Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.
A terminal device that can perform positioning with high accuracy and at a low cost is provided. [Solution] A terminal device that is held by a terminal holding object includes a magnetic detection unit configured to detect magnetic field produced by a magnetic anchor made of magnet; and a position information acquisition unit configured to acquire position information that corresponds to magnetic information detected by the magnetic detection unit by referring to correspondence between magnetic information and position information prepared in advance.
G01C 21/16 - Navigation; Instruments de navigation non prévus dans les groupes en utilisant des mesures de la vitesse ou de l'accélération exécutées à bord de l'objet navigant; Navigation à l'estime en intégrant l'accélération ou la vitesse, c. à d. navigation par inertie
G01C 21/04 - Navigation; Instruments de navigation non prévus dans les groupes par des moyens terrestres
3.
ASSET MANAGEMENT SYSTEM AND ASSET MANAGEMENT METHOD
[Object] An asset management system that can perform asset management with high accuracy is provided. [Solution] An asset management system that manages an asset to which a tag capable of identifying individual information is attached includes a terminal unit that is held by a terminal holding object, in which the terminal unit includes a tag communication unit that communicates with the tag to read the individual information, and a position information acquisition unit that acquires position information, the position information acquisition unit starts to acquire the position information as information on the asset to which the tag is attached when a first condition is satisfied, and ends acquisition of the position information when a second condition is satisfied, the first condition is at least one of a condition that communication between the tag communication unit and the tag is established and the distance between the tag communication unit and the tag is equal to or less than a first threshold value, and the second condition is at least one of a condition that the wireless communication is not established and the distance between the tag communication unit and the tag is more than the second threshold value.
G06Q 10/06 - Ressources, gestion de tâches, des ressources humaines ou de projets; Planification d’entreprise ou d’organisation; Modélisation d’entreprise ou d’organisation
G06Q 10/08 - Logistique, p.ex. entreposage, chargement ou distribution; Gestion d’inventaires ou de stocks
G06Q 10/087 - Gestion d’inventaires ou de stocks, p.ex. exécution des commandes, approvisionnement ou régularisation par rapport aux commandes
G06Q 50/28 - Logistique, p.ex. stockage, chargement, distribution ou expédition
4.
MICROELECTROMECHANICAL ACOUSTIC SENSOR WITH MEMBRANE ETCH RELEASE STRUCTURES AND METHOD OF FABRICATION
Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.
G01H 11/06 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores par détection des changements dans les propriétés électriques ou magnétiques par des moyens électriques
H04R 7/10 - Membranes planes comportant plusieurs sections ou couches comportant des couches superposées en contact
09 - Appareils et instruments scientifiques et électriques
Produits et services
Scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signalling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments; Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity; Apparatus and instruments for recording, transmitting, reproducing or processing sound, images or data; Recorded and downloadable media, computer software, blank digital or analogue recording and storage media; Mechanisms for coin-operated apparatus; Cash registers, calculating devices; Computers and computer peripheral devices; Diving suits, divers' masks, ear plugs for divers, nose clips for divers and swimmers, gloves for divers, breathing apparatus for underwater swimming; Fire-extinguishing apparatus; Inertial measurement unit; motion sensors; accelerometers; gyroscopes; magnetometers; pressure sensors; temperature sensors; ultrasonic sensors for measuring acceleration, angle of rotation, pressure, temperature, and distance ranges, all for use in automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; measuring equipment (sensors) comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, passive components, and high-precision algorithms, all for use in sensor fusion for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, obstacles, ultrasonic signals, and ultrasonic range sensing; downloadable computer software for integrating drivers for multi-sensor modules for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things software development systems, and internet of things applications..
6.
FIXED-FIXED MEMBRANE FOR MICROELECTROMECHANICAL SYSTEM MICROPHONE
The present invention relates to a fixed-fixed membrane for a microelectromechanical system (MEMS) microphone. In one embodiment, a MEMS acoustic sensor includes a substrate; a membrane situated parallel to the substrate; and at least one vent formed into the membrane, wherein the at least one vent is a curved opening in the membrane, and wherein the at least one vent is disposed substantially along a length of the membrane.
H04R 7/22 - Dispositions pour monter ou pour tendre des membranes ou des cônes à la périphérie pour fixer le bord de la membrane ou du cône sur son siège
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p.ex. comportant des membranes ou des lamelles élastiques
H04R 7/10 - Membranes planes comportant plusieurs sections ou couches comportant des couches superposées en contact
7.
FIXED-FIXED MEMBRANE FOR MICROELECTROMECHANICAL SYSTEM MICROPHONE
The present invention relates to a fixed-fixed membrane for a microelectromechanical system (MEMS) microphone. In one embodiment,
a MEMS acoustic sensor includes a substrate; a membrane situated parallel to the substrate; and at least one vent formed into the membrane, wherein the at least one vent is a curved opening in the membrane, and wherein the at least one vent is disposed substantially along a length of the membrane.
A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
G01P 15/08 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.
G10L 25/18 - Techniques d'analyses de la parole ou de la voix qui ne se limitent pas à un seul des groupes caractérisées par le type de paramètres extraits les paramètres extraits étant l’information spectrale de chaque sous-bande
G10L 25/51 - Techniques d'analyses de la parole ou de la voix qui ne se limitent pas à un seul des groupes spécialement adaptées pour un usage particulier pour comparaison ou différentiation
Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.
APPLYING A POSITIVE FEEDBACK VOLTAGE TO AN ELECTROMECHANICAL SENSOR UTILIZING A VOLTAGE-TO-VOLTAGE CONVERTER TO FACILITATE A REDUCTION OF CHARGE FLOW IN SUCH SENSOR REPRESENTING SPRING SOFTENING
Reducing a spring softening effect on a capacitive sense element of an electromechanical sensor is presented herein. A system, such as a microphone or an accelerometer, comprises an electromechanical sensor and a voltage-to-voltage converter component. The electromechanical sensor comprises a capacitive sense element and a bias voltage component that applies a bias voltage to a sense electrode of the capacitive sense element. The voltage-to-voltage converter component couples a positive feedback voltage to the sense electrode to maintain a constant charge at the sense electrode to facilitate a reduction of charge flow in the electromechanical sensor representing a spring softening effect on the capacitive sense element. In an example, the spring softening effect on the sense element alters a resonant frequency of the sense element and a gain of the sense element. In another example, the charge flow corresponds to a parasitic capacitance that is electrically coupled to the sense electrode.
G01P 1/00 - MESURE DES VITESSES LINÉAIRES OU ANGULAIRES, DE L’ACCÉLÉRATION, DE LA DÉCÉLÉRATION OU DES CHOCS; INDICATION DE LA PRÉSENCE OU DE L’ABSENCE D’UN MOUVEMENT; INDICATION DE LA DIRECTION D’UN MOUVEMENT - Parties constitutives des instruments
G01P 15/00 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération
G01P 15/125 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom electrode layer. The top electrode layer is disposed above the piezoelectric layer and comprises a segmented center electrode disposed above a center of the membrane layer and a segmented outer electrode spaced apart from the segmented center electrode. The controller, responsive to the PMUT being placed in a transmit mode, is configured to couple the first and second segments of the bottom electrode layer with ground, couple the first output of the transmitter with the segments of the segmented center electrode, and couple the second output with the segments of the segmented outer electrode.
