A fuse element includes a low-melting-point metal plate, a first high-melting-point metal layer, and a second high-melting-point metal layer. The low-melting-point metal plate has a first main surface, a second main surface, a first side surface, and a second side surface. The first main surface and the second main surface face each other. The first side surface and the second side surface face each other and each connect the first main surface and second main surface. The first high-melting-point metal layer is disposed on the first main surface and second main surface. The second high-melting-point metal layer is disposed on the first side surface and second side surface. The fuse element has a cut-out portion in which at least a portion of the second high-melting-point metal layer is cut out.
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
2.
HEAT-CONDUCTIVE SHEET, HEAT-CONDUCTIVE SHEET PRODUCTION METHOD, AND ELECTRONIC EQUIPMENT
A heat-conductive sheet includes a binder resin and a fibrous filler having a major axis and dispersed in the binder resin. The major axis of the fibrous filler is arranged at an angle of 70 to 90 degrees with respect to a surface direction of the heat-conductive sheet when viewed in a cross-section along a thickness direction of the heat-conductive sheet. If the heat-conductive sheet is processed to a shape having a thickness of 2 mm and a diameter of 29 mm, and subject to a compression such that the thickness is decreased by 40% of the thickness before the compression, at room temperature for 24 hours, a difference of an angle of the major axis of the fibrous filler after release of the compression and an angle of the major axis of the fibrous filler before the compression is in a range within 10 degrees.
By coating a flux in an appropriate manner, fusing occurs swiftly and reliably due to an increased cross-sectional area of a fuse element. The present invention comprises an insulated substrate (2), a heat-generating body (4), an insulating layer (5) that covers the heat-generating body (4), an intermediate electrode (6), a fuse element (3), a cap member (30), and a flux (7). The cap member (30) has a protrusion (31) that is erected opposite the intermediate electrode (6). The intermediate electrode (6) has a greater length than the width of the fuse element (3) in a direction that is orthogonal to the electric conduction direction of the fuse element (3), at least one end portion (6a, 6b) protruding beyond the fuse element (3). The protrusion (31) is provided at a position that is opposed to a position of the intermediate electrode (6) where the fuse element (3) is mounted, and at a position that is opposed to the end portions (6a, 6b) where the fuse element (3) is not mounted.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
4.
LAMINATE MANUFACTURING METHOD, AND LAMINATE MANUFACTURING DEVICE
This laminate manufacturing method comprises: a bonding step in which a laminated film having a base material film and an inorganic layer laminated on the base material film is bonded to a substrate; and a cutting step in which the laminated film is cut to match the shape of the substrate. During the cutting step, a cutting tool is heated to a temperature not lower than 65ºC below the softening point temperature of the base material film, and the laminated film is cut.
This method for producing a laminate comprises: a first step, in which a layered film comprising a base film and an inorganic layer formed on the base film is pressed on a first midpoint between a first end and second end of a substrate, using a pressing tool, and the pressing tool is moved from the first midpoint toward the first end while being pressed on the layered film; a second step, in which the pressing tool is moved to a second midpoint between the first end and the second end, without being pressed on the layered film; and a third step, in which the pressing tool is moved from the second midpoint toward the second end while being pressed on the layered film.
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
This optical multilayer body is sequentially provided with a transparent base material, an adhesion layer, a first high refractive index layer, a first low refractive index layer, a second high refractive index layer and a second low refractive index layer in this order; and this optical multilayer body is additionally provided with an oxynitride layer, which is formed of an oxynitride of Si, on a surface of the second low refractive index layer, the surface being on the reverse side from the transparent base material.
A thermally-conductive sheet includes: a binder; and an anisotropic thermally-conductive filler. The anisotropic thermally-conductive filler is oriented in a thickness direction of the thermally-conductive sheet An arithmetical mean height Sa is 5 μm or less and a maximum height Sz is 50 μm or less on either surface of the thermally-conductive sheet. A dielectric breakdown voltage of the thermally-conductive sheet is 0.5 kV/mm or higher.
A thermally conductive sheet includes a binder resin and boron nitride flakes. The boron nitride flakes are oriented in a thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet are tacky. A method for manufacturing a thermally conductive sheet includes preparing a thermally conductive composition containing a binder resin and boron nitride flakes. A molded block is formed from the thermally conductive composition. The molded block is sliced into a sheet shape to obtain a thermally conductive sheet precursor. The thermally conductive sheet precursor is pressed to obtain a thermally conductive sheet.
A method for producing a heat transfer sheet, includes: (A1) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B1) slicing the molded body into a sheet shape to obtain a molded sheet; (C1) pressing the molded sheet; and (D1), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.
[Problem] To enable beam steering to narrow down an irradiation area within a range measurement target area in a light irradiation device that does not use a lens unit. [Solution] Provided is a light irradiation device 2 that is provided in an optical ranging device 1 and that irradiates light onto a range measurement target area 5, the light irradiation device 2 comprising: a light source 20; and a light distribution element 30 that bends light from the light source 20 toward the range measurement target area 5 in a plurality of bending directions.
A heat conductive composition according to the present invention contains a thermoplastic resin, a rosin-based resin, heat conductive particles, and low-melting-point metal particles, wherein the thermoplastic resin and the rosin-based resin include a volatile component, and the content ratio of the volatile component is 5.0 wt% or less.
A connection structure 1 in which an electrode 11 of an electronic component 10 and an electrode 21 of a substrate 20 are connected by a connecting material 2' derived from a conductive particle-containing layer in which conductive particles are held in an adhesive material has, in the plan view of the connection surface of the electrode 11 of the electronic component 10 and the electrode 21 of the substrate 20, a region 5' in which the connecting material 2' derived from the conductive particle-containing layer does not exist between adjacent electrodes 11a, 11b in the electronic component 10. In a method for manufacturing the connection structure 1, a connecting material 2 in which conductive particles are held in the adhesive material is disposed on the electrode 11 of the electronic component 10 or the electrode 21 of the substrate 20, and a region 5 in which the connecting material 2 does not exist between the adjacent electrodes 11a, 11b in the electronic component 10 or adjacent electrodes 21a, 21b in the substrate 20 are formed, and the connecting material 2 is sandwiched by electrodes 11, 21 and crimping, etc., is performed.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
13.
PROTECTIVE ELEMENT AND METHOD FOR MANUFACTURING PROTECTIVE ELEMENT
Provided is a protective element capable of quickly and reliably melting and cutting even when the size of the cross-sectional area of a fuse element increases. This protective element 1 has: an insulating substrate 2; a heating body 4 provided on a surface 2a side of the insulating substrate 2; an insulating layer 5 which covers the heating body 4; an intermediate electrode 6 provided on the insulating layer 5; a fuse element 3 connected to the intermediate electrode 6; and a flux 7 provided on the fuse element 3, wherein the intermediate electrode 6 has a length which is the same as or greater than that of the heating body 4 in a direction perpendicular to the energization direction of the fuse element 3 and has a front-end section 4 extending further than the heating boy 4, and the flux 7 is applied, in a direction perpendicular to the energization direction of the fuse element 3, to pass the fuse element 3 and at least up to the same position as the heating body 4.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H02H 7/18 - Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from norm for accumulators
14.
DISPLAY DEVICE AND DISPLAY DEVICE MANUFACTURING METHOD, AND CONNECTING FILM AND CONNECTING FILM MANUFACTURING METHOD
Provided are: a display device and a display device manufacturing method with which it is possible to obtain excellent light transmission and visibility; and a connecting film, and a connecting film manufacturing method. This display device comprises a plurality of light emitting elements (30), a wiring substrate (20), and a cured film (40) of a connecting film that connects the plurality of light emitting elements (30) and the wiring substrate (20), wherein the cured film (40) has a first surface (40a) for which the root mean square height is 3.0×10-1 μm or lower, and the plurality of light emitting elements (30) are mounted on the first surface 40a. This makes it possible to suppress light scattering and to obtain excellent light transmission and visibility.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
A connected structure 1 wherein electrodes 11 of an electronic component 10 are connected to electrodes 21 of a substrate 20 by a connecting material 2' derived from electroconductive particles coated with a pressure-sensitive adhesive material, the connected structure 1 having been configured so that in a plan view of the connection surfaces of each electrode 11 of the electronic component 10 and the electrode 21 of the substrate 20, the area of the connecting material 2' is less than 120% of the area of the electrode 11 of the electronic component 10. The connected structure 1 can be obtained by disposing electroconductive particles 2 coated with a pressure-sensitive adhesive material, in the state of particles or in the form of pieces, on the electrodes 11 of the electronic component 10 or on the electrodes 21 of the substrate 20, sandwiching the electroconductive particles 2 coated with a pressure-sensitive adhesive material between the electrodes 11 of the electronic component 10 and the electrodes 21 of the substrate 20, and heating or pressing the stack to connect the electrodes.
