An inductor component includes an element body and inductor wiring. Among outer surfaces of the element body, one specific surface is defined as a first main surface, one surface perpendicular to the first main surface is defined as a first end surface, and one surface perpendicular to the first main surface and the first end surface is defined as a bottom surface. The inductor wiring includes a winding portion. The winding portion includes an upper side portion, a lower side portion, and a first lateral side portion. The first lateral side portion linearly extends from an end of the lower side portion facing the first end surface to the same position as that of an end of the upper side portion facing the first end surface in a direction perpendicular to the first end surface.
A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/14 - Arrangements for reducing ripples from dc input or output
H02M 1/32 - Means for protecting converters other than by automatic disconnection
An inductor component includes an element body and an inductor wiring. The element body has a planar first main surface. The inductor wiring extends inside the element body. The inductor wiring includes a plurality of wiring portions arrayed in a direction perpendicular to the first main surface. The element body includes a plurality of interlayer insulating layers filling spaces between the wiring portions that are adjacent to each other in a direction perpendicular to the first main surface. The interlayer insulating layers each contain an insulating base material and a plurality of filler particles dispersed within the base material. In a first interlayer insulating layer, which is one of the plurality of interlayer insulating layers, the average particle size of the filler particles is less than or equal to the standard deviation of the thickness of the first interlayer insulating layer.
A MEMS gyrocompass and method are provided to mitigate systematic error in determination of a north angle. The MEMS gyrocompass includes one or more MEMS gyroscopes having a sense axis within a reference plane. Samples from an output of the MEMS gyroscope are obtained in at least two angles of rotation about an axis perpendicular to the reference plane. First fit coefficients are determined by fitting samples with first fitting functions determined as function of time. Second fit coefficients are determined by fitting components of earth rotation rate projected on the reference plane based on samples obtained by all the MEMS gyroscopes, which fitting is performed with a second fitting function determined as a function of rotation angle of the MEMS gyroscope with respect to a reference angle. The north angle is determined as an angle between the reference angle and true north based on the second fit coefficients.
A composite electronic component includes circuit layers, each including an electronic component, that are laminated, first and second circuit layers, a ceramic electronic component between the first and second circuit layers and including via electrodes extending through a body mainly including ceramic and being exposed at a corresponding one of a main surface on one side and a main surface on another side, and a sealing resin covering at least the ceramic electronic component at a location between the first and second circuit layers. At least one electronic component included in each of the first and second circuit layers are electrically connected by the via electrodes.
H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
H01L 23/528 - Layout of the interconnection structure
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
An optical component including: a first block having a first refractive index and a first reflective surface; a first light absorbing member containing a first metal ion that absorbs light having a first specific wavelength and has a second refractive index different from the first refractive index; a first buffer layer between and in contact with each of the first light absorbing member and the first block, and having a third refractive index having a value between the first refractive index and the second refractive index, wherein the first light absorbing member, the first buffer layer, and the first block are arranged in this order in a first direction such that first block reflects light traveling in the first direction in a second direction different from the first direction on the first reflective surface.
An acoustic wave element includes a piezoelectric substrate, an IDT electrode including comb electrode fingers, and a reflector including reflective electrode fingers. An average value of all pitches of the comb electrode fingers is smaller than an average value of all pitches of the reflective electrode fingers. When a total number of the comb electrode fingers is defined as N, at least one n-th end-side pitch satisfying 1≤n≤(0.233×N) is smaller than the average value of all the pitches of the comb electrode fingers.
A filter device includes a piezoelectric substrate, a dielectric layer on the piezoelectric substrate, a first IDT electrode on the dielectric layer, a second IDT electrode positioned on the piezoelectric substrate in an area where the dielectric layer is not provided such that the first and second IDT electrodes are side by side in an acoustic wave propagation direction extending along a principal surface of the piezoelectric substrate, a first reflector on the dielectric layer and adjacent to the first IDT electrode on a side of the second IDT electrode, and a second reflector on the piezoelectric substrate and adjacent to the second IDT electrode on a side of the first IDT electrode. The dielectric layer includes an edge portion between the first and second reflectors in planar view seen from a stacking direction of the piezoelectric substrate and the dielectric layer.
Described is a power transmission gate which includes a charge pump, an NMOS transistor, and a gate driver circuit configured to power (or bias or “drive”) a gate of the NMOS transistor. With this arrangement, a power transmission gate capable of achieving substantially the same resistance provided by prior art power transmission gates while having a footprint of just over one NMOS size unit is provided.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.
An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 μm, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.
A filter device has a first piezoelectric plate spanning a first and second cavity of a substrate. A first and second interdigital transducer (IDT) are on a front surface of the first piezoelectric plate over the first and second cavity. A dielectric layer is formed on the first piezoelectric plate and covers the first IDT and second IDT. A second piezoelectric plate is bonded to a front surface of the dielectric layer over the first cavity and the second cavity. A second dielectric layer is formed on a front surface of the second piezoelectric plate over the first cavity but not over the second cavity. The thickness of the dielectric layer, the first piezoelectric plate and the second piezoelectric plate can be selected to tune a shunt resonator over the first cavity and a series resonator over the second cavity.
H03H 9/205 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having multiple resonators
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A power amplifier circuit includes a first amplifier, a second amplifier, a third amplifier, and a harmonic suppression circuit. The first amplifier operates on power supplied through a first supply line, and amplifies a first transmit signal in a first frequency band. The second amplifier operates on power supplied through a second supply line connected to the first supply line, and amplifies a second transmit signal in a second frequency band different from the first frequency band. The third amplifier shares an antenna with the second amplifier, and amplifies a receive signal in the second frequency band received from the antenna. The harmonic suppression circuit generates, based on a harmonic of the first transmit signal, a suppression signal to suppress the harmonic to be transferred to the first supply line, and outputs the suppression signal to the first supply line or the second supply line.
A filter device includes input and output terminals, first and second ground electrodes opposed to each other, and a resonator connected to one of the input and output terminals. The resonator includes a third ground electrode, and first, second, and third resonant portions. The third ground electrode is between and connected to the first and second ground electrodes. The first resonant portion is between the first and third ground electrodes, and connected to the third ground electrode and one of the input and output terminals. The second resonant portion is between the first and third ground electrodes, and connected to the third ground electrode. The third resonant portion is between the second and third ground electrodes, and connected to the third ground electrode.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
16.
