An adaptive pre-charge control circuit includes include a high-voltage switch and a control circuit. The high-voltage switch controls the flow of current between an electric battery and a DC link capacitor, the electric battery to supply power to an electric vehicle. The DC link capacitor is made up of a sum of individual input capacitors of multiple subunits within an electric vehicle. The control circuit sends a PWM signal to the high-voltage switch based on a difference between an electric battery voltage and a DC link capacitor voltage.
An isolated packaging structure and methods thereof. The structure includes a housing having a top side and a bottom side. The housing encapsulates one or more electronic components. The structure also include one or more openings disposed in the bottom side of the housing. One or more openings are configured for exposing one or more metallized surfaces of one or more electronic components. One or more metallized surfaces are configured for coupling to one or more lead terminals.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
A Power Distribution Unit (PDU) includes a cover and a base. The cover has multiple fastener receptacles and a pair of indentations located along its outer edge. The base has an opening on a short side of the PDU for receiving a cable connector and a window on a long side of the PDU, the window being secured to a second cover. The long side is perpendicular to the short side.
H02B 1/28 - Enveloppes; Leurs parties constitutives ou accessoires à cet effet étanches à la poussière, aux projections, aux éclaboussures, à l'eau ou aux flammes
H02B 1/46 - Enveloppes; Leurs parties constitutives ou accessoires à cet effet - Parties constitutives ou accessoires
A fuse shield features a cylindrical body, a first cap cover, a second cap cover, and a stop region. The cylindrical body is adapted to be placed over and partially surround a cylindrical fuse. The cylindrical body is sandwiched between the first and second cap covers. The stop region is located on an edge of the first cap cover to limit rotation of the cylindrical fuse to a first degree in one direction on a flat surface.
An electrical contactor including a contactor assembly including a housing, an electromagnet coil and an electrically conductive core disposed within the housing, the core being movable relative to the coil under influence of an electromagnetic force produced by the coil, and an electrically conductive bridge connected to a lower end of the core and movable with the core, an interrupter assembly including a base located below the bridge and having a trench formed in a top surface thereof, an input bus bar and an output bus bar disposed on the base on opposing sides of the trench, and a pyrotechnic interrupter disposed within the trench. The pyrotechnic interrupter may include a plunger and pyrotechnic ignitor disposed below the plunger, wherein, when the pyrotechnic ignitor is actuated, the plunger forcibly drives the bridge away from the input bus bar and an output bus bar to break an electrical connection therebetween.
A method for producing an arc quenching fuse filler including providing a conventional fuse filler material, mixing a binder agent with the conventional fuse filler material, mixing an arc quenching promotor with the conventional fuse filler material and binder agent, and curing the binder agent, whereby granules of the arc quenching promotor are bound to granules of the conventional fuse filler material.
Provided are circuit protection devices. In some embodiments, a protection device may include a set of leads extending though a socket body, wherein the socket body includes a first side opposite a second side, and a third side opposite a fourth side, wherein the third and fourth sides extend between the first and second sides, and wherein the third side includes a thermal vent. The protection device may further include a fusible element surrounding a central shaft, wherein the fusible element is connected with the set of leads.
A fuse holder includes a movable tab, a base, and a cover. A stud is affixed to the movable tab and secures a terminal of a bolt-down fuse. A second stud is affixed to the base and secures a second terminal of the bolt-down fuse. The base has a channel into which the movable tab is slidably inserted. The cover connects to the base and is located over the stud and the second stud.
A fuse includes multiple stacked layers, a first terminal, and a second terminal. The first terminal is connected to one end of a fusible element and the second terminal is connected to the other end. The stacked layers include first and second intermediate layers and a special layer. The first intermediate layer, which has a centrally disposed opening, is stacked on the first terminal and the second terminal. The second intermediate layer, also having a centrally disposed opening is stacked above the first intermediate layer, and the centrally disposed openings define a chamber above the fusible element. The special layer is located between the first intermediate layer and the second intermediate layer and includes one or more geometric elements. The geometric elements divide the chamber into two sub-chambers, the first sub-chamber being above the second sub-chamber.
A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. The clip is attached to the power substrate and has a foot at one end and a recessed area at the other, opposite end. The foot is connected to the power substrate. The trimetal has a base, a trapezoid structure, and a clip portion. The base is soldered to the chip. The trapezoid structure is located above the base. The clip portion is located above the trapezoid structure and includes a projecting area. The recessed area of the clip fits into the projecting area of the trimetal.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
An active/passive fuse module including a fuse having an electrically insulating fuse body, first and second endcaps disposed on opposing ends of the fuse body, a fusible element extending through the fuse body between the first endcap and the second endcap, and an arc quenching material disposed within the fuse body and surrounding the fusible element. The fuse module further includes a pyrotechnic interrupter (PI) coupled to the fuse body, the PI having a housing defining a shaft, a piston disposed within the shaft, a drive pin extending from the piston into the fuse body, the drive pin terminating in a cutter disposed adjacent the fusible element, and a pyrotechnic ignitor disposed within the shaft above the piston configured to detonate upon receiving an initiation signal from a controller, whereby the piston and the drive pin are forcibly driven through the shaft causing the cutter to separate the fusible element.
A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.
A power semiconductor device package. The package may include a baseplate that has a plurality of through holes. The package may also include an insulating body, affixed to a top side of the baseplate The insulating body may include a main portion, to enclose a set of semiconductor devices therein, and a plurality of locking structures, the plurality of locking structures disposed along a lower periphery of the main portion, and integrally formed within the insulating body, wherein the plurality of locking structures extend through the baseplate.
A fuse includes a stack, a flattened wire, and a terminal. The stack has multiple layers arranged to form steps. The stack has an upper stack with layers of a first size and a lower stack with layers of a second, larger size. The flattened wire is located between the upper stack and the lower stack. The terminal is connected to the flattened wire and includes multiple surfaces to cover the steps at one end of the stack.
A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.
C09D 177/00 - Compositions de revêtement à base de polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principale; Compositions de revêtement à base de dérivés de tels polymères
H01H 85/143 - Contacts électriques; Fixation d'éléments fusibles sur de tels contacts
B05D 5/12 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers pour obtenir un revêtement ayant des propriétés électriques spécifiques
A chip fuse includes a first terminal disposed on a first end of a fuse element array and a second terminal disposed on a second end of the fuse element array opposite the first end. The fuse element array includes multiple layers disposed in a stacked arrangement, each layer including a first terminal portion disposed within the first terminal, a second terminal portion disposed within the second terminal, a first fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion, and a second fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion. The first fuse element portion is adjacent the second fuse element portion.
A fuse holder includes a movable tab, a base, and a cover. A stud is affixed to the movable tab and secures a terminal of a bolt-down fuse. A second stud is affixed to the base and secures a second terminal of the bolt-down fuse. The base has a channel into which the movable tab is slidably inserted. The cover connects to the base and is located over the stud and the second stud.
