A cBN sintered compact in accordance with an embodiment of the present invention comprises: cBN grains in the amount of 40 vol % or more and 80 vol % or less; and a binder phase containing titanium boride grains. The cBN sintered compact satisfies the following relation: 3.0≤X/Y≤10.0, where Y is the sum of the lengths of envelopes on which the cBN grains are in contact with the binder phase, and X is the sum of the interfacial lengths of the titanium boride grains that are present within 2 μm from the surfaces of each cBN grain and have an oblateness of 1.3 or more and 30.0 or less where the oblateness is defined by L2/(4πS), where L is the interfacial length and S is the area of the titanium boride grain.
C04B 35/5831 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on boron nitride based on cubic boron nitride
C04B 35/58 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides
This continuous cast wire rod contains Cu: 62.0 mass % or greater and 70.0 mass % or less, Sn: 0.3 mass % or greater and 0.9 mass % or less, Zr: 0.0050 mass % or greater and 0.1000 mass % or less, and P: 0.0050 mass % or greater and 0.1000 mass % or less, with a balance being Zn and impurities, and a mass ratio Zr/P of Zr to P is 0.3 or greater.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
B22D 11/00 - Continuous casting of metals, i.e. casting in indefinite lengths
Provided is a more appropriate method of producing lithium sulfide having high ionic conductivity and no by-products generated. The method of producing lithium sulfide includes a temperature rising step (Step S14) of reducing lithium sulfate fed into a furnace in a state of heating to a temperature of more than 700° C. under an atmosphere of a reduced pressure of 0.05 MPa or less.
This method for recovering a valuable metal from a used LIB includes: a step of adding, to an electrode assembly taken out of a detoxified used LIB, metallic zinc in an excess amount relative to a mass of the electrode assembly; a step of heating a mixture of the electrode assembly and the metallic zinc to form a molten metal; a step of taking out the molten metal and separating the molten metal into an alloy metal and a slag; and a step of heating the alloy metal to volatilize zinc in the alloy metal, and thereby, recovering an alloy metal of a valuable metal.
A valuable metal recovery method includes: recovering a battery slag from lithium ion battery waste; adding an acid to the battery slag; adding a sulfur compound the leachate; filtering the first processed product to obtain a first processed filtrate; adding a sulfur compound to the first processed filtrate; filtering the second processed product to obtain a second processed filtrate; adding calcium hydroxide to the second processed filtrate; filtering the third processed product to obtain a third processed filtrate; adding sodium carbonate to the third processed filtrate; filtering the processed product; heating the fourth processed filtrate; blowing carbon dioxide or adding a carbonate; and filtering the processed product, wherein a pH of the second processed product is higher than a pH of the first processed product, and a pH of the third processed product is higher than the pH of the second processed product.
The coating film includes a laminated structure including at least one first layer and at least one second layer alternately disposed. The or each first layer has an average thickness of 0.5 to 100.0 nm and has an average composition: (AlxTi1-x-y-zMy)BzN, where M is at least one element selected from the group consisting of Groups 4, 5, and 6 elements, and lanthanide elements in the periodic table, 0.100≤x≤0.640, 0.001≤y≤0.100, and 0.060≤z≤0.400. The or each second layer has an average thickness of 0.5 to 100.0 nm and has an average composition: (AlpCr1-p-q-rM′q)BrN, where M′ is at least one element selected from the group consisting of Groups 4, 5, and 6 elements, and lanthanide elements in the periodic table, 0.650≤p≤0.900, 0.000≤q≤0.100, and 0.000≤r≤0.050.
This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size μ in a sheet-thickness central portion is 40 μm or less.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, an aspect ratio of the crystal grain on the rolled surface is set to 2.0 or less, and a length percentage of the small tilt grain boundary and the subgrain boundary with respect to all grain boundaries is set to 80% or less in terms of partition fraction.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
9.
DITHIAPOLYETHER DIOL, METHOD FOR PRODUCING SAME, SNAG PLATING SOLUTION CONTAINING DITHIAPOLYETHER DIOL, AND METHOD FOR FORMING PLATING FILM WITH USE OF SNAG PLATING SOLUTION
This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more and is represented by the following general formula (1) or (2). In the general formula (1) or (2), x and y are arbitrary natural numbers
This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more and is represented by the following general formula (1) or (2). In the general formula (1) or (2), x and y are arbitrary natural numbers
C07C 323/12 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
C25D 3/56 - Electroplating; Baths therefor from solutions of alloys
10.
POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE
A polyimide resin composition includes a polyimide resin and a filler dispersed in the polyimide resin, in which the polyimide resin has a dicarboxylic acid group or an acid anhydride group of the dicarboxylic acid group at both ends, and the filler includes at least one inorganic compound selected from the group consisting of aluminum oxide, aluminum hydroxide, magnesium oxide, and magnesium hydroxide on a surface thereof.
To improve performance. A negative electrode material is a negative electrode material for a battery, and includes carbon, tungsten trioxide, and silicon particles (33) including silicon, and in the silicon particles (33), a ratio of the amount of Si in Si2p derived from elemental silicon to the amount of Si in Si2p derived from SiO2 in a surface layer is 3 or more, on an atomic concentration basis, as measured by X-ray photoelectron spectroscopy.
Provided are a temperature sensor for a busbar that can measure the busbar temperature with high accuracy by reliably bringing a heat-receiving surface into close contact, a busbar module, and a manufacturing method therefor. The temperature sensor for a busbar according to the present invention is a temperature sensor 1 that is used by being attached to a busbar 2, the temperature sensor including a heat-sensitive element 3 and a case part 4 in which the heat-sensitive element is housed, wherein the busbar has a through hole 2a, the case part has a case body 5 and a protrusion 6 that is formed to protrude from the case body and can be inserted into the through hole, and the heat-sensitive element is housed in the protrusion.
A cutting insert has a multi-stage columnar shape with an insert central axis as a center, the cutting insert including: a head portion having a circular cutting edge with the insert central axis as a center, a shaft portion disposed on a lower side of the head portion in an insert axial direction along the insert central axis and having a smaller outer diameter dimension than the head portion; a step portion configured to connect the head portion and the shaft portion; and an index portion disposed over a part of the step portion and a part of the head portion and recessed inward in an insert radial direction from an outer peripheral surface of each of the step portion and the head portion, in which a plurality of the index portions are arranged in an insert circumferential direction, and each of the index portions has a planar alignment surface.
This flat conductive plate provided with an insulating film includes a flat conductive plate which is a punched product, and an insulating film which coats at least a part of the flat conductive plate, the insulating film is an electrodeposited film, the insulating film includes a polyamide-imide resin and a fluorine-based resin, an amount of the fluorine-based resin with respect to a total amount of the polyamide-imide resin and the fluorine-based resin is in a range of 72% by mass or more and 95% by mass or less, a relative permittivity at 25° C. is in a range of 2.2 or more and 2.8 or less, and an average film thickness is in a range of 5 μm or more and 100 μm or less.
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
A cBN sintered compact includes a binder phase that contains a Ti—Al alloy containing at least one of the Si, Mg, and Zn elements, Ti2CN, TiB2, AlN, and Al2O3; the ratio ITi2CN/ITiAl is 2.0 or more and 30.0 or less, wherein ITi2CN represents the intensity of the Ti2CN peak appearing at 2θ from 41.9° to 42.2° and ITiAl represents the intensity of the Ti—Al alloy peak appearing at 2θ from 39.0° to 39.3° in XRD; and, in the mapped image of each element of Ti, Al, Si, Mg, and Zn by Auger electron spectroscopy, the ratio STiAlM/STiAl, is 0.05 or more and 0.98 or less wherein STiAlM represents the average area of the portions wherein Ti, Al and at least one selected from the group consisting of Si, Mg, and Zn overlap and STiAl represents the average area of the portions where Ti and Al overlap.
An annular metal seal (10) that is pressed down and deformed by a second member (2) when in a state fitted into an annular seal groove (4) of a first member (1) comprises an annular seal main body (10a), an upper and lower pair of tapered first projecting ridges (11, 12) that project from an upper surface and a lower surface of the seal main body (10a) respectively and that correspond to an outer circumferential side corner portion (R1) of the seal groove (4), an upper and lower pair of tapered second projecting ridges (13, 14) that project from the upper surface and the lower surface of the seal main body (10a) respectively and that correspond to an inner circumferential side corner portion (R2) of the seal groove (4), and a positioning protuberance 20 that bulges out from a side surface on at least one of a radially outer side and a radially inner side of the seal main body (10a), wherein a height of the upper and lower pair of second projecting ridges (13, 14) from a vertical center (C) and a height of the upper and lower pair of first projecting ridges (11, 12) from the vertical center (C) differ from one another. As a result, damage to the first member (1) and the second member (2) and a load on a clamping bolt are reduced.
Free-cutting copper alloy comprises Cu: more than 59.7% but less than 64.7%, Si: more than 0.60% but less than 1.30%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.001% but less than 0.10 mass %, and P: more than 0.001% but less than 0.15%, with remainder being Zn and unavoidable impurities, wherein total amount of Fe, Mn, Co, and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, 56.7≤Cu−4.7×Si+0.5×Pb+0.5×Bi−0.5×P≤59.7 and 0.003≤Pb+Bi<0.25 are satisfied, 0.02≤Bi/(Pb+Bi)≤0.98 is satisfied if 0.003≤Pb+Bi<0.08, 0.01≤Bi/(Pb+Bi)≤0.40 or 0.85≤Bi/(Pb+Bi)≤0.98 is satisfied if 0.08≤Pb+Bi<0.13.
C22C 9/04 - Alloys based on copper with zinc as the next major constituent
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
A Li recovery method includes: an acid leaching step of adding an acid to a battery slag to produce a leachate; a first addition step of adding a Ca content to the leachate to produce a first processed product; a post-first-addition filtration step of filtering the first processed product to be separated into a first processing filtrate and a first processing residue; a second addition step of adding sodium carbonate to the first processing filtrate to produce a second processed product; a post-second-addition filtration step of filtering the second processed product to be separated into a second processing filtrate and a second processing residue; heating the second processing filtrate; blowing carbon dioxide into the heated second processing filtrate to produce a third processed product; and a post-carbonation filtration step of filtering the third processed product to be separated into a third processing filtrate and a third processing residue.
Tungsten trioxide is appropriately disposed on the surface of carbon. A negative-electrode material is a negative-electrode material for a battery and contains amorphous carbon and tungsten trioxide provided on the surface of the amorphous carbon.
Provided is a copper/ceramic bonded body (10, 110) in which a copper member (12, 13, 112, 113) made from copper or a copper alloy is bonded to a ceramic member (11, 111), in which an active metal compound layer (31) containing a compound of at least one active metal selected from Ti, Zr, Nb and Hf or a magnesium oxide layer (131) is formed on a copper member-side region in the ceramic member (11, 111), and a transition metal layer (34, 134) containing at least one transition metal selected from V, Cr, Mn, Fe, Co, Ni, Mo, Ta and W is formed at the copper member-side interface of the active metal compound layer (31) or the magnesium oxide layer (131).
There is provided a method for producing a carbon material, including a carbon generation step of causing carbon dioxide to react with a reducing agent to generate carbon, in which, as the reducing agent, an oxygen-deficient iron oxide represented by Fe3O4-δ (where δ is 1 or more and less than 4), which is obtained by reducing magnetite while maintaining a crystal structure, or an oxygen-completely deficient iron (δ=4) which is obtained by completely reducing magnetite is used.
There is provided a method for recovering lead from copper smelting dust according to the present invention includes an alkali leaching step of leaching lead contained in copper smelting dust with an alkali solution, a step of performing a solid liquid separation on a post-leaching solution and a leaching residue after the alkali leaching step, a neutralization step of adding an acid to the separated post-leaching solution to precipitate a lead, and a step of recovering a precipitate containing the lead by performing a solid liquid separation.
The purpose is to provide a heat-storing thermally conductive material having high thermal conductivity and high heat storage capacity that can suppress fluidization of the heat-storing material even in a high-temperature environment. The material comprises a heat-storing material, a thermally conductive filler, and a base resin. The thermally conductive filler has a specific surface area of 0.5 m2/g or more. The thermally conductive filler is contained in a proportion of 30 weight parts or more relative to 90 weight parts of the heat-storing material. The base resin has a polyurethane comprising a polyol having two or more hydroxyl groups per molecule and an isocyanate having two or more functional groups capable of reacting with the hydroxyl groups of the polyol per molecule.
C09K 5/06 - Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice-versa
24.
METAL MEMBER HAVING THREE-DIMENSIONAL REGULAR SKELETON STRUCTURE, ELECTRODE HAVING THREE-DIMENSIONAL REGULAR SKELETON, WATER ELECTROLYSIS APPARATUS, AND FUEL CELL
NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY (Japan)
Inventor
Sano Yosuke
Ohmori Shinichi
Kato Jun
Mitsushima Shigenori
Kuroda Yoshiyuki
Nagasawa Kensaku
Abstract
This metal member has a three-dimensional regular skeleton structure of which a void ratio is in a range of 50% to 95%, inclusive. The three-dimensional regular skeleton structure includes a skeleton and a plurality of pores extending in a first direction, and on a cross section of which orthogonal to the first direction, a layered structure is formed in which a pore row in which the pore and the skeleton are alternately arranged is periodically layered. In addition, this electrode includes a number-sign-shaped sheet layer with a plurality of through holes in a thickness direction. The number-sign-shaped sheet has a void ratio in a range of 20% to 70%, inclusive, and a thickness in a range of 10 µm to 500 µm, inclusive.
B22F 5/10 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/00 - Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
C25B 11/03 - Electrodes; Manufacture thereof not otherwise provided for characterised by shape or form perforated or foraminous
C25B 11/042 - Electrodes formed of a single material
Provided is a clamping tool for attaching a cutting insert to a holder or detaching a cutting insert from a holder, the cutting insert including a head portion having a circular cutting edge and a shaft portion, the clamping tool including: a first jaw portion configured to be locked to the holder; and an operation lever configured to be connected to the first jaw portion, in which the first jaw portion has a locking portion configured to be locked to the holder, and a first pressing portion configured to push the head portion downward and fit the shaft portion into a shaft hole portion of the holder when the operation lever is rotationally moved in a first direction using the locking portion as a fulcrum.
The present invention provides: a thermistor element which is provided with a conductive intermediate layer that can be stable even at high temperatures; and a method for producing this thermistor element. A thermistor element according to the present invention is provided with a thermistor base body 2 that contains an oxide thermistor material having a perovskite crystal structure, a conductive intermediate layer 3 that is formed on the thermistor base body, and an electrode layer 4 that is formed on the conductive intermediate layer; and the conductive intermediate layer is composed of a composite oxide that contains Mn. A method for producing this thermistor element comprises: an intermediate layer formation step in which a conductive intermediate layer of a composite oxide that contains Mn is formed on a thermistor base body; and an electrode layer formation step in which an electrode layer is formed on the conductive intermediate layer. In the intermediate layer formation step, an Mn-containing dispersion liquid is applied to and dried on the thermistor base body, thereby forming a provisional intermediate layer. In the electrode formation step, a Pt paste that contains Pt is applied to and fired on the provisional intermediate layer, thereby forming an electrode layer, while converting the provisional intermediate layer into a conductive intermediate layer.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY (Japan)
Inventor
Arai Koya
Yano Masahiro
Oya Takahide
Abstract
The present invention comprises: a thermoelectric material-containing porous body (20) made of a porous body including a thermoelectric material that has a Seebeck coefficient of absolute value 3 μV/K or higher; and a first electrode section (11) and second electrode section (12) that are connected to the thermoelectric material-containing porous body (20). One end of the thermoelectric material-containing porous body (20) is an immersed part (21) to be immersed in a liquid 3, and another end of the thermoelectric material-containing porous body (20) is a non-immersed part (22). The liquid (3) is sucked up into the immersed part (21), and the sucked-up liquid (3) is volatilized in the non-immersed part (22). The heat of vaporization when the liquid (3) is volatilized creates a temperature difference between the one end and the other end of the thermoelectric material-containing porous body (20), and this temperature difference generates power.
H02N 11/00 - Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
H10N 10/13 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
H10N 10/851 - Thermoelectric active materials comprising inorganic compositions
H10N 10/855 - Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
H10N 10/856 - Thermoelectric active materials comprising organic compositions
H10N 10/857 - Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY (Japan)
Inventor
Arai Koya
Yano Masahiro
Oya Takahide
Abstract
This gas sensor comprises an electrical-conductor-containing porous material (20) in which carbon nanotubes are contained in an insulating porous material, a first electrode portion (11) and a second electrode portion (12) disposed spaced apart in an extension direction of the electrical-conductor-containing porous material (20), and a resistance measuring unit (15) for measuring an electrical resistance value between the first electrode portion (11) and the second electrode portion (12), wherein the electrical-conductor-containing porous material (20) serves as a gas sensing portion for sensing a gas.
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A tin alloy plating solution of the present invention includes (A) a soluble salt or oxide including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms, (D) a free acid, and (E) an antioxidant. In addition, a content of the tin complexing agent is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) is 30 g/L or more.
The electrodeposition dispersion of the present invention is an electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the solution including water, a dispersion medium, and a solid component, in which the solid component includes a polyimide-based resin and a fluorine-based resin, the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less, an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and a standard deviation of the particle diameter of the solid component is 250 nm or less.
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
31.
TRANSACTION MANAGEMENT DEVICE, TRANSACTION MANAGEMENT SYSTEM, USER TERMINAL, TRANSACTION MANAGEMENT METHOD, DISPLAY CONTROL METHOD, AND PROGRAM
This transaction management device comprises an information acquiring means, an updating means, and a transmitting means. The information acquiring means acquires progress status information for each step including a content evaluating process of a transaction relating to a recycled raw material containing valuable metal, the recycled raw material having been delivered by a user. The updating means updates status information corresponding to each step on the basis of the progress status information. The transmitting means transmits screen information including the status information to a user terminal device of the user in response to a viewing request from the user terminal device.
A fluorine rubber composition contains a component A that is a base rubber containing a hydrogen-containing fluorine rubber as a main component, a component B that is a compound having a perfluoropolyether skeleton, and a component C that is a powdery filler having a bulk density of 0.4 g/cm3 or less. A part or whole of the component B contains an alkenyl group in a molecule. (pC/dC)/(pB/dB)≥4 is satisfied wherein dB is a density of the component B, pB is a content of the component B relative to 100 parts by mass of the component A, dC is the bulk density of the component C, and pC is a content of the component C relative to 100 parts by mass of the component A.
A resin molded body according to the present invention is a resin molded body to be provided on an outer periphery of one or more lithium-ion secondary battery cells including a safety valve or an exhaust hole such that at least the safety valve or the exhaust hole is covered, in which a thermal conductivity (measurement temperature: 50° C.) of the resin molded body measured by a steady state comparative-longitudinal heat flow method based on JIS H7903:2008 is less than 1.0 W/m·K, a thickness of a part of the resin molded body, the part covering the safety valve or the exhaust hole, is 0.5 mm or more and 10.0 mm or less, and a hardness of a surface of the resin molded body measured by Type D durometer based on JIS K7215 is 50 or more and 90 or less.
H01M 50/209 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
H01M 50/233 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions
H01M 50/229 - Composite material consisting of a mixture of organic and inorganic materials
This cutting tool comprises a rake face (1), a flank (2), a cutting edge (3) which is disposed on a ridge line portion where the rake face (1) and the flank (2) are connected, and which has a V-shape in a plan view in which the rake face (1) is seen from the front, and a chip breaker (4) disposed on the rake face (1), wherein: the chip breaker (4) includes a first projecting portion (41) projecting upward from the rake face (1), second projecting portions (42) which project upward from the rake face (1), are disposed rearward of the first projecting portion (41), and extend toward the front with increasing distance in left and right directions from a bisector of the cutting edge (3), and a third projecting portion (43) which projects upward from the rake face (1) and is disposed in front of the first projecting portion (41); the first projecting portion (41) and the second projecting portion (42) project further upward than the cutting edge (3); and the third projecting portion (43) has a smaller height in a vertical direction than the first projecting portion (41).
A surface-coated cutting tool includes a coating layer having a laminated structure that includes first sublayers and second sublayers having a cubic crystal structure and has an average thickness of 0.5 to 8 μm, the bottommost and topmost sublayers being both first sublayers; the first sublayer has an average thickness of 0.1 to 2 μm and a composition (Al1−xCrx)N, where x=0.20 to the second sublayer has an average thickness of 0.1 to 2 μm, has a composition (Al1-a-bCraSib)N where a=0.20 to 0.60, b=0.01 to 0.20, and has a repeated variation in Si content with an average interval of 1 to 100 nm between local minima and local maxima, the average local maximum and minimum are each within a specific range; and the diffraction peaks of the 111 and 200 diffraction peaks each have a predetermined full width at half maximum and a peak intensity.
C04B 35/622 - Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
B23B 27/14 - Cutting tools of which the bits or tips are of special material
C04B 35/581 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
C04B 35/58 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides
36.
PURE COPPER MATERIAL, INSULATING SUBSTRATE AND ELECTRONIC DEVICE
A pure copper material according to the present invention has a Cu content within the range of 99.9 mass% to 99.999 mass%, while having an average crystal grain size of 10 μm or more in a rolled surface; and if a measurement area of 1 mm2 or more is measured by means of an EBSD method in steps with measurement intervals of 1 μm and the boundaries at which the misorientation between adjacent pixels is 5° or more are considered as crystal grain boundaries, while excluding the measurement points at which the CI value as obtained by an analysis using data analysis software OIM is 0.1 or less, the average of Local Orientation Spread (LOS) is 2.00° or less.
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
37.
PURE COPPER MATERIAL, INSULATING SUBSTRATE AND ELECTRONIC DEVICE
A pure copper material according to the present invention has a Cu content within the range of 99.9 mass% to 99.999 mass%, while having an average crystal grain size of 10 μm or more in a rolled surface; and if a measurement area of 1 mm2 or more is measured by means of an EBSD method in steps with measurement intervals of 1 μm and the boundaries at which the misorientation between adjacent pixels is 5° or more are considered as crystal grain boundaries, while excluding the measurement points at which the CI value as obtained by an analysis using a data analysis software OIM is 0.1 or less, the average of angle differences (misorientation angles) between crystals which are adjacent to each other across a crystal grain boundary is 40° or more.
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
38.
ALUMINUM POWDER MIXTURE AND METHOD FOR PRODUCING ALUMINUM SINTERED BODY
This aluminum powder mixture is obtained by mixing a starting material powder, which is composed of pure aluminum or an aluminum alloy, with 5% by mass to 30% by mass of an aluminum alloy powder that has a lower melting point than the pure aluminum or the aluminum alloy. The aluminum alloy powder is composed of an aluminum alloy which has a composition that contains 5% by mass to 20% by mass of at least one of Si and Cu, and 0.2% by mass to 2.0% by mass of Mg, with a balance of aluminum and unavoidable impurities. Consequently, sintering among the aluminum powders is accelerated and it is possible to obtain an aluminum sintered body that has a higher density and a high electrical conductivity as well as obtaining a high thermal conductivity.
This pure copper material has a Cu content of at least 99.96 mass%, wherein: the total amount of at least one or two group A elements selected from among Ca, Ba, Sr, Zr, Hf, Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu and/or at least one or two group B elements selected from among O, S, Se, and Te falls within the range of 10 mass ppm to 300 mass ppm; and the pure copper material has an average crystal grain size on a rolled surface of at least 15 μm, and has a high-temperature Vickers hardness of 4.0 HV to 10.0 HV at 850 °C.
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
40.
MULTILAYER ASSEMBLY, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SAME
The present invention suppresses warpage through low-temperature bonding when forming a multilayer assembly, such as when bonding a heat sink to an insulated circuit board. A multilayer assembly according to the present invention comprises: a ceramic substrate; a first aluminum plate that is bonded to one surface of the ceramic substrate and contains aluminum or an aluminum alloy; a first intermediate metal layer that is bonded to the reverse side of the first aluminum plate from the ceramic substrate and contains any one of copper, nickel, silver, and gold; a first copper sintered layer bonded to the reverse side of the first intermediate metal layer from the first aluminum plate; and a first metal member that is bonded to the reverse side of the first copper sintered layer from the first intermediate metal layer and contains any one of aluminum, an aluminum alloy, copper, and a copper alloy.
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
41.
ELECTRODE PLATE FOR PLASMA TREATMENT DEVICE AND ELECTRODE STRUCTURE
This electrode plate (3) for a plasma treatment device is disposed on an electrode contact surface (142) side of a cooling plate (14). The electrode plate (3) comprises a downstream gas flow channel (11) connected to an upstream gas flow channel (15) that penetrates the electrode contact surface (142) from one surface (141) of the cooling plate (14). Corrosion resistant membranes (210, 230), which are resistant to a process gas that flows in the upstream gas flow channel (15) of the cooling plate (14), are formed on a first surface (31) that is in contact with the cooling plate (14) as a result of providing an inlet (111) which is a section of the downstream gas flow channel (11).
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating using electric discharges
H05H 1/46 - Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
This slip prevention member has, on at least a portion of a surface of a base material composed of an inorganic material, a protrusion area in which a plurality of protrusions are erected, wherein: the protrusion area has a first direction and a second direction crossing the first direction; the plurality of protrusions are periodically disposed in at least one direction among the first direction and the second direction; the average pitch of the plurality of protrusions in the first direction and/or the second direction is within the range of 20-1,000 nm; and the dynamic friction coefficient of the surface is 0.20 or greater.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
43.
HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFACTURING HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD
A heatsink-integrated insulating circuit board includes a heat sink including a radiating fin, an insulating resin layer formed on a top plate part of the heat sink, and a circuit layer arranged on one surface of the insulating resin layer. An angle θ formed between an end of the metal piece and a surface of the insulating resin layer is set to be 70° or more and 110° or less. Root-mean-square heights Sq1 and Rq1 in bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece, and root-mean-square heights Sq2 and Rq1 in regions other than the bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece have a relationship of Sq1>Sq2 or Rq1>Rq2.
H01L 23/367 - Cooling facilitated by shape of device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
This noble metal production method comprises: a base metal dissolution step for producing a noble-metal-containing raw material and a base metal eluate in which a base metal has been dissolved; a noble metal dissolution step for producing a noble metal eluate in which the noble metal contained in the noble-metal-containing raw material has been eluted; a heating step for heating the noble metal eluate in the range of 30-100°C; a noble metal adsorption step for adding a yeast to the noble metal eluate after heating and selectively adsorbing to the yeast noble metal ions included in the noble metal eluate; and a noble metal separation step for adding a reducer to a dispersion of the yeast to which the noble metal ions are adsorbed, and separating the noble metal which has become nanoparticles.
In this slit copper material, a purity of Cu is 99.96% by mass or greater, a ratio W/t of a plate width W to a plate thickness t is 10 or greater, an electrical conductivity is 97.0% IACS or greater, and an average value of orientation densities at φ2=5°, in a range of φ1=0° to 90°, and at Φ=0° in a plate center portion is 2.0 or greater and less than 30.0.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/02 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
46.
ZIRCONIUM-CONTAINING NITRIDE POWDER AND ULTRAVIOLET RAY-CURABLE BLACK ORGANIC COMPOSITION
This zirconium-containing nitride powder has a composition represented by the following General Formula (I). (Zr, X, Y) (N, O) . . . (I). In General Formula (I), X represents at least one element selected from the group consisting of Dy, Er, Gd, Ho, Lu, Nd, Pr, Sc, Sm, Tb, and Tm, Y represents an element symbol of yttrium, an amount of Y is 0 mol or greater with respect to 1 mol of a total amount of Zr, X, and Y, N represents nitrogen, O represents oxygen, and an amount of oxygen is 0 mol or greater with respect to 1 mol of a total amount of nitrogen and oxygen.
In an attachment structure for an annular metal seal, an annular metal seal includes a seal body configured such that at least one of outer corner portions thereof corresponding to an inner corner portion of the seal groove has a sharp ridge, and in a state where a positioning ring is held between an inner-side side surface of the seal groove and an inner-diameter-side side surface or an outer-diameter-side side surface of the seal body, the annular metal seal is fitted in the seal groove with the positioning ring abutted on at least a portion of the inner-side side surface of the seal groove and the sharp ridge of the seal body spaced from the inner corner portion of the seal groove, and the first member and the second member are fastened with each other, so that inner and an outer sides of the annular metal seal are sealed.
This grooving tool includes a cutting insert, a holder, and a coolant flow path. The holder includes an insert mounting seat, and jaw parts that are disposed on an upper side and a lower side of the insert mounting seat and fix the cutting insert. The jaw part forms a curved shape as viewed from a tool distal end side, and has a thickness that is decreased as a distance from the insert mounting seat is increased. The coolant flow path includes a jaw part flow path extending through an inside of the jaw part, and the jaw part flow path includes a guide flow path section that has a vertically elongated shape with a dimension a in the vertical direction larger than a dimension b in the tool width direction in a channel cross section, and an ejection flow path section that has a laterally elongated shape
A silicon member (10) comprises a plurality of plate members (11, 12) made from a Si-containing material. The plate members (11, 12) are bonded in the thickness direction. A bonding layer (20) is formed between the plate members (11, 12). The area percentage of the Si-phase in the bonding layer (20) is 12% or less. The aspect ratio of the Si-phase in the bonding layer (20) is preferably 3.0 or less.
A wiper insert includes three first corner portions and three second corner portions which are alternately aligned on a polygonal surface in an insert circumferential direction. A cutting edge has a first cutting edge that performs a finishing operation on a work material, and a second cutting edge. An outer peripheral surface has a first flank face, a second flank face, and a first restraint surface disposed outward from the second cutting edge in an insert radial direction. When viewed in an insert axial direction, an insert shape is rotationally symmetrical by 180° around a rotation center axis passing through the second corner portion adjacent to a first side of a predetermined first corner portion in the insert circumferential direction and an insert center axis.
The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.
In production of a solid electrolyte member, the amount or kinds of sulfides used as raw materials are reduced. A method of producing a solid electrolyte member is a method of producing a solid electrolyte member based on sulfide, the method including: a preparation step (S10) of preparing an aggregate of starting materials, in which the starting materials include elemental sulfur, and a non-sulfide raw material that is at least one of an element as an elemental substance other than sulfur that constitutes the solid electrolyte member, and a compound of elements other than sulfur that constitute the solid electrolyte member; and a forming step (S12) of heating the aggregate of starting materials to form the solid electrolyte member. The non-sulfide raw material contains no elements other than elements except sulfur that constitute the solid electrolyte member, except inevitable impurities.
There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.
A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The tensile strength is 275 MPa or less. The heat-resistant temperature after draw working is 150° C. or higher.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
What is provided is a method for separating cobalt and nickel including: a crushing and sorting step of crushing and classifying the lithium ion secondary battery to obtain an electrode material containing at least cobalt, nickel, copper, and lithium; a leaching step of immersing the electrode material in a processing liquid containing sulfuric acid and hydrogen peroxide to obtain a leachate; a copper separation step of adding a hydrogen sulfide compound to the leachate with stirring and subsequently carrying out solid-liquid separation to obtain an eluate containing cobalt and nickel and a residue containing copper sulfide; and a cobalt/nickel separation step of adding an alkali metal hydroxide to the eluate to adjust a pH and subsequently, adding a hydrogen sulfide compound with stirring and carrying out solid-liquid separation to obtain a precipitate containing cobalt sulfide and nickel sulfide and a residual liquid containing lithium.
This cobalt and nickel recovery method comprises: a pretreatment step for removing either/both copper ions or/and iron(III) ions contained in a raw solution containing either/both cobalt or/and nickel; and a xanthate treatment step for adding a xanthide to the pretreated solution to selectively precipitate a xanthate of either/both cobalt or/and nickel, and recovering the precipitate.
The present invention provides an oxide thermistor having a smaller change in resistance value in high-temperature environments, and a method for manufacturing the oxide thermistor. The oxide thermistor according to the present invention is an oxide thermistor 1 having Mn and Co as main ingredients, with Cu furthermore added thereto, wherein the oxide thermistor 1 is densely sintered, and the crystal structure of the oxide thermistor 1 includes a cubic spinel phase 2, an NaCl-type crystal phase 3, and a cuprite-type crystal phase 4 that includes monovalent Cu and is in contact with or contained within the NaCl-type crystal phase. This method for manufacturing an oxide thermistor includes a calcinating step for calcining a mixture in which Mn, Co, and Cu are mixed, a molding step for molding the calcined mixture after the calcinating step into a compact, and a firing step for firing the compact and forming a sintered body, the firing step involving firing the compact at a temperature equal to or higher than the temperature at which the NaCl-type crystal phase precipitates, until the cuprite-type crystal phase precipitates together with the NaCl-type crystal phase.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
The present invention provides: an oxide thermistor which has a smaller change in the resistance in a high temperature environment; and a method for producing this oxide thermistor. An oxide thermistor according to the present invention is mainly composed of Mn and Co, while additionally containing Cu and M that represents at least one element selected from among Mg, Cr, Fe, Ni, Zn, Al and Ga; and the crystal structure of this oxide thermistor comprises a cubic spinel phase 2 and an NaCl crystal phase 3. A method for producing this oxide thermistor according to the present invention comprises: a calcination step in which a mixture obtained by mixing Mn, Co, Cu and M (M represents at least one element selected from among Mg, Cr, Fe, Ni, Zn, Al and Ga) is calcined; a molding step in which the mixture is molded into a molded body after the calcination step; and a firing step in which the molded body is fired so as to form a sintered body. In the firing step, the molded body is fired until an NaCl crystal phase is precipitated at a temperature that is not less than the temperature at which the NaCl crystal phase is precipitated.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
59.
RESIN COMPOSITION, RESIN MOLDED BODY, AND METHOD FOR PRODUCING RESIN COMPOSITION
This resin composition is characterized by containing 59-88 parts by mass of a thermoplastic resin, 1-18 parts by mass of carbon fibers, and 0.3-7 parts by mass of a silane coupling agent per 100 total parts by mass of resin composition, and is moreover characterized in that the carbon fibers are isotropic pitch-based carbon fibers.
C08L 101/00 - Compositions of unspecified macromolecular compounds
C08J 3/20 - Compounding polymers with additives, e.g. colouring
C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
C08L 69/00 - Compositions of polycarbonates; Compositions of derivatives of polycarbonates
This method for separating cobalt and nickel comprises: a step (S3) for immersing an electrode material for a lithium-ion secondary battery in a processing liquid including sulfuric acid and hydrogen peroxide to obtain a leeching solution; a step (S4) for adding a hydrogen sulfide compound to the leeching solution to precipitate copper; one of a first processing step (S5A) or a second processing step (S5B); a step (S6) for obtaining a precipitate including cobalt sulfide and nickel sulfide, and a residual liquid including lithium; and a re-dissolving step (S7) for dissolving cobalt and nickel in a suspension in which the precipitate is suspended in distilled water or dilute sulfuric acid. In the re-dissolving step (S7), a fine-bubble generation apparatus is used to perform bubbling in the suspension, using oxidation gas including oxygen.
C22B 3/22 - Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means
C22B 3/44 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
H01M 10/54 - Reclaiming serviceable parts of waste accumulators
62.
PLASMA-RESISTANT COATING FILM, SOL GEL LIQUID FOR FORMING SAID FILM, METHOD FOR FORMING PLASMA-RESISTANT COATING FILM, AND SUBSTRATE WITH PLASMA-RESISTANT COATING FILM
The plasma-resistant coating film according to the present invention is formed on a substrate, including crystalline Y2O3 particles having an average particle diameter of 0.5 μm to 5.0 μm in a SiO2 film, in which a film density of the plasma-resistant coating film is 90% or more, the film density being obtained by performing image analysis of a cross section of the film with an electron scanning microscope and by using the following expression (1), a size of pores in the film is 5 μm or less in terms of diameter, and a peeling rate of the film from the substrate measured by performing a cross-cut test is 5% or less. Film density (%)=[(S1−S2)/S1]×100 (1). However, in the expression (1), S1 is an area of the film and S2 is an area of a pore portion in the film.
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
63.
SLIT COPPER MATERIAL, PART FOR ELECTRIC/ELECTRONIC DEVICE, BUS BAR, HEAT DISSIPATION SUBSTRATE
A slit copper material, a purity of Cu is comprises 99.96% by mass or greater of Cu. In this slit copper material, a ratio W/t of a plate width W to a plate thickness t is 10 or greater, an electrical conductivity is 97.0% IACS or greater, a ratio B/A of an average crystal grain size B in a plate surface layer portion to an average crystal grain size A in a plate center portion is in a range of 0.80 or greater and 1.20 or less, and the average crystal grain size A in the plate center portion is 25 μm or less.
C22C 1/03 - Making non-ferrous alloys by melting using master alloys
C22F 1/02 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
64.
INSERT SINTERED PART AND MANUFACTURING METHOD FOR SAME
By using a forming die having a fixed die and a movable die moving along a parting surface on the fixed die and by moving the movable die along the parting surface, to press and hold a sintered part between the movable die and the fixed die, to form a cavity around the sintered part except parts which abut on the fixed die and the movable die by the forming die, and to fill the cavity with melted material which becomes an exterior part, so that the sintered part and the exterior part are integrated by insert molding.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
F16C 33/14 - Special methods of manufacture; Running-in
B22F 5/10 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
65.
HEAT TRANSFER MEMBER, METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER, AND PLASMA TREATMENT DEVICE
This heat transfer member is made of a sintered body of a molded product containing a fluororesin or a fluoroelastomer, and has a hardness lower than that of the molded product by at least 7, as measured using a type AM durometer according to JIS K 6253-3:2012. This heat transfer member has high plasma resistance and can maintain high adhesion to various members for a long period of time.
XY1-X-Yα1-αavgavgavgavgavgavgavgavgmaxmaxminminmaxminmin ≤ 0.400; and the lattice coefficient A (nm), which is calculated from an XRD pattern, and A*(nm), which is A*avgavgavgavgavg), satisfy |A-A*| < 0.0010 (nm).
A thermally conductive filler according to the present invention comprises coarse inorganic particles and small-diameter inorganic particles. The coarse inorganic particles comprise, at a mass ratio of 60:40 to 100:0, large-diameter electro-fused alumina particles having the average particle diameter in a range of 20 µm to 50 µm, and medium-diameter inorganic particles having the average particle diameter in a range of 1.0 µm to 10 µm. The average particle diameter of the small-diameter inorganic particles is in a range of at least 0.1 µm to less than 1.0 µm, and the content percentage of the small-diameter inorganic particles is in a range of 15 mass% to 30 mass%.
A turning tool unit according to the present invention comprises a turning tool (1), and a holder (80, 90) which holds the turning tool (1) and is mounted on a machine tool (200, 210), wherein: the turning tool (1) comprises a tool main body (2) which extends along a tool axis (J) and has a pedestal (23d) on a distal end portion on one side in an axial direction (Dj) along the tool axis (J), a cutting insert (4) detachably attached to the pedestal (23d), and a tool-side electronic component (P) provided in the tool main body (2); and the holder (80, 90) comprises a holder main body (81, 91) having a tool holding portion (81a) for holding the tool main body (2), a holder-side electronic component (85) which is electrically connected to the tool-side electronic component (P) and which includes a communication module (88) capable of communicating with the outside, and a box-like casing (84) which is held in the holder main body (81, 91) to accommodate the holder-side electronic component (85).
B23B 25/06 - Measuring, gauging, or adjusting equipment on turning-machines for setting-on, feeding, controlling, or monitoring the cutting tools or work
B23B 27/00 - Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
This turning tool comprises: a tool main body (2) that extends along the tool axis (J) and has a seating (23d) at one end in the axial direction (Dj) that follows the tool axis (J); a cutting insert (4) that is detachably attached to the seating (23d); and a camera that is provided to the tool main body (2) and images a machined surface of a workpiece cut using the cutting insert (4). The camera is disposed so as to be able to image outward in the radial direction (Dr) of the tool main body (2), said direction being orthogonal to the axial direction (Dj).
B23Q 11/08 - Protective coverings for parts of machine tools; Splash guards
B23Q 17/20 - Arrangements for indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
B23Q 17/24 - Arrangements for indicating or measuring on machine tools using optics
71.
ELECTRODE MATERIAL LEACHING METHOD AND METHOD FOR SEPARATING COBALT AND NICKEL
Provided is an electrode material leaching method for performing acid leaching on an electrode material of a lithium-ion secondary battery, the electrode material leaching method being characterized in that: the electrode material leaching method comprises a leaching step for causing the electrode material of the lithium-ion secondary battery to react with sulfuric acid to obtain a leachate in which metal contained in the electrode material is leached; and the leaching step includes a sulfuric acid adding process for adding sulfuric acid to the electrode material to obtain a sulfuric-acid-added electrode material, a kneading process for kneading the sulfuric-acid-added electrode material to form a leaching paste, and a diluting process for diluting the leaching paste with water.
A method of recovering cobalt and nickel includes the steps of: adding alkaline to an acidic solution containing aluminum together with cobalt and nickel, adjusting pH of the acidic solution to 5 to 7, and converting the cobalt, the nickel and the aluminum into hydroxides thereof; recovering the hydroxides by solid-liquid separation, mixing the recovered hydroxides with an alkaline solution, and leaching aluminum contained in the hydroxides under a liquid condition of pH 8 or more; and recovering a cobalt hydroxide and a nickel hydroxide that aluminum is separated therefrom by solid-separation on a leachate.
This thermally conductive polymer composition includes a liquid rubber having two or more hydroxyl groups per molecule thereof, a solvent having one or more hydroxyl groups per molecule thereof, a curing agent having, per molecule thereof, two or more functional groups capable of reacting with both the hydroxyl groups of the liquid rubber and the hydroxyl groups of the solvent, and a filler. The thermally conductive polymer composition is characterized in that after mixing the thermally conductive polymer composition, the compressive modulus at room temperature of the thermally conductive polymer cured after standing for 24 hours or more in ordinary atmospheric conditions at 25°C is 4.5 N/mm2to 5.5 N/mm2, inclusive.
This aluminum powder product for metal additive manufacturing has a purity of aluminum in the whole powder of 98 mass% or more and contains 0.01-0.5 mass% inclusive of Mg, and the ratio (Mg amount)/(oxygen amount) of the contained amount (mass%) of Mg to the contained amount (mass%) of oxygen is 0.1-2.0 inclusive.
B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 10/14 - Formation of a green body by jetting of binder onto a bed of metal powder
B22F 10/34 - Process control of powder characteristics, e.g. density, oxidation or flowability
This thermally conductive polymer comprises a liquid rubber having two or more hydroxyl groups in each molecule, a solvent having one or more hydroxyl groups in each molecule, a hardener having, in each molecule, two or more functional groups reactive with both the hydroxyl groups of the liquid rubber and the hydroxyl groups of the solvent, and a filler having thermal conductivity.
This thermally-conductive composition contains a liquid rubber having two or more hydroxyl groups per molecule, a plasticizer that has one or more hydroxyl groups per molecule and is compatible with the liquid rubber, a tackifier that is compatible with the plasticizer, and a curing agent having two or more functional groups per molecule capable of reacting with either the hydroxyl groups of the liquid rubber and the hydroxyl groups of the plasticizer. The tackifier is dispersed such that tackifier particles having a diameter of at least 10 μm in terms of roundness are not present in the plasticizer.
This thermoplastic elastomer composition comprises a thermally conductive filler (14) and a base polymer containing a styrenic thermoplastic elastomer and an ethylene-propylene rubber. The thermoplastic elastomer composition is characterized by containing 200 mass parts to 4000 mass parts of the thermally conductive filler (14) per 100 mass parts of the base polymer.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 μm or more and 20.0 μm or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less; and an average crystal grain size of the silver-nickel-potassium alloy plating layer is preferably 10 nm or more and 150 nm or less.
H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
A method for processing a lithium ion secondary battery according to the present invention comprises: a grinding and classification step (S02) in which a lithium ion secondary battery is ground and classified so as to obtain an electrode material that contains at least lithium; a leaching step (S03) in which the electrode material is immersed in an acid so as to obtain a leachate; a pH adjustment step (S04) in which the pH of the leachate is adjusted by adding lithium hydroxide thereto; a metal recovery step (S05) in which metals other than lithium are recovered from the leachate so as to obtain a lithium-containing liquid; and a lithium hydroxide recovery step (S06) in which lithium in the lithium-containing liquid is recovered in the form of lithium hydroxide. The lithium hydroxide recovered in the lithium hydroxide recovery step (S06) is used in the pH adjustment step (S04).
The invention includes a robot exterior body (1), a substrate (3) contained within the robot exterior body (1), and a heat transfer member (4) that is contained within the robot exterior body (1) and disposed between the robot exterior body (1) and the substrate (3), wherein: the robot exterior body (1) includes a heat sink (14); the heat sink (14) includes a heat release part (14a) exposed to the outside of the robot exterior body (1), and a heat receiving part (14b) opposed to the heat transfer member (4); and the heat transfer member (4) includes a first surface (41) connected to an arithmetic element (31) mounted on the substrate (3) and a second surface (42) connected to the heat receiving part (14b).
Provided is a heat flow switching element in which there is a larger change in thermal conductivity, and which has excellent thermal responsiveness. The heat flow switching element according to the present invention comprises: a temperature changing body 4 which includes a material or element that undergoes a change in temperature due to external energy; and a phase transitioning body 5 which is provided so as to contact the temperature changing body and undergoes a phase transition due to a temperature change. With respect to thermal conductivity measured by a thermoreflectance method and/or a flash method, the phase transitioning body has a higher thermal conductivity when undergoing a phase transition than in the phases before and after the phase transition. The heat flow switching element also comprises a first electrode 2 and a second electrode 3, and the temperature changing body is an electrical resistor that is provided between the first electrode and the second electrode and includes a material that generates heat due to current generated in response to a voltage applied between the first and second electrodes.
H10N 15/00 - Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
84.
CORROSION-RESISTANT TERMINAL MATERIAL FOR ALUMINUM CORE WIRE, METHOD FOR MANUFACTURING SAME, CORROSION-RESISTANT TERMINAL, AND ELECTRIC WIRE TERMINAL STRUCTURE
A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.
H01R 4/18 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
A chip discharging flute is formed in a tip outer peripheral portion of a drill body rotated around an axis in a drill rotation direction. A cutting edge is formed in an intersection ridgeline portion between a wall surface of the chip discharging flute facing the drill rotation direction and a tip flank. The cutting edge includes a main cutting edge portion extending from an inner peripheral side toward an outer peripheral side of the drill body, and a cutting edge shoulder portion extending from an outer peripheral end of the main cutting edge portion to an outer periphery of the drill body, and is subjected to honing. Compared to the outer peripheral end of the main cutting edge portion, in an outer peripheral end of the cutting edge shoulder portion, a true rake angle is increased on a negative rake angle side, and a size of the honing decreases.
An adhesive structure in which at least a portion of the surface thereof comprises an inorganic material, the elastic modulus of the surface is in the range of 0.01 GPa to 50 GPa, and the adhesive force, when a nanoindenter is used to press a spherical indenter having a diameter of 40 μm into the surface under the condition of a pressing depth of at least either 10 nm or 20 nm, is 35 N/cm2 or higher.
This copper alloy powder is formed from a copper alloy containing 5 to 50 mass% Ni. This copper alloy powder optionally contains 45 to 95 mass% Cu. This copper alloy powder optionally contains 1 to 42 mass% Zn. This copper alloy powder optionally contains no more than 7 mass% Mn.
This adhesive structure (10, 20) comprises: a base body (11, 21); and a protrusion section (12, 22) having a plurality of protrusions (13, 23) provided on the surface of at least a portion of the base body (11, 21). The adhesive structure is made of an inorganic material. The plurality of protrusions (13, 23) are arranged in a periodic fashion along a first direction and a second direction that is perpendicular to the first direction. The protrusions (13, 23) have a sharp section (14, 24) having a sharp tip. The average pitch between the protrusions (13, 23) along the first direction is within a range of 100 nm to 1500 nm. The average pitch of the protrusions (13, 23) along the second direction is within a range of 100 nm to 1500 nm. The average height of the protrusions (13, 23) is within a range of 100 nm to 2000 nm.
An adhesive structure (1) that is provided with a substrate (2) and triangular wave-shaped protrusions (3) provided to the surface of at least a portion of the substrate (2), and that comprises an inorganic material, wherein the average pitch of the triangular wave-shaped protrusions (3) is in the range of 100 nm to 1000 nm, and the average height of the triangular wave-shaped protrusions (3) is in the range of 100 nm to 1000 nm.
C09J 5/00 - Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
F16B 11/00 - Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
90.
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, BUS BAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE
This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio TLD/TTD is greater than 0.95 and less than 1.08. The half-softening temperature TLD is 210° C. or higher.
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
91.
COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, TERMINAL, HEAT DISSIPATION SUBSTRATE
This copper alloy contains 10-100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise; 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50. The electrical conductivity is 97% IACS or greater. The half-softening temperature is 200° C. or higher. The residual stress ratio RSG at 180° C. for 30 hours is 20% or greater. The ratio RSG/RSB at 180° C. for 30 hours is greater than 1.0.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
C09K 5/14 - Solid materials, e.g. powdery or granular
92.
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUS BAR, LEAD FRAME AND HEAT DISSIPATION SUBSTRATE
This copper alloy of one aspect contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, in which among the inevitable impurities, a S amount is 10 mass ppm or less, a P amount is 10 mass ppm or less, a Se amount is 5 mass ppm or less, a Te amount is 5 mass ppm or less, an Sb amount is 5 mass ppm or less, a Bi amount is 5 mass ppm or less, an As amount is 5 mass ppm or less, a total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less, a mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater, and a residual stress ratio at 150° C. for 1000 hours is 20% or greater.
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
93.
PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, AND TERMINAL
A copper alloy plastically-worked material comprises Mg in the amount of greater than 10 mass ppm and 100 mass ppm or less and a balance of Cu and inevitable impurities, that comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less, the electrical conductivity is 97% IACS or greater. The tensile strength is 200 MPa or greater. The heat-resistant temperature is 150° C. or higher.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
C21D 8/06 - Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of rods or wires
94.
HAFNIUM COMPOUND-CONTAINING SOL-GEL LIQUID AND HAFNIA-CONTAINING FILM
H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass
C23C 24/10 - Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
95.
CO2 SEPARATION AND RECOVERY METHOD AND CO2 SEPARATION AND RECOVERY DEVICE IN CEMENT PRODUCTION EXHAUST GAS
A CO2 separation/recover method in cement production exhaust gas has a step of harmful component removal that removes an acidic component and a harmful component from exhaust gas discharged from a cement production facility; and a step of CO2 separation and recover that separates and recovers CO2 by bringing the exhaust gas from which the acidic component and the harmful component are removed into contact with a CO2 absorption material, so that the acidic component and the harmful component are removed before separating and recovering CO2, resulting in deterioration of the absorbing ability of the CO2 absorption material being suppressed; and the cement production exhaust gas can be appropriately disposed.
B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
Provided are a thermistor element and a manufacturing method therefor that afford a favorable electrical connection between encapsulated electrodes and a thermistor chip, even for a type of encapsulation in an insulating pipe such as a glass pipe. This thermistor element comprises: a chip-shaped or plate-shaped thermistor chip 2; a pair of encapsulated electrodes 3 arranged opposite each other on upper and lower surfaces of the thermistor chip; and an insulating pipe 4 to both ends of which the pair of encapsulated electrodes are joined and inside which the thermistor chip is encapsulated. The thermistor chip is equipped with a chip-shaped or plate-shaped thermistor element body 2a, a pair of electrode films 2b that are formed on upper and lower surfaces of the thermistor element body, and an insulating protective film 2c formed on an outer peripheral surface of the thermistor element body and on the pair of electrode films. At least a portion of the protective film on the inside of a ridgeline of the thermistor element body in the plane of the electrode films is removed to expose the electrode films, thereby establishing contact between an electrode-film exposed section 2d and the encapsulated electrodes.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
97.
THERMISTOR ELEMENT AND METHOD FOR MANUFACTURING SAME
Provided are a thermistor element and a method for manufacturing the same, the thermistor element having good electrical connection and high mountability, and in which formation of oxygen deficiency is suppressed. A thermistor element according to the present invention comprises: a chip-shaped or plate-shaped thermistor element body 2a; a pair of electrode films 2b formed on upper and lower surfaces of the thermistor element body; and an insulating protection film 2c formed on an outer peripheral surface of the thermistor element body and on the pair of electrode films. An electrode-film-exposed portion 2d is provided in at least the center in the plane of the electrode film from which the protection film is removed. Further, the protection film is formed of a material of which the adhesive strength with the electrode film is smaller than with the thermistor element body.
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
98.
METALLIC INK, METHOD FOR PRODUCING METALLIC INK, METHOD FOR PRODUCING METALLIC LAYER, AND METALLIC LAYER
The present invention enables a metallic ink to be adequately stored for a long period while inhibiting the metal particles from aggregating. The metallic ink (10) comprises metal particles (12), a medium (16), an organic medium (18) which has a boiling point at atmospheric pressure of 150°C or higher and is miscible with water, and a polyhydric alcohol (14) which has two or more OH groups and is soluble in water and ethanol.
B22F 9/00 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor
B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/107 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
99.
METHOD FOR UTILIZING CO2 IN EXHAUST GAS FROM CEMENT PRODUCTION, AND CO2 UTILIZING SYSTEM
Generating methane by adding hydrogen to CO2 in exhaust gas discharged a from cement production facility or CO2 that is separated and recovered from the exhaust gas, and using the methane as an alternative fuel to fossil fuel such as coal, petroleum, natural gas and the like, by methanation of CO2 in the exhaust gas from the cement production facility that includes exhaust gas originated from lime stone not from the fossil oil and effectively utilizing it, it is possible to reduce usage of the fossil fuel, suppress CO2 originated from energy, and improve an effect of reducing greenhouse gas.
C07C 1/12 - Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon from oxides of carbon from carbon dioxide with hydrogen
