A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.
A thermal analysis method and apparatus, and a computer program that enable highly accurate heat transfer simulation of a structure or space, while reducing calculation costs. By performing thermal analysis on a structure or space using the calculation meshes generated by initial dividing means, the spatial distribution of heat flux vectors J and temperature gradient vectors ∇T are calculated; by calculating the volume integrals of the inner products J·∇T of the heat flux vectors J and the temperature gradient vectors ∇T for individual partitioned regions and acquiring the absolute values of the volume integrals, thermal management sensitivity indices are calculated for the partitioned regions. Subsequently, partition of calculation meshes and subdivision of partitioned regions are performed on a predetermined number of partitioned regions that indicate greater indices among the calculated thermal management sensitivity indices, for example one partitioned region. Thermal analysis is performed again using the calculation meshes.
A power amplifier circuit includes an amplifier transistor having a collector terminal, an emitter terminal, and a base terminal, bias circuits, and a current limiter circuit. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current from an emitter terminal to the base terminal. The current limiter circuit includes a current limiting transistor an emitter terminal of which is connected to the bias circuit, a resistive element connected between the current limiting transistor and a power supply terminal, and a resistive element connected between the current limiting transistor and the constant current amplifier transistor. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current i3 from an emitter terminal to the base terminal.
A coil component includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body stacked sequentially, and a coil in the inner insulator and an internal magnetic body inside the coil. Volumes A, B, C, and D of the first and second outer insulators, the inner insulator, the coil, and the internal magnetic body, respectively, and volume E of the first outer magnetic body, the first inner magnetic body, the second inner magnetic body, and the second outer magnetic body satisfy 0.05≤A≤0.07, 0.2≤B≤0.4, 0.01≤C≤0.08, 0.03≤D≤0.05, and 0.4≤E≤0.71, where 0.05B≤C≤0.2B and A+B+C+D+E=1.
A high frequency circuit (1) comprises: a filter (31) including a transit bandwidth having a downlink bandwidth of a band (A) and a downlink bandwidth of a band (B); a filter (32) including a transit bandwidth having a downlink bandwidth of the band (A) and a downlink bandwidth of a band (C); and a switch (51) including a terminal (511) connected to an antenna connection terminal, a terminal (512) connected to the filter (31), and a terminal (513) connected to the filter (32). The downlink bandwidth of the band (A), the downlink bandwidth of the band (B), and the downlink bandwidth of the band (C) at least partially overlap one another. A combination of the bands (A and B) and a combination of the bands (A and C) are included in a band combination capable of simultaneous communication defined in advance.
A first detection circuit (11) and a second detection circuit (12) output a first signal when a corresponding abnormal state is detected. A first register (21) and a second register (22) store data that correspond to the first signal inputted from the corresponding detection circuit from among the first detection circuit (11) and the second detection circuit (12), and output a second signal. A first selection circuit (31) and a second selection circuit (32) select whether to output a third signal in response to the second signal inputted from the corresponding register from among the first register (21) and the second register (22). An exclusive OR circuit (41) outputs a fourth signal in response to the third signal inputted from the first selection circuit (31) and the second selection circuit (32). A single output terminal outputs, as an abnormality detection signal, the fourth signal outputted from the exclusive OR circuit (41).
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 31/00 - Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
An electronic device 1 comprises: a wiring board 10 having a first main surface 11 and a second main surface 12 that oppose each other in the thickness direction; a first electronic component 20 mounted on the first main surface 11 of the wiring board 10; a second electronic component 30 mounted on the second main surface 12 of the wiring board 10; a first heat diffusion plate 40 thermally connected to the first electronic component 20; a second heat diffusion plate 50 thermally connected to the second electronic component 30; and a heat conductor 60 that is provided so as to penetrate the wiring board 10 in the thickness direction, and that is thermally connected to the first heat diffusion plate 40 and the second heat diffusion plate 50.
This sensor module comprises: an elastic member including a resin; a first sensor provided in contact with the elastic member and including an upper electrode, a piezoelectric film, and a lower electrode; and a switch. The first sensor outputs a first signal corresponding to deformation of the elastic member. The switch has a function of causing a short circuit between the upper electrode and the lower electrode. The lower electrode is a signal electrode.
G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
An amplification circuit (1) comprises: a power source voltage terminal (130) that receives a power source voltage V1; a power source voltage terminal (140) that receives a power source voltage V2 having a different voltage level than that of the power source voltage V1; digital control terminals (160 and 170) that receive a digital control signal based on an envelope signal; a power amplifier (12) connected to the power source voltage terminal (130); a power amplifier (22) connected to the power source voltage terminal (140); a synthesis circuit (40) connected to the power amplifiers (12 and 22); a bias circuit (50) that supplies a bias current; and a switch circuit that is connected to the digital control terminals (160 and 170), switches the bias circuit (50) and the power amplifier (12) between connected and not connected, and switches the bias circuit (50) and the power amplifier (22) between connected and not connected. Each of the power amplifiers (12 and 22) include a plurality of amplification transistors that are cascode-connected.
H03F 3/68 - Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics
H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a drawing-out terminal 20A (21A) electrically connected to the external electrode 12a (12b); an outer case 30 having accommodated therein the capacitor element 10 such that the drawing-out terminal 20A (21A) is projecting outward; and a filling resin 40 that fills inside the outer case 30 so as to embed the capacitor element 10. The drawing-out terminal 20A (21A) has a first drawing-out terminal 20Aa (21Aa) and a second drawing-out terminal 20Ab (21Ab) that is electrically connected to the external electrode 12a (12b) via the first drawing-out terminal 20Aa (21Aa). The first drawing-out terminal 20Aa (21Aa) and the second drawing-out terminal 20Ab (21Ab) are locked so as to be in surface contact with each other.
An inductor component includes first and second internal wiring lines, an interlayer insulating layer between the first and second internal wiring lines and having a first main surface facing the first internal wiring line, a second main surface facing the second internal wiring line, and a via extending between the first main surface and the second main surface, and a via wiring line inserted through the via that electrically connects the first and second internal wiring lines. In a first section including a central axis of the via wiring line, the first main surface includes a first portion in contact with the first internal wiring line. The second main surface includes a second portion that is parallel to the first portion. A straight line that includes the first portion is a first reference line. A straight line that includes the second portion is a second reference line.
An inductor component includes: a first internal conductor; a second internal conductor; an insulating interlayer disposed between the first internal conductor and the second internal conductor and having a first main surface on the first internal conductor side, a second main surface on the second internal conductor side, and a via extending therethrough between the first main surface and the second main surface; and a via conductor inserted through the via and electrically connecting the first internal conductor and the second internal conductor. In a first section including a central axis of the via conductor, the via conductor has a wedge portion interposed between the insulating interlayer and the first internal conductor in a direction parallel to the central axis.
A directional coupler includes a main line, a first sub-line, a second sub-line, a first phase shift circuit, a first short-circuit path, and a first short-circuit switch. The first phase shift circuit is connected between the first sub-line and the second sub-line. The first short-circuit path short-circuits both ends of the first phase shift circuit. The first short-circuit switch switches between conduction and non-conduction of the first short-circuit path.
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
A highly reliable multilayer coil component in which the internal stress is further alleviated, and a method for producing the same. The method produces a multilayer coil component that includes an insulator portion, a coil that is embedded in the insulator portion and includes a plurality of coil conductor layers electrically connected to one another, and an outer electrode that is disposed on a surface of the insulator portion and is electrically connected to an extended portion of the coil. The method includes forming a conductive paste layer by using a conductive paste; forming an insulating paste layer by using an insulating paste; forming a multilayer compact that includes the conductive paste layer and the insulating paste layer; and firing the multilayer compact, in which the conductive paste has a PVC of 60% or more and 80% or less (i.e., from 60% to 80%).
