Abstract

Provided are an electronic device and a processor module that, even if a relatively tall memory module is mounted, can experience no reduction in packing density, or can further increase packing density. This processor module includes a first circuit board and a second circuit board that each have, on one surface of the board, a processor mounting region and a memory mounting region. At least one processor is mounted to the processor mounting region, and a plurality of memory modules arranged in a comb shape are mounted to the memory mounting region. The one surface of the first circuit board and the one surface of the second surface board are brought together in a facing manner. The first circuit board and the second circuit board are positioned such that the processor mounting region and the memory mounting region of the first circuit board respectively face the processor mounting region and the memory mounting region of the second circuit board, and such that tip end sections of the plurality of memory modules of the first circuit board, said memory modules being arranged in a comb shape, and tip end sections of the plurality of memory modules of the second circuit board, said memory modules being arranged in a comb shape, are alternatingly arranged, with gaps created between neighboring memory modules.

IPC Classes  ?

• G06F 1/20 - Cooling means
• G06F 1/18 - Packaging or power distribution
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided are an electronic device and a processor module that, even if a relatively tall memory module is mounted, can experience no reduction in packing density, or can further increase packing density. This processor module includes a first circuit board and a second circuit board that each have, on one surface of the board, a processor mounting region and a memory mounting region. At least one processor is mounted to the processor mounting region, and a plurality of memory modules arranged in a comb shape are mounted to the memory mounting region. The one surface of the first circuit board and the one surface of the second surface board are brought together in a facing manner. The first circuit board and the second circuit board are positioned such that the processor mounting region and the memory mounting region of the first circuit board respectively face the processor mounting region and the memory mounting region of the second circuit board, and such that tip end sections of the plurality of memory modules of the first circuit board, said memory modules being arranged in a comb shape, and tip end sections of the plurality of memory modules of the second circuit board, said memory modules being arranged in a comb shape, are alternatingly arranged, with gaps created between neighboring memory modules. A third circuit board is positioned in a space that is formed by upper surfaces of the processors of the first circuit board and the second circuit board facing one another.

IPC Classes  ?

• G06F 1/20 - Cooling means
• G06F 1/18 - Packaging or power distribution
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided are an electronic device and a power supply unit that are immersed in a coolant inside a cooling device and directly cooled. The electronic device includes: a carrier substrate comprising a voltage input terminal that supplies DC voltage for the electronic device; a plurality of module connectors arranged on one surface of the carrier substrate; a plurality of module substrates; a plurality of supporting plates that hold both ends of the plurality of module substrates; and a supporting member that supports the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal in the power supply unit. Each of the plurality of module substrates has a module connector plug electrically coupled to each of the plurality of module connectors. The supporting member supports the carrier substrate so as to be positioned in an upper section of the power supply unit arranged in the bottom section of a cooling tank provided in the cooling device, when the electronic device is electrically connected to the power supply unit. The power supply unit has: a unit substrate; a voltage step-down device mounted on the unit substrate; and a stage having the unit substrate fixed thereto.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack

Abstract

Provided is a liquid immersion cooling system. The cooling system includes: a cooling device; a plurality of electronic devices immersed in coolant inside a cooling device and directly cooled; and a plurality of power supply units. The cooling device has a cooling tank having an open space formed by a bottom wall and a side wall. A plurality of inlet openings into which the coolant flows are formed in the bottom section of the cooling tank and an outlet opening is formed in the vicinity of the liquid surface of the coolant flowing through the cooling tank. Each of the plurality of electronic devices includes a voltage input terminal that supplies DC voltage to the electronic device. Each of the plurality of power supply units includes: a power supply voltage input terminal that supplies external power supply voltage; and a voltage output terminal electrically connected to the voltage input terminals for the electronic devices. Each of the power supply units are arranged in the bottom section of the cooling tank such that electronic devices are positioned in an upper section of the power supply units when each electronic device is electrically connected to each of the power supply units; and the power supply units and the electronic devices are cooled by the coolant that flows in from the bottom section.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack

Abstract

Provided is an electronic device that is immersed in a coolant inside a cooling device and directly cooled. The electronic device includes: a carrier substrate comprising a voltage input terminal that supplies DC voltage for the electronic device; and a supporting member that supports the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal in a power supply unit. The supporting member supports the carrier substrate so as to be positioned in an upper section of the power supply unit arranged in the bottom section of a cooling tank provided in the cooling device, when the electronic device is electrically connected to the power supply unit. The supporting member can include a backboard or a frame structure that have the carrier substrate fixed to one surface thereof. The backboard or frame structure can be slidably supported by a plurality of support columns vertically erected and fixed inside the cooling tank. The backboard or frame structure can include a support pin or guide pin inserted, from above, into a bracket fixed inside the cooling tank.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack

Abstract

Provided is a power supply unit that is immersed in a coolant inside a cooling device and directly cooled. The power supply unit has a unit substrate and a voltage step-down device mounted on the unit substrate. The unit substrate comprises: a voltage input terminal that supplies external power supply voltage; and a voltage output terminal. The voltage output terminal is electrically connected to the voltage input terminal of an electronic device. The power supply unit is arranged in the bottom section of a cooling tank provided in the cooling device, being arranged such that, when the electronic device and the power supply unit are electrically connected, the electronic device is positioned in the upper section of the power supply unit. The power supply unit is cooled by coolant that flows in from the bottom section or flows in from other sites in the cooling tank. The unit substrate can be arranged away from the bottom section so as to form a flow channel through which coolant flows, forming same between one surface of the unit substrate and the bottom section. The voltage step-down device can include a converter module that steps down 200–420 V external high-voltage DC voltage to 24–52 V DC voltage.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack

Abstract

This electronic device, which is directly cooled by immersion in a cooling liquid within a cooling device, is configured to enable housing in a housing unit of the cooling device and includes a pair of substrate groups. The substrate groups each include: a first circuit board, with at least one processor and a plurality of main memories being mounted to one surface of the board; a plurality of coprocessors, each coprocessor being provided with an electrical connection terminal and a housing which has a rectangular cross-section; and connectors electrically connecting between the first circuit board and the plurality of coprocessors. The distance H1 between the one surface of the first circuit board and the bottom surface of the housing of each coprocessor, when the electrical connection terminals of the coprocessors are inserted into the connectors, is longer than the height of the processor and the height of the plurality of main memories. In addition, the pair of substrate groups are combined together, with the first circuit boards to the rear sides, in a direction which shortens the distance H2 between the one surface of the first circuit board in one substrate group and the top surface of the housings of the coprocessors in the other substrate group.

IPC Classes  ?

• G06F 1/18 - Packaging or power distribution
• G06F 1/20 - Cooling means
• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is an electronic device that is directly cooled by immersion in a cooling liquid within a cooling device. This electronic device is configured to enable housing in a housing unit of the cooling device, and includes a baseboard, a plurality of storage substrates disposed on at least one surface of the baseboard, a backplane attached perpendicularly to the one surface of the baseboard, and a plurality of flash storage devices mounted to each of the plurality of storage substrates. The backplane comprises a combination of a plurality of backplane sections, and each of the plurality of backplane sections is provided with a signal connector and a power source connector. In addition, the signal connector and the power source connector are provided independently for each backplane section. The plurality of flash storage devices are disposed so as to be mutually adjacent, in a plane parallel to at least one surface of the storage substrates, in either the width direction or the length direction of the flash storage devices.

IPC Classes  ?

• G06F 1/18 - Packaging or power distribution
• G06F 1/20 - Cooling means
• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is an electronic device that is directly cooled by immersion in a cooling liquid within a cooling device. The electronic device includes storage substrates and a plurality of flash storage devices mounted to each storage substrate. The plurality of flash storage devices are disposed so as to be mutually adjacent, in a plane parallel to at least one surface of the storage substrates, in either the width direction or the length direction, or in both the width direction and the length direction of the flash storage devices. The plurality of storage substrates are disposed on at least one surface of a baseboard. A backplane is provided with a plurality of connectors for electrically connecting each of the plurality of storage substrates, and is attached perpendicularly to the one surface of the baseboard. The flash storage devices are preferably M.2 SSDs or mSATA SSDs.