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
18.
SOLID STATE RELAY HARVESTING POWER FROM LOAD BY MEASURING ZERO CROSSING
A relay circuit, including a solid state relay switch, connected to a first relay line and to a charging capacitor, and connected to a second relay line. The relay circuit may also include a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may include a voltage detection circuit, having an input coupled to an output of the charging capacitor, and having an output arranged to generate a LOW voltage signal when a voltage level of the charging capacitor is below a low threshold value. The solid state relay control circuit may also include a zero crossing circuit, coupled to the first relay line and the second relay line, and having an output to generate a clock signal when a zero crossing event takes place between the first relay line and the second relay line.
H03K 17/13 - Modifications pour commuter lors du passage par zéro
H03K 19/20 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion caractérisés par la fonction logique, p.ex. circuits ET, OU, NI, NON
A relay circuit may include a solid state relay switch, coupled to an external voltage line and to an charging capacitor; and a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may be arranged to: turn the solid state relay switch to an OFF state when a capacitor voltage of the charging capacitor falls below a low threshold value; and change the solid state relay switch from the OFF state to an ON state when the capacitor voltage increases above a high threshold value.
H03K 17/687 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
H01H 47/00 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné
H02H 3/08 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à une surcharge
H02H 3/10 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à une surcharge sensibles de plus à quelque autre condition électrique anormale
H02H 3/20 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un excès de tension
H03K 17/06 - Modifications pour assurer un état complètement conducteur
H03K 19/20 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion caractérisés par la fonction logique, p.ex. circuits ET, OU, NI, NON
20.
High breaking capacity fuse with fire-extinguishing pads
A high breaking capacity fuse including an electrically insulating fuse body, a fusible element extending through the fuse body, an electrically conductive first terminal connected to a first end of the fusible element, an electrically conductive second terminal connected to a second end of the fusible element, and a first fire extinguishing pad and a second fire extinguishing disposed within the fuse body and sandwiching the fusible element therebetween, each of the first and second fire extinguishing pads formed of a polymeric substrate and a plurality of microcapsules embedded in the polymeric substrate, the plurality of microcapsules filled with an arc-quenching liquid.
A fuse including a fuse body having first and second end faces at opposing first and second longitudinal ends thereof, each of the first and second end faces having at least one notch formed therein, a fusible element extending through the fuse body and having a first end bent over the first end face and disposed within the at least one notch in the first end face and a second end bent over the second end face and disposed within the at least one notch in the second end face, and a first endcap disposed on the first longitudinal end of the fuse body and a second endcap disposed on the second longitudinal end of the fuse body, wherein the first and second endcaps flatly abut the first and second end faces without interference from the fusible element.
A fuse assembly includes a housing and a wound wire operable as a fusible element. The housing has a cavity for the fusible element. The fusible element is formed by coating a wire with enamel and wrapping the wire around a core to produce enamel-coated wound wire. The enamel-coated wound wire is attached to the housing. The core is etched away until the core is dissolved and the enamel is stripped away.
A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. The PPTC device may include a PPTC body; a first electrode disposed on a first surface of the PPTC body and a second electrode disposed on a second surface of the PPTC body, opposite the first electrode. The PPTC body may include a polymer matrix; and a conductive filler, disposed in the polymer matrix. The conductive filler may include a tungsten carbide component comprising at least 30 volume percent of the PPTC body; and a carbon component, wherein a total volume fraction of the conductive filler comprises between forty volume percent and sixty five volume percent of the PPTC body.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
24.
Fuse with compartmentalized body and parallel fuse elements
A fuse including a fuse body having a base with a central portion and first and second sidewalls, the central portion having first and second fastening holes formed therethrough, a mid-body disposed atop the central portion and having first and second troughs formed in a top surface thereof and separated by a partition wall, the mid-body further having first and second through holes formed therethrough, and a cover disposed atop the mid-body and having a central portion and first and second sidewalls, the central portion having first and second fastening bosses extending therefrom and through the first and second through holes of the mid-body and the first and second fastening holes of the base, and a conductive portion including first and second terminal portions connected by parallel first and second fuse members disposed within the first and second troughs of the mid-body and separated by the partition wall.
A battery master disconnect switch includes a front panel and a back panel. The front panel has a selector knob for selecting between multiple positions. The back panel has a primary terminal, a secondary terminal, and an auxiliary terminal. The primary terminal is for connection, using a first cable, to a primary battery. The secondary terminal is for connection, using a second cable, to a secondary battery. The auxiliary terminal is for enabling a device. The device receives power for any of the positions of the selector knob. The battery master disconnect switch can present a voltage for the primary, the secondary, or both the primary and secondary batteries.
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p.ex. le niveau ou la densité de l'électrolyte
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
A stud assembly is assembled by inserting a sphere into a cavity of a stud, where the cavity is cylindrical in shape, inserting a neck of a rivet into the cavity until the neck touches the sphere, and press-fitting the rivet into the cavity until the neck melds with the sphere.
F16B 19/10 - Rivets creux; Rivets en plusieurs morceaux fixés par action mécanique
27.
Automobile rain and temperature sensor module comprising a compound providing a thermally conductive medium between the cover of a housing and a temperature sensing element
A rain and temperature sensing module including a housing having a cover plate formed of a transparent material, a printed circuit board disposed within the housing and having a light emitter, a light receiver, and a temperature sensing element disposed thereon, a transparent compound disposed within the housing and covering the light emitter, the light receiver, and the temperature sensing element, the transparent compound filling a space between the printed circuit board and the cover plate, wherein the transparent compound has a refractive index that is substantially equal to a refractive index of the cover plate, and wherein the transparent compound provides a thermally conductive medium between the cover plate and the temperature sensing element.
B60S 1/08 - Essuie-glaces ou analogues, p.ex. grattoirs caractérisés par l'entraînement entraînés électriquement
B60R 11/00 - Autres aménagements pour tenir ou monter des objets
G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p.ex. des thermocouples
G01K 7/16 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs
G01K 13/00 - Thermomètres spécialement adaptés à des fins spécifiques
28.
THERMAL PROTECTION DEVICE TO WITHSTAND HIGH VOLTAGE
A thermal protection device, comprising: a first PTC device, arranged in a PTC circuit, and having a first input side, coupled to an input path of the PTC circuit, and having a first output side, coupled to an output path of the PTC circuit; a second PTC device, arranged in the PTC circuit, and having a second input side, coupled to the input path of the PTC circuit, and having a second output side, coupled to the output path of the PTC circuit; and a thermal link having a third input side, coupled to the first output side of the first PTC device and the second output side of the second PTC device, via the output path of the PTC circuit.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H05B 3/14 - Eléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
A fuse assembly includes a fuse element, a first terminal, a second terminal, a socket, and a capsule. The fuse element is disposed between first and second end bells. The first terminal includes a first bell portion, a first socket portion, and a first capsule portion, the first bell portion being connected to the first end bell. The second terminal includes a second bell portion, a second socket portion, and a second capsule portion, the second bell portion being connected to the second end bell. The first socket portion and the second socket portion are integrated through the socket. The first capsule portion and the second capsule portion are integrated through the capsule. The socket is seated atop the capsule to create an interior chamber inside which the fuse element is disposed.
