A computing device includes a housing having a plurality of apertures therein, an active cooling system, and at least one of a plurality of membranes or a plurality of valves. The membranes and/or valves are coupled with the apertures. Each of the membranes is watertight and gas breathable. The valves are configured to prevent entry of water through the apertures. The active cooling system is in the housing. When activated, the active cooling system drives a gas through a membrane but does not drive water through the membrane.
A heat transfer system including an active component and a dissipation region is described. The active component is configured to undergo vibrational motion. The active component transfers fluid from a high pressure region to an ambient pressure region via an egress. The active component also induces a pulsating pressure in the fluid. The pulsating pressure is dissipated in the dissipation region such that turbulence is reduced where the fluid is introduced to the ambient pressure region.
F04B 43/04 - Pompes ayant un entraînement électrique
H01L 23/42 - Choix ou disposition de matériaux de remplissage ou de pièces auxiliaires dans le conteneur pour faciliter le chauffage ou le refroidissement
H01L 23/44 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température le dispositif complet étant totalement immergé dans un fluide autre que l'air
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
F04B 17/00 - Pompes caractérisées par leur combinaison avec des machines motrices ou moteurs particuliers qui les entraînent ou par leur adaptation à ceux-ci
F04B 43/14 - "Machines", pompes ou installations de pompage ayant des organes de travail flexibles à action péristaltique ayant des organes flexibles du genre plat
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p.ex. d'air
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
A heat transfer system includes fluid transfer cells that vibrationally move a fluid and a thermally conductive cover that conducts heat from the cells while avoiding transfer of mechanical energy between the cells. A fluid transfer module includes outer and inner walls, a support member, and a membrane. The outer wall has an outer opening. The inner wall has an inner opening. The support member is disposed laterally on the inner wall such that a flow chamber is defined between the outer and inner walls. The membrane is supported by the support member along the outer wall. A fluid transfer module includes an inlet port and an actuator. The actuator undergoes vibrational motion and has first and second vibrational modes. The first vibrational mode causes fluid to enter the inlet port. The second vibrational mode expels fluid from the inlet port, which reduces clogging of the inlet port.
F04B 43/04 - Pompes ayant un entraînement électrique
H01L 23/42 - Choix ou disposition de matériaux de remplissage ou de pièces auxiliaires dans le conteneur pour faciliter le chauffage ou le refroidissement
H01L 23/44 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température le dispositif complet étant totalement immergé dans un fluide autre que l'air
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
F04B 17/00 - Pompes caractérisées par leur combinaison avec des machines motrices ou moteurs particuliers qui les entraînent ou par leur adaptation à ceux-ci
F04B 43/14 - "Machines", pompes ou installations de pompage ayant des organes de travail flexibles à action péristaltique ayant des organes flexibles du genre plat
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p.ex. d'air
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
4.
COOLING ELEMENT ARCHITECTURE FOR MEMS-BASED COOLING SYSTEM ARCHITECTURE
A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
5.
ANCHOR AND CAVITY CONFIGURATION FOR MEMS-BASED COOLING SYSTEMS
A cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
H01L 41/08 - Eléments piézo-électriques ou électrostrictifs
6.
DRIVING OF PIEZOELECTRICS FOR MEMS-BASED COOLING SYSTEMS
A cooling system is described. The cooling system includes a support structure, a cooling element, and drive electronics. The cooling element has a central axis and is supported by the support structure at the central axis. First and second portions of the cooling element are on first and second sides of the central axis and unpinned. The first and second portions of the cooling element undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element further first and second piezoelectrics having opposite polarizations. The first piezoelectric is part of the first portion of the cooling element. The second piezoelectric is part of the second portion of the cooling element. The drive electronics drive the first and second portions of the cooling element using a single drive signal.
A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p.ex. d'air
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01L 41/04 - DISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS - Détails - Détails d'éléments piézo-électriques ou électrostrictifs
H01L 41/053 - Montures, supports, enveloppes ou boîtiers
H01L 41/09 - Eléments piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F04B 43/04 - Pompes ayant un entraînement électrique
F04B 17/00 - Pompes caractérisées par leur combinaison avec des machines motrices ou moteurs particuliers qui les entraînent ou par leur adaptation à ceux-ci
8.
