Abstract

Provided is a cover tape that is used by being heat sealed onto the front surface of an electronic component conveyance-use carrier tape that intermittently includes, in the longitudinal direction, accommodation sections for accommodating electronic components, the heat sealing performed so as to seal the accommodation sections. The cover tape includes: a substrate layer; and a heat sealant layer which is provided to one surface of the substrate layer. The heat sealant layer is formed so as to extend in a strip shape at both ends of the substrate layer in the longitudinal direction thereof.

IPC Classes  ?

• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• B65D 65/40 - Applications of laminates for particular packaging purposes

Abstract

An optical waveguide according to the present invention includes a first core pattern and a second core pattern. The first core pattern comprises a first incidence/emission surface and a second incidence/emission surface that are provided at one end of the first core pattern, a third incidence/emission surface and a fourth incidence/emission surface that are provided at the other end of the first core pattern, a first rectification part, a first branching part, and a second branching part. The second core pattern comprises a fifth incidence/emission surface and a sixth incidence/emission surface that are provided at one end of the second core pattern, a seventh incidence/emission surface and an eighth incidence/emission surface that are provided at the other end of the second core pattern, a second rectification part, a third branching part, and a fourth branching part. A line-symmetric relationship with respect to a first straight line as the axis of symmetry is established between the first to fourth incidence/emission surfaces and the fifth to eighth incidence/emission surfaces, and a line-symmetric relationship with respect to a second straight line as the axis of symmetry is established between the first incidence/emission surface and the third incidence/emission surface, and the second incidence/emission surface and the fourth incidence/emission surface, and between the fifth incidence/emission surface and the seventh incidence/emission surface, and the sixth incidence/emission surface and the eighth incidence/emission surface.

IPC Classes  ?

• G02B 6/125 - Bends, branchings or intersections
• G02B 6/30 - Optical coupling means for use between fibre and thin-film device
• G02B 6/36 - Mechanical coupling means

Abstract

A sandwich panel (100) comprises: a core layer (1) having a honeycomb structure; and a plurality of skin layers (2) that are disposed on both surfaces of the core layer (1). The skin layers (2) each comprise two or more prepregs (21) which are stacked on one another with a sheet (22), which is obtained by a papermaking process, interposed therebetween.

IPC Classes  ?

• B32B 3/12 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a layer of regularly-arranged cells whether integral or formed individually or by conjunction of separate strips, e.g. honeycomb structure
• B29C 43/20 - Making multilayered or multicoloured articles
• B29C 70/42 - Shaping or impregnating by compression for producing articles of definite length, i.e. discrete articles
• B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary

Abstract

A mold release film 10 according to a first invention comprises: a first mold release layer 1 comprising a first thermoplastic resin composition; and a cushion layer 3 laminated on the first mold release layer 1, wherein the oxygen permeability of the mold release film 10 as measured according to JIS K 7126-2 is 60.0 cc/(m2·atm·day) or more. A mold release film 10 according to a second invention comprises: a first mold release layer 1 comprising a first thermoplastic resin composition; and a cushion layer 3 laminated on the first mold release layer 1, wherein the water vapor permeability of the mold release film 10 as measured according to JIS K 7129 (B method) is more than 1.0 g/m2·day (25°C·90% RH).

IPC Classes  ?

• B32B 27/00 - Layered products essentially comprising synthetic resin
• B29C 33/68 - Release sheets
• B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters

Goods & Services

Phenolic resins, unprocessed; unprocessed furan resins; unprocessed condensation plastics; unprocessed polymerization plastics; unprocessed plastics; unprocessed plastics in primary form; adhesives for industrial purposes.

Abstract

The purpose of the present invention is to provide a high-frequency diffusion sheet which can facilitate increase in opportunities of receiving electromagnetic waves in a high-frequency region by a communication device in a building, by reflecting and diffusing the electromagnetic waves in the high-frequency region. A high-frequency diffusion sheet 10 according to the present invention is used for diffusing electromagnetic waves in a high-frequency region, and is formed from a laminate having an electromagnetic wave shielding layer 11 which exhibits an electromagnetic wave shielding property and an electromagnetic reflection layer 13 which is layered on the electromagnetic wave shielding layer 11 and which exhibits an electromagnetic reflection property. The electromagnetic wave shielding layer 11 is patterned in a plan view of the laminate, and has openings 15 passing through the electromagnetic wave shielding layer 11 in the thickness direction thereof.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H01Q 15/23 - Combinations of reflecting surfaces with refracting or diffracting devices

Abstract

A release film 10 according to a first invention includes a first release layer 1 comprising a first thermoplastic resin composition, and a cushion layer 3 laminated on the first release layer 1. The thermal diffusivity coefficient in the thickness direction of the release film 10 is 1.3×10-7m2/s or more. A release film 10 according to a second invention has a first release layer 1 comprising a first thermoplastic resin composition, and a cushion layer 3 laminated on the first release layer 1. The puncture strength of the release film 10 is 0.5 N or more, as measured when punctured by a needle from the first release layer side under conditions of 175°C in accordance with JIS Z 1707.

IPC Classes  ?

• B32B 27/00 - Layered products essentially comprising synthetic resin
• B29C 43/34 - Feeding the material to the mould or the compression means
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• H05K 1/03 - Use of materials for the substrate

Abstract

This electrochromic sheet comprises a first substrate, a second substrate, an electrochromic element, and a sealing part, wherein: the electrochromic element has a first transparent electrode, a first auxiliary electrode, a second transparent electrode, a second auxiliary electrode, and an electrochromic layer; the first auxiliary electrode has a first extraction part protruding to the outside of a colored region, and the second auxiliary electrode has a second extraction part protruding to the outside of the colored region; in a plan view, the first extraction part does not overlap with the second transparent electrode, and the second extraction part does not overlap with the first transparent electrode; and in a cross-section connecting the first extraction part and the colored region, the distance from an end of the second transparent electrode on the first extraction part side to the colored region is 0.01-1.0 mm.

IPC Classes  ?

• G02F 1/155 - Electrodes
• G02F 1/15 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on an electrochromic effect
• G02F 1/161 - Gaskets; Spacers; Sealing of cells; Filling or closing of cells

Abstract

The present invention provides a heat sink-attached circuit board (50) in which a conductor layer (30) constituting a circuit and a heat sink (10) are integrated with an insulating layer (20) therebetween. The heat sink (10) comprises a planar base plate (11) and a plurality of fins (12) protruding from a surface opposite the insulating layer (20). The insulating layer (20) is composed of a material including a thermoplastic resin and boron nitride particles.

IPC Classes  ?

• H05K 1/05 - Insulated metal substrate
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H05K 1/02 - Printed circuits - Details
• H05K 3/44 - Manufacturing insulated metal core circuits
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

This photosensitive resin composition contains a polyimide (A) having an imide ring structure in the molecule, and a photosensitizer (B), and the water content measured by the Karl Fischer method is 0.30-10 mass% inclusive.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials
• G03F 7/037 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
• G03F 7/075 - Silicon-containing compounds

Abstract

The mold release film has a multilayer structure in which a mold release layer, a first base material layer, and a second base material layer are laminated. The mold release layer constitutes a mold release surface, and the second base material layer constitutes a surface of the mold release film on an opposite side of the mold release surface. The mold release layer contains one or two or more selected from a silicone resin, a fluororesin, a melamine resin, an epoxy resin, and a phenolic resin. The first base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin. The second base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin.

IPC Classes  ?

• B29C 33/68 - Release sheets
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

122 each independently represent any one of a hydrogen atom, a hydrocarbon or aromatic group having 1 to 30 carbon atoms, an aromatic group, a hydroxyl group, and an alkoxyl group having 1 to 30 carbon atoms.)

IPC Classes  ?