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
H01H 85/143 - Contacts électriques; Fixation d'éléments fusibles sur de tels contacts
H01H 85/175 - Enveloppes caractérisées par leur configuration ou leur forme
A fuse assembly includes a fuse element and a terminal vent channel. The fuse element is located between a first terminal and a second terminal. The fuse element breaks in response to an overcurrent event. The terminal vent channel is located in the first terminal and provides a path for the outgassing of debris during the overcurrent event.
An electrical device assembly and method to attach an isolated single stud fuse assembly to an electrical device are disclosed. The electrical device assembly consists of multiple studs, one or more of which is replaced with the isolated single stud fuse. A conductive copper landing zone receives an electrically isolated steel stud. When the landing pad assembly is orbital riveted into a plastic housing of the electrical device, the stud is locked into the housing permanently. Electrical devices such as disconnect switches and power distribution modules, both of which include multiple studs, are good candidates for being adapted with the single stud fuse assembly.
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
H01H 85/143 - Contacts électriques; Fixation d'éléments fusibles sur de tels contacts
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
H01H 11/00 - Appareillages ou procédés spécialement adaptés à la fabrication d'interrupteurs électriques
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
H01H 89/00 - Combinaisons de plusieurs types d'interrupteurs électriques, de relais, de sélecteurs et de dispositifs de protection d'urgence, non couvertes par un des autres groupes principaux de la présente sous-classe
A relay circuit, including a solid state relay switch, connected to a first relay line and to a charging capacitor, and connected to a second relay line. The relay circuit may also include a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may include a voltage detection circuit, having an input coupled to an output of the charging capacitor, and having an output arranged to generate a LOW voltage signal when a voltage level of the charging capacitor is below a low threshold value. The solid state relay control circuit may also include a zero crossing circuit, coupled to the first relay line and the second relay line, and having an output to generate a clock signal when a zero crossing event takes place between the first relay line and the second relay line.
H03K 19/20 - Circuits logiques, c. à d. ayant au moins deux entrées agissant sur une sortie; Circuits d'inversion caractérisés par la fonction logique, p.ex. circuits ET, OU, NI, NON
33.
TEMPERATURE-SENSING TAPE BASED UPON BIMETAL SWITCH, AND METHOD OF TEMPERATURE CONTROL
A temperature-sensing tape including a flexible, electrically insulating substrate, a plurality of temperature-sensing elements disposed on the substrate, wherein a temperature-sensing element includes a bimetallic switch.
H02H 7/18 - Circuits de protection de sécurité spécialement adaptés pour des machines ou appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou ligne, et effectuant une commutation automatique dans le cas d'un chan pour accumulateurs
34.
Protection device including multi-plane fusible element
Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a substrate and a fusible element coupled to the substrate, wherein the fusible element may include a first end opposite a second end, and wherein the first and second ends wrap around the substrate. The fusible element may further include a central section comprising a plurality of segments connected end-to-end in a continuous arrangement between the first and second ends, wherein a first set of segments of the plurality of segments extends along a first plane, and wherein a second set of segments of the plurality of segments extends along a second plane, different than the first plane.
A magnetic sensing system includes a sensor and three magnets. The sensor is located within an appliance housing, the appliance having three moving components. The first magnet is disposed in a first orientation adjacent the first moving component, with the position of the first magnet changing in concert with movement of the first moving component. The second magnet is disposed in a second orientation adjacent the second moving component, with the position of the second magnet changing in concert with movement of the second moving component. The third magnet is disposed in a third orientation adjacent the third moving component, with the position of the third magnet changing in concert with movement of the third moving component. The sensor detects displacement of the first moving component, the second moving component, or the third moving component.
G01R 33/09 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs magnéto-résistifs
G01R 33/07 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs à effet Hall
36.
PPTC HEATER AND MATERIAL HAVING STABLE POWER AND SELF-LIMITING BEHAVIOR
A polymer positive temperature coefficient (PPTC) material may include a polymer matrix, the polymer matrix defining a PPTC body; and a graphene filler component, disposed in the polymer matrix, wherein the graphene filler component comprises a plurality of graphene particles aligned along a predetermined plane of the PPTC body.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p.ex. sérigraphie
H05B 3/14 - Eléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
Provided herein is are quick-assembly plug connectors. In some embodiments, an assembly may include a body, and a contact carrier within the body, the contact carrier including a main body including a plurality of openings each operable to receive a contact, and a plurality of legs extending from the main body, each of the plurality of legs coupled with the body.
H01R 13/639 - Moyens additionnels pour maintenir ou verrouiller les pièces de couplage entre elles après l'engagement
H01R 13/506 - Socles; Boîtiers composés de différentes pièces assemblées par enclenchement réciproque des pièces
H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p.ex. moyens pour aligner ou guider, leviers, pression de gaz
Provided herein is a fuse assembly including an anti-rotation device. In some embodiments, the fuse assembly may include a fusible device connected to a conductive component, wherein the conductive component is operable to connect to a terminal of a power source and a securement device coupled to the fusible device. The securement device may include a body including a recess operable to receive the fusible device and a support post extending from the body, wherein the support post is operable to engage the power source to reduce rotation of the securement device and the fusible device relative to the power source.
A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
40.
CIRCUIT PROTECTION DEVICE WITH PTC DEVICE AND BACKUP FUSE
A circuit protection device including a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 1/08 - Dispositions de réfrigération, de chauffage ou de ventilation
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
41.
FUSE AND PROTECTION CIRCUIT BASED UPON BIDIRECTIONALSWITCH
Circuitry and techniques for providing a bidirectional switch in devices for overcurrent protection and voltage protection are disclosed herein. In one embodiment, a circuit may include a first reverse-blocking insulating gate bipolar transistor (IGBT), having a first gate terminal, first collector terminal and a first emitter terminal. The circuit may include a second reverse-blocking IGBT, having a second gate terminal, a second collector terminal, electrically coupled to the first emitter terminal, and a second emitter terminal, electrically coupled to the first collector terminal. As such the first IGBT and the second IGBT may define a first current path, extending from the first collector to the second emitter; and a switch control circuit, coupled to send a control signal to at least one of: the first gate terminal and the second gate terminal, during an overcurrent event.
H02H 3/18 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à l'inversion de courant continu
H02H 1/00 - CIRCUITS DE PROTECTION DE SÉCURITÉ - Détails de circuits de protection de sécurité
Devices herein may include conductor lines connected between a power supply and load, each of the conductor lines coupled to an AC contactor and a contactor control circuit, wherein the contactor control circuit is operable to open and close one or more contactors of the AC contactor. The devices may further include a current transformer coupled to the conductor lines, the current transformer operable to output a secondary current corresponding to a primary current magnitude of an electrical current not flowing to the load, wherein the AC contactor is connected between the power supply and the load. Devices may further include a zero cross detection circuit operable to generate an interrupt at each of a plurality of zero crossings for a microprocessor, and determine whether to open the one or more contactors of the AC contactor in a predetermined optimum interval calculated with respect to the zero crossing points.
H02H 3/16 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un courant de défaut à la terre ou à la masse
H02H 1/00 - CIRCUITS DE PROTECTION DE SÉCURITÉ - Détails de circuits de protection de sécurité
43.
Single bolt fuse assembly with an electrically isolated bolt
A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
H01R 13/68 - Association structurelle avec des composants électriques incorporés avec fusible incorporé
A reed switch including a cylindrical enclosure with two ends, a first blade and a second blade is disclosed. The first blade has a first lead, a first web, and a first contact, and the first web is bent at a first angle as compared to the first lead. The second blade has a second lead, a second web, and a second contact, and the second web is bent at a second angle as compared to the second lead. The first contact is disposed adjacent to the second contact with a gap between them.
H01H 1/66 - Contacts scellés dans une enveloppe à vide ou remplie de gaz, p.ex. contacts à lames magnétiques
H01H 11/00 - Appareillages ou procédés spécialement adaptés à la fabrication d'interrupteurs électriques
H01H 36/00 - Interrupteurs actionnés par la variation du champ magnétique ou champ électrique, p.ex. par le changement de la position relative d'un aimant et d'un interrupteur, par écran
H01H 51/28 - Relais dont l'armature et les contacts se trouvent dans une enveloppe scellée, à l'extérieur de laquelle est disposée la bobine de commande, p.ex. contact entraîné par un ressort à lames ou une tige magnétiques
A novel electrical box to house one or more ISO micro relays, is adapted to support IP67 and IP69K Ingress Protection ratings. The housing of the electrical box is molded with blade sockets that correspond to blade positions of the ISO micro relay. The housing is also molded with terminal seats and cylindrical openings which vary, depending on the blade socket, enabling terminals of different sizes, orientations, and positions relative to the respective blades, to be easily inserted into the back of the housing. The resulting position of the terminals ensures that electrical connections to the ISO micro relay are made and ingress protection of components inside the electrical box is ensured.
H01R 33/76 - Supports avec alvéoles, pinces ou contacts analogues, adaptés pour l'engagement axial par glissement, avec des broches, lames ou contacts analogues disposés parallèlement sur la pièce complémentaire, p.ex. support pour tube électronique
H02B 1/28 - Enveloppes; Leurs parties constitutives ou accessoires à cet effet étanches à la poussière, aux projections, aux éclaboussures, à l'eau ou aux flammes
H02B 1/48 - Montage de dispositifs à l'intérieur de ces boîtiers
H01R 33/88 - Dispositifs de couplage spécialement conçus pour supporter un appareil et munis d'une pièce de couplage assurant la fonction de support et la connexion électrique par l'intermédiaire d'une pièce complémentaire qui est structurellement associée à l'ap; Leurs pièces détachées adaptés pour un fonctionnement simultané avec plusieurs pièces complémentaires identiques
A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p.ex. sérigraphie
47.
OVERCURRENT PROTECTION BY DEPLETION MODE MOSFET OR JFET AND BI-METALLIC TEMPERATURE SENSING SWITCH IN MINI CIRCUIT BREAKER
A miniature circuit breaker for providing short circuit and overload protection is disclosed herein. The miniature circuit breaker features a field effect transistor (FET), which may be a depletion mode metal oxide semiconductor FET (D MOSFET), a junction field-effect transistor (JFET), or a silicon carbide JFET, the FET being connected to a bi-metallic switch, where the bi-metallic switch acts as a temperature sensing circuit breaker. In combination, the D MOSFET and bi-metallic switch are able to limit current to downstream circuit components, thus protecting the components from damage.
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H01L 27/088 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type comprenant uniquement des composants à effet de champ les composants étant des transistors à effet de champ à porte isolée
H01L 27/06 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration non répétitive
H03K 17/687 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
48.
Two-piece fuse endbell with pre-cast/pre-molded alignment slots and optional interface crush ribs
A novel fuse assembly design utilizes a fuse body, a single-piece terminal assembly and a two-piece endbell. The terminal assembly is disposed within the fuse body and includes first and second opposing surfaces with a fuse element extending between a first terminal and a second terminal. The endbell, to be connected to the fuse body, includes first and second endbell portions. Formed within the first endbell portion is a first receptacle and extending from the first endbell portion is a first protrusion. Formed within the second endbell portion is a second receptacle and extending from the second endbell portion is a second protrusion. When the two endbell portions are fastened to one another with the terminal assembly sandwiched between them, the first protrusion engages the second receptacle and the second protrusion engages the first receptacle.
A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.
A fuse housing for safe outgassing of a fuse is disclosed. The fuse housing features labyrinth walls disposed at opposing sides of the fuse housing. The labyrinth walls feature serpentine paths for the flow of outgassing material. At an end of the serpentine paths which is farthest away from a fuse element are vent channels. The vent channels are narrower in depth than that of the serpentine paths of the labyrinth walls, facilitating a suctioning effect during outgassing. Conductive material deposits along the serpentine paths so that the fuse maintains a high OSR rating. By directing and controlling the outflow of gases, the fuse housing is able to reduce the temperature of the gases produced. The fuse housing is also able to reduce the physical and observable effects of outgassing.
A novel busbar, suitable for low-power applications, features a u-shaped extension having a male terminal that fits into and establishes electrical connection with a standard female terminal. The housing of an electrical box including the busbar is modified to receive the female terminal in such a way that Ingress Protection ratings of IP67 and IP69K are maintained within the electrical box. The busbar is not riveted to a thicker busbar terminating with a stud and lug nut, as in legacy configurations, thus being simpler and cheaper to manufacture. The female terminal, once connected to the busbar, is removable by inserting a tool into a dedicated opening within the housing.
H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
H01R 25/16 - Rails ou barres omnibus pourvus de plusieurs points de connexion pour pièces complémentaires
H01R 11/09 - CONNEXIONS CONDUCTRICES DE L'ÉLECTRICITÉ; ASSOCIATION STRUCTURELLE DE PLUSIEURS ÉLÉMENTS DE CONNEXION ÉLECTRIQUE ISOLÉS LES UNS DES AUTRES; DISPOSITIFS DE COUPLAGE; COLLECTEURS DE COURANT Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p.ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par caractérisés par le type des emplacements de connexion sur l'élément individuel ou par le type des connexions entre les emplacements de connexion et les organes conducteurs les emplacements de connexion étant identiques
52.
METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR PACKAGE
A method to connect power terminals to substrates within semiconductor packages is disclosed. The power terminal connection method minimally adapts the power terminal so that laser treatment can be used to connect the power terminal to the substrate. The power terminal may be adapted in a variety of ways, such that an interface between the power terminal and the substrate may be transformed (melted with consecutive rapid solidification) by the laser device, allowing the power terminal to be connected to the substrate.
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/498 - Connexions électriques sur des substrats isolants
53.
Protection device with laser trimmed fusible element
Provided are trimmed parallel element protection devices. Some protection devices may include a substrate and first and second terminals at opposite ends of the substrate. The protection devices may further include a first fusible and a second fusible element extending between the first and second terminals, wherein at least one of the first and second fusible elements includes a trimmed portion.
Provided are waveguide sensors and position sensing systems. In some embodiments, a position sensing system may include a waveguide configured to receive and transmit a pulse, and a magnet moveable relative to the waveguide. The waveguide may include a first core layer and a second core layer, a magnetic layer between the first and second core layers, and a conductive winding around the first core layer, the second core layer, and the magnetic layer. The position sensing system may further include a first substrate layer above the conductive winding and a second substrate layer below the conductive winding.
G01D 5/12 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques
H01P 3/02 - Guides d'ondes; Lignes de transmission du type guide d'ondes à deux conducteurs longitudinaux
55.
PTC device with integrated fuses for high current operation
A circuit protection device including a PTC device having a PTC element, first and second electrodes disposed on opposing first and second surfaces of the PTC element, respectively, first and second chip fuses disposed on the first and second electrodes, respectively, the second chip fuse electrically connected in series with the PTC device, and the first chip fuse electrically in connected parallel with the PTC device and the second chip fuse, the first chip fuse having a lower electrical resistance than the PTC element when the PTC element is in a non-tripped state, wherein a fusible element of the first chip fuse has a first melting temperature and is configured to carry a current higher than the PTC element can carry without tripping, and wherein a fusible element of the second chip fuse has a second melting temperature that is greater than the first melting temperature.
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.
A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
H01R 13/68 - Association structurelle avec des composants électriques incorporés avec fusible incorporé
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
58.
Automobile antenna assembly with integrated photo radiation intensity sensor
An automobile antenna assembly including a housing adapted for installation on a roof of an automobile, the housing having a base portion and a fin portion extending from the base portion, a radio antenna disposed within the fin portion, and a photo radiation intensity sensor disposed within the base portion, the photo radiation intensity sensor including a first light detecting element located on a first side of the fin portion and a second light detecting element located on a second side of the fin portion opposite the first side, wherein at least a portion of the base portion is translucent for allowing light to be received by the first and second light detecting elements, the fin portion providing a light barrier between the first light detecting element and the second light detecting element.
A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p.ex. sérigraphie
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
60.
Semiconductor device having junction termination structure and method of formation
A power semiconductor device may include a junction termination region, bounded by a side edge of a semiconductor substrate. The junction termination region may include a substrate layer of a first dopant type, a well layer of a second dopant type, a conductive trench assembly having a first set of conductive trenches, in the junction termination region, and extending from above the substrate layer through the well layer; and a metal layer, electrically connecting the conductive trench assembly to the well layer. The metal layer may include a set of inner metal contacts, electrically connecting a set of inner regions of the well layer to a first set of trenches of the conductive trench assembly; and an outer metal contact, electrically connecting an outer region of the well layer to a second set of conductive trenches of the conductive trench assembly, wherein the outer region borders the side edge.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
A polymeric positive temperature coefficient (PPTC) tank heater features a first conductive region, a heater body, and a second conductive region, forming a sandwich. The first conductive region includes a first conductive surface connected to a first lead and a second conductive surface connected to a second lead. The heater body is a PPTC polymer matrix including a conductive filler and a semi-crystalline polymer. The sandwich includes multiple heating elements connected in series and each heating element supplies a different resistance.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisés; Emploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
H01C 17/065 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour déposer en couche le matériau résistif sur un élément de base par des techniques de film épais, p.ex. sérigraphie
A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.
H03K 17/60 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors bipolaires
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/74 - Dispositifs du type thyristor, p.ex. avec un fonctionnement par régénération à quatre zones
H01L 23/367 - Refroidissement facilité par la forme du dispositif
A fuse including a fuse body having a main body portion formed of a dielectric material, a plurality of arc chambers formed in the main body portion, the arc chambers arranged in a matrix configuration, a conductor extending through the main body portion and intersecting the arc chambers, the conductor having bridge portions disposed within the arc chambers, the bridge portions being mechanically weaker than other portions of the conductor and configured to melt and separate upon the occurrence of an overcurrent condition in the fuse.
H01H 85/38 - Moyens pour éteindre ou supprimer l'arc
H01H 85/56 - Dispositifs de protection dans lesquels le fusible est porté, tenu ou retenu par un organe intermédiaire ou auxiliaire pouvant être détaché du socle, ou utilisé comme sectionneur l'organe intermédiaire ou auxiliaire comportant des contacts latéraux pour être embroché dans le socle, p.ex. porte-fusible à pont
Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a fuse assembly having a fusible link extending between a first lead end and a second lead end, and a first lead extending from the first lead end and a second lead extending from the second lead end. The protection device may further include a body including a first section coupleable with a second section, wherein the first and second sections define a central cavity housing the fusible link. The first section may include an interior face operable to engage an opposite interior face of the second section, an engagement member extending away from the interior face towards the second section, and an engagement channel adjacent the engagement member, the engagement channel operable to receive a corresponding engagement member of the second section.
H01H 37/76 - Interrupteurs dans lesquels uniquement le mouvement d'ouverture ou uniquement le mouvement de fermeture d'un contact est effectué par chauffage ou refroidissement Élément de contact actionné par fusion d'une matière fusible, actionné par combustion d'une matière combustible ou par explosion d'une matière explosive
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
A pPTC heating device having areas with different power densities distributed over the surface of the device. The device is constructed using a base layer composed of a pPTC material having a layer of sectioned conductive plates disposed over and under the layer of pPTC such as to control the path of the current through the device, thereby controlling resistance of the device and the power density of the device.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H05B 3/14 - Eléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
Switch assemblies and switching methods are disclosed. In some embodiments, a switch assembly may include a first blade having a first contact within an enclosed cavity, and a second blade having a second contact within the enclosed cavity. The first and second contacts are operable to make or break contact with one another in response to a magnetic field. The switch assembly may further include a coating formed over each of the first and second contacts, the coating including a titanium layer, a second layer formed over the titanium layer, and a tungsten-copper layer formed over the second layer. In some embodiments, the second layer is copper or molybdenum.
