Shibaura Mechatronics Corporation

Japan

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H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components 47
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees 25
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation 24
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches 24
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting 22
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1.

VIBRATING BODY AND SUBSTRATE PROCESSING APPARATUS

      
Application Number JP2023035170
Publication Number 2024/071209
Status In Force
Filing Date 2023-09-27
Publication Date 2024-04-04
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kamiya, Masaya
  • Demura, Kensuke
  • Nakamura, Satoshi
  • Nakamura, Minami

Abstract

A vibrating body according to an embodiment is used for cleaning a substrate. A contact portion of the vibrating body with a liquid on a surface of the substrate has a region which is inclined with respect to an end of the vibrating body that faces the substrate. If the angle between the inclined region and an extension line of the end of the vibrating body is θ, the expression included herein is satisfied. 20°≤θ≤87°

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
  • B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

2.

CLEANING APPARATUS

      
Application Number 18371121
Status Pending
Filing Date 2023-09-21
First Publication Date 2024-03-28
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Imaoka, Yuichi

Abstract

According to one embodiment of the present disclosure, a cleaning apparatus includes a plurality of rollers that rotates a substrate in contact with an outer periphery of the substrate; a rotation mechanism including a motor that rotates the rollers about the rotation shaft; a cover interposed between the rollers and the rotation mechanism to cover the rotation mechanism; an ejection port provided in the cover and that ejects gas between the cover and the rollers; a negative pressure region provided in the cover on a side of the rotation mechanism and having a negative pressure lower than an atmospheric pressure outside the cover through exhaust; a liquid ejector that ejects a cleaning liquid onto the substrate; and a cleaning unit that brings the brush into contact with at least one surface of the substrate that is being rotated, thereby cleaning the surface of the substrate.

IPC Classes  ?

  • B08B 7/04 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
  • B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • B08B 11/02 - Devices for holding articles during cleaning

3.

SUBSTRATE PROCESSING DEVICE

      
Application Number JP2023033901
Publication Number 2024/063049
Status In Force
Filing Date 2023-09-19
Publication Date 2024-03-28
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Furuya Masaaki
  • Kobayashi Hiroaki
  • Mori Hideki

Abstract

Provided is a substrate processing device that makes it possible to synchronize a plurality of clamp pins to stably position a substrate at a center of rotation. A substrate processing device 1 according to an embodiment of the present invention comprises: a clamp lever 12 that, in accordance with rotation about a horizontal axis, moves at least three clamp pins 11 between an open position away from the outer peripheral edge We of a substrate W and a closed position for contacting the outer peripheral edge We and holding the substrate W; a rising/lowering ring 15 that rotates the clamp lever 12 in accordance with rising and lowering; a rotating body 30 that rotates the substrate W held by the clamp pins 11; a rotation mechanism 40 that rotates the rotating body 30 about an axis Ax; a raising/lowering mechanism 50 that raises and lowers the rising/lowering ring 15; a biasing member 56 that biases the clamp lever 12 in a direction for achieving the closed position; a synchronization ring 61 that is provided so as to be rotatable about the axis Ax and incapable of rising and lowering; a conversion mechanism 62 that converts rising and lowering of the rising/lowering ring 15 into rotation of the synchronization ring 61, while maintaining the orientation of the rising/lowering ring 15 in a horizontal state; and a supply unit 70 that supplies a processing liquid to the substrate W.

IPC Classes  ?

  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

4.

CLEANING APPARATUS FOR WAFER STORAGE CONTAINER

      
Application Number 18369002
Status Pending
Filing Date 2023-09-15
First Publication Date 2024-03-21
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ishihara, Junji
  • Yamazaki, Katsuhiro
  • Miyasako, Hisaaki
  • Nishibe, Yukinobu

Abstract

According to an embodiment of the present disclosure, the cleaning apparatus includes a cleaning tank body having a body opening and a cleaning space; a lid provided to be openable and closable with respect to the body opening; a mounting stage provided in the cleaning space placing a shell of a wafer storage container; a first ejector that ejects a cleaning liquid into a storage space of the shell; a second ejector that ejects the cleaning liquid into an outer portion of the shell; a first discharge port that discharges the cleaning liquid ejected into the storage space of the shell; a second discharge port that discharges the cleaning liquid that has passed through the outer portion of the shell; and a particle counter that measures particles in the cleaning liquid discharged by the first discharge port.

IPC Classes  ?

  • B08B 9/08 - Cleaning of containers, e.g. tanks
  • B08B 9/20 - Cleaning of containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans, are brought
  • B08B 9/46 - Inspecting cleaned containers for cleanliness

5.

SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE

      
Application Number 18469619
Status Pending
Filing Date 2023-09-19
First Publication Date 2024-03-21
Owner
  • SHIBAURA MECHATRONICS CORPORATION (Japan)
  • KIOXIA CORPORATION (Japan)
Inventor
  • Demura, Kensuke
  • Nakamura, Satoshi
  • Kamiya, Masaya
  • Nakamura, Minami
  • Takai, Kosuke
  • Tanabe, Mana
  • Umezawa, Kaori

Abstract

According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

6.

SUBSTRATE PROCESSING APPARATUS

      
Application Number 18212395
Status Pending
Filing Date 2023-06-21
First Publication Date 2023-12-28
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hamada, Takahiro
  • Yamazaki, Osamu

Abstract

According to one embodiment, a substrate processing apparatus includes a rotating table configured to rotate a substrate and a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate, wherein each fixing member includes a curved surface on a side that abuts the substrate, a reduced portion formed to be connected to an end of the curved surface and having a width which is continuously reduced in the first direction from a boundary with the curved surface, a first sloping surface formed on a top portion to slope downwards in the first direction, and a support portion formed on the curved surface and configured to support the substrate such that a top surface of the top portion is flush with an upper surface of the substrate in a state where the substrate is grasped.

IPC Classes  ?

  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • B23Q 1/03 - Stationary work or tool supports

7.

FILM FORMATION APPARATUS

      
Application Number 18337764
Status Pending
Filing Date 2023-06-20
First Publication Date 2023-12-21
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Takizawa, Yoji
  • Higuchi, Masatoshi

Abstract

A film formation apparatus includes: a chamber which an interior thereof can be made vacuum; a rotary table provided inside the chamber, holding a workpiece, and circulating and transporting the workpiece in a circular trajectory; a film formation unit including a target formed of film formation material and a plasma generator which turns sputtering gas introduced between the target and the rotary table into plasma, the film formation unit depositing by sputtering film formation material on the workpiece; a film processing unit processing the film deposited by the film formation unit on the workpiece; holding regions each holding the workpiece and provided in a circular film formation region facing the film formation unit and the film processing unit that is a region other than the rotation axis in the rotary table; and a heater provided in the holding regions.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • C23C 14/50 - Substrate holders
  • C23C 14/54 - Controlling or regulating the coating process
  • C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • C23C 14/58 - After-treatment
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • H01J 37/32 - Gas-filled discharge tubes

8.

FILM FORMATION APPARATUS AND FILM FORMATION METHOD

      
Application Number 18029054
Status Pending
Filing Date 2021-09-15
First Publication Date 2023-11-16
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Matsunaka, Shigeki
  • Fujita, Atsushi

Abstract

According to an embodiment, a film formation apparatus and a film formation method that can form GaN film with high productivity are provided. The film formation apparatus includes: the chamber which an interior thereof can be made vacuum; the rotary table provided inside the chamber, holding a workpiece, and circulating and transporting the workpiece in a circular trajectory, a GaN film formation processing unit including a target formed of film formation material containing GaN and a plasma generator which turns sputtering gas introduced between the target and the rotary table into plasma, the GaN film formation processing unit depositing by sputtering particles of the film formation material containing GaN on the workpiece circulated and transported by the rotary table; and a nitriding processing unit nitriding particles of the film formation material deposited on the workpiece circulated and transported by the rotary table in the GaN film formation processing unit.

IPC Classes  ?

  • C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • C23C 14/34 - Sputtering
  • C23C 14/48 - Ion implantation
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering

9.

ELECTROMAGNETIC WAVE ATTENUATOR, ELECTRONIC DEVICE, FILM FORMATION APPARATUS, AND FILM FORMATION METHOD

      
Application Number 18328892
Status Pending
Filing Date 2023-06-05
First Publication Date 2023-10-12
Owner Shibaura Mechatronics Corporation (Japan)
Inventor
  • Nishigaki, Hisashi
  • Fujita, Atsushi
  • Tanabe, Shohei
  • Kamo, Yoshinao
  • Matsunaka, Shigeki

Abstract

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

IPC Classes  ?

  • H01L 23/552 - Protection against radiation, e.g. light
  • H01F 10/26 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
  • H01F 10/30 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of intermediate layers
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

10.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Application Number 18123793
Status Pending
Filing Date 2023-03-20
First Publication Date 2023-09-28
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hayashi, Konosuke
  • Higuchi, Koichi

Abstract

According to one embodiment, a substrate processing apparatus includes: a holding unit that holds a substrate; a driving unit that is provided in the holder and rotates the substrate together with the holder; a supply unit that supplies a processing liquid to a target surface of the substrate; a first cup provided to surround the substrate; a second cup provided to surround the first cup and having an inner wall surface having a property different from a property of an inner wall surface of the first cup; and a movement controller that moves the first cup and the second cup such that the processing liquid scattered from the substrate is received either on the inner wall surface of the first cup or on the inner wall surface of the second cup.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

11.

PROCESSING LIQUID SUPPLY DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR INSPECTING PROCESSING LIQUID SUPPLY DEVICE

      
Application Number 18125310
Status Pending
Filing Date 2023-03-23
First Publication Date 2023-09-28
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Furuya, Masaaki
  • Kobayashi, Hiroaki
  • Mori, Hideki

Abstract

According to one embodiment, a processing liquid supply device includes: a tank that stores the processing liquid; a supply path that supplies the processing liquid to the processing device; a heater that heats the processing liquid; a thermometer that measures a temperature of the processing liquid; a densitometer that measures a concentration of the processing liquid; and a controller including an inspecting unit that inspects the densitometer. The inspecting unit includes: a temperature setting device that sets a boiling point temperature at which a predetermined concentration is reached as a predetermined temperature; a heating controller that heats the processing liquid by the heater so as to reach a target temperature within a predetermined range; and a determination device that determines whether or not the concentration of the processing liquid is a target concentration within a predetermined range based on the predetermined concentration.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

12.

PROCESSING LIQUID SUPPLY DEVICE, SUBSTRATE PROCESSING APPARATUS, AND PROCESSING LIQUID SUPPLY METHOD

      
Application Number 18119401
Status Pending
Filing Date 2023-03-09
First Publication Date 2023-09-14
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Furuya, Masaaki
  • Kobayashi, Hiroaki
  • Mori, Hideki

Abstract

According to one embodiment, a processing liquid supply device includes a plurality of tanks, a supply path that supplies a processing liquid to a processing device, a heating unit that heats the processing liquid, a dilution unit that dilutes the processing liquid, a new-liquid supply unit that supplies a new liquid, a common flow path through which the processing liquid of the plurality of tanks passes, a switching unit that switches between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path, a densitometer provided in the common flow path, and a control device that controls at least one of the heating unit, the dilution unit, and the new-liquid supply unit so that the concentration reaches a target value set in advance.

IPC Classes  ?

  • B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material

13.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Application Number 18103462
Status Pending
Filing Date 2023-01-30
First Publication Date 2023-08-03
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Takakita, Yoko

Abstract

The substrate processing apparatus includes: a rotating unit that holds and rotates a substrate; a processing liquid supply unit including an ejecting unit that supplies a processing liquid from the ejecting unit to a target surface of the substrate that is being rotated by the rotating unit so as to process the substrate; and the receiving unit 30 including a container having an open top, and relatively movable with respect to the ejecting unit 21 between a block position where the supply of the processing liquid from the ejecting unit 21 is blocked and an allowance position where the supply of the processing liquid from the ejecting unit is allowed.

IPC Classes  ?

  • B05B 12/18 - Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
  • B05B 9/00 - Spraying apparatus for discharge of liquid or other fluent material without essentially mixing with gas or vapour
  • B05B 16/40 - Construction elements specially adapted therefor, e.g. floors, walls or ceilings

14.

SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD

      
Application Number JP2022046444
Publication Number 2023/127553
Status In Force
Filing Date 2022-12-16
Publication Date 2023-07-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Arai Rie
  • Nishibe Yukinobu
  • Kato Shun
  • Futatsukawa Shinji

Abstract

Provided are a substrate transfer device and a substrate transfer method that make it possible to transport a substrate between processing devices while maintaining the surface of the substrate in a wet state. A substrate transfer device 2 according to one embodiment includes: a carriage accommodating part 210 having an accommodating chamber 211 which receives a substrate conveyance carrier 1 from outside the device and accommodates such carrier, the substrate conveyance carrier having mounted thereon a tank 110 accommodating a plurality of substrates W together with water; and an extraction device 250 that extracts the substrates W from the tank 110 mounted on the substrate conveyance carrier 1 accommodated in the accommodating chamber 211, and delivers the substrates to a cleaning device 3 which is an adjacent treatment device.

IPC Classes  ?

  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

15.

SUBSTRATE TRANSPORT CARRIAGE

      
Application Number JP2022046445
Publication Number 2023/127554
Status In Force
Filing Date 2022-12-16
Publication Date 2023-07-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kato Shun
  • Futatsukawa Shinji
  • Arai Rie
  • Nishibe Yukinobu

Abstract

Provided is a substrate transport carriage capable of transporting a substrate between processing apparatuses while maintaining a wet condition of the surface of the substrate. A substrate transport carriage of an embodiment comprises: a tank 110 in which a plurality of substrates W can be stored in a water-immersed state and in a direction allowing for removal from above, the substrates W being spaced apart from each other and stacked and housed in a cassette 4; and a transport unit 120 that can travel with the tank 110 mounted thereon.

IPC Classes  ?

  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
  • B08B 3/02 - Cleaning by the force of jets or sprays
  • B62B 3/00 - Hand carts having more than one axis carrying transport wheels; Steering devices therefor; Equipment therefor
  • B65G 1/00 - Storing articles, individually or in orderly arrangement, in warehouses or magazines
  • B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
  • H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers

16.

MAINTENANCE METHOD AND HEAT TREATMENT APPARATUS

      
Application Number 17951716
Status Pending
Filing Date 2022-09-23
First Publication Date 2023-04-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ishihara, Junji
  • Iso, Akinori
  • Masuda, Hirokazu

Abstract

Provided is a maintenance method of a heat treatment apparatus including a chamber having a box shape and provided with a heater and a receiving member that supports a cassette having a box shape including a space in which a workpiece is supported. The maintenance method includes: attaching a loading/unloading jig including a roller on an upper portion and capable of moving the roller upward and downward, to the receiving member; transmitting the cassette supported by the receiving member onto the roller by raising the loading/unloading jig; unloading the cassette to an outside of the chamber by moving the cassette on the roller; loading the cassette into the chamber by moving the cassette on the roller; transmitting the cassette to the receiving member by lowering the loading/unloading jig; and detaching the loading/unloading jig from the receiving member.

IPC Classes  ?

  • B05D 3/04 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
  • B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
  • B05C 13/00 - Means for manipulating or holding work, e.g. for separate articles

17.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Application Number JP2022035858
Publication Number 2023/054326
Status In Force
Filing Date 2022-09-27
Publication Date 2023-04-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Koyama Hiroki

Abstract

The present invention provides a substrate processing apparatus and a substrate processing method, which are capable of suppressing the occurrence of defective products by protecting a portion, which is exposed after etching, with an oxide film. A substrate processing apparatus 1 according to one embodiment of the present invention is provided with: a rotor 10 which holds and rotates a substrate W; a first processing liquid supply unit 40 which performs etching by supplying a first processing liquid for etching to a surface to be processed of the substrate W that is rotated by the rotor 10; and a second processing liquid supply unit 50 which performs, following the etching by means of the supply of the first processing liquid, an oxide film formation process by supplying a second processing liquid for oxidation to the surface to be processed of the substrate W that is rotated by the rotor 10.

IPC Classes  ?

  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching

18.

SUPPLY TANK, SUPPLY DEVICE AND SUPPLY SYSTEM

      
Application Number 17942520
Status Pending
Filing Date 2022-09-12
First Publication Date 2023-03-16
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Furuya, Masaaki
  • Kobayashi, Hiroaki
  • Mori, Hideki

Abstract

According to one embodiment, provided is a supply tank a supply device, and a supply system that stabilizes the liquid temperature of a process liquid to be supplied to a substrate processing device. A supply tank that supplies a process liquid to a substrate processing device includes a container that stores the process liquid, a first dividing plate that divides the container into a first region where the process liquid is introduced, and a second region that supplies the process liquid to the substrate processing device, first piping that feeds, to the second region, the process liquid introduced in the first region, and a first heater which is provided on a path through the first piping, and which heats the process liquid.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

19.

SUPPLY DEVICE AND SUPPLY SYSTEM

      
Application Number 17942786
Status Pending
Filing Date 2022-09-12
First Publication Date 2023-03-16
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Furuya, Masaaki
  • Kobayashi, Hiroaki
  • Mori, Hideki

Abstract

A supply device includes a collect tank which collects a process liquid from a substrate processing device and heats the collected liquid, and a supply tank connected to the collect tank and which supplies, to the substrate processing device, the process liquid heated in the collect tank. The collect tank includes a collect container that stores the process liquid, a first dividing plate that divides the collect container into a first region where the process liquid is introduced from the substrate processing device, and a second region that introduces the process liquid to the supply tank, piping that feeds, to the second region, the process liquid introduced in the first region, a first heater provided on a path through the piping and which heats the process liquid, and feed piping that feeds, to the supply tank, the process liquid in the second region and heated by the first heater.

IPC Classes  ?

  • B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
  • B05C 11/11 - Vats or other containers for liquids or other fluent materials

20.

SUBSTRATE DRYING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

      
Application Number 17656059
Status Pending
Filing Date 2022-03-23
First Publication Date 2022-10-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Taruno, Yoko

Abstract

A substrate drying apparatus and a substrate processing apparatus that can reduce the blockade of patterns are provided. The substrate drying apparatus according to one embodiment includes: the drier (substrate drying apparatus) of the present disclosure, includes the heater which heats the substrate, the drying room into which the substrate wherein the liquid film of the processing liquid is formed on the surface to be processed is carried in, the support which receives the substrate carried into the drying room at the standby position distant from the heater, and the driving mechanism which moves the substrate close to the heater and ejects the liquid at which the gas layer is produced between the substrate heated by the heater and the liquid film by centrifugal force due to the rotation of the substrate.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
  • B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning

21.

FILM FORMATION APPARATUS

      
Application Number 17657262
Status Pending
Filing Date 2022-03-30
First Publication Date 2022-10-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Nishigaki, Hisashi
  • Yoshimura, Koji

Abstract

According to one embodiment, a film formation apparatus that suppresses effects of pre-processing and enables stable film formation is provided. A film formation apparatus of the present disclosure includes a chamber that can be made vacuum, a transporter that is provided inside the chamber and that circulates and transports a workpiece in a trajectory of a circle, a film formation unit that forms film by sputtering on the workpiece circulated and transported by the transporter, a load-lock room that loads the workpiece into and out of the chamber relative to air space while keeping an interior of the chamber vacuum, and a pre-processing unit that is provided in the chamber at a position adjacent to the load-lock room and that performs pre-processing to the workpiece loaded in from the load-lock room in a state distant from the transporter.

IPC Classes  ?

  • H01J 37/32 - Gas-filled discharge tubes
  • C23C 14/50 - Substrate holders
  • C23C 14/34 - Sputtering
  • C23C 14/56 - Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • C23C 14/54 - Controlling or regulating the coating process

22.

SUBSTRATE TREATMENT DEVICE

      
Application Number 17704135
Status Pending
Filing Date 2022-03-25
First Publication Date 2022-09-29
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Nakamura, Minami
  • Demura, Kensuke

Abstract

A substrate treatment device includes a placement platform rotating a substrate, a cooling part supplying a cooling gas to a space between the placement platform and the substrate, a liquid supplier supplying a liquid to a surface of the substrate opposite to the placement platform side, a detector that is above the surface of the substrate and detects a freezing start of the liquid, and a controller controlling the substrate rotation, the cooling gas supply, and the liquid supply. The controller controls at least one of the substrate rotation, the cooling gas flow rate, or the liquid supply rate, and causes the liquid on the substrate surface to reach a supercooled state; and when determining based on a signal from the detector that the freezing of the supercooled liquid has started, the controller starts thawing the frozen liquid after a prescribed interval has elapsed from the freezing start of the liquid.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

23.

SUBSTRATE TREATMENT DEVICE

      
Application Number 17665657
Status Pending
Filing Date 2022-02-07
First Publication Date 2022-08-25
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kamiya, Masaya
  • Demura, Kensuke

Abstract

A substrate treatment device according to an embodiment includes a placement part that includes a placement platform on which a substrate is placeable and that is configured to rotate the placed substrate, a cooling nozzle configured to supply a cooling gas to a space between the placement platform and the substrate, a liquid supplier configured to supply a liquid to a surface of the substrate opposite to the placement platform side, and a dispersion plate located at a discharge side of the cooling gas of the cooling nozzle. The dispersion plate includes a first hole extending through the dispersion plate in a thickness direction. The first hole is located at a position overlapping a central axis of the cooling nozzle when viewed along a direction along the central axis of the cooling nozzle.

IPC Classes  ?

  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

24.

HEAT TREATMENT DEVICE

      
Application Number 17582298
Status Pending
Filing Date 2022-01-24
First Publication Date 2022-08-04
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Imaoka, Yuichi
  • Mochizuki, Yosuke
  • Kuroiwa, Kyota
  • Iso, Akinori

Abstract

According to an embodiment of the present disclosure, a heat treatment device includes: a chamber capable of maintaining an atmosphere that is decompressed from an atmospheric pressure; an exhaust unit capable of exhausting an inside of the chamber through an exhaust port provided in the chamber; a support portion provided inside the chamber and capable of supporting a workpiece; a first heating unit provided inside the chamber and capable of heating the workpiece; an adhesion preventive plate detachably provided on an inner wall of the chamber; and a second heating unit capable of heating the adhesion preventive plate.

IPC Classes  ?

  • H05B 3/22 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible

25.

FILM DEPOSITION DEVICE AND FILM DEPOSITION METHOD

      
Application Number JP2021033945
Publication Number 2022/070922
Status In Force
Filing Date 2021-09-15
Publication Date 2022-04-07
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Matsunaka Shigeki
  • Fujita Atsushi

Abstract

Provided are a film deposition device and a film deposition method by which a GaN film can be deposited with high productivity. A film deposition device 1 according to an embodiment of the present invention has: a GaN film deposition processing unit 40A which has a chamber 20 the interior of which can be evacuated, a rotary table 31 disposed inside the chamber 20, holding workpieces 10, and conveying the workpieces 10 in a circulating manner along a circumferential track, a target made of a GaN-containing film deposition material, and a plasma generator for generating plasma of a sputtering gas G1 introduced between the target and the rotary table, and which causes particles of a film deposition material containing GaN and Ga to be deposited by means of sputtering onto the workpieces 10 being conveyed in the circulating manner by the rotary table 31; and a nitriding processing unit 50 which nitrides the particles of the film deposition material deposited by the GaN film deposition processing unit 40A onto the workpieces 10 being conveyed in the circulating manner by the rotary table 31.

IPC Classes  ?

  • C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • H01L 21/203 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using physical deposition, e.g. vacuum deposition, sputtering

26.

