AAC Acoustic Technologies (Shenzhen) Co., Ltd.

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H04R 9/06 - Loudspeakers 470
H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details 366
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H04R 19/04 - Microphones 120
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1.

MOTION-SENSING IN-VEHICLE ALERTING METHOD, SYSTEM AND RELATED DEVICE

      
Application Number 18323402
Status Pending
Filing Date 2023-05-24
First Publication Date 2024-06-13
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Sun, Shuyuan
  • Meng, Yiming
  • Yin, Hao
  • Zhang, Xin
  • Zhang, Henglizi
  • Ge, Huan
  • Huang, Xiang

Abstract

Disclosed are a motion-sensing in-vehicle alerting method, a system, and a related device, which are applied to vehicles. The method includes steps of: obtaining, by a controller, an audio signal from an in-vehicle audio bus; performing an acoustic characteristics analysis on the audio signal, and extracting an acoustic waveform of the audio signal in a time domain waveform; performing an amplitude modulation on a sinusoidal signal of the acoustic waveform to obtain a modulated sinusoidal signal after amplitude modulation; obtaining, by the controller, a control signal indicating operational behavior information from an in-vehicle control bus, matching the control signal with the modulated sinusoidal signal according to a predetermined rule to generate a vibration signal, and transmitting the vibration signal to the excitation oscillator to achieve a vibration alert. The method of the present application not only enhances safety, but also provides the vibration alert, resulting in an improved user experience.

IPC Classes  ?

  • G08B 6/00 - Tactile signalling systems, e.g. personal calling systems
  • B60Q 9/00 - Arrangement or adaptation of signal devices not provided for in one of main groups
  • G06F 3/16 - Sound input; Sound output

2.

SEALED DUAL-MEMBRANE STRUCTURE AND DEVICE

      
Application Number CN2023087210
Publication Number 2024/108866
Status In Force
Filing Date 2023-04-10
Publication Date 2024-05-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Jenkins, Colin Robert

Abstract

The present invention provides a sealed dual-membrane (SDM) structure and a device comprising the structure. The SDM structure of the present invention comprises: a substrate; a first vibrating membrane and a second vibrating membrane which are disposed on the substrate, the first vibrating membrane and the second vibrating membrane forming a sealed cavity together with the substrate; first rear electrode plates and second rear electrode plates which are disposed between the first vibrating membrane and the second vibrating membrane; and conductor plate units disposed between the first rear electrode plates and the second rear electrode plates. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate units, and each conductor plate unit forms a capacitor structure with each of the first rear electrode plates and each of the second rear electrode plates. The present invention reduces the number of support columns required in the SDM structure, and improves the sensitivity of the device comprising the SDM.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • H04R 9/08 - Microphones

3.

OPTICAL MICROPHONE

      
Application Number CN2023087211
Publication Number 2024/108867
Status In Force
Filing Date 2023-04-10
Publication Date 2024-05-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick Pierre

Abstract

Provided in the present invention is an optical microphone, comprising: a housing, which comprises an inner cavity and a sound intake hole that enables communication between the inner cavity and the outside; a micro-electro-mechanical module, which is located in the inner cavity and comprises a flexible film and a grating; a photoelectric module, which is located in a rear cavity and comprises a light source and a light beam detector; and an integrated circuit module, which is located in the rear cavity and is electrically connected to the micro-electro-mechanical module and the photoelectric module. The photoelectric module and the integrated circuit module are arranged on the same chip. A reflection layer is provided on the side of the flexible film that faces the light source, and another reflection layer is provided on the side of the grating that faces the light source. The microphone has the following beneficial effects: less connection lines are used, and crosstalk noise between the lines is reduced, thereby achieving easier package fabrication and better package miniaturization.

IPC Classes  ?

4.

SEALED DUAL MEMBRANE STRUCTURE AND DEVICE INCLUDING THE SAME

      
Application Number 17993800
Status Pending
Filing Date 2022-11-23
First Publication Date 2024-05-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Jenkins, Colin Robert

Abstract

Provided is a sealed dual membrane (SDM) structure and a device including the same. The SDM structure according to the present invention includes a substrate, a first vibrating membrane and a second vibrating membrane disposed on the substrate, which form a sealed cavity together with the substrate, a first back electrode plate and a second back electrode plate disposed between the vibrating membrane and the second vibrating membrane, and a conductor plate unit disposed between the first back electrode plate and the second back electrode plate. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate unit, and the conductor plate unit forms a capacitor structure with each of the first back electrode plate and the second back electrode plate. The present invention reduces the number of pillars required in the SDM structure and increases the sensitivity of the device including the SDM.

IPC Classes  ?

  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones
  • H04R 19/04 - Microphones

5.

OPTICAL MICROPHONE

      
Application Number 17993804
Status Pending
Filing Date 2022-11-23
First Publication Date 2024-05-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick Pierre

Abstract

Provided is an optical microphone, including a case including an inner cavity and a sound inlet aperture that makes the inner cavity communicate with exterior; a micro-electromechanical module in the inner cavity and including a flexible film and a grating; an optoelectronic module in the rear cavity and including a light source and a light beam detector; and an integrated circuit module in the rear cavity and electrically connected to the micro-electromechanical module and the optoelectronic module. The optoelectronic module and the integrated circuit module are provided on a same chip; a reflective layer is provided at a side of the flexible film facing the light source, and another reflective layer is provided at a side of the grating facing the light source. The microphone has following beneficial effects: connection wires are less and crosstalk noise between wires is reduced, thereby achieving easier package manufacturing and better package miniaturization.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups

6.

MICROPHONE AND VEHICLE-MOUNTED ENTERTAINMENT SYSTEM

      
Application Number CN2023080307
Publication Number 2024/098599
Status In Force
Filing Date 2023-03-08
Publication Date 2024-05-16
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor Zhang, Jinyu

Abstract

Provided in the present utility model are a microphone and a vehicle-mounted entertainment system. The microphone comprises a shell having an accommodating cavity, a circuit board fixed in the accommodating cavity, an interface assembly fixed to an outer side of the shell and electrically connected to the circuit board, and a microphone unit fixed to the circuit board, the shell comprising a housing having the accommodating cavity, and a cover plate fixed to the housing and covering the accommodating cavity, characterized in that the interface assembly is fixed to the side of the housing away from the cover plate, and the plugging direction of the interface assembly is perpendicular to a board face of the circuit board; and the housing is provided with a sound pickup channel for providing sound signals for the microphone unit. The present solution omits a weak connecting plate, such that the connection strength between the interface assembly and the shell can be enhanced, the microphone can be miniaturized and can flexibly adapt to different installation modes; in addition, the extending direction of the board face of the circuit board is perpendicular to the plugging direction of the interface assembly, such that dragging, which causes loosening or even brakages between the interface assembly and the shell, can not occur during plugging, thereby preventing the microphone from being damaged.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor

7.

MEMS MICROPHONE

      
Application Number CN2022140833
Publication Number 2024/098519
Status In Force
Filing Date 2022-12-21
Publication Date 2024-05-16
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Linlin
  • Wang, Kaijie
  • Zhang, Rui

Abstract

Provided in the present utility model is an MEMS microphone, comprising: a base, a support plate arranged on one side of the base, and a capacitor system arranged on the support plate. The capacitor system comprises: a back plate, which is fixed to the support plate; a fixing member, which is fixed to the side of the back plate close to the base; and a diaphragm, which is fixed to the side of the fixing member away from the back plate, the fixing member being located in the central region of the diaphragm, and the diaphragm and the back plate being arranged opposite each other. The MEMS microphone further comprises: a first pad, which is fixed to the side of the supporting plate away from the base; and a first electrode, which is fixedly connected to the central region of the diaphragm and electrically connected to the first pad, the first electrode being only connected to the central region of the diaphragm. In the present utility model, the diaphragm forms a cantilever beam structure fixed in the middle, and the first electrode is only connected to the central region of the diaphragm, so as to prevent the first electrode from interfering with the deformation of an edge region of the diaphragm, such that the sensitivity of the microphone can be improved by way of fully releasing residual stress of the diaphragm.

IPC Classes  ?

8.

MICROPHONE

      
Application Number 18323391
Status Pending
Filing Date 2023-05-24
First Publication Date 2024-05-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

A microphone is provided. The microphone includes a housing having an accommodating cavity, a circuit board fixed to the accommodating cavity, an interface assembly fixed to an outer side of the housing and electrically connected to the circuit board, and a microphone unit fixed to the circuit board. The housing includes a shell having the accommodating cavity and a cover plate fixed to the housing and covering the accommodating cavity, the interface assembly is fixed to one side of the shell away from the cover plate, an insertion direction of the interface assembly is perpendicular to a surface of the circuit board. The microphone cancels the weak connecting plate, which can enhance the connection strength between interface assembly and the housing, which is conducive to miniaturizing the microphone and allowing it to flexibly adapt to different installation methods.

IPC Classes  ?

  • H04R 1/04 - Structural association of microphone with electric circuitry therefor

9.

MEMS MICROPHONE

      
Application Number 18454042
Status Pending
Filing Date 2023-08-22
First Publication Date 2024-05-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Linlin
  • Wang, Kaijie
  • Zhang, Rui

Abstract

A MEMS microphone includes a substrate, a supporting plate, a capacitor system, a first pad, and a first electrode. The substrate defines a back cavity, the supporting plate is disposed at one side of the substrate and defines an accommodation cavity, and the capacitor system is disposed at the supporting plate. The capacitor system includes a back plate, a fixing component, and a vibrating diaphragm. The vibrating diaphragm is fixed to one side of the fixing component distal from the back plate. The vibrating diaphragm forms a cantilever structure fixing at the middle, and the first electrode is only connected to a central region of the vibrating diaphragm, the first electrode may not interfere with deformation of an edge region of the vibrating diaphragm, thereby improving sensitivity of the MEMS microphone through fully releasing residual stress of the vibrating diaphragm.

IPC Classes  ?

10.

MEMS OPTICAL MICROPHONE

      
Application Number CN2022138554
Publication Number 2024/066065
Status In Force
Filing Date 2022-12-13
Publication Date 2024-04-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

Disclosed in the present application is an MEMS optical microphone. The MEMS optical microphone comprises: a shell, which has an inner cavity and a sound inlet, which allows the inner cavity to be in communication with the outside; a micro-electro-mechanical module, which comprises a vibrating diaphragm, the vibrating diaphragm being suspended in the inner cavity, wherein when a pressure is applied to the vibrating diaphragm, a light-passing gap is opened in the vibrating diaphragm, and the size of the light-passing gap is increased or reduced with the pressure applied to the vibrating diaphragm; a photoelectric module, which comprises an electromagnetic radiation source and a sensor, wherein a light beam, which is emitted by the electromagnetic radiation source, passes through the light-passing gap and then reaches the sensor; and an integrated circuit module, which is electrically connected to the photoelectric module. In the present application, a vibrating diaphragm is provided with a light-passing gap, which is opened or closed in response to a pressure or sound signal applied to the vibrating diaphragm, and the amount of light, which is transmitted through the light-passing gap, is controlled such that a transmitted light beam is converted into an electrical signal, which corresponds to an applied pressure level for the sound signal and has the advantages of a high sensitivity, a flat frequency response, etc., thereby providing potential for further improving the device performance.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups

11.

MEMS OPTICAL MICROPHONE

      
Application Number CN2022143107
Publication Number 2024/066102
Status In Force
Filing Date 2022-12-29
Publication Date 2024-04-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

Disclosed in the present invention is an MEMS optical microphone, comprising: a housing, which is provided with an inner cavity and a sound inlet for making the inner cavity be in communication with the outside; a micro-electro-mechanical module, which comprises a vibrating diaphragm, wherein the vibrating diaphragm is suspended in the inner cavity and is provided with a light passage gap in a penetrating manner, and the size of the light passage gap is increased or reduced along with the magnitude of sound pressure; a photoelectric module, which comprises an electromagnetic radiation source and a sensor that are respectively arranged on two opposite sides of the vibrating diaphragm, wherein the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the light passage gap, and the size of the light beam is greater than the maximum size of the light passage gap; and an integrated circuit module, which is electrically connected to the photoelectric module. Comparing the present invention with the prior art, the size of the light beam emitted by the electromagnetic radiation source is set to be greater than the maximum size of the light passage gap, so that the dynamic range of the MEMS optical microphone is widened, sound signals in a larger range can be sensed, and there is relatively high sensitivity to a linear change in radiation or light intensity caused by the sound signals.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups

12.

MEMS OPTICAL MICROPHONE

      
Application Number CN2022136208
Publication Number 2024/066027
Status In Force
Filing Date 2022-12-02
Publication Date 2024-04-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

A MEMS optical microphone, comprising: a housing (10), which has an inner cavity (15) and a sound inlet (11) that places the inner cavity (15) in communication with the outside; a diaphragm (20), which is suspended inside of the inner cavity (15) and seals the sound inlet (11); a waveguide piece (30), a through-hole (31) being penetratingly provided therein, an input waveguide (32) and an output waveguide (33) being provided on the waveguide piece (30) on two opposite sides of the through-hole (31); a variable optical wave member (40), a second end of the variable optical wave member (40) extending into the through-hole (31), and the variable optical wave member (40) being able to move back and forth in a first direction as the diaphragm (20) vibrates and deforms; a photoelectric module, which comprises an electromagnetic radiation source (50) and a sensing member, the variable optical wave member (40) being used for converting an input polarization state of a first light path into an output polarization state, and the output polarization state presenting different forms as the distance of movement of the variable optical wave member (40) in the first direction varies; and an integrated circuit module (60), which is electrically connected to the diaphragm (20) and the photoelectric module. Such a MEMS optical microphone has advantages such as high sensitivity and flat frequency response, providing potential for further improvements in device performance.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups
  • G01H 9/00 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means

13.

MEMS OPTICAL MICROPHONE

      
Application Number CN2023071211
Publication Number 2024/066132
Status In Force
Filing Date 2023-01-09
Publication Date 2024-04-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

Disclosed is a MEMS optical microphone, comprising: a housing, which has an inner cavity and a sound inlet that places the inner cavity in communication with the outside; a micro-electromechanical module, which comprises a diaphragm that is suspended inside of the inner cavity, a light lobe being formed on the diaphragm, and when sound pressure is applied, a light passing gap being formed in an opening of the light lobe, the size of the light passing gap increasing or decreasing as the sound pressure varies; a photoelectric module, which comprises an electromagnetic radiation source and a sensor, the electromagnetic radiation source and the sensor being arranged on two opposite sides of the diaphragm, and a light beam emitted by the electromagnetic radiation source traversing the light passing gap and then reaching the sensor; and an integrated circuit module, which is electrically connected to the photoelectric module. Compared with the prior art, the present invention has advantages such as high sensitivity and flat frequency response, providing potential for further improvements in device performance.

IPC Classes  ?

14.

MEMS OPTICAL MICROPHONE

      
Application Number 17952359
Status Pending
Filing Date 2022-09-26
First Publication Date 2024-03-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including: a shell including an inner cavity and a sound inlet that communicates the inner cavity with outside; a MEMS module including a diaphragm suspended in the inner cavity, a light flap is formed in the diaphragm, when an acoustic pressure is applied, an aperture is formed by opening of the light flap, and a size of the aperture increases or decreases with a magnitude of the acoustic pressure applied; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, and a light beam passes through the aperture to the sensor; and an integrated circuit module electrically connected with the optoelectronic module. Advantages of high sensitivity and flat frequency response are realized.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 23/00 - Transducers other than those covered by groups

15.

MEMS OPTICAL MICROPHONE

      
Application Number 17952340
Status Pending
Filing Date 2022-09-26
First Publication Date 2024-03-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including: a case, a membrane, a waveguide plate, a variable optical waveplate, an optoelectronic module, and an IC module. The case includes a cavity and a sound inlet. The membrane is suspended in the cavity and closes the sound inlet. The waveguide plate is suspended in the cavity and located at a side of the membrane away from the sound inlet. The optoelectronic module includes an electromagnetic radiation source and a sensing part provided at two opposite sides of the waveguide plate, respectively. The variable optical waveplate is configured to convert an input polarization state of the first light path into an output polarization state, which varies as a moving distance of the variable optical waveplate. The IC module is electrically connected to the membrane and the optoelectronic module. It has advantages such as high sensitivity, flat frequency response, thereby further improving the device performance.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
  • H04R 3/00 - Circuits for transducers
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 19/04 - Microphones

16.

MEMS OPTICAL MICROPHONE

      
Application Number 17952357
Status Pending
Filing Date 2022-09-26
First Publication Date 2024-03-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including a casing including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, an aperture is provided penetrating through the diaphragm, and a size of the aperture increases or decreases with acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the aperture, and a size of the light beam is larger than a maximum size of the aperture; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Dynamic range of the MEMS optical microphone is improved, wider range of sound signals can be sensed, and higher sensitivity can be realized.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 23/00 - Transducers other than those covered by groups

17.

METHOD AND APPARATUS FOR ELIMINATING SOUND LEAKAGE

      
Application Number 18088641
Status Pending
Filing Date 2022-12-26
First Publication Date 2024-03-14
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Liu, Kejia
  • Jiang, Yuheng
  • He, Wenkai

Abstract

A method for eliminating sound leakage includes: controlling, upon detecting call voice being outputted by a receiver, a collection device to determine a first frequency response curve of first sound wave of the call voice at a first position outside a terminal device; controlling a speaker to generate a second sound wave; controlling the collection device to determine a second frequency response curve of the second sound wave at the first position; and regulating, according to the first frequency response curve, the second frequency response curve to a third frequency response curve. Frequency responses of the first and third frequency response curves at a corresponding frequency are superimposed on and cancel each other. The speaker actively generates second sound wave that is modulated according to a parameter of first sound wave, so as to ensure that second sound wave effectively eliminates leakage of call content caused by first sound wave.

IPC Classes  ?

  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase

18.

SOUND-ABSORBING MATERIAL BLOCK, PREPARATION METHOD THEREFOR, AND USE THEREOF

      
Application Number CN2022122708
Publication Number 2024/050899
Status In Force
Filing Date 2022-09-29
Publication Date 2024-03-14
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Zhongyang
  • Wang, Hezhi
  • Zhang, Jie

Abstract

A sound-absorbing material block, a preparation method therefor, and a use thereof. The sound-absorbing material block comprises three-dimensional open-cell foam, sound-absorbing material powder, a binder, a gelling agent, and a cross-linking agent. The gelling agent, the cross-linking agent, and the binder enable the sound-absorbing material powder to be bonded to itself and connected to the three-dimensional open-cell foam. Based on the mass of the sound-absorbing material powder, the gelling agent accounts for 1-5 wt% of the sound-absorbing material powder and the binder accounts for 1-8 wt% of the sound-absorbing material powder, and based on the mass of the gelling agent, the cross-linking agent accounts for 1-10 wt% of the gelling agent. In the sound-absorbing material block, the amount of the binder that is added is reduced, and the sound absorption performance and strength of the material block are significantly improved.

IPC Classes  ?

19.

METHOD AND APPARATUS FOR EMILINATING SOUND LEAKAGE

      
Application Number 18088640
Status Pending
Filing Date 2022-12-26
First Publication Date 2024-03-14
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jiang, Yuheng
  • He, Wenkai
  • Liu, Kejia

Abstract

The present application relates to a method and apparatus for eliminating sound leakage which includes: determining a first frequency response curve of a first sound wave generated by the call voice at a first position outside a terminal device; controlling a vibration motor to drive a rear housing of the terminal device to vibrate to generate a second sound wave; determining a second frequency response curve of the second sound wave at the first position; and regulating the second frequency response curve to a third frequency response curve, frequency response of the third frequency response curve being superimposed on and canceling frequency response of the first frequency response curve at a corresponding frequency. The vibration motor drives the rear housing to vibrate to actively generate the second sound wave superimposed on and canceling the first sound wave generated by call sound leakage, so as to eliminate leakage of call content.

IPC Classes  ?

  • H04R 3/04 - Circuits for transducers for correcting frequency response

20.

SOUND LEAKAGE ELIMINATION METHOD AND APPARATUS

      
Application Number CN2022129413
Publication Number 2024/050949
Status In Force
Filing Date 2022-11-03
Publication Date 2024-03-14
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Liu, Kejia
  • Jiang, Yuheng
  • He, Wenkai

Abstract

The present application relates to the field of terminal devices, and in particular to a sound leakage elimination method and apparatus. The sound leakage elimination method comprises: when it is detected that a receiver outputs a call voice, controlling a collection device to determine a first frequency response curve of a first sound wave, which is generated by the call voice, at a first position outside a terminal device; controlling a speaker to generate a second sound wave; controlling the collection device to determine a second frequency response curve of the second sound wave at the first position; and according to the first frequency response curve, adjusting, to a third frequency response curve, the second frequency response curve generated by the second sound wave at the first position, wherein the frequency response of the third frequency response curve is used for being superimposed with and canceling the frequency response of the first frequency response curve at a corresponding frequency. By means of the solution, a speaker actively emits a second sound wave, and the second sound wave is modulated according to parameters of a first sound wave, so as to ensure that the second sound wave can more effectively eliminate the problem of call content leakage caused by the first sound wave.

IPC Classes  ?

  • H04M 1/58 - Anti-side-tone circuits
  • H04M 1/68 - Circuit arrangements for preventing eavesdropping

21.

SOUND LEAKAGE ELIMINATION METHOD AND APPARATUS

      
Application Number CN2022129705
Publication Number 2024/050950
Status In Force
Filing Date 2022-11-04
Publication Date 2024-03-14
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jiang, Yuheng
  • He, Wenkai
  • Liu, Kejia

Abstract

The present application relates to the field of terminal devices, and in particular to a sound leakage elimination method and apparatus. A sound leakage elimination method, comprising: when it is detected that a receiver outputs a call voice, controlling a collection device to determine a first frequency response curve, at a first position outside a terminal device, of a first sound wave generated by the call voice; controlling a vibration motor to drive a rear housing of the terminal device to vibrate to generate a second sound wave; determining, by means of the collection device, a second frequency response curve of the second sound wave at the first position; and according to the first frequency response curve, adjusting, to a third frequency response curve, the second frequency response curve generated by the second sound wave at the first position, wherein the frequency response of the third frequency response curve is used for superimposing and eliminating the frequency response of the first frequency response curve on a corresponding frequency. By means of the embodiments of the present invention, a vibration motor drives a rear housing of a terminal device to vibrate, so as to actively send a second sound wave, and the second sound wave superimposes and eliminates a first sound wave generated by leaked call sound, so as to eliminate the problem of leakage of call content.

IPC Classes  ?

22.

SOUND-ABSORBING MATERIAL BLOCK, METHOD FOR PREPARING THE SAME AND ITS APPLICATION

      
Application Number 18095000
Status Pending
Filing Date 2023-01-10
First Publication Date 2024-03-07
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Zhongyang
  • Wang, Hezhi
  • Zhang, Jie

Abstract

A sound-absorbing material block, a method for preparing the same and application thereof are provided. The sound-absorbing material block includes three-dimensional open-cell foam, sound-absorbing material powder, a binder, a gel, and a cross-linking agent. The sound-absorbing material powder is bonded to each other and connected to the three-dimensional open-cell foam by means of the gel, the cross-linking agent, and the binder, by mass of the sound-absorbing material powder, the gel accounts for 1 wt % to 5 wt % of the sound-absorbing material powder, and the binder accounts for 1 wt % to 8 wt % of the sound-absorbing material powder, and by mass of the gel, the cross-linking agent accounts for 1 wt % to 10 wt % of the gel. The sound-absorbing material block according to the present disclosure reduces an additive amount of the binder, and significantly improves sound-absorbing performance and strength of the material block.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • C08J 9/42 - Impregnation with macromolecular compounds
  • C09D 5/02 - Emulsion paints
  • C09D 7/20 - Diluents or solvents
  • C09D 7/61 - Additives non-macromolecular inorganic
  • C09D 109/08 - Latex
  • C09D 125/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
  • C09D 133/04 - Homopolymers or copolymers of esters
  • H04R 1/02 - Casings; Cabinets; Mountings therein

23.

MEMS MICROPHONE

      
Application Number CN2022125144
Publication Number 2024/045283
Status In Force
Filing Date 2022-10-13
Publication Date 2024-03-07
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Linlin
  • Zhang, Rui
  • Wang, Kaijie
  • Zhao, Zhuanzhuan
  • Nguyen, Ngoc Minh

Abstract

Provided in the present invention is a MEMS microphone, comprising a base having a back chamber, and a capacitance system arranged on the base, wherein the capacitance system comprises a back plate, and a diaphragm arranged opposite to the back plate; the back plate comprises a body portion and a fixing portion connected to the body portion and the base; and the back plate is further provided with several strip-shaped reinforcing ribs protruding from the body portion. Compared with the prior art, in the MEMS microphone provided by the present invention, the strength of the back plate can be improved.