Provided are a mask with which superior workability and transferability of individual pieces can be achieved, a mask manufacturing method, a display device manufacturing method, and a display device. A curable resin film (22) that is provided on a substrate (21) is irradiated with a laser beam from the substrate (21) side, using a mask in an opening that allows the laser beam to pass through, said mask having a light blocking section of a prescribed shape that blocks the laser beam and transmitting the laser beam at the periphery of the light blocking section. The curable resin film (22) in the irradiated section is removed (removed section (23)), and individual pieces that have prescribed shapes, comprise the curable resin film (22), and have a reaction percentage of 25% or less are formed on the substrate (21). Thus, superior workability and transferability of individual pieces can be achieved, and takt time can be improved.
B23K 26/066 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
B23K 26/361 - Removing material for deburring or mechanical trimming
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
17.
METHOD FOR PRODUCING INDIVIDUALIZED FILM, INDIVIDUALIZED FILM, METHOD FOR PRODUCING DISPLAY DEVICE, AND DISPLAY DEVICE
The present invention provides: a method for producing an individualized film, the method enabling the achievement of excellent processability of an individualized piece; an individualized film; a method for producing a display device; and a display device. According to the present invention, an anisotropic conductive film (22) that is provided on a base material (21) is irradiated with laser light from the base material (21) side so as to remove the anisotropic conductive film (22) (a removal part (23)) in the irradiated portion, thereby forming an individualized piece which is formed of the anisotropic conductive film (22) and has a predetermined shape. Meanwhile, the thickness of the anisotropic conductive film (22) is 1 µm to 10 µm; the melt viscosity of the anisotropic conductive film (22) at 30°C is 2,000 Pa∙s to 800,000 Pa∙s; and 90% or more of conductive particles in the anisotropic conductive film (22) are present on the average value of the center positions of the conductive particles in the thickness direction of the anisotropic conductive film (22). Consequently, the present invention enables the achievement of excellent processability of an individualized piece, thereby being capable of improving the takt time.
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
C07C 271/16 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of hydrocarbon radicals substituted by singly-bound oxygen atoms
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 20/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
C09K 5/14 - Solid materials, e.g. powdery or granular
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
19.
DIFFUSER PLATE, DISPLAY DEVICE, PROJECTING DEVICE, AND LIGHTING DEVICE
To reduce unevenness in a luminance distribution in two directions of microlenses disposed in a form of a rectangular grid to improve uniformity of light distribution. Provided is a diffuser plate of a microlens array type including a base material, and a microlens array composed of a plurality of microlenses disposed on an X-Y plane on at least one surface of the base material using a rectangular grid as a reference, in which grid intervals Wx in an X direction of the microlenses disposed in the X direction of the rectangular grid are different from each other, grid intervals Wy in a Y direction of the microlenses disposed in the Y direction of the rectangular grid are different from each other, and surface shapes of the plurality of microlenses are different from each other.
Provided are an anisotropic conductive film, a connection structure, and a method for producing a connection structure, that, in the case of high-pressure mounting, suppress increases in the continuity resistance value, avoid the generation of gaps between the anisotropic conductive film and terminals, and enable the long-term retention of connection reliability. The anisotropic conductive film according to the present invention comprises (A) an epoxy resin, (B) an epoxy resin curing agent having a melting point of at least 60°C, (C) (meth)acrylate monomer, and (D) a radical polymerization initiator, and has a glass transition temperature of at least 85°C and a minimum melt viscosity of 20,000 Pa·s to 90,000 Pa·s.
C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
This protective element comprises: first and second terminals arranged away from each other in a back-and-forth direction; a fuse element that is disposed between the first and second terminals and electrically connects the first and second terminals, and that is fused when a prescribed current or more flows therethrough; an insulation member disposed to face the fuse element from both sides in an up-and-down direction orthogonal to the back-and-forth direction; a heat generating element disposed to be superposed on the fuse element in the up-and-down direction; a power supply member for supplying current to the heat generating element; and an insulating case that stores a part of the first terminal, a part of the second terminal, the fuse element, the insulation member, the heat generating element, and a part of the power supply member. The heat generating element receives current from the power supply member to generate heat, and melts and fuses at least a part of the fuse element.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
H01H 85/12 - Two or more separate fusible members in parallel
This laminate comprises: a first base material; a heat transfer particle-containing layer that is disposed on the first base material, and contains heat transfer particles; and a second base material that is disposed on the heat transfer particle-containing layer. At least a part of a surface, of at least one of the first base material and the second base material, that is on the side of the heat transfer particle-containing layer has a recess communicating with the outer periphery of at least one of the first base material and the second base material.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
This electromagnetic interference absorber comprises a dielectric layer that contains a high-loss material and a resin in which a low dielectric material is dispersed, and an electromagnetic wave reflection layer; and the dielectric layer has a relative dielectric constant of 15 or less, a relative magnetic permeability of 1 or less, a dielectric loss tangent of 0.1 or less and a magnetic loss tangent of 2 or less. It is preferable that the content of the high-loss material in the dielectric layer is 10% by volume to 40% by volume, and that the content of the low dielectric material in the dielectric layer is 10% by volume to 40% by volume.
An optical device capable of achieving desired polarization properties including a light source, incident-side polarizing element, optical modulating element, emission-side first polarizing element, and emission-side second polarizing element, the first and second polarizing elements each have a wire-grid structure and include a plurality of convex portions arranged on a transparent substrate and spaced apart from each other at a pitch shorter than the wavelength of light in the light source, the transmission axis of the first polarizing element relative to the transmission axis of the incident-side polarizing element is within ±8.5°, and the convex portions of the second polarizing element are lattice-shaped extending in a predetermined direction and include, in order from the transparent substrate side, a reflection layer, dielectric layer, and absorption layer, the rotation angle of the absorption axis of the second polarizing element relative to the absorption axis of the incident-side polarizing element is within ±0.7°.
There is provided a novel and improved optical body, master, and method for manufacturing an optical body in which the anti-reflection characteristics are improved even further, and fabrication is facilitated, the optical body having a concave-convex structure in which structures having convex shapes or concave shapes are arrayed on an average cycle less than or equal to visible light wavelengths. The structures have an asymmetric shape with respect to any one plane direction perpendicular to a thickness direction of the optical body. Accordingly, the anti-reflection characteristics are improved even further, and fabrication is facilitated.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
Provided is a smart card for which: the adhesive strength of an IC chip module can be improved even under low pressure; and deformation of the card can be prevented with the increased fluidity of a conductive adhesive. This smart card comprises: a card body 2 that incorporates an antenna coil 3; and an IC chip module 4 that is provided with an antenna connection terminal 5 which is electrically connected to the antenna coil 3, and that is housed in a recessed housing section 6 provided in the card body 2. The antenna coil 3 and the antenna connection terminal 5 are electrically connected via a conductive adhesive 9 in which conductive particles 8 are mixed into a binder resin 7. The antenna connection terminal 5 has formed therein an opening 10 that is wider than the average particle diameter of the conductive particles 8.
