The mold release film has a multilayer structure in which a mold release layer, a first base material layer, and a second base material layer are laminated. The mold release layer constitutes a mold release surface, and the second base material layer constitutes a surface of the mold release film on an opposite side of the mold release surface. The mold release layer contains one or two or more selected from a silicone resin, a fluororesin, a melamine resin, an epoxy resin, and a phenolic resin. The first base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin. The second base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyimide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl Group (provided that N-methyl-2-pvrrolidone is excluded), and the amount or the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.
Provided is a thermally-conductive resin composition containing a thermosetting resin and boron nitride particles, in which, in a case where a void fraction of the boron nitride particles relative to a compression pressure is measured, a void fraction at a compression pressure of 4 MPa is 30% or more and 60% or less, and a void fraction at a pressure of 8 MPa is 20% or more and 50% or less.
A stator (4) has a stator core having a plurality of tooth portions (7), a slot (8) provided between the tooth portions (7) and accommodating a coil (9), and the coil (9) accommodated in the slot (8), the stator has a resin layer (50) provided on an inner surface of the slot (8) and made of an insulating resin composition, a wall surface (a resin layer surface (55) of an inner resin layer (51)) of the resin layer (50) on an inner side of the slot (8) is provided in parallel with a rotating shaft direction, the resin composition of the resin layer (50) contains a thermosetting resin, and the thermosetting resin has a glass transition temperature Tg of 120° C. or higher.
H02K 3/34 - Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation
H02K 3/30 - Windings characterised by the insulating material
H02K 21/14 - Synchronous motors having permanent magnets; Synchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets rotating within the armatures
H02K 15/10 - Applying solid insulation to windings, stators or rotors
H02K 15/12 - Impregnating, heating or drying of windings, stators, rotors or machines
Provided is a water soluble resol-type phenol resin, in which an unreacted phenol content is 0.1% by mass or less and an unreacted aldehyde content is 0.1% by mass or less.
C08G 8/10 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
6.
RESIN MOLDING MATERIAL, MOLDED PRODUCT, AND METHOD FOR PRODUCING MOLDED PRODUCT
A resin molding material of the present invention is used for transfer molding or compression molding, the resin molding material containing (A) soft magnetic particles, (B) a silicone compound which is liquid at normal temperature (25° C.) , and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass.
C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
7.
RESIN MOLDING MATERIAL, MOLDED PRODUCT, AND METHOD FOR PRODUCING MOLDED PRODUCT
A resin molding material of the present invention contains (A) soft magnetic particles, (B) a silica fine powder having an average particle diameter of equal to or more than 0.1 μm and equal to or less than 2.0 μm, and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass, and a content of the silica fine powder (B) is equal to or less than 1.5% by mass.
A powder coating material used for a powder coating method including a step of immersing a coil end of a coil, which includes a conductor portion coated with an insulating coating and an exposed portion where the conductor portion is exposed from the insulating coating, in a fluidized chamber in which a powder coating material flows, and adhering a melt of the powder coating material to an outside of the exposed portion, the powder coating material containing a particulate thermosetting resin composition. The thermosetting resin composition contains an epoxy resin, and a curing agent.
A power module (10) includes a power semiconductor chip (1) and a Cu circuit (3) having the power semiconductor chip (1) provided on one surface. The power module (10) includes: a sintering layer (2) joining the power semiconductor chip (1) and the Cu circuit (3) by using a sintering paste; and a heat dissipation sheet (4) provided for joining a Cu base plate (5) to the other surface of the Cu circuit (3), in which in a first laminated structure in which the power semiconductor chip (1), the sintering layer (2), the Cu circuit (3), and the heat dissipation sheet (4) are laminated, the total thermal resistance XA in the direction of lamination is equal to or less than 0.30 (K/W).
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H05K 1/09 - Use of materials for the metallic pattern
H01L 23/04 - Containers; Seals characterised by the shape
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied.
The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied.
Y≥0.4X−25 (1)
The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied.
Y≥0.4X−25 (1)
50≥Y≥3 (2)
The present invention provides a microchannel chip including: a resin substrate in which a channel groove is formed on at least one surface of the resin substrate; and a resin film which has a base layer and a pressure-sensitive adhesive layer and is bonded to the resin substrate such that the pressure-sensitive adhesive layer covers the channel groove, in which when a thickness of the base layer of the resin film is defined as X (μm), and a thickness of the pressure-sensitive adhesive layer of the resin film is defined as Y (μm), all of Relational Expressions (1) to (3) are satisfied.
Y≥0.4X−25 (1)
50≥Y≥3 (2)
X≥40 (3)
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 7/02 - Physical, chemical or physicochemical properties
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
This organ protecting member (1) is used when an opening portion (36a) is formed in an abdominal wall (30) and an intestinal tract (32) is exposed to a body surface (33) from the opening portion (36a) to temporarily construct an artificial anus (34). The organ protecting member (1) includes a movement restricting part (support string (12)) configured to restrict movement of a portion of the lifted intestinal tract (32) on which the artificial anus (34) is constructed toward an abdominal cavity (35); and a cover (11) disposed between the intestinal tract (32) and an inner wall surface (36b) of the opening portion (36a) of the abdominal wall (30).
A method of manufacturing a sandwich panel (100) includes: a step of preparing a plurality of sheet-like prepregs (211); a step of performing a first heating and pressurization process through a release film (25) on upper and lower surfaces of a laminate where the plurality of prepregs (211) are laminated such that the laminate is integrated to obtain a composite facing material (40); and a step of disposing the composite facing material (40) on each of an upper surface side and a lower surface side of a sheet-like core layer (10) having a honeycomb structure and integrating the laminate through a second heating and pressurization process, in which a pressure of the first heating and pressurization process is higher than or equal to a pressure of the second heating and pressurization process.
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 3/12 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a layer of regularly-arranged cells whether integral or formed individually or by conjunction of separate strips, e.g. honeycomb structure
A heat radiating substrate (10) (circuit board) includes: an insulating layer (11) (insulating substrate); and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which the circuit pattern (20) has a first circuit pattern formed in a first region on the insulating layer (11) and a second circuit pattern (120) formed in a second region on the insulating layer (11), and the first region (that is, the first circuit pattern) surrounds and closes the second region (that is, second circuit pattern (120)) when viewed in a top view.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
A heat radiating substrate includes an insulating layer (11) (insulating substrate) and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which a contour line of the circuit pattern (20) has a corner portion (27) that forms a curved line exhibiting a circular arc with a radius of 0.2 mm or more and 5 mm or less when viewed in a top view.