H01H 1/02 - Contacts caractérisés par leur matériau
H01H 1/58 - Connexions électriques avec ou entre contacts; Bornes
H01H 36/00 - Interrupteurs actionnés par la variation du champ magnétique ou champ électrique, p.ex. par le changement de la position relative d'un aimant et d'un interrupteur, par écran
C23C 14/16 - Matériau métallique, bore ou silicium sur des substrats métalliques, en bore ou en silicium
Provided herein is an improved bi-stable relay. In some embodiments, the bi-stable relay assembly may include a housing, and a core assembly within the housing. The core assembly may include a coil support structure, a first coil and a second coil along a central section of the coil support structure, a first magnet at a first end of the coil support structure, a second magnet at a second end of the coil support structure, and a first electromagnetic shell component and a second electromagnetic shell component each extending between the first and second magnets.
H01H 47/22 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné pour l'alimentation de la bobine du relais en courant d'excitation
Provided herein are methods for an improved bi-stable relay. In some embodiments, a method may include providing a core assembly within a housing, the core assembly comprising a plunger extending through a coil support structure. The method may further include winding a first coil and a second coil about a central section of the coil support structure, providing a first magnet and a first ferromagnetic plate at a first end of the coil support structure, and providing a second magnet and a second ferromagnetic plate at a second end of the coil support structure. In some embodiments, the method may further include activating the first coil or the second coil to move the plunger between a first position and a second position, wherein in the first position a circuit formed by a set of contacts is closed, and wherein in the second position the circuit is open.
H01H 47/22 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné pour l'alimentation de la bobine du relais en courant d'excitation
H01H 49/00 - Appareils ou procédés spécialement adaptés à la fabrication de relais ou d'éléments de relais
Provided herein are coil support structures and methods of retaining a printed circuit board assembly (PCBA) of a relay. In some embodiments, a bi-stable relay assembly may include a coil support structure, having a central section extending between a first end section and a second end section, and set of biasable fasteners extending from the first end section and the second end section, wherein each of the set of biasable fasteners includes a sloped engagement surface and a retention slot. The coil support structure may further include a PCBA coupled to the first and second end sections of the coil support structure, wherein the coil support structure extends within the retention slot of each of the set of biasable fasteners.
H01H 47/22 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné pour l'alimentation de la bobine du relais en courant d'excitation
H01H 50/64 - Dispositions d'entraînement entre en élément mobile de circuit magnétique et un contact
70.
Ultra-low clamping voltage surge protection module using depletion mode MOSFET
An ultra-low clamping voltage Surge Protection Module (SPM) is disclosed which utilizes a depletion mode MOSFET (D MOSFET). The SPM may be part of a circuit or a device and includes a primary protection stage and a secondary protection stage, with the D MOSFET being connected between the two stages. The SPM may include a single D MOSFET, dual D MOSFETs, or multiple D MOSFETs and the primary and secondary protection stages may be implemented with a number of different components. The SPM using D MOSFET(s) exhibits improved surge protection over circuits using inductors.
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H02H 9/00 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion
H02H 9/04 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de tension
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
71.
Two-piece fuse endbell with pre-cast/pre-molded alignment slots and optional interface crush ribs
A novel fuse assembly design utilizes single-piece terminal assemblies and two-piece endbells. The two-piece endbells and terminal assembly feature mating elements that enable fastening of the endbell portions to the terminal assembly without use of adhesives. The mating elements also provide positioning guidance for ease of assembly. Slots in the endbells for receipt of insertion pins enable the endbells to be pre-cast/pre-molded without costly rework of molding tools.
A miniature circuit breaker for providing short circuit and overload protection is disclosed herein. The miniature circuit breaker features a field effect transistor (FET), which may be a depletion mode metal oxide semiconductor FET (D MOSFET), a junction field-effect transistor (JFET), or a silicon carbide JFET, the FET being connected to a bi-metallic switch, where the bi-metallic switch acts as a temperature sensing circuit breaker. In combination, the D MOSFET and bi-metallic switch are able to limit current to downstream circuit components, thus protecting the components from damage.
H02H 3/08 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à une surcharge
H02H 3/02 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion - Détails
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H02H 9/00 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion
H03K 17/082 - Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension par réaction du circuit de sortie vers le circuit de commande
H03K 17/16 - Modifications pour éliminer les tensions ou courants parasites
73.
Overcurrent protection by depletion mode MOSFET and bi-metallic temperature sensing switch
Circuits for providing overcurrent and overvoltage protection are disclosed herein. The circuits feature a depletion mode MOSFET (D MOSFET) as a current limiter, the D MOSFET being connected to a bi-metallic switch, where the bi-metallic switch acts as a temperature sensing circuit breaker. In combination, the D MOSFET and bi-metallic switch are able to limit current to downstream circuit components, thus protecting the components from damage.
H03K 17/081 - Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension sans réaction du circuit de sortie vers le circuit de commande
H03K 17/0812 - Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension sans réaction du circuit de sortie vers le circuit de commande par des dispositions prises dans le circuit de commande
G01K 3/00 - Thermomètres donnant une indication autre que la valeur instantanée de la température
G01K 7/01 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments semi-conducteurs à jonctions PN
A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.
Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a fuse assembly having a fusible link extending between a first lead end and a second lead end, and a first lead extending from the first lead end and a second lead extending from the second lead end. The protection device may further include a body including a first section coupleable with a second section, wherein the first and second sections define a central cavity housing the fusible link. The first section may include an interior face operable to engage an opposite interior face of the second section, an engagement member extending away from the interior face towards the second section, and an engagement channel adjacent the engagement member, the engagement channel operable to receive a corresponding engagement member of the second section.
H01H 37/76 - Interrupteurs dans lesquels uniquement le mouvement d'ouverture ou uniquement le mouvement de fermeture d'un contact est effectué par chauffage ou refroidissement Élément de contact actionné par fusion d'une matière fusible, actionné par combustion d'une matière combustible ou par explosion d'une matière explosive
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
A fuse housing for safe outgassing of a fuse is disclosed. The fuse housing features labyrinth walls disposed at opposing sides of the fuse housing. The labyrinth walls feature serpentine paths for the flow of outgassing material. At an end of the serpentine paths which is farthest away from a fuse element are vent channels. The vent channels are narrower in depth than that of the serpentine paths of the labyrinth walls, facilitating a suctioning effect during outgassing. Conductive material deposits along the serpentine paths so that the fuse maintains a high OSR rating. By directing and controlling the outflow of gases, the fuse housing is able to reduce the temperature of the gases produced. The fuse housing is also able to reduce the physical and observable effects of outgassing.
