A tailored thermal body includes a substrate and a plurality of material regions extending throughout the substrate, the plurality of material regions having a variable thermal conductivity. At least one heating element is secured to the substrate. The substrate and the plurality of material regions are formed using at least one additive manufacturing process, and materials of the substrate and the plurality of material regions are chemically fused together.
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B33Y 40/00 - Auxiliary operations or equipment, e.g. for material handling
2.
METHOD AND SYSTEM FOR CALIBRATING A CONTROLLER THAT DETERMINES A RESISTANCE OF A LOAD
A method for enhancing resistance measurements of a load includes obtaining a plurality of sample resistance values of the load, determining an average resistance value based on the plurality of sample resistance values, determining a resistance difference based on the average resistance value and a nominal resistance value associated with the load, updating an offset correction value of a controller in response to the resistance difference being greater than a resistance tolerance, and measuring a resistance of the load based on the offset correction value and one or more electrical characteristics of the load.
A temperature sensing system to detect a temperature of a surface includes a sensor assembly and first and second lead wires. The sensor assembly includes a probe head and a temperature sensor disposed within the probe head. The first and second lead wires suspend the probe head such that the probe head abuts the surface. The first and second lead wires comprising different materials. The first and second lead wires are configured to provide multiple degrees of freedom of movement to the probe head and temperature measurements.
A heater system for semiconductor processing includes a base, a plurality of gas processing components, and a heater. The plurality of gas processing components are secured to the base. The heater is disposed along a length of the base and between the base and the plurality of gas processing components. The heater is configured to provide heat to the plurality of gas processing components.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
5.
HYBRID SHAFT ASSEMBLY FOR THERMAL CONTROL IN HEATED SEMICONDUCTOR PEDESTALS
A hybrid shaft assembly for use in controlled atmosphere chambers, such as by way of example heated pedestals for semiconductor manufacturing, includes a substrate, a hub having an upper portion and a lower portion, the upper portion being secured to the substrate with an upper joining layer, and a shaft secured to the lower portion of the hub with a lower joining layer. The shaft comprises a material having a thermal conductivity lower than a material of the hub and a material of the substrate.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A terminal assembly for a heater system includes a plurality of resistive heating elements arranged in multiple power phases includes a plurality of power busbars, a neutral busbar, a phase barrier disposed between each of the plurality of power busbars, and a plurality of interchangeable couplers. Each power busbar corresponds to a power phase of the multiple power phases and is configured to connect a power lead from one of the multiple power phases and a first end of a plurality of resistive heating elements. The resistive heating elements are in electrical communication with the power lead. The neutral busbar is offset longitudinally from the power busbars and configured to receive a second end of the resistive heating elements. The interchangeable couplers are configured to connect at least a subset of the resistive heating elements to at least one power busbar or at least one neutral busbar.
A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid- state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A method of generating a digital twin of an environment (10) includes generating one or more mathematical-based variables based on a mathematical model (304) of the environment and sensor data from one or more sensors of the environment, generating one or more machine learning-based variables based on a machine learning-based model of the environment (308) and the sensor data, and stacking the one or more mathematical-based variables and the one or more machine learning-based variables based on a meta-learning model to generate a machine learning input (312) for predicting a performance characteristic of the environment (320).
G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
G05B 17/02 - Systems involving the use of models or simulators of said systems electric
9.
SHAPED ELECTRICAL INTERCONNECTIONS FOR MULTI-LAYER HEATER CONSTRUCTIONS
An electrical interconnect for use in connecting layers of a multi-layer heater includes a shaped body having a lower end portion and an upper end portion. The lower end portion has a smaller contact area than a contact area of the upper end portion, and the contact area of the lower end portion is proximate a heating layer and the contact area of the upper end portion is proximate a routing layer.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
10.
METHOD AND SYSTEM FOR CALCULATING ELECTRICAL CHARACTERISTICS OF AN ELECTRIC HEATER
A method of controlling temperature of a heater including a resistive heating element includes measuring a voltage count and a current count based on data from an analog-digital converter (ADC) circuit of a sensor circuit, where the sensor circuit is electrically coupled to the heater. The method includes selecting one or more dynamic gain levels of the ADC from among a plurality of dynamic gain levels based on a shift gain correlation, determining a resistance of the resistive heating element based on the voltage count, the current count, and the one or more dynamic gain levels, and controlling power to the heater based on the resistance.
A temperature sensing system includes an outer casing, a thermocouple including a thermocouple junction, and a reference sensor. The thermocouple and the reference sensor are received within the outer casing. The reference sensor is disposed proximate an end of the thermocouple opposing the thermocouple junction and is configured to provide a reference temperature based on which a temperature measured by the thermocouple is determined.
A standoff assembly for use in terminating a plurality of resistive heaters disposed within a fluid vessel includes a pressure adapter plate, an electrical enclosure adapter plate, and a plurality of conduits. An end portion of each of the resistive heating elements extends through the pressure adapter plate. The electrical enclosure adapter plate is spaced apart from the pressure adapter plate to define a dry volume therebetween. The conduits are secured to the pressure adapter plate and the electrical enclosure adapter plate. Each conduit is aligned concentrically with each of the resistive heating elements. An electrical termination portion of each resistive heating element is disposed within the conduit.
An electric heater system includes an inlet, an outlet, a plurality of heat exchanger assemblies, and one or more connectors. The plurality of heat exchanger assemblies are connected in series. Each heat exchanger assembly includes a vessel, heating elements disposed within the vessel, and a fluid guide member. The connectors secure the vessels of the plurality of heat exchanger assemblies to each other. The connectors are also in fluid communication with the vessels. Fluid entering the inlet flows through the heat exchanger assemblies and through one or more connectors where it exits the outlet. The fluid guide members of the heat exchanger assemblies are of different or the same combinations to generate a predetermined pressure drop between the inlet and the outlet.
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
F24H 9/00 - FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL - Details
A thermal insulation structure includes an insulation layer having a first surface proximate a cooling device and a second surface opposing the first surface. A heater is disposed proximate the second surface, and a protective layer is disposed proximate the heater layer such that the heater layer is disposed between the insulation layer and the protective layer. The heater layer is configured to reduce frost or ice buildup on an exterior surface of the insulation layer.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
15.
METAL HEATER ASSEMBLY WITH EMBEDDED RESISTIVE HEATERS
A metal heater includes a metal substrate with a groove, a resistive heater disposed within the groove, and a fill metal disposed over the resistive heater and substantially filling the groove, wherein the fill metal has a lower melting temperature than the metal substrate. The fill metal can be indium and a cover plate can be bonded to the metal substrate and over the indium. A method of manufacturing the metal heater and a method of operating the metal heater are also provided.
H05B 3/24 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor being self-supporting
16.
CABLE HEATER ASSEMBLY WITH CABLE END ADAPTER SYSTEM
A cable heater assembly includes a cable heater and an adapter system. The cable heater includes an outer sheath and a conductor. A portion of the conductor is exposed from the outer sheath. The adapter system includes an adapter body mounted to an end of the cable heater and a cap joined to the adapter body to enclose the portion of the conductor inside the cap.
A method of detecting a leak-induced abnormal condition in a fluid line system having a plurality of heaters includes determining a plurality of temperature characteristics at a plurality of locations of the fluid line system, where each temperature from among the plurality of temperature characteristics is associated with at least one heater from among the plurality of heaters and monitoring, for each of the plurality of heaters, an electrical characteristic of the heater. The method includes determining the leak-induced abnormal condition is present within the fluid line system in response to the electrical characteristic of a given heater from among the plurality of heaters and the temperature characteristic associated with the given heater satisfying a temperature-and-electrical characteristics (TEC) deviation condition and performing a corrective action in response to determining the leak-induced abnormal condition is present.
A method of providing power via a plurality of power control systems forming a power network is provided. Each power control system includes a power controller and a power switch operable by the power controller. The method includes defining, by each power controller of the power network, a power allocation schedule for a power cycle using a dynamic load scheduling model based on a members list of the power network. The power cycle is divided into a plurality of power units, and the power allocation schedule identifies one or more designated power control systems from among the plurality of power control systems to provide power to a load during each of the power units. For the power cycle, the method includes providing power to the load by the one or more designated power control systems during a respective power unit based on the power allocation schedule.
A termination assembly for a heater assembly includes a plurality of resistive heaters (26) arranged in discrete power phases, each resistive heater comprising a resistive heating element surrounded by dielectric material and a sheath. The termination assembly includes a plurality of electrically nonconductive members (76). Each electrically nonconductive member (76) includes a plurality of apertures configured to receive power pins (80) of the plurality of resistive heaters. The termination assembly includes a plurality of connectors (82) configured to connect the power pins to the electrically nonconductive members. Each electrically nonconductive member includes a number of the plurality of connectors corresponding to a number of power pins being terminated. The termination assembly includes an electrical circuit (85) embedded in or disposed on at least one of the plurality of electrically nonconductive members.
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
H05B 3/42 - Heating elements having the shape of rods or tubes non-flexible
20.
COUPLING BOX HAIRPIN REPLACEMENT FOR HIGH VOLTAGE HEATING ELEMENT
A heater assembly includes a pair of heating sections (22) and a coupling assembly (24). The heating sections each include a conductive portion (52). The coupling assembly (24) includes a coupling enclosure (26) and a coupling member (28) disposed inside the coupling enclosure (26). The conductive portions of the pair of heating sections are connected by the coupling member inside the coupling enclosure.
H05B 3/42 - Heating elements having the shape of rods or tubes non-flexible
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
21.
DEVICES FOR DETECTING MATERIAL DEPOSITS IN FLUID FLOW CONDUITS
A sensor for detecting material deposits in a fluid flow conduit includes a body and an array of pairs of temperature sensors disposed within the body, where each pair of temperature sensors is spaced a distance apart along a primary flow direction of the fluid flow conduit.
A method of detecting accumulation of material deposits within a fluid flow conduit includes providing, by a controller, an excitation signal to a heating element of the fluid flow conduit. The method includes obtaining, by the controller, thermodynamic data of the fluid flow conduit in response to providing the excitation signal, where the thermodynamic data includes heat flux data, diffusivity data, time data, temperature differential data, or a combination thereof. The method includes determining, by the controller, an amount of material deposits based on the thermodynamic data.
A method for controlling a heated process of an electric heater includes obtaining a setpoint variable indicating a target temperature of the heater. The method includes identifying an energy profile for the heater based on the setpoint variable. The energy profile provides a defined magnitude of initial electrical energy to be applied to the heater to have a temperature of the heated process reach the target temperature. The method includes obtaining a process variable indicating a performance characteristic of the heated process. The method includes providing electrical energy to the heater based on at least one of the energy profile and the process variable.
In one form, the present disclosure is directed toward a method for controlling temperature of a heater including a resistive heating element. The method includes applying power to the resistive heating element of the heater at a variable ramp rate to increase temperature of the heater to a desired temperature setpoint. The variable ramp rate is set to a desired ramp rate. The method further includes monitoring an electric current flowing through the resistive heating element of the heater, and reducing the variable ramp rate from the desired ramp rate to a permitted ramp rate in response to the electric current being greater than a lower limit of an electric current limit band. An upper limit of the electric current limit band is provided as a system current limit.
In one form, the present disclosure is directed toward a method of controlling temperature of a heater including a resistive heating element. The method includes applying power to the resistive heating element at a variable ramp rate to decrease temperature of the heater to a desired temperature setpoint, where the variable ramp rate is set to a desired ramp rate. The method further includes monitoring the temperature of the heater to detect a runaway condition and adjusting the variable ramp rate from the desired ramp rate to a permitted ramp rate in response to the runaway condition being detected.
A method of controlling a thermal system of an industrial process includes monitoring intermediate data, associating the intermediate data with correlation data, wherein the correlation data includes an internal process control input, an external heater control input, the output control, or a combination thereof. The method further includes generating a model that defines a relationship between the intermediate data and the correlation data, identifying a state of the heater system based on the model, and selectively performing a corrective action based on the identified state of the heater system.
G05B 17/02 - Systems involving the use of models or simulators of said systems electric
G05B 11/42 - Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential for obtaining a characteristic which is both proportional and time-dependent, e.g. P. I., P. I. D.
27.
MULTIPOINT SERIES SENSOR IN ELECTRIC HEATING ELEMENTS
A temperature sensing system includes a plurality of resistive segments connected in electrical series. Each resistive segment defines a material different from a material of an adjacent resistive segment, and the plurality of resistive segments are joined at sensing junctions to define a plurality of sensing junctions along a length of the resistive segments. A temperature deviation is calculated from the plurality of sensing junctions based on electric potential at each of the sensing junctions.
G01K 1/02 - Means for indicating or recording specially adapted for thermometers
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
F24H 1/00 - Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
H05B 1/00 - ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - Details of electric heating devices
28.
MODULAR HEATER ASSEMBLIES FOR USE IN FLUID CONDUITS
A modular heater assembly includes resistive heaters disposed along sections of a fluid conduit system, insulation members around the resistive heaters, and at least one insulation block around a fitting. The fitting is configured to join at least two adjacent sections of the fluid conduit system and defines an exterior geometric profile. The insulation block includes a central recess extending axially in a direction of one of the at least two adjacent sections and defining an internal geometric profile substantially matching the external geometric profile of the fitting, and a peripheral aperture. The peripheral aperture is open to the central recess, defines an internal geometric profile substantially matching an external geometric profile of another of the at least two adjacent sections, extends through a sidewall of the insulation block, and is axially aligned with the another of the at least two adjacent sections.
A method of calibrating a heater includes powering the heater to a first temperature setpoint. The heater includes a resistive heating element that has a varying temperature coefficient of resistance. The method further includes concurrently obtaining a plurality of resistance measurements of the resistive heating element and a plurality of reference temperature measurements of a reference member as the heater cools from a first temperature setpoint to a second temperature setpoint that is lower than the first temperature setpoint, and generating a resistance- temperature calibration table that correlates the plurality of resistance measurements with the plurality of reference temperature measurements.
A method includes providing thermal energy to a component, determining a thermal response of the component in response to providing the thermal energy, and determining a thermal characteristic of the component based on a reference thermal response and the thermal response. The method includes predicting a surface condition of the component based on the thermal characteristic and a predictive analytic model, where the predictive analytic model correlates the thermal characteristics of the component to an estimated surface condition of the component.
A power converter system provides adjustable power to a heater and includes an input rectifier and a full-bridge isolating converter. The input rectifier is configured to rectify a line power having a line energy. The full-bridge isolating converter configured to generate an isolated output voltage based on the rectified line power. The isolated output voltage is electrically isolated from the line energy.
H02M 3/335 - Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H05B 6/00 - Heating by electric, magnetic or electromagnetic fields
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
32.
MODULAR HEATER ASSEMBLY WITH INTERCHANGEABLE AUXILIARY SENSING JUNCTIONS
A heater system is provided, which includes a plurality of heaters, a controller for supplying power to the plurality of heaters, a plurality sets of auxiliary wires extending from the plurality of heaters, and a wire harness for connecting the plurality sets of auxiliary wires to the controller. Each set of auxiliary wires includes three wires, two of the three wires being made of different materials and being joined to form a thermocouple junction, such that each of the plurality of heaters is operable to function as both a heater and a temperature sensor.
H05B 3/48 - Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
G01K 7/08 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples the object to be measured forming one of the thermoelectric materials, e.g. pointed type
33.
RESISTANCE CALIBRATION AND MONITORING OF THERMAL SYSTEMS
A method of calibrating temperature of a resistive element having a material with a Curie temperature includes generating a standard resistance-temperature (R-T) curve for the resistive element in isothermal conditions to identify values of the R-T curve and an inflection point at the Curie temperature, generating operational R-T curves for the resistive element over an operational time period, comparing the standard R-T curve to the operational R-T curves, and adjusting the operational curves to the standard R-T curve at the Curie temperature to calibrate temperature of the resistive element.
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01K 7/38 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using magnetic elements, e.g. magnets, coils the variations of temperature influencing the magnetic permeability
G01K 15/00 - Testing or calibrating of thermometers
A method of dynamically calibrating a heater having a plurality of zones defined by one or more resistive heating elements includes controlling power to a heater having a plurality of zones based on a dynamic resistance-temperature (R-T) model to control a temperature of the heater to a temperature setpoint. For each of the plurality of zones, the method further includes measuring a temperature of a respective zone based on a resistance of the resistive heating elements of the respective zone and the dynamic R-T model, measuring a reference temperature for the respective zone, and incrementally adjusting a resistance value associated with the temperature setpoint provided in the dynamic R-T model for the respective zone to a calibrated resistance value. The method further includes providing the dynamic R-T model that correlates the calibrated resistance values of the plurality of zones with the temperature setpoint as a calibrated R-T model.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
35.
CONTROL AND MONITORING SYSTEM FOR GAS DELIVERY SYSTEM
A method for monitoring a semiconductor processing system including a gas delivery system, a thermal system, and a fluid flow line includes obtaining a plurality of operational data from the gas delivery system, the thermal system, or a combination thereof and determining a performance characteristic of the fluid flow line based on one or more operational data of the plurality of operational data. The method includes identifying one or more locations associated with the one or more operational data in a reference virtual model and generating a dynamic state model of the fluid flow line based on the reference virtual model, the one or more identified locations, and the determined performance characteristic, where the dynamic state model is a digital representation of the fluid flow line.
G06Q 10/06 - Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An electric heater includes a first busbar, a second busbar, a third busbar, a neutral busbar, a plurality of first heating elements, a plurality of second heating elements, and a plurality of third heating element. A first end of each first heating element is coupled to the first busbar for electrical communication therewith. A second end of each first heating element is coupled to the neutral busbar for electrical communication therewith. A first end of each second heating element is coupled to the second busbar for electrical communication therewith. A second end of each second heating element is coupled to the neutral busbar for electrical communication therewith. A first end of each third heating element is coupled to the third busbar for electrical communication therewith. A second end of each third heating element is coupled to the neutral busbar for electrical communication therewith.
A heater includes an aluminum nitride (AIN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AIN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AIN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AIN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AIN substrate via a transient liquid phase bond.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
A method of constructing an E-puck includes forming at least one trench into a lower substrate, depositing an electrode material onto the lower substrate and into the at least one trench, removing excess electrode material from the lower substrate to leave the electrode material within the at least one trench to form an electrode, and forming a dielectric on the lower substrate and the electrode such that the electrode is between the lower substrate and the upper substrate. Forming the at least one trench into the lower substrate forms at least one standoff portion adjacent to the at least one trench and the at least one standoff portion reduces dishing of the electrode material during removal of the excess electrode material from the lower substrate.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
An electrostatic chuck is formed by depositing a diffuser layer onto an electrostatic puck and removing areas of the diffuser layer to form discrete diffuser segments separated by gaps. The discrete diffuser segments may define continuous concentric rings, discontinuous concentric rings, or a combination of continuous concentric rings and discontinuous concentric rings. The discrete diffuser segments are separated from each other by forming at least one trench in the diffuser layer. The trench may extend partially through the diffuser layer, completely through the diffuser layer to the electrostatic puck, or have a first portion that extends partially through the diffuser layer and a second portion that extends completely through the diffuser layer. Also, the trench can have a constant width or have a variable width.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
40.
INDUSTRIAL CONTROL PROJECTIVE CAPACITIVE TOUCH INTERFACE
An industrial control device includes a display, a body, and a controller. The body includes a capacitive slider sensor, a graphic, and a window. The graphic overlaps the capacitive slider sensor. The window is transparent and aligned with the display to permit the display to be viewed through the window. The controller is coupled to an output of the capacitive slider sensor to receive signals from the capacitive slider sensor. The controller is coupled to the display and configured to control the display.
A method of monitoring a condition of a dynamic system includes installing a vibration signal acquisition device at a predetermined location of the dynamic system, acquiring vibration signals by the vibration signal acquisition device, analyzing the vibration signals in a frequency domain, and predicting a change in the condition of the dynamic system based on the vibration signals in the frequency domain. A system is also provided, and a condition of the dynamic system includes clogging.
G01M 7/00 - Vibration-testing of structures; Shock-testing of structures
F04D 15/00 - Control, e.g. regulation, of pumps, pumping installations, or systems
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
42.
SYSTEM AND METHOD FOR CALIBRATING A CONTROL SYSTEM OPERATING AN ELECTRIC HEATER
A method for calibrating a control system configured to control a two-wire heater includes providing power to a load electrically coupled to the control system, generating, an initial measured characteristic and a calibrated measured characteristic of the load by the control system and a controller calibration system, respectively. The method further includes defining a calibrated measurement reference based on a correlation of the initial measured characteristic and the calibrated measured characteristic. With the calibrated measure reference, the control system is further calibrated to define a resistance-temperature calibration reference for determining a working temperature of the two-wire heater based on a measured resistance of the two-wire heater.
A method of adjusting a watt density distribution of a resistive heater includes designing a baseline heater circuit. A detection circuit is designed having a constant trace watt density and the detection circuit overlaps the baseline heater circuit. The detection circuit is manufactured, and its baseline thermal map is obtained. The baseline heater circuit is manufactured, and a nominal thermal map is obtained. A subsequent detection circuit is manufactured, and an actual thermal map is obtained. A subtraction thermal image is created by subtracting the baseline thermal map from the actual thermal map, and a subsequent baseline heater circuit is modified according to the subtraction thermal image.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
A temperature limiting device for a thermal system includes a modular unit that is configured to connect to a two-wire heater of the thermal system. More particularly, the modular unit includes a heater interface configured to connect to a two-wire heater of the thermal system, a power interface configured to connect to a power source to receive power; and a controller including a sensor circuit. The sensor circuit is configured to measure an electrical characteristic of the two-wire heater, which includes voltage, current, or a combination thereof. The controller is configured to calculate a temperature of the thermal system based on the measured electrical characteristic and determine whether the temperature is greater than a temperature setpoint.
33 3 storage condition of aftertreatment system, an ambient temperature, and combinations thereof. The control device modulates power to the heater based on the at least one input such that the heater provides a continuously variable heating output during operation of the exhaust system.
F02D 41/02 - Circuit arrangements for generating control signals
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
46.
SYSTEM AND METHOD FOR A CLOSED-LOOP BAKE-OUT CONTROL
A control system for operating a heater includes a controller configured to determine an operational power level based on a measured performance characteristic of the heater, a power set-point, and a power control algorithm, determine a bake-out power level based on a measured leakage current at the heater, a leakage current threshold, and a moisture control algorithm, and select a power level to be applied to the heater. The selected power level is the lower power level from among the operational power level and the bake-out power level.
A wireless sensor assembly includes a housing defining a first aperture and a second aperture. A first communication port is provided at the first aperture and configured to communicably couple to an external sensor and a second communication port is provided at the second aperture and configured to physically connect to an external communication device. A wireless power source disposed in the housing. One or more electronics receives power from the wireless power source and acquire data from the external sensor. The one or more electronics includes a wireless module operable to form a wireless communication link, and is configured to transmit the acquired data to an external computing device by the second communication port and/or the wireless module.
G01D 5/24 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
A temperature sensing unit is provided, which includes a temperature sensor for measuring a temperature of an object and a mounting member. The mounting member is elastic and is attached to the temperature sensor for securing the temperature sensor around the object, and the temperature sensor in one form defines a first thermocouple ribbon and a second thermocouple ribbon with a very low profile and high temperature capability.
G01K 1/14 - Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
A method of constructing a heater includes the steps of forming a sintered assembly including a ceramic substrate and a plurality of first slugs embedded therein, forming a functional element on one of opposing surfaces of the sintered assembly such that the functional element is connected to the plurality of first slugs, and forming a monolithic substrate in which the functional element and the plurality of first slugs are embedded.
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
50.
FIBER OPTIC PROBE WITH DUAL SEALING AND COMPRESSION ELEMENT
Temperature sensing probes for sensing the temperature of a substrate based on fluorescence are disclosed. The temperature sensing probes include a fiber optic cable having at a cold end an optical interface and at a hot end a temperature sensing element for contacting a substrate. A sheath surrounds at least a portion of the hot end of the fiber optic cable. A retaining member securely and removably engages the sheath with a support member. The sheath forms a vacuum seal around the contact between the temperature sensing element and the substrate.
G01K 11/32 - Measuring temperature based on physical or chemical changes not covered by group , , , or using changes in transmittance, scattering or luminescence in optical fibres
An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 μm.
A heater includes a ceramic substrate and a heating layer made of aluminum material disposed in the ceramic substrate. The ceramic substrate includes a first plate member in which the heating layer is disposed and a second plate member through which a plurality of first vias made of the aluminum material extend. A routing layer made of the aluminum material can be disposed in the second plate member. The first plate member and the second plate member are bonded to each other by the aluminum material. The ceramic substrate can include a third plate member through which a plurality of second vias made from the aluminum material extend. The second plate member and the third plate member are bonded to each other by the aluminum material. Also, terminal wires can be bonded to the plurality of second vias.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
The present disclosure is directed toward a heater that includes a resistive heating element, a first power pin, and a second power pin. The first power pin forms a first junction with a first end of the resistive heating element, and the second power pin forms a second junction with the second end of the resistive heating element. The second power pin includes a first lead wire and a second lead wire. The first lead wire forms the second junction with the second end of the resistive heating element and defines a first conductive material. The second lead wire forms a primary sensing junction with the first lead wire at a first reference area, and defines a second conductive material different from the first conductive material to measure a temperature at the first reference area based on a voltage change created by the primary sensing junction.
H05B 3/40 - Heating elements having the shape of rods or tubes
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
The present disclosure is directed toward a temperature detector probe that includes a housing, a pair of electrical connectors, a support cap, and a sensor. The housing defines a bore longitudinally extending through the housing, and the pair of electrical connectors extend through the bore. The support cap is disposed at a first end portion of the housing. The sensor is provided on the support cap and is electrically coupled to the pair of electrical connectors. The support cap is positioned between the pair of electrical connectors and the support cap.
The present disclosure is directed toward a control system for controlling a heater system. The control system includes a plurality of zone control circuits, at least two auxiliary controllers, and a primary controller. The zone control circuits are operable to provide power to a plurality of heater zones of the heater system and to sense performance characteristics of the zones. The auxiliary controllers are coupled to the plurality of zone control circuits to control power to the plurality of zones and to monitor operation of the heater zones based on the performance characteristics. The primary controller is coupled to the auxiliary controllers and is configured to provide an operation set-point for each of the heater zones based on the performance characteristics. The auxiliary controllers operate the zone control circuits to supply power to the heater system based on the operation set-point.
An electrical heater (10) and method includes heating member (14), a cable (18), and a connector (22). A resistance heating element (30) is within a sheath (26) of the heating member. A proximal end of the sheath is inserted into a slot of a first fitting (110) and welded to the first fitting with first and second leads extending into the first fitting. The second fitting (114) is threadably engaged with the first fitting. The second fitting defines a central bore disposed about the axis. An end of a power cable extends into the second central bore. A first wire is coupled to the first lead. A second wire is coupled to the second lead.
H01R 4/20 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping using a crimping sleeve
H05B 3/08 - Heater elements structurally combined with coupling elements or with holders having electric connections specially adapted for high temperatures
The present disclosure is directed toward a control system for controlling a heater that includes at least one heating element. The control system includes a power converter operable to supply an adjustable voltage output to the heater, a sensor circuit that measures an electrical characteristic of the heating element of the heater, a reference temperature sensor that measures a reference temperature of a reference at the heater, and a controller. The controller is configured to calculate a primary temperature of a heater element based on the electrical characteristic and determines the voltage output to be applied to the heater based on at least one of the reference temperature and the primary temperature. The controller is configured to operate in at least one of an operation mode and a learn mode, and execute protection protocols when voltage is being supplied to the heater.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H02M 7/5387 - Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
A method of constructing a heater includes providing a substrate, forming at least one trench into the substrate, depositing a functional material onto the substrate and into the at least one trench to form a functional element, and providing an electrical termination in contact with the functional element.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
The present disclosure relates to a sensing system and method that includes a plurality of resistive elements coupled to a plurality of nodes and a control system configured to index through a plurality of modes to measure an electrical characteristic for each resistive element. Each mode of the plurality of modes represents a different combination of power, return, or open circuit condition applied to each of the plurality of nodes, and the control system is configured to calculate, for each of the modes, a total power consumed by the system and a power consumed by each of the resistive elements based on the measured electrical characteristics, to determine a physical parameter.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
The present disclosure provides a support pedestal that includes a support member including a resistive layer having at least two zones, a routing layer, and a plurality of conductive vias. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of vias. The number of zones of the resistive layer is greater than or equal to a number of wires coupled to the routing layer. The routing layer may include a plurality of arm portions that extend from a central region of the routing layer. The support pedestal may further include a second resistive layer disposed along the same plane as the routing layer.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A support pedestal is provided that includes a substrate having a top resistive layer defining a first set of zones and a bottom resistive layer defining a second set of zones. Each zone of the first and second set of zones is coupled to at least two electric terminals from among a plurality of electric terminals, and a total number of electric terminals is less than or equal to a total of the first and second set of zones.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A fiber optic sensing system includes a plurality of optical probes, a light source, and a light splitting unit connecting the light source to the plurality of optical probes. The light splitting unit splits a light emitted from the light source into a plurality of divided lights, the divided lights being transmitted to the plurality of optical probes.
G01K 11/32 - Measuring temperature based on physical or chemical changes not covered by group , , , or using changes in transmittance, scattering or luminescence in optical fibres
A method of manufacturing a pedestal includes having a support plate including a substrate, an electric element embedded in the substrate, and a conductive member connected to the electric element, preparing a tubular shaft that defines a chamber, securing the tubular shaft to the support plate, the conductive member being exposed in the chamber of the tubular shaft, and applying a protective layer on the conductive member by an atomic layer deposition (ALD) process. A system for manufacturing the pedestal and a pedestal are also provided in the present disclosure.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A ceramic pedestal assembly and a method of forming a ceramic pedestal assembly is provided. The ceramic pedestal assembly includes a ceramic substrate defining an upper surface and a lower surface, at least one via extending through the ceramic substrate, an upper conductive foil layer extending across the upper surface of the ceramic substrate and a lower conductive foil layer extending across the lower surface of the ceramic substrate. Each via includes an upper via defining a cavity and a lower via defining a corresponding tapered insert. In one form, the upper via, the lower via, and the conductive foil layers define a material having a melting temperature greater than 2,000°C and a CTE less than or equal to the ceramic substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A heater assembly includes a continuous series of perforated helical members and a plurality of heating elements. The perforated helical members cooperate to define a geometric helicoid disposed about a longitudinal axis of the heater assembly. Each perforated helical member defines opposed edges and a predetermined pattern of perforations. The perforations extend through each perforated helical member parallel to the longitudinal axis. The heating elements extend through the perforations.
F28F 9/22 - Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
F28D 7/16 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
F28D 7/06 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits having a single U-bend
66.
SENSOR SYSTEM AND INTEGRATED HEATER-SENSOR FOR MEASURING AND CONTROLLING PERFORMANCE OF A HEATER SYSTEM
A fluid sensor system detects one or more performance characteristics of a heating system that heats a fluid. The sensor system includes a probe having a finite length a portion of which is to be immersed in the fluid. The probe includes a resistive heating element and a fluid temperature sensor for measuring one or more performance characteristics, wherein the fluid temperature sensor is configured to measure a fluid temperature, and the resistive heating element is operable as a heater to create a temperature differential between the fluid and air to detect the fluid, and as a sensor to measure a fluid level.
G01F 23/24 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
A47J 37/12 - Deep fat fryers, e.g. for frying fish or chips
An assembly, which in one form is a pedestal, includes an upper member, a lower member bonded to the upper member, and a thermal phase diffuser disposed between the upper member and the lower member within a hermetically sealed volume. The thermal phase diffuser diffuses heat by way of a phase change of a working fluid within the hermetically sealed volume. The assembly/pedestal is capable of operating at high temperatures, in excess of 1000°C, with a high degree of temperature uniformity, and in one form is an aluminum nitride (AIN) material.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present disclosure provides a method of treating a diesel exhaust system that includes heating a reagent to a temperature such that at least a portion of the reagent is heated to a gaseous phase, injecting the reagent into a diesel exhaust stream upstream of a catalyst, and reacting the diesel exhaust with the heated reagent over the catalyst to convert NOx into N2 and H2O. The heating modulates a mass flow rate of the reagent by converting a state of matter of the reagent at least partially to the gaseous phase, and the heated reagent in the gaseous form reduces deposit formations within the diesel exhaust system.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
F01N 3/08 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
A wireless sensor assembly includes a housing, a wireless power source, and electronics. The housing defines an interior space and at least one aperture sized to receive at least one external sensor. The wireless power source is mounted within the housing. The electronics are mounted within the housing and are configured to receive power from the wireless power source and to be in electrical communication with the external sensor. The electronics include a wireless communications component, and firmware configured to manage a rate of data transmittal from the wireless communications component to an external device such that the wireless communications component has a power consumption less than about 0.5 mW. The electronics are powered exclusively by the wireless power source and the wireless sensor assembly defines a volume less than about 2 in3.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
70.
HIGH POWER DENSITY INSULATED EXHAUST HEATING SYSTEM
A heating apparatus for an exhaust gas system, or a fluid flow system, is provided by the present disclosure. The heating apparatus has a container body and includes at least one heater element and a support member disposed inside the container body and configured for restricting movement of the at least one heater element in the container body. The support member defines a tortuous geometry and flanks opposed sides of the at least one insulated heater element along a majority of a length of the at least one insulated heater element, wherein the support member increases heat transfer from the at least one heater element to an exhaust gas flowing through the container body.
F01N 5/02 - Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat
F23G 7/00 - Methods or apparatus, e.g. incinerators, specially adapted for combustion of specific waste or low grade fuels, e.g. chemicals
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
A heater includes at least one resistive element. The at least one resistive element includes a material having a high temperature coefficient of resistance (TCR) such that the resistive element functions as a heater and as a temperature sensor, the resistive element being a material selected from the group consisting of greater than about 95% nickel, a nickel copper alloy, stainless steel, a molybdenum-nickel alloy, niobium, a nickel-iron alloy, tantalum, zirconium, tungsten, molybdenum, Nisil, and titanium. In one form, the heater is a tubular heater with compacted MgO insulation and a metal sheath.
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
72.
HEATER BUNDLE FOR ADAPTIVE CONTROL AND METHOD OF REDUCING CURRENT LEAKAGE
A method of controlling a heating system is provided that includes having at least one heater assembly, the heater assembly comprising a plurality of heater units, each heater unit defining at least one independently controlled heating zone, supplying power to each of the heater units through power conductors electrically connected to each of the independently controlled heating zones in each of the heater units, and modulating power supplied to each of the independently controlled heating zones. A voltage is selectively supplied to each of the independently controlled heating zones such that a reduced number of independently controlled heating zones receives the voltage at a time, or at least a subset of the independently controlled heating zones receive a reduced voltage at all times.
The present disclosure generally describes a system that includes a heater, a power converter including a power switch, and a controller. The power converter is in communication with the heater and is operable to apply an adjustable voltage to the heater. The controller is in communication with the power switch to control the voltage output of the power converter based on at least one of a load current and a detected voltage at the heater. The controller operates the power switch to adjust the voltage output of the power converter.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A heater includes a resistance coil, a first conducting pin and a second conducting pin. The resistance coil includes a first end connected to the first conducting pin, and a second end connected to the second conducting pin. The resistance coil defines a first portion adjacent the first end, a second portion adjacent the second end, and a third portion disposed between the first portion and the second portion. At least one of the first, second, and third portions has a continuously variable pitch along its length.
A method of predicting the temperature of a resistive heating element in a heating system is provided. The method includes obtaining resistance characteristics of resistive heating elements and compensating for variations in the resistance characteristics over a temperature regime. The resistance characteristics of the resistive heating element include, but are not limited to, inaccuracies in resistance measurements due to strain-induced resistance variations, variations in resistance due to the rate of cooling, shifts in power output due to exposure to temperature, resistance to temperature relationships, non-monotonic resistance to temperature relationships, system measurement errors, and combinations of resistance characteristics. The method includes interpreting and calibrating resistance characteristics based on a priori measurements and in situ measurements.
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
76.
SYSTEM AND METHOD FOR AXIAL ZONING OF HEATING POWER
A heater system (20) for an exhaust system (18) is provided. The heater system (20) includes a heater (28) disposed in an exhaust conduit (32). The heater (28) includes a plurality of heating elements (38) disposed in the exhaust conduit (32). A heating control module (30) controls the plurality of heating elements (38) differently according to operating conditions specific to each heating element (38). In other forms, the heater system (20) for an exhaust system (18) has a plurality of heating zones, instead of a plurality of heating elements (38). The heating control module (30) controls the plurality of heating zones differently according to operating conditions specific to each heating zone.
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F01N 13/00 - Exhaust or silencing apparatus characterised by constructional features
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
F01N 11/00 - Monitoring or diagnostic devices for exhaust-gas treatment apparatus
G01K 7/00 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat
G01K 13/00 - Thermometers specially adapted for specific purposes
G01F 1/68 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
77.
DUAL-PURPOSE HEATER AND FLUID FLOW MEASUREMENT SYSTEM
A control system for use in a fluid flow application is provided. The control system includes a heater having at least one resistive heating element. The heater is adapted to heat the fluid flow. The control system further includes a control device that uses heat loss from at least one resistive heating element to determine flow characteristics of the fluid flow.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
F01N 13/14 - Exhaust or silencing apparatus characterised by constructional features having thermal insulation
G01K 7/00 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat
G01K 13/00 - Thermometers specially adapted for specific purposes
G01F 1/68 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
F01N 11/00 - Monitoring or diagnostic devices for exhaust-gas treatment apparatus
A heater system includes a heater bundle and a power supply device. The heater bundle includes a plurality of heater assemblies and a plurality of power conductors. The heater assembly includes a plurality of heater units, each heater unit defining at least one independently controlled heating zone. The power conductors are electrically connected to each of the independently controlled heating zones in each of the heater units. The power supply device is configured to modulate power to each of the independently controlled heater zones of the heater units through the power conductors.
A control system for a heating system of an exhaust system is provided. The control system includes at least one electric heater disposed within an exhaust fluid flow pathway, and a control device adapted to receive at least one input selected from the group consisting of mass flow rate of an exhaust fluid flow, mass velocity of an exhaust fluid flow, flow temperature upstream of the at least one electric heater, flow temperature downstream of the at least one electric heater, power input to the at least one electric heater, parameters derived from physical characteristics of the heating system, and combinations thereof. The control device is operable to modulate power to the at least one electric heater based on at least one input.
A heater is provided that includes at least one resistive heating element having a material with a non-monotonic resistivity vs. temperature profile and exhibiting a negative dR/dT characteristic over a predetermined operating temperature range along the profile. The heater can include a plurality of circuits disposed in a fluid path to heat fluid flow.
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
A fluid control system is provided that in one form includes a first flow channel, a second flow channel, a heater disposed in the second flow channel, and a fluid control device disposed upstream from the first and second flow channels. When the heater is turned on, the fluid control device changes a fluid flow rate through at least one of the first flow channel and the second flow channel. In another form, the fluid control system includes a bypass conduit, a heater disposed within the bypass conduit, and a fluid control device disposed near the inlet and outlet of the bypass conduit. In still another form, the fluid control system includes a regeneration device disposed downstream from at least one exhaust after treatment system and closes an outlet of the exhaust pipe.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
F01N 13/14 - Exhaust or silencing apparatus characterised by constructional features having thermal insulation
A susceptor for use in a heated fluid flow system is provided. In one form, a susceptor is arranged within a conduit and adapted to absorb radiant energy from at least one heating element and inhibit the radiant energy from being absorbed by the at least one wall of the conduit and/or other components. In another form, the susceptor absorbs and inhibits the radiant energy from being absorbed by the outer wall of the conduit.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
F01N 13/14 - Exhaust or silencing apparatus characterised by constructional features having thermal insulation
83.
THERMAL STORAGE DEVICE FOR USE IN A FLUID FLOW SYSTEM
An exhaust system is provided that includes at least one exhaust aftertreatment unit provided in an exhaust fluid flow pathway and a thermal storage device disposed upstream from the exhaust aftertreatment unit. The thermal storage device is operable to store thermal mass and provide thermal insulation to enable a catalyst to maintain a minimum predetermined temperature for a minimum predetermined time. In one form, a heater is also provided proximate the thermal storage device, along with variations that include a secondary flow pathway for the thermal storage device.
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
A heater for use in heating a fluid flow through a passageway is provided that includes a continuous resistive heating element having a predefined shape that is directly exposed to the fluid flow. The predefined shape includes a cross-sectional geometry that provides a required heat distribution, structural strength, and reduced back pressure within the passageway. The predefined shape may include airfoils, while the cross-sectional geometry provides a required heat distribution, structural strength, and reduced back pressure within the passageway.
A semiconductor processing apparatus includes a wafer support assembly, a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly, and a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.
A modular heater system includes a plurality of modular units aligned along a longitudinal direction of a fluid conduit for heating a fluid contained in the fluid conduit. The modular units each include a carrier member, a heating element mounted on the carrier member and a thermal insulation jacket surrounding the carrier member and the heating element. The carrier member defines a receiving space for receiving the fluid conduit therein and includes side slots recessed from outer surfaces of the carrier member. The thermal insulation jacket includes an upper half portion and a lower half portion. The upper half portion and the lower half portion are self-locked in the side slots of the carrier member.
A thermal system includes a plurality of thermal elements. In one form, each of the thermal elements define a resistor and a current limiting device. The plurality of thermal elements have at least a first subset of parallel thermal elements and at least a second subset of parallel thermal elements. The system also has a plurality of power lines connected to the plurality of thermal elements. The power lines are configured in pairs for providing power to a subset of the plurality of thermal elements that are connected in a parallel set. Each of the pairs of power lines share a common power line with an adjacent parallel set of thermal elements within a subset. Additionally, each of the current limiting devices in the adjacent parallel sets of thermal elements within a subset are opposed. The first and second subsets of parallel thermal elements share the common power line.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A thermal system includes a plurality of resistor circuits that define a number of resistor circuits Rn. The thermal system also has a plurality of nodes that connect the plurality of resistor circuits and define a number of nodes Nn. A plurality of power wires are connected to each of the plurality of nodes, and the plurality of power wires define a number of power wires Pn. A plurality of signal wires connect to each of the plurality of nodes to sense the temperature of each of the resistor circuits, and the plurality of signal wires define a number of signal wires Sn. The number of power wires Pn and the number of signal wires Sn is equal to the number of nodes Nn, and the number of resistor circuits Rn is greater than or equal to the number of nodes Nn.
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
89.
COMPOSITE DEVICE WITH CYLINDRICAL ANISOTROPIC THERMAL CONDUCTIVITY
An apparatus for supporting a substrate in a process chamber and regulating surface temperature of the substrate and method of making the same is provided. The apparatus includes a base support having a surface adapted to support the substrate and a heater for heating the substrate with the heater being disposed proximate the base support. The base support is made of a composite material comprising a plurality of thermally conductive arcuate members embedded within a matrix, each of the plurality thermally conductive arcuate members being arranged concentrically and defining predetermined intervals in a radial direction such that the composite material provides an anisotropic thermal conductivity in radial (p), azimuthal (φ) and axial (z) directions in a cylindrical coordinate system of the base support.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
90.
INTEGRATED DEVICE AND METHOD FOR ENHANCING HEATER LIFE AND PERFORMANCE
A control system for controlling an operation of a resistive heater includes a dielectric parameter determination module for determining a dielectric parameter of the resistive heater when the resistive heater is in an active mode, and a diagnostic module for diagnosing performance of the resistive heater based on the dielectric parameter.
A heater assembly (10) includes a heating member (12), a mounting member (14) that mounts the heating member (12) to a wall (16) of an external component, and an insulator (22) disposed between the heating member (12) and the wall (16). The insulator (22) electrically insulates the heating member (12) from the wall (16) and blocks a ground path from the heating member (12) to the wall (16) of the external component.
H05B 3/42 - Heating elements having the shape of rods or tubes non-flexible
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
92.
HIGH THERMAL CONDUCTIVITY WAFER SUPPORT PEDESTAL DEVICE
A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separated by corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel. A cooling fluid flows through the fluid supply channel, through the plurality of linear- parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F26B 25/00 - DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM - Details of general application not covered by group or
A heater is provided that includes a first power pin made of a first conductive material, a second power pin made of a second conductive material that is dissimilar from the first conductive material of the first power pin, and a resistive heating element having two ends and made of a material that is different from the first and second conductive materials of the first and second power pins. The resistive heating element forms a first junction at one end with the first power pin and a second junction at its other end with the second power pin, and changes in voltage at the first and second junctions are detected to determine an average temperature of the heater.
An active temperature measurement system includes at least one grounded thermocouple and a processor in communication with the at least one grounded thermocouple. The processor is configured to receive measurements from the at least one grounded thermocouple. The at least one grounded thermocouple is biased by an isolated voltage when the processor is receiving a measurement from the at least one grounded thermocouple.
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
G01K 7/04 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
G01K 7/06 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials the thermoelectric materials being arranged one within the other with the junction at one end exposed to the object, e.g. sheathed type
F01N 3/027 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters using means for regenerating the filters, e.g. by burning trapped particles using electric or magnetic heating
F01N 3/20 - Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
F01N 13/00 - Exhaust or silencing apparatus characterised by constructional features
F23J 15/08 - Arrangements of devices for treating smoke or fumes of heaters
F24H 3/04 - Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element
95.
THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS
A heater system includes a heater assembly, an imaging device and a control system. The heater assembly includes a plurality of heating zones. The imaging device acquires an image of the heater assembly. The control system determines variations in the plurality of heating zones based on the thermal image.
H05B 3/22 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
G01N 25/00 - Investigating or analysing materials by the use of thermal means
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A sensor assembly is provided that includes a housing having a unitary body with a proximal end portion and a distal end portion. The distal end portion is open and defines an internal cavity exposed to an outside environment, and the proximal end portion defines a plurality of internal passageways that extend and open into the internal cavity. A thin film resistive temperature device (RTD), or other micro-sensor, is disposed within the internal cavity, the thin film RTD having a plurality of lead wires that extend through the plurality of internal passageways, and the thin film RTD being in contact with at least one wall of the internal cavity. The thin film RTD and the lead wires are secured within the housing by a thermal adhesive having a matched coefficient of thermal expansion with that of the housing and the thin film RTD substrate.
An assembly, for example an electrostatic chuck, is provided including a substrate, an electrostatic chuck, a heating plate, and a bond layer comprising a phosphorescent material. In one form, an optical sensor is disposed proximate the bond layer to detect a temperature of the bond layer in the field of view of the optical sensor. The phosphorescent material is illuminated and the subsequent decay is observed by the optical sensor. From this information, the temperature of the electrostatic chuck and substrate is determined and heating elements may be adjusted by a controller.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
98.
MOVABLE CONTACT SENSOR ASSEMBLY HAVING SEALED CONSTRUCTION
A sensor assembly includes a tubular housing having an inner surface defining an axial chamber and a temperature sensor disposed in the axial chamber and moveable along an axial direction of the tubular housing. The sensor assembly further includes a seal carrier movable with the temperature sensor, and a sealing member disposed around the seal carrier. The sealing member is in sliding contact with the inner surface of the tubular housing and hermetically seals an interface between the sealing member and the inner surface of the tubular housing.
An infrared thermographic inspection system (10) includes a heat source (12) configured to be removably attached to an exterior surface (28) of an object (26). A thermal imaging device (16) obtains a thermal image of the object (26), and an analyzing device (20) determines a location of a defect (24) in the object (26) based on the thermal image. The heat source (12) consists of a flexible polyimide heater (12) comprising a plurality of heating elements (42) which are independently controlled and the flexible heater can conform to the exterior surface (28) of the object (26).
A support assembly includes a first functional element, a second functional element adjacent to the cooling plate, and an adhesive layer disposed between the cooling plate and the substrate. An intermediate layer is disposed between the cooling plate and the substrate. The intermediate layer has a melting temperature less than a temperature that the adhesive layer melts or decomposes at in order to provide for recycling of the support assembly.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
patents