IPC Classes  ?

24.

MICROPHONE CHIP AND MICROPHONE

      
Application Number 18072657
Status Pending
Filing Date 2022-11-30
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan
  • Wang, Linlin

Abstract

A microphone chip and a microphone are provided. The microphone chip includes a diaphragm and a back plate. When the sound wave drives the diaphragm to vibrate through the sound hole, a distance between the electrode sheet and the diaphragm changes, and a capacitance value of the capacitance system changes, thereby converting the sound wave signal into an electrical signal. In the direction perpendicular to the back plate, the outer contour of the projection of each protrusion on the diaphragm and an outer contour of a corresponding fold of the plurality of folds do not intersect, so as to prevent the protrusion from contacting and getting stuck with the side wall of the fold in the process of external vibration or excessive blowing, which may lead to adhesion between the diaphragm and the back plate and affection of the normal operation of the microphone chip.

IPC Classes  ?

  • H04R 7/14 - Non-planar diaphragms or cones corrugated, pleated, or ribbed
  • H04R 1/08 - Mouthpieces; Attachments therefor

25.

MICROPHONE CHIP

      
Application Number 18072661
Status Pending
Filing Date 2022-11-30
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan

Abstract

A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

26.

MICROPHONE CHIP AND MICROPHONE

      
Application Number 18072669
Status Pending
Filing Date 2022-11-30
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan

Abstract

A microphone chip and a microphone are provided. The microphone chip includes a substrate and a capacitive system disposed on the substrate. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate. The diaphragm includes an inner membrane portion, at least one outer membrane portion, and at least one supporting portion. The microphone chip further includes a supporting member. In an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions. The diaphragm in the operating state is divided by the supporting member into a plurality of floating regions separated from each other, such that the rigidity of the diaphragm can be effectively adjusted and enhanced according to requirements.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

27.

VIBRATION SENSOR

      
Application Number CN2022114686
Publication Number 2024/040494
Status In Force
Filing Date 2022-08-25
Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Meng, Zhenkui

Abstract

The present utility model provides a vibration sensor, comprising a circuit board having an accommodating cavity, and a first vibration assembly having a first vibration cavity and a second vibration assembly having a second vibration cavity which are respectively arranged on two opposite sides of the circuit board. The circuit board is provided with a first through hole for communicating the first vibration cavity with the accommodating cavity and a second through hole for communicating the second vibration cavity with the accommodating cavity; the first vibration assembly vibrates so that the air pressure in the first vibration cavity changes and the vibration is transferred to a MEMS chip through the first through hole, and the second vibration assembly vibrates so that the air pressure in the second vibration cavity changes and the vibration is transferred to the MEMS chip through the second through hole. The MEMS chip in the vibration sensor provided by the present utility model can better sense vibrations generated by the two vibration assemblies, and convert sensed vibration signals into electric signals, thereby effectively improving the sensitivity and greatly improving the signal-to-noise ratio at the same time.

IPC Classes  ?

28.

MICROPHONE CHIP AND MICROPHONE

      
Application Number CN2022119284
Publication Number 2024/040648
Status In Force
Filing Date 2022-09-16
Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan

Abstract

The present application relates to the technical field of condenser microphones, in particular to a microphone chip and a microphone. The microphone chip comprises: a substrate with a front cavity; and a capacitance system, which is arranged on the substrate, and comprises a diaphragm located at an upper part of the substrate and a back plate spaced apart from the diaphragm, wherein an air gap is formed between the diaphragm and the back plate, and the diaphragm and the back plate are connected to the substrate by means of a fixing portion. The diaphragm comprises an inner diaphragm portion, an outer diaphragm portion and a supporting portion, wherein the inner diaphragm portion and the outer diaphragm portion are spaced apart, and the supporting portion is connected to the fixing portion and the inner diaphragm portion or connected to the fixing portion and the outer diaphragm portion. The microphone chip further comprises a supporting piece, which is connected to the back plate and located between the back plate and the inner diaphragm portion. In an operating state, the inner diaphragm portion can be attracted onto the supporting piece, and the supporting piece can divide the inner diaphragm portion into at least two areas. The diaphragm in the operating state is divided into a plurality of isolated floating areas by means of the supporting piece, so that the rigidity of the diaphragm is effectively adjusted and enhanced according to requirements.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor

29.

Vibration Transducer

      
Application Number 18073452
Status Pending
Filing Date 2022-12-01
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Meng, Zhenkui

Abstract

The present disclosure discloses a vibration transducer including a circuit board enclosing a receiving cavity, a MEMS chip, a first vibration unit having a first vibration cavity and a second vibration unit having a second vibration cavity. A first through hole provided on the circuit board is configured to connect the receiving cavity with the first vibration cavity; a second through hole provided on the circuit board is configured to connect the receiving cavity with the second vibration cavity. The first vibration unit vibrates to cause pressure change in the first vibration cavity which is transmitted to the MEMS chip through the first through hole; the second vibration unit vibrates to cause pressure change in the second vibration cavity which is transmitted to the MEMS chip through the second through hole. The vibration transducer in the present disclosure has higher sensitivity and SNR.

IPC Classes  ?

30.

MICROPHONE CHIP

      
Application Number CN2022119299
Publication Number 2024/040649
Status In Force
Filing Date 2022-09-16
Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan

Abstract

The present application relates to a microphone chip, comprising: a substrate with a front cavity, and a capacitance system, which is arranged on and connected to the substrate. The capacitance system comprises a diaphragm located at an upper part of the substrate and a back plate spaced apart from the diaphragm, wherein an air gap is formed between the diaphragm and the back plate, and the diaphragm and the back plate are connected to the substrate by means of a fixing portion. The diaphragm comprises an inner diaphragm portion, an outer diaphragm portion and a supporting portion, wherein the inner diaphragm portion and the outer diaphragm portion are spaced apart by a slit, and the supporting portion is connected to the fixing portion. The microphone chip further comprises a sealing piece, which is connected to the back plate, located between the back plate and the diaphragm, and arranged near the periphery of the inner diaphragm portion. In the microphone chip, the inner diaphragm portion and the outer diaphragm portion are spaced apart by the slit, and the supporting portion is connected to the fixing portion to fix the diaphragm, so that the diaphragm is cantilevered; and by arranging the sealing piece between the back plate and the diaphragm, the inner diaphragm portion is attracted onto the sealing piece by means of an electrostatic force, the sealing piece supports the inner diaphragm portion to achieve an operating state, and low attenuation of a microphone is reduced.

IPC Classes  ?

31.

MICROPHONE CHIP AND MICROPHONE

      
Application Number CN2022119520
Publication Number 2024/040652
Status In Force
Filing Date 2022-09-19
Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan
  • Wang, Linlin

Abstract

The present application relates to a microphone chip and a microphone. The microphone chip comprises: a diaphragm and a backplane, wherein the diaphragm is provided with a plurality of corrugations, the side of the backplane close to the diaphragm is provided with protrusions, and in the direction perpendicular to the backplane, the outer contours of the projections of the protrusions on the diaphragm do not intersect the outer contours of the corrugations. The side of the backplane close to the diaphragm is provided with an electrode sheet, and the side of the diaphragm close to the backplane is also provided with an electrode, so that the electrode sheet and the diaphragm form a capacitor system. The backplane is provided with sound outlet holes, and when acoustic waves pass through the sound outlet holes and drive the diaphragm to vibrate, the distance between the electrode sheet and the diaphragm changes, and the capacitance value of the capacitor system changes, so as to convert an acoustic wave signal into an electrical signal. In the direction perpendicular to the backplane, the outer contours of the projections of the protrusions on the diaphragm do not intersect the outer contours of the corrugations, thereby preventing the normal operation of the microphone chip from being affected by the adhesion between the diaphragm and the backplane due to the fact that the protrusions are in contact with and get stuck in the side walls of the corrugations during external vibration or excessive blowing.

IPC Classes  ?

32.

MEMS optical microphone

      
Application Number 17952358
Grant Number 11917366
Status In Force
Filing Date 2022-09-26
First Publication Date 2024-02-27
Grant Date 2024-02-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including: a shell including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, when an acoustic pressure is applied, an aperture is formed in the diaphragm, and the size of the aperture increases or decreases with the magnitude of the acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor, the electromagnetic radiation source and the sensor are arranged on opposite sides of the diaphragm, and a light beam emitted by the electromagnetic radiation source passes through the aperture and reaches the sensor; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Advantages of high sensitivity and flat frequency response can be achieved, which provides the potential to further improve the performance of the device.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups
  • H04R 1/08 - Mouthpieces; Attachments therefor
  • G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
  • A61B 5/107 - Measuring physical dimensions, e.g. size of the entire body or parts thereof
  • G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness

33.

MEMS DEVICE MANUFACTURING METHOD AND MEMS DEVICE

      
Application Number CN2022121224
Publication Number 2024/036705
Status In Force
Filing Date 2022-09-26
Publication Date 2024-02-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chang, Ping-He
  • Lai, Kah Keen

Abstract

An MEMS device manufacturing method and an MEMS device. The method comprises: depositing a thin film (2) on at least part of the surface of a sacrificial layer (1); machining through holes (21) in the thin film (2); removing at least part of a material covered by the thin film (2) in the sacrificial layer (1), and discharging from the through holes (21) the material removed from the sacrificial layer (1), so as to form a cavity (11) in the sacrificial layer (1); and depositing a sealing layer (4) on the surface of the thin film (2) facing away from the sacrificial layer (1), so as to seal the through holes (21). According to the present invention, only a layer of thin film (2) needs to be deposited, such that the production period can be shortened, and a reliable field sealing capability is achieved.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

34.

METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

      
Application Number 18073472
Status Pending
Filing Date 2022-12-01
First Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chang, Ping-He
  • Lai, Kahkeen

Abstract

A method for manufacturing a MEMS device and the MEMS device are provided. The method includes: depositing a film on at least a part of a surface of a sacrificial layer, defining at least one through hole in the thin film by machining, removing at least a part of a material covered by the thin film in the sacrificial layer, discharging the part of the material removed from the sacrificial layer from the at least one through hole to define a cavity in the sacrificial layer, and depositing a sealing layer on a surface of the thin film facing away from the sacrificial layer to seal the at least one through hole. Compared with the manufacturing method in the related art, the manufacturing method of the disclosure only requires to deposit one layer of thin film, shorten the production period, and has reliable on-site sealing capability.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

35.

Vibration transducer

      
Application Number 18079004
Status Pending
Filing Date 2022-12-12
First Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure discloses a vibration transducer including a circuit board, a vibration detection assembly and a signal detection assembly arranged on two opposite sides of the circuit board; the vibration detection assembly includes a first vibration detection unit, a second vibration detection unit, and a third vibration detection unit; the signal detection assembly includes a first MEMS microphone, a second MEMS microphone, and a third MEMS microphone. A first membrane of the first vibration detection unit, a second membrane of the second vibration detection unit, and the third membrane of the third vibration detection unit vibrate along three orthogonal directions. The vibration transducer has higher sensitivity and bigger bandwidth.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 19/04 - Microphones

36.

CANTILEVER MICROPHONE

      
Application Number CN2023078384
Publication Number 2024/031961
Status In Force
Filing Date 2023-02-27
Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Kervran, Yannick Pierre
  • Cargill, Scott Lyall

Abstract

Provided in the present invention is a cantilever microphone, comprising: a base plate; a cantilever, which comprises a rotor frame, a cover plate that covers the rotor frame, and a plurality of rotor comb fingers, the cantilever being provided with a first edge fixed to the base plate and a second edge opposite to the first edge, the plurality of rotor comb fingers being fixed to an edge of the end of the cover plate close to the second edge, and the rotor comb fingers being spaced apart from the rotor frame; and a stator, which is fixed to the base plate and comprises a plurality of stator comb fingers, wherein the stator comb fingers and the rotor comb fingers are alternately arranged and spaced apart from each other; and the rotor frame is made of at least one of polycrystalline silicon, silicon nitride, silicon oxide and silicon carbide. The cantilever microphone of the present invention can achieve both high mechanical sensitivity of the cantilever and high electrostatic sensitivity of the comb structure, thereby improving the performance or signal-to-noise ratio of the cantilever microphone.

IPC Classes  ?

37.

