A method for manufacturing a semiconductor device, includes forming a first insulating layer on a first nitride semiconductor layer having a first principal surface, forming, on the first insulating layer, a mask including a first mask opening through which a portion of the first insulating layer is exposed, forming a first opening in the first insulating layer through the first mask opening, to expose a portion of the first nitride semiconductor layer, forming a second nitride semiconductor layer on the first nitride semiconductor layer inside the first opening, through the first mask opening, forming a first electrode on the second nitride semiconductor layer, so as to cover a boundary line between the second nitride semiconductor layer and the first insulating layer, through the first mask opening, and removing the mask after the forming the first electrode.
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/20 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternative layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of AlaCr1-a-bCebN, a is more than 0.500 and 0.800 or less, b is 0.001 or more and 0.100 or less, the second unit layer is composed of AlcV1-cN, c is 0.10 or more and 0.75 or less, and a and c satisfy a relationship of a>c.
An optical fiber cable includes an optical fiber bundle including optical fibers and a protective member having a cylindrical shape and defining an internal space where the optical fiber bundle is accommodated. The optical fiber bundle being a single optical fiber bundle is accommodated in the internal space. The protective member includes a first cylindrical portion having a ring-shaped first cut and a second cylindrical portion having a second cut corresponding to the first cut, the second cylindrical portion being spaced from the first cylindrical portion. An end of a first optical fiber included in the optical fibers is pulled out to outside of the protective member from between the first cylindrical portion and the second cylindrical portion.
An optical sensor includes a support film having a first main surface and a second main surface located opposite to the first main surface in a thickness direction; a thermoelectric-conversion material section disposed on the first main surface and including a plurality of strip-shaped first material layers formed of SiGe having p-type conductivity and configured to convert thermal energy into electric energy, and a plurality of strip-shaped second material layers formed of SiGe having n-type conductivity and configured to convert thermal energy into electric energy; a heat sink disposed on the second main surface; and a light absorbing film disposed so as to form a temperature difference in each of the first material layers in longitudinal directions and each of the second material layers in longitudinal directions and configured to convert received light into thermal energy.
H10N 10/851 - Matériaux actifs thermoélectriques comprenant des compositions inorganiques
G01J 5/12 - Pyrométrie des radiations, p.ex. thermométrie infrarouge ou optique en utilisant des détecteurs électriques de radiations en utilisant des éléments thermoélectriques, p.ex. des thermocouples
H10N 10/13 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c. à d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par les moyens d'échange de chaleur à la jonction
H10N 10/817 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c. à d. dispositifs présentant l'effet Seebeck ou l'effet Peltier - Détails de structure - Détails structurels de la jonction la jonction étant inamovible, p.ex. obtenue par cémentation, frittage ou soudage
An optical sensor includes a support layer, a thermoelectric-conversion material section disposed on the support layer and including strip-shaped p-type material layers configured to convert thermal energy into electric energy and strip-shaped n-type material lavers configured to convert thermal energy into electric energy, a heat sink, a light absorbing film, and an insulating film disposed between the thermoelectric-conversion material section and the light absorbing film. Each of the p-type material layers includes a first region overlapping the heat sink and a second region overlapping the light absorbing film. Each of the n-type material layers includes a third region overlapping the heat sink and a fourth region overlapping the light absorbing film. The p-type material layers and the n-type material layers are alternately disposed in series. The light absorbing film includes 60 mass % to 95 mass % of carbon and 5 mass % to 40 mass % of a resin.
G01J 5/12 - Pyrométrie des radiations, p.ex. thermométrie infrarouge ou optique en utilisant des détecteurs électriques de radiations en utilisant des éléments thermoélectriques, p.ex. des thermocouples
A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of AlaCr1-a-bCebN, a is 0.400 or more and 0.800 or less, b is 0.001 or more and 0.100 or less, the second unit layer is composed of TicSi1-cN, and c is 0.200 or more and 0.990 or less.
A method for manufacturing a semiconductor device includes forming a first insulating layer on a first nitride semiconductor layer having a principal surface, forming a mask including a first mask opening on the first insulating layer, forming a first opening in the first insulating layer through the first mask opening, forming a second nitride semiconductor layer on the first nitride semiconductor layer inside the first opening, forming a second insulating layer covering a boundary between the second nitride semiconductor layer and the first insulating layer through the first mask opening and thereafter removing the mask, forming a second opening in the second insulating layer, foaming a first electrode on the second insulating layer contacting the second nitride semiconductor layer through the second opening, and forming a gate electrode above the first nitride semiconductor layer, and separated from the second insulating layer in a plan view perpendicular to the principal surface.
H01L 29/20 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/3065 - Gravure par plasma; Gravure au moyen d'ions réactifs
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
In a terminal unit, a second contact portion of a female terminal includes a push-up protrusion projecting toward a first contact portion and a pair of first projecting contact point portions, to be respectively brought into contact with a pair of inclined portions, of a male terminal. The male terminal includes an accommodation recess capable of accommodating the push-up protrusion. In an incomplete connection state, the male terminal is in contact with the push-up protrusion and pushed up toward the first contact portion, whereby the inclined portions of the male terminal are separated from the first projecting contact point portions of the female terminal. In a complete connection state, the inclined portions of the male terminal are pressed by the first projecting contact point portions of the female terminal.
In a semiconductor switch, a resistance value between a current input terminal to which a current is input and a current output terminal from which a current is output decreases as a voltage of a control terminal based on a potential of the current output terminal increases. A booster circuit is disposed on a path extending from the current input terminal to the control terminal. The booster circuit boosts a voltage input from the current input terminal side and applies the boosted voltage to the control terminal. A switch is connected between the control terminal and the current output terminal of the semiconductor switch. The switch is switched off by power consumption. The power consumption stops and the switch switches on if the supply of power to the booster circuit stops.
H03K 17/687 - Commutation ou ouverture de porte électronique, c. à d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
H02H 3/38 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion sensibles à l'angle de déphasage entre tension et courant
H03K 17/06 - Modifications pour assurer un état complètement conducteur
H03K 17/081 - Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension sans réaction du circuit de sortie vers le circuit de commande
A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 15/082 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines acryliques
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
A clamp (10) according to one aspect of the present disclosure, which secures an electric wire (5) to an attachment target such as a vehicle door, comprises a secured part (13) secured to an attachment target such as a body and a holding part (14) that holds the electric wire (5) in a selected position along the height of the secured part (13). The clamp (10) comprises a height adjustment mechanism (15) that attaches the holding part (14) to the secured part (13) such that the position of the holding part (14) can be selected along the height of the secured part (13). The height adjustment mechanism (15) is a structure for setting, as appropriate, the engagement combination of a first protrusion (29) and a second protrusion (30) to adjust the height position.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H02G 3/32 - Installations de câbles ou de lignes sur les murs, les sols ou les plafonds utilisant des colliers de fixation
A diamond sensor unit includes: a diamond having a color center with electron spin; an excitation light irradiation part that irradiates the diamond with excitation light; a first patch antenna that receives electromagnetic waves; an electromagnetic wave irradiation part that irradiates the diamond with the electromagnetic waves received by the first patch antenna; a detection part that detects radiated light radiated from the color center of the diamond after the diamond is irradiated with the excitation light and the electromagnetic waves; and an optical waveguide that transmits the excitation light and the radiated light.
Provided are a metal material and a connection terminal with which the characteristics of In can be obtained on the surface even after experiencing a high-temperature environment, and a method with which it is possible to manufacture such a metal material. The metal material 1 includes: a substrate 2; an intermediate layer 3 that contains at least Ni and that covers the surface of the substrate 2; and an In coating layer 4 comprising In or an In alloy that does not contain Ni other than as unavoidable impurities, the In coating layer 4 coating the surface of the intermediate layer 3 and being exposed on the outermost surface, In being contained at an amount greater than 7/3 times the amount of Ni as a ratio of the number of atoms in the intermediate layer 3 and the In coating layer 4 combined. The connection terminal contains the metal material 1, the intermediate layer 3 and the In coating layer 4 being formed on the surface of the substrate 1 at least a contact part that comes into electrical contact with a counterpart electroconductive member.
H01R 13/03 - Contacts caractérisés par le matériau, p.ex. matériaux de plaquage ou de revêtement
C22C 28/00 - Alliages à base d'un métal non mentionné dans les groupes
C25D 5/12 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome
H01R 43/16 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour la fabrication des pièces de contact, p.ex. par découpage et pliage
A semiconductor device includes a substrate, a source electrode, a drain electrode, a first gate electrode extending in a first direction and provided between the source electrode and the drain electrode, a second gate electrode provided in a region between the source electrode and the drain electrode positioned in the first direction from the first gate electrode, a gate pad provided so as to dispose the first gate electrode between the gate pad and the second gate electrode, and electrically connected to the first gate electrode, a first gate line provided above the source electrode, a second gate line provided above the source electrode and extending in a second direction that crosses the first direction, and a first guard metal layer provided between the second gate line and the drain electrode, and having at least a portion provided between the drain electrode and the source electrode.