OPTICAL DEVICE AND IMAGING UNIT PROVIDED WITH OPTICAL DEVICE
The present disclosure provides an optical device in which foreign substances adhering to the surface of a light-transmitting body can be sufficiently removed without complicating the configuration, and an imaging unit provided with the optical device. An optical device (10) is provided with an outermost layer lens (1) (light-transmitting body), a housing (2), a vibrating body (3), a piezoelectric element (5), and a drive circuit (6). The drive circuit (6) causes a voltage (Vp-p_1) of a drive signal that drives the piezoelectric element (5) in an atomization mode (first vibration mode) among a plurality of vibration modes that vibrate the outermost layer lens (1), and a voltage (Vp-p_(underbar)2) of a drive signal that drives the piezoelectric element (5) in a heating mode (second vibration mode), to be the same. The drive circuit (6) drives the piezoelectric element (5) such that an effective voltage (Veff_1) applied to the piezoelectric element (5) within a predetermined period of the atomization mode, and an effective voltage (Veff_2) applied to the piezoelectric element (5) within a predetermined period of the heating mode, are different.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G03B 11/00 - Filters or other obturators specially adapted for photographic purposes
G03B 17/55 - APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR - Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
The present invention provides an elastic wave device that makes it possible to reduce the size of a filter device and to improve power handling properties. An elastic wave device 10 according to the present invention comprises a first elastic wave resonator 10A and a second elastic wave resonator 10B. The first elastic wave resonator 10A and the second elastic wave resonator 10B each comprise: a piezoelectric film which includes a piezoelectric layer 14 that comprises lithium niobate; a first comb-shaped electrode (first, fourth comb-shaped electrodes) which is provided on the piezoelectric layer 14, which is connected to an input potential, and which has a first bus bar (first, fourth bus bars 22, 32) and a plurality of first electrode fingers (plurality of first, fourth electrode fingers 25, 35) that are respectively connected to one end of the first bus bar; a second comb-shaped electrode (second, fifth comb-shaped electrodes) which is provided on the piezoelectric layer 14, which is connected to an output potential, and which has a second bus bar (second, fifth bus bars 23, 33) and a plurality of second electrode fingers (plurality of second, fifth electrode fingers 26, 36) that are respectively connected to one end of the second bus bar and that are interpolated in the plurality of first electrode fingers (plurality of first, fourth electrode fingers 25, 35); and a third electrode which is connected to a reference potential and which has a plurality of third electrode fingers (plurality of third, sixth electrode fingers 27, 37) that are respectively provided on the piezoelectric layer 14 so as to be side by side with the first electrode fingers and the second electrode fingers along the direction in which the first electrode fingers and the second electrode fingers are arranged in a plan view, and a connection electrode (third, sixth bus bars 24, 34) that connects adjacent third electrode fingers to each other. In each of the first elastic wave resonator 10A and the second elastic wave resonator 10B, the order in which the first electrode fingers, the second electrode fingers, and the third electrode fingers are arranged in a plan view is such that, starting from a first electrode finger, one cycle is constituted by a first electrode finger, a third electrode finger, a second electrode finger, and a third electrode finger. The first elastic wave resonator 10A and the second elastic wave resonator 10B are each a divided resonator in which one elastic wave resonator is divided in series.
This detection circuit includes: a comparison unit to which a signal outputted from an output terminal of a predetermined amplifier, and a reference voltage are inputted, and which outputs, from an output terminal, a first output signal corresponding to a difference between the signal level of the signal outputted from the predetermined amplifier and the reference voltage; a direct current removal unit which has one terminal electrically connected to the output terminal of the comparison unit, and outputs, from the other terminal, a signal obtained by removing a direct-current component of the first output signal; and a detection unit which has an input terminal electrically connected to the other terminal of the direct current removal unit, and outputs, from an output terminal, a control signal corresponding to the signal level of the signal outputted from the predetermined amplifier.
The present disclosure provides an optical device with which it is possible to achieve size reduction and reduce manufacturing costs, and an imaging unit provided with the optical device. An optical device (10) comprises: an outermost layer lens (1) (light-transmitting body) that transmits light of a predetermined wavelength; a housing (2) that holds the outermost layer lens (1); a vibrating body (3) that is in contact with the outermost layer lens (1) held by the housing (2); and a piezoelectric element (5) that is provided on the vibrating body (3) and vibrates the vibrating body (3). The vibrating body (3) is a cylindrical body, and is shaped to have a plurality of groove portions (30) in a support portion (33) (third part) connecting a connecting portion (31) (first part) that is in contact with the outermost layer lens (1) and a vibrating portion (32) (second part) on which the piezoelectric element (5) is provided.
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
20.
SECONDARY BATTERY ELECTROLYTE AND SECONDARY BATTERY
A secondary battery according to the present invention comprises a positive electrode, a negative electrode, and an electrolyte that contains a thiazole compound. The thiazole compound contains at least a compound represented by formula (1) and/or a compound represented by formula (2).
An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.
A pulse-shaping network configured for use in a radio frequency (rf) power amplifier system, the pulse-shaping network comprising: a coupled magnetic element comprising a first inductive element magnetically coupled to a second inductive element, the first inductive element comprising a first winding disposed about a first portion of a core, and the second inductive element comprising a second winding disposed about a second portion of a core, wherein the first and second inductive elements are electrically coupled to provide three output terminals of the coupled magnetic element.
A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.
H01F 27/245 - Magnetic cores made from sheets, e.g. grain-oriented
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
In a vibration wave radiating device, when a distance between a connection portion and a reflecting plane portion in a direction orthogonal to the reflecting plane portion is TD, an angle defined by a virtual line parallel to the reflecting plane portion and a back surface of a vibrating portion in a longitudinal section is θ, a shortest distance between a peripheral edge of the back surface at an end of the vibrating portion opposite to the connection portion and a peripheral edge of the reflecting plane portion is L, and a wavelength of a vibration wave emitted from the vibrating portion is λ, a relationship indicated by 0.78λ≤L≤1.19λ or 1.5λ≤L≤2.14λ is satisfied when TD=0 and 35°≤θ≤55°.
A cylindrical battery is provided and includes a columnar electrode body, a cylindrical battery can in which one end portion is opened and the electrode body is accommodated, and a current interrupt device provided at the one end portion. The current interrupt device includes a cover, a holder provided inside the cover, and a disk provided inside the holder.
H01M 50/578 - Devices or arrangements for the interruption of current in response to pressure
H01M 10/04 - Construction or manufacture in general
H01M 50/586 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
An inductor component includes an element body and inductor wiring. The element body has first and second electrodes connected to first and second ends of the inductor wiring, respectively. One outer surface of the element body is a first main surface, one surface perpendicular to the first main surface is a first end surface, and one surface perpendicular to the first main and end surfaces is a bottom surface. The first electrode includes a first bottom surface electrode portion and a first end surface electrode portion. A size of the first bottom surface electrode portion in a direction perpendicular to the bottom surface is a thickness, and a portion of the first bottom surface electrode portion farthest from the first end surface is a leading end. The thickness of at least part of the first bottom surface electrode portion including the leading end decreases toward the leading end.
A biosignal electrode that includes a substrate having first and second opposed main surfaces; a conductive material pattern on the first main surface of the substrate, the conductive material pattern defining a plurality of open spaces extending through the conductive material pattern and exposing the first surface of the substrate therethrough; and a biocompatible glue material within the plurality of open spaces of the conductive material pattern.
A noise reduction circuit includes a surface-mount common mode choke coil mounted on a circuit board. Output terminals of the common mode choke coil are connected to an input capacitor via second circuit patterns. Two terminals of the input capacitor are connected to two input ends of a switching circuit via third circuit patterns. Path lengths of the second circuit patterns are longer than path lengths of the third circuit patterns. Of a plurality of current paths, the path lengths of the third circuit patterns are shortest in comparison with path lengths of other current paths. First circuit patterns are parallel and face each other to form a first parasitic capacitance, and the second circuit patterns are parallel and face each other to form second parasitic capacitances.
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/14 - Arrangements for reducing ripples from dc input or output
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
29.
SYSTEMS AND METHODS FOR GENERATING AN OPTIMIZED ACOUSTIC WAVE (AW) RESONATOR USING THE FINITE ELEMENT TEARING AND INTERCONNECTING (FETI) METHOD
Techniques described herein relate to systems and methods for generating an optimized acoustic wave (AW) structure, including: receiving, by a computing system, a set of frequency response requirements and a physical model of the AW structure; partitioning the physical model into a plurality of subdomains that are non-overlapping; determining and applying transmission conditions (TCs) for each of the plurality of subdomains to couple neighboring subdomains; reducing a subdomain problem for each subdomain of the plurality of subdomains to a local interface problem; assembling degrees of freedoms (DOFs) from all local interface problems to form a global interface system; solving the global interface system by monitoring for convergence accelerated by the applied TCs; deriving a frequency response of the AW structure at least partially from the solved global interface system; comparing the frequency response to the set of frequency response requirements; and optimizing the AW structure based on the comparison.
