An illumination module may include an emitter configured to emit light along an optical axis of the illumination module and an optical system located on or over the emitter. The optical system may include a curved surface where the curved surface is tilted in a first direction, such that the optical system introduces optical aberration in the first direction.
An illumination module may include an emitter configured to emit light along an optical axis of the illumination module and an optical system located on or over the emitter. The optical system may include a curved surface where the curved surface is tilted in a first direction, such that the optical system introduces optical aberration in the first direction.
An electro-acoustic transducer includes a membrane and at least one laser. The at least one laser is configured to emit radiation toward the membrane such that radiation emitted by the at least one laser is reflected from the membrane back toward the at least one laser to produce a self-mixing interference effect corresponding to an excursion or velocity of the membrane.
An optoelectronic module comprising: a radiation-emitting device; a housing comprising a wall or walls laterally surrounding the radiation-emitting device; two or more terminals disposed on a surface of the wall or walls; a transparent substrate abutting the housing, the transparent substrate comprising an interlock feature; a control unit coupled to the two or more terminals, wherein the control unit is configured to: supply an electrical current though the interlock feature; monitor an electrical parameter associated with the interlock feature; wherein the terminals are arranged such that: when the transparent substrate is in a first orientation about an optical axis of the radiation-emitting device, the interlock feature is coupled to at least two of the two or more terminals and the optoelectronic module is operable to provide a field of illumination in a first illumination orientation; and when the transparent substrate is in a second orientation about the optical axis of the radiation-emitting device, the interlock feature is coupled to at least two of the two or more terminals and the optoelectronic module is operable to provide a field of illumination in a second illumination orientation different from the first illumination orientation.
An optical sensor. The optical sensor comprises a light source, first and second light sensors, and a controller. The light source has a field of illumination. The first and second light sensors have respective first and second fields of view. The intersection of the field of illumination and the first field of view forms a first overlap region. The intersection of the field of illumination and the second field of view forms a second overlap region. When a surface is within one or both of the first and second overlap region, the surface reflects light from the light source to the respective light sensor. The controller is configured to determine a first distance measurement to a surface within one or both of the first and second overlap regions based on the ratio of reflected light from the light source received by the first sensor and reflected light from the light source received by the second sensor. A similar ultrasonic sensor is also disclosed.
G01S 17/10 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes à modulation d'impulsion interrompues
G01S 7/481 - Caractéristiques de structure, p.ex. agencements d'éléments optiques
G01S 15/08 - Systèmes pour mesurer la distance uniquement
G01S 7/4865 - Mesure du temps de retard, p.ex. mesure du temps de vol ou de l'heure d'arrivée ou détermination de la position exacte d'un pic
6.
LIGHT REPLICATION / RETRANSMISSION APPARATUS AND METHOD
A substantially planar light replication or re-transmission component having an incident light receiving surface and an opposed light emitting surface. The component comprises a substantially transparent planar substrate, one or more bipolar junction transistors provided on said substrate, the or each transistor comprising a collector region adjacent to said light receiving surface, an emitter region adjacent to said light emitting surface, and a base region between said collector region and said emitter region, and circuitry for biasing the bipolar transistors in use. The or each transistor is configured and biased in use so that said collector and base regions of the transistor operate as a photodiode whilst said base and emitter regions operate as a light emitting diode.
H01L 33/10 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une structure réfléchissante, p.ex. réflecteur de Bragg en semi-conducteur
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 33/26 - Matériaux de la région électroluminescente
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
A sensing system may include a first coded aperture configured to receive incident light and transmit a coded image of an object. The sensing system comprises a light replication component configured to detect the coded image and emit a replicated coded image. The sensing system may include a second coded aperture configured to receive the replicated coded image and transmit a decoded image. The sensing system may include a sensor configured to detect the decoded image.
H04N 19/172 - Procédés ou dispositions pour le codage, le décodage, la compression ou la décompression de signaux vidéo numériques utilisant le codage adaptatif caractérisés par l’unité de codage, c. à d. la partie structurelle ou sémantique du signal vidéo étant l’objet ou le sujet du codage adaptatif l’unité étant une zone de l'image, p.ex. un objet la zone étant une image, une trame ou un champ
G02B 27/58 - Optique pour l'apodisation ou la super-résolvance; Systèmes optiques à ouverture synthétisée
A method of manufacturing an optical element, the method comprising: providing a substrate; providing a tool comprising, on a first side, a section defining a surface structure of the optical element; aligning the tool and the substrate with respect to each other and bringing the tool and a first side of the substrate together, with material between the tool and the substrate; positioning a transparent masking structure adjacent to the substrate onto which the material has adhered, the masking structure comprising a masking layer; emitting light through the masking structure to be incident on a portion of the material to cure said potion of the material, wherein the masking layer prevents light from being incident on a remaining portion of the material such that the remaining portion of the material is uncured; and removing the uncured remaining portion of the material.
G02B 1/04 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques caractérisés par la substance dont ils sont faits; Revêtements optiques pour éléments optiques faits de substances organiques, p.ex. plastiques
An optical sensor. The optical sensor comprises a substrate, a Fabry-Perot interferometer, and first and second photodetectors. The Fabry-Perot interferometer comprises a first mirror and a second mirror, and is mounted on the substrate such that light is transmitted through the interferometer to the substrate. The first and second photodetectors are configured to detect light transmitted through the etalon and the substrate. The first photodetector is sensitive to a first wavelength range, and the second photodetector is sensitive to a second wavelength range, and wherein the first and second wavelength ranges each correspond to a different mode of the interferometer.
G01J 3/26 - Production du spectre; Monochromateurs en utilisant une réflexion multiple, p.ex. interféromètre de Fabry-Perot, filtre à interférences variables
G01J 3/36 - Mesure de l'intensité des raies spectrales directement sur le spectre lui-même Étude de plusieurs bandes d’un spectre à l’aide de détecteurs distincts
G01J 3/02 - Spectrométrie; Spectrophotométrie; Monochromateurs; Mesure de la couleur - Parties constitutives
G01J 3/51 - Mesure de couleur; Dispositifs de mesure de couleur, p.ex. colorimètres en utilisant des détecteurs électriques de radiations en utilisant des filtres de couleur
10.
METHOD FOR USE IN MANUFACTURING AN OPTICAL EMITTER ARRANGEMENT
A method for use in manufacturing an optical emitter arrangement comprises holding an electrically conductive base member and two electrically conductive base elements in a predetermined spatial relationship, and providing two electrically conductive projections, wherein each projection extends in a direction away from a surface of a corresponding one of the base elements and wherein each projection terminates at a corresponding outer end. The method further comprises bringing a projecting portion of a surface profile of a mold tool into engagement with an area of a surface of the base member whilst bringing other portions of the surface profile of the mold tool into engagement with the outer ends of the projections so as to form a void that extends away from the surface of the base member around the projecting portion of the surface profile of the mold tool and that extends away from the surface of each of the base elements around each projection without extending over the outer end of each projection. The method further comprises injecting an electrically insulating plastic material into the void and curing the plastic material so as to form an electrically insulating housing that extends away from the surface of the base member so as to define a space for accommodating an optical emitter device, wherein the space extends away from the area of the surface of the base member, and wherein the housing also extends away from the surface of each of the base elements around each projection without covering the outer end of each projection. The method may be used, in particular though not exclusively, for manufacturing an optical emitter arrangement for a projector or an illuminator such as flood illuminator.
H01S 5/02257 - Découplage de lumière utilisant des fenêtres optiques, p.ex. spécialement adaptées pour réfléchir de la lumière sur un détecteur à l’intérieur du boîtier
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01S 5/0236 - Fixation des puces laser sur des supports en utilisant un adhésif
A privacy film for a curved display screen. The privacy film has a curved cross section when no force is applied. The privacy film comprises alternating transparent layers and opaque layers, each extending across the privacy film, and each parallel to the other transparent and opaque layers when no force is applied. A method of manufacturing the film is also disclosed.
Optical Device and Manufacturing Method An optical device (380) is disclosed, the device comprising a substrate (330), first electrically-conductive element (325) formed as a pattern on the substrate, a layer of material extending over at least a portion of the first electrically-conductive element and forming an optical element (370), and a second electrically-conductive element (355) extending through the layer of material and coupled to the first electrically-conductive element. Also disclosed is an associated method of manufacturing the optical device (380), and an apparatus (600) comprising at least one of the disclosed optical devices, a camera (605), and processing circuitry (615) communicably coupled to the at least one optical device and to the camera.
