COVERS FOR ELECTRONIC DEVICES WITH A HYDROPHOBIC COATING
| Register | USPTO Patent |
|---|---|
| Application Number | 17786619 |
| Status | Pending |
| Filing Date | 2020-01-08 |
| First Publication Date | 2023-02-02 |
| Publication Date | 2023-02-02 |
| Owner | Hewlett-Packard Development Company, L.P. (USA) |
| Inventor |
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Abstract
This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, a cover comprises a substrate comprising a first metal; a second metal injection molded 10 on the surface of the substrate; a paint layer or an electrophoretic deposition layer on the second metal surface; a chamfered edge on the substrate, wherein the chamfered edge cuts through the paint layer or the electrophoretic deposition layer, the second metal, and partially through the first metal; and a hydrophobic coating.