Showa Denko K.K.

Japan

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2023 25
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IPC Class
G11B 5/84 - Processes or apparatus specially adapted for manufacturing record carriers 95
H01M 4/36 - Selection of substances as active materials, active masses, active liquids 86
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) 84
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers 80
H01L 33/32 - Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen 78
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Found results for  patents
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1.

ALUMINUM ALLOY MEMBER FOR FORMING FLUORIDE FILM AND ALUMINUM ALLOY MEMBER HAVING FLUORIDE FILM

      
Application Number JP2022034148
Publication Number 2023/042812
Status In Force
Filing Date 2022-09-13
Publication Date 2023-03-23
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Hirose Katsumasa
  • Kaneshita Takeshi
  • Murase Isao
  • Kudo Yu

Abstract

An aluminum alloy member (1) for forming a fluoride film is used as a member of a semiconductor manufacturing device and has a composition containing 1.2-4.5 mass% of Mg and 0.2-1.0 mass% of Si, with the excess Mg concentration being 0.5 mass% or more.

IPC Classes  ?

  • C22C 21/00 - Alloys based on aluminium
  • C22C 21/06 - Alloys based on aluminium with magnesium as the next major constituent
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/047 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
  • C25D 11/04 - Anodisation of aluminium or alloys based thereon
  • C25D 11/18 - After-treatment, e.g. pore-sealing

2.

LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE MATERIAL, LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE, METHOD FOR PRODUCING SAID LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE MATERIAL, METHOD FOR PRODUCING SAID LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE, AND ALL-SOLID-STATE BATTERY

      
Application Number JP2022031814
Publication Number 2023/032772
Status In Force
Filing Date 2022-08-24
Publication Date 2023-03-09
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sei Ryosuke
  • Lee Kunchan

Abstract

28288 of the lithium ion-conductive solid electrolyte material, is 0.160° or more in X-ray diffractometry.

IPC Classes  ?

  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
  • C01B 35/12 - Borates
  • H01B 1/06 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
  • H01B 1/08 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
  • H01M 4/40 - Alloys based on alkali metals
  • H01M 4/48 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
  • H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials
  • H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators

3.

SOLID ELECTROLYTE, SOLID-STATE BATTERY, AND SOLID ELECTROLYTE MATERIAL

      
Application Number JP2022031815
Publication Number 2023/032773
Status In Force
Filing Date 2022-08-24
Publication Date 2023-03-09
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sei Ryosuke
  • Lee Kunchan

Abstract

One embodiment of the present invention relates to a solid electrolyte, a solid-state battery, or a solid electrolyte material. The solid electrolyte contains: a lithium ion conducting phase including at least tantalum, phosphorus, and oxygen as constituent elements; and a chemical phase that has at least phosphorus and oxygen as constituent elements and does not include tantalum. In a scanning transmission electron microscopy energy dispersive X-ray spectroscopy (STEM-EDX) image of the solid electrolyte, the area ratio of the chemical phase relative to a total of 100% of the area of the lithium ion conducting phase, the area of the chemical phase, and the void area is at least 0.40%, and the solid electrolyte has at least lithium, tantalum, phosphorus, and oxygen as constituent elements.

IPC Classes  ?

  • H01B 1/06 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
  • C01B 25/45 - Phosphates containing plural metal, or metal and ammonium
  • H01B 1/08 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
  • H01M 4/40 - Alloys based on alkali metals
  • H01M 4/48 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
  • H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
  • H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

4.

THERMALLY CONDUCTIVE COMPOSITION

      
Application Number JP2022021189
Publication Number 2023/026615
Status In Force
Filing Date 2022-05-24
Publication Date 2023-03-02
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Minorikawa, Naoki
  • Funahashi, Hajime
  • Satoh, Hikaru
  • Yukutake, Hajime

Abstract

Provided is a thermally conductive composition comprising a filler and a polymer component, wherein the filler includes at least one surface-treated filler selected from the group consisting of the following fillers (A) and (B). Filler (A): a filler which is surface-treated through chemical vapor deposition by using a siloxane having one SiH group. Filler (B): a filler which is surface-treated through chemical vapor deposition by using a siloxane having two or more SiH groups, and which has, on the surface thereof, silicon atoms to which at least one group selected from the group consisting of an unsubstituted C6-C20 alkyl group, a substituted C2-C20 alkyl group, and a group having a specific structure is bonded and introduced.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
  • C08L 75/04 - Polyurethanes
  • C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
  • C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups

5.

ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT

      
Application Number JP2022026719
Publication Number 2023/017696
Status In Force
Filing Date 2022-07-05
Publication Date 2023-02-16
Owner SHOWA DENKO K.K. (Japan)
Inventor Matsui Kazuma

Abstract

1-xx1-yyy. In the chemical formulae, x is not less than 0 but less than 1, y is more than 0 but not more than 1, and x is smaller than y.

IPC Classes  ?

  • H01L 21/3065 - Plasma etching; Reactive-ion etching
  • H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting

6.

LINING MATERIAL

      
Application Number JP2022030719
Publication Number 2023/017853
Status In Force
Filing Date 2022-08-12
Publication Date 2023-02-16
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Okada, Naoto
  • Kobayashi, Kenichi
  • Goto, Naoki
  • Inoue, Satoshi
  • Marumo, Kazumasa

Abstract

Provided is a lining material containing a fiber base material including a resin composition, the resin composition comprising (A) a vinyl ester resin, (B) an ethylenically unsaturated group-containing monomer, (C) at least one compound selected from oxides and hydroxides of a Group 2 element, and (D) a photopolymerization initiator, wherein the vinyl ester resin (A) has an acid value of 1 to 35 KOHmg/g.

IPC Classes  ?

  • B29C 63/26 - Lining or sheathing of internal surfaces
  • C08F 283/01 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to unsaturated polyesters
  • C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
  • C08F 290/06 - Polymers provided for in subclass
  • C08F 290/14 - Polymers provided for in subclass
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • F16L 1/00 - Laying or reclaiming pipes; Repairing or joining pipes on or under water

7.

RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND COMPOSITE MATERIAL

      
Application Number JP2022030720
Publication Number 2023/017854
Status In Force
Filing Date 2022-08-12
Publication Date 2023-02-16
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kobayashi, Kenichi
  • Goto, Naoki
  • Okada, Naoto

Abstract

A resin composition comprising (A) a vinyl ester resin, (B) a monomer containing an ethylenically unsaturated group, (C) at least one compound selected from an alkaline earth metal oxide and an alkaline earth metal hydroxide, and (D) at least one compound selected from water and a compound containing a hydroxy group, in which the vinyl ester resin (A) comprises a vinyl ester resin (A1), and the vinyl ester resin (A1) has a weight average molecular weight (Mw) of 1,500 or more and a molecular weight distribution (Mw/Mn) of 2.0 or more.

IPC Classes  ?

  • C08F 290/06 - Polymers provided for in subclass
  • C08G 59/16 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

8.

METHOD FOR RENOVATING PIPE

      
Application Number JP2022030701
Publication Number 2023/017851
Status In Force
Filing Date 2022-08-12
Publication Date 2023-02-16
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kobayashi, Kenichi
  • Okada, Naoto
  • Inoue, Satoshi
  • Marumo, Kazumasa

Abstract

This method for renovating a pipe includes: a step (I) for preparing a resin composition; a step (II) for impregnating a fiber base material (F) with the resin composition to obtain a resin composition-impregnated base material; a step (III) for obtaining a lining material containing the resin composition-impregnated base material; and a step (IV) for disposing the lining material in a pipe and photocuring the lining material. The resin composition contains: a resin (A); an ethylenically unsaturated group-containing monomer (B); a thickening agent (C); and a photopolymerization initiator (D). The resin composition has a viscosity of 0.1-3 Pa·s at 25°C in step (II). The resin composition has a viscosity of 400-3500 Pa·s at 25°C when the lining material is disposed in the pipe in step (IV).

IPC Classes  ?

  • B29C 63/34 - Lining or sheathing of internal surfaces using tubular layer or sheathings
  • C08F 283/01 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to unsaturated polyesters
  • C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
  • C08F 290/06 - Polymers provided for in subclass
  • C08F 290/14 - Polymers provided for in subclass
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • F16L 1/00 - Laying or reclaiming pipes; Repairing or joining pipes on or under water
  • F16L 55/162 - Devices for covering leaks in pipes or hoses, e.g. hose-menders from inside the pipe

9.

RESIN COMPOSITION AND MATERIAL FOR LINING MATERIAL

      
Application Number JP2022030702
Publication Number 2023/017852
Status In Force
Filing Date 2022-08-12
Publication Date 2023-02-16
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kobayashi, Kenichi
  • Okada, Naoto
  • Goto, Naoki
  • Marumo, Kazumasa

Abstract

A resin composition used for a lining material for pipe rehabilitation, the resin composition containing a resin (A), an ethylenic-unsaturated-group-containing monomer (B), a thickener (C), and a photopolymerization initiator (D), the resin composition having a viscosity at 25°C of 0.1-3 Pa∙s one hour after preparation, and the resin composition having a viscosity at 25°C of 400-3500 Pa∙s two days and/or five days after preparation.

IPC Classes  ?

  • C08F 290/06 - Polymers provided for in subclass
  • C08F 283/01 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to unsaturated polyesters
  • C08F 290/14 - Polymers provided for in subclass
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

10.

RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND COMPOSITE MATERIAL

      
Application Number JP2022030721
Publication Number 2023/017855
Status In Force
Filing Date 2022-08-12
Publication Date 2023-02-16
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kobayashi, Kenichi
  • Goto, Naoki
  • Okada, Naoto

Abstract

Provided are: a resin composition which exhibits a low initial viscosity immediately after the production thereof, can be thickened at a proper speed, and has excellent handling properties; a method for producing the resin composition; and a composite material comprising the resin composition. The resin composition according to the present invention comprises (A) a vinyl ester resin, (B) a monomer containing an ethylenically unsaturated group, and (C) at least one metal compound selected from an oxide of a Group-2 element and a hydroxide of a Group-2 element, in which the vinyl ester resin (A) comprises a vinyl ester resin (A1) having a weight average molecular weight Mw of 1,500 or more and a ratio of an weight average molecular weight Mw to a number average molecular weight Mn, i.e., an Mw/Mn ratio, of 2.0 or more.

IPC Classes  ?

  • C08F 290/06 - Polymers provided for in subclass
  • C08G 59/16 - Polycondensates modified by chemical after-treatment by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

11.

THERMALLY CONDUCTIVE RESIN COMPOSITION, CURED PRODUCT, HEAT TRANSFER MEMBER AND ELECTRONIC DEVICE

      
Application Number JP2022019257
Publication Number 2023/007894
Status In Force
Filing Date 2022-04-28
Publication Date 2023-02-02
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Yukutake, Hajime
  • Funahashi, Hajime
  • Satoh, Hikaru

Abstract

A thermally conductive resin composition which contains an epoxy resin and a thermally conductive powder, wherein: the thermally conductive powder contains aluminum nitride, which has a silicon-containing oxide coating film on the surface, and another thermally conductive powder; the content of the epoxy resin is from 1% by mass to 20% by mass relative to the total amount of the thermally conductive resin composition; the content of the thermally conductive powder is from 80% by mass to 99% by mass relative to the total amount of the thermally conductive resin composition; the content of the aluminum nitride, which has a silicon-containing oxide coating film on the surface, is from 10% by mass to 70% by mass relative to the total amount of the thermally conductive resin composition; and the content of the other thermally conductive powder is from 10% by mass to 89% by mass relative to the total amount of the thermally conductive resin composition.

IPC Classes  ?

  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
  • C01B 21/072 - Binary compounds of nitrogen with metals, with silicon, or with boron with aluminium
  • C08K 3/22 - Oxides; Hydroxides of metals
  • C08K 9/02 - Ingredients treated with inorganic substances
  • H01L 23/373 - Cooling facilitated by selection of materials for the device

12.

ELECTROCHEMICAL DEVICE, ELECTROLYTE SOLUTION, AND ADDITIVE USED FOR ELECTROLYTE SOLUTION

      
Application Number JP2022029343
Publication Number 2023/008569
Status In Force
Filing Date 2022-07-29
Publication Date 2023-02-02
Owner
  • SHOWA DENKO MATERIALS CO., LTD. (Japan)
  • SHOWA DENKO K.K. (Japan)
Inventor
  • Konno Kaoru
  • Yamada Kumpei
  • Ikeda Yosuke
  • Irie Koji

Abstract

An electrochemical device which is provided with a positive electrode, a negative electrode and an electrolyte solution, wherein: the negative electrode contains a silicon-based active material; and the electrolyte solution contains a compound represented by formula (1). In formula (1), each of R1to R3 independently represents a hydrogen atom or a methyl group; and X represents a divalent organic group.

IPC Classes  ?

  • H01M 10/0567 - Liquid materials characterised by the additives
  • H01G 11/64 - Liquid electrolytes characterised by additives
  • H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
  • H01M 4/48 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
  • H01M 10/052 - Li-accumulators

13.

MATERIAL DESIGN ASSISTANCE DEVICE, MATERIAL DESIGN ASSISTANCE METHOD, AND PROGRAM

      
Application Number JP2022027887
Publication Number 2023/002951
Status In Force
Filing Date 2022-07-15
Publication Date 2023-01-26
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takemoto, Shimpei
  • Kaneshita, Takeshi
  • Okano, Yu
  • Okuno, Yoshishige

Abstract

Provided is a material design assistance device for assisting in optimizing the design conditions of a material, the material design assistance device having: a design condition setting unit for setting a range of design conditions of the material; a required characteristic setting unit for setting a range of required characteristics of the material; a covering prediction point generation unit for generating a plurality of covering prediction points within the range of design conditions; a prediction unit for inputting the plurality of covering prediction points to a trained model that is trained using a correspondence relation between the design conditions of the material and characteristic values of the material and predicting the characteristic values of the material; and a design condition adjustment unit for adjusting the range of design conditions of a material for which a plurality of covering prediction points is to be generated next, on the basis of range of required characteristics of the material and the characteristic values of the material for each of the predicted plurality of covering prediction points.

IPC Classes  ?

  • G06Q 50/04 - Manufacturing
  • G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model

14.

THIOL-CONTAINING COMPOSITION, PHOTOCURABLE COMPOSITION, AND THERMOSETTING COMPOSITION

      
Application Number JP2022028178
Publication Number 2023/003011
Status In Force
Filing Date 2022-07-20
Publication Date 2023-01-26
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Hashimoto Yuji
  • Nishimura Norihito

Abstract

This thiol-containing composition contains a polyfunctional secondary thiol compound (A) and a disulfide dimer (B). The polyfunctional secondary thiol compound (A) is an ester of a carboxylic acid having a secondary mercapto group and a polyhydric alcohol. The disulfide dimer (B) is a disulfide dimer of the polyfunctional secondary thiol compound (A). The content of the disulfide dimer (B) is 0.001-1.5 parts by mass relative to 100 parts by mass of the polyfunctional secondary thiol compound (A).

IPC Classes  ?

  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • C07C 323/52 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
  • C08G 59/66 - Mercaptans
  • C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds

15.

FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM

      
Application Number JP2022026256
Publication Number 2023/286626
Status In Force
Filing Date 2022-06-30
Publication Date 2023-01-19
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kasahara Chizuru
  • Kato Tsuyoshi
  • Shibata Natsumi
  • Yagyu Daisuke
  • Tanji Yutaka
  • Kuroda Takuma

Abstract

Provided is a fluorine-containing ether compound that can form a lubricating layer with which it is possible to raise the chemical resistance of magnetic recording media even when the layer is thin and that can be used suitably as a material of a lubricant for magnetic recording media. Provided is a fluorine-containing ether compound represented by the following formula. R122-R2222-CHR3222-R422-R5(in the formula, R2and R4are perfluoropolyether chains. R1and R5are end groups that include two or three hydroxyl groups, each of the hydroxyl groups bonding to a mutually different carbon atom, and the carbon atoms to which the hydroxyl groups are bonded bonding to each other via linking groups that include carbon atoms to which no hydroxyl groups are bonded. R32aa-OH (a is an integer of 2-8.))

IPC Classes  ?

  • C07C 43/13 - Saturated ethers containing hydroxy or O-metal groups
  • C10N 30/00 - Specified physical or chemical property which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
  • C10N 40/18 - Electric or magnetic purposes in connection with recordings on magnetic tape or disc
  • G11B 5/70 - Record carriers characterised by the selection of the material comprising one or more layers of magnetisable particles homogeneously mixed with a bonding agent on a base layer
  • G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
  • G11B 5/84 - Processes or apparatus specially adapted for manufacturing record carriers
  • C10M 105/54 - Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing halogen containing carbon, hydrogen, halogen and oxygen

16.

TRANSPARENT CONDUCTIVE FILM LAMINATE AND METHOD FOR PRODUCING SAME

      
Application Number JP2022025918
Publication Number 2023/286601
Status In Force
Filing Date 2022-06-29
Publication Date 2023-01-19
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Yamaki Shigeru
  • Yoneda Shuhei

Abstract

[Problem] To provide: a transparent conductive film laminate which is suppressed in curling of the transparent conductive film laminate during a heating process in cases where a polycarbonate resin is used as a base material for a transparent conductive film, and which is capable of ensuring the yield of the subsequent processes and capable of reducing the production cost; and a method for producing this transparent conductive film laminate. [Solution] A transparent conductive film laminate which comprises a transparent conductive film 10 and a carrier film 1 that is superposed on the transparent conductive film, wherein: the transparent conductive film 10 is obtained by sequentially superposing a transparent conductive layer 3 that comprises a metal thin wire and an overcoat layer 4 in this order on one main surface of a transparent resin film 2 that is formed of a polycarbonate film (having a thickness Ts of 30 to 100 µm); the transparent conductive film 10 is removably superposed on one adhesive main surface of the carrier film 1, which is formed of a polyolefin film and only one main surface of which is adhesive, so that the overcoat layer 4 serves as the outermost layer; and the ratio (Tc/Ts) of the thickness Tc of the carrier film 1 to the thickness Ts of the transparent resin film 2 satisfies 0.2 ≤ Tc/Ts ≤ 0.7.

IPC Classes  ?

  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
  • B32B 7/025 - Electric or magnetic properties
  • B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins

17.

TRANSPARENT CONDUCTIVE FILM LAMINATE AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2022025919
Publication Number 2023/286602
Status In Force
Filing Date 2022-06-29
Publication Date 2023-01-19
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Yamaki Shigeru
  • Yoneda Shuhei

Abstract

[Problem] To provide a transparent conductive film laminate and a method for manufacturing the same, whereby, when an amorphous cycloolefin-based resin is used in a base material of a transparent conductive film, curling of a transparent conductive film laminate during a heating process is suppressed, the yield of a subsequent process can be ensured, and manufacturing costs can be reduced. [Solution] Provided is a transparent conductive film laminate containing a transparent conductive film 10 and a carrier film 1 laminated thereto. The transparent conductive film 10 is obtained by laminating a transparent conductive layer 3, that contains a fine metal wire, and an overcoat layer 4, in this order, onto one main surface of a transparent resin film 2 comprising an amorphous cycloolefin-based resin (thickness Ts = 30 to 150 µm). The carrier film 1 comprises a polyolefin film, and only one main surface of the carrier film 1 is adhesive. The transparent conductive film 10 is releasably laminated to the one adhesive main surface of the carrier film 1 such that the overcoat layer 4 becomes the outermost layer. The ratio (Tc/Ts) of the thickness Tc of the carrier film 1 to the thickness Ts of the transparent resin film 2 satisfies 0.2 ≦ Tc/Ts ≦ 0.8.

IPC Classes  ?

  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
  • B32B 7/025 - Electric or magnetic properties
  • B32B 15/085 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyolefins
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins

18.

EVALUATION DEVICE, EVALUATION METHOD, AND EVALUATION PROGRAM

      
Application Number JP2022025255
Publication Number 2023/282087
Status In Force
Filing Date 2022-06-24
Publication Date 2023-01-12
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Okano, Yu
  • Sakaguchi, Junya
  • Nakajima, Takumi
  • Hirasawa, Shinya
  • Takemoto, Shimpei
  • Okuno, Yoshishige

Abstract

Provided are an evaluation device, an evaluation method, and an evaluation program that make it possible to evaluate the quality of a sintered body. The evaluation device includes: an acquisition unit that acquires a cross-sectional image obtained by capturing an image of a cross section of a sintered body group dyed using a dyeing liquid; a generation unit that extracts a chroma component of each sintered body from the cross-sectional image and generates a chroma component image; and a visualization unit that visualizes the chroma component image.

IPC Classes  ?

  • G01N 21/91 - Investigating the presence of flaws, defects or contamination using penetration of dyes, e.g. fluorescent ink

19.

FILLER AND MANUFACTURING METHOD THEREFOR, AND COLUMN FOR SIZE EXCLUSION CHROMATOGRAPHY

      
Application Number JP2022022598
Publication Number 2023/276550
Status In Force
Filing Date 2022-06-03
Publication Date 2023-01-05
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Uchiyama Naoki
  • Kokido Yuzuru

Abstract

24l36m24nn-H (In formula 1, l is an integer from 5 to 140, m is an integer from 15 to 75, and n is an integer from 5 to 140. The percentage of m in the total of l, m, and n is 5-85%.)

IPC Classes  ?

  • B01J 20/282 - Porous sorbents
  • B01D 15/34 - Size-selective separation, e.g. size-exclusion chromatography; Gel filtration; Permeation
  • B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
  • B01J 20/285 - Porous sorbents based on polymers
  • B01J 20/30 - Processes for preparing, regenerating or reactivating

20.

METHOD FOR PRODUCING ALCOHOL

      
Application Number JP2022017416
Publication Number 2023/276406
Status In Force
Filing Date 2022-04-08
Publication Date 2023-01-05
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Koyano, Masafumi
  • Inoue, Gen
  • Kimura, Toshihiro

Abstract

Provided is a method for producing an alcohol through an olefin hydration reaction using a heteropolyacid catalyst, the method enabling the catalyst to be stably used over a long period. In the olefin hydration reaction, in which the heteropolyacid catalyst is used, the pressure loss during the period of passing a feed-material gas through a catalyst layer is regulated to a certain value or less. Specifically, the method for producing an alcohol comprises using a solid-acid catalyst including a supported heteropolyacid or salt thereof, supplying water and a 2C-5C olefin to a reactor, and hydrating the olefin in a gas phase, wherein the pressure loss during the period of passing the feed-material gas through a layer of the catalyst is regulated to 350 kPa or less.

IPC Classes  ?

  • C07C 29/04 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by addition of hydroxy groups to unsaturated carbon-to-carbon bonds, e.g. with the aid of H2O2 by hydration of carbon-to-carbon double bonds
  • B01J 23/30 - Tungsten
  • C07C 31/08 - Ethanol
  • C07B 61/00 - Other general methods

21.

METHOD FOR PRODUCING ALCOHOLS

      
Application Number JP2022017423
Publication Number 2023/276407
Status In Force
Filing Date 2022-04-08
Publication Date 2023-01-05
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Inoue, Gen
  • Kimura, Toshihiro
  • Koyano, Masafumi

Abstract

Provided is a method for producing alcohols by an olefin hydration reaction using a heteropolyacid catalyst, wherein the catalyst can be stably used on a long-term basis. The temperature difference within the catalyst layer in the olefin hydration reaction using a heteropolyacid catalyst is made less than or equal to a certain value. Specifically, in a method for producing alcohols in which a gas-phase hydration reaction is carried out using a solid acid catalyst that supports a heteropolyacid acid or salt thereof and supplying water and C2-C5 olefin to a reactor, the temperature difference within the catalyst layer in the reactor is established at less than or equal to 6°C.

IPC Classes  ?

  • C07C 29/04 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by addition of hydroxy groups to unsaturated carbon-to-carbon bonds, e.g. with the aid of H2O2 by hydration of carbon-to-carbon double bonds
  • B01J 23/30 - Tungsten
  • C07C 31/08 - Ethanol
  • C07B 61/00 - Other general methods

22.

FILLER, METHOD FOR PRODUCING SAME, AND COLUMN FOR SIZE EXCLUSION CHROMATOGRAPHY

      
Application Number JP2022022597
Publication Number 2023/276549
Status In Force
Filing Date 2022-06-03
Publication Date 2023-01-05
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Uchiyama Naoki
  • Kokido Yuzuru

Abstract

Provided are: a filler for use in size exclusion chromatography which has high alkali resistance and in which non-specific adsorption is suppressed; and a method for producing the filler. The filler is characterized in that one end of at least one alkylene group selected from among linear alkylene groups, cycloalkylene groups, and linear alkylcycloalkylene groups with 4 to 9 carbon atoms is bonded by a glycidyl group derived from glycidyl methacrylate to a porous organic polymer carrier containing 60-95 mol% of a repeating unit derived from glycidyl methacrylate and 5-40 mol% of a repeating unit derived from a polyfunctional monomer, and the other end of the alkylene group is bonded with any one end of a polyol via an ether bond.

IPC Classes  ?

  • C08F 220/32 - Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
  • B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
  • B01J 20/285 - Porous sorbents based on polymers
  • C08F 8/00 - Chemical modification by after-treatment

23.

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PROTECTIVE SHEET

      
Application Number JP2022025552
Publication Number 2023/276944
Status In Force
Filing Date 2022-06-27
Publication Date 2023-01-05
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Imai Yuya
  • Sasaki Kazuhiro
  • Ikeya Tatsuhiro
  • Nakanishi Kenichi

Abstract

Provided is a pressure-sensitive adhesive composition which can give cured objects inhibited from changing in gel content even under high-temperature high-humidity conditions. This pressure-sensitive adhesive composition comprises a urethane polymer (A) containing an ethylenically unsaturated group, a monomer (B) containing an ethylenically unsaturated group, and a photopolymerization initiator (C). The urethane polymer (A) containing an ethylenically unsaturated group is a product of reaction among a polyoxyalkylene polyol (a1), polyisocyanates (a2), and either an ethylenically unsaturated hydroxylated compound (a3-1) or an ethylenically unsaturated compound (a3-2) containing an isocyanato group. The polyisocyanates (a2) comprise a polyisocyanate (a2-1) containing an ethylenically unsaturated group and a polyisocyanate (a2-2) containing no ethylenically unsaturated group.

IPC Classes  ?

  • C08F 290/06 - Polymers provided for in subclass
  • C08F 290/14 - Polymers provided for in subclass
  • C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
  • C09J 4/02 - Acrylmonomers
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 175/08 - Polyurethanes from polyethers
  • C09J 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
  • C08G 18/67 - Unsaturated compounds having active hydrogen
  • C08G 18/81 - Unsaturated isocyanates or isothiocyanates
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

24.

FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM

      
Application Number JP2022025579
Publication Number 2023/276954
Status In Force
Filing Date 2022-06-27
Publication Date 2023-01-05
Owner SHOWA DENKO K.K. (Japan)
Inventor Nanko Masaki

Abstract

Provided is a fluorine-containing ether compound that has excellent abrasion resistance even when the thickness thereof is low, and that can form a lubrication layer in which a reduction in film thickness caused by spin-off is unlikely to occur. This fluorine-containing ether compound is represented by the following formula: R1-R222-R322-O-R4-R5(R3represents a perfluoropolyether chain. R1and R5each represent either an alkyl group optionally having a substituent group, or a hydrocarbon group having a double bond or a triple bond. R2and R4each represent a divalent linkage group having one or more heteroatoms, each have one or more polar groups, and respectively have a heteroatom at the outermost terminal on the side where a bond is formed with R1and R5. At least one of R2or R4includes one or more secondary amine structures. At least one of R1-R2- or -R4-R5 has one or more cyano groups.)

IPC Classes  ?

  • C07C 255/24 - Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and singly-bound nitrogen atoms, not being further bound to other hetero atoms, bound to the same saturated acyclic carbon skeleton
  • C08G 65/28 - Cyclic ethers and hydroxy compounds
  • G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
  • C10M 105/54 - Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing halogen containing carbon, hydrogen, halogen and oxygen
  • C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen

25.

ETHYLENICALLY UNSATURATED GROUP-CONTAINING URETHANE POLYMER, METHOD FOR PRODUCING SAME, AND ADHESIVE COMPOSITION

      
Application Number JP2022025738
Publication Number 2023/277008
Status In Force
Filing Date 2022-06-28
Publication Date 2023-01-05
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Imai Yuya
  • Sasaki Kazuhiro

Abstract

Provided are: an ethylenically unsaturated group-containing urethane polymer able to suppress a change in the gel fraction of a cured product even under conditions of high temperature and high humidity; a method for producing same; and an adhesive composition obtained using the urethane polymer. This ethylenically unsaturated group-containing urethane polymer is a product of a reaction between: a urethane prepolymer, which is a product of a reaction between a polyoxyalkylene polyol (a1) and a polyisocyanate (a2); and a hydroxyl group-containing ethylenically unsaturated compound (a3-1) or an isocyanate group-containing ethylenically unsaturated compound (a3-2). The polyisocyanate (a2) contains a polyisocyanate (a2-1) that contains an ethylenically unsaturated group and a polyisocyanate (a2-2) that does not contain an ethylenically unsaturated group. A structure derived from the polyisocyanate (a2-1) that contains an ethylenically unsaturated group is present in at least the central region of the main chain of the ethylenically unsaturated group-containing urethane polymer.

IPC Classes  ?

  • C08G 18/81 - Unsaturated isocyanates or isothiocyanates
  • C08F 290/14 - Polymers provided for in subclass
  • C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
  • C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 175/08 - Polyurethanes from polyethers
  • C09J 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds

26.

PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, AND IMAGE DISPLAY DEVICE

      
Application Number JP2022024139
Publication Number 2022/270407
Status In Force
Filing Date 2022-06-16
Publication Date 2022-12-29
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Zhou Zhengwei
  • Yanagi Masayoshi
  • Kinoshita Takehiro

Abstract

A photosensitive resin composition comprising an alkali-soluble resin, an alkoxysilylated resin, a reactive diluent, a photo-radical polymerization initiator, and a solvent, wherein the alkali-soluble resin contains a constituent unit (a-1) derived from a compound having an ethylenically unsaturated group and containing an aromatic group, has an acid group and a (meth)acryloyloxy group, has an ethylenically-unsaturated-group equivalent of 400-2,500 g/mol, and contains the constituent unit (a-1) in an amount of 15-60 mol% with respect to all the repeating constituent units of the alkali-soluble resin and the alkoxysilylated resin includes a constituent unit derived from a compound having an ethylenically unsaturated group and containing an alkoxysilyl group.

IPC Classes  ?

  • C08F 220/04 - Acids; Metals salts or ammonium salts thereof
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/32 - Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
  • G03F 7/004 - Photosensitive materials
  • G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/075 - Silicon-containing compounds

27.

METHOD FOR MANUFACTURING BONDED BODY

      
Application Number JP2022025232
Publication Number 2022/270613
Status In Force
Filing Date 2022-06-24
Publication Date 2022-12-29
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takahashi, Nobuyuki
  • Kuroki, Kunihiro
  • Saito, Hayato

Abstract

A method for manufacturing a bonded body, having: a pre-bonding step in which a substrate A, a solid bonding agent, and a substrate B are positioned in this order to prepare a layered body, said solid bonding agent having, as the primary component thereof, an amorphous thermoplastic resin that is a thermoplastic epoxy resin and/or a phenoxy resin; and a bonding step in which the layered body is heated and pressurized to melt the solid bonding agent, and the substrate A and the substrate B are bonded, wherein the amorphous thermoplastic resin has an epoxy equivalent of 1,600 or greater or the amorphous thermoplastic resin does not include an epoxy group, and the heat of fusion of the amorphous thermoplastic resin is 15 J/g or less.

IPC Classes  ?

  • B29C 65/48 - Joining of preformed parts; Apparatus therefor using adhesives
  • C09J 5/06 - Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
  • C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
  • C09J 171/12 - Polyphenylene oxides

28.

PHYSICAL PROPERTY PREDICTION DEVICE, PHYSICAL PROPERTY PREDICTION METHOD, AND PROGRAM

      
Application Number JP2022024845
Publication Number 2022/270530
Status In Force
Filing Date 2022-06-22
Publication Date 2022-12-29
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Aonuma, Naoto
  • Takemoto, Shimpei
  • Minami, Takuya
  • Kakuda, Kohsuke
  • Okuno, Yoshishige
  • Takashi, Hiroko

Abstract

A physical property prediction device for predicting a physical property of a compound. The physical property prediction device comprises: a creation unit which uses a first stage of synthesis information and synthesis result information as learning data to create a first stage of a trained model; a creation unit which uses an nth (n≧2) stage of synthesis information, an nth stage of synthesis result information, and an n-1th stage of synthesis result information as learning data to create a second stage to a final stage of trained models; an accepting unit for accepting a setting of synthesis information about a compound of which a physical property is to be predicted; a prediction unit for predicting a physical property value of a product synthesized by a first stage of chemical reaction of the compound; a prediction unit for repeating a process of predicting a physical property value of a product synthesized by an nth stage of chemical reaction of the compound from a second stage of the compound to a final stage of chemical reaction; and an output unit for outputting the predicted physical property value.

IPC Classes  ?

  • G16C 20/30 - Prediction of properties of chemical compounds, compositions or mixtures
  • G16C 20/70 - Machine learning, data mining or chemometrics

29.

COMPOSITE CARBON PARTICLES AND USE THEREOF

      
Application Number JP2022024885
Publication Number 2022/270539
Status In Force
Filing Date 2022-06-22
Publication Date 2022-12-29
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kurita Takayuki
  • Ito Yuji
  • Inoue Hirofumi

Abstract

Provided are composite carbon particles with which it is possible to obtain a lithium ion secondary battery exhibiting improved cycle characteristics. The composite carbon particles each contain a porous carbon material and a silicon component. The silicon component is included in at least a portion of pores of the porous carbon material. The composite carbon particles contain phosphorus elements at an amount not less than 40 mass ppm but less than 8000 mass ppm.

IPC Classes  ?

  • C01B 32/00 - Carbon; Compounds thereof
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
  • H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals

30.

RADICALLY POLYMERIZABLE RESIN COMPOSITION

      
Application Number JP2022021260
Publication Number 2022/264761
Status In Force
Filing Date 2022-05-24
Publication Date 2022-12-22
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Usami Akira
  • Fujita Shinichiro

Abstract

The present invention is able to provide a radically polymerizable resin composition which is capable of suppressing change in the strength of a cured product thereof due to exposure to a high temperature environment. A radically polymerizable resin composition according to the present invention contains (A) a radically polymerizable resin, (B) an ethylenically unsaturated compound, (C) a hindered phenolic compound and (D) a hindered amine compound.

IPC Classes  ?

  • C08F 290/06 - Polymers provided for in subclass
  • C08F 290/14 - Polymers provided for in subclass
  • C08K 5/13 - Phenols; Phenolates
  • C08K 5/17 - Amines; Quaternary ammonium compounds
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers

31.

ALUMINUM ALLOY EXTRUSION AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2022023598
Publication Number 2022/264959
Status In Force
Filing Date 2022-06-13
Publication Date 2022-12-22
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Maruyama Takumi
  • Ohashi Yoshimasa
  • Xiang Juan

Abstract

The present invention provides an aluminum alloy extrusion having a high tensile strength and a high offset yield strength at low cost. The aluminum alloy extrusion comprises 0.90 mass% to 2.00 mass% Si, 0.65 mass% to 0.90 mass% Mg, 0.25 mass% to 0.50 mass% Cu, 0.050 mass% to 0.49 mass% Fe, 0.10 mass% to 0.25 mass% Zr, 0.010 mass% to 0.10 mass% Ti, and an amount of B that, by mass, is 0.050 to 1.0 times the amount of Ti, with the remainder being made up of Al and unavoidable impurities. In a cross-section of aluminum alloy extrusion perpendicular to the extrusion direction, the area ratio occupied by crystal grains having an aspect ratio of 5.0 or below and a length in the long axis direction of 50 μm to 1000 μm is greater than or equal to 90.0%, and the electrical conductivity of the surface is less than or equal to 51.1 IACS%.

IPC Classes  ?

  • C22C 21/02 - Alloys based on aluminium with silicon as the next major constituent
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/043 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
  • C22F 1/05 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys of the Al-Si-Mg type, i.e. containing silicon and magnesium in approximately equal proportions

32.

DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT, AND CLEANING METHOD

      
Application Number JP2022022490
Publication Number 2022/259953
Status In Force
Filing Date 2022-06-02
Publication Date 2022-12-15
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Iwasaki Jumpei
  • Matsui Kazuma

Abstract

The present invention provides a dry etching method that is capable of selectively etching an etching object, which contains lanthanum, over a non-etching object at a sufficient etching rate without using a plasma. This dry etching method comprises a dry etching step in which an etching gas that contains nitrosyl fluoride is brought into contact with a member (12) to be etched, which comprises an etching object that is to be etched by the etching gas and a non-etching object that is not to be etched by the etching gas, and the etching object is selectively etched over the non-etching object without using a plasma. The etching object contains lanthanum.

IPC Classes  ?

  • H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
  • C23F 1/12 - Gaseous compositions
  • H01L 21/3065 - Plasma etching; Reactive-ion etching

33.

INFORMATION PROCESSING SYSTEM, MATERIAL COMPOSITION SEARCHING METHOD, MATERIAL COMPOSITION SEARCHING DEVICE, AND PROGRAM

      
Application Number JP2022022916
Publication Number 2022/260029
Status In Force
Filing Date 2022-06-07
Publication Date 2022-12-15
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sakaguchi, Suguru
  • Okuno, Yoshishige

Abstract

An information processing system including an annealing-type calculation device using an Ising model and a material composition searching device that converts a combination optimization problem of material compositions asymptotic to a target physical property value into the Ising model to make the calculation device solve the combination optimization problem, the information processing system further including: an input reception unit that receives input of a target value of at least one physical property; a conversion unit that converts a mathematical expression formulating the combination optimization problem of the material compositions asymptotic to the target value among mixed materials of materials having known physical property values into the Ising model of a data type that can be used by the calculation device; an optimized solution calculation unit that uses the Ising model to calculate an optimized solution of the material compositions asymptotic to the target value; and an output control unit that outputs the optimized solution of the material compositions asymptotic to the calculated target value, wherein the mathematical expression is formulated so that, of the material compositions asymptotic to the target value, a material composition containing a larger number of materials is less likely to be calculated as the optimized solution, and a material composition containing a smaller number of materials is more likely to be calculated as the optimized solution.

IPC Classes  ?

  • G06N 99/00 - Subject matter not provided for in other groups of this subclass

34.

INFORMATION PROCESSING SYSTEM, MATERIAL COMPOSITION SEARCH METHOD, MATERIAL COMPOSITION SEARCH DEVICE, AND PROGRAM

      
Application Number JP2022022917
Publication Number 2022/260030
Status In Force
Filing Date 2022-06-07
Publication Date 2022-12-15
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sakaguchi, Suguru
  • Okuno, Yoshishige

Abstract

This information processing system, comprising an annealing-type computing device employing an Ising model, and a material composition search device which converts a material composition combinatorial optimization problem that asymptotically approaches a target physical property value into an Ising model, and causes the computing device to solve the same, includes: an input accepting unit for accepting input of a target value and an allowable variation range of a physical property; a converting unit for converting a formula formulating the material composition combinatorial optimization problem that asymptotically approaches the target value into an Ising model having a data format that can be used by the computing device; an optimal solution calculating unit for using the Ising model to calculate an optimal solution for the material composition that asymptotically approaches the target value; a post-processing unit for performing post-processing to exclude a material contained in a mixed material from the optimal solution of the material composition, within the allowable variation range of the target value; and an output control unit for outputting the post-processed material composition.

IPC Classes  ?

  • G06N 99/00 - Subject matter not provided for in other groups of this subclass

35.

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION

      
Application Number JP2022021293
Publication Number 2022/255171
Status In Force
Filing Date 2022-05-24
Publication Date 2022-12-08
Owner SHOWA DENKO K.K. (Japan)
Inventor Miyaishi, Yuki

Abstract

Provided is a highly sensitive chemical amplification photosensitive resin composition containing a metal complex dye. This positive photosensitive resin composition contains: (A) a first resin having multiple alkali-soluble functional groups in which at least a portion of the multiple alkali-soluble functional groups is protected by acid-decomposable groups, (B) a photoacid generator, and (C) a metal complex dye, wherein the metal complex dye (C) contains 50 to 94 mass% metal complex ions.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H05B 33/12 - Light sources with substantially two-dimensional radiating surfaces
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H05B 33/22 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

36.

AQUEOUS RESIN COMPOSITION, COATING FILM, COATING FILM PRODUCTION METHOD, AND AQUEOUS RESIN COMPOSITION SET

      
Application Number JP2022021819
Publication Number 2022/255272
Status In Force
Filing Date 2022-05-27
Publication Date 2022-12-08
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kuzutani Takuya
  • Murata Naoki

Abstract

An aqueous resin composition comprising an aqueous resin emulsion (α), a curing agent (β), and a curing accelerator (γ), wherein the aqueous resin emulsion (α) contains a copolymer (X), a polyepoxy compound (Y), and an aqueous medium (Z), the copolymer (X) includes structural units derived from a (meth)acrylic acid ester (A) and structural units derived from an ethylenically unsaturated carboxylic acid (B), the structural units derived from the (meth)acrylic acid ester (A) include a structural unit derived from a hydrophilic (meth)acrylic acid ester (A1), one or both of the copolymer (X) and the polyepoxy compound (Y) include a carboxy group, the curing agent (β) contains an aromatic polyamine (F) having active hydrogen, and the curing accelerator (γ) contains a tertiary amine not having active hydrogen.

IPC Classes  ?

  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
  • C08G 59/50 - Amines
  • C08L 33/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters,; Compositions of derivatives of such polymers
  • C09D 5/02 - Emulsion paints
  • C09D 133/04 - Homopolymers or copolymers of esters
  • C09D 163/00 - Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

37.

1,2,3,4-TETRACHLORO-1-FLUOROBUTANE AND METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING 1,2,3,4-TETRACHLORO-1,1,2,3,4,4-HEXAFLUOROBUTANE

      
Application Number JP2022019336
Publication Number 2022/249852
Status In Force
Filing Date 2022-04-28
Publication Date 2022-12-01
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Fukuchi Yohsuke
  • Mikami Katsumi
  • Kobayashi Hiroshi

Abstract

Provided is a method for producing 1,2,3,4-tetrachloro-1-fluorobutane, which serves as a starting material that enables the production by a stable reaction of 1,2,3,4-tetrachloro-1,1,2,3,4,4-hexafluorobutane. The method for producing 1,2,3,4-tetrachloro-1-fluorobutane comprises a chlorination step of obtaining 1,1,2,3,4-pentachlorobutane by chlorinating 1,2,3,4-tetrachlorobutane by reacting 1,2,3,4-tetrachlorobutane with chlorine gas by a photoreaction in the liquid phase; and a fluorination step of obtaining 1,2,3,4-tetrachloro-1-fluorobutane by fluorinating the 1,1,2,3,4-pentachlorobutane yielded by the chlorination step.

IPC Classes  ?

  • C07C 19/10 - Acyclic saturated compounds containing halogen atoms containing fluorine and chlorine
  • C07C 17/20 - Preparation of halogenated hydrocarbons by replacement by halogens of halogen atoms by other halogen atoms

38.

METHOD FOR PRODUCING 1,2,3,4-TETRACHLORO-1,1,4-TRIFLUOROBUTANE, AND METHOD FOR PRODUCING 1,2,3,4-TETRACHLORO-1,1,2,3,4,4-HEXAFLUOROBUTANE

      
Application Number JP2022019337
Publication Number 2022/249853
Status In Force
Filing Date 2022-04-28
Publication Date 2022-12-01
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Fukuchi Yohsuke
  • Mikami Katsumi
  • Kobayashi Hiroshi

Abstract

Provided is a method for producing 1,2,3,4-tetrachloro-1,1,4,4-trifluorobutane as a raw material from which 1,2,3,4-tetrachloro-1,1,2,3,4,4-hexafluorobutane can be produced through a stable reaction. The method for producing 1,2,3,4-tetrachloro-1,1,4-trifluorobutane comprises: a chlorination step in which chlorine gas is reacted through photoreaction with 1,2,3,4-tetrachlorobutane in a liquid phase and 1,2,3,4-tetrachlorobutane is chlorinated to obtain 1,1,1,2,3,4,4-heptachlorobutane; and a fluorination step in which 1,1,1,2,3,4,4-heptachlorobutane obtained in the chlorination step is fluorinated to obtain 1,2,3,4-tetrachloro-1,1,4-trifluorobutane.

IPC Classes  ?

  • C07C 19/10 - Acyclic saturated compounds containing halogen atoms containing fluorine and chlorine
  • C07C 17/20 - Preparation of halogenated hydrocarbons by replacement by halogens of halogen atoms by other halogen atoms

39.

NONAQUEOUS SECONDARY BATTERY ELECTRODE BINDER, AND NONAQUEOUS SECONDARY BATTERY ELECTRODE

      
Application Number JP2022021375
Publication Number 2022/250080
Status In Force
Filing Date 2022-05-25
Publication Date 2022-12-01
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Nakayama Keito
  • Fukase Kazunari
  • Tanaka Yuma
  • Takahashi Kentarou

Abstract

The present invention provides: a nonaqueous secondary battery electrode binder which enables a significant improvement of discharge capacity retention rate after charge and discharge cycles, while improving flexibility of an electrode active material layer that is formed on a collector; a composition of this nonaqueous secondary battery electrode binder; and a nonaqueous secondary battery electrode. This nonaqueous secondary battery electrode binder contains a copolymer (P). The copolymer (P) comprises: a main chain that is composed of carbon-carbon bonds; a substituent that has an amide bond and is bonded to the main chain; a substituent that has a salt of a carboxy group; and a substituent (c) that is represented by general formula (1). The amount of the amide bond contained per 1 g of the copolymer (P) is from 0.050 to 5.0 mmol/g; the amount of the substituent (b1) is from 5.0 to 12.0 mmol/g; and the amount of the substituent (c) is from 0.15 × 10-2to 8.0 × 10-2 mmol/g.

IPC Classes  ?

  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 10/05 - Accumulators with non-aqueous electrolyte
  • H01M 10/0566 - Liquid materials

40.

COMPOSITE PARTICLES, NEGATIVE ELECTRODE MIXTURE LAYER AND LITHIUM ION SECONARY BATTERY

      
Application Number JP2022021539
Publication Number 2022/250109
Status In Force
Filing Date 2022-05-26
Publication Date 2022-12-01
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Ito Yuji
  • Fujita Masato
  • Tonegawa Akihisa
  • Kurita Takayuki
  • Inoue Hirofumi

Abstract

One embodiment of the present invention provides composite particles which contain silicon and carbon, while having the following characteristics. If the cross-sectional diameter and the silicon content ratio of each one of the composite particles are measured by means of cross-sectional SEM-EDS of the composite particles, and composite particles having a cross-sectional diameter that is not more than half the number average of the cross-sectional diameters are defined as small-diameter composite particles, the proportion of the number of small-diameter composite particles in the number of measured composite particles is from 5% to 50%, the ratio of the average silicon content ratio (% by mass) of particles other than the small-diameter composite particles to the average silicon content ratio (% by mass) of the small-diameter composite particles is 0.90 or less, and the silicon content ratio of the entire composite particles is 45% by mass or more.

IPC Classes  ?

  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
  • H01M 4/48 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
  • H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals
  • C01B 32/05 - Preparation or purification of carbon not covered by groups , , ,

41.

COMPOSITE PARTICLE, NEGATIVE ELECTRODE ACTIVE MATERIAL, AND LITHIUM-ION SECONDARY BATTERY

      
Application Number JP2021020504
Publication Number 2022/249476
Status In Force
Filing Date 2021-05-28
Publication Date 2022-12-01
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takeda Akifumi
  • Tonegawa Akihisa
  • Ito Yuji
  • Kurita Takayuki
  • Fujita Masato
  • Inoue Hirofumi

Abstract

The present invention addresses the problem of providing a negative electrode active material for lithium-ion secondary batteries that suppresses temporal oxidation and has excellent coulombic efficiency and cycle characteristics. Composite particles (A) according to the present invention, in which inorganic particles and a polymer are present in at least a portion of the surface of Si-C composite particles including silicon and a carbon material, have a polymer content of 0.1 to 10.0 mass% and a peak that is present in 450 to 495 cm-1SiSiGDGG) is 0.50 or more and less than 1.25. When an XRD pattern is subjected to powder XRD measurement using Cu-Kα radiation, (peak intensity of SiC111 surface)/(peak intensity of Si111 surface) is 0.01 or less.

IPC Classes  ?

  • H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
  • H01M 4/134 - Electrodes based on metals, Si or alloys
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers

42.

PRODUCTION METHOD OF Si-C COMPOSITE

      
Application Number JP2022021957
Publication Number 2022/250169
Status In Force
Filing Date 2022-05-30
Publication Date 2022-12-01
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Fujita Masato
  • Kojima Kunihiro
  • Ito Yuji
  • Inoue Hirofumi

Abstract

This method for producing a silicon-carbon composite involves passing a silane-containing gas into a reactor filled with porous carbon particles, pyrolyzing the silane in the silane-containing gas and precipitating the silicon in the pores of the porous carbon particles, wherein the reactor is provided with a silane-containing gas passage that leads from a silane-containing gas inlet to an exhaust gas outlet, the porous carbon particles are filled in the silane-containing gas passage, the reaction temperature in the silane-containing gas passage is 330°C-450°C, and has a temperature distribution that rises from the silane-containing gas inlet towards the exhaust gas outlet; defining the reaction temperature of the porous carbon particles in the silane-containing gas passage at the silane-containing gas inlet end as Tup, the reaction temperature at the midpoint between the silane-containing gas inlet end and the exhaust gas outlet end as Tmid, and the reaction temperature at the exhaust gas outlet end as Tdown, it holds that 0°C < Tmid – Tup ≤ 70°C and 0°C ≤ Tdown – Tmid ≤ 50°C.

IPC Classes  ?

  • C01B 32/05 - Preparation or purification of carbon not covered by groups , , ,
  • C01B 33/029 - Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition of monosilane
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys

43.

PREDICTION DEVICE, LEARNING DEVICE, PREDICTION METHOD, LEARNING METHOD, PREDICTION PROGRAM, AND LEARNING PROGRAM

      
Application Number JP2022017833
Publication Number 2022/244563
Status In Force
Filing Date 2022-04-14
Publication Date 2022-11-24
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kakuda, Kosuke
  • Fujimori, Takahiro
  • Lee, Haein
  • Takemoto, Shimpei
  • Minami, Takuya
  • Okuno, Yoshishige

Abstract

The present invention improves the prediction accuracy of a prediction device that uses a trained model. This prediction device includes: a first trained model and a second trained model to each of which is inputted input data to be predicted, and which thereby respectively output first output data and second output data; and an output unit which acquires the first and second output data, and outputs prediction data by calculating a weighted average value or by taking a weighted majority. The first trained model is configured so as to have higher prediction accuracy for input data of an interpolation area than the second trained model, and the second trained model is configured so as to have higher prediction accuracy for input data of an extrapolation area than the first trained model.

IPC Classes  ?

44.

TITANIUM OXIDE PARTICLES AND METHOD FOR PRODUCING SAME

      
Application Number JP2022019383
Publication Number 2022/244620
Status In Force
Filing Date 2022-04-28
Publication Date 2022-11-24
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Furumoto, Yoshiyasu
  • Kayama, Susumu
  • Kogoi, Hisao

Abstract

The present invention provides: titanium oxide particles which exhibits excellent uniformity and excellent dispersibility, while containing less coarse particles; a method for producing the titanium oxide particles; and a slurry, a dispersion, a composition and a dielectric starting material, each of which contains the titanium oxide particles. With respect to the titanium oxide particles according to the present invention, the D90(LD)/D50(LD) of the titanium oxide particles as determined by a laser diffraction/scattering method is more than 1.0 but not more than 2.0; and the concentration (on a number basis) of coarse particles relative to D50 (SEM) of primary particles as determined by the observation with a field-emission scanning electronic microscope is 20 ppm or less, the coarse particles having a size more than 16 times the D50 (SEM). During the production of the titanium oxide particles, when a starting material gas and an oxidizing gas are introduced into a reaction tube so as to be reacted with each other, the inner wall of the reaction tube is provided with a blow-off opening for a purge medium and the blow-off angle of the purge medium and the blow-off rate (B) of the purge medium from the inner wall of the reaction tube are set so that the purge medium whirls along the inner wall of the reaction tube.

IPC Classes  ?

  • C01G 23/07 - Producing by vapour phase processes, e.g. halide oxidation

45.

METHOD FOR PRODUCING BROMOFLUOROMETHANE

      
Application Number JP2022015079
Publication Number 2022/244481
Status In Force
Filing Date 2022-03-28
Publication Date 2022-11-24
Owner SHOWA DENKO K.K. (Japan)
Inventor Matsui Kazuma

Abstract

Provided is a method for producing bromofluoromethane, the method making it possible to selectively synthesize tribromofluoromethane and/or dibromodifluoromethane. This method for producing bromofluoromethane has a fluorination step for reacting a fluorinating agent with a raw-material compound that is carbon tetrabromide and/or tribromofluoromethane in the presence of a simple substance or a salt of a metal belonging to period 3 or 4 of the periodic table and belonging to any of groups 3 through 13 to carry out fluorination and synthesize a target compound that is tribromofluoromethane and/or dibromodifluoromethane. However, the raw-material compound and the target compound are not the same.

IPC Classes  ?

  • C07C 17/20 - Preparation of halogenated hydrocarbons by replacement by halogens of halogen atoms by other halogen atoms
  • B01J 23/10 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of rare earths
  • B01J 23/745 - Iron
  • B01J 23/75 - Cobalt
  • B01J 23/755 - Nickel
  • B01J 27/125 - Halogens; Compounds thereof with scandium, yttrium, aluminium, gallium, indium or thallium
  • C07B 61/00 - Other general methods
  • C07C 19/14 - Acyclic saturated compounds containing halogen atoms containing fluorine and bromine

46.

ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT

      
Application Number JP2022016207
Publication Number 2022/244519
Status In Force
Filing Date 2022-03-30
Publication Date 2022-11-24
Owner SHOWA DENKO K.K. (Japan)
Inventor Matsui Kazuma

Abstract

Provided is an etching method by which an etching object containing silicon nitride can be selectively etched compared to a non-etching object, while suppressing the generation of particles and variations in etching rate. This etching method comprises an etching step in which an etching gas containing more than 20 vol% of nitrosyl fluoride is brought into contact with a member (12) to be etched, which has an etching object that is to be etched by the etching gas and a non-etching object that is not to be etched by the etching gas, and without using plasma, the etching object is selectively etched in comparison to the non-etching object. The etching object contains silicon nitride.

IPC Classes  ?

  • H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting

47.

DECOMPOSING/CLEANING COMPOSITION, METHOD FOR PRODUCING SAME, AND METHOD FOR CLEANING ADHESIVE POLYMER

      
Application Number JP2022018477
Publication Number 2022/244593
Status In Force
Filing Date 2022-04-21
Publication Date 2022-11-24
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Nakazaki, Susumu
  • Miyahara, Kuniaki

Abstract

Provided is a decomposing/cleaning composition having a high etching speed. The decomposing/cleaning composition contains: (A) an N-substituted amide compound, in which 2 alkyl groups are bonded to an amide nitrogen atom, as an aprotic solvent; and (B) a quaternary ammonium alkyl fluoride or a hydrate thereof. The content of an N-substituted amide acid derivative, which is a compound in which 2 hydrogen atoms on a carbon atom at the α-position of the amide nitrogen atom of the N-substituted amide compound (A) are substituted with oxo groups, is 550 ppm by mass or less.

IPC Classes  ?

  • B08B 3/04 - Cleaning involving contact with liquid
  • C11D 7/26 - Organic compounds containing oxygen
  • C11D 7/28 - Organic compounds containing halogen
  • C11D 7/32 - Organic compounds containing nitrogen
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

48.

LITHIUM ION CONDUCTING OXIDE AND ALL SOLID BATTERY

      
Application Number JP2022012228
Publication Number 2022/230426
Status In Force
Filing Date 2022-03-17
Publication Date 2022-11-03
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Lee Kunchan
  • Sei Ryosuke

Abstract

288, containing at least lithium, tantalum, boron, phosphorus, oxygen and fluorine as the constituent elements thereof, having a boron content represented by formula (1) of 4.0-15.0%, and having a fluorine content represented by formula (2) of 0.5-2.0%. (1): Number of B atoms/(number of B atoms + number of P atoms) × 100 (2): Number of F atoms/(number of O atoms + number of F atoms) × 100

IPC Classes  ?

  • C01B 25/37 - Phosphates of heavy metals
  • H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
  • H01B 1/08 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
  • C04B 35/495 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
  • H01M 10/0562 - Solid materials

49.

RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD

      
Application Number JP2022018284
Publication Number 2022/224988
Status In Force
Filing Date 2022-04-20
Publication Date 2022-10-27
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sakaguchi Yoichiro
  • Saito Kohei

Abstract

Provided are a recess filling material kit, a cured product of the recess filling material kit, and a recess filling method using the recess filling material kit, whereby it becomes possible to provide, for example, a technique for preventing defective working including a defect in initial adhesion to a concrete material and a steel iron material used in recesses. The recess filling material kit according to the present invention includes a first radical-polymerizable resin composition and a second radical-polymerizable resin composition. The first radical-polymerizable resin composition comprises a first radical-polymerizable compound (A-1), a first radical-polymerizable unsaturated monomer (B-1), an acidic compound (C) and a first radical-polymerization initiator (D-1), and the second radical-polymerizable resin composition comprises a second radical-polymerizable compound (A-2), a second radical-polymerizable unsaturated monomer (B-2), a second radical-polymerization initiator (D-2), an expansion material (J) and an aggregate (K).

IPC Classes  ?

50.

RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND METHOD FOR FILLING RECESS

      
Application Number JP2022018288
Publication Number 2022/224989
Status In Force
Filing Date 2022-04-20
Publication Date 2022-10-27
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sakaguchi Yoichiro
  • Saito Kohei

Abstract

Provided are: a recess filling material kit which is capable of providing a construction method and the like that eliminates construction defects such as initial adhesion to a concrete material or a steel material used in a recess; a cured product thereof; and a method for filling a recess using the recess filling material kit. The recess filling material kit according to the present invention has first and second radical polymerizable resin compositions. The first radical polymerizable resin composition contains a first radical polymerizable compound (A-1), a first radical polymerizable unsaturated monomer (B-1), an acidic compound (C), and a first radical polymerization initiator (D-1). The second radical polymerizable resin composition contains a second radical polymerizable compound (A-2), a second radical polymerizable unsaturated monomer (B-2), a second radical polymerization initiator (D-2), an expansion material (J), cement (P), and aggregate (K).

IPC Classes  ?

51.

PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL

      
Application Number JP2022014606
Publication Number 2022/220080
Status In Force
Filing Date 2022-03-25
Publication Date 2022-10-20
Owner SHOWA DENKO K.K. (Japan)
Inventor Arai, Yoshikazu

Abstract

Provided is a high-sensitivity photosensitive resin composition which contains a black colorant and by which development and pattern formation are possible even at low amounts of light exposure. This photosensitive resin composition comprises: (A) a binder resin; (B1) a first quinone diazide adduct, which is a quinone diazide adduct to a first phenol compound; (B2) a second quinone diazide adduct, which is a quinone diazide adduct to a second phenol compound; and (C) a black colorant. The difference between the molecular weight of the first phenol compound and the molecular weight of the second phenol compound is 40-500. The molecular weight of the first phenol compound is smaller than the molecular weight of the second phenol compound.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/022 - Quinonediazides
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • H05B 33/02 - Electroluminescent light sources - Details
  • H05B 33/12 - Light sources with substantially two-dimensional radiating surfaces
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H05B 33/22 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

52.

FLUOROETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM

      
Application Number JP2022017159
Publication Number 2022/215703
Status In Force
Filing Date 2022-04-06
Publication Date 2022-10-13
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Shibata Natsumi
  • Fukumoto Naoya
  • Asano Ayano
  • Kato Tsuyoshi
  • Kuroda Takuma
  • Yagyu Daisuke
  • Kasahara Chizuru
  • Tanji Yutaka

Abstract

A fluoroether compound represented by the formula R122- R222- R322-R422-R522-R622-R7(where R2, R4, and R6are each a perfluoropolyether chain, R3is formula (2), R5is formula (3), and R1and R7 are each independently a terminal group including two or three polar groups, wherein the polar groups have been bonded respectively to different carbon atoms and the carbon atoms having the polar groups bonded thereto have been bonded to each other by a linking group including a carbon atom having no polar group bonded thereto).

IPC Classes  ?

  • C07C 43/13 - Saturated ethers containing hydroxy or O-metal groups
  • C08G 65/331 - Polymers modified by chemical after-treatment with organic compounds containing oxygen
  • C10N 30/12 - Inhibition of corrosion, e.g. anti-rust agents, anti-corrosives
  • C10N 40/18 - Electric or magnetic purposes in connection with recordings on magnetic tape or disc
  • G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
  • C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen

53.

FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM

      
Application Number JP2022017256
Publication Number 2022/215726
Status In Force
Filing Date 2022-04-07
Publication Date 2022-10-13
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Shibata Natsumi
  • Fukumoto Naoya
  • Asano Ayano
  • Kato Tsuyoshi
  • Kuroda Takuma
  • Yagyu Daisuke
  • Kasahara Chizuru
  • Tanji Yutaka

Abstract

Provided is a fluorine-containing ether compound represented by the following formula. R122-R222-R322-R422-R522-R622-R7(R2, R4, and R6are perfluoropolyether chains having the same structure; R3and R5are each independently a connecting group including one or more hydroxyl groups; and R1and R72s22OH (2) (s is 0 or 1; [D] and [E] are each independently a chain-like structure constituted of a combination of 2-5 methylene groups and one oxygen atom or a chain-like structure constituted of 1-4 methylene groups, with the proviso that, when s is 0 and [E] includes an oxygen atom, the number of methylene groups included in [E] is 3 or more.)

IPC Classes  ?

  • C07C 43/13 - Saturated ethers containing hydroxy or O-metal groups
  • C08G 65/331 - Polymers modified by chemical after-treatment with organic compounds containing oxygen
  • C08G 67/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups
  • C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
  • G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
  • G11B 5/84 - Processes or apparatus specially adapted for manufacturing record carriers
  • C10N 30/06 - Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
  • C10N 30/12 - Inhibition of corrosion, e.g. anti-rust agents, anti-corrosives
  • C10N 40/18 - Electric or magnetic purposes in connection with recordings on magnetic tape or disc

54.

HEAT CONDUCTIVE URETHANE RESIN COMPOSITION AND CURED PRODUCT

      
Application Number JP2022003250
Publication Number 2022/215326
Status In Force
Filing Date 2022-01-28
Publication Date 2022-10-13
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Funahashi, Hajime
  • Minorikawa, Naoki
  • Satoh, Hikaru
  • Kobayashi, Ikue
  • Yukutake, Hajime
  • Iemura, Takeshi

Abstract

This heat conductive urethane resin composition contains a castor oil-based polyol, a polyisocyanate compound, and a filler, the heat conductive urethane resin composition being characterized in that: the equivalent ratio (NCO/OH) of the isocyanate group of the polyisocyanate compound to the hydroxyl group of the castor oil-based polyol is 0.8-1.6; the filler contains a filler (A) having an average particle diameter of 0.03-10 μm; and the filler (A) is surface-treated by using a specific surface treatment agent.

IPC Classes  ?

  • C08G 18/36 - Hydroxylated esters of higher fatty acids
  • C08G 18/08 - Processes
  • C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
  • C08L 75/04 - Polyurethanes
  • H01L 23/373 - Cooling facilitated by selection of materials for the device

55.

SILVER NANOWIRE MANUFACTURING METHOD

      
Application Number JP2022009791
Publication Number 2022/209613
Status In Force
Filing Date 2022-03-07
Publication Date 2022-10-06
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Hasegawa Aoi
  • Yamaki Shigeru
  • Toba Masahiko

Abstract

[Problem] To provide a silver nanowire manufacturing method by which silver nanoparticles can be efficiently removed from a coarse dispersion liquid containing silver nanowires and the silver nanoparticles. [Solution] A silver nanowire manufacturing method characterized by including a coarse dispersion liquid preparation step for preparing a coarse dispersion liquid containing silver nanowires and silver nanoparticles and a reprecipitation/cleaning step for refining the silver nanowires in the coarse dispersion liquid by means of a reprecipitation method, wherein in the reprecipitation/cleaning step, a series of operations, which comprise (a) a precipitation step for causing silver nanowire-containing precipitates to precipitate by adding a precipitation solvent to the coarse dispersion liquid or to a redispersion liquid described below, (b) a supernatant removal step for removing a supernatant containing at least some of the silver nanoparticles formed by the precipitation of the precipitates, and (c) a redispersion step for obtaining a redispersion liquid by redispersing the precipitates in water by adding water having a specific resistance value of 3.3 MΩ·cm or higher to the remaining precipitates, are repeated several times.

IPC Classes  ?

  • B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
  • B82Y 40/00 - Manufacture or treatment of nanostructures
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 1/054 - Nanosized particles
  • B22F 1/062 - Fibrous particles

56.

TRANSPARENT CONDUCTIVE FILM AND METHOD FOR FORMING TRANSPARENT CONDUCTIVE PATTERN

      
Application Number JP2022015138
Publication Number 2022/210586
Status In Force
Filing Date 2022-03-28
Publication Date 2022-10-06
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Yamaki Shigeru
  • Yoneda Shuhei
  • Miyamura Yasunao
  • Terao Kumiko

Abstract

[Problem] To provide a method for forming different transparent conductive patterns on both main surfaces of a transparent resin film using a pulse laser. [Solution] First and second transparent conductive films containing a nanostructure network having a metal nanowire intersecting part and a binder resin are formed on first and second main surfaces of a transparent resin film. The first and second transparent conductive films have an absorption peak based on the nanostructure network in a light transmittance spectrum. The transparent resin film has a thickness of 40 μm or more. After the formation of first and second protection films on the first and second transparent conductive films, only the first transparent conductive film is etched from the first protection film side by a pulse laser having a pulse width of one nanosecond or shorter and having an absorption peak maximum wavelength based on the nanostructure network of within ±30 nm, and a first transparent conductive pattern is formed on the first main surface from a first conductive region and a first non-conductive region formed from the first transparent conductive film.

IPC Classes  ?

  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • B32B 27/26 - Layered products essentially comprising synthetic resin characterised by the use of special additives using curing agents
  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
  • B32B 7/023 - Optical properties
  • B32B 7/025 - Electric or magnetic properties
  • G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
  • G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

57.

TRANSPARENT CONDUCTIVE FILM AND TRANSPARENT CONDUCTIVE PATTERN FORMING METHOD

      
Application Number JP2022015137
Publication Number 2022/210585
Status In Force
Filing Date 2022-03-28
Publication Date 2022-10-06
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Yamaki Shigeru
  • Yoneda Shuhei
  • Miyamura Yasunao
  • Terao Kumiko

Abstract

[Problem] To provide a method for forming different transparent conductive patterns for both principal surfaces of a transparent resin film by using a pulse laser. [Solution] With respect to a transparent conductive film in which first and second transparent conductive layers and first and second protective layers are sequentially formed, each of the first and second transparent conductive layers including a binder resin and a nano-structured network that has intersection sections of metal nanowires on first and second respective principal surfaces of a resin film including a base resin and an ultraviolet absorber, and which, in a light transmission spectrum, has a light transmittance of 10% or smaller in a wavelength region of 350-370 nm and of 80% or larger in a wavelength region of 350-700 nm of a film of the base resin having the same thickness as the resin film, etching is performed only on the first transparent conductive layer from a first protective layer side by means of a pulse laser of which the wavelength is within a range of 350-370 nm and of which the pulse width is shorter than 1 nano second, and a first transparent conductive pattern is formed with a first conductive area and a first non-conductive area.

IPC Classes  ?

  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • B32B 27/26 - Layered products essentially comprising synthetic resin characterised by the use of special additives using curing agents
  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
  • B32B 7/023 - Optical properties
  • B32B 7/025 - Electric or magnetic properties
  • G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
  • G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

58.

SPREADING AGENT, FERTILIZER COMPOSITION AND AGRICULTURAL CHEMICAL COMPOSITION

      
Application Number JP2022010072
Publication Number 2022/202296
Status In Force
Filing Date 2022-03-08
Publication Date 2022-09-29
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Fujita, Ichiro
  • Uchida, Hiroshi
  • Saito, Makoto

Abstract

Provided is a spreading agent that has a high water solubility and can effectively enhance the adhesion force of a fertilizer component or an agricultural chemical to a plant. This spreading agent contains at least one oligosaccharide selected from the group consisting of a chitin oligosaccharide, a cello-oligosaccharide and a xylo-oligosaccharide.

IPC Classes  ?

  • C09K 23/56 - Glucosides; Mucilage; Saponins
  • C05G 3/70 - Mixtures of one or more fertilisers with additives not having a specifically fertilising activity for affecting wettability, e.g. drying agents

59.

MATERIAL CHARACTERISTICS PREDICTION METHOD AND MODEL GENERATION METHOD

      
Application Number JP2022011453
Publication Number 2022/196663
Status In Force
Filing Date 2022-03-15
Publication Date 2022-09-22
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takemoto, Shimpei
  • Okuno, Yoshishige
  • Kaneshita, Takeshi

Abstract

The present invention includes: a model setting step for setting a trained model obtained by performing machine learning of the correspondence relationship between explanatory variables that each include information relating to a production condition or a material composition of a target material and response variables that each include information relating to material characteristics of the target material; and a prediction step for inputting, to the trained model that have been set in the model setting step, an explanatory variable relating to the target material for which material characteristics are to be predicted, outputting a response variable relating to information of the explanatory variable, and predicting the material characteristics of the target material to be predicted on the basis of the response variable. The explanatory variable further includes: a material characteristics evaluation temperature that is a temperature at the time of measurement of material characteristics and that is included in the response variable; and an evaluation temperature retention time in which the material characteristics evaluation temperature has been retained until measurement of the material characteristics.

IPC Classes  ?

  • G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
  • G01N 33/20 - Metals

60.

ETCHING GAS AND ETCHING METHOD

      
Application Number JP2022006377
Publication Number 2022/190809
Status In Force
Filing Date 2022-02-17
Publication Date 2022-09-15
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Iwasaki Jumpei
  • Tanimoto Yosuke

Abstract

The present invention provides an etching gas and an etching method, each of which is capable of selectively etching an etching object comprising silicon nitride over a non-etching object. The etching gas contains nitrosyl fluoride, while containing nitryl fluoride as an impurity; and the concentration of the nitryl fluoride is from 0.0001 ppm by mass to 100 ppm by mass. The etching method comprises an etching step in which this etching gas is brought into contact with a member (12) to be etched, which comprises an etching object that is to be etched by an etching gas and a non-etching object that is not to be etched by an etching gas, thereby selectively etching the etching object over the non-etching object. The etching object comprises silicon nitride.

IPC Classes  ?

61.

HYDROGEN FLUORIDE GAS REMOVAL DEVICE AND METHOD FOR REMOVING HYDROGEN FLUORIDE GAS

      
Application Number JP2022005421
Publication Number 2022/185878
Status In Force
Filing Date 2022-02-10
Publication Date 2022-09-09
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kanauchi Riku
  • Fukuchi Yohsuke
  • Kobayashi Hiroshi

Abstract

Provided is a hydrogen fluoride gas removal device capable of continuously performing a removal process for removing hydrogen fluoride gas from a mixed gas containing hydrogen fluoride gas over an extended period of time without stopping. The hydrogen fluoride removal device can remove hydrogen fluoride gas from a mixed gas that contains hydrogen fluoride gas and other gases. This hydrogen fluoride removal device is equipped with a hydrogen fluoride gas removal processor (10) for performing a process to remove hydrogen fluoride gas from a mixed gas by bringing the mixed gas into contact with a removal agent for removing hydrogen fluoride gas from mixed gas, a removal agent supplier (20) for supplying the removal agent to the hydrogen fluoride gas removal processor (10), a removal agent regeneration processor (30) for subjecting used removal agent to a regeneration process to improve the hydrogen fluoride gas removal performance of the removal agent, and a regenerated removal agent transporter (40) for transporting the regenerated removal agent and supplying the regenerated removal agent to the removal agent supplier (20).

IPC Classes  ?

  • C01B 7/19 - Fluorine; Hydrogen fluoride
  • B01D 53/08 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with moving adsorbents according to the "moving bed" method
  • B01J 20/04 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of alkali metals, alkaline earth metals or magnesium
  • B01J 20/34 - Regenerating or reactivating

62.

HYDROGEN FLUORIDE GAS REMOVAL DEVICE AND HYDROGEN FLUORIDE GAS REMOVAL METHOD

      
Application Number JP2022005422
Publication Number 2022/185879
Status In Force
Filing Date 2022-02-10
Publication Date 2022-09-09
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kanauchi Riku
  • Fukuchi Yohsuke
  • Kobayashi Hiroshi

Abstract

Provided is a hydrogen fluoride gas removal device which is insusceptible to adhesion of a removal agent when performing a removal process to remove hydrogen fluoride gas from a mixed gas containing hydrogen fluoride gas by using the removal agent. The hydrogen fluoride gas removal device can remove hydrogen fluoride gas from a mixed gas containing the hydrogen fluoride gas and another type of gas. This hydrogen fluoride gas removal device comprises: a hydrogen fluoride gas removal processing unit (10) which performs a process to remove hydrogen fluoride gas from a mixed gas by bringing the mixed gas into contact with a removal agent for removing the hydrogen fluoride gas from the mixed gas; a removal agent supplying unit (20) which supplies the removal agent to the hydrogen fluoride gas removal processing unit (10); a removal agent moving unit which moves the removal agent stored in the hydrogen fluoride gas removal processing unit (10) inside the hydrogen fluoride gas removal processing unit (10); and a removal agent discharging unit which discharges the used removal agent from the hydrogen fluoride gas removal processing unit (10).

IPC Classes  ?

  • B01D 53/08 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with moving adsorbents according to the "moving bed" method
  • B01J 20/04 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of alkali metals, alkaline earth metals or magnesium
  • C01B 7/19 - Fluorine; Hydrogen fluoride
  • B01J 20/34 - Regenerating or reactivating

63.

COMPOSITE LAMINATE AND JOINED BODY

      
Application Number JP2022007818
Publication Number 2022/181754
Status In Force
Filing Date 2022-02-25
Publication Date 2022-09-01
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Otani, Kazuo
  • Takahashi, Nobuyuki
  • Niibayashi, Ryota

Abstract

A composite laminate comprising a base material formed of a metal or a resin, and one or more resin primer layers laminated on a surface of the base material, wherein at least one of the resin primer layers is at least one polymer layer selected from the group consisting of polymer layers each formed of a polymer of an in-situ polymerization type thermoplastic resin composition that contains the following (A), polymer layers each formed of a polymer of an in-situ polymerization type thermoplastic resin composition that contains the following (B), polymer layers each formed of a polymer of an in-situ polymerization type thermoplastic resin composition that contains the following (C), polymer layers each formed of a polymer of an in-situ polymerization type thermoplastic resin composition that contains the following (D), and polymer layers each formed of a polymer of an in-situ polymerization type thermoplastic resin composition that contains the following (E) and any one of (A)-(D), and said polymer layer is disposed at the outermost surface. (A) A combination between a bifunctional thiol compound, and a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin. (B) A combination between a bifunctional amino compound, and a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin. (C) A combination between a bifunctional carboxy compound, and a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin. (D) A combination between a bifunctional isocyanate compound, and a phenol novolak resin and/or a cresol novolak resin. (E) A maleic anhydride-modified polyolefin and/or a chlorinated polyolefin.

IPC Classes  ?

  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
  • B29C 65/02 - Joining of preformed parts; Apparatus therefor by heating, with or without pressure
  • B29C 65/64 - Joining a non-plastics element to a plastics element, e.g. by force

64.

WATER- AND OIL-REPELLENT COMPOSITION, FIBER TREATING AGENT, FIBER TREATMENT METHOD, PROCESSED FIBER PRODUCT AND COATING AGENT

      
Application Number JP2021042292
Publication Number 2022/176290
Status In Force
Filing Date 2021-11-17
Publication Date 2022-08-25
Owner SHOWA DENKO K.K. (Japan)
Inventor Murata Naoki

Abstract

A water- and oil-repellent composition that comprises copolymer (A) containing no structural unit having a siloxane bond, copolymer (B) containing a structural unit having a siloxane bond, a polyether-modified polydimethylsiloxane and an aqueous medium, wherein: copolymer (A) contains a structural unit derived from a compound having an ethylenically unsaturated bond and an ester bond and having no carboxy group and a structural unit derived from a compound having an ethylenically unsaturated bond and a carboxy group; and copolymer (B) contains a structural unit derived from a compound having an ethylenically unsaturated bond and an ester bond and having no carboxy group, a structural unit derived from a compound having an ethylenically unsaturated bond and a carboxy group, and a structural unit derived from a polydimethylsiloxane having an ethylenically unsaturated bond.

IPC Classes  ?

  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C09K 3/00 - Materials not provided for elsewhere
  • C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
  • D06M 15/263 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acids; Salts or esters thereof
  • D06M 15/647 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds containing silicon in the main chain containing polyether sequences

65.

POLYMERIC DISPERSANT, PIGMENT DISPERSION COMPOSITION, AND PHOTOSENSITIVE COLORED COMPOSITION

      
Application Number JP2021047340
Publication Number 2022/172607
Status In Force
Filing Date 2021-12-21
Publication Date 2022-08-18
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Otake Kenta
  • Aoki Yusuke
  • Kinoshita Takehiro

Abstract

Provided are a polymeric dispersant having satisfactory pigment-dispersing properties and storage stability and a pigment dispersion composition obtained using the polymeric dispersant. A photosensitive colored composition obtained using the pigment dispersion composition has satisfactory developability and gives cured objects having excellent solvent resistance. Also provided are a color filter including the cured object of the photosensitive colored composition and an image display element including the color filter. This polymeric dispersant has a quaternary ammonium cation group (g-1) having one or more groups selected from the group consisting of an ethylenically unsaturated group and groups each having a carbon-carbon triple bond.

IPC Classes  ?

66.

WELDING FILM AND JOINED BODY

      
Application Number JP2022004352
Publication Number 2022/172863
Status In Force
Filing Date 2022-02-04
Publication Date 2022-08-18
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Niibayashi, Ryota
  • Takahashi, Nobuyuki
  • Saito, Hayato
  • Kuroki, Kunihiro

Abstract

A welding film comprising a phenoxy resin, wherein the Z‐average molecular weight of the phenoxy resin is 70,000 or more, and the ratio [Mz/Mn] of the Z‐average molecular weight with respect to the number average molecular weight of the phenoxy resin is 5.0 or more.

IPC Classes  ?

  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • C09J 171/10 - Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
  • C08J 5/18 - Manufacture of films or sheets
  • B29C 65/02 - Joining of preformed parts; Apparatus therefor by heating, with or without pressure
  • B29C 65/08 - Joining of preformed parts; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
  • B29C 65/20 - Joining of preformed parts; Apparatus therefor by heating, with or without pressure using heated tool with direct contact, e.g. using "mirror"
  • B29C 65/32 - Induction
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/35 - Heat-activated
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties

67.

VEHICLE ON-BOARD CAMERA AND MANUFACTURING METHOD THEREFOR

      
Application Number JP2021004651
Publication Number 2022/168323
Status In Force
Filing Date 2021-02-08
Publication Date 2022-08-11
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takahashi, Nobuyuki
  • Sato, Masahiro
  • Otani, Kazuo

Abstract

Provided is a vehicle on-board camera in which superior airtightness can be achieved, and a method by which such a vehicle on-board camera can be manufactured at low cost. A vehicle on-board camera (10) includes: a case (X) that has at least a first part (12) and a second part (14); and at least one module (Y) that is installed in the case. A first resin member is one of the first part and the second part, and a second resin member is the other of the first part and the second part. The first resin member and the second resin member are welded with a primer layer (3) interposed therebetween. At least one layer of the primer layer is an in situ polymerization type composition layer that is formed by polymerizing an in situ polymerization type composition on a thermoplastic resin material.

IPC Classes  ?

  • H04N 5/225 - Television cameras
  • B29C 65/02 - Joining of preformed parts; Apparatus therefor by heating, with or without pressure

68.

BUMPER FASCIA AND METHOD OF MANUFACTURING SAME

      
Application Number JP2021004654
Publication Number 2022/168324
Status In Force
Filing Date 2021-02-08
Publication Date 2022-08-11
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sato, Masahiro
  • Otani, Kazuo
  • Takahashi, Nobuyuki

Abstract

The present invention provides a bumper fascia that can achieve a desired rigidity even if the weight thereof is reduced and can achieve a favorable appearance, and a method that can be used to manufacture such a bumper fascia at a low cost. A first resin member (1) is a reinforcing rib and/or a bracket, a second resin member (4) is a bumper fascia main body, the first and second resin members are welded to each other, and at least one primer layer is an in-situ polymerization composition layer formed by polymerizing an in-situ polymerization composition over the thermoplastic resin material.

IPC Classes  ?

  • B60R 19/04 - Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects formed from more than one section

69.

BACK DOOR OUTER PANEL AND PRODUCTION METHOD THEREFOR

      
Application Number JP2021004658
Publication Number 2022/168325
Status In Force
Filing Date 2021-02-08
Publication Date 2022-08-11
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sato, Masahiro
  • Otani, Kazuo
  • Takahashi, Nobuyuki

Abstract

The present invention provides: a back door outer panel that is capable of achieving a desired rigidity even in the case where weight reduction is pursued and that is also capable of achieving a favorable appearance; and a method with which it is possible to produce such a back door outer panel at low cost. A first resin member (1) serves as a reinforcement rib and/or a bracket. A second resin member (4) serves as a back door outer panel body. The first resin member and the second resin are welded together. At least one of primer layers is an in-situ polymerized-type composition layer that is formed by polymerizing an in-situ polymerizable composition on a thermoplastic resin material.

IPC Classes  ?

  • B60J 5/10 - Doors arranged at the vehicle rear

70.

BUMPER FASCIA AND PRODUCTION METHOD THEREFOR

      
Application Number JP2021004664
Publication Number 2022/168329
Status In Force
Filing Date 2021-02-08
Publication Date 2022-08-11
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sato, Masahiro
  • Otani, Kazuo
  • Takahashi, Nobuyuki

Abstract

Provided are: a bumper fascia that achieves desired rigidity even if designed to be lighter and that can achieve a favorable appearance; and a method for enabling the low-cost production of said bumper fascia. A first resin member (1) is a reinforcing rib and/or a bracket. A second resin member (4) is a bumper fascia body. The first resin member and the second resin member are welded, and at least one layer of a primer layer is an in-situ polymerization-type composition layer, which is formed by polymerizing an in-situ polymerization-type composition on the thermoplastic resin material.

IPC Classes  ?

  • B60R 19/04 - Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects formed from more than one section

71.

BARRIER FUNCTION IMPROVER

      
Application Number JP2022003962
Publication Number 2022/168846
Status In Force
Filing Date 2022-02-02
Publication Date 2022-08-11
Owner SHOWA DENKO K.K. (Japan)
Inventor Nakagami Yuko

Abstract

A barrier function improver which contains methylhesperidin as an active ingredient, and a barrier function improver composition which contains said barrier function improver and a pharmaceutically acceptable carrier.

IPC Classes  ?

  • A61K 31/7034 - Compounds having saccharide radicals attached to non-saccharide compounds by glycosidic linkages attached to a carbocyclic compound, e.g. phloridzin
  • A61K 8/60 - Sugars; Derivatives thereof
  • A61K 31/7048 - Compounds having saccharide radicals and heterocyclic rings having oxygen as a ring hetero atom, e.g. leucoglucosan, hesperidin, erythromycin, nystatin
  • A61P 17/16 - Emollients or protectives, e.g. against radiation
  • A61Q 19/00 - Preparations for care of the skin
  • C07H 15/203 - Monocyclic carbocyclic rings other than cyclohexane rings; Bicyclic carbocyclic ring systems
  • C07H 17/07 - Benzo[b]pyran-4-ones

72.

BACKDOOR OUTER PANEL AND MANUFACTURING METHOD THEREFOR

      
Application Number JP2021004647
Publication Number 2022/168321
Status In Force
Filing Date 2021-02-08
Publication Date 2022-08-11
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Sato, Masahiro
  • Otani, Kazuo
  • Takahashi, Nobuyuki

Abstract

Provided are a backdoor outer panel which achieves desired rigidity even when the weight thereof is reduced and with which an excellent appearance can be achieved, and a method capable of manufacturing such a backdoor outer panel at a low cost. In this invention, a first resin member (1) is a reinforcing rib and/or a bracket. A second resin member (4) is a backdoor outer panel body. The first resin member and the second resin member are welded to each other. At least one layer of primer layers is an in-situ polymerization type composition layer formed by polymerizing an in-situ polymerization type composition on a thermoplastic resin material.

IPC Classes  ?

  • B60J 5/10 - Doors arranged at the vehicle rear

73.

RADAR DEVICE AND MANUFACTURING METHOD THEREFOR

      
Application Number JP2021004659
Publication Number 2022/168326
Status In Force
Filing Date 2021-02-08
Publication Date 2022-08-11
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takahashi, Nobuyuki
  • Sato, Masahiro
  • Otani, Kazuo

Abstract

Provided are a radar device that can be easily manufactured with a reduced number of components, and a method for manufacturing the same. A first resin member (1) is a case, a second resin member (4) is a radome, the first resin member and the second resin member are welded through a primer layer, and at least one layer of the primer layer is an in-situ polymerized composition layer formed by polymerizing an in-situ polymerizable composition on a thermoplastic resin material.

IPC Classes  ?

  • G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
  • C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
  • H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome

74.

METHOD FOR FORMING PATTERN OF METAL OXIDE AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT

      
Application Number JP2021046122
Publication Number 2022/163182
Status In Force
Filing Date 2021-12-14
Publication Date 2022-08-04
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Matsui Kazuma
  • Oka Yuki
  • Taniwaki Moe

Abstract

The present invention provides a method for forming a pattern of a metal oxide, the method being capable of selectively etching an etching object that contains a metal oxide over a non-etching object, while being capable of forming a metal oxide pattern having the shape of the pattern of the non-etching object that serves as a template for the pattern formation of the metal oxide. According to the present invention, a pattern of a metal oxide is formed by etching a metal oxide, which contains an oxide of at least one of tin and indium, with use of an etching gas. According to the present invention, a predetermined pattern of a template layer (21) is transferred to a metal oxide layer (22) by bringing an etching gas that contains a halon into contact with a member to be etched in the presence of a plasma so as to etch the member to be etched, while applying a bias power to a lower electrode (2) that supports the member to be etched, thereby selectively etching the metal oxide layer (22) over a silicon substrate (24), the template layer (21) and a base layer (23).

IPC Classes  ?

75.

FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM

      
Application Number JP2022002903
Publication Number 2022/163708
Status In Force
Filing Date 2022-01-26
Publication Date 2022-08-04
Owner SHOWA DENKO K.K. (Japan)
Inventor Nanko Masaki

Abstract

Provided is a fluorine-containing ether compound represented by the following formula. R1-R222-R322-R4(wherein R1is a terminal group that includes an oxime group and is represented by formula (2), R2is a divalent linking group that has a polar group, R3is a perfluoropolyether chain, and R4 is a terminal group having at least two polar groups; in formula (2), X and Y are each a hydrogen atom, a C1 to C12 alkyl group that may have a substituent, or an organic group that has a double-bond or a triple bond).

IPC Classes  ?

  • C07C 251/54 - Oximes having oxygen atoms of oxyimino groups bound to carbon atoms of substituted hydrocarbon radicals of hydrocarbon radicals substituted by singly-bound oxygen atoms
  • C10M 107/44 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
  • G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
  • G11B 5/84 - Processes or apparatus specially adapted for manufacturing record carriers
  • C10N 40/18 - Electric or magnetic purposes in connection with recordings on magnetic tape or disc

76.

BLOCKED ISOCYANATE COMPOUND

      
Application Number JP2021047400
Publication Number 2022/145298
Status In Force
Filing Date 2021-12-21
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Wakabayashi Tomomitsu
  • Kawashima Naoki
  • Nanjo Shun
  • Shimoda Hiroki

Abstract

The present invention provides: a novel blocked isocyanate compound that can be produced at high yield; a compound having a low-temperature (at most 100ºC) crosslinkable double bond using said blocked isocyanate compound; and a resin obtained by curing said compound having a double bond. The present invention includes a blocked isocyanate compound (A) in which a compound (a1) having an isocyanate group and a compound (a2) represented by formula (1) and having a hydroxyl group are urethane-bonded via the isocyanate group and the hydroxyl group. (In formula (1), R1and R2are each independently a hydrogen atom or a C1-C20 hydrocarbon group. R3and R4 are each independently a hydrogen atom or a C1-C20 hydrocarbon group.)

IPC Classes  ?

  • C07C 271/16 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of hydrocarbon radicals substituted by singly-bound oxygen atoms
  • C07C 271/28 - Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atom of at least one of the carbamate groups bound to a carbon atom of a six-membered aromatic ring to a carbon atom of a non-condensed six-membered aromatic ring
  • C08F 8/00 - Chemical modification by after-treatment
  • C08F 299/00 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08G 18/80 - Masked polyisocyanates
  • C08G 18/81 - Unsaturated isocyanates or isothiocyanates

77.

CHLORINATED-POLYOLEFIN COMPOSITION

      
Application Number JP2021048750
Publication Number 2022/145447
Status In Force
Filing Date 2021-12-28
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor Sagae Ichiro

Abstract

[Problem] To provide a chlorinated-polyolefin composition, especially one excellent in terms of durability including acid resistance and heat resistance. [Solution] A chlorinated-polyolefin composition which comprises a chlorinated polyolefin and epoxidized polybutadiene.

IPC Classes  ?

  • C08L 23/28 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or halogen-containing compounds
  • C08L 63/08 - Epoxidised polymerised polyenes

78.

WATER- AND OIL-REPELLENT COMPOSITION, FIBER TREATING AGENT, FIBER TREATMENT METHOD, PROCESSED FIBER PRODUCT AND COATING AGENT

      
Application Number JP2021042599
Publication Number 2022/145147
Status In Force
Filing Date 2021-11-19
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor Murata Naoki

Abstract

A water- and oil-repellent composition that comprises copolymer (A) containing no structural unit having a siloxane bond, copolymer (B) containing a structural unit having a siloxane bond, a polyether-modified polydimethylsiloxane and an aqueous medium, wherein: copolymer (A) contains structural unit (a1) derived from a compound having an ethylenically unsaturated bond and an ester bond and having no amide bond and structural unit (a2) derived from a compound having an ethylenically unsaturated bond and an amide bond; and copolymer (B) contains structural unit (b1) derived from a compound having an ethylenically unsaturated bond and an ester bond and having no amide bond, structural unit (b2) derived from a compound having an ethylenically unsaturated bond and an amide bond, and structural unit (b3) derived from a polydimethylsiloxane having an ethylenically unsaturated bond.

IPC Classes  ?

  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C09K 3/00 - Materials not provided for elsewhere
  • C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
  • D06M 15/263 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acids; Salts or esters thereof
  • D06M 15/285 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acid amides or imides
  • D06M 15/647 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds containing silicon in the main chain containing polyether sequences

79.

PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION

      
Application Number JP2021045202
Publication Number 2022/145187
Status In Force
Filing Date 2021-12-08
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Ishida, Yasuhiro
  • Furue, Kentaro
  • Kuramoto, Hiroki

Abstract

The present invention provides a photosensitive resin composition that is highly sensitive and contains a black colorant, the composition making it possible to form a thick film pattern having a high optical density (OD value). Provided is a photosensitive resin composition containing (A) a first resin that has an epoxy group and a phenolic hydroxyl group, (B) a second resin that has a weight average molecular weight of 3,000 to 80,000, (D) a radiation-sensitive compound, and (E) a black colorant, wherein: the optical density (OD value) of a cured coating obtained from the photosensitive resin composition is 0.5 or higher per 1 μm of film thickness; and the alkaline dissolution rate of the second resin is no more than 5% of the alkaline dissolution rate of the first resin.

IPC Classes  ?

  • C08G 59/62 - Alcohols or phenols
  • G03F 7/004 - Photosensitive materials
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • H05B 33/02 - Electroluminescent light sources - Details
  • H05B 33/12 - Light sources with substantially two-dimensional radiating surfaces
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H05B 33/22 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

80.

PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION

      
Application Number JP2021045203
Publication Number 2022/145188
Status In Force
Filing Date 2021-12-08
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Ishida, Yasuhiro
  • Furue, Kentaro
  • Kuramoto, Hiroki

Abstract

The present invention provides a photosensitive resin composition that is highly sensitive and contains a black colorant, the composition making it possible to form a thick film pattern having a high optical density (OD value) and limited surface roughness. Provided is a photosensitive resin composition containing (A) a first resin, (B) a second resin that differs from the first resin and has a phenolic hydroxyl group, (C) a third resin that differs from both the first resin and the second resin and has a phenolic hydroxyl group, (D) a radiation-sensitive compound, and (E) a black colorant, wherein: the optical density (OD value) of a cured coating obtained from the photosensitive resin composition is 0.5 or higher per 1 μm of film thickness; and the phenolic hydroxyl group equivalent of the second resin is 1.1 to 5.0 times the phenolic hydroxyl group equivalent of the third resin.

IPC Classes  ?

  • C08G 59/62 - Alcohols or phenols
  • G03F 7/004 - Photosensitive materials
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • H05B 33/02 - Electroluminescent light sources - Details
  • H05B 33/12 - Light sources with substantially two-dimensional radiating surfaces
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H05B 33/22 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

81.

PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION

      
Application Number JP2021045210
Publication Number 2022/145189
Status In Force
Filing Date 2021-12-08
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Ishida, Yasuhiro
  • Furue, Kentaro
  • Kuramoto, Hiroki

Abstract

The present invention provides a photosensitive resin composition that is highly sensitive and contains a black colorant, the composition making it possible to form a thick film pattern having a high optical density (OD value). Provided is a photosensitive resin composition containing (A) a first resin that has an epoxy group and a phenolic hydroxyl group, (B) a second resin that has a weight average molecular weight of 3,000 to 80,000, a phenolic hydroxyl group equivalent of 250 to 700, and a carboxy group content of 0.0 to 0.5 mmol/g, (D) a radiation-sensitive compound, and (E) a black colorant, wherein the optical density (OD value) of a cured coating obtained from the photosensitive resin composition is 0.5 or higher per 1 μm of film thickness.

IPC Classes  ?

  • C08G 59/62 - Alcohols or phenols
  • G03F 7/004 - Photosensitive materials
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • H05B 33/02 - Electroluminescent light sources - Details
  • H05B 33/12 - Light sources with substantially two-dimensional radiating surfaces
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H05B 33/22 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

82.

AQUEOUS RESIN COMPOSITION, FILM, METHOD FOR PRODUCING COATING FILM, AQUEOUS RESIN COMPOSITION SET, AND METHOD FOR PROTECTING METAL

      
Application Number JP2021046231
Publication Number 2022/145227
Status In Force
Filing Date 2021-12-15
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kuzutani Takuya
  • Murata Naoki

Abstract

An aqueous resin composition which contains: an aqueous resin emulsion that comprises a copolymer, a polyepoxy compound and an aqueous medium; a curing agent; and a curing accelerator. With respect to this aqueous resin composition, the copolymer comprises a predetermined amount of a structural unit (a) which is derived from a (meth)acrylic acid alkyl ester, a predetermined amount of a structural unit (b) which is derived from an ethylenically unsaturated carboxylic acid, and a predetermined amount of a structural unit (c) which is derived from a compound having an epoxy group; the structural unit (a) comprises a predetermined amount of a structural unit (a1) which is derived from a hydrophilic (meth)acrylic acid alkyl ester; the polyepoxy compound (Y) comprises a predetermined amount of at least one compound that is selected from among bisphenol type epoxy compounds and hydrogenated bisphenol type epoxy compounds; the curing agent comprises a predetermined amount of a compound which has a functional group that is reactive with an epoxy group; and the curing accelerator comprises a predetermined amount of a tertiary amine.

IPC Classes  ?

  • C08F 283/10 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polymers containing more than one epoxy radical per molecule
  • C08G 59/38 - Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
  • C09D 5/02 - Emulsion paints
  • C09D 133/02 - Homopolymers or copolymers of acids; Metal or ammonium salts thereof
  • C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
  • C09D 163/02 - Polyglycidyl ethers of bis-phenols
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers

83.

AQUEOUS RESIN COMPOSITION, FILM, METHOD FOR PRODUCING COATING FILM, AQUEOUS RESIN COMPOSITION SET, AND METHOD FOR PROTECTING METAL

      
Application Number JP2021046241
Publication Number 2022/145228
Status In Force
Filing Date 2021-12-15
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kuzutani Takuya
  • Murata Naoki

Abstract

This aqueous resin composition contains: an aqueous resin emulsion including a copolymer, a polyepoxy compound, and an aqueous medium; a curing agent; and a curing accelerator. The carboxy group content and the epoxy group content within the copolymer are within a predetermined range. The polyepoxy compound does not include any ethylenically unsaturated bonds, includes two or more epoxy groups in the molecule thereof, and is at least one substance selected from among bisphenol-type epoxy compounds and hydrogenated bisphenol-type epoxy compounds. The epoxy group content within the polyepoxy compound is within a predetermined range. The curing agent includes a predetermined amount of a compound having a functional group that is reactive to epoxy groups. The curing accelerator includes a predetermined amount of a tertiary amine having no functional groups that are reactive to epoxy groups.

IPC Classes  ?

  • C08F 283/10 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polymers containing more than one epoxy radical per molecule
  • C08G 59/38 - Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
  • C09D 5/02 - Emulsion paints
  • C09D 133/02 - Homopolymers or copolymers of acids; Metal or ammonium salts thereof
  • C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
  • C09D 163/02 - Polyglycidyl ethers of bis-phenols
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers

84.

CHLORINATED POLYOLEFIN COMPOSITION

      
Application Number JP2021048749
Publication Number 2022/145446
Status In Force
Filing Date 2021-12-28
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor Sagae Ichiro

Abstract

[Problem] The present invention relates to a chlorinated polyolefin composition, and more specifically relates to a chlorinated polyolefin composition having excellent durability properties such as acid resistance, alkali resistance, and heat resistance. [Solution] A chlorinated polyolefin composition comprising a chlorinated polyolefin and an acid acceptor, wherein the acid acceptor is at least one substance selected from among aliphatic glycidyl ether and epoxidized oil, and the molecular weight of the acid acceptor is not less than 200.

IPC Classes  ?

  • C08K 5/1515 - Three-membered rings
  • C08L 23/28 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or halogen-containing compounds
  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins

85.

POLYCHLOROPRENE LATEX COMPOSITION

      
Application Number JP2021048751
Publication Number 2022/145448
Status In Force
Filing Date 2021-12-28
Publication Date 2022-07-07
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Ogawa Noriko
  • Shibuya Akira

Abstract

The present invention relates to a polychloroprene latex composition, a dipped product, an adhesive, a bonding agent, and a bonded product. The polychloroprene latex composition includes a chloroprene (co)polymer (A) and an aromatic compound (B) having 7-10 carbon atoms. The ratio of the aromatic compound (B) having 7-10 carbon atoms is 0.0012-0.15 parts by mass when the solid content of the polychloroprene latex composition is defined as 100 parts by mass.

IPC Classes  ?

86.

SILVER NANO-WIRE PRODUCTION METHOD

      
Application Number JP2021041880
Publication Number 2022/137886
Status In Force
Filing Date 2021-11-15
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Hasegawa Aoi
  • Hara Masanao
  • Toba Masahiko
  • Noguchi Tomoyuki

Abstract

[Problem] To provide a silver nano-wire production method having high production capability and allowing for suppression of an increase in diameter during cooling that follows completion of reaction. [Solution] This silver nano-wire production method is characterized by comprising the step of synthesizing a silver nano-wire at a temperature of 120 to 170°C by the polyol reduction method, and the step of cooling, after the end of the silver nano wire synthesis, the reaction solution temperature from the temperature at the time of the end of the reaction to 80°C at a cooling speed of -0.50°C/minute or faster on average.

IPC Classes  ?

  • B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties

87.

ADHESIVE COMPOSITION, COPOLYMER DISPERSION, SET, ADHESIVE TAPE, AND ADHESION METHOD

      
Application Number JP2021044887
Publication Number 2022/138132
Status In Force
Filing Date 2021-12-07
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor Okuhara, Kenta

Abstract

This adhesive composition comprises a copolymer (A), a crosslinking agent (B), and an aqueous medium, wherein: the copolymer (A) has a structural unit derived from a monomer (a1), a structural unit derived from a monomer (a2) having a carboxy group, and a structural unit derived from a monomer (a3) having an epoxy group; the monomer (a1) is composed of one or both of alkyl (meth)acrylate having only one ethylenically unsaturated bond and hydrocarbon having only one ethylenically unsaturated bond; the content of the structural unit derived from the monomer (a2) with respect to 100 parts by mass of the structural unit derived from the monomer (a1) in the copolymer (A) is 1.0-12 parts by mass; the content of the structural unit derived from the monomer (a3) with respect to 100 parts by mass of the structural unit derived from the monomer (a1) in the copolymer (A) is 0.10-10 parts by mass; the crosslinking agent (B) contains at least one selected from the group consisting of a polycarbodiimide compound, a polyepoxy compound, and a polyisocyanate compound; and the content of the crosslinking agent (B) with respect to 100 parts by mass of the copolymer (A) is 0.010-10 parts by mass.

IPC Classes  ?

  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 11/08 - Macromolecular additives
  • C09J 133/02 - Homopolymers or copolymers of acids; Metal or ammonium salts thereof
  • C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C09J 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
  • C09J 163/00 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
  • C09J 175/04 - Polyurethanes
  • C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

88.

COPOLYMER AND METHOD FOR PRODUCING SAME

      
Application Number JP2021045077
Publication Number 2022/138159
Status In Force
Filing Date 2021-12-08
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Nagai Eri
  • Kinoshita Takehiro
  • Kawaguchi Yasuaki
  • Yanagi Masayoshi

Abstract

The purpose of the present invention is to provide: a resin composition which exhibits good developing performance when used as a photosensitive material, which has excellent storage stability, and which yields a cured product having excellent solvent resistance even if cured at a low temperature; a copolymer that is useful for preparing this resin composition; and a method for producing the copolymer. This copolymer contains a constituent unit (a) having a group represented by formula (1) or formula (2), a constituent unit (b) having a hydroxyl group and a constituent unit (c) having an acid group, and has a glass transition temperature of 30ºC or lower.

IPC Classes  ?

  • C08F 8/00 - Chemical modification by after-treatment
  • C08F 265/04 - Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group on to polymers of esters
  • C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • G03F 7/004 - Photosensitive materials
  • G02B 5/20 - Filters

89.

SEPARATOR BINDER FOR NONAQUEOUS SECONDARY BATTERIES, SEPARATOR FOR NONAQUEOUS SECONDARY BATTERIES, METHOD FOR PRODUCING SEPARATOR SLURRY FOR NONAQUEOUS SECONDARY BATTERIES, AND NONAQUEOUS SECONDARY BATTERY

      
Application Number JP2021046023
Publication Number 2022/138323
Status In Force
Filing Date 2021-12-14
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takahashi Kentarou
  • Hanasaki Mitsuru
  • Kurata Tomonori

Abstract

The present invention provides a separator binder for nonaqueous secondary batteries and a separator binder composition for nonaqueous secondary batteries, each of which is capable of forming a slurry that has good wettability and coatability with respect to a base material, while enabling a coating layer to have high peel strength and suppressing thermal shrinkage of a separator. A separator binder composition for nonaqueous secondary batteries according to the present invention contains a polymer (A) and a polymer (B). The polymer (A) comprises a primary amide group and a hydroxyl group, while having a main chain that is composed of a bond of carbon atoms; the polymer (B) comprises a hydroxyl group, while having a main chain that is composed of a bond of carbon atoms; the amount of the primary amide group contained per 1 g of the polymer (A) is 7.5 × 10-3mol/g or more; the amount of the hydroxyl group contained per 1 g of the polymer (A) is from 0.50 × 10-3mol/g to 8.0 × 10-3mol/g; and the amount of the hydroxyl group contained per 1 g of the polymer (B) is 8.80 × 10-3 mol/g or more.

IPC Classes  ?

  • C08F 220/56 - Acrylamide; Methacrylamide
  • C08L 29/04 - Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
  • C08L 33/26 - Homopolymers or copolymers of acrylamide or methacrylamide
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • H01M 50/411 - Organic material
  • H01M 50/42 - Acrylic resins
  • H01M 50/434 - Ceramics
  • H01M 50/443 - Particulate material
  • H01M 50/446 - Composite material consisting of a mixture of organic and inorganic materials
  • H01M 50/449 - Separators, membranes or diaphragms characterised by the material having a layered structure
  • H01M 50/489 - Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties

90.

NON-AQUEOUS SECONDARY BATTERY ELECTRODE BINDER, NON-AQUEOUS SECONDARY BATTERY ELECTRODE BINDER COMPOSITION, AND NON-AQUEOUS SECONDARY BATTERY

      
Application Number JP2021046248
Publication Number 2022/138371
Status In Force
Filing Date 2021-12-15
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kawahara Yuta
  • Ikehata Ryohsuke
  • Horikoshi Hideo
  • Hanasaki Mitsuru

Abstract

Provided is a binder for non-aqueous secondary battery electrodes, that effectively improves peel strength from a current collector of an electrode active material layer and can contribute to a reduction in the internal resistance of a battery and an improvement in cycle characteristics. This binder for non-aqueous secondary battery electrodes includes a copolymer (A) and a copolymer (B). The copolymer (A) has 11th to 13th structural units that are derived from: monomers (a1), (a2) that have an ethylenically unsaturated bond; and an internal cross-linking agent (a3). The copolymer (B) has, among all structural units, 5.0–98 mol%, 0.30–90 mol%, and 0.30–10 mol%, respectively, of 21st to 23rd structural units indicated by formulas (1)–(3). Chemical formula 1 (In formula (2), R1indicates a C1–6 alkyl group that may be branched. In formula (3), R2 indicates a group having an ethylenically unsaturated bond.)

IPC Classes  ?

  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • C08F 212/08 - Styrene
  • C08F 220/10 - Esters
  • C08G 65/32 - Polymers modified by chemical after-treatment
  • C08L 25/04 - Homopolymers or copolymers of styrene
  • C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C08L 71/02 - Polyalkylene oxides
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
  • H01M 4/139 - Processes of manufacture

91.

LITHIUM ION-CONDUCTIVE SOLID ELECTROLYTE, AND ALL-SOLID-STATE BATTERY

      
Application Number JP2021047810
Publication Number 2022/138804
Status In Force
Filing Date 2021-12-23
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Lee Kunchan
  • Sei Ryosuke

Abstract

[Problem] To provide a novel solid electrolyte having excellent lithium ion-conductivity. [Solution] A lithium ion-conductive solid electrolyte according to the present invention includes a chalcogenide having a monoclinic crystal structure, wherein the monoclinic crystal has an a-axis length of 9.690-9.711 Å, a b-axis length of 11.520-11.531 Å, and a c-axis length of 10.680-10.695 Å, and has an axis angle β in the range of 90.01-90.08°. An all-solid-state battery according to the present invention comprises: a positive electrode having a positive electrode active material; a negative electrode having a negative electrode active material; and a solid electrolyte layer disposed between the positive electrode and the negative electrode, wherein the solid electrolyte layer includes the lithium ion-conductive solid electrolyte.

IPC Classes  ?

  • C01B 35/12 - Borates
  • H01M 12/06 - Hybrid cells; Manufacture thereof composed of a half-cell of the fuel-cell type and of a half-cell of the primary-cell type with one metallic and one gaseous electrode
  • H01M 12/08 - Hybrid cells; Manufacture thereof composed of a half-cell of a fuel-cell type and a half-cell of the secondary-cell type
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
  • H01M 4/40 - Alloys based on alkali metals
  • H01M 4/48 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
  • H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
  • H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01B 1/06 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

92.

TRANSPARENT ELECTROCONDUCTIVE FILM LAMINATE

      
Application Number JP2021048067
Publication Number 2022/138882
Status In Force
Filing Date 2021-12-24
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kuwahara Jun
  • Yamaki Shigeru

Abstract

The present invention easily provides a transparent electroconductive film laminate that is suitable for three-dimensional molding and that has a curved surface. A transparent electroconductive film laminate characterized by having a transparent substrate that is formed from a transparent thermoplastic resin film, a transparent electroconductive film that is formed on at least one principal surface of the transparent substrate and that is configured to include a binder resin and a metal nanowire, and a protective film that contains a resin component formed on the transparent electroconductive film, the transparent electroconductive film laminate moreover being characterized in that: the binder resin contains a copolymer including 70 mol% or more of poly-N-vinyl acetamide and N-vinylacetamide (NVA) as monomer units, and also contains at least one cellulose-based resin; and 94 mass% or more of the resin components constituting the protective film are derived from a thermoplastic resin.

IPC Classes  ?

  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • H01B 5/00 - Non-insulated conductors or conductive bodies characterised by their form
  • H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
  • G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

93.

MOLDING MATERIAL AND MOLDED ARTICLE

      
Application Number JP2021033392
Publication Number 2022/137666
Status In Force
Filing Date 2021-09-10
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Mori, Masatoshi
  • Ishiuchi, Ryujin
  • Miki, Toshitada

Abstract

Provided is a molding material which has a low specific gravity and exhibits good moldability. Provided is a molding material that contains: (A) a thermosetting resin; (B) a reactive diluent; (C) a thermoplastic resin; (D) hollow inorganic particles; and (E) a thermal polymerization initiator. The thermosetting resin (A) contains at least an unsaturated polyester resin. The content of the thermoplastic resin (C) is 5-15 mass%. The true density of the hollow inorganic particles (D) is 0.3-0.7 g/cm3. The pressure resistance strength of the hollow inorganic particles (D) is 10 MPa or more. The content of the hollow inorganic particles (D) is 35-70 vol%. If the specific gravity calculated from the blending quantity of the molding material is taken to be the theoretical specific gravity and the specific gravity measured using a test piece obtained by molding a contracted disk specified in JIS K 6911: 2006 by means of compression molding for a molding time of 3 minutes at a molding temperature of 150ºC and a molding pressure of 2 MPa and then cutting is taken to be the measured specific gravity, the difference between the measured specific gravity and the theoretical specific gravity (measured specific gravity minus theoretical specific gravity) is 0.03 or less.

IPC Classes  ?

  • C08L 67/06 - Unsaturated polyesters
  • B29C 70/02 - Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising combinations of reinforcements and fillers incorporated in matrix material, forming one or more layers, with or without non-reinforced or non-filled layers
  • C08J 9/32 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
  • C08K 5/14 - Peroxides
  • C08K 7/02 - Fibres or whiskers
  • C08K 7/24 - Expanded, porous or hollow particles inorganic
  • C08L 101/00 - Compositions of unspecified macromolecular compounds

94.

UNSATURATED POLYESTER RESIN COMPOSITION AND MOLDED OBJECT

      
Application Number JP2021035157
Publication Number 2022/137686
Status In Force
Filing Date 2021-09-24
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Miki, Toshitada
  • Ishiuchi, Ryujin
  • Mori, Masatoshi

Abstract

Provided is an unsaturated polyester resin composition which has satisfactory resin flowability during molding and can give molded objects excellent in terms of molded-article appearance, dimensional accuracy, and strength and having few burrs. The unsaturated polyester resin composition contains inorganic fillers in an amount in a specific range, the inorganic fillers comprising a specific proportion of three inorganic fillers having respective average particle diameters.

IPC Classes  ?

  • C08F 283/01 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to unsaturated polyesters
  • C08K 7/02 - Fibres or whiskers
  • C08L 67/06 - Unsaturated polyesters
  • C08K 3/26 - Carbonates; Bicarbonates

95.

METHOD FOR PRODUCING SURFACE-TREATED THERMALLY CONDUCTIVE FILLER, AND THERMALLY CONDUCTIVE COMPOSITION

      
Application Number JP2021036561
Publication Number 2022/137716
Status In Force
Filing Date 2021-10-04
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Minorikawa, Naoki
  • Satoh, Hikaru
  • Funahashi, Hajime
  • Kobayashi, Ikue
  • Yukutake, Hajime
  • Iemura, Takeshi

Abstract

A method for producing a surface-treated thermally conductive filler, characterized by treating the surface of a thermally conductive filler by chemical vapor deposition using an alkoxysilane having a specific structure.

IPC Classes  ?

  • C09C 3/12 - Treatment with organosilicon compounds
  • H01L 23/373 - Cooling facilitated by selection of materials for the device
  • C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C09K 3/00 - Materials not provided for elsewhere
  • C09K 5/14 - Solid materials, e.g. powdery or granular

96.

ADHESIVE COMPOSITION, COPOLYEMR DISPERSION LIQUID, SET, ADHESIVE TAPE AND BONDING METHOD

      
Application Number JP2021044886
Publication Number 2022/138131
Status In Force
Filing Date 2021-12-07
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor Okuhara, Kenta

Abstract

An adhesive composition which contains a copolymer (A), a crosslinking agent (B) and an aqueous medium, wherein: the copolymer (A) has a structural unit derived from a monomer (a1), a structural unit derived from a monomer (a2) that has a carboxy group, and a structural unit derived from a monomer (a3) that has an alkoxysilyl group; the monomer (a1) is composed of an alkyl (meth)acrylate ester that has only one ethylenically unsaturated bond and/or a hydrocarbon that has only one ethylenically unsaturated bond; the content of the structural unit derived from a monomer (a2) relative to 100 parts by mass of the structural unit derived from a monomer (a1) in the copolymer (A) is from 1.0 part by mass to 12 parts by mass; the content of the structural unit derived from a monomer (a3) relative to 100 parts by mass of the structural unit derived from a monomer (a1) in the copolymer (A) is from 0.010 part by mass to 3.5 parts by mass; the crosslinking agent (B) contains one or more compounds that are selected from the group consisting of polycarbodiimide compounds, polyepoxy compounds and polyisocyanate compounds; and the content of the crosslinking agent (B) relative to 100 parts by mass of the copolymer (A) is from 0.010 part by mass to 10 parts by mass.

IPC Classes  ?

  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 11/08 - Macromolecular additives
  • C09J 133/02 - Homopolymers or copolymers of acids; Metal or ammonium salts thereof
  • C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C09J 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
  • C09J 143/04 - Homopolymers or copolymers of monomers containing silicon
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

97.

COPOLYMER, AND METHOD FOR PRODUCING SAID COPOLYMER

      
Application Number JP2021045180
Publication Number 2022/138173
Status In Force
Filing Date 2021-12-08
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Nagai Eri
  • Kinoshita Takehiro
  • Yanagi Masayoshi

Abstract

This copolymer contains a structural unit (a) having a blocked isocyanate group blocked by a pyrazole compound, a structural unit (b) having a hydroxy group, and a structural unit (c) having an acid group, wherein the copolymer has a glass transition temperature of at most 30 °C.

IPC Classes  ?

  • C08G 18/80 - Masked polyisocyanates
  • C08F 2/00 - Processes of polymerisation
  • C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
  • C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
  • C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
  • G02B 5/20 - Filters
  • G03F 7/004 - Photosensitive materials

98.

FIXED-BED REACTOR

      
Application Number JP2021045840
Publication Number 2022/138286
Status In Force
Filing Date 2021-12-13
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Kawai, Tatsuhiko
  • Okuno, Yoshishige
  • Kodera, Kenta
  • Daibo, Shota
  • Iwama, Yasuhiro
  • Ikushima, Maiko
  • Umehara, Kazuki

Abstract

This fixed-bed reactor comprises: a pipe which introduces a gas-liquid two-phase flow from above said fixed-bed reactor into the same; and an inlet baffle which is located inside said fixed-bed reactor, opposite an inlet for the pipe. The inlet baffle is a horizontally positioned flat plate. The inlet for the pipe is located directly above a centre position of the inlet baffle. A shielding plate, which has a shielding surface that inhibits a situation where gas-liquid two-phase flow directed at the centre position is scattered towards the outer diameter of the inlet baffle, is positioned upright on a main surface of the inlet baffle, radially outward of a position acquired by projecting the outer diameter of the inlet for the pipe onto the inlet baffle.

IPC Classes  ?

  • B01J 8/02 - Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with stationary particles, e.g. in fixed beds
  • B01J 19/24 - Stationary reactors without moving elements inside

99.

SEPARATOR BINDER POLYMER FOR NON-AQUEOUS SECONDARY BATTERY, SEPARATOR FOR NON-AQUEOUS SECONDARY BATTERY, AND NON-AQUEOUS SECONDARY BATTERY

      
Application Number JP2021046003
Publication Number 2022/138320
Status In Force
Filing Date 2021-12-14
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takahashi Kentarou
  • Hanasaki Mitsuru
  • Kurata Tomonori

Abstract

Provided are a separator binder polymer for a non-aqueous secondary battery, and a separator binder composition for a non-aqueous secondary battery, which are capable of: producing a slurry having good wettability and coatability to a substrate; forming a coating layer having high peel strength on a separator; and suppressing the thermal shrinkage of the separator. A separator binder polymer for a non-aqueous secondary battery according to the present invention has a first structural unit (a1) derived from (meth)acrylamide, and a second structural unit (a2) derived from a compound having a hydroxyl group and an ethylenically unsaturated bond. The value of a mass ratio of the content of the first structural unit (a1) to the content of the second structural unit (a2) is 55.0/45.0 to 95.0/5.0.

IPC Classes  ?

  • H01M 50/42 - Acrylic resins
  • H01M 50/434 - Ceramics
  • H01M 50/443 - Particulate material
  • H01M 50/451 - Separators, membranes or diaphragms characterised by the material having a layered structure comprising layers of only organic material and layers containing inorganic material

100.

SEPARATOR BINDER FOR NONAQUEOUS SECONDARY BATTERY, SEPARATOR FOR NONAQUEOUS SECONDARY BATTERY, METHOD FOR PRODUCING SEPARATOR SLURRY FOR NONAQUEOUS SECONDARY BATTERY, AND NONAQUEOUS SECONDARY BATTERY

      
Application Number JP2021046014
Publication Number 2022/138322
Status In Force
Filing Date 2021-12-14
Publication Date 2022-06-30
Owner SHOWA DENKO K.K. (Japan)
Inventor
  • Takahashi Kentarou
  • Hanasaki Mitsuru
  • Kurata Tomonori

Abstract

Provided are a separator binder for a nonaqueous secondary battery and a separator binder composition for a nonaqueous secondary battery that make it possible to produce a slurry having good wettability and coatability on a substrate, that make it possible to form a coating layer having high peel strength on a separator, and that can suppress heat shrinkage of the separator. The separator binder for a nonaqueous secondary battery of the present invention comprises a polymer (A) and a polymer (B). In the polymer (A), the main chain is a polyolefin structure and has a first structural unit (a1) derived from a (meth)acrylamide and a second structural unit (a2) derived from a compound having a hydroxyl group and an ethylenic unsaturated bond. The polymer (B) is a polyvinyl alcohol having a degree of saponification of 55 mol% or more. In the polymer (A), the value of the mass ratio of (a1) and (a2) is from 55.0/45.0 to 95.0/5.0, and the value of the mass ratio of (A) and (B) is from 55.0/45.0 to 97.0/3.0.

IPC Classes  ?

  • C08F 220/56 - Acrylamide; Methacrylamide
  • C08L 29/04 - Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
  • C08L 33/26 - Homopolymers or copolymers of acrylamide or methacrylamide
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • H01M 50/403 - Manufacturing processes of separators, membranes or diaphragms
  • H01M 50/414 - Synthetic resins, e.g. .thermoplastics or thermosetting resins
  • H01M 50/42 - Acrylic resins
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