17/24 - Agencements sur les machines-outils pour indiquer ou mesurer utilisant des moyens optiques
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
B26D 3/06 - Rainurage, impliquant un enlèvement de matière à la surface de la pièce
B26D 5/00 - Dispositions pour manœuvrer et commander les machines ou les dispositifs de coupe, découpage, poinçonnage, perforation ou séparation autrement que par coupe
B26D 7/01 - Moyens pour maintenir ou mettre en position la pièce
B23Q 15/26 - Commande ou régulation de la position de l'outil ou de la pièce de la position angulaire
B23Q 17/24 - Agencements sur les machines-outils pour indiquer ou mesurer utilisant des moyens optiques
B24B 19/02 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux pour meuler des gorges, p.ex. sur des arbres, dans des gaines, des tubes, des éléments de joint homocinétique
B24B 51/00 - Systèmes pour la commande automatique d'une série d'opérations successives du meulage d'une pièce
90.
SURFACE SHAPE MEASURING DEVICE AND SURFACE SHAPE MEASURING METHOD
The present invention provides a surface shape measuring device with which it is possible to suppress any reduction in measurement precision when an index table is installed on a rotating table and the surface shape of a workpiece is measured, and a surface shape measuring method. This surface shape measuring device comprises: a rotating table on which a workpiece is placed and which freely rotates about a rotational center; and a detector having a measuring element that is brought into contact with the workpiece placed on the rotating table, the detector detecting displacement of the measuring element. The rotating table is provided with an index table having a centering mechanism for regulating the center of the workpiece and the center of rotation, the index table being detachably installed on the rotating table. The index table is configured so as to enable index feeding along a first axis and a second axis that are orthogonal to the rotational center, and is provided with an eccentric-load-offsetting means that offsets an eccentric load associated with the index feeding of the index table.
Provided are: a dicing device and method capable of preventing interference between a blade and a jig when performing dicing processing and also capable of securing throughput. The dicing method comprises: a form measurement step for measuring a form of a work (W); an alignment step of acquiring measurement results of the form of the work, and performing, on the basis of the acquired measurement result, alignment between the work and the jig such that a line (CT1) that follows an intended dividing line (CL1) of the work and that has a breadth corresponding to a blade width of a blade (32) for performing dicing processing of the work, fits within a jig groove (G1) of a jig (J1); and a step of adsorption holding of the work with a jig and for performing dicing processing of the work along the intended dividing line.
B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p.ex. cloisonnement en zones séparées
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Custom manufacture of semiconductor manufacturing machines and systems for others; custom manufacture of measuring and testing machines and instruments for others; custom manufacture of semiconductor elements for others; custom manufacture of electronic circuits, not including those recorded with computer programs for others; rental of semiconductor manufacturing machines and systems; removal of radiation rays; treatment or processing of cloth, clothing or fur, including drying; tailoring or dressmaking; embroidery [embroidering]; metal treating; processing of rubber; processing of plastics; ceramic processing; woodworking; paper treating and working; stone treating; taxidermy; processing of bamboo, tree barks, rattan, vines or other mineral vegetable materials (other than processing of ingredients); food processing; processing of artificial limbs or dental prostheses, including processing of medical materials; processing of cinematographic films; photographic enlarging; photographic printing; photographic film development; bookbinding; water treating; recycling of waste and trash; nuclear fuel reprocessing; engraving of sealing stamps; photogravure; rental of textile machines and apparatus; rental of machines and apparatus for film development, photograph printing, photograph enlargement or photograph finishing; rental of metal treating machines and tools; rental of bookbinding machines; rental of machines and apparatus for processing foods or beverages; rental of machines and apparatus for lumbering, wood-working, or veneering or plywood making; rental of machines and apparatus for pulp-making, papermaking or paper-working; rental of water purifying apparatus; rental of waste compacting machines and apparatus; rental of waste crushing machines; rental of chemical processing machines and apparatus; rental of glassware manufacturing machines and apparatus; rental of shoe making machines; rental of tobacco processing machines; providing material treatment information; printing; sorting and disposal of waste and trash; rental of knitting machines; rental of sewing machines; rental of printing machines and apparatus.
(2) Design or development of semiconductor manufacturing machines and systems; advisory services relating to design or development of semiconductor manufacturing machines and systems; design or development of measuring and testing machines and instruments; advisory services relating to design or development of measuring and testing machines and instruments; testing, inspection or research of semi-conductor chips for others; calibration of machines, apparatus, instruments and parts thereof for others; providing meteorological information; architectural design; surveying; geological surveys or research; designing of machines, apparatus, instruments [including their parts] or systems composed of such machines, apparatus and instruments; design services; computer software design, computer programming, or maintenance of computer software; creating or maintaining web sites for others; technological advice relating to computers, automobiles and industrial machines; testing, inspection or research of pharmaceuticals, cosmetics or foodstuffs; research on building construction or city planning; testing or research on prevention of pollution; testing or research on electricity; testing or research on civil engineering; testing, inspection or research on agriculture, livestock breeding or fisheries; testing or research on machines, apparatus and instruments; rental of measuring apparatus; rental of computers; providing computer programs on data networks; rental of laboratory apparatus and instruments; rental of technical drawing instruments; rental of measuring and testing machines and instruments.