IPC Classes  ?

• G06F 1/18 - Packaging or power distribution
• G06F 1/20 - Cooling means
• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is an electronic device that is directly cooled by immersion in a cooling liquid within a cooling device. The electronic device includes a first circuit board in which a plurality of processors and a plurality of main memories are mounted to one surface of the board. The plurality of processors are arranged upon the one surface of the first circuit board in the lengthwise direction of the main memories. The length of each of the plurality of processors in the lengthwise direction of the main memories is preferably no more than half the length of the main memories. The processors may be a semiconductor device with a system-on-chip design, and the main memories may be a memory module with an ultra low profile. At least four processors and at least four main memories may be mounted upon the first circuit board of the electronic device. The at least four main memories may be arranged in a manner partitioning the one surface of the first circuit board into at least two regions in the width direction, and at least two processors may be disposed in each of the at least two regions and arranged in the lengthwise direction of the main memories.

IPC Classes  ?

• G06F 1/18 - Packaging or power distribution
• G06F 1/20 - Cooling means
• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is an electronic device that is directly cooled by immersion in a cooling liquid within a cooling device. The electronic device includes storage substrates and a plurality of flash storage devices mounted to each storage substrate. The plurality of flash storage devices are disposed so as to be mutually adjacent, in a plurality of planes parallel to at least one surface of the storage substrates, in either the width direction or the length direction, or in both the width direction and the length direction of the flash storage devices. A plurality of flash storage connectors having mutually different heights are preferably disposed facing one another on the one surface of the storage substrates. The plurality of storage substrates are disposed on at least one surface of a baseboard. A backplane is provided with a plurality of connectors for electrically connecting each of the plurality of storage substrates, and is attached perpendicularly to the one surface of the baseboard. The flash storage devices are preferably M.2 SSDs or mSATA SSDs.

IPC Classes  ?

• G06F 1/18 - Packaging or power distribution
• G06F 1/20 - Cooling means
• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The purpose of the present invention is to provide a refrigeration system which, when a pump in a stopped state is activated, is capable of effectively avoiding an occurrence of a bubble in a flow path which includes a piping part which surmounts a barrier. Provided is a refrigeration system 100, comprising: a refrigeration tank 11, wherein a refrigeration fluid C is placed; flow paths 15, 16, wherethrough the refrigeration fluid which has exited from an outflow port of the refrigeration tank 11 returns to an inflow port of the refrigeration tank 11; an inverted U-shaped piping part 16a which is disposed partway along the flow path 16; a primary pump 31; an auxiliary pump 33 which is positioned opposite the primary pump 31 with the inverted U-shaped piping part 16a therebetween; and a controller 35 which controls the driving of the primary pump 31 and the auxiliary pump 33. The controller 35 drives the auxiliary pump 33 for a prescribed time prior to activating the primary pump 31. It would suffice for the prescribed time for which the auxiliary pump 33 is driven to cause a preparatory flow of the refrigeration fluid C to occur. It would suffice for the auxiliary pump 33 to be driven for only a short time, and thus, even if said auxiliary pump 33 were to be positioned within a room in a building, said pump would not disturb the silence within said room.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is an electronic device that is immersed in a cooling liquid inside a cooling device and directly cooled. The electronic device includes: metal boards configured so as to be able to be housed in each of a plurality of housing sections in the cooling device, said metal boards being held by a pair of board retainers provided in the housing sections; and at least one substrate group attached to each out of a first surface of the metal boards and a second surface on the opposite side to the first surface. Each substrate group has: at least one first circuit substrate that has a plurality of sockets for mounting a plurality of processors and a main memory to one surface of the substrate and also has component that mutually connects the plurality of processors; a second circuit substrate that has a mother board component including a chip set for controlling at least the main memory; and a flow channel formed by a gap between a surface on the opposite side to the one surface of the at least one first circuit substrate and one surface of the second circuit substrate facing the opposite-side surface.

IPC Classes  ?