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
There is provided a power amplifier circuit capable of adjusting the gain according to the power mode. A power amplifier circuit includes: a splitter outputting an input signal by splitting the input signal to a signal RF1 and a signal RF2; amplifiers connected to the splitter; and an amplifier provided in or on a signal path branching from between the splitter and an input of the amplifier, connected in parallel with the amplifier, and connected to a biasing terminal supplied with a third bias current or voltage.
A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a first transistor and a current draw circuit. The first transistor receives, at its base or gate, a first radio frequency signal, and outputs, from its emitter or source, a second radio frequency signal obtained by amplifying the first radio frequency signal. The current draw circuit draws, from the emitter or source of the first transistor, a current based on a control signal.
An inductor component includes a base body, first and second inner wiring line inside the base body, an inter-layer insulation layer, and a via-wiring line. The inter-layer insulation layer is inside the base body, and between the first and second inner wiring lines. The inter-layer insulation layer includes first and second major faces and a via-hole. The first major face faces the first inner wiring line. The second major face faces the second inner wiring line. The via-hole extends through the inter-layer insulation layer between the first and second major faces. The via-wiring line is in the via-hole, and electrically connects the first and second inner wiring lines. As seen in a first cross-section including a center axis of the via-wiring line, the via-wiring line includes a first portion in contact with the first inner wiring line, and a second portion in contact with the second inner wiring line.
A solid electrolytic capacitor that includes: an anode plate made of a valve metal; a porous layer on at least one of principal surface of the anode plate; a dielectric layer on a surface of the porous layer; a cathode layer that includes a solid electrolyte layer on the dielectric layer, the cathode layer including two or more cathode portions; a first insulating layer that surrounds at least one of the cathode portions as viewed in a thickness direction of the solid electrolytic capacitor, wherein a material of the first insulating layer fills a portion of the porous layer and is also present on a surface of the filled portion of the porous layer; and a first piercing section that pierces through both of the porous layer and the first insulating layer in the thickness direction.
A resonance device that includes: a first substrate having a first silicon substrate and a resonator, wherein the resonator includes a single-crystal silicon film and a first silicon oxide film interposed between the single-crystal silicon film and the first silicon substrate, and a through hole that passes through the single-crystal silicon film and the first silicon oxide film; a second substrate opposite the first substrate; a frame shaped bonding portion that bonds the first substrate to the second substrate to seal a vibration space of the resonator; and a first blocking member disposed in an interior of the through hole and surrounding a vibration portion of the resonator in a plan view of the first substrate so as to divide the first silicon oxide film, wherein the first blocking member has a lower helium permeability than the first silicon oxide film.
H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
20.
RADIO FREQUENCY CIRCUIT, COMMUNICATION DEVICE, AND CONTROL METHOD
A radio frequency circuit that supports simultaneous communication using downlink MIMO in a first band and uplink communication in a second band includes first and second power amplifiers connected to first and second antenna terminals, respectively. When a first SRS in the first band is output through the first antenna terminal, the first power amplifier amplifies the first SRS, according to a first deterioration amount of a signal-to-noise ratio in the first band due to distortion of a transmission signal in the second band having leaked in through the first antenna terminal, and when a second SRS in the first band is output through the second antenna terminal, the second power amplifier amplifies the second SRS, according to a second deterioration amount of the signal-to-noise ratio in the first band due to distortion of the transmission signal in the second band having leaked in through the second antenna terminal.
A power amplifier circuit includes external input and output terminals; a first power amplifier with first input and output terminals, the first input terminal being connected to the external input terminal, the first output terminal being connected to the external output terminal; a second power amplifier having second input and output terminals, the second input terminal being connected to the external input terminal, the second output terminal being connected to the external output terminal; a power supply terminal that receives a power supply voltage that is supplied to the first power amplifier and controllably supplied to the second power amplifier; and a switch having first and second terminals, the first terminal being connected to the power supply terminal, the second terminal being connected to the second power amplifier.
An electrical device includes a thermally insulating layer including first and second opposing surfaces. The first surface of the thermally insulating layer is on a first surface of the electrical device. A thermally conductive layer is on the second surface of the thermally insulating layer. The electrical device further includes one or more thermal conductors in thermal contact with the thermally conductive layer to transfer heat away from the thermally conductive layer via one or more coolers provided externally to the electrical device. Such a composite layer arrangement maintains a temperature of a surface at a low value, allowing low temperature rated electronic components to be mounted directly onto the electrical device.
A directional coupler includes a main line, a sub-line, an output terminal, a first termination circuit, and a termination switch. The sub-line includes a first end and a second end. The output terminal is connected to one end of the first end and the second end. The first termination circuit connects a first output path, which connects the one end and the output terminal, to a ground. The termination switch switches between connection and non-connection between the first output path and the first termination circuit.
H03H 7/06 - Frequency selective two-port networks including resistors
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
The present invention has an element body 20, an external electrode covering a portion of an outer surface (21) of the element body (20), and a protective film (30) of aluminum oxide. The protective film (30) is positioned between the element body (20) and the external electrode. The thickness of the protective film (30) in a direction perpendicular to the outer surface (21) of the element body (20) is defined as the film thickness (TP). The protective film (30) is viewed in a cross-section orthogonal to the outer surface (21) of the element body (20) at a location covered by the external electrode. When the average value and standard deviation of the film thickness (TP) are calculated in a range of 1 μm in a direction along the outer surface (21) of the element body (20), the ratio of the standard deviation to the average value is 0.4 or greater.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a drawn-out terminal 20a (20b) that is electrically connected to the external electrode 12a (12b); an outer case 30A having accommodated therein the capacitor element 10 such that the drawn-out terminal 20a (20b) is projecting outward; and a filling resin 40 that fills inside the outer case 30A so as to embed the capacitor element 10. Outer surfaces of the outer case 30A include a mounting surface 34 that faces a mounting object in a first direction D1 when the drawn-out terminal 20a (20b) has been electrically connected to the mounting object. The outer case 30A has a hook-shaped part 35Aa (35Ab, 35Ac) extending from the mounting surface 34.
This RFID module comprises: a substrate having a first main surface and a second main surface opposite each other; an RFIC chip disposed on the first main surface side of the substrate; and a coil element on which a conductive wire is wound a plurality of times. One end of the RFIC chip is electrically connected to one end of the coil element. The other end of the RFIC chip is electrically connected to the other end of the coil element. The coil element has at least one sparsely wound portion. Both ends of the coil element are first densely wound portions in which the inter-conductive wire pitch is narrower than in the sparsely wound portion.
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A filter device 10 comprises: a first piezoelectric substrate 2A having a first main surface 2a and a second main surface 2b opposing each other; at least one first acoustic wave resonator 13A that includes an IDT electrode provided on the first main surface 2a of the first piezoelectric substrate 2A, the first acoustic wave resonator 13A being a series-arm resonator or a parallel-arm resonator; a support body 8A that is provided on the first main surface 2a of the first piezoelectric substrate 2A and is provided so as to surround the first acoustic wave resonator 13A; a second piezoelectric substrate 2B that is provided on the support body 8A and includes a third main surface 2c positioned on the first piezoelectric substrate 2A side and a fourth main surface 2d opposing the third main surface 2c; and at least one second acoustic wave resonator 13B that includes an IDT electrode provided on the third main surface 2c of the second piezoelectric substrate 2B, the second acoustic wave resonator 13B having at least one series-arm resonator. The electromechanical coupling coefficient Ksaw of the second piezoelectric substrate 2B is less than the electromechanical coupling coefficient Ksaw of the first piezoelectric substrate 2A. The at least one second acoustic wave resonator 13B includes a series-arm resonator that has the lowest anti-resonance frequency among all the series-arm resonators configured on the first piezoelectric substrate 2A and the second piezoelectric substrate 2B.
