The invention relates to a strip-like connector made of metal, wherein the length and width of the strip-like connector are greater than the thickness of the strip-like connector, the strip-like connector comprising a first metal material (41) and a second metal material (42), wherein the first material (41) and the second material (42) are directly and interlockingly connected to one another and joined together by way of a connecting surface (50), wherein the connecting surface (50) has, lying opposite one another at least in some regions, interlocking and interengaging serrations (43, 52) of the first material (41) and the second material (42) along the width of the strip-like connector. The invention also relates to the use of such a strip-like connector for connecting galvanic cells, to a galvanic element comprising multiple galvanic cells, wherein the galvanic cells are connected and electrically contacted by at least one such strip-like connector, and to a method for producing a connecting strip and for producing strip-like connectors from the connecting strip.
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising a single busbar
B23K 20/04 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
3.
CATALYST SYSTEM FOR A FLOW REACTOR, AND METHOD FOR THE CATALYTIC OXIDATION OF AMMONIA
The invention relates to a catalyst system for flow reactors, said catalyst system being characterized by the order of the noble metal-containing alloys used in the catalyst gauze which forms the catalyst system. By using a ternary platinum alloy for a second catalyst gauze group and a palladium alloy for a third catalyst gauze group, the platinum and rhodium content of the catalyst system can be kept relatively low overall while having a high degree of efficiency. The invention additionally relates to a method for catalytically combusting ammonia, in which a fresh gas which contains at least ammonia is conducted through a catalyst system.
The present invention relates to a catalyst network comprising at least one noble metal wire that contains at least one dispersion-strengthened noble metal alloy. The invention also relates to a catalyst system containing at least one catalyst network according to the invention, and to a method for the catalytic oxidation of ammonia in which a catalyst network according to the invention is used.
C07D 235/12 - Radicals substituted by oxygen atoms
C07D 235/16 - Radicals substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
The invention relates to a particulate inorganic material equipped with elemental silver and elemental ruthenium, said inorganic material having an average particle size (d50) in the range of 50 nm to 40 μm and a BET surface area in the range of 1 to 1600 m2/g. The inorganic material as such is selected from the group consisting of aluminum nitride, titanium nitride, silicon nitride, corundum, titanium dioxide in the form of anatase, titanium dioxide in the form of rutile, pyrogenic silica, precipitated silica, sodium aluminum silicate, zirconium silicate, zeolite, hydrotalcite and gamma-aluminum oxide hydroxide.
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
C23C 18/44 - Coating with noble metals using reducing agents
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
7.
ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FORM OF WEDGE-WEDGE-BONDED STRUCTURES NOT CONSISTING OF SOLID METAL MATERIAL
An electronic module comprising one or more arrangements each composed of a first electronic component having a first contact surface with, wedge-bonded on this first contact surface, a first terminus of an originally free structure not consisting of solid metal material and a second electronic component having a second contact surface with, wedge-bonded on this second contact surface, a second terminus of the originally free structure not consisting of solid metal material, wherein the originally free structure not consisting of solid metal material is a structure (i) in ribbon form composed of knitted, woven or braided fine metal wire and having a cross-sectional area in the range of 25,000 to 800,000 µm2or (ii) in cable form composed of stranded fine metal wire and having a cross-sectional area in the range of 8000 to 600,000 µm2or (iii) in tube form composed of circular-knitted fine metal wire and having a cross-sectional area in the range of 8000 to 600,000 µm2.
H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The invention relates to a hydraulically curable inorganic cement composition comprising at least one compound with a water solubility of >10 g/L (at 20°C), selected from the group consisting of 5-member compounds which have an aromatic nitrogenous heterocyclic ring system that is free of other ring heterocyclic atoms and 6-member compounds which have an aromatic nitrogenous heterocyclic ring system that is free of other ring heteroatoms, and at least one water-dispersible EVA copolymer.
C04B 28/02 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
C04B 28/10 - Lime cements or magnesium oxide cements
C04B 28/34 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
C04B 40/00 - Processes, in general, for influencing or modifying the properties of mortars, concrete or artificial stone compositions, e.g. their setting or hardening ability
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
9.
CERAMIC-COATED METAL FOIL AS A FRICTION-ENHANCING ELEMENT
The invention relates to a joint element for increasing the frictional force in force-fitting connections, comprising a metal substrate having two opposing planar surfaces, wherein at least one of said surfaces has a ceramic layer, said ceramic layer preferably having been applied by aerosol deposition. The joint element is preferably free of phosphorus and does not contain diamonds.
A particulate carbon material that is provided with elemental silver and elemental ruthenium and has an average particle size (d50) in the range of 0.5 to 500 µm, a pore volume in the range of 0.5 to 10 mL/g and a BET surface in the range of 200 to 2000 m²/g.
The present invention relates to a method for producing a two-layer noble metal mesh on a flatbed knitting machine which has a first and a second needle bed. The method comprises: providing at least one wire containing noble metal; and knitting the noble metal mesh. The first and second layers of the noble metal mesh are knitted simultaneously on the first and second needle beds, these two parts being at least in part connected at their two abutting edges by connecting stitches.
The present invention relates to a method for producing a two-layer noble metal mesh on a flatbed knitting machine which has a first and a second needle bed. The method comprises: providing at least one wire containing noble metal; and knitting the noble metal mesh. The first and second layers of the noble metal mesh are knitted simultaneously on the first and second needle bed, and a supporting mesh is knitted on the first and second needle bed using a supporting thread. An abutting edge of the supporting mesh is connected to the two layers of the noble metal mesh via connecting stitches and knitted via both needle beds in the knitting rows containing the connection.
The invention relates to a method for separating rhodium from an aqueous hydrochloric solution which contains at least one chloro complex of rhodium and at least one chloro complex of iridium and/or at least one chloro complex of ruthenium. The invention is characterized in that the rhodium is precipitated out of the aqueous hydrochloric solution with a redox potential of ≥950 to 1050 mV using an aliphatic polyamine as a poorly soluble rhodium chloro complex salt while explicitly dispensing with a previously carried out joint separation together with the iridium and/or the ruthenium.
Particulate material Z composed of 15% to 50% by weight of particles X consisting of water-insoluble support material T provided with elemental silver and elemental ruthenium and 50% to 85% by weight of solid Y at least partially disposed on the particles X, wherein the solid Y is selected from the group consisting of aluminum oxide, aluminum hydroxide, aluminum oxyhydroxide, magnesium oxide, magnesium hydroxide, magnesium oxyhydroxide, calcium oxide, calcium hydroxide, calcium oxyhydroxide, silicon dioxide, silica, zinc oxide, zinc hydroxide, zinc oxyhydroxide, zirconium dioxide, zirconium(IV) oxyhydrates, titanium dioxide, titanium(IV) oxyhydrates and combinations thereof.
B22F 1/10 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
C22C 1/04 - Making non-ferrous alloys by powder metallurgy
16.
METAL-CERAMIC SUBSTRATE, METHOD FOR THE PRODUCTION THEREOF, AND MODULE
The present invention relates to a phosphine of the formula (1), wherein - Q is SiR3R4, GeR3R4, SnR3R4, AsR31-41-4 alkyl; or two groups R that bind to the same carbon atom together with the carbon atom form a 4- to 7-membered ring; or, under the proviso that m + n ≥ 2, two groups R that bind to different carbon atoms together with these carbon atoms form a 4- to 7-membered ring; - Ar1is aryl; - Ar2is aryl; - R3and R41-45-75-7 cycloalkyl or an aryl; or R3and R4 together with the Si, Ge or Sn atom form a 4- to 7-membered ring.
C07F 9/6596 - Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having atoms other than oxygen, sulfur, selenium, tellurium, nitrogen or phosphorus as ring hetero atoms
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
C07D 401/04 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring- member bond
C07D 403/04 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings directly linked by a ring-member-to-ring- member bond
C07D 413/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and oxygen atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring- member bond
The invention relates to a method for producing a metal film comprising the steps of applying a metal layer onto a substrate by means of aerosol deposition of a powder and at least partially or completely removing the substrate to obtain a film. The method is particularly suitable for processing brittle metals such as for example tungsten to metal films.
B22F 3/18 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor by using pressure rollers
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
The present invention relates to a process for manufacturing a capacitor, compris ing the process steps: a) provision of a porous electrode body (1) made of an electrode material (2), wherein a dielectric (3) at least partially covers a surface of this electrode material (2); b) introduction of a liquid composition which comprises an electrically con ductive polymer and a dispersing agent into at least a part of the porous electrode body (1) provided in process step a), wherein a conductive layer made from the liquid composition has a conductivity of less than 100 S/cm; c) at least partial removal of the dispersing agent from the porous electrode body (1) obtained in process step b) for the formation of a solid electrolyte layer (4) that at least partially covers a surface of the dielectric (3); d) filling at least a part of the pores (5) of the porous electrode body (1) ob tained in process step c) with an impregnation solution comprising at least one impregnation solvent, wherein the at least one impregnation solvent has a boiling point (determined at 1013 hPa) of at least 150°C; e) at least partial removal of the impregnation solvent from the porous elec trode body (1) obtained in process step d); f) encapsulation of the porous electrode body (1) obtained in process step e). The invention also relates to capacitor manufactured with this process, to a capaci tor characterized by a certain a decrease of the relative capacitance upon perfor mance of a surge test, to the use of an electrolytic capacitor and to electronic cir cuits.
The present invention relates to a process for producing a liquid composition comprising a functionalized π-conjugated polythiophenes, comprising the process steps of i) providing a liquid phase comprising a functionalized π-conjugated polythiophene that is dissolved or dispersed in a solvent, wherein the functionalized π-conjugated polythiophene comprises repeating units of the general formula (I) wherein X,Y are identical or different and are O, S, or NR1, wherein R1 is hydrogen or an aliphatic or aromatic residue having 1 to 18 carbon atoms; A is an organic residue carrying an anionic functional group; and wherein the liquid phase has a pH-value of less than 2.5; ii) adjusting the pH-value of the liquid phase provided in process step i) to a value in the range from 2.5 to 10 by the addition of a base. The present invention also relates to a liquid composition obtainable by this process, to a liquid composition comprising a functionalized π-conjugated polythiophene, wherein the composition, after is has been dried, is characterized by a certain weight loss at a given minimum temperature, to a process for the preparation of a layered body in which these liquid compositions are used for the formation of a conductive layer, to a layered body obtainable by this process and to the use of the liquid compositions for the preparation of a conductive layer in an electronic device.
The present invention relates to a printed product, which comprises: a. a substrate; b. a primer layer located on the substrate, wherein the primer layer comprises an organic dielectric material; c. a metal conductive layer located on the primer layer; wherein the printed product further comprises a hybrid layer between the primer layer and the metal conductive layer, wherein the hybrid layer comprises materials from the primer layer and the metal conductive layer. In addition, the present invention further relates to a method for preparing the printed product and an electronic device comprising the printed product. The metal conductive layer in the printed product of the present invention has excellent uniformity in thickness; good adhesion between the primer layer and the conductive layer; and the printed product of the present invention has excellent EMI shielding effects, such that the printed product can be used in high frequency applications such as 5G applications.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
A composition consisting of: (A) 20% to 30% by weight of one or more thermoplastic polymers, (B) 45% to 69% by weight of organic solvent, (C) 2% to 15% by weight of silica particles, (D) 0.5% to 10% by weight of organic thickener, (C) 1% to 10% by weight of particulate inorganic filler having a Mohs hardness in the range from 1 to 8, and (F) 0% to 1% by weight of one or more constituents other than constituents (A) to (E).
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
The present invention relates to a composition comprising i) at least one polythiophene selected from the group consisting of - a polythiophene comprising monomer units of structure (I) in which * indicates the bond to the neighboring monomer units, x, z represent O or S, R1-R4independently from each other represent a hydrogen atom or an organic residue R, with the proviso that at least one of residues R1to R4 represents an organic residue R; a polythiophene which is characterized by its compatibility in PGME (1-methoxypropan-2-ol), demonstrated by an RF-value of at least 0.8; iii) at least one ethylenically unsaturated compound; iv) at least one organic solvent; v) at least one radical initiator. The present invention also relates to a process for preparing a layer structure, to a layer structure obtainable by this process, to a layer structure, to an electronic component and to the use of composition according to the present invention.
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
24.
ANTI-CORROSION LAYER FOR SURFACES OF LOW-ALUMINUM ALLOYS
The invention relates to a method for depositing an aluminum oxide layer on the surface of a metal body, the metal of the metal body containing aluminum in an amount of 0.3-6 wt.%. The deposition is carried out by spraying an aerosol onto the surface of the metal body using the aerosol deposition method while an aluminum oxide layer is deposited. The aluminum oxide layer can serve as an anti-corrosion layer. The invention also relates to a metal body comprising an aluminum oxide layer which is produced according to the method.
C23C 24/04 - Impact or kinetic deposition of particles
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
Alloy comprising 90 to 96.8 wt.% of tin; 0.1 to 2.0 wt.% of silver; 2.0 to 4.0 wt.% of bismuth; 1.0 to 2.0 wt.% of antimony; 0.1 to 1.0 wt.% of copper; and 0.01 to 1 wt.% of germanium.
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
26.
SILVER SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF ELECTRONIC COMPONENTS
B22F 1/145 - Chemical treatment, e.g. passivation or decarburisation
B22F 1/16 - Metallic particles coated with a non-metal
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
27.
METHOD AND CATALYST FOR PRODUCING PHENOLIC BUILDING BLOCKS FROM LIGNIN
The invention relates to a method for the catalyzed decomposition of lignin with a high yield and high selectivity for phenolic building blocks and with minimal formation of the coke fraction, and to a catalyst suitable for the method. The catalyst contains a basic carrier material, platinum at a weight percentage of 1-10 wt.% and nickel at a weight percentage of 0-5 wt.%. The method comprises: providing a reaction mixture comprising - lignin, - the catalyst and - a solvent; and heating the reaction mixture so as to obtain a mixture comprising - a product mix, - the catalyst and - the solvent.
The present invention relates to a process for producing a noble metal-modified, graphitized carbon material, comprising providing a graphitized carbon material, wherein the graphitized carbon material has a degree of graphitization of at least 10%, impregnating the graphitized carbon material with a composition and thermal treatment of the impregnated graphitized carbon material. The composition comprises an organic solvent and at least one organic noble metal complex dissolved in the organic solvent. The invention further relates to a supported catalyst produced by this process and to an electrochemical cell containing this supported catalyst.
The invention relates to a method for reductive extraction of elemental noble metals from an acidic aqueous solution containing noble metal, the method comprising the addition of non-noble metal including zinc and/or tin to the acidic aqueous solution containing noble metal to form a reaction mixture, wherein the dissolved noble metal includes iridium, rhodium and/or ruthenium, wherein the non-noble metal is added in a leaner-than-stoichiometric amount, and wherein the pH of the acidic aqueous solution containing noble metal prior to the addition of the non-noble metal is in the range of +0.8 to +3.0 and is also kept in this range in the reaction mixture.
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ≤ 40 wt.-ppm.
B23K 35/40 - Making wire or rods for soldering or welding
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
31.
METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED METAL-CERAMIC SUBSTRATE
The invention relates to a method for structuring metal-ceramic substrates and to a structured metal-ceramic substrate which can be used in particular in power electronics. In the method, a first metal-ceramic substrate and a second metal-ceramic substrate are etched, wherein, while being contacted with an etching solution that is capable of removing active metal from the connecting layer of the metal-ceramic substrates, the first metal-ceramic substrate and the second metal-ceramic substrate are positioned such that an orthogonal projection of the first metal-ceramic substrate onto a projection plane parallel to the metal layer of the first metal-ceramic substrate shades no more than 60% of the metal layer of the second metal-ceramic substrate.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
C23F 1/00 - Etching metallic material by chemical means
The invention relates to a coated membrane containing - a membrane with a front and a rear face, - a catalyst-containing coating which is provided on the front face of the membrane, - said catalyst containing - a support material which has a BET surface area of maximally 80 m2/g, and - an iridium-containing coating which is provided on the support material and which contains an iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide or a mixture of at least two of said iridium compounds, wherein - the catalyst contains iridium in a quantity of maximally 60 wt.%, and - the coating provided on the membrane front face has an iridium content of maximally 0.4 mg iridium / cm2.
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
C25B 11/091 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of two or more catalytic elements or catalytic compounds
33.
PROCESS FOR THE MANUFACTURE OF ENCAPSULATED SEMICONDUCTOR DIES AND/OR OF ENCAPSULATED SEMICONDUCTOR PACKAGES
A process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages or for the manufacture of an encapsulation of semiconductor dies and/or of semiconductor packages comprising the steps: (1) assembling a multitude of bare semiconductor dies on a temporary carrier, and (2) encapsulating the assembled bare semiconductor dies, characterized in that an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent in step (2).
