A coil component having improved magnetic characteristics. The coil component includes a body having a substantially hexahedral shape and including a winding portion formed by winding a conductive wire based on a winding axis and a magnetic body portion; and paired metal terminals having joint portions to which first and second ends of the conductive wire are electrically connected. Each of the paired metal terminals extends outside an outer surface of the body parallel to the winding axis. Of four quadrants separated from one another by imaginary coordinate axes that are orthogonal to one another with the center of the body as the origin in plan view in the winding axis direction, more than half the area of one of the joint portions is disposed in a quadrant not adjacent to the quadrant in which more than half the area of the other joint portion is disposed.
A circuit module comprises a substrate module, an electronic component, and a first conductive joining member. The substrate module includes a circuit substrate having an upper main surface and a lower main surface, an insulating member covering the upper main surface of the circuit substrate, an insulating member covering the upper main surface of the circuit substrate, and a first metal pin that passes through the insulating member parallel to a vertical axis and is electrically connected to the circuit substrate. The first metal pin has a first exposed portion. The first exposed portion is exposed from the insulating member to face a right direction. A first outer electrode has a left projecting portion projecting in a left direction from the left surface. A first conductive joining member joins the first exposed portion and the left projecting portion to each other.
A case includes a case body including an accommodation space to accommodate electronic components and a discharge port to discharge the electronic components accommodated in the accommodation space, a shutter slidable relative to the case body to open and close the discharge port, a slider integral with the shutter to perform a slide operation of the shutter, and an operation opening in the case body to expose the slider to outside to allow for operation of the slider. A seal including a portion that covers and seals at least the operation opening is attachable to the case body.
The deterioration in characteristics of a filter is reduced. In a high frequency module, the filter includes a first substrate, a first functional electrode provided on the first substrate and forming a part of an antenna end resonator, a second substrate separate from the first substrate, and a second functional electrode provided on the second substrate and forming a part of at least one acoustic wave resonator other than the antenna end resonator among a plurality of acoustic wave resonators. A first electronic component including the first substrate and the first functional electrode is disposed on the first main surface of the mounting substrate. An inductor is adjacent to the first electronic component in a plan view from a thickness direction of the mounting substrate. The inductor does not overlap the antenna end resonator in a side view from a direction of a winding axis of a winding portion.
An alignment device includes a pallet including a flat plate portion and a lateral wall portion defining an alignment area to which chips are supplied, recessed portions defining holding positions in the alignment area to hold the chips in an alignment state, a supply port defined by a portion of the lateral wall portion being open and allowing the chips to be supplied into the alignment area from outside of the lateral wall portion, and a magnet defining a moving holder at least at either one of the flat plate portion or the lateral wall portion to cause each of the chips supplied from the supply port to the alignment area to move to a corresponding one of the recessed portions and hold each of the chips at a corresponding one of the recessed portions.
H01G 13/00 - Appareils spécialement adaptés à la fabrication de condensateurs; Procédés spécialement adaptés à la fabrication de condensateurs non prévus dans les groupes
H01G 4/012 - Forme des électrodes non autoporteuses
6.
ANTENNA MODULE AND COMMUNICATION DEVICE EQUIPPED WITH THE ANTENNA MODULE
An antenna module has a substrate, a radiating element disposed in or on the substrate, a power feeding line, and a dielectric body. The substrate has a rectangular shape including first and second sides adjacent to each other. The power feeding line extends in a normal direction of the substrate and transfers radio frequency signals supplied from an RFIC to the radiating element. The dielectric body is disposed on a side surface of the substrate. The power feeding line is coupled to the radiating element at a position offset from the center of the radiating element in a first direction toward the first side. The dielectric body is disposed so as to cover the side surface of the substrate including the first side. The dielectric constant of the dielectric body is higher than the dielectric constant of the substrate.
H01Q 21/24 - Combinaisons d'unités d'antennes polarisées dans des directions différentes pour émettre ou recevoir des ondes polarisées circulairement ou elliptiquement ou des ondes polarisées linéairement dans n'importe quelle direction
To provide a battery pack including a heat-absorbing member capable of suppressing permeation of a heat-absorbing agent. A battery pack includes a secondary battery and a heat-absorbing member that includes a heat-absorbing agent and an exterior member accommodating the heat-absorbing agent and is in contact with the secondary battery at least in part, wherein the exterior member includes a metal layer, a resin layer overlapping the metal layer, and a sealing portion sealing the heat-absorbing agent, the metal layer is located inside the exterior member, and the metal layers are joined to each other at the sealing portion.
H01M 10/6555 - Barres ou plaques disposées entre les éléments
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/643 - Chauffage ou refroidissement; Commande de la température caractérisé par la forme des éléments Éléments cylindriques
H01M 10/653 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des matériaux électriquement isolants ou thermiquement conducteurs
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p.ex. ronde ou elliptique
A method of controlling a converter apparatus operable based on a first frequency modulation control signal and at least one second frequency modulation control signal, includes determining updated periods of the first frequency modulation control signal and the at least one second frequency modulation control signal based on the output, for each second frequency modulation control signal, at a beginning of each period of the first frequency modulation control signal, determining a phase shift of the second frequency modulation control signal relative to the first frequency modulation control signal, when a difference between the phase shift and a target phase shift exceeds a predetermined threshold, determining the period of the second frequency modulation control signal as the updated period increased or decreased by a predetermined amplitude, otherwise determining the period of the second frequency modulation control signal as the updated period.
H02M 1/00 - APPAREILS POUR LA TRANSFORMATION DE COURANT ALTERNATIF EN COURANT ALTERNATIF, DE COURANT ALTERNATIF EN COURANT CONTINU OU VICE VERSA OU DE COURANT CONTINU EN COURANT CONTINU ET EMPLOYÉS AVEC LES RÉSEAUX DE DISTRIBUTION D'ÉNERGIE OU DES SYSTÈMES D'ALI; TRANSFORMATION D'UNE PUISSANCE D'ENTRÉE EN COURANT CONTINU OU COURANT ALTERNATIF EN UNE PUISSANCE DE SORTIE DE CHOC; LEUR COMMANDE OU RÉGULATION - Détails d'appareils pour transformation
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p.ex. régulateurs à commutation
9.
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
A multilayer substrate includes a multilayer body including first insulator layers and a second insulator layer stacked on each other. The multilayer body includes first and second regions when viewed in a stacking direction. The first region is a region that does not include the second insulator layer when viewed in the stacking direction. The second region is a region that includes the second insulator layer when viewed in the stacking direction. The first insulator layers include a small-area first insulator layer located in the first region and not located in the second region. The small-area first insulator layer overlaps the second insulator layer when viewed in a first direction. A porosity of the second insulator layer is higher than an overall porosity of the first insulator layers.
A multiplexer includes a common terminal, an inductor including a first end connected to the common terminal and a second end, a filter connected to the second end and having a first pass band, a filter connected to the common terminal and having a second pass band located on a higher frequency side relative to the first pass band, an inductor connected between a ground and a path that links the second end to the filter, and a capacitor connected between the path and the ground. A resonant frequency of an LC parallel resonance circuit including the inductor and the capacitor is located between the first pass band and the second pass band.
A circuit board includes a substrate, a first mounting conductor, a first ground conductor, a first floating conductor, a signal line conductor, and a connection conductor. The first mounting conductor is on a surface of the substrate and includes a first external connection conductor. The first ground conductor is positioned on the substrate opposite to the first mounting conductor. The floating conductor is between the first mounting conductor and the first ground conductor. The signal line conductor is inside the substrate. The connection conductor connects the first mounting conductor and the signal line conductor. When viewed in a thickness direction of the substrate, the signal line conductor and the connection conductor are each provided at a position different from the first external connection conductor, and the floating conductor overlaps an entirety or substantially an entirety of the first external connection conductor.
The present invention provides a multilayer ceramic capacitor that can suppress a decrease in strength against external stress even when the thickness is reduced. A multilayer ceramic capacitor 1 comprises: a multilayer body 10 in which a plurality of dielectric layers 20 formed from a ceramic material and a plurality of internal electrode layers 30 are layered; a plurality of external electrodes 40 disposed on at least a second main surface TS2 of the multilayer body 10; and a stress suppression film 50 that suppresses stress applied to the multilayer body 10 and the plurality of external electrodes 40. The stress suppression film 50 is formed from an insulating material and extends along a first main surface TS1 and two end surfaces LS1, LS2 or along the first main surface TS1 and two side surfaces to cover the multilayer body 10 and the plurality of external electrodes 40. The ends of the stress suppression film 50 protrude with respect to the outermost surfaces of the plurality of external electrodes 40 on the second main surface TS2 side.
Provided is a secondary battery having a higher safety. This secondary battery comprises: a battery element formed by winding a laminated body including a first electrode and a second electrode about a winding axis extending in a first direction; an exterior member having a through hole that penetrates in the first direction and housing the battery element; and an external terminal attached to the exterior member via an insulating member at a position overlapping with the through hole of the exterior member in the first direction. The external terminal has a curved shape including a recessed surface or a protruded surface facing the battery element.
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c. à d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 50/107 - Boîtiers, fourreaux ou enveloppes primaires d’une seule cellule ou d’une seule batterie caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p.ex. ronde ou elliptique
H01M 50/152 - Couvercles caractérisés par leur forme pour des cellules ayant une section transversale courbée, p.ex. ronde ou elliptique
H01M 50/562 - Bornes caractérisées par le matériau
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p.ex. les contacts incorrects des bornes ou des barres omnibus
H01M 50/593 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries caractérisés par les moyens de protection Éléments d’espacement; Plaques d’isolation
14.
OPTICAL DEVICE AND IMAGING UNIT PROVIDED WITH OPTICAL DEVICE
The present disclosure provides an optical device in which foreign substances adhering to the surface of a light-transmitting body can be sufficiently removed, and an imaging unit provided with the optical device. An optical device (10) is provided with an outermost layer lens (1) (light-transmitting body), a housing (2), a vibrating body (3), and a piezoelectric element (5). The outermost layer lens (1) transmits light of a predetermined wavelength. The housing (2) holds the outermost layer lens (1). The vibrating body (3) is a cylindrical body and is in contact with the outermost layer lens (1) at one end, and the piezoelectric element (5) is provided at the other end (32). The vibrating body (3), when in a heat generation mode among multiple vibration modes that vibrate the outermost layer lens (1), vibrates the outermost layer lens (1) at the natural vibration frequency of the outermost layer lens (1) and at a vibration acceleration rate in the range of 3.0×106m/s2to 3.0×108m/s2.
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
G03B 30/00 - Modules photographiques comprenant des objectifs et des unités d'imagerie intégrés, spécialement adaptés pour être intégrés dans d'autres dispositifs, p.ex. des téléphones mobiles ou des véhicules
H04N 23/52 - Caméras ou modules de caméras comprenant des capteurs d'images électroniques; Leur commande - Détails de structure Éléments optimisant le fonctionnement du capteur d'images, p. ex. pour la protection contre les interférences électromagnétiques [EMI] ou la commande de la température par des éléments de transfert de chaleur ou de refroidissement
The purpose of the present invention is to provide a multilayer ceramic electronic component capable of reducing ESR. A multilayer ceramic capacitor 1 has a first external electrode 40A and a second external electrode 40B. The first external electrode 40A has a first base electrode layer 50A, a first conductive resin layer 60A including a thermosetting resin and a metal component disposed on the first base electrode layer 50A, and a first Ni plating layer 71A disposed on the first conductive resin layer 60A. The second external electrode 40B has a second base electrode layer 50B, a second conductive resin layer 60B including a thermosetting resin and a metal component disposed on the second base electrode layer 50B, and a second Ni plating layer 71B disposed on the second conductive resin layer 60B. Tensile stress remains as internal stress inside the first Ni plating layer 71A and the second Ni plating layer 71B.
Provided are: a ceramic substrate which, even upon reception of a thermal shock, can be prevented from suffering a defect in the heat dissipation member or the ceramic layers or from suffering a defect around the interface between the heat dissipation member and a ceramic layer and can be inhibited from deteriorating in bending strength; and a method for producing the ceramic substrate. This ceramic substrate (1) comprises: a multilayer structure (10) comprising a plurality of superposed ceramic layers (11) and having an accommodation part (20) inside; and a heat dissipation member (30) disposed in the accommodation part (20). Along a direction (H) in which the heat dissipation member (30) extends, there is a first cavity (41) between at least some of the outer surface (31) of the heat dissipation member (30) and the inner wall surface (21) of the accommodation part (20).
ABB) of a band (B). The tracker circuit (1A) further comprises: a voltage supply path (P41) that connects the output switch circuit (30) and the power amplifier (2A); a voltage supply path (P42) that connects the output switch circuit (30) and the power amplifier (2B); and a filter circuit (40A) that can be connected in shunt with the voltage supply paths (P41 and P42).
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p.ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
This press head is provided with a head body and a sheet portion. The head body has a press surface. The sheet portion faces the press surface and is fixed so as to have a gap with respect to the press surface. Further, the sheet portion has a flexible layer opposed to the press surface and a release layer formed so as to contact the flexible layer.
AA) of a band (A) to which a TDD is applied. The filter circuit (40A) is not series connected to but connected in shunt with the voltage supply path (P41).
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p.ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
20.
DRIVER WITH BUILT-IN SELF TESTING OF SWITCH STATUS
Methods and devices for reading and programming a state of a switch device are presented. The programming of the state of the switch device is performed by providing driving pulses to the switch device. The amplitude and the width of the driving pulses are a function of one or more of a) temperature of the switch device, b) desired state of the switch device, and c) operational time of the switch device. The described devices include a device to store the data demonstrating the functional relation between the amplitude and the width of the driving pulses and the temperature of the switch device. Such device can be a lookup table or an arithmetic logic unit (ALU). The disclosed switch devices can be PCM switches.
H03K 17/18 - Modifications pour indiquer l'état d'un commutateur
H03K 17/80 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs magnétiques ou diélectriques non linéaires
H03K 17/81 - Dispositifs de commutation comportant plusieurs bornes d'entrée et de sortie, p.ex. multiplexeurs, distributeurs
G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou
H10N 70/20 - Dispositifs de commutation multistables, p.ex. memristors
An acoustic wave device includes a monocrystalline spinel substrate made of a magnesium aluminate single crystal, a piezoelectric layer on the monocrystalline spinel substrate, and an IDT electrode on the piezoelectric layer. Euler angles (ϕ, θ, ψ) of the magnesium aluminate single crystal of the monocrystalline spinel substrate are within a range of any of regions A in FIGS. 5 to 41.
A wireless power transmission system includes a structure surrounded as a whole by an electromagnetic wave-shielding member having an appropriate conductivity, at least one power transmission unit, and at least one power reception unit. A power reception unit includes a power receiver including a dielectric substrate, a rectifier circuit, and a power reception antenna. The power reception antenna includes power reception antenna lines in a same plane on the dielectric substrate. One ends of the power reception antenna lines are connected to the rectifier circuit, and other ends different from the one ends connected to the rectifier circuit are open ends. A planar shape of the dielectric substrate is a 2N-sided polygon with line symmetry (where N is an integer of two or more), and the power reception antenna lines are along N sides that are adjacent to and different from each other of the dielectric substrate.
H02J 50/12 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif du type couplage à résonance
H02J 50/00 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique
H02J 50/40 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant plusieurs dispositifs de transmission ou de réception
23.
HIGH FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS
A high frequency circuit includes a power amplifier and a matching circuit connected to an output terminal of the power amplifier. The matching circuit includes an inductor connected in series to an output transmission path of the power amplifier, a capacitor connected in series to and between one end of the inductor and the ground, an inductor connected in series to and between the capacitor and the ground, a switch having a common terminal, a selection terminal, and a selection terminal, a capacitor connected in series to and between the common terminal and the one end of the inductor. The selection terminal is connected to the ground, and the selection terminal is connected to the other end of the inductor.
An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.
An increase in cost can be suppressed. A high frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal layer has a ground potential and covers a part of the resin layer. The metal layer overlaps a part of the first electronic component and overlaps a part of the second electronic component in plan view from a thickness direction of the mounting substrate. A height of the first electronic component is lower than a height of the second disposal condition in the thickness direction of the mounting substrate. A part of a main surface of the first electronic component that is far away from the mounting substrate is in contact with the metal layer.
H04B 1/03 - TRANSMISSION - Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission Émetteurs - Détails de structure, p.ex. boîtiers, enveloppes
A multilayer coil component includes a multilayer body and outer electrodes. The multilayer body includes insulating layers and a coil. The insulating layers are stacked on top of one another in a stacking direction. The coil is embedded in the multilayer body. The outer electrodes are on an outer surface of the multilayer body and are electrically connected to the coil. The coil includes coil conductors, which are stacked together with the insulating layers in the stacking direction and electrically connected to each other. The coil includes a parallel section in which two or more of the coil conductors stacked in layers are electrically connected in parallel by via conductors interposed therebetween. The parallel section includes a first parallel section and a second parallel section, which is electrically connected in series with the first parallel section.
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes an electrolyte salt and a lithium fluorophosphate. The electrolyte salt includes an imide anion, and the imide anion includes at least one of an anion represented by Formula (1), an anion represented by Formula (2), an anion represented by Formula (3), or an anion represented by Formula (4). The lithium fluorophosphate includes lithium monofluorophosphate, lithium difluorophosphate, or both.
H01M 10/0568 - Matériaux liquides caracterisés par les solutés
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p.ex. batteries à insertion ou intercalation de lithium dans les deux électrodes; Batteries à l'ion lithium
H01M 10/0569 - Matériaux liquides caracterisés par les solvants
28.
RADIO FREQUENCY MODULE AND COMMUNICATION APPARATUS
A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/552 - Protection contre les radiations, p.ex. la lumière
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A first receiving band and a first transmission band in band A and a second transmission band and a second receiving band in band B are listed in frequency order. A radio frequency module includes: first and second boards; a first filter having a passband that is the first transmission band; second and sixth filters each having a passband that is the first receiving band; third and fifth filters each having a passband that is the second receiving band; a first power amplifier connected to the first filter; a fourth filter having a passband that is the second transmission band; and a second power amplifier connected to the fourth filter. The first to third filters and the first power amplifier are disposed on the first board, and the fourth to sixth filters and the second power amplifier are disposed on the second board.
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, base electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers and each including glass and copper, and plated layers respectively provided on an outer side of the base electrode layers. A protective layer including sulfur is provided between the glass included in the base electrode layers and the plated layers.
A secondary battery according to the present disclosure comprises an electrode assembly and an accommodation part that accommodates the electrode assembly. The electrode assembly has: a wound body obtained by winding a laminate in which a positive electrode and a negative electrode are stacked with a separator interposed therebetween; and tabs that protrude from edge sections of the positive electrode and the negative electrode. The wound body has an outer peripheral surface extending in the circumferential direction, and two side sections. The tabs protrude from the side sections of the wound body. The accommodation part is provided with: a metal cover that covers the side sections of the wound body and part of the outer peripheral surface of the wound body, the metal cover being electrically connected to the tabs; and an outer cladding. The outer cladding has: an outer cladding body that surrounds the periphery of the wound body, a central-direction end section of the outer cladding body being welded in an overlapping manner to the outer peripheral surface of the metal cover; and a seal part that is disposed at the outer periphery of the outer cladding body, the seal part being formed by welding together a pair of protruding sections that protrude from one circumferential-direction end section and the other circumferential-direction end section of the outer cladding body.
H01M 50/164 - Couvercles caractérisés par le matériau ayant une structure en couches
H01M 50/176 - Dispositions pour introduire des connecteurs électriques dans ou à travers des boîtiers adaptées à la forme des cellules pour des cellules prismatiques ou rectangulaires
H01M 50/474 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES - Détails de construction ou procédés de fabrication des parties non actives des cellules électrochimiques autres que les piles à combustible, p.ex. piles hybrides Éléments d’espacement dans les cellules Éléments d'espacement à l'intérieur des cellules autres que les séparateurs, les membranes ou les diaphragmes; Leurs procédés de fabrication caractérisés par leur position dans les cellules
H01M 50/477 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES - Détails de construction ou procédés de fabrication des parties non actives des cellules électrochimiques autres que les piles à combustible, p.ex. piles hybrides Éléments d’espacement dans les cellules Éléments d'espacement à l'intérieur des cellules autres que les séparateurs, les membranes ou les diaphragmes; Leurs procédés de fabrication caractérisés par leur forme
H01M 50/533 - Connexions d’électrodes dans un boîtier de batterie caractérisées par la forme des conducteurs ou des languettes
H01M 50/534 - Connexions d’électrodes dans un boîtier de batterie caractérisées par le matériau des conducteurs ou des languettes
H01M 50/545 - Bornes formées par le boîtier de l’élément
32.
AMPLIFICATION CIRCUIT, TRACKER MODULE, AMPLIFICATION MODULE, AND COMMUNICATION DEVICE
An amplification circuit (40) comprises: power amplifiers (21 and 22); trackers (11 and 12) that can output variable power supply voltages; a switch (31) that is connected between the output terminal of the tracker (11) and the output terminal of the tracker (12); and a switch (33) that is connected between the output terminal of the tracker (12) and the power amplifier (22). The output terminal of the tracker (11) is connected to the power amplifier (21).
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p.ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
In the present invention, a transistor comprises a collector layer, a base layer, and an emitter layer stacked in this order on an upper surface, which is one surface of a substrate. Four or more emitter electrodes are electrically connected to the emitter layer. A base electrode includes two or more base fingers electrically connected to the base layer. A collector electrode is electrically connected to the collector layer. The emitter electrodes and the base fingers each have a shape that is long in a first direction in the upper surface of the substrate. The emitter electrodes and the base fingers are disposed side by side in a second direction orthogonal to the first direction in the upper surface of the substrate. In a row of four or more emitter electrodes and two or more base fingers arranged side by side in the second direction, emitter electrodes are disposed at both ends in the second direction. Among inter-base-finger regions, which are each between two base fingers adjacent in the second direction, two emitter electrodes arranged side-by-side in the second direction are disposed in at least one inter-base-finger region. When an area/facing length ratio is defined as the ratio of the area, in plan view, of an emitter electrode to the length of the edge of the emitter electrode that faces one or two base fingers disposed adjacently to the plurality of emitter electrodes, the difference between the maximum value and the minimum value of the area/facing length ratio of each of the plurality of emitter electrodes is not more than 20% of the average value of the area/facing length ratio.
H01L 27/06 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration non répétitive
A plurality of first terminal pins are placed side by side in a first direction. A plurality of second terminal pins are placed to extend in parallel with the plurality of first terminal pins. The plurality of first terminal pins and the plurality of second terminal pins include an inside face facing each other, an outside face opposite to the inside face, and side faces connecting the inside face and the outside face. At least one of the side faces includes a first portion having a relatively rough surface, and a second portion having a relatively fine surface and having approximately the same roughness as the inside face and the outside face.
A filter apparatus includes an input terminal, first and second ground electrodes opposed to each other, and first and second filters connected to the input terminal. The first filter has a first passband. The second filter has a second passband higher than the first passband. Each of the first and second filters includes resonators in stages between the first and second ground electrodes. A resonator in the first stage in the first filter includes a capacitor connected to the second ground electrode and an inductor connected between the capacitor and the first ground electrode. A resonator in the first stage in the second filter includes a capacitor connected between the input terminal and the second ground electrode and an inductor connected between the capacitor and the second ground electrode.
H03H 7/075 - Réseaux en échelle, p.ex. filtres à onde électrique
H03H 7/46 - Réseaux pour connecter plusieurs sources ou charges, fonctionnant sur des fréquences ou dans des bandes de fréquence différentes, à une charge ou à une source commune
36.
FILTER DEVICE AND HIGH-FREQUENCY FRONT-END CIRCUIT PROVIDED WITH THE SAME
A filter device includes a main body, an input terminal, an output terminal, a ground terminal, and resonators. The resonators are located in the main body and are electro-magnetically coupled with each other so as to transmit a signal from the input terminal to the output terminal. Each of the resonators includes a first path connected from nodes via capacitors to the ground terminal, and a second path connected from the nodes to the ground terminal without passing through the capacitors. The second path of a first resonator and the second path of a second resonator are partially shared. The filter device further includes a third path connected with the node of the first resonator and the node of the second resonator.
A method of manufacturing an inductor component includes preparing an insulating paste that is photosensitive and that includes a filler material composed of quartz, a glass material and a resin material, and a conductive paste, forming a first insulating layer by applying the insulating paste, and exposing the first insulating layer in a state where a first portion of the first insulating layer is shielded by a mask. The method further includes removing the first portion of the first insulating layer to form a groove at a position corresponding to the first portion, applying the conductive paste in the groove to form a coil conductor layer in the groove, and applying the insulating paste on the first insulating layer and the coil conductor layer to form a second insulating layer.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateurs; Appareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
H01F 17/00 - Inductances fixes du type pour signaux
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
An electronic component that includes: a ceramic body; and an external electrode on a surface of the ceramic body, wherein the external electrode includes: a base layer in contact with the surface of the ceramic body, the base layer including a granulate of a metal material and a continuous phase of a titanium-containing oxide present around the granulate of the metal material; and a plating layer on the base layer.
A radio frequency circuit includes a carrier amplifier, a peak amplifier, a transformer, and an impedance converting circuit. One end of an input coil is connected to an output of the carrier amplifier, one end of an output coil is connected to an output terminal. The impedance converting circuit includes main and auxiliary lines. One end of the main line is connected to an output of the peak amplifier, and the other end of the main line is connected to the other end of the input coil. One end of the auxiliary line is connected to the one end of the main line, and the other end of the auxiliary line is connected to ground. A first direction from the one end to the other end of the main line, and a second direction from the other end to the one end of the auxiliary line (302) are the same.
H03F 3/21 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs
H03F 3/213 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
A battery pack capable of improving safety is obtained. A battery pack according to an embodiment of the present disclosure includes a secondary battery provided in a power supply path and including a positive electrode and a negative electrode, a first terminal connected to one end of the power supply path, a second terminal connected to the other end of the power supply path, a cutoff circuit provided in the power supply path and cutting off a current flowing through the power supply path, a discharge circuit connected to the positive electrode of the secondary battery and the negative electrode of the secondary battery and discharging the secondary battery, and a control circuit monitoring the secondary battery and causing the cutoff circuit to cut off the current and causing the discharge circuit to discharge the secondary battery when an abnormality is detected based on a monitoring result.
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p.ex. le niveau ou la densité de l'électrolyte
H01M 50/548 - Bornes caractérisées par la position des terminaux sur les cellules sur des côtés opposés de la cellule
41.
NEGATIVE ELECTRODE FOR SECONDARY BATTERY, AND SECONDARY BATTERY
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The negative electrode includes first fiber parts, covering parts, and second fiber parts, and has voids. The first fiber parts are coupled to each other to thereby form a three-dimensional mesh structure having the voids. The first fiber parts each include carbon as a constituent element. The covering parts each cover a surface of corresponding one of the first fiber parts, and each include silicon as a constituent element. At least some of the second fiber parts are each coupled to a surface of any of the covering parts. The second fiber parts each include carbon as a constituent element. The first fiber parts have an average fiber diameter that is greater than or equal to 10 nm and less than or equal to 8000 nm. The second fiber parts have an average fiber diameter that is greater than or equal to 1 nm and less than or equal to 300 nm. The negative electrode has a void rate that is greater than or equal to 40 vol % and less than or equal to 70 vol %.
H01M 4/58 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de structures polyanioniques, p.ex. phosphates, silicates ou borates
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p.ex. batteries à insertion ou intercalation de lithium dans les deux électrodes; Batteries à l'ion lithium
There is provided a method for manufacturing a battery electrode. The method includes: forming a precursor of the battery electrode including a double-sided coating area in which both sides of a current collector are coated with an electrode material layer and a single-sided coating area adjacent to the double-sided coating area; subjecting the current collector located at a boundary portion between the double-sided coating area and the single-sided coating area to a heat treatment locally; and pressurizing the precursor of the battery electrode. The single-sided coating area includes a main side of the current collector that is coated with the electrode material layer.
A stacked semiconductor device capable of increasing heat dissipation comprises a first member and a second member. The first member includes a semiconductor substrate and a first electronic circuit. The first electronic circuit includes a semiconductor element provided on one surface of the semiconductor substrate. A second member is attached to a first surface, which is one surface of the first member. The second member includes a second electronic circuit including another semiconductor element. The second member is provided with a first opening that penetrates the second member in a thickness direction. A first conductor projection is coupled to the first electronic circuit. The first conductor projection protrudes from the first surface of the first member through the first opening of the second member to the outside of the first opening.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H03F 1/56 - Modifications des impédances d'entrée ou de sortie, non prévues ailleurs
H03F 3/195 - Amplificateurs à haute fréquence, p.ex. amplificateurs radiofréquence comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
H03F 3/24 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
Provided is a thermal-excitation-type pressure-wave-generating element with which it is possible to generate higher sound pressure. A pressure-wave-generating element according to the present invention is a thermal-excitation-type element and comprises a first solid insulating layer that has a first principal surface, a first metal layer that is provided to the first principal surface of the first solid insulating layer, a second metal layer that is disposed so as to be spaced apart from the first metal layer by a distance in the thickness direction of the first solid insulating layer, a first electrode that is electrically connected to one end of the first metal layer and to one end of the second metal layer, and a second electrode that is electrically connected to the other end of the first metal layer and to the other end of the second metal layer, the first solid insulating layer being positioned between the first and second metal layers.
Provided are a multilayer ceramic capacitor and a mounting structure for the multilayer ceramic capacitor that make it possible to suitably suppress squeaking. A multilayer ceramic capacitor 1 comprises a capacitor body 1A and an interposer 4. The capacitor body 1A has a first outer electrode 3a and a second outer electrode 3b. The interposer 4 has an interposer body 40, a first columnar body 50a, and a second columnar body 50b. The interposer body 40 has an interposer body first principal surface AIa that is on the capacitor body 1A side, an interposer body second principal surface AIb that is on the other side, and a first through hole 41a and a second through hole 41b. The columnar bodies 50 each comprise a metal material that includes, as a principal component, a metal that has a melting point of at least 230°C, are respectively arranged inside the through holes 41, and are respectively conductively joined to the outer electrodes 3. The columnar bodies 50 each protrude from at least one of the interposer body first principal surface AIa and the interposer body second principal surface AIb.
The present invention provides a multilayer ceramic electronic capacitor that has a high cracking resistance. This multilayer ceramic capacitor 1 comprises: a laminate 10; a first external electrode 40A, which includes a first base electrode layer 50A; and a second external electrode 40B, which includes a second base electrode layer 50B, said external electrodes 40A and 40B being set apart from each other at each of both ends in the length direction L of the laminate 10. The first base electrode layer 50A and the second base electrode layer 50B have a metal part 70 and a plurality of non-metal parts 80 that are present in the metal part 70, and in the cross section view perpendicular to the width direction W, the average area of the non-metal parts 80 in a first population constituted of non-metal parts 80 having a circularity of 0.4 or less is 10 µm2 or greater, and in the cross section view perpendicular to the width direction W, the ratio at which the non-metal parts 80 are present in the first base electrode layer 50A and the second base electrode layer 50B is 8.2% or greater.
A high frequency circuit (1) is capable of simultaneously transmitting a first band signal and a second band signal different from the first band, and comprises: a filter (11) having a passband including at least a portion of the first band; a power amplifier (21) connected to the filter (11); a filter (14) having a passband including at least a portion of the second band; a low-noise amplifier (32) connected to the filter (14); and a band elimination filter (15) that is connected to the output end of the low-noise amplifier (32) and has a stopband including at least a portion of the first band.
Provided is a secondary battery comprising: an electrode roll that is composed of a positive electrode, a negative electrode, and a separator disposed between the positive electrode and the negative electrode; and a cup-shaped member and a lid-shaped member that accommodate the electrode roll. One of the positive electrode and the negative electrode comprises a tab that extends from the electrode roll. The tab comprises a slit that extends from the tip of the tab toward the base of the tab. The tab, together with the slit, is held between the cup-shaped member and the lid-shaped member.
H01M 50/533 - Connexions d’électrodes dans un boîtier de batterie caractérisées par la forme des conducteurs ou des languettes
H01M 50/107 - Boîtiers, fourreaux ou enveloppes primaires d’une seule cellule ou d’une seule batterie caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p.ex. ronde ou elliptique
H01M 50/152 - Couvercles caractérisés par leur forme pour des cellules ayant une section transversale courbée, p.ex. ronde ou elliptique
H01M 50/167 - Couvercles caractérisés par le procédé d’assemblage des boîtiers avec des couvercles par sertissage
H01M 50/169 - Couvercles caractérisés par le procédé d’assemblage des boîtiers avec des couvercles par soudage, brasage ou brasage tendre
H01M 50/531 - Connexions d’électrodes dans un boîtier de batterie
H01M 50/545 - Bornes formées par le boîtier de l’élément
H01M 50/586 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’intérieur des batteries p.ex. les contacts incorrects des électrodes
A high frequency circuit (1) comprises: a filter (31) having a passband that includes a transmission band of a band (A); a filter (32) having a passband that includes a transmission band and/or a reception band of a band (B) which is higher than the transmission band of the band (A) and which allows communication simultaneously with the transmission band of the band (A); a filter (33) having a passband that includes a transmission band and/or a reception band of a band (C) which is higher than the transmission band and/or the reception band of the band (B); and a switch (51) including a terminal (511) that is connected to an antenna connection terminal (100), a terminal (512) that is connected to the filters (31 and 32), and a terminal (513) that is connected to the filter (33). A gap (G1) between the transmission band of the band (A) and a satellite positioning system band is narrower than a gap (G2) between the transmission band of the band (A) and the transmission band and/or the reception band of the band (C).
The present invention provides a filtration material which is capable of removing fine inorganic particles from an inorganic paste such as a ceramic slurry and an conductive paste, the inorganic paste being used during the production of a multilayer ceramic capacitor. The present invention provides a filtration material for filtering an inorganic paste which contains first inorganic particles having a particle diameter of 20 nm to 300 nm, second inorganic particles having a particle diameter of less than 20 nm, an organic solvent, a binder and a dispersant; and a potential having a polarity reverse from the polarity of the first inorganic particles and the second inorganic particles is applied to this filtration material.
A power system (10) comprises: a plurality of loads (41-44); a plurality of power conditioners (31-34); a power reception point (P500); and a control device (60). The plurality of loads (41-44) are respectively installed in a plurality of different fireproof compartments in a building. The plurality of power conditioners (31-34) comprise power storage batteries (315, 325, 335, 345) installed in the respective fireproof compartments, and perform charging using power supplied from a commercial power grid or discharging of power from the storage batteries (315, 325, 335, 345) to the loads (41-44). The control device (60): detects a failure in the power storage batteries (315, 325, 335, 345) of the plurality of power conditioners (31-34); and performs control so as to supply power, from a power conditioner (32) located outside a fireproof compartment in which a power conditioner (34) comprising a failed power storage battery (345) is installed, to a load (44) in the fireproof compartment in which the power conditioner (34) comprising the failed power storage battery (345) is installed.
H02J 3/32 - Dispositions pour l'équilibrage de charge dans un réseau par emmagasinage d'énergie utilisant des batteries avec moyens de conversion
H02J 3/38 - Dispositions pour l’alimentation en parallèle d’un seul réseau, par plusieurs générateurs, convertisseurs ou transformateurs
H02J 9/06 - Circuits pour alimentation de puissance de secours ou de réserve, p.ex. pour éclairage de secours dans lesquels le système de distribution est déconnecté de la source normale et connecté à une source de réserve avec commutation automatique
52.
INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING SAME
Provided is an inductor component which makes it possible to easily perform a wire member assembly operation. An inductor component equipped with a coil which includes a plurality of wire members, wherein: a first end section of a first wire member and a second end section of a second wire member, which are adjacent wire members, are connected to one another; the plurality of wire members constitute the spiral of the coil; a wall section which projects in the centerline direction of the first end section is provided to the end surface of the first end section; the end surface of the first end section faces a peripheral surface of the second end section; and a lateral surface of the wall section in a direction which is perpendicular to the centerline direction of the first end section faces the end surface of the second end section.
H01F 17/06 - Inductances fixes du type pour signaux avec noyau magnétique avec noyau refermé sur lui-même, p.ex. tore
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateurs; Appareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
This optical sensor module (101) is provided with: a first substrate (51) which has a first surface (51a) that comprises a first region and a second region; a light emitting element (2) which is mounted on the first region; a light receiving element (3) which is mounted on the second region; a first annular member (41) which is connected to the first surface (51a) so as to surround the light emitting element (2); a second annular member (42) which is connected to the first surface (51a) so as to surround the light receiving element (3); and a second substrate (52) which is arranged so as to partially overlap with the first substrate (51), while being parallel to the first substrate (51). The second substrate (52) has a first opening (521) in a region that includes the projection region of the light emitting element (2), while having a second opening (522) in a region that includes the projection region of the light receiving element (3). The first annular member (41) is arranged so as to surround the first opening (511), while being connected to the second substrate (52). The second annular member (42) is arranged so as to surround the second opening (522), while being connected to the second substrate (52). A first transparent substrate (71) is fitted to the second substrate (52) so as to close the first opening (521). A second transparent substrate (72) is fitted to the second substrate (52) so as to close the second opening (522). A sealing resin (6) is arranged so as to seal a region of the first substrate (51)-side surface of the second substrate (52), the region being on the outer side of the first annular member (41), while being on the outer side of the second annular member (42).
H01L 31/12 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails structurellement associés, p.ex. formés dans ou sur un substrat commun, avec une ou plusieurs sources lumineuses électriques, p.ex. avec des sources lumineuses électroluminescentes, et en outre électriquement ou optiquement couplés avec lesdites sour
A pen-type electronic apparatus (1) comprising: a tubular housing (30) that has a grip section (101) which is gripped by a user; a pen shaft (10) that is housed in the interior of the housing (30); a sheet-shaped pressing sensor (20) that is wound in a location on an outside surface of the pen shaft (10) or an inside surface of the housing (30), said location overlapping with the grip section (101); and a cushioning material (50) that is positioned between the pen shaft (10) and the pressing sensor (20), or between the pressing sensor (20) and the housing (30), wherein the pressing sensor (20) has a low-sensitivity region at a center portion (102) of the grip section (101) along the lengthwise direction of the pen shaft (10).
An inductor component includes a component body having a mounting surface and a top surface and provided therein with a spiral inductor wiring line advancing in the extending direction of a winding center axis. The inductor wiring line is connected to a first external electrode at a first end, and connected to a second external electrode at a second end. The component body includes: a first inclined surface connected to a first end of the mounting surface on a first side in a length direction and inclined toward the top surface as separating from the first end; and a second inclined surface connected to a second end of the mounting surface on a second side in the length direction and inclined toward the top surface as separating from the second end. The winding center axis extends in a direction parallel to the mounting surface and perpendicular to the length direction.
A multilayer ceramic capacitor includes dielectric layers and inner electrode layers that are stacked and each made of a ceramic material. Each of the inner electrode layers includes through holes. Inside the through holes, a portion of the dielectric layers is packed and Si that is derived from the dielectric layers segregates.
A multilayer ceramic capacitor includes dielectric layers and inner electrode layers stacked and each made of a ceramic material. Each of the inner electrode layers includes through holes. An average circularity of the through holes is equal to or greater than to about 0.6.
A switching circuit includes: a substrate including input-and-output terminals; a switch provided to the substrate and including a source terminal, a gate terminal, and a drain terminal, the source terminal being connected to an input end of a power amplifier, the drain terminal being connected to a first input-and-output terminal; a voltage control circuit provided to the substrate and connected to the gate terminal; a switch provided to the substrate and including a source terminal, a gate terminal, and a drain terminal, the source terminal being connected to a second input-and-output terminal, the drain terminal being connected to an output end of the power amplifier; and a voltage control circuit provided to the substrate to be apart from the voltage control circuit and connected to the gate terminal.
H03K 17/56 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs
H03K 5/1252 - Suppression ou limitation du bruit ou des interférences
A fiber with which a further enhanced electric field intensity is obtained when a compressive force is applied across the longitudinal axis of the fiber. The fiber is composed of a potential generating filament having at least one interior angle of less than 120° in a contour shape in a sectional view in a direction perpendicular to a longitudinal axis of the fiber.
A coil component includes a core including a winding core portion and a pair of flange portions provided at both ends of the winding core portion, electrode portions provided in the flange portions, a wire wound around the winding core portion, and a magnetic plate fixed to the flange portions. The magnetic plate includes an annular first planar portion, a second planar portion that is located inside the inner circumference of the first planar portion and has a step between the first and the second planar portions, and a connection surface portion connecting the inner circumference of the first planar portion to the outer circumference of the second planar portion. The connection surface portion is configured by annularly disposing at least three slopes inclined with respect to the direction orthogonal to the first planar portion and has chamfered portions each being disposed between adjacent slopes.
An acoustic wave device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate, first bumps bonding the first acoustic wave chip to the substrate and including first ground bumps connected to a ground potential, second bumps bonding the second acoustic wave chip to the substrate and including second ground bumps connected to a ground potential. When a number of the first ground bumps is n1, a number of the second ground bumps is n2, a height of the first ground bumps is h1, and a height of the second ground bumps is h2, n1
A semiconductor module comprises a first member including a semiconductor substrate made of a compound semiconductor and a first electronic circuit on the semiconductor substrate is mounted on a mounting surface of a module substrate, and a second member including a semiconductor layer formed of a single semiconductor thinner than the semiconductor substrate of the first member and a second electronic circuit on the semiconductor layer is bonded to an upper surface of the first member. First and second pads are respectively connected to the first electronic circuit on the first member and the second electronic circuit on the second member. A first wire connects the first pad and a substrate side pad. A second wire connects the second pad and a substrate side pad. An inter-member connection wire made of a conductor film on the first and second members connects the first and second electronic circuits.
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
A multiplexer includes a first filter connected between a common terminal and an input/output terminal and having a pass band including a first frequency band, a second filter connected between the common terminal and an input/output terminal and having a pass band including a second frequency band higher than the first frequency band, and an additional circuit connected in parallel to a path connecting the common terminal and the input/output terminal. The additional circuit includes a longitudinally coupled resonator including IDT electrodes. If a peak frequency in an IDT response occurring in a bandpass characteristic of the additional circuit is f1, and if a frequency corresponding to a lowest impedance among frequencies higher than the second frequency band in an impedance characteristic viewing the multiplexer from the common terminal is f2, f2×(1−0.0012)≤f1≤f2×(1+0.0012) is satisfied.
H04B 1/00 - TRANSMISSION - Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
H03H 7/46 - Réseaux pour connecter plusieurs sources ou charges, fonctionnant sur des fréquences ou dans des bandes de fréquence différentes, à une charge ou à une source commune
A conductive paste containing: a conductive powder; a glass frit; an organic vehicle; and a silicon resonate sintering retardant, and a content of the silicon resinate sintering retardant is 0.005 wt % or more in terms of metal based on 100 wt % of the conductive powder.
A processing device includes an operation circuit that determines based on a first signal a swing start time, the first signal being acquired from a sensor that is attached to a striking member for striking a to-be-struck object by being swung and that detects deformation of the striking member when the striking member is swung. An absolute value of a difference between a reference value and a value of the first signal is defined as a first difference value. The operation circuit executes a first determination step in which an impact time is determined based on one or more times at which the first difference value becomes greater than or equal to a first determination value.
An acoustic wave device is provided that includes a piezoelectric layer and first and second resonators. The first resonator includes a first functional electrode and a first dielectric film on the piezoelectric layer. The second resonator includes a second functional electrode and a second dielectric film on the piezoelectric layer. The piezoelectric layer includes first and second resonator portions respectively including portions of the first and second resonators. Moreover, a resonant frequency of the first resonator is lower than that of the second resonator. A thickness of the first resonator portion is greater than that of the second resonator portion, and ts1/tp1≤ts2/tp2 is satisfied, where tp1, tp2, ts1, and ts2 are respectively thicknesses of the first and second resonator portions and the first and second dielectric films.
H03H 9/205 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiques; Résonateurs électromécaniques - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant des résonateurs multiples
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiques; Résonateurs électromécaniques - Détails
A radio-frequency circuit includes an antenna connection terminal, switch circuits, a duplexer, a low-pass filter, and a high-pass filter. The switch circuit includes a port connected to the antenna connection terminal and ports. The switch circuit includes a single transmission port connected to the port, a simultaneous transmission port connected to ports. The duplexer is connected to the port. The low-pass filter is disposed on a signal path connecting the port and the simultaneous transmission port. The high-pass filter is connected to the port. No filter is disposed on a signal path connecting the port and the single transmission port.
A piezoelectric bulk wave device includes a support including a support substrate, a piezoelectric layer including a first main surface on the support side and a second main surface opposite from the first main surface, and at least one functional electrode including at least a portion on at least one of the first and second main surfaces. The at least one functional electrode is supported by the support and includes a functional electrode including a portion on the first main surface of the piezoelectric layer. A cavity portion is provided in the support and superposed on a portion of the functional electrode and an entirety or substantially an entirety of the piezoelectric layer in plan view. The piezoelectric layer is supported by the functional electrode supported by the support.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiques; Résonateurs électromécaniques - Détails
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
An acoustic wave device includes a piezoelectric substrate including an acoustic reflection layer and a piezoelectric layer on the acoustic reflection layer, and an IDT electrode on the piezoelectric substrate and including electrode fingers. When a wavelength defined by an electrode finger pitch of the IDT electrode is λ, a thickness of the piezoelectric layer is about 3λ or smaller. The electrode fingers include at least one electrode layer. A sum total of a thickness of the at least one electrode layer converted based on a density ratio of the at least one electrode layer and Al assuming that the at least one electrode layer includes Al is a same or larger than the thickness of the piezoelectric layer.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiques; Résonateurs électromécaniques - Détails
C22C 27/02 - Alliages à base de vanadium, niobium ou tantale
H03H 9/145 - Moyens d'excitation, p.ex. électrodes, bobines pour réseaux utilisant des ondes acoustiques de surface
H03H 9/25 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiques; Résonateurs électromécaniques - Détails de réalisation de résonateurs utilisant des ondes acoustiques de surface
70.
RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS
A radio-frequency module includes a module substrate, a carrier amplifier and a peak amplifier, a transformer, and a phase adjustment circuit. The carrier amplifier and the peak amplifier are included in a semiconductor IC. One end of an input-side coil is connected to an output terminal of the carrier amplifier. One end of the output-side coil is connected to a signal output terminal.
H03F 3/24 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p.ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
An electronic component includes a ceramic body, and an external electrode on the ceramic body, the external electrode includes a base layer continuously covering an end surface of the ceramic body and a portion of a side surface bordering the end surface, and a plating layer covering the base layer, the ceramic body includes a recess open on the side surface, an opening of the recess includes a pair of edges, one edge of the opening is located within a covered region on the side surface covered with the base layer, and the other edge of the opening is spaced away from the covered region.
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température négatif
H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant sensibles à la tension, p.ex. varistances
H01G 4/232 - Bornes pour la connexion électrique d'au moins deux couches d'un condensateur à empilement ou à enroulement
In a composite filter device, a first acoustic wave resonator includes a functional electrode on a first main surface of a first piezoelectric substrate, and a wiring electrode is on the first main surface and is not connected to a signal potential. A support is on the first main surface and surrounds the first acoustic wave resonator. A second piezoelectric substrate is on the support and includes a third main surface closer to the support than a fourth main surface. A second acoustic wave resonator includes a functional electrode on the third main surface. The second acoustic wave resonator is a parallel-arm resonator higher in resonant frequency than any other parallel-arm resonator or a series-arm resonator lower in resonant frequency than any other series-arm resonator. The second acoustic wave resonator and the wiring electrode overlap each other when viewed in plan.
This secondary battery comprises a positive electrode, a negative electrode including a negative electrode active material layer, and an electrolyte, wherein the negative electrode active material layer includes an alkali metal carbonate compound and a magnesium compound. The alkali metal carbonate compound has a carbonate bond (-OC(=O)O-) and includes an alkali metal element as a constituent element, and the magnesium compound includes magnesium as a constituent element.
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p.ex. liants, charges
H01M 4/133 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication Électrodes à base de matériau carboné, p.ex. composés d'intercalation du graphite ou CFx
H01M 4/134 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication Électrodes à base de métaux, de Si ou d'alliages
H01M 4/136 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication Électrodes à base de composés inorganiques autres que les oxydes ou les hydroxydes, p.ex. sulfures, séléniures, tellurures, halogénures ou LiCoFy
H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
IRON BASE RARE EARTH BORON-BASED ISOTROPIC NANOCOMPOSITE MAGNET ALLOY, METHOD FOR PRODUCING IRON BASE RARE EARTH BORON-BASED ISOTROPIC NANOCOMPOSITE MAGNET ALLOY, AND METHOD FOR PRODUCING RESIN-BONDED PERMANENT MAGNET
The present invention provides an iron base rare earth boron-based isotropic nanocomposite magnet alloy which has an alloy composition that has a composition which is represented by the composition formula T100-x-y-z(B1-nCn)xREyZrzMm (wherein: T represents one or more transition metal elements that are selected from the group consisting of Fe, Co and Ni, and necessarily includes Fe; RE represents one or more rare earth elements that are selected from among Nd and Pr, and necessarily includes Nd; and M represents one or more metal elements that are selected from the group consisting of Al, Si, V, Cr, Ti, Mn, Cu, Zn, Ga, Nb, Mo, Ag, Hf, Ta, W, Pt, Au and Pb), wherein the compositional ratios x, y, and z respectively satisfy 4.2% by atom ≤ x ≤ 5.0% by atom, 12.5 % by atom ≤ y ≤ 14.0% by atom, 0% by atom < z ≤ 2.0% by atom, 0.0% by atom ≤ m ≤ 5.0% by atom, and 0.0 ≤ n ≤ 0.5. This iron base rare earth boron-based isotropic nanocomposite magnet alloy has a metal structure which has, as a main phase, an RE2Fe14B-type tetragonal compound that has a lower B concentration than the stoichiometric composition of an RE2Fe14B-type tetragonal compound, while having an average crystal grain size of not less than 10 nm but less than 70 nm, the average crystal grain size being smaller than the single domain critical diameter, and which comprises a phase that is richer in Fe than the main phase in the grain boundary phase that surrounds the main phase.
H01F 1/057 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p.ex. SmCo5 et des éléments IIIa, p.ex. Nd2Fe14B
B22F 1/00 - Poudres métalliques; Traitement des poudres métalliques, p.ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittage; Appareils spécialement adaptés à cet effet
B22F 9/04 - Fabrication des poudres métalliques ou de leurs suspensions; Appareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau solide, p.ex. par broyage, meulage ou écrasement à la meule
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateurs; Appareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
This electronic component (100) is provided with: a multilayer body (110) which is obtained by stacking a plurality of dielectric layers; an external electrode (121) which is arranged on at least one of outer surfaces of the multilayer body (110); and internal electrodes (140) which are arranged in a plurality of layers of the multilayer body (110), and are connected to the external electrode (121). At least one cavity part (190) is formed in a dielectric layer that is positioned between internal electrodes (140) within the range of 0 µm to 200 µm from the position where the external electrode (121) and the internal electrodes (140) are connected to each other in the extending direction of the internal electrodes (140).
An electric power system (10) comprises: a plurality of inverse converters (31 to 34) and a power receiving point (P500), outputs from the plurality of inverse converters (31 to 34) each being connected to the power receiving point (P500) via a grid interconnection relay; a plurality of loads (L41 to L44) each including one of air conditioners (41 to 44); a current sensor (CT); and a control device (60). The plurality of inverse converters (31 to 34) are each installed on a different floor of the same building. The control device (60) rotates the operation of the air conditioners (41 to 44) provided respectively on each floor such that respective operating times thereof do not overlap, and performs control, on the basis of a measured value from the current sensor (CT), such that electricity is discharged from storage batteries of the plurality of inverse converters (31 to 34) to a heavy load, such that an amount of electric power procured from a power grid per prescribed unit of time does not exceed a prescribed value.
An infrared sensor module (101) comprises: a first substrate (51) that has a first surface (51a); a pyroelectric element (3) that is mounted on the first surface (51a); an annular member (4) that is connected to the first surface (51a) so as to surround the pyroelectric element (3); and a second substrate (52) that is disposed so as to be parallel to the first substrate (51) and at least partially overlap the first substrate (51). The second substrate (52) has an opening (52e) in a region that includes a projection region of the pyroelectric element (3). The annular member (4) is connected to the second substrate (52) while being disposed so as to surround the opening (52e). An infrared transmission filter (7) is attached to the second substrate (52) so as to close the opening (52e). A sealing resin (6) is disposed so as to seal a region of the surface of the second substrate (52) on the first substrate (51) side outward of the annular member (4).
Provided is a secondary battery in which charging and discharging reactions occur more favorably, thereby improving the volumetric energy density of an electrode. A secondary battery 100 according to the present disclosure comprises an electrode structure 10 composed of a positive electrode 1 and a negative electrode 2 having a larger area than the positive electrode 1, the positive and negative electrodes being disposed opposite to each other with a separator 3 interposed therebetween. The negative electrode 2 has an opposite part 21 opposite to the positive electrode 1 and a non-opposite part 22 that is not opposite to the positive electrode 1. The surface of the non-opposite part 22 is rougher than the surface of the opposite part 21.
H01M 4/13 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c. à d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H03K 17/08 - Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension
H03K 5/08 - Mise en forme d'impulsions par limitation, par application d'un seuil, par découpage, c. à d. par application combinée d'une limitation et d'un seuil
H03K 17/082 - Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension par réaction du circuit de sortie vers le circuit de commande
An acoustic wave filter includes a first filter circuit with a predetermined frequency band as a pass band and provided on a first path connecting first and second signal terminals, and an additional resonant circuit connected in parallel with at least a portion of the first filter circuit. The additional resonant circuit includes an IDT electrode group including IDT electrodes positioned along an acoustic wave propagation direction. At least one resonant frequency of one or more resonant frequencies of the additional resonant circuit is included within the pass band of the first filter circuit.
H03H 9/13 - Moyens d'excitation, p.ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
H03H 9/70 - Réseaux à plusieurs accès pour connecter plusieurs sources ou charges, fonctionnant sur des fréquences ou dans des bandes de fréquence différentes, à une charge ou à une source commune
81.
PHOTOSENSITIVE PASTE, METHOD FOR FORMING WIRING PATTERN, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
A photosensitive paste contains a photoinitiator, a photopolymerizable monomer, an alkali-soluble polymer, an inorganic powder, and a radical scavenger. A method for forming a wiring pattern includes a step of forming a photosensitive paste film by applying the photosensitive paste that has electrical conductivity to an insulating sheet; a step of irradiating a portion of the photosensitive paste film with an active energy ray; and a step of forming a wiring pattern by removing an uncured portion of the photosensitive paste film.
An electronic component package includes a base, a lid, and a bonding layer part. The lid has a first recess. The lid is bonded to the base with a bonding layer part interposed therebetween. The base closes the first recess of the lid. The base and the lid define an internal space of the electronic component package. An electronic component is located in the internal space of the electronic component package. The electronic component is mounted on the base.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
An amplification circuit includes an amplification transistor connected to a signal input terminal, a power supply circuit configured to supply a bias voltage to the amplification transistor, a resistor disposed in series to a bias path connecting the power supply circuit and the amplification transistor, a transistor that is connected to the bias path and the power supply circuit and that is a simulated transistor for the amplification transistor, and a detection diode connected to the signal input terminal and the bias path between the resistor and a gate of the amplification transistor.
A coil component includes a drum core including a winding core portion and first and second flange portions, and first and second wires. A portion of the first wire that first comes into contact with an outer peripheral surface of the winding core portion when the first wire is traced from a first wire end to a second wire end is defined as a 1.0 turn portion of the first wire. A portion of the second wire where an angular position thereof about a central axis first coincides with an angular position of the 1.0 turn portion of the first wire, on a side of a second negative direction with respect to the central axis, when the second wire is traced from a first wire end to a second wire end is defined as a 1.0 turn portion of the second wire.
A semiconductor device has a semiconductor substrate, at least one first transistor that has a mesa structure including one or more semiconductor layers, a first bump that overlaps the first transistor and extends in a first direction, and a second bump, in which the mesa structure has a first end portion on one end side in a second direction and a second end portion on the other end side in the second direction. The opening has a first opening end portion and a second opening end portion that are adjacent in the second direction. In plan view, the first opening end portion is closer to the second bump than the second opening end portion and the first end portion and the second end portion of the mesa structure are disposed between the first opening end portion and the second opening end portion.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 29/08 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode transportant le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
To provide electronic component in which bonding strength between external electrode and plating layer and bonding strength between external electrode and internal conductor can be increased. Electronic component according to present disclosure includes element body, interlayer connection conductor provided inside element body so as to extend to main surface of element body, external electrode formed on main surface of element body so as to cover interlayer connection conductor, and plating layer covering external electrode. Plating layer includes impregnation part that is impregnated into interlayer connection conductor.
A multilayer ceramic capacitor includes a capacitor main body including a multilayer body and external electrodes, the multilayer body including dielectric layers and internal electrode layers stacked alternately, each of the external electrodes being provided on an end surface in a length direction of the multilayer body and being connected to the internal electrode layers, and two interposers on one surface in a stacking direction of the capacitor main body and spaced apart from each other in the length direction, the interposers including bonding surfaces bondable to the one surface of the capacitor main body and including inner edge portions which are opposite to each other and each having a length longer than a length in a width direction of the multilayer body.
A method for manufacturing a negative electrode active material is provided. The method includes reacting a compound capable of forming a complex with lithium and a negative electrode active material containing lithium and silicon.
H01M 4/131 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication Électrodes à base d'oxydes ou d'hydroxydes mixtes, ou de mélanges d'oxydes ou d'hydroxydes, p.ex. LiCoOx
H01M 4/134 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Électrodes Électrodes composées d'un ou comprenant un matériau actif Électrodes pour accumulateurs à électrolyte non aqueux, p.ex. pour accumulateurs au lithium; Leurs procédés de fabrication Électrodes à base de métaux, de Si ou d'alliages
H01M 4/60 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de composés organiques
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p.ex. batteries à insertion ou intercalation de lithium dans les deux électrodes; Batteries à l'ion lithium
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
A transmission circuit appropriately controls output power in response to fluctuations in the impedance of a load. A transmission circuit includes: a transistor to which a bias current IB1 is supplied and that amplifies and outputs an input signal RFin; a transistor to which a bias current IB2 is supplied, that has a collector connected to the collector of the transistor, and that amplifies and outputs the input signal; a current generation circuit that generates a current I2 on the basis of a current I1 from the emitter of the transistor; and a bias control circuit that outputs a first bias control signal for controlling the bias current IB1 and a second bias control signal for controlling the bias current IB2 on the basis of the current I2.
H03F 3/24 - Amplificateurs de puissance, p.ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p.ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/195 - Amplificateurs à haute fréquence, p.ex. amplificateurs radiofréquence comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
90.
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiques; Résonateurs électromécaniques - Détails
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
H03H 3/10 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface pour obtenir une fréquence ou un coefficient de température désiré
H03H 9/54 - Filtres comprenant des résonateurs en matériau piézo-électrique ou électrostrictif
H10N 30/80 - Dispositifs piézo-électriques ou électrostrictifs - Détails de structure
H10N 30/85 - Matériaux actifs piézo-électriques ou électrostrictifs
H10N 30/87 - Dispositifs piézo-électriques ou électrostrictifs - Détails de structure Électrodes ou interconnexions, p.ex. connexions électriques ou bornes
An electronic circuit module includes: a substrate; a first electronic component mounted on one main surface of the substrate; a substrate electrode provided on the one main surface; a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component; a conductor provided on the support surface of the first electronic component; a wire connected to the conductor and the substrate electrode; and a component electrode provided on a surface of the second electronic component and electrically connected to the conductor.
A solid electrolytic capacitor that includes: a capacitor element; a sealing material that seals the capacitor element to form a sealing body; and a vent structure embedded in the sealing material such that a portion of the vent structure is exposed on an outer surface of the sealing body, the vent structure being composed of a material that has a self-sealing valve action in which the vent structure turns into a melt at a reflow mounting temperature and the melt cleaves when receiving pressure of vaporized components generated inside the sealing body so as to form a hole communicating from an inside to the outer surface of the sealing body to discharge the vaporized components, and upon being cooled from the reflow mounting temperature, the melt flows and then solidifies so as to block the hole.
An alkaline battery includes a positive electrode containing member, a negative electrode containing member, a positive electrode, a negative electrode, a frame-shaped member, a separator, and a sealing member. The positive electrode is contained inside the positive electrode containing member. The negative electrode and the frame-shaped member are contained inside the negative electrode containing member. The separator is disposed between the positive electrode and the negative electrode. The sealing member is disposed between the positive electrode containing member and the negative electrode containing member, and is separated from the frame-shaped member. The positive electrode containing member and the negative electrode containing member are crimped to each other with the sealing member interposed between the positive electrode containing member and the negative electrode containing member. The negative electrode includes a negative electrode active material and an alkaline electrolytic solution. The frame-shaped member surrounds the negative electrode and adjoins the separator.
H01M 50/186 - Boîtiers, fourreaux ou enveloppes primaires d’une seule cellule ou d’une seule batterie Éléments de scellement caractérisés par la position des éléments de scellement
H01M 6/04 - PROCÉDÉS OU MOYENS POUR LA CONVERSION DIRECTE DE L'ÉNERGIE CHIMIQUE EN ÉNERGIE ÉLECTRIQUE, p.ex. BATTERIES Éléments primaires; Leur fabrication Éléments avec électrolyte aqueux
H01M 50/109 - Boîtiers, fourreaux ou enveloppes primaires d’une seule cellule ou d’une seule batterie caractérisés par leur forme ou leur structure physique en forme de bouton ou plate
H01M 50/153 - Couvercles caractérisés par leur forme pour cellules en forme de bouton ou plate
H01M 50/167 - Couvercles caractérisés par le procédé d’assemblage des boîtiers avec des couvercles par sertissage
H01M 50/586 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’intérieur des batteries p.ex. les contacts incorrects des électrodes
H01M 50/593 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries caractérisés par les moyens de protection Éléments d’espacement; Plaques d’isolation
A radio frequency circuit includes carrier amplifiers and peak amplifiers, transformers, a signal output terminal connected to a first end of an output-side coil, an LC series circuit, and a capacitor. An input-side coil is connected, at its first end, to the carrier amplifier, and is connected, at its second end, to the carrier amplifier. An input-side coil is connected, at its first end, to the peak amplifier, and is connected, at its second end, to the peak amplifier. The LC series circuit is connected between the peak amplifier and the ground. The capacitor is connected to a second end of the output-side coil and a first end of an output-side coil. The output-side coil is connected, at its second end, to the ground.
A multilayer ceramic capacitor includes a second alloy portion including one metal element provided in a greatest amount among metal elements of an internal electrode layer, and one or more metal elements among a metal group including Sn, In, Ga, Zn, Bi, Pb, Cu, Ag, Pd, Pt, Ph, Ir, Ru, Os, Fe, V, and Y is provided between a second dielectric ceramic layer and a first internal electrode layer, and between a second dielectric ceramic layer and a second internal electrode layer, respectively.
The present invention provides a secondary battery which has higher reliability. This secondary battery is provided with: a battery element which is obtained by stacking a first electrode and a second electrode upon each other, with a separator being interposed therebetween, and subsequently winding the stacked electrodes around a winding axis that extends in a first direction; and an outer package member which contains the battery element. The second electrode comprises: a second electrode collector which has a second electrode inner surface that faces the winding axis side, and a second electrode outer surface that is on the reverse side of the second electrode inner surface; a second electrode inner active material layer which is provided on the second electrode inner surface; and a second electrode outer active material layer which is provided on the second electrode outer surface. From the inner periphery-side end part of the battery element to the outer periphery-side end part of the battery element, the area density of the second electrode outer active material layer is higher than the area density of the second electrode inner active material layer, which faces the second electrode outer active material layer with the second electrode collector being interposed therebetween.
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c. à d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 50/109 - Boîtiers, fourreaux ou enveloppes primaires d’une seule cellule ou d’une seule batterie caractérisés par leur forme ou leur structure physique en forme de bouton ou plate
This power-feeding member comprises: a bonding member having a bonding surface that can bind to a piezoelectric element; at least one contact section that is provided on the bonding member and can electrically connect to an electrode of the piezoelectric element; and a wiring part that is drawn out from the bonding member. When viewed in a first direction that intersects the bonding surface, the contact section and a connection portion between the bonding member and the wiring part are located at positions deviated from each other.
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H02N 2/12 - Machines électriques en général utilisant l'effet piézo-électrique, l'électrostriction ou la magnétostriction produisant un mouvement rotatif, p.ex. moteurs rotatifs - Détails de structure
H10N 30/20 - Dispositifs piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique, p.ex. fonctionnant comme actionneurs ou comme vibrateurs
H10N 30/87 - Dispositifs piézo-électriques ou électrostrictifs - Détails de structure Électrodes ou interconnexions, p.ex. connexions électriques ou bornes
In the present invention, a pulse wave measurement unit generates a pulse wave signal from the result of measurement by a pulse wave sensor attached to a site that is further from the heart than a pressure application site at which a pressure is applied in order to tourniquet blood flow. A peripheral blood pressure index calculation unit calculates a peripheral blood pressure index relating to the steepness of the rise, in each beat, of the pulse wave signal generated by the pulse wave measurement unit. A vascular endothelial function evaluation unit evaluates vascular endothelial function on the basis of a value calculated for the peripheral blood pressure index applicable from the point in time at which the tourniquet is released to when the evaluation time has elapsed.
A61B 5/02 - Mesure du pouls, du rythme cardiaque, de la pression sanguine ou du débit sanguin; Détermination combinée du pouls, du rythme cardiaque, de la pression sanguine; Evaluation d'un état cardio-vasculaire non prévue ailleurs, p.ex. utilisant la combinaison de techniques prévues dans le présent groupe et des techniques d'électrocardiographie; Sondes cardiaques pour mesurer la pression sanguine
A61B 5/021 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins
A61B 5/022 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins par application d'une pression pour fermer les vaisseaux sanguins, p.ex. contre la peau; Ophtalmodynamomètres
In the present invention, the temperature dependency of the intensity of light outputted from two light-emitting elements exhibits the same tendency. A reflector is arranged so that light outputted from the light-emitting elements is diffusely reflected, and a portion of reflected light is incident on a light-receiving element. An elastic support member supports the reflector with respect to the two light-emitting elements and the light-receiving element, and is deformed by an external force and thereby changes the position of the reflector relative to the light-emitting elements and the light-receiving element. A processing unit calculates a physical quantity that depends on the amount of deformation of the elastic support member, on the basis of the ratio of two light reception amounts of light received by the light-receiving element when the two light-emitting elements are separately caused to emit light. The relative positions of the two light-emitting elements and the light-receiving element are fixed, and the distance from one light-emitting element to the light-receiving element and the distance from the other light-emitting element to the light-receiving element are different.
G01L 1/24 - Mesure des forces ou des contraintes, en général en mesurant les variations des propriétés optiques du matériau quand il est soumis à une contrainte, p.ex. par l'analyse des contraintes par photo-élasticité
100.
ELECTRONIC COMPONENT MANAGEMENT METHOD, AND HOUSING BODY FOR ELECTRONIC COMPONENTS
An electronic component management method includes manufacturer-side steps including storing electronic components in a housing body that includes an RFID tag, writing in the RFID tag at least one piece of manufacturer-side information related to the electronic components stored in the housing body, shipping the housing body with the manufacturer-side information written in the RFID tag, and storing the electronic components, and user-side steps including receiving the shipped housing body, reading the manufacturer-side information written in the RFID tag, a preparing an electronic circuit board, and arranging the electronic components on the electronic circuit board based on the read manufacturer-side information.
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G05B 19/418 - Commande totale d'usine, c.à d. commande centralisée de plusieurs machines, p.ex. commande numérique directe ou distribuée (DNC), systèmes d'ateliers flexibles (FMS), systèmes de fabrication intégrés (IMS), productique (CIM)
G06K 19/077 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré - Détails de structure, p.ex. montage de circuits dans le support