G03B 17/48 - APPAREILS OU DISPOSITIONS POUR PRENDRE DES PHOTOGRAPHIES, POUR LES PROJETER OU LES VISIONNER; APPAREILS OU DISPOSITIONS UTILISANT DES TECHNIQUES ANALOGUES UTILISANT D'AUTRES ONDES QUE DES ONDES OPTIQUES; LEURS ACCESSOIRES - Parties constitutives des appareils ou corps d'appareils; Leurs accessoires prévus pour être combinés à d'autres appareils photographiques ou optiques
A method of manufacturing a spacer (285) for spacing apart and electrically coupling first and second components of an optical device is disclosed. The method comprises a step of adhesively coupling a first substrate (250) to each of a plurality of spacer elements (205). The method comprises a step of adhesively coupling a second substrate (275) to each of the plurality of spacer elements, such that the plurality of spacer elements are disposed between opposing surfaces of the first and second substrates. At least one of the plurality of spacer elements comprises a conductive coating and/or is adhesively coupled to the first and second substrates with an electrically-conductive adhesive, such that an electrically-conductive path (290a-d) is formed for electrically coupling the first and second components of the optical device. Also disclosed is an optical device (500) comprising a spacer (285) manufactured according to the method.
A method for producing a plurality of optical prisms comprises: providing at least one manufacturing intermediate; and dividing the at least one manufacturing intermediate into a plurality of individual triangular prisms. The manufacturing intermediate comprises a main body in the form of a triangular prism having three rectangular surfaces and two triangular surfaces. The main body is formed from a light-transmitting material. A layer of opaque material is provided on two of the three rectangular surfaces of the main body, the layer of opaque material having a plurality of axially spaced apertures on each of the two of the three rectangular surfaces, each one of the apertures on one of the two surfaces being disposed at substantially the same axial position as one of the apertures on the other one of the two surfaces. The at least one manufacturing intermediate is divided into a plurality of individual triangular prisms such that each individual triangular prism has one of the apertures on each of two sides thereof.
B28D 1/04 - Travail de la pierre ou des matériaux analogues p.ex. briques, béton, non prévu ailleurs; Machines, dispositifs, outils à cet effet par sciage avec des lames de scie circulaires ou des disques de scie
G02B 7/18 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs
B28D 7/04 - Accessoires spécialement conçus pour leur utilisation avec les machines ou les dispositifs des autres groupes de la présente sous-classe pour supporter ou maintenir les pièces travaillées
An inductive position sensor device includes at least a first terminal to couple the position sensor device with a first receiving antenna coil for providing a first reception signal, and at least a second terminal to couple the position sensor device with a second receiving antenna coil for providing a second reception signal. The device further includes a unique receiver channel to evaluate the first and second reception signal, and a multiplexer. The multiplexer is configured to selectively couple the at least one first terminal or the at least one second terminal with the unique receiver channel in dependence on operating the multiplexer in a first or second operation state.
G01D 5/20 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier l'inductance, p.ex. une armature mobile
A method for generating a depth map A method for generating a depth map for a field of view is disclosed. The method comprises illuminating the field of view with a plurality of discrete radiation beams and detecting a reflected portion of at least some of the plurality of discrete radiation beams. The method further comprises determining range information for an object within the field of view from which each reflected portion was reflected based on time of flight. The method further comprises identifying a corresponding one of the plurality of discrete radiation beams from which each reflected portion originated. The method further comprises generating a depth map comprising a plurality of points, each point having: a depth value corresponding to determined range information for a detected reflected portion of a discrete radiation beam; and a position within the depth map corresponding to a position of the identified corresponding one of the plurality of discrete radiation beams.
G01S 3/78 - Radiogoniomètres pour déterminer la direction d'où proviennent des ondes infrasonores, sonores, ultrasonores ou électromagnétiques ou des émissions de particules sans caractéristiques de direction utilisant des ondes électromagnétiques autres que les ondes radio
G01S 17/06 - Systèmes déterminant les données relatives à la position d'une cible
17.
A LIDAR SENSOR FOR LIGHT DETECTION AND RANGING, LIDAR MODULE, LIDAR ENABLED DEVICE AND METHOD OF OPERATING A LIDAR SENSOR FOR LIGHT DETECTION AND RANGING
A LiDAR sensor for light detection and ranging includes a light source, a driver circuit, a detector and a processing unit. The light source includes an array of light emitters, wherein the light emitters are electrically interconnected as groups, and wherein the light emitters are operable to emit light away from the LiDAR sensor. At least two of the groups of light emitters form areas of the light source resembling different geometries from each other. The driver circuit is operable to address the groups of light emitters individually, such that the light emitters from a same group emit light with a same emission characteristic. The detector includes an array of photodetectors, wherein each photodetector is operable to detect light emitted by the light source and being reflected by an object outside the LiDAR sensor and to generate a detector signal as a function of the detected light. The processing unit is operable to provide an output indicative of distance to the object based on the detector signals associated with a respective group of light emitters.
An optical sensor. The optical sensor comprises a substrate and a Fabry-Perot interferometer. The substrate is formed from a semiconductor. The Fabry-Perot interferometer comprises a first mirror and a second mirror, and is mounted on the substrate such that light is transmitted through the interferometer to the substrate. The substrate is doped such that a region of the substrate to which light is transmitted by the interferometer forms a photodiode.
G01J 3/02 - Spectrométrie; Spectrophotométrie; Monochromateurs; Mesure de la couleur - Parties constitutives
G01J 3/26 - Production du spectre; Monochromateurs en utilisant une réflexion multiple, p.ex. interféromètre de Fabry-Perot, filtre à interférences variables
19.
APPARATUS FOR MONITORING MECHANICAL INTEGRITY OF AN EYE-SAFETY COMPONENT OF AN ILLUMINATOR
An apparatus for monitoring mechanical integrity of an eye-safety component of an illuminator is disclosed. The apparatus comprises a transducer operable to create a vibration in the eye-safety component, a sensor operable to sense the vibration in the eye safety component and to output a signal representative of the sensed vibration, and a processor. The processor is operable to: monitor the signal from the sensor; determine if the signal comprises at least one parameter that falls outside of a pre-determined acceptable range, the pre-determined acceptable range being indicative of mechanical integrity of the eye-safety component; and initiate a safety action in response to a determination that the at least one parameter falls outside of the pre-determined acceptable range thereby indicating a loss of mechanical integrity.
G01H 1/12 - Mesure des vibrations dans des solides en utilisant la conduction directe au détecteur les vibrations étant longitudinales ou non spécifiées
G01N 29/11 - Analyse de solides en mesurant l'atténuation des ondes acoustiques
An optical assembly comprising an interdigital capacitor, one or more electrical contacts in electrical connection with the interdigital capacitor and an insulating layer covering at least a portion of the interdigital capacitor. The one or more electrical contacts and a portion of the insulating layer are configured to receive conductive adhesive. The optical assembly further comprises a metallic layer positioned between the interdigital capacitor and the portion of the insulating layer configured to receive the conductive adhesive.
H01S 5/0233 - Configuration de montage des puces laser
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
A method of calibrating a driving parameter of an optical component across an operating wavelength range of the component. The method comprises placing a layer of material in a light path, the layer of material being substantially planar and substantially transparent and having a thickness of the order of wavelengths in said range and operating said component to vary said driving parameter whilst detecting light transmitted through said layer of material to obtain driving parameter versus light intensity data. The obtained data is then compared with characterizing data previously derived for said layer of material in order to calibrate said driving parameter.
A method of manufacturing an optical element is disclosed. The method comprises the steps of forming a layer of first material on a substrate, forming a plurality of cavities in the layer of first material by an imprinting process, and forming a layer of second material in the plurality of cavities to form an optical meta-surface. Also disclosed is an optical element manufactured according to the method, and an optical device comprising the optical element, and an optical apparatus such as a cellular telephone, a camera, an image-recording device, or a video recording device.
G02B 1/00 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques caractérisés par la substance dont ils sont faits; Revêtements optiques pour éléments optiques
An apparatus for monitoring mechanical integrity of an eye-safety component of an illuminator is disclosed. The apparatus comprises a sensor, operable to sense a photoacoustic effect in the eye-safety component during operation of the illuminator and to output a signal representative of the sensed photoacoustic effect, and a processor. The processor is operable to: monitor the signal from the sensor; determine if the signal comprises at least one parameter that falls outside of a pre-determined acceptable range, the pre-determined acceptable range being indicative of mechanical integrity of the eye-safety component; and initiate a safety action in response to a determination that the at least one parameter falls outside of the pre-determined acceptable range thereby indicating a loss of mechanical integrity.