An apparatus for filtering radio frequency signals is provided. The apparatus includes a substrate and a membrane coupled to the substrate that includes piezoelectric material. The apparatus also includes an interdigital transducer (IDT) coupled to the membrane and includes a plurality of interleaved fingers. The apparatus also includes a lid, in which the membrane is arranged between the substrate and the lid with a first cavity having a first height between the lid and a first main surface of the membrane and a second cavity having a second height between the substrate and a second main surface of the membrane that opposes the first main surface. Moreover, the first height between the lid and the first main surface of the membrane is greater than a pitch of at least one pair of interleaved fingers of the plurality of interleaved fingers and at most four times greater than the second height.
An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.
An acoustic wave device includes a support substrate with a thickness in a first direction, an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an interdigital transducer electrode including a first electrode finger on a surface of the piezoelectric layer and extending in a second direction intersecting the first direction, a first busbar electrode connected to the first electrode finger, a second electrode finger opposed to the first electrode finger in a third direction orthogonal or substantially orthogonal to the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode finger. The intermediate layer includes a space in a region in which at least a portion of the intermediate layer overlaps the interdigital transducer electrode in a plan view in the first direction, and an inner wall of the space includes at least one notch.
In an acoustic wave element, a distance between a comb electrode finger closest to a reflector and a reflective electrode finger closest to an interdigital transducer (IDT) electrode is set as an IDT-reflector gap. An inter-center distance between adjacent electrode fingers is set as a pitch. The electrode fingers in a direction from the comb electrode finger closest to the reflector toward a center are sequentially set as an n-th end-side electrode finger, and a pitch between the n-th end-side electrode finger and an (n+1)-th end-side electrode finger is set as an n-th end-side pitch. An average value of each pitch by all the comb electrode fingers is set as an average IDT pitch, and an average value of each pitch by the reflective electrode fingers is set as an average reflector pitch.
A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H05K 1/14 - Structural association of two or more printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
The present invention makes it possible to prevent short-circuiting between a positive electrode and a negative electrode when a separator has been damaged by an external force. The battery comprises an electrode assembly having a positive electrode, a negative electrode, and a film separator. The electrode assembly has a flat shape. When the shortest direction of the electrode assembly is defined as a first direction, the separator has a thickness in at least the first direction, and is provided between the positive electrode and the negative electrode in at least the first direction. When, in a plan view taken in the first direction, a direction in which the distance of mutually opposing edges of the separator becomes the shortest is defined as a second direction, and a direction perpendicular to the first direction and the second direction is defined as a third direction, the angle formed, in a plan view taken in the first direction, between the second direction and a direction in which the tensile strength of the separator becomes the minimum is larger than the angle formed between the third direction and the direction in which the tensile strength of the separator becomes the minimum. In a plan view taken in the first direction, the ratio of the length of the separator in the third direction to the length of the separator in the second direction is 2.0 or more.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 50/489 - Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
This information processing device classifies a pattern of the biological activity of an animal. The information processing device comprises a calculation circuit which receives a biological signal that is a detection result of the biological activity of an animal detected by a sensor unit including a sensor having a plurality of detection channels or a plurality of sensors. The calculation circuit detects a quasi-periodic signal from the detection result, expands and contracts the quasi-periodic signal in a time direction, generates an elastic signal of which the period is a prescribed value, decomposes the elastic signal into a plurality of frequency components, acquires time-series phase information about the plurality of frequency components, and classifies the pattern of the biological activity on the basis of the time-series phase information.
A secondary battery according to the present invention comprises: a positive electrode; a negative electrode that contains a negative electrode active material; and an electrolyte that contains a thiazole compound. The negative electrode active material includes a core part that occludes and releases an electrode reactant, and a covering part that covers the surface of the core part. The covering part contains at least one of nickel, iron, and copper as a constituent element. The thiazole compound includes a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and/or a compound represented by formula (4).
Provided is a switching power source device (80) equipped with a composite power inductor (10), the switching power source device comprising: a linear inductor conductor (31); a linear inductor conductor (32); an inductor conductor (33); and one magnetic body (20) that forms a magnetic path of a magnetic flux generated by a current flowing to the inductor conductor (31), the inductor conductor (32), and the inductor conductor (33). One end of the inductor conductor (31) is connected to a first input terminal, and the other end is connected to one end of the inductor conductor (33). One end of the inductor conductor (32) is connected to a second input terminal, and the other end is connected to one end of the inductor conductor (33). The inductor conductor (31), the inductor conductor (32), and the inductor conductor (33) are sandwiched by or contained in the magnetic body (20). The inductor conductor (31) and the inductor conductor (32) are arranged in parallel so that the magnetic fluxes generated by the current flowing to each conductor are cancelled out at an inner leg section (10ZI) of the magnetic body (20) between the inductor conductor (31) and the inductor conductor (32), and the magnetic fluxes generated by the current flowing to each conductor are intensified at outer leg sections (10ZO1, 10ZO2) of the magnetic body (20) on the outside of the inductor conductor (31) and the inductor conductor (32). The inductor conductor (33) is arranged so that a plane created by the magnetic flux generated by the current flowing to the inductor conductor (33) is orthogonal to the planes created by the magnetic fluxes generated by the current flowing to the inductor conductor (31) and the inductor conductor (32). The inductor conductor (31) and the inductor conductor (32) are inductors that constitute a power conversion circuit, and the inductor conductor (33) is an inductor that constitutes a low-pass filter with respect to an output current of the power conversion circuit.
H02M 3/155 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
H01F 17/04 - Fixed inductances of the signal type with magnetic core
H01F 27/00 - MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - Details of transformers or inductances, in general
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
39.
WIRELESS POWER SUPPLY SYSTEM AND POWER TRANSMISSION DEVICE FOR WIRELESS POWER SUPPLY SYSTEM
A wireless power supply system (10) comprises a power reception device (90) and a power transmission device (20). The wireless power supply system (10) forms an electromagnetic resonance field between the power transmission device (20) and the power reception device (90) to perform wireless power supply and uses the electromagnetic resonance field to perform signal transmission by a resonance modulation. The power transmission device (20) comprises: a power transmission coil (30) that performs wireless power transmission by forming the electromagnetic resonance field; a power transmission circuit (40) having a power transmission resonance circuit (43); a resonance demodulation circuit that achieves a resonance demodulation corresponding to the resonance modulation; a current detection circuit (60) that detects the input current to the power transmission circuit; and a current adjustment circuit (70) that adjusts the input current. The power transmission device (20) detects, by the current detection circuit (60), a state of being unable to detect a signal using the resonance modulation by a power reception circuit (92). The current detection circuit (60) changes the input current using the current adjustment circuit (70) when being in the state of being unable to detect the signal.
