A substrate storage container includes a container body configured to store a substrate, a lid that closes the opening of the container body, a retainer that is attached to the lid, and a substrate support portion formed in the retainer. The substrate support portion has an arc shape in a cross-sectional view from the top-to-bottom direction perpendicular to the closing direction of the lid. The substrate support portion includes a pair of left and right substrate support portions configured to hold the substrate together with the container body to retain the substrate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
An anticorrosion structure includes at least one of a metal bolt and a metal nut, and an anticorrosion member coating a portion, protruding beyond a connection surface, of a connecting part using at least one of the bolt and the nut, the anticorrosion member being formed of a silicone rubber obtained by curing a silicone rubber compound.
A substrate storage container includes a container body configured to store substrates, a lid that closes an opening of the container body, and a valve unit that controls the flow of gas to the container body. The valve unit includes an elastic valve having a valve opening that connects a first passage communicating with the outside of the container body to a second passage communicating with the inside of the container body, a holding member that holds the elastic valve, and a clamping cap that is inserted in the elastic valve and secures the elastic valve to the holding member. The valve opening is tightly closed by the elastic force of the elastic valve.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
F16K 15/14 - Check valves with flexible valve members
6.
DIFFUSED LIGHT CONTROL SHEET AND DIFFUSED LIGHT IRRADIATION DEVICE
A diffused light control sheet includes: a louver layer on which light-transmitting zones and light-shielding zones are arranged alternately; a transparent protective layer disposed on a first face of the louver layer; and a light-diffusing layer disposed on a second face of the louver layer, in which the light-diffusing layer has a haze of 93% or more as measured in accordance with JIS K 7136 (2000).
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
F21V 3/06 - Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
7.
A STORAGE CONTAINER AND MANUFACTURING METHOD OF THE SAME
A storage container with improved strength and airtightness, and a method for manufacturing the storage container are provided. The storage container includes, as a functional resin member, an insert component for a container body insert-molded with a molding material containing predetermined resin. The functional resin member is a side wall plate with support pieces. The side wall plate has a thick portion having at least a thickness of a side wall of the container body, and a thin joint portion formed around the thick portion, to be interposed into and joined to a peripheral wall of the container body. Most of the peripheral wall and the thin joint portion are engaged and joined to enlarge their contact area to eliminate a decrease of the mechanical strength and leakage around the peripheral edge of the side wall plate and prevent the peripheral wall from parting from the side wall plate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 25/10 - Devices to locate articles in containers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
8.
HEAT RADIATION STRUCTURE, AND BATTERY PROVIDED WITH SAME
A heat dissipation structure including a plurality of heat dissipating members, and a support plate for supporting the heat dissipating members. Each of the heat dissipating members includes a plurality of cushion members each having a hollow or a solid shape, and a heat conduction sheet covering an outer surface of the cushion members. The support plate includes a plurality of grooves for supporting the heat dissipating members in a direction orthogonal to a longitudinal direction of the heat dissipating members. Each of the grooves is a curved recess portion formed in a thickness direction, opened to the side of the heat dissipating member, formed to have a radius of curvature larger than a radius of curvature of the heat dissipating member, and to have a depth smaller than a circular conversion diameter of the heat dissipating member, and a battery provided with the heat dissipating structure.
H01M 10/6551 - Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
H01M 50/211 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for pouch cells
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
According to one embodiment, a substrate storage container comprises: a container body configured to store a substrate; a lid that closes a rectangular opening of the container body; and an annular gasket located between the container body and the lid. The container body has at least either one of a guide rib or a guide slit in an opening portion around the opening. The lid has at least either one of a guide slit or a guide rib that is engageable with the guide rib or the guide slit of the container body. The guide rib and the guide slit engage each other when the opening is closed with the lid and prevent the lid from tilting at a predetermined tilt angle or more with respect to an opening surface where the opening is formed.
There is provided a metal-clad laminate in which the transmission loss of electrical signals can be reduced, a finer pitch of a circuit pattern is possible, a high precision and fine circuit can be formed, and the close adhesiveness of the metal film is excellent. The metal-clad laminate includes a coating film and a metal film laminated on a base material film in this order, wherein the metal film is a metal film formed by at least any formation method of plating, sputtering, and vapor deposition, and a surface roughness (Rz) of the coating film is 1 μm or less.
Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.
National University Corporation Saitama University (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Matsuo, Rika
Noguchi, Hitoshi
Abstract
A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond; and a step of forming a modified layer 20, which includes a processing mark 21b of graphite and a crack 22b extending along a surface (111) around the processing mark 21b, along the surface (111) of the single crystal diamond at a predetermined depth from an upper surface of the block by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally.
National University Corporation Saitama University (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Matsuo, Rika
Noguchi, Hitoshi
Abstract
A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond, a step of forming a modified layer 20, which includes a processing mark 21 of graphite and a crack 22b extending along a surface (111) around the processing mark 21, in a partial region of the upper surface 10a of the block 10 along the surface (111) of the single crystal diamond, along the surface (111) of the single crystal diamond at a predetermined depth from the upper surface 10a of the block 10 by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally, and a step of forming a cleavage plane 25 at the predetermined depth of the remaining region of the upper surface 10a of the block 10 by spontaneously propagating cleavage from the modified layer 20.
C30B 33/04 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
B23K 26/40 - Removing material taking account of the properties of the material involved
C04B 41/00 - After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
C04B 41/91 - After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
According to one embodiment, a substrate storage container includes a transport component configured to be mountable to a container body by being relatively displaced with respect to the container body from the rear side to the front side. The container body has a container body-side protrusion protruding upward. The transport component has a transport component-side protrusion protruding downward. In a mounted state, the transport component-side protrusion is engaged with the front side of the container body-side protrusion to be restricted from being displaced backwards. When a predetermined load is applied to the transport component-side protrusion upwardly, the transport component-side protrusion is displaced by a smaller amount than the container body-side protrusion displaced when the predetermined load is applied to the container body-side protrusion downwardly.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate storage container includes: an opening on a front surface side; and a gas supply mechanism on a bottom surface. The gas supply mechanism has: an introduction path configured to receive a gas from a bottom surface side; a check valve disposed at a position that does not overlap with the introduction path in a horizontal plane along the bottom surface; and a flow path configured to supply the gas from the introduction path to the check valve.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
B08B 9/093 - Cleaning of containers, e.g. tanks by the force of jets or sprays
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A multilayer sheet disposed at least between a plurality of heat sources and capable of conducting heat from the heat sources includes: a rubber sheet made of a rubber-like elastic body; heat insulating sheets laminated on both surfaces of the rubber sheet and capable of reducing heat conduction between the plurality of adjacent heat sources; and first heat conductive sheets laminated outside the heat insulating sheets in a separated manner and having more excellent heat conductivity than the rubber sheet and the heat insulating sheets, in which the heat insulating sheets have a bag shape wrapping the rubber sheet, and a cell unit including the multilayer sheet.
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
A substrate storage container includes: a container body configured to store a substrate; a lid configured to close an opening formed on the front side of the container body; and a retainer arranged on the back of the lid and configured to restrict the substrate from moving to the front side. The retainer includes an integration of: a frame configured to be detachably attached to the back of the lid; a contact portion including a convex portion configured to contact the substrate and restrict the substrate from moving to the front side; and a beam structure that connects the frame and the contact portion. The contact portion and the beam structure are configured to be spaced apart from the lid.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
18.
HEAT DISSIPATING STRUCTURE AND BATTERY PROVIDED WITH THE SAME
In a heat, dissipating structure, a plurality of heat dissipating members for a heat source are connected. Each heat dissipating member has a heat conduction sheet that extends while winding in a spiral shape for conducting the heat from the heat source; a cushion member which is provided on an annular rear side of the heat conduction sheet and can be more easily deformed corresponding to the outer surface shape of the heat source than the heat conduction sheet; an adhesive layer that fixes the heat conduction sheet and the cushion member and is more easily deformed than the heat conduction sheet; and a through passage penetrating in the direction in which the heat conduction sheet extends while being wound. The heat dissipating members are connected by connection members in a state of being aligned perpendicular to the direction in which the heat conduction sheet extends while being wound.
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
A heat dissipation structure for a battery includes a plurality of heat dissipation members. The heat dissipation members are each provided with: a heat conductive sheet having a shape that extends while winding in a spiral shape for transferring the heat from the heat source, a cushion member which is provided on an annular rear surface of the heat conductive sheet and can be more easily deformed to conform to the outer surface shape of the heat source than the heat conductive sheet, and a penetration path penetrating in the direction in which the heat conductive sheet extends while winding. The plurality of heat dissipation members is connected to each other by connection members in a state of being aligned in a direction perpendicular to the direction in which the beat conductive sheet extends while winding.
H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
A conductive polymer dispersion of this disclosure includes: a conductive composite containing a π-conjugated conductive polymer and a polyanion; an isocyanurate-based compound; and a dispersion medium for dispersing the conductive composite.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
C09D 175/12 - Polyurethanes from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group
21.
Heat dissipating device for batteries or electric devices
A light control filter includes a sheet having a sea-island structure including a light-transmitting portion and a light-shielding portion, wherein the light-transmitting portion and the light-shielding portion each extend from a first principal surface to a second principal surface, wherein any one of the light-transmitting portion and the light-shielding portion forms a plurality of island portions configured to penetrate through the sheet from the first principal surface to the second principal surface, and another of the light-transmitting portion and the light-shielding portion forms a sea portion configured to separate the plurality of island portions from one another, and wherein the sea portion has an MD-1 rubber hardness of 25 or more and 80 or less.
In a pressure-sensitive touch sensor of a capacitance type, a first electrode and a second electrode are provided on a first surface of a base material sheet. The base material sheet is folded between the first electrode and the second electrode so that a surface of the first electrode and a surface of the second electrode face each other. The base material sheet is folded at a fold line portion in which a slit is formed. An elastic layer is provided between folded parts of the base material sheet. The pressure-sensitive touch sensor is configured to detect pressing on the operation surface based on a change in capacitance, which is caused when the elastic layer is compressed and deformed in a thickness direction by a pressing force to reduce a distance between the first electrode and the second electrode.
G01D 5/241 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
The sealability against interior positive pressure is ensured, while reducing particles generated by friction in opening and closing a lid. Disclosed is a substrate storage container, including: a container body configured to store at least one substrate; and a lid configured to close an opening of the container body. In the substrate storage container, a first part of the container body, the first part being provided around the opening, is non-contact at least partially with a second part of the lid, the second part being opposed to the first part; and the first part and the second part cooperatively form a labyrinth seal structure.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate storage container is provided with a valve body attached thereto which includes a first cylindrical portion having one end communicating with the outside of a container body, a second cylindrical portion having one end communicating with the interior of the container body and spaced apart from the other end of the first cylindrical portion, a plug member positioned between the other end of the first cylindrical portion and the other end of the second cylindrical portion, and an elastic body that covers at least the plug member and has an inner diameter equal to or smaller than the outer diameter of the plug member, and wherein gas flow to the container body is controlled by close contact between the plug member and the elastic body.
F16K 17/18 - Safety valves; Equalising valves opening on surplus pressure on either side
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
F16K 7/02 - Diaphragm cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage with tubular diaphragm
F16K 15/02 - Check valves with guided rigid valve members
26.
Electrical connector and method for producing same
Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 33/94 - Holders formed as intermediate parts for linking a counter-part to a coupling part
B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
H01R 43/18 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 13/24 - Contacts for co-operating by abutting resiliently mounted
H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
Provided is a panel storage container that can suppress flexure of the middle portions of the panels. A panel storage container has: a container body for storing panels; and a panel support means for supporting the panels. The panel support means has: a panel support portion for supporting right and left edges of the panels; a central support portion for supporting each middle portion of the panels; and elastic bodies for contacting the panels, the elastic bodies being provided along a front and rear direction of the central support portion at a predetermined interval.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 25/10 - Devices to locate articles in containers
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
28.
Substrate storage container with umbrella-shaped seal lip
Corrosion resistance of valves is enhanced, while ensuring the check valve function of the valves against an inflow of outside air. Disclosed is a substrate storage container that includes: a container body for storing at least one substrate; a lid for closing an opening of the container body; and at least one valve for controlling gas flow to the container body or from the container body. The at least one valve includes an elastic, non-metallic seal lip in a communication passage that extends in a first direction and communicates between an outside of the container body and an inside of the container body. The seal lip has an umbrella-like form which closes on one side in the first direction and opens on the other side in the first direction, the seal lip abutting an inner peripheral wall of the communication passage on the other side.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a substrate storage container including a valve(s) capable of controlling flow of gas without using a metallic member. The valve(s) are attached to a substrate storage container and include: a cylindrical body having an open edge and an interior space; a stopcock portion partitioning the interior space into a first space and a second space and extending to the open edge; and an elastic body covering the open edge and the stopcock portion. The first space has a first communication hole communicating with an outside of the container body. The second space has a second communication hole communicating with an inside of the container body. The elastic body controls flow of gas relative to the container body by closely contacting the stopcock portion or separating from the stopcock portion.
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 81/20 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
30.
Substrate storage container and method of manufacturing the same
There is provided a substrate storage container 1 capable of suppressing deformation of a functional member insert-molded and a method of manufacturing the container 1, and an device positioning member 4 as the functional member including: an attachment part 41 having a thick section 413 formed in thickness equal to a wall member of a container body 10 or a lid 20 and a thin section 410 decreasing in thickness as it approaches toward an outer edge from the thick section 413; and a body part 42 coupled to the attachment part 41, the device positioning member 4 being disposed on the container body 10 or the lid 20 so that a first surface 420 of the thick section 413 is flush with an inner surface of the wall member.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
31.
Electric connector and method for manufacturing the same
An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 μm.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 7/22 - Metal wires or tapes, e.g. made of steel
H01R 13/405 - Securing in non-demountable manner, e.g. moulding, riveting
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
A substrate storage container includes a container main body having an opening at the front, a support portion for supporting a substrate in the interior thereof, and a substrate receiving portion positioned more toward a rear wall than the support portion, an a lid on which a substrate pressing portion for pressing the substrate is formed. The substrate receiving portion and the substrate pressing portion are present within a range of greater than or equal to 0 mm and less than or equal to 80 mm in the horizontal direction from a vertical center line that passes through the center of the container main body when the lid is viewed from the front.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The present disclosure provides a substrate storage container equipped with a container main body that has an opening portion formed by an opening frame at a front surface and is capable of storing a plurality of substrates and a lid that closes the opening portion. The container main body is of a box-like shape having the opening frame, a rear wall, a right wall, a left wall, a top wall, and a bottom wall. Each of the walls has a thickness which is thinner at a side toward the opening frame at the front surface than at a side toward the rear wall.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
34.
Heat dissipating structure and battery provided with the same
A heat dissipating structure for a battery includes a plurality of heat dissipating members connected for enhancing heat dissipation from a heat source and a fixation member. The heat dissipating member includes a spirally winding shaped heat conduction sheet for conducting heat from the heat source, a cushion member that is provided on an annular back surface of the heat conduction sheet, and deformable following a surface shape of the heat source more easily than the heat conduction sheet, and a through passage penetrating in a winding direction of the heat conduction sheet. The fixation member fixes the heat dissipating members orthogonally arranged to a longitudinal direction thereof. The fixation member fixes at least each one end of the heat dissipating members in the longitudinal direction.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/6551 - Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Abstract
An etching method for etching a substrate using a molten alkali, wherein, while an oxide coating is formed on the surface of the substrate PL to be etched in a high-temperature oxygen-containing environment, the surface to be etched is isotropically etched to remove the oxide coating using a molten alkali AL brought into a prescribed high-temperature range.
NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Matsuo, Rika
Abstract
A method for manufacturing a peeled substrate has a laser condensing step for focusing laser light at a prescribed depth from the surface of a substrate and a positioning step for moving and positioning a laser condenser relative to the substrate, the method involving forming a processed layer in the substrate. The laser condensing step includes a laser light adjustment step in which a diffraction optical element is used to branch the laser light into a plurality of branched laser beams, and at least one of the branched laser beams is branched such that the intensity thereof differs from the other branched laser beams. The processed layer is elongated using the branched laser beam having a relatively high intensity among the plurality of branched laser beams to process the substrate, and the elongation of the processed layer is restrained using the branched laser beams having a relatively low intensity.
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
C30B 33/04 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
A substrate storage container comprises a container body that stores substrates, a lid that closes an opening of the container body, locking mechanisms provided on the lid and locking with the locking portions of the container body, and packing interposed between the container body and the lid, wherein the packing includes a first packing attached to the container body and a second packing attached to the lid, and wherein the first packing and the second packing are located inside the container body from positions of the locking portions when viewed from the direction orthogonal to the closing direction of the lid. As a result, a substrate storage container with improved internal cleanliness can be provided while also improving the sealability with respect to internal negative pressure and positive pressure.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
38.
Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film
A conductive polymer dispersion of this disclosure includes: a conductive composite containing a n-conjugated conductive polymer and a polyanion; an isocyanurate-based compound; and a dispersion medium for dispersing the conductive composite.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
C09D 175/12 - Polyurethanes from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group
A substrate storage container includes an annular packing provided between a container body for storing substrates and a lid. The container body has a seal surface which is in contact with the packing. The lid is provided with an attachment groove for attaching the packing. The packing is formed of a main body fitted in the attachment groove and an extended piece extending from the main body. The extended piece has a protrusion protruding toward the lid in the closing direction of the lid. A seal portion is located at an end beyond the protrusion. The seal portion is inverted to a side of the seal surface and a side of the main body and comes into contact with the seal surface.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
F16J 15/10 - Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
40.
Electrical connector with an elastic body having carbon nanotubes and method for manufacturing same
Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including: an elastic body having a plurality of through holes each being opened on a first surface and a second surface; and one or more carbon nanotube yarns joined to each of the through holes.
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
H01R 13/24 - Contacts for co-operating by abutting resiliently mounted
H01R 43/18 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 12/00 - Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, ; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
A substrate storage container comprises a container body capable of containing a plurality of substrates, and an air supply member capable of supplying gas from outside of the container body to an internal space, wherein for the substrate storage container the container body is formed in a front open box and the air supply member is attached to the bottom surface, and wherein a functional unit that changes the environment of the internal space to different states are connected with the air supply member so as to be able to be exchanged.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
F16K 27/02 - Construction of housings; Use of materials therefor of lift valves
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A push-button switch member includes: a movable contact and an operation key disposed facing the protruding side thereof, and in contact therewith or spaced therefrom. The movable contact includes: an upper contact portion disposed directly under a key body; an outer fixed portion in the upper contact portion or more outward therefrom in the radial direction, and fixed more outward in the radial direction than the key body; and a non-contacting outer portion provided more outward in the radial direction than the upper contact portion, and disposed to face in a non-contacting state another contact so as to be able to contact another contact which is disposed on an outer side in the radial direction and contacted by the upper contact portion when pushed by the key body. The non-contacting outer portion has a bottom portion for a line contact or a surface contact with another contact.
H01H 13/70 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
H01H 13/79 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the form of the contacts, e.g. interspersed fingers or helical networks
43.
Substrate storage container and gas replacement unit
A substrate storage container and a gas replacement unit capable of reducing variations in humidity or concentration of gas in a space above a substrate are provided. The substrate storage container comprises a container body having an opening and is capable of containing substrates, a lid, at least one intake valve for supplying gas to the inside of the container body, and at least one gas replacement unit which blows out the supplied gas wherein the at least one intake valve is attached to the back, bottom surface of the container body. The gas replacement unit includes a housing member and a cover member. The housing member has a plurality of first group blowout holes in the vertical direction, and the opening area of the top first group blowout hole is larger than the opening area of the second of the first group blowout holes.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
44.
Adhesive substrate and method for separating an object from an adhesive substrate
An adhesive substrate is disclosed, which includes a base substrate and a heat-resistant elastomer layer formed on the base substrate, wherein the base substrate is flexible and has a thickness of 0.2 mm or more and 2 mm or less, wherein the adhesive substrate is used as part of a method for physically separating an object that has been held immovable in such a manner that the object has been adhered to by the heat-resistant elastomer layer and the object is anchored from the upper side, and wherein by starting to physically separate the end portion of the adhesive substrate downward the object is able to be separated.
In a contact member, a mesh-like contact including one or more layers of a metal other than a noble metal is embedded in such a manner as to be exposed from one of the surfaces of a rubbery elastic body. The contact member includes a highly conductive metal coat layer only in the regions of the mesh-like contact which are exposed from the rubbery elastic body, the coat layer having conductivity higher than that of the metal on the outermost surfaces of the mesh-like contact.
NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Noguchi, Hitoshi
Abstract
A substrate manufacturing method capable of easily obtaining a thin magnesium oxide single crystal substrate is provided. A first step is performed which disposes a condenser for condensing a laser beam on an irradiated surface of a magnesium oxide single crystal member in a non-contact manner. A second step is performed which forms processing mark lines in parallel by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substrate relative to each other in a two-dimensional manner. A third step is performed which forms new processing mark lines between the adjacent irradiation lines in the second step to allow planar separation, by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substrate 20 relative to each other in a two-dimensional manner.
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B23K 26/08 - Devices involving relative movement between laser beam and workpiece
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
There is provided a heat dissipation structure adaptable to various forms of a heat source, light in weight, and excellent in heat dissipation efficiency, and a battery provided with the heat dissipation structure. The present invention relates to a heat dissipation structure for enhancing heat dissipation from a heat source, including: a heat conduction sheet in a spirally wound shape for conducting heat from the heat source; a cushion member provided on an annular back surface of the heat conduction sheet, and easily deformed corresponding to a surface shape of the heat source compared to the heat conduction sheet; and a through passage penetrating in a direction in which the heat conduction sheet in the wound shape runs, and a battery provided with the same.
H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
H01M 10/6557 - Solid parts with flow channel passages or pipes for heat exchange arranged between the cells
H01M 2/10 - Mountings; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
48.
Heat dissipating structure and battery comprising the same
Provided are a heat dissipating structure that deforms to detachably come close contact with the battery cells, is disposed between the battery cells and a cooling member in order to reduce a risk of leakage of liquid inside the battery cells, and is excellent in heat dissipating property, and a battery including the heat dissipating structure. The present invention relates to a heat dissipating structure that is provided between battery cells and a cooling member, conducts heat from the battery cells to the cooling member to promote heat dissipation from the battery cells, and includes holding members detachably holding end parts of the respective battery cells, and to a battery including the heat dissipation structure.
A substrate storage container with increased mounting force of the conveyance component is provided. The substrate storage container comprises a container body having an opening closed by a lid and capable of storing a plurality of substrates, and a conveyance component detachably attached to the container body via a mounting mechanism, wherein the mounting mechanism includes at least one first mounting portion on the opening side of the container body and at least one second mounting portion on the side away from the opening. Furthermore, the conveyance component has at least one engaging portion to be engaged with the mounting mechanism, and the at least one engaging portion includes at least one first engaging portions displaced and engaged in a predetermined direction and at least one second engaging portion displaced and engaged in a direction different from the predetermined direction.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
50.
Substrate storage container and gas replacement unit
A substrate storage container and gas replacement units are provided in which variations in humidity or concentration in an internal space are small. This is achieved by providing a container body capable of housing substrates, at least one intake valve for supplying an external gas to the internal space of the container body, and gas replacement units for blowing the supplied gas into the internal space of the container body. The container body is formed in an open front box, the intake valve is attached at the back of the bottom surface of the container, the gas replacement units each include a housing member and a cover member, each housing member has a plurality of first blowout holes for blowing the stored gas in one direction, and each cover member has a plurality of second blowout holes for blowing in a direction substantially opposite direction.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A capacitive three-dimensional sensor includes: a light-guide unit having a side surface and an operation surface, the side surface being formed along the Z direction and including a light entering portion, through which light from a light source enters, the operation surface being configured to input the inputs and including a light output portion, from which the light exits; a sheet-like X-Y electrode body configured to sense the inputs in the plane X and Y directions; a deformable body including a sheet-like elastic body; and a sheet-like Z electrode body configured to sense the input in the Z direction. The light-guide unit includes an optional decorative sheet, and a light-guide sheet to guide the light that has entered the light-guide unit from the side surface and output the light toward the light output portion. A total of bending stiffnesses of the light-guide sheet and decorative sheet is less than 256.
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
G06F 3/0354 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
52.
Conductive polymer dispersion, conductive film and method of manufacturing the same, and antistatic container and method of manufacturing the same
Provided is a conductive polymer dispersion, including: a conductive composite containing a π-conjugated conductive polymer and a polyanion; a vinyl versatate polymer; and a dispersion medium.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
B65D 65/38 - Packaging materials of special type or form
C09D 129/10 - Homopolymers or copolymers of unsaturated ethers
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
B05D 3/14 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
B29C 51/10 - Forming by pressure difference, e.g. vacuum
B29K 31/00 - Use of polyvinylesters as moulding material
The present invention provides a sponge roller comprising a shaft body and an elastic layer formed on an outer peripheral surface of the shaft body, wherein the elastic layer is formed of a millable silicone rubber, unexpanded microballoon cells and chemical blowing agent cells, and an image forming apparatus comprising the sponge roller. The sponge roller has high durability, excellent surface smoothness and small permanent compression set.
C08J 9/32 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
F16C 13/00 - Rolls, drums, discs, or the like; Bearings or mountings therefor
C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
G03G 15/16 - Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern
G03G 21/00 - Arrangements not provided for by groups , e.g. cleaning, elimination of residual charge
G03G 15/20 - Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
G03G 15/02 - Apparatus for electrographic processes using a charge pattern for laying down a uniform charge, e.g. for sensitising; Corona discharge devices
G03G 15/08 - Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
C08J 9/10 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen
54.
Conductive polymer dispersion and method for preparing same, and method for manufacturing conductive film
A conductive polymer dispersion of this disclosure includes: a conductive composite containing a π-conjugated conductive polymer and a polyanion; an isocyanurate-based compound; and a dispersion medium for dispersing the conductive composite.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
C09D 175/12 - Polyurethanes from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group
55.
Conductive polymer solution, capacitor, and method for producing the capacitor
[Object] To provide a conductive polymer solution capable of forming a capacitor having a large capacitance, low ESR, and excellent long-term reliability without using treatment solutions for conductive polymer layer formation differing in composition, and without forming an inside conductive polymer layer by different approaches, the capacitor and a method for producing the capacitor
[Solution] The present invention relates to: a conductive polymer solution which comprises a conductive polymer and a solvent, wherein the conductive polymer comprises a pi-conjugated conductive polymer, a polyanion with which the pi-conjugated conductive polymer has been doped, and a compound formed by reacting an oxirane or oxetane group with an anion making no contribution to the dope in the polyanion, and the solution has a pH in the range of 2.0 to 6.0; a capacitor which includes either the conductive polymer solution or the compounds remaining after removal of the solvent from the solution; and a method for producing a capacitor, comprising impregnating the capacitor with the conductive polymer solution and removing the solvent therefrom.
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY (Japan)
SHIN-ETSU CHEMICAL CO., LTD. (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Noguchi, Hitoshi
Abstract
r of a magnesium oxide single crystal substrate 20 to be irradiated; and a second step of irradiating a laser beam to a surface of the magnesium oxide single crystal substrate 20 and condensing the laser beam into an inner portion of the single crystal member under designated irradiation conditions using the condenser, and at a same time, two-dimensionally moving the condenser and the magnesium oxide single crystal substrate 20 relatively to each other, and sequentially forming processing marks to sequentially allow planar peeling.
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
[Problem] To form, by using a conductive composition capable of being stably dispersed and solubilized in a solvent consisting mainly of an organic solvent, a silicone film having excellent conductivity and having few problems originating from amine compounds, such as problems wherein an addition-type silicone does not set easily.
[Solution] The present invention relates to: an addition-curable antistatic organopolysiloxane composition that includes (a) a π-conjugated conductive polymer, (b) a polyanion, (c) a compound represented by chemical formula (1), and (d) an addition-curable organopolysiloxane composition; and an antistatic silicone film formed by supplying the addition-curable antistatic organopolysiloxane composition onto a substrate and curing.
(R represents a functional group having an unsaturated bond).
C08L 49/00 - Compositions of homopolymers or copolymers of compounds having one or more carbon-to-carbon triple bonds; Compositions of derivatives of such polymers
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
A pushbutton switch includes: a dome-shaped movable contact; and an operation key on a side of the movable contact. Pushing the operation key causes the movable contact to electrically connect at least two contacts. The operation key includes: a key body; a dome connected with an exterior of the key body and deformable by pushing the key body; a foot connected with an exterior of the dome; and a protrusion on top of the key body, protruding from the top, and deformable by compression. The movable contact includes: an upper contact in contact with a site below the key body and contacting the at least two contacts when the key body is pushed; and an outer fixing part at the upper contact in a radial direction and fixed outside of the key body of the operation key in the radial direction.
H01H 13/02 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch - Details
H01H 13/52 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell push switch
H01H 13/66 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member wherein the switch has more than two electrically distinguishable positions, e.g. multi-position push-button switches the operating member having only two positions
A pushbutton switch member has a dome-shaped movable contact and an operation key facing and separated from a movable contact. Pushing the operation key toward the movable contact causes the movable contact to electrically connect at least two contacts on a substrate. The operation key is provided with: a key; a dome connected with an outer periphery of the key, and deformable by pushing of the key toward the substrate; and a foot connected with an outer periphery of the dome, and fixed on the substrate. The movable contact is provided with: an upper contact spaced apart from a site directly below the key, and which makes contact with a contact when the key is pushed in; and an outer fixing part disposed at the upper contact, or further outside thereof in the radial direction, and fixed outside of the key in the radial direction.
H01H 13/02 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch - Details
H01H 13/26 - Snap-action arrangements depending upon deformation of elastic members
H01H 13/48 - Snap-action arrangements depending upon deformation of elastic members using buckling of disc springs
H01H 13/52 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell push switch
H01H 13/66 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member wherein the switch has more than two electrically distinguishable positions, e.g. multi-position push-button switches the operating member having only two positions
60.
Method of producing amine adduct of conductive composite, method of producing amine adduct liquid of conductive composite, and method of producing conductive film
Provided is a method of producing an amine adduct of a conductive composite, including: adding an amine compound to a conductive polymer dispersion liquid which contains water and a conductive composite containing a π conjugated conductive polymer and a polyanion at a mass ratio of the π conjugated conductive polymer to the polyanion of 1:3 to 1:7.5 to precipitate an amine adduct of the conductive composite.
C09D 125/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C08J 3/03 - Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
C08G 75/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon
C08F 112/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 28/06 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur by a heterocyclic ring containing sulfur
[Problem] To reduce a sliding trace in a vicinity of a substrate end surface, while maintaining smooth vertical movement of a substrate in a groove of the holding section in a substrate storage container, said sliding trace being made with the holding section.
a) of the first holding section (12) is configured from an alloy resin having a polycarbonate resin and a polybutylene terephthalate resin as main components.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
G03F 1/66 - Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
62.
Coating material for forming conductive release layer, method for producing same, conductive release film, and method for producing same
Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
H01B 3/42 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes polyacetals
C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
C09D 167/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
C09D 167/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
C09D 181/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Coating compositions based on polysulfones; Coating compositions based on derivatives of such polymers
C09D 141/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic rin; Coating compositions based on derivatives of such polymers
C09J 167/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
C09J 181/00 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
C09J 125/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
C09J 167/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
C08K 5/3467 - Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 5/08 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
The substrate storage container includes a container main body, an air feed valve, and an air replacement unit. The container main body is formed in a front open box form with the air feed valve attached to the rear of the bottom plate. The air replacement unit includes a housing and a cover that covers the open front of the housing. The bottom of the housing is connected to the air feed valve so as to flow the purge gas while the housing is supported at the upper portion thereof by a rear wall of the container main body. Either the housing or the cover is formed with a plurality of blow holes for blowing the purge gas toward the front of the container main body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A switch apparatus has a pressing section that is formed of a rubber-like elastic material and has a pressing region that is pressed in a predetermined pressing direction; and a capacitance sensor for detecting the pressing of the pressing region on the basis of capacitance. The capacitance sensor is positioned apart from the pressing section in the pressing direction, and is configured so that when the pressing region is not being pressed, a space (clearance) is maintained between the part (the lowermost surface of a protruding section of the pressing section on the side towards the capacitance sensor corresponding to the pressing region and another member (base housing disposed in the vicinity of the pressing region along the pressing direction, the space (clearance) allowing the part on the side towards the capacitance sensor to move in the pressing direction.
H03K 17/975 - Switches controlled by moving an element forming part of the switch using a capacitive movable element
H01H 13/702 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
A method for producing an antistatic molded article according to the present invention includes: a conductive film preparation step to obtain a conductive film by coating, and drying, a conductive polymer dispersion liquid containing a conductive composite that contains a π-conjugated conductive polymer and a polyanion, a polyvinyl alcohol, a binder component, and a dispersion medium for dispersing the conductive composite on at least one surface of a film substrate; and a molding step for subjecting the conductive film to molding.
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
66.
Electrically conductive polymer dispersion and electrically conductive coating film
A conductive polymer dispersion is provided which is capable of easily forming a conductive coating film having both excellent water resistance and excellent solvent resistance.
The conductive polymer dispersion of the present invention includes a π-conjugated conductive polymer, a polyanion, a polyester resin having an alkali metal salt of an acid group, and a glycidyl group-containing acrylic resin. In the conductive polymer dispersion, the ratio (α/β) of total mass α of the polyester resin and the glycidyl group-containing acrylic resin to total mass β of the π-conjugated conductive polymer and the polyanion is in a range of 6.90 to 62.5.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
C09D 167/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
A transparent electrode capacitance sensor includes a transparent resin substrate; at least one transparent electrode formed on the transparent resin substrate; a pseudo auxiliary electrode formed in at least a portion of an outer periphery of the transparent electrode; and a lead wire connected to the pseudo auxiliary electrode, wherein the pseudo auxiliary electrode is thicker than the transparent electrode, and includes the same material as the transparent electrode.
G06F 3/045 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
G01R 27/00 - Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
The lateral substrate support part has: a plurality of plate parts, which have a parallel positional relationship, and support end portions of a plurality of substrates; and a plate-part support part, which supports the plate part, and is fixed to a side wall. The plate-part support part has: a groove-forming portion having a groove formed therein, said groove linearly extending over the whole plate parts in the direction intersecting the plate parts; a protrusion, which is formed in the groove, and which protrudes such that the protrusion reduces the width of the groove in the direction orthogonal to the direction in which the groove extends; and a positioned part that is formed at a center portion of the groove in the direction in which the groove extends.
B65D 85/00 - Containers, packaging elements or packages, specially adapted for particular articles or materials
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The bottom plate has a plate-like shape, is arranged to face an outer face of a lower wall, and has a locking portion. The groove member has: a groove-forming portion having a groove opening downward formed therein, a surrounding wall portion, which is connected to the groove-forming portion, and is arranged around the groove-forming portion; and a locked portion, which is connected to the surrounding wall portion, is elastically deformable, and is locked by way of the locking portion of the bottom plate by being elastically deformed. The groove member is supported and fixed by way of the lower wall and the bottom plate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A handling member includes: a substantially plate-like handling member main body that is arranged along a pair of the side walls, respectively; a circular position-restriction through hole that is formed to extend through the handling member main body in a thickness direction of the handling member and with which the semicircular convex portion can be engaged; a handling member side guided portion that is engaged with the guide members and of which a movement is guided between the mounting position and the detachment position by the guide members; and a back-side guided portion that can be engaged with the back-side engaging portion by a movement of the handling member from the detachment position to the mounting position.
H01L 23/04 - Containers; Seals characterised by the shape
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
71.
Electroconductive polymer dispersion liquid and electroconductive coating
The present invention relates to an electroconductive polymer dispersion liquid characterized in containing a π-conjugated electrically conductive polymer, a polyanion, a compound represented by the following chemical formula (1), and a dispersion medium. In accordance with the present invention, an electroconductive polymer dispersion liquid capable of readily forming an electroconductive coating having excellent electrical conductivity, heat resistance, moist-heat resistance, and substrate adhesion property can be provided.
3 (1)
4 represents a methyl group or an ethyl group.
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C08K 5/5455 - Silicon-containing compounds containing nitrogen containing at least one group
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
A method of manufacturing an antistatic film includes a preparation step of preparing a mixed liquid by mixing a polyvinyl alcohol with an aqueous conductive polymer dispersion in which a conductive composite containing a π-conjugated conductive polymer and a polyanion is included in a water-based dispersion medium; a coating step of obtaining a coating film by coating at least one surface of a film base with the mixed liquid; and a drying and stretching step of drying and stretching the coating film with heating.
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
73.
Conductive composition, conductive composition production method, anti-static resin composition and antistatic resin film
A transparent conductive film with fewer problems originating from amine compounds is provided using a conductive composition stably and pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent. This invention relates to: a conductive composition which is pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent and which contains (a) a π-conjugated conductive polymer, (b) polyanions doping the π-conjugated conductive polymer (a), and (c) a reaction product of those anions of the polyanions (b) that were not needed for doping, and an oxirane group- and/or oxetane group-containing organic compound; a production method of said conductive composition; an anti-static resin composition formed by mixing said conductive composition and a resin solution dissolved in an organic solvent; and antistatic resin film formed by curing said antistatic resin composition.
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
The invention relates to a composition for an antistatic release agent comprising: a release component, a conductive component, an organic solvent, and water, wherein the release component contains a condensation-type organopolysiloxane, the conductive component contains a complex with a π-conjugated electrically conductive polymer and a polyanion having a molecular weight of 20,000 to 900,000, an amount of the conductive component is 1 to 300 parts by mass, relative to 100 parts by mass of the release component, at least one amine compound selected from the group consisting of a secondary amine, a tertiary amine or a quaternary ammonium salt is coordinated to or bonded to portion of anion groups in the polyanion as an ion pair, and the water content is 5% by mass or less, relative to a total amount of the composition for an antistatic release agent. The present invention can provide a composition for an antistatic release agent containing a release component, which can be sufficiently cured, and having superior antistatic properties and release properties.
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
C09D 141/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic rin; Coating compositions based on derivatives of such polymers
The substrate storage container includes: a container body for storing a semiconductor wafer; a lid body for opening and closing a front of the container body; and a locking mechanism for locking the lid body that has closed the front of the container body. The lid body is formed of a lid main body to be fitted to the front of the container body and a cover plate for covering a front face of the lid main body. The locking mechanism includes a rotating operation portion that is pivotally supported by the lid main body and rotationally operated from an outside of the cover plate. A plurality of posture control members for the rotating operation portions are provided for, at least, the cover plate, among the cover plate and the rotating operation portion.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 43/22 - Devices for holding in closed position, e.g. clips
The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
78.
Antistatic release agent and antistatic release film
The invention relates to an antistatic release agent comprising: a release component that contains a condensation-curing type organopolysiloxane, a conductive component that contains a complex of a π-conjugated electrically conductive polymer and a polyanion and an organic solvent, wherein the amount of the conductive component relative to 100 parts by mass of the release component is 1 to 300 parts by mass, at least one amine-type compound selected from the group consisting of a secondary amine, a tertiary amine or a quaternary ammonium salt is coordinated to or bonded to portion of anion groups in the polyanion as an ion pair, and the amine-type compound has one or more substituent selected from the group consisting of an alkyl group having 4 or more carbon atoms, an aryl group, an aralkyl group, an alkylene group, an arylene group, an aralkylene group and an oxyalkylene group.
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
C09D 141/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic rin; Coating compositions based on derivatives of such polymers
The present invention is a conductive polymer composition containing a π-conjugated conductive polymer, a polyanion, and a gemini surfactant. There can be provided a conductive polymer composition that has excellent antistatic performance and excellent application properties, does not adversely affect a resist, and can be suitably used in lithography using electron beam or the like.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
G03F 7/09 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
To provide a substrate storage container capable of keeping low a relative humidity in an internal closed space for a long period of time even after purging, a substrate storage container including a constitutive material, which includes a shell body, a door and an on-off valve, defining the internal closed space, the constitutive material being formed of a specific constitutive material having a water absorption of 0.1 wt. % or less when immersed in water at 23 degree C. for 24 hours, and thereby, an actual requirement is objectively satisfied in terms of water release suppression ability under JIS K 7209 or ISO 62 to significantly suppress releasing of water into the internal closed space 3 through the shell body, the door and the on-off valve.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
81.
Electromagnetic shielding film, flexible printed wiring board with electromagnetic shielding film, electronic device and method for forming the same
A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.
Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
As a permeable membrane of an air conditioning system that performs as supply to a space to be air conditioned through the permeable membrane and/or gas discharge from the space to be air conditioned through the permeable membrane, an asymmetric membrane is used. The asymmetric membrane is made of a cyclic olefin addition polymer obtained by addition polymerization of a cyclic olefin functionality siloxane, or by addition polymerization of the cyclic olefin functionality siloxane and a cyclic olefin compound, and in which a rate of a structural unit derived from the cyclic olefin functionality siloxane is 5 to 100 mol % of the addition polymer, and a number average molecular weight (Mn) is 10,000 to 2,000,000 in terms of polystyrene conversion measured by a GPC using tetrahydrofuran as a solvent.
B01D 53/22 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by diffusion
B01D 67/00 - Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
B01D 71/64 - Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
B01D 69/02 - Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor characterised by their properties
C08L 45/00 - Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
F24F 3/14 - Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by dehumidification
A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
85.
Antistatic release agent, antistatic release coated film and antistatic release base material
The present invention relates to an antistatic release agent comprising an aqueous solution of an electrically conductive polymer complex composed of a π-conjugated electrically conductive polymer and a polyanion having an anionic group in a molecule thereof, an alkaline compound, a silicone emulsion and a dispersion medium, wherein the alkaline compound is at least one type of compound selected from the group consisting of an inorganic alkali, as amine compound and a nitrogen-containing aromatic cyclic compound, the content of the alkaline compound in the antistatic release agent is 0.7 times or more relative to the number of moles of the neutralization equivalent of the electrically conductive polymer complex, and the pH of the antistatic release agent at 25° C. is 10 or lower. The present invention can provide an antistatic release agent having superior storage stability for forming an antistatic release coated film.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.
G01R 27/26 - Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants
G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
87.
Developing roller, developing apparatus, and image-forming device
Provided are a developing roller having an elastic layer formed on an outer circumferential face of a shaft and a coating layer formed on an outer circumferential face of the elastic layer, wherein the coating layer is composed of first coating layers that are formed at respective edges across the elastic layer, and a second coating layer formed between the first coating layers, and wherein the first coating layers contain a resin obtained through a reaction of a polyol with a silane-coupling agent, fluororesin particles, and an electric conductivity agent; and the second coating layer contains a urethane resin, an ionic liquid, an electric conductivity agent, and filler particles; and a development apparatus and an image-forming device having the developing roller. The provided are capable of keeping the image quality high and of arresting leakage of the toner satisfactorily.
Provided is a solid electrolytic capacitor which retains a high capacitance and a low ESR and has high heat resistance. The solid electrolytic capacitor (10) is obtained by winding a porous anode foil (11) having a dielectric layer formed thereon and a cathode foil (14) together with separators (15) each interposed therebetween, the separators (15) having a solid electrolyte (13) supported thereon. Each layer of the solid electrolyte comprises a conductive composite (a) of a cationized conductive polymer with a polymer anion, a first hydroxy compound (b) having four or more hydroxy groups, and a second hydroxy compound (c) having an amino group and one or more hydroxy groups, the content of the conductive composite (a), in terms of mass proportion, being lower than that of the first hydroxy compound (b) and higher than that of the second hydroxy compound (c).
A member for an electrostatic capacitance-type sensor which suppresses a decrease in the variation amount of the electrostatic capacitance caused between an input body and the electrode through a proximate operation or a touch operation by the input body and has a metallic luster appearance which does not degrade with time, and is economical, and an electrostatic capacitance-type sensor using the same. The disclosed member includes a sheet member having an operation surface S on which a proximate operation or a touch operation by an input body is carried out and an electrode which is disposed on the opposite side of the operation surface of the sheet member, in which the sheet member includes a decorative layer having a metallic luster, and the decorative layer is a continuous film made of silicon or an alloy of silicon and a metal.
A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate storage container includes an attachment structure in a container body for storing substrates so that a transport component is removably attached to the attachment structure. The attachment structure includes a supporting rail portion provided on an outer wall of the container body, a guide piece provided on the outer wall of the container body, and an engagement part formed with the guide piece. A forked portion formed of a combination of the guide piece and the engagement part. The transport component includes a hollowed frame-shape main part member supported by the supporting rail portion of the attachment structure.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
In a push-button switch manufacturing method, a key-top end of a pressing element is inserted into a lower-mold recess. A reinforcing plate is placed in the lower mold so that the pressing element extends through a plate through hole of the reinforcing plate. An upper mold and the lower mold are moved toward each other so as to insert the other end of the pressing element into an upper-mold recess for the pressing element, which is provided in a lower surface of the upper mold. A liquid silicone rubber, which contains a component that does not adhere to the upper and lower molds but adheres to the pressing element, is introduced into a cavity, the upper and lower molds are opened to remove a molded product in which an intermediate portion in an axial direction of the pressing element is supported in the plate through hole by the silicone rubber.
This invention provides an electrically conductive roller capable of forming an image without fogging even in a low humidity environment and an image-forming device. Specifically, the invention relates to an electrically conductive roller has an elastic layer formed on an outer circumferential surface of a shaft and a urethane coat layer formed on an outer circumferential surface of the elastic layer, wherein the urethane coat layer includes a urethane resin, and at least one ionic liquid selected from the group consisting of pyridinium ionic liquids and amine ionic liquids, in an amount from 1 to 20 parts by mass to 100 parts by mass of the urethane resin; and an image-forming device equipped with the electrically conductive roller.
G03G 15/16 - Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern
G03G 15/02 - Apparatus for electrographic processes using a charge pattern for laying down a uniform charge, e.g. for sensitising; Corona discharge devices
G03G 15/08 - Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
G03G 15/20 - Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (σ/Ra) of 0.2 or less, and the rough surface of the film has (σ/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (σ) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.
Disclosed are a low-cost radio wave-transmitting decorative film which has excellent stretch moldability, radio wave transmissibility, and mirror-like metallic gloss that does not easily disappear, and a decorative member employing the radio wave-transmitting decorative film. Specifically disclosed are a decorative film which includes a first polymer film, a second polymer film, and a light-reflecting layer which is arranged between the polymer films and formed by the physical vapor deposition of an alloy of silicon and a metal, and a decorative member in which the decorative film is provided on the surface of a base.
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
C23C 14/20 - Metallic material, boron or silicon on organic substrates
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
97.
Conductive composition and conductive cross-linked product, capacitor and production method thereof, and antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium
A conductive composition comprises a π conjugated conductive polymer, a dopant, and a nitrogen-containing aromatic cyclic compound. A capacitor comprises an anode composed of a porous material of valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a cathode provided on the dielectric layer and having a solid electrolyte layer containing a π conjugated conductive polymer, which comprises an electron donor compound containing an electron donor element provided between the dielectric layer and the cathode. Another capacitor is based on the above-described capacitor, wherein the solid electrolyte layer further comprises a dopant and a nitrogen-containing aromatic cyclic compound. An antistatic coating material comprises a π conjugated conductive polymer, a solubilizing polymer containing an anion group and/or an electron attractive group, a nitrogen-containing aromatic cyclic compound, and a solvent. An antistatic coating is formed by applying the antistatic coating material.
In a capacitive input switch that is accommodated in a housing of electronic equipment, the capacitive input switch includes a rigidity imparting layer having rigidity and a laminate sheet laminated on the rigidity imparting layer. The rigidity imparting layer and the laminate sheet are three dimensionally formed. The laminate sheet is formed by a substrate sheet, a conductive pattern layer for capacitor formation, and a decorative layer that is laminated at least on any one of the substrate sheet and the conductive pattern layer. A separate conductor is caused to contact with the conductive pattern layer and the conductive pattern layer is caused to be electrically connected to an external electric circuit by the conductor.
A multidirectional input member according to the present invention includes a base plate on which a looped sensor that includes a plurality of groups of non-contacting electrodes configured in a loop is formed and an operation plate locating opposite to the base plate. The operation plate has a first loop-shaped protrusion that is located at a plane opposite to the base plate, that is protruded toward the base plate side, that is opposite to the looped sensor, and that is configured with a resistant rubber member. The first protrusion has a configuration in which its sectional area of a plane parallel to the base plate is tapered in the direction from the operation plate side toward the base plate side.
National University Corporation Saitama University (Japan)
Inventor
Kunishi, Yousuke
Suzuki, Hideki
Komatsu, Hiroto
Ikeno, Junichi
Abstract
A transparent conductive film (12, 22) including a transparent base material (2) having insulation properties; and a mesh member made of a conductive metal and provided in the transparent base material (2), wherein the transparent base material (2) is provided with a conductive portion in which the mesh member is arranged, and an insulating portion (I) in which a gap (5) formed by removing the mesh member is arranged.
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