• H02K 5/00 - Casings; Enclosures; Supports
• C08G 8/00 - Condensation polymers of aldehydes or ketones with phenols only
• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• H02K 3/30 - Windings characterised by the insulating material
• H02K 3/44 - Protection against moisture or chemical attack; Windings specially adapted for operation in liquid or gas

Abstract

The present invention provides a wire grid polarizing element having a high degree of polarization and necessary light transmittance, and a method for producing same.　Provided is a wire grid polarizing element 11 comprising a substrate 21 in which a plurality of recessed grooves 24 extending in parallel are provided periodically to a transparent sheet surface 22, and a conductor layer 31 which is formed in the recessed grooves, wherein the shape of the plurality of recessed grooves provided to the substrate is such that side walls 26 that face each other are parallel to each other, and the conductor layer formed in the recessed grooves is formed at least on both side walls 26 of the recessed grooves with a substantially uniform thickness and in an opposing manner with a gap therebetween.

IPC Classes  ?

• G02B 5/30 - Polarising elements

Abstract

Provided are: a wire grid type polarizing element having an excellent degree of polarization and having a high rate of polarized light transmittance in a perpendicular direction; and a manufacturing method thereof.　This wire grid type polarizing element includes: a base material formed such that a transparent sheet surface has a cross-section having a continuous wave shape; electroconductor protrusions that are continuous with tips of the wave shape, extending in a perpendicular direction that is perpendicular to an array direction, the electroconductor protrusions protruding in a direction in which the tips extend; and an electroconductor layer covering a surface section of said protrusions excluding the tips. The period (a) of the wave shape is 100-400 nm, the average depth (b) from convex tips of the wave shape to valleys of recesses of the wave shape is 200-600 nm, the average occupancy ([2d/a]×100) of the electroconductor layer, which is the ratio of the average width (d) in the array direction of two electroconductor layers present inside one cycle relative to the period (a), is 18-40%, and the average thickness (h) in the tip direction of the electroconductor protrusions is at least 1.5 times the average width (d) of the electroconductor layer.

IPC Classes  ?

• G02B 5/30 - Polarising elements

Goods & Services

Phenolic resins, unprocessed; unprocessed furan resins; unprocessed condensation plastics; unprocessed polymerization plastics; unprocessed plastics; unprocessed plastics in primary form; adhesives for industrial purposes

Abstract

A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyimide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl Group (provided that N-methyl-2-pvrrolidone is excluded), and the amount or the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials

Abstract

This electrode for electroencephalogram measurement has a base part (51), a plurality of protrusions (60) that are made of an elastic body and extend from the base part (51), and an electrode part (80) that is provided on the surface of the protrusions (60) so as to cover an electroconductive member (70). The electroconductive member (70) is provided so as to cover at least the distal end portion (61) of the protrusions (60). The electroconductive member (70) has a thin-walled part that is provided on the base (51) side so as to be thin-walled, and a bulging part that bulges in the width direction of the protrusions (60) on the distal end portion (61) and the vicinity thereof, on the distal end portion (61) side relative to the base (51).

IPC Classes  ?

• A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
• A61B 5/263 - Bioelectric electrodes therefor characterised by the electrode materials
• A61B 5/256 - Wearable electrodes, e.g. having straps or bands
• A61B 5/262 - Needle electrodes

Abstract

Provided is a thermally-conductive resin composition containing a thermosetting resin and boron nitride particles, in which, in a case where a void fraction of the boron nitride particles relative to a compression pressure is measured, a void fraction at a compression pressure of 4 MPa is 30% or more and 60% or less, and a void fraction at a pressure of 8 MPa is 20% or more and 50% or less.

IPC Classes  ?

• C09K 5/14 - Solid materials, e.g. powdery or granular
• C08K 3/38 - Boron-containing compounds
• C08J 5/18 - Manufacture of films or sheets

Abstract

A stator (4) has a stator core having a plurality of tooth portions (7), a slot (8) provided between the tooth portions (7) and accommodating a coil (9), and the coil (9) accommodated in the slot (8), the stator has a resin layer (50) provided on an inner surface of the slot (8) and made of an insulating resin composition, a wall surface (a resin layer surface (55) of an inner resin layer (51)) of the resin layer (50) on an inner side of the slot (8) is provided in parallel with a rotating shaft direction, the resin composition of the resin layer (50) contains a thermosetting resin, and the thermosetting resin has a glass transition temperature Tg of 120° C. or higher.

IPC Classes  ?

• H02K 3/34 - Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation
• H02K 3/30 - Windings characterised by the insulating material
• H02K 21/14 - Synchronous motors having permanent magnets; Synchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets rotating within the armatures
• H02K 15/10 - Applying solid insulation to windings, stators or rotors
• H02K 15/12 - Impregnating, heating or drying of windings, stators, rotors or machines

Abstract

This translucent resin sheet is used in a translucent cover member 1 that is capable of transmitting light, and comprises a polarizing layer 2 and protective layers 3A, 3B, the relational expression A∙B(1) [mm∙%], where A [%] is the content ratio of moisture in the translucent resin sheet and B [mm] is the total thickness of the two protective layers 3A, 3B, of the product of the content ratio A and the total thickness B when the translucent resin sheet is stored for 23 hours under conditions of a temperature of 25°C and a humidity of 50% Rh satisfying the relationship 0.20 ≤ A∙B(1) ≤ 0.70.

IPC Classes  ?

• G02B 5/30 - Polarising elements
• B32B 7/023 - Optical properties
• G02B 27/01 - Head-up displays
• G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Abstract

The present invention provides a resin sheet which contains a chlorinated polyvinyl chloride and a dimethyltin compound, wherein: the chlorine content in the chlorinated polyvinyl chloride is 60% by mass or more; and the deflection temperature under load of this resin sheet as determined in accordance with JIS K 7191-1 A method is 80°C or more.

IPC Classes  ?

• C08J 5/18 - Manufacture of films or sheets
• C08K 5/57 - Organo-tin compounds
• C08L 27/24 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers modified by chemical after-treatment halogenated

Abstract

An easily detachable thermosetting resin composition according to the present invention contains a thermosetting component; and a cured product which is obtained by thermally curing this thermosetting resin composition has a structure represented by formula (1).

IPC Classes  ?

• C08L 101/06 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

A method for producing a lignin-modified resol-type phenol resin, the method comprising: a step for obtaining a first mixture containing a phenol, water, and a lignin such that the mass ratio of phenol:water between the phenol and the water is 1:0.03 to 1:1.5; a step for obtaining a second mixture by heating the first mixture at a temperature of 70-120°C at a pH of 7 or lower to dissolve the lignin in the phenol and in the water; a step for obtaining a third mixture by adding, to the second mixture, an aldehyde and a basic catalyst and adjusting the pH thereof to 7.5-12; and a step for obtaining the lignin-modified resol-type phenol resin by heating the third mixture at a temperature of 60-105°C to cause the lignin, the phenol, and the aldehyde to react in the presence of the basic catalyst.

IPC Classes  ?

• C08G 8/00 - Condensation polymers of aldehydes or ketones with phenols only
• C08G 8/20 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols

Abstract

This liquid resin composition is used to encapsulate, by casting, a power module comprising a power module substrate with a circuit layer formed thereon and a power semiconductor element mounted on the circuit layer of the power module substrate. The liquid resin composition includes (A) an epoxy resin, (B) an acid anhydride, (C) a hardening accelerator, (D) an inorganic filler, and (E) a sedimentation preventing agent. The epoxy resin (A) includes an alicyclic epoxy resin. The viscosity of the liquid resin composition at 25°C is 75 Pa•s or less.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• C08G 59/42 - Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,

Abstract

122 each independently represent a hydrogen atom, a C1-30 hydrocarbon group or aromatic group, a hydroxyl group, or a C1-30 alkoxyl group.)

IPC Classes  ?

• H02K 1/276 - Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
• C08K 3/011 - Crosslinking or vulcanising agents, e.g. accelerators
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• H02K 15/03 - Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies having permanent magnets

Abstract

A resin composition for resin coated sand, the resin composition containing a lignin-modified novolac phenolic resin, wherein the content of free phenols in the lignin-modified novolac phenolic resin is 2% by mass or less.

IPC Classes  ?

• B22C 1/22 - Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
• C04B 20/10 - Coating or impregnating
• C08G 8/28 - Chemically modified polycondensates
• C08K 5/544 - Silicon-containing compounds containing nitrogen
• C08L 61/14 - Modified phenol-aldehyde condensates

Goods & Services

Unprocessed epoxy resins; unprocessed phenolic resins; unprocessed condensation synthetic resins; unprocessed condensation plastics; unprocessed polymerization plastics; unprocessed plastics Engine parts and fittings for automobiles, namely, automotive engine blocks, automotive engine valve covers, engine covers, heads for internal combustion engines, contact points, engine seals and combustion chambers Engines for automobiles; brakes and their structural parts for automobiles; structural parts for automobiles

Abstract

A method for manufacturing a circuit board (50) with a heat sink includes the following steps of: stacking an insulating layer (20) on one side of a heat sink (10); disposing a lead frame (35) having a plurality of independent circuit patterns (30) and a convex bridge (31) provided as a bridge between adjacent circuit patterns (30) on the insulating layer (20); embedding a sealing resin (40) between the circuit patterns (30); and removing a part of the sealing resin (40) and the convex bridge (31) to expose the upper surface of the circuit pattern (30).

IPC Classes  ?

• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,

Abstract

[Problem] To provide a belt or clothing that uses electrodes that have higher noise resistance and durability than electrodes made only of a conductive fiber fabric or a conductive elastomer fabric. [Solution] Clothing C includes: an electrode 1 in a detection area F1; and an insulating fiber fabric 2. The electrode 1 is provided on the inner side of the detection area F1 on the clothing C so as to come into contact with the body of a wearer P. The insulating fiber fabric 2 is a clothing material to be worn by the wearer P, and is a fabric that constitutes most of the clothing C. The electrode 1 has: a conductive fiber fabric layer 11; and a conductive elastomer layer 12. The conductive fiber fabric layer 11 is a fiber fabric formed by weaving or knitting yarns containing conductive fibers having conductive properties. The conductive elastomer layer 12 is formed by applying a paste containing an elastomer composition 120 and a conductive filler 121 to the inner side of the conductive fabric layer 11 and drying the paste.

IPC Classes  ?

• A61B 5/256 - Wearable electrodes, e.g. having straps or bands
• A41D 13/00 - Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
• A61B 5/27 - Conductive fabrics or textiles
• D06M 11/83 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
• D06M 15/643 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds containing silicon in the main chain
• D06M 15/693 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compounds; Such treatment combined with mechanical treatment with natural or synthetic rubber, or derivatives thereof

Abstract

[Problem] To provide an electrode having more excellent noise resistance and more excellent durability compared with an electrode formed only from conductive fiber fabric or conductive elastomer fabric. [Solution] Clothing C has, in a detection region F1, an electrode 1 and an insulation fiber fabric 2. The electrode 1 is provided inside the detection region F1 of the clothing C so as to come into contact with the body of a wearer P. The insulation fiber fabric 2 is a clothing material worn by the wearer P and constitutes a major part of the clothing C. The electrode 1 has a conductive fiber fabric layer 11 and a conductive elastomer layer 12. The conductive fiber fabric layer 11 is fiber fabric formed by, for example, weaving or knitting yarn including conductive fibers having conductivity. The conductive elastomer layer 12 is formed by applying a paste including an elastomer composition 120 and a conductive filler 121 onto the inner surface of the conductive fiber fabric layer 11, and drying the paste.

IPC Classes  ?

• A61B 5/27 - Conductive fabrics or textiles
• A61B 5/256 - Wearable electrodes, e.g. having straps or bands

Abstract

Provided is a water soluble resol-type phenol resin, in which an unreacted phenol content is 0.1% by mass or less and an unreacted aldehyde content is 0.1% by mass or less.

IPC Classes  ?

• C08G 8/10 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol

Abstract

A resin molding material of the present invention is used for transfer molding or compression molding, the resin molding material containing (A) soft magnetic particles, (B) a silicone compound which is liquid at normal temperature (25° C.) , and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
• H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances

Abstract

A resin molding material of the present invention contains (A) soft magnetic particles, (B) a silica fine powder having an average particle diameter of equal to or more than 0.1 μm and equal to or less than 2.0 μm, and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass, and a content of the silica fine powder (B) is equal to or less than 1.5% by mass.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Goods & Services

Unprocessed plastics (plastics in primary form); condensation synthetic resins; condensation plastics; unprocessed phenolic resins; polymerization plastics

Abstract

An adhesive composition for a wet friction material, the composition containing a resol-type phenolic resin, polyvinyl butyral, a C1-6 carboxylic acid, and an alcohol-based solvent.

IPC Classes  ?

• C09J 11/06 - Non-macromolecular additives organic
• C09J 129/14 - Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
• C09J 159/00 - Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
• C09J 161/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols

Abstract

A series of palladium compounds as described herein are found to be superior vinyl addition polymerization catalysts. Specifically the compounds of formulae (I) and (II) as described herein surprisingly exhibit much higher reactivity than the compounds known in the art in the vinyl addition polymerization of a variety of cyclo-olefinic monomers, and thus polymers of very high molecular weight can be formed. Also disclosed are the formation of a variety of solid three dimensional objects, such as for example, solution extrusion of the polymer solutions formed from the vinyl addition polymerization of a variety of cyclic-olefinic monomers utilizing very low levels of palladium compounds of formulae (I) or (II) as described herein. The polymer films formed from the polymerization composition exhibit hitherto unattainable properties, for example superior transparent properties, higher thermal and mechanical properties, among other improved properties. Accordingly, the films thus formed are useful in a variety of opto-electronic applications.

IPC Classes  ?

• C08F 4/70 - Iron group metals, platinum group metals, or compounds thereof
• C08F 32/00 - Homopolymers or copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
• C08J 5/18 - Manufacture of films or sheets

Abstract

The present invention provides an intravascular indwelling medical device having a structure with which it is possible to occlude a desired site in a blood vessel in a short time. The intravascular indwelling medical device (100) according to the present invention dwells within a blood vessel (360) and occludes the blood vessel (360). The intravascular indwelling medical device (100) comprises a mesh-form main body (10), and a water-absorbing swelling material (20) that swells upon absorbing water, the water-absorbing swelling material (20) being disposed within the main body (10).

IPC Classes  ?

• A61B 17/12 - Surgical instruments, devices or methods, e.g. tourniquets for ligaturing or otherwise compressing tubular parts of the body, e.g. blood vessels or umbilical cord

Abstract

This resin composition for molding is for collectively sealing: a substrate equipped with an electronic component; a stator core which is fixed onto the substrate and which has a plurality of slots formed in the circumferential direction; and a plurality of coils accommodated in the slots. The resin composition comprises: an epoxy resin; a curing agent and/or a curing catalyst; and an inorganic filler. A cured product yielded by curing the resin composition for molding at 140°C for two minutes has a bending elastic modulus (according to JIS K6911:2006) at 25°C of 0.1 GPa to 30 GPa.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

An optical sheet 15 according to the present invention comprises: a first base material 11 that is configured with a resin material as the main material thereof; a half mirror layer 13 that is provided joined to one surface of the first base material 11 and that is provided with a laminate in which a high-refractive-index layer and a low-refractive-index layer are laminated alternately in a repeating manner; and a second base material 12 that is configured with a resin material as the main material thereof and that is provided joined to the surface of the half mirror layer 13 on the opposite side from the first base material 11. In the half mirror layer 13, the refractive index of the high-refractive-index layer is higher than the refractive index of the low-refractive-index layer. The interface between the first base material 11 and the half mirror layer 13 forms a continuous layer. The interface between the second base material 12 and the half mirror layer 13 forms a continuous layer.

IPC Classes  ?

• G02B 5/26 - Reflecting filters
• G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
• G02B 5/28 - Interference filters
• G02B 5/30 - Polarising elements
• G02C 7/10 - Filters, e.g. for facilitating adaptation of the eyes to the dark; Sunglasses

Abstract

A powder coating material used for a powder coating method including a step of immersing a coil end of a coil, which includes a conductor portion coated with an insulating coating and an exposed portion where the conductor portion is exposed from the insulating coating, in a fluidized chamber in which a powder coating material flows, and adhering a melt of the powder coating material to an outside of the exposed portion, the powder coating material containing a particulate thermosetting resin composition. The thermosetting resin composition contains an epoxy resin, and a curing agent.

IPC Classes  ?

• C09D 5/03 - Powdery paints
• C09D 163/00 - Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/40 - Additives
• C09D 7/63 - Additives non-macromolecular organic

Abstract

This cover tape for packaging an electronic component has a long shape having a width of 3 mm or less, and exhibits a breaking strength of 10 N or more as measured in accordance with JIS K 6734. In addition, this electronic component packaging body comprises: a carrier tape in which an electronic component is stored; and the aforementioned cover tape for packaging the electronic component, which is bonded to the carrier tape so as to seal the electronic component.

IPC Classes  ?

• B65D 73/02 - Articles, e.g. small electrical components, attached to webs
• B65D 77/20 - Container closures formed after filling by applying separate lids or covers
• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components

Abstract

A surface-modifier resin composition which is for use in a process comprising a step in which the surface-modifier resin composition is adhered to a surface of a structure including a first region, which is made of a cured epoxy resin composition, and a step in which the surface-modifier resin composition is thereafter removed from the surface to thereby modify the surface, the surface-modifier resin composition including a phenoxy resin.

IPC Classes  ?

• C08J 7/12 - Chemical modification
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• C08L 63/04 - Epoxynovolacs
• C08L 71/10 - Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
• C23C 26/00 - Coating not provided for in groups

Abstract

This soft magnetic material includes soft magnetic particles (A) that have an Fe content of at least 94 mass% and a median diameter of at least 20 μm.

IPC Classes  ?

• H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
• H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
• H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets

Abstract

An endoscope hood (100) comprises a cylindrical mounting portion (20) into which a tip-end portion (111) of an endoscope (110) is inserted, and a tubular hood body portion (30) which is continuously connected to the tip-end side of the mounting portion (20), the endoscope hood having a tubular overall shape. A tip-end opening (10) that is open at the tip end of the hood body portion (30) is eccentric with respect to the central axis (AX1) of the mounting portion (20).

IPC Classes  ?

• A61B 1/00 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
• G02B 23/24 - Instruments for viewing the inside of hollow bodies, e.g. fibrescopes

Abstract

The problem addressed by the present invention is to provide an electrochromic sheet comprising an electrochromic element, said electrochromic sheet having a configuration that makes it possible to easily find out whether a defect has occurred in the electrochromic element when manufacturing a lens comprising the electrochromic sheet.　An electrochromic sheet (150) according to the present invention comprises: substrates (11, 12); a sealing part (55) that is disposed between the substrates and that demarcates a coloring region (70); an electrochromic element (60) that is disposed within the coloring region (70); a first electrically conductive part (17) that fills a first hole (53) formed in the outside of the sealing part (55) relative to the electrochromic element (60); and a second electrically conductive part (18) that fills a second hole (54). The electrically conductive parts (17, 18) are respectively exposed at differing positions on end parts of the electrochromic sheet (150).

IPC Classes  ?

• G02F 1/1676 - Electrodes
• G02F 1/15 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on an electrochromic effect

Abstract

This resin composition for encapsulation is used to produce a single-sided-encapsulation-type structure by single-sided encapsulation of a mother board on which at least one electronic device is mounted. This resin composition for encapsulation comprises a trifunctional or higher epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a wax and has a mold shrinkage rate of 0.1% or less.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• C08L 91/06 - Waxes
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides a disposable pipette with which it is possible to avoid mixing foreign matter into a sample. This disposable pipette (1) is for use in the medical field or the biochemical field, the disposable pipette (1) comprising a plastic pipette body (20) having a connection part (23) connected to a drawing device, and a resin filter (30) inserted into the connection part (23). In the resin filter (30), the elution amount upon exposure to irradiation such that the absorbed dose reaches 20 kGy or greater is equivalent at a maximum absorbance of 0.08 or less in a wavelength section of 220-241 nm and a maximum absorbance of 0.05 or less in a wavelength section of 241-350 nm.

IPC Classes  ?

• B01L 3/02 - Burettes; Pipettes

Abstract

This positive-type photosensitive resin composition is used in a rewiring layer of a semiconductor device. The photosensitive resin composition includes (A) a phenol resin having a biphenol structure, (B) a crosslinking agent, and (C) a photosensitizer. The tensile fracture strength of a cured product obtained by curing the positive-type photosensitive resin composition at 180°C is not less than 100 MPa.

IPC Classes  ?

• G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
• G03F 7/004 - Photosensitive materials
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials

Abstract

A power module (10) includes a power semiconductor chip (1) and a Cu circuit (3) having the power semiconductor chip (1) provided on one surface. The power module (10) includes: a sintering layer (2) joining the power semiconductor chip (1) and the Cu circuit (3) by using a sintering paste; and a heat dissipation sheet (4) provided for joining a Cu base plate (5) to the other surface of the Cu circuit (3), in which in a first laminated structure in which the power semiconductor chip (1), the sintering layer (2), the Cu circuit (3), and the heat dissipation sheet (4) are laminated, the total thermal resistance XA in the direction of lamination is equal to or less than 0.30 (K/W).

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H05K 1/09 - Use of materials for the metallic pattern
• H01L 23/04 - Containers; Seals characterised by the shape
• H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials

Abstract

A deployment device 1 for deploying a radially expandable cylindrical therapeutic instrument 10 within a bend part in a living body lumen comprises a sheath 20 that can accommodate the cylindrical therapeutic instrument 10, and an elongate shaft-like member 30 configured to be capable of holding the cylindrical therapeutic instrument 10, and configured to be capable of advancing and retracting the tip-end side thereof along the axial direction inside the sheath 20. The shaft-like member 30 has step portions 31a, 32a protruding in the radial direction of the shaft-like member 30, and cover portions 33, 34 that, on proximal end sides of the step portions 31a, 32a, cover boundary areas between the shaft-like member 30 and the step portions 31a, 32a with inclined surfaces 33a, 34a.

IPC Classes  ?

• A61F 2/07 - Stent-grafts
• A61F 2/95 - Instruments specially adapted for placement or removal of stents or stent-grafts
• A61F 2/954 - Instruments specially adapted for placement or removal of stents or stent-grafts for placing stents or stent-grafts in a bifurcation

Abstract

The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied. The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied. Y≥0.4X−25  (1) The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied. Y≥0.4X−25  (1) 50≥Y≥3  (2) The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied. Y≥0.4X−25  (1) 50≥Y≥3  (2) X≥40  (3)

IPC Classes  ?

• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• C09J 7/29 - Laminated material
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
• B32B 7/02 - Physical, chemical or physicochemical properties
• B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties

Abstract

This organ protecting member (1) is used when an opening portion (36a) is formed in an abdominal wall (30) and an intestinal tract (32) is exposed to a body surface (33) from the opening portion (36a) to temporarily construct an artificial anus (34). The organ protecting member (1) includes a movement restricting part (support string (12)) configured to restrict movement of a portion of the lifted intestinal tract (32) on which the artificial anus (34) is constructed toward an abdominal cavity (35); and a cover (11) disposed between the intestinal tract (32) and an inner wall surface (36b) of the opening portion (36a) of the abdominal wall (30).

IPC Classes  ?

• A61F 5/449 - Body securing means, e.g. belts, garments

Abstract

A sealing resin composition according to the present invention contains an epoxy resin (A) and a curing agent (B) that includes a phenolic curing agent obtained from a plant-derived starting material.

IPC Classes  ?