SUBSTRATE PROCESSING APPARATUS

      
Application Number 17469876
Status Pending
Filing Date 2021-09-09
First Publication Date 2022-03-17
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Demura, Kensuke
  • Matsushima, Daisuke
  • Kamiya, Masaya

Abstract

A substrate processing apparatus according to an embodiment of the present disclosure includes a stage having a substantially disc-shaped form and including a hole in a center thereof; a roller that contacts a side surface of the stage and rotates the stage; a first liquid nozzle that supplies a first liquid to a first surface of the substrate; a first driver that moves a position of the first liquid nozzle; a second liquid nozzle that supplies a second liquid from the hole of the stage to a second surface of the substrate; a second driver that moves a position of the second liquid nozzle; a cooling nozzle that supplies a cooling gas from the hole of the stage to the second surface; a third driver that moves a position of the cooling nozzle; and a controller that controls the first driver, the second driver, and the third driver.

IPC Classes  ?

  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • B08B 3/04 - Cleaning involving contact with liquid
  • B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning

27.

Film formation apparatus

      
Application Number 17474403
Grant Number 11955367
Status In Force
Filing Date 2021-09-14
First Publication Date 2022-03-17
Grant Date 2024-04-09
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Tanabe, Shohei
  • Yoshimura, Koji
  • Matsuhashi, Ryo

Abstract

A film deposition apparatus reduces hillock formation while yielding uniform film thickness distribution. A film deposition apparatus of a present embodiment includes: a chamber; a rotary table that circulates and carries a workpiece W along a circumferential transfer path L; multiple targets that contain a film deposition material, and that are provided in positions at different radial distances from a center of rotation of the rotary table; a shield member that forms a film deposition chamber surrounding a region where the film deposition material scatters, and that has an opening on the side facing the circulated and carried workpiece; and a plasma generator that includes a sputter gas introduction unit for introducing a sputter gas into the film deposition chamber, and a power supply unit for applying power to the target, and that generates plasma in the sputter gas G1 in the film deposition chamber.

IPC Classes  ?

  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01J 37/32 - Gas-filled discharge tubes
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

28.

SUBSTRATE CARRYING APPARATUS

      
Application Number 17476368
Status Pending
Filing Date 2021-09-15
First Publication Date 2022-03-17
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Furuya, Masaaki

Abstract

A substrate carrying apparatus that can reduce attachment of dust to substrates can be provided. The substrate carrying apparatus 1 of the present embodiment includes a carrying arm 2 for carrying a substrate, a column 32 standing up from a base body 31 with fixed angle, an upper link 33 which supports the carrying arm 2 at one end, which is rotatably connected to the column 32, and which moves the carrying arm 2 up and down in accordance with a rotation, a lower link 34 which is connected to be rotatable around an axis in parallel with a rotation axis of the upper link 33 as a center below a portion of the column 32 connected to the upper link 33, a connection link 35 which is rotatably connected to the upper link 33 and the lower link 34 so that the upper link 33 rotates in accordance with a rotation of the lower link 34, and a driving unit 4 which rotates the lower link 34.

IPC Classes  ?

  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B65G 47/90 - Devices for picking-up and depositing articles or materials

29.

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

      
Application Number 17372931
Status Pending
Filing Date 2021-07-12
First Publication Date 2022-02-03
Owner Shibaura Mechatronics Corporation (Japan)
Inventor Nagashima, Yuji

Abstract

According to one embodiment, a substrate treatment method of removing an upper end of a protrusion on a substrate is disclosed. An unevenness is formed on a surface of the substrate. The method can supply a first liquid on the surface of the substrate. The unevenness is formed on the surface. The method can form a protective layer. The protective layer covers the surface of the substrate from the first liquid supplied to the surface of the substrate. The method can supply a second liquid onto the protective layer. In addition the method can physically remove the protective layer which is on the upper end of the protrusion, and can bring the second liquid into contact with the upper end of the protrusion. The protective layer is removed from the upper end of the protrusion.

IPC Classes  ?

  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
  • B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
  • A46B 13/00 - Brushes with driven brush bodies
  • A46B 13/02 - Brushes with driven brush bodies power-driven
  • A46B 9/00 - Arrangements of the bristles in the brush body

30.

Cooling device, substrate treatment device, cooling method, and substrate treatment method

      
Application Number 17321639
Grant Number 11948812
Status In Force
Filing Date 2021-05-17
First Publication Date 2021-11-25
Grant Date 2024-04-02
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Demura, Kensuke

Abstract

According to one embodiment, a cooling device includes a flow path configured to flow a refrigerant, a condenser provided in the flow path, a heat exchanger provided in the flow path, a compressor provided in the flow path between the condenser and the heat exchanger, a cooler cooling the refrigerant flowing from the condenser into the heat exchanger, a gas cooling part supplying a gas to the heat exchanger, and configured to cool the gas by exchanging heat with the refrigerant, a first thermometer configured to detect a temperature of the cooled gas, a second thermometer configured to detect a temperature of the refrigerant flowing into the heat exchanger, and a first controller configured to control the temperature of the cooled refrigerant flowing into the heat exchanger by the cooler. The first controller controls the temperature of the cooled refrigerant by switching a first control and a second control.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 3/04 - Cleaning involving contact with liquid
  • F25B 13/00 - Compression machines, plants or systems, with reversible cycle
  • H01J 37/32 - Gas-filled discharge tubes
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/311 - Etching the insulating layers

31.

SUBSTRATE TREATMENT DEVICE

      
Application Number 17230152
Status Pending
Filing Date 2021-04-14
First Publication Date 2021-10-21
Owner Shibaura Mechatronics Corporation (Japan)
Inventor
  • Matsushima, Daisuke
  • Demura, Kensuke
  • Nakamura, Satoshi
  • Kamiya, Masaya
  • Nakamura, Minami

Abstract

According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

IPC Classes  ?

  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
  • B08B 3/04 - Cleaning involving contact with liquid
  • F25C 1/12 - Producing ice by freezing water on cooled surfaces, e.g. to form slabs

32.

Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation method

      
Application Number 17205098
Grant Number 11710707
Status In Force
Filing Date 2021-03-18
First Publication Date 2021-09-30
Grant Date 2023-07-25
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Nishigaki, Hisashi
  • Fujita, Atsushi
  • Tanabe, Shohei
  • Kamo, Yoshinao
  • Matsunaka, Shigeki

Abstract

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • H01L 23/552 - Protection against radiation, e.g. light
  • H01F 10/26 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
  • H01F 10/30 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of intermediate layers
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices

33.

SUBSTRATE TREATMENT DEVICE

      
Application Number 17195924
Status Pending
Filing Date 2021-03-09
First Publication Date 2021-09-30
Owner Shibaura Mechatronics Corporation (Japan)
Inventor
  • Demura, Kensuke
  • Matsushima, Daisuke
  • Kamiya, Masaya

Abstract

According to one embodiment, q substrate treatment device includes a placement stand, a plurality of support portions, a cooling part, a liquid supplier, and at least one protrusion. The placement stand has a plate shape, and is configured to rotate. The support portions are provided on one surface of the placement stand and configured to support a substrate. The cooling part is configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions. The liquid supplier is configured to supply a liquid onto a surface of the substrate. At least one protrusion is provided on the one surface of the placement stand and extends along a boundary line of a region where the substrate is provided in a plan view.

IPC Classes  ?

  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration

34.

SUBSTRATE TREATMENT DEVICE

      
Application Number 17181227
Status Pending
Filing Date 2021-02-22
First Publication Date 2021-09-09
Owner Shibaura Mechatronics Corporation (Japan)
Inventor
  • Nakamura, Minami
  • Matsushima, Daisuke
  • Demura, Kensuke

Abstract

According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand side, a detector configured to detect a state of the liquid on the surface of the substrate, and a controller controlling at least one of a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, obtains a temperature of the liquid in the supercooled state at a start of freezing, and is configured to calculate a removal ratio of a contamination.

IPC Classes  ?

  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • G03F 7/20 - Exposure; Apparatus therefor
  • B08B 7/04 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

35.

Substrate treatment device

      
Application Number 17181264
Grant Number 11784040
Status In Force
Filing Date 2021-02-22
First Publication Date 2021-08-26
Grant Date 2023-10-10
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Demura, Kensuke
  • Matsushima, Daisuke
  • Kamiya, Masaya

Abstract

According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.

IPC Classes  ?

  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

36.

FILM FORMATION APPARATUS AND MOISTURE REMOVAL METHOD THEREOF

      
Application Number 17174592
Status Pending
Filing Date 2021-02-12
First Publication Date 2021-08-19
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Tanabe, Shohei
  • Yoshimura, Koji

Abstract

According to one embodiment, a film formation apparatus and a moisture removing method thereof that can facilitate the removement of moisture in the chamber without the complication of the apparatus are provided. The film formation apparatus according to the present embodiment includes the chamber 10 which an interior thereof can be made vacuum, the exhauster 20 that exhausts the interior of the chamber 10, the carrier 30 that circularly carries the workpiece W by a rotation table 31 provided inside the chamber 10, and the plurality of the plasma processor 40 that performs plasma processing on the workpiece W which is circularly carried, in which the plurality of the plasma processor 40 each has the processing spaces 41 and 42 to perform the plasma processing, at least one of the plurality of the plasma processor 40 is the film formation processor 410 that performs film formation processing by sputtering on the workpiece W which is circularly carried, and at least one of the plurality of the plasma processor 40 is the heater 420 that removes moisture in the chamber 10 by producing plasma and heating the interior of the chamber 10 via the rotation table 31 together with exhaustion by the exhauster 20 and rotation by the rotation table 31 in a condition the film formation process by the film formation processor 410 is not performed.

IPC Classes  ?

  • C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
  • C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating

37.

Tablet printing apparatus, tablet printing method, tablet manufacturing apparatus, and tablet manufacturing method

      
Application Number 17026427
Grant Number 11203215
Status In Force
Filing Date 2020-09-21
First Publication Date 2021-04-01
Grant Date 2021-12-21
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Haijima, Hironori
  • Tanaka, Junpei

Abstract

c detects that the tablet T other than the good tablet is not collected.

IPC Classes  ?

  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41J 29/393 - Devices for controlling or analysing the entire machine
  • B41J 13/08 - Bands or like feeding devices
  • B41J 13/10 - Sheet holders, retainers, or stationary guides
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms

38.

Substrate processing apparatus and substrate processing method

      
Application Number 17034173
Grant Number 11322384
Status In Force
Filing Date 2020-09-28
First Publication Date 2021-04-01
Grant Date 2022-05-03
Owner
  • SHIN-ETSU ENGINEERING CO., LTD. (Japan)
  • SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kubota, Shunya
  • Matsui, Emi
  • Yamazaki, Katsuhiro
  • Ohtani, Yoshikazu
  • Tomioka, Kyouhei

Abstract

According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a table 20 configured to support a processing target W including a substrate W1, a ring W2 surrounding a surrounding of the substrate W1, and a dicing tape W3 adhered to a lower surface of the substrate W1 and a lower surface of the ring W2, and a liquid supplier 50 configured to eject a liquid which does not mix with a processing liquid for processing the substrate W1 and which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, an outer circumference end portion of the substrate W1 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, and between the substrate W1 and the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism in accordance with a rotation number of the table 20 to supply the liquid between the substrate W1 and the ring W2 of the processing target W.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

39.

Plasma processing apparatus

      
Application Number 17009921
Grant Number 11437224
Status In Force
Filing Date 2020-09-02
First Publication Date 2021-03-11
Grant Date 2022-09-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Azumano, Hidehito

Abstract

According to one embodiment, a plasma processing apparatus includes a chamber configured to maintain an atmosphere depressurized below atmospheric pressure, a gas supply part configured to supply a gas into the chamber, a placement part provided inside the chamber, and configured to place a processed product, a depressurization part configured to depressurize inside the chamber, a window provided in the chamber, and facing the placement part, a plasma generator provided outside the chamber and on a surface of the window on an opposite side to the placement part, and configured to generate plasma inside the chamber, an optical path changing part provided inside the window and having a surface tilted to a central axis of the chamber, and a detection part provided on a side surface side of the window, and facing the surface of the optical path changing part.

IPC Classes  ?

40.

FILM-FORMING APPARATUS

      
Application Number JP2020021712
Publication Number 2020/246449
Status In Force
Filing Date 2020-06-02
Publication Date 2020-12-10
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Ono, Daisuke

Abstract

Provided is a film-forming apparatus that is capable of forming a flat film in which deterioration of optical characteristics is minimized. This film-forming apparatus is for forming films on workpieces 10, and is provided with: a transfer part 30 having a rotary table 31 for circularly transferring the workpieces 10; a film-forming processing part 40 that has a target 42 comprising a film-forming material and a plasma generator for turning a sputtering gas introduced between the target 42 and the rotary table 31 into a plasma and that forms films on the workpieces 10 by subjecting the target 42 to a sputtering process using a plasma; and an ion emission part 60 for emitting ions, wherein the transfer part 30 circularly transfers the workpieces 10 so as to cause the workpieces 10 to pass through the film-forming part 40 and the ion emission part 60, and the ion emission part 60 emits ions on the films that are being formed on the workpieces 10.

IPC Classes  ?

41.

Film formation apparatus and film formation method

      
Application Number 16856650
Grant Number 11505866
Status In Force
Filing Date 2020-04-23
First Publication Date 2020-10-29
Grant Date 2022-11-22
Owner SHIBAURA MECHATRONICS CORPORATION (USA)
Inventor
  • Ono, Daisuke
  • Ito, Akihiko

Abstract

According to one embodiment, film formation apparatus includes: a carrying unit that includes a rotation table which circulates and carries a workpiece; a film formation process unit which includes a target formed of a silicon material, and a plasma producer that produces plasma of a sputter gas introduced between the target and the rotation table, and which forms a silicon film on the workpiece by sputtering; and a hydrogenation process unit which includes a process gas introducing unit that introduces a process gas containing a hydrogen gas, and a plasma producer that produces plasma of the process gas, and which performs hydrogenation on the silicon film formed on the workpiece. The carrying unit carries the workpiece so as to alternately pass through the film formation process unit and through the hydrogenation process unit.

IPC Classes  ?

  • C23C 14/00 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C 14/58 - After-treatment
  • C23C 14/56 - Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • H01J 37/32 - Gas-filled discharge tubes
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating using electric discharges
  • C23C 16/452 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before introduction into the reaction chamber, e.g. by ionization or by addition of reactive species
  • C23C 16/40 - Oxides
  • C23C 16/24 - Deposition of silicon only
  • C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber

42.

Substrate treatment device and substrate treatment method

      
Application Number 16916288
Grant Number 11355337
Status In Force
Filing Date 2020-06-30
First Publication Date 2020-10-22
Grant Date 2022-06-07
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kamiya, Masaya
  • Demura, Kensuke
  • Matsushima, Daisuke
  • Nakano, Haruka
  • Ganachev, Ivan Petrov

Abstract

A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.

IPC Classes  ?

  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • G03F 7/40 - Treatment after imagewise removal, e.g. baking
  • G03F 7/42 - Stripping or agents therefor
  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L 21/66 - Testing or measuring during manufacture or treatment

43.

Organic film forming apparatus

      
Application Number 16899767
Grant Number 11906246
Status In Force
Filing Date 2020-06-12
First Publication Date 2020-10-01
Grant Date 2024-02-20
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Nishibe, Yukinobu
  • Iso, Akinori
  • Oomori, Keigo
  • Takahashi, Takashi

Abstract

According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.

IPC Classes  ?

  • F27B 17/00 - Furnaces of a kind not covered by any of groups
  • F27D 7/06 - Forming or maintaining special atmospheres or vacuum within heating chambers
  • F27B 5/04 - Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
  • F27B 5/14 - Arrangements of heating devices
  • F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
  • F26B 9/06 - Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
  • C23C 14/56 - Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

44.

Tablet printing apparatus and heat dissipation method thereof

      
Application Number 16807241
Grant Number 11155101
Status In Force
Filing Date 2020-03-03
First Publication Date 2020-09-10
Grant Date 2021-10-26
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveyor configured to convey a tablet while sucking and holding the tablet by the discharge of air; an inkjet head configured to perform printing on the tablet conveyed by the conveyor; an exhaust pipe which the air discharged from the conveyor passes through; an exhaust blower as a heat source that generates heat; a heat conductive member that is in contact with the exhaust pipe and the exhaust blower; and a housing configured to house the conveyor, the inkjet head, the exhaust pipe, the exhaust blower, and the heat conductive member.

IPC Classes  ?

  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material

45.

Electromagnetic wave attenuator and electronic device

      
Application Number 16564008
Grant Number 11049818
Status In Force
Filing Date 2019-09-09
First Publication Date 2020-07-30
Grant Date 2021-06-29
Owner
  • KABUSHIKI KAISHA TOSHIBA (Japan)
  • SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kikitsu, Akira
  • Kurosaki, Yoshinari
  • Yamada, Kenichiro
  • Matsunaka, Shigeki

Abstract

According to one embodiment, an electromagnetic wave attenuator includes a multilayer member, and a magnetic member. The multilayer member includes a plurality of magnetic layers and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction from the multilayer member toward the magnetic member. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A thickness along the first direction of the magnetic member is not less than ½ of a thickness along the first direction of the multilayer member.

IPC Classes  ?

  • H01L 23/552 - Protection against radiation, e.g. light
  • H01L 43/02 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof - Details

46.

Electromagnetic wave attenuator and electronic device

      
Application Number 16562652
Grant Number 11011474
Status In Force
Filing Date 2019-09-06
First Publication Date 2020-07-16
Grant Date 2021-05-18
Owner
  • KABUSHIKI KAISHA TOSHIBA (Japan)
  • SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kikitsu, Akira
  • Kurosaki, Yoshinari
  • Yamada, Kenichiro
  • Matsunaka, Shigeki

Abstract

According to one embodiment, an electromagnetic wave attenuator includes a plurality of magnetic layers, and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A first thickness along the first direction of the one of the plurality of magnetic layers is not less than ½ times a second thickness along the first direction of the one of the plurality of nonmagnetic layers.

IPC Classes  ?

  • H01L 23/552 - Protection against radiation, e.g. light
  • H01F 10/30 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of intermediate layers
  • H01F 10/14 - Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
  • H01F 10/16 - Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing cobalt

47.

Reflective mask cleaning apparatus and reflective mask cleaning method

      
Application Number 16715044
Grant Number 11609491
Status In Force
Filing Date 2019-12-16
First Publication Date 2020-04-23
Grant Date 2023-03-21
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Matsushima, Daisuke
  • Demura, Kensuke
  • Suzuki, Masafumi
  • Nakamura, Satoshi

Abstract

A reflective mask cleaning apparatus according to an embodiment comprises a first supply section configured to supply a first solution containing at least one of an organic solvent and a surfactant to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer. A reflective mask cleaning apparatus according to an alternative embodiment comprises a third supply section configured to supply a plasma product produced from a reducing gas to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.

IPC Classes  ?

  • G03F 1/24 - Reflection masks; Preparation thereof
  • G03F 1/82 - Auxiliary processes, e.g. cleaning
  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass

48.

Film formation apparatus

      
Application Number 16585525
Grant Number 11211233
Status In Force
Filing Date 2019-09-27
First Publication Date 2020-04-16
Grant Date 2021-12-28
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Ono, Daisuke

Abstract

According to one embodiment, a film formation apparatus includes a chamber having an interior to be vacuumed, a carrying unit which is provided in the chamber, and which carries a workpiece that has a processing target surface in a solid shape along a circular carrying path, a film formation unit that causes a film formation material to be deposited by sputtering on the workpiece that is being carried by the carrying unit to form a film thereon, and a shielding member which has an opening located at a side where the workpiece passes through, and which forms a film formation chamber where the film formation by the film formation unit is performed. A compensation plate that protrudes in the film formation chamber is provided, and the compensation plate has a solid shape along a shape of the processing target surface of the workpiece, and is provided at a position facing the workpiece.

IPC Classes  ?

49.

TABLET PRINTING DEVICE AND TABLET PRINTING METHOD

      
Application Number JP2019037723
Publication Number 2020/067225
Status In Force
Filing Date 2019-09-25
Publication Date 2020-04-02
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Furuya,masaaki

Abstract

The tablet printing device 1A according to the present embodiment comprises: a transport unit 10 that transports tablets T, each having a mark allowing for front-back discrimination; a detection unit 20 detecting the presence or the absence of the mark; an inversion tube 13a that is connected to the transport unit 10 and is an instance of an inversion route through which the front and back of a tablet T is inverted and returned to the transport unit 10; an inversion nozzle 13b that is an instance of a moving unit that causes, in response to the detection result of the detection unit 20, a tablet T being transported by the transport unit 10 to be moved into the inversion tube 13a so as to unify the front-back orientation of the tablets T on the transport unit 10; and a printing unit 40 for performing printing on the tablet T being transported by the transport unit 10, on the downstream side from the inversion tube 13a in the tablet T transport direction A1.

IPC Classes  ?

  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 2/01 - Ink jet
  • B41M 3/00 - Printing processes to produce particular kinds of printed work, e.g. patterns

50.

Plasma processing apparatus

      
Application Number 16581859
Grant Number 11387083
Status In Force
Filing Date 2019-09-25
First Publication Date 2020-04-02
Grant Date 2022-07-12
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Azumano, Hidehito

Abstract

According to one embodiment, a plasma processing apparatus includes a chamber, a plasma generator, a gas supplier supplying, a placement part, a depressurization part, and a supporting part. The supporting part includes a mounting part positioned below the placement part and provided with the placement part, and a beam extending from a side surface of the chamber toward a center axis of the chamber. One end of the beam is connected to a side surface of the mounting part. The beam includes a space connected to an outside space of the chamber. A following formula is satisfied, t1>t2, when a thickness of a side portion on the placement part side of side portions of the beam is taken as t1, a thickness of a side portion on an opposite side of the placement part side of the beam is taken as t2.

IPC Classes  ?

  • H01J 37/32 - Gas-filled discharge tubes
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

51.

Plasma processing apparatus

      
Application Number 16581886
Grant Number 11387082
Status In Force
Filing Date 2019-09-25
First Publication Date 2020-04-02
Grant Date 2022-07-12
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Azumano, Hidehito

Abstract

According to one embodiment, a plasma processing apparatus includes a chamber being possible to maintain an atmosphere more depressurized than atmospheric pressure, a plasma generator generating a plasma inside the chamber, a gas supplier supplying a gas into the chamber, a placement part positioned below a plasma generation region and placing a processed product thereon, a depressurization part depressurizing the chamber, and a power supply electrically connected to an electrode provided on the placement part via a bus bar. The bus bar is formed of an alloy of copper and gold. Gold is more included than copper on a surface side of the bus bar. The bus bar includes a first layer formed of copper and a second layer covering the first layer and formed of an alloy of copper and gold. Gold is more included than copper on a surface side of the second layer.

IPC Classes  ?

  • H01J 37/32 - Gas-filled discharge tubes
  • H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

52.

TABLET PRINTING DEVICE AND TABLET PRINTING METHOD

      
Application Number JP2019034674
Publication Number 2020/066502
Status In Force
Filing Date 2019-09-03
Publication Date 2020-04-02
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Tanaka,junpei
  • Komito,junsuke
  • Tanio,noritsugu
  • Tsuruoka,yasutsugu
  • Hirano,azusa

Abstract

A tablet printing device 1 according to an embodiment is provided with: an imaging device 23 that images the side surface of a tablet T having a dividing line formed on one surface thereof; a transporting device 21 that transports the tablet T; a print head device 24 that prints information on the tablet T transported by the transporting device 21; and a control device 50 that specifies the angle of the dividing line on the basis of the image captured by the imaging device 23, uses the specified angle to generate print data for printing information along the dividing line, and controls the print head device 24 using the generated print data.

IPC Classes  ?

  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 2/01 - Ink jet

53.

Heater pipe gas leak detecting device and heater pipe gas leak detecting method

      
Application Number 16587737
Grant Number 11193850
Status In Force
Filing Date 2019-09-30
First Publication Date 2020-01-23
Grant Date 2021-12-07
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Yokoi, Masataka
  • Kobayashi, Nobuo
  • Furuya, Masaaki
  • Kinase, Atsushi

Abstract

A gas leak detecting device of a heater pipe and a gas leak detecting method of a heater pipe, which are able to reliably detect a leak of gas from a heater pipe in which a fine hole is formed. A gas leak detecting device of a heater pipe, which is provided with an inside pipe housing a heater element and an outside pipe sealed surrounding the inside pipe and which is adjusted by a pressure adjustment mechanism in gas pressure in a space between the outside pipe and the inside pipe to a predetermined pressure value. The gas leak detecting device includes a gas flow resistance part, a pressure detection unit, and a leak judging device that judges whether gas is leaking from the heater pipe based on a detected pressure value obtained by the pressure detection unit.

IPC Classes  ?

  • G01M 3/28 - Investigating fluid tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for valves
  • H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
  • G01M 3/00 - Investigating fluid tightness of structures

54.

Tablet printing apparatus and tablet printing method

      
Application Number 16368532
Grant Number 10814644
Status In Force
Filing Date 2019-03-28
First Publication Date 2019-07-18
Grant Date 2020-10-27
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu
  • Tanio, Noritsugu
  • Ogimoto, Shinichi
  • Komito, Junsuke

Abstract

According to one embodiment, a tablet printing apparatus includes a conveyor, an inkjet print head, and a controller. The conveyor is configured to convey a tablet having an outer shape that does not determine the printing direction of a print pattern to be printed thereon. The print head includes a plurality of nozzles each configured to eject a liquid to print the print pattern on the tablet being conveyed. The controller is configured to control the print head to perform printing on the tablet being conveyed such that the printing direction of the print pattern is changed at predetermined intervals at least between a first direction which is parallel to or crosses the conveying direction of the tablet, and a second direction which crosses the conveying direction, and in which more nozzles are used for printing than in the first direction.

IPC Classes  ?

  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
  • B41J 2/145 - Arrangement thereof
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form

55.

ORGANIC FILM FORMATION DEVICE

      
Application Number JP2018045879
Publication Number 2019/117250
Status In Force
Filing Date 2018-12-13
Publication Date 2019-06-20
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Nishibe, Yukinobu
  • Iso, Akinori
  • Oomori, Keigo
  • Takahashi, Takashi

Abstract

This organic film formation device according to one embodiment is provided with: a chamber in which an atmosphere that has been depressurized to below atmospheric pressure can be maintained; at least one treatment compartment that is provided to the interior of the chamber and is enclosed by a cover; and an exhaust unit that makes it possible to exhaust air out of the interior of the chamber. Provided to the treatment compartment are: an upper heating unit having at least one first heater; a lower heating unit that has at least one second heater and stands opposite the upper heating unit; and a workpiece support section that can support, between the upper heating unit and the lower heating unit, a workpiece that comprises a substrate and a solution that contains organic material and a solvent and that has been applied to an upper surface of the substrate. The treatment compartment comprises a space communicated with the chamber. The exhaust unit depressurizes the interior of the chamber, and also depressurizes a space between an inner wall of the chamber and the cover.

IPC Classes  ?

  • F26B 9/06 - Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
  • F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
  • F26B 25/10 - Floors, roofs, or bottoms; False bottoms
  • F27B 17/00 - Furnaces of a kind not covered by any of groups
  • F27D 7/06 - Forming or maintaining special atmospheres or vacuum within heating chambers
  • G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
  • G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers

56.

Tablet printing apparatus and tablet printing method

      
Application Number 16285259
Grant Number 10806674
Status In Force
Filing Date 2019-02-26
First Publication Date 2019-06-20
Grant Date 2020-10-20
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ogimoto, Shinichi
  • Ikuta, Ryo
  • Okabe, Yutaka
  • Aoyagi, Hitoshi
  • Hoshino, Hikaru

Abstract

According to one embodiment, a tablet printing apparatus includes a conveyor configured to convey tablets sequentially supplied while sucking and holding the tablets; a print head arranged to face the conveyor to perform printing on each of the tablets being conveyed; a detector arranged upstream of the print head to detect the posture of each of the tablets; and a print condition tester arranged downstream of the print head to check print condition on each of the tablets. Suction force applied to the tablets is reduced at least in an area from a detection position to a print condition check position than in other area.

IPC Classes  ?

  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • A61J 3/10 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of compressed tablets
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 2/01 - Ink jet
  • B41J 3/60 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing on both faces of the printing material
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein

57.

Film formation apparatus

      
Application Number 16143927
Grant Number 10896841
Status In Force
Filing Date 2018-09-27
First Publication Date 2019-04-04
Grant Date 2021-01-19
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Ono, Daisuke

Abstract

A film formation apparatus includes a film formation unit which includes a film formation room having an opening at one end, has a target formed of a film formation material in the film formation room, and deposits the film formation material of the target on a surface of a workpiece facing the opening by plasma produced by a sputter gas in the film formation room, and a carrier that carries the workpiece along a predetermined carrying path so that the workpiece repeatedly pass through a facing region which faces the opening of the film formation room and a non-facing region which does not face the opening of the film formation room. The carrier includes a low-pressure position where the workpiece is placed and which causes an interior of the film formation room to be lower than a plasma ignition lower limit pressure and to be equal to or higher than a plasma electric discharge maintaining lower limit pressure when passing through the facing region, and a high-pressure position where workpiece is not placed and which causes the interior of the film formation room to be equal to or higher than the plasma ignition lower limit pressure when passing through the facing region.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01J 37/32 - Gas-filled discharge tubes
  • C23C 14/00 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C 14/56 - Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • C23C 14/08 - Oxides
  • C23C 14/50 - Substrate holders

58.

Tablet printing apparatus and tablet printing method

      
Application Number 16206338
Grant Number 10682849
Status In Force
Filing Date 2018-11-30
First Publication Date 2019-04-04
Grant Date 2020-06-16
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ikuta, Ryo
  • Komito, Junsuke
  • Ogimoto, Shinichi

Abstract

According to one embodiment, a tablet printing apparatus includes a conveying device, an inkjet printing device, and a control device. The conveying device is configured to convey a tablet. The printing device includes a nozzle array in which a plurality of nozzles are arranged in a direction crossing a conveying path where the tablet is conveyed by the conveying device, and performs printing by ejecting ink from the nozzles to the tablet being conveyed by the conveying device. The control device increases either one of a resolution in the conveying direction of the tablet at the time of performing the printing and a resolution in the array direction of the nozzles at the time of performing the printing higher than the other according to a print density or a print shape on the tablet, and controls the printing device to perform the printing.

IPC Classes  ?

  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • B41J 2/135 - Nozzles
  • B41J 2/21 - Ink jet for multi-colour printing
  • B41J 2/155 - Arrangement thereof for line printing

59.

Tablet printing apparatus

      
Application Number 16204229
Grant Number 10864717
Status In Force
Filing Date 2018-11-29
First Publication Date 2019-03-28
Grant Date 2020-12-15
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ogimoto, Shinichi
  • Ikuta, Ryo
  • Okabe, Yutaka
  • Aoyagi, Hitoshi
  • Hoshino, Hikaru
  • Hirano, Azusa
  • Kuribayashi, Toru
  • Tsuruoka, Yasutsugu
  • Tanaka, Junpei

Abstract

According to one embodiment, a tablet printing apparatus includes: a first rotator having an inner space; a duct configured to communicate with the inner space of the first rotator; a suction pipe configured to suck inside the duct; a second rotator arranged to face the first rotator across the duct; a conveyor belt wrapped around the first rotator and the second rotator; and a print head that performs printing on a tablet held on the conveyor belt. The conveyor belt includes a plurality of suction holes which communicate with the inner space of the first rotator and that of the duct, and are arranged in the rotation direction of the first rotator. The first rotator and the duct constitutes a suction chamber that applies a suction force to those of the suction holes of the conveyor belt located around the outer periphery of the first rotator and the duct.

IPC Classes  ?

  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
  • B41F 23/00 - Devices for treating the surfaces of sheets, webs or other articles in connection with printing
  • B65G 47/14 - Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms

60.

Tablet printing apparatus and tablet printing method

      
Application Number 16132935
Grant Number 10596828
Status In Force
Filing Date 2018-09-17
First Publication Date 2019-03-21
Grant Date 2020-03-24
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu
  • Haijima, Hironori
  • Ikuta, Ryo

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveying path where a tablet is conveyed; a drying device configured to dry the tablet in the conveying path; and a print head device located on the downstream side of the drying device in the conveying path. The print head device is configured to perform printing on the tablet dried by the drying device.

IPC Classes  ?

  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41J 11/42 - Controlling
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms

61.

Film formation apparatus

      
Application Number 16123709
Grant Number 10903059
Status In Force
Filing Date 2018-09-06
First Publication Date 2019-03-07
Grant Date 2021-01-26
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ono, Daisuke
  • Kambe, Yu

Abstract

A film formation apparatus includes a chamber which has an interior capable of being vacuumed, and which includes a lid that is openable and closable on the upper part of the chamber, a rotation table which is provided in the chamber and which and carries a workpiece in the circular trajectory, a film formation unit that deposits film formation materials by sputtering on the workpiece carried by the rotation table to form films, a shielding member which is provided with an opening at the side which the workpiece passes through, and which forms a film formation room where the film formations by the film formation units are performed, and a support which supports the shielding member, and which is independent relative to the chamber and is independent from the lid.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • H01J 37/32 - Gas-filled discharge tubes
  • C23C 14/00 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C 14/50 - Substrate holders
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • C23C 14/08 - Oxides
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation

62.

Tablet printing apparatus

      
Application Number 16017397
Grant Number 10486440
Status In Force
Filing Date 2018-06-25
First Publication Date 2018-12-27
Grant Date 2019-11-26
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu
  • Haijima, Hironori
  • Kuribayashi, Toru

Abstract

According to one embodiment, a tablet printing apparatus performs printing by using an inkjet print head device for a tablet conveyed by a conveying device. The conveying device includes a conveyor belt having a suction hole and configured to convey the tablet while sucking the tablet from the suction hole. The tablet printing apparatus further includes a rectifying board arranged at a distance from the conveyor belt so as to face a surface of the conveyor belt. The rectifying board has a gas permeability to let an airflow flowing toward the suction hole pass therethrough.

IPC Classes  ?

  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form

63.

Tablet printing apparatus and tablet printing method

      
Application Number 16059097
Grant Number 10709639
Status In Force
Filing Date 2018-08-09
First Publication Date 2018-12-06
Grant Date 2020-07-14
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveyor belt configured to convey a tablet; a print head configured to perform printing on the tablet conveyed by the conveyor belt; and a belt-position detector configured to detect the position of the conveyor belt in a direction crossing the conveying direction of the tablet in a horizontal plane. The conveyor belt includes a plurality of holes arranged in a row along the conveying direction of the tablet to hold the tablet. The belt-position detector includes an imaging device configured to capture an image of two or more of the holes; and an image processing device configured to detect the position of the conveyor belt in the crossing direction based on the image captured by the imaging device.

IPC Classes  ?

  • B65H 5/22 - Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B65H 7/14 - Controlling article feeding, separating, pile-advancing, or associated apparatus, to take account of incorrect feeding, absence of articles, or presence of faulty articles by feelers or detectors by photoelectric feelers or detectors
  • B65H 7/20 - Controlling associated apparatus
  • B41J 2/21 - Ink jet for multi-colour printing
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B41J 21/00 - Column, tabular or like printing arrangements; Means for centralising short lines
  • B41J 29/387 - Automatic cut-off devices
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms

64.

Tablet printing apparatus and tablet manufacturing method

      
Application Number 16040948
Grant Number 10421293
Status In Force
Filing Date 2018-07-20
First Publication Date 2018-11-15
Grant Date 2019-09-24
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Tanio, Noritsugu
  • Tanaka, Jumpei
  • Mafune, Norihito
  • Komito, Junsuke

Abstract

A tablet printing apparatus and a tablet manufacturing method are provided which are capable of distinguishing and collecting a preceding tablet and a following tablet from each other when two or more tablets in contact with each other are carried. A tablet printing apparatus includes a carrying device 20 carrying tablets Tb, a sensor 30 detecting the tablet Tb being carried by the carrying device 20, a printing unit 50 performing, when the status changes from the status in which the sensor 30 the tablet Tb is not detected to the status in which the tablet Tb is detected, printing on the tablet Tb that has changed the status, and a collecting unit R distinguishing and collecting, when the time length at which the sensor 30 is detecting the tablet Tb is longer than the predetermined setting value because two or more tablets Tb in contact with each other are carried, the preceding tablet Tb and the following tablet Tb following thereto among two or more tablets Tb.

IPC Classes  ?

  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles

65.

Tablet printing apparatus

      
Application Number 15963549
Grant Number 10220640
Status In Force
Filing Date 2018-04-26
First Publication Date 2018-11-01
Grant Date 2019-03-05
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Tsuruoka, Yasutsugu
  • Haijima, Hironori
  • Kuribayashi, Toru
  • Umemura, Yuki

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveyor belt including a suction hole to suck a tablet; and an ink jet print head configured to perform printing on the tablet; wherein the conveyor belt further includes a plurality of protrusions formed around the suction hole and configured to support the tablet in contact with the tablet, and a recess formed between the protrusions and communicated with the suction hole, each of the protrusions has a bottom surface, an upper surface, area of which is smaller than that of the bottom surface, and a side surface having an inclined surface, the protrusions support the tablet such that a gap is formed between a surface of the tablet on conveyor belt side and the suction hole, and a suction force is applied to the gap and space of the recess through the suction hole to suck the tablet.

IPC Classes  ?

  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B65G 15/58 - Belts or like endless load-carriers with means for holding or retaining the loads in fixed position, e.g. magnetic
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material

66.

Tablet printing apparatus and tablet printing method

      
Application Number 15997756
Grant Number 10772801
Status In Force
Filing Date 2018-06-05
First Publication Date 2018-10-04
Grant Date 2020-09-15
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Okabe, Yutaka

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveyor belt configured to convey a tablet; a first suction path configured to suck the tablet to hold the tablet on the conveyor belt and suck the conveyor belt while allowing the conveyor belt to convey the tablet; a second suction path configured as a different path from the first suction path to suck only the conveyor belt while allowing the conveyor belt to convey the tablet; and a printer configured to perform printing on the tablet conveyed by the conveyor belt.

IPC Classes  ?

  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
  • B41M 1/40 - Printing on bodies of particular shapes
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
  • B65G 15/58 - Belts or like endless load-carriers with means for holding or retaining the loads in fixed position, e.g. magnetic
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • A61J 3/10 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of compressed tablets

67.

HEATER PIPE GAS LEAK DETECTING DEVICE AND HEATER PIPE GAS LEAK DETECTING METHOD

      
Application Number JP2018011993
Publication Number 2018/181105
Status In Force
Filing Date 2018-03-26
Publication Date 2018-10-04
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Yokoi Masataka
  • Kobayashi Nobuo
  • Furuya Masaaki
  • Kinase Atsushi

Abstract

[Problem] To provide a heater pipe gas leak detecting device and a heater pipe gas leak detecting method with which it is possible for a leak of gas from a heater pipe in which fine holes are formed to be detected reliably. [Solution] According to one mode of embodiment of the present invention, a gas leak detecting device for a heater pipe 10 is provided with an inner pipe 10a accommodating a heater body, and an outer pipe 10b which encloses the inner pipe and is hermetically sealed, wherein a gas pressure in a space between the outer pipe 10b and the inner pipe 10a is regulated via a pipeline 30 to a prescribed pressure value by means of a pressure regulating mechanism 20. The gas leak detecting device comprises: a gas flow resistance portion 21 (213) which is provided in the pipeline 30 and locally makes it difficult for the gas to flow; a pressure detecting unit 23 which detects the gas pressure in the space between the outer pipe 10b and the inner pipe 10a, between the gas flow resistance portion 21 in the pipeline 30 and the heater pipe 10; and a leak determining means 50 for determining whether gas is leaking from the heater pipe 10, on the basis of a detected pressure value obtained by the pressure detecting unit 23.

IPC Classes  ?

  • G01M 3/26 - Investigating fluid tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
  • H05B 3/78 - Heating arrangements specially adapted for immersion heating

68.

Plasma processing apparatus

      
Application Number 15941817
Grant Number 11004665
Status In Force
Filing Date 2018-03-30
First Publication Date 2018-10-04
Grant Date 2021-05-11
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kawamata, Yoshio
  • Ono, Daisuke

Abstract

A plasma processing apparatus includes a vacuum container, a conveyance unit including a rotator and circulating and carrying a workpiece through the conveyance path, a cylindrical member having an opening at one end extended in the direction toward the conveyance path, a window member provided at the cylindrical member, and dividing a gas space from the exterior thereof, a supply unit supplying the process gas in the gas space, and an antenna generating inductive coupling plasma on the workpiece. The supply unit supplies the process gas from plural locations where a passing time at which the surface of the rotator passes through a process region is different, and the plasma processing apparatus further includes an adjusting unit individually adjusting the supply amounts of the process gas from the plural locations of the supply unit per a unit time in accordance with the passing time.

IPC Classes  ?

  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • H01J 37/32 - Gas-filled discharge tubes
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation

69.

Plasma processing apparatus

      
Application Number 15941853
Grant Number 11127574
Status In Force
Filing Date 2018-03-30
First Publication Date 2018-10-04
Grant Date 2021-09-21
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kawamata, Yoshio
  • Kambe, Yu

Abstract

A plasma processing apparatus includes a conveyance unit that has a rotator in a vacuum container, and circulating carries a workpiece by the rotator along a circular conveyance path, a cylindrical member extended in a direction toward the conveyance path in the vacuum container, a window member that divides a gas space where a process gas is introduced and an exterior, and an antenna causing the process gas to generate inductive coupling plasma for plasma processing when power is applied. The cylindrical member is provided with an opposing part with the opening and faces the rotator, a dividing wall is provided between the opposing part and the rotator so as not to contact the opposing part and the rotator and not to move relative to the vacuum container, and the dividing wall is provided with an adjustment opening that faces the opening, and adjusts a range of the plasma processing.

IPC Classes  ?

  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • H01J 37/32 - Gas-filled discharge tubes
  • C23C 14/50 - Substrate holders
  • C23C 14/56 - Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

70.

Tablet printing apparatus

      
Application Number 15897513
Grant Number 10293597
Status In Force
Filing Date 2018-02-15
First Publication Date 2018-08-16
Grant Date 2019-05-21
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu
  • Umemura, Yuki
  • Komito, Junsuke

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveyor belt that includes a suction hole connected to a suction chamber, and conveys a tablet while sucking the tablet to the suction hole; an ink jet print head that has a nozzle surface where a nozzle is formed, and is located above the conveyor belt such that the nozzle surface faces the conveyor belt, and performs printing on the tablet conveyed by the conveyor belt; and a control plate that is located on the upstream side of the print head in the conveying direction of the tablet between the conveyor belt and the height position of the nozzle surface of the print head, and controls an airflow generated between the conveyor belt and the print head.

IPC Classes  ?

  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
  • B41J 2/145 - Arrangement thereof
  • B41J 13/08 - Bands or like feeding devices
  • B41J 13/00 - Devices or arrangements specially adapted for supporting or handling copy material in short lengths, e.g. sheets
  • B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein

71.

Tablet printing apparatus and tablet printing method

      
Application Number 15740465
Grant Number 10124580
Status In Force
Filing Date 2016-05-30
First Publication Date 2018-07-12
Grant Date 2018-11-13
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu
  • Komito, Junsuke

Abstract

[Problem to be Solved] To provide a tablet printing apparatus and a tablet printing method that can perform printing with high quality by ejecting ink droplets to a tablet with a various posture from a plurality of nozzles. [Solution] A tablet printing apparatus includes: inclined posture detector (23, 100) that detects an inclined posture of a conveyed tablet with respect to a conveying surface; a printer including an inkjet head 21 equipped with a plurality of nozzles for ejecting an ink droplet, the printer performing printing on the conveyed tablet by ejecting ink to the conveyed tablet from the plurality of nozzles; and a controller 100 for adjusting preset printing data corresponding to an inclined posture of the tablet detected by the inclined posture detector such that predetermined printing is performed on the tablet, wherein the printer performs printing on the tablet based on printing data adjusted by the printing data adjuster.

IPC Classes  ?

  • B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
  • B41J 2/145 - Arrangement thereof
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • B41J 2/125 - Sensors, e.g. deflection sensors
  • B41J 2/14 - Structure thereof

72.

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

      
Application Number JP2017047028
Publication Number 2018/124211
Status In Force
Filing Date 2017-12-27
Publication Date 2018-07-05
Owner
  • SHIBAURA MECHATRONICS CORPORATION (Japan)
  • CHUKOH CHEMICAL INDUSTRIES, LTD. (Japan)
Inventor
  • Hamada, Takahiro
  • Hayashi, Konosuke
  • Nagashima, Yuji
  • Kamiyama, Hiroki

Abstract

A substrate processing device 10 for cleaning a surface Wa to be cleaned of a semiconductor wafer W, wherein the substrate processing device 10 is provided with: a rotary chuck 21 capable of holding the semiconductor wafer W; a cleaning brush 41a disposed so as to face the surface Wa to be cleaned of the semiconductor wafer W held by the rotary chuck 21, the cleaning brush 41a being such that fibers of a porous fluororesin are formed in the perpendicular direction with respect to the surface of the semiconductor wafer W; a rotary motor 44 for rotationally driving the rotary chuck 21 so that the normal direction of the surface Wa to be cleaned of the substrate is the substrate rotation axis; and a nozzle tube 45 for feeding a cleaning liquid L to the surface Wa to be cleaned of the semiconductor wafer W held by the rotary chuck 21. The particle removal power is thereby increased, making it possible to use a chemical liquid as the cleaning liquid or heat the cleaning liquid, and to perform particle removal over a wide range.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

73.

Floating conveyor and substrate processing apparatus

      
Application Number 15856665
Grant Number 10421622
Status In Force
Filing Date 2017-12-28
First Publication Date 2018-06-28
Grant Date 2019-09-24
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Imaoka, Yuichi
  • Iso, Akinori

Abstract

According to one embodiment, a floating conveyor is configured to convey a substrate while floating the substrate. The floating conveyor includes a lower floating section and an upper floating section with a conveying path of the substrate therebetween. A plurality of floating blocks that constitute at least one of the lower floating section and the upper floating section are arranged to be separated by a space, and a floating block that constitutes the other is arranged to face the space.

IPC Classes  ?

  • B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
  • B65G 9/00 - Apparatus for assisting manual handling having suspended load-carriers movable by hand or gravity
  • B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
  • C03C 21/00 - Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals into the surface
  • B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs

74.

Tablet printing apparatus and printing method

      
Application Number 15579236
Grant Number 10406826
Status In Force
Filing Date 2016-05-11
First Publication Date 2018-06-21
Grant Date 2019-09-10
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu

Abstract

According to one embodiment, a tablet printing device 1 includes: a conveyer 10 configured to convey a tablet T; a laser displacement meter 30 configured to emit laser beams to the tablet T conveyed by the conveyer 10 and receive the laser beams reflected by the tablet T; a determination unit 81 configured to determine whether there is a split line on the upper surface of the tablet T conveyed by the conveyer 10 based on an output value of the laser displacement meter 30; and a printing unit 50 configured to perform printing on the tablet T conveyed by the conveyer 10 based on a determination result obtained by the determination unit 81.

IPC Classes  ?

  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • B41J 2/01 - Ink jet

75.

Film formation apparatus

      
Application Number 15838982
Grant Number 10633736
Status In Force
Filing Date 2017-12-12
First Publication Date 2018-06-14
Grant Date 2020-04-28
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ito, Akihiko
  • Kamo, Yoshinao
  • Matsunaka, Shigeki
  • Fujita, Atsushi

Abstract

A film formation apparatus includes a carrying unit circulating and carrying an electronic component in a sputtering chamber, a film formation processing unit including a mount surface and a mount member which is mounted on the mount surface, and on which the electronic component is placed. The mount member includes a holding sheet having an adhesive surface, and a non-adhesive surface, and a sticking sheet having a first sticking surface with adhesiveness sticking to the non-adhesive surface, and a second sticking surface with adhesiveness sticking to the mount surface of the tray. The adhesive surface includes a pasting region for pasting the electronic components. The first sticking surface sticks across an entire region of the non-adhesive surface corresponding to at least the pasting region to provide a file formation apparatus which employs a simple structure that is capable of suppressing heating of electronic components.

IPC Classes  ?

  • C23C 14/50 - Substrate holders
  • C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
  • H01J 37/32 - Gas-filled discharge tubes
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • C23C 14/34 - Sputtering
  • H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • H01L 23/552 - Protection against radiation, e.g. light
  • C23C 14/18 - Metallic material, boron or silicon on other inorganic substrates
  • C23C 14/54 - Controlling or regulating the coating process
  • C23C 14/02 - Pretreatment of the material to be coated
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

76.

Tablet printing apparatus and tablet printing method

      
Application Number 15570008
Grant Number 10857818
Status In Force
Filing Date 2016-04-27
First Publication Date 2018-06-07
Grant Date 2020-12-08
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ogimoto, Shinichi
  • Ikuta, Ryo
  • Okabe, Yutaka
  • Aoyagi, Hitoshi
  • Hoshino, Hikaru

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveyor configured to convey tablets sequentially supplied thereto while sucking and holding the tablets by a suction chamber 14; a print head located to face the conveyor and configured to elect ink to the tablet conveyed by the conveyor to perform printing; and partition walls 144, 144 and suction paths 1421, 1422 that serve as a suction force adjusting device configured to reduce a suction force applied to the tablet at a conveyance position facing the print head to be lower than a suction force applied to the tablet at conveyance positions in front of and behind the conveyance position.

IPC Classes  ?

  • B41J 2/01 - Ink jet
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41J 11/42 - Controlling

77.

Imprint template manufacturing apparatus and imprint template manufacturing method

      
Application Number 15860044
Grant Number 10773425
Status In Force
Filing Date 2018-01-02
First Publication Date 2018-05-03
Grant Date 2020-09-15
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Demura, Kensuke
  • Nakamura, Satoshi
  • Matsushima, Daisuke
  • Hatano, Masayuki
  • Kashiwagi, Hiroyuki

Abstract

According to one embodiment, an imprint template manufacturing apparatus includes: a supply head that supplies a liquid-repellent material in liquid form to a template having a convex portion where a concavo-convex pattern is formed on a stage; a moving mechanism that moves the stage and the supply head relatively in a direction along the stage; a controller that controls the supply head and the moving mechanism such that the supply head applies the liquid-repellent material to at least a side surface of the convex portion so as to avoid the concavo-convex pattern; and a cleaning unit that supplies a liquid to the template coated with the liquid-repellent material. The liquid-repellent material contains a liquid-repellent component and a non-liquid-repellent component that react with the surface of the template, and a volatile solvent that dissolves the liquid-repellent component. The liquid is a fluorine-based volatile solvent that dissolves the non-liquid-repellent component.

IPC Classes  ?

  • B29C 33/42 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
  • B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
  • B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
  • B29C 33/72 - Cleaning
  • B29C 59/00 - Surface shaping, e.g. embossing; Apparatus therefor
  • B29L 31/00 - Other particular articles

78.

Electronic component, electric component manufacturing apparatus, and electronic component manufacturing method

      
Application Number 15730361
Grant Number 10244670
Status In Force
Filing Date 2017-10-11
First Publication Date 2018-04-19
Grant Date 2019-03-26
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ito, Akihiko
  • Kamo, Yoshinao
  • Matsunaka, Shigeki
  • Fujita, Atsushi

Abstract

An electronic component, an electronic component manufacturing apparatus, and an electronic component manufacturing method are provided which enable an electromagnetic wave shielding film formed on a package to achieve an excellent shielding characteristic. An electronic component 10 includes an electromagnetic wave shielding film 13 formed on the top face of a package sealing elements. The thickness of the electromagnetic wave shielding film 13 on the top face of the package 12 is 0.5 to 9 μm, and the relationship between the average height Rc of the roughness curvature factor of the top face of the package 12 and the thickness Te of the electromagnetic wave shielding film 13 is Rc≤2Te.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 23/552 - Protection against radiation, e.g. light
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

79.

Tablet printing apparatus and tablet printing method

      
Application Number 15846843
Grant Number 10343424
Status In Force
Filing Date 2017-12-19
First Publication Date 2018-04-19
Grant Date 2019-07-09
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Aoyagi, Hitoshi
  • Komito, Junsuke

Abstract

According to one embodiment, a tablet printing apparatus includes: a first conveyor conveying a tablet while holding a other surface of the tablet; a second conveyor conveying the tablet transferred from the first conveyor while holding a one surface of the tablet; a first print head performing printing on the one surface of the tablet; a second print head performing printing on the other surface of the tablet; a first detection mechanism detecting the one surface of the tablet; a second detection mechanism detecting the other surface of the tablet; and a controller sending a printing instruction to the first and the second print heads based on information related to the state of a split line included in detection information on the one surface of the tablet or detection information on the other surface of the tablet.

IPC Classes  ?

  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 2/01 - Ink jet

80.

Substrate processing apparatus

      
Application Number 15720928
Grant Number 10460961
Status In Force
Filing Date 2017-09-29
First Publication Date 2018-04-05
Grant Date 2019-10-29
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Nagashima, Yuji
  • Hayashi, Konosuke

Abstract

According to one embodiment, a substrate processing apparatus includes a processing chamber, a support part, a heater, and an optical member. In the processing chamber, air flows from the top to the bottom. The support part is located in the processing chamber to support a substrate having a surface to be treated. The heater is arranged so as not to be above the support part and emits light for heating. The optical member is arranged in the processing chamber so as not to be above the support part to guide the light emitted by the heater and having passed above the support part to the surface to be treated of the substrate supported by the support part.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 3/02 - Cleaning by the force of jets or sprays
  • B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
  • B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
  • F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

81.

TABLET-PRINTING APPARATUS AND TABLET-PRINTING METHOD

      
Application Number JP2017033638
Publication Number 2018/061852
Status In Force
Filing Date 2017-09-19
Publication Date 2018-04-05
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano,azusa
  • Tsuruoka,yasutsugu
  • Tanio,noritsugu
  • Ogimoto,shinichi
  • Komito,junsuke

Abstract

The tablet-printing apparatus 1 according to an embodiment performs printing using an inkjet-type print head 51 on tablets T conveyed by a conveyance device 20. The tablets T are tablets that can be printed without considering directionality. The tablet-printing apparatus 1 according to the embodiment has a control device 90 for changing the printing direction with respect to the tablet T conveyance direction A1 at a predetermined interval by rotating a standard printing pattern to be used for printing the tablets T with respect to the tablet T conveyance direction A1 at a predetermined interval.

IPC Classes  ?

82.

Tablet printing apparatus and tablet printing method

      
Application Number 15567789
Grant Number 10596811
Status In Force
Filing Date 2016-04-19
First Publication Date 2018-03-29
Grant Date 2020-03-24
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ikuta, Ryo
  • Aoyagi, Hitoshi
  • Hirano, Azusa
  • Hoshino, Hikaru

Abstract

[Problem to be Solved] To provide a tablet printing apparatus that can prevent drying of ink on the tip end of each nozzle of an inkjet printing mechanism, when a tablet does not arrive at a print position. [Solution] a that holds a tablet on the surface of the conveyor belt in a predetermined area including at least the print position by sucking in air; determination means (S15) that determines whether a tablet arrives at the print position; and head retreat means (32, S21) that retreats an inkjet head 31 such that a tip end part of each of the nozzles of the inkjet printing mechanism goes away from the surface of the conveyor belt, when it is determined that a tablet does not arrive at the print position.

IPC Classes  ?

  • B41J 29/38 - Drives, motors, controls, or automatic cut-off devices for the entire printing mechanism
  • B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
  • B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
  • B41J 25/304 - Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles

83.

TABLET PRINTING DEVICE AND TABLET PRINTING METHOD

      
Application Number JP2017031314
Publication Number 2018/043628
Status In Force
Filing Date 2017-08-31
Publication Date 2018-03-08
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ogimoto,shinichi
  • Ikuta,ryo
  • Okabe,yutaka
  • Aoyagi,hitoshi
  • Hoshino,hikaru

Abstract

A tablet printing device according to a mode of embodiment of the present invention includes: a conveying device which holds by suction and conveys successively supplied tablets; a printing head H which is provided facing the conveying device and which prints onto the conveyed tablets; a detecting device which detects the attitude of each tablet on the upstream side of the printing head H; and a print state verifying device 33 which verifies a print state of each tablet on the downstream side of the printing head H. The tablet printing device causes the suction force acting on the tablets in at least a region from a detecting position to a print state verifying position to be lower than in other regions.

IPC Classes  ?

  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 2/01 - Ink jet

84.

Substrate treatment device and substrate treatment method

      
Application Number 15671529
Grant Number 10734217
Status In Force
Filing Date 2017-08-08
First Publication Date 2018-02-15
Grant Date 2020-08-04
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kamiya, Masaya
  • Demura, Kensuke
  • Matsushima, Daisuke
  • Nakano, Haruka
  • Ganachev, Ivan Petrov

Abstract

A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.

IPC Classes  ?

  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • G03F 7/40 - Treatment after imagewise removal, e.g. baking
  • G03F 7/42 - Stripping or agents therefor

85.

Processing liquid generator and substrate processing apparatus using the same

      
Application Number 15661480
Grant Number 11670522
Status In Force
Filing Date 2017-07-27
First Publication Date 2018-02-01
Grant Date 2023-06-06
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hayashi, Konosuke
  • Miyazaki, Kunihiro

Abstract

According to one embodiment, a processing liquid generator capable of improving the reliability of the concentration of generated processing liquid is provided. b, which opens and closes the second processing liquid path P2.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

86.

TABLET PRINTING DEVICE, TABLET, AND TABLET MANUFACTURING METHOD

      
Application Number JP2017027115
Publication Number 2018/021440
Status In Force
Filing Date 2017-07-26
Publication Date 2018-02-01
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano,azusa
  • Ogimoto,shinichi
  • Komito,junsuke

Abstract

Provided are a tablet printing device, a tablet, and a tablet manufacturing method, whereby the working efficiency of tablet division and the accuracy verifying equal division of a tablet can be enhanced. The tablet printing device pertaining to an embodiment of the present invention is provided with a conveyance unit for conveying a tablet (T), and a printing unit for printing a figure (B1) on a tablet (T) conveyed by the conveyance unit, the figure (B1) for indicating a region where division is allowed when the tablet (T) is divided. The working efficiency of tablet division can thereby be enhanced, and the accuracy of verifying equal division of a tablet (T) can furthermore be enhanced.

IPC Classes  ?

  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • A61K 9/44 - Pills, lozenges or tablets printed, embossed, grooved, or perforated
  • B41J 2/01 - Ink jet

87.

Tablet printing apparatus and tablet printing method

      
Application Number 15716728
Grant Number 10160217
Status In Force
Filing Date 2017-09-27
First Publication Date 2018-01-18
Grant Date 2018-12-25
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Aoyagi, Hitoshi
  • Hirano, Azusa
  • Tsuruoka, Yasutsugu

Abstract

According to one embodiment, a tablet printing apparatus includes: a conveyor; an inkjet head configured to eject ink from a nozzle to a tablet conveyed by the conveyor to perform printing; an ink tank configured to contain the ink to be supplied to the inkjet head; a moving device configured to change the height of the ink tank; and a control unit configured to control the moving device. The control unit controls the moving device to change the height of the ink tank based on a use amount of the ink figured out in advance to maintain a head difference between the height of the liquid level of the ink in the ink tank and the height of a nozzle forming surface, where the nozzle is formed in the inkjet head, at a predetermined value.

IPC Classes  ?

  • B41J 2/175 - Ink supply systems
  • A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
  • B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
  • B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

88.

Imprint template treatment apparatus

      
Application Number 15717435
Grant Number 10668496
Status In Force
Filing Date 2017-09-27
First Publication Date 2018-01-18
Grant Date 2020-06-02
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Nakamura, Satoshi
  • Demura, Kensuke
  • Matsushima, Daisuke
  • Hatano, Masayuki
  • Kashiwagi, Hiroyuki

Abstract

According to one embodiment, an imprint template manufacturing apparatus includes a stage, a supply head, a moving mechanism, and a controller. The stage supports a template that includes a base having a main surface, and a convex portion provided on the main surface and having an end surface on a side opposite to the main surface. A concavo-convex pattern to be pressed against a liquid material to be transferred is formed on the end surface. The supply head supplies a liquid-repellent material in a liquid form to the template on the stage. The moving mechanism moves the stage and the supply head relative to each other in a direction along the stage. The controller controls the supply head and the moving mechanism such that the supply head applies the liquid-repellent material to at least the side surface of the convex portion so as to avoid the concavo-convex pattern.

IPC Classes  ?

  • B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
  • B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing

89.

TABLET PRINTING APPARATUS

      
Application Number JP2017022555
Publication Number 2018/003579
Status In Force
Filing Date 2017-06-19
Publication Date 2018-01-04
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ogimoto,shinichi
  • Ikuta,ryo
  • Okabe,yutaka
  • Aoyagi,hitoshi
  • Hoshino,hikaru
  • Hirano,azusa
  • Kuribayashi,toru
  • Tsuruoka,yasutsugu
  • Tanaka,junpei

Abstract

A tablet printing apparatus according to an embodiment is provided with: a pulley body 21b that has an internal space; a chamber 21f that is formed so as to be in communication with the internal space of the pulley body 21b; a suction tube that suctions the interior of the chamber 21f; driven pulleys 21c that are provided so as to face the pulley body 21b with the chamber 21f therebetween; a conveyor belt 21a that bridges the pulley body 21b and the driven pulleys 21c; and a print head device 25 that prints on tablets T held upon the conveyor belt 21a. The conveyor belt 21a has multiple suction holes that form a line in the rotation direction of the pulley body 21b and are in communication with the internal spaces of the pulley body 21b and the chamber 21f. The pulley body 21b and the chamber 21f constitute a suction chamber for applying a suction force to the suction holes of the conveyor belt 21a that are located at the outer peripheries of the pulley body 21b and the chamber 21f.

IPC Classes  ?

  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees

90.

TABLET PRINTING DEVICE AND TABLET PRINTING METHOD

      
Application Number JP2017023413
Publication Number 2018/003747
Status In Force
Filing Date 2017-06-26
Publication Date 2018-01-04
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Ikuta,ryo
  • Komito,junsuke
  • Ogimoto,shinichi

Abstract

A tablet printing device 1 according to one embodiment comprises: a conveyance device 20 that conveys tablets T; an ink-jet-type printing device 50 that has a row of nozzles in which a plurality of nozzles are arranged so as to intersect with the conveyance path of the tablets T conveyed by the conveyance device 20; and a control device 90 that controls the printing device 50 such that, in accordance with the density or shape of printing on the pills T, the resolution in one of either the conveyance direction of the tablets T or the row direction of the nozzles when printing is raised above the resolution in the other direction, and printing is executed.

IPC Classes  ?

  • B41J 2/01 - Ink jet
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees

91.

Substrate processing apparatus and substrate processing method

      
Application Number 15468577
Grant Number 10573540
Status In Force
Filing Date 2017-03-24
First Publication Date 2017-10-05
Grant Date 2020-02-25
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Kobayashi, Nobuo
  • Kogawa, Takeki
  • Yamazaki, Katsuhiro
  • Saito, Yuki

Abstract

According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching

92.

Substrate transfer apparatus, substrate processing apparatus, and substrate processing method

      
Application Number 15472671
Grant Number 10483151
Status In Force
Filing Date 2017-03-29
First Publication Date 2017-10-05
Grant Date 2019-11-19
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor Furuya, Masaaki

Abstract

According to one embodiment, a substrate transfer apparatus includes: a first gripping plate; a first claw that is supported by the first gripping plate, and has an abutment surface abutting on the outer peripheral surface of a substrate located above and below a surface of the first gripping plate; a second gripping plate arranged as overlapping with the first gripping plate; a second claw that is supported by the second gripping plate, and has an abutment surface abutting on the outer peripheral surface of the substrate located above and below the surface of the first gripping plate; and a gripping part configured to move the first gripping plate and the second gripping plate relative to each other such that the first claw and the second claw move close to and away from each other in a direction intersecting the outer peripheral surface of the substrate.

IPC Classes  ?

  • H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

93.

Substrate processing apparatus

      
Application Number 15512308
Grant Number 10607863
Status In Force
Filing Date 2015-09-30
First Publication Date 2017-09-28
Grant Date 2020-03-31
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hayashi, Konosuke
  • Ootagaki, Takashi

Abstract

a) located at the bottom of the recess (30) of a nozzle head (32), and configured to discharge the liquid droplets as a target to be removed out of the recess (30); and a controller configured to control the discharge state of a gas discharge nozzle (33) such that there is a period in which a gas is discharged from the gas discharge nozzle (33) at a flow rate, at which the gas discharged does not reach a surface to be processed of s substrate W, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 3/02 - Cleaning by the force of jets or sprays
  • B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect

94.

Film formation apparatus and film formation method

      
Application Number 15461906
Grant Number 10260145
Status In Force
Filing Date 2017-03-17
First Publication Date 2017-09-21
Grant Date 2019-04-16
Owner Shibaura Mechatronics Corporation (Japan)
Inventor Ono, Daisuke

Abstract

A film formation apparatus includes a chamber that is a sealed container in which a target formed of a film formation material is placed, and into which the workpiece is carried, a gas discharging unit discharging a gas in the sealed container for a predetermined time period after the workpiece is carried into the chamber to obtain a base pressure, and a sputter gas introducing unit introducing a sputter gas containing oxygen to the interior of the chamber having undergone the discharging and becoming the base pressure. The sputter gas introducing unit decreases an oxygen partial pressure in the sputter gas to be introduced in the chamber in accordance with an increase in the base pressure due to an increase of the film formation material sticking to the interior of the chamber.

IPC Classes  ?

95.

Substrate processing device and substrate processing method

      
Application Number 15608554
Grant Number 10406566
Status In Force
Filing Date 2017-05-30
First Publication Date 2017-09-14
Grant Date 2019-09-10
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Matsushita, Jun
  • Nagashima, Yuji
  • Hayashi, Konosuke
  • Miyazaki, Kunihiro

Abstract

A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

IPC Classes  ?

  • B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • B08B 3/02 - Cleaning by the force of jets or sprays

96.

Device and method for treating a substrate with hydrofluoric and nitric acid

      
Application Number 15450542
Grant Number 09972513
Status In Force
Filing Date 2017-03-06
First Publication Date 2017-09-07
Grant Date 2018-05-15
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Saito, Yuki
  • Hayashi, Konosuke
  • Ootagaki, Takashi
  • Nagashima, Yuji

Abstract

According to the embodiment, a substrate treating device 10 for treating a semiconductor wafer W using an etchant L containing hydrofluoric acid and nitric acid includes a storage tank 210 that stores the etchant L; a concentration sensor 256 that measures a concentration of nitrous acid in the etchant L; an alcohol feeding line 280 that feeds IPA to the etchant L and maintains the concentration of nitrous acid to a predetermined value or more; and a substrate treating unit 100 that feeds the etchant L in the storage tank 210 to the semiconductor wafer W. The substrate treating device can improve the etching efficiency by efficiently generating nitrous acid, and thereby producing an etchant having a nitrous acid concentration suitable for etching.

IPC Classes  ?

  • H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

97.

TABLET PRINTING DEVICE AND TABLET PRINTING METHOD

      
Application Number JP2017001016
Publication Number 2017/145562
Status In Force
Filing Date 2017-01-13
Publication Date 2017-08-31
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hirano,azusa
  • Tsuruoka,yasutsugu

Abstract

This tablet printing device (1) comprises a transport belt (21) that transports a tablet (T), a print head (51) that prints on the tablet (T) transported by the transport belt (21), and an imaging device (40) and image processing device (90) that function as a belt position detecting device to detect the position of a tablet (T) on the transport belt (21) in a transverse-direction that intersects the transport direction (A1) in a horizontal plane.

IPC Classes  ?

  • B65H 7/14 - Controlling article feeding, separating, pile-advancing, or associated apparatus, to take account of incorrect feeding, absence of articles, or presence of faulty articles by feelers or detectors by photoelectric feelers or detectors
  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
  • B41J 21/00 - Column, tabular or like printing arrangements; Means for centralising short lines
  • B41J 29/387 - Automatic cut-off devices

98.

Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate

      
Application Number 15441709
Grant Number 10804121
Status In Force
Filing Date 2017-02-24
First Publication Date 2017-08-31
Grant Date 2020-10-13
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hamada, Koichi
  • Kobayashi, Nobuo

Abstract

According to an embodiment, a substrate treatment apparatus includes, a substrate support unit supporting a substrate, a rotary unit rotating the substrate, a treatment liquid supply unit supplying treatment liquid to a surface of the substrate, and a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells

99.

ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD, AND METHOD FOR MANUFACTURING PACKAGE COMPONENT

      
Application Number JP2017003439
Publication Number 2017/135257
Status In Force
Filing Date 2017-01-31
Publication Date 2017-08-10
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Hashimoto Masaki
  • Ida Takuya

Abstract

This mounting device (1) is provided with: a stage unit (20) for moving a stage (21) on which a support substrate (W) is placed so that a plurality of mounting regions of the support substrate (W) are positioned in sequence in fixed mounting positions; a mounting unit (50) for individually moving, to a mounting position, a first and second mounting head for respectively holding and mounting an electronic component in a mounting region; a first recognition unit (22) for recognizing the overall position of the support substrate (W) on the stage (21); and a second recognition unit for recognizing the position of the electronic component held in the first or second mounting head, the movement of the stage (21) and the first and second mounting heads being controlled on the basis of the correction data for the moving position error of the stage (21) caused by the movement mechanism, the support substrate (W) position data, and the electronic component position data.

IPC Classes  ?

  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
  • H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
  • H05K 13/04 - Mounting of components

100.

TABLET PRINTING DEVICE AND TABLET MANUFACTURING METHOD

      
Application Number JP2017003062
Publication Number 2017/131211
Status In Force
Filing Date 2017-01-27
Publication Date 2017-08-03
Owner SHIBAURA MECHATRONICS CORPORATION (Japan)
Inventor
  • Tanio, Noritsugu
  • Tanaka, Jumpei
  • Mafune, Norihito
  • Komito, Junsuke

Abstract

Provided are a table printing device and a tablet manufacturing method whereby, when two or more tablets contiguous with each other are conveyed, it is possible to collect a leading tablet and a trailing tablet in distinction from each other. The present invention has a conveyance device 20 for conveying a tablet Tb, a sensor 30 for detecting the tablet Tb conveyed by the conveyance device 20, a printing unit 50 for printing on a tablet Tb by which a change in state occurs from a state in which the sensor 30 does not detect a tablet Tb to a state in which a tablet Tb is detected, and a collecting unit R for collecting a leading tablet Tb and a trailing tablet Tb in distinction from each other from among two or more tablets Tb when the length of time for which the sensor 30 detects a tablet Tb is greater than a predetermined set value due to two or more tablets Tb being conveyed which are contiguous with each other.

IPC Classes  ?

  • A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
  • B41J 2/01 - Ink jet
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