Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine


 
Quantité totale PI 37 087
Quantité totale incluant filiales 37 178 (+ 216 pour les filiales)
Rang # Quantité totale PI 13
Note d'activité PI 4,9/5.0    30 038
Rang # Activité PI 8
Activité incl filiales 4,8/5.0    30 098
Symbole boursier
ISIN TW0002330008
Capitalisation 22.9T  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

36 979 36
10 5
17 0
40
 
Dernier brevet 2024 - Method of analyzing semiconducto...
Premier brevet 1985 - Amplitude enhanced sampled clipp...
Dernière marque 2023 - N6e
Première marque 1994 - TSMC

Filiales

3 subsidiaries with IP (213 patents, 3 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Shielding structure for ultra-high voltage semiconductor devices. A method for manufacturing a d...
Invention Surface modification layer for conductive feature formation. Embodiments described herein relate...
Invention Photonic semiconductor device and method of manufacture. A package includes a photonic layer on ...
Invention Power cell for semiconductor devices. A device includes an electrical circuit. The device furthe...
Invention Vertically mounted die groups. A semiconductor package includes: a base substrate structure; and...
Invention System for designing a semiconductor device, device made, and method of using the system. A semi...
Invention Ferroelectric memory device using back-end-of-line (beol) thin film access transistors and method...
Invention Nanosheet semiconductor device and method for manufacturing the same. A method for manufacturing...
Invention Interconnect layout for semiconductor device. A semiconductor device and a method of forming the...
Invention Gate all around transistor with dual inner spacers. A method for forming a gate all around trans...
Invention Forming a cavity with a wet etch for backside contact formation. In some embodiments, the presen...
Invention Semiconductor device including vertical transistor with back side power structure. A semiconduct...
Invention Source/drain epitaxial layer profile. The present disclosure describes a method that mitigates t...
Invention Methods of controlling pcram devices in single-level-cell (slc) and multi-level-cell (mlc) modes ...
Invention Method of analyzing semiconductor structure. A method includes providing a detector disposed abo...
Invention Slurry monitoring device, cmp system and method of in-line monitoring a slurry. A slurry monitor...
Invention Package structure and method of forming the same. A package structure and method of forming the ...
Invention Selective deposition of a protective layer to reduce interconnect structure critical dimensions. ...
Invention Semiconductor structure, electronic device, and method of manufacturing semiconductor structure. ...
Invention Wafer notch positioning detection. An optical system may include a light source to provide a bea...
Invention Transistor device having ultraviolet attenuating capability. A transistor device includes a firs...
Invention Methods, structures and devices for intra-connection structures. Systems and methods are provide...
Invention Package structure and method of forming the same. A package structure includes a thermal dissipa...
Invention Discrete time loop based thermal control. In an embodiment, a circuit includes: an error amplifi...
Invention Method of manufacturing semiconductor device. A reticle enclosure includes a base including a fi...
Invention First fire operation for ovonic threshold switch selector. First fire operations for an ovonic t...
Invention Finfet device. A fin-type field-effect transistor (FinFET) device includes a plurality of fins f...
Invention Contact formation method and related structure. A method and structure for forming a via-first m...
Invention Methods of reducing gate spacer loss during semiconductor manufacturing. A method includes formi...
Invention Semiconductor devices. In an embodiment, a device includes: a first nanostructure over a substra...
Invention Vias for cobalt-based interconnects and methods of fabrication thereof. Interconnect structures ...
Invention Semiconductor device and method of manufacture. A semiconductor device includes a first conducti...
Invention Transistors having nanostructures. A semiconductor device according to the present disclosure in...
Invention Semiconductor devices and methods of forming the same. A semiconductor device includes a substra...
Invention Package structure and manufacturing method thereof. A package structure includes a first redistr...
Invention Semiconductor device with helmet structure between two semiconductor fins. A semiconductor devic...
Invention Memory array test structure and method of forming the same. A test structure for 3D memory array...
Invention Semiconductor device and method. A method of manufacturing a semiconductor device includes formi...
Invention Source/drain structure for semicondcutor device. The present disclosure describes a semiconducto...
2023 Invention Extreme ultraviolet mask with tantalum base alloy absorber. An extreme ultraviolet mask includin...
Invention Extreme ultraviolet mask and method for forming the same. A photolithography mask includes a sub...
Invention Methods for wafer bonding. Methods for improving wafer bonding performance are disclosed herein....
Invention Photoresist top coating material for etching rate control. A patterning stack is provided. The p...
Invention Dielectric gas spacer formation for reducing parasitic capacitance in a transistor including nano...
Invention Semiconductor structure and manufacturing method thereof. A method includes forming a plurality ...
Invention Die bonding tool with tiltable bond head for improved bonding and methods for performing the same...
Invention Semicondcutor devices and methods of forming the same. A method of forming a semiconductor devic...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
Invention Semiconductor device and manufacturing method thereof. A method includes depositing an epitaxial...
Invention Semiconductor metrology system and method. A machine learning system and method for optical crit...
2022 Invention Dbi encoding device and dbi encoding method. The disclosure provides a data bus inversion (DBI) ...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; electronic machines; tel...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
P/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea...
P/S Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu...
2021 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
2020 P/S Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
P/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
2018 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and structured semi-conduct...
P/S Custom manufacture of semiconductors, memory chips, wafers, and integrated circuits Product resea...
2011 P/S Semiconductor integrated circuit wafer fabrication services for others; custom fabrication of sem...
2008 P/S Semiconductors and integrated circuits. Custom manufacture of semiconductors, memory chips, wafer...
P/S Semiconductors and integrated circuits
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Scientific res...