The invention relates to a particulate catalyst, containing: - a support material, - an iridium-containing coating which is provided on the support material and which contains iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide, wherein the support material has a BET surface area ranging from 2 m2/g to 50 m2/g, and the iridium content of the catalyst satisfies the following condition: (1.505 (g/m2) x BET) / (1 + 0.0176 (g/m2) x BET) ≤ Ir-G ≤ (4.012 (g/m2) x BET) / (1 + 0.0468 (g/m2) x BET), where BET is the BET surface area of the support material, in m2/g, and Ir-G is the iridium content, in wt.%, of the catalyst.
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
C25B 11/091 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of two or more catalytic elements or catalytic compounds
35.
SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS
The invention relates to a sintering paste consisting of: (A) 30 to 40 wt.% of silver flakes with an average particle size ranging from 1 to 20 µm, (B) 8 to 20 wt.% of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt.% of silver(I) oxide particles, (D) 12 to 20 wt.% of at least one organic solvent, (E) 0 to 1 wt.% of at least one polymer binder, and (F) 0 to 0.5 wt.% of at least one additive differing from the components (A) to (E).
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
The present invention relates to a method for manufacturing a semiconductor wafer comprising: i) applying a MOD ink composition to a semiconductor wafer, thereby forming a precursor layer; and ii) curing the precursor layer. In an embodiment, the application in step i) is carried out by inkjet printing. The method for inkjet printing MOD ink has low equipment cost and low power consumption; no material waste; on-demand printing and easy selective deposition/design flexibility (no etching required). In addition, the method of the present invention improves the adhesion and electric conductivity of the metallization layer on backside of the wafer.
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
The present invention relates a process for the production of a layer composition (9), comprising the process steps: a) provision of a substrate (10) with a substrate surface (11); b) formation of a stabilized electrically conductive polymer layer (12) on at least a part of the substrate surface (11), the formation of the stabilized electrically conductive polymer layer (12) comprising the process steps: b1) formation of an electrically conductive polymer layer (13) comprising an electrically conductive polymer on at least a part of the substrate surface (11); b2) application of a liquid stabilizer phase, comprising at least one stabilizer (7) and at least one solvent or dispersant, onto the electrically conductive polymer layer (13) obtained in process step b1) for the formation of a stabilizer layer (14), wherein the at least one stabilizer (7) is a flavonoid. The present invention also relates to a layer composition and to the use of a layer composition.
The invention relates to a method for recovering noble metal from a heterogeneous catalytic converter comprising a solid supporting material and palladium, platinum or rhodium, present at least partially in elemental form, said method comprising the steps of: (a) converting the noble metal to an oxidation level > 0 by treating the heterogeneous catalytic converter with an oxidizing agent in the presence of hydrochloric acid so as to form a two-phase system A comprising a hydrochloric aqueous phase A1 and a solid phase comprising the supporting material which is insoluble therein, (b) optionally, at least partially separating the hydrochloric aqueous phase A1 from the two-phase system A and adding a further aqueous phase to the remaining residue of the two-phase system A so as to form a two-phase system B comprising a hydrochloric aqueous phase B1 and a solid phase comprising the supporting material insoluble therein, and (c) cathodic electro-deposition of the at least one noble metal from the hydrochloric aqueous phase of the two-phase system.
The invention relates to a method for producing a wire, having at least the following steps: (i) providing a wire precursor; (ii) pressing depressions on the wire precursor and optionally molding the wire precursor in the process; and (iii) annealing the wire precursor provided with depressions in order to form the wire; wherein the wire has a content of at least 95 wt.% of copper based on the total weight of the wire. The invention additionally relates to a wire which can be obtained according to the aforementioned method and to the use of a roller in order to produce the wire and/or in order to set the roughness at at least one location of the wire.
B21B 1/16 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling wire or material of like small cross-section
B21H 8/00 - Rolling metal of indefinite length in repetitive shapes specially designed for the manufacture of particular objects
B21J 5/12 - Forming profiles on internal or external surfaces
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
The invention relates to a layered composite comprising two outwardly facing metal layers and, located therebetween, an alternating layer sequence of n layers of a hydraulically hardened inorganic cement composition and n - 1 metal layers with n = 1, 2 or 3.
B32B 13/02 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material with fibres or particles embedded in it or bonded with it
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
41.
LAMINATE FOR IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE
The laminate for an image display device of the present invention at least comprises: an adhesive layer formed of an adhesive composition comprising an adhesive polymer (A), a conductive polymer (B) comprising a conjugated polymer and a polyanion, and a crosslinking agent (C), an image display element located on one of two surfaces of the adhesive layer, and a polarizing film located on the other surface of the adhesive layer, wherein with respect to a test material comprising the adhesive layer having the polarizing film on one surface and a protective material, which has a release layer and which comprises polyethylene terephthalate (PET), on the other surface of the adhesive layer, with the adhesive layer and the release layer being located so as to be adjacent to each other, when the protective material is peeled off from the test material in an environment of a temperature of 23C and a relative humidity of 50%, a surface resistivity of the adhesive layer is 1 x 1012Ω/□ or less, a haze value of the test material from which the protective material has been peeled off is 2% or less, and the following formula (1) is satisfied. y/x < 10 ・・・ (1) (wherein x represents a surface resistivity of the adhesive layer when the protective material is peeled off from the test material in an environment of a temperature of 23°C and a relative humidity of 50%, and y represents a surface resistivity of the adhesive layer when the protective material is peeled off from the test material in an environment of a temperature of 23°C and a relative humidity of 50%, provided that the test material has been maintained in an environment of a temperature of 60°C and a relative humidity of 90% for 500 hours and dried at 80°C for 1 hour.)
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
nmmm, wherein L means a compound functioning as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and -O(CO)R2, wherein -O(CO)R1 and -O(CO)R2 mean identical or different non-aromatic C6-C18-monocarboxylic acid residues, and wherein n is a whole number ≥ 1 and m is a whole number ≥ 2, and (C) 0 to 10 wt% of at least one additive.
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
43.
NOBLE METAL COMPLEXES COMPRISING DIOLEFIN AND C6-C18 MONOCARBOXYLATE LIGANDS FOR SURFACE COATING
nmmm, in which L represents a compound acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and -O(CO)R2, wherein -O(CO)R1 and -O(CO)R2 represent identical or different non-aromatic C6-C18 monocarboxylic acid residues, in each case with the exception of a phenylacetic acid residue, and wherein n is an integer ≥ 1 and m is an integer ≥ 2.
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
44.
PROCESS FOR PRODUCING POLYMER CAPACITORS FOR HIGH RELIABILITY APPLICATIONS
The present invention relates to a method for manufacturing a capacitor, comprising the meth- od steps: a) provision of a porous electrode body (1) made of an electrode material (2), wherein a dielectric (3) at least partially covers a surface of this electrode material (2); b) introduction of a liquid composition which comprises an electrically conductive polymer, at least one high-boiling solvent having a boiling point (determined at 1013.25 hPa) of at least 150°C and of not more than 275°C and optionally a dispersing agent into at least a part of the porous electrode body (1) provided in process step a) and at least partial removal of the high-boiling solvent and, if present, of the dispersing agent for the formation of a solid electrolyte (4) that at least partially covers a surface of the dielectric (3); c) filling at least a part of the pores of the porous electrode body (1) obtained in process step b) with an impregnation solution (6) comprising at least one impregnation solvent, wherein the at least one impregnation solvent comprises at least one hydroxy group and has a molecular weight in the range from 70 to 180 g/mol; d) encapsulation of the porous electrode body (1) obtained in process step c). The invention also relates to capacitor manufactured with this method, the use of an electrolytic capacitor and electronic circuits.
ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD FOR PRINTING A FUNCTIONAL LAYER ON A SURFACE OF A THREE-DIMENSIONAL ELECTRONIC DEVICE
The present invention relates to an assembly to be used in an inkjet printer (1), an inkjet printer (1) and a method for printing. The assembly comprises (i) a first fixture (3a) configured to hold a first print head (200); and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section (20) in which a functional layer is printed on a surface of an electronic device (1000), a sintering section (40) spaced apart from the first printing section (20) and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section (20) to the sintering section (40). The first fixture 3a is movable from one processing line A, B, C, D to another processing line A, B, C, D.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
46.
METHOD FOR PRODUCING GLASS-FIBRE NOZZLES, AND GLASS-FIBRE NOZZLE
The invention relates to a method for producing glass-fibre nozzles, comprising the following steps: A) providing or producing a base plate (81) comprising a first material, wherein the first material is chemically resistant to the glass melt and is dispersion hardened; B) pressing at least one tube (82, 92), made of a second material, onto a face of the base plate (81), wherein the at least one tube (82, 92) comprises in each case at least one feedthrough (84, 94) and wherein the second material is chemically resistant to the glass melt; C) producing at least one passage (80) in the base plate (81), wherein the at least one passage (80) through the base plate (81) is connected to at least one of the at least one feedthrough (84, 94) of in each case one of the at least one tube (82, 92) such that each of the at least one passage (80) through the base plate (81) forms, together with at least one of the at least one feedthrough (84, 94) of an associated tube (82, 92) of the at least one tube (82, 92), a common line through which the glass melt can pass, which line leads through the base plate (81) and through the associated tube (82, 92), and wherein the base plate (181) is produced using a different method than the at least one tube (82, 92). The invention also relates to a glass-fibre nozzle for producing glass fibres and to a method for producing glass fibres.
The invention relates to a wire (1) or strip for production of test needles or slide contacts, the wire (1) or strip including a material or consisting of a material, the material having a matrix composed of copper, palladium, rhodium, or of a copper-base alloy, palladium-base alloy or rhodium-base alloy, including impurities associated therewith, wherein the matrix forms a coherent, metallically conductive structure in the material, wherein the boron nitride nanotubes are present in the matrix, wherein the boron nitride nanotubes form a fixed structure with the matrix. The invention also relates to a process for producing a wire (1) or tape and a test needle, a slide wire, a slide contact and a test needle array having at least one fragment of such a wire (1) or strip.
B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
B22F 5/12 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of tubes or wires
C22C 32/00 - Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
C22C 47/08 - Making alloys containing metallic or non-metallic fibres or filaments by contacting the fibres or filaments with molten metal, e.g. by infiltrating the fibres or filaments placed in a mould
C22C 49/02 - Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
C22C 49/14 - Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
C22C 47/14 - Making alloys containing metallic or non-metallic fibres or filaments by powder metallurgy, i.e. by processing mixtures of metal powder and fibres or filaments
48.
METHOD FOR PRODUCING A PRECIOUS METAL-CONTAINING COLLECTOR ALLOY OR PURE SILVER
The invention relates to a method for producing a collector alloy which comprises a total of 25 to 100 wt.% of precious metal, comprising 0 to <97 wt.% of the precious metal silver, 0 to 75 wt.% of at least one precious metal selected from gold, platinum, rhodium, and palladium, and 0 to 75 wt.% of at least one non-precious metal selected from copper, iron, tin, and nickel or for producing pure silver, having the steps of: (1) providing precious metal waste comprising a total of 4 to 30 wt.% of precious metal, comprising 0 to 30 wt.% of the precious metal silver, 0 to 10 wt.% of at least one precious metal selected from gold, platinum, rhodium, and palladium, 0 to 10 wt.% of at least one non-precious metal selected from copper, iron, tin, and nickel, and 70 to 96 wt.% of at least one refractory inorganic material, (2) providing a fluxing agent which, when melted together with the refractory inorganic material from the precious metal waste provided in step (1), is capable of forming a molten slag consisting of >35 to 45 wt.% of calcium oxide, 35 to 45 wt.% of silicon dioxide, 15 to <20 wt.% of aluminum oxide, and 0 to <15 wt.% of one or more refractory inorganic compounds differing from calcium oxide, silicon dioxide, and aluminum oxide, (3) melting together the materials provided in steps (1) and (2) at a temperature ranging from 1300 to 1600 °C, thereby forming a melt comprising at least two phases of different densities, said phases lying one over the other, and (4) separating the upper phase and the lower phase, wherein the upper phase comprises a slag phase consisting of >35 to 45 wt.% of calcium oxide, 35 to 45 wt.% of silicon dioxide, 15 to <20 wt.% of aluminum oxide, and 0 to <15 wt.% of one or more refractory inorganic compounds differing from calcium oxide, silicon dioxide, and aluminum oxide, and the lower phase comprises the collector alloy or pure silver. None of the materials used in the method comprise copper oxide apart from the copper oxide optionally used as the outer copper oxide layer provided on metallic copper.
Solder paste consisting of 85% to 92% by weight of a tin-based solder and 8% to 15% by weight of a flux, wherein the flux comprises i) 30% to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5% to 20% by weight, based on its total weight, of at least one low-molecular weight carboxylic acid; and iii) 0.4% to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molar mass distribution of 45 to 70 area% in the molar mass range of 150 to 550 and of 30 to 55 area% in the molar mass range of >550 to 10 000 in the combined GPC.
B23K 35/00 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
B23K 35/22 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B23K 35/38 - Selection of media, e.g. special atmospheres for surrounding the working area
B23K 35/365 - Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
B23K 35/368 - Selection of non-metallic compositions of core materials either alone or conjoint with selection of soldering or welding materials
A process for recovering precious metal from an acidic aqueous solution containing dissolved precious metal and free chlorine, comprising the sequential steps: (1) a salt of a non-precious metal at a low oxidation stage and in the form of a solid or an aqueous solution and the acidic aqueous solution are added together, resulting in the consumption of the free chlorine and the formation of an acidic aqueous mixture, and (2) a non-precious metal is added to the acidic aqueous mixture formed in step (1), leading to the precipitation of elementary precious metal.
nn, wherein L1 and L2 represent identical or different monoolefin ligands or together represent a compound L1L2 which functions as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and -O(CO)R2, wherein -O(CO)R1 and -O(CO)R2 represent identical or different nonaromatic C6-C18 monocarboxylic acid radicals or together represent a nonaromatic C8-C18 dicarboxylic acid radical -O(CO)R1R2(CO)O-, wherein the complexes are mononuclear platinum complexes with n = 1 or wherein in case of the presence of L1L2 and/or of -O(CO)R1R2(CO)O- the complexes may be polynuclear platinum complexes with integer n > 1, and (C) 0% to 10% by weight of at least one additive.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
The present invention relates to a method for producing a catalyst for an electrochemical cell, wherein: - a graphited porous carbon material having an oxygen-containing plasma or an aqueous medium containing an oxidising agent is treated, - at least one noble metal compound is deposited on the treated carbon material, - the impregnated carbon material is brought into contact with a reducing agent such that the noble metal compound is reduced to a metallic noble metal.
The invention relates to a method for producing a particulate carrier material provided with silver and ruthenium, comprising the following steps: a) providing a water-insoluble particulate carrier material and aqueously dissolved silver and ruthenium precursors, b) bringing the particulate carrier material into contact with the aqueous solution of the precursors to form an intermediate, c) bringing the intermediate into contact with an aqueous hydrazine solution having a pH value of >7 to 14 to form a mass comprising silver and ruthenium, d) optionally washing the obtained mass, and e) removing water and other possible volatile components from the mass.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
C23C 18/44 - Coating with noble metals using reducing agents
B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
54.
METHOD FOR PRODUCING A CATALYTIC CONVERTER SYSTEM FOR GAS REACTIONS
The invention relates to a method for producing a catalytic converter system for gas reactions comprising at least one precious metal sheet material having gas-permeable openings, comprising the steps: (1) providing at least one precious metal powder consisting of at least substantially spherical precious metal particles, and (2) repeatedly applying, layer by layer, the precious metal powder(s) provided in step (1) to a substrate in a construction space, followed in each case by an at least partial melting of the precious metal powder applied as a layer by means of high-energy radiation and allowing the melted precious metal powder to solidify as part of an additive manufacturing process, wherein the precious metal sheet material or each of the precious metal sheet materials having gas-permeable openings has an individual weight per area in the range from 25 to 2500 g/m2, wherein the precious metal particles of the precious metal powder(s) have a particle size distribution having a d10-value of ≥ 5 µm and a d90-value of ≤ 80 µm, and wherein the precious metal of the precious metal particles of the precious metal powder(s) is selected from the group consisting of precious metal alloys of platinum together with 1-15 wt% rhodium, platinum together with 2-15 wt% rhodium and 0.1-20 wt% palladium, platinum together with 2-15 wt% rhodium, 0.1-20 wt% palladium and 0.1-2 wt% ruthenium, platinum together with 2-15 wt% rhodium, 0.1-20 wt% palladium and 0.1-5 wt% iridium, palladium together with 3-15 wt% platinum, palladium together with 1-20 wt% platinum and 1-10 wt% rhodium, palladium together with 1-25 wt % tungsten, and palladium together with 1-15 wt% nickel.
A silver sintering preparation comprising: (A) 30 to 88 wt.-% of silver flake particles having a mean particle diameter (d50) in the range of >1 to 20 µm, (B) 5 to 30 wt.-% of at least one silver precursor, (C) 1 to 10 wt.-% of an organic polymer system, and (D) 6 to 30 wt.-% of organic solvent, wherein the organic polymer system (C) is chemically essentially stable at temperatures <300 °C and forms a continuous phase together with the organic solvent (D).
B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
The present invention relates to a composition comprising i) at least one polythiophene comprising monomer units of structure (la) or (lb), Formulae (IA) or (Ib) in which * indicates the bond to the neighboring monomer units, X,Z represent O or S, R1-R6independently from each other represent a hydrogen atom or an organic residue R, with the proviso that at least one of residues R1to R4and one of residues R5and R6represents an organic residue R; ii) at least one organic compound carrying one or two inorganic acid group(s), preferably one or two sulfonic acid group(s), one or two sulfuric acid group(s), one or two phosphonic acid group(s) or one or two phosphoric acid group(s), or a salt of said organic compound, wherein the molecular weight of the organic compound or the salt thereof is less than 1,000 g/mol; iii) at least one organic solvent. The present invention also relates to a process for preparing a composition, to a composition obtainable by this process, to a layer structure, to a process for the preparation of a layer structure, to a layer structure obtainable by this process, to an electronic component and to the use of composition according to the present invention.
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C09D 133/10 - Homopolymers or copolymers of methacrylic acid esters
nn, wherein L1 and L2 are the same or different monoolefin ligands or together represent a compound L1L2 acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and -O(CO)R2, wherein -O(CO)R1 and -O(CO)R2 are the same or different C6-C18 or C8- C18 non-aromatic monocarboxylic acid residues with the exception of a phenylacetic acid residue, or together represent a C8-C18 non-aromatic dicarboxylic acid residue -O(CO)R1R2(CO)O-, wherein it is a mononuclear platinum complex where n = 1 or if L1L2 and/or of -O(CO)R1 R2(CO)O- is present, it may be a polynuclear platinum complex with a whole number n > 1.
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
The invention relates to a process of manufacturing a composite comprising a layer of a polyimide and a substrate, comprising at least these steps: i. Providing a first composition comprising an acid compound; and a second composition comprising a diamine compound; ii. Forming a first layer on the substrate, and iii. Forming a second layer on the first layer, wherein if the first layer is formed by applying the first composition, the second layer is formed by applying the second composition, and vice versa; wherein the first and the second layer overlap at least in part thereby forming a pattern on the substrate; iv. Conducting a thermal treatment on the pattern wherein the polyimide layer is formed. The invention further relates to such a composite, a kit comprising a first composition comprising an acid compound and a second composition comprising a diamine compound as well as a use of the kit.
C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
The invention relates to a method for integrally joining components, wherein (a) a component (1) and a component (2) are provided, (b1) a layer of copper paste is applied to one of the surfaces to be joined, a soldering agent is then applied thereto and the components (1) and (2) are arranged such that they are in contact via the combination of copper paste and soldering agent, or (b2) a soldering agent or a tin (alloy) layer is applied to one of the surfaces to be joined, and then a layer of copper paste is applied thereto and the components (1) and (2) are arranged such that they are in contact via the combination of soldering agent and copper paste or of tin (alloy) layer and copper paste, or (b3) a layer of copper paste is applied to one of the surfaces to be joined and a soldering agent or a tin (alloy) layer is applied to the other of the surfaces to be joined and the components (1) and (2) are arranged such that they are in contact via the layer consisting of copper paste and the soldering agent or via the layer consisting of copper paste and the tin (alloy) layer, or (b4) a layer of copper paste is applied to one of the surfaces to be joined and the components (1) and (2) are arranged such that the surfaces thereof to be joined are in contact via the layer consisting of copper paste, and a soldering agent is applied next to or onto a portion of the layer consisting of copper paste not covered by one of the components (1) or (2), and (c) the arrangement created in step (b1), (b2), (b3) or (b4) is soldered, wherein the copper paste (i) contains 66–90 wt% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles and copper-rich copper/tin alloy particles, (ii) 0–20 wt% of at least one type of solder particles selected from the group consisting of tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles and tin-rich tin/copper/silver alloy particles and (iii) 10–20 wt% of a vehicle, wherein the particles (i) have an average particle size in the range from 20 to 50 µm and wherein the absolute particle sizes of the particles (i) are at least substantially within the range from 4 µm to 70 µm.
The present invention relates to a capacitor comprising i) an electrode body comprising an electrode material, wherein a dielectric layer comprising a dielectric material at least partially covers a surface of the electrode body; ii) a solid electrolyte layer comprising a solid electrolyte material that at least partially covers a surface of the dielectric layer, wherein the solid electrolyte material comprises a conductive polymer; iii) an anode contact that is in contact with the electrode body and that comprises copper, metal-plated copper or a copper-containing alloy; and iv) a cathode contact that is in contact with the solid electrolyte layer; wherein the capacitor further comprises at least one metal ion migration inhibitor. The present invention also relates to a process for the production of a capacitor, to a capacitor obtainable by such a process, to electronic circuit comprising the capacitor according to present invention and to the use of these capacitors in electronic circuits.
The invention relates to a method for preparing a catalyst composition, wherein - in an aqueous medium containing an iridium compound, at a pH ≥ 9, an iridium-containing solid is deposited on a support material, and - the support material loaded with the iridium-containing solid is separated from the aqueous medium and dried, wherein, in the method, the support material loaded with the iridium-containing solid is not subjected to a thermal treatment at a temperature of more than 250°C for a period of time of longer than 1 hour.
The present invention relates to a method for producing a membrane for a fuel cell or electrolytic cell, in which (i) a liquid coating composition, which contains a supported catalyst containing precious metal and also contains an ionomer, is applied to a polymer electrolyte membrane which contains an ionomer, the ionomer of the liquid coating composition and the ionomer of the polymer electrolyte membrane each being a copolymer which contains as monomer a fluoroethylene and a fluorovinyl ether containing a sulfonic acid group, (ii) the coated polymer electrolyte membrane is heated to a temperature in the range from 178°C to 250°C.
C09D 141/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic rin; Coating compositions based on derivatives of such polymers
H01M 8/1004 - Fuel cells with solid electrolytes characterised by membrane-electrode assemblies [MEA]
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/10 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms including an ion-exchange membrane in or on which electrode material is embedded
H01M 8/102 - Polymeric electrolyte materials characterised by the chemical structure of the main chain of the ion-conducting polymer
The invention relates to a method for producing a PGM collector alloy, comprising the steps: (1) providing (a) copper and/or silver, (b) material to be processed by melting metallurgy, in the form of at least one sodium and/or potassium aluminum silicate carrier, equipped with at least one PGM, and (c) at least one compound selected from the group consisting of iron oxides, calcium oxide, magnesium oxide, calcium carbonate, magnesium carbonate, sodium carbonate and potassium carbonate, (2) collective melting of the materials provided in step (1) at a temperature in the range of from 1250 to <1450°C, ensuring a 100:40 to 100:20 weight ratio of the materials provided in the sub-steps (1b) and (1c) and a 35:65 to 80:20 weight ratio of copper and/or silver : PGM, forming a melt comprising two phases of different densities, (3) separating the top phase of low density, consisting of melted slag, from the bottom phase of high density, consisting of melted PGM collector alloy, by utilizing the difference in density, (4) allowing the melt phases, which have been separated from each other, to cool and solidify, and (5) collecting the solidified PGM collector alloy.
C22B 5/10 - Dry processes by solid carbonaceous reducing agents
C22B 9/10 - General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals with refining or fluxing agents; Use of materials therefor
C22B 11/02 - Obtaining noble metals by dry processes
64.
METHOD FOR BREAKING DOWN A MIXTURE OF SOLID PARTICLES COMPRISING RUTHENIUM
A method for breaking down a mixture, which is present in the form of solid particles, consisting of: (A) 0 to 99% by weight of metallic ruthenium, (B) 0 to 50% by weight of at least one element other than ruthenium, which is present in elementary form, selected from the group of elements of the atomic numbers 13, 21-30, 39-42, 45-52, and 72-83, (C) 0 to 99% by weight of ruthenium oxide, (D) 0 to 70% by weight of at least one solid element oxide other than ruthenium, (E) 0 to 30% by weight of at least one inorganic substance other than (A) to (D), and (F) 0 to 3% by weight of at least one organic substance, wherein the sum of the % by weight of the compounds (A) to (F) is 100% by weight and the ruthenium content of the mixture is 2 to 99% by weight, and wherein the method comprises the steps of: (1) optionally mixing said mixture with alkali carbonate by forming a blend, (2) alkaline oxidizing breakdown of the mixture or of the blend, respectively, formed in optional step (1) into molten potassium hydroxide using a gaseous oxidizing agent selected from the group consisting of air, oxygen, and air/oxygen mixtures, and without use of nitrate, and (3) cooling down the breakdown material formed in step (2) to a temperature below its solidification temperature, wherein the gaseous oxidizing agent is introduced into the melt in step (2).
Known catalyst systems for the catalytic combustion of ammonia to form nitrogen oxides consist of a plurality of single- or multi-layer catalyst gauzes which are knitted, braided or woven from platinum-based precious metal wire, and when arranged after one another when viewed in a fresh gas flow direction, they form a front group of gauze layers and at least one downstream group of gauze layers arranged after the front group. In order to provide a catalyst system on this basis for use in a medium-pressure system for ammonia oxidation, with which a long lifespan and a high yield of the main product NO can be achieved, according to the invention: the front group comprises one gauze layer or multiple gauze layers made from a first rhodium-rich precious metal wire, wherein the gauze layer or one of the gauze layers made from the rhodium-rich precious metal wire is a front-most gauze layer facing the fresh gas; and the downstream group comprises gauze layers made from a second low-rhodium precious metal wire, wherein the rhodium content in the rhodium-rich precious metal wire is at least 7 wt.% and max. 9 wt.% and is at least one percentage point higher than the rhodium proportion in the low-rhodium precious metal wire.
Known catalyst systems for the catalytic combustion of ammonia to form nitrogen oxides consist of a plurality of catalyst gauze layers which are knitted, woven or braided from platinum-based precious metal wire, which form a catalyst package when arranged after one another when viewed in a fresh gas flow direction. In order to provide a catalyst system on this basis for use in a medium-pressure system, with which a yield of the main product NO comparable to the industry standard can be achieved despite the reduced precious metal use, according to the invention, the catalyst package is formed from a front assembly with three catalyst gauzes with a first average mass per unit area and a downstream assembly of catalyst gauze layers arranged after the front assembly and having a second average mass per unit area, wherein the average mass per unit area of the front assembly has a short weight in the region of 1.5 % to 29% in relation to the second average mass per unit area, and the first average mass per unit area lies in the regions of 410 to 30 g/m2and the second average mass per unit area lies in the region of 540 to 790 g/m2.
The invention relates to a test needle for measurement of electrical contact connection and to a bonding wire for electrical contact connection of a chip, wherein the test needle or bonding wire has been manufactured from a foil for production of test needles or bonding wires, said foil having a thickness of not more than 100 pm and said film comprising a composite composed of Cu layers composed of copper and/or a copper-base alloy with at least 90% by weight of copper and refractory metal layers composed of a refractory metal from the group of niobium and tantalum or refractory metal layers composed of a refractory metal-base alloy having at least 90% by weight of at least one refractory metal, wherein the layer composite includes at least 125 Cu layers and 125 refractory metal layers per 10 pm of thickness, wherein the test needle has a thickness between 2 pm and 100 pm or the bonding wire has a cross section between 2 pm and 100 pm. The invention also relates to a process for producing such a test needle for measurement of electrical contact connection and such a bonding wire for electrical contact connection of a chip.
The invention relates to a packaging unit for substrates, a packaging stack having packaging units of this type and a method for packaging substrates. The packaging unit for substrates comprises a first substrate, a spacer and a second substrate. The spacer is placed on the first substrate and the second substrate is placed on the spacer. A respective metal deposit is applied to a surface of the first substrate and to a surface of the second substrate and a respective adhesive point is arranged on the two metal deposits. The spacer is placed on the first substrate in such a way that the spacer is only in contact with the first substrate outside of the adhesive point. The spacer is bridge-shaped. At least the first substrate comprises a plurality of individual substrates arranged next to one another and the spacer borders the individual substrates.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
The invention relates to a packaging unit for a substrate, a packaging stack having packaging units of this type and a method for packaging a substrate. The packaging unit for a substrate comprises a casing, a substrate and a cover. The substrate is introduced into the casing. A metal deposit is applied to a surface of the substrate and an adhesive point is arranged on the metal deposit. The cover is placed onto the casing and has at least one protrusion, which contacts the substrate outside of the adhesive point and secures the substrate in a direction perpendicular to the surface of the substrate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 21/02 - Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
B65D 81/02 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
B65D 1/36 - Trays or like shallow containers with moulded compartments or partitions
B65D 81/127 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using rigid or semi-rigid sheets of shock-absorbing material
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
B65D 81/26 - Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
The present invention relates to a packaging unit for a substrate, to a packaging stack with such packaging units, and to a method for packaging a substrate. The packaging unit for a substrate comprises a first tray, a substrate and a second tray. The substrate is laid in the first tray and the second tray is placed on the first tray such that a first side of the substrate is enclosed by the first tray and an opposite, second side of the substrate is covered by the second tray. Applied to the second side of the substrate is a metal deposit, and a spot of glue is arranged on the metal deposit. The second tray is supported on the first tray such that the second tray is in contact with the substrate only away from the spot of glue.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
B65D 1/36 - Trays or like shallow containers with moulded compartments or partitions
B65D 21/02 - Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
B65D 81/02 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of a material selected from the group consisting of pure copper, doped copper with a copper content of >99.8 wt.-% and copper alloys with a copper content of at least 98 wt.-%, wherein all amounts in wt.-% are based on the total weight of the core, and wherein the coating layer is a triple-layer comprised of a 1 to 100 nm thick inner layer of gold, a 25 to 300 nm thick intermediate layer of palladium and a 1 to 50 nm thick outer layer of gold.
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C25D 5/10 - Electroplating with more than one layer of the same or of different metals
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/40 - Making wire or rods for soldering or welding
The present invention relates to a method of manufacturing a semiconductor package, which is at least in part covered by an electromagnetic interference shielding layer, comprising at least these steps: i. Providing the semiconductor package and an ink composition; wherein the ink composition comprises at least these constituents: a) A compound comprising at least one metal precursor; b) At least one organic compound; and ii. Applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; iii. Treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm, and to a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. The present invention relates also to a semiconductor package comprising a electromagnetic interference shielding layer, wherein the specific conductance of the first layer of electromagnetic interference shielding material is in the range from 5 to 90 % of bulk metal; and wherein the thickness of the first layer of electromagnetic interference shielding material is in the range from 5 nm to 5 pm. The present invention relates further to some uses of an ink composition.
The invention relates to a metal paste, which comprises (A) 65 to 85 wt.-% metal particles and (B) 10 to 35 wt.-% organic solvent, 70 to 100 wt.-% of the metal particles (A) consisting of organically coated copper flakes having a specific surface in the range of 1.9 to 3.7 m2/g, a total oxygen content in the range of 2 to 4 wt.-% and a total carbon to total oxygen weight ratio in the range of 0.2 to 0.9.
The invention relates to a method for breaking down a mixture in the form of solid particles, consisting of: (A) 0.05 to 99 wt% of metallic ruthenium, (B) 0 to 50 wt% of at least one element different from ruthenium, in elemental form, selected from the group of elements having atomic numbers 13, 21-30, 39-42, 45-52 and 72-83, (C) 0 to 99 wt% of ruthenium oxide, (D) 0 to 70 wt% of at least one solid element oxide different from ruthenium oxide, (E) 0 to 30 wt% of at least one inorganic substance different from (A) to (D), and (F) 0 to 3 wt% of at least one organic substance, the sum of the wt% of constituents (A) to (F) being 100 wt% and the ruthenium concentration of the mixture being 2 to 99 wt%, and the method comprising the steps: (1) optionally mixing the mixture with alkali carbonate to form an admixture, (2) breaking down the mixture or the admixture formed in the optional step (1) by alkaline oxidation in molten potassium hydroxide using air as an oxidant and without the use of nitrate, and (3) cooling the breakdown material formed in step (2) to a temperature below the solidification temperature of said breakdown material.
Described is a metal-insulator substrate in which the metal is patterned for direct cooling purposes. Furthermore, a process for manufacturing said metal-insulator substrate is described.
The present invention relates to a liquid composition comprising i) particles comprising a complex of a polythiophene and a polyanion; ii) a liquid phase, wherein the liquid phase comprises iia) water and iib) at least one organic solvent having -a boiling point, determined at a pressure of 1013 mbar, in the range from 110 to 250°C and -a solubility in water, determined at 25°C,of at least 10 wt.-%, wherein the liquid phase is an azeotrope or is capable of forming an azeotrope. The invention also relates to a process for the preparation of a layered body, to the layered body obtainable by such a process and to the use of a liquid composition.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
HERAEUS PRECIOUS METAL TECHNOLOGY (CHINA) CO., LTD. (China)
Inventor
Zhang, Bin
Mock, Christian
Bauer-Siebenlist, Bernhardt
Hu, Zhengquan
Fan, Cunfei
Li, Wengang
Liu, Gangfeng
Abstract
A process for the incineration of precious metal catalyst briquettes, wherein the precious metal catalyst briquettes comprise precious metal catalyst, optionally water, and, also optionally, binder.
An object of the present invention is to provide an optical laminate provided with a protective material that has high antistatic property when peeled from an optical member and has high transmittance, an adhesive composition and a protective material used for these. An optical laminate provided with an optical member, and a protective material laminated on the optical member, in which the protective material has a substrate, and an adhesive layer provided on the substrate, and the adhesive layer contains a (meth)acrylic adhesive polymer having a glass transition temperature of 0°C or lower, a conductive polymer containing a conjugated polymer and a polyanion, and an amphiphilic compound, and is provided so as to adjacent to a surface of the optical member.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, ; Adhesives based on derivatives of such polymers
79.
METHOD FOR PRODUCING A CONDUCTOR TRACK SECTION OF A CONNECTION CARRIER, CONDUCTOR TRACK SECTION PRODUCED IN THIS WAY, METHOD FOR PRODUCING A CONNECTION CARRIER, CONNECTION CARRIER PRODUCED IN THIS WAY, AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT
The invention relates to a method for producing at least one conductor track section (21, 21`, 22) of a connection carrier (10). The method according to the invention is characterized by the following steps: a) separating a metal film (50, 50') situated in a processing machine in the transport direction (T) into a plurality of metal strips (51, 51`), b) at least in sections increasing the distance between the metal strips (51, 51`) in the processing machine, c) separating the metal strips (51, 51`) applied on a carrier film into a plurality of conductor track sections (21, 21`, 22).
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced, by melting, from a solder preform comprising discrete contact surfaces B and C, and subsequent cooling of the molten solder at the solidification temperature thereof, the solder preform being fixed to the contact surfaces A and/or D, before the melting, with the contact surfaces B and/or C thereof, by means of an applied fixing agent consisting of a fixing agent composition, and the contact surface A is arranged facing the contact surface B and the contact surface C is arranged facing the contact surface D.
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
C21D 9/50 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for welded joints
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced by melting a solder deposit arranged between the two components and connected to one of the components, on the contact surface A or D, and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being previously produced by melting a solder preform fixed to the relevant contact surface by means of an applied fixing agent consisting of a fixing agent composition and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being arranged with the free contact surface thereof facing the corresponding contact surface D or A of the as yet unconnected component. Said fixing agent composition consists of between 0 and 97 wt. % of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285°C, between 3 and 100 wt. % of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable between 30 and 180°C and (ii) non-polymer organic compounds without acid groups, which are meltable between 30 and 180°C, between 0 and 20 wt. % of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable between 30 and 180°C and (iv) non-polymer organic compounds without acid groups, which are not meltable between 30 and 180°C and do not have a boiling point or have a boiling of above 285°C, and between 0 and 30 wt. % of at least one inorganic solid filler. In the absence of at least one constituent (i) in the at least one material M1 1500 µm2, the sum of the surface portions, provided with the fixing agent, of the contact surfaces A and B or C and D forming a common overlapping surface when the solder preform is put in place, amounts to 50 surface % of the common overlapping surface, while in the sole absence of at least one constituent (ii) in the at least one material M1 1500 µm2, said sum amounts to 100 surface % of the common overlapping surface.
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced by melting a solder deposit connected to one of the components, on the contact surface A or D, and subsequent cooling of the molten solder at the solidification temperature thereof, a fixing agent consisting of a fixing agent composition having been previously applied to the contact surface A or D which is not connected to the solder deposit and/or to the free contact surface of the solder deposit, and the solder deposit being arranged with the free contact surface thereof facing the contact surface A or D which is not connected to the solder deposit. Said fixing agent composition consists of between 0 and 97 wt. % of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285°C, between 3 and 100 wt. % of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable between 30 and 180°C and (ii) non-polymer organic compounds without acid groups, which are meltable between 30 and 180°C, between 0 and 20 wt. % of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable between 30 and 180°C and (iv) non-polymer organic compounds without acid groups, which are not meltable between 30 and 180°C and do not have a boiling point or have a boiling of above 285°C, and between 0 and 30 wt. % of at least one inorganic solid filler. In the absence of at least one constituent (i) in the at least one material M1 1500 µm2, the sum of the surface portions, provided with the fixing agent, of the contact surface A or D forming a common overlapping surface with the free contact surface of the solder deposit, amounts to 50 surface % of the common overlapping surface, while in the sole absence of at least one constituent (ii) in the at least one material M1 1500 µm2, said sum amounts to 100 surface % of the common overlapping surface.
B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
A method for the hydrometallurgical processing of a noble metal-tin alloy consisting of (i) 0.45 to 25 wt.% of at least one metal A selected from the group consisting of gold and platinum, (ii) 35 to 99.2 wt.% of at least one metal B selected from the group consisting of palladium, silver and copper, (iii) 0.3 to 30 wt.% tin and (iv) 0 to 50 wt.% of at least one of an element other than gold, platinum, palladium, silver, copper and tin, the alloy having a metal A : tin ratio by weight of > 0.7 : 1, comprising the steps: (a1) targeted selection of the noble metal-tin alloy or (a2) targeted production of the noble metal-tin alloy, (b) dissolving the nitric acid-soluble components of the noble metal-tin alloy in nitric acid to form a nitric acid solution comprising the at least one metal B as a dissolved nitrate and an undissolved residue, (c) separating the undissolved residue from the nitric acid solution, and (d) dissolving the separated residue in hydrochloric acid and a medium comprising at least one oxidising agent.
An electrically conductive composition containing the constituents: (A1a) 30 to 50 wt% of electrically conductive particles having an average particle size ranging from 1 to 25 μm and an aspect ratio ranging from 5 to 30 : 1 and (A1b) 20 to 60 wt% of non-metallic particles having an average particle size ranging from 1 to 25 μm and an aspect ratio ranging from 1 to 3 : 1, or (A2a) 70 to 90 wt% of electrically conductive particles and (A2b) 0 to 15 wt% of non-metallic particles, (B) 5 to 25 wt% of particles different from (A1a) and (A2a) and made of an alloy that melts at temperatures ranging from 50 to 180°C and contains indium and/or tin, (C) 5 to 25 wt% of a curable resin system, and (D) 0 to 10 wt% of at least one additive, the electrically conductive composition being devoid of substances with one or more cyanate groups.
A process for the recovery of precious metal (PM) from PM oil, the process including combustion of PM oil within a furnace, where the PM oil is burned in atomized form.
C22B 11/02 - Obtaining noble metals by dry processes
C10G 31/00 - Refining of hydrocarbon oils, in the absence of hydrogen, by methods not otherwise provided for
F23J 15/06 - Arrangements of devices for treating smoke or fumes of coolers
F23G 7/05 - Methods or apparatus, e.g. incinerators, specially adapted for combustion of specific waste or low grade fuels, e.g. chemicals of waste oils
C01G 55/00 - Compounds of ruthenium, rhodium, palladium, osmium, iridium, or platinum
F23D 11/00 - Burners using a direct spraying action of liquid droplets or vaporised liquid into the combustion space
86.
METHOD FOR PRODUCING A STABLE SANDWICH ARRANGEMENT OF TWO COMPONENTS WITH SOLDER SITUATED THEREBETWEEN
A method for producing a stable sandwich arrangement of two components with solder situated therebetween comprises the steps: (1) providing two components, which each have at least one contact area, and one free solder preform, (2) producing a sandwich arrangement of the components and a solder preform, which is arranged between said components and is not yet connected to said components, by bringing into contact (i) in each case one of the contact areas or (ii) in each case the single contact area of the components or (iii) one of the contact areas of one component and the single contact area of the other component with the contact areas of the free solder preform, and (3) hot-pressing the sandwich arrangement produced in step (2) so as to form the stable sandwich arrangement at a temperature which lies at 10 to 40% below the melting point, expressed in °C, of the solder metal of the solder preform. Each of the two components can be selected from the group consisting of substrates, active components and passive components. The combination of pressure and pressing duration can lie in a range which causes a reduction in the original thickness of the originally free solder preform of <10%. The method can comprise the further steps: (4) heating the stable sandwich arrangement to a temperature above the melting point of the solder metal of the solder connection which connects the two components, and (5) cooling down the sandwich arrangement to below the solidification temperature of the molten solder metal, which is situated between the components, so as to form a solder connection between the components.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
87.
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PREFORM
Method for producing a component which is connected to a solder preform comprises the steps of: (1) providing a component, which has at least one contact face, and a free solder preform, (2) producing an arrangement comprising the component and the solder preform, which is not yet connected to it, by bringing one or the only contact face of the component into contact with a contact face of the free solder preform, and (3) hot-pressing the arrangement, which is produced in step (2), so as to form the component, which is connected to the solder preform, at a temperature which is 10 to 40% below the melting point of the solder metal of the solder preform expressed in °C and a combination of pressing force and pressing duration which in the process creates a reduction in the original thickness of the originally free solder preform of <10%. The component can be a substrate, an active component or a passive component. The method can comprise the further steps of: (4) producing a sandwich arrangement comprising solder preform which is connected to the component and a further component which is to be connected thereto by bringing the outwardly facing solder metal contact face of the solder preform, which is connected to the component, into contact with one or the only contact face of the further component, (5) heating the sandwich arrangement to a temperature above the melting point of the solder metal of the solder preform, and (6) cooling down the sandwich arrangement to below the solidification temperature of the molten solder metal which is located between the components, so as to form a solder connection between the components. As an alternative, the method can comprise, instead of steps (4)-(6), the further steps of: (4') producing a sandwich arrangement comprising solder preform, which is connected to the component, and a further component, which is to be connected thereto, by bringing the outwardly facing solder metal contact face of the solder preform, which is connected to the component, into contact with one or the only contact face of the further component, and (5') hot-pressing the sandwich arrangement which is produced in step (4') at a temperature which is 10 to 40% below the melting point of the solder metal of the solder preform, which is connected to the component which is provided in step (1), expressed in °C, so as to form a solder connection between the components, wherein the combination of pressing force and pressing duration which acts during step (5') lies in a region which can cause a reduction in the thickness of the connected solder preform of <10%.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
88.
COMPOSITION FOR PRODUCING AN AQUEOUS COATING COMPOUND
C04B 28/34 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
89.
SOLAR CELL CONNECTOR HAVING A FUNCTIONAL LONGITUDINAL COATING
The invention relates to a connector for connecting a first solar cell electrode to a further element, wherein the connector has a metallic conductor structure and the conductor structure is coated along its length alternately in a circumferential manner with two respective continuous areas of materials A and B, wherein A is a solder material and B is a dielectric material, characterized in that the surface area of each orthogonal projection of the entire connector is at least 10% larger than the surface area of the orthogonal projection of each of the areas of material A. The invention further relates to a method for producing the connector and to a photovoltaic component containing the connector according to the invention.
An object of the present invention is to provide an adhesive composition and an adhesive sheet that are stably dissolved or dispersed in a solvent or a dispersion medium having low polarity, have high total light transmittance and have high-function antistatic properties. An adhesive composition including (A) an adhesive polymer comprising repeated structures which consist of one or more kinds of (meth)acryl-based, urethane-based, silicone-based and polyolefin-based unit structures, (B) a conductive polymer complex including a conjugated polymer, and a polyanion having a block copolymer structure, and (C) a nonaqueous solvent or dispersion medium, in which the conductive polymer complex is contained by 0.1 parts by mass or higher and lower than 10 parts by mass relative to 100 parts by mass of the adhesive polymer.
The invention relates to a composition consisting of: (a) 1 to 30 wt.% of a 1 to 90 wt.% aqueous phosphoric acid and/or at least one hydrogen phosphate selected from the group consisting of mono- and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt and copper; (b) 1 to 40 wt.% of at least one compound selected from the group consisting of oxides, hydroxides and oxide hydrates of magnesium, calcium, iron, zinc and copper; (c) 40 to 95 wt.% of at least one particulate filling material selected from the group consisting of glass; mono-, oligo- and polyphosphates of magnesium, calcium, barium and aluminium; calcium sulphate; barium sulphate; simple and complex silicates comprising sodium, potassium, calcium, aluminium, magnesium, iron and/or zirconium; simple and complex aluminates comprising sodium, potassium, calcium, magnesium and/or zirconium; simple and complex titanates comprising sodium, potassium, calcium, aluminium, magnesium, barium and/or zirconium; simple and complex zirconates comprising sodium, potassium, calcium, aluminium and/or magnesium; zirconium dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; (d) 0.5 to 12 wt.% of at least one solid hydroxycarboxylic acid; (e) 0.5 to 12 wt.% of at least one solid hydroxycarboxylic acid salt comprising at least one cation selected from the group consisting of sodium, potassium, calcium, magnesium, aluminium and ammonium; and (f) 0 to 15 wt.% of at least one component that is different to the components (a) to (e).
C04B 28/34 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
The invention relates to a composition consisting of: (a) 1 to 30 wt.% of at least one hydrogen phosphate selected from the group consisting of mono- and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt and copper, optionally in combination with 1 to 90 wt.% aqueous phosphoric acid; (b) 1 to 40 wt.% of at least one compound selected from the group consisting of oxides, hydroxides and oxide hydrates of magnesium, calcium, iron, zinc and copper; (c) 40 to 95 wt.% of at least one particulate filling material selected from the group consisting of glass; mono-, oligo- and polyphosphates of magnesium, calcium, barium and aluminium; calcium sulphate; barium sulphate; simple and complex silicates comprising sodium, potassium, calcium, aluminium, magnesium, iron and/or zirconium; simple and complex aluminates comprising sodium, potassium, calcium, magnesium and/or zirconium; simple and complex titanates comprising sodium, potassium, calcium, aluminium, magnesium, barium and/or zirconium; simple and complex zirconates comprising sodium, potassium, calcium, aluminium and/or magnesium; zirconium dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; and (d) 0 to 25 wt.% of at least one component that is different from the components (a) to (c), wherein component (a) can comprise up to 10 wt.% of free water relative to the entire component (a), wherein component (d) can comprise up to 10 wt.% of water relative to the entire component (d), wherein the composition exists as a two- or multi-component system, and wherein the components (a) and (b) exist at least substantially separate from one another, or separate from one another if component (a) comprises phosphoric acid.
C04B 28/34 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
The invention relates to a composition consisting of: (a) 1 to 30 wt.% of a 1 to 90 wt.% aqueous phosphoric acid and/or at least one hydrogen phosphate selected from the group consisting of mono- and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt and copper; (b) 1 to 40 wt.% of at least one compound selected from the group consisting of oxides, hydroxides and oxide hydrates of magnesium, calcium, iron, zinc and copper; (c) 40 to 95 wt.% of at least one particulate filling material selected from the group consisting of glass; mono-, oligo- and polyphosphates of magnesium, calcium, barium and aluminium; calcium sulphate; barium sulphate; simple and complex silicates comprising sodium, potassium, calcium, aluminium, magnesium, iron and/or zirconium; simple and complex aluminates comprising sodium, potassium, calcium, magnesium and/or zirconium; simple and complex titanates comprising sodium, potassium, calcium, aluminium, magnesium, barium and/or zirconium; simple and complex zirconates comprising sodium, potassium, calcium, aluminium and/or magnesium; zirconium dioxide; titanium dioxide; aluminium oxide; silicon dioxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; (d) 1 to 10 wt.% of at least one urea compound selected from the group consisting of imidazolidin-2-one, allantoin and imidazolidinyl urea; and (e) 0 to 15 wt.% of at least one component that is different to the components (a) to (d).
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
C04B 28/34 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
C04B 41/50 - Coating or impregnating with inorganic materials
22-CHR1-COOR2- wherein R1represent H or an alkyl group, and R21105050) of at least 500 nm; ii) particles B) of a conductive polymer, preferably particles B) of a complex of a cationic polythiophene and a polymeric anion, wherein the particles B) have a mass average particle diameter of less than 150 nm; iii) at least one dispersant, preferably water; wherein the weight ratio of the polymer in particles A) to the conductive polymer in particles B), preferably the weight ratio of the polymer in particles A) to the total weight of the cationic polythiophene and the polymeric anion in the complex of particles B) is at least 5 : 1. The present invention also relates to a layered body, to a process for the production of such a layered body, to a layered body obtainable by that process and to the use of a layered body for electrophysical measurements.
A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, ; Adhesives based on derivatives of such polymers
C08L 81/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
C09J 7/00 - Adhesives in the form of films or foils
The invention relates to a device for tracking and optionally controlling a chemical reaction occurring in a reaction medium, wherein a colour is measured in a gas phase outside of the reaction medium using a colour sensor which is not in physical contact with the gas phase.
G01N 21/27 - Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection
G01N 21/78 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator producing a change of colour
97.
SYNERGISTIC COMBINATIONS OF PLATINUM AND RHODIUM COMPOUNDS AS CATALYSTS IN HYDROSILYLATION
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick- film paste for bonding a metal foil onto a ceramic substrate. The metal-ceramic-substrate according to the present invention are provided with at least one vertical via (via-hole) in the ceramic in order to allow circuit interconnections.
A logic power module, comprising at least one logic component, at least one power component and a substrate, whereby the logic element and the power component are provided in separate areas on the substrate is described. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
patents