H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
Provided is an elastic wave device that can suppress an increase in return loss. An elastic wave device 1 comprises: a piezoelectric substrate 2; an IDT electrode 3 that includes a first bus bar 4 and a second bus bar 5 that are provided on the piezoelectric substrate 2 and are opposed to each other, and a plurality of first electrode fingers 6 and a plurality of second electrode fingers 7 that are interdigitated with each other; and a pair of reflectors 13A, 13B that are provided on the piezoelectric substrate 2 so as to oppose each other across the IDT electrode 3 in a second direction x orthogonal to a first direction y in which the plurality of first electrode fingers 6 and the plurality of second electrode fingers 7 extend. Each of the plurality of first electrode fingers 6 includes a first proximal end 6a connected to the first bus bar 4. Each of the plurality of second electrode fingers 7 includes a second proximal end 7a connected to the second bus bar 5. A pair of the regions of the IDT electrode 3 that are positioned outside in the first direction y of the first proximal end 6a and the second proximal end 7a are a pair of outer regions (first and second outer regions Ba, Bb). Extensions of the pair of outer regions in the second direction x are a pair of extension outer regions (first and second extension outer regions Oa, Ob). The reflectors each include a pair of reflector bus bars (first and second reflector bus bars 14, 15) opposing each other, and a plurality of reflector electrode fingers 16 electrically connected to the pair of reflector bus bars. The reflector bus bars are provided in portions of the reflectors positioned in the extension outer regions, and include a plurality of reflector-connecting electrodes 15c that are connected to the plurality of reflector electrode fingers 16 directly or indirectly. The regions of the reflectors in which the plurality of reflector-connecting electrodes 15c are positioned and that extend in the second direction x are connection electrode-forming regions C. When twice the center-to-center distance in the second direction x between adjacent reflector electrode fingers 16 is a one-period dimension, and the percentage of the dimension of a portion, over a virtual line E of the one-period dimension extending in the second direction x, in which the piezoelectric substrate 2 is covered by the metal of which the reflectors are composed is a metallization ratio, the connection electrode-forming region C of at least one reflector bus bar of at least one of the reflectors includes a portion having different metallization ratios in at least one of the first direction y and the second direction x.
A power supply modulator circuit includes a multi-output power supply that generates multiple power output signals; at least one power modulator circuit generates a modulated power output signal from the multiple power output signals of the multi-output power supply; at least one pulse shaping network (PSN) having at least one passive element, the PSN configured to shape the modulated power output signal; at least one power amplifier coupled to receive the modulated power signal; and a switching network having a plurality of switches to create or modify power signal paths from the at least one power modulator circuit to the at least one power amplifier.
A secondary battery according to the present invention comprises a positive electrode, a negative electrode, and an electrolyte that contains a benzothiazoline compound represented by formula (1).
As viewed in a Z-axis negative direction, a ground conductor layer non-formation region in which one or more first ground conductor layers are not provided is present in a radiation conductor layer region in which a radiation conductor layer is provided. As viewed in the Z-axis negative direction, a signal conductor layer has an overlap section overlapping with the ground conductor layer non-formation region. Aside from the radiation conductor layer, no conductor that covers the entire ground conductor layer non-formation region is present on the Z-axis positive side of the signal conductor layer in the ground conductor layer non-formation region. A first branch conductor layer and a second branch conductor layer are provided to a layered body, and are electrically connected to the signal conductor layer. As viewed in the Z-axis negative direction, there is an imaginary line that passes through the overlap section, and with regard to which the first branch conductor layer and the second branch conductor layer demonstrate line symmetry.
This sensor module comprises a sensor that outputs a signal corresponding to deformation of an elastic member, and a computation circuit that receives the signal from the sensor. The computation circuit measures the length of time of a target period in which the signal strength is outside a range defined by threshold values, calculates a signal gradient on the basis of the length of at least one portion of the target period and the amount of variation in the signal in the at least one portion of the target period, and computes a stress value representing the stress applied to the elastic member on the basis of the gradient and the length of time of the target period.
A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.
A thermal analysis method and apparatus, and a computer program that enable highly accurate heat transfer simulation of a structure or space, while reducing calculation costs. By performing thermal analysis on a structure or space using the calculation meshes generated by initial dividing means, the spatial distribution of heat flux vectors J and temperature gradient vectors ∇T are calculated; by calculating the volume integrals of the inner products J·∇T of the heat flux vectors J and the temperature gradient vectors ∇T for individual partitioned regions and acquiring the absolute values of the volume integrals, thermal management sensitivity indices are calculated for the partitioned regions. Subsequently, partition of calculation meshes and subdivision of partitioned regions are performed on a predetermined number of partitioned regions that indicate greater indices among the calculated thermal management sensitivity indices, for example one partitioned region. Thermal analysis is performed again using the calculation meshes.
A power amplifier circuit includes an amplifier transistor having a collector terminal, an emitter terminal, and a base terminal, bias circuits, and a current limiter circuit. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current from an emitter terminal to the base terminal. The current limiter circuit includes a current limiting transistor an emitter terminal of which is connected to the bias circuit, a resistive element connected between the current limiting transistor and a power supply terminal, and a resistive element connected between the current limiting transistor and the constant current amplifier transistor. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current i3 from an emitter terminal to the base terminal.
A coil component includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body stacked sequentially, and a coil in the inner insulator and an internal magnetic body inside the coil. Volumes A, B, C, and D of the first and second outer insulators, the inner insulator, the coil, and the internal magnetic body, respectively, and volume E of the first outer magnetic body, the first inner magnetic body, the second inner magnetic body, and the second outer magnetic body satisfy 0.05≤A≤0.07, 0.2≤B≤0.4, 0.01≤C≤0.08, 0.03≤D≤0.05, and 0.4≤E≤0.71, where 0.05B≤C≤0.2B and A+B+C+D+E=1.
A high frequency circuit (1) comprises: a filter (31) including a transit bandwidth having a downlink bandwidth of a band (A) and a downlink bandwidth of a band (B); a filter (32) including a transit bandwidth having a downlink bandwidth of the band (A) and a downlink bandwidth of a band (C); and a switch (51) including a terminal (511) connected to an antenna connection terminal, a terminal (512) connected to the filter (31), and a terminal (513) connected to the filter (32). The downlink bandwidth of the band (A), the downlink bandwidth of the band (B), and the downlink bandwidth of the band (C) at least partially overlap one another. A combination of the bands (A and B) and a combination of the bands (A and C) are included in a band combination capable of simultaneous communication defined in advance.
This sensor module comprises: an elastic member including a resin; a first sensor provided in contact with the elastic member and including an upper electrode, a piezoelectric film, and a lower electrode; and a switch. The first sensor outputs a first signal corresponding to deformation of the elastic member. The switch has a function of causing a short circuit between the upper electrode and the lower electrode. The lower electrode is a signal electrode.
G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
An amplification circuit (1) comprises: a power source voltage terminal (130) that receives a power source voltage V1; a power source voltage terminal (140) that receives a power source voltage V2 having a different voltage level than that of the power source voltage V1; digital control terminals (160 and 170) that receive a digital control signal based on an envelope signal; a power amplifier (12) connected to the power source voltage terminal (130); a power amplifier (22) connected to the power source voltage terminal (140); a synthesis circuit (40) connected to the power amplifiers (12 and 22); a bias circuit (50) that supplies a bias current; and a switch circuit that is connected to the digital control terminals (160 and 170), switches the bias circuit (50) and the power amplifier (12) between connected and not connected, and switches the bias circuit (50) and the power amplifier (22) between connected and not connected. Each of the power amplifiers (12 and 22) include a plurality of amplification transistors that are cascode-connected.
H03F 3/68 - Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics
H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
A first detection circuit (11) and a second detection circuit (12) output a first signal when a corresponding abnormal state is detected. A first register (21) and a second register (22) store data that correspond to the first signal inputted from the corresponding detection circuit from among the first detection circuit (11) and the second detection circuit (12), and output a second signal. A first selection circuit (31) and a second selection circuit (32) select whether to output a third signal in response to the second signal inputted from the corresponding register from among the first register (21) and the second register (22). An exclusive OR circuit (41) outputs a fourth signal in response to the third signal inputted from the first selection circuit (31) and the second selection circuit (32). A single output terminal outputs, as an abnormality detection signal, the fourth signal outputted from the exclusive OR circuit (41).
