An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 39/06 - Cooling; Heating; Prevention of freezing
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
A cooling system including a support structure and a cooling element is described. The cooling element has a central region and a perimeter. The cooling element is supported by the support structure at the central region. At least a portion of the perimeter is unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. Further, the cooling element has a first side distal from the heat-generating structure and a second side proximate to the heat-generating structure. The support structure supports the cooling element from one of the first side and the second side.
A flow chamber, a cooling system and a method are described. The flow chamber includes an upper chamber including a top wall, an actuator, and a lower chamber. The actuator is located distally from the top wall. The lower chamber receives fluid from the upper chamber when the actuator is actuated. The top wall includes at least one cavity therein. The cooling system utilizes cooling cells including the flow chamber. The method includes driving the actuator at a frequency that directs fluid through the flow chamber.
F28F 13/10 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
A computing device includes a housing having a plurality of apertures therein, an active cooling system, and at least one of a plurality of membranes or a plurality of valves. The membranes and/or valves are coupled with the apertures. Each of the membranes is watertight and gas breathable. The valves are configured to prevent entry of water through the apertures. The active cooling system is in the housing. When activated, the active cooling system drives a gas through a membrane but does not drive water through the membrane.
A system including a plurality of cooling cells and a switching and control module is described. The cooling cells including cooling elements configured to be actuated to induce vibrational motion to drive a fluid toward a heat-generating structure. The switching and control module is coupled to the cooling elements and provides drive signals to the cooling elements based on at least one drive signal input. Each of the drive signals has a frequency corresponding to a cooling element. The frequency of the drive signal corresponds to a resonant state of the cooling element.
A computing device includes a housing having a plurality of apertures therein, an active cooling system, and at least one of a plurality of membranes or a plurality of valves. The membranes and/or valves are coupled with the apertures. Each of the membranes is watertight and gas breathable. The valves are configured to prevent entry of water through the apertures. The active cooling system is in the housing. When activated, the active cooling system drives a gas through a membrane but does not drive water through the membrane.
A heat transfer system including an active component and a dissipation region is described. The active component is configured to undergo vibrational motion. The active component transfers fluid from a high pressure region to an ambient pressure region via an egress. The active component also induces a pulsating pressure in the fluid. The pulsating pressure is dissipated in the dissipation region such that turbulence is reduced where the fluid is introduced to the ambient pressure region.
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 43/14 - Machines, pumps, or pumping installations having flexible working members having peristaltic action having plate-like flexible members
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
A heat transfer system includes fluid transfer cells that vibrationally move a fluid and a thermally conductive cover that conducts heat from the cells while avoiding transfer of mechanical energy between the cells. A fluid transfer module includes outer and inner walls, a support member, and a membrane. The outer wall has an outer opening. The inner wall has an inner opening. The support member is disposed laterally on the inner wall such that a flow chamber is defined between the outer and inner walls. The membrane is supported by the support member along the outer wall. A fluid transfer module includes an inlet port and an actuator. The actuator undergoes vibrational motion and has first and second vibrational modes. The first vibrational mode causes fluid to enter the inlet port. The second vibrational mode expels fluid from the inlet port, which reduces clogging of the inlet port.
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 43/14 - Machines, pumps, or pumping installations having flexible working members having peristaltic action having plate-like flexible members
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
9.
MEMS BASED COOLING SYSTEMS HAVING AN INTEGRATED SPOUT
A heat transfer system including an active component and a dissipation region is described. The active component is configured to undergo vibrational motion. The active component transfers fluid from a high pressure region to an ambient pressure region via an egress. The active component also induces a pulsating pressure in the fluid. The pulsating pressure is dissipated in the dissipation region such that turbulence is reduced where the fluid is introduced to the ambient pressure region.
A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F28F 13/10 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
A heat transfer system includes fluid transfer cells that vibrationally move a fluid and a thermally conductive cover that conducts heat from the cells while avoiding transfer of mechanical energy between the cells. A fluid transfer module includes outer and inner walls, a support member, and a membrane. The outer wall has an outer opening. The inner wall has an inner opening. The support member is disposed laterally on the inner wall such that a flow chamber is defined between the outer and inner walls. The membrane is supported by the support member along the outer wall. A fluid transfer module includes an inlet port and an actuator. The actuator undergoes vibrational motion and has first and second vibrational modes. The first vibrational mode causes fluid to enter the inlet port. The second vibrational mode expels fluid from the inlet port, which reduces clogging of the inlet port.
F28F 13/10 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F04B 43/02 - Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
12.
MOUNTING AND USE OF PIEZOELECTRIC COOLING SYSTEMS IN DEVICES
A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.
F28D 9/00 - Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
13.
Method and system for driving and balancing actuators usable in MEMS-based cooling systems
A cooling system including a support structure and a cooling element are described. The cooling element has a central region, a first cantilevered arm, a second cantilevered arm, and a piezoelectric. The cooling element is supported by the support structure at the central region. The piezoelectric extends across at least half of a length of the first cantilevered arm. The first and second cantilevered arms are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure.
A fluid flow system is described. The fluid flow system includes an actuator and a chamber having a feature therein. The actuator is configured to vibrate in response to a driving signal. The chamber is in communication with the actuator. The chamber is characterized by a fluidic resonant frequency. Vibration of the actuator tends to drive a fluid through the chamber. The feature is within the chamber and obstructs direct flow of the fluid within the chamber such that the fluidic resonant frequency is less than a nominal fluidic resonant frequency that would exist without the feature.
A server system is described. The server system includes a vapor chamber in thermal communication with a plurality of heat sources and an array of microelectromechanical system (MEMS) jets arranged to cause a fluid to impinge on a surface of the vapor chamber.
09 - Scientific and electric apparatus and instruments
Goods & Services
Microelectromechanical (MEMS) devices in the nature of
piezoelectric transducers for applications in electronic or
computer heat dissipation, micro-fluidic pumping, RF
filtering in electronics, and energy harvesting from
mechanical stress.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Microelectromechanical (MEMS) devices in the nature of piezoelectric transducers for applications in electronic or computer heat dissipation, micro-fluidic pumping, RF filtering in electronics, and energy harvesting from mechanical stress.
A system including a module and an egress passageway is described. The module includes a cooling cells, a heat spreader, and a cover including vents therein. The cooling cells are between the heat spreader and the cover. Each of the cooling cells includes a cooling element configured to draw air in through the plurality of vents and drive air out of an aperture between the heat spreader and the cover at a first flow rate. A stream of hot air having been heated by a heat from a heat-generating structure thermally coupled to the heat spreader is thus provided. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn at a second flow rate to be mixed with the hot air. The second flow rate is greater than the first flow rate.
09 - Scientific and electric apparatus and instruments
Goods & Services
Microelectromechanical (MEMS) devices in the nature of piezoelectric transducers for applications in electronic or computer heat dissipation and micro-fluidic pumping.
20.
ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS
A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
A cooling system including a support structure, a cooling element, and a bottom plate is described. The cooling element has a central region and a perimeter. The cooling element is supported by the support structure at the central region. At least a portion of the perimeter is unpinned. The cooling element undergoes vibrational motion when actuated to drive a fluid toward a heat-generating structure. The bottom plate has orifices and at least one cavity therein. The at least one cavity is adjacent to and fluidically connected with the orifices. The at least one cavity and the orifices define an orifice distance between the orifices and the heat-generating structure and an orifice length within the bottom plate. The heat-generating structure and the bottom plate define a gap between a portion of the bottom plate and a portion of the heat-generating structure.
A cooling system is described. The cooling system includes a support structure, a cooling element, and drive electronics. The cooling element has a central axis and is supported by the support structure at the central axis. First and second portions of the cooling element are on first and second sides of the central axis and unpinned. The first and second portions of the cooling element undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element further has first and second piezoelectrics having opposite polarizations. The first piezoelectric is part of the first portion of the cooling element. The second piezoelectric is part of the second portion of the cooling element. The drive electronics drive the first and second portions of the cooling element using a single drive signal.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
H01L 23/367 - Cooling facilitated by shape of device
23.
COOLING ELEMENT ARCHITECTURE FOR MEMS-BASED COOLING SYSTEM ARCHITECTURE
A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.
A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.
A cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.
A cooling system is described. The cooling system includes a support structure, a cooling element, and drive electronics. The cooling element has a central axis and is supported by the support structure at the central axis. First and second portions of the cooling element are on first and second sides of the central axis and unpinned. The first and second portions of the cooling element undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element further first and second piezoelectrics having opposite polarizations. The first piezoelectric is part of the first portion of the cooling element. The second piezoelectric is part of the second portion of the cooling element. The drive electronics drive the first and second portions of the cooling element using a single drive signal.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
27.
ENGINEERED ACTUATORS USABLE IN MEMS ACTIVE COOLING DEVICES
An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.
09 - Scientific and electric apparatus and instruments
Goods & Services
Microelectromechanical (MEMS) devices in the nature of piezoelectric transducers for applications in electronic or computer heat dissipation, micro-fluidic pumping, RF filtering in electronics, and energy harvesting from mechanical stress
29.
CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS
A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.
A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
H01L 41/053 - Mounts, supports, enclosures or casings
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
A system including a cooling element and an egress passageway is described. The cooling element is configured to provide a stream of hot air having been heated by a heat from a heat-generating structure. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn to be mixed with the hot air.
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
32.
Mounting and use of piezoelectric cooling systems in devices
A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.
F28D 9/00 - Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
33.
Exhaust blending for piezoelectric cooling systems
A system including a cooling element and an egress passageway is described. The cooling element is configured to provide a stream of hot air having been heated by a heat from a heat-generating structure. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn to be mixed with the hot air.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
A mobile device, such as a mobile phone, including a housing and active cooling cells is described. The active cooling cells are in the housing. The cooling cells utilize vibrational motion to drive a fluid such that the mobile phone has a coefficient of thermal spreading (CTS) greater than 0.5 for a steady-state power generated by the mobile phone of at least five watts.
A system includes an active micro-electric mechanical system (MEMS) cooling system and a drive system. The MEMS cooling system includes cooling element(s) that direct fluid toward a surface of heat-generating structure(s) when driven to vibrate by a driving signal having a frequency and an input voltage. The drive system is coupled to the active MEMS cooling system and provides the driving signal. The drive system includes a power source and a feedback controller providing a feedback signal corresponding to a proximity to a resonant state of the at least one cooling element. The drive system adjusts at least one of the frequency and the input voltage based on the feedback signal such that the frequency corresponds to the resonant state of the cooling element(s). The input voltage does not exceed a maximum safe operating voltage for the cooling element(s).
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
A cooling system including a heat spreader and a cooling element is described. The heat spreader is thermally coupled with a heat-generating structure. The cooling element is in fluid communication heat spreader. The heat-generating structure is offset from the cooling element. The cooling element undergoes vibrational motion when actuated to drive a fluid toward the heat spreader while not directing the fluid directly at the heat-generating structure.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
H01L 41/02 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details
H01L 41/00 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
H01L 41/08 - Piezo-electric or electrostrictive elements
A system includes an active micro-electric mechanical system (MEMS) cooling system and a drive system. The MEMS cooling system includes cooling element(s) that direct fluid toward a surface of heat-generating structure(s) when driven to vibrate by a driving signal having a frequency and an input voltage. The drive system is coupled to the active MEMS cooling system and provides the driving signal. The drive system includes a power source and a feedback controller providing a feedback signal corresponding to a proximity to a resonant state of the at least one cooling element. The drive system adjusts at least one of the frequency and the input voltage based on the feedback signal such that the frequency corresponds to the resonant state of the cooling element(s). The input voltage does not exceed a maximum safe operating voltage for the cooling element(s).
F28F 13/12 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
38.
Mobile device having a high coefficient of thermal spreading
A mobile device, such as a mobile phone, including a housing and active cooling cells is described. The active cooling cells are in the housing. The cooling cells utilize vibrational motion to drive a fluid such that the mobile phone has a coefficient of thermal spreading (CTS) greater than 0.5 for a steady-state power generated by the mobile phone of at least five watts.
A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F28F 13/10 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
42.
METHOD AND SYSTEM FOR FABRICATING MEMS-BASED COOLING SYSTEMS
A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.
H01L 41/27 - Manufacturing multilayered piezo-electric or electrostrictive devices or parts thereof, e.g. by stacking piezo-electric bodies and electrodes
43.
SYSTEM LEVEL CONTROL OF MEMS-BASED COOLING SYSTEMS
A system including a plurality of cooling cells and a switching and control module is described. The cooling cells including cooling elements configured to be actuated to induce vibrational motion to drive a fluid toward a heat-generating structure. The switching and control module is coupled to the cooling elements and provides drive signals to the cooling elements based on at least one drive signal input. Each of the drive signals has a frequency corresponding to a cooling element. The frequency of the drive signal corresponds to a resonant state of the cooling element.
H05K 5/02 - Casings, cabinets or drawers for electric apparatus - Details
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
44.
System level control of mems-based cooling systems
A system including a plurality of cooling cells and a switching and control module is described. The cooling cells including cooling elements configured to be actuated to induce vibrational motion to drive a fluid toward a heat-generating structure. The switching and control module is coupled to the cooling elements and provides drive signals to the cooling elements based on at least one drive signal input. Each of the drive signals has a frequency corresponding to a cooling element. The frequency of the drive signal corresponds to a resonant state of the cooling element.
A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.
A system including a tile and a hood is described. The tile includes a plurality of cooling cells. Each of the cooling cells includes a support structure and a cooling element. The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The hood is coupled to the tile and directs the fluid around the plurality of cooling cells.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
47.
METHOD AND SYSTEM FOR FABRICATING MEMS-BASED COOLING SYSTEMS
A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
09 - Scientific and electric apparatus and instruments
Goods & Services
Microelectromechanical (MEMS) devices in the nature of
piezoelectric transducers for applications in electronic or
computer heat dissipation and micro-fluidic pumping.
09 - Scientific and electric apparatus and instruments
Goods & Services
Microelectromechanical (MEMS) devices in the nature of
piezoelectric transducers for applications in electronic or
computer heat dissipation, micro-fluidic pumping, RF
filtering in electronics, and energy harvesting from
mechanical stress.
A flow chamber, a cooling system and a method are described. The flow chamber includes an upper chamber including a top wall, an actuator, and a lower chamber. The actuator is located distally from the top wall. The lower chamber receives fluid from the upper chamber when the actuator is actuated. The top wall includes at least one cavity therein. The cooling system utilizes cooling cells including the flow chamber. The method includes driving the actuator at a frequency that directs fluid through the flow chamber.
F28F 13/10 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
51.
Engineered actuators usable in MEMS active cooling devices
An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.
A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
An active cooling system is described. The active cooling system includes at least one cooling element that has a vent therein and is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open for the virtual valve being closed.
A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.
A system including an active cooling system is described. The active cooling system includes a cooling element in communication with a fluid and configured to use vibrational motion to direct a fluid toward a surface of heat-generating structure(s). Heat is transferred from the heat-generating structure to the fluid. The system is configured such that the fluid follows a path from the surface of the heat-generating structure(s) past a structure having a lower temperature than the surface of the heat-generating structure. The structure absorbs heat from the fluid. The structure is within the system and distal from the active cooling system.
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
56.
Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
F04B 39/06 - Cooling; Heating; Prevention of freezing
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
An active cooling system is described. The active cooling system includes at least one cooling element that has a vent therein and is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open for the virtual valve being closed.
A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.
A system including an active cooling system is described. The active cooling system includes a cooling element in communication with a fluid and configured to use vibrational motion to direct a fluid toward a surface of heat-generating structure(s). Heat is transferred from the heat-generating structure to the fluid. The system is configured such that the fluid follows a path from the surface of the heat-generating structure(s) past a structure having a lower temperature than the surface of the heat-generating structure. The structure absorbs heat from the fluid. The structure is within the system and distal from the active cooling system.
A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
61.
Engineered actuators usable in MEMs active cooling devices
An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.
An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 39/06 - Cooling; Heating; Prevention of freezing
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
F04B 43/08 - Machines, pumps, or pumping installations having flexible working members having tubular flexible members
65.
MEMS-based airflow system having a vibrating fan element arrangement
A system including an orifice plate, a fan element and at least one channel is disclosed. The orifice plate has at least one orifice therein. The fan element is configured to undergo vibrational motion to drive a fluid through the orifice(s). The fluid is drawn through the channel(s) in response to the fluid being driven through the at least one orifice.
F04B 49/00 - Control of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for in, or of interest apart from, groups
A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
09 - Scientific and electric apparatus and instruments
Goods & Services
Microelectromechanical (MEMS) devices in the nature of piezoelectric transducers for applications in electronic or computer heat dissipation and micro-fluidic pumping
09 - Scientific and electric apparatus and instruments
Goods & Services
Microelectromechanical (MEMS) devices in the nature of piezoelectric transducers for applications in electronic or computer heat dissipation, micro-fluidic pumping, RF filtering in electronics, and energy harvesting from mechanical stress
69.
Piezoelectric MEMS-based active cooling for heat dissipation in compute devices
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
H01L 41/02 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details
H01L 41/00 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
H01L 41/08 - Piezo-electric or electrostrictive elements
A piezoelectric cooling chamber and method for providing the cooling system are described. The cooling chamber includes a piezoelectric cooling element, an array of orifices and a valve. A vibrational motion of the piezoelectric cooling element causes an increase or decrease in a chamber volume as the piezoelectric cooling element is deformed. The array of orifices is distributed on at least one surface of the chamber. The orifices allow escape of fluid from within the chamber during the decrease in the chamber volume in response to the vibration of the piezoelectric element. The valve is configured to admit fluid into the chamber when the chamber volume increases and to substantially prevent fluid from exiting the chamber through the valve when the chamber volume decreases.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H01L 41/02 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details
H01L 41/00 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
H01L 41/08 - Piezo-electric or electrostrictive elements
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
H04M 1/02 - Constructional features of telephone sets
A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
H01L 41/00 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat- generating structure to extract heat from the heat-generating structure.
A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
H01L 41/02 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details
H01L 41/00 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof
H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
F04B 45/04 - Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
H01L 41/08 - Piezo-electric or electrostrictive elements
75.
Mobile phone and other compute device cooling architecture
A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect
F04D 33/00 - Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
H04M 1/02 - Constructional features of telephone sets
