A synthesizable clock doubler is disclosed. The clock doubler is implemented using unique combination of logic cells from a standard cell library. At the core of the clock doubler is a high-frequency ring oscillator that generates timing information for clock measurements. Replica ring oscillators are used to generate programmable delays for the correction of the output clock imperfection, such as cycle-to-cycle variation and duty cycle of the doubled clock.
Systems and methods related to serial communication devices are provided. An example integrated circuit (IC) device includes interface circuitry coupled to a two-wire serial communication bus having a serial clock (SCI) line and a serial data (SDA) bus line. The IC device further includes bus stuck recovery circuitry to monitor for a local SDA fault condition at the IC device based on a number of clock cycles during which an internal SDA signal (e.g., generated by the IC device) drives the SDA bus line to a first signal state, the clock cycles based on a clock signal received from the SCI line; and responsive to the local SDA fault condition, release the SDA bus line independent of the internal SDA signal, where the SDA bus line is in a second signal state different from the first signal state based on the release.
The present disclosure provides a method of fabricating a sensor assembly in which a sensor surface has an anchor species provided thereon, the anchor species having a first functional group attached. The method further comprises disposing a fluid channel over the surface and subsequently providing an analyte capture species to the fluid channel. The analyte capture species comprises a second functional group configured to react with the first functional group. The surface is then exposed to photo radiation and the first and second functional groups react forming a link between the analyte capture species and the anchor species on the sensing surface.
The present disclosure provides a method of fabricating a target capture and sensor assembly. The method comprises the steps of: providing a fluid path with a target capture surface comprising an anchor species with a first functional group disposed thereon; providing a target capture species to the target capture surface of the fluid path, wherein each target capture species comprises a target capture part and a second functional group configured to react with the first functional group; and exposing at least a portion of the target capture surface of the fluid path to photo radiation so as to cause a photo-initiated reaction between the first functional group and the second functional group, wherein the target capture and sensor assembly further comprises a sensing surface in the fluid path and wherein the target capture surface and the sensing surface are in fluid communication with one another.
Aspects of the present disclosure include methods and systems for transmitting digital information including generating digital information, converting the digital information to two or more transmission signals, outputting each of the two or more transmission signals onto a respective wire of two wires of a cable for at least a first slave node, and outputting a supply current via the two wires for at least the first slave node.
A contact pin printhead for microfluidic array spot printing can include a printhead chassis with a plurality of micro-pins insertable within respective sockets in the printhead chassis. An individual micro-pin can include a micro-pin tip that can be individually biased in a distal direction toward a target substrate via an elastic mechanical biaser associated with the micro-pin. An individual micro-pin can deposit fluid earned within a cavity therein and onto a target substrate during physical contact therewith at a micro-pin tip. Also, an individual micro-pin can retain fluid carried within the cavity, without depositing, absent physical contact at the micro-pin tip.
A system for gas sensing of a biological specimen can include a chamber, such as to receive the biological specimen therewithin. The system can also include a gas sensing unit to be coupled to the chamber and separated therefrom by a moveable separator. A gas sensor included in the gas sensing unit can be selectively exposed to a fluid headspace of the first chamber, such as a gas environment associated with the biological specimen, upon modification or moving of a separator.
Systems, devices, and methods related to wireless battery management system (wBMS) are provided. For example, a wBMS network manager comprises a memory to store a list of hardware identifiers (IDs), wherein each hardware ID in the list is associated with a respective one of a plurality of battery modules; and mapped, based on a predetermined mapping, to a different one of a plurality of source IDs; an interface to receive, from a remote battery module, a packet including a source ID and a hardware ID associated with the remote battery module; and one or more processing units to search, using the source ID in the received packet and the predetermined mapping, for a first hardware ID from the list of hardware IDs; and authenticating the remote battery module based on a comparison of the hardware ID in the received packet to the first hardware ID from the list.
A target gas composition, such as within ambient gas in an environment, can be detected using a gas chemical detector (100). A functionalized region (110) of the gas chemical detector (100) can be exposed to the ambient gas. The functionalized region (110) can include an optical property indicative of the target gas composition. An optical response signal can be generated based on the optical property and indicative of the target gas composition within the ambient gas in the environment using the functionalized region (110). An electrical property can be electrochemically transduced, the electrical property indicative of the target gas composition into an electrical response signal. Both the electrical and optical properties can be used together to determine a presence or other characteristic of a target gas in an ambient environment, such as can be produced by a bacteria or infectious agent of interest.
G01N 21/25 - Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
G01N 21/77 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
G01N 21/78 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator producing a change of colour
An incubation system for gas detection of a biological specimen includes an optical gas sensor. The sensor (210) is arranged to be placed in communication with a biological specimen vessel (215) for generating a response signal. The specimen is incubated in a temperature-controlled chamber (220), within a shelf (218) defining a plurality of receptacles (214). Processing circuitry (226) controls the placing of the sensor (210) and the vessel (215) in communication with each other.
C12M 1/34 - Measuring or testing with condition measuring or sensing means, e.g. colony counters
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups ; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
11.
SERIAL DAISY-CHAINED BUS POWER FOR SERIAL DAISY-CHAINED COMMUNICATION SYSTEM
In some examples of networks and methods, a data network includes nodes. The nodes include a main node (MN) and at least one sub node. Each node includes a node transceiver. The node transceiver is operable to perform data communication in accordance with a first network protocol for power over data via a first pair of conductors. A physical layer includes a cable segment (e.g., the cable segment of bus) between each node. Each cable segment includes a plurality of pairs of conductors (e.g., pairs) and a connector (e.g., 8P8C connector- though other connectors with multiple pairs of conductors can be used) at each end. A first pair of the conductors (e.g., connected to pin 4 and pin 5 of the 8P8C connector) implements the first network protocol between the nodes. One or more of the remaining pairs of the conductors provide supplemental power to the nodes.
A method is provided for pretraining a hyper model configured for use in predicting a state of power (SoP) of a vehicle battery. The method includes performing electrochemical impedance spectroscopy (EIS) scans on a plurality of batteries having a set of similar operating characteristics to the vehicle battery. The EIS scans are performed across various states of the vehicle battery. The method further includes fitting parameters of the hyper model by applying an optimization technique to results of the EIS scans. The hyper model includes a family of models that each define a voltage response of a respective cell from among a plurality of cells of the vehicle battery to a current profile over the various states of the vehicle battery.
B60L 58/18 - Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling batteries of two or more battery modules
B60L 3/00 - Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
14.
METHODS AND SYSTEMS FOR PERFORMING OBJECT DIMENSIONING
Aspects of the present disclosure include isolating a target scene object from multiple images of a time-of-flight (TOF) sensor. Multiple images from a TOF sensor can be transformed into multiple three-dimensional (3D) point clouds. In each of the multiple 3D point clouds, one or more large planes having a minimal threshold size can be identified. A common 3D point cloud can be generated by aligning rotated and translated point clouds corresponding to at least a portion of the multiple 3D point clouds. The common 3D point cloud can be rotated and translated to have one of one or more large planes identified as a ground plane within a common coordinate system of the common 3D point cloud, and a target object can be isolated.