A capacitor 1 comprises: a capacitor element 10 including an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a lead-out terminal 20a (20b) electrically connected to the external electrode 12a (12b); a metal case 30 inside of which the capacitor element 10 is accommodated so that the lead-out terminal 20a (20b) protrudes toward the exterior; an insulating member 40 that is accommodated in the interior of the metal case 30 and positions the capacitor element 10 so that the lead-out terminal 20a (20b) and the metal case 30 are not in contact; and a filler resin 50 with which the interior of the metal case 30 is filled so as to embed the capacitor element 10. A protrusion 35 protruding toward the capacitor element 10 is provided to the inner surface of the metal case 30 at a position at which the insulating member 40 is not present, and the shortest distance between the capacitor element 10 and the protrusion 35 is smaller than the shortest distance between the lead-out terminal 20a (20b) and the metal case 30.
A second positive main surface is in contact with a first negative main surface. One or more first ground conductor layers are positioned toward the positive side of the Z-axis from a signal conductor layer. The one or more first ground conductor layers are not positioned on the second positive main surface. When viewed in the negative direction of the Z-axis, a ground conductor layer non-formation region in which the one or more first ground conductor layers are not provided is present in a first substrate region in which a first substrate is provided. When viewed in the negative direction of the Z-axis, the signal conductor layer overlaps with the ground conductor layer non-formation region. In the ground conductor layer non-formation region, there is no conductor that covers the entire ground conductor layer non-formation region on the positive side of the Z-axis from the signal conductor layer other than a radiating conductor layer.
A CPAP device includes a main unit including a first electric circuit including a blower and a connection terminal connected to the first electric circuit, and a base unit connectable to the main unit, including a blower tube, a second electric circuit different from the first electric circuit, and a connection terminal connected to the second electric circuit. The main unit has a first electrical connection portion including an exposed portion of the connection terminal and a first peripheral portion surrounding the first electrical connection portion. The base unit has a second electrical connection portion including an exposed portion of the connection terminal and a second peripheral portion surrounding the second electrical connection portion.
A CPAP device includes a main unit including an inlet, an outlet, and a first electric circuit including a blower; and a base unit, to which the main unit is attachable, including an outlet, an inlet, a blower tube, and a second electric circuit different from the first electric circuit. The main unit has a lower wall, and the lower wall has multiple connection terminals connected to the first electric circuit. The base unit has an upper wall, and the upper wall has multiple connection terminals connected to the second electric circuit. The multiple connection terminals and the multiple connection terminals are disposed side by side in a direction substantially parallel to a direction in which the lower wall and the upper wall face each other. One of the multiple connection terminals and the multiple connection terminals includes a biasing force generation member that generates biasing force.
An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.
A method is provided for sealing and contacting a microelectromechanical device that includes a silicon device wafer with MEMS device structures and a cap wafer with an electrical circuit. The device wafer includes a sealing region and an interconnection region. Moreover, the cap wafer includes a corresponding sealing region and an interconnection region. Layers of eutectic metal alloy material are deposited on the sealing and the interconnection regions of the device wafer and the cap wafer. The cap wafer is bonded to the device wafer so that the interconnection region of the device wafer is aligned with the interconnection region of the cap wafer and the sealing region of the device wafer is aligned with the sealing region of the cap wafer.
A displacement detection device includes a transmitter, a receiver, and a controller configured or programmed to output a first transmission signal to the transmitter to transmit a modulated wave and acquire a responsive first reception signal in a first measurement period, extract first phase information indicating a phase defined in a correlation between a first transmission signal and a reception signal, output a second transmission signal to the transmitter and acquire a responsive second reception signal in a second measurement period after the first measurement period, extract second phase information indicating a phase defined in a correlation between the second transmission signal and reception signal, and detect a displacement of an object between the first and second measurement periods, depending on a difference between the first and second phase information.
A battery pack includes a plurality of batteries, an isolating member that is arranged between the plurality of batteries and isolates the plurality of batteries from each other, and a heat absorbing agent that is housed inside the isolating member. The isolating member has a first housing space for housing the heat absorbing agent, and contains an amorphous engineering plastic. In addition, the isolating member has a first thin portion having a locally thin wall thickness in at least a part of a region where the first housing space faces each of the plurality of batteries.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
H01M 50/383 - Flame arresting or ignition-preventing means
36.
SOLID ELECTROLYTIC CAPACITOR ELEMENT AND SOLID ELECTROLYTIC CAPACITOR
A solid electrolytic capacitor element that includes: a valve acting metal substrate having a dielectric layer thereon; an insulating mask layer on the dielectric layer and separating the valve acting metal substrate into positive and negative electrode portions; a solid electrolyte layer on the dielectric layer, a tip of the solid electrolyte layer covering an outer surface of the insulating mask layer; a carbon layer on the solid electrolyte layer, a tip of the carbon layer covering a same position as the tip of the solid electrolyte layer or a position closer to the negative electrode portion; and a negative conductor layer on the carbon layer, a tip of the negative conductor layer covering a position closer to the negative electrode portion, and wherein the negative electrode portion has a negative conductor layer-non-formed region where the negative conductor layer does not cover a part of the carbon layer.
Circuits and methods for selectable conversion ratio power converters that include low-dropout (LDO) power supplies adapted to select voltage inputs based on the selected conversion ratio while achieving high efficiency. The LDO power supplies limit current through power FETs of power converters, thereby mitigating or eliminating potentially damaging events. In some embodiments, first and second full gate-drive LDOs have “wired-OR” outputs which may power a target circuit such as a pre-driver (and optionally, a level-shifter) coupled to the gate of a power FET. In some embodiments, first and second reduced gate-drive LDOs have “wired-OR” outputs that may power a final driver coupled to the gate of a power FET. Some embodiments have dual full gate-drive LDOs that power a target circuit such as a pre-driver (and optionally, a level-shifter), while dual reduced gate-drive LDOs that power a final driver coupled to the gate of the power FET.
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
Provided is a composite fiber comprising first fiber formation member formed of a material having a volume resistivity of 5×10-6to 5×106 Ωm or a material of a semiconductor or a semimetal and a second fiber formation member containing a ceramic, the first fiber formation member and the second fiber formation member being next to each other to form a fiber body.
This antenna module (100) comprises: a first substrate (131) having a first surface and a second surface that face each other; a second substrate (132) having a third surface and a fourth surface that face each other, and disposed so that the third surface and the second surface of the first substrate (131) face each other; radiating elements (141A-141D) provided to the first surface side on the first substrate (131); a first ground electrode (GND1) provided to the first substrate (131) and facing the radiating elements (141A-141D) in the normal direction of the first substrate (131); a power inductor (180) provided further to the second substrate (132) side than the first ground electrode (GND1) when viewing a plan view of the first substrate (131) from the normal direction; and electronic components (110, 170) provided to the fourth surface side of the second substrate (132) and connected to the power inductor (180), wherein the power inductor (180) has magnetic body cores (181) and windings (182) that are wound around the magnetic body cores (181) over the first substrate (131) and the second substrate (132), and recessed sections (1310, 1320) in which the magnetic body cores (181) are disposed are provided to at least one among the second surface side of the first substrate (131) and the third surface side of the second substrate (132).
The present invention provides a multilayer ceramic electronic component (1) which enables the achievement of a multilayer ceramic capacitor wherein the adhesion between a multilayer body (2) and a base electrode layer (21) is able to be improved without increasing the ESR within an external electrode (20). With respect to this multilayer ceramic electronic component (1), a plurality of ceramic layers (4) stacked upon each other are mainly composed of Ca and Zr; a first external electrode (20a) and a second external electrode (20b) respectively comprise a first base electrode layer (21a) and a second base electrode layer (21b), and a plating layer that is formed so as to partially cover the first base electrode layer (21a) and the second base electrode layer (21b); the first base electrode layer (21a) and the second base electrode layer (21b) are mainly composed of Cu; the multilayer body (2) is provided, on an edge (7) in the stacking direction (T), with a first compound region (8a) that is stretched on a first end face (62a) and a second compound region (8b) that is stretched on a second end face (62b); the first compound region (8a) is bonded to the first base electrode layer (21a); the second compound region (8b) is bonded to the second base electrode layer (21b); and the first compound region (8a) and the second compound region (8b) are not bonded to each other.
Provided is a laminated ceramic capacitor whereby cracking or the like is less likely to occur in a ceramic body. Provided is a laminated ceramic capacitor comprising: a ceramic body, in which a plurality of ceramic layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated in the height direction, and which has a first principal surface and a second principal surface that face one another in the height direction, a first end surface and a second end surface that face one another in the length direction orthogonal to the height direction, and a first side surface and a second side surface that face one another in the width direction orthogonal to the height direction and to the length direction; and a first external electrode and a second external electrode that are formed on an outer surface of the ceramic body. The first internal electrodes are drawn out to the first end surface and electrically connected with the first external electrode; and the second internal electrodes are drawn out to the second end surface and electrically connected with the second external electrode. When a cross-section parallel to the first side surface and the second side surface is viewed, the first external electrode is formed in an L-shape on the first end surface and the first principal surface, and the second external electrode is formed in an L-shape on the second end surface and the first principal surface; and an R-dimension of a ridge line where the first principal surface and the first end surface, the first side surface, the second end surface, and the second side surface are in contact is greater than an R-dimension of a ridge line where the second principal surface and the first end surface, the first side surface, the second end surface, and the second side surface are in contact.
In the present invention, a mounting board has a mounting surface. A semiconductor apparatus has: a device layer on which an electronic circuit including a semiconductor element is formed; an insulation layer which is positioned on one surface of the device layer; and a plurality of bumps which are positioned on the other surface of the device layer. The semiconductor apparatus is mounted on the mounting board such that the surface of the device layer on which the plurality of bumps are positioned faces the mounting surface. A resin layer is positioned on the surface of the insulation layer on the reverse side from the side toward the device layer. A molded material is disposed on a region of the mounting surface on the outside of the semiconductor apparatus in plan view. The dielectric loss tangent of the resin layer is less than the dielectric loss tangent of the molded material.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
Provided are: a coil component in which two wires are wrapped in opposite directions, the coil component having a structure that is easy to produce; and a filter circuit in which said coil component is mounted. The coil component (1) according to the present disclosure comprises: a bobbin (2) that includes a body section (2a) around which wires are wound, and a first collar section (2b) and second collar section (2c) provided at both ends of the body section (2a); and a first wire (4) and second wire (5) wound around the body section (2a). The bobbin (2) includes a plurality of mounting terminals (6a-6d) and a plurality of connection terminals (8a-8d). On surfaces of the coil component (1) having depressions (7a, 7b) respectively provided in one surface of the first collar section (2b) and one surface of the second collar section (2c), the first connection terminal (8a) is located at a position diagonal from the second connection terminal (8b), and the third connection terminal (8c) is located at a position diagonal from the fourth connection terminal (8d).
H01F 27/00 - MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - Details of transformers or inductances, in general
A vapor chamber 1 according to an embodiment of a thermal diffusion device comprises: a housing 10 which has a first inner surface 11a and a second inner surface 12a which face each other in a thickness direction Z and is provided with an inner space; a working medium 20 sealed in the inner space of the housing 10; a wick 30 disposed in the inner space of the housing 10; and a first supporter (for example, column 40) disposed, in the inner space of the housing 10, between the wick 30 and the inner surface of either of the first inner surface 11a or the second inner surface 12a of the housing 10. The wick 30 has a through-hole 60 passing therethrough in the thickness direction Z. The wick 30 located in a region overlapping the first supporter in a plan view of the first inner surface 11a has at least one through-hole 60 present therein, and is provided with a first protruding section 61a which is closer to the first supporter in the thickness direction Z than the peripheral edge of the through-hole 60 located in the region.
F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 1/32 - Means for protecting converters other than by automatic disconnection
H03K 17/08 - Modifications for protecting switching circuit against overcurrent or overvoltage
A filter device includes first and second terminals, a first inductor located between the first and second terminals, and an LC series resonator connected in parallel to the first inductor and including a first capacitor and a second inductor. The first and second inductors are magnetically coupled to each other. An inductance of the first inductor is smaller than an inductance of the second inductor.
An inductor including an element body containing metal magnetic powder and resin and having a coil conductor that has a winding portion, an extended portion extended from the winding portion, and an outer electrode connection portion leading to the extended portion and connected to an outer electrode and is embedded in the element body; and an element body coat covering a surface of the element body. The outer electrode is formed on a surface of the element body and connected to the outer electrode connection portion, in which the outer electrode connection portion has a region covered with the element body coat and a region connected to the outer electrode on the surface of the element body.
A sintered body that includes: a spinel ferrite oxide having a main constituent of metal elements of Fe, Ni, Cu, and Zn; and Zr, Mn, Al, Co, and Cr. Wherein, when Zn, Ni, Cu, Zr, Mn, Al, Co, and Cr have a contained mole part: “a”, “b”, “c”, “d”, “e”, “f”, “g”, and “h”, respectively, and based on Fe being 100 mole parts: 49.0<100−a−b−c+2d+(1/2)e<50.0, 50.2
C04B 35/26 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
An object detection device includes a wave transmitter to transmit a sound wave to an object, a wave receiver to receive the sound wave and generate a signal representing a reception result, and a controller to control transmission of the sound wave by the wave transmitter and obtain the receive signal from the wave receiver. The controller is configured or programmed to output a transmit signal to cause the wave transmitter to transmit the sound wave and obtain a corresponding receive signal. The controller is configured or programmed to generate detection information about the object by performing complexification on a correlation signal representing a correlation between the transmit signal and the receive signal. A signal corrector is configured or programmed to correct any of the correlation signal, the receive signal, and the transmit signal to mitigate a direct-current component in the correlation signal targeted for the complex analysis.
G01S 7/539 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisation; Target signature; Target cross-section
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
A tire observation apparatus includes a computer and an imaging device including a camera and range sensors positioned at different angles relative to a ground surface. The computer is configured or programmed to calculate a position of a tire relative to the camera by using various distances to the tire calculated by the range sensors. By using the position of the tire, the computer is configured or programmed to calculate an amount of adjustment usable by the imaging device to adjust the position and an angle of the camera such that an imaging center of the camera is directed at a center of the tire or at a surface of the tire that is to be measured.
Provided is a chip-type electronic component that is less likely to cause separation of a spacer and a mounting substrate. A chip-type electronic component 1 of the present invention comprises a multilayered ceramic capacitor 1A and spacers 10. The multilayered ceramic capacitor 1A comprises: a stack 2 that includes internal electrode layers 5 and dielectric layers 4 that are alternately disposed; and external electrodes 3. When the two surfaces of the stack 2 opposing each other in the multilayered direction are capacitor main surfaces A, the two surfaces thereof opposing each other in the width direction are capacitor side surfaces B, and the two surfaces thereof opposing each other in the length direction are capacitor end surfaces C, the external electrodes 3 are respectively provided on the capacitor end surfaces C. The spacers 10 are disposed on both sides in the length direction of the capacitor main surface A on the mounting substrate side of the multilayered ceramic capacitor 1A. When the two surfaces opposing each other in the multilayered direction of each of the spacers 10 are spacer main surfaces AS, a recess 11 is formed in the surface of the spacer main surface AS on the mounting substrate side.
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
The present invention provides a multilayer ceramic capacitor which is not susceptible to the occurrence of a crack or the like in a ceramic element. This multilayer ceramic capacitor is provided with: a ceramic element which is obtained by stacking a plurality of ceramic layers, a plurality of first internal electrodes and a plurality of second internal electrodes in the height direction, and which has a first main surface and a second main surface opposite to each other in the height direction, a first end face and a second end face opposite to each other in the length direction that is perpendicular to the height direction, and a first lateral surface and a second lateral surface opposite to each other in the width direction that is perpendicular to the height direction and the length direction; and a first external electrode and a second external electrode, which are formed on the outer surface of the ceramic element. The first internal electrodes are led out in the first end face, and are electrically connected to the first external electrode; while the second internal electrodes are led out in the second end face, and are electrically connected to the second external electrode. If a cross-section that is parallel to the first lateral surface and the second lateral surface is examined, the first external electrode is formed in an L-shape on the first end face and the first main surface; the second external electrode is formed in an L-shape on the second end face and the first main surface; and the second main surface is provided with a plurality of embossed pores.
Provided is a filter device that can suppress an increase in insertion loss. This filter device comprises: a first piezoelectric substrate 2A that has a first main surface 2a and a second main surface 2b opposed to each other; one or more first elastic wave resonators 13A that each include a function electrode provided on the first main surface 2a of the first piezoelectric substrate 2A and that are series-arm resonators or parallel-arm resonators; a supporter 8A that is provided on the first main surface 2a of the first piezoelectric substrate 2A and that surrounds the first elastic wave resonators 13A; a second piezoelectric substrate 2B that is provided on the supporter 8A and that has a third main surface 2c positioned on the first piezoelectric substrate 2A side and a fourth main surface 2d opposed to the third main surface 2c; one or more second elastic wave resonators 13B each of which includes a function electrode provided on the third main surface 2c of the second piezoelectric substrate 2B and at least one of which is a parallel-arm resonator; and an external connection terminal 11 that is provided in the second piezoelectric substrate 2B. A space surrounded by the first piezoelectric substrate 2A, the second piezoelectric substrate 2B, and the supporter 8A is configured. The first elastic wave resonators 13A and the second elastic wave resonators 13B are positioned in the space. The one or more second elastic wave resonators 13B include a parallel-arm resonator having the highest resonance frequency among all of the parallel-arm resonators configured on the first piezoelectric substrate 2A and the second piezoelectric substrate 2B.
This RFID module comprises: a first substrate having a first main surface and a second main surface that face each other; an RFIC chip disposed on the first main surface-side of the first substrate; a first radiation element disposed on the first main surface-side of the first substrate such that at least a part of the radiation element is set apart from the first main surface; and a second radiation element disposed on the second main surface-side of the first substrate. The second radiation element has a first end and a second end that face each other in the longitudinal direction of the first substrate. The first end is electrically connected to one terminal of the RFIC chip. The first radiation element has a third end and a fourth end that face each other in the longitudinal direction of the first substrate. The third end is electrically connected to the other terminal of the RFIC chip. The second end of the second radiation element and the fourth end of the first radiation element are electrically connected to each other. The second radiation element has a first opening.
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H05K 1/14 - Structural association of two or more printed circuits
A blower device (10) comprises: a housing (20) that has an air inlet (281) and an air outlet (291); an air filter (40) that is disposed at a position where the air filter (40) overlaps with the air inlet (281) of the housing (20) when the air inlet (281) is viewed from the front; and a filter cover (30) that holds the air filter (40) and that is disposed at a position where the filter cover (30) overlaps with the air filter (40) when the air inlet (281) is viewed from the front. The filter cover (30) includes a plurality of posts (321-323) that are spaced apart from each other. The posts (321-323) include projections (321P, 323P) that project toward the air filter (40). The filter cover (30) is fixed to the housing (20) in a state in which the projections (321P, 323P) are in contact with the air filter (40) and portions of the plurality of posts (321-323) other than the projections (321P, 323P) are apart from the air filter (40).
A pulse-shaping network configured for use in a radio frequency (rf) power amplifier system, the pulse-shaping network comprising: a coupled magnetic element comprising a first inductive element magnetically coupled to a second inductive element, the first inductive element comprising a first winding disposed about a first portion of a core, and the second inductive element comprising a second winding disposed about a second portion of a core, wherein the first and second inductive elements are electrically coupled to provide three output terminals of the coupled magnetic element.
Circuits and methods for selectable conversion ratio power converters that include low-dropout (EDO) power supplies adapted to select voltage inputs based on the selected conversion ratio while achieving high efficiency. The EDO power supplies limit current through power FETs of power converters, thereby mitigating or eliminating potentially damaging events. In some embodiments, first and second full gate-drive LDOs have "wired-OR" outputs which may power a target circuit such as a pre-driver (and optionally, a level-shifter) coupled to the gate of a power FET. In some embodiments, first and second reduced gate-drive LDOs have "wired-OR" outputs that may power a final driver coupled to the gate of a power FET. Some embodiments have dual full gate-drive LDOs that power a target circuit such as a pre-driver (and optionally, a level-shifter), while dual reduced gate-drive LDOs that power a final driver coupled to the gate of the power FET.
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
A communication circuit includes a transmission terminal to which a transmission signal is supplied, a first duplexer that has a transmission node, a reception node, and a common node, a first filter that has a first end part electrically connected to the common node of the first duplexer and a second end part electrically connected to an antenna terminal, a first auxiliary output terminal that outputs the transmission signal to an external circuit, an inductor that is part of a second filter and has a first end part and a second end part that is electrically connected to the first auxiliary output terminal, and a first switch that switches the electrical connection destination of the transmission terminal between the transmission node of the first duplexer and the first end part of the inductor.
A coil component includes a drum core including a winding core portion, and first and second flange portions; and a first metal terminal which includes a bonding portion, a connecting portion, a mounting portion, an extending portion, and a joining portion. The first flange portion includes a main body portion, an end-surface-side protruding portion protruding from an outer end surface of the main body portion and a bottom-surface-side protruding portion protruding from a bottom surface of the main body portion. In a direction parallel to a second axis, a shortest distance from an end of the end-surface-side protruding portion on the second positive direction side to the joining portion is a first distance. A maximum distance from the end of the end-surface-side protruding portion to a side end surface of the end-surface-side protruding portion is a second distance. The first distance is larger than the second distance.
To suppress a decrease in mounting strength of a coil component, a coil component includes a drum core including a winding core portion, and first and second flange portions. The coil component includes a first metal terminal which includes a bonding portion, a connecting portion, and a mounting portion. The bonding portion is bonded to the first flange portion with an adhesive. The mounting portion is closest to the first positive direction side in the first metal terminal and is separated from the first flange portion toward the first positive direction side. The connecting portion connects the bonding and mounting portions. The first flange portion has a facing surface that faces the mounting portion, a bonding surface, and a first inclined surface between the facing and bonding surfaces. The distance from the facing surface increases in a direction parallel to the first axis toward the bonding surface.
To suppress deformation of a mounting portion, a coil component includes a drum core including a winding core portion, a first flange portion, and a second flange portion. The coil component includes a first metal terminal. The first metal terminal includes a joining portion, a mounting portion, and an extending portion. A first wire end of the first wire is connected to a surface of the joining portion facing a first positive direction. The mounting portion is located closest to the first positive direction in the first metal terminal. The extending portion connects the mounting portion and the joining portion. The extending portion includes a second portion having a thickness dimension smaller than the thickness dimension of the mounting portion.
A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a transistor and a feedback circuit. The transistor receives, at its base or gate, a radio frequency signal and a bias voltage or current which changes, and outputs an amplified radio frequency signal from its collector or drain. The feedback circuit provides, to the base or gate or the emitter or source of the transistor, a voltage or a current based on the amplified radio frequency signal.
An acoustic wave device includes a support substrate with a thickness in a first direction, an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an IDT electrode including a first electrode finger at the piezoelectric layer in the first direction and extending in a second direction intersecting the first direction, a first busbar electrode connected to the first electrode finger, a second electrode finger facing the first electrode finger in a third direction orthogonal or substantially orthogonal to the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode finger. The intermediate layer includes a void portion at least partially overlapping the IDT electrode in plan view, and a surface roughness of an inner sidewall of the intermediate layer is about 0.0055 μm or more.
A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
Commissariat A L'Energie Atomique Et Aux Energies Alternatives (France)
Inventor
Oukassi, Sami
Sallaz, Valentin
Voiron, Frédéric
Abstract
A supercapacitor that includes: a first electrode; a second electrode; and a composite solid electrolyte disposed between the first electrode and the second electrode. The composite solid electrolyte includes a dielectric matrix and an ionic conductor disposed in channels/pores in the dielectric matrix. Methods of fabricating such supercapacitors are also disclosed.
An acoustic wave device includes a piezoelectric material layer, and an IDT electrode on the piezoelectric material layer and including first electrode fingers and second electrode fingers arranged periodically. The electrode fingers each include at least one electrode layer including at least one of Nb, Pd, or Ni. A sum of thicknesses of the at least one electrode layer, calculated assuming that the electrode layer(s) includes Mo and based on a density ratio between the electrode layer(s) and Mo, is at least about 10% of a spatial period of the electrode fingers.
An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support substrate, a space overlapping at least a portion of the piezoelectric layer, and a functional electrode on the piezoelectric layer. The support includes a space at a position at least partially overlapping the functional electrode in plan view. The functional electrode includes a first metal layer and a second metal layer on at least a portion of the first metal layer. A linear expansion coefficient of the second metal layer is smaller than a linear expansion coefficient of the first metal layer.
This vibration device comprises: a vibration body; a piezoelectric element that is located at one end in a first direction of the vibration body; a light-transmitting body that is located at the other end in the first direction of the vibration body; a retaining part that, with the other end of the vibration body, sandwiches the light-transmitting body therebetween in the first direction; a first member that is located between the light-transmitting body and the retaining part and connected to the light-transmitting body and the retaining part; and a second member that is located between the light-transmitting body and the vibration body and connected to the light-transmitting body and the vibration body. The thickness of the first member is greater than or equal to the thickness of the second member.
This secondary battery is provided with: a positive electrode that contains a positive electrode active material and a plurality of fibrous substances; a negative electrode; and an electrolyte solution. The positive electrode active material contains a sulfur-containing material; and the plurality of fibrous substances are intertwined with each other, thereby forming a three-dimensional network structure. The fibrous substances each comprise a carbon fiber part and a plurality of carbon covering parts that cover the surface of the carbon fiber part and hold the positive electrode active material. The plurality of carbon covering parts are separated from each other in the extending direction of the carbon fiber part; and the carbon fiber part has a plurality of exposed parts that are not covered by the plurality of carbon covering parts. The carbon covering parts each have a first end and a second end which is positioned on the opposite side of the first end in the extending direction of the carbon fiber part. The degree of flexibility of the fibrous substances expressed by formula (1) is 8.6 to 19.2. (1): F = (L2/L1) × T (In the formula, F denotes the degree of flexibility; L1 represents the length (µm) of the carbon fiber part in the extending direction of the carbon fiber part; L2 represents the sum (µm) of the respective lengths of the plurality of exposed parts in the extending direction of the carbon fiber part; and T represents the sum (number) of the respective numbers of the first ends and the second ends.)
Provided is a protrusion-and-recess structure that has sufficiently high drug resistance and is unlikely to break. A protrusion-and-recess structure (1) according to the present invention is composed of a film-like frame part (20) in which a plurality of droplet-shaped recessed sections (10) are formed on one main surface (1a), wherein the frame part (20) is a porous ceramic sintered body having a porosity of 45% or less, and the average value of the maximum depths (D) of the recessed sections (20) in the thickness direction of the frame section (20) is 0.01 times to less than 1.0 times the thickness (T) of the frame section.
Provided is a film capacitor in which a laminate film covering a capacitor element is hardly damaged even when being sandwiched by means of pressure force. A film capacitor (1) according to the present invention includes: a capacitor element (10) including an element body (11) having end surfaces (11e) located on both ends in the longitudinal direction (L) and lateral surfaces (11s) connecting the end surfaces (11e) to each other, and external electrodes (12) provided on the end surfaces (11e) of the element body (11); a laminate film (20) covering the capacitor element (10); and an intermediate member (30) disposed at at least a portion between the capacitor element (10) and the laminate film (20).
Provided is a plating apparatus that suppresses the occurrence of defects in a plated object without the plated object rising excessively to a high position in a plating solution in which the plated object is contained, even if the flow rate of the plating solution sprayed from a spraying unit is increased. The plating apparatus according to the present invention comprises: a plating tank that stores the plating solution and contains the plated object; and the spraying unit, which includes a first spraying port that is formed in the plating tank and sprays the plating solution, the plated object in the plating solution being agitated by the plating solution sprayed from the spraying unit. A mesh member is provided to the first spraying port of the spraying unit. The mesh member is formed by overlapping at least two meshes, and, when viewed in a planar direction, the mesh member includes a center portion and a peripheral portion provided to the outside of the center portion. The peripheral portion is formed using a layer of one mesh or a layer of a plurality of meshes. The center portion is formed in a layer of a plurality of meshes, and the number of layers of the mesh in the center portion is greater than the number of layers of the mesh in the peripheral portion.
C25D 17/28 - Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during the treatment
C25D 21/10 - Agitating of electrolytes; Moving of racks
Provided is a plating apparatus with which the time required for plating is improved and unevenness in the thickness of the obtained plating film is minimized. This plating apparatus comprises a plating tank storing a plating liquid, a cylindrical metal tube having a hollow part, a cylindrical mesh tube having a hollow part, and a second electrode, wherein: the metal tube is a first electrode; the mesh tube is produced from an insulating material; the metal tube, the mesh tube, and the second electrode are housed in the plating tank; the metal tube is disposed inside the hollow part of the mesh tube; a plating forming part is formed between the inner side of the mesh tube and the outer side of the metal tube; the second electrode is disposed on the outer side of the mesh tube; an upward flow lifting the plating liquid is generated inside the hollow part of the metal tube; and an object to be plated is lifted inside the hollow part of the metal tube by the upward flow of the plating liquid, is discharged to the outside of the metal tube, is stirred, then falls inside the plating forming part, and is plated through application of a current between the metal tube, i.e. the first electrode, and the second electrode during the descent of the object. There is an auxiliary electrode inside the plating part, the auxiliary electrode being electrically connected to the metal tube, i.e. the first electrode.
C25D 17/28 - Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during the treatment
Provided is a plating apparatus with which, even when the flow amount of a plating solution sprayed from a spray unit is increased, there is no excessive rising of a material subject to plating to a high position within retained plating solution, and defects in the material subject to plating are inhibited from occurring. This plating apparatus comprises a plating bath that retains a plating solution containing a material subject to plating, and a spray unit that is formed on the plating bath and that sprays the plating solution, the material subject to plating contained in the plating solution being stirred by the plating solution sprayed from the spray unit. The spray unit has an inner cylindrical shape having a bottom surface that expands in the horizontal direction, an inner wall that extends in the height direction from the bottom surface, and an opening formed at the upper end of the inner wall. The opening is a first spray port through which the plating solution is sprayed into the plating bath. A mesh member is provided to the first spray port. A second spray port through which the plating solution is sprayed into the spray unit is provided to the bottom surface. A flow rate control plate in which a plurality of holes are formed is provided, parallel to the bottom surface, at a location partway along the height direction of the spray unit. When viewed in a planar direction, the flow rate control plate has a center part and a periphery part provided to the outer side of the center part. The respective opening areas of the holes formed in the center part is less than the respective opening areas of the holes formed in the periphery part. A cylindrical member having a hollow part is provided between the flow rate control plate and the mesh member of the first spray port.
C25D 17/28 - Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during the treatment
C25D 21/10 - Agitating of electrolytes; Moving of racks
The present invention provides a solid-state battery having an exterior part that contains oxide ceramics demonstrating even more satisfactory reactivity resistance to solid electrolytes and can be formed so as to demonstrate even more satisfactory moisture resistance, compared to the state of the art. The present invention pertains to a solid-state battery having an exterior part 2 including oxide ceramics containing one or more kinds of elements (M) selected from the group consisting of group 4 and group 5 elements, Li (lithium), and Mg (magnesium).
The present invention provides a multilayer ceramic capacitor (1) in which the occurrence of dielectric breakdown is further suppressed. The multilayer ceramic capacitor (1) comprises: a laminate (2) including a plurality of dielectric layers (4) and a plurality of internal electrode layers (10) stacked on one another; and external electrodes (20) provided on a first end surface (62a) and a second end surface (62b). The internal electrode layers (10) comprise first internal electrode layers (10a) and second internal electrode layers (10b), the first internal electrode layers (10a) being led to the first end surface (62a), and the second internal electrode layers (10b) being led to the second end surface (62b). The external electrodes (20) include a first external electrode (20a) connected to the first internal electrode layers (10a) and a second external electrode (20b) connected to the second internal electrode layers (10b). A region that is disposed on the first end surface (62a) side and in which the first internal electrode layers (10a) do not overlap each other in the stacking direction (T), and a region that is disposed on the second end surface (62b) side and in which the second internal electrode layers (10b) do not overlap each other in the stacking direction (T) are defined as L gap regions (51). The L gap regions (51) comprise Si segregation layers (14).
This vehicular air conditioning device (10) comprises: a compressor (31) that compresses a refrigerant; a condenser (32) that liquefies a refrigerant discharged from the compressor (31); expansion valves (41, 42) that decompress the liquefied refrigerant; evaporators (511, 521) that vaporize the decompressed refrigerant and absorb the heat; and a refrigerant circuit which circulates, to the compressor (31), the refrigerant discharged from the evaporators (511, 521), and in which oil is encapsulated together with the refrigerant. The vehicular air conditioning device (10) includes a control device (20) that controls the expansion valves (41, 42) and operation of the compressor (31), and oil sensors (71, 72, 73) provided to at least one among piping connecting the condenser (32) and the evaporators (511, 521), and piping connecting the condenser (32) and the evaporators (511, 521) in the refrigerant circuit. The control device (20) performs an oil return operation in accordance with an output of the oil sensors (71, 72, 73).
A battery characteristic acquisition system (10) comprises: a charging control unit (21), a measuring unit (22), a storage unit (33), and a characteristic curve creation unit (321). The charging control unit (21) charges a battery (90). The measuring unit (22) measures the OCV of the battery (90) before the start of charging and the charge capacity value charged from the start of charging to the completion of charging by full charging, and calculates the SOC at the start of charging by subtracting the measured charge capacity value from the full charge capacity of the secondary battery. The storage unit (33) stores the OCV and the SOC for a plurality of times. The characteristic curve creation unit (321) creates an SOC-OCV curve of the battery (90) by using the OCV and remaining capacity for a plurality of times.
G01R 31/382 - Arrangements for monitoring battery or accumulator variables, e.g. SoC
G01R 31/385 - Arrangements for measuring battery or accumulator variables
G01R 31/387 - Determining ampere-hour charge capacity or SoC
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02J 7/04 - Regulation of the charging current or voltage
79.
LOAD SENSOR AND METHOD FOR MANUFACTURING LOAD SENSOR
This load sensor 1 for sensing a load in the thickness direction comprises: an upper casing 30 having an upper surface part 31 and a side surface part 32 extending in the thickness direction from the outer circumference of the upper surface part 31; a lower casing 20 having a lower surface part 21 that faces the upper surface part 31 in the thickness direction, the lower casing 20 having a property of being less elastically deformable than the upper casing 30; a piezoelectric vibrator 10 accommodated in a space between the upper casing 30 and the lower casing 20, the piezoelectric vibrator 10 having a piezoelectric substrate 13 provided between the upper surface part 31 and the lower surface part 21, and a pair of excitation electrodes provided on the mutually opposing main surfaces of the piezoelectric substrate 13. The pair of excitation electrodes extend in the thickness direction. One edge from among an edge 35 of the upper casing 30 and an edge 25 of the lower casing 20 is fixed by crimping to the other edge. The elastic deformation of the upper casing 30 due to the crimping causes the upper casing 30 to apply a preload to the piezoelectric vibrator 10 in the thickness direction.
The present invention relates to a secondary battery that includes a current collector and an electrode layer disposed on the current collector, wherein the electrode layer includes a water-insoluble polymer and a water-soluble polymer, the water-insoluble polymer has a relatively large distribution to the current collector side in the electrode layer, and the water-soluble polymer is distributed evenly in the thickness direction facing from the electrode layer to the current collector.
This wiring board comprises a first base material having a first main surface, a second base material having a second main surface, a first wire disposed on the first main surface, and a second wire disposed on the second main surface. The first main surface and the second main surface are in contact with each other. The first base material and the second base material are in connection with each other. The first wire and the second wire are opposed to each other in the thickness direction of the first base material and are electrically connected to each other.
This capacitor element 1 comprises: a capacitor unit 10 that includes an anode plate 11 having a porous part 11B on at least one main surface of a core part 11A, a dielectric layer 13 provided on the surface of the porous part 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13; and a sealing layer 30 that seals the capacitor unit 10, where inside the sealing layer 30, an insulation layer 40 having a lower Young's modulus than the sealing layer 30 is provided at a position not in contact with the cathode layer 12.
This stretchable device comprises: a stretchable first base material; first wiring provided on a first primary surface of the first base material; a second base material which faces the first base material in a first direction which is the thickness direction of the first base material and is connected to the first base material; second wiring which is provided on a first primary surface of the second base material and faces the first wiring in the first direction; and a first protective layer which is continuously provided on the first primary surface of the first base material and a second primary surface of the second base material so as to cover at least a portion of the first wiring and a portion of the second base material, wherein the first wiring and the second wiring are electrically connected in an overlap region where the wirings overlap each other when viewed in the first direction, and the first protective layer overlaps the entirety of the overlap region when viewed in the first direction.
H05K 1/14 - Structural association of two or more printed circuits
H01R 12/61 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
H05K 3/36 - Assembling printed circuits with other printed circuits
84.
BONDED STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE MEMBER FOR SOLDER BONDING, AND STRUCTURE FOR SOLDER BONDING
A bonded structure which comprises a first conductive member, a second conductive member, and a solder bonding part for bonding the first conductive member and the second conductive member to each other, wherein at least one of the first conductive member and the second conductive member contains a metal and particles of a layered material that comprises one or more layers.
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/103 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
This analysis method comprises: performing molecular dynamics calculations on an electrolyte to calculate the behavior over time of a series of atoms that make up constituent components of the electrolyte; calculating a first dielectric relaxation spectrum signal of the constituent components on the basis of the behavior of the series of atoms over time; calculating a second dielectric relaxation spectrum signal of the electrolyte on the basis of the first dielectric relaxation spectrum signal; and calculating physical property values specific to the constituent components on the basis of the first dielectric relaxation spectrum signal and the second dielectric relaxation spectrum signal.
G01N 22/00 - Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more
An amplification circuit (1), which receives a plurality of discrete power supply voltages, comprises: a carrier amplifier (12); a peak amplifier (22); a synthesizing circuit (40) that synthesizes a high frequency signal output from the carrier amplifier (12) and a high frequency signal output from the peak amplifier (22); a bias circuit (50) that supplies a first bias current to the peak amplifier (22); digital control terminals (140 and 150) that receive digital control signals based on an envelope signal; and a switch (23) that is connected to the digital control terminals (140 and 150) to switch between connection and disconnection of the bias circuit (50) and the peak amplifier (22). Each of the carrier amplifier (12) and the peak amplifier (22) includes a plurality of cascode-connected amplification elements.
H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 3/68 - Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics
This tracker module (7) comprises: a substrate (390) on which a switch included in a pre-regulator circuit (310) configured to convert input voltage to regulated voltage is disposed and a separate module substrate (90); a switched capacitor circuit (20) configured to generate a plurality of discrete voltages on the basis of the regulated voltage; and an output switch circuit (30) configured to selectively output at least one of the discrete voltages to an amplifier, where the switch and capacitor included in the switched capacitor circuit (20), as well as the switch included in the output switch circuit (30) are disposed on the module substrate (90).
A secondary battery with improved performance is provided. The secondary battery is provided with an electrode wound body, a first electrode current-collecting plate, a second electrode current-collecting plate, an electrolyte solution, and a battery can. The electrode wound body has a first end face and a second end face. The first electrode current-collecting plate is disposed to face the first end face. The second electrode current-collecting plate is disposed to face the second end face. The first electrode comprises: a first electrode coating portion in which the first electrode current collector is coated with a first electrode active material layer; and a first electrode exposed portion in which the first electrode current collector is not coated with the first electrode active material layer and is exposed, the first electrode exposed portion being bonded to the first electrode current-collecting plate and being located adjacent to the first electrode coating portion in a first direction. The number of bent portions of the first electrode current collector of the first electrode exposed portion in a central axis-side portion of the electrode wound body is greater than the number of bent portions of the first electrode current collector of the first electrode exposed portion in an outer peripheral-side portion of the electrode wound body.
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
H01M 10/04 - Construction or manufacture in general
H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
89.
SECONDARY BATTERY ELECTROLYTIC SOLUTION AND SECONDARY BATTERY
This secondary battery comprises a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes a phenylisothiocyanate compound represented by formula (1).
A coil component includes an element body including a multilayer body in which a first ferrite layer, a first glass layer, and a second ferrite layer are laminated in that order; a coil embedded in the first glass layer; and an outer electrode provided on an outer surface of the element body and electrically connected to the coil. The first glass layer includes regions in which Cu and Mg coexist.
An amplifier module includes an antenna that includes four power feed points, and four power amplifiers. Output ends of the four power amplifiers are connected to the four power feed points in a one-to-one relationship. The four power feed points are arranged rotationally symmetrically around a center of the antenna when a main surface of the antenna is viewed in plan.
A power amplifier circuit and an LC circuit are included. The power amplifier circuit amplifies a radio frequency signal by switching between the first mode, in which power is amplified by using the envelope tracking system, and the second mode, in which power is amplified by using the average power tracking system. The LC circuit is connected, at its first end, to the power supply path of the power amplifier circuit and that is grounded, at its second end, through a switch circuit. The LC circuit includes a first capacitor and an inductor that is connected in series to the first capacitor. The switch circuit is controlled to be switched off in the first mode and is controlled to be switched on in the second mode.
An amplifier module includes an input terminal; a first preamplifier formed in or on a first substrate and configured to amplify a signal that is input to the input terminal; a first postamplifier and a second postamplifier that are formed in or on a second substrate and that are configured to receive an output of the first preamplifier and output a differential signal; an output balun configured to receive the differential signal that is output from the first postamplifier and the second postamplifier; and a variable capacitance element. The output balun includes a primary winding subjected to the differential signal and a secondary winding, and the variable capacitance element is connected in parallel with the primary winding of the output balun.
An amplifier circuit includes amplifiers, transformers, and a transmission line. A first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to an output terminal of the amplifier via the transmission line, a first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to the output terminal of the amplifier via the transmission line, a first end of an output-side coil is connected to an output terminal, a second end of the output-side coil is connected to a ground, a first end of an output-side coil is connected to an output terminal, and a second end of the output-side coil is connected to the ground.
An electronic component that includes: a base body having an outer surface defining a recess with an inner surface, wherein, when the recess is viewed in a direction orthogonal to the outer surface, at least a part of an outer edge of the recess is curved, and when the recess is viewed in a section orthogonal to the outer surface, at least a part of the inner surface of the recess is curved; a wiring inside the base body; and a glass film covering the outer surface of the base body and not covering the inner surface of the recess.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
An acoustic wave device includes a support, a piezoelectric layer with an anisotropic coefficient of linear expansion, and including first and second main surfaces, at least one through-hole, a first electrode in or on the first main surface, and a second electrode in or on the second main surface and opposed to the first electrode. A cavity is provided in the support. At least a portion of the first and second electrodes overlaps the cavity in plan view. In plan view, the at least one through-hole is line symmetric about an axis of symmetry that passes a center of the cavity in a region where the first and second electrodes overlap each other and that extends in a direction in which the coefficient of linear expansion of the piezoelectric layer is greatest.
In a high frequency module, a plurality of filters is connected to an antenna terminal with a switch interposed. The plurality of filters includes a first filter that has a pass band including a frequency band of a first communication band and a second filter that has a pass band including a frequency band of a second communication band that is capable of simultaneous communication with the first communication band. A first electronic component having the first filter and a second antenna end resonator of the second filter is disposed on a first principal surface of the mounting substrate. A second electronic component having at least one second acoustic wave resonator other than a second antenna end resonator of the second filter is disposed on the first principal surface of the mounting substrate.
Filter devices and methods are disclosed. A single-crystal piezoelectric plate is attached to substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate defines a low band filter including low band shunt resonators and low band series resonators and a high band filter including high band shunt resonators and high band series resonators. Interleaved fingers of interdigital transducers (IDTs) of the low band shunt resonators are disposed on respective diaphragms having a first thickness, interleaved fingers of IDTs of the high band series resonators are disposed on respective diaphragms having a second thickness less than the first thickness, and interleaved fingers of IDTs of the low band series resonators and the high band shunt resonators are disposed on respective diaphragms having thicknesses intermediate the first thickness and the second thickness.
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An antenna module including a dielectric substrate having a long side and a short side, a ground electrode, a radiating element, a peripheral electrode, and a parasitic element. The radiating element is disposed to face the ground electrode. The peripheral electrode is disposed along the long side of the dielectric substrate and is electrically connected to the ground electrode. The parasitic element is disposed along the short side of the dielectric substrate and is disposed away from the radiating element. The radiating element is configured to emit radio waves in two polarization directions along the long side and the short side of the dielectric substrate. The shortest distance between the radiating element and the parasitic element is greater than the shortest distance between the radiating element and the peripheral electrode.
The present invention provides a secondary battery that has higher reliability. This secondary battery comprises an electrode winding body, a first electrode current collector plate, and a second electrode current collector plate. The electrode winding body has a laminate in which a first electrode and a second electrode are laminated with a separator interposed therebetween, said laminate being wound about a central axis that extends in a first direction, and having a first end surface and a second end surface that are on opposite sides from each other in the first direction. The first electrode current collector plate faces the first end surface of the electrode winding body and is connected to the first electrode. The second electrode current collector plate faces the second end surface of the electrode winding body and is connected to the second electrode. The first electrode has a first electrode covered portion in which a first electrode current collector is covered by a first electrode active material layer, and a first electrode exposed portion in which the first electrode current collector is exposed and not covered by the first electrode active material layer. A plurality of first edge portions among the first electrode exposed portion, said first edge portions being adjacent in the radial direction of the electrode winding body, are bent toward the central axis so as to overlap each other, thereby forming the first end surface, and each tip portion of the plurality of first edge portions includes a first curved surface.
H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
H01M 4/48 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/536 - Electrode connections inside a battery casing characterised by the method of fixing the leads to the electrodes, e.g. by welding