EXHAUST BLENDING FOR PIEZOELECTRIC COOLING SYSTEMS
A system including a cooling element and an egress passageway is described. The cooling element is configured to provide a stream of hot air having been heated by a heat from a heat-generating structure. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn to be mixed with the hot air.
F04B 43/04 - Pompes ayant un entraînement électrique
H01L 23/42 - Choix ou disposition de matériaux de remplissage ou de pièces auxiliaires dans le conteneur pour faciliter le chauffage ou le refroidissement
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p.ex. d'air
A system includes an active micro-electric mechanical system (MEMS) cooling system and a drive system. The MEMS cooling system includes cooling element(s) that direct fluid toward a surface of heat-generating structure(s) when driven to vibrate by a driving signal having a frequency and an input voltage. The drive system is coupled to the active MEMS cooling system and provides the driving signal. The drive system includes a power source and a feedback controller providing a feedback signal corresponding to a proximity to a resonant state of the at least one cooling element. The drive system adjusts at least one of the frequency and the input voltage based on the feedback signal such that the frequency corresponds to the resonant state of the cooling element(s). The input voltage does not exceed a maximum safe operating voltage for the cooling element(s).
A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.
F04B 43/04 - Pompes ayant un entraînement électrique
H01L 23/42 - Choix ou disposition de matériaux de remplissage ou de pièces auxiliaires dans le conteneur pour faciliter le chauffage ou le refroidissement
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p.ex. d'air
11.
METHOD AND SYSTEM FOR FABRICATING MEMS-BASED COOLING SYSTEMS
A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.
H01L 41/27 - Fabrication de dispositifs piézo-électriques ou électrostrictifs multicouches ou de leurs parties constitutives, p.ex. en empilant des corps piézo-électriques et des électrodes
12.
SYSTEM LEVEL CONTROL OF MEMS-BASED COOLING SYSTEMS
A system including a plurality of cooling cells and a switching and control module is described. The cooling cells including cooling elements configured to be actuated to induce vibrational motion to drive a fluid toward a heat-generating structure. The switching and control module is coupled to the cooling elements and provides drive signals to the cooling elements based on at least one drive signal input. Each of the drive signals has a frequency corresponding to a cooling element. The frequency of the drive signal corresponds to a resonant state of the cooling element.
H05K 5/02 - Enveloppes, coffrets ou tiroirs pour appareils électriques - Détails
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
An active cooling system is described. The active cooling system includes at least one cooling element that has a vent therein and is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open for the virtual valve being closed.
A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.
A system including an active cooling system is described. The active cooling system includes a cooling element in communication with a fluid and configured to use vibrational motion to direct a fluid toward a surface of heat-generating structure(s). Heat is transferred from the heat-generating structure to the fluid. The system is configured such that the fluid follows a path from the surface of the heat-generating structure(s) past a structure having a lower temperature than the surface of the heat-generating structure. The structure absorbs heat from the fluid. The structure is within the system and distal from the active cooling system.
H01L 23/427 - Refroidissement par changement d'état, p.ex. caloducs
H01L 23/433 - Pièces auxiliaires caractérisées par leur forme, p.ex. pistons
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01L 41/09 - Eléments piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
F04B 17/00 - Pompes caractérisées par leur combinaison avec des machines motrices ou moteurs particuliers qui les entraînent ou par leur adaptation à ceux-ci
16.
ENGINEERED ACTUATORS USABLE IN MEMS ACTIVE COOLING DEVICES
An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H01L 23/42 - Choix ou disposition de matériaux de remplissage ou de pièces auxiliaires dans le conteneur pour faciliter le chauffage ou le refroidissement
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
17.
CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS
A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat- generating structure to extract heat from the heat-generating structure.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
F04B 43/02 - "Machines", pompes ou installations de pompage ayant des organes de travail flexibles ayant des organes flexibles du genre plat, p.ex. des diaphragmes
brevets