CANTILEVER MICROPHONE

      
Application Number 17883645
Status Pending
Filing Date 2022-08-09
First Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Kervran, Yannick Pierre
  • Cargill, Scott Lyall

Abstract

A cantilever microphone includes: a substrate; a cantilever including a rotor frame and a plate covering the rotor frame, where the cantilever includes a first edge fixed to the substrate and a second end opposite to the first edge, a plurality of rotor comb fingers is attached to the plate at an edge of the plate adjacent to the second edge; and a stator fixed to the substrate or attached to a sub structure to allow some displacement from the substrate, where the stator includes a plurality of stator comb fingers, and the stator comb fingers are interdigitated with the rotor comb fingers. For the cantilever microphone, high mechanical sensitivity of the cantilever and high electrostatic sensitivity of the comb structure can be implemented, so as to increase the performance or signal-to-noise ratio of the cantilever microphone.

IPC Classes  ?

38.

VIBRATION SENSOR

      
Application Number CN2022119759
Publication Number 2024/031783
Status In Force
Filing Date 2022-09-20
Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jin Yu

Abstract

A vibration sensor (100), comprising a circuit board (1), and a vibration pickup structure (2) and a signal pickup assembly (3) which are respectively fixed to two opposite sides of the circuit board (1). The vibration pickup structure (2) comprises a first vibration pickup structure (23) accommodated in a first vibration cavity (26), a second vibration pickup structure (24) accommodated in a second vibration cavity (27), and a third vibration pickup structure (25) accommodated in a third vibration cavity (28), wherein the first vibration pickup structure (23), the second vibration pickup structure (24), and the third vibration pickup structure (25) are mutually independent pairwise. The signal pickup assembly (3) comprises a first MEMS microphone (31), a second MEMS microphone (32), and a third MEMS microphone (33). The first vibration pickup structure (23) comprises a first diaphragm (231) vibrating along a first axis (X), the second vibration pickup structure (24) comprises a second diaphragm (241) vibrating along a second axis (Y), and the third vibration pickup structure (25) comprises a third diaphragm (251) vibrating along a third axis (Z). The first axis (X), the second axis (Y) and the third axis (Z) are perpendicular to each other. According to the vibration sensor (100), vibration signals in three directions can be picked up at the same time, and the induced vibration signals are converted into electrical signals, thereby effectively improving the sensitivity and bandwidth of the vibration sensor (100).

IPC Classes  ?

  • H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
  • H04R 19/04 - Microphones
  • H04R 19/00 - Electrostatic transducers
  • G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means

39.

THIN-FILM BULK ACOUSTIC RESONATOR

      
Application Number CN2022110237
Publication Number 2024/007404
Status In Force
Filing Date 2022-08-04
Publication Date 2024-01-11
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Shuai
  • Wu, Ke
  • Wang, Chao
  • Zhang, Lirong
  • Zhuang, Zhiqiang

Abstract

A thin-film bulk acoustic resonator, comprising a substrate (1), an acoustic reflection structure (2) arranged on one side of the substrate (1), a bottom electrode (3) stacked on one side of the acoustic reflection structure (2), a piezoelectric thin film (4) covering the bottom electrode (3), and a top electrode (5) stacked on the side of the piezoelectric thin film (4) away from the bottom electrode (3), wherein an interdigitated protruding frame (6) is provided on the side of the top electrode (5) away from the piezoelectric thin film (4); the interdigitated protruding frame (6) comprises a first protruding frame (61) and a second protruding frame (62) which are arranged opposite each other; at least one pair of interdigitated structures which respectively extend towards each other from the first protruding frame (61) and the second protruding frame (62) and are spaced apart by a preset distance is formed in an overlapping manner; and each interdigitated structure comprises two interdigital fingers spaced by a preset distance in an overlap direction. Two or more transverse Rayleigh-Lamb waves can be reflected to achieve high reflection efficiency, and a Q value corresponding to the anti-resonance frequency of the resonator is improved. The problem of stripping residue caused by a closed loop of an existing protruding frame can be solved.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/05 - Holders or supports
  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator

40.

MEMS MICROPHONE

      
Application Number CN2022114905
Publication Number 2024/000773
Status In Force
Filing Date 2022-08-25
Publication Date 2024-01-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present invention provides a MEMS microphone, comprising a substrate having a back cavity and a capacitor system provided on the substrate. The capacitor system comprises a back plate and a vibrating diaphragm provided opposite to the back plate; the vibrating diaphragm comprises a vibrating portion and a fixed portion surrounding the vibrating portion and fixed to the substrate; the vibrating portion and the fixed portion are spaced apart by a slit; the fixed portion is provided with a plurality of release portions; and the release portions penetrate through the fixed portion. Compared with the related technologies, the MEMS microphone provided by the present invention can improve the reliability of the back plate.

IPC Classes  ?

41.

ELECTROSTATIC CLUTCH

      
Application Number CN2022116395
Publication Number 2024/000797
Status In Force
Filing Date 2022-09-01
Publication Date 2024-01-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Patel, Anup
  • Boyd, Euan James
  • Kervran, Yannick Pierre

Abstract

An electrostatic clutch (100). The electrostatic clutch (100) comprises: a plurality of grounded high-impedance node electrode arrays (101), which form a rigid movable body; and a plurality of bias electrode arrays (102), which form another rigid movable body, such that an electrostatic force is generated between the plurality of bias electrode arrays (102) and the plurality of high-impedance node electrode arrays (101) when relative displacement occurs between same. Compared with the prior art, a microphone is allowed to operate under a large-range atmospheric pressure possibly expected by a customer. The electrostatic clutch is electrostatically implemented in a purely passive manner, and has advantages over other designs that require complicated electronic and active control; and since only minor alternating-current disturbances of a rotor need to be taken into account when a direct-current change at the position of the rotor is not taken into account, a film is physically decoupled from a sensing structure, such that the design of the sensing structure is simplified.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 3/04 - Circuits for transducers for correcting frequency response
  • H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
  • H04R 19/04 - Microphones

42.

ELECTROSTATIC CLUTCH

      
Application Number 17852255
Status Pending
Filing Date 2022-06-28
First Publication Date 2023-12-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Patel, Anup
  • Boyd, Euan James
  • Kervran, Yannick Pierre

Abstract

Provided is an electrostatic clutch. The electrostatic clutch includes: multiple arrays of HIN electrodes, a respective pass-through channel being formed between any two arrays of the multiple arrays of HIN electrodes; and multiple arrays of biased electrodes, each array of the multiple arrays of biased electrodes moving back and forth in the respective pass-through channel such that electrostatic force is generated between the multiple arrays of biased electrodes and the multiple arrays of HIN electrodes. Such configuration allows microphone performance over a wide range of atmospheric pressures which is likely expected by applications. This is achieved electrostatically in a purely passive way having advantages over other designs which require complex electronics and active control. Physically decoupling the membrane and sense structure simplifies design of the sense structure as only small AC perturbations of the rotor is considered with no DC changes in rotor position.

IPC Classes  ?

43.

MEMs condenser microphone

      
Application Number 17852279
Grant Number 11950054
Status In Force
Filing Date 2022-06-28
First Publication Date 2023-12-28
Grant Date 2024-04-02
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Patel, Anup
  • Boyd, Euan James
  • Kervran, Yannick Pierre

Abstract

Provided is a MEMS condenser microphone, including a base plate, a spacer and a membrane. The membrane is supported above the base plate by the spacer. The base plate, the spacer, and the membrane enclose a vacuum cavity. An end of the membrane close to the vacuum cavity is connected, by means of a connecting rod, to an electrostatic clutch. The electrostatic clutch is connected to a capacitive sensing structure. The microphone has the advantage of allowing microphone performance over a wide range of atmospheric pressures which is likely expected by customers. This is achieved electrostatically in a purely passive way which has an advantage over other designs which require complex electronics and active control. Physically decoupling the membrane and sense structure simplifies the design of the sense structure as only small AC perturbations of the rotor need to be considered with no DC changes in rotor position.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

44.

MEMS Speaker

      
Application Number 17969668
Status Pending
Filing Date 2022-10-19
First Publication Date 2023-12-21
Owner
  • AAC Kaitai Technologies (Wuhan) CO., LTD (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Dan, Qiang
  • Shen, Yu
  • Zhou, Yiwei
  • Li, Yang

Abstract

The invention provides a MEMS speaker including a substrate enclosing a cavity, a cantilever beam at least partially suspended above the cavity, a piezoelectric actuator away from the cavity, a polymer layer away from the cavity and attached to the cantilever beam and the piezoelectric actuator for completely covering the cantilever beam, the piezoelectric actuator and the cavity, and a piezoelectric composite vibration structure formed by the polymer layer. The cantilever beam includes a first section fixed to the substrate, a second section extending from the first section to the cavity and suspended above the cavity, and a third section extending from the second section away from the first section, an end of the third section away from the second section being suspended; and the piezoelectric actuator is only fixed with the third section.

IPC Classes  ?

  • H04R 17/00 - Piezoelectric transducers; Electrostrictive transducers

45.

MEMS device

      
Application Number 17826184
Grant Number 11889282
Status In Force
Filing Date 2022-05-27
First Publication Date 2023-11-30
Grant Date 2024-01-30
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Boyd, Euan James
  • Cargill, Scott Lyall
  • Kervran, Yannick Pierre

Abstract

Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.

IPC Classes  ?

  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 19/04 - Microphones

46.

MEMS device

      
Application Number 17826185
Grant Number 11974109
Status In Force
Filing Date 2022-05-27
First Publication Date 2023-11-30
Grant Date 2024-04-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Boyd, Euan James
  • Cargill, Scott Lyall

Abstract

Provided is an MEMS device, including: a base, a rear cavity; a vibrating diaphragm, the vibrating diaphragm including an upper diaphragm and a lower diaphragm, and an accommodation space being formed between the upper and lower diaphragms; a counter electrode arranged in the accommodation space; and supporting members concentrically arranged and spaced apart. The supporting members are arranged between the upper and lower diaphragms and are spaced apart from the counter electrode, two opposite ends of each supporting member are connected to the upper and lower diaphragms, and at least one of the supporting members is provided with first cavities. An upper ventilation hole and a lower ventilation hole are respectively formed at a position of the upper diaphragm and a position of the lower diaphragm corresponding to one of the first cavities; and the upper ventilation hole, the first cavity and the lower ventilation hole communicate with each other.

IPC Classes  ?

  • H04R 7/12 - Non-planar diaphragms or cones
  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones

47.

LOUDSPEAKER MODULE AND ASSEMBLY METHOD

      
Application Number CN2022098084
Publication Number 2023/226093
Status In Force
Filing Date 2022-06-10
Publication Date 2023-11-30
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Yang, Haijuan
  • Wang, Lei
  • Wu, Shuwen

Abstract

The present invention provides a loudspeaker module, comprising a housing having an accommodating space, a vibration system accommodated inside the accommodating space, and a magnetic circuit system accommodated inside the accommodating space and configured for driving the vibration system, wherein the housing comprises a supporting frame having a through cavity, a front cover covering one side of the supporting frame, and a rear cover covering a side of the supporting frame facing away from the front cover; a positioning structure is provided on an inner side of the supporting frame and the inner side of the supporting frame extends towards the interior of the through cavity to form clamping plates; an edge of the vibration system is connected to a side of the positioning structure close to the front cover; the magnetic circuit system is fixed to a side of the positioning structure close to the rear cover and is fixed to the clamping plates; the vibration system and the front cover define a front cavity; and the vibration system, the supporting frame and the rear cover define a rear cavity. The vibration system and the magnetic circuit system of the present invention are directly assembled with the housing to obtain the loudspeaker module, and the two assembly procedures of a loudspeaker and a module that are separate in the prior art can be simplified into one assembly procedure for a loudspeaker, thereby reducing the cost.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details

48.

MEMS DEVICE

      
Application Number 17826182
Status Pending
Filing Date 2022-05-27
First Publication Date 2023-11-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Boyd, Euan James
  • Cargill, Scott Lyall
  • Kervran, Yannick Pierre

Abstract

Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing through; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, ventilation slots are annularly spaced on the diaphragm along circumferential direction and penetrate through the first and second membranes, the electrode region extends from center of the first and second membranes toward but does not reach the ventilation slots. Through design of the first and second membranes and the electrode region, sensitivity of the microphone is increased.

IPC Classes  ?

  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 19/04 - Microphones
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

49.

