COVERS FOR ELECTRONIC DEVICES WITH A HYDROPHOBIC COATING
| Registre | Brevet USPTO |
|---|---|
| Numéro d'application | 17786619 |
| Statut | En instance |
| Date de dépôt | 2020-01-08 |
| Date de la première publication | 2023-02-02 |
| Date de publication | 2023-02-02 |
| Propriétaire | Hewlett-Packard Development Company, L.P. (USA) |
| Inventeur(s) |
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Abrégé
This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, a cover comprises a substrate comprising a first metal; a second metal injection molded 10 on the surface of the substrate; a paint layer or an electrophoretic deposition layer on the second metal surface; a chamfered edge on the substrate, wherein the chamfered edge cuts through the paint layer or the electrophoretic deposition layer, the second metal, and partially through the first metal; and a hydrophobic coating.