Provided is a substrate container equipped with a valve structure having improved valve opening/closing reliability. The substrate container comprises a container main body for accommodating a substrate, a lid for closing an opening of the container main body, and a valve structure (40) for controlling a gas flow through the container main body, wherein the valve structure (40) comprises: a block member (41) having communication passages (416, 417) formed therein which enable the inside of the container main body to communicate with the outside thereof via a valve hole (466); and an elastically deformable, platy valve member (45) for opening/closing the valve hole (466). In the valve structure (40), a valve seat (467) around the valve hole (466) and the sealing surface (452a) of the valve member (45) are in contact with each other while curving downstream along a gas-flow direction.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
F16K 15/16 - Check valves with flexible valve members with tongue-shaped laminae
F16K 24/00 - Devices, e.g. valves, for venting or aerating enclosures
A substrate storage container includes a container body configured to store a substrate, a lid that closes the opening of the container body, a retainer that is attached to the lid, and a substrate support portion formed in the retainer. The substrate support portion has an arc shape in a cross-sectional view from the top-to-bottom direction perpendicular to the closing direction of the lid. The substrate support portion includes a pair of left and right substrate support portions configured to hold the substrate together with the container body to retain the substrate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
4.
ANISOTROPICALLY CONDUCTIVE CONNECTOR, ANISOTROPICALLY CONDUCTIVE CONNECTOR HAVING FRAME, AND INSPECTION APPARATUS
The objective of the present invention is to provide: an anisotropically conductive connector that is even capable of a narrow-pitch arrangement in which compact electric/electronic components are accommodated, has excellent connection stability to an electrode, hardly damages the electrode of an electric/electronic component to which to connect, is capable of reducing the deposition of oxidized foreign matter so as to suppress an increase in a resistance value, and is easy to replace even if a conduction failure occurs during use; an anisotropically conductive connector having a frame; and an inspection apparatus. This anisotropically conductive connector is provided with: a strip-shaped insulating part that comprises an elastic material having insulation properties; and a plurality of silver wires that penetrate from the first surface to the second surface of the insulating part by extending in the thickness direction thereof, and that are arranged at a constant pitch in the length direction of the insulating part. Each among the plurality of silver wires is provided so as to be inclined with respect to the thickness direction of the insulating part.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
5.
VIEWING ANGLE CONTROL ELEMENT AND METHOD FOR PRODUCING SAME
The present invention provides: a viewing angle control element which is capable of eliminating the risk of warping or deformation even in cases where the thickness thereof is increased for the purpose of narrowing the visible range or in cases where the installation environment of an image display device is at a high temperature; and a method for producing this viewing angle control element. The present invention provides a viewing angle control element 1 which is in a sheet form and comprises: a louver layer 2 in which a plurality of light transmission bands 3 and light blocking bands 4 are alternately arranged; a pair of bonding layers 5 which are respectively superposed on the both surfaces of the louver layer 2; and a pair of light-transmitting polycarbonate resin films 6 which are respectively superposed on and bonded to the pair of bonding layers 5. This viewing angle control element 1 is mounted on a passenger-side entertainment monitor on the dashboard of an automobile for the purpose of controlling the visible angle; the light transmission bands 3 of the louver layer 2 are formed of a light-transmitting silicone rubber; the light blocking bands 4 of the louver layer 2 are formed of a colored silicone rubber; and the light blocking band width of the light blocking bands 4 is set to 10 µm to 20 µm. Since the louver layer 2 is formed of the silicone rubbers, the risk of warping or deformation caused by heat can be eliminated.
The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, and exhibits a small linear coefficient of thermal expansion (CTE); and an adhesive composition containing said resin composition. This adhesive composition contains a resin composition containing: a maleimide resin (A) having a molecular weight of 1,000 or more; a benzoxazine resin (B); and an alkenyl resin (C) having a 1-alkenyl group. In the resin composition, the mix ratio of the benzoxazine resin (B) and the alkenyl resin (C) is 1:10 to 10:1.
The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, suppresses the occurrence of air bubbles, and exhibits a small linear coefficient of thermal expansion (CTE); and an adhesive composition containing said resin composition. This adhesive composition contains a resin composition containing: a maleimide resin having a molecular weight of 1,000 or more; and a benzoxazine resin. The benzoxazine resin has a site represented by formula (1). (In formula (1), R represents a hydrocarbon group having 4 or more carbon atoms. The hydrocarbon group may have an unsaturated bond site.)
[Problem] To provide a housing for an electronic control unit and a method for manufacturing the same, the housing capable of alleviating stress due to a thermal expansion difference between the housing composed of a resin and a heat sink. [Solution] The present invention relates to a housing 1 for an electronic control unit capable of accommodating the electronic control unit and a method for manufacturing the same, the housing comprising: a tray 4 that has a recessed section 42 that can accommodate the electronic control unit, and is constituted mainly by a resin; and a lid body 2 that engages with the tray 4 so as to cover the recessed section 42, wherein the lid body 2 comprises: a heat sink 10 that has heat dissipation fins 12; a lid body housing 20 that is mainly constituted by a resin, engages with the tray 4, and surrounds the outer periphery of the heat sink 10 so that the heat dissipation fins 12 are exposed on the side opposite to the recessed section 42; and a seal member 30 that is constituted by a rubber elastic body and is disposed between the heat sink 10 and the lid body housing 20.
DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (Japan)
Inventor
Teshima Masahiro
Honda Masayuki
Sakuta Noritaka
Fujii Tomoya
Abstract
[Problem] To provide a fuel cell separator which is superior in strength, electric conductivity, and gas barrier performance, and a method for manufacturing the same. [Solution] The present invention pertains to a fuel cell separator 1 and a method for manufacturing the same, the fuel cell separator 1 comprising: a plate 2 that contains graphite and a resin and that has grooves 30, 32 serving as flow paths on surfaces 31 of the plate; and surface layer films 4, 5 that include the grooves 30, 32 and the surfaces 31 other than the grooves 30, 32, and that cover the surfaces 31 on both sides in the thickness direction of the plate 2. The surface layer films 4, 5 contain a resin and carbon nanotubes.
An anticorrosion structure includes at least one of a metal bolt and a metal nut, and an anticorrosion member coating a portion, protruding beyond a connection surface, of a connecting part using at least one of the bolt and the nut, the anticorrosion member being formed of a silicone rubber obtained by curing a silicone rubber compound.
Medical apparatus and instruments, and their parts and
fittings; silicone catheters; medical tubes; drainage tubes
for medical purposes; feeding tubes for medical purposes;
vessel loops; balloon catheters.
A substrate storage container includes a container body configured to store substrates, a lid that closes an opening of the container body, and a valve unit that controls the flow of gas to the container body. The valve unit includes an elastic valve having a valve opening that connects a first passage communicating with the outside of the container body to a second passage communicating with the inside of the container body, a holding member that holds the elastic valve, and a clamping cap that is inserted in the elastic valve and secures the elastic valve to the holding member. The valve opening is tightly closed by the elastic force of the elastic valve.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
F16K 15/14 - Check valves with flexible valve members
Provided is a substrate storage container capable of ensuring sealability of a lid body and smoothly moving a locking claw of a locking mechanism by making the locking mechanism metal-free. Locking claws 40 are held between a pair of locking mechanism guide blocks of a lid body 10 to be linearly movable outward in the lid body, and are each provided with: a locking block 41 that can oscillate in the thickness direction of the lid body; a connection bar 44 connected to an advancing/retreating bar 34 of a locking mechanism 30; and a cam boss 46 to be fitted in a cam groove 17 of a corresponding one of the locking mechanism guide blocks. The locking block 41, the connection bar 44, and the cam boss 46 are integrally formed by a resin-containing molding material. A recess is formed in the locking block 41, and a resin pin 49 is provided so as to be suspended between opposing sides thereof. The resin pin 49 is fitted through a pressing resin roller 50. A pair of flat surfaces 47 are formed in a cam boss circumferential surface. The cam groove 17 is divided into a linear movement straight groove 19 that makes a sliding-contact with the flat surfaces 47 and that restrains oscillation of a corresponding one of the locking claws 40, and an oscillatory movement circular-arc groove that causes the corresponding one of the locking claws 40 to oscillate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
15.
LAMINATE AND METAL-CLAD LAMINATE BOARD HAVING SAID LAMINATE
Provided is a metal-clad laminate board (for example, a copper-clad laminate board (CCL)) that, while having good electric characteristics (dielectric characteristics) adapted to 5G, has an excellent bonding property (adhesive property) between a base material film (laminate) and a metal film and has excellent dimensional stability, and of which curling is suppressed. Also, provided is a laminate for a printed wiring board that is used to form the above metal-clad laminate board. The laminate comprises: a low CTE resin film that has a linear coefficient of thermal expansion (CTE) of 50 ppm/℃ or less and does not have a melting point at or below 300℃; and resin films (SPS resin films) made of a styrene-based polymer having a syndiotactic structure (SPS) that are laminated on both surfaces of the low CTE resin film.
B29C 63/02 - Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
B29C 65/44 - Joining a heated non-plastics element to a plastics element
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
A diffused light control sheet includes: a louver layer on which light-transmitting zones and light-shielding zones are arranged alternately; a transparent protective layer disposed on a first face of the louver layer; and a light-diffusing layer disposed on a second face of the louver layer, in which the light-diffusing layer has a haze of 93% or more as measured in accordance with JIS K 7136 (2000).
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
F21V 3/06 - Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
17.
HEAT TRANSFER MEMBER, METHOD FOR PRODUCING SAME, AND BATTERY
[Problem] To increase the thermal conduction of a heat transfer member that is interposed between a heat source and a cooling member. [Solution] The present invention relates to a heat transfer member 1 which is capable of transferring heat from a heat source to a cooling member by being interposed between the heat source and the cooling member, and which is provided with: an elastic sheet body 10 comprising an elastic sheet 11 that is elastically deformable at least in the thickness direction, and a highly lubricated layer 16 that is formed on at least one surface of the elastic sheet 11 in the thickness direction and has a higher lubricity than the elastic sheet 11; and a heat transfer film 20 which is provided so as to meander in a specific direction that is perpendicular to the thickness direction of the elastic sheet body 10 within the sheet surface, while being alternatively exposed in the front-side surface and the back-side surface of the elastic sheet body 10 in the thickness direction. The present invention also relates to: a method for producing a heat transfer member; and a battery.
Provided is a metal-clad laminate (for example, copper-clad laminate (CCL) in which curling is suppressed and which excels in adhesiveness (adhesion) between a base material film (laminated body) and a metal film and dimensional stability while having good electrical properties (dielectric properties) compatible with 5G. Also provided is a laminated body for a printed wiring board, which is used to form the metal-clad laminate. This laminated body comprises: a low-CTE resin film having a coefficient of linear thermal expansion (CTE) of 50 ppm/°C or less; and a high-CTE resin film having a coefficient of linear thermal expansion (CTE) of greater than 50 ppm/°C and laminated on both sides of the low-CTE resin film, wherein the low-CTE resin film does not have a melting point at 300°C or less, the low-CTE resin film does not melt at a temperature obtained by adding 30°C to the melting point of the high-CTE resin film, the high-CTE resin film has a melting point of 250°C or higher, and the high-CTE resin film has a tensile elongation at break in the machine direction (MD direction) of 400% or less.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
A storage container with improved strength and airtightness, and a method for manufacturing the storage container are provided. The storage container includes, as a functional resin member, an insert component for a container body insert-molded with a molding material containing predetermined resin. The functional resin member is a side wall plate with support pieces. The side wall plate has a thick portion having at least a thickness of a side wall of the container body, and a thin joint portion formed around the thick portion, to be interposed into and joined to a peripheral wall of the container body. Most of the peripheral wall and the thin joint portion are engaged and joined to enlarge their contact area to eliminate a decrease of the mechanical strength and leakage around the peripheral edge of the side wall plate and prevent the peripheral wall from parting from the side wall plate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 25/10 - Devices to locate articles in containers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
20.
HEAT RADIATION STRUCTURE, AND BATTERY PROVIDED WITH SAME
A heat dissipation structure including a plurality of heat dissipating members, and a support plate for supporting the heat dissipating members. Each of the heat dissipating members includes a plurality of cushion members each having a hollow or a solid shape, and a heat conduction sheet covering an outer surface of the cushion members. The support plate includes a plurality of grooves for supporting the heat dissipating members in a direction orthogonal to a longitudinal direction of the heat dissipating members. Each of the grooves is a curved recess portion formed in a thickness direction, opened to the side of the heat dissipating member, formed to have a radius of curvature larger than a radius of curvature of the heat dissipating member, and to have a depth smaller than a circular conversion diameter of the heat dissipating member, and a battery provided with the heat dissipating structure.
H01M 10/6551 - Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
H01M 50/211 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for pouch cells
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
Medical devices, namely, silicone catheters, drainage tubes for medical purposes, feeding tubes for medical purposes, vessel loops and balloon catheters
According to one embodiment, a substrate storage container comprises: a container body configured to store a substrate; a lid that closes a rectangular opening of the container body; and an annular gasket located between the container body and the lid. The container body has at least either one of a guide rib or a guide slit in an opening portion around the opening. The lid has at least either one of a guide slit or a guide rib that is engageable with the guide rib or the guide slit of the container body. The guide rib and the guide slit engage each other when the opening is closed with the lid and prevent the lid from tilting at a predetermined tilt angle or more with respect to an opening surface where the opening is formed.
There is provided a metal-clad laminate in which the transmission loss of electrical signals can be reduced, a finer pitch of a circuit pattern is possible, a high precision and fine circuit can be formed, and the close adhesiveness of the metal film is excellent. The metal-clad laminate includes a coating film and a metal film laminated on a base material film in this order, wherein the metal film is a metal film formed by at least any formation method of plating, sputtering, and vapor deposition, and a surface roughness (Rz) of the coating film is 1 μm or less.
The present invention is a thermoplastic polyurethane elastomer composition comprising a thermoplastic polyurethane elastomer, an inorganic flame retardant that is a metal hydroxide and/or a metal hydrate, a phosphorus flame retardant, and a melamine flame retardant, wherein 5 to 50 parts by mass of the inorganic flame retardant, 15 to 50 parts by mass of the phosphorus flame retardant, and 25 to 50 parts by mass of the melamine flame retardant are included at these proportions with respect to 100 parts by mass of the thermoplastic polyurethane elastomer, and the thermoplastic polyurethane elastomer is a carbonate thermoplastic polyurethane elastomer having a plurality of carbonate bonds in the molecular chain of the elastomer.
Provided is a substrate storage container eliminating the possibility of a decrease in connection strength between a slide member and a bending locking member or a fall-off of the bending locking member from the slide member, without using a metal pin. This substrate storage container comprises a lid (10) which is fitted in an open front face (2) of a container body (1) in which a semiconductor wafer can be stored, and a locking mechanism (20) for locking the fitted lid (10). The locking mechanism (20) is composed of: an operating reel (21) that is supported on the operation lid (10) and is rotated by an external operation; a connecting bar (24) that slides in an upper-lower direction of the lid (10) due to rotation of the operating reel (21); and a locking claw (27) that projects from an entrance/exit opening (12) in a peripheral edge portion of the lid (10) as the connecting bar (24) slides, and that can be locked in a locking pocket (4) of a front-face inner periphery portion of the container body (1). The locking claw (27) is rotatably connected to the tip-end portion of the connecting bar (24) by means of a resin pin (31) of φ1.5 mm or greater. Use of the resin pin (31) reduces generation of metal ions, and eliminates various adverse effects on the semiconductor wafer.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
26.
METAL-CLAD LAMINATED BOARD, AND LAMINATED BODY USED IN SAID METAL-CLAD LAMINATED BOARD
The present invention provides a metal-clad laminated board in which a low-dielectric base film having poor adhesiveness can be closely adhered and the adhesion of a metal layer formed by a dry process such as deposition and sputtering or a wet process such as a plating treatment is good. The present invention also provides a laminated body which is intended to be used for the formation of the metal-clad laminated board and comprises a base film and a resin layer formed on the base film. The laminated body comprises a base film and a coating layer comprising a maleimide resin, in which the surface roughness (Rz) of the coating layer is 1 μm or less, and the laminated body has a relative permittivity of 3.5 or less and a dielectric dissipation factor of 0.005 or less under the condition including a frequency of 28 GHz.
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
The purpose of the present invention is to provide an electrostatic capacitance type input device that combines: having a switch that is easy to handle and has a rotary dial or push button; and using an electrostatic capacitance touch sensor with a simple design. This electrostatic capacitance type input device comprises: an operation panel; a sensor sheet attached to the rear surface side of the operation panel; and a switch including at least one of a rotary dial and push button. A base material sheet of the sensor sheet is provided with a touch sensor electrode for detecting a touch operation on a surface of the operation panel by a change in electrostatic capacitance, and a detection electrode for detecting a switch operation on the switch by a change in electrostatic capacitance. The switch is provided with a conductor having a distance to the detection electrode that changes by the switch operation, and the switch operation on the switch is detected from a change in electrostatic capacitance caused by the change in distance between the detection electrode and the conductor.
H01H 36/00 - Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Provided is a metal-clad laminated plate that has smooth-surfaced metal film that reduces electrical signal transmission loss. The metal-clad laminated plate has good metal film adhesion and can be used to create fine-pitched circuit patterns and form high-precision fine circuits. The metal-clad laminated plate is obtained by laminating a coating film, a layer comprising an adhesion-imparting agent, and a metal film on a substrate film, in said order. The metal film is formed by at least one formation process out of plating, sputtering, and deposition and the surface roughness (Rz) of the coating film is 1 μm or less.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
Provided is a metal-clad laminate which adheres even to a low-dielectric substrate film having poor adhesion, and which has good adhesion to a metal layer formed by a dry process such as vapor deposition or sputtering, or a wet process such as plating. The present invention also provides a laminate which is used to form said metal-clad laminate, and in which a resin layer is formed on a substrate film. The laminate has: a substrate film; and a layer composed of a resin composition containing a silane coupling agent, wherein the layer composed of the resin composition has a surface roughness (Rz) of at most 1 µm, and the laminate has a relative permittivity of at most 3.5 and a dielectric loss tangent of at most 0.005 under the frequency condition of 28 GHz.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
[Problem] To provide a method for producing a dielectric film using a polymeric material and an organic compound having a polar group. [Solution] A method for producing a dielectric film, comprising a step in which a polymeric material and an organic compound having a polar group are dissolved in a solvent to prepare a mixture solution including the polymeric material and the organic compound having a polar group, a step in which the mixture solution is applied to a substrate, and a step in which the polymeric material applied to the substrate is cured to form a thin film, the method being characterized in that the mixture solution is prepared so that the cured thin film has an inner structure composed of separated phases which are a continuous phase comprising the polymeric material and a dispersed phase consisting mainly of the organic compound having a polar group.
C08L 101/00 - Compositions of unspecified macromolecular compounds
H01B 3/28 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
[Problem] To provide a heat-dissipating sheet having reduced hardness and increased heat conductivity, and a method for manufacturing the same. [Solution] The present invention relates to a heat-dissipating sheet 1 and a method for manufacturing the same. The heat-dissipating sheet 1 comprises a sheet-like rubbery elastic body 10, and an elongated heat-conductive filler 20 having higher heat conductivity compared to the rubber-like elastic body 10 and embedded in the rubber-like elastic body 10 oriented obliquely with respect to a thickness direction thereof. The rubber-like elastic body 10 includes at least one hole 14 which is oriented in parallel to the thickness direction of the rubber-like elastic body 10 or obliquely with respect to the thickness direction. The heat-conductive filler 20 has both ends thereof exposed on surfaces 11, 12 of the rubber-like elastic body 10.
[Problem] To provide: a thermally conductive sheet that can be configured to have a low hardness and a high thermal conductivity; and a method for producing the same. [Solution] The present invention relates to a thermally conductive sheet 1 provided with a rubber-like elastic body 10 in sheet form and carbon fibers 20 that are embedded diagonally with respect to the direction of thickness of the rubber-like elastic body 10, wherein the carbon fibers 20 are amorphous carbon fibers and both ends 21 and 22 thereof are exposed at the surfaces 11 and 12 of the rubber-like elastic body 10. The present invention also relates to a method for producing the thermally conductive sheet 1.
[Problem] To provide a push-button switch member in which the resistance drops rapidly to enable a clear push-down after a load with which a push-button is pushed reaches a maximum. [Solution] The present invention relates to a push-button switch member comprising: a keytop; a domed part; and a base part. When the keytop is pushed toward the base part side, the domed part is buckled and deformed, and when the pushing of the keytop is released, the domed part returns to its original shape. In a load-displacement curve 20, 30 that begins from the start of pushing of the keytop, passes through the buckling deformation of the domed part, and ends when a lower area of the keytop abuts a fixed part on an extension line of the keytop, a second angle B from a peak point where the load reaches a maximum value to a make point where the load reaches a minimum value is smaller than a first angle A from an initial point where the pushing of the keytop is initiated to the peak point.
H01H 13/52 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell push switch
34.
FIRE-SPREAD PREVENTION TYPE CELL UNIT, METHOD FOR MANUFACTURING SAME, AND BATTERY
[Problem] To provide a fire-spread prevention type cell unit in which a battery cell is provided with a fire-spread preventing sheet that deforms readily in conformity with thermal expansion of a battery cell, and that is capable of deforming elastically over a long period of time, thereby maintaining porosity of the sheet, and to provide a method for manufacturing the fire-spread prevention type cell unit, and a battery. [Solution] The present invention relates to a fire-spread prevention type cell unit 1, a method for manufacturing the same, and a battery, the fire-spread prevention type cell unit 1 comprising a battery cell 20, and a fire-spread preventing sheet 10 which is affixed to a side surface positioned in a direction in which the battery cell 20 extends, wherein: the fire-spread preventing sheet 10 is a porous sponge sheet; and holes 15 in the fire-spread preventing sheet 10 have an elongate shape, and a length direction of the holes 15 is oriented in a thickness direction of the fire-spread preventing sheet 10.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
35.
FIRE SPREADING PREVENTION UNIT AND BATTERY PROVIDED WITH SAME
[Problem] To provide: a fire spreading prevention unit that prevents fire spreading by reducing thermal conduction between heat sources during a rise in temperature of the heat sources, that is not easily damaged during expansion of the heat sources, and that can actively dissipate heat from the heat sources; and a battery provided with the same. [Solution] The present invention relates to a fire spreading prevention unit 1, comprising: fire spreading prevention sheets 20 each disposed so as to be sandwiched between a plurality of heat sources; and a thermally conductive member 10 disposed between the heat sources and a member to which heat from the heat sources is transmitted. The fire spreading prevention sheets 20 are multilayer sheets each obtained by laminating one or more rubber sheets 23, one or more heat resistant sheets 21, and one or more thermally conductive sheets 22. The thermally conductive sheets 22 each have a protrusion 25 that protrudes beyond the rubber sheet 23 and the heat resistant sheet 21 and has both surfaces in the thickness direction of the thermally conductive sheet 22 exposed. The fire spreading prevention sheets 20 are erected on the thermally conductive member 10 in a state in which the respective protrusions 25 are brought into contact with the thermally conductive member 10. The present invention also relates to a battery provided with the fire spreading prevention unit.
[Problem] To provide a push button switch member that has high durability while maintaining good operability. [Solution] The present invention relates to a push button switch member 1 comprising: a push-movable part 11 having a recess 12 that is recessed downward from a top surface, the push-movable part being movable in a pushing direction and a reverse direction in response to pushing on the top surface; a buckling-deformable first dome portion 13 connected to the outer periphery in the radial direction of the push-movable part 11 as seen in plan view; a non-buckling-deformable second dome portion 14 different from the first dome 13, the second dome portion being connected to the inner periphery in the radial direction of the push-movable part 11 as seen in plan view; a protrusion 16 protruding from the second dome portion 14 in the opposite direction from the top surface, the protrusion being able to move toward a substrate 50 that is in the opposite direction from the top surface; and a base portion 15 connected to the outer periphery in the radial direction of the first dome portion 13 as seen in plan view, the base portion being secured to the substrate 50. The second dome portion 14 and the protrusion 16 cover an end portion on the opposite side from the top surface of the recess 12, and the second dome portion 14 has at least one convex portion 40 between the push-movable part 11 and the protrusion 16, the convex portion protruding toward the opening side of the recess 12.
[Problem] To provide a multilayer separator which is capable of stabilizing the gas barrier characteristics at high levels. [Solution] The present invention relates to a multilayer separator 1 which is provided with: a plate 2 which contains graphite and a resin, and has a surface that is provided with grooves 30, 32 serving as flow channels; and an internal barrier layer 3c for gas barrier, the internal barrier layer 3c being positioned inside the plate 2 in the thickness direction so as to divide the plate 2 into two regions in the thickness direction. The present invention also relates to a method for producing this multilayer separator 1.
Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.
The present invention is a method for producing an adhesive holding jig 10 provided with a support substrate 11 and an adhesive agent layer 12 which is provided on the support substrate 11 and which has a relief pattern 13 on a surface 12a thereof, said method comprising: a first step for inserting a nano-implant mold 30 that has a pattern 31 for forming a relief pattern 13 into an upper mold 21 of a mold 20 that has the upper mold 21 and a lower mold 22, and disposing the support substrate 11 in a cavity bottom part 22a of the lower mold 22; a second step for disposing a heat-curing liquid adhesive material 24 on the support substrate 11; a third step for closing and then heating the mold 20 so as to integrally bond and mold the support substrate 11 and the heat-curing liquid adhesive material 24; and a fourth step for opening the mold 20 and removing an adhesive holding jig 10 that has been molded.
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
B29C 33/42 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
[Problem] To provide: a separator which has excellent strength and excellent electrical conductivity; and a method for producing this separator. [Solution] The present invention relates to a separator 1 for power storage devices, the separator 1 being provided with a plate 2 that contains graphite, a resin and an aramid fiber that is different from the resin, wherein: a surface 31 of the plate 2 is provided with grooves 30, 32 that serve as flow channels; and the aramid fiber is a para-aramid fiber that contains a meta-phenylene group. The present invention also relates to a method for producing this separator 1.
In order to provide a fuel cell separator having excellent strength, electrical conductivity, and gas barrier properties, a fuel cell separator 1 according to the present invention comprises: a plate 2, the constituent material of which contains granular or fibrous graphite and granular or fibrous resin; and a barrier layer 3 which has more favorable gas barrier characteristics than the plate 2, wherein the surface of the plate 2 is provided with grooves 30 serving as flow passages, and the barrier layer 3 covers at least the front-side surface and the rear-side surface of the plate 2, including the grooves 30 and portions of the surface of the plate 2 other than the grooves 30.
H01M 8/026 - Collectors; Separators, e.g. bipolar separators; Interconnectors characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant characterised by grooves, e.g. their pitch or depth
National University Corporation Saitama University (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Matsuo, Rika
Noguchi, Hitoshi
Abstract
A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond; and a step of forming a modified layer 20, which includes a processing mark 21b of graphite and a crack 22b extending along a surface (111) around the processing mark 21b, along the surface (111) of the single crystal diamond at a predetermined depth from an upper surface of the block by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally.
National University Corporation Saitama University (Japan)
Inventor
Ikeno, Junichi
Yamada, Yohei
Suzuki, Hideki
Matsuo, Rika
Noguchi, Hitoshi
Abstract
A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond, a step of forming a modified layer 20, which includes a processing mark 21 of graphite and a crack 22b extending along a surface (111) around the processing mark 21, in a partial region of the upper surface 10a of the block 10 along the surface (111) of the single crystal diamond, along the surface (111) of the single crystal diamond at a predetermined depth from the upper surface 10a of the block 10 by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally, and a step of forming a cleavage plane 25 at the predetermined depth of the remaining region of the upper surface 10a of the block 10 by spontaneously propagating cleavage from the modified layer 20.
C30B 33/04 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
B23K 26/40 - Removing material taking account of the properties of the material involved
C04B 41/00 - After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
C04B 41/91 - After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having heat resistance and being capable of preventing resin flow (resin flow-out properties), that exhibits excellent adhesiveness even with respect to a low-dielectric base material film having poor adhesiveness, and that has excellent electrical properties (dielectric properties) capable of handling 5G. Further, the adhesive composition can form an adhesive layer having superior adhesion-reliability even after being kept at 150°C for 168 hours. The adhesive composition contains a resin composition including styrene-based elastomers. The styrene-based elastomers include a modified styrene-based elastomer. The styrene-based elastomers also include a styrene-based elastomer having a styrene ratio of 33 or more.
Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having both heat resistance and chemical resistance (solvent resistance), that exhibits excellent adhesiveness even with respect to a low-dielectric base material film having poor adhesiveness, and that has excellent electrical properties (dielectric properties) capable of handling 5G. The adhesive composition contains styrene-based elastomers, a bismaleimide resin, and a benzoxazine resin. The styrene-based elastomers include a styrene-based elastomer including an amino group.
C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
The present invention provides an adhesive composition for forming a low-dielectric adhesive layer that has both heat resistance and chemical resistance (solvent resistance), the adhesive composition exhibiting favorable adhesion to a low-dielectric base material film having poor adhesion properties, while having favorable electrical properties (dielectric properties) compatible with 5G. The adhesive composition contains a styrene elastomer and a benzoxazine resin, and the styrene elastomer includes a styrene elastomer containing an amino group.
C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
47.
THERMALLY CONDUCTIVE MEMBER, MANUFACTURING METHOD OF THERMALLY CONDUCTIVE MEMBER, AND BATTERY
[Problem] To increase thermal conduction of a thermally conductive member interposed between a heat source and a cooling member. [Solution] The present invention pertains to a thermally conductive member 1 that can be interposed between a heat source and a cooling member to cause heat to move from the heat source to the cooling member. The thermally conductive member 1 comprises: an elastic sheet 10 that is elastically deformable at least in the thickness direction; and a thermally conductive film 20 provided so as to advance by meandering in a predetermined direction in the sheet plane at a right angle to the thickness direction of the elastic sheet 10, while being exposed at the front surface and the back surface, in an alternating manner, in the thickness direction of the elastic sheet 10. The elastic sheet 10 is provided with a tapered part 15 or a curved part at the edge contacting the thermal conducive film 20. The thermally conductive film 20 covers the tapered member 15 or the curved member of the elastic sheet 10. The present invention also pertains to: a manufacturing method of the thermally conductive member; and a battery.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
According to one embodiment, a substrate storage container includes a transport component configured to be mountable to a container body by being relatively displaced with respect to the container body from the rear side to the front side. The container body has a container body-side protrusion protruding upward. The transport component has a transport component-side protrusion protruding downward. In a mounted state, the transport component-side protrusion is engaged with the front side of the container body-side protrusion to be restricted from being displaced backwards. When a predetermined load is applied to the transport component-side protrusion upwardly, the transport component-side protrusion is displaced by a smaller amount than the container body-side protrusion displaced when the predetermined load is applied to the container body-side protrusion downwardly.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate accommodating container according to the present invention comprises a container main body capable of accommodating a substrate (W), a lid (20) for closing an opening in the container main body, a retainer (50) installed in the lid (20), and a left and right pair of substrate supporting portions (55) which are formed in the retainer (50), and which hold the substrate (W) by sandwiching the same against the container main body, wherein the substrate supporting portions (55) have an arcuate shape in a cross-sectional view from a vertical direction perpendicular to a closing direction of the lid (20). Further, the substrate supporting portions (55) form U-shaped slots together with a pair of substrate guide portions (56) which are provided upright from both upper and lower edges. It is thus possible to provide a substrate accommodating container capable of holding substrates stably, even if the substrate thicknesses differ.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
This panel accommodating container comprises a container main body for accommodating a plurality of panels, and a panel supporting portion provided inside the container main body to support the plurality of panels, wherein: the panel supporting portion is provided with a first shaft extending in a first direction, for supporting one panel among the plurality of panels; the container main body is provided with a first support strut for fixing the first shaft; the first shaft has a first end portion and a second end portion, which are two end portions thereof in the first direction; a first fitting hole into which the first end portion is fitted is provided in the first support strut; and the first fitting hole is inclined upward with increasing distance toward the inside of the container main body in the first direction.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/42 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for electronic valves or tubes
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
A substrate storage container includes: an opening on a front surface side; and a gas supply mechanism on a bottom surface. The gas supply mechanism has: an introduction path configured to receive a gas from a bottom surface side; a check valve disposed at a position that does not overlap with the introduction path in a horizontal plane along the bottom surface; and a flow path configured to supply the gas from the introduction path to the check valve.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
B08B 9/093 - Cleaning of containers, e.g. tanks by the force of jets or sprays
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A multilayer sheet disposed at least between a plurality of heat sources and capable of conducting heat from the heat sources includes: a rubber sheet made of a rubber-like elastic body; heat insulating sheets laminated on both surfaces of the rubber sheet and capable of reducing heat conduction between the plurality of adjacent heat sources; and first heat conductive sheets laminated outside the heat insulating sheets in a separated manner and having more excellent heat conductivity than the rubber sheet and the heat insulating sheets, in which the heat insulating sheets have a bag shape wrapping the rubber sheet, and a cell unit including the multilayer sheet.
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
53.
THERMAL CONDUCTION MEMBER AND BATTERY PROVIDED THEREWITH
[Problem] With respect to a thermal conduction member, to reduce damage to a thermal conduction film serving as a heat flow path during compression in the thickness direction. [Solution] The present invention pertains to a thermal conduction member 1 that can be interposed between a heat source and a cooling unit to cause heat to move from the heat source to the cooling unit. The thermal conduction member 1 comprises: an elastic sheet 10 that is elastically deformable at least in the thickness direction; and a thermal conduction film 20 provided so as to advance meandering in a predetermined direction in the sheet plane at a right angle to the thickness direction of the elastic sheet 10 while also being alternately exposed to the front-side surface and the reverse-side surface of the thickness direction of the elastic sheet 10. The thermal conduction film 20 is provided to the elastic sheet 10 so that all or a major portion of a predetermined direction is inclined at an acute angle to the thickness direction in the cross-section of the thickness direction of the elastic sheet 10. The present invention also pertains to a battery provided with the thermal conduction member.
A substrate storage container includes: a container body configured to store a substrate; a lid configured to close an opening formed on the front side of the container body; and a retainer arranged on the back of the lid and configured to restrict the substrate from moving to the front side. The retainer includes an integration of: a frame configured to be detachably attached to the back of the lid; a contact portion including a convex portion configured to contact the substrate and restrict the substrate from moving to the front side; and a beam structure that connects the frame and the contact portion. The contact portion and the beam structure are configured to be spaced apart from the lid.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a panel storage container including: a container body that has a flange that demarcates an opening and that stores a plurality of panels; a lid body that closes the opening; and a protruding protective member that is provided between an outer circumferential surface of the lid body and an inner circumferential surface of the flange, the circumferential surfaces being opposed to each other in a state in which the lid body closes the opening.
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is an adhesive composition for forming low-dielectric adhesive layers which have satisfactory electrical properties (dielectric properties) that render the adhesive layer adaptable to the 5th generation mobile communication system (5G) and which have satisfactory adhesiveness also to low-dielectric base films having poor bondability and further have heat resistance and chemical resistance (solvent resistance), the adhesive composition being capable of being reduced in resin flow. The adhesive composition comprises a hardener and a resin composition including a modified styrene-based elastomer, wherein the modified styrene-based elastomer is contained in an amount of 25 parts by mass or more per 100 parts by mass of the resin composition and the resin composition has a melt flow rate (200°C, 21.60 kg) of 40 g/10 min or less.
C09J 153/02 - Vinyl aromatic monomers and conjugated dienes
C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
The present invention provides a fixing pad 10 comprising a base material 11 and a sliding layer 13 provided over a principal surface 11a of the base material 11, wherein the sliding layer 13 is formed from a woven material or knitted material containing fluorocarbon fiber and/or glass fiber, and wherein a sliding surface 13a of the sliding layer 13 has a surface roughness Ra of 12.0 μm or less.
Provided is a substrate storage container provided with a valve body that improves assembly workability. This substrate storage container comprises a valve body 40 that controls the flow of a gas to a container body 10. The valve body 40 comprises: a first path 458 that communicates with the outside; an elastic valve body 45 that has a valve opening 454 that allows communication with a second path 459 that communicates with the inside; a retention member 41 that retains the elastic valve body 45; and a fastening cap 47 that, by being inserted into the elastic valve body 45, fixes the elastic valve body 45 to the retention member 41. The valve opening 454 is closed by adhesion resulting from the elastic force of the elastic valve body 45.
F16K 15/14 - Check valves with flexible valve members
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
Provided is a substrate storage container capable of suppressing seal defects due to a gasket when an opening of a container body is closed with a lid. This substrate storage container 1 comprises: a container body 10 capable of storing a substrate; a lid 20 which closes a rectangular opening of the container body 10; and an annular gasket 30 provided between the container body 10 and the lid 20, wherein the container body 10 has, in an opening section 11 that forms the opening, at least one among a guide rib 40 or a guide slit 50, the lid 20 has at least one among a guide slit 50 or a guide rib 40 which can engage with the guide rib 40 or the guide slit 50 of the container body 10, and when the opening is closed with the lid 20, the guide rib 40 engages with the guide slit 50, thereby preventing the lid 20 from inclining at an angle greater than a certain angle with respect to an opening surface that forms the opening.
B65D 43/04 - Removable lids or covers having a part, or parts, engaging within the mouth of the container and retained by friction or gravity
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
61.
HEAT DISSIPATING STRUCTURE AND BATTERY PROVIDED WITH THE SAME
In a heat, dissipating structure, a plurality of heat dissipating members for a heat source are connected. Each heat dissipating member has a heat conduction sheet that extends while winding in a spiral shape for conducting the heat from the heat source; a cushion member which is provided on an annular rear side of the heat conduction sheet and can be more easily deformed corresponding to the outer surface shape of the heat source than the heat conduction sheet; an adhesive layer that fixes the heat conduction sheet and the cushion member and is more easily deformed than the heat conduction sheet; and a through passage penetrating in the direction in which the heat conduction sheet extends while being wound. The heat dissipating members are connected by connection members in a state of being aligned perpendicular to the direction in which the heat conduction sheet extends while being wound.
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
Provided is a diffused light control sheet (10) comprising: a louver layer (1) in which a light-transmission band (2) and a light-shielding band (3) are alternately and repeatedly provided; a transparent protective layer (4) provided on the first surface of the louver layer; and a light diffusion layer (5) provided on the second surface of the louver layer, the haze measured in accordance with JIS K 7136 (2000) of the light diffusion layer being 93% or greater.
B32B 25/08 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided is a developing roller that has suitable toner release properties and excellent filming resistance. The developing roller 1 comprises a shaft 2, an elastic layer 3 provided to the outer surface of the shaft 2 and containing a silicone rubber, and a coating layer 4 provided outside the elastic layer 3 and containing a silicone-modified urethane resin. The adhesive force of the coating layer 4 as measured by a nanoindenter is 4.0 μN or less. The capacitance of the coating layer 4 is preferably 11 nF or less at 0.1 Hz.
Provided is an adhesive composition that makes it possible to prevent resin flow on the occasion of thermocompression bonding by controlling mechanical characteristics, that exhibits suitable electrical characteristics, and whereby it is possible to form an adhesive layer having suitable adhesion. The adhesive composition contains at least an inorganic filler and a resin composition including a styrene elastomer. The content of the inorganic filler is 1-180 parts by mass with respect to 100 parts by mass of the resin composition. The inorganic filler has a plate-like or scale-like shape. An adhesive layer obtained by curing the adhesive composition has a dielectric constant of 3.5 or less at a frequency of 28 GHz. The dielectric loss tangent of the adhesive layer at a frequency of 28 GHz is 0.005 or less.
[Problem] To provide: a heat dissipation member that can be adapted to various forms of heat source, has excellent elastic deformability, and has high heat dissipation properties and electrical insulation properties; a heat dissipation structure; and a battery. [Solution] The present invention pertains to: a heat dissipation member 2 for enhancing heat dissipation from a heat source, the heat dissipation member 2 having a form in which a sheet 1 is curved in an arcuate shape, the sheet 1 being provided with a heat conduction member 20 and a coating layer 10 coating the outside of the heat conduction member 20; a heat dissipation structure comprising two or more heat dissipation members 2; and a battery comprising a heat dissipation member 2.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/655 - Solid structures for heat exchange or heat conduction
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
66.
STORAGE CONTAINER AND METHOD FOR MANUFACTURING SAME
Provided are a storage container and a method for manufacturing the same that are capable of improving the strength and airtightness of a molded container. This storage container has, as a functional resin member, an insert component of a container body 1, said insert component being insert molded from a molding material containing a specified resin, and the functional resin member is made to be a sidewall plate 20 including a plurality of support pieces 12, said sidewall plate 20 having a thick part 21 that has an equivalent or greater thickness than the thickness of a sidewall 11 of the container body 1, and a thin joining part 22 that is formed on the periphery of said thick part 21 and that clamps to a peripheral wall 2 of the container body 1 so as to be joined. When insert molding the container body 1, the majority of the peripheral wall 2 of the container body 1 and the thin joining part 22 of the sidewall plate 20 are caused to engage and join, and the contact area of the peripheral wall 2 and the joining part 22 are expanded. Consequently, it is possible to eliminate the deterioration of the mechanical strength and the leakiness of around the sidewall plate 20 peripheral part in the sidewall 11 of the container body 1, and it is possible to prevent the separation of the peripheral wall 2 of the container body 1 and the sidewall plate 20.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
67.
HEAT DISSIPATING STRUCTURE AND BATTERY PROVIDED WITH THE SAME
A heat dissipation structure for a battery includes a plurality of heat dissipation members. The heat dissipation members are each provided with: a heat conductive sheet having a shape that extends while winding in a spiral shape for transferring the heat from the heat source, a cushion member which is provided on an annular rear surface of the heat conductive sheet and can be more easily deformed to conform to the outer surface shape of the heat source than the heat conductive sheet, and a penetration path penetrating in the direction in which the heat conductive sheet extends while winding. The plurality of heat dissipation members is connected to each other by connection members in a state of being aligned in a direction perpendicular to the direction in which the beat conductive sheet extends while winding.
H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
[Problem] To provide an anticorrosion structure of advanced anticorrosion effectiveness, and a method of manufacturing the same. [Solution] The present invention relates to an anticorrosion structure 6 and a method of manufacturing the same, the anticorrosion structure 6 comprising at least one of a metal bolt 2 and a metal nut 3, and an anticorrosion member 1 that covers a section protruding from a joint surface 50 of a joint employing the at least one of the bolt and the nut, wherein the anticorrosion member 1 is composed of a silicone rubber which is a cured silicone rubber compound.
The present invention provides an adhesive composition for forming a low-dielectric adhesive layer that has both heat resistance and chemical resistance (solvent resistance), the adhesive composition exhibiting satisfactory bonding properties, with respect to a low-dielectric base material film having poor bonding properties, while having satisfactory electrical properties (dielectric properties) capable of handling 5G. Said adhesive composition contains a styrene-based elastomer and an epoxy-modified resin having a structure represented by formula (1) below. (R1, R2, R3, and R4are each independently hydrogen or an organic group. Note that at least one of R1and R2is an organic group, and at least one of R3and R4 is an organic group.)
This cell culturing silicone rubber sheet (10) has a plurality of regularly arranged through-holes (2), wherein the average opening diameter of the plurality of through-holes opened in a first surface (1a) of said silicone rubber sheet is 0.4-10 μm, and the thickness of the silicone rubber sheet is 5-200 μm.
The present invention provides: a resin film which is produced from a polyarylene ether ketone resin and has improved thermal dimensional stability without deteriorating heat resistance and low dielectric characteristics, while being suppressed in increase of the relative dielectric constant or tanδ due to high humidity; a method for producing this resin film; a printed wiring board; a coverlay; and a multilayer body. A resin film 2 which is used for a printed wiring board 1 or the like and contains a polyarylene ether ketone resin, a fluorine-based resin and a synthetic mica, wherein: the total content of the polyarylene ether ketone resin and the fluorine-based resin is set to 100 parts by mass; the content of the synthetic mica is set to a value from 10 parts by mass to 80 parts by mass; the mass ratio of the polyarylene ether ketone resin to the fluorine-based resin, namely (polyarylene ether ketone resin)/(fluorine-based resin) is set to a value from 98/2 to 50/50; and the relative crystallinity of the polyarylene ether ketone resin is set to 80% or higher.
C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
C08L 71/08 - Polyethers derived from hydroxy compounds or from their metallic derivatives
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
A conductive polymer dispersion of this disclosure includes: a conductive composite containing a π-conjugated conductive polymer and a polyanion; an isocyanurate-based compound; and a dispersion medium for dispersing the conductive composite.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C09D 167/00 - Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
C09D 175/12 - Polyurethanes from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group
Provided is a sponge roller having high durability. The present invention is a sponge roller 1 comprising a shaft body 2 and a foamed elastic layer 3 formed on the outer circumference of the shaft body 2, wherein: the foamed elastic layer 3 is formed by foaming and vulcanizing a composition which is for a foamed elastic layer and contains a millable-type silicone rubber composition, a vinyl group-containing silicone crude rubber, a foaming agent, and a crosslinking agent; and the loss factor tanδ of a cured product of a rubber composition, which is obtained by removing the foaming agent from the composition for a foamed elastic layer, is at most 0.035 under the following measurement conditions. Frequency of 8 Hz, temperature of 100ºC, and strain control of 5 μm
An alloy resin usable for forming a surface layer of a shaped article comprising a base layer and the surface layer, the alloy resin comprising the vinyl-chloride-based resin and the methyl-methacrylate-based resin in a mass ratio of 20:80 to 90:10. When the ratio (W) of the mass of the methyl-methacrylate-based resin to the total mass of the vinyl-chloride-based resin and the methyl-methacrylate-based resin is plotted as the abscissa and the melt flow rate (R) of the alloy resin, measured in accordance with JIS K 7210-1, is plotted as the ordinate to obtain a graph, then the plots lie in a range sandwiched between a line represented by R=6.25-4.7×W and a line represented by R=4.50-4.7×W.
[Problem] To provide a heat radiation structure and a battery that may adapt to various forms of a heat source, have excellent elastic deformation, have excellent heat radiation efficiency, improve the equalization of the heat radiation of each of a plurality of heat sources, and improve the productivity. [Solution] The present invention relates to a heat radiation structure 1 and a battery, including: a plurality of heat radiation members 20; and a support plate 10 for supporting the plurality of heat radiation members 20, the heat radiation members 20 including a plurality of cushion members 22 having a hollow or solid shape, and heat conducting sheets 21 covering the outside surfaces of the cushion members 22, the support plate 10 including a plurality of trench parts 15 in a direction perpendicular to the longitudinal direction of the heat radiation members 20, the trench parts 15 being for supporting the heat radiation members 20, and each trench part 15 being a curved trench part that is open on the heat radiation member 20 side and recessed in the thickness direction, each trench part 15 being formed to have a curvature radius R2 larger than the curvature radius R1 of each heat radiation member 20 and a depth T smaller than the circle conversion diameter D of each heat radiation member 20.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
The purpose of the present invention is to provide a vertical contact-type probe, a probe card, and a socket that have excellent durability for the inspection of a DUT, i.e., a semiconductor IC or a packaged semiconductor, having a small electrode interval, and that can handle high-frequency inspection of DUTs having high operation frequency. Provided is a vertical contact-type probe (1) which, in a state in which: a first needle-like electrically conductive member (20) extends in a thickness direction of an elastomer sheet (12) on a first surface (10a) side of an elastomer connector (10); a first end (20a) of the first needle-like electrically conductive member (20) is in contact with a metal thin wire (14); a second needle-like electrically conductive member (30) extends in a thickness direction of the elastomer sheet (12) on a second surface (10b) side of the elastomer connector (10); a first end (30a) of the second needle-like electrically conductive member (30) is in contact with the metal thin wire (14); and a second end (30b) of the second needle-like electrically conductive member (30) is in contact with an electrode terminal of a circuit board, inspects a DUT by causing a second end (20b) of the first needle-like electrically conductive member (20) to contact an electrode of the DUT.
H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
H01L 21/66 - Testing or measuring during manufacture or treatment
H01R 33/76 - Holders with sockets, clips or analogous contacts, adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Provided is a metal-clad laminated plate in which transmission loss of electrical signals can be reduced, the fineness in pitch of a circuit pattern can be increased, and a very fine circuit can be formed with high precision, the metal-clad laminated plate having exceptional adhesion of a metal film. A metal-clad laminated plate obtained by laminating a coating film and a metal film on a substrate film in the stated order, wherein: the metal film is formed by at least one formation process from among plating, sputtering, and deposition; and the surface roughness (Rz) of the coating film is 1 μm or less.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
The purpose of the present invention is to provide: an alloy resin which contains a vinyl chloride resin and a methyl methacrylate resin and enables the achievement of a molded article that exhibits excellent transparency; and a molded article which uses this alloy resin. An alloy resin which is obtained by blending a vinyl chloride resin and a methyl methacrylate resin at a mass ratio of from 50:50 to 90:10, wherein if an arbitrarily selected part thereof is observed with a transmission electron microscope at a magnification of 3,000 times, a white spot having a size of 4 μm2 or more is not observed within a region having a length of 55 μm and a width of 80 μm, said region being arbitrarily selected from a microscopic image thereof.
[Problem] To provide a multilayer sheet that is capable of reducing thermal conductivity between a plurality of heat sources and raising heat conduction efficiency from the heat sources to a cooling site, and a cell unit provided with the multilayer sheet. [Solution] The present invention pertains to: a multilayer sheet 1 that is positioned at least between each of a plurality of heat sources and is capable of conducting heat from the heat sources, the multilayer sheet 1 being characterized by comprising a rubber sheet 13 formed from a rubber-form elastic body, heat-insulating sheets 12 that are layered on both surfaces of the rubber sheet 13 and are capable of reducing the conduction of heat between adjacent heat sources among the plurality of heat sources, and a first heat conduction sheet 11 that is separated from and layered on the outer side of the heat-insulating sheets 12 and has thermal conductivity superior to that of the rubber sheet 13 and the heat-insulating sheets 12, the multilayer sheet 1 also being characterized in that the heat-insulating sheets 12 have a bag shape that encompasses the rubber sheet 13; and a cell unit provided with the multilayer sheet 1.
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/6555 - Rods or plates arranged between the cells
H01M 10/6556 - Solid parts with flow channel passages or pipes for heat exchange
A light control filter includes a sheet having a sea-island structure including a light-transmitting portion and a light-shielding portion, wherein the light-transmitting portion and the light-shielding portion each extend from a first principal surface to a second principal surface, wherein any one of the light-transmitting portion and the light-shielding portion forms a plurality of island portions configured to penetrate through the sheet from the first principal surface to the second principal surface, and another of the light-transmitting portion and the light-shielding portion forms a sea portion configured to separate the plurality of island portions from one another, and wherein the sea portion has an MD-1 rubber hardness of 25 or more and 80 or less.
In a pressure-sensitive touch sensor of a capacitance type, a first electrode and a second electrode are provided on a first surface of a base material sheet. The base material sheet is folded between the first electrode and the second electrode so that a surface of the first electrode and a surface of the second electrode face each other. The base material sheet is folded at a fold line portion in which a slit is formed. An elastic layer is provided between folded parts of the base material sheet. The pressure-sensitive touch sensor is configured to detect pressing on the operation surface based on a change in capacitance, which is caused when the elastic layer is compressed and deformed in a thickness direction by a pressing force to reduce a distance between the first electrode and the second electrode.
G01D 5/241 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
Provided is an adhesive composition that has superior electrical properties and is capable of forming an adhesive layer of superior tightness of bond (adhesiveness) when heat-cured, and that has superior tightness of bond (adhesiveness) even when cured at lower temperatures, and allows for improved workability. The adhesive composition contains an amino-group-containing styrene-based elastomer, and an epoxy resin.
C09J 153/00 - Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided is an adhesive composition which has excellent electrical properties (low relative permittivity and low dielectric dissipation factor) and can form an adhesive layer having excellent adhesion (adhesiveness) after heat curing. The adhesive composition can attain an improvement in adhesion (adhesiveness) in laminating steps, can prevent layer separation or lifting in temporary fixing or roll-to-roll processing, and gives adhesive layers having a high crosslink density and suffering no decrease in heat resistance, solvent resistance, etc. The adhesive composition comprises a bismaleimide resin and a styrene-based elastomer.
C09J 153/00 - Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided is an adhesive composition from which an adhesive layer having an excellent electrical property and an excellent adhesion (stickiness) after heat and curing can be formed, and with which an adhesion (stickiness) during a laminating process can be further improved, and peeling or lifting of a layer during a temporary fixing or a roll-to-roll operation can be prevented. The adhesive composition includes: a styrene-based elastomer containing a carboxyl group; a styrene-based elastomer containing no carboxyl group; and an epoxy resin.
C09J 153/00 - Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
[Problem] To provide: a heat conductive member that can be adapted to various forms of heat sources, has excellent heat dissipation efficiency, and can have reduced heat conduction to adjoining heat sources; and a battery provided with the heat conductive member. [Solution] The present invention pertains to a heat conductive member 1 in which: a plurality of elongated members 10 are arranged and fixed in a width direction perpendicular to a longitudinal direction of the elongated members 10; the elongated members 10 each have a heat conductive sheet 11 as an outer shell; a space 15 is provided inside the outer shell; a surface of the elongated member 10 as viewed in the longitudinal direction thereof is in the shape of an oval, a quadrangle, or a polygon having five or more corners; the plurality of elongated members 10 are arranged such that flat surfaces, or surfaces closest to flat surfaces, of the elongated member 10 are parallel with the width direction; and the plurality of elongated members 10 are fixed on at least opposite end sides in the longitudinal direction thereof by fixing sheets 21 and 22 extending in the width direction. The present invention also pertains to a battery 50 provided with the heat conductive member 1.
The sealability against interior positive pressure is ensured, while reducing particles generated by friction in opening and closing a lid. Disclosed is a substrate storage container, including: a container body configured to store at least one substrate; and a lid configured to close an opening of the container body. In the substrate storage container, a first part of the container body, the first part being provided around the opening, is non-contact at least partially with a second part of the lid, the second part being opposed to the first part; and the first part and the second part cooperatively form a labyrinth seal structure.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate storage container is provided with a valve body attached thereto which includes a first cylindrical portion having one end communicating with the outside of a container body, a second cylindrical portion having one end communicating with the interior of the container body and spaced apart from the other end of the first cylindrical portion, a plug member positioned between the other end of the first cylindrical portion and the other end of the second cylindrical portion, and an elastic body that covers at least the plug member and has an inner diameter equal to or smaller than the outer diameter of the plug member, and wherein gas flow to the container body is controlled by close contact between the plug member and the elastic body.
F16K 17/18 - Safety valves; Equalising valves opening on surplus pressure on either side
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
F16K 7/02 - Diaphragm cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage with tubular diaphragm
F16K 15/02 - Check valves with guided rigid valve members
89.
Electrical connector and method for producing same
Provided is an electric connector, which is to be arranged between a connection terminal of a first device and a connection terminal of a second device, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, the electric connector including a composite, the composite including: an elastic body having a plurality of through holes that penetrate therethrough in a thickness direction; and a conductive member, which is joined to an inner wall of each of the through holes, and is configured to electrically connect the connection terminal of the first device and the connection terminal of the second device to each other, wherein at least a part of a vicinity of at least one of distal ends of the conductive member is hollow.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 33/94 - Holders formed as intermediate parts for linking a counter-part to a coupling part
B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
H01R 43/18 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 13/24 - Contacts for co-operating by abutting resiliently mounted
H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
Provided is a substrate storage container in which a cleansing liquid does not readily remain in an air supply mechanism. A substrate storage container having an opening in the front-surface side thereof and comprising an air supply mechanism in a bottom surface, the air supply mechanism comprising an introduction path for receiving air from the bottom-surface side, a check valve that is positioned at a position that does not overlap the introduction path in a horizontal plan view along the bottom surface, and a flow path that supplies air from the introduction path to the check valve.
B65D 43/00 - Lids or covers for rigid or semi-rigid containers
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
Provided is a substrate storage container having an increased ability of mounting a conveyed component. A substrate storage container 1 is provided with a conveyed component 30 which can be mounted to a container body 20 by being displaced from a rear side to a front side relative to the container body 20, wherein the container body 20 is provided with a body-side projection 29 which projects upward, the conveyed component 30 is provided with a component-side projection 34 which projects downward, the component-side projection 34 is engaged with the front side of the body-side projection 29 so as to restrict displacement toward the rear side in a mounted state, and the amount of displacement when a prescribed load is applied upward to the component-side projection 34 is less than that when the same load is applied downward to the body-side projection 29.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
Provided is a panel storage container that can suppress flexure of the middle portions of the panels. A panel storage container has: a container body for storing panels; and a panel support means for supporting the panels. The panel support means has: a panel support portion for supporting right and left edges of the panels; a central support portion for supporting each middle portion of the panels; and elastic bodies for contacting the panels, the elastic bodies being provided along a front and rear direction of the central support portion at a predetermined interval.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 25/10 - Devices to locate articles in containers
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Provided is a board accommodation container provided with a retainer having a structure that can effectively absorb deflection of a board. The present invention is provided with: a container body for accommodating a board; a lid body that closes an opening provided in a front surface of the container body; and a retainer that is provided on the rear surface side of the lid body and restricts the movement of the board toward the front surface side. The retainer is configured by integrally forming: a frame body that is detachably provided to the rear surface side of the lid body; an abutment part having a protruding portion that abuts the board and restricts the movement of the board toward the front surface side; and a beam structure coupled with the abutment part and the frame body. The abutment part and the beam structure are separately provided from the lid body.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
94.
Substrate storage container with umbrella-shaped seal lip
Corrosion resistance of valves is enhanced, while ensuring the check valve function of the valves against an inflow of outside air. Disclosed is a substrate storage container that includes: a container body for storing at least one substrate; a lid for closing an opening of the container body; and at least one valve for controlling gas flow to the container body or from the container body. The at least one valve includes an elastic, non-metallic seal lip in a communication passage that extends in a first direction and communicates between an outside of the container body and an inside of the container body. The seal lip has an umbrella-like form which closes on one side in the first direction and opens on the other side in the first direction, the seal lip abutting an inner peripheral wall of the communication passage on the other side.
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Provided is a substrate storage container including a valve(s) capable of controlling flow of gas without using a metallic member. The valve(s) are attached to a substrate storage container and include: a cylindrical body having an open edge and an interior space; a stopcock portion partitioning the interior space into a first space and a second space and extending to the open edge; and an elastic body covering the open edge and the stopcock portion. The first space has a first communication hole communicating with an outside of the container body. The second space has a second communication hole communicating with an inside of the container body. The elastic body controls flow of gas relative to the container body by closely contacting the stopcock portion or separating from the stopcock portion.
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 81/20 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
96.
Substrate storage container and method of manufacturing the same
There is provided a substrate storage container 1 capable of suppressing deformation of a functional member insert-molded and a method of manufacturing the container 1, and an device positioning member 4 as the functional member including: an attachment part 41 having a thick section 413 formed in thickness equal to a wall member of a container body 10 or a lid 20 and a thin section 410 decreasing in thickness as it approaches toward an outer edge from the thick section 413; and a body part 42 coupled to the attachment part 41, the device positioning member 4 being disposed on the container body 10 or the lid 20 so that a first surface 420 of the thick section 413 is flush with an inner surface of the wall member.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
97.
RESIN FILM, HIGH-FREQUENCY CIRCUIT BOARD, AND PRODUCTION METHOD FOR HIGH-FREQUENCY CIRCUIT BOARD
Provided are: a resin film that can achieve improved thermal dimensional stability without a reduction in the low-dielectric properties and heat resistance characteristic of a film that is for use, for example, in a high-frequency circuit board produced from a poly(arylene ether ketone) resin; a high-frequency circuit board; and a production method for the high-frequency circuit board. A resin film 1 that contains 100 parts by mass of a poly(arylene ether ketone) resin and 10–80 parts by mass of a non-swelling synthetic mica. The resin film 1 is molded using a molding material 4 that contains a non-swelling synthetic mica and can therefore achieve a reduced coefficient of linear expansion. As a result, the thermal dimensional stability of the resin film 1 is improved, it is possible to suppress differences in thermal dimensional properties relative to a metal layer that comprises a metal foil 2 or the like, and, when a conductive layer 3 is formed to produce a high-frequency circuit board, it is possible to prevent curling and deformation of the high-frequency circuit board.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
C08L 71/10 - Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 μm.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 7/22 - Metal wires or tapes, e.g. made of steel
H01R 13/405 - Securing in non-demountable manner, e.g. moulding, riveting
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
99.
HEAT-DISSIPATING STRUCTURE SHEET AND METHOD FOR MANUFACTURING HEAT-DISSIPATING STRUCTURE
[Problem] To provide a heat-dissipating structure sheet and a method for manufacturing a heat-dissipating structure. The heat-dissipating structure sheet is adaptable to various forms of a heat source, lightweight, highly elastically deformable, has high heat-dissipating efficiency, and makes it possible to increase heat-dissipating structure producibility. [Solution] The present invention relates to a heat-dissipating structure sheet 60 that is a sheet-like member and a method for manufacturing a heat-dissipating structure 25. The heat-dissipating structure sheet 60 comprises a plurality of heat-dissipating members 27 for increasing heat dissipation from a heat source 20, and a fixing member 50 fixing the heat-dissipating members 27. The heat-dissipating members 27 include: a heat transfer sheet 30 that extends in a spirally winding manner to transfer heat from the heat source 20; and a tubular cushioning member 31 which is provided on an annular back surface of the heat transfer sheet 30, has a through-path 32 penetrating through in a direction in which the heat transfer sheet 30 extends in a spirally winding manner, and is more easily deformable to follow the surface shape of the heat source 20 compared to the heat transfer sheet 30. The fixing member 50 is a sheet-like member which fixes the plurality of heat-dissipating members 27 with longitudinal ends 28, 28 thereof mounted to the fixing member 50, contactlessly with respect to intermediate portions 29 which are portions of the heat-dissipating members 27 other than the ends 28, 28.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
A substrate storage container includes a container main body having an opening at the front, a support portion for supporting a substrate in the interior thereof, and a substrate receiving portion positioned more toward a rear wall than the support portion, an a lid on which a substrate pressing portion for pressing the substrate is formed. The substrate receiving portion and the substrate pressing portion are present within a range of greater than or equal to 0 mm and less than or equal to 80 mm in the horizontal direction from a vertical center line that passes through the center of the container main body when the lid is viewed from the front.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65D 85/30 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
