Abstract

A nozzle holder assembly for a three-dimensional printer comprises a mount, a printer nozzle, and a locking mechanism. The mount is operable to be secured to the three-dimensional printer. The printer nozzle shaft is movably coupled to the mount along a predetermined length. The locking mechanism is configured to fix the printer nozzle shaft relative to the mount at any position along the predetermined length.

IPC Classes  ?

• B29C 64/209 - Heads; Nozzles
• B29C 64/25 - Housings, e.g. machine housings
• B29C 64/386 - Data acquisition or data processing for additive manufacturing

Abstract

A micro-alloyed copper powder was produced using gas atomization reaction synthesis, with the alloy preferably comprising Cu-0.3Zr-0.15Ag wt. %. The novel copper alloy improves the manufacturability of copper in powder bed fusion manufacturing processes by minimizing or avoiding the prior art problems associated with oxidation of the copper precursor used in additive manufacturing. Advantageously, the provided copper alloy powder maintains the high electrical conductivity of copper while addressing the prior art oxidation issue.

IPC Classes  ?

• B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
• B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
• B22F 1/16 - Metallic particles coated with a non-metal
• B22F 9/08 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying

Abstract

Systems, apparatuses, and methods for microfluidic fluid evaporation using femtosecond laser-patterned surfaces are disclosed. A microfluidic device may comprise a femtosecond laser-patterned substrate having at least one input path and at least one output path. The femtosecond laser-patterned substrate may comprise both superhydrophobic and superhydrophilic sections. Fluid deposited at an input path may be wicked to an output path due to the surface pattern. A heating device may be provided to heat the fluid to evaporate volatiles therefrom. Vacuums and gas streams may be used to aid in volatile removal. Gas streams may add gas to the microfluidic device to react with the fluid.

IPC Classes  ?

• B01D 1/22 - Evaporating by bringing a thin layer of the liquid into contact with a heated surface
• B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers

Abstract

A method of tuning an electrically small antenna comprising a radiating element and a support structure comprises applying a force to the support structure to change a shape or a dimension of the radiating element to increase or decrease a frequency at which the electrically small antenna resonates.

IPC Classes  ?

• H01Q 9/14 - Length of element or elements adjustable
• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
• H01Q 9/30 - Resonant antennas with feed to end of elongated active element, e.g. unipole

Abstract

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

IPC Classes  ?

• H05K 3/22 - Secondary treatment of printed circuits
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/02 - Printed circuits - Details

Abstract

A sensor discriminator for detecting a gaseous substance includes a power source, a discrimination module, a sensor simulator that simulates a metal organic framework under at least one simulation condition, a simulation circuitry electrically coupling the sensor simulator to the power source and the discrimination module, and a discriminator circuitry that electrically couples the power source and the discrimination module to a gas capture probe. The discrimination module compares a discrimination pulse and a simulation pulse from the power source after the discrimination pulse passes through a metal organic framework of the gas capture sensor and the simulation pulse passes through a simulation component of the sensor simulator. The discrimination module causes a discriminator output that includes the comparison of the discrimination pulse to the simulation pulse. An electrical property of the discrimination pulse depends on an electrical parameter of the metal organic framework that is augmented by the gaseous substance.

IPC Classes  ?

• G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
• B01J 20/22 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material

Abstract

A lattice structure and system for absorbing energy, damping vibration, and reducing shock. The lattice structure comprises a plurality of unit cells, each unit cell comprising a plurality of rib elements with at least a portion of the rib elements including a solid bendable hinge portion for converting energy into linear motion along a longitudinal axis of the respective rib element.

IPC Classes  ?

• F16F 3/02 - Spring units consisting of several springs, e.g. for obtaining a desired spring characteristic with springs made of steel or of other material having low internal friction
• F16F 15/073 - Suppression of vibrations of non-rotating, e.g. reciprocating, systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating system using elastic means with metal springs using only leaf springs
• F16F 7/12 - Vibration-dampers; Shock-absorbers using plastic deformation of members

Abstract

Provided herein are polysiloxane-based composite materials comprising a high weight percentage of elemental components (e.g., elemental boron, elemental copper, elemental bismuth, elemental lead) and low levels of carbon nanofibers. The elemental components may be present in the composite materials at levels greater than 25% by weight. Also provided herein are methods of forming the composite materials that have desirable flexibility and shielding properties. The invention provides a versatile composite material that is compliant and moldable, while still comprising high levels of the elemental shielding components. The materials are particularly useful for applications in which radiation shielding or neutron capture are desired.

IPC Classes  ?

• C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
• C08L 83/04 - Polysiloxanes
• C08K 3/02 - Elements
• C08K 3/04 - Carbon
• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08J 3/20 - Compounding polymers with additives, e.g. colouring
• C08K 3/38 - Boron-containing compounds
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Abstract

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

IPC Classes  ?

• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
• H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

Abstract

A microwave oven for warming food, the microwave oven comprising an enclosure, a microwave generator, a chemical sensor, and a controller. The enclosure forms a heating chamber in which the food is warmed. The microwave generator is configured to propagate microwaves into the heating chamber to warm the food. The chemical sensor is in fluid communication with the heating chamber and configured to detect a chemical indicative of a completed warming state of the food and transmit a detection signal indicating the completed warming state has been achieved upon detection of the chemical. The controller is configured to generate an output alteration signal representing an instruction to alter an output of the microwave generator upon receiving the detection signal from the first sensor to minimize release of the chemical.

IPC Classes  ?

• H05B 6/64 - Heating using microwaves
• G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups

Abstract

An air bearing for calibrating a force measurement device comprises an inner wall, an outer wall, an upper wall, a lower wall, an internal chamber, an object retention opening, and a plurality of air outlets. The inner wall and outer wall each have a cylindrical shape with the outer wall being concentric with the inner wall. The upper wall and lower wall each have an annular shape and are attached to the inner wall and the outer wall. The internal chamber is formed by inner surfaces of the four walls, and is configured to retain compressed air. The object retention opening is formed by an outer surface of the inner wall and is configured to receive and retain an object. The air outlets are positioned along the inner wall and are configured to allow compressed air to flow from the internal chamber to the object retention opening.

IPC Classes  ?

• G01L 25/00 - Testing or calibrating of apparatus for measuring force, torque, work, mechanical power, or mechanical efficiency
• F16C 32/06 - Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings

Abstract

A computer-implemented method for compressing video data comprises receiving a sequence of video data values, each video data value being a digital value from a successive one of a plurality of pixels that form a video sensor, the sequence of video data values resulting from successive frames of video captured by the video sensor; extracting the video data values for each pixel in turn to create a plurality of pixel data streams, each pixel data stream including the video data value for each frame of captured video for the pixel; and applying data compression to each pixel data stream to create compressed data for each pixel data stream.

IPC Classes  ?

• H04N 19/184 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being bits, e.g. of the compressed video stream
• H04N 19/172 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being an image region, e.g. an object the region being a picture, frame or field
• H04N 19/136 - Incoming video signal characteristics or properties
• H04N 19/132 - Sampling, masking or truncation of coding units, e.g. adaptive resampling, frame skipping, frame interpolation or high-frequency transform coefficient masking
• H04N 19/182 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being a pixel
• H04N 19/587 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using predictive coding involving temporal sub-sampling or interpolation, e.g. decimation or subsequent interpolation of pictures in a video sequence
• H03M 7/30 - Compression; Expansion; Suppression of unnecessary data, e.g. redundancy reduction

Abstract

A laser welding system for welding a component and reducing defects in the weld by ensuring uniform, laminar gas flow over a process area of the system. The laser welding system comprises a laser for welding the component, a platform for supporting the component, an enclosure surrounding the platform, a first actuatable barrier, a second actuatable barrier, an actuator, and a controller. The enclosure includes a plurality of walls, one of the walls having an inlet and another wall having an outlet. The inlet and outlet each having an opening having a cross-sectional area for letting gas flow through. The first and second barriers are configured to modify the cross-sectional areas of the openings when actuated. The actuator is configured to actuate the barriers, and the controller is configured to direct the actuator to actuate the barriers so that the cross-sectional area of the first opening is larger than the cross-sectional area of the second opening so that a pressure at the inlet is greater than a pressure at the outlet.

IPC Classes  ?

• B23K 26/142 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
• B23K 26/144 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
• B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
• B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure

Abstract

A locking power cord receptacle configured to receive an electric power cord plug that includes a ground pin comprises a base receptacle and a locking assembly. The base receptacle includes a first female connector, a second female connector, and a ground female connector positioned on an upper surface and arranged to receive the power cord plug. The base receptacle further includes a body cavity on the upper surface. The locking assembly has a locked state in which the locking assembly blocks access to the base receptacle and an unlocked state in which the power cord plug can be plugged in to the base receptacle. The locking assembly includes a locking cover and a locking component. The locking cover includes a disc and a sleeve coupled to the disc and the base receptacle. The locking component is retained in the body cavity and has a locked configuration and an unlocked configuration.

IPC Classes  ?

• H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
• H01R 24/30 - Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable with additional earth or shield contacts
• H01R 24/78 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure with sockets, clips or analogous contacts and secured to apparatus or structure, e.g. to a wall with additional earth or shield contacts

Abstract

A spiral antenna assembly with an integrated feed network and method of manufacturing the same are disclosed. The spiral antenna assembly may comprise a supporting structure integrally formed with a feed network structure, thereby presenting a monolithic structure. A spiral antenna element may be disposed on a bottom surface or a top surface of the supporting structure. The feed network structure may comprise the feed network and project from a center of the top surface of the supporting structure. The feed network may comprise a microstrip balun architecture. The spiral antenna assembly may be formed by additively manufacturing the supporting structure and the feed network structure. A laser direct structuring process may write and activate the spiral antenna element on the supporting structure and the feed network on the feed network structure.

IPC Classes  ?

• H01Q 9/27 - Spiral antennas
• H01Q 21/00 - Antenna arrays or systems
• H01Q 9/06 - Resonant antennas - Details
• H01Q 15/14 - Reflecting surfaces; Equivalent structures

Abstract

Systems, methods, and computer-readable media for evaluating a set of computed tomography data associated with a lattice structure. The lattice structure may be additively manufactured. The computed tomography data may be segmented using a filter for identifying blob-like structures to identify nodes present within the lattice structure. A three-dimensional path traversal is applied to volumetric data to identify a plurality of struts within the lattice structure that are compared to corresponding struts within a set if three-dimensional mesh data of the lattice structure to identify defective struts. Further, two-dimensional slices may be extracted from each of the computed tomography data and the mesh data and compared to identify one or more inconsistencies indicative of defects within the lattice structure.

IPC Classes  ?

• G06T 7/00 - Image analysis
• G06T 3/40 - Scaling of a whole image or part thereof

Abstract

Waveguides and methods for manufacturing a waveguide that include forming a first channel in a first layer of dielectric material, the first channel comprising one or more walls; forming a second channel in a second layer of dielectric material, the second channel comprising one or more walls; depositing electrically conductive material on the one or more walls of the first channel; depositing electrically conductive material on the one or more walls of the second channel; arranging the first layer adjacent to the second layer to form a stack with the first channel axially aligned with and facing the second channel; and heating the stack so that the conductive material on the one or more walls of the first channel and the conductive material on the one or more walls of the second channel connect to form the waveguide.

IPC Classes  ?

• H01P 3/12 - Hollow waveguides
• H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type

Abstract

Systems, methods, and computer-readable media for evaluating a set of computed tomography data associated with a lattice structure. The lattice structure may be additively manufactured. The computed tomography data may be segmented using a filter for identifying blob-like structures to identify nodes present within the lattice structure. A three-dimensional path traversal is applied to volumetric data to identify a plurality of struts within the lattice structure that are compared to corresponding struts within a set if three-dimensional mesh data of the lattice structure to identify defective struts. Further, two-dimensional slices may be extracted from each of the computed tomography data and the mesh data and compared to identify one or more inconsistencies indicative of defects within the lattice structure.

IPC Classes  ?

• G06T 7/00 - Image analysis
• G06T 3/40 - Scaling of a whole image or part thereof

Abstract

A multi-layer body armor plate includes a strike plate; a mesh layer positioned over the strike plate, the mesh layer having a number of open cells; and an outer skin layer positioned over the mesh layer so as to encapsulate the open cells of the mesh layer between the strike plate and the outer skin layer. The open cells of the mesh layer may entrap air or may be filled with expandable, buoyant foam.

IPC Classes  ?

• F41H 5/04 - Plate construction composed of more than one layer
• F41H 5/08 - Shields for personal use
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
• B32B 15/16 - Layered products essentially comprising metal next to a particulate layer
• B32B 3/12 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a layer of regularly-arranged cells whether integral or formed individually or by conjunction of separate strips, e.g. honeycomb structure
• B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
• B33Y 80/00 - Products made by additive manufacturing
• B33Y 10/00 - Processes of additive manufacturing

Abstract

Shelf-stable, rapid crosslinking, “all-in-one” pastes useful as “inks” in additive manufacturing are provided. These pastes exhibit desirable rheological flow properties and crosslinking upon exposure to UV light. The pastes are based on vinylsilyl-functionalized, completely amorphous, linear terpolysiloxanes containing predominantly dimethylsiloxy- repeat units with small amounts of diphenylsiloxy-, methylphenylsiloxy-, diethylsiloxy-, and/or methyltrifluoroalkylsiloxy- crystallization disruptors. The base polymers are preferably compounded with a trimethylsilylated-hydrophobic silica filler, thixotropic flow agent, hydrosilyl-functionalized oligomeric crosslinker, and a catalytic system comprising platinum (II) acetylacetonate or trimethyl(methylcyclopentadienyl)-platinum (IV), and diethyl azodicarboxylate.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes

Abstract

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details

Abstract

Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

IPC Classes  ?

• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

Systems and methods for forming a magnetically-enabled part via additive manufacturing. The method includes depositing a layer of additive manufacturing material on a build plate, melting or sintering the layer of additive manufacturing material, depositing additional layers of additive manufacturing material on previous layers of additive manufacturing material, the additive manufacturing material of at least some of the additional layers being magnetically permeable, and melting or sintering the additional layers of additive manufacturing material such that the magnetically-enabled part has a transition region including at least some of the magnetically permeable additive manufacturing material.

IPC Classes  ?

• H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
• B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
• B23K 26/342 - Build-up welding
• B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
• B22F 10/25 - Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]

Abstract

A hydrogen peroxide sterilization device for sterilizing a medical device, the hydrogen peroxide sterilization device including a hermetic outer container, a hydrogen peroxide pouch, and a hydrogen peroxide solution in the solution chamber. The hermetic outer container includes a sterilization enclosure configured to receive the medical device. The hydrogen peroxide pouch includes a permeable membrane enclosing a solution chamber and is configured to be positioned in the sterilization enclosure of the outer container. The permeable membrane is configured to allow hydrogen peroxide vapor to diffuse from the solution chamber through the permeable membrane into the sterilization enclosure.

IPC Classes  ?

• A61L 2/20 - Gaseous substances, e.g. vapours

Abstract

A demating device configured to demate an electrical connector assembly having a first connector and a second connector is provided. The demating device may include a first separating member, a second separating member, and a gripping assembly. Actuation of the first separating member and the second separating member towards one another drives the jaws of the gripping assembly together, therein allowing secure gripping of the electrical connector assembly via the demating device for separation of the first and second connectors.

IPC Classes  ?

• H01R 43/26 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
• H01R 13/633 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for disengagement only

Abstract

Electrical connector assembly devices, systems, and methods including a demating device configured to separate a first connector and a second connector of an electrical connector assembly. The demating device includes a housing body, a drive assembly including: a drive lever, a trigger configured to push against the drive lever, a drive assembly rod, and a spring mounted around the drive assembly rod; and a demating assembly including: a movable plate having at least two sides, wherein each of the two sides includes at least two prongs; a stationary plate having at least two sides, wherein each of the two sides includes at least two prongs; and a rotary actuator configured to rotate the movable plate.

IPC Classes  ?

• H01R 43/26 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
• H01R 13/633 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for disengagement only
• H01R 13/635 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for disengagement only by mechanical pressure, e.g. spring force
• H01R 43/22 - Hand tools

Abstract

A method of testing a sensing device with a sensing mass includes accelerating the sensing device along a circular path about a central axis. The sensing mass of the sensing device may be movable relative to the central axis. The method includes determining a position of the sensing mass of the sensing device via a sensor and shifting the sensing device radially relative to the central axis based at least in part on the position of the sensing mass during acceleration.

IPC Classes  ?

• G01M 1/32 - Compensating unbalance by adding material to the body to be tested, e.g. by correcting-weights
• B04B 9/14 - Balancing rotary bowls
• B04B 13/00 - Control arrangements specially designed for centrifuges; Programme control of centrifuges

Abstract

Porous polysiloxane microspheres may be formed using a double emulsion (W/O/W) and double reaction process. The methods generally comprise forming a first emulsion and reacting components of the emulsion phases to form reinforced hydrogen gas pockets. The first emulsion is then combined with a solvent to form a second emulsion comprising a plurality of microspheres making up the dispersed phase. The microspheres comprise the reinforced gas pockets encapsulated by a polysiloxane, which are cured and recovered. The microspheres are particularly useful as fillers for low density composite materials and sensor applications.

IPC Classes  ?

• B01J 13/16 - Interfacial polymerisation
• C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08G 77/08 - Preparatory processes characterised by the catalysts used
• B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein

Abstract

A liner for a ram configured to press a viscous material. The liner includes a liner wall and a circumferential lip. The liner wall is configured to abut a ram plate of the ram and includes a number of apertures configured to align with apertures of the ram plate. The liner wall and circumferential lip are configured to prevent the viscous material from contacting a ram surface and circumferential surface of the ram plate, thus making the ram easier to clean.

IPC Classes  ?

• B30B 15/06 - Platens or press rams
• B30B 9/30 - Presses specially adapted for particular purposes for baling; Compression boxes therefor

Abstract

A method of detecting a deformation in a lattice structure comprises capturing first image data of the lattice structure via a first image capturing device with a first telecentric lens and a second image capturing device with a second telecentric lens. The first telecentric lens is directed toward the lattice structure, and the second telecentric lens is spaced apart from the first telecentric lens and also directed toward the lattice structure. The method includes compressing the lattice structure; capturing second image data of the lattice structure via the first and second image capturing devices; and detecting the deformation based at least in part on the first and second image data.

IPC Classes  ?

• G06T 7/00 - Image analysis
• H04N 5/247 - Arrangement of television cameras
• H04N 5/235 - Circuitry for compensating for variation in the brightness of the object
• H04N 5/225 - Television cameras
• G02B 13/22 - Telecentric objectives or lens systems
• G01M 5/00 - Investigating the elasticity of structures, e.g. deflection of bridges or aircraft wings

Abstract

A method for mixing, milling, and coating a plurality of constituents comprises placing the constituents in a container that includes a cylindrical inner surface; applying a first vibration to the container such that a motion of the vibration is parallel to a longitudinal axis of the container; and applying a second vibration to the container such that the motion of the vibration is not parallel to the longitudinal axis of the container.

IPC Classes  ?

• B01F 31/50 - Mixers with shaking, oscillating, or vibrating mechanisms with a receptacle submitted to a combination of movements, i.e. at least one vibratory or oscillatory movement
• B01F 35/42 - Clamping or holding arrangements for mounting receptacles on mixing devices
• B05D 1/42 - Distributing applied liquids or other fluent materials by members moving relatively to surface by non-rotary members
• B05C 3/05 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material by applying vibrations thereto

Abstract

A gripping device comprises a first arm, a second arm, and a tip. The second arm opposes at least a portion of the first arm and has a proximal end and a distal end operable to shift toward the first arm. The tip is shiftably coupled to the distal end of the second arm so that the tip is operable to longitudinally shift between a retracted position in which the tip is relatively closer to the proximal end of the second arm and an extended position in which the tip is relatively farther from the proximal end of the second arm. The tip enables a user to engage an object and shift so that the object can be rotated while held by the gripping device.

IPC Classes  ?

• B25B 9/02 - Hand-held gripping tools other than those covered by group without sliding or pivotal connections, e.g. tweezers, one-piece tongs

Abstract

A testing system for testing a missile component having a sense axis includes a centrifuge, a support arm, an orientation assembly, and a controller. The centrifuge rotates the orientation assembly about a vertical axis in a substantially horizontal plane. The orientation assembly includes a first motor, a first gimbal, and a gimballed support. The first motor has a first rotatable shaft defining a first gimbal axis. The first gimbal is coupled with the first rotatable shaft to rotate about the first gimbal axis while the centrifuge rotates the orientation assembly about the vertical axis such that missile component is simultaneously rotated about both the vertical axis and the first gimbal axis to simulate a missile launch of the missile component. The gimballed support is coupled with the first gimbal for supporting the missile component such that the sense axis of the missile component is not parallel to the substantially horizontal plane. The orientation assembly may also include a second gimbal that is rotated about a second gimbals axis by a second motor.

IPC Classes  ?

• F42B 15/10 - Missiles having a trajectory only in the air
• G01L 5/14 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the energy of projectiles
• F42B 35/00 - Testing or checking of ammunition

Abstract

An electrical connector comprises an outer shell, at least one pin, and an insulating seal. The outer shell includes at least one side wall defining a cavity and having an inner surface. The outer shell is formed from electrically conductive material. The pin is positioned within the cavity and is also formed from electrically conductive material. The insulating seal is configured to provide electrical isolation of the pin and fills the cavity between the inner surface of the side wall and the pin. The insulating seal is formed from glass doped with a transition metal oxide.

IPC Classes  ?

• H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
• H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases

Abstract

A tool for feeding material into a mill having a roller and forming a nip gap. The tool broadly comprises a baseplate, a guide plate, and a ram. The baseplate is configured to be positioned on the mill over the roller and forms a slot. The guide plate is configured to be positioned in the slot of the baseplate near the nip gap. The guide plate forms a chute for feeding the material into the nip gap. The ram is configured to be inserted into the chute to urge the material into the nip gap while preventing a user's fingers and other foreign objects from nearing the nip gap through the chute.

IPC Classes  ?

• B02C 4/28 - Crushing or disintegrating by roller mills - Details

Abstract

A system and method of testing a part manufactured using an additive manufacturing process. The part may be excited via an input mechanism that imparts an excitation force on the part to induce a dynamic response in the part. An output mechanism may be used to sense the dynamic response in the part. A processing element may be used to compare the dynamic response with a reference to identify an indication of excess powder in the part.

IPC Classes  ?

• B22F 10/68 - Cleaning or washing
• B22F 12/90 - Means for process control, e.g. cameras or sensors
• B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing

Abstract

An EM driver for accelerating an object may be configured as an EM rifle for accelerating, rotating to spin-stabilize, and releasing a projectile. A core includes a stator coil, forward and reverse coils, a railed shaft, and a transfer shaft. The stator coil generates a first EM field, and the forward and reverse coils generate second and third EM fields which interact with the first EM field to accelerate the armature in forward and reverse directions, respectively. The railed shaft is elongated along a central axis through the armature and includes multiple rails arranged helically around a central shaft. The armature remains in contact with the rails during acceleration so as to impart a turning motion. The transfer shaft is physically coupled with and projects forwardly from the armature and transfers to the projectile the acceleration and the turning motion of the armature in the forward direction.

IPC Classes  ?

• H01F 3/00 - Cores, yokes or armatures
• F41B 6/00 - Electromagnetic launchers

Abstract

Systems, methods, and computer-readable media for evaluating a set of computed tomography data associated with a lattice structure. The lattice structure may be additively manufactured. The computed tomography data may be segmented using a filter for identifying blob-like structures to identify nodes present within the lattice structure. A three-dimensional path traversal is applied to volumetric data to identify a plurality of struts within the lattice structure that are compared to corresponding struts within a set if three-dimensional mesh data of the lattice structure to identify defective struts. Further, two-dimensional slices may be extracted from each of the computed tomography data and the mesh data and compared to identify one or more inconsistencies indicative of defects within the lattice structure.

IPC Classes  ?

• G06T 7/00 - Image analysis
• G06T 3/40 - Scaling of a whole image or part thereof

Abstract

A nozzle holder assembly for a three-dimensional printer comprises a mount, a printer nozzle, and a locking mechanism. The mount is operable to be secured to the three-dimensional printer. The printer nozzle shaft is movably coupled to the mount along a predetermined length. The locking mechanism is configured to fix the printer nozzle shaft relative to the mount at any position along the predetermined length.

IPC Classes  ?

• B29C 64/209 - Heads; Nozzles
• B29C 64/386 - Data acquisition or data processing for additive manufacturing
• B29C 64/25 - Housings, e.g. machine housings
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor

Abstract

A microfluidic device having hydrophobic and hydrophilic regions and a method of manufacture thereof are provided. The microfluidic device may include one or more channels formed using a short-pulse laser that are configured for separation or mixing of fluids. The microfluidic device may further include hydrophilic or hydrophobic surfaces configured to aid in the separation or mixture of fluids. The short-pulse laser may be a femtosecond laser.

IPC Classes  ?

• B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
• B01F 33/30 - Micromixers
• B01D 17/04 - Breaking emulsions

Abstract

A fixture for lap shear bonding a bottom panel to a top panel comprises a bottom tool, a first spacer, a second spacer, and a top tool. The bottom tool has a quadrilateral shape including a top surface, a bottom surface, and four side surfaces and is configured to retain the bottom panel on the top surface. The first spacer is attached to the top surface of the bottom tool adjacent to one edge. The second spacer is attached to the top surface of the bottom tool adjacent to an opposing edge. The top tool has a quadrilateral shape including a top surface, a bottom surface, and four side surfaces and is configured to retain the top panel on the bottom surface. The top tool is further configured to attach to the first spacer and the second spacer such that the top panel contacts the bottom panel.

IPC Classes  ?

• B32B 38/18 - Handling of layers or the laminate
• B29C 65/00 - Joining of preformed parts; Apparatus therefor
• G01N 3/24 - Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces

Abstract

A tool for handling a die assembly, the tool including a rocker and a swivel. The rocker includes a foot and a backrest. The foot engages a base of the die assembly when the tool is upright and stabilizes the die assembly as the tool is leaned from being upright to reclined. The backrest extends vertically from the foot when the tool is upright. The swivel supports an outer shell and other components of the die assembly on the backrest and translates and rotates relative to the backrest when the tool is reclined to rotate the outer shell and other components from an inverted orientation to a non-inverted orientation. The foot stabilizes the die as the tool is leaned from being reclined to upright and can be moved horizontally out of engagement with the base when the tool is upright.

IPC Classes  ?

• B21D 37/14 - Particular arrangements for handling and holding in place complete dies

Abstract

A method for forming monosubstituted diphenylsilanes is broadly provided. The method involves reacting diphenylsilane with an alcohol in the presence of a catalyst and a strong base activator. The reaction results in high selectivity to addition at only one hydrogen site.

IPC Classes  ?

• C07F 7/08 - Compounds having one or more C—Si linkages
• B01J 31/22 - Organic complexes

Abstract

An apparatus, methods, and systems for forming microspheres comprises a furnace and an ultrasonic nozzle. The furnace has a channel and is operable to generate heat in the channel. The ultrasonic nozzle is configured to receive precursor solution and spray precursor droplets into the channel so that the heat in the channel causes the precursor droplets to form the microspheres.

IPC Classes  ?

• B01J 13/04 - Making microcapsules or microballoons by physical processes, e.g. drying, spraying
• B05B 17/06 - Apparatus for spraying or atomising liquids or other fluent materials, not covered by any other group of this subclass operating with special methods using ultrasonic vibrations

Abstract

Systems, methods, and devices are provided for producing and using a low-value inductor which is stable at high frequencies, the inductor including a plurality of radial spokes extending between two concentric rings. The inductance of the inductor is controlled by the number and dimensions of the plurality of spokes, as well as the materials of the inductor. In some cases, the inductor is used as a low value inductance standard for directly measuring a low value electrical inductance.

IPC Classes  ?

• H01F 5/00 - Coils
• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 27/40 - Structural association with built-in electric component, e.g. fuse

Abstract

A mold extractor for separating a molded part from a mold portion following a molding process, and a method of using the same. The mold extractor includes a mold holder that removably couples to the mold portion, a retainer that abuts a portion of the molded part and that surrounds the mold holder such that a cavity is provided between the mold holder and the retainer, and an extraction rod engaged with the mold holder and the retainer and spanning the cavity between the mold holder and the retainer. The mold extractor is set up to reduce a distance between the mold holder and the retainer along the extraction rod such that the mold holder translates into the cavity and imparts a force on the mold portion sufficient to extract the mold portion from the molded part.

IPC Classes  ?

• B29C 43/50 - Removing moulded articles
• B29C 37/00 - Component parts, details, accessories or auxiliary operations, not covered by group or

Abstract

A system and method for displaying augmented reality information for a real object. A transparent display displays the information for the real object within a field of view, such that the information and the real object are simultaneously viewable by a user. Data-gathering peripheral devices gather data of the field of view, including a camera gathering visual data for tracking the real object. An articulating arm moveably supports and facilitates repositioning the display and redirecting the data-gathering peripheral devices in a particular direction. A security interlock disables the data-gathering peripherals when the articulating arm is moved beyond a pre-established threshold, thereby preventing the data-gathering peripherals from gathering data of a real environment outside of a limit of the field of view as determined by the pre-established threshold. The security interlock may include an adjustable contact switch which adjustably defines the pre-established threshold in at least one direction.

IPC Classes  ?

• G06T 19/00 - Manipulating 3D models or images for computer graphics
• G06T 7/536 - Depth or shape recovery from perspective effects, e.g. by using vanishing points
• G06T 7/557 - Depth or shape recovery from multiple images from light fields, e.g. from plenoptic cameras

Abstract

An article transport case comprising an outer shell including opposing sections, first and second pinscreen assemblies, and first and second securement mechanisms. The pinscreen assemblies each include a frame, a securement plate, and a number of pins. The first and second securement mechanisms are configured to be in a secured configuration to retain the first and second sections in a closed configuration and keep the securement plates in a secured position thereby restraining the pins against the article in an article conforming arrangement. The securement plates are in an unsecured position so that the pins are free to translate longitudinally when the securement mechanisms are in an unsecured configuration such that the pins are not restrained in the article conforming arrangement when the shell is open.

IPC Classes  ?

• B65D 81/05 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents

Abstract

Systems and methods for removing an oxide layer in an additive manufacturing process are provided. A direct write machine may be used to create wire bonds for semiconductors. The direct write machine may deposit a conductive print material between bond pads to create interconnections. The bond pads may comprise aluminum and an aluminum oxide layer on an outer surface. The presence of an aluminum oxide layer may decrease the electrical connection between the wire bond and the aluminum substrate. To remove the aluminum oxide layer, an abrasive tool is provided to ultrasonically abrade the aluminum oxide layer while the conductive print material is being deposited. The conductive print material may include abrasive additives materials to further aid in abrading the aluminum oxide layer.

IPC Classes  ?

• B22F 10/66 - Treatment of workpieces or articles after build-up by mechanical means
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
• B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
• B22F 10/38 - Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
• B22F 10/22 - Direct deposition of molten metal

Abstract

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

IPC Classes  ?

• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome

Abstract

A multichip module comprises a carrier, a plurality of chips, an electrical insulating layer, and an electrical interconnect structure. The carrier includes a bottom wall and four side walls defining an internal cavity. The chips are positioned in the internal cavity, with each chip including a plurality of bond pads. The electrical insulating layer is formed from electrically insulating material and is positioned on an upper surface of the carrier and the chips. The electrical interconnect structure includes a plurality of interconnect traces, with each interconnect trace formed from electrically conductive material and electrically connected to a first bond pad on a first chip and a second bond pad on a second chip. Each interconnect trace includes a bridge having a segment that is spaced apart from, and positioned above, the electrical insulating layer.

IPC Classes  ?

• H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A battery and cooling device system comprising a thermal battery and a cooling device including a boiler, a condenser, a vapor tube, a reaction container, and a siphon. The boiler boils a solvent via heat drawn from the battery. The condenser condenses the vaporized solvent. The vapor tube connects the boiler to the reaction container so that the vaporized solvent travels through the vapor tube from the boiler into the condenser. The reaction container receives the liquidated solvent from the condenser so that the liquidated solvent interacts with a solute in the reaction container to effect an endothermic reaction to further draw heat from the battery. The siphon connects the reaction container to the boiler and drains the liquid solvent from the reaction container into the boiler once a predetermined amount of liquid solvent fills the reaction container.

IPC Classes  ?

• H01M 10/6569 - Fluids undergoing a liquid-gas phase change or transition, e.g. evaporation or condensation
• H01M 10/613 - Cooling or keeping cold
• H01M 10/6568 - Liquids characterised by flow circuits, e.g. loops, located externally to the cells or cell casings

Abstract

A simulation system for use in testing a radar system comprises a coarse delay module, a fine delay module, and a doppler shift module. The coarse delay module is configured to receive a first stream of digital data samples that are sampled from a radar signal at a sample time period or a second stream of digital data samples that are processed by another simulation system component and delay the digital data samples by a selectable first delay time that is greater than or equal to the sample time period. The fine delay module is configured to receive the digital data samples and filter the digital data samples to represent delay by a selectable second delay time that is less than the sample time period. The doppler shift module is configured to receive the digital data samples and adjust a value of a frequency content of the fine delayed samples.

IPC Classes  ?

• G01S 7/40 - Means for monitoring or calibrating

Abstract

A system, device, and method for imparting or transferring a geometric pattern on the surface of a substrate. The device comprises, a housing forming at least a partially enclosed space, a light source body comprising an array of light emitters, a base disposed below the light source body and configured for supporting the substrate having a photoresist layer thereon, and a controller for activating a predetermined number of individual light emitters corresponding to the predetermined geometric pattern. Each individual light emitter within the array of light emitters is selectively activatable to emit a light. The array of light emitters comprises a plurality of light-emitting diodes, a plurality of quantum dots, or both.

IPC Classes  ?

• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
• H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

Abstract

A computer-implemented method for compressing video data comprises receiving a sequence of video data values, each video data value being a digital value from a successive one of a plurality of pixels that form a video sensor, the sequence of video data values resulting from successive frames of video captured by the video sensor; extracting the video data values for each pixel in turn to create a plurality of pixel data streams, each pixel data stream including the video data value for each frame of captured video for the pixel; and applying data compression to each pixel data stream to create compressed data for each pixel data stream.

IPC Classes  ?

• H04N 19/184 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being bits, e.g. of the compressed video stream
• H04N 19/172 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being an image region, e.g. an object the region being a picture, frame or field
• H04N 19/136 - Incoming video signal characteristics or properties
• H04N 19/132 - Sampling, masking or truncation of coding units, e.g. adaptive resampling, frame skipping, frame interpolation or high-frequency transform coefficient masking
• H04N 19/182 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being a pixel

Abstract

A method of tuning an electrically small antenna comprising a radiating element and a support structure comprises applying a force to the support structure to change a shape or a dimension of the radiating element to increase or decrease a frequency at which the electrically small antenna resonates.

IPC Classes  ?

• H01Q 9/14 - Length of element or elements adjustable
• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
• H01Q 9/30 - Resonant antennas with feed to end of elongated active element, e.g. unipole

Abstract

A caul for debulking a composite part broadly includes opposing first and second surfaces, a plurality of through-holes, and a coating. The first surface may have a curvature complementary to a shape of the composite part. The through-holes pass through the caul from the first surface to the second surface. The coating may be a chemically inert material to ensure the caul does not affect the composite part. The caul is configured to be positioned against the composite part for debulking. The caul may be made out of silicone rubber or any other suitable material and may be reusable.

IPC Classes  ?

• B29C 70/54 - Component parts, details or accessories; Auxiliary operations
• B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
• B29C 70/34 - Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression
• B33Y 80/00 - Products made by additive manufacturing

Abstract

3 bonded carbon atoms may be varied to modify the properties of the DLC for various electronic components.

IPC Classes  ?

• H01L 29/49 - Metal-insulator semiconductor electrodes
• H01L 29/51 - Insulating materials associated therewith
• H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
• H01L 29/868 - PIN diodes

Abstract

A process for forming polymer-grafted nanoparticles is provided. The process utilizes flow chemistry techniques to activate nanoparticle surfaces and then form polymer chains on the activated surfaces in a continuous process, thus avoiding the limitations and shortcomings of batch processes for forming polymer-grafted nanoparticles. The polymer-grafted nanoparticles are particularly useful as a filler or additive in fused deposition modeling (“FDM”) filaments, leading to printed parts having improved properties.

IPC Classes  ?

• B29C 41/02 - Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
• C08F 292/00 - Macromolecular compounds obtained by polymerising monomers on to inorganic materials
• B82Y 40/00 - Manufacture or treatment of nanostructures
• B33Y 70/10 - Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
• B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

IPC Classes  ?

• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

An enclosure for a three-dimensional printing system comprises a plurality of walls and a glass panel. The walls define an inner chamber for receiving the three-dimensional printing system and an opening that provides access to the inner chamber from outside the walls. The glass panel is shiftable between a closed position in which the panel blocks access to the inner chamber and an open position in which the panel allows access to the inner chamber via the opening.

IPC Classes  ?

• B29C 64/25 - Housings, e.g. machine housings
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor

Abstract

Systems, methods, components, and parts are provided for improving casting and electroplating performance of a plated cast part by doping a semiconductor material with an electrically active dopant before mixing the semiconductor material into a base material. The doped semiconductor material improves the castability of the base material and has an improved electrical conductivity which is closer to that of the base material such that a consistency of a subsequent plating on the part is improved.

IPC Classes  ?

• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• C25D 3/44 - Aluminium
• C25D 3/38 - Electroplating; Baths therefor from solutions of copper
• C25D 7/12 - Semiconductors

Abstract

A system for manufacturing a part, the system comprising a power source, a rectifier, an electrical conduit, and a framework. The power source is configured to generate a high frequency, high current electrical signal. The rectifier is configured to convert the electrical signal to a direct current electrical signal. The electrical conduit is configured to carry the electrical signal. The framework is formed of electrically resistive metal having a relatively high melting point and is connected to the electrical conduit and at least partially encased in a powdered metal having a melting point lower than the melting point of the framework so that transmission of the electrical signal through the framework transitions at least some of the powdered metal into its molten state so that at least some of the molten metal cooled into its solidified state forms at least a portion of the part.

IPC Classes  ?

• B22F 10/20 - Direct sintering or melting
• H02M 7/06 - Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
• B23K 11/00 - Resistance welding; Severing by resistance heating
• B23K 11/24 - Electric supply or control circuits therefor

Abstract

A base configured to be joined with other bases to form a substrate for an antenna array comprises a body, a plurality of male interconnecting features, and a plurality of female interconnecting features. The body includes a front surface and a rear surface and a plurality of edges positioned therebetween. The front surface or the rear surface is configured to retain an antenna. The male interconnecting features of a first base connect with the female interconnecting features of a second base when the first base is joined with the second base to form the substrate or a portion of the substrate.

IPC Classes  ?

• H01Q 21/00 - Antenna arrays or systems
• H01Q 1/08 - Means for collapsing antennas or parts thereof
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/05 - Insulated metal substrate
• C23C 14/22 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
• C23C 14/16 - Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
• C23C 16/02 - Pretreatment of the material to be coated
• C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
• H05K 3/28 - Applying non-metallic protective coatings
• C23C 16/27 - Diamond only

Abstract

Systems and methods for using a non-stick conductive material to automate tool touch-off in an additive manufacturing process are provided. A substrate comprises a first conductive layer, an intermediate binder layer, and a second non-stick conductive layer. The non-stick conductive layer may comprise perfluoroalkoxy alkanes and carbon nanotubes. An electrical connection may be made between the first conductive layer and the second non-stick conductive layer. When used with an additive manufacturing device, when the nozzle of the device contacts the substrate, a circuit may close resulting in a detectable voltage drop. When the voltage drop is detected, a reference point for the additive manufacturing device may be set.

IPC Classes  ?

• B29C 64/245 - Platforms or substrates
• C09D 11/52 - Electrically conductive inks
• C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
• C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
• B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
• B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes

Abstract

A lattice structure and system for absorbing energy, damping vibration, and reducing shock. The lattice structure comprises a plurality of unit cells, each unit cell comprising a plurality of rib elements with at least a portion of the rib elements including a solid bendable hinge portion for converting energy into linear motion along a longitudinal axis of the respective rib element.

IPC Classes  ?

• F16F 7/12 - Vibration-dampers; Shock-absorbers using plastic deformation of members
• F16F 3/02 - Spring units consisting of several springs, e.g. for obtaining a desired spring characteristic with springs made of steel or of other material having low internal friction
• F16F 15/073 - Suppression of vibrations of non-rotating, e.g. reciprocating, systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating system using elastic means with metal springs using only leaf springs

Abstract

Media, method and system for approximating a finite element analysis texture map for an object. To accomplish this, the object is converted to a computer generated model and finite element analysis is performed for a plurality of different simulated inputs to generate a plurality of simulated mappings. Each simulated mapping is converted into a simulated texture map. A machine learning model is trained on the simulated inputs and simulated texture maps to generate a texture map which approximates a finite element analysis. The machine learning model receives a user input and generates the texture map therefrom. The texture map is then wrapped to the object and displayed.

IPC Classes  ?

• G06F 30/23 - Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
• G06T 15/04 - Texture mapping
• G06T 19/00 - Manipulating 3D models or images for computer graphics
• G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer

Abstract

A multi-resonant, electrically-small antenna having a first helical arm and a second helical arm. The first helical arm encircles a first central axis and includes a proximal end. A radius between the first helical arm and the first central axis decreases in a distal direction away from the proximal end of the first helical arm. The second helical arm is nested in the first helical arm and encircles a second central axis. The second helical arm also includes a proximal end. A radius between the second helical arm and the second central axis decreases in a distal direction away from the proximal end of the second helical arm.

IPC Classes  ?

• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
• H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
• H01Q 9/06 - Resonant antennas - Details
• H01Q 5/335 - Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching

Abstract

An electromagnetic propulsion system is provided. The system comprises first and second pluralities of stator coils wound about first and second axes, a plurality of support structures, first and second couplers that surround portions of the first and second pluralities of stator coils, and first and second pluralities of sets of rotor coils wound about axes that are parallel to the first and second axes. The stator coils are configured to receive electric current through an outside controller selecting appropriately coupled stator sections or through a sliding electrical contact system or bearing system to induce at least a first magnetic field. The plurality of support structures supports the first and second plurality of stator coils. The first and second couplers include notches and are oriented so that their notches pass over the plurality of support structures when the couplers move along the stator coils. The couplers may have an adjustable segment to close the notch. The sets of rotor coils are equidistantly attached to the couplers and are configured to receive electric current to induce magnetic fields that interact with the magnetic fields of the stator coils so that magnetic forces are applied to the plurality of rotor coils, thereby propelling the couplers along the stator coils.

IPC Classes  ?

• H01F 7/06 - Electromagnets; Actuators including electromagnets
• H01F 7/17 - Pivoting and rectilinearly-movable armatures
• H02K 1/2786 - Outer rotors
• H02K 5/167 - Means for supporting bearings, e.g. insulating supports or means for fitting bearings in the bearing-shields using sliding-contact or spherical cap bearings
• H02K 7/09 - Structural association with bearings with magnetic bearings
• H02K 1/2788 - Outer rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of a single magnet or two or more axially juxtaposed single magnets
• F41B 6/00 - Electromagnetic launchers

Abstract

A computer-implemented method comprises receiving a plurality of sampled data points, each data point including a y value and a t value; defining a plurality of bins; defining an array of elements; dividing the sampled data points into a plurality of sections; assigning a plurality of polynomial equations, one polynomial equation to each section, each polynomial equation having a waveform that fits the data points of the associated section; determining a plurality of section bin times, one section bin time for each bin in each section, each section bin time determined using the polynomial equation and indicating an amount of time that the waveform has values in the range of one of the bins; and adding the section bin time for each bin in each section to the histogram data in the array element pointed to by the number of the bin.

IPC Classes  ?

• G06F 17/18 - Complex mathematical operations for evaluating statistical data
• G06F 17/12 - Simultaneous equations
• G06V 10/75 - Image or video pattern matching; Proximity measures in feature spaces using context analysis; Selection of dictionaries
• G06F 17/40 - Data acquisition and logging

Abstract

A system for monitoring electrostatic charge buildup and electrostatic discharge (ESD) remotely comprises a plurality of electrostatic charge measurement units and a data acquisition device. Each electrostatic charge measurement unit includes a primary charge plate, a static sensor device, a secondary charge plate, and a shielded cable. The primary charge plate is positioned proximal to an object. The static sensor device includes an input sensor at which an electric voltage is measured and outputs an electronic signal whose level varies according to the measured electric voltage. The secondary charge plate is positioned in proximity to the input sensor of the static sensor device. The shielded cable includes an inner conductor electrically connected to the primary charge plate and the secondary charge plate and an outer conductor electrically connected to electrical ground. The data acquisition device receives the electronic signal from the static sensor device of each electrostatic charge measurement unit.

IPC Classes  ?

• G01R 29/12 - Measuring electrostatic fields
• G01R 31/00 - Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Abstract

A liquid shim includes a bag (24) defining a closed inner volume and having sealed openings spaced inwardly from a periphery of the bag. The sealed openings are sealed from the closed inner volume and delimit holes extending through the bag. A liquid shim material (22) is flowable through the closed inner volume around the sealed openings and is curable to form a solid. The liquid shim material has a liquid shim material volume being less than the closed inner volume of the bag. A method of creating a liquid shim, and a method of shimming a gap between components, is also disclosed.

IPC Classes  ?

• B64F 5/10 - Manufacturing or assembling aircraft, e.g. jigs therefor
• B64C 1/12 - Construction or attachment of skin panels
• B64C 3/26 - Construction, shape, or attachment of separate skins, e.g. panels
• F16B 5/02 - Joining sheets or plates to one another or to strips or bars parallel to them by means of fastening members using screw-thread

Abstract

A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits - Details
• H05K 1/03 - Use of materials for the substrate
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.

IPC Classes  ?

• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
• H01G 4/33 - Thin- or thick-film capacitors
• H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
• B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
• B33Y 80/00 - Products made by additive manufacturing
• B28B 1/00 - Producing shaped articles from the material
• B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
• B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
• B22F 10/85 - Data acquisition or data processing for controlling or regulating additive manufacturing processes
• B22F 12/90 - Means for process control, e.g. cameras or sensors

Abstract

A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/03 - Use of materials for the substrate

Abstract

Systems and methods of detecting launch of a model rocket are described herein. A mechanically implemented launch accelerometer may be disposed on a model rocket. The launch accelerometer may detect acceleration of the rocket by a mass of the launch accelerometer moving relative to the rocket and against a spring force based on the rocket acceleration. The mass may comprise a first electrical contact that may contact a second electrical contact when the mass is accelerated beyond a threshold, which is indicative of launch of the rocket. The contact between the first electrical contact and the second electrical contact may complete an electrical circuit. Furthermore, at least one pin may lock the mass in a position allowing the electrical circuit to remain complete.

IPC Classes  ?

• A63H 27/00 - Toy aircraft; Other flying toys
• A63H 27/14 - Starting or launching devices for toy aircraft; Arrangements on toy aircraft for starting or launching

Abstract

An antenna system comprises a substrate, an antenna positioned on the substrate, and a circuit component positioned on the substrate. The antenna is positioned on a first surface of the substrate and operable to emit a radiation pattern. The circuit component is positioned on the substrate in a null region of the radiation pattern. The thickness of portions of the substrate are modified to achieve a desired performance characteristic of the antenna.

IPC Classes  ?

• H01Q 11/08 - Helical antennas
• H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles

Abstract

A system for creating an internal formation of a tubular structure having an inner surface via additive manufacturing. The system broadly includes a computer modeling system and an additive manufacturing system. The computer modeling system may include a processor for generating a lattice cellular component via computer-aided design software according to inputs received from a user. The processor may also generate an internal formation lattice structure based on the lattice cellular component and modify the lattice structure to follow and/or conform to the curvature of the inner surface of the outer wall of the tubular structure. The additive manufacturing system may be configured to produce the lattice structure and the tubular structure via additive manufacturing material deposited layer by layer according to the lattice structure.

IPC Classes  ?

• B33Y 80/00 - Products made by additive manufacturing
• B29C 64/386 - Data acquisition or data processing for additive manufacturing
• B29C 64/118 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
• B29L 23/00 - Tubular articles

Abstract

A laser welding system for welding a component and reducing defects in the weld by ensuring uniform, laminar gas flow over a process area of the system. The laser welding system comprises a laser for welding the component, a platform for supporting the component, an enclosure surrounding the platform, a first actuatable barrier, a second actuatable barrier, an actuator, and a controller. The enclosure includes a plurality of walls, one of the walls having an inlet and another wall having an outlet. The inlet and outlet each having an opening having a cross-sectional area for letting gas flow through. The first and second barriers are configured to modify the cross-sectional areas of the openings when actuated. The actuator is configured to actuate the barriers, and the controller is configured to direct the actuator to actuate the barriers so that the cross-sectional area of the first opening is larger than the cross-sectional area of the second opening so that a pressure at the inlet is greater than a pressure at the outlet.

IPC Classes  ?

• B23K 26/142 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
• B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
• B23K 26/144 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
• B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor

Abstract

Waveguides and methods for manufacturing a waveguide that include forming a first channel in a first layer of dielectric material, the first channel comprising one or more walls; forming a second channel in a second layer of dielectric material, the second channel comprising one or more walls; depositing electrically conductive material on the one or more walls of the first channel; depositing electrically conductive material on the one or more walls of the second channel; arranging the first layer adjacent to the second layer to form a stack with the first channel axially aligned with and facing the second channel; and heating the stack so that the conductive material on the one or more walls of the first channel and the conductive material on the one or more walls of the second channel connect to form the waveguide.

IPC Classes  ?

• H01P 3/12 - Hollow waveguides
• H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• H01P 3/16 - Dielectric waveguides, i.e. without a longitudinal conductor

Abstract

Systems and methods for representing internal defects of an object to determine defect detectability using a multi-scan computed tomography (CT) approach are disclosed. A defect-free object may be scanned using a CT machine. In one or more separate scans, phantom defects may be imaged and the resulting projections combined and reconstructed to represent internal defects. The air-normalized intensities of the object and the phantom defect may be used to represent voids and inclusions. Subtraction of materials may be represented by the quotient of the air-normalized intensities thereof, and the addition of materials may be represented by the product of the air-normalized intensities thereof. A void may be represented by subtracting a phantom defect scan from the object scan. An inclusion may be represented by creating a void, scanning an additional phantom defect, and adding the additional phantom defect in the volume created by the void.

IPC Classes  ?

• G01N 23/04 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by transmitting the radiation through the material and forming images of the material
• G01N 23/18 - Investigating the presence of defects or foreign matter
• G01N 23/046 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
• G01B 15/06 - Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring the deformation in a solid

Abstract

A shrouded screw apparatus includes an outer tube, a telescoping inner tube, an auger bit, and an anti-rotation pin. The outer tube has a first sidewall defining a first interior chamber. The first sidewall has an opening defined therethrough. The inner tube is positioned in the first interior chamber. The inner tube has a second sidewall defining a second interior chamber. The second sidewall has a longitudinal groove defined therein. The inner tube is configured to extend from and retract within the first interior chamber of the outer tube. The auger bit is positioned in the second interior chamber and is rotatably coupled to the inner tube. The anti-rotation pin is coupled to the first sidewall of the outer tube and extends inwardly into the first interior chamber. The pin engages the longitudinal groove of the inner tube.

IPC Classes  ?

• E21B 10/22 - Roller bits - characterised by bearing, lubrication or sealing details
• E21B 10/62 - Drill bits characterised by parts, e.g. cutting elements, which are detachable or adjustable
• E21B 10/44 - Bits with helical conveying portion, e.g. screw type bits; Augers with leading portion or with detachable parts
• E21B 17/07 - Telescoping joints for varying drill string lengths; Shock absorbers

Abstract

A testing system for evaluating the performance of an electrical/electronic UUT under dynamic operating conditions. The testing system includes a dynamic testing component (e.g., a centrifuge) for applying a stimulus to the UUT, and an iDAQ system configured to perform in situ data acquisition and real-time data analysis. The iDAQ system may also be subject to the stimulus. The iDAQ system includes a processor (e.g., an SoC) component, a power supply, a CR/I component, an IR component, and a single enclosure. The processor component may control the dynamic testing component, including varying in real-time the stimulus applied to the UUT. The processor component may include multiple input channels, and a high current/voltage subcomponent of the power supply may be configured to supply up to five hundred volts.

IPC Classes  ?

• G01N 3/00 - Investigating strength properties of solid materials by application of mechanical stress
• G01N 3/02 - Investigating strength properties of solid materials by application of mechanical stress - Details
• G06F 1/26 - Power supply means, e.g. regulation thereof
• G01N 3/34 - Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces generated by mechanical means, e.g. hammer blows
• G01R 15/12 - Circuits for multi-testers, e.g. for measuring voltage, current, or impedance at will
• G01N 29/07 - Analysing solids by measuring propagation velocity or propagation time of acoustic waves

Abstract

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

IPC Classes  ?

• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 1/03 - Use of materials for the substrate

Abstract

A system and method of additively manufacturing a part via salt micro-spheres. The method includes mixing salt micro-spheres with an additive manufacturing material to form an additive manufacturing material mixture. The additive manufacturing material mixture is deposited on a build platform layer by layer and cured so as to create a structure having pores formed by the salt micro-spheres. The salt micro-spheres may then be dissolved and flushed from the pores.

IPC Classes  ?

• B29C 67/00 - Shaping techniques not covered by groups , or
• B29C 64/165 - Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
• B29C 64/245 - Platforms or substrates
• B29C 64/205 - Means for applying layers
• B29C 64/314 - Preparation
• B29C 64/35 - Cleaning
• B33Y 40/00 - Auxiliary operations or equipment, e.g. for material handling
• B29K 105/04 - Condition, form or state of moulded material cellular or porous
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor

Abstract

Shelf-stable, rapid crosslinking, “all-in-one” pastes useful as “inks” in additive manufacturing are provided. These pastes exhibit desirable rheological flow properties and crosslinking upon exposure to UV light. The pastes are based on vinylsilyl-functionalized, completely amorphous, linear terpolysiloxanes containing predominantly dimethylsiloxy-repeat units with small amounts of diphenylsiloxy-, methylphenylsiloxy-, diethylsiloxy-, and/or methyltrifluoroalkylsiloxy-crystallization disruptors. The base polymers are preferably compounded with a trimethylsilylated-hydrophobic silica filler, thixotropic flow agent, hydrosilyl-functionalized oligomeric crosslinker, and a catalytic system comprising platinum(II) acetylacetonate or trimethyl(methylcyclopentadienyl)-platinum(IV), and diethyl azodicarboxylate.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes

Abstract

Shelf-stable, rapid crosslinking, “all-in-one” pastes useful as “inks” in additive manufacturing are provided. These pastes exhibit desirable rheological flow properties and crosslinking upon exposure to UV light. The pastes are based on vinylsilyl-functionalized, completely amorphous, linear terpolysiloxanes containing predominantly dimethylsiloxy-repeat units with small amounts of diphenylsiloxy-, methylphenylsiloxy-, diethylsiloxy-, and/or methyltrifluoroalkylsiloxy-crystallization disruptors. The base polymers are preferably compounded with a trimethylsilylated-hydrophobic silica filler, thixotropic flow agent, hydrosilyl-functionalized oligomeric crosslinker, and a catalytic system comprising platinum(II) acetylacetonate or trimethyl(methylcyclopentadienyl)-platinum(IV), and diethyl azodicarboxylate.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes

Abstract

A shrouded screw apparatus includes an outer tube, a telescoping inner tube, an auger bit, and an anti-rotation pin. The outer tube has a first sidewall defining a first interior chamber. The first sidewall has an opening defined therethrough. The inner tube is positioned in the first interior chamber. The inner tube has a second sidewall defining a second interior chamber. The second sidewall has a longitudinal groove defined therein. The inner tube is configured to extend from and retract within the first interior chamber of the outer tube. The auger bit is positioned in the second interior chamber and is rotatably coupled to the inner tube. The anti-rotation pin is coupled to the first sidewall of the outer tube and extends inwardly into the first interior chamber. The pin engages the longitudinal groove of the inner tube.

IPC Classes  ?

• E21B 10/22 - Roller bits - characterised by bearing, lubrication or sealing details
• E21B 10/62 - Drill bits characterised by parts, e.g. cutting elements, which are detachable or adjustable
• E21B 10/44 - Bits with helical conveying portion, e.g. screw type bits; Augers with leading portion or with detachable parts
• E21B 17/07 - Telescoping joints for varying drill string lengths; Shock absorbers

Abstract

Methods and assemblies for additive manufacturing portions of components with enhanced strength are provided. The assemblies comprise a first deposition head and an apparatus for causing one or more reinforcement fibers to extend more than two layers within previously-deposited layers of build material. The first deposition head is configured to deposit a plurality of layers of a filament comprising a reinforcement fiber and thermoplastic material. The apparatus may comprise a needle point configured to be inserted into the plurality of layers to displace the reinforcement fiber so that it extends two or more of the plurality of layers. The apparatus may additionally or alternatively comprise a second deposition head having a needle tip configured to be inserted into the plurality of layers to inject a length of a second filament comprising thermoplastic material and a reinforcement fiber so that the reinforcement fiber of the second filament extends two or more layers of the plurality of layers of the first filament.

IPC Classes  ?

• B29C 64/118 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
• B29C 64/209 - Heads; Nozzles
• B29C 64/227 - Driving means
• B29C 64/188 - Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control

Abstract

An assembly for shock testing a specimen, the assembly including first and second opposing brackets and opposing lower and upper caps. The opposing brackets include lower and upper angled surfaces. The lower cap includes lower angled surfaces configured to engage the lower angled surfaces of the left and right brackets. The upper cap includes upper angled surfaces configured to engage the upper angled surfaces of the left and right brackets. The first and second brackets are configured to be drawn toward each other via fasteners, thereby wedging the lower and upper caps toward each other against the specimen.

IPC Classes  ?

• G01N 3/04 - Chucks
• G01N 3/30 - Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force
• G01P 15/18 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
• G01M 7/08 - Shock-testing

Abstract

A system for creating a plasma field Faraday cage around a structure, the system comprising a plurality of lasers spaced apart from each other, each laser being configured to transmit an electromagnetic energy beam to a focal point of an atmosphere region, each electromagnetic energy beam having an amount of energy less than an amount of energy required to ionize air, the electromagnetic energy beams intersecting at the focal point such that the electromagnetic energy beams cooperatively ionize the air at the focal point to block electromagnetic radiation from passing through the focal point.

IPC Classes  ?

• H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

Abstract

A product includes a porous three-dimensional printed structure having printed filaments arranged in a geometric pattern. The printed filaments include a material having a plurality of gas-filled microballoons. The printed structure has hierarchical porosity including an inter-filament porosity defined by the arrangement of the printed filaments, and an intra-filament porosity of the material. The intra-filament porosity is defined by the plurality of gas-filled microballoons in the material of the printed filament.

IPC Classes  ?

• C09D 183/04 - Polysiloxanes
• C09D 7/40 - Additives
• B33Y 80/00 - Products made by additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing

Abstract

A system for creating a plasma field Faraday cage around a structure, the system comprising a plurality of lasers spaced apart from each other, each laser being configured to transmit an electromagnetic energy beam to a focal point of an atmosphere region, each electromagnetic energy beam having an amount of energy less than an amount of energy required to ionize air, the electromagnetic energy beams intersecting at the focal point such that the electromagnetic energy beams cooperatively ionize the air at the focal point to block electromagnetic radiation from passing through the focal point.

IPC Classes  ?

• H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

Abstract

A system and method of additively manufacturing a part including electrically conductive or static dissipating fluorine-containing polymers. The method includes depositing fluorine-containing polymer additive manufacturing material onto a build platform, selectively cross-linking portions of the deposited additive manufacturing material, and curing the selectively cross-linked portions such that the part is at least one of electrically conductive and static dissipating.

IPC Classes  ?

• B29C 64/00 - Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
• B29C 64/135 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
• B29C 64/20 - Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering - Details thereof or accessories therefor
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
• B33Y 80/00 - Products made by additive manufacturing
• B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
• B29C 64/307 - Handling of material to be used in additive manufacturing
• B29C 64/255 - Enclosures for the building material, e.g. powder containers
• B29C 64/245 - Platforms or substrates
• B33Y 99/00 - Subject matter not provided for in other groups of this subclass
• B29C 64/182 - Processes of additive manufacturing specially adapted for manufacturing multiple 3D objects in parallel batches
• B22F 12/00 - Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
• B29C 64/30 - Auxiliary operations or equipment
• B29C 64/386 - Data acquisition or data processing for additive manufacturing
• B33Y 40/10 - Pre-treatment
• B33Y 40/00 - Auxiliary operations or equipment, e.g. for material handling
• B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• B29C 64/25 - Housings, e.g. machine housings
• B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
• B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
• B29C 64/205 - Means for applying layers
• B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
• B33Y 50/00 - Data acquisition or data processing for additive manufacturing
• B22F 12/82 - Combination of additive manufacturing apparatus or devices with other processing apparatus or devices
• B29C 64/10 - Processes of additive manufacturing
• B29C 64/176 - Processes of additive manufacturing specially adapted for manufacturing multiple 3D objects sequentially
• B29C 64/227 - Driving means
• B22F 10/85 - Data acquisition or data processing for controlling or regulating additive manufacturing processes
• B05D 5/08 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• C09D 5/24 - Electrically-conducting paints
• H01L 23/498 - Leads on insulating substrates
• H01M 4/66 - Selection of materials
• G03G 5/05 - Organic bonding materials; Methods for coating a substrate with a photoconductive layer; Inert supplements for use in photoconductive layers
• G03G 5/07 - Polymeric photoconductive materials
• H05K 1/09 - Use of materials for the metallic pattern
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
• B29K 27/12 - Use of polyvinylhalogenides as moulding material containing fluorine
• B29K 507/04 - Carbon
• B01D 67/00 - Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
• G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

Abstract

A method of tuning an electrically small antenna comprising a radiating element and a support structure comprises applying a force to the support structure to change a shape or a dimension of the radiating element to increase or decrease a frequency at which the electrically small antenna resonates.

IPC Classes  ?

• H01Q 11/08 - Helical antennas
• H01Q 9/14 - Length of element or elements adjustable
• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
• H01Q 9/30 - Resonant antennas with feed to end of elongated active element, e.g. unipole

Abstract

A method of recovering filler material from a polymer material comprises (a) heating the polymer material to a first temperature; (b) heating the polymer material to a second temperature higher than the first temperature resulting in a pyrolyzed material; (c) elutriating the pyrolyzed material to obtain a separated mixture; and (d) filtering the separated mixture to obtain the filler material.

IPC Classes  ?

• B01D 43/00 - Separating particles from liquids, or liquids from solids, otherwise than by sedimentation or filtration
• B29C 71/02 - Thermal after-treatment