JX Nippon Mining & Metals Corporation

Japon


 
Quantité totale PI 1 637
Quantité totale incluant filiales 1 708 (+ 71 pour les filiales)
Rang # Quantité totale PI 748
Note d'activité PI 3,5/5.0    666
Rang # Activité PI 1 069
Activité incl filiales 3,2/5.0    698
Parent JX Holdings, Inc.
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

613 3
80 1
935 0
5
 
Dernier brevet 2023 - Metal resin composite electromag...
Premier brevet 1991 - Pretreating solution for silver ...
Dernière marque 2018 - ACROTEC
Première marque 1988 - ACROTEC

Filiales

4 subsidiaries with IP (42 patents, 29 trademarks)

2 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2022 Invention Nonmagnetic material-dispersed fe-pt based sputtering target. Provided is a sputtering target wh...
Invention Sputtering target. A sputtering target according to the present invention contains Co and Pt as ...
Invention Sputtering target member, sputtering target assembly, and film forming method. Provided is a sput...
Invention Fe-pt-c-based sputtering target member, sputtering target assembly, method for forming film, and ...
Invention Method for producing cobalt solution, method for producing cobalt salt, method for producing nick...
Invention Igzo sputtering target. The present invention provides an IGZO sputtering target which has a high...
Invention Pure copper or copper alloy powder for deposition modeling. The present invention addresses the p...
Invention Metal resin composite electromagnetic shielding material. The present invention provides a metal ...
Invention Sputtering target and method for producing sputtering target. This sputtering target is formed fr...
Invention Sputtering target and method for manufacturing same. The present invention addresses the problem ...
Invention Layered body having function as transparent electroconductive film and method for producing same,...
Invention Magnetic particle powder and magnetic particle dispersion. Provided is a magnetic particle powder...
Invention Metal-resin composite body. A metal-resin composite body 1 is provided with a metal plate 2, and ...
Invention Indium phosphide substrate. An indium phosphide substrate, the phosphide substrate has an angle ...
Invention Indium phosphide substrate. fbb from the wafer edge on the reverse side of the main surface is 15...
Invention Laminate and method for manufacturing same. Provided is a laminate that enhances an electromagnet...
Invention Brookite-type crystalline titanium oxide powder, and method for producing brookite-type crystalli...
Invention Method for treating battery waste. This method for treating battery waste includes: a first heat ...
Invention Treatment method for battery waste. A method for treating battery waste includes: a first heat tr...
Invention Copper oxide-containing powder, conductive paste, and copper oxide-containing powder manufacturin...
Invention Copper powder. Copper powder comprising copper particles wherein the compacted bulk density is 1....
Invention Male pin for connector and manufacturing method of male pin for connector. Provided are a male pi...
Invention Sputtering target and method for manufacturing the same. A ceramic sputtering target, wherein wh...
Invention Surface-treated copper foil, copper-clad laminate and printed wiring board. The present invention...
Invention Surface-treated copper foil, copper-clad laminate, and printed wiring board. This surface-treated...
Invention Surface-treated copper foil, copper-cladded laminate plate, and printed wiring board. A surface-t...
Invention Surface-treated copper foil, copper-clad laminate plate, and printed wiring board. Provided is a ...
Invention Surface-treated copper foil, copper-clad laminate board, and printed wiring board. This surface-t...
2021 Invention Electrical and electronic component scrap processing method, and electrical and electronic compon...
Invention Positive electrode active material for all-solid-state lithium ion batteries, positive electrode ...
Invention Indium phosphide substrate, semiconductor epitaxial wafer, method for producing indium phosphide ...
Invention Plated material and electronic component. The present invention provides: a plated material which...
Invention Smelting furnace and method for operating same. The smelting furnace according to the present inv...
Invention Copper alloy powder having si coating film and method for producing same. Provided is a copper a...
Invention Method for producing lithium hydroxide. Provided is a method for producing lithium hydroxide, wh...
Invention Heat treatment method for battery waste and lithium recovery method. A method for heat-treating ...
Invention Method for removing linear objects, device for removing linear objects, and method for processing...
Invention Mg2si single crystal, mg2si single crystal substrate, infrared light receiving element and method...
Invention Packaging container, packaging method, and metal foil transport method. Provided are a packaging...
2020 Invention High-purity molybdenum oxychloride and manufacturing method therefor. Provided is a molybdenum o...
Invention Yag ceramic joined body and production method therefor. A YAG ceramic bonded body in which a YAG...
Invention Method for processing ore or refining intermediate. A method for processing ores containing gold...
Invention Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosph...
Invention Raw material discharge device, method of processing of electronic/electrical device component scr...
Invention Method for dissolving tin (ii) oxide. The present invention provides a method for producing an a...
Invention Sputtering target product and method for producing recycled sputtering target product. The discl...
2018 P/S Compound semiconductors; semi-conductor wafers; semi-conductors; semiconductor chips; connectors ...
2016 P/S Copper and its alloys.
2013 P/S Foils of metal for electronic circuits; copper foil and Copper-aluminium foils.
2009 P/S Copper and copper alloy for use as sputtering targets. Sputtering targets made of copper and copp...
P/S sputtering targets made of copper and copper alloy
2008 P/S Industrial chemicals; chemical reagents, other than for medical or veterinary purposes; copper su...
1993 P/S metallic laminate used as a component in the manufacture of printed circuit boards
1988 P/S Semiconductor wafers, and connectors for optical fibers.
P/S SEMICONDUCTOR CHIPS, SEMICONDUCTOR WAFERS, [ LARGE-SCALE INTEGRATED CIRCUITS, SURFACE ACOUSTIC WA...