Abstract

A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

A method of generating a tessellated output file comprising receiving a computer-aided design (CAD) model file defining a CAD model including a plurality of vertices, a plurality of curves, a plurality of surfaces, and at least one volume; generating base polygon data defining the CAD model for additive manufacturing, the base polygon data including a plurality of connected polygons, each polygon including a plurality of nodes, a plurality of edges, and a face; generating data for a vertex metadata container including a listing of CAD model vertices and one polygon node associated with each CAD model vertex; generating data for a curve metadata container including a listing of CAD model curves and at least one polygon edge associated with each CAD model curve; and generating data for a surface metadata container including a listing of CAD model surfaces and at least one polygon face associated with each CAD model surface.

IPC Classes  ?

• G06F 17/50 - Computer-aided design
• B33Y 50/00 - Data acquisition or data processing for additive manufacturing

Abstract

An improved superhydrophobic coating and a process of making it is provided herein. More particularly, a robust superhydrophobic coating is produced by using carbon dioxide to enhance the integration of a binder material into the superhydrophobic coating. The carbon dioxide may be used to infiltrate and fill the interstitial voids of a superhydrophobic material, such as diatomaceous earth. Consequently, occupying these voids in the superhydrophobic material effectively blocks other components (e.g., binders) from entering the voids. As a result, the coating formulations of the present invention are more robust and may strongly adhere to the substrates to which they are applied.

IPC Classes  ?

• B01J 2/30 - Processes or devices for granulating materials, in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic using agents to prevent the granules sticking together; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
• C09D 7/80 - Processes for incorporating ingredients
• C09D 1/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
• B05D 5/08 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
• B05D 1/02 - Processes for applying liquids or other fluent materials performed by spraying

Abstract

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

IPC Classes  ?

• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

An electromagnetic launcher with a closed-loop guideway and conductors for launching a projectile. The projectile is accelerated along the guideway using electromagnetic forces until it reaches a desired speed, then the projectile is launched in a desired direction. The direction of the launch of the projectile is determined by orienting the guideway in the desired direction using an actuator. The guideway may include a door or aperture allowing the projectile to be launched therefrom, tangent to the curvature of the guideway.

IPC Classes  ?

• F41B 6/00 - Electromagnetic launchers
• H02K 41/02 - Linear motors; Sectional motors

Abstract

An electromagnetic launcher with a curved or spiral-shaped, open-ended guideway and conductors for launching a projectile. The projectile, movably retained on or within the guideway, is accelerated along the guideway using electromagnetic forces until it reaches an end of the guideway, then the projectile is launched in a desired direction. The direction of the launch of the projectile is determined by orienting the guideway in the desired direction using an actuator.

IPC Classes  ?

• F41B 6/00 - Electromagnetic launchers

Abstract

A system for creating an internal formation of a tubular structure having an inner surface via additive manufacturing. The system broadly includes a computer modeling system and an additive manufacturing system. The computer modeling system may include a processor for generating a lattice cellular component via computer-aided design software according to inputs received from a user. The processor may also generate an internal formation lattice structure based on the lattice cellular component and modify the lattice structure to follow and/or conform to the curvature of the inner surface of the outer wall of the tubular structure. The additive manufacturing system may be configured to produce the lattice structure and the tubular structure via additive manufacturing material deposited layer by layer according to the lattice structure.

IPC Classes  ?

• G06F 17/50 - Computer-aided design
• G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)

Abstract

A system and method of creating a shape-conforming lattice structure for a part formed via additive manufacturing. The method includes receiving a computer model of the part and generating a finite element mesh. A lattice structure including a number of lattice cellular components may also be generated. Some of the mesh elements of the finite element mesh may be deformed so that the finite element mesh conforms to the overall shape of the part. The lattice structure may then be deformed so that the lattice structure has a cellular periodicity corresponding to the finite elements of the finite element mesh. In this way, the part retains the benefits of its overall shape and the benefits of lattice features without introducing structural weak points, directional stresses, and other structural deficiencies.

IPC Classes  ?

• B29C 67/00 - Shaping techniques not covered by groups , or
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 50/00 - Data acquisition or data processing for additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• G06F 17/50 - Computer-aided design

Abstract

A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/02 - Printed circuits - Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

Abstract

An apparatus for generating seismic waves includes a housing, a strike surface within the housing, and a hammer movably disposed within the housing. An actuator induces a striking motion in the hammer such that the hammer impacts the strike surface as part of the striking motion. The actuator is selectively adjustable to change characteristics of the striking motion and characteristics of seismic waves generated by the impact. The hammer may be modified to change the physical characteristics of the hammer, thereby changing characteristics of seismic waves generated by the hammer. The hammer may be disposed within a removable shock cavity, and the apparatus may include two hammers and two shock cavities positioned symmetrically about a center of the apparatus.

IPC Classes  ?

• G01V 1/04 - Generating seismic energy - Details

Abstract

A method for removing contaminants from synthetic resin material containers using a first-organic solvent systenrand a second carbon dioxide system. The organic solvent is utilized for removing the contaminants from the synthetic resin material and the carbon dioxide is used to separate any residual organic solvent from the synthetic resin material.

IPC Classes  ?

• C08F 6/00 - Post-polymerisation treatments
• C08J 3/00 - Processes of treating or compounding macromolecular substances