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Custom manufacture of semiconductor manufacturing machines and systems for others; custom manufacture of coordinate measuring machines and instruments, and machines and instruments for semiconductor testing; custom manufacture of semiconductor wafers for others; custom manufacture of electronic circuits, not including those recorded with computer programs for others; rental of semiconductor manufacturing machines and systems; removal of radiation rays, namely, radiation area decontamination services; treatment and processing of cloth, clothing and fur; custom tailoring and dressmaking; embroidery being embroidery services; metal treating; processing of rubber; processing of plastics; ceramic processing; woodworking; paper treating and paper working being paper finishing; stone treating being treatment of materials in the nature of stone; taxidermy; processing of bamboo, tree barks, rattan, vines and herbs, other than processing of ingredients; food processing; processing of artificial limbs and dental prostheses, and processing of medical materials; processing of cinematographic films; photographic enlarging; photographic printing; photographic film development; bookbinding; water treating; recycling of waste and trash; nuclear fuel reprocessing; engraving of sealing stamps; photogravure; rental of textile machines and apparatus for treating textiles; rental of machines and apparatus for film development, photograph printing, photograph enlargement or photograph finishing; rental of metal treating machines and tools; rental of bookbinding machines; rental of machines and apparatus for processing foods or beverages; rental of machines and apparatus for lumbering, wood-working, or veneering or plywood making; rental of machines and apparatus for pulp-making, papermaking or paper-working; rental of water purifying apparatus; rental of waste compacting machines and apparatus; rental of waste crushing machines; rental of chemical processing machines and apparatus; rental of glassware manufacturing machines and apparatus; rental of shoe making machines; rental of tobacco processing machines; providing material treatment information; printing; sorting and disposal being destruction of waste and trash; rental of knitting machines; rental of sewing machines; rental of printing machines and apparatus Design and development of semiconductor manufacturing machines and systems; advisory services relating to design or development of semiconductor manufacturing machines and systems; design and development of measuring and testing machines; advisory services relating to design or development of measuring and testing machines and instruments; testing, inspection or research of semi-conductor chips for others; calibration services of machines, apparatus, instruments and parts thereof for others; providing meteorological information; architectural design; surveying; geographical surveys and research; designing of machines, apparatus, instruments, including their parts, or systems composed of such machines, apparatus and instruments; design of computer hardware and semiconductors for others; computer software design, computer programming, and maintenance of computer software; creating and maintaining web sites for others; technological advice relating to the design of computers, automobiles and industrial machines; testing, inspection or research of pharmaceuticals, cosmetics or foodstuffs; research on building construction or city planning; testing or research on prevention of pollution; testing or research on electricity; testing or research on civil engineering; testing, inspection or research on agriculture, livestock breeding or fisheries; testing or research on machines, apparatus and instruments, namely, testing the functionality of machines and research on machines; rental of measuring apparatus; rental of computers; providing temporary use of non-downloadable computer programs for designing manufacturing machinery and for operating machinery for use in manufacturing; rental of laboratory apparatus and instruments; rental of technical drawing instruments; rental of laboratory measuring and testing machines and instruments
A problem of the present invention is to provide a measurement apparatus in which load torques are similar when ascending and descending by using a mechanism that does not require a complicated structure, is completed with a rigid body of only the weight of a driven body, is driven by the moment of inertia of only the weight of the driven body, is not limited in acceleration, and is free of disturbances such as coupled forces. The abovementioned problem is solved by a measurement device comprising: a detector that detects a surface position of a measurement target; a driven body that supports the detector; a movement support mechanism that is provided with a rotary shaft, causes the driven body to descend through rotation of the rotary shaft in a first direction, and causes the driven body to ascend through rotation of the rotary shaft in a second direction, which is a direction opposite the first direction; a motor that rotates the rotary shaft in the first direction or the second direction; and a load device that applies a load torque to the rotary shaft, and applies a larger load torque to rotation in the first direction than rotation in the second direction of the rotary shaft.
