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Résultats pour
brevets
1.
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FLUID CONTAINER UNIT AND METHOD FOR INJECTING DIFFERENT KINDS OF FLUIDS INTO FLUID USAGE EQUIPMENT
Numéro de document |
02740768 |
Statut |
Délivré - en vigueur |
Date de dépôt |
2009-10-15 |
Date de disponibilité au public |
2010-04-22 |
Date d'octroi |
2016-04-05 |
Propriétaire |
- SARAYA CO., LTD. (Japon)
- OLYMPUS CORPORATION (Japon)
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Inventeur(s) |
- Nishio, Suguru
- Kotani, Kojiro
- Inoue, Ryo
- Iwanami, Takayoshi
- Sato, Yoshiyuki
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Abrégé
The present invention is directed to a fluid container unit comprising: a container coupling for coupling a supply/discharge port of a first container with a supply/discharge port of a second container; a single nozzle member having a nozzle tube; a connection cap having one end for holding a base portion of the nozzle member and another end for covering one side of the container coupling by fitting around an outer periphery thereof; an intermediate adaptor having a pair of pusher elements facing to the first and the second supply/discharge port respectively, and being held movably in a direction along a longitudinal axis of the nozzle tube in the connection cap, and a supply/discharge port opening mechanism for moving the intermediate adaptor toward the container coupling and opening the supply/discharge ports by the pusher elements. Thereby, in configuring a fluid container unit by integrally-assembling two containers for respectively accumulating different kinds of fluids in a parallel arrangement, the workability in fixing the fluid container unit to an injection site of a fluid usage equipment is improved, and the injection site can be configured to be more compact.
Classes IPC ?
- A61B 1/12 - Instruments pour procéder à l'examen médical de l'intérieur des cavités ou des conduits du corps par inspection visuelle ou photographique, p.ex. endoscopes; Dispositions pour l'éclairage dans ces instruments avec système de refroidissement ou de rinçage
- B65D 81/32 - Réceptacles, éléments d'emballage ou paquets pour contenus présentant des problèmes particuliers de stockage ou de transport ou adaptés pour servir à d'autres fins que l'emballage après avoir été vidés de leur contenu pour emballer plusieurs matériaux différents qui doivent être maintenus séparés avant d’être mélangés
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2.
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IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME
Numéro de document |
02611916 |
Statut |
Délivré - en vigueur |
Date de dépôt |
2006-05-25 |
Date de disponibilité au public |
2007-02-01 |
Date d'octroi |
2011-11-08 |
Propriétaire |
OLYMPUS CORPORATION (Japon)
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Inventeur(s) |
Fujimori, Noriyuki
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Abrégé
An object is to realize an imaging apparatus in which an optical system that focuses light from an object can be readily attached to a solid-state imaging sensor, and in which an unnecessary external light other than the light from the object can be blocked without fail. An imaging apparatus of the present invention includes a solid-state imaging sensor (2) that receives the light from the object and performs photoelectric conversion, an optical system (3) that focuses the light from the object, and a resin material (5). The solid-state imaging sensor (2) has a semiconductor chip which receives the light from the object through a light receiving surface and performs the photoelectric conversion. A translucent member is provided on an upper surface of the semiconductor chip and electrode terminals is provided on a lower surface of the semiconductor chip. The optical system (3) is provided on a light receiving region on a surface of the translucent member. The light receiving region faces the light receiving surface. The resin material (5) reinforces a bonding strength of a circuit board (4) on which the solid- state imaging sensor (2) is placed and the group of electrode terminals of the solid-state imaging sensor (2), and shields a region outside the light receiving region of the translucent member from light.
Classes IPC ?
- H01L 27/14 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit ra
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3.
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Numéro de document |
02536799 |
Statut |
Délivré - en vigueur |
Date de dépôt |
2004-08-25 |
Date de disponibilité au public |
2005-03-10 |
Date d'octroi |
2013-11-12 |
Propriétaire |
OLYMPUS CORPORATION (Japon)
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Inventeur(s) |
- Yamamoto, Satoshi
- Suemasu, Tatsuo
- Hirafune, Sayaka
- Isokawa, Toshihiko
- Shiotani, Koichi
- Matsumoto, Kazuya
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Abrégé
A semiconductor package includes a semiconductor element having a circuit element arranged on a first surface of a semiconductor substrate; an external wiring region arranged on a second surface of the semiconductor substrate; a support substrate arranged on the first surface of the semiconductor substrate; an electrode pad arranged on the first surface of the semiconductor substrate; and a through electrode reaching from the electrode pad to the second surface of the semiconductor substrate.
Classes IPC ?
- H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
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