LOUDSPEAKER MODULE AND ASSEMBLY METHOD THEREFOR

      
Application Number CN2022098087
Publication Number 2023/226094
Status In Force
Filing Date 2022-06-10
Publication Date 2023-11-30
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Yang, Haijuan
  • Wang, Lei
  • Wu, Shuwen

Abstract

Provided in the present invention are a loudspeaker module and an assembly method therefor. The loudspeaker module comprises a housing having an accommodating space, and a vibration system and a magnetic circuit system which are accommodated in the accommodating space. The housing comprises a basket, and an upper cover plate and a lower cover plate which cover opposite sides of the basket. The basket has a side wall extending in a vibration direction of a diaphragm; the basket and the side wall enclose the accommodating space; and the diaphragm, a circuit board and a magnetic bowl are disposed on the side wall. The upper cover plate, the vibration system and the basket enclose a front sound cavity; and the lower cover plate, the vibration system, the magnetic circuit system and the basket enclose a rear sound cavity. According to the present invention, the basket has the side wall, and when the upper cover plate and the lower cover plate are assembled on the basket, the basket, the upper cover plate and the lower cover plate form the housing of the loudspeaker module, that is, the assembly process is simplified from the original two separate assembly processes for a loudspeaker unit and a loudspeaker module into one assembly process for the loudspeaker module, thereby reducing the machining difficulty and cost.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details

50.

Diaphragm and MEMS Sensor Using Same

      
Application Number 17970585
Status Pending
Filing Date 2022-10-21
First Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Linlin
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Shi, Zhengyu
  • Nguyen, Minh Ngoc
  • Zhang, Rui

Abstract

The present invention provides a diaphragm and a MEMS sensor using the diaphragm. The diaphragm is a rectangular diaphragm, and the diaphragm includes a main body of the diaphragm and fixed parts arranged outside the main body of the diaphragm and located at the four corners of the diaphragm. The four corners of the rectangular diaphragm are depressed parts formed by concave in the direction of the diaphragm main body. The fixed part includes at least two fixed anchor points arranged along the edge of the diaphragm forming the depressed part. The present invention improves the effective sensing area of the diaphragm and the acoustic performance of the MEMS sensor.

IPC Classes  ?

  • H04R 19/00 - Electrostatic transducers
  • H04R 19/04 - Microphones
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

51.

Gas Sensor

      
Application Number 18095003
Status Pending
Filing Date 2023-01-10
First Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure provides a gas sensor, including a substrate, a first housing fixed on the substrate and enclosed with the substrate to form a first chamber, and a first infrared transmitter and a first acoustic sensor connected to the substrate. The first acoustic sensor and the first infrared transmitter are housed in the first chamber, and the first housing is provided with a first venthole. The gas sensor also includes an environmental detection assembly connected to the substrate and located outside the first housing, and a differential processor connected to the substrate. The differential processor of the present disclosure can eliminate the ambient sound signal and the vibration signal in the first detection signal according to the second detection signal. Eliminate the strong interference of noise and vibration in the external environment, and improve the accuracy of the gas concentration detection of the gas sensor.

IPC Classes  ?

  • G01N 29/02 - Analysing fluids
  • G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
  • G01N 21/01 - Arrangements or apparatus for facilitating the optical investigation
  • G01N 29/24 - Probes

52.

Method for audio peak reduction using all-pass filter

      
Application Number 17732417
Grant Number 11881829
Status In Force
Filing Date 2022-04-28
First Publication Date 2023-11-02
Grant Date 2024-01-23
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Schlecht, Sebastian
  • Fierro, Leonardo
  • Valimaki, Vesa
  • Backman, Juha

Abstract

Provided is a method for audio peak reduction using an all-pass filter, including: determining a delay parameter m and a gain parameter g based on a formula (1): absolute peak map s is calculated based on formula (3): This method is widely used in the reproduction, storage and broadcasting of sound, and the computational complexity is small, which is a supplement to the traditional nonlinear compression algorithm.

IPC Classes  ?

  • H03G 7/00 - Volume compression or expansion in amplifiers

53.

LOUDSPEAKER

      
Application Number CN2022097068
Publication Number 2023/206714
Status In Force
Filing Date 2022-06-06
Publication Date 2023-11-02
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Wang, Hezhi
  • Zhang, Jie
  • Wang, Zhongyang

Abstract

Provided in the present invention is a loudspeaker. The loudspeaker comprises a cavity filled with a sound absorption material, wherein the cavity is further filled with expandable foam which expands after being triggered, so as to limit the movement of the sound absorption material in the cavity. By means of the loudspeaker provided by the present invention, the reliability of the filled sound absorption material is improved.

IPC Classes  ?

54.

DIAPHRAGM AND MEMS SENSOR

      
Application Number CN2022093423
Publication Number 2023/206642
Status In Force
Filing Date 2022-05-18
Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Linlin
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Shi, Zhengyu
  • Ruan, Yuming
  • Zhang, Rui

Abstract

A diaphragm (2) and an MEMS sensor (100) using the diaphragm. The diaphragm (2) is a rectangular diaphragm; the diaphragm comprises a diaphragm main body portion (21) as well as fixing portions (22) which are provided on the outside of the diaphragm main body portion (21) and are located at four corners of the diaphragm (2); the four corners of the diaphragm (2) are recessed towards the direction of the diaphragm main body portion (21) to form recessed portions (23); and each fixing portion (22) comprises at least two fixing anchor points (220) provided along the edge, where the corresponding recessed portion (23) is formed, of the diaphragm (2). According to the design of the diaphragm (2), the effective sensing area of the diaphragm (2) and the acoustic performance of the MEMS sensor (100) are improved.

IPC Classes  ?

55.

MEMS MICROPHONE CHIP

      
Application Number CN2022093426
Publication Number 2023/206644
Status In Force
Filing Date 2022-05-18
Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Zhang, Rui

Abstract

Provided is a MEMS microphone chip, comprising a substrate, a first diaphragm fixed to the substrate, a supporting member fixed to the first diaphragm, and a second diaphragm fixed to the supporting member and spaced apart from the first diaphragm; the second diaphragm comprises a supporting portion supported on the supporting member and a free end surrounding the supporting portion; the projection of the free end in a vibration direction falls into a back cavity. The second diaphragm is configured to be a cantilever beam structure having a free end, and the middle part of the first diaphragm having a maximum displacement is used for driving the second diaphragm having the free end in connection with the middle part by means of the supporting member, so that the limitation of stress and thickness on the vibration performance of the second diaphragm is remarkably reduced, and the sensitivity of the second diaphragm is effectively improved, thereby improving the signal-to-noise ratio of the MEMS microphone chip.

IPC Classes  ?

56.

GAS SENSOR

      
Application Number CN2022093812
Publication Number 2023/206663
Status In Force
Filing Date 2022-05-19
Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

A gas sensor, comprising: a substrate (1); a first housing (21), which is fixed to the substrate (1) and forms a first chamber (32) with the substrate (1) by means of enclosure; and a first infrared transmitter (35) and a first sound sensor (31), which are connected to the substrate (1), wherein the first sound sensor (31) and the first infrared transmitter (35) are both accommodated in the first chamber (32), and the first housing (21) is provided with a first vent hole (33). The gas sensor further comprises: an environment detection assembly (4), which is connected to the substrate (1) and is located outside the first housing (21); and a differential processor, which is connected to the substrate (1), wherein a second detection signal, which is generated by the environment detection assembly (4), includes an ambient sound signal and a vibration signal, and the differential processor is electrically connected to the first sound sensor (31) and the environment detection assembly (4). The differential processor may cancel an ambient sound signal and a vibration signal in a first detection signal according to the second detection signal, and eliminate the strong interference of noise and vibration in an external environment, thereby improving the precision of gas concentration measurement performed by the gas sensor.

IPC Classes  ?

57.

MEMS MICROPHONE

      
Application Number CN2022097266
Publication Number 2023/206721
Status In Force
Filing Date 2022-06-07
Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Shi, Zhengyu
  • Wang, Kaijie
  • Wang, Linlin
  • Zhang, Rui

Abstract

Provided in the present invention is an MEMS microphone. The MEMS microphone comprises a base having a back cavity and a capacitive system arranged on the base; the capacitive system comprises a back plate and a diaphragm arranged opposite to the back plate, the diaphragm being located on the side of the back plate close to the base, and the diaphragm comprising a vibration part and a fixed part surrounding the vibration part and fixed to the base. The MEMS microphone is further provided with a supporting member located between the diaphragm and the back plate, the vibration part of the diaphragm being fixedly connected to the back plate by means of the supporting member. A blocking part is arranged on the side of the back plate facing the diaphragm, the projection of the blocking part in the vibration direction of the diaphragm being located at the vibration part of the diaphragm. Compared with the related art, the MEMS microphone provided by the present invention can improve the signal-to-noise ratio thereof.

IPC Classes  ?

58.

MEMS Microphone

      
Application Number 17994026
Status Pending
Filing Date 2022-11-25
First Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Siewseong
  • Chang, Yangmeng
  • Chua, Tiongkee
  • Pu, Jingxin
  • Zhang, Rui

Abstract

The present invention provides a MEMS microphone, including a housing body with a containment space, a sound hole penetrating the housing body, a MEMS microphone chip, an ASIC chip and a subtractor accommodated in the containment space. The MEMS microphone chip includes at least a first MEMS microphone chip and a second MEMS microphone chip. the first MEMS microphone chip is different from the frequency response droop characteristic of the second MEMS microphone chip. the first MEMS microphone chip and the output signal of the second MEMS microphone chip are output to the subtractor, and are output to the ASIC chip after the subtractor performs subtraction processing. Compared with the related art, the MEMS microphone of the present invention has good anti-interference performance and good sensitivity.

IPC Classes  ?

  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 19/04 - Microphones

59.

CORE-SHELL MOLECULAR SIEVE AND PREPARATION METHOD THEREFOR, SOUND-ABSORBING MATERIAL, AND LOUDSPEAKER

      
Application Number CN2022093428
Publication Number 2023/201810
Status In Force
Filing Date 2022-05-18
Publication Date 2023-10-26
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Zhang, Jie
  • Wang, Hezhi
  • Wang, Zhongyang

Abstract

A core-shell structure molecular sieve, taking a ZSM-5 molecular sieve with a mesoporous structure as a core phase, the silicon-aluminum mass ratio of silicon to aluminum of the core phase being 50-150. The core-shell structure molecular sieve takes a rare earth metal-modified ZSM-5 molecular sieve with a microporous structure as a shell layer, the mass ratio of silicon to aluminum of the shell layer being 300-800, and the shell layer containing 1-5 wt% of a rare earth metal. The shell layer of the core-shell structure molecular sieve has a high silicon-to-aluminum ratio, and after being modified with the rare earth metal, has a greatly improved water resistance. Meanwhile, the microporous structure of the shell layer can effectively limit the entry of VOCs into the core phase of the core-shell structure molecular sieve, so that the molecular sieve in the core phase can maintain a good activity, improving the water resistance and VOCs performance of a sound-absorbing material prepared from the molecular sieve with the core-shell structure, and thus endowing a loudspeaker filled with the sound-absorbing material with stable acoustic performance.

IPC Classes  ?

  • C01B 39/40 - Type ZSM-5 using at least one organic template directing agent
  • C01B 39/02 - Crystalline aluminosilicate zeolites; Isomorphous compounds thereof; Direct preparation thereof; Preparation thereof starting from a reaction mixture containing a crystalline zeolite of another type, or from preformed reactants; After-treatment thereof
  • C04B 26/04 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C04B 26/06 - Acrylates
  • G10K 11/162 - Selection of materials
  • H04R 1/02 - Casings; Cabinets; Mountings therein

60.

SINGLE-ENDED-TO-DIFFERENTIAL MICROPHONE CIRCUIT

      
Application Number CN2022093937
Publication Number 2023/201824
Status In Force
Filing Date 2022-05-19
Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Chuationg, Kee

Abstract

HCMMEMSACFB1FB1FB2FB2MEMSACAC) is connected to an input end of the second primary amplifier (Amp2); and the signal processing module (10) is used for adjusting output signals of the first primary amplifier (Amp1) and the second primary amplifier (Amp2) to target differential signals that have equal amplitudes and opposite phases, and outputting the target differentials signal to the current sharing amplifier (CR-Amp). In the single-ended-to-differential microphone circuit, the current sharing amplifier (CR-Amp), which has a small range of input common-mode voltages and low noise, is used to realize single-ended-to-differential conversion of a signal, thereby facilitating the improvement of a signal-to-noise ratio of a circuit.

IPC Classes  ?

  • H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
  • H03F 3/45 - Differential amplifiers
  • H04R 3/00 - Circuits for transducers

61.

SINGLE-ENDED-TO-DIFFERENTIAL MICROPHONE CIRCUIT AND ELECTRONIC DEVICE

      
Application Number CN2022094173
Publication Number 2023/201829
Status In Force
Filing Date 2022-05-20
Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Chuationg, Kee

Abstract

ACFB1FB1FB1FB2FB2FB1BBB enables an alternating-current electrical signal to be input at the positive input end and the negative input end of the amplifier at the same time. The circuit in the present invention can use a microphone structure having a smaller capacitor, and also achieves a better system signal-to-noise ratio.

IPC Classes  ?

  • H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
  • H03F 3/45 - Differential amplifiers
  • H03F 3/00 - Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements

62.

Microphone

      
Application Number 17994024
Status Pending
Filing Date 2022-11-25
First Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Siewseong
  • Chang, Yangmeng
  • Chua, Tiongkee
  • Pu, Jingxin
  • Zhang, Rui

Abstract

The present invention provides a microphone, including a protection structure with a containment space, and an ASIC chip and a MEMS microphone chip accommodated in the containment space. The microphone also includes a low pass filter circuit. The low pass filter circuit is connected between the ASIC chip and the MEMS microphone chip, or the low pass filter circuit is integrated in the ASIC chip. The high frequency cutoff frequency of the low pass filter circuit is greater than 20 khz, so that by setting the low pass filter circuit, the interference of the ultrasonic frequency band can be filtered, the noise can be reduced, and the audio quality can be improved.

IPC Classes  ?

  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

63.

MEMS MICROPHONE

      
Application Number CN2022093437
Publication Number 2023/201811
Status In Force
Filing Date 2022-05-18
Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Siewseong
  • Chang, Yangmeng
  • Chua, Tiongkee
  • Pu, Jingxin
  • Zhang, Rui

Abstract

The present utility model provides a MEMS microphone, comprising a housing provided with an accommodating space, a sound hole that penetrates through the housing, MEMS microphone chips and an ASIC chip that are accommodated in the accommodating space, and a subtractor. The MEMS microphone chips comprise at least a first MEMS microphone chip and a second MEMS microphone chip, and the frequency response drop-off characteristic of the first MEMS microphone chip is different from the frequency response drop-off characteristic of the second MEMS microphone chip; both output signals of the first MEMS microphone chip and output signals of the second MEMS microphone chip are outputted to the subtracter, and after undergoing subtraction by the subtracter, said signals are outputted to the ASIC chip. Compared with related technologies, the MEMS microphone of the present utility model has good anti-interference performance and good sensitivity.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 19/00 - Electrostatic transducers
  • H04R 19/04 - Microphones

64.

MICROPHONE

      
Application Number CN2022094172
Publication Number 2023/201828
Status In Force
Filing Date 2022-05-20
Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Siewseong
  • Chang, Yangmeng
  • Chua, Tiongkee
  • Pu, Jingxin
  • Zhang, Rui

Abstract

The present utility model provides a microphone, comprising a protection structure provided with an accommodating space, and an ASIC chip and a MEMS microphone chip accommodated in the accommodating space. The microphone further comprises a low-pass filter circuit. The low-pass filter circuit is connected between the ASIC chip and the MEMS microphone chip, or the low-pass filter circuit is integrated in the ASIC chip, and the high cut-off frequency of the low-pass filter circuit is greater than 20 KHz. Therefore, by providing the low-pass filter circuit, ultrasonic band interference can be filtered out, noise can be reduced, and the audio quality can be improved.

IPC Classes  ?

  • H04R 3/06 - Circuits for transducers for correcting frequency response of electrostatic transducers
  • H04R 19/00 - Electrostatic transducers
  • H04R 19/04 - Microphones

65.

VIBRATION CONTROL METHOD AND DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM

      
Application Number CN2022089222
Publication Number 2023/197375
Status In Force
Filing Date 2022-04-26
Publication Date 2023-10-19
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Xiang, Zheng
  • Wang, Xiuyue

Abstract

A vibration control method and device, and a computer-readable storage medium. The method comprises: acquiring target effect parameters in a preset vibration effect design model with reference to a haptic effect requirement indicator (101), wherein the effect parameters in the vibration effect design model comprise: a granularity perception parameter, a sharpness perception parameter and a hardness perception parameter; generating a vibration control signal corresponding to the target effect parameters (10); and controlling, on the basis of the vibration control signal, an actuator to vibrate(103). According to the method, the vibration control mode of the actuator can be adaptively designed according to different haptic effect needs, thereby ensuring the diversity of the haptic effects and the adaptability to scenarios. Moreover, the vibration effect of the actuator account for the perception factors of multiple aspects, thereby providing a user with a more sophisticated haptic feedback.

IPC Classes  ?

  • G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer

66.

MEMS DEVICE AND ELECTRO-ACOUSTIC TRANSDUCER

      
Application Number 17723458
Status Pending
Filing Date 2022-04-18
First Publication Date 2023-10-19
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Kervran, Yannick Pierre
  • Boyd, Euan James
  • Jenkins, Colin Robert
  • Chung, Colin Wei Hong
  • Cargill, Scott Lyall

Abstract

Provided is a MEMS device and an electro-acoustic transducer. The MEMS device includes: a substrate having a cavity passing through the substrate; a diaphragm connected to the substrate and covers the cavity. The diaphragm includes oppositely arranged first and second membranes. The first membrane is on one side of the second membrane facing away from the cavity and includes a first protrusion extending away from the second membrane, the first protrusion has a first groove opening towards the second membrane. The second membrane includes a second protrusion extending away from the first membrane and opposite to the first protrusion, the second protrusion has a second groove opening towards the first membrane. By providing first and second protrusions on first and second diaphragms to form a corrugated diaphragm, the internal stress and stiffness of the diaphragm decreases, which effectively increases the mechanical sensitivity of the MEMS device.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

67.

FORCE FEEDBACK TRIGGER MODULE

      
Application Number CN2022089226
Publication Number 2023/197376
Status In Force
Filing Date 2022-04-26
Publication Date 2023-10-19
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Li, Yuntong
  • Xie, Bing
  • Zhang, Lijin

Abstract

A force feedback trigger module, comprising a housing having a mounting slot, a trigger swing rod rotatably connected to the housing, and a transmission device connected to the trigger swing rod. The transmission device comprises a one-way transmission module engaged with the trigger swing rod, a driving module connected to the one-way transmission module, and a driving member for driving the driving module; the driving member is connected to the driving module, and the driving member is mounted in the housing; the driving module is mounted in the mounting slot; one end of the one-way transmission module is connected to the driving module, and the other end of the one-way transmission module is engaged with the trigger swing rod. Detachable engaging connection at the position where the one-way transmission module and the trigger swing rod are engaged and at the joint between the one-way transmission module and the driving module can be used to temporarily disengage the trigger swing rod from the driving module when the trigger swing rod is reset, so that when being reset, the trigger swing rod does not drive the driving member to reversely rotate, or drag the driving member; in this way, the trigger swing rod can be quickly reset, thereby providing good game experience for users.

IPC Classes  ?

  • A63F 13/24 - Constructional details thereof, e.g. game controllers with detachable joystick handles
  • A63F 13/285 - Generating tactile feedback signals via the game input device, e.g. force feedback

68.

Speaker Box

      
Application Number 17965838
Status Pending
Filing Date 2022-10-14
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Haijuan
  • Wu, Lifeng

Abstract

The present invention provides a speaker box. The speaker box includes a housing, a speaker unit, and an air-permeable spacer assembly accommodated in the housing. The air-permeable spacer assembly includes a bracket and an air-permeable spacer fixed to the bracket. The housing includes a bottom wall and a side wall. The bracket includes an annular main body and a leg. The air-permeable spacer is attached to the annual main body. The annular main body is fixed to the side wall. The leg is fixed to the bottom wall. At the same time, the bracket can be easily and conveniently adapted to various complex shapes of the housing through the annular main body and the leg. In addition, the filling amount of the sound absorbing powder can be increased.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 1/02 - Casings; Cabinets; Mountings therein

69.

Sounding Unit

      
Application Number 17974508
Status Pending
Filing Date 2022-10-26
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The sounding unit provided by the present invention includes a frame, a vibration system and a magnetic circuit system. The vibration system includes a diaphragm, a voice coil and an FPC. The diaphragm consists of a dome with a protruded platform and a suspension. The FPC includes an internal fixed part, an external fixed part, and an elastic part. The internal fixed part includes a first fixed part, a second fixed part, and a third fixed part. The voice coil includes an upper end surface and a lower end surface. The upper end surface is fixed to the protruded platform. The lower end surface is fixed to the third fixed part. The bonding strength between the FPC and the voice coil in the sounding unit is improved, and the vibration stability of the sounding unit is enhanced.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 7/12 - Non-planar diaphragms or cones
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details

70.

MULTIFUNCTIONAL SOUNDING DEVICE AND ELECTRIONIC DEVICE

      
Application Number 17975582
Status Pending
Filing Date 2022-10-27
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Xiao, Bo
  • Kong, Chenliang
  • Zhang, Tong
  • Linghu, Ronglin

Abstract

Provided is a multifunctional sounding device and an electronic device. The multifunctional sounding device includes a casing, a sounding body accommodated in the casing, a vibrator assembly and an elastic supporting member for suspending the vibrator assembly in the accommodating space and providing elastic restoring force. The sounding body includes a vibration system and a magnetic circuit system for driving the vibration system to sound. The elastic supporting member includes a first supporting arm fixed to the vibrator assembly, bent portions bent and extended from both ends of the first supporting arm, and second supporting arms extended away from the first supporting arm and both fixed to the casing. A thickening member is arranged on each bent portion, and a sum of a thicknesses of each bent portion and the thickening member is greater than a thicknesses of the first supporting arm and the second supporting arm.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

71.

Speaker Module

      
Application Number 18094993
Status Pending
Filing Date 2023-01-10
First Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Yang, Haijuan
  • Wang, Lei
  • Wu, Shuwen

Abstract

The present disclosure provides a speaker module. The speaker module includes a housing body, a vibration system, and a magnetic circuit system. The housing body includes a support frame having a through cavity, a front cover mounted on the through cavity opening side of the support frame, and a back cover mounted on the side of the support frame away from the front cover. The vibration system, the support frame and the back cover are enclosed to form a back cavity. The support frame includes an integrally injection-molded conductive element. This configuration of the present disclosure can simplify the manufacturing process of the speaker module, and reduce the application cost.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 7/20 - Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands

72.

Sounding Device

      
Application Number 18095001
Status Pending
Filing Date 2023-01-10
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The present disclosure provides a sounding device. The sounding device includes a vibration system, a magnetic circuit system, a conductive element and a fixed element. The vibration system includes a diaphragm and a voice coil fixed to the diaphragm. The sounding device further includes a reinforcement element having a first reinforcement part fixed to the upper surface of the connection part or the lower surface of the connection part, a second reinforcement part fixed to the outer side surface of the voice coil, and a third reinforcement part fixed with the upper surface of the voice coil. Compared with the related art, the sounding device provided by the present disclosure has a simple structure and good reliability.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 3/00 - Circuits for transducers

73.

Sounding Device

      
Application Number 18095535
Status Pending
Filing Date 2023-01-11
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The present disclosure provides a sounding device. The sounding device includes a vibration system, a magnetic circuit system, a conductive element and a fixed element. The vibration system includes a diaphragm and a voice coil fixed to the diaphragm. The diaphragm consists of a dome part and a suspension around the dome part. The dome part includes a dome body and a protruded platform of the dome extending from the dome body to the voice coil and fixed to the voice coil. The dome part also includes dome reinforcement elements. Compared with the related art, the sounding device provided by the present disclosure has a simple structure and good reliability.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 7/12 - Non-planar diaphragms or cones

74.

Sounding Device

      
Application Number 18095537
Status Pending
Filing Date 2023-01-11
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The present disclosure provides a sounding device. The sounding device includes a vibration system, a magnetic circuit system, a conductive element and a fixed element. The vibration system includes a diaphragm and a voice coil fixed to the diaphragm. The sounding device also includes a reinforcement element for fixing the voice coil and the connection part. The reinforcement element includes a first reinforcement part fixed to the upper surface of the connection part or the lower surface of the connection part, and a second reinforcement part fixed to the outer side surface of the voice coil. Compared with the related art, the sounding device provided by the present disclosure has a simple structure and good reliability

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 7/12 - Non-planar diaphragms or cones

75.

LOUDSPEAKER BOX

      
Application Number CN2022087900
Publication Number 2023/193298
Status In Force
Filing Date 2022-04-20
Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Wu, Shuwen
  • Ge, Zhenfan

Abstract

A loudspeaker box, comprising: a housing provided with an accommodation cavity; and a sound production unit fixed in the accommodation cavity, the sound production unit partitioning the accommodation cavity into a closed rear sound cavity and a front sound cavity communicated with the outside of the housing; a heat exchange cavity being formed in the wall body of the accommodation cavity and filled with a heat exchange medium. The heat exchange cavity filled with the heat exchange medium is formed in the housing, and when the loudspeaker box is in a working state, the sound production unit vibrates to generate heat, the heat is conducted to the heat exchange medium via the wall body of the accommodation cavity, and the heat exchange medium is in contact with outside air for heat exchange to release the heat, so that the heat dissipation efficiency of the loudspeaker box is improved.

IPC Classes  ?

  • H04R 1/02 - Casings; Cabinets; Mountings therein

76.

LOUDSPEAKER BOX

      
Application Number CN2022087913
Publication Number 2023/193301
Status In Force
Filing Date 2022-04-20
Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Wu, Shuwen
  • Ge, Zhenfan

Abstract

A loudspeaker box, comprising: a housing, provided with an accommodating cavity; and a sound production unit, fixed in the accommodating cavity, wherein the sound production unit partitions the accommodating cavity into a closed rear sound cavity, and a front sound cavity communicated with the outside of the housing. A heat exchange member is further provided in the sound production unit; a heat exchange cavity is formed in the heat exchange member; the heat exchange cavity is filled with a heat exchange medium; and a part of the heat exchange member is exposed to the sound production unit. Compared with the prior art, according to the loudspeaker box, by providing the heat exchange member in the sound production unit, the loudspeaker box is in a working state, the sound production unit vibrates to generate heat, the heat is conducted to the heat exchange medium in the heat exchange member by means of the wall body of the heat exchange member, and the heat exchange medium is in contact with air outside the sound production unit for heat exchange to release heat, thereby improving the heat dissipation efficiency of the loudspeaker box.

IPC Classes  ?

77.

LOUDSPEAKER MODULE

      
Application Number CN2022087962
Publication Number 2023/193305
Status In Force
Filing Date 2022-04-20
Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Wu, Shuwen
  • Ge, Zhenfan

Abstract

Provided in the present application is a loudspeaker module, which comprises: a housing; a loudspeaker unit, which is mounted in an accommodating cavity of the housing; a heat dissipation support; and a heat dissipation tube, which is mounted on the heat dissipation support and located outside the housing and abuts against a heat dissipation part outside the loudspeaker module. The heat dissipation support is provided with a first cooling channel arranged around the loudspeaker unit, and the heat dissipation tube is provided with a second cooling channel in communication with the first cooling channel, and both the first cooling channel and the second cooling channel are filled with a coolant. In the present application, heat generated by the vibration of the loudspeaker unit can be transferred to the heat dissipation support and then transferred to the outside by means of the coolant in the first cooling channel and the second cooling channel, and the high-temperature coolant in the first cooling channel flows to the second cooling channel under the action of a difference in pressure, thereby achieving circulating flow of the coolant, so that the heat dissipation support has a relatively high heat dissipation efficiency.

IPC Classes  ?

  • H04R 1/02 - Casings; Cabinets; Mountings therein
  • H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

78.

LOUDSPEAKER MODULE

      
Application Number CN2022090941
Publication Number 2023/193320
Status In Force
Filing Date 2022-05-05
Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Yang, Haijuan
  • Wang, Lei
  • Wu, Shuwen

Abstract

The present invention provides a loudspeaker module. The loudspeaker module of the present invention comprises a housing having an accommodation space, a vibration system accommodated in the accommodation space, and a magnetic circuit system accommodated in the accommodation space to drive the vibration system to vibrate and produce sound. The housing comprises a supporting frame having a through cavity, a front cover installed on the opening side of the through cavity of the supporting frame and a rear cover installed on the side of the supporting frame deviating from the front cover. A positioning structure is arranged on the inner side of the supporting frame, the vibration system is fixed to the side of the positioning structure close to the front cover, and the magnetic circuit system is fixed to the side of the positioning structure close to the rear cover. A front cavity is formed between the vibration system and the front cover, and the vibration system, the supporting frame and the rear cover enclose a rear cavity. The supporting frame comprises a conductive member integrally injection molded therein, one end of the conductive member is exposed in the through cavity and electrically connected to the vibration system, and the other end of the conductive member is exposed outside the supporting frame. The solution can simplify a manufacturing process and an assembly process of the loudspeaker module, and reduce the application cost.

IPC Classes  ?

  • H04N 5/00 - PICTORIAL COMMUNICATION, e.g. TELEVISION - Details of television systems
  • H04R 9/08 - Microphones

79.

SOUND PRODUCTION DEVICE

      
Application Number CN2022090945
Publication Number 2023/193321
Status In Force
Filing Date 2022-05-05
Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Song, Wei
  • Jin, Xin
  • Zhang, Fan
  • Linghu, Ronglin
  • Xiao, Bo

Abstract

A sound production device, comprising a shell having an accommodating cavity and a sound production driver arranged in the accommodating cavity, wherein the sound production driver comprises a vibration system located in the accommodating cavity, and a magnetic circuit system for driving the vibration system to vibrate and produce sound in a first direction. The sound production device further comprises: a box body located in the accommodating cavity; a coil, which is arranged on the side of the magnetic circuit system away from the vibration system and is spaced apart from the magnetic circuit system; a circuit board arranged on the side of the shell that faces the coil and is electrically connected to the coil; and an elastic assembly having one end connected to the shell and the other end connected to the box body, wherein the vibration system and the magnetic circuit system are arranged in the box body, the coil is fixed to the shell so as to drive the sound production driver to vibrate in a second direction, the second direction is configured to be perpendicular to the first direction, and the elastic assembly is configured to suspend the box body in the accommodating cavity. The coil and the vibration system share one magnetic circuit system, and the sound production driver directly serves as a quality unit of the coil, so that components are shared to the maximum possible extent, thereby simplifying an assembly process and saving on costs.

IPC Classes  ?

80.

Multifunctional Acoustic Device

      
Application Number 17949233
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Zhang, Fan
  • Linghu, Ronglin
  • Xiao, Bo
  • Song, Wei

Abstract

The present invention provides a multifunctional acoustic device includes a cover enclosing an accommodating cavity and an acoustic member. The cover has a sound hole. The acoustic member includes a housing, a vibration system having a diaphragm, and a magnetic circuit system driving the diaphragm. The diaphragm divides a space of the housing into a front acoustic cavity and a rear acoustic cavity. The multifunctional acoustic device includes a sound channel communicating the sound hole with the front acoustic cavity and a sealing element located between the sound hole and the sound channel. The sealing element is arranged on a peripheral side of the sound channel so that the acoustic member communicates with an outside only through the sound channel.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

81.

Multifunctional Acoustic Device

      
Application Number 17949234
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Zhang, Fan
  • Linghu, Ronglin
  • Xiao, Bo
  • Song, Wei

Abstract

The present invention provides a multifunctional acoustic device includes a cover enclosing an accommodating cavity and an acoustic member. The cover has a sound hole. The acoustic member includes a housing, a vibration system having a diaphragm, and a magnetic circuit system driving the diaphragm. The diaphragm divides a space of the housing into a front acoustic cavity and a rear acoustic cavity. The multifunctional acoustic device includes a sound channel communicating the front acoustic cavity to an outside of the sound hole and a sealing element located on an outer side of the cover. The sealing element is arranged covering a peripheral side of the sound hole and the sound channel so that the acoustic member communicates with the outside only through the sound channel.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

82.

Multifunctional Sounding Device

      
Application Number 17949236
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Xiao, Bo
  • Linghu, Ronglin
  • Zhang, Fan
  • Song, Wei

Abstract

Disclosed is a multifunctional sounding device which combines functions of emitting sounds and providing vibrations and includes a speaker unit including a vibration assembly including a first ring and a diaphragm vibrating along a first direction and a magnetic assembly including a main magnet and an auxiliary magnet; an elastic member suspending the speaker unit; a second ring surrounding the first ring; a flexible sealing membrane connected between the two rings; and a driving coil driving the speaker unit for vibrating in a second direction. The two directions are perpendicular. The driving coil includes two sides respectively facing the main magnet and the auxiliary magnet in the first direction. The diaphragm, the first ring, the flexible sealing membrane and the second ring are integrally formed, thereby ensuring concentricity of them four and avoiding glue width requirements so as to release spaces.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

83.

Multifunctional Sounding Device

      
Application Number 17949237
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Zhang, Fan
  • Xiao, Bo
  • Linghu, Ronglin
  • Song, Wei

Abstract

Disclosed is a multifunctional sounding device which combines functions of emitting sounds and providing vibrations and includes a housing; a speaker unit including a vibration assembly vibrating along a first direction and a magnetic assembly including a main magnet and an auxiliary magnet; an elastic member suspending the speaker unit in the housing; a flexible sealing membrane assembly connected between the housing and the speaker unit including an outer ring, an inner ring, and a flexible sealing membrane connected between the two rings; and a driving coil driving the speaker unit for vibrating in a second direction including two sides respectively facing the main magnet and the auxiliary magnet in the first direction. The two directions are perpendicular. The outer ring, the flexible sealing membrane and the inner ring are integrally formed, thereby achieving a high structural consistency and avoiding glue width requirements so as to release spaces.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 1/02 - Casings; Cabinets; Mountings therein
  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 7/04 - Plane diaphragms

84.

SPEAKER

      
Application Number 17981494
Status Pending
Filing Date 2022-11-07
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

A speaker includes: a frame, a vibration system, including a diaphragm, a voice coil, and a flexible circuit board, and a magnetic circuit system, wherein the voice coil includes a first lead wire and a second lead wire, the flexible circuit board includes a first surface facing the diaphragm and a second surface opposite to the first surface, the first lead wire and the first surface are located at one side of the flexible circuit board, the second lead wire and the second surface are located at another side of the flexible circuit board, the flexible circuit board includes a first pad on the first surface and a second pad on the second surface, the first lead wire is connected to the first pad, the second lead wire is connected to the second pad. Compared with the related art, the speaker disclosed by the present disclosure has better acoustic performance.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 3/00 - Circuits for transducers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 7/12 - Non-planar diaphragms or cones

85.

SPEAKER

      
Application Number 17981495
Status Pending
Filing Date 2022-11-07
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

A speaker includes a diaphragm, a voice coil with a lead wire, and a flexible circuit board assembly. The flexible circuit board assembly includes at least two flexible circuit boards and a soldering sheet. Each flexible circuit board includes an inner fixing portion including an upper surface close to the diaphragm, the upper surface of a first flexible circuit board is provided with a first pad, the upper surface of a second flexible circuit board is provided with a second pad. The lead wire is arranged on a side of the first flexible circuit board close to the diaphragm and is electrically connected to the first pad. The soldering sheet includes a first fixing portion electrically connected to the second pad, a second fixing portion and a third fixing portion electrically connected to a bottom surface of the voice coil. The speaker has a better acoustic performance.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 3/00 - Circuits for transducers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 7/12 - Non-planar diaphragms or cones

86.

SPEAKER

      
Application Number 17981496
Status Pending
Filing Date 2022-11-07
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

A speaker includes: a frame, a vibration system including a diaphragm, a voice coil, and a flexible circuit board, and a magnetic circuit system, wherein the flexible circuit board includes an outer fixing portion, an inner fixing portion, and an elastic connecting arm, the inner fixing portion includes a first fixing portion electrically connected with the elastic connecting arm, a second fixing portion bent and extended from the first fixing portion in a direction away from the diaphragm, and a third fixing portion bent and extended from an end of the second fixing portion away from the first fixing portion in a direction of the voice coil, the third fixing portion is provided with a pad which is electrically connected with a bottom surface of the voice coil. Compared with the related art, the speaker disclosed by the present disclosure has better acoustic performance.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details

87.

LOUDSPEAKER MODULE

      
Application Number CN2022087942
Publication Number 2023/193302
Status In Force
Filing Date 2022-04-20
Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC MICROTECH (CHANGZHOU) CO., LTD. (China)
Inventor
  • Wu, Shuwen
  • Ge, Zhenfan

Abstract

Provided in the present application is a loudspeaker module, comprising a housing, a single loudspeaker mounted in an accommodation chamber of the housing, and a heat dissipation support. The heat dissipation support comprises a body part, one part of the body part being mounted in the accommodation chamber, the other part of the body part extending to the outer side of the housing, an extension part bent and extending upwards in the thickness direction of the loudspeaker module being arranged at the end of the body part located on the outer side of the housing, and the extension part abutting against a heat dissipation part outside the loudspeaker module. The body part is provided with a first cooling channel, the first cooling channel surrounding the periphery of the single loudspeaker, and the extension part being provided with a second cooling channel communicating with the first cooling channel. Heat generated by the vibration of the single loudspeaker can be transferred to the heat dissipation support, and transferred to the outside via a cooling liquid in the first cooling channel and the second cooling channel, and under the action of a pressure difference, the high-temperature cooling liquid in the first cooling channel flows to the second cooling channel, so that the circulation flow of the cooling liquid is realized, and the heat dissipation support has relatively high heat dissipation efficiency.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein
  • H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

88.

MICROPHONE AMPLIFICATION CIRCUIT DESIGN METHOD, AND MICROPHONE AMPLIFICATION CIRCUIT

      
Application Number CN2022088162
Publication Number 2023/184625
Status In Force
Filing Date 2022-04-21
Publication Date 2023-10-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Chuationg, Kee

Abstract

The present invention provides a microphone amplification circuit design method. The method comprises the following steps: placing a layer of underlying metal between a substrate and a bonding pad of an integrated circuit, forming a first parasitic capacitor between the bonding pad and the underlying metal, and forming a second parasitic capacitor between the underlying metal and the substrate; locating a circuit node in the amplification circuit, and enabling the circuit node to meet preset conditions; connecting the underlying metal to the circuit node, and connecting the bonding pad to an input terminal; welding the microphone to the bonding pad of the integrated circuit to serve as a microphone capacitor, connecting one terminal of the microphone capacitor to a high-voltage bias voltage, and connecting the other terminal of the microphone capacitor to the input terminal; connecting one terminal of the first parasitic capacitor to the input terminal, and connecting the other terminal of the first parasitic capacitor to an output terminal; and connecting one terminal of the second parasitic capacitor to the output terminal, and grounding the other terminal of the second parasitic capacitor. The present invention further provides a microphone amplification circuit. Compared with the prior art, the microphone amplification circuit design method and the microphone amplification circuit have a high signal-to-noise ratio and better performance.

IPC Classes  ?

  • H04R 3/00 - Circuits for transducers
  • H04R 3/04 - Circuits for transducers for correcting frequency response
  • H03F 3/187 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only in integrated circuits

89.

MICROPHONE CIRCUIT AND MICROPHONE MODULE, AND METHOD FOR RAISING ACOUSTIC OVERLOAD POINT OF MICROPHONE

      
Application Number CN2022090025
Publication Number 2023/184640
Status In Force
Filing Date 2022-04-28
Publication Date 2023-10-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Chuationg, Kee

Abstract

A microphone circuit. The microphone circuit comprises an amplifier, a bias resistor, and a bias network module, which is connected to an input end of the microphone circuit, wherein the amplifier is used for receiving a signal, which is output by an external microphone, amplifying the signal, and then outputting same; a first end of the bias resistor is used for accessing a preset bias voltage, and a second end of the bias resistor is used for connecting to an output end of the microphone; and the bias network module is used for performing determination regarding the voltage value of the signal, and if the voltage value of the signal exceeds a voltage value range of preset threshold voltage groups, the input end of the microphone circuit accesses impedances corresponding to the bias network module, such that the amplitude of the signal is reduced, which impedances correspond to the threshold voltage groups on a one-to-one basis. Further provided are a microphone module and a method for raising an acoustic overload point of a microphone. Compared with the prior art, the technical solution raises an acoustic overload point of a microphone, and has a good electrical performance.

IPC Classes  ?

90.

Vibration Motor

      
Application Number 17946069
Status Pending
Filing Date 2022-09-16
First Publication Date 2023-10-05
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Ma, Jie
  • Cui, Zhiyong
  • Wang, Yao

Abstract

The present disclosure discloses a linear motor having a housing with an receiving space, a vibration unit and a stator unit received in the receiving space. The vibrator unit includes a weight and an elastic member fixed to the weight. The elastic member includes a first fixation portion fixed to the weight and a second fixation portion fixed to the housing. At least one soldering plate fixed to at least one of the first fixation portion and the second fixation portion. The soldering plate includes a rectangle portion and the extending portion having a smaller width than the rectangle portion. The vibration motor has higher fatigue life and high reliability.

IPC Classes  ?

  • H02K 33/16 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with polarised armatures moving in alternate directions by reversal or energisation of a single coil system

91.

Vibration Motor

      
Application Number 17947194
Status Pending
Filing Date 2022-09-19
First Publication Date 2023-10-05
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ma, Jie

Abstract

The present disclosure discloses a linear motor having a housing with an receiving space, a vibration unit and a stator unit received in the receiving space. The vibrator unit includes a weight and an elastic member fixed to the weight. The elastic member includes a first fixation portion fixed to the housing and a second fixation portion fixed to the weight and an elastic portion. An elastic member having a groove penetrating thereon is sandwiched between the elastic portion and the weight. The elastic member includes a first damping portion and a second damping portion arranged on two opposite side f the groove along a vibration direction. The groove can effectively avoid the detachment of the elastic member from the elastic member and the weight, thus improving the vibration stability of the vibration motor.

IPC Classes  ?

  • G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
  • H02K 7/06 - Means for converting reciprocating motion into rotary motion or vice versa

92.

MEMS device and electro-acoustic transducer

      
Application Number 17826179
Grant Number 11765509
Status In Force
Filing Date 2022-05-27
First Publication Date 2023-09-19
Grant Date 2023-09-19
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Boyd, Euan James

Abstract

Provided is an MEMS device, including: a substrate having back cavity passing thererthrough; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes, and accommodating space formed therebetween; a counter electrode; and support loop members arranged concentrically. Opposite ends of the support loop member are connected to the first and second membranes. The support loop members are arranged at intervals. Each support loop member has first sections concentrically arranged as a loop member at intervals. A first notch is formed between two adjacent first sections. In at least one support loop member, the first section has second sections concentrically arranged as a loop member at intervals. A second notch is formed between two adjacent second sections. By a larger first section, distance between adjacent first sections is larger, the technical problem that large number of slots required for counter electrode is solved.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones

93.

MEMS Microphone

      
Application Number 17827817
Status Pending
Filing Date 2022-05-30
First Publication Date 2023-07-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Shi, Zhengyu
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present invention provides a MEMS microphone including a substrate with a back cavity and a capacitive system disposed on the substrate. The capacitive system includes a back plate and a vibration diaphragm arranged opposite to the back plate. The back plate includes a middle part and a fixed part surrounding the middle part and fixed to the substrate. The fixed part is arranged with a thickness greater than that of the middle part, and the fixed part includes a first surface away from the substrate and a second surface opposite to the first surface. The first surface includes a first arc connected to the middle part, and the first arc protrudes away from the substrate. Compared with related technologies, the MEMS microphone provided by the present invention can improve the reliability of the back plate.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

94.

MEMS Microphone

      
Application Number 17879788
Status Pending
Filing Date 2022-08-03
First Publication Date 2023-07-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Zhang, Rui

Abstract

The present invention discloses a MEMS microphone, which includes a substrate with a back cavity, a connection part, and a capacitive system arranged in the connection part. The capacitive system includes a first electrode connected to the inner wall of connection part, and a second electrode disposed on the substrate near the first electrode and spaced from the first electrode. The second electrode has two shape separation gaps. The shape separation gap includes a splitting gap in the second electrode, and two end gaps. The second electrode is divided into an effective vibration area and an auxiliary area by adopting a cracking gap structure. While improving the sensitivity of the first electrode, the stress concentration point of the second electrode is directed to the edge of the second electrode, so as to disperse the stress under the action of loud pressure.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

95.

Microphone and method for manufacturing the same

      
Application Number 17743482
Grant Number 11832043
Status In Force
Filing Date 2022-05-13
First Publication Date 2023-07-06
Grant Date 2023-11-28
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Tu, Lanlan
  • Goh, Wooicheang
  • Lai, Kahkeen

Abstract

Provided is a microphone, including a base having a back cavity, a diaphragm, a backplate electrode, and a backplate spaced from the diaphragm and defining an inner cavity jointly with the diaphragm. The diaphragm includes a vibration portion, a fixing portion, and a leak hole. The back cavity is communicated with the inner cavity through the leak hole. The backplate is provided with a first through hole. The inner cavity is communicated with outside through the first through hole. The backplate includes a backplate body and a backplate extension portion. The inner cavity includes a first inner cavity and a second inner cavity. The backplate extension portion is provided with a second through hole, and the second inner cavity is communicated with outside through the second through hole. A method for manufacturing the microphone is further provided. The technical solution has better drop performance.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 1/32 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only

96.

MICRO-ELECTRO-MECHANICAL SYSTEM AND ELECTRO-ACOUSTIC CONVERSION DEVICE HAVING THE MICRO-ELECTRO-MECHANICAL SYSTEM

      
Application Number 17561736
Status Pending
Filing Date 2021-12-24
First Publication Date 2023-06-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Patel, Anup Hasmukh
  • Boyd, Euan James
  • Cargill, Scott Lyall

Abstract

Provided is a micro-electro-mechanical system and an electro-acoustic conversion device having the micro-electro-mechanical system. The micro-electro-mechanical system includes: first and second membranes arranged opposite to each other; support members arranged between the first and second membranes; and an opening provided on the first and/or second membranes. Each support member includes support walls, and opposite ends of each of the support walls are connected to the first and second membranes. The first and second membranes, and two adjacent support walls in one support member are enclosed to form a first chamber. The opening is configured to link the first chamber with the outside. By arranging a supporting member composed of support walls and providing an opening on the first and/or second membranes, the compliance of the first or second membrane is increased, and the inter-plate capacitance therebetween is reduced.

IPC Classes  ?

  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

97.

Bone conduction microphone

      
Application Number 17827815
Grant Number 11895452
Status In Force
Filing Date 2022-05-30
First Publication Date 2023-06-29
Grant Date 2024-02-06
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Meng, Zhenkui
  • Hong, Tingting
  • Wang, Kai

Abstract

The present invention provides a bone conduction microphone including a housing and a circuit board connected with the housing. The circuit board has an acoustic channel. The microphone further includes a vibration assembly forming a first conduction cavity and a second conduction cavity. The vibration assembly includes a vibration member and a frame. The frame, the vibration member and the circuit board form a first conduction cavity. The frame, the vibration member and the circuit board form a second conduction cavity. The vibration of the vibration member is conducted to one side of the vibration diaphragm, and is also conducted to the other side of the vibration diaphragm. Compared with the related art, the bone conduction microphone of the present invention can effectively improve the sensitivity and the signal to noise ratio.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 1/02 - Casings; Cabinets; Mountings therein
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor

98.

Differential condenser microphone

      
Application Number 17553814
Grant Number 11765520
Status In Force
Filing Date 2021-12-17
First Publication Date 2023-06-22
Grant Date 2023-09-19
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Kervran, Yannick Pierre

Abstract

A differential condenser microphone is provided, including: a base having a cavity passing through the base; a diaphragm connected to the base and covering the cavity; a mounting portion connected to the diaphragm through a connector, movable electrodes protruding from an outer edge of the mounting portion; first fixed electrodes connected to the base, the first fixed electrodes and the movable electrodes are spatially separated from and cross each other; second fixed electrodes connected to the base, the second fixed electrodes and the movable electrodes are separated from and cross each other, and the first fixed and second fixed electrodes are arranged opposite to and spaced from each other along vibration direction of the diaphragm. Compared to the related art, the microphone can achieve higher sensitivity, higher signal-to-noise ratio, better capacity in suppressing linear distortion, and improve anti-interference capacity, thereby achieving longer signal transmission distance and better audio performance.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor

99.

MEMS chip

      
Application Number 17739202
Grant Number 11950053
Status In Force
Filing Date 2022-05-09
First Publication Date 2023-06-22
Grant Date 2024-04-02
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Shi, Zhengyu
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

100.

MEMS chip

      
Application Number 17739203
Grant Number 11968497
Status In Force
Filing Date 2022-05-09
First Publication Date 2023-06-22
Grant Date 2024-04-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Shi, Zhengyu
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present invention discloses a Micro-Electro-Mechanical System MEMS) chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
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