F16D 63/00 - Freins non prévus ailleurs; Freins combinant plusieurs des types mentionnés dans les groupes
F16H 25/22 - Mécanismes à vis avec billes, rouleaux ou organes similaires entre pièces travaillant en conjugaison; Eléments essentiels pour l'utilisation de ces organes
G12B 5/00 - Réglage de la position ou de l'attitude, p.ex. niveau d'instruments ou d'autres appareils, ou de leurs parties constitutives; Compensation des effets d'inclinaison ou d'accélération, p.ex. pour appareils d'optique
G01B 5/008 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer les coordonnées de points en utilisant des machines de mesure de coordonnées
Provided are a laser machining device and a laser machining method capable of stably operating an autofocus function without causing an unfavorable state such as an overshoot etc. A laser machining device and a laser machining method of the present invention performs a normal AF (autofocus) control when a scan position of the machining laser light and the detecting laser light is located in a work central portion, and performs a slow-tracking AF (autofocus) control with a trackability to a displacement of a main surface of a work reduced to be lower than a trackability of the normal AF control when the scan position of the machining laser light and the detecting laser light is located in a work end portion.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
B23K 26/046 - Focalisation automatique du faisceau laser
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p.ex. pour faire des fissures d'amorce de rupture
B23K 26/03 - Observation, p.ex. surveillance de la pièce à travailler
B23K 26/082 - Systèmes de balayage, c. à d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
H01L 21/268 - Bombardement par des radiations ondulatoires ou corpusculaires par des radiations d'énergie élevée les radiations étant électromagnétiques, p.ex. des rayons laser
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p.ex. marques de repérage, schémas de test
B23K 26/06 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples
B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
B23K 103/00 - Matières à braser, souder ou découper
96.
DISPLACEMENT DETECTOR, SURFACE TEXTURE MEASUREMENT INSTRUMENT, AND ROUNDNESS MEASUREMENT INSTRUMENT
Provided are a displacement detector, surface texture measurement instrument, and roundness measurement instrument that make it possible to measure displacement in a plurality of directions, have simple structures, and make highly accurate measurement possible. A displacement measurement instrument (20) comprises: a detector body (30); a roughly L-shaped stylus (40) having a contactor (44) for touching a surface under measurement of an object (W) under measurement; a stylus holding part (33) that is provided in the detector body (30) and holds the stylus (40) such that the same can pivot in a pivoting plane including a first direction and second direction that are orthogonal to each other; and a displacement detection unit that is provided in the detector body (30) and detects displacement of the contactor (44) accompanying contact between the contactor (44) and the surface under measurement.
A linear drive mechanism which moves a detector having sensitivity in a first axial direction, relatively to a workpiece in a second axial direction orthogonal to the first axial direction, the linear drive mechanism includes: a drive shaft extending in the second axial direction; a mover which is supported in a non-contact fashion by the drive shaft and configured to move along the drive shaft integrally with the detector or the workpiece; a guide provided at a position deviated relative to the drive shaft in a third axial direction orthogonal to both the first axial direction and the second axial direction, the guide parallel to the drive shaft; and a resistance force generator which is provided on one of the mover and the guide, and is in contact with the other of the mover and the guide, the resistance force generator generates a resistance force which resists against movement of the mover.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 21/20 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des contours ou des courbes, p.ex. pour déterminer un profil
H02K 7/102 - Association structurelle avec des embrayages, des freins, des engrenages, des poulies ou des démarreurs mécaniques avec des freins à friction
Provided are a three-dimensional measuring system and a three-dimensional measuring method having improved measuring accuracy and measuring efficiency. This three-dimensional measuring system is provided with: a platen 18; a robot arm 50 that holds a workpiece W, which is an object being measured, and that is capable of varying the attitude of the workpiece W; and a probe 22 which is configured to be capable of moving relative to the platen 18 and which performs three-dimensional measurement of the workpiece W.
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
The present invention provides a workpiece processing device and method capable of grooving, with high precision, the surface of workpieces having various shapes and sizes and a cylindrical surface. The workpiece processing device is provided with: a workpiece support part for supporting a workpiece in a manner rotatable around a first axis that is parallel to the central axis of the workpiece when the workpiece has a cylindrical surface; a cutting part provided with a blade for cutting the surface of the workpiece supported by the workpiece support part; a detection unit for calculating the position of the vertex of the surface of the workpiece in a direction along a second axis that is perpendicular to the first axis and parallel to the blade; and a control unit for controlling the workpiece support part so that a cutting position on the surface of the workpiece is located at the vertex in the direction along the second axis, and forming a groove at the cutting position by relatively moving the workpiece support part and the cutting part so that the cutting direction of the blade is on a plane defined by the central axis of the workpiece and the cutting position on the surface of the workpiece.
B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
B24B 19/02 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux pour meuler des gorges, p.ex. sur des arbres, dans des gaines, des tubes, des éléments de joint homocinétique
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
To provide a wafer processing method which can simplify the wafer processing process and efficiently obtain chips of stable quality. A wafer processing method includes: a tape attaching step of attaching a back grinding tape to the front surface of a wafer; a modified region forming step of applying a laser beam from the back surface of the wafer along a cut line to form modified regions inside the wafer; a back surface processing step of processing the back surface of the wafer having the modified regions to reduce a thickness of the wafer; and a dividing step of, in a state in which the back grinding tape is attached to the front surface of the wafer, applying a load to the cut line from the back surface of the wafer to divide the wafer along the cut line and obtain individual chips.
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