Aspects described herein relate to estimating mean arterial pressure (MAP) of a living being. The estimating may include obtaining pulsatile arterial blood pressure (pABP) waveform, obtaining arterial blood flow (ABF) waveform, identifying a set of segments of the pABP waveform in steady state, identifying a set of segments of the ABF waveform in steady state, and estimating the MAP based on the identified segment of the pABP waveform in steady state and the identified segment of the ABF waveform in steady state.
A61B 5/021 - Measuring pressure in heart or blood vessels
A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
A61B 5/02 - Measuring pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography; Heart catheters for measuring blood pressure
Aspects of the present disclosure include obtaining images from a time-of-flight (TOP) sensor for determining dimensions of an object. A prompt to capture at least one image of an object can be displayed on an interface. At least one image of the object can be captured based on an interaction with the prompt. It can be determined whether multiple images including the at least one image are sufficient for performing object dimensioning, and if so, the images can be provided for performing object dimensioning to compute or display dimensions of the object.
Aspects of the present disclosure include aligning multiple three-dimensional (3D) point clouds into a common 3D point cloud. A first subset of points within a first 3D point cloud generated from one time-of-flight (TOF) view can be associated with a second subset of points within a second 3D point cloud generated from another TOF view based on each point in the first subset of points having a threshold correspondence to a unique counterpart point in the second subset of points. The first subset of points and the second subset of points can be refined, and a relative rotation and translation between the first 3D point cloud and the second 3D point cloud can be determined. The first 3D point cloud and the second 3D point cloud can be aligned within a common coordinate system based on the relative rotation and translation.
Aspects of the present disclosure include obtaining images from a time-of-flight (TOP) sensor for determining dimensions of an object including obtaining, from the TOP sensor, multiple images including the object, validating whether the multiple images are taken at desired poses relative to the object, and where the multiple images are validated as taken at the desired poses, providing the multiple images for object dimensioning to compute or display dimensions of the object.
An electronic device is disclosed. The electronic device can include a molded integrated device package, where the molded integrated device package comprising a substrate, at least one electronic element mounted to the substrate, and a molding compound in which the electronic element is at least partially embedded, a slot formed through the molding compound. The integrated package can include a conductor comprising a horizontal section and a vertical section extending nonparallel from the horizontal section, the horizontal section having a lower side attached by an adhesive to an upper portion of the molding compound and the vertical section inserted into the slot and electrically connected to the substrate or to pads on the substrate by a conductive adhesive, such as solder.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
20.
STRESS ISOLATION FOR INTEGRATED CIRCUIT PACKAGE INTEGRATION
Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
B81C 3/00 - Assembling of devices or systems from individually processed components
H01L 21/77 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
21.
MICROELECTROMECHANICAL SYSTEMS (MEMS) AND RELATED PACKAGES
Compact packages including microelectromechanical system (MEMS) devices and multiple application specific integrated circuits (ASICs) are described. These packages are sufficiently small to be applicable to contexts in which space requirements are particularly strict, such as in consumer electronics. These packages involve vertical die stacks. A first ASIC may be positioned on one side of the die stack and another ASIC may be positioned on the other side of the die stack. A die including a MEMS device (e.g., an accelerometer, gyroscope, switch, resonator, optical device) is positioned between the ASICs. Optionally, an interposer serving as cap substrate for the MEMS device is also positioned between the ASICs. In one example, a package of the types described herein has an extension of 2 mm x 2 mm in the planar axes and less than 500 — 800 μm in height.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
H01L 25/03 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
22.
POWER CONVERTER LOOP GAIN IDENTIFICATION AND COMPENSATION USING A MACHINE-LEARNING MODEL
Technologies are provided for identification of closed-loop gain response and compensation of power supply devices. In an aspect, a computing device can receive data indicative of a transient output voltage of a power supply device. The computing device also can determine frequency-domain loop response of a control loop of the power supply device by applying a machine-learned model to the data indicative of the transient output voltage. In addition, or in other aspects, the computing device also can adjust one or multiple compensation component(s) of the power supply device in order to achieve a satisfactory performance during operation of the power supply device.
H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
G05B 13/04 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
G05B 13/02 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
G05B 21/02 - Systems involving sampling of the variable controlled electric
In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.
H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
24.
PROGRAMMABLE POWER MODULE FOR LIDAR RECEIVER CHAIN
Technologies described herein include a programmable power module for a light detection and ranging (LiDAR) system. In some aspects, the programmable power module includes circuitry that supplies a bias voltage to a photodetector array, and a programmable interface comprising a serial interface and multiple configurable ports. Each one of the multiple configurable ports is configured as one of a digital-to-analog converter (DAC) output port, an analog-to-digital converter (ADC) input port, a digital output port, or a digital input port. The serial interface can be configured to receive program code defining a control voltage that causes the circuitry to set the bias voltage. A first configurable port of the multiple configurable ports can be connected to the circuitry and can be configured as a first DAC output port that outputs the control voltage to the circuitry.
Systems, devices, and methods related to audio systems for providing personalized audio zones are provided. An example audio system includes a first speaker to transmit an ultrasonic signal modulated by a first portion of a first audio signal. The audio system further includes a second speaker to transmit a second portion of the first audio signal, where the second portion is in a lower frequency band than the first portion. The audio system further includes a noise canceller to at least attenuate a second audio signal, where the second audio signal is in a lower frequency band than the first portion of the first audio signal.
H04R 3/12 - Circuits for transducers for distributing signals to two or more loudspeakers
B60R 11/02 - Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
The present disclosure provides a device for determining the presence of BNP, proBNP and NT-proBNP. The devices comprise multiple capture regions configured to selectively capture BNP, proBNP and NT-proBNP by specific binding of proBNP. Alternatively or additionally, the devices may capture and label epitopes to distinguish proBNP from NT-proBNP or BNP.
The present subject matter improves efficiency of a switching power supply. Generally, in a switching power supply scheme as described herein, the input voltage and an output voltage of the switching power supply are monitored. A bitstream is produced using the input voltage, the output voltage, and a switching control signal used to control charging of an inductor of the switching power supply. The bitstream is representative of efficiency of operation of the switching power supply. One or more operating parameters of the switching power supply according to the bitstream.
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H03M 3/02 - Delta modulation, i.e. one-bit differential modulation
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 3/139 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 3/315 - Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
29.
DYNAMIC THRESHOLD VOLTAGE CONTROL OF POWER AMPLIFIERS
A semiconductor device including a transistor having a threshold voltage for switching the transistor from a first conductive state to a second conductive state. The transistor includes a first region formed by a first compound semiconductor material and a second region formed by a second compound semiconductor material, where the second region overlying the first region and forming a two-dimensional electron gas (2DEG) at a junction with the first region. The transistor further includes a buried field plate disposed proximate to the first region so that the 2DEG is interposed between the buried field plate and the second region. The semiconductor device further includes a control circuit configured to adjust the threshold voltage of the transistor by providing a bias voltage to the buried field plate responsive to an input signal received at the transistor.
H01L 27/092 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
The present disclosure provides a sensor assembly for detecting the presence of at least one amplification product of an isothermal amplification process (i.e., an isothermal nucleic acid amplification process). The sensor assembly includes a first sensor responsive to the detection of an indicator of the presence of at least one amplification product to provide a first signal, the first sensor comprising a sensing surface arranged to contact a sample in the amplification product receiving region, the sensing surface comprises a first layer comprising a one-dimensional or two-dimensional material. Alternatively or additionally, the disclosure provides a pH sensor comprising a sensing surface comprising a first layer comprising a one-dimensional or two-dimensional material.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
B82Y 15/00 - Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
C12Q 1/00 - Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
G01N 27/30 - Electrodes, e.g. test electrodes; Half-cells
G01N 27/414 - Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
G01N 33/48 - Biological material, e.g. blood, urine; Haemocytometers
Electric field management techniques in GaN based semiconductors that utilize patterned regions of differing conductivity under the active GaN device, such as a GaN high electron mobility transistor (HEMT), are described. As an example, a patterned layer of oxidized silicon can be formed superjacent a layer of silicon dioxide during or prior to the heteroepitaxy of GaN or another semiconductor material. These techniques can be useful for back-side electric field management because a silicon layer, for example, can be made conductive to act as a back-side field plate.
Systems, devices, and methods for optical sensing applications. An example multi-wavelength light emitter structure including a substrate; and a vertical structure over the substrate and extending vertically away from the substrate along an axis, the vertical structure comprising a first active region including one or more cascade stages of superlattices for light emission at a first wavelength; a second active region including one or more cascade stages of superlattices for light emission at a second wavelength different from the first wavelength, wherein the second active region is closer to the substrate than the first active region and spaced apart from the first active region; and an electrically conductive material along sidewalls of at least one of the first active region or the second active region.
H01L 33/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
H01L 31/111 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by at least three potential barriers, e.g. photothyristor
33.
IMPURITY REDUCTION TECHNIQUES IN GALLIUM NITRIDE REGROWTH
Various techniques for impurity dopant reduction in GaN regrowth are described. In a first technique, a barrier layer, such as AlN, can be formed at a regrowth interface before the regrown GaN layer. The barrier layer can bury the impurities at the regrowth interface and reduce their effect on the layers above that include the channel of the device, e.g., transistor. In a second technique, a buffer layer, such as a carbon-doped GaN layer, can be formed at the regrowth interface before the regrown GaN layer. Carbon can act as an acceptor to compensate for the dopants, e.g., silicon, and cancel their electronic effect on the above layers. In a third technique, a hydrogen bake treatment can be performed before the GaN regrowth. Hydrogen can desorb a thin layer of GaN at the regrowth interface, which is the GaN layer with the highest concentration of impurities.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
34.
DIFFERENTIAL PATH LENGTH SENSING USING MONOLITHIC, DUAL-WAVELENGTH LIGHT EMITTING DIODE
This disclosure provides an ultra-compact and highly stable and efficient optical measurement system based on principals of optical absorption spectroscopy using substantially collinear pathways. It improves on such an emitter for gas sensing applications and utilizes it in a differential path-length configuration, in which two separate paths have different optical absorption coefficients by an analyte gas or molecule. The combination of two-color emission from the same source as well as two separate path lengths provides four independent measurements that can measure molecular concentration while cancelling out system fluctuations from temperature, humidity, stress, device aging, power, spectral shifts, as well as other environmental factors mechanics that would otherwise interfere with the measurement and limit sensitivity or require significant additional calibration. The use of a monolithically-integrated device for addressable two-color emission from the same die enables control over spectral profiles so as to optimize signal-to-noise ratio, while also ensuring similar path-lengths.
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
G01N 21/01 - Arrangements or apparatus for facilitating the optical investigation
A gallium nitride (GaN) semiconductor device, such as a field-effect transistor (FET), is described with a design that can enable the semiconductor device to handle high current and high voltage simultaneously. For example, the device can have highly doped n-type N+ regions to ensure low contact resistance and high current. The semiconductor device can have a lightly conducting region next to the drain side of the gate contact, and the device can have a more highly conducting region further from the edge of the drain side of the gate contact. The semiconductor device can handle high current because of the low contact resistance and highly doped drain region but can handle a high electric field because of the lightly doped region near the drain edge of the gate contact. The semiconductor device can be formed in GaN by forming the original N+/N- structure, and then etching a portion of it away, and then regrowing the barrier layer.
Digital isolators operable in multiple power modes are described. The digital isolators include a low power mode, in which some circuitry of the isolator operates in a lower power state than in other mode(s) of operation or may be deactivated, and in which data communication across the isolator is not permitted. The isolator may wake from the low power mode in response to a detected event or may periodically wake. Circuitry on one side of the isolator may dictate when and how the isolator wakes from a lower power mode.
Systems, devices, and methods related to using model architecture search for hardware configuration are provided. An example apparatus includes an input node to receive an input signal; a pool of processing units to perform one or more arithmetic operations and one or more signal selection operations, wherein each of the processing units in the pool is associated with at least one parameterized model corresponding to a data transformation operation; and a control block to configure, based on a first parameterized model, a first subset of the processing units in the pool, where the first subset of the processing units processes the input signal to generate a first signal.
H04B 1/62 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission for providing a predistortion of the signal in the transmitter and corresponding correction in the receiver, e.g. for improving the signal/noise ratio
H03F 1/32 - Modifications of amplifiers to reduce non-linear distortion
One embodiment is circuitry for implementing a baseline restoration ("BLR") circuit for a photon-counting computed tomography ("PCCT") signal chain, the circuitry comprising a multi-level discriminator circuit for receiving a shaper voltage from the PCCT signal chain, the discriminator circuit outputting a digital signal indicative of one of a range of voltages within which the shaper voltage falls; a digital-to-analog converter ("DAC") connected to receive the digital signal output from the discriminator circuit, the DAC converting the received digital signal to a corresponding active reference voltage; and a feedback circuit that injects a cancellation current proportional to the difference between the shaper voltage and the active reference voltage at the input of the PCCT signal chain.
Systems, devices, and methods related to using model architecture search for hardware configuration are provided. A method includes receiving, by a computer-implemented system, information associated with a pool of processing units; receiving, by the computer-implemented system, a data set associated with a data transformation operation; training, based on the data set and the information associated with the pool of processing units, a parameterized model associated with the data transformation operation, where the training includes updating at least one parameter of the parameterized model associated with configuring at least a subset of the processing units in the pool; and outputting, based on the training, one or more configurations for at least the subset of the processing units in the pool.
Systems, devices, and methods related to hybrid basis function, neural network-based digital predistortion (DPD) are provided. An example apparatus for a radio frequency (RF) transceiver includes a digital predistortion (DPD) actuator to receive an input signal associated with a nonlinear component of the RF transceiver and output a predistorted signal. The DPD actuator includes a basis-function-based actuator to perform a first DPD operaton using a set of basis functions associated with a first nonlinear characteristic of the nonlinear component. The DPD actuator further includes a neural network-based actuator to perform a second DPD operation using a first neural network associated with a second characteristic of the nonlinear component. The predistorted signal is based on a first output signal of the basis-function-based actuator and a second ouput signal of the neural network-based actuator.
In a dynamic signal traffic scenario, a narrowband to wideband transition in a DPD system results in a tilt in the output spectrum until the next DPD adaptation cycle occurs. To address this problem, regularization term is applied with a weighing factor when performing DPD coefficient estimation and adaptation. The regularization term can be obtained from in a variety of ways: using pre-stored waveforms, through factory or in-situ calibration, or through an adaptive or opportunistic update by observing the system. Application of the regularization term improves the spectrum flatness for a narrow to wideband signal transition, and does not require transmitting additional calibration tones to correct the gain flatness
H04B 1/62 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission for providing a predistortion of the signal in the transmitter and corresponding correction in the receiver, e.g. for improving the signal/noise ratio
H03F 1/32 - Modifications of amplifiers to reduce non-linear distortion
42.
HIGH-VOLTAGE TO LOW- VOLTAGE INTERFACE IN POWER CONVERTER CIRCUIT
A UHV-LV interface circuit that is capable of the following, among other things: 1) starting up a primary controller of a power converter circuit with a precisely controlled startup charging profile; 2) performing pulse-based line-voltage sensing with reduced power and improved sensing accuracy; and 3) discharging a capacitor, e.g., class-X2 capacitor, with a stable supply voltage for the controller. The UHV-LV interface circuit can use a single UHV device, such as a single depletion-mode transistor, e.g., field-effect transistor (FET).
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/335 - Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 7/219 - Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only in a bridge configuration
H02M 7/04 - Conversion of ac power input into dc power output without possibility of reversal by static converters
43.
MULTIPLE TRIGGER ELECTROSTATIC DISCHARGE ESD PROTECTION DEVICE FOR INTEGRATED CIRCUITS WITH MULTIPLE POWER SUPPLY DOMAINS
A system having a device for conducting an electrostatic discharge (ESD) current from a designated pin node. The system includes first and second pin nodes, and a switching device having a first switching threshold. The switching device includes a first terminal coupled to a reference node, and a second terminal, coupled to the first pin node to actuate the switching device to conduct ESD current from the first pin node responsive to a voltage between the first pin node and the reference node exceeding the first switching threshold. The switching device further includes a third terminal, coupled to the second pin node, to actuate the switching device to conduct ESD current from the first pin node responsive to a voltage between the first pin node and the second pin node exceeding a second switching threshold.
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
H02H 9/04 - Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
44.
TECHNIQUE FOR ESTIMATION OF INTERNAL BATTERY TEMPERATURE
One embodiment is a method for estimating an internal temperature of a battery, the method comprising obtaining multiple terminal impedance measurements for the battery, wherein each of the terminal impedance measurements is obtained at a different one of a plurality of frequencies; automatically selecting one of a plurality of battery models using on a value of a parameter of the battery, wherein each of the battery models has been trained and corresponds to a different range of values for the battery parameter and wherein the value of the parameter of the battery falls within the range of values for the battery parameter corresponding to the selected one of the plurality of battery models; and applying the selected one of the plurality of battery models to the multiple terminal impedance measurements to estimate the internal temperature of the battery.
One embodiment is a system for estimating an internal temperature of a battery including a first circuit for receiving a system input signal comprising a measurement of at least one observable quantity associated with the battery and outputting an average battery temperature signal based on the system input signal; and an estimator for receiving the system input signal and the average battery temperature signal and estimating an internal temperature of the battery based on the received signals, wherein the estimator comprises a lumped thermal model of the battery comprising a plurality of parameters.
Methods and apparatus are disclosed for communicating multiple logic states across a digital isolator. The digital isolator is a universal serial bus (USB) isolator in some embodiments. The digital isolator includes one or more single-bit data channels. Three or more logic states of information are transmitted across the single-bit data channel(s). The logic states are distinguished by a pulse sequence, and in particular a number of edges of the pulse sequence and a final value or final edge of the pulse sequence.
H03M 5/16 - Conversion to or from representation by pulses the pulses having three levels
H04L 25/49 - Transmitting circuits; Receiving circuits using three or more amplitude levels
H04L 25/493 - Transmitting circuits; Receiving circuits using three or more amplitude levels by transition coding, i.e. the time-position or direction of a transition being encoded before transmission
Apparatus and methods for pre-distorting a radio frequency transmit signal based on local oscillator clock shaping are disclosed. In certain embodiments, one or more clock signals generated by a local oscillator and used for mixing in a transceiver are shaped to account for non-linearity of a power amplifier that amplifies the radio frequency transmit signal. Such pre-distortion can be performed in addition to or alternatively to performing digital pre-distortion on a digital representation of the radio frequency transmit signal.
H04B 1/62 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission for providing a predistortion of the signal in the transmitter and corresponding correction in the receiver, e.g. for improving the signal/noise ratio
H03F 1/32 - Modifications of amplifiers to reduce non-linear distortion
Systems and methods are provided for operating an electrolyzer. The systems and methods perform operations comprising obtaining a plurality of impedance measurements of the plurality of electrolytic cells at a plurality of frequencies; tracking changes to the plurality of impedance measurements of the plurality of electrolytic cells over a time period; and generating, based on the changes to the plurality of impedance measurements, a model representing operating conditions of the electrolytic cells on an individual electrolytic cell basis.
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 9/77 - Assemblies comprising two or more cells of the filter-press type having diaphragms
G01N 27/02 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
49.
PEAK CURRENT MODE CONTROL FOR BUCK-BOOST REGULATORS
Controller circuitry can employ a method to provide control signals to bridge switches operating an inductor for switched-mode inductive buck-boost voltage regulation. The buck mode can operate the bridge switches in a buck current control mode when the input voltage exceeds the output voltage. The boost mode can operate the bridge switches in a boost current control mode when the output voltage exceeds the input voltage. The buck-boost transition mode can operate the bridge switches in a peak buck-boost current control mode that minimizes a minimum duty cycle (having a minimum "on" duty time and a minimum "off" duty time) when the output voltage is approximately equal to the input voltage during a transition from at least one of the current control buck mode to the current control boost mode or from the current control boost mode to the current control buck mode.
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
H02M 1/32 - Means for protecting converters other than by automatic disconnection
Described herein are techniques of remotely performing key revocation on a device that cannot communicate outside of a local network of the device. The techniques involve including key revocation instructions in software update instructions that are sent to the device. The device may verify the software update instructions using one or more keys to determine whether they are safe for execution on the device. For example, the device may verify that the software update instructions have been sent by a trusted software provider. The device may execute the key revocation instructions included in the software update instruction to revoke use of a key of the key(s), and initiate use of a new key in place of the revoked key.
G06F 21/57 - Certifying or maintaining trusted computer platforms, e.g. secure boots or power-downs, version controls, system software checks, secure updates or assessing vulnerabilities
A microelectromechanic al systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
52.
TECHNIQUES FOR MODEL-BASED LUNG FLUID STATUS DETECTION
One embodiment is a method of performing thoracic tomography on a human subject including performing multiple 4-wire impedance measurements on a region of interest to obtain measured impedance data; comparing the measured impedance data to simulated impedance data obtained from a plurality of models of the region of interest; for each of the models, determining a fit of the model based on a comparison between the simulated impedance data obtained from the model and the measured impedance data; and integrating individual resistivity estimates obtained from the models based on a fit of the model such that the individual resistivity estimate from a better fitting model is weighted more heavily in a final resistivity estimate than an individual resistivity estimate from a worse fitting model.
Apparatus and methods for control and calibration of external oscillators are provided herein. In certain embodiments, an electronic oscillator system includes a semiconductor die and a controllable oscillator that is external to the semiconductor die. The oscillation frequency of the controllable oscillator is tuned by a first varactor and a second varactor. The semiconductor die includes a phase-locked loop (PLL) that provides fine tuning to the controllable oscillator by controlling the first varactor, and a calibration circuit that provides coarse tuning to the controllable oscillator by controlling the second varactor.
H03L 7/189 - Indirect frequency synthesis, i.e. generating a desired one of a number of predetermined frequencies using a frequency- or phase-locked loop using a frequency divider or counter in the loop a time difference being used for locking the loop, the counter counting between fixed numbers or the frequency divider dividing by a fixed number using means for coarse tuning the voltage controlled oscillator of the loop comprising a D/A converter for generating a coarse tuning voltage
H03L 7/099 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
H03L 1/02 - Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
H03L 7/089 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses
54.
METHODS FOR USING A SURFACE ACOUSTIC WAVE RESONATOR FOR AUTOMOBILE SECURITY
Remote keyless entry (RKE) systems and devices are described. The RKE devices include one or more passive radios that respond to an interrogation signal from an interrogating device such as a vehicle. The passive radio sends a responsive signal that can include a decaying portion representing a ringdown signal. The passive radio includes a SAW resonator in some situations.
B60R 25/24 - Means to switch the anti-theft system on or off using electronic identifiers containing a code not memorised by the user
B60R 25/01 - Fittings or systems for preventing or indicating unauthorised use or theft of vehicles operating on vehicle systems or fittings, e.g. on doors, seats or windscreens
H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
55.
COMPOUND SEMICONDUCTOR DEVICES WITH A CONDUCTIVE COMPONENT TO CONTROL ELECTRICAL CHARACTERISTICS
Integrated circuits can include compound semiconductor devices having conductive components that control electrical characteristics of the compound semiconductor devices. In one or more examples, one or more conductive components can be located to increase the concentration of electrons in relation to a source electrical contact or a drain electrical contact. In one or more additional examples, a conductive component can be located to reduce the concentration of electrons in relation to a gate electrical contact. The compound semiconductor devices can include a number of compound semiconductor layers that include one or more materials having at least one Group 13 element and at least one Group 15 element.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
Apparatus and methods for logarithmic current to voltage conversion are disclosed herein. In certain embodiments, a logarithmic current to voltage converter includes an input terminal that receives an input current, an output terminal that provides a logarithmic output voltage, a first field-effect transistor (FET) having a gate connected to the input terminal, a first bipolar transistor having a collector connected to the input terminal and an emitter connected to the output terminal, and a stacked transistor connected to the output terminal and to the first FET to form a feedback loop. For example, the stacked transistor can correspond to a second bipolar transistor having a collector connected to the output terminal and a base connected to the source of the first FET, or to a second FET having a drain connected to the output terminal and a gate connected to the source of the first FET.
Apparatus and methods for frequency compensation of amplifiers are provided herein. In certain embodiments, an amplifier includes an input transistor (which can be part of a differential input pair) electrically connected to a first node, a folded cascode transistor electrically connected between the first node and a second node, a current source electrically connected to a third node, a current source transistor electrically connected between the third node and the first node, a first output transistor having an input (for example, a gate) electrically connected to the second node and an output (for example, a drain) electrically connected to a fourth node, and a frequency compensation capacitor electrically connected between the fourth node and the third node.
A current sensor circuit comprises multiple resistive circuit elements of different values of electrical resistance arranged between at least one input terminal of the current sensor circuit and an output terminal; a first plurality of switching circuits coupled between the input terminal and the resistive circuit elements, wherein each switching circuit of the first plurality of switching circuits includes a pair of transistors connected in series; at least one drive amplifier including an output and an input connected to the output terminal; and a second plurality of switching circuits, each switching circuit including a first switch terminal coupled to the at least one drive amplifier output and a second switch terminal coupled to a common connection of a pair of transistors of the first plurality of switching circuits.
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 31/52 - Testing for short-circuits, leakage current or ground faults
G01R 1/30 - Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
G01R 19/252 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques using analogue/digital converters of the type with conversion of voltage or current into frequency and measuring of this frequency
A sensor module is disclosed. The sensor module can include a housing body that is disposed about a cavity that is sized and shaped to receive a container in which a substance is disposed in an operational configuration of the sensor module. The sensor module can include a first electrode that is coupled to or formed with the housing body. The first electrode is disposed at a first peripheral position on the housing body. The sensor module can include a second electrode that is coupled to or formed with the housing body. The second electrode is disposed at a second peripheral position on the housing body that is opposite the first peripheral position. The cavity is disposed between the first and second electrodes in the operational configuration of the housing body.
G01F 11/02 - Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement
G01F 1/56 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using electric or magnetic effects
Processes for using a capacitive sensor to control drug delivery are described. The capacitive sensor measures a capacitance across a pair of electrodes arranged along either side of a container. The container includes an air chamber, a fluid chamber, and a stopper separating the air chamber from the fluid chamber. A volume of drug in the fluid chamber may be determined based on the measured capacitance. The volume is compared to a target volume, and if the volume in the fluid chamber is greater than the target volume, a stopper actuator expels a portion of the drug from the fluid chamber.
Aspects of the present disclosure are directed to a measurement module for measurement of a multi-electrode resistive sensing element with improved noise performance and accuracy. In some embodiments, stimulation to the sensing element is provided by a current path that originates from a signal source, through a switch block, through a pair of terminals, and ending at a reference node such as ground. An analog-to-digital converter (ADC) is coupled directly to one or both of the terminals to digitize a voltage. The ADC is coupled to terminals on the sensing element to measure a sensed voltage signal before the sensed signal goes through the switch block. As a result, the measured voltage signal may be free of noise that could be picked up from passing through the switch block, and accuracy of the resistance measurements on the sensing element can be improved.
Disclosed herein are systems and techniques for node discovery and configuration in a daisy-chained network. For example, in some embodiments, a main node may "auto-discover" the topology and identity of sub nodes in a daisy-chained network so that changes in the topology may be readily adapted to without substantial interruptions in data transfer in the network.
Quadrature error correction (QEC) for radio transceivers are provided herein. In certain embodiments, a transceiver includes an in-phase (I) signal path including a first controllable amplifier coupled to a first data converter, and a quadrature-phase (Q) signal path including a second controllable amplifier coupled to a second data converter. The transceiver further includes a QEC circuit operable to correct for a quadrature error between the I signal path and the Q signal path by adjusting a gain of the first controllable amplifier and/or a gain of the second controllable amplifier.
Battery monitoring techniques, which consume low amounts of power, are described herein. The battery monitoring techniques can be used when the host device (e.g., electric vehicle) is not operating, thus providing a time to use low power techniques. Measurement devices can measure system parameters when a host processor is off or in a low power mode using a heartbeat (HB) sequencing technique. Based on the HB message, the host processor can be alerted and awakened when a fault is detected.
Aspects of the embodiments are directed to auxiliary communication over a pulse density modulated (PDM) interface. Systems utilize a PDM interface between a sigma-delta modulator and a decimation filter to transmit data between devices. In some examples, the PDM interface is used to add non-PDM coded data communication between devices. Devices having a sigma-delta modulator can include microphones and accelerometers. Devices having a decimator can include digital signal processors (DSPs), microcontrollers, and audio codecs. In some examples, non-PDM coded data can be communicated between microphones and a node in a two-wire communication system, between a microphone and a digital signal processor (DSP), or between two microphones.
G05B 19/045 - Programme control other than numerical control, i.e. in sequence controllers or logic controllers using logic state machines, consisting only of a memory or a programmable logic device containing the logic for the controlled machine and in which the state of its outputs is dependent on the state of its inputs or part of its own output states, e.g
A sensor system that obtains and processes time-of-flight data (TOF) obtained in an arbitrary orientation is provided. A TOF sensor obtains distance data describing various surfaces. A processor identifies a horizontal Z-plane in the environment, and transforms the data to align with the Z-plane. In some embodiments, the environment includes a box, and the processor identifies a bottom and a top of the box in the transformed data. The processor can further determine dimensions of the box, e.g., the height between the top and bottom of the box, and the length and width of the box top.
In one or more implementations, a semiconductor device can include a first compound semiconductor device coupled to a second compound semiconductor device coupled in a face-to-face arrangement. The first compound semiconductor device can be coupled to the second compound semiconductor device such that a cavity is formed that includes a first gate electrical contact of the first compound semiconductor device and a second gate electrical contact of the second compound semiconductor device. A gap can be present between the first gate electrical contact and the second gate electrical contact.
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
One embodiment is a baseline restoration ("BLR") circuit for a photo-counting computed tomography ("PCCT") signal chain, the BLR circuit comprising a comparator for comparing a shaper voltage output from a shaper component of the PCCT signal chain with a baseline voltage, the comparator outputting a single bit indicative of whether the shaper voltage is above or below the baseline voltage; a low pass filter connected to filter a voltage signal output from the comparator; and a transconductor connected to receive a filtered voltage signal output from the low pass filter, convert the filtered voltage signal to a current signal, and feed the current signal back to an input of the PCCT signal chain.
The battery monitoring techniques described herein may be used for detection of battery anomalies or faults. Also, the battery monitoring techniques described herein may be used to generate estimates of total battery capacity. The battery monitoring techniques may employ an alternating current frequency response (ACFR) of the battery. The ACFR response of the battery may be used to detect anomalies and/or estimate a total capacity of the battery.
One embodiment is a method for estimating an internal temperature of a battery, the method comprising obtaining multiple terminal impedance measurements, wherein each of the terminal impedance measurements is taken at a different one of a plurality of frequencies; determining model parameters for a multivariable polynomial regression model; and applying the multivariable polynomial regression model to the multiple terminal impedance measurements to estimate the internal temperature of the battery.
G01K 7/42 - Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)
G06G 7/70 - Analogue computers for specific processes, systems, or devices, e.g. simulators for vehicles, e.g. to determine permissible loading of ships
71.
SELF-CHARACTERIZING SMART CELLS FOR BATTERY LIFECYCLE MANAGEMENT
The battery monitoring techniques described herein use a self-characterizing wireless monitor coupled to a battery to monitor different properties of the battery. The wireless monitor may measure, among other things, an alternating current frequency response (ACFR) of the battery. To accomplish this, the wireless monitor may generate and inject a stimulus signal into the battery, and the monitor may then synchronously measure the corresponding impedance response of the battery.
B60L 53/68 - Off-site monitoring or control, e.g. remote control
B60L 58/16 - Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling batteries responding to battery ageing, e.g. to the number of charging cycles or the state of health [SoH]
B60L 53/20 - Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles characterised by converters located in the vehicle
B60L 3/00 - Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
A flow control system is disclosed. The flow control system can include a flow meter positioned at a first location of a flow path of a fluid substance, and a valve positioned at a second location of the flow path of the fluid substance. The flow meter can include a molded non-conductive housing, a heating element that is at least partially embedded in the housing, and a sensing element that is at least partially embedded in the housing. The valve can open the flow path to allow the fluid substance to flow in the flow path. The valve can include an actuator that includes deformable chamber and a gate in the flow path of the fluid substance.
One embodiment is a method for binning charge events in a photon-counting CT scanning system comprising a plurality of discriminators, wherein each discriminator is associated with a respective one of a plurality of threshold voltage levels, the method comprising detecting a transition in a signal output from one of the discriminators; and incrementing a count corresponding to the threshold voltage level associated with the one of the discriminators only if the detected discriminator output signal transition was immediately preceded by an opposite transition in the discriminator output signal.
According to some aspects, there is provided a microelectromechanical systems (MEMS) device wherein one or more components of the MEMS device exhibit attenuated motion relative to one or more other moving components. The MEMS device may comprise a substrate; a proof mass coupled to the substrate and configured to move along a resonator axis; and a first shuttle coupled to the proof mass and comprising one of a drive structure configured to drive the proof mass along the resonator axis or a sense structure configured to move along a second axis substantially perpendicular to the resonator axis in response to motion of the proof mass along the resonator axis, wherein displacement of at least a first portion of the proof mass is attenuated relative to displacement of the first shuttle and/or a second portion of the proof mass.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
G01C 19/5705 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
G01C 19/5755 - Structural details or topology the devices having a single sensing mass
G01C 19/5747 - Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
G01P 15/14 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of gyroscopes
75.
SYSTEM AND METHOD TO ENHANCE NOISE PERFORMANCE IN A DELTA SIGMA CONVERTER
Systems and methods for a power-efficient 3-level digital-to-analog converter. A converter cell using a current starving technique keeps a portion of the converter cell turned on in a low power mode, as opposed to completely turning off current in selected modes. A conversion system keeps a first set of converters active while allowing a second set of converters to be powered down. Systems and methods presented save power and allow for efficient reactivation of converters.
H03M 1/68 - Digital/analogue converters with conversions of different sensitivity, i.e. one conversion relating to the more significant digital bits and another conversion to the less significant bits
H03M 1/70 - Automatic control for modifying converter range
Systems and method for improving stability and performance in class-D modulators. In particular, a multi-cycle feedback network is positioned around a quantizer of a digital class-D amplifier. The multi-cycle feedback network allows the main class-D feedback loop to have multiple clock cycles of delay.
Systems and methods for improving noise efficiency in a Delta Sigma modulator. A bypass scheme for a noise splitter is disclosed that reduces toggling activity for small signals. In particular, a sample-by-sample bypass noise splitter is disclosed that includes a noise splitting module and a bypass line. The bypass line bypasses the noise splitting module when signals are below a selected threshold, increasing efficiency of the system.
H03M 1/68 - Digital/analogue converters with conversions of different sensitivity, i.e. one conversion relating to the more significant digital bits and another conversion to the less significant bits
H03M 1/70 - Automatic control for modifying converter range
Systems and methods for improving the efficiency of a rotational dynamic element matching (DEM) for Delta Sigma converters. In some implementations, the systems and methods are provided a for reducing intersymbol interference (ISI) of a Delta Sigma converter. A delta sigma converter architecture can include multiple I-DACs, and the output from each I-DAC can vary from the other I-DACs. Techniques are disclosed for decreasing mismatch among multiple I-DACs while improving efficiency of rotational dynamic element matching.
Embodiments of the present disclosure provide systems and methods for maintaining timing precision in different operating modes of a device (e.g., a wireless node). A timing circuit may switch clock signals between two different modes (e.g., high power and low power) while preserving timing precision. In a high-power mode, the timing circuit may provide a high frequency clock signal, and in a lower-power mode, it may provide a low frequency clock signal. Moreover, the switching between the different clock signals may be synchronized to select edges of the low frequency clock signal.
A passive wireless sensor may be wirelessly coupled with an interrogator. The sensor uses multiple antennas to receive an interrogation signal from the interrogator and compares a path length difference between the signal received at each antenna. The path length difference changes based on the relative position of the sensor and interrogator. Using the path length difference, the sensor transmits a response signal to the interrogator. The interrogator analyzes the response signal to determine sensor position. The interrogator compares the determined sensor position to a previous known sensor position to determine if an attack has occurred, such as a replay, counterfeit, or tampering attack. The sensor may include cryptographic circuitry that scrambles the response signal, thwarting an attack such as a sniffing attack. The interrogator may include multiple antennas and determine a position of the sensor by calculating an angle-of- arrival that enhances a signal from the sensor, via beamforming.
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
A connector assembly is disclosed. The connector assembly can include first and second connectors. The first connector can include a first electronic component mounted on a first component mount region of the first substrate. The second connector can include a second electronic component mounted on a second component mount region of the second substrate. The first connector and the second connector have different profiles from each other as seen from a top plan view, and can have wider middle portions that overlap when assembled. The first connector can be configured to connect to a sensor panel and a first external substrate or component. The second connector can be configured to connect to the sensor panel and a second external substrate or component.
H01R 12/78 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
The present disclosure provides a method and a system to estimate LO leakage and quadrature error parameters for a transmitter RF front end, such as a direct up-conversion transmitter RF front end, in a joint fashion. The proposed method utilizes a PN sequence inserted at the transmitter baseband. At the observation receiver side, an RX accumulator is implemented to sum receiver signals to take advantage of a despreading gain using the same PN sequence from transmitter side. Through the despreading process, the receiver-transmitter channel may be estimated and used to extract the quadrature error parameters. The estimated channel may also be used to eliminate user data interference presented within the RX accumulator output, which may further be used to compute the LO leakage.
Multiple transmit and receive channels in a communication transceiver may be dynamically configured using corresponding channel registers. In order to support fast frequency hopping, arbitrary sample rate change or profile switching, the present disclosure proposes a profile-based direct memory access (PDMA) that can be used to transfer data from a memory and program specific profile registers in a randomly accessed addressing manner. PDMAs can offload the system processor from reprogramming many system registers based on external or internal events in a multi channels communication system. Furthermore, a PDMA based DMA controller is proposed to configure the fast frequency hopping registers of the transceiver based on PDMA.
ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY (Ireland)
Inventor
Gullapalli, Hemtej
Soltanmohammadi, Erfan
Abstract
Sensors and methods for determining the state of charge of a battery are described. The state of charge is determined in some instances by applying a current perturbation having a frequency to the battery terminals, monitoring the response signal, and determining the phase of the response signal. The phase may be correlated to the state of charge of the battery, so that once the phase is determined, a determination of the state of charge of the battery may be made. In some situations, the state of charge may be used to determine the operating condition of a load connected to the battery. In some embodiments, the state of charge may be used to determine whether the battery is defective.
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
85.
SYNCHRONIZING COMMUNICATION CHANNELS BETWEEN DIGITAL FRONT-END PROCESSORS
A digital front end processor is proposed that includes a transmit channel and/or a receive channel. The digital front end processor may be a part of a multi-antenna wireless communication system or any other system including multiple data channels for which data output is to be in synchronization. The digital front end processor includes a data buffer to receive input data in synchronization with a first strobe signal and generate output data based in the input data. The digital front end processor is to synchronize the output data of transmit channels or receive channels of a plurality of digital front end processors based on a data delay applied to the input data.
Robust and portable gas detection apparatus using at least two optical light sources (220: 320, 330; 420, 430) of different central wavelengths arranged to propagate in the gas detector along a common pathway (280) towards a common detector (240) and adapted to detect the presence and concentration of gases such as C02, NOx, water vapor, methane, etc.
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
An electronic module includes a package substrate, an integrated device die, a dam structure, and a mounting compound. The integrated device die can have an upper side, a lower side, and an outer side edge. The dam structure can have first and second sidewalls opposing each other. The second sidewall can be nearer to the outer side edge than the first sidewall. The first sidewall can be laterally positioned between a center of the lower side of the integrated device die and the outer side edge. The dam structure can be disposed between a portion of the package substrate and a portion of the lower side of the integrated device die. The mounting compound can be disposed between the lower side of the integrated device die and the package substrate. The dam structure can be positioned between the mounting compound and the outer side edge of the integrated device die.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 23/16 - Fillings or auxiliary members in containers, e.g. centering rings
ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY (Ireland)
ANALOG DEVICES, INC. (USA)
Inventor
Stein, Yosef
Kessler, Seth, S.
Primo, Haim
Abstract
Aspects of the present application allow for measurement of a calibrated resistance for a resistive film in a sensing element, such that effects from contact resistance and background resistance drifts due to factors such as temperature, strain or aging can be reduced or eliminated. In some embodiments, by taking a plurality of two -terminal resistance measurements between various pairs of electrodes on a resistive film, a contact-resistance- independent resistance of a reference portion of the resistive film can be determined. Further, a contact-resistance-independent resistance of a sensing portion of the resistive film can be determined based on a plurality of two -terminal resistance measurements between pairs of electrodes. The resistance of the reference portion can be removed from the measured resistance of the sensing portion, such that variations in the reference portion resistance that are not caused by a sensed environmental condition may be compensated.
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01K 1/20 - Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
G01K 15/00 - Testing or calibrating of thermometers
G01R 31/374 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC] with means for correcting the measurement for temperature or ageing
A MEMS device is provided comprising a mass configured to move along a first axis and a second axis substantially perpendicular to the first axis; a drive structure coupled to the mass and configured to cause the mass to move along the first axis; a sense structure coupled to the mass and configured to detect motion of the mass along the second axis; a stress relief structure coupled to one of the drive structure or the sense structure; and at least one anchor coupled to an underlying substrate of the MEMS device, wherein the stress relief structure is coupled to the at least one anchor and the at least one anchor is disposed outside of the stress relief structure.
A sample testing device is disclosed. The sample testing device can include a first compartment that is configured to receive a test sample, a second compartment that is configured to receive the test sample, a separator that is disposed between and separating the first compartment and the second compartment, and a mechanical lock structure that is configured to lock and unlock a movement of the separator. When the mechanical lock is unlocked, the separator opens to transfer the test sample from the first compartment to the second compartment. The sample testing device can include a sensing assembly.
A MEMS device is provided comprising a substrate; a proof mass coupled to the substrate and configured to move along a resonator axis; a drive structure comprising at least one electrode and configured to drive the proof mass to move along the resonator axis; and a pivoting linkage coupled to the proof mass at first and second ends of the pivoting linkage, the first end comprising a first fixed pivot and the second end comprising a second fixed pivot, the pivoting linkage comprising: a first bar configured to pivot about the first fixed pivot and a first dynamic pivot; a second bar configured to pivot about the second fixed pivot and a second dynamic pivot; and a third bar configured to pivot about the first dynamic pivot and the second dynamic pivot, wherein the proof mass moves along the resonator axis when the pivoting linkage pivots.
Fin field-effect transistor (FinFET) thyristors for protecting high-speed communication interfaces are provided. In certain embodiments herein, high voltage tolerant FinFET thyristors are provided for handling high stress current and high RF power handling capability while providing low capacitance to allow wide bandwidth operation. Thus, the FinFET thyristors can be used to provide electrical overstress protection for ICs fabricated using FinFET technologies, while addressing tight radio frequency design window and robustness. In certain implementations, the FinFET thyristors include a first thyristor, a FinFET triggering circuitry and a second thyristor that serves to provide bidirectional blocking voltage and overstress protection. The FinFET triggering circuitry also enhances turn-on speed of the thyristor and/or reduces total on-state resistance.
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Customizable tunable filters are provided herein. In certain implementations, a tunable filter including: a first filter bank including a plurality of high-pass filters each having a different cutoff frequency, and a second filter bank including a plurality of low-pass filters each having a different cutoff frequency. The tunable filter further includes a first pair of switches configured to select a first filter chosen from the first filter bank, and a second pair of switches configured to select a second filter chosen from the second filter bank. The tunable filter operates with a first cutoff frequency of the first filter and with a second cutoff frequency of the second filter.
A substance delivery device is disclosed. The substance delivery device includes a lever that includes a drive arm that is rotatable about a pivot. The substance delivery device also includes a pump that has a deformable chamber. The deformable chamber is configured to rotate the drive arm about the pivot towards a container so as to deform the container to drive a fluid substance from the container.
A reader apparatus with software-controller power exciter, and methods for operating the same to wirelessly interrogate an environmental or structural sensor are disclosed. Some aspects of the application are directed to a reader apparatus that transmits high power for a fast cold start of a sensor and subsequently switch to low power transmission in response to an indication signal received from the sensor indicating that a state of charge of the sensor has reached a threshold value such that high power transmission is no longer necessary, thereby extending battery life of the reader apparatus.
Systems and methods are disclosed for phase unwrapping for time-of-flight imaging. A method is provided for phase unwrapping that includes measuring a plurality of wrapped depths at a respective plurality of frequencies, wherein each of the plurality of wrapped depths corresponds to a respective phase, generating a plurality of unwrapped phases based on a probability distribution function, by unwrapping each of the plurality of wrapped depths, and identifying a Voronoi cell.
G01S 7/4915 - Time delay measurement, e.g. operational details for pixel components; Phase measurement
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
A sensor for measuring the contents of a syringe or other container is described. The sensor includes a voltage source, a pair of electrodes, a measurement circuit, and an electrode shield. The voltage source is coupled to the electrodes, and the electrodes apply an electric field through at least a portion of the container or syringe. The measurement circuit measures capacitance across the electrodes. The electrode shield partially encloses the pair of electrodes. The electrode shield may include an inner electrode shield having a second voltage, and an outer electrode shield having a third voltage.
G01F 23/26 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
G01F 23/22 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
G01F 23/02 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by gauge glasses or other apparatus involving a window or transparent tube for directly observing the level to be measured or the level of a liquid column in free communication with the main body of the liquid
An automated testing system comprises a high side switch circuit coupled to an input/output (I/O) connection, a low side switch circuit coupled to the I/O connection, a high side force amplifier (HFA) coupled to the high side switch, a low side force amplifier (LFA) coupled to the low side switch, an adjusting circuit coupled to the HFA and the LFA, and a control circuit configured to change the adjusting circuit to change control of current at the I/O connection from one of the HFA or LFA to the other of the HFA or LFA.
A clamp circuit comprises an output transistor and a replica transistor coupled as a current mirror pair, wherein the replica transistor is scaled in size to the output transistor by a size ratio; a first current source configured to set a current in the replica transistor, wherein the output current is set at a clamped output current value that is a sum of current of the first current source and a scaled value of the current of the first current source determined according to the size ratio; and a register circuit, wherein a register value stored in the register circuit sets the clamped output current value.
An impedance sensing circuit includes three impedance elements and a sensing element arranged in a bridge configuration. A first input terminal is coupled to two of the impedance elements to apply a stimulus signal. In a mutual-sensing mode, a second input terminal is coupled to the third impedance element and the sensing impedance element to apply an opposite phase stimulus signal. The impedance sensing circuit may be configured in a self-sensing mode, in which the opposite phase stimulus signal is decoupled from the third impedance element and the sensing impedance element. At least one of the impedance elements is variable and may be adjusted to balance an offset impedance load on the sensing element.
patents