G01H 9/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores en utilisant des moyens sensibles aux radiations, p.ex. des moyens optiques
A system includes a first light source; an optical element disposed on a face of a transparent substrate. The optical element is positioned to receive light from the first light source. The transparent substrate has edges that are beveled relative to the first face of the transparent substrate. The system includes a second light source positioned to illuminate the face of the transparent substrate at a position aligned with a first one of the beveled edges of the transparent substrate. The system includes a light detector positioned to receive light reflected from a second one of the beveled edges of the transparent substrate.
H04N 13/254 - Générateurs de signaux d’images utilisant des caméras à images stéréoscopiques en combinaison avec des sources de rayonnement électromagnétique pour l’éclairage du sujet
B60R 1/00 - Dispositions pour la visibilité optique; Dispositions de visualisation en temps réel pour les conducteurs ou les passagers utilisant des systèmes de capture d’images optiques, p.ex. des caméras ou des systèmes vidéo spécialement adaptés pour être utilisés dans ou sur des véhicules
H04M 1/02 - Caractéristiques de structure des appareils téléphoniques
An optical assembly comprising a busbar system comprising an electrically conductive first busbar conductively coupled to one or more electrically conductive mechanical fasteners and one or more vertical-cavity surface-emitting laser (VCSEL) array modules each comprising one or more electrically conductive contacts. Each VCSEL array module is releasably fastened to the busbar system by the one or more of the mechanical fasteners. When in a fastened position, the one or more mechanical fasteners are conductively coupled to the one or more electrically conductive contacts to provide an electrical connection between the first busbar and the one or more VCSEL array modules.
According to a first aspect of the present invention there is provided a method of measuring the optical reflectance R of a target using a detection system comprising a light emitter and a light detector spaced apart from one another. The method comprises illuminating the target with the light emitter, detecting light reflected from the target using the light detector, wherein the light detector provides an electrical output signal SS indicative of the intensity of the detected light, and determining the optical reflectance R of the target according to (Formula 1), where RR is the spectral reflectance of a reference standard, SR is the detector electrical output signal with the reference standard in place, SH is the detector electrical output signal with no target in front of the light emitter and light detector, and M is a calibration factor.
According to a first aspect of the present invention there is provided a method of measuring the optical reflectance R of a target using a detection system comprising a light emitter and a light detector spaced apart from one another. The method comprises illuminating the target with the light emitter, detecting light reflected from the target using the light detector, wherein the light detector provides an electrical output signal SS indicative of the intensity of the detected light, and determining the optical reflectance R of the target according to (Formula 1), where RR is the spectral reflectance of a reference standard, SR is the detector electrical output signal with the reference standard in place, SH is the detector electrical output signal with no target in front of the light emitter and light detector, and M is a calibration factor.
R
=
M
·
R
R
s
s
-
s
H
M
·
⌈
s
R
-
s
H
⌉
-
R
R
⌈
s
R
-
s
s
⌉
,
(
1
)
G01N 21/27 - Couleur; Propriétés spectrales, c. à d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en utilisant la détection photo-électrique
A method of forming a three-dimensional image A method of forming a three-dimensional image comprises, first, capturing a first image of a field of view and then, subsequently, capturing range information. The method further comprises forming the three-dimensional image, wherein the three-dimensional image is dependent on the first image. Capturing the first image of a field of view comprises: illuminating the field of view with radiation; and determining an intensity of each of a plurality of pixels of reflected radiation from the field of view. Capturing the range information comprises: illuminating the field of view with radiation; and determining a time delay of reflected radiation from the field of view for each of a plurality of pixels.
An optical device (1) comprises an emitter (3) for emitting light, a receiver (4) for receiving reflected light and providing a data signal (15), a register (5) for storing processing parameters comprising a baseline reference value (16), and a processing unit (6) for processing the data signal (15) using the processing parameters. The processing unit (6) is configured to compare the data signal (15) to the baseline reference value (16), and determine that a crosstalk calibration of the optical device is required based at least partially on the comparison.
A temperature sensor comprises a first oscillator (110) to provide a first oscillation signal (PTAT_freq) having a frequency that increases with increasing temperature and a second oscillator (120) to provide a second oscillation signal (CTAT_freq) having a frequency that decreases with increasing temperature. A time domain sigma-delta modulator (130) is coupled to the first and the second oscillator (110, 120) to receive one of the first oscillation signal and the second oscillation signal to generate an output signal including a bitstream (BS).
G01K 7/01 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments semi-conducteurs à jonctions PN
G01K 7/34 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments capacitifs
30.
APPARATUS AND METHOD FOR DETECTING MOVEMENT ALONG AN AXIS
Apparatus and method for detecting movement along an axis Apparatus for providing a control signal in dependence upon an axial position of a controller displaceable along an axis. The apparatus comprises a component for displacement with said controller along said axis, a radiation source and detector arrangement configured to direct radiation towards a target region and generate a detector signal dependent upon radiation reflected from within that target region, and a computer processor configured to process said detector signal to determine a measure of distance or change of distance to a reflecting surface region within said target region, and to use said measure to provide said control signal. Said component defines a reflecting surface that passes through said target region such that a reflecting surface region is present within said target region with a distance that varies with the axial position of the component along said axis.
G04G 21/00 - Dispositifs d'entrée ou de sortie intégrés dans des garde-temps
G04C 3/00 - Horloges ou montres électromécaniques indépendantes d'autres garde-temps et dans lesquelles le mouvement est entretenu par des moyens électriques
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
G06F 1/16 - TRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES - Détails non couverts par les groupes et - Détails ou dispositions de structure
G01D 5/30 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens optiques, c. à d. utilisant de la lumière infrarouge, visible ou ultraviolette avec déviation des rayons lumineux, p.ex. pour une indication optique directe les rayons lumineux étant détectés par des cellules photo-électriques
G04G 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
A rotary encoder for providing a control signal in dependence upon an angular position of a controller rotatable about an axis of rotation. The rotary encoder comprises a component for rotation with said controller about said axis of rotation, a radiation source and detector arrangement configured to direct radiation towards a target region and generate a detector signal dependent upon radiation reflected from within that target region, and a computer processor configured to process said detector signal to determine a measure of distance or change of distance to a reflecting surface region within said target region, and to use said measure to provide said control signal. Said component defines a reflecting surface that passes through said target region such that a reflecting surface region is present within said target region with a distance that varies with the angular position of the component about said axis.
G01D 5/347 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens optiques, c. à d. utilisant de la lumière infrarouge, visible ou ultraviolette avec atténuation ou obturation complète ou partielle des rayons lumineux les rayons lumineux étant détectés par des cellules photo-électriques en utilisant le déplacement d'échelles de codage
G01B 11/26 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes
G06F 21/35 - Authentification de l’utilisateur impliquant l’utilisation de dispositifs externes supplémentaires, p.ex. clés électroniques ou cartes à puce intelligentes communiquant sans fils
33.
DESIGNING AND CONSTRUCTING DOT PROJECTORS FOR THREE-DIMENSIONAL SENSOR MODULES
For an optical dot projector having multiple light emitters, a relationship is determined between locations of the light emitters with respect to a substrate of the optical dot projector and corresponding first locations of dots projected by the dot projector onto an imaging plane. An optical grating approximating one or more optical characteristics of one or more optical elements of the optical dot projector is determined based on the relationship. Second locations of dots corresponding to a replacement of the one or more optical elements of the optical dot projector by the optical grating are determined, and modified locations of the light emitters with respect to the substrate are determined based on the second locations of dots. Optical dot projectors are constructed according to the determined modified locations.
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p.ex. des franges de moiré, sur l'objet
A sensor device comprises an array (10) of photodetectors. A multiplexer circuit (20) is connected to the array (10) of photodetectors and provides dedicated output paths for each photodetector in the array (10), respectively. Furthermore, the sensor device comprises at least one control terminal (21). An array of time-to-digital converters (40) is connected to output terminals (22) of the multiplexer circuit (20). Depending on a control signal to be applied at the at least one control terminal (21), the multiplexer circuit (20) is arranged to electrically connect only the output paths of a subarray (11) of photodetectors to the output terminals (22) of the multiplexer circuit (20).
G01S 17/10 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes à modulation d'impulsion interrompues
G01S 17/894 - Imagerie 3D avec mesure simultanée du temps de vol sur une matrice 2D de pixels récepteurs, p.ex. caméras à temps de vol ou lidar flash
A sensor (300) for ambient light and/or color sensing is disclosed. The sensor comprises a pixel (200), wherein the pixel comprises a plurality of pinned photodiodes (205a-d) selectively coupled to a floating diffusion region (220). The sensor also comprises circuitry (230) configurable to select an integration time and to couple one or more of the plurality of pinned photodiodes to the floating diffusion region in response to a sensed intensity of radiation incident on the pixel. Also disclosed is an electronic device (500) comprising the sensor.
A pixel (200, 400) for an ambient light and/or color sensor is disclosed. The pixel comprises a plurality of pinned photodiodes (205a-d; 405a-d) and a floating diffusion region (220, 420). A ratio of an active area of the plurality of pinned photodiodes to an area of the floating diffusion region is greater than 150. Also disclosed is a sensor (500) for color or ambient light sensing, comprising the pixel, and an electronic device (600) comprising such a sensor.
An optical module (100, 200, 300, 400, 500) comprising: a display (104) comprising light emitting elements that emit visible light; an image sensor layer (102) comprising infra-red light sensitive elements; and a mask layer (108) configured to block infra-red light having a wavelength in one or more portions of the infra-red optical spectrum and pass visible light; wherein the optical module is lensless.
Embodiments relate to an optoelectronic module, a method of manufacturing the same, and a computing device comprising the optoelectronic module. The optoelectronic module comprising: a driver die (108) mounted on a substrate (114); an optical sensor die (106) mounted on an upper surface of the driver die, the optical sensor die comprising at least one optical detector (306), wherein the driver die is electrically connected to the optical sensor die; an optical stack (102) mounted via an adhesive layer (104) to an upper surface of the optical sensor die (106) above the at least one optical detector; and an encapsulant material (116) that laterally encapsulates the optical stack.
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
An optical device 1 comprises a display 2 comprising display circuitry and an optical sensor 3 arranged behind the display 2, the optical sensor 3 comprising an emitter for emitting light through the display 2 and a receiver for receiving light reflected back through the display 2. The absorption of the display 2 is wavelength dependent, and the emitter is configured to emit light at a wavelength where the absorption of the display is lower than 5%.
G06F 3/042 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens opto-électroniques
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
CODED APERTURE IMAGING SYSTEM AND METHOD An optical system for imaging an object comprises a spatial encoding arrangement for generating spatially encoded light with an initial spatial distribution, a coded aperture defining a mask pattern which is based on the initial spatial distribution of the spatially encoded light, and an image sensor. The optical system is configured such that, in use, the spatial encoding arrangement directs the spatially encoded light onto the object so that the object reflects at least a portion of the spatially encoded light to form reflected light, the reflected light is directed through the coded aperture to form spatially decoded light, the spatially decoded light is directed onto the image sensor so as to form an image thereon, and the image sensor detects the image. The optical system may be used to image the object in a way which eliminates, or at least reduces, the complexity of the image processing required to reconstruct an image of the object from the light detected by the image sensor compared with prior art coded aperture imaging techniques performed using prior art coded aperture imaging systems.
G02B 30/10 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p.ex. des effets stéréoscopiques en utilisant des méthodes d'imagerie intégrale
G02B 30/56 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p.ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p.ex. des voxels en projetant une image aérienne ou flottante
H04N 13/293 - Génération d’images stéréoscopiques mixtes; Génération d’images stéréoscopiques et monoscopiques mixtes, p.ex. une fenêtre avec une image stéréoscopique en superposition sur un arrière-plan avec une image monoscopique
H04N 13/339 - Affichage pour le visionnement à l’aide de lunettes spéciales ou de visiocasques utilisant le multiplexage spatial
H04N 13/363 - Reproducteurs d’images utilisant des écrans de projection
An electro-acoustic transducer (100, 300, 405, 500, 530, 560) is disclosed. The electro-acoustic transducer comprises a membrane (105, 305, 515, 575), a magnet (115, 315) and at least one laser (145a-d, 345a-d, 505a-b, 510a-b, 535a-b, 540a-b, 565a-b, 570a-b) configured to emit radiation toward the membrane such that radiation emitted by the at least one laser is reflected from the membrane back towards the at least one laser to produce a self-mixing interference effect corresponding to an excursion or velocity of the membrane. Also disclosed are methods of operating and assembling the electro-acoustic transducers, and communications devices comprising the electro-acoustic transducers.
Embodiments relate to an optoelectronic module, a method of manufacturing the same, and a computing device comprising the optoelectronic module. The optoelectronic module comprising: a driver die (108) mounted on a substrate (114); an optical emitter (102) mounted to an upper surface (204) of the driver die; a spacer (105) mounted to the upper surface of the driver die, the spacer enclosing and defining a cavity around the optical emitter; and an optical element (111) mounted to an upper surface of the spacer, the optical element transparent to light emitted by the optical emitter and comprising an interlock feature (113) electrically connected to the driver die.
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An electro-acoustic transducer (100, 300, 405, 500, 530, 560) is disclosed. The electro-acoustic transducer comprises a membrane (105, 305, 515, 575), a magnet (115, 315), a substrate (140, 340) and at least one optical device (145a-d, 345a-d, 505a-b, 510a-b, 535a-b, 540a-b, 565a-b, 570a-b) coupled to the substrate for sensing an excursion or velocity of the membrane. The at least one optical device is disposed on an opposite side of the substrate to the membrane. Also disclosed is an electro-acoustic transducer (100, 405, 500, 560) comprising a membrane (105, 515, 575), a magnet (115) and a substrate (140) provided between the magnet and the membrane, wherein a conductive element (150, 450) extends through an aperture (155) in the magnet to provide an electrical connection to the substrate. Also disclosed are methods of assembling the electro-acoustic transducers and communications devices (400) comprising the electro-acoustic transducers.
: An optical sensor. The optical sensor comprises a light source (303), first (301) and second (302) light sensors, and a controller. The light source (303) has a field of illumination (313). The first and second light sensors have respective first (311) and second (312) fields of view. The intersection of the field of illumination and the first field of view forms a first overlap region (321). The intersection of the field of illumination and the second field of view forms a second overlap region (322). When a surface (304) is within one or both of the first and second overlap region, the surface reflects light from the light source to the respective light sensor. The controller is configured to determine a first distance measurement to a surface within one or both of the first and second overlap regions based on the ratio of reflected light from the light source received by the first sensor and reflected light from the light source received by the second sensor. A similar ultrasonic sensor is also disclosed. Distance Measurement using Field of View.
Techniques for controlling the flow of replication material (e.g., epoxy) during the formation of replicated optical elements include providing a transparent substrate (220) onto which the optical elements are to be replicated. The substrate (220) includes a structured UV curable shield (202) adhering to its surface. The UV curable shield (202), in turn, has openings (203) that expose portions of the surface of the transparent substrate (220) for replication of the optical elements. During the replication process, excess replication material (124A) may flow onto the UV curable shield (202), which subsequently can be cured so as to facilitate the release and removal of the shield (202) along with the excess replication material (124A).
Flow barriers such as trenches (144) and/or walls (152) laterally surrounding an aperture (142) in a coating (140) on a transparent substrate (120) help control the flow of replication material (124) during the formation of a replicated optical element on the aperture (142).
A method of manufacturing a master for use in a wafer-scale replication process is disclosed. The method comprises at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer. The method also comprises a step of developing the at least one patterned layer to provide one or more structures defining the master. In an embodiment, the at least one step of forming the layer of photoresist comprises a process of dry film lamination.
G03F 7/00 - Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
G03F 7/16 - Procédés de couchage; Appareillages à cet effet
48.
METHOD OF SHIELDING ELECTRONIC MODULES FROM RADIO FREQUENCY ELECTROMAGNETIC RADIATION
A method of manufacturing radio frequency shielded electronic modules, the method comprising: providing a tool having one or more outlet holes; applying the tool to a surface of a wafer assembly comprising a plurality of electronic modules supported on a substrate, so that one or more contacting portions of the tool contacts said surface of the wafer assembly and said contacting portions are aligned with regions of the wafer assembly where a radio frequency shielding fluid is not to be deposited; depositing an electrically conductive radio frequency shielding fluid on the wafer assembly via the outlet holes; removing excess fluid from the tool and wafer assembly; removing the tool from the wafer assembly; and separating the wafer assembly into discrete electronic modules.
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
H01L 23/552 - Protection contre les radiations, p.ex. la lumière
49.
OPTOELECTRONIC MODULE COMPRISING AN INTERLOCK FEATURE
: An optoelectronic module comprising: a radiation-emitting device; a housing comprising a wall or walls laterally surrounding the radiation-emitting device; two or more terminals disposed on a surface of the wall or walls; a transparent substrate abutting the housing, the transparent substrate comprising an interlock feature; a control unit coupled to the two or more terminals, wherein the control unit is configured to: supply an electrical current though the interlock feature; monitor an electrical parameter associated with the interlock feature; wherein the terminals are arranged such that: when the transparent substrate is in a first orientation about an optical axis of the radiation-emitting device, the interlock feature is coupled to at least two of the two or more terminals and the optoelectronic module is operable to provide a field of illumination in a first illumination orientation; and when the transparent substrate is in a second orientation about the optical axis of the radiation-emitting device, the interlock feature is coupled to at least two of the two or more terminals and the optoelectronic module is operable to provide a field of illumination in a second illumination orientation different from the first illumination orientation.
A method for use in manufacturing an optical element such as a micro-optic lens comprises providing a substrate having a surface profile, the substrate surface profile defining one or more flow stop features for restraining a flow of viscous material over the substrate surface profile, providing a mold tool having a mold surface profile, and dispensing viscous material onto the mold surface profile and/or onto the substrate surface profile. The mold surface profile and the substrate surface profile are configured so that when the mold surface profile and the substrate surface profile are disposed towards one another and aligned relative to one another, the mold surface profile and the substrate surface profile define therebetween an optical element cavity for defining a profile of the optical element with respect to an optical axis, a peripheral cavity disposed around a periphery of the optical element cavity, the peripheral cavity including the one or more flow stop features, and an air flow path for allowing air to flow out of the peripheral cavity to an environment external to the mold tool and the substrate and for allowing to flow into the peripheral cavity from the external environment, wherein the optical element cavity and the peripheral cavity define a peripheral constriction therebetween.
G02B 1/04 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques caractérisés par la substance dont ils sont faits; Revêtements optiques pour éléments optiques faits de substances organiques, p.ex. plastiques
B29D 11/00 - Fabrication d'éléments optiques, p.ex. lentilles ou prismes
51.
DIMMING LIGHT THAT IS INTERFERING WITH AN OBSERVER'S VISION
The current disclosure describes a system for dimming sunlight that interferes with an observer's vision. A position of an observer's eyes and a position of the sun relative to a transparent screen are determined, and, based on the position of the observer's eyes and the position of the sun, an area of the transparent screen where light emitted by the sun intersects the transparent screen before reaching the position of the observer's eyes is identified. The system causes the area of the transparent screen to be modified such that the light emitted by the sun is dimmed in the area of the transparent screen.
An illumination system comprises a support member, an optical emitter device mounted on the support member, an electrical driver mounted on the support member; and one or more electrically conductive connections between the electrical driver and the optical emitter device. The electrical driver is configured to supply an electrical signal to the optical emitter device via the one or more electrically conductive connections. The support member comprises a thermally-conductive ceramic material. The illumination system may be used in a sensing system such as a 3D sensing system or a light detection and ranging (LIDAR) system. A method of manufacturing the illumination system and a method of operating the illumination system are also disclosed.
F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
G01S 7/481 - Caractéristiques de structure, p.ex. agencements d'éléments optiques
A method of wafer-level manufacturing of an optical package (285) is disclosed. The method comprises forming an apertured substrate (170; 405) by a process of vacuum injection molding, each aperture (175A; 175B) in the apertured substrate configured to support an optical element (225; 420; 425). The method also comprises coupling the apertured substrate to a further substrate (255) comprising optical devices (260, 265) aligned with the apertures in the apertured substrate. Also disclosed is optical package (285, 600) formed according to the method and an apparatus, such as a smartphone, comprising the optical package.
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
An illumination module comprising an emitter configured to emit light along an optical axis of the illumination module and an optical system (110) located on or over the emitter. The optical system comprising a curved surface (114), where the curved surface is tilted in a first direction, such that the optical system introduces optical aberration in the first direction.
G02B 1/04 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques caractérisés par la substance dont ils sont faits; Revêtements optiques pour éléments optiques faits de substances organiques, p.ex. plastiques
We disclose an optoelectronic module comprising an optoelectronic device operable to emit or detect a wavelength of radiation, an optical element arranged on the optoelectronic device, the optical element being transparent to the wavelength of radiation capable of being emitted or detected by the optoelectronic device, and a wall configured to laterally enclose the optoelectronic device and the optical element, the wall being opaque to the wavelength of radiation capable of being emitted or detected by the optoelectronic device.
H01L 31/12 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails structurellement associés, p.ex. formés dans ou sur un substrat commun, avec une ou plusieurs sources lumineuses électriques, p.ex. avec des sources lumineuses électroluminescentes, et en outre électriquement ou optiquement couplés avec lesdites sour
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 31/0232 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails Éléments ou dispositions optiques associés au dispositif
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
A method of forming an optical system comprising a lens and another optical element, wherein the method comprises: forming a master tool using a lithographic apparatus; using the master tool to form a substrate comprising a plurality of lenses and associated lens alignment features; dicing the substrate to form individual substrates each having a lens with an integrated lens alignment feature; locating the other optical element in a jig; and placing a lens of the plurality of lenses in the jig such that the integrated alignment feature for said lens rests against surfaces of the jig thereby placing the lens is in a desired position relative to the other optical element.
An apparatus includes a spectrometer. A housing is attached to a substrate and defines an illumination channel and a receiving channel. The illumination channel includes an illumination source mounted on the substrate and operable to produce light in a particular part of the spectrum. A light pipe is disposed over the illumination source so as to direct light from the illumination source out of the illumination channel toward a target. The receiving channel includes a sensor chip mounted on the substrate. The sensor chip includes light sensitive elements, each of which is selectively sensitive to a respective region of the particular part of the spectrum. The sensor chip further includes an electronic control unit operable to analyze signals from the light sensitive elements.
G01N 21/31 - Couleur; Propriétés spectrales, c. à d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p.ex. spectrométrie d'absorption atomique
A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respect to the tool (101) and the substrate (120).
B29C 43/02 - Moulage par pressage, c. à d. en appliquant une pression externe pour faire couler la matière à mouler; Appareils à cet effet pour la fabrication d'objets de longueur définie, c. à d. d'objets séparés
B29C 43/38 - Moules pour la fabrication d'objets de longueur définie, c. à d. d'objets séparés avec des moyens pour éviter les bavures
B29C 64/112 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p.ex. dépôt d’un cordon continu de matériau visqueux utilisant des gouttelettes individuelles, p.ex. de buses de jet
B29C 64/379 - Manutention des objets en 3D obtenus, p.ex. à l’aide de robots
B29D 11/00 - Fabrication d'éléments optiques, p.ex. lentilles ou prismes
A method of manufacturing a plurality of optical elements includes providing a first wafer (200) having lower alignment features (192) arranged on a first surface of the substrate, providing a second wafer (201) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer (201) further comprising upper alignment features (194) protruding, on the replication side, further than an outermost feature of the replication sections, depositing liquid droplets (196) on the first side of the first wafer (200), and bringing the second wafer (201) and the first side of the first wafer (200) together, with liquid droplets (196) between the first wafer (200) and the second wafer (201), the upper alignment features (194) contacting the liquid droplets (196) on the lower alignment features (192) on the first side of the first wafer (200), and thereby causing the second wafer (201) to align with the first wafer (200) by capillary action.
An illumination system (200) includes an illumination device (202); an optical element (206) positioned to receive light (208) from the illumination device (202); a layer (210) of a transparent material disposed on the optical element (206) and positioned to receive light (208) from the illumination device (202); and an interlock circuit (220) configured to measure a resistivity of the layer (210) of transparent material and to control operation of the illumination device (202) based on the measured resistivity.
F21V 25/02 - Dispositifs de sécurité associés structuralement avec les dispositifs d'éclairage entrant en action quand le dispositif d'éclairage est dérangé, démonté ou cassé
A method of manufacturing a plurality of optical elements (140), the method comprising providing a first wafer (120) having hardened replication material forming optical elements (140) on a first side of the first wafer (120), providing a second wafer (121) having hardened replication material forming optical elements (140) on a first side of the second wafer (121), depositing liquid droplets (180) on the first side of the first wafer (120) between the optical elements (140) aligning the first side of the first wafer (120) with the first side of the second wafer (121), and bringing the two wafers (120, 121) together such that the liquid droplets (180) on the first side of the first wafer (120) adhere to the first side of the second wafer (121).
An example system includes a housing defining a cavity and an aperture, a photodetector disposed within the cavity, a voltage-tunable interferometer disposed within the cavity between the aperture and the photodetector, a first light source disposed within the cavity, and an electronic control device. The electronic control device is operable to vary an input voltage applied to the interferometer, and concurrently, cause the first light source to emit light towards the interferometer and measure light reflected from the interferometer using the photodetector. The electronic control device is also operable to determine a calibrated input voltage based on light reflected from the interferometer and measured by the photodetector. The electronic control device is also operable to apply the calibrated input voltage to the interferometer, and concurrently, obtain one or more spectral measurements using the photodetector.
G01J 3/26 - Production du spectre; Monochromateurs en utilisant une réflexion multiple, p.ex. interféromètre de Fabry-Perot, filtre à interférences variables
An example system includes a first light source, a second light source, a photodetector, and an electronic control device. The electronic control device is operable to cause the first light source to emit first light within a range of wavelengths towards a subject, and measure, using the photodetector, the first light reflected from the subject. The electronic control device is also operable to cause the second light source to emit second light including a plurality of emission peaks within the range of wavelengths, and measure, using the photodetector, the second light. The electronic control device is also operable to determine spectral information regarding the subject based on the measured first light and the measured second light.
An optical sensor module uses polarized light such that, in some instances, crosstalk effects caused by light reflected from a cover glass or from a thin smudge layer on the cover glass can be eliminated, or at least reduced, by directing light of a first polarization through the cover glass toward a target and selectively detecting, in the module, light of a second polarization that is orthogonal to the first polarization.
A system for detecting particles (1) comprises a probing volume (2), an emitter arrangement (20) including an array of light emitters (21) configured to emit light into the probing volume (2), and a detector arrangement (30) including an array of light detectors (31) configured to detect the light that is emitted by the emitter arrangement (20) into the probing volume (2). The system further comprises an evaluation circuit (60) configured to generate an output signal from detector signals received from the detector arrangement (30) based on the detected light. Each of the array of light detectors (31) is configured to receive light from an associated one of the array of light emitters (21), and an amount of light received by the detector arrangement (30) depends on whether a particle (3) is located within the probing volume (2).
G01N 15/02 - Recherche de la dimension ou de la distribution des dimensions des particules
G01N 15/14 - Recherche par des moyens électro-optiques
G01N 15/00 - Recherche de caractéristiques de particules; Recherche de la perméabilité, du volume des pores ou de l'aire superficielle effective de matériaux poreux
G01N 15/06 - Recherche de la concentration des suspensions de particules
Projecting with expanded field of illumination An optical device (1) comprises an imaging system (2) provided to generate a plurality of images being distributed over an imaging plane (3). It further comprises a micro-lens-array, MLA (9), wherein micro-lenses are assigned to individual images (4) and are provided to form channels of light beams (12) by projecting the individual images (4) towards a projecting plane (13). An optical expander (17) is arranged between the MLA (9) and the projecting plane (13) and comprises an input surface (22) and least two output surfaces (23, 26, 33). The optical expander (17) is provided to fan out and direct the channels of light beams (12) onto the projecting plane (13), such that individual projections (14) of the individual images (4) are formed on the projection plane (13). An overall projection (15) is formed on the projection plane (13) by superimposing the individual projections (14).
G02B 27/18 - Systèmes ou appareils optiques non prévus dans aucun des groupes , pour projection optique, p.ex. combinaison de miroir, de condensateur et d'objectif
G03B 21/14 - Projecteurs ou visionneuses du type par projection; Leurs accessoires - Détails
67.
OPTICAL LIGHT GUIDES AND METHODS OF MANUFACTURING THE SAME
Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a “yard,” or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.
F21V 8/00 - Utilisation de guides de lumière, p.ex. dispositifs à fibres optiques, dans les dispositifs ou systèmes d'éclairage
G02B 6/12 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES - Détails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p.ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
B29D 11/00 - Fabrication d'éléments optiques, p.ex. lentilles ou prismes
A method of producing optical modules comprising transferring liquid polymer to a lens mold array by dipping an array of fingers of a transfer device into a liquid polymer, bringing the array of fingers into proximity with recesses of the lens mold array so that the liquid polymer is received in the recesses, then separating the array of fingers and the lens mold array so that liquid polymer is retained in the recesses, and forming lenses on optical devices by bringing the lens mold array into proximity with the array of optical devices so that the liquid polymer contacts a surface of the optical devices, and curing the liquid polymer to form the lenses on the optical devices.
A method of making optical diffuser elements (20) includes providing a substrate (100) composed of a polymer material and having openings (102) therein. An optical diffuser material (110) is dispensed into the openings (102), and the optical diffuser material (110) is hardened to form a sheet (200) composed of regions of the optical diffuser material (110) surrounded laterally by the polymer material. The method includes separating the sheet (200) into multiple optical diffuser elements (30) that retain their mechanical stability and optical properties when subjected to a reflow process.
A privacy film for a curved display screen. The privacy film has a curved cross section when no force is applied. The privacy film comprises alternating transparent layers and opaque layers, each extending across the privacy film, and each parallel to the other transparent and opaque layers when no force is applied. A method of manufacturing the film is also disclosed.
G02B 1/04 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques caractérisés par la substance dont ils sont faits; Revêtements optiques pour éléments optiques faits de substances organiques, p.ex. plastiques
C08L 33/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et un seul étant terminé par un seul radical carboxyl; Compositions contenant des dérivés de tels polymères
C08L 69/00 - Compositions contenant des polycarbonates; Compositions contenant des dérivés des polycarbonates
C08L 67/02 - Polyesters dérivés des acides dicarboxyliques et des composés dihydroxylés
71.
LIGHT REPLICATION / RETRANSMISSION APPARATUS AND METHOD
A substantially planar light replication or re- transmission component having an incident light receiving surface and an opposed light emitting surface. The component comprises a substantially transparent planar substrate, one or more bipolar junction transistors provided on said substrate, the or each transistor comprising a collector region adjacent to said light receiving surface, an emitter region adjacent to said light emitting surface, and a base region between said collector region and said emitter region, and circuitry for biasing the bipolar transistors in use. The or each transistor is configured and biased in use so that said collector and base regions of the transistor operate as a photodiode whilst said base and emitter regions operate as a light emitting diode.
H01L 33/46 - Revêtement réfléchissant, p.ex. réflecteur de Bragg en diélectriques
H01L 33/24 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une forme particulière, p.ex. substrat incurvé ou tronqué de la région électroluminescente, p.ex. jonction du type non planaire
H01L 33/36 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les électrodes
A sensing system 200 comprising a first coded aperture 210 configured to receive incident light and transmit a coded image of an object 230. The sensing system 200 comprises a light replication component 250 configured to detect the coded image and emit a replicated coded image. The sensing system 200 comprises a second coded aperture 260 configured to receive the replicated coded image and transmit a decoded image. The sensing system 200 comprises a sensor 220 configured to detect the decoded image.
G03B 9/07 - Diaphragmes avec des moyens pour régler le diaphragme au préalable
G03B 30/00 - Modules photographiques comprenant des objectifs et des unités d'imagerie intégrés, spécialement adaptés pour être intégrés dans d'autres dispositifs, p.ex. des téléphones mobiles ou des véhicules
H04N 5/238 - Circuits pour la compensation des variations de la luminance de l'objet en agissant sur la partie optique de la caméra
A method of manufacturing an optical element, the method comprising: providing a substrate; providing a tool comprising, on a first side, a section defining a surface structure of the optical element; aligning the tool and the substrate with respect to each other and bringing the tool and a first side of the substrate together, with material between the tool and the substrate; positioning a transparent masking structure adjacent to the substrate onto which the material has adhered, the masking structure comprising a masking layer; emitting light through the masking structure to be incident on a portion of the material to cure said potion of the material, wherein the masking layer prevents light from being incident on a remaining portion of the material such that the remaining portion of the material is uncured; and removing the uncured remaining portion of the material.
Techniques are described for use with a wide range of consumer and other electronic devices to facilitate a user's control of such features as volume, as well as song, channel or page selection, depending on the application. A method includes emitting light out of a module, receiving signals from light detectors in the module, wherein the signals represent, at least in part, light reflected by a person's finger or other object passing in front of the light detectors, detecting movement of the person's finger or other object based on the received signals, and controlling a feature of a device in response to the detected movement.
An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 31/173 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails structurellement associés, p.ex. formés dans ou sur un substrat commun, avec une ou plusieurs sources lumineuses électriques, p.ex. avec des sources lumineuses électroluminescentes, et en outre électriquement ou optiquement couplés avec lesdites sour le dispositif à semi-conducteur sensible au rayonnement étant commandé par la ou les sources lumineuses les sources lumineuses et les dispositifs sensibles au rayonnement étant tous des dispositifs semi-conducteurs caractérisés par au moins une barrière de potentiel ou de surface formés dans, ou sur un substrat commun
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
A method of manufacturing a plurality of optical elements comprising the steps of providing a substrate (120) providing a tool (100) comprising, a plurality of replication sections (106) each defining a surface structure of one of the optical elements, and at least one contact spacer portion (112), aligning the tool (100) and the substrate (120) with respect to each other and bringing the tool (100) and a first side of the substrate (120) together, with replication material (124) between the tool (100) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (120), hardening the replication material (124), and separating the tool (100) from the substrate (120) with the hardened replication material adhering to the substrate (120), wherein the tool (100) has yard line features (304) around at least a portion of the replication sections (106), the yard line features (304) configured to contain the replication material (124) on a first side of the yard line with respect to both the tool (100) and the substrate (120).
An apparatus, e.g. a proximity sensor module (10), for optical distance sensing includes a target surface (25) having a non-uniform design including a high-reflectivity region and a low-reflectivity region for light of a particular wavelength. The position of the target surface (25) is displaceable within the apparatus. The apparatus includes a light source (12) operable to emit light at the particular wavelength toward the target surface (25), and a photodetector (14) operable to sense at least some of the light emitted by the light source and subsequently reflected by the target surface (25). A processor is operable to correlate an output from the photodetector (14) with a distance to the target surface (25). A wall (22) may separate the light source (12) and photodetector (14) from one another, which can help reduce internal optical crosstalk. The light source (12) and photodetector (14) are mounted and electrically coupled to a substrate (16) that, in turn, can be mounted and electrically coupled to a printed circuit board (PCB) (18) of a host device. The light source (12) and photodetector (14) are surrounded laterally by a spacer or housing wall (20). The target surface (25) may be the backside of a touch interactive display screen (24) in the host device, e.g., a portable computing device such as a smartphone, tablet, wearable device, personal digital assistant (PDA), or personal computer. Circuitry (28) can be implemented, for example, as an integrated circuit chip or other processor and may include software and/or a look-up table stored in memory that allows the circuitry (28) to correlate the measured photodetector signal to a distance. When pressure is provided on the display screen (24) (e.g., by a person pressing her finger on the screen), the display screen is displaced slightly in the direction of the substrate (16) on which the light source (12) and photodetector (14) are mounted. As a result of the displacement, the intensity of light detected by the photodetector (24) changes. The signal measured by the photodetector (24) can be correlated to a distance value. If the distance value is within a specified range (or changes by at least a specified amount), for example, it can trigger some further action in the host device.
G06F 3/042 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens opto-électroniques
G01B 11/02 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur
G01S 7/48 - DÉTERMINATION DE LA DIRECTION PAR RADIO; RADIO-NAVIGATION; DÉTERMINATION DE LA DISTANCE OU DE LA VITESSE EN UTILISANT DES ONDES RADIO; LOCALISATION OU DÉTECTION DE LA PRÉSENCE EN UTILISANT LA RÉFLEXION OU LA RERADIATION D'ONDES RADIO; DISPOSITIONS ANALOGUES UTILISANT D'AUTRES ONDES - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe
G01S 17/08 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement
G06F 3/041 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
78.
LIGHT EMITTING MODULES WITH IRREGULAR AND/OR APERIODIC CONDUCTIVE TRACES
An example system includes an optical element defining a first surface, and a substrate layer defining a second surface and a third surface opposite the second surface. The second surface of the substrate layer is adjacent the first surface the optical element. The system also includes a conductive trace disposed on the third surface of the substrate layer. The optical element is operable to emit light in a first direction through the substrate layer and the conductive trace. The conductive trace defines at least one of an aperiodic path or an irregular path.
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
H01S 5/068 - Stabilisation des paramètres de sortie du laser
79.
LINEAR TEMPERATURE CALIBRATION COMPENSATION FOR SPECTROMETER SYSTEMS
In an example method, light is emitted towards a sample region, and sample light is received at an interferometer. A subset of the sample light is transmitted from the interferometer to a detector. Transmitting the subset of the sample light includes determining a reference voltage corresponding to the range of wavelengths of the subset of sample light, and a reference temperature. Transmitting the subset of sample light also includes determining a temperature of an environment, determining a bias voltage corresponding to a difference between the reference temperature and the temperature of the environment, and applying, to the interferometer, an input voltage corresponding to the sum of the reference voltage and the bias voltage. The subset of the sample light is measured by the detector, and a spectral distribution of light is determined based on the measurements.
G01J 3/02 - Spectrométrie; Spectrophotométrie; Monochromateurs; Mesure de la couleur - Parties constitutives
G01J 3/26 - Production du spectre; Monochromateurs en utilisant une réflexion multiple, p.ex. interféromètre de Fabry-Perot, filtre à interférences variables
Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 31/0232 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails Éléments ou dispositions optiques associés au dispositif
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/54 - Encapsulations ayant une forme particulière
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01S 5/02 - Lasers à semi-conducteurs - Détails ou composants structurels non essentiels au fonctionnement laser
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
B29D 11/00 - Fabrication d'éléments optiques, p.ex. lentilles ou prismes
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
B29C 33/12 - Moules ou noyaux; Leurs détails ou accessoires comportant des moyens incorporés pour positionner des inserts, p.ex. marquages
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
82.
METHOD FOR USE IN MANUFACTURING AN OPTICAL EMITTER ARRANGEMENT
Provided is a method for use in manufacturing an optical emitter arrangement for use, in particular through not exclusively, in projectors or illuminators such as flood illuminators for mobile electronic devices. The method solves, with a method for manufacturing prior art optical emitter arrangements, a problem that an electrically conductive connection between an electrically conductive track or trace of an optical safety element and electrically conductive projections may be unreliable.
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
An optical sensor. The optical sensor comprises a substrate, a Fabry-Perot interferometer, and first and second photodetectors. The Fabry-Perot interferometer comprises a first mirror and a second mirror, and is mounted on the substrate such that light is transmitted through the interferometer to the substrate. The first and second photodetectors are configured to detect light transmitted through the etalon and the substrate. The first photodetector is sensitive to a first wavelength range, and the second photodetector is sensitive to a second wavelength range, and wherein the first and second wavelength ranges each correspond to a different mode of the interferometer.
G01J 3/26 - Production du spectre; Monochromateurs en utilisant une réflexion multiple, p.ex. interféromètre de Fabry-Perot, filtre à interférences variables
Optical Device and Manufacturing Method An optical device (380) is disclosed, the device comprising a substrate (330), a first electrically-conductive element (325) formed as a pattern on the substrate, a layer of material extending over at least a portion of the first electrically-conductive element and forming an optical element (370), and a second electrically-conductive element (355) extending through the layer of material and coupled to the first electrically-conductive element. Also disclosed is an associated method of manufacturing the optical device (380), and an apparatus (600) comprising at least one of the disclosed optical devices, a camera (605), and processing circuitry (615) communicably coupled to the at least one optical device and to the camera.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
85.
Optical ranging system having multi-mode operation using short and long pulses
An apparatus includes a time-of-flight (TOF) sensor system that has an illuminator operable to emit pulses of light toward an object outside the apparatus. The illuminator is operable in a first mode in which the illuminator emits pulses having a first width and a second mode in which the illuminator emits pulses having a second width longer than the first width. The TOF sensor system further includes a photodetector operable to detect light produced by the illuminator and reflected by the object back toward the apparatus. An electronic control device is operable to control emission of light by the illuminator and is operable to estimate a distance to the object based on a time elapsed between an emission of one or more of the pulses by the illuminator and detection of the reflected light by the photodetector.
G01S 17/10 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes à modulation d'impulsion interrompues
G01S 7/481 - Caractéristiques de structure, p.ex. agencements d'éléments optiques
Integrated Detector on Fabry-Perot Interferometer System An optical sensor. The optical sensor comprises a substrate and a Fabry-Perot interferometer. The substrate is formed from a semiconductor. The Fabry-Perot interferometer comprises a first mirror and a second mirror, and is mounted on the substrate such that light is transmitted through the interferometer to the substrate. The substrate is doped such that a region of the substrate to which light is transmitted by the interferometer forms a photodiode.
G01J 3/26 - Production du spectre; Monochromateurs en utilisant une réflexion multiple, p.ex. interféromètre de Fabry-Perot, filtre à interférences variables
A method of manufacturing a spacer (285) for spacing apart and electrically coupling first and second components of an optical device is disclosed. The method comprises a step of adhesively coupling a first substrate (250) to each of a plurality of spacer elements (205). The method comprises a step of adhesively coupling a second substrate (275) to each of the plurality of spacer elements, such that the plurality of spacer elements are disposed between opposing surfaces of the first and second substrates. At least one of the plurality of spacer elements comprises a conductive coating and/or is adhesively coupled to the first and second substrates with an electrically-conductive adhesive, such that an electrically-conductive path (290a-d) is formed for electrically coupling the first and second components of the optical device. Also disclosed is an optical device (500) comprising a spacer (285) manufactured according to the method.
An inductive position sensor device (100) comprises at least a first terminal (101) to couple the position sensor device with a first receiving antenna coil for providing a first reception signal, and at least a second terminal (102) to couple the position sensor device with a second receiving antenna coil for providing a second reception signal. The device further comprises a unique receiver channel (110) to evaluate the first and second reception signal, and a multiplexer (120). The multiplexer (120) is configured to selectively couple the at least one first terminal (101) or the at least one second terminal (102) with the unique receiver channel (110) in dependence on operating the multiplexer (120) in a first or second operation state.
G01D 5/20 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier l'inductance, p.ex. une armature mobile
G01L 3/10 - Dynamomètres de transmission rotatifs dans lesquels l'élément transmettant le couple comporte un arbre élastique en torsion impliquant des moyens électriques ou magnétiques d'indication
89.
DEPTH SENSING USING OPTICAL TIME-OF-FLIGHT TECHNIQUES THROUGH A TRANSMISSIVE COVER
Techniques for determining dynamically the intensity of the reflection from a transmissive cover and neutralizing it so as to improve the accuracy of depth measurements. Depth measurements of light modulation at multiple frequencies—which also can be used for depth disambiguation—are obtained and used to decouple the information to estimate the intensity of the signal reflected by the transmissive cover itself or a smudge on the transmissive cover, and the intensity of the signal reflected by the target object.
G01S 7/481 - Caractéristiques de structure, p.ex. agencements d'éléments optiques
G01S 17/36 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes continues, soit modulées en amplitude, en fréquence ou en phase, soit non modulées avec comparaison en phase entre le signal reçu et le signal transmis au même moment
G01N 21/27 - Couleur; Propriétés spectrales, c. à d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en utilisant la détection photo-électrique
An example system includes a light source, a first spectrometer, a second spectrometer, and an electronic control module. The light source is operable to emit light within a first range of wavelengths in a field of illumination. The first spectrometer is operable to measure first sample light reflected from an object within a second range of wavelengths and in a first field of detection. The second spectrometer is operable to measure second sample light reflected from the object within a third range of wavelengths and in a second field of detection. The electronic control module operable to determine, based on the measured first sample light and the measured second sample light, a distance between the system and the object, and determine, based on the measured first sample light and the measured second sample light, a spectral distribution of light corresponding to the object.
G01J 3/02 - Spectrométrie; Spectrophotométrie; Monochromateurs; Mesure de la couleur - Parties constitutives
G01J 3/36 - Mesure de l'intensité des raies spectrales directement sur le spectre lui-même Étude de plusieurs bandes d’un spectre à l’aide de détecteurs distincts
Image Sensors An image sensor comprises a detector unit comprising a plurality of single photon detectors; a processing circuit configured to receive signals from the plurality of single photon detectors, to determine a time of arrival (ToA) of each signal, and to code shift the ToA of signals from different detectors by different amounts; and a memory configured to store the time shifted ToA of each signal in a histogram.
A method includes: providing a substrate, in which a first surface of the substrate includes at least one optical element module region defining an area in which multiple optical elements are to be disposed; forming, for each optical element module region on the first surface of the substrate, a corresponding reflow waste channel in the first surface of the substrate and around a perimeter of the optical element module region; providing a first optical element mold, in which a surface of the first optical element mold includes multiple first cavities, each first cavity defining a shape of a corresponding optical element of the multiple optical elements; providing resin globules between the surface of the optical element mold and the first surface of the substrate; and compressing the first optical element mold to the first surface of the substrate so that the resin fills the multiple first cavities, and so that excess resin flows into the reflow waste channel.
An example system includes a first spectrometer, a second spectrometer, and an electronic control device communicatively coupled to the first spectrometer and the second spectrometer. The first spectrometer is operable to emit first light using a first light source towards a sample region between the first spectrometer and the second spectrometer. The first spectrometer is also operable to measure first reflected light reflected using a first photodetector from an object in the sample region. The second spectrometer is operable to measure first transmitted light transmitted through the object using a second photodetector. The electronic control device is operable to determine, based on at least one of the measured first reflected light or the measured first transmitted light, a spectral distribution of light corresponding to the object.
The present disclosure is directed to optoelectronic modules with substantially temperature-independent performance characteristics and host devices into which such optoelectronic modules can be integrated. In some instances, an optoelectronic module can collect proximity data using light-generating components and light-sensitive components that exhibit temperature-dependent performance characteristics. The light-generating components and light-sensitive components can be configured such that they exhibit complementing temperature-dependent performance characteristics such that the operating performance of the optoelectronic module is substantially temperature independent.
G01S 17/04 - Systèmes de détermination de la présence d'une cible
H01L 31/12 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails structurellement associés, p.ex. formés dans ou sur un substrat commun, avec une ou plusieurs sources lumineuses électriques, p.ex. avec des sources lumineuses électroluminescentes, et en outre électriquement ou optiquement couplés avec lesdites sour
H01S 5/068 - Stabilisation des paramètres de sortie du laser
G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p.ex. des thermocouples
G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p.ex. une thermistance
H01S 5/183 - Lasers à émission de surface [lasers SE], p.ex. comportant à la fois des cavités horizontales et verticales comportant uniquement des cavités verticales, p.ex. lasers à émission de surface à cavité verticale [VCSEL]
A method for producing a plurality of optical prisms comprises: providing at least one manufacturing intermediate; and dividing the at least one manufacturing intermediate into a plurality of individual triangular prisms. The manufacturing intermediate comprises a main body in the form of a triangular prism having three rectangular surfaces and two triangular surfaces. The main body is formed from a light-transmitting material. A layer of opaque material is provided on two of the three rectangular surfaces of the main body, the layer of opaque material having a plurality of axially spaced apertures on each of the two of the three rectangular surfaces, each one of the apertures on one of the two surfaces being disposed at substantially the same axial position as one of the apertures on the other one of the two surfaces. The at least one manufacturing intermediate is divided into a plurality of individual triangular prisms such that each individual triangular prism has one of the apertures on each of two sides thereof.
G02B 1/02 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques caractérisés par la substance dont ils sont faits; Revêtements optiques pour éléments optiques faits de cristaux, p.ex. sel gemme, semi-conducteurs
97.
A LIDAR SENSOR FOR LIGHT DETECTION AND RANGING, LIDAR MODULE, LIDAR ENABLED DEVICE AND METHOD OF OPERATING A LIDAR SENSOR FOR LIGHT DETECTION AND RANGING
A LiDAR sensor for light detection and ranging comprises a light source (LS), a driver circuit (DC), a detector (DT) and a processing unit (PU). The light source (LS) comprises an array of light emitters (LE), wherein the light emitters (LE) are electrically interconnected as groups, and wherein the light emitters are operable to emit light away from the LiDAR sensor. At least two of the groups of light emitters (LE) form areas of the light source (LS) resembling different geometries from each other. The driver circuit (DC) is operable to address the groups of light emitters (LE) individually, such that the light emitters (LE) from a same group emit light with a same emission characteristic. The detector (DT) comprises an array of photodetectors (PD), wherein each photodetector (PD) is operable to detect light emitted by the light source (LS) and being reflected by an object outside the LiDAR sensor and to generate a detector signal as a function of the detected light. The processing unit (PU) is operable to provide an output indicative of distance to the object based on the detector signals associated with a respective group of light emitters (LE).
The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.
An optical encoder system is disclosed comprising a movable target arranged to provide a varying reflectance dependent on a position of the target within the system. An emitter is positioned on a first side of the target to illuminate the target and a sensor is positioned on the first side of the target to sense a reflectance from the target, wherein the sensed reflectance is dependent on the position of the target within the system. Also disclosed are a target and a sensor module for use in such a system, a device comprising such a system and a method of determining the position of a moving target using such a system.
G01D 5/347 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens optiques, c. à d. utilisant de la lumière infrarouge, visible ou ultraviolette avec atténuation ou obturation complète ou partielle des rayons lumineux les rayons lumineux étant détectés par des cellules photo-électriques en utilisant le déplacement d'échelles de codage
100.
OPTICAL ELEMENTS AND WAFERS INCLUDING OPTICAL ELEMENTS
An optics wafer includes replicated optical elements such as lenses that can be formed without the use of a separate glass or other substrate on which the optical elements would otherwise need to be replicated or mounted.
brevets