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 31/00 - Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
An electronic device 1 comprises: a wiring board 10 having a first main surface 11 and a second main surface 12 that oppose each other in the thickness direction; a first electronic component 20 mounted on the first main surface 11 of the wiring board 10; a second electronic component 30 mounted on the second main surface 12 of the wiring board 10; a first heat diffusion plate 40 thermally connected to the first electronic component 20; a second heat diffusion plate 50 thermally connected to the second electronic component 30; and a heat conductor 60 that is provided so as to penetrate the wiring board 10 in the thickness direction, and that is thermally connected to the first heat diffusion plate 40 and the second heat diffusion plate 50.
A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a drawing-out terminal 20A (21A) electrically connected to the external electrode 12a (12b); an outer case 30 having accommodated therein the capacitor element 10 such that the drawing-out terminal 20A (21A) is projecting outward; and a filling resin 40 that fills inside the outer case 30 so as to embed the capacitor element 10. The drawing-out terminal 20A (21A) has a first drawing-out terminal 20Aa (21Aa) and a second drawing-out terminal 20Ab (21Ab) that is electrically connected to the external electrode 12a (12b) via the first drawing-out terminal 20Aa (21Aa). The first drawing-out terminal 20Aa (21Aa) and the second drawing-out terminal 20Ab (21Ab) are locked so as to be in surface contact with each other.
An inductor component includes first and second internal wiring lines, an interlayer insulating layer between the first and second internal wiring lines and having a first main surface facing the first internal wiring line, a second main surface facing the second internal wiring line, and a via extending between the first main surface and the second main surface, and a via wiring line inserted through the via that electrically connects the first and second internal wiring lines. In a first section including a central axis of the via wiring line, the first main surface includes a first portion in contact with the first internal wiring line. The second main surface includes a second portion that is parallel to the first portion. A straight line that includes the first portion is a first reference line. A straight line that includes the second portion is a second reference line.
An inductor component includes: a first internal conductor; a second internal conductor; an insulating interlayer disposed between the first internal conductor and the second internal conductor and having a first main surface on the first internal conductor side, a second main surface on the second internal conductor side, and a via extending therethrough between the first main surface and the second main surface; and a via conductor inserted through the via and electrically connecting the first internal conductor and the second internal conductor. In a first section including a central axis of the via conductor, the via conductor has a wedge portion interposed between the insulating interlayer and the first internal conductor in a direction parallel to the central axis.
A directional coupler includes a main line, a first sub-line, a second sub-line, a first phase shift circuit, a first short-circuit path, and a first short-circuit switch. The first phase shift circuit is connected between the first sub-line and the second sub-line. The first short-circuit path short-circuits both ends of the first phase shift circuit. The first short-circuit switch switches between conduction and non-conduction of the first short-circuit path.
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
A highly reliable multilayer coil component in which the internal stress is further alleviated, and a method for producing the same. The method produces a multilayer coil component that includes an insulator portion, a coil that is embedded in the insulator portion and includes a plurality of coil conductor layers electrically connected to one another, and an outer electrode that is disposed on a surface of the insulator portion and is electrically connected to an extended portion of the coil. The method includes forming a conductive paste layer by using a conductive paste; forming an insulating paste layer by using an insulating paste; forming a multilayer compact that includes the conductive paste layer and the insulating paste layer; and firing the multilayer compact, in which the conductive paste has a PVC of 60% or more and 80% or less (i.e., from 60% to 80%).
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
There is provided a power amplifier circuit capable of adjusting the gain according to the power mode. A power amplifier circuit includes: a splitter outputting an input signal by splitting the input signal to a signal RF1 and a signal RF2; amplifiers connected to the splitter; and an amplifier provided in or on a signal path branching from between the splitter and an input of the amplifier, connected in parallel with the amplifier, and connected to a biasing terminal supplied with a third bias current or voltage.
A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a first transistor and a current draw circuit. The first transistor receives, at its base or gate, a first radio frequency signal, and outputs, from its emitter or source, a second radio frequency signal obtained by amplifying the first radio frequency signal. The current draw circuit draws, from the emitter or source of the first transistor, a current based on a control signal.
An inductor component includes a base body, first and second inner wiring line inside the base body, an inter-layer insulation layer, and a via-wiring line. The inter-layer insulation layer is inside the base body, and between the first and second inner wiring lines. The inter-layer insulation layer includes first and second major faces and a via-hole. The first major face faces the first inner wiring line. The second major face faces the second inner wiring line. The via-hole extends through the inter-layer insulation layer between the first and second major faces. The via-wiring line is in the via-hole, and electrically connects the first and second inner wiring lines. As seen in a first cross-section including a center axis of the via-wiring line, the via-wiring line includes a first portion in contact with the first inner wiring line, and a second portion in contact with the second inner wiring line.
A solid electrolytic capacitor that includes: an anode plate made of a valve metal; a porous layer on at least one of principal surface of the anode plate; a dielectric layer on a surface of the porous layer; a cathode layer that includes a solid electrolyte layer on the dielectric layer, the cathode layer including two or more cathode portions; a first insulating layer that surrounds at least one of the cathode portions as viewed in a thickness direction of the solid electrolytic capacitor, wherein a material of the first insulating layer fills a portion of the porous layer and is also present on a surface of the filled portion of the porous layer; and a first piercing section that pierces through both of the porous layer and the first insulating layer in the thickness direction.
A resonance device that includes: a first substrate having a first silicon substrate and a resonator, wherein the resonator includes a single-crystal silicon film and a first silicon oxide film interposed between the single-crystal silicon film and the first silicon substrate, and a through hole that passes through the single-crystal silicon film and the first silicon oxide film; a second substrate opposite the first substrate; a frame shaped bonding portion that bonds the first substrate to the second substrate to seal a vibration space of the resonator; and a first blocking member disposed in an interior of the through hole and surrounding a vibration portion of the resonator in a plan view of the first substrate so as to divide the first silicon oxide film, wherein the first blocking member has a lower helium permeability than the first silicon oxide film.
H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
64.
RADIO FREQUENCY CIRCUIT, COMMUNICATION DEVICE, AND CONTROL METHOD
A radio frequency circuit that supports simultaneous communication using downlink MIMO in a first band and uplink communication in a second band includes first and second power amplifiers connected to first and second antenna terminals, respectively. When a first SRS in the first band is output through the first antenna terminal, the first power amplifier amplifies the first SRS, according to a first deterioration amount of a signal-to-noise ratio in the first band due to distortion of a transmission signal in the second band having leaked in through the first antenna terminal, and when a second SRS in the first band is output through the second antenna terminal, the second power amplifier amplifies the second SRS, according to a second deterioration amount of the signal-to-noise ratio in the first band due to distortion of the transmission signal in the second band having leaked in through the second antenna terminal.
A power amplifier circuit includes external input and output terminals; a first power amplifier with first input and output terminals, the first input terminal being connected to the external input terminal, the first output terminal being connected to the external output terminal; a second power amplifier having second input and output terminals, the second input terminal being connected to the external input terminal, the second output terminal being connected to the external output terminal; a power supply terminal that receives a power supply voltage that is supplied to the first power amplifier and controllably supplied to the second power amplifier; and a switch having first and second terminals, the first terminal being connected to the power supply terminal, the second terminal being connected to the second power amplifier.
An electrical device includes a thermally insulating layer including first and second opposing surfaces. The first surface of the thermally insulating layer is on a first surface of the electrical device. A thermally conductive layer is on the second surface of the thermally insulating layer. The electrical device further includes one or more thermal conductors in thermal contact with the thermally conductive layer to transfer heat away from the thermally conductive layer via one or more coolers provided externally to the electrical device. Such a composite layer arrangement maintains a temperature of a surface at a low value, allowing low temperature rated electronic components to be mounted directly onto the electrical device.