• G06F 1/20 - Cooling means

Abstract

Provided is an electronic device that is immersed in a cooling liquid inside a cooling device and directly cooled. The electronic device includes: metal boards that are configured so as to be able to be housed in each of a plurality of housing sections in the cooling device, said boards being held by a pair of board retainers provided in the housing sections; at least one substrate group attached to each of a first surface of the metal boards and a second surface on the opposite side to the first surface; and a plurality of slots provided above the at least one substrate group and being attached, in parallel, to the metal boards, each of the plurality of slots having a power supply unit housed therein. A third circuit substrate is arranged such that the plurality of slots are interposed between the third circuit substrate and the metal boards. A plurality of network cable sockets are provided, in parallel, upon one side of the third circuit substrate that is positioned on the opening side of the plurality of slots.

IPC Classes  ?

• G06F 1/20 - Cooling means

Abstract

Provided is an electronic device that is immersed in a cooling liquid inside a cooling device and directly cooled. The electronic device includes: metal boards configured so as to be able to be housed in each of a plurality of housing sections for the cooling device, said boards being held by a pair of board retainers provided in the housing sections; a plurality of storages each arranged on a first surface of the metal boards and on a second surface on the opposite side to the first surface; and a back plane having a plurality of connectors for electrically connecting each of the plurality of storages, said back plane being attached orthogonally to the first surface of the metal board and the second surface on the opposite side to the first surface. The metal boards include a main member and an auxiliary member. The main member has a plurality of cuts formed in the width direction, for fixing a plurality of support plates supporting the plurality of storages, to the main member. The auxiliary member has a plurality of hooks that are inserted into each of a plurality of slits formed in the back plane and are fixed to the main member. The plurality of support plates have holes formed therein through which the cooling liquid passes.

IPC Classes  ?

• G06F 1/20 - Cooling means

Abstract

Provided is a cooling system wherein a plurality of electronic devices of different types are immersed in a cooling liquid inside a cooling device and directly cooled. The cooling device has: a cooling tank having an open space formed by a bottom wall and side walls; a plurality of arranged housing sections formed by the open space being partitioned by providing a plurality of internal partitions inside the cooling tank; and inlet ports and discharge ports for the cooling liquid. The inlet ports are formed in the bottom or a side surface of each housing section and the discharge ports are formed in the vicinity of the liquid surface of the cooling liquid flowing through each housing section. The plurality of electronic devices of different types constitute a computer that houses any number of each, separately, in the plurality of housing sections in the cooling device, said computer having a desired calculation capacity and a desired memory capacity, and said plurality of electronic devices including: at least one first electronic device having calculation by a plurality of processors as the core thereof; and at least one second electronic device having storage using a plurality of storages as the core thereof.

IPC Classes  ?

• G06F 1/20 - Cooling means

Abstract

A cooling system 400 in which electronic devices are immersed in coolant and are directly cooled, said cooling system 400 comprising: a cooling tank 50 containing coolant C; and a leakage reception unit 21 disposed between the cooling tank 50 and a floor 32 so as to receive coolant L (if any) leaking from the cooling tank 50, said coolant L corresponding to a leakage portion of the coolant C. The cooling tank 50 comprises: a lower structure 53 affixed to the floor 32; an upper structure 51 in which electronic devices are immersed in the coolant C; and a seismic isolation device 55 disposed between the lower structure 53 and the upper structure 51. Thus, the present invention can provide a cooling system having a high tolerance to external strong shocks and vibrations, etc. associated with seismic hazards, etc.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A cooling system 100 in which electronic devices are immersed in coolant and are directly cooled, said cooling system 100 comprising: a cooling tank 11 containing coolant C; a leakage reception unit 21 disposed between the cooling tank 11 and the floor so as to receive coolant L (if any) leaking from the cooling tank 11, said coolant L corresponding to a leakage portion of the coolant C; another leakage reception unit 23, disposed so as to receive coolant L flowing from the leakage reception unit 21 when the volume of leakage coolant L retained in the leakage reception unit 21 is greater than a predetermined volume; and a channel 25 which connects the leakage reception unit 21 and the other leakage reception unit 23, and allows the passage of the coolant L flowing from the leakage reception unit 21 when the volume of leakage coolant retained in the leakage reception unit 21 is greater than the predetermined volume. This configuration facilitates recovering of coolant (if any) leaking from the cooling tank 11, and, furthermore, makes it possible to minimize the height of the equipment for temporarily retaining the leakage coolant L before the leakage coolant is recovered.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A cooling system 300 in which electronic devices are immersed in coolant and are directly cooled, said cooling system 300 comprising: a cooling tank 11 containing coolant C; and a leakage reception unit 41 disposed between the cooling tank 11 and the floor so as to receive coolant (if any) leaking from the cooling tank 11, said leakage coolant corresponding to a leakage portion of the coolant C. The leakage reception unit 41 is configured from: a distributor plate 40 which distributes the load imposed by the cooling tank 11; a closed sidewall disposed on the distributor plate so as to surround the cooling tank 11; and a cover 42 which covers the upper opening between the closed sidewall and the cooling tank 11. This configuration facilitates recovering of coolant (if any) leaking from the cooling tank 11, and, furthermore, makes it possible to minimize the height of the equipment for temporarily retaining the leakage coolant L before the leakage coolant is recovered.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A cooling system 10 has a cooling tank 12, a second cooling liquid 13 that has a boiling point T2 being placed inside the open space of the cooling tank 12. An eelectronic device 100 in which a processor 110 is mounted as a heat-emitting body on a board 120 is stored inside the open space of the cooling tank 12 and is immersed in the second cooling liquid 13 (boiling point T2). An ebullient cooling device 200 is thermally connected to the processor 110, a first cooling liquid 11 that has a boiling point T1 (where T1 = T2 or T1 ឬ T2) being sealed in the ebullient cooling device 200. A first heat exchanger 22 is provided with: high-temperature-side flow channels for letting pass the second cooling liquid, the high-temperature-side flow channels comprising an aggregate of narrow gaps or minute flow channels; and low-temperature-side flow channels for letting pass a third cooling medium having a boiling point T3 (where T3 = T2 or T3 ឬ T2), the low-temperature-side flow channels comprising an aggregate of narrow gaps or minute flow channels. The high-temperature-side flow channels and the low-temperature-side flow channels are provided alternately and are separated by walls. A pump 40 pressure-feeds the second cooling liquid 13, which is heated inside the cooling tank 12, toward the inlet to the high-temperature-side flow channels of the first heat exchanger 22.

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

By disposing a plurality of interior partitions 13a-13d within a cooling tank 10 which comprises an open space 10a, a plurality of arranged housing parts 14a-14d is formed, and at least one electronic device 100 is housed in each of the housing parts. A lifting mechanism 20 comprises: a tower 21, further comprising a guide and a motive power source which are for raising and lowering an arm 22; a slide mechanism 23 which is attached to the cooling tank 10; and stoppers 27 which restrict the movement of the tower 21 such that the range in which the tower 21 moves in the width direction of the cooling tank 10 does not practically exceed at least the width of the open space 10a. The slide mechanism 23 supports the tower 21 to be movable with respect to the cooling tank 10 in a horizontal plane located above the open space. The liquid immersion cooling device 1 does not require a stage in the periphery of the installation surface of the cooling tank 10, and it is possible to safely raise or lower the electronic devices 100 which are housed at a high density in the cooling tank 10.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a simple and efficient cooling system exhibiting improved electronic-device cooling performance. A cooling system 10 having a cooling tank 12, wherein a first coolant 13 having a boiling point T1 is inserted into the open space of the cooling tank 12. An electronic device 100 having processors 110, 112 mounted on a board 120 is stored inside the open space in the cooling tank 12, and is immersed in the first coolant 13. A first heat exchanger 22 is immersed in the surface-layer section of the first coolant inside the cooling tank 12. A second coolant having a boiling point T2 (wherein T1=T2 or T1>T2) is sealed inside the first heat exchanger 22.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a simple and efficient cooling system exhibiting improved electronic-device cooling performance. A cooling system 10 having a cooling tank 12, wherein a second coolant 13 having a boiling point T2 is inserted into the open space of the cooling tank 12. An electronic device 100 obtained by mounting a processor 110 functioning as a heat-generating element on a board 120 is stored inside the open space in the cooling tank 12, and is immersed in the second coolant 13. A vapor cooling device 200 is thermally connected to the processor 110, and has a first coolant 11 having a boiling point T1 (wherein T1=T2 or T1T3) is sealed inside the first heat exchanger 22.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided are a cooling apparatus that improves the cooling capabilities for a plurality of electronic instruments and that eliminates and stabilizes unevenness of cooling capabilities as well as electronic instruments having improved cooling efficiency through immersion cooling. By providing a plurality of internal partition walls 13a-13e, 14a-14e inside a cooling tank 12 having an open space formed by a bottom wall and side walls, the open space is partitioned, forming a plurality of arranged housing portions 15aa-15dd. An electronic instrument 100 is stored in each of the housing portions. Within each of the housing portions, inflow apertures 16aa-16dd for a cooling liquid 11 are formed at a bottom portion or side surfaces of the housing portions, and outflow apertures 17aa-17ee are formed near the surface of the cooling liquid circulating in the housing portions. The electronic instruments comprise a first board 121 having a first surface on which at least one processor is disposed and a second surface opposite the first surface, a second board 122 having a third surface facing the second surface of the first board, and a flow channel 123 formed by a gap between the second surface and the third surface.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a cooling device, wherein performance of cooling a plurality of electronic apparatuses is improved, and the cooling performance is stabilized by eliminating variance of the cooling performance, and handleability and maintainability of the electronic apparatuses are improved. A plurality of inner partitioning walls 13a-13e and 14a-14e are provided in a cooling tank 12 having an open space formed with a bottom wall and side walls, thereby forming a plurality of storing sections 15aa-15dd that are disposed by dividing the open space. An electronic apparatus 100 is stored in each of the storing sections 15aa-15dd. In the storing sections 15aa-15dd, inflow ports 16aa-16dd or inflow ports 116aa-116ee, and outflow ports 17aa-17ee of a cooling liquid 11 are formed, respectively. The inflow ports 16aa-16dd or the inflow ports 116aa-116ee are formed in a bottom section or side surfaces of the storing sections 15aa-15dd, and the outflow ports 17aa-17ee are formed close to a liquid surface 19 of the cooling liquid 11 circulating in the storing sections 15aa-15dd.

IPC Classes  ?

• G06F 1/20 - Cooling means
• F25D 9/00 - Devices not associated with refrigerating machinery and not covered by groups ; Combinations of devices covered by two or more of the groups
• H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided are a cooling system and a cooling method that are simple and efficient, and improved in performance for cooling an electronic apparatus. The cooling system 10 has a cooling tank 12, and the open space of the cooling tank 12 has thereinside a second cooling liquid 13 having a boiling point T2. In the open space of the cooling tank 12, an electronic apparatus 100 in which a processor 110, which is a heat emitting element, is mounted on a board 120 is housed and immersed in the second cooling liquid 13. An ebullient cooling device 200 is thermally connected to the processor 110, and has a first cooling liquid 11 having a boiling point T1 (T2 > T1) encapsulated therein.

IPC Classes  ?

• H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
• F25D 9/00 - Devices not associated with refrigerating machinery and not covered by groups ; Combinations of devices covered by two or more of the groups
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a cooling system which efficiently cools a plurality of electronic equipment placed at a high density in a small-volume cooling pool while reducing loss of a coolant caused by evaporation. The cooling system 10 is configured to accommodate a plurality of electronic equipment 100 in an open space of a cooling pool 12 in which are provided an entrance 14 and exit 16 for a coolant 13, wherein the plurality of electronic equipment 100 is immersed and directly cooled in the coolant 13 circulating in the open space. The coolant 13 contains a perfluorinated compound as a main ingredient, and has a liquid weight reduction rate of at most 1.5% when 100 hours have passed when 10 ml of the coolant is placed in a 10-ml graduated cylinder (11.5 mm-diameter opening) and allowed to evaporate naturally in a normal environment at a room temperature of 25 °C. Moreover, the coolant 13 can be configured such that the coolant has a vapor pressure of at most 1.0 kPa at a room temperature of 25 °C, and/or a boiling point of at least 150 °C.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids