There is disclosed a method of placing a substrate into a controlled conductivity plasma electrolytic oxidation (PEO) bath configured for the substrate; wherein the PEO bath includes a nitrogen containing organic compound, and applying a voltage for a period of time to produce a substantially continuous nitride or nitrogen compound containing PEO layer of between about 1 to about 100 microns thick on the substrate. The substrates are preferably magnesium, titanium, or aluminium. The PEO process is preferably carried out under alkaline conditions and at voltages of less than about 160 volts.
The invention relates to a method for providing a conductive surface on a non-conductive surface, in particular a polymeric surface. In particular the method relates to attaching silver ions to a polymeric surface to facilitate the adhesion of a metallic layer to the polymeric surface.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between 1 to 50 microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between 8 and 14, applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.
In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.
There is disclosed a method of placing a substrate into a controlled conductivity plasma electrolytic oxidation (PEO) bath configured for the substrate; wherein the PEO bath includes a nitrogen containing organic compound, and applying a voltage for a period of time to produce a substantially continuous nitride or nitrogen compound containing PEO layer of between about 1 to about 100 microns thick on the substrate. The substrates are preferably magnesium, titanium, or aluminium. The PEO process is preferably carried out under alkaline conditions and at voltages of less than about 160 volts.
There is disclosed a method of placing a substrate into a controlled conductivity plasma electrolytic oxidation (PEO) bath configured for the substrate; wherein the PEO bath includes a nitrogen containing organic compound, and applying a voltage for a period of time to produce a substantially continuous nitride or nitrogen compound containing PEO layer of between about 1 to about 100 microns thick on the substrate. The substrates are preferably magnesium, titanium, or aluminium. The PEO process is preferably carried out under alkaline conditions and at voltages of less than about 160 volts.
In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between (1) to (50) microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between (8) and (14), applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.
C25D 11/30 - Anodisation of magnesium or alloys based thereon
C25D 3/22 - Electroplating; Baths therefor from solutions of zinc
C25D 3/46 - Electroplating; Baths therefor from solutions of silver
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 5/16 - Electroplating with layers of varying thickness
C25D 5/18 - Electroplating using modulated, pulsed or reversing current
C25D 9/12 - Electrolytic coating other than with metals with inorganic materials by cathodic processes on light metals
C25D 13/18 - Electrophoretic coating characterised by the process using modulated, pulsed or reversing current
In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between (1) to (50) microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between (8) and (14), applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.
C25D 11/30 - Anodisation of magnesium or alloys based thereon
C25D 3/12 - Electroplating; Baths therefor from solutions of nickel or cobalt
C25D 3/46 - Electroplating; Baths therefor from solutions of silver
C25D 3/38 - Electroplating; Baths therefor from solutions of copper
C25D 3/22 - Electroplating; Baths therefor from solutions of zinc
C25D 9/12 - Electrolytic coating other than with metals with inorganic materials by cathodic processes on light metals
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 5/16 - Electroplating with layers of varying thickness
C25D 5/18 - Electroplating using modulated, pulsed or reversing current
C25D 13/18 - Electrophoretic coating characterised by the process using modulated, pulsed or reversing current
In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.
C25D 3/12 - Electroplating; Baths therefor from solutions of nickel or cobalt
C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 5/16 - Electroplating with layers of varying thickness
C25D 5/18 - Electroplating using modulated, pulsed or reversing current
C25D 9/04 - Electrolytic coating other than with metals with inorganic materials
C25D 11/04 - Anodisation of aluminium or alloys based thereon
C25D 11/08 - Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.
C25D 11/04 - Anodisation of aluminium or alloys based thereon
C25D 11/08 - Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
C25D 9/04 - Electrolytic coating other than with metals with inorganic materials
C25D 3/12 - Electroplating; Baths therefor from solutions of nickel or cobalt
C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 5/16 - Electroplating with layers of varying thickness
C25D 5/18 - Electroplating using modulated, pulsed or reversing current
C25D 13/18 - Electrophoretic coating characterised by the process using modulated, pulsed or reversing current
The present invention relates to a method for producing a polymer, polymers and metal-polymer composites produced by the method. The method comprises providing one or more polymerisable monomers and providing a substrate comprising an activated metal surface, the activated metal surface comprising one or more compounds capable of initiating polymerisation of the one or more polymerisable monomers. The method comprises contacting the activated metal surface and the one or more polymerisable monomers to polymerise the one or more polymerisable monomers, thereby producing the polymer.
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
B29C 41/02 - Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
12.
METHOD TO CREATE THIN FUNCTIONAL COATINGS ON LIGHT ALLOYS
In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.
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