An weapon sight system includes a weapon sight having body with an optical element that is configured to superimpose a reticle that is visible through the optical element. The weapon sight includes a controller in electronic communication with and configured to control a light source. The light source may include an LED for generating a reticle image on the optical element at a plurality of different brightness conditions. The light source may include an array of LEDs for generating multiple different reticle images on the optical element. The weapon sight includes a Hall effect sensor in electronic communication with the controller to adjust user-selectable settings including reticle brightness or reticle image. The weapon sight system includes a magnetic input device for providing an input to the Hall effect sensor of the weapon sight.
F41G 1/30 - Appareils de visée à réflexion spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie
F41G 1/16 - Mécanismes de réglage des crans de mire; Montures des crans de mire
G01R 33/07 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs à effet Hall
G02B 27/34 - Repères fiduciels ou échelles de mesure à l'intérieur du système optique éclairés
G02B 27/36 - Repères fiduciels ou échelles de mesure à l'intérieur du système optique réglables
H05B 47/11 - Commande de la source lumineuse en réponse à des paramètres détectés en détectant la luminosité ou la température de couleur de la lumière ambiante
2.
ADJUSTABLE WEAPON SIGHT SYSTEM AND METHOD OF CONTROL
An weapon sight system includes a weapon sight having body with an optical element that is configured to superimpose a reticle that is visible through the optical element. The weapon sight includes a controller in electronic communication with and configured to control a light source. The light source may include an LED for generating a reticle image on the optical element at a plurality of different brightness conditions. The light source may include an array of LEDs for generating multiple different reticle images on the optical element. The weapon sight includes a Hall effect sensor in electronic communication with the controller to adjust user-selectable settings including reticle brightness or reticle image. The weapon sight system includes a magnetic input device for providing an input to the Hall effect sensor of the weapon sight.
F41G 1/30 - Appareils de visée à réflexion spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie
F41G 1/32 - Appareils de visée de nuit, p.ex. luminescents
G02B 23/10 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée comprenant des prismes ou des miroirs projetant dans le champ de vision des indications supplémentaires, p.ex. données par des collimateurs
F41G 1/16 - Mécanismes de réglage des crans de mire; Montures des crans de mire
G02B 23/02 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée comprenant des prismes ou des miroirs
G02B 27/00 - Systèmes ou appareils optiques non prévus dans aucun des groupes ,
An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.
H01J 29/96 - TUBES À DÉCHARGE ÉLECTRIQUE OU LAMPES À DÉCHARGE ÉLECTRIQUE - Détails des tubes à rayons cathodiques ou des tubes à faisceau électronique des types couverts par le groupe un ou plusieurs éléments de circuits associés structuralement au tube
H01J 31/50 - Tubes convertisseurs d'image ou amplificateurs d'image, c. à d. comprenant un signal d'entrée optique, à rayons X ou analogue, et un signal de sortie optique
An enhanced vision system includes a first optic subsystem and a transparent photodetector subsystem disposed within a common housing. The first optic subsystem may include passive devices such as simple or compound lenses, active devices such as low-light enhancing image intensifiers, or a combination of passive and active devices. The transparent photodetector subsystem receives the visible image exiting the first optic subsystem and converts a portion of the electromagnetic energy in the visible image to a signal communicated to image analysis circuitry. On a real-time or near real-time basis, the image analysis circuitry detects and identifies structures, objects, and/or individuals in the visible image. The image analysis circuitry provides an output that includes information regarding the structure, objects, and individuals to the system user contemporaneous with the system user viewing the visible image.
G06V 20/20 - RECONNAISSANCE OU COMPRÉHENSION D’IMAGES OU DE VIDÉOS Éléments spécifiques à la scène dans les scènes de réalité augmentée
G02B 23/12 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée avec des moyens pour renverser ou intensifier l'image
H04N 23/11 - Caméras ou modules de caméras comprenant des capteurs d'images électroniques; Leur commande pour générer des signaux d'image à partir de différentes longueurs d'onde pour générer des signaux d'image à partir de longueurs d'onde de lumière visible et infrarouge
H04N 23/45 - Caméras ou modules de caméras comprenant des capteurs d'images électroniques; Leur commande pour générer des signaux d'image à partir de plusieurs capteurs d'image de type différent ou fonctionnant dans des modes différents, p. ex. avec un capteur CMOS pour les images en mouvement en combinaison avec un dispositif à couplage de charge [CCD]
H04N 23/57 - Caméras ou modules de caméras comprenant des capteurs d'images électroniques; Leur commande - Détails mécaniques ou électriques de caméras ou de modules de caméras spécialement adaptés pour être intégrés dans d'autres dispositifs
H04N 23/63 - Commande des caméras ou des modules de caméras en utilisant des viseurs électroniques
Methods and systems are disclosed for a weapon sight with a tapered housing. The housing may be configured to enclose an optical bench and/or a portion of an adjuster assembly within the weapon sight. The housing may include an outer shell, a first window, and a second window. The first window may define a first area. The second window may define a second area. The second area may be greater than the first area, for example, such that the outer shell is tapered outward from the first opening to the second opening. The outer shell may define a first wall and a second wall that extend between the first opening and the second opening on opposed sides of an optical path of the weapon sight. The first wall and the second wall may be slanted outward from the first window to the second window.
A weapon system has an optical sight mounted to a weapon and a frame with a sight window that is configured to superimpose a reticle that is visible through the sight window in a first focal plane. An optoelectronic device is mounted to the weapon and includes an imager with a sensor array and a display device. An image processor is configured to receive image data captured by the sensor array and process the image data to generate a subset image that is received from a select region of the sensor array. The select region of the sensor array defines a second focal plane. A controller is configured to receive an input from an operator, and in response to the input, to select the select region of the sensor array for aligning the second focal plane with the first focal plane.
F41G 1/34 - Appareils de visée de nuit, p.ex. luminescents combinés à une source lumineuse, p.ex. projecteur
F41G 1/32 - Appareils de visée de nuit, p.ex. luminescents
F41G 1/38 - Appareils de visée télescopiques spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie; Leurs supports ou leurs montures
8.
SYSTEM AND METHOD OF DIGITAL FOCAL PLANE ALIGNMENT FOR IMAGER AND WEAPON SYSTEM SIGHTS
A weapon system has an optical sight mounted to a weapon and a frame with a sight window that is configured to superimpose a reticle that is visible through the sight window in a first focal plane. An optoelectronic device is mounted to the weapon and includes an imager with a sensor array and a display device. An image processor is configured to receive image data captured by the sensor array and process the image data to generate a subset image that is received from a select region of the sensor array. The select region of the sensor array defines a second focal plane. A controller is configured to receive an input from an operator, and in response to the input, to select the select region of the sensor array for aligning the second focal plane with the first focal plane.
F41G 1/32 - Appareils de visée de nuit, p.ex. luminescents
F41G 1/38 - Appareils de visée télescopiques spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie; Leurs supports ou leurs montures
F41G 11/00 - APPAREILS DE VISÉE; POINTAGE - Parties constitutives des appareils de pointage ou de visée; Accessoires
A weapon system has an optical sight mounted to a weapon and a frame with a sight window that is configured to superimpose a reticle that is visible through the sight window in a first focal plane. An optoelectronic device is mounted to the weapon and includes an imager with a sensor array and a display device. An image processor is configured to receive image data captured by the sensor array and process the image data to generate a subset image that is received from a select region of the sensor array. The select region of the sensor array defines a second focal plane. A controller is configured to receive an input from an operator, and in response to the input, to select the select region of the sensor array for aligning the second focal plane with the first focal plane.
F41G 1/17 - Appareils de visée à éléments interchangeables, c. à d. jeux de plusieurs dispositifs de visée, disposés au choix sur la ligne de visée
F41G 1/30 - Appareils de visée à réflexion spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie
F41G 1/38 - Appareils de visée télescopiques spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie; Leurs supports ou leurs montures
A holographic sight comprises a unitary optical component carrier having a plurality of receptacles for receiving optical components. A collimating optic abuts a surface of a first receptacle. A mirror abuts a surface of a second receptacle. A collar is positioned in a third receptacle and a laser diode is positioned within the collar. A first portion of the collar is affixed relative to a first portion of the third receptacle and a second portion of the collar is free to expand and contract relative to the third receptacle. The laser diode is affixed to the collar proximate the second portion and is free to move relative to the third receptacle with expansion and contraction of the second portion. The laser diode, the mirror, and the collimating optic are positioned relative to each other to create an optical path.
G02B 7/00 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques
G02B 5/32 - Hologrammes utilisés comme éléments optiques
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
G03H 1/00 - Procédés ou appareils holographiques utilisant la lumière, les infrarouges ou les ultraviolets pour obtenir des hologrammes ou pour en obtenir une image; Leurs détails spécifiques
F41G 3/08 - Dispositifs de pointage avec correcteurs de vitesse, direction, température, pression ou humidité de l'atmosphère
Methods and systems are disclosed for a modular weapon sight assembly. A weapon sight may include a base, an optical bench, an adjuster assembly, and/or a housing. The base may be configured to be releasably secured to a weapon. The optical bench may include a plurality of optical elements attached to a unitary component carrier. A relative position of the plurality of optical elements may define an optical path of the weapon sight. The base, the optical bench, the adjuster assembly, and the housing may be configured as separate modules. For example, the optical path of the optical bench may remain constant during adjustment and/or replacement of the base, the adjuster assembly, and/or the housing. A change in position of the base, the adjuster assembly, and/or the housing may not alter the relative position of the plurality of optical elements with respect to one another.
An enhanced vision system includes a first optic subsystem and a transparent photodetector subsystem disposed within a common housing. The first optic subsystem may include passive devices such as simple or compound lenses, active devices such as low-light enhancing image intensifiers, or a combination of passive and active devices. The transparent photodetector subsystem receives the visible image exiting the first optic subsystem and converts a portion of the electromagnetic energy in the visible image to a signal communicated to image analysis circuitry. On a real-time or near real-time basis, the image analysis circuitry detects and identifies structures, objects, and/or individuals in the visible image. The image analysis circuitry provides an output that includes information regarding the structure, objects, and individuals to the system user contemporaneous with the system user viewing the visible image.
G06V 20/20 - RECONNAISSANCE OU COMPRÉHENSION D’IMAGES OU DE VIDÉOS Éléments spécifiques à la scène dans les scènes de réalité augmentée
G02B 23/12 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée avec des moyens pour renverser ou intensifier l'image
H04N 23/11 - Caméras ou modules de caméras comprenant des capteurs d'images électroniques; Leur commande pour générer des signaux d'image à partir de différentes longueurs d'onde pour générer des signaux d'image à partir de longueurs d'onde de lumière visible et infrarouge
H04N 23/45 - Caméras ou modules de caméras comprenant des capteurs d'images électroniques; Leur commande pour générer des signaux d'image à partir de plusieurs capteurs d'image de type différent ou fonctionnant dans des modes différents, p. ex. avec un capteur CMOS pour les images en mouvement en combinaison avec un dispositif à couplage de charge [CCD]
H04N 23/57 - Caméras ou modules de caméras comprenant des capteurs d'images électroniques; Leur commande - Détails mécaniques ou électriques de caméras ou de modules de caméras spécialement adaptés pour être intégrés dans d'autres dispositifs
H04N 23/63 - Commande des caméras ou des modules de caméras en utilisant des viseurs électroniques
F41G 1/38 - Appareils de visée télescopiques spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie; Leurs supports ou leurs montures
An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.
An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.
H01J 29/96 - TUBES À DÉCHARGE ÉLECTRIQUE OU LAMPES À DÉCHARGE ÉLECTRIQUE - Détails des tubes à rayons cathodiques ou des tubes à faisceau électronique des types couverts par le groupe un ou plusieurs éléments de circuits associés structuralement au tube
H01J 31/50 - Tubes convertisseurs d'image ou amplificateurs d'image, c. à d. comprenant un signal d'entrée optique, à rayons X ou analogue, et un signal de sortie optique
A holographic sight comprises a base, a support member attached to the base and extending upward therefrom, and a unitary optical component carrier formed with the support member. The support member is flexible and the unitary optical component carrier moveable in horizontal and vertical directions relative to the base. A bridge is attached to the base and forms an opening into which a portion of the unitary optical component carrier extends. A projection is coupled with the bridge and protrudes into the opening to abut the unitary optical component carrier. Extending the projection into the opening increases pressure applied by the projection to the optical component carrier. The increased pressure causes the unitary optical component carrier to be displaced.
F41G 1/30 - Appareils de visée à réflexion spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie
F41G 1/16 - Mécanismes de réglage des crans de mire; Montures des crans de mire
G02B 5/32 - Hologrammes utilisés comme éléments optiques
G02B 23/00 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée
G02B 23/10 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée comprenant des prismes ou des miroirs projetant dans le champ de vision des indications supplémentaires, p.ex. données par des collimateurs
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
A holographic sight comprises a base, a support member attached to the base and extending upward therefrom, and a unitary optical component carrier formed with the support member. The support member is flexible and the unitary optical component carrier moveable in horizontal and vertical directions relative to the base. A bridge is attached to the base and forms an opening into which a portion of the unitary optical component carrier extends. A projection is coupled with the bridge and protrudes into the opening to abut the unitary optical component carrier. Extending the projection into the opening increases pressure applied by the projection to the optical component carrier. The increased pressure causes the unitary optical component carrier to be displaced.
F41G 1/30 - Appareils de visée à réflexion spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie
F41G 1/16 - Mécanismes de réglage des crans de mire; Montures des crans de mire
G02B 23/10 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée comprenant des prismes ou des miroirs projetant dans le champ de vision des indications supplémentaires, p.ex. données par des collimateurs
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
A holographic sight comprises a unitary optical component carrier having a plurality of receptacles for receiving optical components. A collimating optic abuts a surface of a first receptacle. A mirror abuts a surface of a second receptacle. A collar is positioned in a third receptacle and a laser diode is positioned within the collar. A first portion of the collar is affixed relative to a first portion of the third receptacle and a second portion of the collar is free to expand and contract relative to the third receptacle. The laser diode is affixed to the collar proximate the second portion and is free to move relative to the third receptacle with expansion and contraction of the second portion. The laser diode, the mirror, and the collimating optic are positioned relative to each other to create an optical path. The collar expands and contracts in response to changes in temperature to compensate for the unitary optical component carrier expanding and contracting in response to changes in temperature.
A holographic sight comprises a unitary optical component carrier. The unitary optical component carrier may comprise a body with a first receptacle configured to receive a laser diode, a second receptacle configured to receive a mirror, a third receptacle configured to receive a collimating optic, a fourth receptacle configured to receive a grating, and a fifth receptacle configured to receive an image hologram. A laser diode may be received within opposing walls formed by the first receptacle. A mirror may be received in, and abut one or more surfaces of the second receptacle. A collimating optic may be received in, and abut one or more surfaces of the third receptacle. A grating may be received in, and abut one or more surfaces of the fourth receptacle. A hologram image may be received in, and abut one or more surfaces of the fifth receptacle.
Methods and systems are disclosed for a modular weapon sight assembly. A weapon sight may include a base, an optical bench, an adjuster assembly, and/or a housing. The base may be configured to be releasably secured to a weapon. The optical bench may include a plurality of optical elements attached to a unitary component carrier. A relative position of the plurality of optical elements may define an optical path of the weapon sight. The base, the optical bench, the adjuster assembly, and the housing may be configured as separate modules. For example, the optical path of the optical bench may remain constant during adjustment and/or replacement of the base, the adjuster assembly, and/or the housing. A change in position of the base, the adjuster assembly, and/or the housing may not alter the relative position of the plurality of optical elements with respect to one another.
A holographic sight comprises a unitary optical component carrier. The unitary optical component carrier may comprise a body with a first receptacle configured to receive a laser diode, a second receptacle configured to receive a mirror, a third receptacle configured to receive a collimating optic, a fourth receptacle configured to receive a grating, and a fifth receptacle configured to receive an image hologram. A laser diode may be received within opposing walls formed by the first receptacle. A mirror may be received in, and abut one or more surfaces of the second receptacle. A collimating optic may be received in, and abut one or more surfaces of the third receptacle. A grating may be received in, and abut one or more surfaces of the fourth receptacle. A hologram image may be received in, and abut one or more surfaces of the fifth receptacle.
A holographic sight comprises a unitary optical component carrier having a plurality of receptacles for receiving optical components. A collimating optic abuts a surface of a first receptacle. A mirror abuts a surface of a second receptacle. A collar is positioned in a third receptacle and a laser diode is positioned within the collar. A first portion of the collar is affixed relative to a first portion of the third receptacle and a second portion of the collar is free to expand and contract relative to the third receptacle. The laser diode is affixed to the collar proximate the second portion and is free to move relative to the third receptacle with expansion and contraction of the second portion. The laser diode, the mirror, and the collimating optic are positioned relative to each other to create an optical path. The collar expands and contracts in response to changes in temperature to compensate for the unitary optical component carrier expanding and contracting in response to changes in temperature.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Rifle scopes; telescopic gun sights; optical lens sights, namely, magnifiers; thermal vision sights, namely, optical lens sights and thermal imaging systems, not for medical use; night vision monocular and binoculars; tactical target lasers, namely, pointing device for use with firearms; optical lens sights, namely, holographic weapon sights; optical lens sights, namely, holographic hybrid sights; optical lens sights, namely, special use sights in the nature of tactical laser sights
Methods and systems are disclosed for a modular weapon sight assembly. A weapon sight may include a base, an optical bench, an adjuster assembly, and/or a housing. The base may be configured to be releasably secured to a weapon. The optical bench may include a plurality of optical elements attached to a unitary component carrier. A relative position of the plurality of optical elements may define an optical path of the weapon sight. The base, the optical bench, the adjuster assembly, and the housing may be configured as separate modules. For example, the optical path of the optical bench may remain constant during adjustment and/or replacement of the base, the adjuster assembly, and/or the housing. A change in position of the base, the adjuster assembly, and/or the housing may not alter the relative position of the plurality of optical elements with respect to one another.
09 - Appareils et instruments scientifiques et électriques
13 - Armes à feu; explosifs
Produits et services
Rifle scopes; telescopic gun sights; optical lens sights, namely, magnifiers; thermal vision sights, namely, optical lens sights and thermal imaging systems, not for medical use; night vision monocular and binoculars; tactical target lasers, namely, pointing device for use with firearms; optical lens sights, namely, holographic weapon sights; optical lens sights, namely, holographic hybrid sights; optical lens sights, namely, special use sights in the nature of tactical laser sights Non-telescopic gun sights for firearms; Firearm attachments, namely, mounts for attaching gun sights to a firearm
Methods and systems are disclosed for a weapon sight with a tapered housing. The housing may be configured to enclose an optical bench and/or a portion of an adjuster assembly within the weapon sight. The housing may include an outer shell, a first window, and a second window. The first window may define a first area. The second window may define a second area. The second area may be greater than the first area, for example, such that the outer shell is tapered outward from the first opening to the second opening. The outer shell may define a first wall and a second wall that extend between the first opening and the second opening on opposed sides of an optical path of the weapon sight. The first wall and the second wall may be slanted outward from the first window to the second window.
F41G 1/16 - Mécanismes de réglage des crans de mire; Montures des crans de mire
G02B 5/32 - Hologrammes utilisés comme éléments optiques
G02B 23/10 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée comprenant des prismes ou des miroirs projetant dans le champ de vision des indications supplémentaires, p.ex. données par des collimateurs
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
Methods and systems are disclosed for a weapon sight with a tapered housing. The housing may be configured to enclose an optical bench and/or a portion of an adjuster assembly within the weapon sight. The housing may include an outer shell, a first window, and a second window. The first window may define a first area. The second window may define a second area. The second area may be greater than the first area, for example, such that the outer shell is tapered outward from the first opening to the second opening. The outer shell may define a first wall and a second wall that extend between the first opening and the second opening on opposed sides of an optical path of the weapon sight. The first wall and the second wall may be slanted outward from the first window to the second window.
G02B 23/10 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée comprenant des prismes ou des miroirs projetant dans le champ de vision des indications supplémentaires, p.ex. données par des collimateurs
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
Methods and systems are disclosed for a weapon sight with a tapered housing. The housing may be configured to enclose an optical bench and/or a portion of an adjuster assembly within the weapon sight. The housing may include an outer shell, a first window, and a second window. The first window may define a first area. The second window may define a second area. The second area may be greater than the first area, for example, such that the outer shell is tapered outward from the first opening to the second opening. The outer shell may define a first wall and a second wall that extend between the first opening and the second opening on opposed sides of an optical path of the weapon sight. The first wall and the second wall may be slanted outward from the first window to the second window.
A holographic sight comprises a unitary optical component carrier. The unitary optical component carrier may comprise a body with a first receptacle configured to receive a laser diode, a second receptacle configured to receive a mirror, a third receptacle configured to receive a collimating optic, a fourth receptacle configured to receive a grating, and a fifth receptacle configured to receive an image hologram. A laser diode may be received within opposing walls formed by the first receptacle. A mirror may be received in, and abut one or more surfaces of the second receptacle. A collimating optic may be received in, and abut one or more surfaces of the third receptacle. A grating may be received in, and abut one or more surfaces of the fourth receptacle. A hologram image may be received in, and abut one or more surfaces of the fifth receptacle.
F41G 1/30 - Appareils de visée à réflexion spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie
G02B 23/10 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée comprenant des prismes ou des miroirs projetant dans le champ de vision des indications supplémentaires, p.ex. données par des collimateurs
G03H 1/00 - Procédés ou appareils holographiques utilisant la lumière, les infrarouges ou les ultraviolets pour obtenir des hologrammes ou pour en obtenir une image; Leurs détails spécifiques
Methods and systems are disclosed for a modular weapon sight assembly. A weapon sight may include a base, an optical bench, an adjuster assembly, and/or a housing. The base may be configured to be releasably secured to a weapon. The optical bench may include a plurality of optical elements attached to a unitary component carrier. A relative position of the plurality of optical elements may define an optical path of the weapon sight. The base, the optical bench, the adjuster assembly, and the housing may be configured as separate modules. For example, the optical path of the optical bench may remain constant during adjustment and/or replacement of the base, the adjuster assembly, and/or the housing. A change in position of the base, the adjuster assembly, and/or the housing may not alter the relative position of the plurality of optical elements with respect to one another.
A holographic sight comprises a unitary optical component carrier having a plurality of receptacles for receiving optical components. A collimating optic abuts a surface of a first receptacle. A mirror abuts a surface of a second receptacle. A collar is positioned in a third receptacle and a laser diode is positioned within the collar. A first portion of the collar is affixed relative to a first portion of the third receptacle and a second portion of the collar is free to expand and contract relative to the third receptacle. The laser diode is affixed to the collar proximate the second portion and is free to move relative to the third receptacle with expansion and contraction of the second portion. The laser diode, the mirror, and the collimating optic are positioned relative to each other to create an optical path. The collar expands and contracts in response to changes in temperature to compensate for the unitary optical component carrier expanding and contracting in response to changes in temperature.
G02B 7/00 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques
G02B 5/32 - Hologrammes utilisés comme éléments optiques
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
G03H 1/00 - Procédés ou appareils holographiques utilisant la lumière, les infrarouges ou les ultraviolets pour obtenir des hologrammes ou pour en obtenir une image; Leurs détails spécifiques
F41G 3/08 - Dispositifs de pointage avec correcteurs de vitesse, direction, température, pression ou humidité de l'atmosphère
A holographic sight comprises a base, a support member attached to the base and extending upward therefrom, and a unitary optical component carrier formed with the support member. The support member is flexible and the unitary optical component carrier moveable in horizontal and vertical directions relative to the base. A bridge is attached to the base and forms an opening into which a portion of the unitary optical component carrier extends. A projection is coupled with the bridge and protrudes into the opening to abut the unitary optical component carrier. Extending the projection into the opening increases pressure applied by the projection to the optical component carrier. The increased pressure causes the unitary optical component carrier to be displaced.
An enhanced vision system includes a first optic subsystem and a transparent photodetector subsystem disposed within a common housing. The first optic subsystem may include passive devices such as simple or compound lenses, active devices such as low-light enhancing image intensifiers, or a combination of passive and active devices. The transparent photodetector subsystem receives the visible image exiting the first optic subsystem and converts a portion of the electromagnetic energy in the visible image to a signal communicated to image analysis circuitry. On a real-time or near real-time basis, the image analysis circuitry detects and identifies structures, objects, and/or individuals in the visible image. The image analysis circuitry provides an output that includes information regarding the structure, objects, and individuals to the system user contemporaneous with the system user viewing the visible image.
G09G 5/00 - Dispositions ou circuits de commande de l'affichage communs à l'affichage utilisant des tubes à rayons cathodiques et à l'affichage utilisant d'autres moyens de visualisation
G06V 20/20 - RECONNAISSANCE OU COMPRÉHENSION D’IMAGES OU DE VIDÉOS Éléments spécifiques à la scène dans les scènes de réalité augmentée
G02B 23/12 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée avec des moyens pour renverser ou intensifier l'image
H04N 5/232 - Dispositifs pour la commande des caméras de télévision, p.ex. commande à distance
F41G 1/38 - Appareils de visée télescopiques spécialement adaptés aux armes à feu individuelles ou aux pièces d'artillerie; Leurs supports ou leurs montures
A novel photocathode employing a conduction band barrier is described. Incorporation of a barrier optimizes a trade-off between photoelectron transport efficiency and photoelectron escape probability. The barrier energy is designed to achieve a net increase in photocathode sensitivity over a specific operational temperature range.
H01J 31/48 - Tubes dont le signal de sortie est amplifié par un multiplicateur d'électrons, disposé à l'intérieur du tube
H01J 31/49 - Tubes capteurs adaptés pour un rayonnement électromagnétique d'entrée autre que la lumière visible et possédant une sortie électrique, p.ex. pour des rayons X ou un rayonnement infrarouge d'entrée
45.
Thermally assisted negative electron affinity photocathode
A novel photocathode employing a conduction band barrier is described. Incorporation of a barrier optimizes a trade-off between photoelectron transport efficiency and photoelectron escape probability. The barrier energy is designed to achieve a net increase in photocathode sensitivity over a specific operational temperature range.
H01J 31/48 - Tubes dont le signal de sortie est amplifié par un multiplicateur d'électrons, disposé à l'intérieur du tube
H01J 31/49 - Tubes capteurs adaptés pour un rayonnement électromagnétique d'entrée autre que la lumière visible et possédant une sortie électrique, p.ex. pour des rayons X ou un rayonnement infrarouge d'entrée
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
09 - Appareils et instruments scientifiques et électriques
13 - Armes à feu; explosifs
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
35 - Publicité; Affaires commerciales
Produits et services
Furbishing preparations, namely cleaning fluids, glass cleaning preparations, and oils for cleaning purposes; cloths impregnated with a detergent for cleaning firearms and firearm sights; pre-moistened towelettes impregnated with a detergent for cleaning firearms and firearm sights; wipes incorporating cleaning preparations for use in cleaning firearms and firearm sights. Optical apparatus and instruments, namely binoculars, telescopes, telescopic sights for firearms, tripods for use with binoculars, telescopes, and eyepieces; portable night vision instruments, namely night vision goggles, night vision telescopes, and, carrying cases, carrying straps, and protective covers for use with telescopes, binoculars, night vision goggles, and tripods; holographic instruments for use in target tracking; optical finders; telescopic sights incorporating lighting units; thermal imaging cameras. Firearms; Firearm attachments, namely, mounts for attaching night vision devices to a firearm; attachments for weapon sights, namely holographic, night vision, and thermal vision-based sights for firearms. Cleaning cloths for sporting optic lenses for use with firearms and firearm sights, namely, cleaning rags, leathers for cleaning purposes, cloths for wiping optical lenses, canister sets, and brushes. Retail store services featuring firearms and firearm attachments, namely firearm sights and firearm scopes, sporting optics, night vision goggles, thermal vision goggles, holographic weapon sights, optical trackers, tripods, cleaning cloths and cleaning fluids for use with firearms and firearm attachments.
47.
IMAGE INTENSIFIER WITH INDEXED COMPLIANT ANODE ASSEMBLY
An image intensifier contains a photocathode assembly (120) including a vacuum window to generate photoelectrons in response to light, a vacuum package (110) and an anode assembly (130) to receive the photoelectrons. The anode assembly is mounted to the vacuum package via a compliant, springy, support structure (160). The anode additionally includes one or more insulating spacers (140) on the surface facing the photocathode so as to precisely index the position of the anode assembly with respect to the photocathode surface. The photocathode and vacuum window assembly is pressed into the vacuum package to generate a sealed leak tight vacuum envelope. During the photocathode assembly to vacuum package assembly pressing operation, the inner surface of the photocathode assembly contacts the insulating spacer/spacers of the anode assembly, thereby compressing the compliant support structure. This structure and assembly method result in a precisely indexed photocathode to anode assembly sealed image intensifier.
H01J 31/50 - Tubes convertisseurs d'image ou amplificateurs d'image, c. à d. comprenant un signal d'entrée optique, à rayons X ou analogue, et un signal de sortie optique
48.
Image intensifier with indexed compliant anode assembly
An image intensifier and a method of fabrication are disclosed. The image intensifier contains a photocathode assembly (120) including a vacuum window to generate photoelectrons in response to light, a vacuum package (110) and an anode assembly (130) to receive the photoelectrons. The anode assembly is mounted to the vacuum package via a compliant, springy, support structure (160). The anode additionally includes one or more insulating spacers (140) on the surface facing the photocathode so as to precisely index the position of the anode assembly with respect to the photocathode surface. The photocathode and vacuum window assembly is pressed into the vacuum package to generate a sealed leak tight vacuum envelope. During the photocathode assembly to vacuum package assembly pressing operation, the inner surface of the photocathode assembly contacts the insulating spacer/spacers of the anode assembly, thereby compressing the compliant support structure. This structure and assembly method result in a precisely indexed photocathode to anode assembly sealed image intensifier.
A holographic sight is provided having a housing that includes a plurality of holograph sight components. A laser diode mounted in the housing is configured to emit a laser light beam. The light beam is transmitted to an integrated diffraction grating and filter unit which includes a grating and a filter in a single device. The diffraction grating has a grating surface for diffracting the light beam and also diffracting unwanted ambient light transmitted into the housing. The filter is an optical filter contacting at least a portion of the grating. The optical filter is adapted to absorb at least one wavelength of the ambient light to inhibit the ambient light from diffracting into a visible spectrum that might otherwise be viewable to a user looking into the holographic sight.
A holographic sight is provided having a housing that includes a plurality of holograph sight components. A laser diode mounted in the housing is configured to emit a laser light beam. The light beam is transmitted to an integrated diffraction grating and filter unit which includes a grating and a filter in a single device. The diffraction grating has a grating surface for diffracting the light beam and also diffracting unwanted ambient light transmitted into the housing. The filter is an optical filter contacting at least a portion of the grating. The optical filter is adapted to absorb at least one wavelength of the ambient light to inhibit the ambient light from diffracting into a visible spectrum that might otherwise be viewable to a user looking into the holographic sight.
09 - Appareils et instruments scientifiques et électriques
13 - Armes à feu; explosifs
Produits et services
Telescopic gun sights; optical sights for guns and archery and optical lenses for distance measurement; holographic firearm optical sights; reticles for optical firearms sights; thermal imaging systems, not for medical use; day and night vision systems primarily comprising day and night sensors, day and night cameras, power sources, communication means, monitors and operating software; magnified optical sighting device for firearms Gun sights, namely, non-telescopic sights for use with firearms; sights for firearms other than telescopic sights; mounts for firearm sights
09 - Appareils et instruments scientifiques et électriques
Produits et services
(1) Digital sensor that employs a metal-oxide semiconductor or a charge coupled device imager to receive and amplify light in low light imaging conditions.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Digital sensor that employs a metal-oxide semiconductor or a charge coupled device imager to receive and amplify light in low light imaging conditions.
An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.
C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c. à d. non caractérisé par le procédé de revêtement
An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.
H04N 3/14 - TRANSMISSION D'IMAGES, p.ex. TÉLÉVISION - Détails des dispositifs de balayage des systèmes de télévision; Leur combinaison avec la production des tensions d'alimentation par des moyens non exclusivement optiques-mécaniques au moyen de dispositifs à l'état solide à balayage électronique
H04N 5/335 - Transformation d'informations lumineuses ou analogues en informations électriques utilisant des capteurs d'images à l'état solide [capteurs SSIS]
64.
LOW ENERGY PORTABLE LOW-LIGHT CAMERA WITH WAVELENGTH CUTOFF
A sensor for night vision applications is provided, wherein the sensor comprises a semiconductor absorption layer of composition that limits long wavelength response cutoff to between 1.25 to 1.4µm wavelength. The selection of this cutoff frequency provides improved dark current performance, thereby requiring less cooling of the sensor. Consequently, energy consumption is reduced, as the sensor does not require active cooling, so that the sensor is particularly beneficial for mobile night vision applications where battery weight is of high importance.
H01L 31/0304 - Matériaux inorganiques comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
H01L 31/105 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel étant du type PIN
65.
Low energy portable low-light camera with wavelength cutoff
A sensor for night vision applications is provided, wherein the sensor comprises a semiconductor absorption layer of composition that limits long wavelength response cutoff to between 1.25 to 1.4 μm wavelength. The selection of this cutoff frequency provides improved dark current performance, thereby requiring less cooling of the sensor. Consequently, energy consumption is reduced, as the sensor does not require active cooling, so that the sensor is particularly beneficial for mobile night vision applications where battery weight is of high importance.
H01L 31/00 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails
A novel photocathode employing a rectifying junction is described that permits color imaging extending applications for photocathodes in a variety of instruments and night vision devices.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/12 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués
H01L 27/04 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur
G01J 5/20 - Pyrométrie des radiations, p.ex. thermométrie infrarouge ou optique en utilisant des détecteurs électriques de radiations en utilisant des éléments résistants, thermorésistants ou semi-conducteurs sensibles aux radiations, p.ex. des dispositifs photoconducteurs
68.
Aiming sight having fixed light emitting diode (LED) array and rotatable collimator
An aiming sight includes a controller, a power supply, an LED array, and a collimator. The power supply powers the LEDs to turn-on and turn-off, and powers the collimator to rotate. The collimator rotates to different rotational positions while the controller, the power supply, and the LED array remain fixed in place. The LEDs are positioned such that one LED and the collimator are at a constant angle and separated by a constant focal distance for each collimator position. The controller controls the collimator to rotate to a collimator position to generate an aiming dot at an angular position corresponding to the collimator position. The controller turns-on the LED which is at the constant angle and separated from the collimator by the constant focal distance and turns-off the remaining LEDs such that the collimator collimates light from the turned-on LED into the aiming dot at the angular position corresponding to the collimator position.
F41G 1/473 - Appareils de visée pour utilisations particulières pour l'indication de correction de vitesse ou de distance, p.ex. sur les fusils ou les fusils de chasse
F41G 1/48 - Appareils de visée pour utilisations particulières pour lancer des grenades au moyen de fusils
A fused thermal and a direct view aiming sight includes an optical gun sight, a thermal sight, and a beam combiner. The optical sight generates a direct view image of an aiming point or reticle superimposed on a target scene. The thermal sight generates a monochromic thermal image of the target scene. The combiner is positioned behind a 1× non-magnified optical sight and the thermal sight and in front of an exit pupil of the thermal sight. The combiner is positioned right behind the intermediate image plane of a magnified optical sight between an objective lens and an eyepiece. The combiner passes the direct view image and reflects the thermal image to the exit pupil to fuse the thermal image onto the direct view image for an operator to see at the exit pupil as a combined thermal and direct view optical image of the target scene together with the aiming reticle.
G02B 23/00 - Télescopes ou lunettes d'approche, p.ex. jumelles; Périscopes; Instruments pour voir à l'intérieur de corps creux; Viseurs; Pointage optique ou appareils de visée
G02B 27/10 - Systèmes divisant ou combinant des faisceaux
70.
Low profile holographic sight and method of manufacturing same
A low profile holographic sight includes a base having a mounting mechanism and a body mounted on the base for housing a laser diode, an associated electronic control and power source, and optical elements including a collimator, a transmission image hologram of the reticle pattern, and a reflective diffraction grating, wherein the optical elements are arranged within the body to direct and fold the laser beam in a substantially generally horizontal path, and is insensitive to drift in laser wavelength. The optical elements superimpose an image of the reticle pattern over the direct view of the target scene in a generally parallel and close relationship with the barrel of a firearm, such as a shotgun or a rifle, upon which the sight is mounted.
Backthinning in an area selective manner is applied to CMOS imaging sensors 12 for use in electron bombarded active pixel array devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels of an active pixel array providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.
H01L 31/00 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails
72.
Semiconductor die attachment for high vacuum tubes
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.
There is described novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
H01L 23/22 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet liquide à la température normale de fonctionnement du dispositif
H01L 23/24 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet solide ou à l'état de gel, à la température normale de fonctionnement du dispositif
09 - Appareils et instruments scientifiques et électriques
Produits et services
Photonics for low light imaging, hyperspectral imaging, and spectroscopy, namely cameras, lasers, imaging spectrometers, spectral filters, optical interferometers, microscopes, light probes, photodetectors, photocathodes, packages electronic chips and video display monitors for creating direct images or hyperspectral images of objects and/or the spectrum of light scattered or emitted from objects illuminated with lasers or light emitting diodes
09 - Appareils et instruments scientifiques et électriques
Produits et services
photonics, namely, cameras, lasers, photodetectors, photocathodes, packaged coded electronic chips and video display monitors for creating images, namely, electronic images of objects, which include objects at low light levels
09 - Appareils et instruments scientifiques et électriques
Produits et services
electronic camera laser systems and subsystems comprising lasers, cameras, lenses, cables and control electronics for viewing of laser illuminated objects
09 - Appareils et instruments scientifiques et électriques
Produits et services
electronic chip based camera system and subsystems therefor comprising of cameras, cables, detectors, and controllers for creating video output electronic signals for viewing objects