Methods and devices addressing power tracking of transmission systems using antenna arrays are disclosed. The disclosed teachings may be implemented on a channel element to channel element basis, are adaptive and can be implemented on short time durations such as time slots. Power efficiency can be improved when applying the described methods to the design of systems with antenna arrays.
A directional coupler includes a main line, a sub-line, an output terminal, a first termination circuit, and a termination switch. The sub-line includes a first end and a second end. The output terminal is connected to one end of the first end and the second end. The first termination circuit connects a first output path, which connects the one end and the output terminal, to a ground. The termination switch switches between connection and non-connection between the first output path and the first termination circuit.
H03H 7/06 - Frequency selective two-port networks including resistors
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
The present invention has an element body 20, an external electrode covering a portion of an outer surface (21) of the element body (20), and a protective film (30) of aluminum oxide. The protective film (30) is positioned between the element body (20) and the external electrode. The thickness of the protective film (30) in a direction perpendicular to the outer surface (21) of the element body (20) is defined as the film thickness (TP). The protective film (30) is viewed in a cross-section orthogonal to the outer surface (21) of the element body (20) at a location covered by the external electrode. When the average value and standard deviation of the film thickness (TP) are calculated in a range of 1 μm in a direction along the outer surface (21) of the element body (20), the ratio of the standard deviation to the average value is 0.4 or greater.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a drawn-out terminal 20a (20b) that is electrically connected to the external electrode 12a (12b); an outer case 30A having accommodated therein the capacitor element 10 such that the drawn-out terminal 20a (20b) is projecting outward; and a filling resin 40 that fills inside the outer case 30A so as to embed the capacitor element 10. Outer surfaces of the outer case 30A include a mounting surface 34 that faces a mounting object in a first direction D1 when the drawn-out terminal 20a (20b) has been electrically connected to the mounting object. The outer case 30A has a hook-shaped part 35Aa (35Ab, 35Ac) extending from the mounting surface 34.
A second positive main surface is in contact with a first negative main surface. One or more first ground conductor layers are positioned toward the positive side of the Z-axis from a signal conductor layer. The one or more first ground conductor layers are not positioned on the second positive main surface. When viewed in the negative direction of the Z-axis, a ground conductor layer non-formation region in which the one or more first ground conductor layers are not provided is present in a first substrate region in which a first substrate is provided. When viewed in the negative direction of the Z-axis, the signal conductor layer overlaps with the ground conductor layer non-formation region. In the ground conductor layer non-formation region, there is no conductor that covers the entire ground conductor layer non-formation region on the positive side of the Z-axis from the signal conductor layer other than a radiating conductor layer.
A filter device 10 comprises: a first piezoelectric substrate 2A having a first main surface 2a and a second main surface 2b opposing each other; at least one first acoustic wave resonator 13A that includes an IDT electrode provided on the first main surface 2a of the first piezoelectric substrate 2A, the first acoustic wave resonator 13A being a series-arm resonator or a parallel-arm resonator; a support body 8A that is provided on the first main surface 2a of the first piezoelectric substrate 2A and is provided so as to surround the first acoustic wave resonator 13A; a second piezoelectric substrate 2B that is provided on the support body 8A and includes a third main surface 2c positioned on the first piezoelectric substrate 2A side and a fourth main surface 2d opposing the third main surface 2c; and at least one second acoustic wave resonator 13B that includes an IDT electrode provided on the third main surface 2c of the second piezoelectric substrate 2B, the second acoustic wave resonator 13B having at least one series-arm resonator. The electromechanical coupling coefficient Ksaw of the second piezoelectric substrate 2B is less than the electromechanical coupling coefficient Ksaw of the first piezoelectric substrate 2A. The at least one second acoustic wave resonator 13B includes a series-arm resonator that has the lowest anti-resonance frequency among all the series-arm resonators configured on the first piezoelectric substrate 2A and the second piezoelectric substrate 2B.
This RFID module comprises: a substrate having a first main surface and a second main surface opposite each other; an RFIC chip disposed on the first main surface side of the substrate; and a coil element on which a conductive wire is wound a plurality of times. One end of the RFIC chip is electrically connected to one end of the coil element. The other end of the RFIC chip is electrically connected to the other end of the coil element. The coil element has at least one sparsely wound portion. Both ends of the coil element are first densely wound portions in which the inter-conductive wire pitch is narrower than in the sparsely wound portion.
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A capacitor 1 comprises: a capacitor element 10 including an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a lead-out terminal 20a (20b) electrically connected to the external electrode 12a (12b); a metal case 30 inside of which the capacitor element 10 is accommodated so that the lead-out terminal 20a (20b) protrudes toward the exterior; an insulating member 40 that is accommodated in the interior of the metal case 30 and positions the capacitor element 10 so that the lead-out terminal 20a (20b) and the metal case 30 are not in contact; and a filler resin 50 with which the interior of the metal case 30 is filled so as to embed the capacitor element 10. A protrusion 35 protruding toward the capacitor element 10 is provided to the inner surface of the metal case 30 at a position at which the insulating member 40 is not present, and the shortest distance between the capacitor element 10 and the protrusion 35 is smaller than the shortest distance between the lead-out terminal 20a (20b) and the metal case 30.
Circuits and methods for selectable conversion ratio power converters that include low-dropout (LDO) power supplies adapted to select voltage inputs based on the selected conversion ratio while achieving high efficiency. The LDO power supplies limit current through power FETs of power converters, thereby mitigating or eliminating potentially damaging events. In some embodiments, first and second full gate-drive LDOs have “wired-OR” outputs which may power a target circuit such as a pre-driver (and optionally, a level-shifter) coupled to the gate of a power FET. In some embodiments, first and second reduced gate-drive LDOs have “wired-OR” outputs that may power a final driver coupled to the gate of a power FET. Some embodiments have dual full gate-drive LDOs that power a target circuit such as a pre-driver (and optionally, a level-shifter), while dual reduced gate-drive LDOs that power a final driver coupled to the gate of the power FET.
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
A CPAP device includes a main unit including a first electric circuit including a blower and a connection terminal connected to the first electric circuit, and a base unit connectable to the main unit, including a blower tube, a second electric circuit different from the first electric circuit, and a connection terminal connected to the second electric circuit. The main unit has a first electrical connection portion including an exposed portion of the connection terminal and a first peripheral portion surrounding the first electrical connection portion. The base unit has a second electrical connection portion including an exposed portion of the connection terminal and a second peripheral portion surrounding the second electrical connection portion.
A CPAP device includes a main unit including an inlet, an outlet, and a first electric circuit including a blower; and a base unit, to which the main unit is attachable, including an outlet, an inlet, a blower tube, and a second electric circuit different from the first electric circuit. The main unit has a lower wall, and the lower wall has multiple connection terminals connected to the first electric circuit. The base unit has an upper wall, and the upper wall has multiple connection terminals connected to the second electric circuit. The multiple connection terminals and the multiple connection terminals are disposed side by side in a direction substantially parallel to a direction in which the lower wall and the upper wall face each other. One of the multiple connection terminals and the multiple connection terminals includes a biasing force generation member that generates biasing force.
An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.
A method is provided for sealing and contacting a microelectromechanical device that includes a silicon device wafer with MEMS device structures and a cap wafer with an electrical circuit. The device wafer includes a sealing region and an interconnection region. Moreover, the cap wafer includes a corresponding sealing region and an interconnection region. Layers of eutectic metal alloy material are deposited on the sealing and the interconnection regions of the device wafer and the cap wafer. The cap wafer is bonded to the device wafer so that the interconnection region of the device wafer is aligned with the interconnection region of the cap wafer and the sealing region of the device wafer is aligned with the sealing region of the cap wafer.
A displacement detection device includes a transmitter, a receiver, and a controller configured or programmed to output a first transmission signal to the transmitter to transmit a modulated wave and acquire a responsive first reception signal in a first measurement period, extract first phase information indicating a phase defined in a correlation between a first transmission signal and a reception signal, output a second transmission signal to the transmitter and acquire a responsive second reception signal in a second measurement period after the first measurement period, extract second phase information indicating a phase defined in a correlation between the second transmission signal and reception signal, and detect a displacement of an object between the first and second measurement periods, depending on a difference between the first and second phase information.
A battery pack includes a plurality of batteries, an isolating member that is arranged between the plurality of batteries and isolates the plurality of batteries from each other, and a heat absorbing agent that is housed inside the isolating member. The isolating member has a first housing space for housing the heat absorbing agent, and contains an amorphous engineering plastic. In addition, the isolating member has a first thin portion having a locally thin wall thickness in at least a part of a region where the first housing space faces each of the plurality of batteries.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
H01M 50/383 - Flame arresting or ignition-preventing means
82.
SOLID ELECTROLYTIC CAPACITOR ELEMENT AND SOLID ELECTROLYTIC CAPACITOR
A solid electrolytic capacitor element that includes: a valve acting metal substrate having a dielectric layer thereon; an insulating mask layer on the dielectric layer and separating the valve acting metal substrate into positive and negative electrode portions; a solid electrolyte layer on the dielectric layer, a tip of the solid electrolyte layer covering an outer surface of the insulating mask layer; a carbon layer on the solid electrolyte layer, a tip of the carbon layer covering a same position as the tip of the solid electrolyte layer or a position closer to the negative electrode portion; and a negative conductor layer on the carbon layer, a tip of the negative conductor layer covering a position closer to the negative electrode portion, and wherein the negative electrode portion has a negative conductor layer-non-formed region where the negative conductor layer does not cover a part of the carbon layer.
Provided is a composite fiber comprising first fiber formation member formed of a material having a volume resistivity of 5×10-6to 5×106 Ωm or a material of a semiconductor or a semimetal and a second fiber formation member containing a ceramic, the first fiber formation member and the second fiber formation member being next to each other to form a fiber body.
This antenna module (100) comprises: a first substrate (131) having a first surface and a second surface that face each other; a second substrate (132) having a third surface and a fourth surface that face each other, and disposed so that the third surface and the second surface of the first substrate (131) face each other; radiating elements (141A-141D) provided to the first surface side on the first substrate (131); a first ground electrode (GND1) provided to the first substrate (131) and facing the radiating elements (141A-141D) in the normal direction of the first substrate (131); a power inductor (180) provided further to the second substrate (132) side than the first ground electrode (GND1) when viewing a plan view of the first substrate (131) from the normal direction; and electronic components (110, 170) provided to the fourth surface side of the second substrate (132) and connected to the power inductor (180), wherein the power inductor (180) has magnetic body cores (181) and windings (182) that are wound around the magnetic body cores (181) over the first substrate (131) and the second substrate (132), and recessed sections (1310, 1320) in which the magnetic body cores (181) are disposed are provided to at least one among the second surface side of the first substrate (131) and the third surface side of the second substrate (132).
The present invention provides a multilayer ceramic electronic component (1) which enables the achievement of a multilayer ceramic capacitor wherein the adhesion between a multilayer body (2) and a base electrode layer (21) is able to be improved without increasing the ESR within an external electrode (20). With respect to this multilayer ceramic electronic component (1), a plurality of ceramic layers (4) stacked upon each other are mainly composed of Ca and Zr; a first external electrode (20a) and a second external electrode (20b) respectively comprise a first base electrode layer (21a) and a second base electrode layer (21b), and a plating layer that is formed so as to partially cover the first base electrode layer (21a) and the second base electrode layer (21b); the first base electrode layer (21a) and the second base electrode layer (21b) are mainly composed of Cu; the multilayer body (2) is provided, on an edge (7) in the stacking direction (T), with a first compound region (8a) that is stretched on a first end face (62a) and a second compound region (8b) that is stretched on a second end face (62b); the first compound region (8a) is bonded to the first base electrode layer (21a); the second compound region (8b) is bonded to the second base electrode layer (21b); and the first compound region (8a) and the second compound region (8b) are not bonded to each other.
Provided is a laminated ceramic capacitor whereby cracking or the like is less likely to occur in a ceramic body. Provided is a laminated ceramic capacitor comprising: a ceramic body, in which a plurality of ceramic layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated in the height direction, and which has a first principal surface and a second principal surface that face one another in the height direction, a first end surface and a second end surface that face one another in the length direction orthogonal to the height direction, and a first side surface and a second side surface that face one another in the width direction orthogonal to the height direction and to the length direction; and a first external electrode and a second external electrode that are formed on an outer surface of the ceramic body. The first internal electrodes are drawn out to the first end surface and electrically connected with the first external electrode; and the second internal electrodes are drawn out to the second end surface and electrically connected with the second external electrode. When a cross-section parallel to the first side surface and the second side surface is viewed, the first external electrode is formed in an L-shape on the first end surface and the first principal surface, and the second external electrode is formed in an L-shape on the second end surface and the first principal surface; and an R-dimension of a ridge line where the first principal surface and the first end surface, the first side surface, the second end surface, and the second side surface are in contact is greater than an R-dimension of a ridge line where the second principal surface and the first end surface, the first side surface, the second end surface, and the second side surface are in contact.
In the present invention, a mounting board has a mounting surface. A semiconductor apparatus has: a device layer on which an electronic circuit including a semiconductor element is formed; an insulation layer which is positioned on one surface of the device layer; and a plurality of bumps which are positioned on the other surface of the device layer. The semiconductor apparatus is mounted on the mounting board such that the surface of the device layer on which the plurality of bumps are positioned faces the mounting surface. A resin layer is positioned on the surface of the insulation layer on the reverse side from the side toward the device layer. A molded material is disposed on a region of the mounting surface on the outside of the semiconductor apparatus in plan view. The dielectric loss tangent of the resin layer is less than the dielectric loss tangent of the molded material.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
Provided are: a coil component in which two wires are wrapped in opposite directions, the coil component having a structure that is easy to produce; and a filter circuit in which said coil component is mounted. The coil component (1) according to the present disclosure comprises: a bobbin (2) that includes a body section (2a) around which wires are wound, and a first collar section (2b) and second collar section (2c) provided at both ends of the body section (2a); and a first wire (4) and second wire (5) wound around the body section (2a). The bobbin (2) includes a plurality of mounting terminals (6a-6d) and a plurality of connection terminals (8a-8d). On surfaces of the coil component (1) having depressions (7a, 7b) respectively provided in one surface of the first collar section (2b) and one surface of the second collar section (2c), the first connection terminal (8a) is located at a position diagonal from the second connection terminal (8b), and the third connection terminal (8c) is located at a position diagonal from the fourth connection terminal (8d).
H01F 27/00 - MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - Details of transformers or inductances, in general
A vapor chamber 1 according to an embodiment of a thermal diffusion device comprises: a housing 10 which has a first inner surface 11a and a second inner surface 12a which face each other in a thickness direction Z and is provided with an inner space; a working medium 20 sealed in the inner space of the housing 10; a wick 30 disposed in the inner space of the housing 10; and a first supporter (for example, column 40) disposed, in the inner space of the housing 10, between the wick 30 and the inner surface of either of the first inner surface 11a or the second inner surface 12a of the housing 10. The wick 30 has a through-hole 60 passing therethrough in the thickness direction Z. The wick 30 located in a region overlapping the first supporter in a plan view of the first inner surface 11a has at least one through-hole 60 present therein, and is provided with a first protruding section 61a which is closer to the first supporter in the thickness direction Z than the peripheral edge of the through-hole 60 located in the region.