A motor (100) includes a stator (6) having a plurality of tooth portions (7), a coil (9) wound around the tooth portions (7), and a slot (8) in which the coil (9) is formed between the tooth portions (7), in which the coil (9) is provided in the slot (8), and a cooling structure for the motor (100) includes a first resin composition with which the slot (8) is filled and which covers the coil (9), and a coil inner side cooling flow path (10) which is provided in a region filled with the first resin composition and extends in a rotating shaft direction, and in which a coolant circulates inside.
H02K 3/24 - Windings characterised by the conductor shape, form or construction, e.g. with bar conductors with channels or ducts for cooling medium between the conductors
H02K 9/19 - Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
H02K 21/14 - Synchronous motors having permanent magnets; Synchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets rotating within the armatures
Provided is a phenol resin composition for a friction material, including a component (A) of a silicone resin having a softening point of 140° C. or lower and a component (B) of a phenol resin.
A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle θ formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.
There is provided a thermally conductive sheet with a metal plate including: a metal plate; and a thermally conductive sheet laminated on the metal plate and containing a thermosetting resin and boron nitride particles, in which an average particle size of the boron nitride particles is 10 μm or more and 100 μm or less, and an amount of warpage of the thermally conductive sheet when the metal plate is removed is 0.15 mm or more and 1.30 mm or less.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/20 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
B32B 38/00 - Ancillary operations in connection with laminating processes
19.
Method for producing carbonaceous substance-coated graphite particles
Resin-adhered graphite particles are obtained by causing a modified novolac-type phenolic resin to adhere to graphite particles. At least part of surfaces of the graphite particles is coated with a carbonaceous coating by heating the resin-adhered graphite particles in a non-oxidizing atmosphere at 900 to 1,500° C. to carbonize the modified novolac-type phenolic resin. Arylene groups having hydroxy groups account for 5 to 95 mol % of arylene groups constituting the modified novolac-type phenolic resin. The obtained carbonaceous substance-coated graphite particles exhibit excellent battery properties when used as a negative electrode material for a lithium ion secondary battery.
The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.
The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.
C08G 69/36 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines, and polycarboxylic acids
21.
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m·K) or higher.
A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.
A solid resin molding material according to the present invention includes a thermosetting resin (A), a curing agent (B), a carboxylic acid-based dispersant (C), and magnetic particles (D).
A thermosetting resin composition, which constitutes at least a part of a heat-dissipating insulating member interposed between a heat-generating body and a heat-dissipating body, includes (A) an epoxy resin, (B) a thermosetting resin (excluding epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound.
A biomedical electrode according to the present invention includes: a plate-shaped support portion; an elastic pillar portion that is provided on a first surface of the plate-shaped support portion; and a conductive resin layer that is formed to cover a distal end of the elastic pillar portion, in which when measured at 37° C. according to JIS K 6253 (1997), a type A durometer hardness of a surface of the elastic pillar portion is higher than 35 and 65 or lower.
An optical sheet 10 of the present invention includes a laminate including a polarizing layer 4 containing at least one kind of a light absorbing agent and having a polarizing function, and a protective layer 1 laminated on the polarizing layer 4, in which in the polarizing layer 4, a value of a* is 0 or more and 30 or less and a value of b* is 0 or more and 30 or less in an L*a*b* color system defined by JIS Z 8781-4, and in the optical sheet 10, a size of a Q Blue value defined by Australian Standard Australia/New Zealand Standard 1067-2016 is 0.70 or more. Thus, even when the optical sheet is toned to brown, blue light can be distinguished with excellent distinguishability.
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
G02C 7/10 - Filters, e.g. for facilitating adaptation of the eyes to the dark; Sunglasses
Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.
H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
28.
GAS BARRIER STRUCTURE, AIR CONDITIONER PART, GAS METERING APPARATUS, AND AUTOMOTIVE PART
A structure (piping part (121)) has a cured product of a thermosetting resin composition (resin molded body (101)) and a plating layer (103) formed on a surface of the cured product, in which the plating layer (103) has a Cu layer (second plating layer (107)) and a thickness of the Cu layer (second plating layer (107)) is 2 μm or more and 50 μm or less.
F16L 9/147 - Compound tubes, i.e. made of materials not wholly covered by any one of the preceding groups comprising only layers of metal and plastics with or without reinforcement
29.
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m·K) or higher. In addition, a volume resistivity R200 of the cured product at 200° C. is preferably 1.0×1010 Ω·m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
30.
BIOMEDICAL ELECTRODE, BIOMEDICAL SENSOR, AND BIOMEDICAL SIGNAL MEASUREMENT SYSTEM
A biomedical electrode according to the present invention includes: a plate-shaped support portion; a pillar portion that protrudes from a first surface of the plate-shaped support portion and is formed of an insulating silicone rubber; and a conductive resin layer that is provided to cover a distal end portion of the pillar portion and is formed of a conductive silicone rubber, in which the insulating silicone rubber of the pillar portion is formed of a cured product of an insulating silicone rubber-based curable composition including a non-conductive filler and a vinyl group-containing organopolysiloxane, and the conductive silicone rubber of the conductive resin layer is formed of a cured product of a conductive silicone rubber-based curable composition including a conductive filler, a non-conductive filler and a vinyl group-containing organopolysiloxane.
Provided is an encapsulating resin composition that is used for collectively encapsulating a circuit board (10) and at least a part of a connector portion (20), in which the encapsulating resin composition contains a curing accelerator, the connector portion (20) includes a terminal (21) that electrically connects the circuit board (10) with the external device, and a housing (22) that is disposed on an outer periphery of the terminal (21) and is encapsulated by the encapsulating resin composition, the housing (22) contains a thermoplastic resin, and in a differential scanning calorimetry (DSC) curve of the encapsulating resin composition obtained in a case where a temperature is increased from 30° C. to 200° C. under conditions of a temperature increase rate of 10° C./min using a DSC meter, a maximum heat release peak temperature is equal to or higher than 100° C. and equal to or lower than 163° C., and a half-value width of a maximum heat release peak is equal to or higher than 5° C. and equal to or lower than 25° C.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
A phenol resin composition used in a resin molded body for which a plating process is applied to a surface includes component (A), which is phenol resin and component (B), which is calcium carbonate.
A thermosetting resin composition used in a resin molded body for which a plating process is applied to a surface includes component (A), which is a thermosetting resin, and component (B), which is core-shell-type elastomer particles.
C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 51/04 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
According to the present invention, A resin material including a phenolic resin and a dicyandiamide polymer finely dispersed in the phenolic resin; and a method for producing a resin material including a phenolic resin and a dicyandiamide polymer dispersed in the phenolic resin, the method including a step of preparing a resin composition including the phenolic resin and dicyandiamide and a step of heating the resin composition to polymerize the dicyandiamide and form the dicyandiamide polymer are provided.
A resin composition for forming a magnetic member of the present invention, which is used for compression molding, includes a thermosetting resin, magnetic particles, and non-magnetic particles having a lower specific gravity and a smaller cumulative 50% particle diameter D50 than the magnetic particles, in which the resin composition for forming a magnetic member is solid at 25° C.
C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
H01F 1/28 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
RESEARCH INSTITUTE OF INNOVATIVE TECHNOLOGY FOR THE EARTH (Japan)
Inventor
Murata, Ryuichi
Inoue, Yusuke
Fujiwara, Daisuke
Tachibana, Kenya
Miyauchi, Hiroyuki
Abstract
There is provided a water-soluble additive composition including a cyclic carboxylic acid, the water-soluble additive composition satisfying at least one of the following Conditions 1 to 4: (Condition 1) component (A) the cyclic carboxylic acid, which is other than the following component (B1), and component (B1) one or more selected from the group consisting of gallic acid and an ester thereof are included; (Condition 2) the total content of Na+ and NH4+ is equal to or more than 100 ppm and equal to or less than 5000 ppm with respect to the cyclic carboxylic acid; (Condition 3) the total inorganic ion content (excluding hydrogen ions and hydroxyl group ions) is equal to or more than 300 ppm and equal to or less than 5000 ppm with respect to the cyclic carboxylic acid; and (Condition 4) component (A) the cyclic carboxylic acid, which is other than the following component (B2), and component (B2) an amino acid are included.
The resin composition for forming a magnetic member of the present invention, which is used for a transfer molding, includes a thermosetting resin and iron-based particles, in which the iron-based particles include iron-based amorphous particles.
H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
38.
SILICONE RUBBER-BASED CURABLE COMPOSITION,STRUCTURE, WEARABLE DEVICE, AND METHOD FOR MANUFACTURING STRUCTURE
A silicone rubber-based curable composition of the present invention include a vinyl group-containing organopolysiloxane (A) and silica particles (C), in which a ratio of change in a cut length, in a test piece formed of a cured product of the silicone rubber-based curable composition with the number of times of bending of 50,000, in a case where the test piece is used to perform a De Mattia-type bending resistance test in accordance with JIS K 6260 and the cut length is measured on the basis of a predetermined procedure, is equal to or more than 1.1 and equal to or less than 11.5.
A silicone rubber-based curable composition according to the present invention includes an organopolysiloxane including a vinyl group-containing organopolysiloxane (A), and an inorganic filler including silica particles (C), in which in a 1H-NMR spectrum of the silicone rubber-based curable composition, a first peak derived from a vinyl group is present, a vinyl group index is equal to or less than 3.5×10−1% by mole, and a content of the inorganic filler satisfies a range of equal to or more than 5 parts by weight and equal to or less than 60 parts by weight with respect to 100 parts by weight of the organopolysiloxane.
A multilayer film, including: a barrier layer in which an unstretched first film layer containing a first resin, and an unstretched second film layer containing a second resin different from the first resin are alternately and repeatedly laminated; a pair of unstretched first outer layers sandwiching the barrier layer; and a pair of unstretched second outer layers sandwiching the pair of unstretched first outer layers, wherein the average thickness per layer of the first film layers is 10 to 1,000 nm, and the lamination number of the first film layers in the barrier layer is in the range of 50 to 5,000.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B65D 75/36 - Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages
An optical sheet of the present invention is an optical sheet used by being disposed on a surface of an optical member having light transmitting properties, the optical sheet including a pair of base materials having light transmitting properties, and a half mirror layer provided between the pair of base materials, which transmits a part of incident light and reflects the rest of the incident light. The base material positioned on an opposite side to the optical member among the pair of base materials include a coloring material.
A resin composition of the present invention is used in an optical layer 10 provided with a first layer (base material layer 1) including a polycarbonate-based resin and a visible light absorber for forming the first layer. The visible light absorber includes a plurality of kinds of light absorbers, and a melting point of a first light absorber having the lowest melting point is equal to or higher than 200° C., in which a melting point of a second light absorber having the highest melting point is equal to or lower than 330° C. The resin composition is such that the viscosity at 260° C. obtainable when a shear rate is 243.2 [1/sec] is equal to or more than 400 Pa·s and equal to or less than 3500 Pa·s.
C08L 69/00 - Compositions of polycarbonates; Compositions of derivatives of polycarbonates
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
According to the present invention, there is provided a resin composition for sealing containing (A) an epoxy resin; (B) a curing agent; and (C) a filler, wherein the epoxy resin (A) includes an epoxy resin (A-1) having a naphthyl ether skeleton, and wherein the resin composition for sealing satisfies the following Formula (1): Formula (1) E2×(α2×10−6)×(175−Tg)×η2≤0.3
According to the present invention, there is provided a resin composition for sealing containing (A) an epoxy resin; (B) a curing agent; and (C) a filler, wherein the epoxy resin (A) includes an epoxy resin (A-1) having a naphthyl ether skeleton, and wherein the resin composition for sealing satisfies the following Formula (1): Formula (1) E2×(α2×10−6)×(175−Tg)×η2≤0.3
wherein, in Formula (1), Tg (° C.) is a glass transition temperature of a cured product of the resin composition for sealing,
α2 (ppm/° C.) is a coefficient of linear expansion over a range from 190° C. to 230° C. of the cured product, and
E2 (MPa) is a hot elastic modulus at 260° C. of the cured product, and
η2 (MPa) is a rectangular pressure at 175° C. of the resin composition for sealing as measured by the following method;
(method)
the resin composition for sealing is injected, using a low-pressure transfer molding machine, into a rectangular-shaped flow channel having a width of 15 mm, a thickness of 1 mm, and a length of 175 mm under conditions of a mold temperature of 170° C. and an injection flow rate of 177 mm3/sec, a change in pressure over time is measured with a pressure sensor embedded at a position 25 mm away from an upstream tip of the flow channel, a lowest pressure (MPa) during a flow of the resin composition for sealing is measured, and the lowest pressure is regarded as the rectangular pressure.
A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS includes the following components: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and (D) a coupling agent, in which the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and at least one of the following conditions is satisfied.
A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS includes the following components: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and (D) a coupling agent, in which the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and at least one of the following conditions is satisfied.
Condition 1: a ratio of particles having a particle size equal to or more than 1 μm and equal to or less than 20 μm in the component (B) is equal to or more than 40% by volume and equal to or less than 95% by volume with respect to a total volume of the component (B), and
A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS includes the following components: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and (D) a coupling agent, in which the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and at least one of the following conditions is satisfied.
Condition 1: a ratio of particles having a particle size equal to or more than 1 μm and equal to or less than 20 μm in the component (B) is equal to or more than 40% by volume and equal to or less than 95% by volume with respect to a total volume of the component (B), and
Condition 2: an angle of fall of the thermosetting resin composition for LDS is equal to or less than 35°.
Research Institute of Innovative Technology for the Earth (Japan)
Sumitomo Bakelite Co., Ltd. (Japan)
Inventor
Inui, Masayuki
Hiraga, Kazumi
Suda, Masako
Hashizume, Masayoshi
Ishida, Junya
Abstract
Provided is a microorganism that is able to produce 2-phenylethanol at a high concentration, and a method of efficiently producing 2-phenylethanol by using a saccharide as a raw material.
Provided is a microorganism that is able to produce 2-phenylethanol at a high concentration, and a method of efficiently producing 2-phenylethanol by using a saccharide as a raw material.
Provided is a coryneform bacterium transformant in which a shikimate pathway is activated, and further, a gene that encodes an enzyme having phenylpyruvate decarboxylase activity is introduced in such a manner that the gene can be expressed.
Provided is a microorganism that is able to produce 2-phenylethanol at a high concentration, and a method of efficiently producing 2-phenylethanol by using a saccharide as a raw material.
Provided is a coryneform bacterium transformant in which a shikimate pathway is activated, and further, a gene that encodes an enzyme having phenylpyruvate decarboxylase activity is introduced in such a manner that the gene can be expressed.
Also provided is a 2-phenylethanol producing method that includes causing the coryneform bacterium transformant according to the present disclosure to react in water containing a saccharide.
C12P 7/22 - Preparation of oxygen-containing organic compounds containing a hydroxy group aromatic
C12N 15/77 - Vectors or expression systems specially adapted for prokaryotic hosts other than E. coli, e.g. Lactobacillus, Micromonospora for Brevibacterium
47.
Method, Kit, and Device for Preparing Glycan from Glycoprotein
National Institute of Advanced Industrial Science and Technology (Japan)
Sumitomo Bakelite Co., Ltd. (Japan)
Inventor
Kameyama, Akihiko
Toyoda, Masaaki
Sakaguchi, Midori
Abstract
Provided are a method for preparing a glycan from a glycoprotein, and a kit and a device for preparing a glycan from a glycoprotein. The method includes (I) a step of obtaining a glycan-containing sample by bringing a glycan releasing solution that contains a hydroxylamine compound and a basic reagent into contact with the glycoprotein and releasing the glycan from the glycoprotein; (II) a step of adsorbing a glycan having a length of a monosaccharide or more on a purifying agent for purifying the glycan by bringing the glycan-containing sample into contact with the purifying agent, which is composed of a compound having a betaine structure; and (III) a step of eluting the glycan from the purifying agent.
Resin-adhered graphite particles are obtained by causing a modified novolac-type phenolic resin to adhere to graphite particles. At least part of surfaces of the graphite particles is coated with a carbonaceous coating by heating the resin-adhered graphite particles in a non-oxidizing atmosphere at 900 to 1,500° C. to carbonize the modified novolac-type phenolic resin. Arylene groups having hydroxy groups account for 5 to 95 mol % of arylene groups constituting the modified novolac-type phenolic resin. The obtained carbonaceous substance-coated graphite particles exhibit excellent battery properties when used as a negative electrode material for a lithium ion secondary battery.
A biomedical electrode of the present invention includes: a plate-shaped support portion; an elastic pillar portion that is provided on a first surface of the plate-shaped support portion; a conductive resin layer that is formed to cover a distal end of the elastic pillar portion; and a conductive wire that is electrically connected to the conductive resin layer and is arranged in the elastic pillar portion from a distal end side toward a base end side.
A biomedical electrode includes: a plate-shaped support portion; an elastic pillar portion that is provided on a first surface of the plate-shaped support portion; and a conductive resin layer that is formed to cover a distal end of the elastic pillar portion, in which the elastic pillar portion includes a silicone rubber, the conductive resin layer includes a conductive filler and a silicone rubber, and when measured at 37° C. according to JIS K 6253 (1997), a type A durometer hardness of a surface of the elastic pillar portion is 15 or higher and 35 or lower.
Provided is an encapsulating resin composition for a power device including an epoxy resin, an inorganic filler, a curing agent, and a curing accelerator. This composition is molded under a condition of 175° C. for 2 minutes and then subjected to after-curing under a condition of 175° C. for 4 hours to obtain a test piece having a diameter of 100 mm and a thickness of 2 mm, and a half width of a current-time curve obtained by measuring the test piece with a thermally stimulated depolarization current method according to an order of (i) to (v) below is equal to or less than 800 seconds, (i) increase a temperature of the test piece to 150° C. at a rate of 5° C./min without applying a voltage, (ii) applying a constant voltage of 500 V for 30 minutes while maintaining the temperature of the test piece at 150° C., (iii) lower the temperature of the test piece to 45° C. at a rate of 5° C./min while applying the constant voltage of 500 V, (iv) stop applying the voltage while maintaining the temperature of the test piece at 45° C. and leave the test piece to stand for 5 minutes, and (v) increase the temperature of the test piece at a rate of 3.5° C./min without applying a voltage to the test piece, and measure a value of a current flowing during the increase in the temperature to obtain a current-time curve.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
A biomedical electrode according to the present invention includes: a plate-shaped support portion; a plurality of elastic pillar portions that are provided on a first surface of the plate-shaped support portion; and a conductive resin layer that is formed to cover distal ends of the elastic pillar portions, in which the plurality of elastic pillar portions are arranged to surround a center portion of the first surface of the plate-shaped support portion, each of distal end portions of the plurality of elastic pillar portions has an inclined surface that is inclined with respect to the first surface, and when a point of the inclined surface closest to the first surface is represented by P1, a point of the inclined surface farthest from the first surface is represented by P2, and a half line extending from P2 to P1 is represented by L, the point P1 is present at a position closer to the center portion than the point P2 in the plurality of elastic pillar portions, and the half line L is configured to pass through the center portion or a vicinity of the center portion in the plurality of elastic pillar portions.
A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 23/08 - Layered products essentially comprising cellulosic plastic substances comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B29C 48/21 - Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets
An elastomer of the present invention is used for a molded body for low temperature environments, includes a silicone rubber, and has a characteristic in which the expression ((tensile stress M100−tensile stress M1000)/tensile stress M1000)×100 is equal to or more than a predetermined value and equal to or less than a predetermined value, where the tensile stress M100 and the tensile stress M1000 are respectively obtained under two different measurement conditions of performing or not performing a cooling treatment of maintaining −40° C. for 30 minutes.
The gastrostomy catheter includes a shaft in which a lumen is provided, a flexible bumper which is provided at a tip of the shaft, and a wire which has elasticity and can bias the bumper in a diameter-increasing direction and restricts deformation of the bumper in a diameter-decreasing direction. At least a portion on a tip side of the wire biases the bumper in the diameter-increasing direction or restricts the deformation of the bumper in the diameter-decreasing direction by the elasticity of the wire in a state in which the wire is disposed in the bumper.
The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent. In a case where SP1 represents a Hansen's method-based average solubility parameter of a resin group consisting of the epoxy resin and the phenolic resin curing agent in the resin composition, and Mn1 represents a number average molecular weight of the resin group, SP1 and Mn1 satisfy Mn1≤210×SP1−4,095.
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.
B29C 48/21 - Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets
G02B 1/14 - Protective coatings, e.g. hard coatings
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 23/08 - Layered products essentially comprising cellulosic plastic substances comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
The resin composition for encapsulating semiconductor of the present invention is a resin composition for encapsulating semiconductor including an epoxy resin, a curing agent, an inorganic filler, and carbon black fine particles, in which when the resin composition for encapsulating semiconductor is injection-molded to have a length of 80 mm, a width of 10 mm and a thickness of 4 mm under conditions of a mold temperature of 175° C., an injection pressure of 10 MPa, and a curing time of 120 seconds, and then heated at 175° C. for 4 hours to obtain a cured product, and then a surface of the obtained cured product is observed with a fluorescence microscope, a maximum particle diameter of aggregates of the carbon black fine particles is 50 μm or less.
A culture vessel that can suppress foaming in a culture medium when a common nozzle is used to supply a liquid culture medium and a gas together. This culture vessel includes: a vessel body having an opening portion that communicates with a housing space; a lid that closes the opening portion; and a nozzle that passes through the and extends to the housing space, and supplies a liquid culture medium and a gas together. The nozzle has a vent opening portion that is formed so as to open in a side of the nozzle and serves as a movement path of the gas from inside of the nozzle into the housing space.
A protective film 10 of the present invention is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21 while heating the resin substrate 21. The protective film 10 includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate 21 and is adhered to the resin substrate 21. The base material layer is formed of a laminate having a first layer which is positioned on the opposite side of the pressure sensitive adhesive layer, contains a thermoplastic resin, and has a melting point of 150° C. or higher and a second layer which is positioned on the pressure sensitive adhesive layer side, contains a thermoplastic resin, and has a melting point of lower than 120° C.
B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
C09J 153/00 - Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
B29K 23/00 - Use of polyalkenes as moulding material
B29K 69/00 - Use of polycarbonates as moulding material
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
63.
HIGH FREQUENCY TREATMENT DEVICE, HIGH FREQUENCY TREATMENT DEVICE KNIFE, AND HIGH FREQUENCY TREATMENT DEVICE DISTAL TREATMENT INSTRUMENT
There is provided a medical high frequency treatment device (200). A distal portion of the high frequency treatment device (200) includes a high frequency treatment device knife (100) having a pair of scissors (10) so as to incise a biological tissue. The pair of scissors (10) is configured to be capable of shearing the biological tissue by pivoting in a direction closer to each other. Each of the pair of scissors (10) has a blade surface (13). Each surface of the pair of scissors (10) includes a formation region of a non-conductive layer (insulating film (12)) and an electrode region (19) where the non-conductive layer is not formed on the surface of the blade surface (13). With regard to at least one of the pair of scissors (10), a width dimension of the electrode region (19) in a plate thickness direction of the scissors (10) varies depending on a position of the scissors (10) in a longitudinal direction.
An optical sheet of the present invention includes a specific wavelength absorption layer that contains a polycarbonate as a main material and a light absorbing agent that absorbs light of a specific wavelength out of light in a wavelength range of 350 nm to 740 nm, in which the polycarbonate has a viscosity average molecular weight Mv of 20,000 to 30,000. In addition, the specific wavelength absorption layer further includes an ultraviolet absorbing agent that absorbs light in a wavelength range of 100 nm to 420 nm.
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
A phenol resin for a wet friction material of the invention contains a resol-type phenol resin having, in one molecule, a structural unit A which is derived from a phenol compound having one phenolic hydroxyl group and a structural unit B which is derived from a polyfunctional phenol compound having two phenolic hydroxyl groups.
C08G 8/24 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups
An optical sheet of the present invention is an optical sheet that has flexibility and is used in a curved state of being curved in one direction, and includes a polarized layer 12 that polarizes incident light and a specific wavelength absorption layer provided on a curved concave side from the polarized layer 12 and containing a resin material and a light absorbing agent that absorbs light in a specific wavelength range out of light in a wavelength range of 350 nm to 740 nm. In addition, the resin material is preferably a polycarbonate having a viscosity average molecular weight Mv of 20,000 to 30,000.
A medical device includes a medical device body, first and second operating lines inserted in axial direction of the device body, and a bending operating part that pulls the operating lines to perform bending operation of a distal end part of the device body. The device body has the distal end part in the axial direction such that the operating lines are gradually curved and approach each other in circumferential direction of the device body toward a distal end side in the distal end part. The device body has a curved region and a parallel region such that in the curved region, the operating lines gradually curve and approach each other in the circumferential direction toward the distal end side and that in a parallel region, the operating lines extend in parallel to each other between the distal end of the curved region and distal ends of the operating lines.
A purification agent which includes a compound having a betaine structure, and which is for a sugar chain having a length equal to or longer than that of a monosaccharide or for a glycopeptide having a sugar chain having a length equal to or longer than that of a monosaccharide.
NATIONAL UNIVERSITY CORPORATION TOKYO MEDICAL AND DENTAL UNIVERSITY (Japan)
Inventor
Arai, Hirokuni
Sakate, Toshifumi
Kawamata, Akira
Harata, Shinetsu
Abstract
The present invention provides a coronary artery bypass surgery treatment tool or the like including a flexible tube, a suction cup in which an opening portion is formed to communicate with the flexible tube and which is provided at a distal end of the flexible tube, a joint portion which has a suction path, a male connector which is provided in one of a proximal end of the flexible tube and a distal end of the suction path of the joint portion, and a female connector which is provided in the other thereof and is detachably connected to the male connector.
A catheter (100) includes a resin-made distal tip (80) linked to a distal end of a catheter body (10), and the distal tip (80) has a distal lumen (81) having an open distal end. The distal lumen (81) communicates with a lumen (31). The catheter (100) is an inactive type microcatheter in which an outer diameter of the distal end of the catheter body (10) is 0.6 mm or smaller and a maximum outer diameter of the distal tip (80) is 0.6 mm or smaller. A dimension of a marker (70) in an axial direction of the catheter body (10) is smaller than the maximum outer diameter of the distal tip (80), and the length of the distal tip (80) in the axial direction of the distal tip (80) is 3 times to 18 times the maximum outer diameter of the distal tip (80).
The present invention provides a catheter provided with a tubular main body. The catheter is characterized in that: the tubular main body has defined therein a first length region and a second length region which is adjacent to the first length region and which is located closer to the distal side than the first length region; the resin hardness of the second length region is lower than the resin hardness of the first length region; and the distance from a plane perpendicular to the axial direction of the tubular main body to the joining line between the first length region and the second length region is non-uniform.
A medical device includes an elongated medical device body; a first operating line and a second operating line inserted in an axial direction of the medical device body; and a bending operating part for performing a bending operation of a distal end part of the medical device body by pulling the first and second operating lines, at an intermediate part and a proximal end part in the axial direction of the medical device body, the first and second operating lines extending in parallel so as to be spaced apart from each other in a circumferential direction of the medical device body, and at the distal end part in the axial direction of the medical device body, the first and second operating lines being curved and joined together so as to approach each other in the circumferential direction of the medical device body gradually toward a distal end side.
Provided is a method for preparing a sugar chain, including: a labeling step of adding a labeling reagent to a sugar chain-containing sample which contains a sugar chain to obtain a labeled product containing a labeled substance of the sugar chain, in which a reaction environment of the labeling reagent and the sugar chain contains water in the labeling step.
Embodiments in accordance with the present invention encompass self-imageable polymer compositions containing a variety of photobase generators which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. The compositions of this invention can be tailored to form positive tone or negative tone images depending upon the intended application in aqueous developable medium. The images formed therefrom exhibit improved properties including low wafer stress and better thermo-mechanical properties, among other property enhancements.
Embodiments encompassing a series of compositions containing photoacid generator (PAG) and a base are disclosed and claimed. The compositions are useful as permanent dielectric materials. More specifically, embodiments encompassing compositions containing a series of copolymers of a variety of norbornene-type cycloolefinic monomers and maleic anhydride in which maleic anhydride is fully or partially hydrolyzed (i.e., ring opened and fully or partially esterified), PAG and a base, which are useful in forming permanent dielectric materials having utility in a variety of electronic material applications, among various other uses, are disclosed.
C08G 61/08 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
A substrate for a power module (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The insulating resin layer (102) includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer (102) at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
77.
Method for liberating sugar chain from glycoprotein
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japan)
SUMITOMO BAKELITE CO., LTD. (Japan)
Inventor
Kameyama, Akihiko
Toyoda, Masaaki
Sakaguchi, Midori
Abstract
Provided is a method for liberating sugar chains from a glycoprotein, including: a step of brining a reaction solution which contains hydroxylamines (a) and a basic reagent (b) into contact with the glycoprotein to obtain a mixed solution of sugar chains liberated from the glycoprotein and the reaction solution.
The present disclosure provides a medical instrument, including a tubular main body; a plurality of operating lines; an operating part main body provided on the base end portion of the tubular main body; a bending operating part which is configured to bend a distal portion of the tubular main body; a path defining part which is configured to define a path of the operating line in the bending operating part; and a deviation preventive member which is configured to prevent the operating line from deviating from a path defined by the path defining part; wherein the operating line becomes in a relaxed state when the bending operating part is in a fixation position, while the operating line becomes in a strained state when the bending operating part is in an operation position.
The thermosetting resin composition for LDS of the invention includes a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays, and a coupling agent, in which the non-conductive metal compound includes one or more selected from the group consisting of a spinel-type metal oxide, a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and a tin-containing oxide, and the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
B33Y 70/00 - Materials specially adapted for additive manufacturing
B33Y 80/00 - Products made by additive manufacturing
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
The polarized laminate of the invention includes a polarized film, which has a first surface and a second surface that is a reverse side of the first surface; a first layer provided on a side of the first surface and formed of a first resin material including a polyamide; and a second layer provided on a side of the second surface and formed of a second resin material including a polyamide. When a Barcol hardness of the polarized laminate before and after immersion of the polarized laminate in distilled water at 80° C. for 15 minutes is measured according to JIS K 7060:1995, the Barcol hardness after the immersion is from 70% to 100% with respect to the Barcol hardness before the immersion.
RESEARCH INSTITUTE OF INNOVATIVE TECHNOLOGY FOR THE EARTH (Japan)
SUMITOMO BAKELITE CO., LTD. (Japan)
Inventor
Inui, Masayuki
Hiraga, Kazumi
Suda, Masako
Kubota, Takeshi
Abstract
Provided is a microorganism that is capable of efficiently producing para-aminobenzoic acid (4-ABA) or a salt thereof, using saccharides as raw materials, and a method for efficiently producing 4-ABA or a salt thereof by using this microorganism.
A transformant obtained by introducing, into a coryneform bacterium, a gene that encodes 4-amino-4-deoxychorismate lyase, a gene that encodes a para-aminobenzoate synthase component I, and a gene that encodes a para-aminobenzoate synthase component II, is capable of efficiently producing 4-ABA or a salt thereof from saccharides.
C12N 15/00 - Mutation or genetic engineering; DNA or RNA concerning genetic engineering, vectors, e.g. plasmids, or their isolation, preparation or purification; Use of hosts therefor
C12N 15/77 - Vectors or expression systems specially adapted for prokaryotic hosts other than E. coli, e.g. Lactobacillus, Micromonospora for Brevibacterium
A medical treatment implement which has an excellent degree of freedom of a procedure and into which a trocar can be re-stuck includes a tubular retractor main body configured to be indwelled in an incision wound and a converter (20) configured to close an opening end portion of an upper end of the retractor main body and to be puncturable with a trocar.
The converter (20) includes a ring-shaped frame portion (22) detachably mounted on the opening end portion and a sheet portion (21) which is mounted inside the frame portion (22) and airtightly covers the opening end portion. A compression force P is applied to the sheet portion (21) in an inner diameter direction.
RESEARCH INSTITUTE OF INNOVATIVE TECHNOLOGY FOR THE EARTH (Japan)
SUMITOMO BAKELITE CO., LTD. (Japan)
Inventor
Inui, Masayuki
Hiraga, Kazumi
Suda, Masako
Kogure, Takahisa
Abstract
Provided is a microorganism that is able to efficiently produce protocatechuic acid or a salt thereof by using a saccharide as a raw material, and a method of efficiently producing protocatechuic acid or a salt thereof by using the microorganism. Provided is a transformant having protocatechuic acid producing ability, subjected to modifications of enhancement of 3-dehydroshikimate dehydratase activity; enhancement of chorismate pyruvate lyase activity; and enhancement of 4-hydroxybenzoate hydroxylase activity. Also provided is a method of producing protocatechuic acid or a salt thereof, including the step of culturing the transformant in a reaction solution containing a saccharide so as to cause the transformant to produce protocatechuic acid or a salt thereof.
C12N 1/00 - Microorganisms, e.g. protozoa; Compositions thereof; Processes of propagating, maintaining or preserving microorganisms or compositions thereof; Processes of preparing or isolating a composition containing a microorganism; Culture media therefor
Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 7/10 - Interconnection of layers at least one layer having inter-reactive properties
C09J 5/06 - Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.
C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
C08L 101/00 - Compositions of unspecified macromolecular compounds
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
An endoscopic clip device including a clip, a treatment instrument body comprising a sheath, an operation wire, and a distal connection portion, a sleeve accommodated inside the sheath and accommodating the connection portion in distal portion of the wire such that portion of inner diameter of the sleeve is smaller than outer diameter of the locking portion when the connection portion is drawable from the accommodation portion. The sleeve has diameter enlargement portion on distal side of the sleeve and elastically self-openable, a diameter reduction step portion on proximal side of the enlargement portion, and a sleeve body positioned on the proximal side of the enlargement portion from the step portion and having radial rigidity higher than that of the enlargement portion, and the inner diameter of the sleeve body is smaller than the outer diameter of the locking portion when the connection portion is drawable from the accommodation portion.
A61B 17/128 - Surgical instruments, devices or methods, e.g. tourniquets for ligaturing or otherwise compressing tubular parts of the body, e.g. blood vessels or umbilical cord for applying or removing clamps or clips
A61B 1/00 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
A61B 17/00 - Surgical instruments, devices or methods, e.g. tourniquets
87.
Fluorine free photopatternable phenol functional group containing polymer compositions
Various polycycloolefinic polymers containing phenolic pendent groups and compositions thereof useful for forming self-imageable films encompassing such polymers are disclosed. Such polymers encompass norbornene-type repeating units containing phenolic pendent groups which contain very low levels of fluorine containing monomers. The films formed from such polymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.
G03F 7/32 - Liquid compositions therefor, e.g. developers
G03F 7/40 - Treatment after imagewise removal, e.g. baking
C08F 32/08 - Homopolymers or copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
C08L 45/00 - Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08F 232/00 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
C09D 145/00 - Coating compositions based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Coating compositions based on derivatives of such polymers
Embodiments in accordance with the present invention encompass self-imagable polymer compositions containing a variety of photobase generators which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. The compositions of this invention can be tailored to form positive tone or negative tone images depending upon the intended application in aqueous developable medium. The images formed therefrom exhibit improved properties including low wafer stress and better thermo-mechanical properties, among other property enhancements.
Embodiments in accordance with the present invention encompass compositions encompassing components A and B which are kept separately and respectively contain a procatalyst and an activator along with one or more monomers which undergo vinyl addition polymerization when both components are mixed together to form a substantially transparent film. The monomers employed therein have a range of refractive index from 1.4 to 1.8 and thus these compositions can be tailored to form transparent films of varied refractive indices. Accordingly, compositions of this invention are useful in various opto-electronic applications, including as coatings, encapsulants, fillers, leveling agents, among others.
C08F 232/00 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
C08F 232/08 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
C09D 167/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
C08G 63/189 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
C09D 145/00 - Coating compositions based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Coating compositions based on derivatives of such polymers
90.
Diazirine compounds and compositions derived therefrom
A method for forming a film for the fabrication of a microelectronic or optoelectronic device comprising a series of diazirine compounds of formula (I) having utility as photocrosslinkers are disclosed.
y are as defined herein.
G03F 7/40 - Treatment after imagewise removal, e.g. baking
C07D 229/02 - Heterocyclic compounds containing rings of less than five members having two nitrogen atoms as the only ring hetero atoms containing three-membered rings
C07D 403/10 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings linked by a carbon chain containing aromatic rings
C07D 403/02 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings
G03F 7/32 - Liquid compositions therefor, e.g. developers
C07D 401/14 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing three or more hetero rings
C07D 403/14 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, not provided for by group containing three or more hetero rings
C08K 5/3442 - Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
91.
Polymers derived from norbornadiene and maleic anhydride and use thereof
Embodiments encompassing a series of compositions containing polymers of norbornadiene and maleic anhydride monomers which are useful in forming a variety of photopatternable structures are disclosed and claimed. The compositions are useful as permanent dielectric materials. More specifically, embodiments encompassing compositions containing a series of ter- and tetrapolymers of a variety of norbornadiene, maleic anhydride, maleimide and norbornene-type cycloolefinic monomers in which maleic anhydride is fully or partially hydrolyzed (i.e., ring opened and fully or partially esterified), and a photoactive compound are disclosed, which are useful in forming permanent dielectric materials having utility in a variety of electronic material applications, among various other uses.
C08F 32/08 - Homopolymers or copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit 6 for supplying the powder material into processing section 3, and processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, and a high-pressure gas (air) generating unit 11. Processing liquid spraying device 70 is configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.
B01J 2/00 - Processes or devices for granulating materials, in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
C01B 33/18 - Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
93.
Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition
Particle production apparatus 1 including processing section 3 in which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamber 4 connected to processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply device 50 with supply portion 5 and supply unit 6 for supplying the powder material into processing section 3, and processing liquid spraying device 70 having a nozzle 7, a pump 8, a supply unit 9 for supplying the processing liquid, and a high-pressure gas (air) generating unit 11. Processing liquid spraying device 70 is configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3. Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.
B01J 2/00 - Processes or devices for granulating materials, in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
C01B 33/18 - Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
94.
Lignin resin composition, cured product, and molded product
Provided is a lignin resin composition including a lignin derivative having a weight-average molecular weight of 500 or more and 4000 or less and a novolac-type phenolic resin having a weight-average molecular weight of 1000 or more and 3000 or less, in which the content of the lignin derivative is not higher than the content of the novolac-type phenolic resin. In particular, the cured product (molded product) of a lignin resin composition obtained by melt-mixing such a lignin resin composition, adding hexamethylenetetramine thereto and then heating the resulting mixture has a high bending strength. Such a lignin resin composition is utilizable as a thermosetting resin substituting a phenolic resin.
C08L 97/00 - Compositions of lignin-containing materials
C08G 8/24 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups
C07G 1/00 - Low-molecular-weight derivatives of lignin
95.
Resin composition for encapsulating, manufacturing method of on-vehicle electronic control unit, and on-vehicle electronic control unit
1 at which the torque value is less than or equal to 2 times a minimum torque value is longer than or equal to 15 seconds and shorter than or equal to 100 seconds, and the minimum torque value is greater than or equal to 0.5 N·m and less than or equal to 2.5 N·m.
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
96.
Artificial tendon-forming auxiliary instrument, somatometry instrument, and auxiliary instrument set
According to the present invention, there is provided an artificial tendon-forming auxiliary instrument in which a valve cusp of a cardiac valve and a papillary muscle can be joined together with an artificial tendon through an easy procedure and the artificial tendon can be finished so as to have a desired length. According to an aspect of the present invention, an auxiliary instrument (100) is used for joining a valve cusp (210) of the cardiac valve and a papillary muscle (212) with an artificial tendon (200). A pair of end-portion support portions (20) and (21) respectively supporting the valve cusp (210) and the papillary muscle (212) is provided at both ends in a longitudinal direction. The auxiliary instrument (100) includes first and second tendon insertion ports through which the artificial tendon (200) is inserted, a tendon guide portion (30), and an instrument holding portion (40). The first and second tendon insertion ports are respectively formed in the pair of end-portion support portions (20) and (21) and have diameters greater than a diameter of the artificial tendon (200). The tendon guide portion (30) is formed so as to extend in the longitudinal direction across the first and second tendon insertion ports. The instrument holding portion (40) is formed in an intermediate portion of the tendon guide portion (30) in the longitudinal direction.
A61B 17/04 - Surgical instruments, devices or methods, e.g. tourniquets for closing wounds, or holding wounds closed, e.g. surgical staples; Accessories for use therewith for suturing wounds; Holders or packages for needles or suture materials
There is provided a phenolic resin composition as a molding material. It includes a resol-type phenolic resin (A) and a novolac-type phenolic resin (B). The novolac-type phenolic resin (B) includes a novolac-type phenolic resin (B1) represented by General Formula (1) and a modified novolac-type phenolic resin (B2) represented by General Formula (2).
B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
C12M 1/00 - Apparatus for enzymology or microbiology
C12M 1/32 - Inoculator or sampler multiple field or continuous type
C12N 1/00 - Microorganisms, e.g. protozoa; Compositions thereof; Processes of propagating, maintaining or preserving microorganisms or compositions thereof; Processes of preparing or isolating a composition containing a microorganism; Culture media therefor
A lignin derivative that is extracted from biomass and is used for rubber reinforcement or for use in a molding material is provided. Such a lignin derivative has a number average molecular weight of 300 to 2,000, and contains a component that is soluble in a polar organic solvent, in an amount of 80% by mass or more. When such a lignin derivative is incorporated, a lignin resin composition, a rubber composition, or a molding material, all of which have excellent low hysteresis loss characteristics, elastic modulus, or tensile properties, can be obtained. Furthermore, when a component that is thermofusible is used as the soluble component, a lignin resin composition, a rubber composition, or a molding material, all of which have superior aforementioned characteristics, can be obtained.
An anti-leak valve unit is removably attached to a base end portion of an overtube through which an endoscope is removably insertable. The anti-leak valve unit includes a frame portion attachable to the overtube, a fitting device on the frame portion that is removably engageable with the base end portion, and a valve element provided inside the frame portion. The frame portion and the fitting device can be embodied as first through third interconnected covers and first and second members attached to the first cover at edges thereof. The valve element can be embodied as a flexible member with an annular endoscope insertion port in a flexible elastic portion thereof.
A61B 1/00 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
A61B 1/015 - Control of fluid supply or evacuation
patents