• C08G 59/62 - Alcohols or phenols
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

Provided are: a catheter capable of indwelling a tubular indwelling tool at an indwelling target site in a lumen of a living body with high accuracy; and a delivery system. A catheter 1 for delivering a colonic stent 2 is provided with: a sheath 11; a long inner tube 12 that is configured so as to be movable in the sheath in the axis direction; a plurality of guide ribs 31 to 33 that are arranged apart from the inner tube in the axis direction; and linear members (a restraining strap 21 and a holding wire 22) that keep at least a portion of the colonic stent in the axis direction while releasing the colonic stent from the sheath. The plurality of guide ribs are arranged so as to become eccentric with respect to circumscribed circles of the guide ribs in a cross section orthogonal to the axis direction, each of the guide ribs has a tube-attaching part 40 to which the inner tube is attached and a guide part 50 through which the linear members are inserted, and the guide ribs are arranged so as to be displaced each other in the peripheral direction with respect to the inner tube.

IPC Classes  ?

• A61M 25/01 - Introducing, guiding, advancing, emplacing or holding catheters
• A61F 2/966 - Instruments specially adapted for placement or removal of stents or stent-grafts having an outer sleeve with relative longitudinal movement between outer sleeve and prosthesis, e.g. using a push rod

Abstract

The present invention relates to a novel reagent and a novel method both for detecting or measuring a serine protease in both of a free form and a conjugated form in a sample with high sensitivity and high accuracy. More specifically, the present invention relates to: a reagent for detecting or measuring a serine protease that can occur in a living body in a conjugated form with a counterpart conjugating molecule, the reagent comprising (A) a surfactant and (B) an antibody against the serine protease or an antigen-binding fragment thereof; and a detection or measurement of the serine protease using the reagent.

IPC Classes  ?

• G01N 33/573 - Immunoassay; Biospecific binding assay; Materials therefor for enzymes or isoenzymes
• C07K 16/40 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against enzymes
• C12M 1/34 - Measuring or testing with condition measuring or sensing means, e.g. colony counters
• G01N 33/543 - Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals

Abstract

An electrode for biosignal measurement (electrode (50) for measuring brain waves), the electrode to be brought into contact with a subject's skin (head (99)) to acquire a biosignal (brain wave signal), the electrode comprising: a protrusion (60) protruding from a base (51); an electrode portion (80) having a conductive member (70) and provided at least on the distal end of the protrusion (60); and a gel member (85) provided on the protrusion (60) so as to cover the electrode portion (80) and accommodating moisture on the inside.　

IPC Classes  ?

• A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
• A61B 5/256 - Wearable electrodes, e.g. having straps or bands
• A61B 5/266 - Bioelectric electrodes therefor characterised by the electrode materials containing electrolytes, conductive gels or pastes

Abstract

A method of manufacturing a sandwich panel (100) includes: a step of preparing a plurality of sheet-like prepregs (211); a step of performing a first heating and pressurization process through a release film (25) on upper and lower surfaces of a laminate where the plurality of prepregs (211) are laminated such that the laminate is integrated to obtain a composite facing material (40); and a step of disposing the composite facing material (40) on each of an upper surface side and a lower surface side of a sheet-like core layer (10) having a honeycomb structure and integrating the laminate through a second heating and pressurization process, in which a pressure of the first heating and pressurization process is higher than or equal to a pressure of the second heating and pressurization process.

IPC Classes  ?

• B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
• B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
• B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
• B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
• B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
• B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 3/12 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a layer of regularly-arranged cells whether integral or formed individually or by conjunction of separate strips, e.g. honeycomb structure

Abstract

This resin composition for injection molding includes at least one kind of wax (a) having a <80°C melting point.

IPC Classes  ?

• C08L 91/06 - Waxes
• B29C 45/17 - Component parts, details or accessories; Auxiliary operations
• B29C 45/26 - Moulds
• B29C 45/47 - Means for plasticising or homogenising the moulding material or forcing it into the mould using screws
• B29C 45/78 - Measuring, controlling or regulating of temperature
• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

A heat radiating substrate (10) (circuit board) includes: an insulating layer (11) (insulating substrate); and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which the circuit pattern (20) has a first circuit pattern formed in a first region on the insulating layer (11) and a second circuit pattern (120) formed in a second region on the insulating layer (11), and the first region (that is, the first circuit pattern) surrounds and closes the second region (that is, second circuit pattern (120)) when viewed in a top view.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

This flexible sheet electrode is provided with a flexible substrate and an elastomer electrode layer provided on a flexible substrate, wherein: the elastomer electrode layer is formed on the outside of the flexible substrate and has layering that includes an electroconductive elastomer layer; and when a 1000-cycle wear test is performed using the Martindale method E, the surface resistance ratio represented by R2/R0, where R0 represents the surface resistance value of the electroconductive elastomer layer before the wear test and R2 represents the surface resistance value of the electroconductive elastomer layer after the wear test, is 20 or below.

IPC Classes  ?

• A61B 5/256 - Wearable electrodes, e.g. having straps or bands
• A61B 5/265 - Bioelectric electrodes therefor characterised by the electrode materials containing silver or silver chloride
• A61B 5/274 - Connection of cords, cables or leads to electrodes using snap or button fasteners

Abstract

A heat radiating substrate includes an insulating layer (11) (insulating substrate) and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which a contour line of the circuit pattern (20) has a corner portion (27) that forms a curved line exhibiting a circular arc with a radius of 0.2 mm or more and 5 mm or less when viewed in a top view.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details

Abstract

The flexible sheet electrode according to the present invention is provided with a flexible base material and an elastomer electrode layer provided on the flexible base material, in which the elastomer electrode layer is formed outside the flexible base material and has a multilayer structure including an electroconductive elastomer layer, and the 100% tensile test force is 5.0 N to 10.0 N inclusive when the flexible sheet electrode is subjected to a tensile test in accordance with a prescribed procedure.

IPC Classes  ?

• A61B 5/256 - Wearable electrodes, e.g. having straps or bands
• A61B 5/265 - Bioelectric electrodes therefor characterised by the electrode materials containing silver or silver chloride
• A61B 5/274 - Connection of cords, cables or leads to electrodes using snap or button fasteners

Abstract

A polymer including a structural unit represented by formula (NB), a structural unit represented by formula (AD), and at least one structural unit selected from among structural units represented by formula (1-2) and structural units represented by formula (1-3). In formula (NB), R1, R2, R3, and R411 is 0, 1, or 2, and R13and R14are each independently a hydrogen atom or a C1-C3 alkyl group. In formula (AD), R11and R12are each independently a C1-C12, linear or branched alkyl group. In formula (1-2), Rpis a group having two or more (meth)acryloyl groups and R22is a hydrogen atom or a C1-C3 organic group. In formula (1-3), Rsis a group having one (meth)acryloyl group and R22 is a hydrogen atom or a C1-C3 organic group.

IPC Classes  ?

• C08F 232/08 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
• C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
• C08F 222/06 - Maleic anhydride
• C08F 222/12 - Esters of phenols or saturated alcohols
• C08F 222/26 - Esters of unsaturated alcohols
• C08F 290/12 - Polymers provided for in subclasses or
• G02B 5/20 - Filters
• G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

Abstract

A motor (100) includes a stator (6) having a plurality of tooth portions (7), a coil (9) wound around the tooth portions (7), and a slot (8) in which the coil (9) is formed between the tooth portions (7), in which the coil (9) is provided in the slot (8), and a cooling structure for the motor (100) includes a first resin composition with which the slot (8) is filled and which covers the coil (9), and a coil inner side cooling flow path (10) which is provided in a region filled with the first resin composition and extends in a rotating shaft direction, and in which a coolant circulates inside.

IPC Classes  ?

• H02K 3/24 - Windings characterised by the conductor shape, form or construction, e.g. with bar conductors with channels or ducts for cooling medium between the conductors
• H02K 9/19 - Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
• H02K 21/14 - Synchronous motors having permanent magnets; Synchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets rotating within the armatures

Abstract

Provided is a phenol resin composition for a friction material, including a component (A) of a silicone resin having a softening point of 140° C. or lower and a component (B) of a phenol resin.

IPC Classes  ?

• F16D 69/02 - Composition of linings

Abstract

A sandwich panel (100) comprises: a core layer (10) having a honeycomb structure; and cured products (40) of one or more layers of prepregs (20) provided on both sides of the core layer (10), wherein parts of the cured products (40) of the prepregs (20) penetrate into the core layer (10), and the number density of pinholes when observing the outermost surface of the sandwich panel (100) is 0-50/cm2.