F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H03K 17/08 - Modifications for protecting switching circuit against overcurrent or overvoltage
A filter device includes first and second terminals, a first inductor located between the first and second terminals, and an LC series resonator connected in parallel to the first inductor and including a first capacitor and a second inductor. The first and second inductors are magnetically coupled to each other. An inductance of the first inductor is smaller than an inductance of the second inductor.
An inductor including an element body containing metal magnetic powder and resin and having a coil conductor that has a winding portion, an extended portion extended from the winding portion, and an outer electrode connection portion leading to the extended portion and connected to an outer electrode and is embedded in the element body; and an element body coat covering a surface of the element body. The outer electrode is formed on a surface of the element body and connected to the outer electrode connection portion, in which the outer electrode connection portion has a region covered with the element body coat and a region connected to the outer electrode on the surface of the element body.
A sintered body that includes: a spinel ferrite oxide having a main constituent of metal elements of Fe, Ni, Cu, and Zn; and Zr, Mn, Al, Co, and Cr. Wherein, when Zn, Ni, Cu, Zr, Mn, Al, Co, and Cr have a contained mole part: “a”, “b”, “c”, “d”, “e”, “f”, “g”, and “h”, respectively, and based on Fe being 100 mole parts: 49.0<100−a−b−c+2d+(1/2)e<50.0, 50.2
C04B 35/26 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
An object detection device includes a wave transmitter to transmit a sound wave to an object, a wave receiver to receive the sound wave and generate a signal representing a reception result, and a controller to control transmission of the sound wave by the wave transmitter and obtain the receive signal from the wave receiver. The controller is configured or programmed to output a transmit signal to cause the wave transmitter to transmit the sound wave and obtain a corresponding receive signal. The controller is configured or programmed to generate detection information about the object by performing complexification on a correlation signal representing a correlation between the transmit signal and the receive signal. A signal corrector is configured or programmed to correct any of the correlation signal, the receive signal, and the transmit signal to mitigate a direct-current component in the correlation signal targeted for the complex analysis.
G01S 7/539 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisation; Target signature; Target cross-section
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
A tire observation apparatus includes a computer and an imaging device including a camera and range sensors positioned at different angles relative to a ground surface. The computer is configured or programmed to calculate a position of a tire relative to the camera by using various distances to the tire calculated by the range sensors. By using the position of the tire, the computer is configured or programmed to calculate an amount of adjustment usable by the imaging device to adjust the position and an angle of the camera such that an imaging center of the camera is directed at a center of the tire or at a surface of the tire that is to be measured.
Provided is a chip-type electronic component that is less likely to cause separation of a spacer and a mounting substrate. A chip-type electronic component 1 of the present invention comprises a multilayered ceramic capacitor 1A and spacers 10. The multilayered ceramic capacitor 1A comprises: a stack 2 that includes internal electrode layers 5 and dielectric layers 4 that are alternately disposed; and external electrodes 3. When the two surfaces of the stack 2 opposing each other in the multilayered direction are capacitor main surfaces A, the two surfaces thereof opposing each other in the width direction are capacitor side surfaces B, and the two surfaces thereof opposing each other in the length direction are capacitor end surfaces C, the external electrodes 3 are respectively provided on the capacitor end surfaces C. The spacers 10 are disposed on both sides in the length direction of the capacitor main surface A on the mounting substrate side of the multilayered ceramic capacitor 1A. When the two surfaces opposing each other in the multilayered direction of each of the spacers 10 are spacer main surfaces AS, a recess 11 is formed in the surface of the spacer main surface AS on the mounting substrate side.
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
The present invention provides a multilayer ceramic capacitor which is not susceptible to the occurrence of a crack or the like in a ceramic element. This multilayer ceramic capacitor is provided with: a ceramic element which is obtained by stacking a plurality of ceramic layers, a plurality of first internal electrodes and a plurality of second internal electrodes in the height direction, and which has a first main surface and a second main surface opposite to each other in the height direction, a first end face and a second end face opposite to each other in the length direction that is perpendicular to the height direction, and a first lateral surface and a second lateral surface opposite to each other in the width direction that is perpendicular to the height direction and the length direction; and a first external electrode and a second external electrode, which are formed on the outer surface of the ceramic element. The first internal electrodes are led out in the first end face, and are electrically connected to the first external electrode; while the second internal electrodes are led out in the second end face, and are electrically connected to the second external electrode. If a cross-section that is parallel to the first lateral surface and the second lateral surface is examined, the first external electrode is formed in an L-shape on the first end face and the first main surface; the second external electrode is formed in an L-shape on the second end face and the first main surface; and the second main surface is provided with a plurality of embossed pores.
Provided is a filter device that can suppress an increase in insertion loss. This filter device comprises: a first piezoelectric substrate 2A that has a first main surface 2a and a second main surface 2b opposed to each other; one or more first elastic wave resonators 13A that each include a function electrode provided on the first main surface 2a of the first piezoelectric substrate 2A and that are series-arm resonators or parallel-arm resonators; a supporter 8A that is provided on the first main surface 2a of the first piezoelectric substrate 2A and that surrounds the first elastic wave resonators 13A; a second piezoelectric substrate 2B that is provided on the supporter 8A and that has a third main surface 2c positioned on the first piezoelectric substrate 2A side and a fourth main surface 2d opposed to the third main surface 2c; one or more second elastic wave resonators 13B each of which includes a function electrode provided on the third main surface 2c of the second piezoelectric substrate 2B and at least one of which is a parallel-arm resonator; and an external connection terminal 11 that is provided in the second piezoelectric substrate 2B. A space surrounded by the first piezoelectric substrate 2A, the second piezoelectric substrate 2B, and the supporter 8A is configured. The first elastic wave resonators 13A and the second elastic wave resonators 13B are positioned in the space. The one or more second elastic wave resonators 13B include a parallel-arm resonator having the highest resonance frequency among all of the parallel-arm resonators configured on the first piezoelectric substrate 2A and the second piezoelectric substrate 2B.
This RFID module comprises: a first substrate having a first main surface and a second main surface that face each other; an RFIC chip disposed on the first main surface-side of the first substrate; a first radiation element disposed on the first main surface-side of the first substrate such that at least a part of the radiation element is set apart from the first main surface; and a second radiation element disposed on the second main surface-side of the first substrate. The second radiation element has a first end and a second end that face each other in the longitudinal direction of the first substrate. The first end is electrically connected to one terminal of the RFIC chip. The first radiation element has a third end and a fourth end that face each other in the longitudinal direction of the first substrate. The third end is electrically connected to the other terminal of the RFIC chip. The second end of the second radiation element and the fourth end of the first radiation element are electrically connected to each other. The second radiation element has a first opening.
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H05K 1/14 - Structural association of two or more printed circuits
A blower device (10) comprises: a housing (20) that has an air inlet (281) and an air outlet (291); an air filter (40) that is disposed at a position where the air filter (40) overlaps with the air inlet (281) of the housing (20) when the air inlet (281) is viewed from the front; and a filter cover (30) that holds the air filter (40) and that is disposed at a position where the filter cover (30) overlaps with the air filter (40) when the air inlet (281) is viewed from the front. The filter cover (30) includes a plurality of posts (321-323) that are spaced apart from each other. The posts (321-323) include projections (321P, 323P) that project toward the air filter (40). The filter cover (30) is fixed to the housing (20) in a state in which the projections (321P, 323P) are in contact with the air filter (40) and portions of the plurality of posts (321-323) other than the projections (321P, 323P) are apart from the air filter (40).