Circuits for providing overcurrent protection are disclosed herein. The circuits feature depletion mode MOSFETs connected to resistive elements, preferably, Positive Temperature Coefficient (PTC) devices, configured in such a way so that the voltage across the PTC device is the same as the gate-to-source voltage of the MOSFET. The circuit may further be configured using a TVS diode, for clamping the drain-to-source voltage of the MOSFET during the overcurrent events. Heat transfer between the MOSFET and the PTC device facilitates overcurrent protection. A two-terminal device including a depletion mode MOSFET, a PTC device, and a TVS diode may provide overcurrent protection to other circuits. A bidirectional circuit c including two MOSFETS disposed on either side of a PTC is also contemplated for AC voltage overcurrent protection.
H02H 3/00 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion
H02H 7/00 - Circuits de protection de sécurité spécialement adaptés pour des machines ou appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou ligne, et effectuant une commutation automatique dans le cas d'un chan
H02H 9/02 - Circuits de protection de sécurité pour limiter l'excès de courant ou de tension sans déconnexion sensibles à un excès de courant
H02H 3/08 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à une surcharge
H02H 3/02 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion - Détails
78.
Thin film coating packaging for device having meltable and wetting links
A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.
B05D 5/12 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers pour obtenir un revêtement ayant des propriétés électriques spécifiques
C09D 177/00 - Compositions de revêtement à base de polyamides obtenus par des réactions créant une liaison amide carboxylique dans la chaîne principale; Compositions de revêtement à base de dérivés de tels polymères
H01H 85/143 - Contacts électriques; Fixation d'éléments fusibles sur de tels contacts
B05D 1/00 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces
B05D 1/18 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par immersion
B05D 1/30 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par gravité uniquement
79.
Single bolt fuse assembly with an electrically isolated bolt
A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
H01H 85/22 - Organes intermédiaires ou auxiliaires destinés à porter, tenir ou retenir le fusible, coopérant avec le socle ou le support fixe, pouvant être enlevés de celui-ci pour renouveler le fusible
A floating two-terminal unipolar current limiting circuit arrangement implemented with enhancement mode devices and bipolar devices with a unique voltage-current operation curve. This operation curve makes this device particularly advantageous to instrumentation systems that are intended to experience large voltage transients and long-term exposure to voltages that would normally damage measurement equipment. The present current limiting device is designed to have a large impedance value prior to a “turn-on” voltage, then quickly transitions to a low-impedance state. When the conducted current exceeds a setpoint or a high-voltage event occurs, the current limiting device further transitions to the “cutoff” region, which transition resumes the initial high-impedance state. In one embodiment the threshold current may be set with internal components, while a further embodiment allows the current setpoint to be set by external components. The current limiting device designs according to the present embodiments allow for series scaling and parallel scaling.
A fuse assembly including a fuse connected to two busbars, an injection molded base and an injection molded cover. The busbars are powder-coating with a powder-based adhesive or adhesion promoter, then cured in an oven. The busbars are then placed in the cavity image of an injection molding apparatus. Plastic is heated to a liquid form and injected into the cavity image. The resulting injection molded base is resistant to both dust and water, protecting the fuse inside.
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
B29C 45/14 - Moulage par injection, c. à d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule fermé; Appareils à cet effet en incorporant des parties ou des couches préformées, p.ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B29C 45/73 - Chauffage ou refroidissement du moule
H01H 85/175 - Enveloppes caractérisées par leur configuration ou leur forme
B29L 31/36 - Prises, connecteurs ou leurs parties constitutives
A fault protection arrangement. The fault protection arrangement may include a neutral grounding resistor including a first non-ground end, connected to a neutralizing point, and a second non-ground end. The fault protection arrangement may include a neutral grounding resistance monitor assembly, directly coupled to the second non-ground end of the neutral grounding resistor. The neutral grounding resistance monitor assembly may include comprising a signal source coupled to the neutralizing-point; a first current sense circuit coupled between the signal source and the neutralizing-point; a first voltage sense circuit coupled between the signal source and the neutralizing-point; a second current sense circuit, comprising a current sensor, coupled between the second non-ground end of the neutral grounding resistor and a protective earth connection.
H02H 5/10 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions non électriques normales de travail avec ou sans reconnexion sensibles à une détérioration mécanique, p.ex. rupture de ligne, rupture de connexion de terre
H02H 3/16 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à un courant de défaut à la terre ou à la masse
H02H 3/05 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion - Détails avec des moyens pour accroître la fiabilité, p.ex. dispositifs redondants
H02H 3/02 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion - Détails
G01R 31/52 - Test pour déceler la présence de courts-circuits, de fuites de courant ou de défauts à la terre
83.
PPTC DEVICE HAVING LOW MELTING TEMPERATURE POLYMER BODY
A fuse device may include a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body. The PPTC body may comprise a polymer matrix and a conductive filler, wherein the fuse device has a trip temperature of less than 120° C.
A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.
H03K 17/60 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors bipolaires
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 23/367 - Refroidissement facilité par la forme du dispositif
A sub-structure element support system is disclosed. The sub-structure element support system includes a novel molded structure designed to support an electrical element, such as a fuse. The molded structure is a protective and insulative sleeve for the electrical element and reduces forces on the electrical element during free-fall and operation conditions. The molded structure also facilitates automation during manufacturing and reduces cost.
H01H 85/20 - Socles pour supporter le fusible; Leurs pièces détachées
H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c. à d. se touchant l'un l'autre; Moyens pour réaliser ou maintenir de tels contacts; Connexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
A semiconductor die having a metal tab connected thereto. The metal tab includes at least one slot on at least one side of the metal tab, wherein the at least one slot i) creates an opening between at least two portions of the metal tab and ii) exposes the semiconductor die in relation to the metal tab. The semiconductor die can be a silicon (Si) die and the metal tab can be a copper (Cu) tab, where the at least one slot includes at least four slots corresponding to each of at least four sides of the metal, and wherein with respect to each of the at least four sides, each corresponding slot i) creates an opening between at least two portions of the Cu metal tab and ii) exposes the Si semiconductor die in relation to the Cu metal tab.
A self-limiting heater and method for building the self-limiting heater are disclosed. The self-limiting heater consists of a resistor and a PTC resistor coupled together in series with a power supply. Both resistive devices have good thermal coupling. The resistor has a minimal resistance change over changes in temperature while the resistance of the PTC resistor increases with an increase in temperature. The ohmic resistance ratio between the resistor and the PTC may be used to adjust the heater characteristics and limit the characteristic sharpness.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
A resistance heater may include a polymer positive temperature coefficient (PPTC) material, arranged in a ring shape that defines a heater body; and an electrode assembly, comprising two or more electrodes arranged in contact with the heater body at two or more locations, wherein PPTC material comprises: a polymer matrix, the polymer matrix defining a PPTC body; and a conductive filler component, disposed in the polymer matrix.
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
H05B 3/03 - Chauffage par résistance ohmique - Détails Électrodes
H05B 3/14 - Eléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur le matériau étant non métallique
H05B 3/26 - Eléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p.ex. plaques chauffantes non flexibles le conducteur chauffant monté sur une base isolante
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
89.