IPC Classes  ?

• B32B 27/00 - Layered products essentially comprising synthetic resin
• B29C 43/20 - Making multilayered or multicoloured articles
• B29C 43/34 - Feeding the material to the mould or the compression means
• B32B 3/12 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a layer of regularly-arranged cells whether integral or formed individually or by conjunction of separate strips, e.g. honeycomb structure
• B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material

Abstract

A mold release film (100) according to the present invention has a structure in which the following are stacked in the stated order: a first mold release layer (11) forming one mold release surface; an intermediate layer (20); and a second mold release layer (12) forming the other mold release surface, wherein the intermediate layer (20) is formed from a resin composition for an intermediate layer that comprises a polyester resin.

IPC Classes  ?

• B32B 27/00 - Layered products essentially comprising synthetic resin
• B29C 33/68 - Release sheets
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• C08J 7/04 - Coating
• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

The present invention relates to a reagent for use in the diagnosis of acute respiratory distress syndrome, assessment of severity, prediction of onset or aggravation, and assessment of onset risk or aggravation risk. The reagent includes: an antibody to a complex, which is bonded to a neutrophil-derived protein or a corresponding binding molecule thereof; or an antigen-binding fragment of said antibody.

IPC Classes  ?

• G01N 33/53 - Immunoassay; Biospecific binding assay; Materials therefor
• A61P 11/00 - Drugs for disorders of the respiratory system
• A61P 31/04 - Antibacterial agents
• A61P 31/12 - Antivirals
• A61P 31/14 - Antivirals for RNA viruses
• A61P 31/16 - Antivirals for RNA viruses for influenza or rhinoviruses
• A61P 31/20 - Antivirals for DNA viruses
• C07K 16/18 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against material from animals or humans
• C07K 16/40 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against enzymes

Abstract

A paste-like resin composition according to the present invention includes silver-containing particles A, a solvent B, and a thermosetting resin C, and the difference between a Hansen solubility parameter a of the silver-containing particles A measured with the method described here and a Hansen solubility parameter b of the solvent B is 4.3 to 9.8. Method: In a 10 ml glass container, add 2 mL of any solvent selected from among the listed solvents for evaluation to 0.2 g of the silver-containing particles A, and after stirring for 5 seconds with a vortex mixer, visually evaluate dispersibility using the four levels listed here. Input the solvent for evaluation and the evaluation result for dispersibility in the solvent into the Sphere program of computer software HSPiP (version 5.2.02) and calculate the Hansen solubility parameter.　Solvents for evaluation: water, methanol, toluene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, acetone, acetonitrile, ethyl acetate, methyl ethyl ketone, 1-butanol, cyclohexanol, isopropyl alcohol　Evaluation: 0: Does not disperse. 1: Precipitation completes in less than 10 minutes. 2: Precipitation completes when 10 minutes or more, and less than 1 hour has passed. 3: Precipitation completes when 1 hour or more, and 12 hours or less have passed.

IPC Classes  ?

• C09J 11/04 - Non-macromolecular additives inorganic
• C08K 5/00 - Use of organic ingredients
• C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 21/52 - Mounting semiconductor bodies in containers
• C08K 3/08 - Metals

Abstract

This optical waveguide manufacturing method is characterized by comprising: a step for preparing an unexposed laminate in which a core formation layer, a base material, and a metallic plate are laminated in this order in a lamination direction; a step for irradiating a portion of the surface of the core formation layer with active radiation in the lamination direction to obtain an exposed laminate; and a step for heating the exposed laminate to obtain a core layer including a core portion and a side surface cladding portion from the core formation layer. It is desirable that the core formation layer be configured to include a polymer and a monomer, and cause a refractive index difference between the irradiated region and the unirradiated region by movement of the monomer by the irradiation with the active radiation.

IPC Classes  ?

• G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
• G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

Abstract

The present invention provides a medical device that has a structure with superior operability. A medical device (100) according to the present invention comprises: a long medical device body (10); a first operation wire (41) and a second operation wire (42) that each extend along the length direction of the medical device body (10); and an operation unit (70) that can pull the first operation wire (41) and the second operation wire (42) individually and can pull both simultaneously, wherein the first operation wire (41) and the second operation wire (42) are positioned in locations that are at opposite extremes from one another in a lateral cross-section of the medical device body (10). The distal end of the first operation wire (41) is fixed to a distal end section (10a) of the medical device body (10), and the distal end of the second operation wire (42) is fixed to the distal end section (10a) of the medical device body (10) in a location that is further toward the proximal end side than the distal end of the first operation wire (41).

IPC Classes  ?

• A61M 25/00 - Catheters; Hollow probes
• A61M 25/092 - Remote control of the orientation of the distal end
• A61M 25/098 - Arrangements for enabling the detection of the internal position of the catheter, e.g. radiographically using radio-opaque markers

Abstract

A brain wave measuring device (1) comprises: a frame (20) which is worn on the head (99) of a subject; an electrode part (10) which comes into contact with the head (99); and an elastic electrode-fixing member (70) which is attached to the frame (20) and to which the electrode part (10) is attached. When the frame (20) is worn on the head (99) and the electrode part (10) is pushed against the head (99), the electrode-fixing member (70) stretches along the shape of the head (99).

IPC Classes  ?

• A61B 5/256 - Wearable electrodes, e.g. having straps or bands
• A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]

Abstract

The present invention provides a flame-retardant insulating sheet which contains a polycarbonate resin and a flame retardant, wherein: the flame retardant is composed of a nitrogen-containing compound; and at least one surface of this flame-retardant insulating sheet has an arithmetic mean peak curvature (Spc) of 200 (1/mm) or more, a peak density (Spd) of 8,000 (1/mm2) or more, or a gloss at 60° of 25 or less. The present invention also provides an electrical/electronic device which uses this flame-retardant insulating sheet.

IPC Classes  ?

• H01B 17/56 - Insulating bodies
• C08K 3/04 - Carbon
• C08K 5/3477 - Six-membered rings

Abstract

A release film (10) according to the present invention has a release layer (1) constituting at least one release surface, the release layer (1) contains 30 mass% or more of a polyester resin, and requirement 1 mentioned below is satisfied. (Requirement 1) When the modulus of storage elasticity of the release film (10) at 70ºC as measured using a dynamic viscoelasticity measurement device (tensile mode, frequency of 1 Hz, temperature increase rate of 5ºC/min) is denoted by A1, and the modulus of storage elasticity after the release film 10 has been treated at 175ºC for 120 seconds at 2 MPa is denoted by A2, the release film (10) satisfies the relationship of A2/A1 ≥ 1.2.

IPC Classes  ?

• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• C08J 5/18 - Manufacture of films or sheets
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided is a phenolic resin composition which is a liquid and which is used for impregnating or coating an organic fiber base material, and which is obtained by means of: a step for reacting a phenol compound that is a starting substance with an aldehyde compound in the presence of a basic catalyst under the condition that the [aldehyde compound]/[phenol compound] molar ratio is 0.8-3.0 to produce a resol-type phenolic resin; and a step for adding glycine to the resol-type phenolic resin in an amount of not less than 0.01 moles and less than 1.0 moles relative to 1 mole of the phenol compound that is a starting substance, thereby producing the phenolic resin composition.

IPC Classes  ?

• C08G 8/04 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes
• C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

Abstract

In a heat-sink-equipped circuit board (50), a semiconductor layer (30) (circuit layer) which constitutes a circuit and a heat sink (10) which is provided with a plate-shaped base plate (11) are integrated with an insulating layer (20) therebetween. Circuit gaps in the semiconductor layer (30) are filled with an encapsulation resin (40), and the top surface of the semiconductor layer (30) and the top surface of the encapsulation resin (40) are substantially flush.

IPC Classes  ?

• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H05K 1/02 - Printed circuits - Details
• H05K 1/05 - Insulated metal substrate
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

2233 ratio of the zeolite being 7-500. Another embodiment of the method for producing a cyclic compound of the present invention is characterized by having a step for obtaining a cyclic compound by applying, to a starting material containing a cyclic carboxylic acid compound, a heat treatment for heating in the presence of a non-solid acid, thereby causing a decarboxylation reaction in the cyclic carboxylic acid compound.

