2023
|
Invention
|
Sputtering target and manufacturing method therefor.
A sputtering target according to one embodi... |
|
Invention
|
Method for dissolving lithium compound, method for manufacturing lithium carbonate, and method fo... |
|
Invention
|
Method for recovering lithium from lithium ion battery scrap.
A method for recovering lithium fr... |
|
Invention
|
Magnetic film and perpendicular magnetic recording medium.
Provided is a sputtering target, the ... |
|
Invention
|
Copper alloy for electronic material, and electronic component. This copper alloy for an electron... |
2022
|
Invention
|
Method for recovering metals from lithium ion battery waste. Provided is a method for efficiently... |
|
Invention
|
Nonmagnetic material-dispersed fe-pt based sputtering target.
Provided is a sputtering target wh... |
|
Invention
|
Multilayer body having function of transparent conductive film. The present disclosure addresses ... |
|
Invention
|
Easily crushable electrodeposited copper. A highly pure electrodeposited copper comprising copper... |
|
Invention
|
Oxide film and oxide sputtering target. The present disclosure addresses the problem of providing... |
|
Invention
|
Method for recovering metal from lithium-ion battery waste. Provided is a method for recovering a... |
|
Invention
|
Metal leaching method. A metal leaching method includes contacting battery powder of lithium ion ... |
|
Invention
|
Metal leaching method. The present invention provides a method for leaching out a metal contained... |
|
Invention
|
Mosi2 heater. 2222 heater, the electrode part is provided with a metal film; and an oxide film th... |
|
Invention
|
Rolled copper foil for secondary batteries, secondary battery negative electrode using same, and ... |
|
Invention
|
Sputtering target.
A sputtering target according to the present invention contains Co and Pt as ... |
|
Invention
|
Sputtering target member, sputtering target assembly, and film forming method. Provided is a sput... |
|
Invention
|
Fe-pt-c-based sputtering target member, sputtering target assembly, method for forming film, and ... |
|
Invention
|
Method for producing cobalt solution, method for producing cobalt salt, method for producing nick... |
|
Invention
|
Igzo sputtering target. The present invention provides an IGZO sputtering target which has a high... |
|
Invention
|
Pure copper or copper alloy powder for deposition modeling. The present invention addresses the p... |
|
Invention
|
Metal resin composite electromagnetic shielding material. The present invention provides a metal ... |
|
Invention
|
Sputtering target and method for producing sputtering target. This sputtering target is formed fr... |
|
Invention
|
Magnetic particle powder and magnetic particle dispersion. Provided is a magnetic particle powder... |
|
Invention
|
Metal-resin composite body. A metal-resin composite body 1 is provided with a metal plate 2, and ... |
|
Invention
|
Indium phosphide substrate.
An indium phosphide substrate, the phosphide substrate has an angle ... |
|
Invention
|
Indium phosphide substrate. fbb from the wafer edge on the reverse side of the main surface is 15... |
|
Invention
|
Brookite-type crystalline titanium oxide powder, and method for producing brookite-type crystalli... |
|
Invention
|
Surface-treated copper foil, copper-clad laminate and printed wiring board. The present invention... |
|
Invention
|
Surface-treated copper foil, copper-clad laminate, and printed wiring board. This surface-treated... |
|
Invention
|
Surface-treated copper foil, copper-cladded laminate plate, and printed wiring board. A surface-t... |
|
Invention
|
Surface-treated copper foil, copper-clad laminate plate, and printed wiring board. Provided is a ... |
|
Invention
|
Surface-treated copper foil, copper-clad laminate board, and printed wiring board. This surface-t... |
2021
|
Invention
|
Indium phosphide substrate, semiconductor epitaxial wafer, method for producing indium phosphide ... |
|
Invention
|
Indium phosphide substrate, method for manufacturing indium phosphide substrate, and semiconducto... |
|
Invention
|
Copper powder, and method for manufacturing copper powder.
A copper powder containing copper par... |
|
Invention
|
Smelting furnace and method for operating same. The smelting furnace according to the present inv... |
|
Invention
|
Sputtering target, manufacturing method therefor, and manufacturing method for magnetic recording... |
|
Invention
|
Method for producing mixed metal salt.
A method for producing mixed metal salts containing manga... |
|
Invention
|
Method for producing mixed metal solution and method for producing mixed metal salt.
A method fo... |
|
Invention
|
Method for producing lithium hydroxide.
Provided is a method for producing lithium hydroxide, wh... |
|
Invention
|
Equipment and method for leaching copper, and method for producing electrolytic copper using said... |
|
Invention
|
Sulfide-based solid electrolyte and all-solid lithium ion battery.
Provided are sulfide-based so... |
|
Invention
|
Heat treatment method for battery waste and lithium recovery method.
A method for heat-treating ... |
|
Invention
|
Method for removing linear objects, device for removing linear objects, and method for processing... |
|
Invention
|
Packaging container, packaging method, and metal foil transport method.
Provided are a packaging... |
2020
|
Invention
|
Sputtering target product and method for producing recycled sputtering target product.
The discl... |
2019
|
Invention
|
Novel peptide and method for using same.
Provided is a method for selecting arsenic-containing m... |
2018
|
P/S
|
Compound semiconductors; semi-conductor wafers; semi-conductors; semiconductor chips; connectors ... |
2016
|
P/S
|
Copper and its alloys. |
2013
|
P/S
|
Foils of metal for electronic circuits; copper foil and Copper-aluminium foils. |
2009
|
P/S
|
Copper and copper alloy for use as sputtering targets. Sputtering targets made of copper and copp... |
|
P/S
|
sputtering targets made of copper and copper alloy |
2008
|
P/S
|
Industrial chemicals; chemical reagents, other than for medical or veterinary purposes; copper su... |
2001
|
P/S
|
Copper foil having a layer of resistive material thereon for use in forming printed circuit boards |
1988
|
P/S
|
Semiconductor wafers, and connectors for optical fibers. |
|
P/S
|
SEMICONDUCTOR CHIPS, SEMICONDUCTOR WAFERS, [ LARGE-SCALE INTEGRATED CIRCUITS, SURFACE ACOUSTIC WA... |