Goods & Services

Chemical products for industrial, scientific purposes; coating compositions [chemicals], other than paints; ceramic materials in the form of powders for industrial purposes. Powder coatings in the form of inorganic coatings; anti-corrosive products for metals; preparations for use as preservatives against atmospheric oxidation; corrosion inhibitors in the nature of a coating; preparations for coating surface to protect against corrosion. Base metals and their alloys; metals in powder form. Machine tools; powder handling apparatus [machines]; coating machines; spray guns for powder coatings. Treatment and coating of metal surfaces; coating of steel; applying wear-resistant coatings to machine components; application of wear-resistant coating agents on metal and plastics; powder coating; treatment of metal parts to prevent corrosion by means of powder coating; treatment of metal parts for corrosion protection. Scientific and technological services and research; development of coatings for non-metals; development of coatings for metals.

Goods & Services

Agents for use in soldering in microelectronic industry; chemical agents in paste form for use in soldering in microelectronic industry. Lead-free solders for the microelectronic industry, in particular microelectronic chip industry, in particular tin comprising solders; solder pastes and printing-pastes of lead-free alloys for wave soldering, THT-soldering, through-hole technology-soldering, and SMD-soldering, surface mounted technology soldering comprising solder metal and its alloys with added flux for printing of electroconductive connections of electronic components, in particular in chip-industry, semiconductor-industry, consumer electronic-industry and automotive-industry; solder pastes and printing-pastes of lead-free alloys comprising solder metal and its alloys with added flux for depositing, in particular printing of connections of electroconductive connections of electronic components in semiconductor-industry to be soldered semi-automatically or fully automatically after placement; soft solder pastes and printing-pastes of lead-free alloys comprising solder metal and its alloys with added flux for depositing, in particular printing of electroconductive connections of electronic components in semiconductor-industry to be soldered semi-automatically or fully automatically after placement, comprising solder metal and its alloys in form of a powder having a particle size of less than 100 micrometer of tin, copper, zinc and/or silver or an alloy of at least two of the metals; solder pastes and printing-pastes of lead-free alloys comprising solder metal and its alloys with added flux for printing of electroconductive connections of electronic components in industry, such as microelectronic contacts and/or microelectronic conducting paths, in particular in stencil printing, screen printing, mask printing processes, in particular each followed by a heating up to less than 300 degrees-Celsius, in particular the solder metal and its alloys comprising tin, copper, zinc and/or silver or an alloy of at least two of the metals; solder pastes and printing-pastes of lead-free alloys comprising solder metal and its alloys with added flux for printing of electroconductive connections of electronic components in industry, in particular in microelectronic industry, preferred in microelectronic semiconductor chip industry, consumer electronic industry, semiconductor-industry, and/or automotive industry, in particular the solder metal and their alloys comprising tin, copper, zinc and/or silver or an alloy of at least two of the metals, particularly iron and lead-free solder and printing paste; common metals, precious metals, wherein the precious metals are selected from gold, silver, rhodium, ruthenium, palladium, osmium, iridium, and platinum and their alloys in powder form, free from iron and free from lead, wherein the particles of the powder having a particle size of less than 50 micrometer for use in depositing pastes, printing pastes and printing inks for the production of electronic conducting paths and/or electronic conducing contacts in microelectronic industry, in particular for use in chip-production with pitches or line space below 300 micrometer; all goods preferred for use in chip-production with pitches or line space from 100 nanometer up to 200 micrometer; all goods preferred for use in processes for the production in microchip industry for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), in particular comprising as metals tin, copper, zinc and/or silver or an alloy of at least of two of the metals; solder pastes and printing-pastes of lead-free alloys comprising common metals, precious metal solder, wherein the precious metals are selected from gold, silver, rhodium, ruthenium, palladium, osmium, iridium, and platinum and alloys in powder form with added flux, wherein the metals and alloys are free from iron and free from lead, wherein the particles of the powder having a particle size of less than 50 micrometer, in particular pastes and printing-pastes according to Industry Specifications, such as IPC, preferred IPC J-STD-005A:2012-02-14 classes T5 to T8 and/or IPC J-STD-001; solder pastes and printing-pastes of lead-free alloys predominantly comprising soft solder in the form of spherical particles in a dispersing media with added flux, in particular organic flux of mixture of solvents and resins and optional activated chemicals to provide solder pastes and printing-pastes of lead-free alloys viscosity for depositing, in particular by printing, wherein the spherical particles have an aspect ratio of the diameters of nearly 1; solder pastes and printing-pastes of lead-free alloys comprising soft solder in the form of spherical particles with added flux, wherein the particles are obtained in a dispersion process in which liquid metal or liquid alloy is dispersed in a dispersing media, wherein the flux comprises organic flux to provide solder pastes and printing-pastes of lead-free alloys a viscosity for depositing; preferred all goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC); soft solder for microelectronic application in the form of a printable paste for use in microelectronic application, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; in particular all of the above mentioned goods comprising tin; in particular all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and/or iron-containing components, in particular in the field of gas and water pipes.

Goods & Services

Semiconductor testing apparatus; material testing apparatus; probes for testing semiconductors; contacts, electric; conductors, electric. Precious metals and their alloys; precious metal alloys for use in electronic technology; palladium alloys; precious metal alloys [other than for use in dentistry].

Goods & Services

Chemical products for industrial purposes; putties and other paste fillers. Gasket material; packing materials; insulating materials; material for electrical insulation; cements for use as insulating and coating compounds in electronics.

Goods & Services

Chemical products for industrial use; chemical preparations and materials for film, photography and printing; industrial chemicals used in industry and science; chemical compositions for use in the manufacture of electronic components; chemical preparations having conductive properties; printing chemicals; chemicals for use in the electronics industry; chemicals for use in printing; chemicals used for plating non-conducting surfaces with metals. Printing ink; printer paste [ink]; inks for printing, marking and engraving; ink jet printer ink; metallic inks; metallic printing inks; paints [other than insulating] for electronic components; conductive paints; printing ink with electric conductivity; ultra violet light-cured printing inks. Industrial machines for printing and dyeing; equipment for the manufacture of devices for the electrostatic and electronic industry; ink jet printing machines; industrial ink jet printing machines; industrial printing machines. Apparatus and instruments for conducting, switching, transforming, storing, regulating or controlling the distribution or use of electricity; electrically conductive materials for electrical sources; electrical devices in the form of electrical circuits and their controllers; ink jet printers; integrated circuit modules; passive electronic circuits; printed electronic circuits; ink jet printers; electrical and electronic components; electronic circuit boards; printed circuit boards; circuit boards provided with integrated circuits; electronic circuit cards; electronic logic circuits; electronic circuits; electronic control circuits; integrated circuits; integrated electronic circuits; printed electrical circuits. Electromagnetic interference shielding gaskets. Printing; printing services; digital printing; printing of electronic components for mobile phones; printing of electronic components for communication devices; custom 3D printing for others; (3D) printing services. Scientific and technological services and research and design relating thereto; research and exploitation for commercial electronic applications; chemical research; development of industrial processes; industrial development services; industrial research; technical consultancy relating to the use of materials for the preparation of electronic circuitry; technical consultancy in the design of machinery for electronic circuitry manufacture; chemistry consultation; product development consultation; component testing; engineering research; engineering services.

Goods & Services

Alloys of rare earth metals; pastes containing metal-filed glass for use in industry (terms considered too vague by the International Bureau - rule 13 (2) (b) of the Common Regulations). Aluminium and its alloys; wrought common metals; metals in foil or powder form for 3D printers; cast iron, unwrought or semi-wrought; casting alloys; building castings of metal; building castings of metal alloys; semi-finished articles of aluminium or its alloys; semi-finished articles of copper or its alloys; semi-finished articles of nickel or its alloys; alloys of metal containing calcium and aluminium; non-ferrous metals and their alloys; alloys of common metal; metals in powder form for 3D printers; alloys of metal; common metals, unwrought or semi-wrought; titanium and its alloys; metals; common metals and their alloys; common metals and their alloys including stainless steel; architectural hardware made of common metals and alloys thereof. Medical instruments; medical apparatus and instruments. Iridium and its alloys; alloys of precious metal; palladium and its alloys; ornaments [jewellery]; clocks. Structural elements of glass; building materials consisting of glass; glass powder for building purposes. Die-casting of metals; metal casting; custom manufacture of metal hardware; metal pressing; metal treating; heat treatment of metals; metal finishing; metal melting services; metalworking; metallurgical processing; recycling of metals. Metallurgical laboratory services; engineering services; metallurgical analysis; engineering services relating to metal forming systems.

Goods & Services

Metal wire; copper wire, not insulated. Solar moduls for electricity generation; solar wafer; solar module; solar cell plates; photovoltaic solar modules; electrical solar cells; crystalline silicon solar cells; solar panels for the production of electricity; solar cells for the generation of electricity; photovoltaic apparatus and installations for generating solar electricity; photovoltaic modules; electrical conductors; electric wire; electric cable; electric contacts; materials for electricity mains; connectors [electricity]; plastic coated wire; rubber covered electric wires; metallic ribbon for use in photovoltaic cells and modules; electrical conductor plates; copper wire, insulated. Generation of electricity; electricity generation from solar energy.

Goods & Services

Chemical preparations for use in industry; chemical preparations and materials for film, photography and printing; unprocessed plastics; adhesives for use in industry; chemical substances, chemical materials and chemical preparations; salts for industrial purposes; unprocessed artificial and synthetic resins; chemicals for use in electrophotography; conductive resins. Dyes, colorants, pigments and inks; materials for use as constituents of printing inks; printing pastes. Semi-worked plastic substances; foils of plastics [semi-finished products]; artificial resins in the form of sheets for use in manufacture.

Goods & Services

Metal-ceramic composite materials, metal predominating.

Goods & Services

Substrate mainly consisting of metal for the production of LED arrays. Apparatus and instruments for conducting, switching, converting, storing, regulating and controlling electricity.

Goods & Services

Chemical products for industrial use; adhesives for industrial use; pastes (chemical products) containing metal powders for industrial use; conductive adhesives.

Goods & Services

Digital recording media; digitally printed electronics, namely printed circuit boards, printed electrical circuits, printed circuits, printed circuit cards and printed wiring boards.

Goods & Services

Common metals in powder form, soft solder for micro electronic application, hard solder for micro electronic application, precious metals in powder form.

Goods & Services

Metal-matrix composite materials for use in the electronics industry; metal-ceramic substrates for use in the electronics industry.

Goods & Services

Metal matrix composite materials and metal-ceramic substrates for use in the electronic industry.

Goods & Services

Common metals and their alloys, amorphous metals, sheet metals in foil and powder form for 3D printers, metal alloys for further processing. Machine tools for working metal. Precious metals and their alloys.

Goods & Services

Catalysts, namely, catalysts for chemical and biochemical processes.

Goods & Services

Paints, varnishes, lacquers; anti-rust preparations, wood preservatives; dyes; mordants; metal in foil and powder form for painters, decorators, printers and artists; silver polymer paste; silver resinate paste; silver spray solutions. Precious metals and the alloys thereof; articles of jewellery; gemstones; watches; chronometric instruments.

Goods & Services

Bond wire.

Goods & Services

Chemicals used in industry and science; chemicals used in connector systems; tempering, soldering and sintering preparations; metal pastes, as far as contained in this class; soldering pastes; conductive pastes, as far as contained in this class; adhesives used in industry. Precious metal compounds for connector systems; electric contact materials with a precious metal base. Precious metals, precious metal alloys and precious metal compounds, not for connector systems; precious metals, precious metal alloys and precious metal compounds in the form of powders and pastes made from these powders.

Goods & Services

Chemicals used in industry, in particular for the production and processing of conductive materials; chemical products for electrophotography; toner resins for electrophotography; unprocessed synthetic resins in the form of powder, paste, granules, liquids, emulsions; dispersions of conductive polymers in organic or inorganic solvents or water, dispersions of 3,4-polyethylenedioxythiophen or polyaniline in organic or inorganic solvents or water. Printing inks or printing pastes (inks) comprising conductive polymers and solvents or water, colored, colorless and transparent formulations of conductive polymers which are used for the coating of surfaces; printing inks or printing pastes (inks) comprising 3,4- polvethylenedioxythiophen or polyaniline and solvents or water; colored, colorless and transparent formulations of 3,4-polyethylenedioxythiophen or polyaniline which are used for the coating of surfaces. Lighting apparatus incorporating light emitting diodes, which contain a coating of conductive polymers, 3,4-polyethylenedioxythiophen or polyaniline. Plastic materials for packaging (not included in other classes); plastic films for packaging. Plastics in extruded form for use in manufacture (plastic films as semi-finished products); plastic films other than for packaging. Goods of plastic, not included in other classes; all the aforementioned goods not for use with regard to furniture.

Goods & Services

Material treatment, particularly recycling of noble metals, including partial processes of the recycling; preparations of samples by treatment of material, particularly noble metal samples, for analysis; homogenisation of noble metal containing material. Execution of chemical analyses, particularly from noble metal samples.

Goods & Services

Recycling of precious metal.

Goods & Services

Produits chimiques destinés à l'industrie. Métaux communs et leurs alliages, notamment toiles et tricots pour catalyseurs de réactions chimiques et pour la récupération de métaux. Métaux précieux, notamment toiles et tricots pour catalyseurs de réactions chimiques et pour la récupération de métaux.

Goods & Services

Pièces détachées pour circuits électroniques, en particulier pour circuits intégrés ainsi que pour circuits hybrides et cartes de circuits imprimés; substrats et supports pour lesdits circuits.

Goods & Services

Platine ou alliages à base de platine et de métaux de la mine du platine; lingots, produits bruts, mi-ouvrés et produits finis réfractaires en platine ou alliages comportant principalement du platine (non compris dans d'autres classes) pour l'industrie du verre fondu.

Goods & Services

Catalyseurs.