IPC Classes  ?

• C07B 59/00 - Introduction of isotopes of elements into organic compounds
• B01J 27/053 - Sulfates
• B01J 29/08 - Crystalline aluminosilicate zeolites; Isomorphous compounds thereof of the faujasite type, e.g. type X or Y
• B01J 29/18 - Crystalline aluminosilicate zeolites; Isomorphous compounds thereof of the mordenite type
• B01J 29/40 - Crystalline aluminosilicate zeolites; Isomorphous compounds thereof of the pentasil type, e.g. types ZSM-5, ZSM-8 or ZSM-11
• B01J 29/60 - Crystalline aluminosilicate zeolites; Isomorphous compounds thereof of the type L
• B01J 29/65 - Crystalline aluminosilicate zeolites; Isomorphous compounds thereof of the ferrierite type, e.g. types ZSM-21, ZSM-35 or ZSM-38
• B01J 29/70 - Crystalline aluminosilicate zeolites; Isomorphous compounds thereof of types characterised by their specific structure not provided for in groups
• B01J 31/04 - Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing carboxylic acids or their salts
• C07B 61/00 - Other general methods
• C07C 37/50 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions decreasing the number of carbon atoms
• C07C 39/04 - Phenol
• C07C 39/08 - Dihydroxy benzenes; Alkylated derivatives thereof
• C07C 209/68 - Preparation of compounds containing amino groups bound to a carbon skeleton from amines, by reactions not involving amino groups, e.g. reduction of unsaturated amines, aromatisation, or substitution of the carbon skeleton
• C07C 211/46 - Aniline

Abstract

The present invention provides a thermosetting resin composition used to form a seal member (65) in a stator (4) having: a stator core (41) that has a plurality of teeth (7) and a plurality of slots (8) formed in an alternating manner in the circumferential direction; a coil (9) that is wound in each slot (8) and accommodated in each slot (8), and has a pair of coil ends that protrude respectively on the two axial sides from the stator core (41); and the seal member (65) that is provided in each slot (8) so as to cover the coil (9). The thermosetting resin composition contains an epoxy resin, a curing agent, and an inorganic filling material, and has a minimum melt viscosity of 40 Pa·s or less.

IPC Classes  ?

• H02K 3/34 - Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation
• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• H02K 15/12 - Impregnating, heating or drying of windings, stators, rotors or machines

Abstract

A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle θ formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

There is provided a thermally conductive sheet with a metal plate including: a metal plate; and a thermally conductive sheet laminated on the metal plate and containing a thermosetting resin and boron nitride particles, in which an average particle size of the boron nitride particles is 10 μm or more and 100 μm or less, and an amount of warpage of the thermally conductive sheet when the metal plate is removed is 0.15 mm or more and 1.30 mm or less.

IPC Classes  ?

• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
• B32B 37/20 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
• B32B 38/00 - Ancillary operations in connection with laminating processes

Abstract

This mold for molding a resin layer (mold portion (20)) on a surface of a tooth portion (7) inside a slot (8), comprises a blade portion (120) which is received inside the slot (8) and which has both end portions arranged outside the slot (8), mold piece parts (121), (122) that respectively support the both end portions of the blade portion (120), and a guide portion (first and second guide portions (104), (106) and guide screws (125)) that guides the mold piece parts (121), (122) to thereby bring the blade portion (120) in the slot (8) to an appropriate position. The tooth portion (7) has, at a distal end thereof or near the distal end, a wide area (distal-end protruding portion (71)) that is widened toward the slot (8) side. The remaining space inside the slot (8) where the blade portion (120) is received is filled with a resin material and the resin material is cured to thereby form the mold portion (20).

IPC Classes  ?

• H02K 15/12 - Impregnating, heating or drying of windings, stators, rotors or machines
• H02K 1/04 - DYNAMO-ELECTRIC MACHINES - Details of the magnetic circuit characterised by the material used for insulating the magnetic circuit or parts thereof
• H02K 15/02 - Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies

Abstract

A method for manufacturing an optical waveguide of the present invention is characterized by comprising: a step (S102) for preparing a pre-exposure laminate comprising a base material, and a core forming layer stacked on the base material; a step (S104) for irradiating the core forming layer with active radiation to obtain a post-exposure laminate comprising a core layer including a core portion corresponding to a non-irradiation region of the active radiation, and a side cladding portion corresponding to an irradiation region of the active radiation, and the base material supporting the core layer; a step (S106) for stacking a cladding layer on the core layer of the post-exposure laminate to obtain a workpiece; and a step (S108) for cutting out an optical waveguide from the workpiece, wherein the irradiation region extends along an outer edge of the core forming layer, and includes a frame portion having a frame shape, and the area of the irradiation region is 20% or more of the entire core forming layer.

IPC Classes  ?

• G02B 6/138 - Integrated optical circuits characterised by the manufacturing method by using polymerisation
• G02B 6/132 - Integrated optical circuits characterised by the manufacturing method by deposition of thin films

Abstract

The translucent resin sheet according to the present invention is used for a cover member (1) disposed so as to cover a window of a storage body. The storage body stores a light source which emits light, and includes the window from which light from the light source is projected toward the outside. This translucent resin sheet (cover member (1)) has: a resin layer (3) formed using a resin material as a main material; and a coat layer (5) laminated on at least one surface of the resin layer (3). The coat layer (5) contains a curable resin and an ultraviolet-absorbing agent. The change in color of the translucent resin sheet as measured in accordance with ISO 11664-4 is less than 5.0 [ΔE], the measurement being conducted after subjecting the coat layer (5) to 600 hours of ultraviolet radiation using a xenon weather meter in accordance with Table 3 of JIS K 7350-2, Method A, Cycle No. 3.

IPC Classes  ?

• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• B60K 35/00 - Arrangement or adaptations of instruments
• F21V 3/06 - Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material

Abstract

An optical waveguide manufacturing method according to the present invention includes: a step for preparing a sheet-like workpiece that has a core layer containing a core-section forming region; and a step for cutting out an optical waveguide from, of the workpiece, inside the core-section forming region. The core layer is characterized by satisfying all of (a), (b), and (c) below.　(a) The core layer contains a polymer and a monomer and has a refractive index distribution based on the concentration difference of the monomer or the concentration difference of a structure originating from the monomer.　(b) The core-section forming region includes: a plurality of first core sections; second core sections provided on either side of each of the first core sections; and first side-surface clad sections provided between the first core sections and the second core sections. In addition, the core-section forming region is defined so that the plurality of second core sections are positioned at outer edges of the core-section forming region.　(c) The core-section forming region is a region in which the total area ratio accounted for by the first core sections and the second core sections in a 1-mm square area is equal to or greater than 50%.

IPC Classes  ?

• G02B 6/132 - Integrated optical circuits characterised by the manufacturing method by deposition of thin films
• G02B 6/122 - Basic optical elements, e.g. light-guiding paths

Abstract

A stator having a yoke, teeth extending from the yoke, coils accommodated in slots formed between the teeth, and cooling water channels (200) for cooling the coils, wherein the cooling water channels (200) include in-coil water channels (301) arranged between one end and the other end in the axial direction to cool the coils, and header water channels (310) that are connected to the plurality of in-coil water channels (301), arranged outside the coils, and distribute cooling water introduced into the in-coil water channels (301) or collect the cooling water discharged from the in-coil water channels (301), and where the total cross-sectional area of the in-coil water channels (301) is S1, and the cross-sectional area of the plane perpendicular to the movement direction of the cooling water in the header water channels (310) is S2, the ratio S2/S1 between S1 and S2 is 0.5 or more.

IPC Classes  ?

