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2023
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Invention
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Pit-less chemical mechanical planarization process and device structures made therefrom.
A cavit... |
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Invention
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Feature patterning using pitch relaxation and directional end-pushing with ion bombardment.
A me... |
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Invention
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Semiconductor device package having warpage control and method of forming the same.
A semiconduc... |
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Invention
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Clock duty cycle adjustment and calibration circuit and method of operating same.
A clock circui... |
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Invention
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Selective removal of an etching stop layer for improving overlay shift tolerance.
An example emb... |
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Invention
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Image sensor scheme for optical and electrical improvement.
The present disclosure, in some embo... |
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Invention
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Isolation structure for active devices.
The present disclosure relates to an integrated chip. Th... |
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Invention
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System and method for heating semiconductor wafers.
A semiconductor process system includes a wa... |
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Invention
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Through vias of semiconductor structure and method of forming thereof.
A semiconductor structure... |
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Invention
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Gate electrode extending into a shallow trench isolation structure in high voltage devices.
In s... |
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Invention
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Magnetic tunnel junction devices.
In an embodiment, a device includes: a magnetoresistive random... |
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Invention
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Integrated circuit stack verification method and system for performing the same.
A method of ver... |
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Invention
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Structure for microelectromechanical systems (mems) devices to control pressure at high temperatu... |
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Invention
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Intersecting module.
An intersecting module is provided. The intersecting module includes a plur... |
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Invention
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Array boundary structure to reduce dishing.
A semiconductor structure including a semiconductor ... |
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Invention
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Latch circuit and method of operating the same.
A latch circuit includes first and second supply... |
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Invention
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Integrated circuit device and method.
An integrated circuit (IC) device includes a power control... |
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Invention
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Two-dimensional grating coupler and methods of making same.
Disclosed are apparatus and methods ... |
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Invention
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Apparatus and methods for handling die carriers.
Apparatus and methods for handling die carriers... |
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Invention
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Porogen bonded gap filling material in semiconductor manufacturing.
A device includes a substrat... |
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Invention
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Backside gate contact.
Semiconductor structures and methods of forming the same are provided. A ... |
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Invention
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Sram-based cell for in-memory computing and hybrid computations/storage memory architecture.
An ... |
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Invention
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Two-port sram structure.
An integrated circuit structure includes a Static Random Access Memory ... |
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Invention
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Integrated circuit with embedded high-density and high-current sram macros.
A semiconductor stru... |
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Invention
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Method and structure for metal gate boundary isolation.
A semiconductor structure includes a fir... |
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Invention
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Image sensor and method of making.
A method of making an image sensor includes depositing a shie... |
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Invention
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Gate all around semiconductor structure with diffusion break.
The current disclosure describes t... |
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Invention
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Semiconductor device comprising a photodetector with reduced dark current.
Various embodiments o... |
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Invention
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Semiconductor device structure with inner spacer.
A semiconductor device structure is provided. ... |
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Invention
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Memory array circuit and method of manufacturing same.
A method of forming a memory circuit incl... |
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Invention
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Non-volatile static random access memory (nvsram) with multiple magnetic tunnel junction cells.
... |
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P/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. |
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P/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits |
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2022
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P/S
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Semiconductors; memory chips; semiconductor wafers; integrated circuits; electronic machines; tel... |
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P/S
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Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device... |
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P/S
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Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic... |
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Invention
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Stacked image sensors and methods of manufacturing thereof.
A semiconductor device includes a fi... |
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P/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear... |
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P/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea... |
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Invention
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Image sensor integrated circuit with isolation structure and method.
A method includes: forming ... |
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Invention
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Wafer bonding method and bonded device structure.
In an embodiment, a method includes: receiving... |
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Invention
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Wafer bonding method and bonded device structure.
In an embodiment, a structure includes: a firs... |
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P/S
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Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu... |
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Invention
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High density capacitor.
A method of forming a capacitor is disclosed. The method includes formin... |
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Invention
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Systems and methods for producing ultrapure water for semiconductor fabrication processes.
Syste... |
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Invention
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Semiconductor devices and methods for increased capacitance.
Semiconductor devices having increa... |
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Invention
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Data processing method, data processing circuit, and computing apparatus.
A data processing meth... |
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Invention
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Semiconductor package structure and method for forming the same.
A semiconductor structure inclu... |
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Invention
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Semiconductor devices and methods of formation.
Various back end of line (BEOL) layer formation ... |
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Invention
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Crack detector units and the related semiconductor dies and methods.
The present disclosure prov... |
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Invention
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Capacitor with contact structures for capacitance density boost.
Various embodiments of the pres... |
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Invention
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Semiconductor structure and forming method thereof.
A semiconductor structure and a method are p... |
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Invention
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In-situ defect count detection in post chemical mechanical polishing.
In-situ defect count detec... |
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Invention
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Inspection apparatus, manufacturing method of integrated circuit, and inspection method.
An insp... |
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Invention
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Semiconductor device with conductive liners over silicide structures and method of making the sem... |
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Invention
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Semiconductor device and manufacturing methods thereof.
Some implementations described herein pr... |
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Invention
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Data backup unit for static random-access memory device.
Various embodiments of the present appl... |
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Invention
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Bonding structure and method thereof.
A bonding method and a bonding structure are provided. A d... |
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2021
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P/S
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Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i... |
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2020
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P/S
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Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor... |
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P/S
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Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a... |
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P/S
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Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s... |
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2018
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P/S
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Semiconductors; computer memory chips; wafers, namely, silicon wafers and structured semi-conduct... |
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P/S
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Custom manufacture of semiconductors, memory chips, wafers, and integrated circuits Product resea... |
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2011
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P/S
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Semiconductor integrated circuit wafer fabrication services for others; custom fabrication of sem... |
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2008
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P/S
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Semiconductors and integrated circuits. Custom manufacture of semiconductors, memory chips, wafer... |
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P/S
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Semiconductors and integrated circuits |
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P/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Scientific res... |
