In some implementations, an optical emitter includes a substrate with a surface that is off-cut relative to an orientation of a crystallographic plane of the substrate; a first set of layers disposed on the substrate and forming an active region of a light emitting junction, wherein the first set of layers includes a gallium-arsenic-nitrogen (GaAsN) material layer, wherein the GaAsN material layer forms a quantum well barrier, wherein the first set of layers further includes an indium-gallium-arsenic-nitrogen-antimony (InGaAsNSb) layer, wherein the InGaAsNSb layer is a strained, dilute nitride InGaAsNSb layer forming a quantum well; and a second set of layers forming a first distributed Bragg reflector (DBR) and a second DBR, wherein the active region is disposed between the first DBR and the second DBR.
H01S 5/18 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales
H01L 33/04 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une structure à effet quantique ou un superréseau, p.ex. jonction tunnel
H01L 33/10 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une structure réfléchissante, p.ex. réflecteur de Bragg en semi-conducteur
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/187 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités horizontales, p.ex. lasers à émission de surface à cavité horizontale [HCSEL] à réflexion de Bragg
H01S 5/42 - Réseaux de lasers à émission de surface
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
2.
MULTIPLE FILTER PACKAGE CONFIGURATION FOR WAVELENGTH DIVISION MULTIPLEXER
A method, device, system, apparatus, a package, an optical device, an Erbium-doped fiber amplifier (EDFA), and a wavelength division multiplexer (WDM) as substantially described herein.
A wavelength division multiplexing (WDM) device includes a spacer (116); a first filter component (120); and a second filter component (122). The spacer(116) is configured to propagate a light beam (126) emitted from an input fiber (108) of the WDM device within the spacer (116) to the first filter component (120). The first filter component (120) is configured to filter the light beam (126) to create and direct a once-filtered light beam to the spacer (116). The spacer (116) is configured to propagate the once-filtered light beam within the spacer (116) to the second filter component (122). The second filter component (122) is configured to filter the once-filtered light beam to create and direct a twice-filtered light beam to the spacer (116). The spacer (116) is configured to propagate the twice-filtered light beam within the spacer (116) to another component of the WDM device, such as another filter component, a mirror component, or an output fiber (110) of the WDM device.
G02B 6/00 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage
4.
RIBBONIZED OPTICAL MODULE INCLUDING A FIBER ROUTING DEVICE
A method, device, system, apparatus, optical module, fiber routing plane (FRP), assembly process, optical system, and optical package are disclosed. The optical module includes the first loose fibers, a bank of components having second loose fibers, and a fiber routing device having third loose fibers. The bank of components and the fiber routing device are collocated in the optical module such that the first loose fibers, the second loose fibers, and the third loose fibers can be collocated and aligned in opposite directions. For each direction, the first, second and third loose fibers are divided into ordered groups and ribbonized.
A fiber routing device may include a planar structure. The fiber routing device may include a set of fiber features associated with organizing fibers for forming ribbon groups, the set of fiber features being held by the planar structure. A first end of a fiber feature of the set of fiber features may be at a first side of the fiber routing device. A second end of the fiber feature may be at a second side of the fiber routing device or may be between the first side of the fiber routing device and the second side of the fiber routing device.
A method for assembling a fiber mount to a base, comprising: placing metal spacers and solder between the fiber mount and the base, applying a squeezing force with a configured time, thus providing a precise control of the gap between the fiber mount and the base, thereby preventing the solder from cracking and reducing the impact of solder creep.
An optical device (100) including a base (305, 406) with a first coefficient of thermal expansion. The optical device (100) may include an opto-mechanical component (310, 402) with a second CTE attached to a surface of the base (305, 406) via a solder layer (126, 315, 404). The first CTE and the second CTE may differ by greater than a threshold amount. A spacer (128, 320, 408) may be disposed within the solder layer (126, 315, 404) to attach the opto-mechanical component (310, 402) to the base (305, 406).
An optical device may include an optical fiber having an input leg and an output leg, a collimating lens, and an optical isolator core positioned between the optical fiber and the collimating lens. The optical isolator core may include birefringent crystals, a Faraday rotator, a halfwave plate, and/or the like. The optical isolator core may laterally displace a portion of a light beam. In some implementations, the optical isolator core may be a single stage isolator core, a dual stage isolator core, and/or the like. The optical device may include a wavelength-division multiplexing filter, another collimating lens, and a pump chip.
G02F 1/09 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments magnéto-optiques, p.ex. produisant un effet Faraday
G02B 6/27 - Moyens de couplage optique avec des moyens de sélection et de réglage de la polarisation
An optical isolator core (110) includes a Faraday rotator (112) and a plurality of birefringent crystal plates (114). The plurality of birefringent crystal plates (114) may include a first birefringent crystal plate (114-1) to separate input light into light having a first polarization and light having a second polarization, and a second birefringent crystal plate (114-2) to combine the light having the first polarization and the light having the second polarization in output light that is laterally displaced by the single stage optical isolator. The Faraday rotator (112) may be provided between the first birefringent crystal plate (114-1) and the second birefringent crystal plate (114-2). The plurality of birefringent crystal plates (114) further include a third birefringent crystal plate (114-3) provided between the Faraday rotator (112) and the second birefringent crystal plate (114-2). Additionally, or alternatively, the optical isolator core (110) may further include a half-wave plate (116) arranged between the Faraday rotator (112) and the first birefringent crystal plate (114-1).
A method for cutting glass comprises: generating an incident Gaussian beam with a ultrafast laser; converting the incident Gaussian beam into a Bessel beam with an axicon; transmitting the Bessel beam through a lens with the large focal length and a tight-focus lens successively; and focusing the beam on glass for cutting the glass.
C03B 33/02 - Découpe ou fendage des feuilles de verre; Dispositifs ou machines à cet effet
B23K 26/064 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p.ex lentilles, miroirs ou prismes
B23K 26/38 - Enlèvement de matière par perçage ou découpage
11.
BESSEL BEAM WITH AXICON FOR CUTTING TRANSPARENT MATERIAL
A Bessel beam laser-cutting system (100) may comprise an ultrafast laser light source (102), an axicon (104), a first lens (106), and a second lens (108). The ultrafast light source (102) may be configured to emit a beam into the axicon (104). The axicon (104) may be configured to diffract the beam into a first/primary Bessel beam in a near field (110) of the axicon (104) and an annular beam in a far field (112) of the axicon (104). The first lens (106) may be configured to focus the annular beam. The second lens (108) may be configured to converge the focused annular beam into a second/secondary Bessel beam to modify a transparent material, wherein a modification depth of the modification generated by the second/secondary Bessel beam is to be within a range of tens of micrometers to several millimeters inside the transparent material.
An optical receiver may include a planar lightwave circuit with an optical path and a tapered reflection surface to direct an optical beam toward a top surface of the planar lightwave circuit. The optical receiver may include a photodiode disposed onto the top surface of the planar lightwave circuit such that a receive portion of the photodiode is aligned to the optical path, wherein a gap between the photodiode and the planar lightwave circuit is less than 5 microns.
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
A method, device, optical receiver, planar lightwave chip (PLC), photodiode (PD), transimpedance amplifier (TIA), clock and data recover (CDR), computer program product, and non-transitory computer-readable medium are provided. For example, a method may include manufacturing an optical transceiver by passive die bonding processes without the need of active alignment. Other implementations may be provided.
A pluggable optical module may include a housing enclosing one or more optical components and one or more electrical components. The pluggable optical module may include a slider to move along an exterior wall of the housing in association with latching or unlatching the pluggable optical module. The pluggable optical module may include an electromagnetic interference (EMI) shield arranged in a gap between the slider and the exterior wall of the housing such that the EMI shield contacts the slider and the exterior wall of the housing. The EMI shield reduce EMI radiation passing through the gap.
G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H01R 13/658 - Dispositions pour le blindage en haute fréquence, p.ex. protection contre les parasites électromagnétiques ou les impulsions électromagnétiques
15.
LASER WELDING FOR PLANAR LIGHTWAVE CIRCUIT–FIBER PACKAGING
An optical device includes a fiber with a fiber core that is directly coupled with a waveguide device, a receptacle, a sleeve associated attaching the fiber, and a package. Wherein a glue is in a gap between the fiber core and the waveguide device so that light propagates through the glue between the fiber core and the waveguide device. The sleeve is laser welded to the receptacle at a plurality of laser welding points, and the package is laser welded to the sleeve at a plurality of laser welding points. The optical device has less light loss and higher mechanical strength.
An optical device (100) includes a waveguide device (104) and a fiber stub (106). The fiber stub (106) at least partially contains a first optical fiber and is directly attached to the waveguide device (104) by an adhesive. The first optical fiber is to be coupled to a second optical fiber included in an optical connector when the optical connector is inserted into a receptacle (110) of the optical device (100). The fiber stub (106) is to couple the first optical fiber to at least one of the waveguide device (104) or an optical waveguide included in the waveguide device (104).
A pump laser package (650) may include an input fiber (205) to send signal light on a first optical path inside a package, a source (215) to send pump light on a second optical path inside the package, and an output fiber (210) on a third optical path inside the package. The pump laser package(650) may include a WDM filter inside the package to receive the signal light on the first optical path and send the signal light on the third optical path, and receive the pump light on the second optical path and send the pump light on the third optical path. The pump laser package (650) may include an isolator (405) inside the package to transmit the signal light in a first direction, and block the signal light in a second direction, or a photo-diode (510) to receive a portion of the signal light sent on a fourth optical path.
A power control method for a laser system comprising laser diodes arranged in diode banks is provided. Each diode bank comprises at least one of the laser diodes and has a maximum power. The method comprises operating a first diode bank of the diode banks to output a first power; and concurrently operating other of the diode banks to output other powers, at least one of the other powers being different than the first power.
The present invention is provided with: a laser oscillator (11) that has a plurality of laser diodes that oscillate multi-wavelength laser light; a transmission fiber (12) that transmits the multi-wavelength laser light that is oscillated by the laser oscillator (11); a laser processing machine (13) that concentrates the multi-wavelength laser light that is transmitted by the transmission fiber and processes a workpiece (W); a detection mechanism (7) that samples a portion of the multi-wavelength laser light and that detects the optical intensity of the sampled laser light at each wavelength; a monitoring unit that monitors reduction in the output of the multi-wavelength laser light on the basis of variation in the optical intensity of the multi-wavelength laser light at each wavelength; and a control module that controls the plurality of laser diodes on the basis of monitoring results from the monitoring unit (73). As a result, the present invention suitably monitors reduction in the output of the multi-wavelength laser light.
A semiconductor laser oscillator (11) is provided with a diode unit (11u) that is configured from a plurality of banks and in which a plurality of laser diodes connected in series constitute one bank. The diode unit (11u) has a wavelength lock mechanism for locking to a plurality of wavelengths. The semiconductor laser oscillator (11) is additionally provided with a control unit (114) that individually controls current input to the laser diodes of each of the plurality of banks so as to correspond to the characteristics of wavelength lock efficiency and thereby controls the output of the entire diode unit (11u) to a required output.
brevets