A manufacturing method for a light emitting device that has a black matrix in at least a portion of the periphery of light emitting elements that are positioned on a wiring board, said manufacturing method having: (step a) a step in which a black transfer film that has a black transfer layer formed on one surface of a light-transmissive substrate is made to face, from the black transfer layer side, the wiring board before the light emitting elements are positioned thereon; (step b) a step in which a laser is shined on the light-transmissive substrate side of the black transfer film, thereby transferring individual pieces of the black transfer layer to locations on the wiring board where the light emitting elements will be positioned; and (step c) a step in which the light emitting elements are positioned on the individual pieces of the black transfer layer that were transferred onto the wiring board, and the light emitting elements are mounted, thereby deforming the black transfer layer to form a black matrix in at least a portion of the periphery of the light emitting elements and connecting the light emitting elements to the wiring board.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Provided is a wire grid polarizing element excellent in heat dissipation and excellent in transmissivity and polarization splitting properties for oblique incident light at wide-range incident angles. A wire grid polarizing element 1 of a hybrid type made of an inorganic material and an organic material includes a substrate 10 made of the inorganic material, a grid structural body 20 made of the organic material and including a base part 21 provided on the substrate 10 and a plurality of ridge portions 22, the base part and the ridge portions being integrally formed, and a functional film 30 made of a metal material and covering part of the ridge portion 22. The ridge portion 22 has an upward narrowing shape that narrows in width with distance from the base part 21. The functional film 30 covers and wraps the top of the ridge portion 22, and does not cover a bottom side of the ridge portion 22 and the base part 21. A surface of the functional film 30 is rounded and bulges in a width direction of the ridge portions 22. A maximum width (WMAX) of the functional film 30 is more than or equal to a bottom width (WB) of the ridge portion 22.
Provided is a curing agent that includes a curing catalyst, and an aliphatic cyclic polyolefin resin disposed on a surface of the curing catalyst. The curing catalyst includes porous polyurea particles each bearing an aluminum chelating compound, or a water-insoluble catalyst powder having a solubility of 5% by mass or less relative to water.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08K 5/5419 - Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
Provided is a protective element capable of preventing an influence of reflow mounting on quick fusion-cutting property of a fuse element while achieving low cost. A protective element 1 comprises: an insulation substrate 2; a first electrode 4 and a second electrode 5 provided on the insulation substrate 2; a fuse element 7 that is disposed on the surfaces of the first electrode 4 and the second electrode 5 and that electrically connects the first electrode 4 and the second electrode 5 to each other; and a connection conductor 8 that connects the fuse element 7 to the first electrode 4 and the second electrode 5. The fuse element 7 is composed of a lead-free conductor, and has a liquid phase point higher than a reflow heating temperature. The connection conductor 8 has a liquid phase point lower than that of the fuse element 7, and a solid phase point lower than the reflow heating temperature.
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/143 - Electrical contacts; Fastening fusible members to such contacts
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
31.
END MILL, METHOD FOR PRODUCING MOLD FOR CREATING MICROLENS, AND DEVICE FOR PRODUCING MOLD FOR CREATING MICROLENS
An end mill having a cutting edge part that has a tip end part and is circular at a bottom surface, a tip end of the tip end part being positioned on a central axis passing through the center of the bottom surface, and the cutting edge part being in the form of a protrusion having one curved surface where a conical body having a circumferential side surface that includes an enlarged-diameter region having a diameter greater than that of the bottom surface is divided by a plane including the central axis.
B23C 5/10 - Shank-type cutters, i.e. with an integral shaft
B23B 27/20 - Cutting tools of which the bits or tips are of special material with diamond bits
B23C 5/16 - Milling-cutters characterised by physical features other than shape
B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
This optical laminate contains a transparent substrate, an optical functional layer and an antifouling layer laminated in that order, wherein when a light with a wavelength of 380 nm to 780 nm from a standard light source D65 is incident upon the optical laminate at an incident angle within a range from 5° to 50° relative to the surface, the a* value and the b* value in the CIE-Lab color system of the reflected light are within the same quadrant of the a*b* plane.
This protection element is provided with a first terminal, as well as a second terminal and a third terminal that are connected to the first terminal. Regarding the electrical resistance of a fuse element connecting the first terminal and the second terminal, at least a portion of a fuse element connecting the first terminal and the third terminal has a higher electrical resistance than the fuse element connecting the first terminal and the second terminal.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
The present invention provides a coating liquid which contains an aerogel, a mineral, a water-soluble polymer, an aqueous emulsion and a liquid medium.
A cell culture method including a culture step for culturing cells, said cells being in contact with a collagen gel containing type III collagen; a production method of a therapeutic composition including a culture step for culturing cells, said cells being in contact with a collagen gel containing type III collagen; or a therapeutic composition comprising a collagen gel containing type III collagen and cells in which the cells are in contact with the collagen gel.
A61P 43/00 - Drugs for specific purposes, not provided for in groups
C12N 1/00 - Microorganisms, e.g. protozoa; Compositions thereof; Processes of propagating, maintaining or preserving microorganisms or compositions thereof; Processes of preparing or isolating a composition containing a microorganism; Culture media therefor
C12N 5/071 - Vertebrate cells or tissues, e.g. human cells or tissues
Provided is a thermally conductive sheet which is highly flexible and of which the thermal resistance value has small load dependency. A thermally conductive sheet 1 contains a curable resin composition 2, a flaky thermally conductive filler 3, and a non-flaky thermally conductive filler 4, wherein the amount of change between the thermal resistance value at load of 1 kgf/cm2 and the thermal resistance value at load in a range greater than 1 kgf/cm2 and not greater than 3 kgf/cm2 is not greater than 0.4° C.·cm2/W, and the amount of change between the compression rate at load of 3 kgf/cm2 and the compression rate at load of 1 kgf/cm2 is not less than 20%.
A method for producing a circuit device according to the present invention joins a circuit board and a mounting component to each other by: arranging a solder paste on an electrode of the circuit board; arranging a resin composition for sealing on at least a part of the periphery of the solder paste; aligning an electrode of the mounting component on the electrode of the circuit board; and forming a solder bonded part by subjecting the solder paste held between the electrode of the circuit board and the electrode of the mounting component to a reflow treatment, while forming a resin sealed part by curing the resin composition for sealing by means of the heating during the reflow treatment. Meanwhile, if (Solvent SP value) is the solubility parameter of a solvent that is contained in a flux of the solder paste and (Resin SP value) is the solubility parameter of a liquid resin component of the resin composition for sealing, the following formula (1) is satisfied. (1): (Solvent SP value) - (Resin SP value) ≥ -0.25
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
39.
SOLAR CELL MODULE, ELECTROCONDUCTIVE ADHESIVE MATERIAL, AND METHOD FOR MANUFACTURING SOLAR CELL MODULE
According to the present invention, even if tab lines on the front and back of a solar battery cell are dislocated, it is possible to prevent the occurrence of breakage or warpage of the solar battery cell, or the occurrence of cracking at the sections connected to the tab lines. A solar cell module 1 has: a solar battery cell 2; and tab lines 3 connected to electrodes 11, 13 formed on the front and back of the solar battery cell 2. A metal bonding section 15 formed of a solder joining each of the electrodes 11, 13 to the corresponding tab line 3 is formed at the widthwise center of the tab line 3. The solar cell module 1 has a covering section 16 that is formed of a cured material of a thermosetting binder resin and that covers bilateral ends of the metal bonding section 15 and the tab line 3 in cross section.
Provided is a substrate for an inspection device, the substrate having an average thickness of 250 µm to 350 µm and a density of 0.25×106g/m3to 0.40×106g/m3.
G01N 37/00 - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES - Details not covered by any other group of this subclass
G01N 35/08 - Automatic analysis not limited to methods or materials provided for in any single one of groups ; Handling materials therefor using a stream of discrete samples flowing along a tube system, e.g. flow injection analysis
C12Q 1/68 - Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions involving nucleic acids
41.
PROTECTIVE ELEMENT, AND PROTECTIVE ELEMENT MANUFACTURING METHOD
Provided is a protective element that can maintain conductivity and connectivity, and also be adaptable to large currents, while reducing the usage amount of an electrode forming material. The present invention comprises: an insulating substrate 2; a heat generating element 3 provided on the insulating substrate 2; a first electrode 4 and a second electrode 5 formed on the insulating substrate 2; a heat generating element lead-out electrode 6 disposed between the first electrode 4 and the second electrode 5 and electrically connected to one end side of the heat generating element 3; and a fusible conductor 7 that is disposed on the surfaces of the first electrode 4, the second electrode 5, and the heat generating element lead-out electrode 6, and that electrically connects the first electrode 4 and the heat generating element lead-out electrode 6 to each other, and the second electrode 5 and the heat generating element lead-out electrode 6 to each other, wherein connection parts 8 of the first electrode 4, the second electrode 5, and the heat generating element lead-out electrode 6, connecting to the fusible conductor 7, are formed thicker than the other portions.
H01H 85/143 - Electrical contacts; Fastening fusible members to such contacts
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
A protective element includes: a fuse element which includes a blowout portion between a first end portion and a second end portion, and is energized in a first direction; and a case having a housing portion housing the blowout portion therein. A length in a thickness direction in a cross section perpendicular to the first direction of the blowout portion is less than or equal to a length in a width direction perpendicular to the thickness direction in the cross section. A first wall surface and a second wall surface that face each other in the thickness direction are provided in the housing portion. A distance in the thickness direction between the first wall surface and the second wall surface is 10 times or less the length in the thickness direction of the blowout portion.
An optical body that has excellent anti-reflection performance and transmittance for light having wavelengths in the visible light band and good absorption performance for light having wavelengths in the near-infrared band is provided. To solve the above problem, the present disclosure provides an optical body 100 including a base material 20, a dye-containing resin layer 30 formed on the base material 20, and an anti-reflection layer 40 formed on the resin layer 30 and having a micro uneven structure in at least one surface. The average spectral transmittance of the optical body 100 for light in a wavelength range of 420 to 680 nm is 60% or greater, and the minimum spectral transmittance of the optical body 100 for light in a wavelength range of 750 to 1400 nm is less than 60%.
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
The present invention provides a multilayer body which comprises: a base material; a first heat conductive layer which is arranged on the base material and contains a curable component, a curing agent that cures the curable component, first heat conductive particles, and low-melting-point metal particles; and a second heat conductive layer which is arranged on the first heat conductive layer and contains a curable component, a curing agent that cures the curable component, second heat conductive particles, and low-melting-point metal particles. Some of the first heat conductive particles in the first heat conductive layer and some of the second heat conductive particles in the second heat conductive layer are in contact with each other; the volume average particle diameter of the first heat conductive particles is smaller than the volume average particle diameter of the second heat conductive particles; and the base material contains at least one substance that is selected from among silicon, aluminum, tungsten, molybdenum, glass, a mold resin, a stainless steel and a ceramic.
A laminate comprising: a base; and a thermally conductive layer that is provided on the substrate, that includes metal-covered resin particles aligned and spaced apart at a prescribed interval, and that contains a curable component, a curing agent for curing the curable component, thermally conductive particles, and low melting point metal particles, wherein the metal-covered resin particles are in contact with the base, the volume average particle size of the metal-covered resin particles is smaller than the volume average particle size of the thermally conductive particles, and the base contains at least one selected from silicon, aluminum, tungsten, molybdenum, glass, mold resin, stainless steel, and ceramic.
The present invention provides a multilayer body which comprises: a base material; a first particle alignment layer which is arranged on the base material and contains first heat conductive particles, and in which the first heat conductive particles are aligned at predetermined intervals; and a second particle alignment layer which is arranged on the first particle alignment layer and contains second heat conductive particles, and in which the second heat conductive particles are aligned at predetermined intervals. Some of the first heat conductive particles in the first particle alignment layer and some of the second heat conductive particles in the second particle alignment layer are in contact with each other; the volume average particle diameter of the first heat conductive particles is smaller than the volume average particle diameter of the second heat conductive particles; and the base material contains at least one substance that is selected from among silicon, aluminum, tungsten, molybdenum, glass, a mold resin, a stainless steel and a ceramic.
06 - Common metals and ores; objects made of metal
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Nonferrous metals and their alloys; sputtering targets of metal; iron and steel; metal hardware, namely, springs, washers, pulleys; industrial packaging containers of metal; metal junctions for pipes; metal flanges Optical sensors; photosensitive modules for human body measurement, blood pressure measurement, blood sugar level measurement, gas detection, encoders and electronic color sorters; optical sensor modules for human body measurement, blood pressure measurement, blood sugar level measurement, gas detection, encoders and electronic color sorters; semi-conductor devices; semiconductor power elements; integrated circuits; printed circuit boards; light-emitting diodes (LED); semiconductor testing apparatus; semi-conductor memory devices; photodiodes; telecommunication machines and apparatus, namely, television receivers, touch panels, digital cameras, digital photo frames, videocameras, navigation apparatus for vehicles, CD players, DVD players, Blu-ray players, mobile telephones, optical communication transceiver modules, data center servers, hyperspectral cameras; filters for optical devices; optical machines and apparatus, namely, optical semiconductors, optical lenses, optical inspection apparatus for inspection of semiconductor materials, namely, semiconductor wafers, reticles, and photomasks; semiconductor wafers; wafers for integrated circuits; downloadable and recorded computer programs for human body measurement, blood pressure measurement, blood sugar level measurement, gas detection, encoders and electronic color sorters; downloadable and recorded computer programs for use in processing semiconductor wafers; downloadable and recorded computer programs for chip design; downloadable and recorded computer programs for modeling electronic circuits; electronic machines, apparatus and their parts, namely, personal computers, computer display monitors, scanners, printers, smartphones, electronic circuit boards, semi-conductors; laboratory apparatus and instruments, namely, DNA chips, biochips for research and scientific purposes; measuring or testing machines and instruments, namely, plastic testing machines, metal strength testing machines, semiconductor measuring apparatus, testing equipment for measuring the temperature, pressure, position or form of workpieces in a machine tool; electric power distribution machines; electronic control systems for machines; solar batteries; electrical batteries and cells; personal digital assistants; downloadable music files; design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; downloadable electronic publications in the nature of book, magazine, manual in the field of integrated circuits and semiconductors Metal treating; provision of information regarding manufacturing, processing, and assembling of semiconductor wafers; custom processing and manufacturing of semiconductors, wafers and integrated circuits; assembling and processing of semiconductors and integrated circuits; processing of rubber; processing of plastics; ceramic processing; providing material treatment information; recycling of waste and trash; rental of metal treating machines and tools; rental of chemical processing machines and apparatus; rental of semiconductor and semiconductor device manufacturing machines; rental of 3D printers Design of semiconductor devices; design of semiconductors; design of integrated circuits; testing or research on semiconductors; research in the area of semiconductor processing technology; testing on semiconductors and integrated circuits and consultancy relating thereto; testing and research on semiconductor manufacturing machines and semiconductor measuring machines; design of semiconductors, semiconductor elements and integrated circuits; advisory and consultancy services relating to semiconductor design; industrial design services; engineering design services; providing temporary use of online non-downloadable computer programs for human body measurement, blood pressure measurement, blood sugar level measurement, gas detection, encoders and electronic color sorters; providing temporary use of online non-downloadable computer programs for use in processing semiconductor wafers; providing temporary use of online non-downloadable computer programs for chip design; providing temporary use of online non-downloadable computer programs for modeling electronic circuits; computer software design; computer programming; maintenance of computer software; technological advice relating to computers, automobiles and industrial machines; rental of computers; providing temporary use of non-downloadable application software for use in processing semiconductor wafers; providing temporary use of non-downloadable application software for chip design; providing temporary use of non-downloadable application software for modeling electronic circuits; providing temporary use of non-downloadable cloud computing software for use in database management and electronic storage of data; analysis of technical data relating to machine engineering, human body measurement, blood pressure measurement, blood sugar level measurement, gas detection, encoders and electronic color sorters; rental of laboratory apparatus and instruments
Spectral noise produced by a diffraction phenomenon of a periodic structure can be reduced to improve homogeneity of intensity of straight diffusion light, and noise of zero-order diffraction light is reduced to improve light distribution properties as well. A diffusion plate 1 of a microlens array type that emits straight diffusion light includes a base material 10, and a plurality of cylindrical lenses 21 arranged in an X direction on an X-Y plane of the base material 10 and composed of elongated convex portions or elongated concave portions extending in a Y direction. An aperture width D and a radius of curvature R in the X direction of each of the cylindrical lenses 21 are randomly varied within variation ranges defined by variation full width rates δD and δR, respectively, using a reference aperture width Dk and a reference radius of curvature Rk as references, and an off-center amount Ec of each of the cylindrical lenses 21 is randomly vaned within a variation range defined by a variation full width rate δEc, where δD, δR, and δEc satisfy Expression (1), and at least either δD or δR is not 0%.
The present invention provides a film laminate which enables the achievement of a sufficient effect of a sterilization treatment, while being free from the risk of breakage of a film surface structure. A film laminate according to the present invention comprises: a plurality of film-like members 2 which are stacked in a separable manner; a first engagement member 6 which is firmly bonded to one of a pair of film-like members 2; and a second engagement member 9 which is firmly bonded to the other one of the pair of film-like members 2. By engaging the first engagement member 6 and the second engagement member 9 with each other in an unengageable manner, the pair of film-like members 2 are stacked with a space therebetween; and the engaged part of the first engagement member 6 and the second engagement member 9 has air permeability.
B32B 3/06 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions for attaching the product to another member, e.g. to a support
A41D 13/00 - Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
A41D 13/11 - Protective face masks, e.g. for surgical use, or for use in foul atmospheres
The present invention provides a film laminate which enables the achievement of a sufficient effect of a sterilization treatment, while being free from the risk of breakage of a film surface structure. A film laminate 1 comprises: a plurality of film-like members 2 which are stacked in a separable manner; and a columnar projection member 5 which protrudes in the stacking direction of the film-like members 2 and holds the film-like members 2 at predetermined intervals. The outer peripheral surface of the projection member 5 is provided with lock parts to which the film-like members 2 are locked at predetermined intervals; the film-like members 2 each have an insertion hole 4 into which the projection member 5 is inserted in a removable manner; and the film-like members 2 are held and stacked at predetermined intervals by inserting the projection member 5 into the insertion holes 4 and locking the film-like members 2 to the lock parts.
B32B 3/06 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions for attaching the product to another member, e.g. to a support
A41D 13/00 - Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
An optical multilayer body according to the present invention is obtained by sequentially stacking a transparent base material, a hard coat layer, an adhesion layer, an optical functional layer and an antifouling layer; and if this optical multilayer body is subjected to a sliding test of 500 reciprocations under a load of 250 g with use of a sliding tool that has a Shore D hardness of 40 and a diameter of 0.8 mm, the absolute value of the change ∆b*of the b*value in the L*a*b* color system of a slid portion before and after the sliding is 1.9 or less.
A method of manufacturing a display device capable of reducing tact time includes: a transfer step of arranging an anisotropic conductive adhesive layer provided on a base material that is transparent to laser light and a wiring board to face each other, and irradiating laser light from the base material side so that individual pieces of the anisotropic conductive adhesive layer are transferred to and arranged at predetermined positions on the wiring board; and a mounting step of mounting light-emitting elements on the individual pieces arranged at the predetermined positions on the wiring board. The individual pieces of the anisotropic conductive adhesive layer are able to be transferred and arranged with high precision and high efficiency by irradiation of laser light.
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
53.
IMAGE DISPLAY DEVICE THAT CAN DISPLAY HIGH BRIGHTNESS AND HIGH CONTRAST IMAGES AND INCLUDES A CURED RESIN LAYER
A thin image display device is provided which is free from display defects caused by the deformation of an image display part and can display high brightness and high contrast images. The image display device includes an image display part, a light-transmitting protective part arranged on the image display part, and a cured resin layer interposed between the image display part and the protective part. The cured resin layer has a light transmittance in the visible region of 90% or more and a refractive index (nD) of 1.45 or more and 1.55 or less.
C08L 51/00 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
54.
THERMALLY CONDUCTIVE SHEET AND PRODUCTION METHOD FOR THERMALLY CONDUCTIVE SHEET
A thermally conductive sheet includes: a binder resin; and a first thermally conductive filler oriented in a thickness direction of the thermally conductive sheet. The thermally conductive sheet has a contact thermal resistance with regard to an adherend of 0.46° C.·cm2/W or less. The first thermally conductive filler is preferably a fibrous thermally conductive filler and/or a flaky thermally conductive filler. The thermally conductive sheet preferably further includes a second thermally conductive filler which is at least one selected from a group consisting of alumina, aluminum, zinc oxide, boron nitride, aluminum nitride, graphite, and a magnetic powder.
Provided is a reel member and an adhesive film winding body capable of suppressing sticking and blocking and preventing falling off. A real member includes: a winding core 3 around which an adhesive film 2 is to be wound; a pair of reel flanges 4 provided on both sides of the winding core 3; and a plurality of ribs 5 formed on an inner surface 4a of the reel flange 4, protruding from the inner surface 4a, and extending from the center side to the peripheral edge side of the reel flange 4, wherein in the rib 5, a rib top width W1 in contact with the adhesive film 2 is narrower than a rib base width W2 in contact with the inner surface 4a in cross-sectional view.
This protective element comprises: a fuse element having a cut part between a first end part and a second end part, energized in a first direction facing from the first end part to the second end part; a movable member having a convex part and a recess-shaped member having a recess in which the convex part can be inserted, arranged facing so as to sandwich the cut part; and a pressing means that applies force to reduce the relative distance in the direction in which the cut part is sandwiched between the movable member and the recess-shaped member, the cut part being cut by the force of the pressing means at a temperature equal to or higher than the softening temperature of the fuse element, where in the protective element, the cut part of the fuse element has in at least a portion one or both of a through hole and a thin part.
Provided are: a fine metal particle aggregate having a uniform particle-size distribution and exhibiting excellent transfer characteristics; a conductive film; a connection structure; and production methods for the same. A metal particle aggregate 1 is an aggregate of metal particles 2 and has pores 3 in the surface thereof. When the aggregate is transferred onto a conductive film 5 and is observed on the surface of the conductive film 5, the pores 3 account for 5% or more of the area of the aggregate in the plan view.
B22F 1/102 - Metallic powder coated with organic material
B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
H01B 5/00 - Non-insulated conductors or conductive bodies characterised by their form
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
The present invention provides a screen that is installed upright to receive and reflect projected light at a light-receiving surface, wherein the screen has the light-receiving surface, the light-receiving surface has a mirror row A in which a number of mirrors A are arranged in a first direction and a mirror row B which is disposed in a second direction intersecting the first direction and in which a number of mirrors B are arranged in the first direction, and the mirrors A and the mirrors B are inclined in the same direction on the light-receiving surface.
The optical system includes: a coherent light source; and a fixed diffusion plate and a relative movement diffusion plate which intersect with a traveling direction of light emitted from the coherent light source, wherein the fixed diffusion plate emits a light having a rectangular shape from an incident light, and wherein, in the relative movement diffusion plate, a diffusion surface of the light moves relative to the incident light.
This production method for an optical laminate is a production method for an optical laminate having a plastic film, an adhesion layer, an optical function layer and an antifouling layer laminated in order and includes an adhesion layer formation step of forming an adhesion layer, an optical function layer formation step of forming an optical function layer, a surface treatment step of treating a surface of the optical function layer so that a change rate of surface roughness represented by the prescribed formula (1) is 5% to 35% or a change rate of an average length of elements represented by the prescribed formula (2) is 7% to 70%, and an antifouling layer formation step of forming an antifouling layer on the optical function layer having a treated surface.
This optical laminate 101 is an optical laminate including a plastic film 11, an adhesion layer 13, an optical function layer 14 and an antifouling layer 15 laminated in order, in which the antifouling layer 15 is made of a vapor-deposited film obtained by 5 vapor deposition of an antifouling material, a film thickness of the antifouling layer 15 is 2.5 nm or more, a water vapor transmission rate is 1.5 g/(m2·1 day) or less, and a hue change ΔE value of reflected color in consideration of specular light (SCI) after contacting a sodium hydroxide aqueous solution having a liquid temperature of 55° C. and a concentration of 0.1 mol/L for four hours is less than 10.
This method of manufacturing an optical laminate comprising a transparent substrate, an adhesion layer, an optical functional layer, and an antifouling layer laminated in this order, includes an adhesion layer forming step of forming the adhesion layer, an optical functional layer forming step of forming the optical functional layer, a surface treatment step of treating the surface of the optical functional layer so that the rate of change in surface roughness represented by formula (1) is 1˜25%, and an antifouling layer forming step of forming the antifouling layer on the surface-treated optical functional layer; Rate of change of surface roughness (%)=((Ra2/Ra1)−1)×100 (%) Formula (1) (Formula (1), where Ra1 represents the surface roughness (Ra) of the optical functional layer before the surface thereof is treated, and Ra2 represents the surface roughness (Ra) of the optical functional layer after the surface thereof is treated.).
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 37/14 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
B32B 37/24 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
A protective element includes: a fuse element cuttable by energization in a first direction; a slider made of an insulating material, including: a plate-shaped portion extending in the first direction; a shielding portion erected in a second direction on the plate-shaped portion, having a shielding-portion through hole penetrating the shielding portion; and a case made of an insulating material, including a housing portion which houses a slider and a portion of the fuse element. The housing portion includes: a shielding-portion housing space which houses the shielding portion such that the shielding portion is movable in the second direction; and a plate-shaped-portion moving space which houses the plate-shaped portion such that the plate-shaped portion is movable in the second direction Prior to the fuse element being cut, the slider and the fuse element are housed such that the fuse element is inserted into the shielding-portion through hole.
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
64.
ELECTROCONDUCTIVE FILM, CONNECTION STRUCTURE AND MANUFACTURING METHOD FOR SAME
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
65.
CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME
A connection structure in which an electrode of a first electronic component and an electrode of a second electronic component are aligned so as to face each other, and the first electronic component and the second electronic component are connected via electroconductive particles and an insulating adhesive agent disposed between the aligned electrodes, wherein electrconductive particles having an average particle diameter of less than 3 µm are used, there is alignment skew in the mutually facing electrodes, and the width of the alignment skew in the connection structure is adjusted to no more than 10.0 times the average particle diameter of the electroconductive particles.
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
66.
LONG FILM AND CONNECTION STRUCTURE PRODUCTION METHOD
Provided are a long film which can maintain properties of individual pieces of an adhesive film, and a connection structure production method. A long film (10) has a long base film (11) and individual pieces (21)-(25), of an adhesive film, which are disposed in the longitudinal direction of the base film (11). An identification mark (30) is provided to at least one of a predetermined individual piece and the base film on which the predetermined individual piece is disposed. Accordingly, at the time of using the individual pieces, it is possible to put aside a defective individual piece by identifying the identification mark and to maintain the performance of each of the individual pieces of the adhesive film.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
B32B 7/06 - Interconnection of layers permitting easy separation
Provided are an individual piece processing adhesive film capable of improving adhesive strength with respect to a substrate on which components are mounted, a method for manufacturing a connecting structure, and a connecting structure. The individual piece processing adhesive film is formed such that individual pieces having openings surrounding the periphery of the components are arranged in the lengthwise direction of a base film with respect to the substrate on which the components are mounted. The method for manufacturing the connecting structure includes connecting a first electronic component terminal and a second electronic component terminal to the substrate on which the components are mounted by using individual pieces having openings surrounding the periphery of the components. This makes it possible to improve adhesive strength.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
C09J 7/00 - Adhesives in the form of films or foils
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
In this connection structure 1A, an electrode 11 of a first electronic component 10 and an electrode 21 of a second electronic component 20 are connected via filler 2, the electrode 11 is embedded in an insulating resin layer 3 on the second electronic component 20, and a top surface 13 of the first electronic component 10 is exposed from the insulating resin layer 3. The connection structure has an inclined region 4 of the insulating resin layer 3 around the first electronic component 10, and a flat region 5 of the insulating resin layer 3 adjacent to the inclined region 4. When the height of the top surface 13 of the first electronic component 10 from an electrode surface 11a is defined as A, the height of the first electronic component 10 of the portion exposed from the insulating resin layer 3 as B, and the distance between the outer edge of the inclined region 4 and the first electronic component 10 as E, 0≤B/A<1, and E≤500 μm.
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
69.
MANUFACTURING METHOD FOR MASTER DISK, MANUFACTURING METHOD FOR TRANSFERRED OBJECT, MANUFACTURING METHOD FOR REPLICA MASTER DISK, AND MANUFACTURING DEVICE FOR MASTER DISK
[Problem] To form with high precision a recess-and-protrusion structured pattern having an arbitrarily defined three-dimensional shape on the outer peripheral surface of a master disk. [Solution] This manufacturing method for a master disk includes: a step for forming a resist layer on the outer peripheral surface of a substrate; a step for dividing an input image, which is obtained by depicting an object having a three-dimensional shape in two dimensions, into a plurality of small areas; a step for determining stepwise the intensity of a laser beam to be radiated onto each of the small areas on the basis of the color shade of a partial image of the object in each of the small areas in which the object is included and generating an exposure control signal corresponding to the object on the basis of the result of the determination; a step for irradiating the resist layer with the laser beam on the basis of the exposure control signal and thereby forming a resist pattern for which the depth changes in accordance with the color shades of the partial images; and a step for using the resist layer as a mask to form a recess-and-protrusion pattern corresponding to the three-dimensional shape of the object on the outer peripheral surface of the substrate.
[Problem] To impart an irregular phase difference to diffused light from a plurality of lenses by using a new variable element having a microlens array structure in order to further increase an effect of suppressing unnecessary diffracted light including spectral diffracted light and zero-order diffracted light, thereby further improving the uniformity and light distribution of the diffused light. [Solution] Provided is a diffuser plate comprising: a base material; and a microlens array composed of a plurality of microlenses disposed on an X-Y plane on at least one surface of the base material, wherein each microlens has a surface shape varying randomly on the basis of a reference surface shape, the plurality of microlenses have different surface shapes from each other, each microlens is disposed at a position shifted randomly in a Z-direction which is perpendicular to the X-Y plane from a reference position in the Z-direction, and a step in the Z-direction is present at a boundary between the plurality of microlenses adjacent to each other.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Provided is a thermally conductive sheet with a reduced total thermal resistance value. This thermally conductive sheet 1 is composed of a cured product of a thermally conductive composition containing an anisotropic thermal conductive material 3, an inorganic filler 4, and a binder resin 2, and has an average height Spk of protruding peak parts of less than 3.5 μm, as measured according to ISO 25178 by using a scanning white light interference microscope with a 20× object lens. The thermally conductive sheet 1 is composed of the cured product of the thermally conductive composition containing the anisotropic thermal conductive material 3, the inorganic filler 4, and the binder resin 2, and has a volume Vmp of the protruding peak parts of at most 0.16 ml/m2, as measured according to ISO 25178 by using a scanning white light interference microscope with a 20× object lens. The thermally conductive sheet 1 is composed of the cured product of the thermally conductive composition containing the anisotropic thermal conductive material 3, the inorganic filler 4, and the binder resin 2, and has a value (Spk/(Spk+Svk)) of the average height Spk of the protruding peak parts to the sum (Spk+Svk) of the average height Spk of the protruding peak parts and an average depth Svk of protruding valley parts of at most 40% and a root mean square gradient Sdq of at most 1.1, as measured according to ISO 25178 by using a scanning white light interference microscope with a 20× object lens.
This connection structure is suitable for high-density mounting and is obtained by connecting a first electronic component and a second electronic component via conductive particles and an insulating adhesive agent disposed between an electrode of the first electronic component and an electrode of the second electronic component. The connection structure uses, as said conductive particles, conductive particles having an average particle diameter of less than 3 μm and a compressive hardness (20% K value) at 20% deformation of 1500-8000 N/mm2.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
According to an aspect of the present invention, provided is a photocatalyst member comprising a photocatalyst layer formed on a base material via a foundation layer, the photocatalyst member being characterized in that the foundation layer at least has a cerium oxide, and the photocatalyst layer at least has a titanium oxide. Here, the foundation layer may comprise only a cerium oxide, or may comprise a cerium oxide and at least one or more other types of elements having a cerium element ratio of 10 atom% or less. According to the present invention, it is possible to produce a photocatalyst with high industrial productivity.
[Problem] To further improve an effect of suppressing unnecessary diffracted light, which includes spectral diffracted light, 0-th order diffracted light, and the like, and thereby further improve the homogeneity and light distribution characteristics of the diffused light, by using a new variable element of a microlens array structure even in a case of regularly arraying a plurality of microlenses, and by imparting irregular phase difference on the diffused light from the plurality of lenses. [Solution] Provided is a diffusion plate that is provided with a base material, and a microlens array composed of a plurality of microlenses arranged on an XY-plane on at least one of the surfaces of the base material. The surface shape of each of the microlenses is a preset reference surface shape, and the plurality of microlenses are arranged regularly on the XY-plane. Each of the microlenses is disposed at a position randomly shifted in the Z-direction, which is perpendicular to the XY-plane, from a reference position in the Z-direction. There are Z-directional steps at boundaries between the microlenses that are mutually adjacent to each other.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Provided is a heat-conducting sheet having a reduced contact thermal resistance. This heat-conducting sheet 1 comprises a cured product of a heat-conducting composition containing a binder resin 2, a fibrous filler 3, and a heat-conducting filler 4 other than the fibrous filler 3. In the heat-conducting sheet 1, the fibrous filler 3 is aligned in the thickness direction B. The average height Spk of peaks on the heat-conducting sheet 1 as measured using a scanning white-light interference microscope having a 20x objective lens in accordance with ISO 25178 is at most 3 μm. The contact thermal resistances of the heat-conducting sheet 1 as measured in accordance with ASTM-D5470 when applied with pressure at 1.4 kgf/cm2and 2.1 kgf/cm2are at most 0.10°C·cm2/W.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
76.
THERMALLY CONDUCTIVE SHEET, MANUFACTURING METHOD FOR THERMALLY CONDUCTIVE SHEET, AND METHOD FOR TESTING FLATNESS OF SURFACE OF THERMALLY CONDUCTIVE SHEET
A joined body production method includes subjecting a first electronic component and a second electronic component to thermocompression bonding via a hot-melt adhesive sheet. The hot-melt adhesive sheet includes a binder and solder particles. The binder includes a crystalline polyamide resin having a carboxyl group. A melting point of the solder particles is 30° C. to 0° C. lower than a temperature of the thermocompression bonding. When melt viscosities of the hot-melt adhesive sheet are measured under a condition of a heating rate of 5° C./min., the hot-melt adhesive sheet has a ratio of a melt viscosity at 40° C. lower than the temperature of the thermocompression bonding to a melt viscosity at 20° C. lower than the temperature of the thermocompression bonding of no less than 10.
H01L 21/603 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
78.
ESTER COMPOUND, METHOD FOR PRODUCING SAME, THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE SHEET
1345124655 represents a divalent saturated hydrocarbon group having 1 to 3 carbon atoms or a divalent unsaturated hydrocarbon group having 2 to 3 carbon atoms.
C07C 67/08 - Preparation of carboxylic acid esters by reacting carboxylic acids or symmetrical anhydrides with the hydroxy or O-metal group of organic compounds
C07C 69/675 - Esters of carboxylic acids having esterified carboxyl groups bound to acyclic carbon atoms and having any of the groups OH, O-metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids of saturated hydroxy-carboxylic acids
C08G 59/02 - Polycondensates containing more than one epoxy group per molecule
Provided is an electromagnetic wave interference absorbing body that includes: a dielectric layer containing conductive particles and a resin in which the conductive particles are dispersed; and an electromagnetic wave reflection layer. The conductive particles have the shape of a disk, ring, or C-type ring with an average outer diameter of 1,000nm or less and an average thickness that is no more than 5/9 of the average outer diameter.
A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.
This optical laminate is obtained by layering a transparent substrate, a hard coat layer, an optically functional layer, and an antifouling layer in the stated order, the hard coat layer containing a filler, the hard coat layer having a thickness of more than 1.0 µm and less than 3.0 µm, and the 10-point average roughness Rz of the surface of the optical laminate being 19-100 nm.
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
G02B 1/111 - Anti-reflection coatings using layers comprising organic materials
G02B 1/14 - Protective coatings, e.g. hard coatings
G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
A fuse element includes: a low-melting-point metal layer; a high-melting-point metal layer provided over at least one surface of the low-melting-point metal layer; and an intermediate layer disposed between the low-melting-point metal layer and the high-melting-point metal layer. Each of the high-melting-point metal layer and the intermediate layer is made of a metal that is liquefied by contacting a molten form of the low-melting-point metal layer. The high-melting point metal layer is made of silver or an alloy comprising silver as a main component thereof. A melting point of a material constituting the intermediate layer is higher than a melting point of a material constituting the low-melting-point metal layer and lower than a melting point of a material constituting the high-melting-point metal layer.
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/00 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
83.
CATIONIC CURING AGENT, METHOD FOR PRODUCING SAME AND CATIONICALLY CURABLE COMPOSITION
Provided is a cationic curing agent including porous particles and a mixture carried on the porous particles. The mixture includes a compound represented by Formula (1) below in which R1 to R3 are identical and R1 to R6 are identical and a compound represented by Formula (1) below in which at least one of R1 to R6 is different.
Provided is a cationic curing agent including porous particles and a mixture carried on the porous particles. The mixture includes a compound represented by Formula (1) below in which R1 to R3 are identical and R1 to R6 are identical and a compound represented by Formula (1) below in which at least one of R1 to R6 is different.
Provided is a cationic curing agent including porous particles and a mixture carried on the porous particles. The mixture includes a compound represented by Formula (1) below in which R1 to R3 are identical and R1 to R6 are identical and a compound represented by Formula (1) below in which at least one of R1 to R6 is different.
In Formula (1), R1 to R3 are each an optionally branched alkyl group having from 1 to 18 carbon atoms, or a phenyl group that may have a substituent, and R4 to R6 are each a hydrogen atom, an optionally branched alkyl group having from 1 to 4 carbon atoms, a halogenoalkyl group, an alkoxy group, or a phenoxy group that may have a substituent.
C08G 59/06 - Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
A conductive layered product includes: a transparent substrate; a first metal oxide layer; a metal layer; and a second metal oxide layer. The first metal oxide layer, the metal layer, and the second layer are layered directly or indirectly on a surface of the transparent substrate in this order from a transparent substrate side. An arithmetic mean roughness of an interface of the first metal oxide layer on the transparent substrate side is 2.0 nm or less. The interface of the first metal oxide layer on the transparent substrate side preferably contacts the surface of the transparent substrate. The conductive layered product preferably further includes a resin layer between the transparent substrate and the first metal oxide layer, and the interface of the first metal oxide layer on the transparent substrate side contacts a surface of the resin layer.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
G02F 1/16761 - Side-by-side arrangement of working electrodes and counter-electrodes
G02F 1/1677 - Structural association of cells with optical devices, e.g. reflectors or illuminating devices
This protective element (1A) comprises: an insulation substrate (2); a heat-generating body (3) disposed on one surface or the other surface of the insulation substrate (2); a first electrode (4) and a second electrode (5) disposed on the other surface of the insulation substrate (2); an extraction electrode (6) disposed between the first electrode (4) and the second electrode (5), the extraction electrode (6) being electrically connected to one end of the heat-generating body (3); a third electrode (7a) electrically connected to the other end of the heat-generating body (3); and a fusible conductor (9) disposed on the surfaces of the first electrode (4), the second electrode (5), and the extraction electrode (6), the fusible conductor (9) electrically connecting the first electrode (4) and the extraction electrode (6), and also electrically connecting the second electrode (5) and the extraction electrode (6). The surface area (S3) of the fusible conductor (9) disposed on the surface of the extraction electrode (6) is less than the surface area (S1) of the fusible conductor (9) disposed on the surface of the first electrode (4) and the surface area (S2) of the fusible conductor (9) disposed on the surface of the second electrode (5).
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01M 50/581 - Devices or arrangements for the interruption of current in response to temperature
H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
Provided are a connection structure manufacturing method, a film structure, and a film structure manufacturing method that enable the shortening of processing takt time. Included are: a step (A1) for preparing a substrate on which a plurality of electronic components are mounted; a step (B1) for preparing a film structure in which a plurality of singulated adhesive films, which include singulated adhesive films containing solder particles, are arranged at prescribed positions on a substrate corresponding to the substrate on which the plurality of electronic components are mounted; a step (C1) for temporarily attaching, at once, the plurality of singulated adhesive films to prescribed locations on the substrate; a step (D1) for placing electronic components on the singulated adhesive films; and a step (E1) for reflowing the substrate provided with the singulated adhesive films and the electronic components. The processing takt time can be shortened because the plurality of singulated adhesive films is temporarily attached to the substrate at once.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
88.
METHOD FOR MANUFACTURING CONNECTION STRUCTURE, AND TRANSFER METHOD FOR SINGULATED ADHESIVE FILM
Provided are a method for manufacturing a connection structure and a transfer method for a singulated adhesive film, whereby productivity can be improved even when unevenness is present on a substrate. The present invention comprises: an arrangement step in which individual pieces of an adhesive film are arranged on a base material with an elastic resin layer interposed therebetween; a transfer step in which the base material is pressed onto a substrate, and the individual pieces of the adhesive film arranged on the elastic resin layer are transferred to the substrate; and a mounting step in which an electronic component is mounted on an individual piece of the adhesive film transferred to the substrate. The size of each individual piece is 200 µm or less, and a peeling force of the adhesive film for the elastic resin layer is less than the peeling force of the adhesive film for the substrate. Through this, excellent transferability of an individual piece of adhesive film is obtained even for a base material on which unevenness is present, the unevenness including steps such as wiring and an insulation film on the wiring surface, and productivity can be improved.
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
In this protective element (1A), a fusing space (12) is divided into a first space (12a) in which a first fuse element (7) is located and a second space (12b) which is connected to a cutting space (13), with a slider (14) therebetween. The slider (14) includes a cutting portion (14a) protruding from the second space (12b) toward the cutting space (13). When a fusing current flows in the first fuse element (7) and the first fuse element (7) is thermally cut by fusing, arc discharge is generated within the first space (12a), and as the pressure within the first space (12a) is increased, the slider (14) is moved toward a second fuse element (10A) side and the cutting portion (14a) cuts the second fuse element (10A).
Provided is a coating liquid containing: a water-soluble polymer having a hydrophobic group including a siloxane bond; an aerogel; and a liquid medium.
Provided is a composition for repairing liquid leakage, the composition containing a tackifier, a hydrophobic monomer, and a rubber, and having a storage modulus of 10,000-150,000 Pa inclusive.
The present invention enables easy designing for arranging conductive particles for a conductive film that is easily adaptable to connection to a mini LED or to a micro LED. This designing method is for arranging conductive particles P in a conductive film having the conductive particles P held in an insulating resin layer when the conductive film is used to connect terminals having a terminal length L1 and a terminal width L2, the method involving: setting arrangement such that the conductive particles P are at lattice points of a rectangular lattice or a rhombic lattice and have a lattice axis orthogonal to the long direction or short direction of the conductive film; then setting the number density or the like of the conductive particles P in the conductive film; then selecting, from among lattice points which are distanced by a terminal length L1 or less from a lattice point A, a lattice point B which has the smallest angle formed between a straight line connecting said lattice point to the lattice point A and the film short direction; rotating the lattice about the lattice point A to obtain a rotation angle α of the lattice where the lattice point A and the lattice point B overlap in the film short direction; and determining the inclination angle of the lattice axis of the conductive film on the basis of the angle α.
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating characterised by the form or arrangement of the conductive interconnection between their connecting locations
Provided are an extract, which is a fractionated component 1 of a water extract of a plant powder, wherein the fractionated component 1 is a fractionated component having a fractionation molecular weight of 12,000 or greater, wherein an ethanol-undissolved component of the fractionated component 1 exhibits a peak attributable to carboxylic acid in a Fourier transform infrared spectroscopy (FT-IR) measurement and exhibits a peak attributable to cellulose in a gas chromatography mass spectrometry (GC-MS) measurement, and wherein an ethanol-dissolved component of the fractionated component 1 exhibits a peak attributable to carboxylic acid in the FT-IR measurement and exhibits a peak attributable to a plant protein in the GC-MS measurement, and a water-purifying agent containing the extract.
C02F 1/52 - Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
B01D 21/01 - Separation of suspended solid particles from liquids by sedimentation using flocculating agents
B01J 20/22 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material
B01J 20/24 - Naturally occurring macromolecular compounds, e.g. humic acids or their derivatives
B01J 20/30 - Processes for preparing, regenerating or reactivating
C02F 1/28 - Treatment of water, waste water, or sewage by sorption
Provided is a wire grid polarizing element comprising: a transparent substrate; and latticed projections which are arrayed, on one-side surface of the transparent substrate, at a pitch shorter than the wavelength of light in a band to be used and extend in a prescribed direction. The latticed projections each include a reflection layer, a dielectric layer, and an absorption layer in the stated order from the transparent substrate side. The reflection layer contains an AlNd alloy.
Provided is a wire-grid polarizer comprising: a transparent substrate; and lattice-shaped protrusions which, on one surface of the transparent substrate, extend in prescribed direction and are arrayed at a pitch which is shorter than the wavelength of light in a band to be used. The lattice-shaped protrusions each include, in order from the transparent substrate side, the following: a reflective layer; a dielectric layer; and an absorption layer. In a prescribed region of the transparent substrate, a region is provided in which the lattice-shaped protrusions are divided.
This protective element, which has a built-in heat generating body, handles increases in voltage and current, and disconnects a current pathway more safely and rapidly, without causing damage inside the element. The protective element comprises a fuse element 2 and a fusing member 3, wherein: the fusing member 3 includes insulating substrates 4, heat generating bodies 5, insulating layers 6 covering the heat generating bodies, heat generating body lead-out electrodes 7 overlapping the heat generating bodies 5 with the insulating layers 6 interposed therebetween, heat dissipating portions 8 which are formed in regions overlapping at least the heat generating bodies 5 on an outer surface 4a side of the insulating substrates 4, and which are electrically independent of the heat generating body lead-out electrodes 7, holding electrodes 10 which are formed on reverse surfaces 4b of the insulating substrates 4, and which hold a melting conductor 2a of the fuse element 2, and through-holes 11 allowing the heat generating body lead-out electrodes 7 and the holding electrodes 10 to be continuous with one another; and the fuse element 2 is connected to the holding electrodes 10.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
The present invention stabilizes the fixing state of a melting member and can stably and quickly cut off a current path, even when the melting member has generated heat over a long period of time. A protection element 1 has a case 28, a fuse element 2, a melting member 3 that is connected to at least one surface of the fuse element 2 and can melt the fuse element 2, and a fixing member 8 that is provided to an inner surface of the case 28 and contacts the melting member 3 so as to suppress oscillation of the melting member 3. The melting member 3 comprises an insulating substrate 4 and a heat-generating body 5 that is formed on the insulating substrate 4. The insulating substrate 4 is connected to the fuse element 2 by a bonding material 9 that softens when the heat-generating body 5 generates heat.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
This optical laminate includes a transparent substrate; an adhesion layer provided on at least one surface of the transparent substrate; and an optical layer provided on a surface of the adhesion layer on a side opposite to the transparent substrate, wherein the adhesion layer is formed of a metal material, and the metal material has a melting point in a range of 100° C. or more and 700° C. or less.
Visibility of an optical film at the time of handling can be improved, and an antireflection region and a visible region can be easily formed on a surface of the optical film in an identical processing step. An optical film 1 includes a base material 11 having flexibility and a resin layer 12 laminated on at least one of surfaces of the base material 11. The resin layer 12 includes a concave-convex pattern region 2 in which a micro concave-convex structure 20 composed of a plurality of convexities 21 or concavities 22 arrayed at a pitch P less than or equal to a wavelength of visible light are formed and a strip-shaped line marker region 3 in which a plurality of ridge portions 31 arrayed at intervals from one another at a track pitch Pt more than or equal to the wavelength of visible light are formed.
G02B 1/14 - Protective coatings, e.g. hard coatings
G02B 1/111 - Anti-reflection coatings using layers comprising organic materials
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
100.
WIRE GRID POLARIZER, METHOD FOR MANUFACTURING WIRE GRID POLARIZER, PROJECTION DISPLAY DEVICE, VEHICLE, AND PHOTO-CURABLE ACRYLIC RESIN FOR IMPRINTING
[Problem] To provide a wire grid polarizer having an excellent heat dissipation characteristic as well as excellent transmission and polarization splitting characteristics with respect to obliquely incident light over a wide range of incidence angles. [Solution] A wire grid polarizer 1 comprises: a substrate 10 made of an inorganic material; a grid structure 20 which is made of an organic material, and in which a base part 21 and a plurality of ridges 22 provided on the substrate 10 are integrally formed; and a functional film 30 which is made of a metal material, and partially covers the ridges 22. Each of the ridges 22 has a tapered shape with a width gradually decreasing as the distance from the base part 21 increases. The functional film 30 wraps a top of each ridge 22, and does not cover a bottom side of the ridge 22 and the base part 21. The coverage ratio (Rc) of a side surface of the ridge 22 by the functional film 30 is not less than 30% and not more than 70%. The organic material is a cured product of a photo-curable acrylic resin for imprinting, containing a photopolymerizable component.