Semiconductor device module and method of assembly
A semiconductor device module. The semiconductor device module may include a first substrate; and a semiconductor die assembly, disposed on the first substrate. The semiconductor die assembly may include a first semiconductor die, bonded to the first substrate; a second semiconductor die, disposed over the first semiconductor die; and an electrical connector, disposed between the first semiconductor die and the second semiconductor die, wherein the semiconductor die assembly comprises an insulated gate bipolar transistor (IGBT) die and a freewheeling diode die.
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
Exemplary embodiments of the present disclosure of a fuse may include a fuse body having a first portion and a second portion. The first and second portions may be configured to mate together thereby forming an internal cavity. A first inner termination and a second inner termination may be at least partially attachable to the first and second portions of the fuse body at respective first and second ends. A fusible element may be disposed in the cavity of the fuse body and extendable from the first inner termination at the first end of the fuse body to the second inner termination at the second end of the fuse body. The fusible element may be attachable to the first inner termination at a first connection and the second inner termination at a second connection. The first and second connections may be inspectable when the fuse is in an assembled state.
A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a base portion and a wall portion disposed in a perpendicular relationship, the fuse module further including a fuse plate including an electrically conductive bus bar disposed on a bottom of the base portion, a fusible element electrically connected to the bus bar and disposed adjacent a front of the wall portion, and a fuse terminal electrically connected to the fusible element and disposed on a top of the base portion, the fuse module further including an electrically conductive terminal post extending from the top of the base portion and through the fuse terminal for facilitating connection to an electrical component.
H01H 85/50 - Dispositifs de protection dans lesquels le fusible est porté ou tenu directement par le socle le fusible comportant des contacts aux extrémités opposées destinés à coopérer avec le socle
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
A fuse including a fuse body, a fusible element disposed within the fuse body providing an electrically conductive pathway extending between a first end of the fuse body and a second end of the fuse body, and a heat shield disposed within the fuse body intermediate an interior surface of the fuse body and an exterior surface of the fuse body for mitigating heat flow therebetween.
A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
94.
Self-oscillating spread spectrum frequency control loop
A self-oscillating spread spectrum frequency control loop contains a gated voltage-controlled oscillator (VCO) which receives a digital signal that can start or stop its oscillation. The VCO generates a spread spectrum carrier by receiving a triangle wave signal from a delaying ramp generator in a loop, its ramp direction controlled by a frequency comparator. The loop generates a spectrum spread as wide as possible above a minimum frequency. RF isolators that utilize low-pass filters in the transmitter and high-pass filters in the receiver, where the F-3 dB cutoff frequencies of both filters vary in a correlated manner, are used to not produce spread spectrum frequencies below the minimum frequency. Die from a given wafer lot, when designed such that the low- and high-pass cutoff frequencies track, can be used to form RF digital isolators whose minimum spread spectrum frequency does not go below the minimum frequency required by that wafer lot.
Provided herein are protection devices having U-shaped fuse elements. In some embodiments, a protection device may include a housing defining a cavity, and a fuse element within the cavity. The fuse element may include a first component and a second component separated by a barrier, and wherein the first and second components are joined at a fusible bridge.
An active/passive fuse module including a base, a busbar disposed on a top surface of the base and including a fuse element and first and second terminal portions extending from opposite ends of the fuse element, the fuse element extending over a cavity in the top surface of the base, a pyrotechnic interrupter (PI) disposed atop the base, the PI including a piston disposed within a shaft above the fuse element, a first pyrotechnic ignitor coupled to a controller, the first pyrotechnic ignitor configured to detonate and force the piston through the fuse element upon receiving an initiation signal from the controller, and a second pyrotechnic ignitor coupled to the busbar by a pair of leads, the second pyrotechnic ignitor configured to detonate and force the piston through the fuse element upon an increase in voltage across the leads.
H01H 89/00 - Combinaisons de plusieurs types d'interrupteurs électriques, de relais, de sélecteurs et de dispositifs de protection d'urgence, non couvertes par un des autres groupes principaux de la présente sous-classe
H01H 39/00 - Dispositifs de commutation actionnés par une explosion produite à l'intérieur du dispositif et amorcée par un courant électrique
H01H 85/00 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
97.
Semiconductor device module and method of assembly
A semiconductor device module. The semiconductor device module may include a first substrate; and a semiconductor die assembly, disposed on the first substrate. The semiconductor die assembly may include a first semiconductor die, bonded to the first substrate; a second semiconductor die, disposed over the first semiconductor die; and an electrical connector, disposed between the first semiconductor die and the second semiconductor die, wherein the semiconductor die assembly comprises an insulated gate bipolar transistor (IGBT) die and a freewheeling diode die.
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
In one embodiment, a power semiconductor device may include a semiconductor substrate, wherein the semiconductor substrate comprises an active device region and a junction termination region. The power semiconductor device may also include a polysilicon layer, disposed over the semiconductor substrate. The polysilicon layer may include an active device portion, disposed over the active device region, and defining at least one semiconductor device; and a junction termination portion, disposed over the junction termination region, the junction termination portion defining a ring structure.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
99.
Bi-stable mechanical latch including positioning spheres
Provided herein is an improved a bi-stable actuator including a first core component coupleable to a housing, the first core component including a central bore containing a shaft and a shaft spring. The actuator may further include a second core component extending around the first core component, wherein the second core component and the first core component are axially moveable relative to one another, and a third core component extending within the second core component, wherein the third core component and the second core component are axially moveable relative to one another. The actuator may further include a positioning sphere extending through an opening of the first core component, wherein the positioning sphere abuts the second core component when the bi-stable actuator is in a first position, and wherein the positioning sphere abuts a detent of the shaft when the bi-stable actuator is in a second position.
H01F 7/124 - Guidage ou positionnement d'armatures, p.ex. maintien des armatures dans leur position extrême au moyen d'un verrou mécanique, p.ex. détente
H01F 7/08 - Electro-aimants; Actionneurs comportant des électro-aimants avec armatures
E05B 63/12 - Serrures à caractéristiques structurales particulières avec des moyens fixés sur le pêne pour le verrouillage par enclenchement avec la gâche
A power semiconductor device may include a junction termination region, bounded by a side edge of a semiconductor substrate. The junction termination region may include a substrate layer of a first dopant type, a well layer of a second dopant type, a conductive trench assembly having a first set of conductive trenches, in the junction termination region, and extending from above the substrate layer through the well layer; and a metal layer, electrically connecting the conductive trench assembly to the well layer. The metal layer may include a set of inner metal contacts, electrically connecting a set of inner regions of the well layer to a first set of trenches of the conductive trench assembly; and an outer metal contact, electrically connecting an outer region of the well layer to a second set of conductive trenches of the conductive trench assembly, wherein the outer region borders the side edge.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
brevets