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H10N 30/87 - Dispositifs piézo-électriques ou électrostrictifs - Détails de structure Électrodes ou interconnexions, p.ex. connexions électriques ou bornes
13.
SIGNAL-TO-NOISE RATIO FOR PHOTOACOUSTIC GAS SENSORS
A bi-directional photoacoustic gas sensor includes a first photoacoustic cell, where an electromagnetic radiation source emits radiation to interact with an external gas and generate pressure waves that are detected by a MEMS diaphragm. A second photoacoustic cell has an interior volume and acoustic compliance that corresponds to the interior volume and acoustic compliance of the first photoacoustic cell. Processing circuitry within a substrate uses a first acoustic signal, received by the first photoacoustic cell, and a second acoustic signal, received by the second photoacoustic cell, to determine a bi-directional response of the gas sensor to remove noise and improve the sensor's signal-to-noise ratio.
G01N 21/17 - Systèmes dans lesquels la lumière incidente est modifiée suivant les propriétés du matériau examiné
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p.ex. systèmes micro-électromécaniques (SMEM, MEMS)
14.
IMPROVED SIGNAL-TO-NOISE RATIO FOR PHOTOACOUSTIC GAS SENSORS
A bi-directional photoacoustic gas sensor includes a first photoacoustic cell, where an electromagnetic radiation source emits radiation to interact with an external gas and generate pressure waves that are detected by a MEMS diaphragm. A second photoacoustic cell has an interior volume and acoustic compliance that corresponds to the interior volume and acoustic compliance of the first photoacoustic cell. Processing circuitry within a substrate uses a first acoustic signal, received by the first photoacoustic cell, and a second acoustic signal, received by the second photoacoustic cell, to determine a bi-directional response of the gas sensor to remove noise and improve the sensor's signal-to-noise ratio.
G01N 29/22 - Recherche ou analyse des matériaux par l'emploi d'ondes ultrasonores, sonores ou infrasonores; Visualisation de l'intérieur d'objets par transmission d'ondes ultrasonores ou sonores à travers l'objet - Détails
A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form in a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.
H10N 30/057 - Fabrication de dispositifs piézo-électriques ou électrostrictifs multicouches ou de leurs parties constitutives, p.ex. en empilant des corps piézo-électriques et des électrodes par empilement de corps massifs piézo-électriques ou électrostrictifs et d’électrodes
H10N 30/87 - Dispositifs piézo-électriques ou électrostrictifs - Détails de structure Électrodes ou interconnexions, p.ex. connexions électriques ou bornes
Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simultaneously, and a processing circuitry configured to adjust a configuration parameter associated with the MEMS microphone device based on the ultrasonic signal.
Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simultaneously, and a processing circuitry configured to adjust a configuration parameter associated with the MEMS microphone device based on the ultrasonic signal.
A system, comprising: a sigma-delta modulator using an integrator of a cascade-of-integrator feedback topology to perform operations is disclosed. The operations can comprise in response to receiving a gain value, applying the gain value to a group of feed-forward coefficients, determining a change in the gain value, and adjusting, during a clock cycle of a defined time period, a plurality of state variables of the sigma-delta modulator by multiplying each of the state variables by the scale factor that is a ratio of the gain value after determining the change in the gain value the gain value before determining the change in the gain value.
An example embodiment includes a head worn electronic device comprising a transceiver for communicating with a host device, an accelerometer having a plurality of axes for detecting three-dimensional forces applied to the head worn electronic device, and a processor. The processor is configured to receive a three-dimensional vibration vector from the accelerometer caused by a voice of a user while the head worn electronic device is positioned in a user's ear, process the three-dimensional vibration vector to determine a voice activity detection axis that correlates with vibrations caused by the voice of the user, perform processing of data from the voice activity detection axis to detect voice activity of the user, and send an instruction to the host device via the transceiver to control the host device based on the voice activity detection.
A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer software for integrating drivers for multi-sensor modules for internet of things software development systems and internet of things applications; measuring equipment sensors comprising inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, pressure, temperature, sound, and distance ranges for use in internet of things applications and internet of things software development systems; measuring equipment sensors comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, microphone, passive components, and high-precision algorithms for use in sensor fusion and internet of things applications, industrial, drone, and automotive applications, and internet of things software development systems..
A device comprises a processor communicatively coupled with an ultrasonic sensor which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with receive periods. Returned ultrasonic signals corresponding to the emitted ultrasonic pulses are received by the ultrasonic sensor during the receive periods. The processor is configured to direct the ultrasonic sensor to listen, during a listening window, for a potentially interfering ultrasonic signal from a second ultrasonic sensor. The listening window is prior to a transmit period of the transmit periods. In response to detecting the potentially interfering ultrasonic signal during the listening window, the processor is configured to adjust operation of the ultrasonic sensor to avoid an ultrasonic collision with the second ultrasonic sensor to facilitate coexistence of the ultrasonic sensor and the second ultrasonic sensor in an operating environment shared by the ultrasonic sensor and the second ultrasonic sensor.
G01S 7/52 - DÉTERMINATION DE LA DIRECTION PAR RADIO; RADIO-NAVIGATION; DÉTERMINATION DE LA DISTANCE OU DE LA VITESSE EN UTILISANT DES ONDES RADIO; LOCALISATION OU DÉTECTION DE LA PRÉSENCE EN UTILISANT LA RÉFLEXION OU LA RERADIATION D'ONDES RADIO; DISPOSITIONS ANALOGUES UTILISANT D'AUTRES ONDES - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe
G01S 15/10 - Systèmes pour mesurer la distance uniquement utilisant la transmission de trains discontinus d'ondes modulées par impulsions
23.
COEXISTENCE OF ULTRASONIC TRANSDUCERS IN AN OPERATING ENVIRONMENT
A device comprises a processor coupled with an ultrasonic transducer which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with listening windows. Each sequential pair of the transmit periods is separated by a single listening window of the listening windows. During a fixed portion of a listening window of the listening windows the ultrasonic transducer is configured to receive returned signals corresponding to an emitted ultrasonic pulse of the ultrasonic pulses which was transmitted during a transmit period of the transmit periods that immediately preceded the listening window. The processor randomizes an overall length of each listening window of the listening windows. The processor directs filtering of returned signals received during a plurality of the randomized listening windows to achieve filtered returned signals. The processor detects, using the filtered returned signals, a moving object in a field of view of the ultrasonic transducer.
A device comprises a processor coupled with an ultrasonic transducer which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with listening windows. Each sequential pair of the transmit periods is separated by a single listening window of the listening windows. During a fixed portion of a listening window of the listening windows the ultrasonic transducer is configured to receive returned signals corresponding to an emitted ultrasonic pulse of the ultrasonic pulses which was transmitted during a transmit period of the transmit periods that immediately preceded the listening window. The processor randomizes an overall length of each listening window of the listening windows. The processor directs filtering of returned signals received during a plurality of the randomized listening windows to achieve filtered returned signals. The processor detects, using the filtered returned signals, a moving object in a field of view of the ultrasonic transducer.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Measuring equipment sensors comprising an inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, sound, and distance ranges, for use in sensor fusion, Internet of Things, industrial applications and software development systems, drone applications and software development systems, automotive applications and software development systems; measuring equipment comprising ultrasonic time-of-flight sensors for measuring distances, obstacles, sounds, ultrasonic signals, and ultrasonic range sensing; acoustic sensors; microphones; sensors for detecting sound; sensors for recognizing sound; sensors for analyzing sound; sensors for the determination of location, positions, movement, change in pressure, activity monitoring, and change in elevation, for use in computers, laptops, tablets, smartphones, portable electronic devices, drones, smart watches, electronic tracking devices, and wearable electronic devices; fingerprint sensors and scanners; ultrasonic sensors; biometric identification apparatus; touchscreen sensors for interpreting fingerprints, image enhancement, fingerprint matching, user identification and user authentication; optical sensors for interpreting fingerprints, image enhancement, fingerprint matching, user identification, and user authentication; sensor development kits for motion comprised primarily of electronic sensors and software for use in industrial applications; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, obstacles, sounds, change in elevation, ultrasonic signals, and barometric pressure; downloadable and recorded software for use with sensors for monitoring position, movement, vibration, inclination, distances, environmental conditions, and Internet of Things applications; downloadable software for use with sensor devices and sensors for detecting sound, recognizing sound, analyzing sound, monitoring sound, and controlling sound; downloadable software for use with sensor-enabled microphones, headsets, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies; downloadable software for interpreting fingerprints; hardware for interpreting fingerprints, image enhancement, fingerprint matching, user identification, and user authentication; software for use with sensor-enabled microphones, headphones, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies, and Internet of Things devices for capturing and storing sensor data and analytics
26.
LOW NOISE READOUT INTERFACE FOR CAPACITIVE SENSORS WITH NEGATIVE CAPACITANCE
Disclosed embodiments provide a self-contained topology that enables a significant noise reduction of capacitive sensor readout interfaces. For example, various embodiments can provide low noise capacitive sensor readout interfaces or analog front ends having a main buffer amplifier in a bootstrap configuration, wherein a bootstrap loop configuration comprises a negative capacitance coupled to an input of the main buffer amplifier with a negative impedance converter.
G01R 27/26 - Mesure de l'inductance ou de la capacitance; Mesure du facteur de qualité, p.ex. en utilisant la méthode par résonance; Mesure de facteur de pertes; Mesure des constantes diélectriques
09 - Appareils et instruments scientifiques et électriques
Produits et services
Inertial measurement unit; motion sensors; accelerometers;
gyroscopes; magnetometers; pressure sensors; temperature
sensors; ultrasonic sensors for measuring acceleration,
angle of rotation, pressure, temperature, and distance
ranges, all for use in automotive systems, autonomous car
systems, advanced driver assisted systems, internet of
things applications, and internet of things software
development systems; measuring equipment (sensors)
comprising an inertial measurement unit, magnetometer,
pressure sensor, temperature sensor, ultrasonic sensor,
passive components, and high-precision algorithms, all for
use in sensor fusion for automotive systems, autonomous car
systems, advanced driver assisted systems, internet of
things applications, and internet of things software
development systems; sensor development kits, namely, kits
comprised primarily of computer hardware and downloadable
software for use in developing and operating sensors and
electronic devices for detecting, transmitting, recognizing,
analyzing, and tracking motion, movement, positions,
distances, obstacles, ultrasonic signals, and ultrasonic
range sensing; downloadable computer software for
integrating drivers for multi-sensor modules for automotive
systems, autonomous car systems, advanced driver assisted
systems, internet of things software development systems,
and internet of things applications.
28.
Parameterized Register Programming Protocol (RPP) To Save Layout Routing Area
A parameterized register interface of an integrated circuit and methods of register programming. An integrated circuit includes a digital controller, at least one client comprising at least one programmable register and a parameterized bus coupled to the digital controller and the client. The digital controller is configured to: transfer, via the parameterized bus, address data and/or register data between the digital controller and the client according to one or more interface signals conveyed over the parameterized bus; generate a transaction command comprising at least one transaction specific to the programmable register of the client, the transaction command generated according to a predetermined register programming protocol; and transfer, via the parameterized bus, the transaction command together with at least one predetermined combination of the interface signals to the client. The programmable register is configured to perform the transaction in accordance with the transaction command.
G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p.ex. circuits de commande E/S de données, mémoires tampon de données E/S
G11C 7/22 - Circuits de synchronisation ou d'horloge pour la lecture-écriture [R-W]; Générateurs ou gestion de signaux de commande pour la lecture-écriture [R-W]
G11C 7/24 - Circuits de protection ou de sécurité pour cellules de mémoire, p.ex. dispositions pour empêcher la lecture ou l'écriture par inadvertance; Cellules d'état; Cellules de test
29.
INCREMENTAL ANALOG TO DIGITAL CONVERTER INCORPORATING NOISE SHAPING AND RESIDUAL ERROR QUANTIZATION
The present invention relates to an incremental analog to digital converter incorporating noise shaping and residual error quantization. In one embodiment, a circuit includes an incremental analog to digital converter, comprising a loop filter that filters an analog input signal in response to receiving a reset signal, resulting in a filtered analog input signal, and a successive approximation register (SAR) quantizer, coupled with the filtered analog input signal, that converts the filtered analog input signal to an intermediate digitized output of a first resolution based on a reference voltage, wherein the SAR quantizer comprises a feedback loop that shapes quantization noise generated by the SAR quantizer as a result of converting the filtered analog input signal; and a digital filter, coupled with the intermediate digitized output, that generates a digitized output signal of a second resolution, greater than the first resolution, by digitally filtering the intermediate digitized output.
H03M 1/46 - Valeur analogique comparée à des valeurs de référence uniquement séquentiellement, p.ex. du type à approximations successives avec convertisseur numérique/analogique pour fournir des valeurs de référence au convertisseur
H03M 1/06 - Compensation ou prévention continue de l'influence indésirable de paramètres physiques
A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.
Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method can include extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.
A dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
G01C 19/5747 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses planaires vibrantes entraînées dans une vibration de translation le long d’un axe - Details de structure ou topologie les dispositifs ayant deux masses de détection en mouvement en opposition de phase chaque masse de détection étant reliée à une masse d'entraînement, p.ex. cadres d'entraînement
G01C 19/5762 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses planaires vibrantes entraînées dans une vibration de translation le long d’un axe - Details de structure ou topologie les dispositifs ayant une seule masse de détection la masse de détection étant reliée à une masse d'entraînement, p.ex. cadres d'entraînement
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer software for integrating drivers for
multi-sensor modules for internet of things software
development systems and internet of things applications;
measuring equipment sensors comprising inertial measurement
unit, magnetometer, pressure sensor, microphone, temperature
sensor, ultrasonic sensor for measuring acceleration, angle
of rotation, pressure, temperature, sound, and distance
ranges for use in internet of things applications and
internet of things software development systems; measuring
equipment sensors comprising an inertial measurement unit,
magnetometer, pressure sensor, temperature sensor,
ultrasonic sensor, microphone, passive components, and
high-precision algorithms for use in sensor fusion and
internet of things applications, industrial, drone, and
automotive applications, and internet of things software
development systems.
34.
PRESSURE SENSOR AND MANUFACTURING METHOD FOR THE SAME
A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.
G01L 9/12 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent en faisant usage des variations de la capacité
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
09 - Appareils et instruments scientifiques et électriques
Produits et services
Motion sensors; industrial sensors for improving efficiency and monitoring conditions in industrial applications; sensor evaluation kits for motion measurement comprised primarily of electronic sensors and software for use in industrial applications; sensors for determining position, movement, vibration, inclination, and distances; downloadable and recorded software for use with sensors and for monitoring position, movement, vibration, inclination, distances, environmental conditions, and for Internet of Things applications..
36.
MEMS design with shear force rejection for reduced offset
A MEMS sensor includes a central anchoring region that maintains the relative position of an attached proof mass relative to sense electrodes in the presence of undesired forces and stresses. The central anchoring region includes one or more first anchors that rigidly couple to a cover substrate and a base substrate. One or more second anchors are rigidly coupled to only the cover substrate and are connected to the one or more first anchors within the MEMS layer via an isolation spring. The proof mass in turn is connected to the one or more second anchors via one or more compliant springs.
G01P 15/125 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
G01P 15/08 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
37.
Round robin sensor device for processing sensor data
A round robin sensor device for processing sensor data is provided herein. The sensor device includes a multiplexer stage configured to sequentially select sensor outputs from one or more sensors continuously. Continuously and sequentially selecting sensor outputs results in a stream of selected sensor outputs. The sensor device also includes a charge-to-voltage converter operatively coupled to the multiplexer stage and configured to convert a charge from a first sensor of the one or more sensors to a voltage. Further, the sensor device includes a resettable integrator operatively coupled to the charge-to-voltage converter and configured to demodulate and integrate the voltage, resulting in an integrated voltage. Also included in the sensor device is an analog-to-digital converter operatively coupled to the resettable integrator and configured to digitize the integrated voltage to a digital code.
G01P 15/08 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
H03M 1/38 - Valeur analogique comparée à des valeurs de référence uniquement séquentiellement, p.ex. du type à approximations successives
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
G01P 15/125 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
09 - Appareils et instruments scientifiques et électriques
Produits et services
Barometric pressure measurement sensors; sensors and
waterproof sensors for the determination of location,
positions, movement, change in pressure, activity
monitoring, and change in elevation, for use in computers,
laptops, tablets, smartphones, portable electronic devices,
drone, smart watches, electronic tracking devices, wearable
electronic devices, and wireless connected devices; software
for use with computers, laptops, tablets, smartphones,
portable electronic devices, smart watches, electronic
tracking devices, wearable electronic devices, and wireless
connected devices, and electronic devices embedded with
sensors; software for use in tracking, locating, activity
monitoring, measuring change in elevation; software for
operating and managing mobile phones, computers, tablet
computers, portable electronic devices, smart watches,
fitness devices, electronic tracking devices, wireless
connected devices, wearable activity trackers, drones, and
in the Internet of Things (IoT); software for use with, but
not limited to, sensor devices, development kit; sensor
development kits, namely, kits comprised primarily of
computer hardware and downloadable software for use in
developing and operating sensors and electronic devices for
detecting, transmitting, recognizing, analyzing, and
tracking motion, change in elevation, movement, positions,
and barometric pressure.
39.
Motion sensor with sigma-delta analog-to-digital converter having resistive continuous-time digital-to-analog converter feedback for improved bias instability
A motion sensor with sigma-delta analog-to-digital converter (ADC) having improved bias instability is presented herein. Differential outputs of a differential amplifier of the sigma-delta ADC are electrically coupled, via respective capacitances, to differential inputs of the differential amplifier. To minimize bias instability corresponding to flicker noise that has been injected into the differential inputs, the differential inputs are electrically coupled, via respective pairs of electronic switches, to feedback resistances based on a pair of switch control signals. In this regard, a first feedback resistance of the feedback resistances is electrically coupled to a first defined voltage, and a second feedback resistance of the feedback resistances is electrically coupled to a second defined reference voltage. The differential outputs are electrically coupled to differential inputs of a differential comparator of the sigma-delta ADC, and complementary outputs of the differential comparator comprise the pair of switch control signals.
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
G01P 1/00 - MESURE DES VITESSES LINÉAIRES OU ANGULAIRES, DE L’ACCÉLÉRATION, DE LA DÉCÉLÉRATION OU DES CHOCS; INDICATION DE LA PRÉSENCE OU DE L’ABSENCE D’UN MOUVEMENT; INDICATION DE LA DIRECTION D’UN MOUVEMENT - Parties constitutives des instruments
G01P 15/08 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
G01C 19/5776 - Traitement de signal non spécifique à l'un des dispositifs couverts par les groupes
Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.
A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
G01P 15/08 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
42.
METHOD AND SYSTEM FOR AUTOMATIC FACTORY CALIBRATION
A sensor may be automatically calibrated during manufacture by providing a sensor processing unit having an integrated sensor, performing a check to determine if the integrated sensor has been previously calibrated upon a reset. When it has been determined the integrated sensor has not been previously calibrated, an automated calibration pattern may be imparted to the sensor so that a calibration parameter is determined.
G01P 13/00 - Indication ou enregistrement de l'existence ou de l'absence d'un mouvement; Indication ou enregistrement de la direction d'un mouvement
G01S 11/14 - Systèmes pour déterminer la distance ou la vitesse sans utiliser la réflexion ou la reradiation utilisant des ondes ultrasonores, sonores ou infrasonores
G06F 3/033 - Dispositifs de pointage déplacés ou positionnés par l'utilisateur; Leurs accessoires
G01S 5/18 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de position; Localisation par coordination de plusieurs déterminations de distance utilisant des ondes ultrasonores, sonores ou infrasonores
G01D 18/00 - Test ou étalonnage des appareils ou des dispositions prévus dans les groupes
G06F 3/038 - Dispositions de commande et d'interface à cet effet, p.ex. circuits d'attaque ou circuits de contrôle incorporés dans le dispositif
G06F 3/0346 - Dispositifs de pointage déplacés ou positionnés par l'utilisateur; Leurs accessoires avec détection de l’orientation ou du mouvement libre du dispositif dans un espace en trois dimensions [3D], p.ex. souris 3D, dispositifs de pointage à six degrés de liberté [6-DOF] utilisant des capteurs gyroscopiques, accéléromètres ou d’inclinaiso
G01C 21/16 - Navigation; Instruments de navigation non prévus dans les groupes en utilisant des mesures de la vitesse ou de l'accélération exécutées à bord de l'objet navigant; Navigation à l'estime en intégrant l'accélération ou la vitesse, c. à d. navigation par inertie
G01S 11/16 - Systèmes pour déterminer la distance ou la vitesse sans utiliser la réflexion ou la reradiation utilisant la différence de temps de transit entre des ondes électromagnétiques et des ondes sonores
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
G01S 11/12 - Systèmes pour déterminer la distance ou la vitesse sans utiliser la réflexion ou la reradiation utilisant des ondes électromagnétiques autres que les ondes radio
A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is formed over the conductive material. Portions of the dielectric layer uncovered by the eutectic bond layer is etched to expose the etch stop layer. The exposed portions of the etch stop layer is etched. A micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
Embodiments for constant charge or capacitance for capacitive micro-electro-mechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacitive sense element comprising an electrode and a sense capacitance. The charge-pump generates, at a bias resistor electrically coupled to the electrode, a bias voltage that is inversely proportional to a capacitance value comprising a value of the sense capacitance to facilitate maintenance of a nominally constant charge on the electrode. A sensing circuit comprises an alternating current (AC) signal source that generates an AC signal at a defined frequency; and generates, based on the AC signal, an AC test voltage at a test capacitance that is electrically coupled to the electrode. The sense element circuit generates, based on the AC test voltage at the defined frequency, an output signal representing the value of the sense capacitance.
Systems and methods are disclosed for capturing stabilized images. Motion of the mobile device is determined so that the relative position of the lens and image sensor may be adjusted to compensate for unintended motion. The relative position of the lens and image sensor may be periodically reset in response to a synchronization signal in between capturing images.
A gas sensor includes a plurality of sensing resistors that vary in resistance based on ambient temperature and the presence of certain gases, such as CO2 and H2O. The responses of each of the sensing resistors vary based on a base temperature of each of the sensing resistors. The base temperatures for each of the sensing resistors and configurations of the sensing resistors are selected to emphasize a response to a gas of interest (e.g., CO2) while de-emphasizing or canceling contributions from ambient temperature and gases that are not of interest (e.g., H2O).
G01N 27/18 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps chauffé électriquement dépendant de variations de température produite par des variations de la conductivité thermique d'un matériau de l'espace environnant à tester
G01N 33/00 - Recherche ou analyse des matériaux par des méthodes spécifiques non couvertes par les groupes
G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p.ex. une thermistance
H05B 3/20 - Eléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p.ex. plaques chauffantes
47.
SYSTEMS AND METHODS FOR CAPTURING STABILIZED IMAGES
Systems and methods are disclosed for capturing stabilized images. Motion of the mobile device is determined so that the relative position of the lens and image sensor may be adjusted to compensate for unintended motion. The relative position of the lens and image sensor may be periodically reset in response to a synchronization signal in between capturing images.
H04N 23/68 - Commande des caméras ou des modules de caméras pour une prise de vue stable de la scène, p. ex. en compensant les vibrations du boîtier de l'appareil photo
48.
CONSTANT CHARGE OR CAPACITANCE FOR CAPACITIVE MICRO-ELECTRICAL-MECHANICAL SYSTEM SENSORS
Embodiments for constant charge or capacitance for capacitive micro-electromechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacitive sense element comprising an electrode and a sense capacitance. The charge-pump generates, at a bias resistor electrically coupled to the electrode, a bias voltage that is inversely proportional to a capacitance value comprising a value of the sense capacitance to facilitate maintenance of a nominally constant charge on the electrode. A sensing circuit comprises an alternating current (AC) signal source that generates an AC signal at a defined frequency; and generates, based on the AC signal, an AC test voltage at a test capacitance that is electrically coupled to the electrode. The sense element circuit generates, based on the AC test voltage at the defined frequency, an output signal representing the value of the sense capacitance.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p.ex. systèmes micro-électromécaniques (SMEM, MEMS)
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p.ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
49.
MICROELECTROMECHANICAL SYSTEM MICROPHONE ARRAY CAPSULE
The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
An inertial sensor such as a MEMS accelerometer or gyroscope has a proof mass that is driven by a self-test signal, with the response of the proof mass to the self-test signal being used to determine whether the sensor is within specification. The self-test signal is provided as a non-periodic self-test pattern that does not correlate with noise such as environmental vibrations that are also experienced by the proof mass during the self-test procedure. The sense output signal corresponding to the proof mass is correlated with the non-periodic self-test signal, such that an output correlation value corresponds only to the proof mass response to the applied self-test signal.
G01C 19/5776 - Traitement de signal non spécifique à l'un des dispositifs couverts par les groupes
G01C 25/00 - Fabrication, étalonnage, nettoyage ou réparation des instruments ou des dispositifs mentionnés dans les autres groupes de la présente sous-classe
G01P 21/00 - Essai ou étalonnage d'appareils ou de dispositifs couverts par les autres groupes de la présente sous-classe
An inertial sensor such as a MEMS accelerometer or gyroscope has a proof mass that is driven by a self-test signal, with the response of the proof mass to the self-test signal being used to determine whether the sensor is within specification. The self-test signal is provided as a non-periodic self-test pattern that does not correlate with noise such as environmental vibrations that are also experienced by the proof mass during the self-test procedure. The sense output signal corresponding to the proof mass is correlated with the non-periodic self-test signal, such that an output correlation value corresponds only to the proof mass response to the applied self-test signal.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p.ex. comportant des membranes ou des lamelles élastiques
G01P 15/08 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
52.
HW programmable signal path event-based DSP for sensor mixed signal devices
A hardware-programmable digital signal path component for processing events from sensor mixed signal devices. A system includes a mixed signal component and a reconfigurable signal path component. The mixed signal component includes a group of sensor devices and generates one or more events from among the group of sensor devices. The signal path component receives the event(s), and includes a control unit component and a digital signal processor (DSP) component. The control unit component includes a programmable function enable mechanism, and distributes the received event(s) in combination with one or more functions among a set of predefined functions enabled by the programmable function enable mechanism. The DSP component is configured to perform one or more operations associated with the distributed event(s) in accordance with the enabled function(s).
An algorithm and architecture for sense transfer function estimation injects one or more test signals from a signal generator into a MEMS gyroscope to detect an output signal (e.g., proof mass output sense signal), including an in-phase (e.g., Coriolis) component and a quadrature component. The in-phase and quadrature components are encoded with reference signals to determine phase and/or gain variation and are processed via a variety of components (e.g., matrix rotation, digital gain, tones demodulator, transfer function errors estimation, etc.) to estimate a sense transfer function of the MEMS (e.g., Hs(fd)) and corresponding phase and/or gain offset of Hs(fd). The in-phase and quadrature components are also compensated for phase and/or gain offset by system components.
G01C 19/5656 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des barres ou des poutres vibrantes les dispositifs comportant une structure micromécanique
G01C 25/00 - Fabrication, étalonnage, nettoyage ou réparation des instruments ou des dispositifs mentionnés dans les autres groupes de la présente sous-classe
54.
ULTRASONIC CLIFF DETECTION AND DEPTH ESTIMATION USING TILTED SENSORS
A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first annular ring is defined around the first acoustic opening port and a second annular rings is defined around the second acoustic opening port. The annular ring attenuate direct path echoes between the acoustic opening ports. The first and second acoustic opening ports are coupled the first and sonic transducers, respectively, via first and second horns; and the horns are tilted from orthogonal with the surface.
G01S 15/931 - Systèmes sonar, spécialement adaptés à des applications spécifiques pour prévenir les collisions de véhicules terrestres
B06B 1/02 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique
A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first plurality of annular rings is defined in the external surface around the first acoustic opening port and a second plurality of annular rings is defined in the external surface around the second acoustic opening port. The pluralities of annular rings attenuate direct path echoes from a subset of the transmitted sonic signals which attempt to travel across the external surface to the second acoustic opening port.
A modified version of a MEMS self-test procedure is presented that can be used to detect the amplitude and frequency of an external vibration from an ambient environment. The method implements processing circuitry that correlates an output sense signal, s(t), with a plurality of periodic signal portions and a plurality of shifted periodic signal portions to generate a plurality of correlation values. A frequency associated with the external vibration is determined based on the plurality of correlation values.
G01P 15/125 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
G01P 1/00 - MESURE DES VITESSES LINÉAIRES OU ANGULAIRES, DE L’ACCÉLÉRATION, DE LA DÉCÉLÉRATION OU DES CHOCS; INDICATION DE LA PRÉSENCE OU DE L’ABSENCE D’UN MOUVEMENT; INDICATION DE LA DIRECTION D’UN MOUVEMENT - Parties constitutives des instruments
G01D 1/08 - Dispositions pour la mesure donnant des résultats autres que la valeur instantanée d'une variable, d'application générale donnant des valeurs intégrées par sommations intermittentes sur des périodes de temps fixées
G01D 1/02 - Dispositions pour la mesure donnant des résultats autres que la valeur instantanée d'une variable, d'application générale donnant des valeurs moyennes, p.ex. des valeurs efficaces
G01D 1/16 - Dispositions pour la mesure donnant des résultats autres que la valeur instantanée d'une variable, d'application générale donnant une valeur qui est une fonction de plusieurs valeurs, p.ex. produit ou rapport
09 - Appareils et instruments scientifiques et électriques
Produits et services
Inertial measurement unit; motion sensors; accelerometers; gyroscopes; magnetometers; pressure sensors; temperature sensors; ultrasonic sensors for measuring acceleration, angle of rotation, pressure, temperature, and distance ranges, all for use in automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; measuring equipment sensors comprising an inertial measurement unit, and high-precision algorithms, all for use in sensor fusion for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, and obstacles; downloadable computer software for integrating drivers for multi-sensor modules for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things software development systems, and internet of things applications
09 - Appareils et instruments scientifiques et électriques
Produits et services
Acoustic sensors; microphones; downloadable software for use
with sensor devices for use in detecting, recognizing,
analyzing, monitoring, and controlling sound; sensors for
detecting, recognizing, analyzing sound; downloadable
software for use with sensor-enabled microphones, headsets,
wireless audio devices, smart speakers, mobile devices,
wearable mobile technologies, and Internet of things (IoT)
devices for capturing and storing sensor data and analytics.
Described herein are methods and systems for controlling a sensor assembly with a plurality of same type sensors. Sensors are operated in active and inactive states. The activation state of at least one of the sensors is changed based on an operational parameter that relates to an environmental condition differentially affecting the plurality of same type sensors.
G01P 15/18 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération dans plusieurs dimensions
G01C 19/00 - Gyroscopes; Dispositifs sensibles à la rotation utilisant des masses vibrantes; Dispositifs sensibles à la rotation sans masse en mouvement; Mesure de la vitesse angulaire en utilisant les effets gyroscopiques
09 - Appareils et instruments scientifiques et électriques
Produits et services
Motion sensors; industrial sensors for improving efficiency
and monitoring conditions in industrial applications; sensor
evaluation kits for motion measurement comprised primarily
of electronic sensors and software for use in industrial
applications; sensors for determining position, movement,
vibration, inclination, and distances; downloadable and
recorded software for use with sensors and for monitoring
position, movement, vibration, inclination, distances,
environmental conditions, and for Internet of Things
applications.
61.
USING A HEARABLE TO GENERATE A USER HEALTH INDICATOR BASED ON USER TEMPERATURE
A hearable comprises a wearable structure including a speaker, a sensor, and a temperature compensating circuit which measures temperature in an environment of the sensor. A portion of the wearable structure, which includes the sensor and temperature compensating circuit, is disposed within a user’s ear when in use. A sensor processing unit which is communicatively coupled with the temperature compensating circuit: acquires temperature data from the temperature compensating circuit while the portion of the wearable structure is disposed within the ear of the user; builds a baseline model of normal temperature for the user; and compares a temperature measurement acquired from the temperature compensating circuit to the baseline model. In response to the comparison showing a deviation beyond a preset threshold from the baseline model, the sensor processing unit generates a health indicator for the user which is used to monitor an aspect of health of the user.
A61B 5/00 - Mesure servant à établir un diagnostic ; Identification des individus
A61B 5/01 - Mesure de la température de parties du corps
A61B 10/00 - Autres méthodes ou instruments pour le diagnostic, p.ex. pour le diagnostic de vaccination; Détermination du sexe; Détermination de la période d'ovulation; Instruments pour gratter la gorge
62.
Systems and methods for operating a mems device based on sensed temperature gradients
An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
63.
Sensor with dimple features and improved out-of-plane stiction
A method includes fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a first mask on a second side of the device wafer, wherein the second side is planar. A plurality of dimple features is formed on an exposed portion on the second side of the device wafer. The first mask is removed from the second side of the device wafer. A second mask is deposited on the second side of the device wafer that corresponds to a standoff. An exposed portion on the second side of the device wafer is etched to form the standoff. The second mask is removed. A rough polysilicon layer is deposited on the second side of the device wafer. A eutectic bond layer is deposited on the standoff. In some embodiments, a micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
Improving motion sensor robustness utilizing a room-temperature-volcanizing (RTV) material via a solder resist dam is presented herein. A sensor package comprises: a first semiconductor die; a second semiconductor die that is attached to the first semiconductor die to form a monolithic die; and a substrate comprising a top portion and a bottom portion, in which the top portion comprises a plurality of solder resist dams, the monolithic die is attached to the top portion of the substrate via the RTV material being disposed in a defined area of the top portion of the substrate, and the bottom portion of the substrate comprises electrical terminals that facilitate attachment and electrical coupling of signals of the sensor package to a printed circuit board.
Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The ceiling portion, the body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is configured to be in contact with the ceiling portion. The membrane is formed from a filtering fabric and is configured to substantially block one or more of liquids and contaminants from passing into the cavity.
Improving motion sensor robustness utilizing a room-temperature-volcanizing (RTV) material via a solder resist dam is presented herein. A sensor package comprises: a first semiconductor die; a second semiconductor die that is attached to the first semiconductor die to form a monolithic die; and a substrate comprising a top portion and a bottom portion, in which the top portion comprises a plurality of solder resist dams, the monolithic die is attached to the top portion of the substrate via the RTV material being disposed in a defined area of the top portion of the substrate, and the bottom portion of the substrate comprises electrical terminals that facilitate attachment and electrical coupling of signals of the sensor package to a printed circuit board.
A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p.ex. comportant des membranes ou des lamelles élastiques
68.
WATERPROOF MEMS PRESSURE SENSOR PACKAGE WITH A METAL LID AND AN EMBEDDED ePTFE FILTER AND PROCESS OF MAKING
Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is formed from a filtering fabric and is configured to substantially block one or more liquids and contaminants from passing into the cavity.
A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
G01L 9/12 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent en faisant usage des variations de la capacité
Disclosed embodiments provide glitch prediction based on machine learning algorithms in mixed analog and digital systems, particularly directed to digital microelectromechanical (MEMS) multipath acoustic sensors or microphones, which allow seamless, low latency gain changes without audible artifacts or interruptions in the audio output signal.
H03G 3/34 - Commande automatique dans des amplificateurs comportant des dispositifs semi-conducteurs rendant l'amplificateur muet en l'absence de signal
A retinal projection display system includes at least one visible light source for projecting a visible light image, an infrared light source for projecting infrared light, a scanning mirror having a field of view larger than the visible light image, a reflective surface on which the visible light image is projected and on which the infrared light is reflected at least partially towards an eye of a user, wherein the reflective surface is larger than the visible light image, at least one infrared photodetector for receiving reflected infrared light that reflects off of the eye of the user, and a hardware computation module comprising a processor and a memory, the hardware computation module configured to determine a gaze direction of the user based at least in part on the reflected infrared light.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Downloadable computer software for integrating drivers for multi-sensor modules for internet of things software development systems and internet of things applications; measuring equipment sensors comprising inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, pressure, temperature, sound, and distance ranges for use in internet of things applications and internet of things software development systems; measuring equipment sensors comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, microphone, passive components, and high-precision algorithms for use in sensor fusion and internet of things applications, industrial, drone, and automotive applications, and internet of things software development systems
09 - Appareils et instruments scientifiques et électriques
Produits et services
Ultrasonic sensors; ultrasonic time-of-flight sensors;
Internet of Things (IoT) sensors; sensor development kits,
namely, kits comprised primarily of computer hardware and
downloadable software for use in developing and operating
sensors and electronic devices for detecting, transmitting,
recognizing, analyzing, and tracking motion, movement,
positions, distances, obstacles, sounds, ultrasonic signal,
and ultrasonic range sensing.
An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a structural layer, a piezoelectric layer having a first surface and a second surface, a first electrode placed on the first surface of the piezoelectric layer, wherein the first electrode is located at the center of the membrane, a second electrode placed on the first surface of the piezoelectric layer, wherein the second electrode is a patterned electrode comprising more than one electrode components that are electrically coupled, and a third electrode coupled to the second surface of the piezoelectric layer and electrically coupled to ground.
A61B 8/00 - Diagnostic utilisant des ondes ultrasonores, sonores ou infrasonores
B06B 1/02 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique
75.
GAZE TRACKING FOR A RETINAL PROJECTION DISPLAY SYSTEM
A retinal projection display system includes at least one visible light source for projecting a visible light image, an infrared light source for projecting infrared light, a scanning mirror having a field of view larger than the visible light image, a reflective surface on which the visible light image is projected and on which the infrared light is reflected at least partially towards an eye of a user, wherein the reflective surface is larger than the visible light image, at least one infrared photodetector for receiving reflected infrared light that reflects off of the eye of the user, and a hardware computation module comprising a processor and a memory, the hardware computation module configured to determine a gaze direction of the user based at least in part on the reflected infrared light.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a structural layer, a piezoelectric layer having a first surface and a second surface, a first electrode placed on the first surface of the piezoelectric layer, wherein the first electrode is located at the center of the membrane, a second electrode placed on the first surface of the piezoelectric layer, wherein the second electrode is a patterned electrode comprising more than one electrode components that are electrically coupled, and a third electrode coupled to the second surface of the piezoelectric layer and electrically coupled to ground.
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
G01H 11/08 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores par détection des changements dans les propriétés électriques ou magnétiques par des moyens électriques utilisant des dispositifs piézo-électriques
77.
ANCHOR CONFIGURATIONS FOR AN ARRAY OF ULTRASONIC TRANSDUCERS
An ultrasonic transducer array including a substrate, a membrane overlying the substrate, the membrane configured to allow movement at ultrasonic frequencies, and a plurality of anchors connected to the substrate and connected to the membrane. The membrane includes a piezoelectric layer, a plurality of first electrodes, and a plurality of second electrodes, wherein each ultrasonic transducer of a plurality of ultrasonic transducers includes at least a first electrode and at least a second electrode. The plurality of anchors includes a first anchor including a first electrical connection for electrically coupling at least one first electrode to control circuitry and a second anchor including a second electrical connection for electrically coupling at least one second electrode. The ultrasonic transducer array could be either a two-dimensional array or a one-dimensional array of ultrasonic transducers.
G06F 3/043 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction utilisant la propagation d'ondes acoustiques
A retinal projection display system includes a light source for projecting an image, a scanning mirror having a field of view larger than the image, and a reflective surface on which the image is projected, wherein the reflective surface is larger than the image. The scanning mirror projects the image onto a viewable region of the reflective surface such that the image is projected into a retina of a user.
Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method can include extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.
A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.
A device includes a substrate and an intermetal dielectric (IMD) layer disposed over the substrate. The device also includes a first plurality of polysilicon layers disposed over the IMD layer and over a bumpstop. The device also includes a second plurality of polysilicon layers disposed within the IMD layer. The device includes a patterned actuator layer with a first side and a second side, wherein the first side of the patterned actuator layer is lined with a polysilicon layer, and wherein the first side of the patterned actuator layer faces the bumpstop. The device further includes a standoff formed over the IMD layer, a via through the standoff making electrical contact with the polysilicon layer of the actuator and a portion of the second plurality of polysilicon layers and a bond material disposed on the second side of the patterned actuator layer.
A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity comprises a first cavity region and a second cavity region separated by a portion of the substrate extruding thereto, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. A surface of the first cavity is covered with a getter material.
A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.
A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity comprises a first cavity region and a second cavity region separated by a portion of the substrate extruding thereto, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. A surface of the first cavity is covered with a getter material.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p.ex. systèmes micro-électromécaniques (SMEM, MEMS)
The present disclosure relates to methods of enhancing a navigation solution about a device and a platform, wherein the mobility of the device may be constrained or unconstrained within the platform, and wherein the navigation solution is provided even in the absence of normal navigational information updates (such as, for example, GNSS). More specifically, the present method comprises utilizing measurements from sensors (e.g. accelerometers, gyroscopes, magnetometers etc.) within the device to calculate and resolve the attitude of the device and the platform, and the attitude misalignment between the device and the platform.
G01C 21/16 - Navigation; Instruments de navigation non prévus dans les groupes en utilisant des mesures de la vitesse ou de l'accélération exécutées à bord de l'objet navigant; Navigation à l'estime en intégrant l'accélération ou la vitesse, c. à d. navigation par inertie
G01C 21/20 - Instruments pour effectuer des calculs de navigation
G01C 25/00 - Fabrication, étalonnage, nettoyage ou réparation des instruments ou des dispositifs mentionnés dans les autres groupes de la présente sous-classe
Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method includes extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.
A device includes a substrate and an intermetal dielectric (IMD) layer disposed over the substrate. The device also includes a first plurality of polysilicon layers disposed over the IMD layer and over a bumpstop. The device also includes a second plurality of polysilicon layers disposed within the IMD layer. The device includes a patterned actuator layer with a first side and a second side, wherein the first side of the patterned actuator layer is lined with a polysilicon layer, and wherein the first side of the patterned actuator layer faces the bumpstop. The device further includes a standoff formed over the IMD layer, a via through the standoff making electrical contact with the polysilicon layer of the actuator and a portion of the second plurality of polysilicon layers and a bond material disposed on the second side of the patterned actuator layer.
The described technology is generally directed towards a sensor signal multiplexer and digitizer with analog notch filter and optimized sample frequency, and corresponding methods of use and manufacture. In some examples, the disclosed technologies can be used to reduce vibration sensitivity of an inertial measurement unit (IMU). The disclosed sensor signal multiplexer can sample sensor inputs on multiple input channels at a first, higher frequency, and integrate samples for each channel in order to generate lower frequency sensor outputs. The lower frequency sensor outputs can be converted to digital form.
A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
G01N 25/56 - Recherche ou analyse des matériaux par l'utilisation de moyens thermiques en recherchant la teneur en eau
G01N 27/12 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps solide dépendant de la réaction avec un fluide
G01L 19/06 - Moyens pour empêcher la surcharge ou l'influence délétère du milieu à mesurer sur le dispositif de mesure ou vice versa
G01L 19/00 - MESURE DES FORCES, DES CONTRAINTES, DES COUPLES, DU TRAVAIL, DE LA PUISSANCE MÉCANIQUE, DU RENDEMENT MÉCANIQUE OU DE LA PRESSION DES FLUIDES - Détails ou accessoires des appareils pour la mesure de la pression permanente ou quasi permanente d'un milieu fluent dans la mesure où ces détails ou accessoires ne sont pas particuliers à des types particuliers de manomètres
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pression; Transmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
Described herein are methods and systems for determining a relative position of different portions of a hinged device. Motion sensor data from sensor assemblies of each portion is fused to relate the device portions to a world frame. An angular orientation between the device portions is determined with respect to the hinge axis and accumulating sensor measurement errors are compensated by constraining determined axes of the sensor assemblies using the motion sensor data and known relationships between physical axes of the sensor assemblies and the mechanical hinge, such that the determined axes of the sensor assemblies are aligned along the hinge axis.
An interleaved cascaded integrator-comb (“CIC”) filter receives an interleaved sensor output signal, including a plurality of digitized sensor signals at an input clock rate. An integrator of the interleaved CIC filter processes the interleaved signal to output an integrated interleaved signal. A downsampler of the interleaved CIC filter buffers portions of the integrated interleaved corresponding to a decimation rate for the interleaved signal. The portions of the signals are provided to a comb filter, which outputs a decimated interleaved signal.
The described technology is generally directed towards an electrical current based temperature sensor and temperature information digitizer, referred to herein as a “temperature digitizer”. The temperature digitizer can include a sensor core, a digital to analog converter, a current comparator, and a processor. The processor can be configured to perform multiple current comparisons using the sensor core, digital to analog converter, and current comparator, and the processor can generate a digital code that reflects the results of the multiple current comparisons. The digital code represents the temperature.
G01K 7/01 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments semi-conducteurs à jonctions PN
93.
Applying a positive feedback voltage to an electromechanical sensor utilizing a voltage-to-voltage converter to facilitate a reduction of charge flow in such sensor representing spring softening
Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor. In yet another example, the electromechanical sensor comprises a piezoelectric sense element.
G01P 15/125 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
G01P 1/00 - MESURE DES VITESSES LINÉAIRES OU ANGULAIRES, DE L’ACCÉLÉRATION, DE LA DÉCÉLÉRATION OU DES CHOCS; INDICATION DE LA PRÉSENCE OU DE L’ABSENCE D’UN MOUVEMENT; INDICATION DE LA DIRECTION D’UN MOUVEMENT - Parties constitutives des instruments
G01P 15/00 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération
A microelectromechanical system (MEMS) microphone includes a cavity to receive an acoustic signal. The acoustic signal causes movement of a diaphragm relative to one or more other surfaces, which in turn results in an electrical signal representative of the received acoustic signal. A light sensor is included within the packaging of the MEMS microphone such that an output of the light sensor is representative of a light signal received with the acoustic signal. The output of the light sensor is used to modify the electrical signal representative of the received acoustic signal in a manner that limits light interference with an acoustical output signal.
Methods and systems for compensation of a microelectromechanical system (MEMS) sensor may include associating test temperature values with input test signal values, identifying temperature-input signal pairs, and applying one of the test temperature values and one of the test signal values to the MEMS sensor. Desired output signal values may be determined, with each of the desired output signal values corresponding to one of the applied temperature-input signal pairs. Measured output signal values from the MEMS sensor may be measured, with each of the measured output signal values corresponding to one of the applied temperature-input signal pairs. Compensation terms may be determined based on the plurality of temperature-input signal pairs, the corresponding plurality of measured output signal values, and the corresponding plurality of desired output signal values. Compensation terms may be used to modify a sense signal of the MEMS sensor.
G01C 19/5776 - Traitement de signal non spécifique à l'un des dispositifs couverts par les groupes
G01P 15/08 - Mesure de l'accélération; Mesure de la décélération; Mesure des chocs, c. à d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
96.
MEMS STRESS REDUCTION STRUCTURE EMBEDDED INTO PACKAGE
A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.
An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.
A method includes forming an etch stop layer over a first side of a device wafer. The method also includes forming a polysilicon layer over the etch stop layer. A handle wafer is fusion bonded to the first side of the device wafer. A eutectic bond layer is formed on a second side of the device wafer. A micro-electro-mechanical system (MEMS) features are etched into the second side of the device wafer to expose the etch stop layer. The exposed etch stop layer is removed to expose the polysilicon layer. The exposed polysilicon layer is removed to expose a cavity formed between the handle wafer and the device wafer.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p.ex. systèmes micro-électromécaniques (SMEM, MEMS)