• H02K 9/19 - Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
• H02K 11/30 - Structural association with control circuits or drive circuits

Abstract

A rotor-fixing resin composition according to the present invention is used for forming a fixing member in a rotor comprising a rotor core that is fixed to a rotary shaft and is provided with a plurality of holes arranged along the periphery of the rotary shaft, magnets inserted in the holes, and the fixing member disposed in a separation part between the holes and magnets. This resin composition comprises an epoxy resin, an imidazole curing agent, and an inorganic filler and has a spiral flow retention ratio, measured under the following conditions, of at least 70%. Conditions: A flow length measured by carrying out a spiral flow measurement on the resin composition at a die temperature of 175°C, an injection pressure of 6.9 MPa, and a cure time of 120 seconds is defined as L1. The resin composition is then stored for 6 months at 25°C. After storage, a flow length measured by carrying out a spiral flow measurement on the resin composition at a die temperature of 175°C, an injection pressure of 6.9 MPa, and a cure time of 120 seconds is defined as L2. The spiral flow retention ratio (%) is calculated using the following formula from the flow lengths L1 and L2. Formula: Spiral flow retention ratio (%) = (L2/L1) × 100.

IPC Classes  ?

• C08G 59/50 - Amines
• B29B 7/42 - Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with single shaft with screw or helix
• B29B 9/06 - Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

Resin-adhered graphite particles are obtained by causing a modified novolac-type phenolic resin to adhere to graphite particles. At least part of surfaces of the graphite particles is coated with a carbonaceous coating by heating the resin-adhered graphite particles in a non-oxidizing atmosphere at 900 to 1,500° C. to carbonize the modified novolac-type phenolic resin. Arylene groups having hydroxy groups account for 5 to 95 mol % of arylene groups constituting the modified novolac-type phenolic resin. The obtained carbonaceous substance-coated graphite particles exhibit excellent battery properties when used as a negative electrode material for a lithium ion secondary battery.

IPC Classes  ?

• H01M 4/583 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx
• H01M 4/04 - Processes of manufacture in general
• H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
• H01M 4/02 - Electrodes composed of, or comprising, active material

Abstract

A cover tape (10) for electronic component packaging comprises a base layer (3) and a sealant layer (2) that is layered on one side of the base layer (3), wherein the sealant layer (2) includes (A) a (meth)acrylate copolymer and (B) a petroleum resin.

IPC Classes  ?

• B65D 85/86 - Containers, packaging elements or packages, specially adapted for particular articles or materials for electrical components

Abstract

The present invention provides: a photosensitive resin composition which contains (A) a polyimide resin, (B) a multifunctional (meth)acrylate compound, (C) a sensitizing agent and (D) a polymerization inhibitor, wherein the polyimide resin (A) comprises a structure that is represented by general formula (a) (in general formula (a), X represents a divalent organic group, and Y represents a tetravalent organic group); an electronic device which is provided with an insulating layer that is formed of this photosensitive resin composition; and a light device which is provided with an insulating layer that is formed of this photosensitive resin composition.

IPC Classes  ?

• G03F 7/037 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
• G03F 7/004 - Photosensitive materials
• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• G03F 7/031 - Organic compounds not covered by group
• G03F 7/075 - Silicon-containing compounds
• G03F 7/20 - Exposure; Apparatus therefor

Abstract

The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound. The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.

IPC Classes  ?

• C08G 69/36 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines, and polycarboxylic acids

Abstract

The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m·K) or higher.

IPC Classes  ?

• C08K 3/38 - Boron-containing compounds
• C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Abstract

Provided is a brain wave detection electrode (50) which comes into contact with the scalp of a subject to detect brain waves, and is provided with a base part (51), a plurality of cone-shaped protruding parts (60) that protrude from the base part (51), and electrode parts respectively arranged on the protruding parts (60), in which the distance D1 between most adjacent two protruding parts (60) among the plurality of protruding parts (60) satisfies formula (1).　(1): D1 < L(m2+n2)1/2-d or D1 > L(m2+n2)1/2+d In the formula, each of m and n represents an integer of 0 or more, in which one of m and n is 1 or more; L represents the distance between centers of pores of the scalp of the subject; and d represents the diameter of a pore of the scalp of the subject.

IPC Classes  ?

• A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
• A61B 5/256 - Wearable electrodes, e.g. having straps or bands

Abstract

This brain wave detection electrode detects brain waves by making contact with the head of a subject. The brain wave detection electrode has: a base section; a plurality of protruding sections protruding from the base section; and electrode sections provided in the protruding sections. The protruding sections are elastic bodies and have a pyramid shape. The following satisfy formula (1): the number N of the protruding sections, the height H of the pyramid of the protruding sections, the width D of the pyramid of the protruding sections, the load F acting on the plurality of protruding sections, the pressure P acting on the region in which the tips of the protruding sections are in contact with the head when the load F acts, and the thickness h of the head hair of the subject. K takes the following value depending on the shape of the pyramid. Formula (2)

IPC Classes  ?

• A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
• A61B 5/256 - Wearable electrodes, e.g. having straps or bands

Abstract

The present invention provides a conductive paste which contains silver-containing particles and a sintering accelerator that accelerates sintering of the silver-containing particles. With respect to this conductive paste, the sintering accelerator contains a compound that is represented by formula (1) or formula (2). (In formula (1), m represents an integer of 1 to 20.) (In formula (2), n represents an integer of 1 to 20.)

IPC Classes  ?

• H01L 21/52 - Mounting semiconductor bodies in containers
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

This method for manufacturing a stator (10) has a teeth fixing step for attaching a plurality of teeth (30), which are separately provided from a cylindrical yoke (20) and around which a coil (50) is wound, to the yoke (20) so that the plurality of teeth protrude on a cylindrical circumferential surface (23) of the yoke (20) toward the radial center of the yoke, wherein in the teeth (30), a region (teeth resin cover section (37)) around which the coil (50) is wound is covered by a first cured material of a first resin composition.

IPC Classes  ?

• H02K 15/10 - Applying solid insulation to windings, stators or rotors
• H02K 1/18 - Means for mounting or fastening magnetic stationary parts on to, or to, the stator structures
• H02K 3/34 - Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation
• H02K 15/06 - Embedding prefabricated windings in machines

Abstract

A microchannel chip (1) comprises: a resin substrate (2) manufactured using a mold formed by direct carving machining, and having a channel groove (21) on one surface thereof; and a covering material (3) bonded to the resin substrate (2) so as to cover the channel groove (21). In the resin substrate (2), the roundness of a corner portion (2c) formed at a boundary between a bonded surface (2a) to the covering material (3) and an inner side surface (2b) defining the channel groove (21) is equal to or less than R 5 μｍ.

IPC Classes  ?

• B81B 1/00 - Devices without movable or flexible elements, e.g. microcapillary devices
• B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
• B29C 45/26 - Moulds
• G01N 37/00 - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES - Details not covered by any other group of this subclass

Abstract

This laminate plate (2) has: an insulating layer (20); a first metal layer (21) provided on one surface of the insulating layer (20); and a second metal layer (22) provided on the other surface of the insulating layer (20), the laminate plate having a rectangular shape when viewed from the top, wherein the surface side of the first metal layer (21) and the surface side of the second metal layer (22) are concavely bent, and the concavely bent amount (δ1) is 0.1-1.0 mm inclusive.

IPC Classes  ?

• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
• B30B 7/00 - Presses characterised by a particular arrangement of the pressing members
• B32B 7/025 - Electric or magnetic properties
• H05K 1/03 - Use of materials for the substrate

Abstract

This photosensitive resin composition contains a polyimide (A) having an imide ring structure, a polyfunctional (meth)acrylate compound (B), a photosensitive agent (C), and a solvent (J). In the photosensitive resin composition, at least the polyimide (A) having an imide ring structure and the polyfunctional (meth)acrylate compound (B) are preferably dissolved in the solvent (J).

IPC Classes  ?

• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• G03F 7/037 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Abstract

220220 of the cured film at 220°C is 0.5-3.0 GPa. [Conditions] Frequency: 1 Hz Temperature: 30-300°C Temperature elevation rate: 5 °C/minute Measurement mode: Tensile mode

IPC Classes  ?

• C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
• C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• G03F 7/028 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
• G03F 7/032 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
• G03F 7/037 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Abstract

A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields