A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ≤40 wt.-ppm.
The invention relates to a method for structuring metal-ceramic substrates and to a structured metal-ceramic substrate which can be used in particular in power electronics. In the method, a first metal-ceramic substrate and a second metal-ceramic substrate are etched, wherein, while being contacted with an etching solution that is capable of removing active metal from the bonding layer of the metal-ceramic substrates, the first metal-ceramic substrate and the second metal-ceramic substrate are positioned such that an orthogonal projection of the first metal-ceramic substrate onto a projection plane parallel to the metal layer of the first metal-ceramic substrate shades no more than 60% of the metal layer of the second metal-ceramic substrate.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
A strip-shaped sandwich composite material for producing probe needles, wherein an inner core layer is arranged between two outer cover layers, wherein the inner core layer consists of a palladium alloy comprising at least 30 wt. % palladium or of a platinum alloy comprising at least 30 wt. % platinum, and wherein the two outer cover layers consist of a precipitation-hardened and/or dispersion-hardened copper alloy comprising at least 90 wt. % copper and/or silver alloy comprising at least 70 wt. % silver. The invention also relates to a probe needle, a bonding strip, a probe needle array and a method for producing a composite material.
The present invention relates to a coated membrane containing:
a membrane with a front and a rear face,
a catalyst-containing coating which is provided on the front face of the membrane,
the catalyst containing
a support material which has a BET surface area of maximally 80 m2/g,
an iridium-containing coating which is provided on the support material and contains an iridium oxide, an iridium hydroxide or an iridium hydroxide oxide or a mixture of at least two of these iridium compounds,
wherein the catalyst contains iridium in a quantity of maximally 60 wt. %, and
the coating provided on the membrane front face has an iridium content of maximally 0.4 mg iridium/cm2.
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 11/075 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of a single catalytic element or catalytic compound
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
C25B 13/08 - Diaphragms; Spacing elements characterised by the material based on organic materials
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
5.
IRIDIUM-CONTAINING CATALYST FOR WATER ELECTROLYSIS
The invention relates to a particulate catalyst, containing: —a support material, —an iridium-containing coating which is provided on the support material and which contains iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide, wherein the support material has a BET surface area ranging from 2 m2/g to 50 m2/g, and the iridium content of the catalyst satisfies the following condition: (1.505 (g/m2)×BET)/(1+0.0176 (g/m2)×BET)≤Ir-G≤(4.012 (g/m2)×BET)/(1+0.0468 (g/m2)×BET), where BET is the BET surface area of the support material, in m2/g, and Ir-G is the iridium content, in wt. %, of the catalyst.
C25B 11/081 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of a single catalytic element or catalytic compound the element being a noble metal
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
The invention relates to a sintering paste consisting of: (A) 30 to 40 wt. % of silver flakes with an average particle size ranging from 1 to 20 μm, (B) 8 to 20 wt. % of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt. % of silver(I) oxide particles, (D) 12 to 20 wt. % of at least one organic solvent, (E) 0 to 1 wt. % of at least one polymer binder, and (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E).
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
The present invention relates to a method for manufacturing a semiconductor wafer comprising: i) applying a MOD ink composition to a semiconductor wafer, thereby forming a precursor layer; and ii) curing the precursor layer. In an embodiment, the application in step i) is carried out by inkjet printing. The method for inkjet printing MOD ink has low equipment cost and low power consumption; no material waste; on-demand printing and easy selective deposition/design flexibility (no etching required). In addition, the method of the present invention improves the adhesion and electric conductivity of the metallization layer on backside of the wafer.
Laminar structure comprising two outwardly facing metal layers with an interposed alternating layer sequence made up of n layers of a hydraulically cured inorganic cement composition and n−1 metal layers, where n=1, 2, or 3.
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 13/02 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material with fibres or particles embedded in it or bonded with it
B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
9.
PROCESS FOR THE MANUFACTURE OF ENCAPSULATED SEMICONDUCTOR DIES AND/OR OF ENCAPSULATED SEMICONDUCTOR PACKAGES
A process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages or for the manufacture of an encapsulation of semiconductor dies and/or of semiconductor packages comprising the steps: (1) assembling a multitude of bare semiconductor dies on a temporary carrier, and (2) encapsulating the assembled bare semiconductor dies, characterized in that an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent in step (2).
A process for the production of a layer composition, comprising the process steps: a) provision of a substrate with a substrate surface; b) formation of a stabilized electrically conductive polymer layer on at least a pail of the substrate surface, the formation of the stabilized electrically conductive polymer layer comprising the process steps: b1) formation of an electrically conductive polymer layer comprising an electrically conductive polymer on at least a part of the substrate surface; b2) application of a liquid stabilizer phase, comprising at least one stabilizer and at least one solvent or dispersant, onto the electrically conductive polymer layer obtained in process step b1) for the formation of a stabilizer layer, wherein the at least one stabilizer is a flavonoid. The present invention also relates to a layer composition and to the use of a layer composition.
A method for recovering noble metal from a heterogeneous catalyst comprising a solid carrier material and palladium, platinum or rhodium, present at least partially in elemental form, said method comprising the steps of converting the noble metal to an oxidation state>0 by treating the heterogeneous catalyst with an oxidizing agent in the presence of hydrochloric acid so as to form a two-phase system A comprising a hydrochloric aqueous phase A1 and a solid phase comprising the carrier material which is insoluble therein, optionally, at least partially separating the hydrochloric aqueous phase A1 from the two-phase system A and adding a further aqueous phase to the remaining residue of the two-phase system A so as to form a two-phase system B comprising a hydrochloric aqueous phase and a solid phase comprising the carrier material insoluble therein.
The present invention relates to a process for coupling a heterocyclic aromatic ring AR1 and a carbocyclic or heterocyclic aromatic ring AR2 to each other by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein
a reaction medium is provided by mixing a first reactant, a second reactant and a catalyst composition, wherein the catalyst composition comprises
(i) a palladium compound which is a palladium salt or a palladium complex or a mixture thereof, and
(ii) a polycyclic compound of Formula (I), (II) or (III):
The present invention relates to a process for coupling a heterocyclic aromatic ring AR1 and a carbocyclic or heterocyclic aromatic ring AR2 to each other by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein
a reaction medium is provided by mixing a first reactant, a second reactant and a catalyst composition, wherein the catalyst composition comprises
(i) a palladium compound which is a palladium salt or a palladium complex or a mixture thereof, and
(ii) a polycyclic compound of Formula (I), (II) or (III):
the reaction medium is irradiated by an external light source, thereby coupling the heterocyclic aromatic ring AR1 of the first reactant to the aromatic ring AR2 of the second reactant by a decarboxylative carbon-carbon cross-coupling reaction.
The present invention relates to a catalyst composition for synthesis of heteroaromatic biaryls by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein the composition comprises
(i) a palladium compound which is selected from a palladium salt or a palladium complex or a mixture thereof,
(ii) at least one of the following compounds:
a compound of Formula (I)
The present invention relates to a catalyst composition for synthesis of heteroaromatic biaryls by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein the composition comprises
(i) a palladium compound which is selected from a palladium salt or a palladium complex or a mixture thereof,
(ii) at least one of the following compounds:
a compound of Formula (I)
a compound of Formula (II)
The present invention relates to a catalyst composition for synthesis of heteroaromatic biaryls by a light-assisted decarboxylative carbon-carbon cross-coupling reaction, wherein the composition comprises
(i) a palladium compound which is selected from a palladium salt or a palladium complex or a mixture thereof,
(ii) at least one of the following compounds:
a compound of Formula (I)
a compound of Formula (II)
an iridium complex comprising ligands L1, L2 and L3, wherein the ligands L1, L2 and L3 are selected, independently from each other, from a phenylpyridine and a bipyridine.
B01J 31/12 - Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
14.
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF COMPONENTS
A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1.
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
The invention relates to a method for producing a particulate carrier material provided with silver and ruthenium, comprising the following steps: a) providing a water-insoluble particulate carrier material and aqueously dissolved silver and ruthenium precursors, b) bringing the particulate carrier material into contact with the aqueous solution of the precursors to form an intermediate, c) bringing the intermediate into contact with an aqueous hydrazine solution having a pH of >7 to 14 to form a mass comprising silver and ruthenium, d) optionally washing the obtained mass, and e) removing water and other possible volatile components from the mass.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
B22F 1/18 - Non-metallic particles coated with metal
C23C 18/44 - Coating with noble metals using reducing agents
Methods of making dispersion-hardened platinum compositions include A) producing a melt having at least 70 wt. % platinum, up to 29.95 wt. % of one or more of rhodium, gold, iridium and palladium, between 0.05 wt. % and 1 wt. % of oxidizable non-precious metals in the form of zirconium, yttrium and scandium, and, as the remainder, platinum including impurities, wherein the ratio of zirconium to yttrium in the melt is in a range of from 5.9:1 to 4.3:1 and the ratio of zirconium to scandium in the melt is at least 17.5:1, B) hardening the melt to form a solid body, C) processing the solid body to form a volume body, and D) oxidizing the non-precious metals contained in the volume body by a heat treatment in an oxidizing medium over a time period of at least 48 hours at a temperature of at least 750° C.
The invention relates to a strip-like connector made of metal, wherein the length and width of the strip-like connector are greater than the thickness of the strip-like connector, the strip-like connector comprising a first metal material (41) and a second metal material (42), wherein the first material (41) and the second material (42) are directly and interlockingly connected to one another and joined together by way of a connecting surface (50), wherein the connecting surface (50) has, lying opposite one another at least in some regions, interlocking and interengaging serrations (43, 52) of the first material (41) and the second material (42) along the width of the strip-like connector. The invention also relates to the use of such a strip-like connector for connecting galvanic cells, to a galvanic element comprising multiple galvanic cells, wherein the galvanic cells are connected and electrically contacted by at least one such strip-like connector, and to a method for producing a connecting strip and for producing strip-like connectors from the connecting strip.
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising a single busbar
B23K 20/04 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
19.
COATED NOBLE METAL ELECTRODES WITH A COLUMN-LIKE SURFACE STRUCTURE
A medical electrode comprising a substrate, a first layer with nanocolumns applied to the substrate, and a second layer comprising an electrically conductive polymer. The first layer can be produced, for example, by means of a sputtering method. The invention also relates to production methods for these electrodes, and uses of these electrodes.
The invention relates to a catalyst system for flow reactors, said catalyst system being characterized by the order of the noble metal-containing alloys used in the catalyst gauze which forms the catalyst system. By using a ternary platinum alloy for a second catalyst gauze group and a palladium alloy for a third catalyst gauze group, the platinum and rhodium content of the catalyst system can be kept relatively low overall while having a high degree of efficiency. The invention additionally relates to a method for catalytically combusting ammonia, in which a fresh gas which contains at least ammonia is conducted through a catalyst system.
The present invention relates to a catalyst network comprising at least one noble metal wire that contains at least one dispersion-strengthened noble metal alloy. The invention also relates to a catalyst system containing at least one catalyst network according to the invention, and to a method for the catalytic oxidation of ammonia in which a catalyst network according to the invention is used.
The invention relates to a method for producing a wire, having at least the following steps: (i) providing a wire precursor; (ii) pressing depressions on the wire precursor and optionally reshaping the wire precursor in the process, and (iii) annealing the wire precursor provided with depressions in order to form the wire; wherein the wire has a content of at least 95 wt. % of copper based on the total weight of the wire. The invention additionally relates to a wire which can be obtained according to the aforementioned method and to the use of a roller in order to produce the wire and/or in order to set the roughness at at least one location of the wire.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
B21B 1/16 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling wire or material of like small cross-section
B21H 8/00 - Rolling metal of indefinite length in repetitive shapes specially designed for the manufacture of particular objects
The present invention relates to a catalyst system for flow reactors which is characterized by the sequence of the noble metal-containing alloys used of the catalyst networks forming the catalyst system. By using palladium alloys for a second and third catalyst network group, the platinum content of the catalyst system can be kept relatively low overall. In addition, the invention relates to a method for catalytic combustion of ammonia, in which a fresh gas containing at least ammonia is conducted through a catalyst system.
The invention relates to a method for coating a substrate with a noble metal layer, which comprises the following steps: (i) providing a substrate; (ii) applying a liquid noble metal ink to the substrate, wherein the noble metal ink contains less than 10 percent by weight of noble metal, based on the total weight of the noble metal ink; and (iii) heating the liquid noble metal ink, and thereby forming a noble metal layer on the substrate.
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
25.
METHOD FOR PREPARING 4-[5-[BIS(2-CHLOROETHYL)AMINO]-1-METHYL-1H-BENZO[D]IMIDAZOL-2-YL]BUTYRIC ACID ALKYL ESTERS AND FORMYLATED DERIVATIVES
C07D 235/12 - Radicals substituted by oxygen atoms
C07D 235/16 - Radicals substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
The disclosure relates to a method for manufacturing a biocompatible wire, a biocompatible wire comprising a biocompatible metallic material and a medical device comprising such wire.
The disclosure relates to a method for manufacturing a biocompatible wire, a biocompatible wire comprising a biocompatible metallic material and a medical device comprising such wire.
The method for manufacturing a biocompatible wire comprises providing a workpiece of a biocompatible metallic material, cold working the workpiece into a wire, and annealing the wire, wherein a cold work percentage is 97 to 99%, wherein the cold working is a drawing with a die reduction per pass ratio in a range of 6 to 40%, and wherein the annealing is done in a range of 850 to 1100° C.
C22F 1/10 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
The invention relates to a medical electrode comprising a substrate, a first layer, and a second layer, wherein the first layer is arranged directly on the substrate, and the second layer is arranged directly on the first layer, wherein the first layer comprises a noble metal, and the second layer comprises a conductive polymer, wherein the first layer comprises a rough and/or porous surface.
The invention relates to a particulate inorganic material equipped with elemental silver and elemental ruthenium, said inorganic material having an average particle size (d50) in the range of 50 nm to 40 μm and a BET surface area in the range of 1 to 1600 m2/g. The inorganic material as such is selected from the group consisting of aluminum nitride, titanium nitride, silicon nitride, corundum, titanium dioxide in the form of anatase, titanium dioxide in the form of rutile, pyrogenic silica, precipitated silica, sodium aluminum silicate, zirconium silicate, zeolite, hydrotalcite and gamma-aluminum oxide hydroxide.
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
C23C 18/44 - Coating with noble metals using reducing agents
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
29.
ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FORM OF WEDGE-WEDGE-BONDED STRUCTURES NOT CONSISTING OF SOLID METAL MATERIAL
An electronic module comprising one or more arrangements each composed of a first electronic component having a first contact surface with, wedge-bonded on this first contact surface, a first terminus of an originally free structure not consisting of solid metal material and a second electronic component having a second contact surface with, wedge-bonded on this second contact surface, a second terminus of the originally free structure not consisting of solid metal material, wherein the originally free structure not consisting of solid metal material is a structure (i) in ribbon form composed of knitted, woven or braided fine metal wire and having a cross-sectional area in the range of 25,000 to 800,000 µm2or (ii) in cable form composed of stranded fine metal wire and having a cross-sectional area in the range of 8000 to 600,000 µm2or (iii) in tube form composed of circular-knitted fine metal wire and having a cross-sectional area in the range of 8000 to 600,000 µm2.
H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The invention relates to a hydraulically curable inorganic cement composition comprising at least one compound with a water solubility of >10 g/L (at 20°C), selected from the group consisting of 5-member compounds which have an aromatic nitrogenous heterocyclic ring system that is free of other ring heterocyclic atoms and 6-member compounds which have an aromatic nitrogenous heterocyclic ring system that is free of other ring heteroatoms, and at least one water-dispersible EVA copolymer.
C04B 28/02 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
C04B 28/10 - Lime cements or magnesium oxide cements
C04B 28/34 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
C04B 40/00 - Processes, in general, for influencing or modifying the properties of mortars, concrete or artificial stone compositions, e.g. their setting or hardening ability
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
31.
CERAMIC-COATED METAL FOIL AS A FRICTION-ENHANCING ELEMENT
The invention relates to a joint element for increasing the frictional force in force-fitting connections, comprising a metal substrate having two opposing planar surfaces, wherein at least one of said surfaces has a ceramic layer, said ceramic layer preferably having been applied by aerosol deposition. The joint element is preferably free of phosphorus and does not contain diamonds.
A palladium-copper-silver alloy consisting of 40 to 58% by weight of palladium, 25 to 42% by weight of copper, 6 to 20% by weight of silver, optionally up to 6% by weight of at least one element from the group ruthenium, rhodium, and rhenium, and up to 1% by weight of impurities, wherein the palladium-copper-silver alloy contains a crystalline phase with a B2 crystal structure and has 0% by volume to 10% by volume of precipitates of silver, palladium, and binary silver-palladium compounds. The invention also relates to a molded body, a wire, a strip, or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for electrical contacting or for the production of a sliding contact. The invention also relates to a method for producing a palladium-copper-silver alloy.
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/14 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
34.
PARTICULATE CARBON MATERIAL PROVIDED WITH ELEMENTAL SILVER AND ELEMENTAL RUTHENIUM
A particulate carbon material that is provided with elemental silver and elemental ruthenium and has an average particle size (d50) in the range of 0.5 to 500 µm, a pore volume in the range of 0.5 to 10 mL/g and a BET surface in the range of 200 to 2000 m²/g.
The invention relates to a noble metal complex comprising diolefin and C6-C18 monocarboxylate ligands of the type [LPd[O(CO)R1]X]n, [LRh[O(CO)R1]]m or [LIr[O(CO)R1]]m, in which L represents a compound acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 represent identical or different non-aromatic C6-C18 monocarboxylic acid residues, in each case with the exception of a phenylacetic acid residue, and wherein n is an integer ≥1 and m is an integer ≥2.
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
A preparation containing:
(A) 30 to 90 wt. % of at least one organic solvent,
(B) 10 to 70 wt. % of at least one noble metal complex comprising diolefin and C6-C18 monocarboxylate ligands selected from the group consisting of noble metal complexes of the type [LPd[O(CO)R1]X]n, [LRh[O(CO)R1]]m, and [LIr[O(CO)R1]]m, wherein L represents a compound acting as diolefin ligand, wherein X is selected among bromide, chloride, iodide, and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 represent identical or different non-aromatic C6-C18 monocarboxylic acid residues, and wherein n is an integral number 1, and m is an integral number 2, and
(C) 0 to 10 wt. % of at least one additive.
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
The present invention relates to a method for producing a layered body comprising at least two layers containing a noble metal in metallic form, which differ from one another in electrical conductivity, porosity, density and/or specific surface unit. The present invention also relates to a layered body obtainable by this method, an electronic component, preferably an electrode, comprising a conductive layer containing a layered body according to the invention, the use of a compound comprising a complex selected from the group consisting of the complexes (COD)Pt[O(CO)CH(C2H5)C4H9]2, (COD)Pt[O(CO)C(CH3)2C6H13]2 and a mixture thereof, for producing a layer containing platinum in metallic form with a defined density, the use of a compound comprising a complex selected from the group consisting of the complexes (COD)Pt[O(CO)CH(C2H5)C4H9]2, (COD)Pt[O(CO)C(CH3)2C6H13]2 and a mixture thereof for producing a layer containing platinum in metallic form having a defined specific surface.
The present invention relates to a method for producing a two-layer noble metal mesh on a flatbed knitting machine which has a first and a second needle bed. The method comprises: providing at least one wire containing noble metal; and knitting the noble metal mesh. The first and second layers of the noble metal mesh are knitted simultaneously on the first and second needle beds, these two parts being at least in part connected at their two abutting edges by connecting stitches.
The present invention relates to a method for producing a two-layer noble metal mesh on a flatbed knitting machine which has a first and a second needle bed. The method comprises: providing at least one wire containing noble metal; and knitting the noble metal mesh. The first and second layers of the noble metal mesh are knitted simultaneously on the first and second needle bed, and a supporting mesh is knitted on the first and second needle bed using a supporting thread. An abutting edge of the supporting mesh is connected to the two layers of the noble metal mesh via connecting stitches and knitted via both needle beds in the knitting rows containing the connection.
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Chemical products for industrial, scientific purposes;
coating compositions [chemicals], other than paints; ceramic
materials in the form of powders for industrial purposes. Powder coatings in the form of inorganic coatings;
anti-corrosive products for metals; preparations for use as
preservatives against atmospheric oxidation; corrosion
inhibitors in the nature of a coating; preparations for
coating surface to protect against corrosion. Base metals and their alloys; metals in powder form. Machine tools; powder handling apparatus [machines]; coating
machines; spray guns for powder coatings. Treatment and coating of metal surfaces; coating of steel;
applying wear-resistant coatings to machine components;
application of wear-resistant coating agents on metal and
plastics; powder coating; treatment of metal parts to
prevent corrosion by means of powder coating; treatment of
metal parts for corrosion protection. Scientific and technological services and research;
development of coatings for non-metals; development of
coatings for metals.
The invention relates to a metal layer stack for use in electronic components, in particular as a spacer in power electronic components, comprising n bulk metal layers and n or n+1 contact material layers, wherein the bulk metal layers and the contact material layers are stacked in an alternating manner and n is at least two. Additionally, the invention relates to a process for preparing the metal layer stack and a semiconductor module comprising such a metal layer stack.
The present invention relates to a medical instrument which comprises a porous metal layer. Also described are methods for producing such a medical instrument. The porous metal layer can serve as a marking for use in imaging radiological methods such as, for example, x-ray or ultrasound images.
The invention relates to a method for separating rhodium from an aqueous hydrochloric solution which contains at least one chloro complex of rhodium and at least one chloro complex of iridium and/or at least one chloro complex of ruthenium. The invention is characterized in that the rhodium is precipitated out of the aqueous hydrochloric solution with a redox potential of ≥950 to 1050 mV using an aliphatic polyamine as a poorly soluble rhodium chloro complex salt while explicitly dispensing with a previously carried out joint separation together with the iridium and/or the ruthenium.
Particulate material Z composed of 15% to 50% by weight of particles X consisting of water-insoluble support material T provided with elemental silver and elemental ruthenium and 50% to 85% by weight of solid Y at least partially disposed on the particles X, wherein the solid Y is selected from the group consisting of aluminum oxide, aluminum hydroxide, aluminum oxyhydroxide, magnesium oxide, magnesium hydroxide, magnesium oxyhydroxide, calcium oxide, calcium hydroxide, calcium oxyhydroxide, silicon dioxide, silica, zinc oxide, zinc hydroxide, zinc oxyhydroxide, zirconium dioxide, zirconium(IV) oxyhydrates, titanium dioxide, titanium(IV) oxyhydrates and combinations thereof.
B22F 1/10 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
C22C 1/04 - Making non-ferrous alloys by powder metallurgy
45.
METAL-CERAMIC SUBSTRATE, METHOD FOR THE PRODUCTION THEREOF, AND MODULE
The present invention relates to a phosphine of the formula (1), wherein - Q is SiR3R4, GeR3R4, SnR3R4, AsR31-41-4 alkyl; or two groups R that bind to the same carbon atom together with the carbon atom form a 4- to 7-membered ring; or, under the proviso that m + n ≥ 2, two groups R that bind to different carbon atoms together with these carbon atoms form a 4- to 7-membered ring; - Ar1is aryl; - Ar2is aryl; - R3and R41-45-75-7 cycloalkyl or an aryl; or R3and R4 together with the Si, Ge or Sn atom form a 4- to 7-membered ring.
C07F 9/6596 - Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having atoms other than oxygen, sulfur, selenium, tellurium, nitrogen or phosphorus as ring hetero atoms
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
C07D 401/04 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring- member bond
C07D 403/04 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings directly linked by a ring-member-to-ring- member bond
C07D 413/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and oxygen atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring- member bond
47.
PROCESS FOR PRODUCING POLYMER CAPACITORS FOR HIGH RELIABILITY APPLICATIONS
The present invention relates to a method for manufacturing a capacitor, comprising the method steps: a) provision of a porous electrode body made of an electrode material, wherein a dielectric at least partially covers a surface of this electrode material; b) introduction of a liquid composition which comprises an electrically conductive polymer, at least one high-boiling solvent; c) filling at least a part of the pores of the porous electrode body obtained in process step b) with an impregnation solution comprising at least one impregnation solvent, wherein the at least one impregnation solvent comprises at least one hydroxy group and has a molecular weight in the range from 70 to 180 g/mol; d) encapsulation of the porous electrode body obtained in process step c). The invention also relates to capacitor manufactured with this method, the use of an electrolytic capacitor and electronic circuits.
The invention relates to a method for producing a metal film comprising the steps of applying a metal layer onto a substrate by means of aerosol deposition of a powder and at least partially or completely removing the substrate to obtain a film. The method is particularly suitable for processing brittle metals such as for example tungsten to metal films.
B22F 3/18 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor by using pressure rollers
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
The present invention relates to a medical electrode comprising a base body on which an electrically conductive first layer and a cover layer are arranged, wherein the cover layer comprises an overhang which partially covers the first layer.
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
A61B 5/268 - Bioelectric electrodes therefor characterised by the electrode materials containing conductive polymers, e.g. PEDOT:PSS polymers
50.
ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD FOR PRINTING A FUNCTIONAL LAYER ON A SURFACE OF A THREE-DIMENSIONAL ELECTRONIC DEVICE
The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
51.
PROCESS FOR PRODUCING POLYMER CAPACITORS FOR HIGH RELIABILITY APPLICATIONS
The present invention relates to a process for manufacturing a capacitor, compris ing the process steps: a) provision of a porous electrode body (1) made of an electrode material (2), wherein a dielectric (3) at least partially covers a surface of this electrode material (2); b) introduction of a liquid composition which comprises an electrically con ductive polymer and a dispersing agent into at least a part of the porous electrode body (1) provided in process step a), wherein a conductive layer made from the liquid composition has a conductivity of less than 100 S/cm; c) at least partial removal of the dispersing agent from the porous electrode body (1) obtained in process step b) for the formation of a solid electrolyte layer (4) that at least partially covers a surface of the dielectric (3); d) filling at least a part of the pores (5) of the porous electrode body (1) ob tained in process step c) with an impregnation solution comprising at least one impregnation solvent, wherein the at least one impregnation solvent has a boiling point (determined at 1013 hPa) of at least 150°C; e) at least partial removal of the impregnation solvent from the porous elec trode body (1) obtained in process step d); f) encapsulation of the porous electrode body (1) obtained in process step e). The invention also relates to capacitor manufactured with this process, to a capaci tor characterized by a certain a decrease of the relative capacitance upon perfor mance of a surge test, to the use of an electrolytic capacitor and to electronic cir cuits.
The present invention relates to a process for producing a liquid composition comprising a functionalized π-conjugated polythiophenes, comprising the process steps of i) providing a liquid phase comprising a functionalized π-conjugated polythiophene that is dissolved or dispersed in a solvent, wherein the functionalized π-conjugated polythiophene comprises repeating units of the general formula (I) wherein X,Y are identical or different and are O, S, or NR1, wherein R1 is hydrogen or an aliphatic or aromatic residue having 1 to 18 carbon atoms; A is an organic residue carrying an anionic functional group; and wherein the liquid phase has a pH-value of less than 2.5; ii) adjusting the pH-value of the liquid phase provided in process step i) to a value in the range from 2.5 to 10 by the addition of a base. The present invention also relates to a liquid composition obtainable by this process, to a liquid composition comprising a functionalized π-conjugated polythiophene, wherein the composition, after is has been dried, is characterized by a certain weight loss at a given minimum temperature, to a process for the preparation of a layered body in which these liquid compositions are used for the formation of a conductive layer, to a layered body obtainable by this process and to the use of the liquid compositions for the preparation of a conductive layer in an electronic device.
A method for producing a collector alloy comprising 25 to 100 wt % precious metal in total, comprising 0 to <97 wt % of the precious metal silver, 0 to 75 wt % of at least one precious metal selected from gold, platinum, rhodium and palladium, and 0 to 75 wt % of at least one non-precious metal selected from copper, iron, tin and nickel, or for producing pure silver, comprising the steps of:
(1) providing precious metal sweeps;
(2) providing a flux which, during collective melting with the refractory inorganic material from the precious metal sweeps provided in step (1);
(3) collective melting of the materials provided in steps (1) and (2) at a temperature in the range of from 1300 to 1600° C., forming a melt comprising at least two phases of different densities arranged one above the other; and.
(4) separating the upper phase and the lower phase.
The present invention relates to a printed product, which comprises: a. a substrate; b. a primer layer located on the substrate, wherein the primer layer comprises an organic dielectric material; c. a metal conductive layer located on the primer layer; wherein the printed product further comprises a hybrid layer between the primer layer and the metal conductive layer, wherein the hybrid layer comprises materials from the primer layer and the metal conductive layer. In addition, the present invention further relates to a method for preparing the printed product and an electronic device comprising the printed product. The metal conductive layer in the printed product of the present invention has excellent uniformity in thickness; good adhesion between the primer layer and the conductive layer; and the printed product of the present invention has excellent EMI shielding effects, such that the printed product can be used in high frequency applications such as 5G applications.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
55.
CATALYST SYSTEM FOR SUZUKI CROSS-COUPLING REACTIONS
The present invention relates to a composition, comprising
a palladium compound which is a palladium salt or a palladium complex or a mixture thereof, and
a polycyclic compound of Formula (I), (II) or (III):
01 - Chemical and biological materials for industrial, scientific and agricultural use
02 - Paints, varnishes, lacquers
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Chemical products for industrial, scientific purposes; Coating compositions (chemicals), other than paints; Ceramic materials in the form of powders for industrial purposes Inorganic coatings; Anti-corrosive products for metals; Preparations for use as preservatives against atmospheric oxidation; Corrosion inhibitors in the nature of a coating; Preparations for coating surface to protect against corrosion Base metals and their alloys; Metals in powder form Machine tools; Powder handling apparatus (machines); Coating machines; Spray guns for powder coatings Treatment and coating of metal surfaces; Coating of steel; Applying wear-resistant coatings to machine components; Application of wear-resistant coating agents on metal and plastics; Powder coating; Treatment of metal parts to prevent corrosion by means of powder coating; Treatment of metal parts for corrosion protection Scientific and technological services and research; Development of coatings for non-metals; Development of coatings for metals
57.
PROCESS FOR THE MANUFACTURE OF HALOGENOBIS(ALKENE)RHODIUM(I) DIMERS OR HALOGENOBIS(ALKENE)IRIDIUM(I) DIMERS
A process for the manufacture of a complex of the formula [MHal(R1R2C═CR3R4)2]2 with M = Rh or Ir; Hal = Cl, Br or l; and R1R2C═CR3R4 = a gaseous mono olefin with 2 to 4 carbon atoms, the process comprising the steps:
(1) preparing an aqueous alcoholic solution of a MHal3 hydrate salt,
(2) reacting the dissolved MHal3 hydrate salt with the gaseous mono olefin R1R2C═CR3R4 under formation of precipitated [MHal(R1R2C═CR3R4)2]2,
(3) optionally, cooling the reaction mixture obtained after conclusion of step (2) down to a temperature in the range of > 0 to 10° C. and keeping it there, and
(4) collecting and drying the precipitated [MHal(R1R2C═CR3R4)2]2,
wherein the temperature of the reaction mixture during step (2) is kept in a range of 15 to 30° C.
A composition consisting of: (A) 20% to 30% by weight of one or more thermoplastic polymers, (B) 45% to 69% by weight of organic solvent, (C) 2% to 15% by weight of silica particles, (D) 0.5% to 10% by weight of organic thickener, (C) 1% to 10% by weight of particulate inorganic filler having a Mohs hardness in the range from 1 to 8, and (F) 0% to 1% by weight of one or more constituents other than constituents (A) to (E).
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises
i) 30 to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins,
ii) 5 to 20% by weight, based on its total weight, of at least one low-molecular carboxylic acid; and
iii) 0.4 to 10% by weight, based on its total weight, of at least one amine, and
wherein the combination of the optionally modified natural resins has an integral molecular weight distribution of 45 to 70% by area in the molecular weight range of 150 to 550 and of 30 to 55% by area in the molecular weight range of >550 to 10,000 in the combined GPC.
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 35/365 - Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
The invention relates to a method for producing a metal-ceramic substrate and to a furnace suitable for carrying out the method. With the method, a metal-ceramic substrate with increased thermal and current conductivity can be obtained. The method comprises the steps of providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, the solder material comprising a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal, and heating the stack, the stack passing through a heating zone for heating.
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
C04B 35/10 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on aluminium oxide
C04B 35/584 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on silicon nitride
C04B 35/581 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.
The present invention relates to a composition comprising i) at least one polythiophene selected from the group consisting of - a polythiophene comprising monomer units of structure (I) in which * indicates the bond to the neighboring monomer units, x, z represent O or S, R1-R4independently from each other represent a hydrogen atom or an organic residue R, with the proviso that at least one of residues R1to R4 represents an organic residue R; a polythiophene which is characterized by its compatibility in PGME (1-methoxypropan-2-ol), demonstrated by an RF-value of at least 0.8; iii) at least one ethylenically unsaturated compound; iv) at least one organic solvent; v) at least one radical initiator. The present invention also relates to a process for preparing a layer structure, to a layer structure obtainable by this process, to a layer structure, to an electronic component and to the use of composition according to the present invention.
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
63.
METHOD FOR PRODUCING A CATALYST SYSTEM FOR GAS REACTIONS
A method for producing a catalyst system for gas reactions comprising at least one planar structure of noble metal having gas-permeable openings, comprising the steps of:
A method for producing a catalyst system for gas reactions comprising at least one planar structure of noble metal having gas-permeable openings, comprising the steps of:
(1) providing at least one noble metal powder consisting of at least substantially spherical noble metal particles, and
A method for producing a catalyst system for gas reactions comprising at least one planar structure of noble metal having gas-permeable openings, comprising the steps of:
(1) providing at least one noble metal powder consisting of at least substantially spherical noble metal particles, and
(2) repeatedly applying the noble metal powder or powders provided in step (1) in layers to a substrate in a build chamber, respectively followed by an at least partial melting of the respective noble metal powder applied as a layer with high-energy radiation, and allowing the melted noble metal powder to solidify within the scope of additive manufacturing.
B01J 23/89 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with noble metals
B22F 9/08 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
A method for recovering precious metal from an acidic aqueous solution containing dissolved precious metal and free chlorine, comprising the following successive steps:
(1) combining a salt of a non-precious metal present in a low oxidation state as a solid or as an aqueous solution with the acidic aqueous solution to consume the free chlorine and form an acidic aqueous mixture, and
(2) adding non-precious metal to the acidic aqueous mixture formed in step (1) to precipitate elementary precious metal.
The invention relates to a method for depositing an aluminum oxide layer on the surface of a metal body, the metal of the metal body containing aluminum in an amount of 0.3-6 wt.%. The deposition is carried out by spraying an aerosol onto the surface of the metal body using the aerosol deposition method while an aluminum oxide layer is deposited. The aluminum oxide layer can serve as an anti-corrosion layer. The invention also relates to a metal body comprising an aluminum oxide layer which is produced according to the method.
C23C 24/04 - Impact or kinetic deposition of particles
C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
66.
HIGH-STABILITY CATALYST FOR AN ELECTROCHEMICAL CELL
The present invention relates to a method for producing a catalyst for an electrochemical cell, wherein:
a graphited porous carbon material is treated with an oxygen-containing plasma or an aqueous medium containing an oxidising agent,
at least one noble metal compound is deposited on the treated carbon material,
the impregnated carbon material is brought into contact with a reducing agent such that the noble metal compound is reduced to a metallic noble metal.
C25B 9/19 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms
C25B 11/081 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of a single catalytic element or catalytic compound the element being a noble metal
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
Alloy comprising 90 to 96.8 wt.% of tin; 0.1 to 2.0 wt.% of silver; 2.0 to 4.0 wt.% of bismuth; 1.0 to 2.0 wt.% of antimony; 0.1 to 1.0 wt.% of copper; and 0.01 to 1 wt.% of germanium.
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
The present invention relates to a composition comprising
i) at least one polythiophene comprising monomer units of structure (Ia) or (Ib)
The present invention relates to a composition comprising
i) at least one polythiophene comprising monomer units of structure (Ia) or (Ib)
in which *, X, Z, R, and R1-R6 are as defined herein;
ii) at least one organic compound carrying one or two inorganic acid group(s), preferably one or two sulfonic acid group(s), one or two sulfuric acid group(s), one or two phosphonic acid group(s) or one or two phosphoric acid group(s), or a salt of said organic compound, wherein the molecular weight of the organic compound or the salt thereof is less than 1,000 g/mol; and
iii) at least one organic solvent. A method of preparing such compounds is also provided.
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
Platinum complex of the type [L1L2Pt[O(CO)R1]X]n, wherein L1 and L2 are the same or different monoolefin ligands or together represent a compound L1L2 acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide, and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 are the same or different C6-C18 or C8-C18 non-aromatic monocarboxylic acid groups with the exception of a phenylacetic acid group, or together represent a C8-C18 non-aromatic dicarboxylic acid group —O(CO)R1R2(CO)O—, wherein it is a mononuclear platinum complex where n=1, or wherein, in the event of the presence of L1L2 and/or of —O(CO)R1R2(CO)O—, it may be a polynuclear platinum complex with a whole number n>1.
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic System
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
The invention relates to a process of manufacturing a composite comprising a layer of a polyimide and a substrate, comprising at least these steps: i. Providing a first composition comprising an acid compound; and a second composition comprising a diamine compound; ii. Forming a first layer on the substrate, and iii. Forming a second layer on the first layer, wherein if the first layer is formed by applying the first composition, the second layer is formed by applying the second composition, and vice versa; wherein the first and the second layer overlap at least in part thereby forming a pattern on the substrate; iv. Conducting a thermal treatment on the pattern wherein the polyimide layer is formed. The invention further relates to such a composite, a kit comprising a first composition comprising an acid compound and a second composition comprising a diamine compound as well as a use of the kit.
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B22F 1/16 - Metallic particles coated with a non-metal
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H01R 4/58 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
73.
SILVER SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF ELECTRONIC COMPONENTS
B22F 1/145 - Chemical treatment, e.g. passivation or decarburisation
B22F 1/16 - Metallic particles coated with a non-metal
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
74.
Multi-component composition for producing an aqueous coating mass
A composition is provided. The composition consists essentially of (a) 1 to 30 wt. % of a hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; (b) 1 to 40 wt. % of a compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper; (c) 40 to 95 wt. % of a particulate filler selected from the group consisting of glass; mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminum; calcium sulfate; barium sulfate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide; aluminum oxide; silicon dioxide; silicon carbide; aluminum nitride; boron nitride and silicon nitride; and (d) 0 to 25 wt. % of a constituent that differs from constituents (a) to (c).
C04B 28/34 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
B28B 1/24 - Producing shaped articles from the material by injection moulding
B28B 11/24 - Apparatus or processes for treating or working the shaped articles for curing, setting or hardening
An electrical conductor has a first layer, wherein the first layer is electrically conducting, and has micro protrusions, macro protrusions, wherein the micro protrusions are arranged on the macro protrusions, a first set of depressions, wherein the first set of depressions comprises at least two longitudinal depressions; the macro protrusions and the at least two longitudinal depressions are arranged in an alternating pattern, at least one coating layer, wherein the at least one coating layer comprises an electrically conducting polymer, touches the first layer, at least partially covers the first layer; wherein at least 50% of the macro protrusions have a width, measured along a first direction in the range of 2.0 mm to 40.0 mm and at least 50% of the micro protrusions have a width, measured along the first direction, in the range of 0.001 mm to 1.000 mm.
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
A61N 1/05 - Electrodes for implantation or insertion into the body, e.g. heart electrode
76.
PROCESS FOR PRODUCING A NOBLE METAL-MODIFIED GRAPHITIZED CARBON MATERIAL AND SUPPORTED CATALYST
The present invention relates to a process for producing a noble metal-modified, graphitized carbon material, comprising providing a graphitized carbon material, wherein the graphitized carbon material has a degree of graphitization of at least 10%, impregnating the graphitized carbon material with a composition and thermal treatment of the impregnated graphitized carbon material. The composition comprises an organic solvent and at least one organic noble metal complex dissolved in the organic solvent. The invention further relates to a supported catalyst produced by this process and to an electrochemical cell containing this supported catalyst.
The invention relates to a method for the catalyzed decomposition of lignin with a high yield and high selectivity for phenolic building blocks and with minimal formation of the coke fraction, and to a catalyst suitable for the method. The catalyst contains a basic carrier material, platinum at a weight percentage of 1-10 wt.% and nickel at a weight percentage of 0-5 wt.%. The method comprises: providing a reaction mixture comprising - lignin, - the catalyst and - a solvent; and heating the reaction mixture so as to obtain a mixture comprising - a product mix, - the catalyst and - the solvent.
One aspect is a method for producing an ablated conductor, including providing a coated conductor including an inner layer that is electrically conducting and at least one coating layer that at least partially covers the inner layer, and providing at least one laser beam. The method includes at least partially removing the at least one coating layer in a first section by moving the at least one laser beam and the coated conductor with respect to each other along at least one scan line in the first section. A first energy density of a first radiation, produced by the at least one laser beam, that irradiates a surface of the first section is adjusted according to a first ablation depth of the first section.
H02G 1/12 - Methods or apparatus specially adapted for installing, maintaining, repairing, or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
The invention relates to a method for the catalyzed decomposition of lignin with a high yield and high selectivity for phenolic building blocks and with minimal formation of the coke fraction, and to a catalyst suitable for the method. The catalyst contains a basic carrier material, platinum at a weight percentage of 1-10 wt.% and nickel at a weight percentage of 0-5 wt.%. The method comprises: providing a reaction mixture comprising - lignin, - the catalyst and - a solvent; and heating the reaction mixture so as to obtain a mixture comprising - a product mix, - the catalyst and - the solvent.
The present invention relates to a process for producing a noble metal-modified, graphitized carbon material, comprising providing a graphitized carbon material, wherein the graphitized carbon material has a degree of graphitization of at least 10%, impregnating the graphitized carbon material with a composition and thermal treatment of the impregnated graphitized carbon material. The composition comprises an organic solvent and at least one organic noble metal complex dissolved in the organic solvent. The invention further relates to a supported catalyst produced by this process and to an electrochemical cell containing this supported catalyst.
The present invention relates to a capacitor comprising i) an electrode body comprising an electrode material, wherein a dielectric layer comprising a dielectric material at least partially covers a surface of the electrode body; ii) a solid electrolyte layer comprising a solid electrolyte material that at least partially covers a surface of the dielectric layer, wherein the solid electrolyte material comprises a conductive polymer; iii) an anode contact that is in contact with the electrode body and that comprises copper, metal-plated copper or a copper-containing alloy; and iv) a cathode contact that is in contact with the solid electrolyte layer; wherein the capacitor further comprises at least one metal ion migration inhibitor. The present invention also relates to a process for the production of a capacitor, to a capacitor obtainable by such a process, to electronic circuit comprising the capacitor according to present invention and to the use of these capacitors in electronic circuits.
The invention relates to a method for preparing a catalyst composition, wherein in an aqueous medium containing an iridium compound, at a pH 9, an iridium-containing solid is deposited on a support material, and the support material loaded with the iridium-containing solid is separated from the aqueous medium and dried, wherein, in the method, the support material loaded with the iridium-containing solid is not subjected to a thermal treatment at a temperature of more than 250° C. for a period of time of longer than 1 hour.
C25B 11/075 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of a single catalytic element or catalytic compound
The present invention relates to a monolithic spring contact ring, preferably for use in a medical electrode, comprising an outer ring and a plurality of elastically deformable belt-shaped spring elements, each comprising two curved connectors which form a continuously running, gap-free connection between the outer ring and the respective spring element, wherein the spring elements each extend continuously from the first connector to the second connector via a first bend, a central part of the spring element and a second bend, wherein the middle part comprises a front side which points in the direction of the central axis of the outer ring.
The invention relates to a method for reductive extraction of elemental noble metals from an acidic aqueous solution containing noble metal, the method comprising the addition of non-noble metal including zinc and/or tin to the acidic aqueous solution containing noble metal to form a reaction mixture, wherein the dissolved noble metal includes iridium, rhodium and/or ruthenium, wherein the non-noble metal is added in a leaner-than-stoichiometric amount, and wherein the pH of the acidic aqueous solution containing noble metal prior to the addition of the non-noble metal is in the range of +0.8 to +3.0 and is also kept in this range in the reaction mixture.
The present invention relates to a method for producing a membrane for a fuel cell or electrolytic cell, in which (i) a liquid coating composition, which contains a supported catalyst containing precious metal and also contains an ionomer, is applied to a polymer electrolyte membrane which contains an ionomer, the ionomer of the liquid coating composition and the ionomer of the polymer electrolyte membrane each being a copolymer which contains as monomer a fluoroethylene and a fluorovinyl ether containing a sulfonic acid group, (ii) the coated polymer electrolyte membrane is heated to a temperature in the range from 178° C. to 250° C.
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ≤ 40 wt.-ppm.
B23K 35/40 - Making wire or rods for soldering or welding
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
87.
METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED METAL-CERAMIC SUBSTRATE
The invention relates to a method for structuring metal-ceramic substrates and to a structured metal-ceramic substrate which can be used in particular in power electronics. In the method, a first metal-ceramic substrate and a second metal-ceramic substrate are etched, wherein, while being contacted with an etching solution that is capable of removing active metal from the connecting layer of the metal-ceramic substrates, the first metal-ceramic substrate and the second metal-ceramic substrate are positioned such that an orthogonal projection of the first metal-ceramic substrate onto a projection plane parallel to the metal layer of the first metal-ceramic substrate shades no more than 60% of the metal layer of the second metal-ceramic substrate.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
C23F 1/00 - Etching metallic material by chemical means
The invention relates to a coated membrane containing - a membrane with a front and a rear face, - a catalyst-containing coating which is provided on the front face of the membrane, - said catalyst containing - a support material which has a BET surface area of maximally 80 m2/g, and - an iridium-containing coating which is provided on the support material and which contains an iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide or a mixture of at least two of said iridium compounds, wherein - the catalyst contains iridium in a quantity of maximally 60 wt.%, and - the coating provided on the membrane front face has an iridium content of maximally 0.4 mg iridium / cm2.
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
C25B 11/091 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of two or more catalytic elements or catalytic compounds
89.
PROCESS FOR THE MANUFACTURE OF ENCAPSULATED SEMICONDUCTOR DIES AND/OR OF ENCAPSULATED SEMICONDUCTOR PACKAGES
A process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages or for the manufacture of an encapsulation of semiconductor dies and/or of semiconductor packages comprising the steps: (1) assembling a multitude of bare semiconductor dies on a temporary carrier, and (2) encapsulating the assembled bare semiconductor dies, characterized in that an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent in step (2).
The invention relates to a coated membrane containing - a membrane with a front and a rear face, - a catalyst-containing coating which is provided on the front face of the membrane, - said catalyst containing - a support material which has a BET surface area of maximally 80 m2/g, and - an iridium-containing coating which is provided on the support material and which contains an iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide or a mixture of at least two of said iridium compounds, wherein - the catalyst contains iridium in a quantity of maximally 60 wt.%, and - the coating provided on the membrane front face has an iridium content of maximally 0.4 mg iridium / cm2.
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
C25B 11/091 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of two or more catalytic elements or catalytic compounds
91.
IRIDIUM-CONTAINING CATALYST FOR WATER ELECTROLYSIS
The invention relates to a particulate catalyst, containing: - a support material, - an iridium-containing coating which is provided on the support material and which contains iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide, wherein the support material has a BET surface area ranging from 2 m2/g to 50 m2/g, and the iridium content of the catalyst satisfies the following condition: (1.505 (g/m2) x BET) / (1 + 0.0176 (g/m2) x BET) ? Ir-G ? (4.012 (g/m2) x BET) / (1 + 0.0468 (g/m2) x BET), where BET is the BET surface area of the support material, in m2/g, and Ir-G is the iridium content, in wt.%, of the catalyst.
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
C25B 11/091 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of two or more catalytic elements or catalytic compounds
92.
IRIDIUM-CONTAINING CATALYST FOR WATER ELECTROLYSIS
The invention relates to a particulate catalyst, containing: - a support material, - an iridium-containing coating which is provided on the support material and which contains iridium oxide, an iridium hydroxide, or an iridium hydroxide oxide, wherein the support material has a BET surface area ranging from 2 m2/g to 50 m2/g, and the iridium content of the catalyst satisfies the following condition: (1.505 (g/m2) x BET) / (1 + 0.0176 (g/m2) x BET) ≤ Ir-G ≤ (4.012 (g/m2) x BET) / (1 + 0.0468 (g/m2) x BET), where BET is the BET surface area of the support material, in m2/g, and Ir-G is the iridium content, in wt.%, of the catalyst.
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 11/054 - Electrodes comprising electrocatalysts supported on a carrier
C25B 11/067 - Inorganic compound e.g. ITO, silica or titania
C25B 11/091 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of two or more catalytic elements or catalytic compounds
93.
SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS
The invention relates to a sintering paste consisting of: (A) 30 to 40 wt.% of silver flakes with an average particle size ranging from 1 to 20 µm, (B) 8 to 20 wt.% of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt.% of silver(I) oxide particles, (D) 12 to 20 wt.% of at least one organic solvent, (E) 0 to 1 wt.% of at least one polymer binder, and (F) 0 to 0.5 wt.% of at least one additive differing from the components (A) to (E).
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
09 - Scientific and electric apparatus and instruments
Goods & Services
Scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signalling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity; scientific research and laboratory apparatus, educational apparatus and simulators; apparatus, instruments and cables for electricity; scientific and laboratory devices for treatment using electricity; chemistry apparatus and instruments; chemical reactors; laboratory apparatus and instruments; laboratory mixers; crucibles [laboratory]; scientific apparatus and instruments; measuring devices; temperature measuring instruments; testing and quality control devices; material testing apparatus; meter testing apparatus; testing apparatus and instruments.
The present invention relates to a method for manufacturing a semiconductor wafer comprising: i) applying a MOD ink composition to a semiconductor wafer, thereby forming a precursor layer; and ii) curing the precursor layer. In an embodiment, the application in step i) is carried out by inkjet printing. The method for inkjet printing MOD ink has low equipment cost and low power consumption; no material waste; on-demand printing and easy selective deposition/design flexibility (no etching required). In addition, the method of the present invention improves the adhesion and electric conductivity of the metallization layer on backside of the wafer.
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
Goods & Services
Agents for use in soldering in microelectronic industry;
chemical agents in paste form for use in soldering in
microelectronic industry. Lead-free solders for the microelectronic industry, in
particular microelectronic chip industry, in particular tin
comprising solders; solder pastes and printing-pastes of
lead-free alloys for wave soldering, THT-soldering,
through-hole technology-soldering, and SMD-soldering,
surface mounted technology soldering comprising solder metal
and its alloys with added flux for printing of
electroconductive connections of electronic components, in
particular in chip-industry, semiconductor-industry,
consumer electronic-industry and automotive-industry; solder
pastes and printing-pastes of lead-free alloys comprising
solder metal and its alloys with added flux for depositing,
in particular printing of connections of electroconductive
connections of electronic components in
semiconductor-industry to be soldered semi-automatically or
fully automatically after placement; soft solder pastes and
printing-pastes of lead-free alloys comprising solder metal
and its alloys with added flux for depositing, in particular
printing of electroconductive connections of electronic
components in semiconductor-industry to be soldered
semi-automatically or fully automatically after placement,
comprising solder metal and its alloys in form of a powder
having a particle size of less than 100 micrometer of tin,
copper, zinc and/or silver or an alloy of at least two of
the metals; solder pastes and printing-pastes of lead-free
alloys comprising solder metal and its alloys with added
flux for printing of electroconductive connections of
electronic components in industry, such as microelectronic
contacts and/or microelectronic conducting paths, in
particular in stencil printing, screen printing, mask
printing processes, in particular each followed by a heating
up to less than 300 degrees-Celsius, in particular the
solder metal and its alloys comprising tin, copper, zinc
and/or silver or an alloy of at least two of the metals;
solder pastes and printing-pastes of lead-free alloys
comprising solder metal and its alloys with added flux for
printing of electroconductive connections of electronic
components in industry, in particular in microelectronic
industry, preferred in microelectronic semiconductor chip
industry, consumer electronic industry,
semiconductor-industry, and/or automotive industry, in
particular the solder metal and their alloys comprising tin,
copper, zinc and/or silver or an alloy of at least two of
the metals, particularly iron and lead-free solder and
printing paste; common metals, precious metals, wherein the
precious metals are selected from gold, silver, rhodium,
ruthenium, palladium, osmium, iridium, and platinum and
their alloys in powder form, free from iron and free from
lead, wherein the particles of the powder having a particle
size of less than 50 micrometer for use in depositing
pastes, printing pastes and printing inks for the production
of electronic conducting paths and/or electronic conducing
contacts in microelectronic industry, in particular for use
in chip-production with pitches or line space below 300
micrometer; all goods preferred for use in chip-production
with pitches or line space from 100 nanometer up to 200
micrometer; all goods preferred for use in processes for the
production in microchip industry for surface mountable
devices (SMD), surface mountable technology (SMT),
through-hole technology (THT), pin-in-hole technology (PIH),
System in Package (SIP), System on-chip (SoC), monolithic
integration in a semiconductor (IC), in particular
comprising as metals tin, copper, zinc and/or silver or an
alloy of at least of two of the metals; solder pastes and
printing-pastes of lead-free alloys comprising common
metals, precious metal solder, wherein the precious metals
are selected from gold, silver, rhodium, ruthenium,
palladium, osmium, iridium, and platinum and alloys in
powder form with added flux, wherein the metals and alloys
are free from iron and free from lead, wherein the particles
of the powder having a particle size of less than 50
micrometer, in particular pastes and printing-pastes
according to Industry Specifications, such as IPC, preferred
IPC J-STD-005A:2012-02-14 classes T5 to T8 and/or IPC
J-STD-001; solder pastes and printing-pastes of lead-free
alloys predominantly comprising soft solder in the form of
spherical particles in a dispersing media with added flux,
in particular organic flux of mixture of solvents and resins
and optional activated chemicals to provide solder pastes
and printing-pastes of lead-free alloys viscosity for
depositing, in particular by printing, wherein the spherical
particles have an aspect ratio of the diameters of nearly 1;
solder pastes and printing-pastes of lead-free alloys
comprising soft solder in the form of spherical particles
with added flux, wherein the particles are obtained in a
dispersion process in which liquid metal or liquid alloy is
dispersed in a dispersing media, wherein the flux comprises
organic flux to provide solder pastes and printing-pastes of
lead-free alloys a viscosity for depositing; preferred all
goods for depositing, in particular by printing, underfill
technologies for flip-chip (FC), and
fine-pitch-ball-grid-array (FPBGA), including chip-size
packaging (CSP), preferred according to Industry
Specifications (IPC); soft solder for microelectronic
application in the form of a printable paste for use in
microelectronic application, wherein the paste comprises
powder having a particle size of less than 50 micrometers of
tin, copper, zinc and silver; in particular all of the above
mentioned goods comprising tin; in particular all the
above-mentioned goods not for soldering of water pipes,
copper pipes, gutters, jewelry and/or iron-containing
components, in particular in the field of gas and water
pipes.
A method for producing a PGM collector alloy comprising the steps of:
A method for producing a PGM collector alloy comprising the steps of:
(1) providing (a) copper and/or silver, (b) material, which is to be processed melt-metallurgically, in the form of at least one sodium and/or potassium aluminosilicate support equipped with at least one PGM, and (c) at least one compound selected from the group consisting of iron oxides, calcium oxide, magnesium oxide, calcium carbonate, magnesium carbonate, sodium carbonate, and potassium carbonate,
(2) joint melting of the materials provided in step (1) at a temperature in the range of 1250 to <1450° C. by maintaining a 100:40 to 100:20 weight ratio of the materials provided in sub-steps (1b) and (1c), and a 35:65 to 80:20 weight ratio of copper and/or silver: PGM by forming a melt comprising two phases of different density,
(3) separating the upper phase of low density of molten slag from the lower phase of high density of molten PGM collector alloy by utilizing the density difference,
(4) allowing the melting phases separated from one another to cool down and solidify, and
(5) collecting the solidified PGM collector alloy.
C22B 11/02 - Obtaining noble metals by dry processes
C22B 9/10 - General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals with refining or fluxing agents; Use of materials therefor
C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
The present invention relates a process for the production of a layer composition (9), comprising the process steps: a) provision of a substrate (10) with a substrate surface (11); b) formation of a stabilized electrically conductive polymer layer (12) on at least a part of the substrate surface (11), the formation of the stabilized electrically conductive polymer layer (12) comprising the process steps: b1) formation of an electrically conductive polymer layer (13) comprising an electrically conductive polymer on at least a part of the substrate surface (11); b2) application of a liquid stabilizer phase, comprising at least one stabilizer (7) and at least one solvent or dispersant, onto the electrically conductive polymer layer (13) obtained in process step b1) for the formation of a stabilizer layer (14), wherein the at least one stabilizer (7) is a flavonoid. The present invention also relates to a layer composition and to the use of a layer composition.
The invention relates to a method for producing a medical electrode, comprising the following steps: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic iridium complex compound dissolved in the solvent; (iii) heating the composition, and thereby forming a noble metal layer on the substrate.
A61B 5/263 - Bioelectric electrodes therefor characterised by the electrode materials
C01G 15/00 - Compounds of gallium, indium, or thallium
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
100.
ELECTRODE-ELECTRICAL CONDUCTOR SYSTEM FOR A MEDICAL DEVICE
One aspect relates to an electrode-electrical conductor system for a medical device including a) one or more electrically insulated wire(s) or cable(s), wherein the electrical insulation includes electrical conductor one or more partial opening(s), which is/are arranged on one side of the wire(s) or cable(s), and b) one or more electrode(s), which is/are mechanically and electrically connected to the wire(s) or cable(s) via the one or more partial opening(s) arranged on one side of the wire(s) or cable(s) by welding, pressing, swaging, adhesives, brazing, soldering and/or dimples. One aspect also relates to a method for preparing such an electrode-electrical conductor system.