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 27/085 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type comprenant uniquement des composants à effet de champ
H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
The purpose of the present invention is to secure a long creepage distance between adjoining male terminal fittings. The connector (A) is provided with a housing (10) having a wall-like terminal holding section (11), multiple press-fit holes (13) formed in the terminal holding section (11), and multiple male terminal fittings (20) individually press-fitted in the multiple press-fit holes (13) and protruding from a rear surface (11R) of the terminal holding section (11) to the outside. Protrusions (16) are formed on the terminal holding section (11) so as to protrude from the rear surface (11R) of the terminal holding section (11) and arranged to separate adjoining press-fit holes (13) from each other.
H01R 13/41 - Fixation d'une manière non démontable, p.ex. par moulage, rivetage par engagement à frottement dans une rondelle isolante, un panneau ou une base
A cutoff control apparatus controls a cutoff unit in a vehicle-mounted system which includes: a power storage unit; a power line between the power storage unit and a load; and the cutoff unit that switches between a cutoff state that cuts off supplying of power on the power line from the power storage unit side to the load side and a canceled state where the cutoff state is canceled. In the vehicle-mounted system, the cutoff unit includes a first cutoff unit and a second cutoff unit, and the second cutoff unit enters the cutoff state when a first overcurrent state has occurred on the power line with the first cutoff unit in the canceled state. The cutoff control apparatus includes a control apparatus that instructs the first cutoff unit to switch to the cutoff state when the power line is in a second overcurrent state.
H02H 7/22 - Circuits de protection de sécurité spécialement adaptés pour des machines ou appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou ligne, et effectuant une commutation automatique dans le cas d'un chan pour dispositifs de commutation
B60R 16/03 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique
H02H 1/00 - CIRCUITS DE PROTECTION DE SÉCURITÉ - Détails de circuits de protection de sécurité
17.
RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, OPTICAL FIBER, METHOD FOR PRODUCING OPTICAL FIBER, OPTICAL FIBER RIBBON, AND OPTICAL FIBER CABLE
A resin composition for primary coating of an optical fiber contains a photopolymerizable compound containing a difunctional urethane (meth)acrylate and a monofunctional urethane (meth)acrylate, and a photopolymerization initiator, the difunctional urethane (meth)acrylate is a reaction product of a diol, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, and the monofunctional urethane (meth)acrylate is a reaction product of a polyoxyalkylene monoalkyl ether, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, or a reaction product of a polyoxyalkylene monoalkyl ether and an isocyanate group-containing (meth)acrylate.
A wiring member-equipped adherend includes: a wiring member including a sheet and a wire-like transmission member bonded to the sheet; and an adherend provided in a position where the wiring member is disposed in a vehicle to be bonded to the sheet. A bonding part where the sheet and the adherend are bonded includes a lateral bonding part provided in a position deviated from the wire-like transmission member along a width direction of the sheet.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme
Provided is a connector that does not require dedicated assembly equipment. A connector (10) includes a primary molded portion (20A) comprising a primary resin material, and a secondary molded portion (50A) comprising a secondary resin material. The secondary molded portion (50A) is provided in such a way as to be capable of moving relative to the primary molded portion (20A).
A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
An electromagnetic field analysis method includes generating meshes so that a first mesh is generated in a first region and no mesh or a second mesh is generated in a second region other than the first region in a coplanar waveguide, the coplanar waveguide including a dielectric layer and a conductor pattern having a signal line and reference potential patterns, the first region including the signal line and respective parts of the reference potential patterns and having a constant width in a direction orthogonal to an extending direction of the signal line, the reference potential patterns being spaced away from the signal line and interposing the signal line therebetween, the second mesh having a larger dimension than the first mesh, and performing electromagnetic field analysis on the coplanar waveguide using the meshes.
An electric wire for use in an electric vehicle with a large current of 100 A or more and a high voltage of 30 V or more includes a conductor and an electrically insulating layer covering an outer surface of the conductor, wherein the conductor includes first twisted wires in each of which a plurality of element wires are twisted together, and the first twisted wires are twisted together to form one or more second twisted wires, wherein an element-wire diameter of each of the element wires is 0.18 mm to 0.35 mm, and wherein a secant modulus of the electrically insulating layer is 15 MPa to 41 MPa.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H01B 3/44 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines acryliques
23.
DETECTION DEVICE, DETECTION METHOD, AND DETECTION PROGRAM
A detection device includes: a monitoring unit configured to monitor a periodic message and an event message as messages in an in-vehicle network, each message having, assigned thereto, identification information of a transmission source and a sequence number; a counter unit configured to change a counter value corresponding to the identification information, when the detection device has received the event message from the in-vehicle network; and a detection unit configured to compare the sequence number with the counter value, based on a result of monitoring, and perform provisional determination for detection of an unauthorized message, based on a result of the comparison. The detection unit performs conclusive determination for detection of the unauthorized message, based on an interval of messages that satisfy a predetermined condition regarding the sequence number, among messages to which the same identification information is assigned, and on a predetermined transmission cycle of the periodic message.
A semiconductor photodetector includes a first group III-V semiconductor layer of a first conductivity type; a second group III-V semiconductor layer of a second conductivity type; and an optical absorption layer disposed between the first group III-V semiconductor layer and the second group III-V semiconductor layer in a first direction. The optical absorption layer includes a plurality of unit structures stacked in the first direction. Each of the plurality of unit structures includes a gallium arsenide layer, an indium arsenide layer, and a gallium arsenide antimonide layer. The gallium arsenide layer and the indium arsenide layer each have a thickness smaller than a thickness of the gallium arsenide antimonide layer.
H01L 31/105 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel étant du type PIN
H01L 31/0304 - Matériaux inorganiques comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
A semiconductor photodetector includes an optical absorption layer. The optical absorption layer includes a plurality of unit structures stacked in a first direction, each of the plurality of unit structures includes a laminate and a gallium arsenide antimonide layer, the laminate includes a first gallium arsenide layer including j gallium arsenide monolayers, a first indium arsenide layer including m indium arsenide monolayers, k stacked structures, and a second gallium arsenide layer including (j−1) gallium arsenide monolayers, each of the k stacked structures includes a third gallium arsenide layer including n gallium arsenide monolayers, and a second indium arsenide layer including m indium arsenide monolayers, j, m, and n are each an integer of 1 or more, and k is an integer of 0 or more.
H01L 31/105 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel étant du type PIN
H01L 31/0304 - Matériaux inorganiques comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV
A spot size converter includes a first optical waveguide, and a second optical waveguide. The first optical waveguide has a first tapered portion. The first tapered portion extends in a direction in which the first optical waveguide extends, and is thicker with decreasing distance from an end portion of the first optical waveguide and is thinner with decreasing distance from the second optical waveguide. The second optical waveguide is separated from the first tapered portion and has a second tapered portion. The second tapered portion extends in a direction in which the second optical waveguide extends, and is thinner with decreasing distance from the first tapered portion and is thicker with increasing distance from the first tapered portion.
A diamond sensor unit includes: a sensor part that includes a diamond having a color center with electron spin; an irradiation part that irradiates the diamond with excitation light; a detection part that detects radiated light from the color center of the diamond; and an optical waveguide that transmits the excitation light, and the radiated light.
G01R 33/26 - Dispositions ou appareils pour la mesure des grandeurs magnétiques faisant intervenir la résonance magnétique pour la mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques utilisant le pompage optique
G02B 6/32 - Moyens de couplage optique ayant des moyens de focalisation par lentilles
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
Provided is a power supply control device that can favorably supply power to a plurality of electric loads. The power supply control device controls discharge from a power supply unit including a plurality of power storage units. The power supply control device includes a switch unit that changes the connection states of the plurality of power storage units and a control unit that controls the switch unit. The switch unit switches between a first connection state in which charging current can be supplied to all of the plurality of power storage units and a second connection state in which the plurality of power storage units are divided into a plurality of power storage unit regions. When the switch unit 30 is in the second connection state, power is supplied from the plurality of power storage unit regions to the corresponding target loads.
B60R 16/03 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
A lead member includes a lead conductor having a first main surface and a second main surface opposite to the first main surface. The lead member includes a resin portion that covers the first main surface, the second main surface, and two side surfaces that are between both ends of the lead conductor, while exposing the both ends of the lead conductor in a first direction. The lead conductor includes a metal substrate and a surface treatment layer formed on at least a portion of a surface of the metal substrate, the surface treatment layer including chromium, oxygen, and fluorine. A moisture content of a portion of the surface treatment layer exposed from the resin portion, as measured by coulometric Karl Fischer titration at a vaporization temperature of 220° C., is 5.0 μg/cm2 or less.
H01M 50/198 - Boîtiers, fourreaux ou enveloppes primaires d’une seule cellule ou d’une seule batterie Éléments de scellement caractérisés par le matériau caractérisés par les propriétés physiques, p.ex. adhérence ou dureté
H01M 50/172 - Dispositions pour introduire des connecteurs électriques dans ou à travers des boîtiers
H01M 50/197 - Boîtiers, fourreaux ou enveloppes primaires d’une seule cellule ou d’une seule batterie Éléments de scellement caractérisés par le matériau ayant une structure en couches
H01M 50/562 - Bornes caractérisées par le matériau
A communication electric wire 1 includes: a conductor 2; an insulating layer 3 covering an outer periphery of the conductor 2; and a magnetic sheath layer 8 covering an outside of the insulating layer 3, wherein the magnetic sheath layer 8 contains an organic polymer and a magnetic material, the magnetic sheath layer 8 contains 15 parts by mass or more of an acid-modified polymer in 100 parts by mass of the entire organic polymer, and the magnetic material is composed of particles with an average particle diameter of 50 μm or less, and a content of the magnetic material in the magnetic sheath layer 8 is 300 parts by mass or more with respect to 100 parts by mass of the entire organic polymer.
An optical connector includes a ferrule, a ferrule holder, a housing, and an anti-rotation structure. The ferrule includes a through hole that extends in a first direction and holds an optical fiber inside the through hole. The ferrule holder is disposed on the outer periphery of the ferrule and is fixed to the ferrule. The anti-rotation structure is provided inside the housing and outside the ferrule, and prevents rotation of the ferrule about an axis with the ferrule holder. The ferrule holder includes a tubular holder main body that accommodates the ferrule therein, and a flange part that protrudes outward from the outer periphery of the holder main body. The flange part includes a configuration to fit with the anti-rotation structure. A center of the flange part in the first direction is located in a central region of the ferrule in the first direction.
A light receiving element includes a substrate having a first main surface, and includes a light receiving layer provided on the first main surface. The light receiving layer includes a first semiconductor layer and a second semiconductor layer provided on the first semiconductor layer. The light receiving element includes a contact layer provided on the light receiving layer, and includes a groove that separates the contact layer for each pixel. The first semiconductor layer includes a type-II quantum-well layer including an InGaAs layer and a GaAsSb layer. The second semiconductor layer includes a AlxGayIn1-x-yAs layer, where 0≤x<1, 0≤y<1, and 0
A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of Ti1-a-bAlaCebN, a is 0.350 or more and 0.650 or less, b is 0.001 or more and 0.100 or less, the second unit layer is composed of AlcV1-cN, c is 0.40 or more and 0.75 or less, and a and c satisfy a relationship of c>a.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of Ti1-a-bAlaCebN, a is between greater than or equal to 0.350 and equal to or less than 0.650, b is between greater than or equal to 0.001 and equal to or less than 0.100, the second unit layer is composed of TicSi1-cN, and c is between greater than or equal to 0.20 and equal to or less than 0.99.
A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of Ti1-a-bAlaCebN, a is 0.350 or more and 0.650 or less, b is 0.001 or more and 0.100 or less, the second unit layer is composed of AlcCr1-cN, c is 0.40 or more and 0.75 or less, and a and c satisfy a relationship of c>a.
An on-board control device includes a plurality of relays, a control unit, and a plurality of current detection units. The plurality of current detection units detect the value of current that flows through respective branch paths. The relays switch between an allowance state of allowing current flow on the respective branch paths and a shut off state of shutting off the current flow. If an anomalous state determined in advance is detected, the control unit switches the relay provided on a specific branch path on which the current value is increasing at the fastest rate among the plurality of branch paths to the shut off state, based on the detection results of the current detection units.
H02H 7/22 - Circuits de protection de sécurité spécialement adaptés pour des machines ou appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou ligne, et effectuant une commutation automatique dans le cas d'un chan pour dispositifs de commutation
B60R 16/03 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique
A resin composition for primary coating of an optical fiber contains a photopolymerizable compound containing a urethane (meth)acrylate containing a reaction product of a polypropylene polyol having a number average molecular weight of 8000 or more and 20000 or less and an isocyanate group-containing (meth)acrylate and a photopolymerization initiator.
A wiring module including a flexible printed wiring board to be electrically connected to a plurality of power storage elements, wherein the flexible printed wiring board includes: a base film that has insulating properties and has a first surface and a second surface; an adhesive layer that has adhesive properties and is stacked onto the first surface of the base film; a conductive path that is stacked onto the first surface of the base film using the adhesive layer; and a coverlay that is stacked onto the first surface of the base film using the adhesive layer, and covers the first surface of the base film and the conductive path, the conductive path has a fuse portion forming a part of a circuit and having a smaller cross-sectional area than another part of the conductive path, and a resin portion that includes a synthetic resin with insulating properties.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
39.
HEAT SHRINKABLE TUBE, HEAT SHRINKABLE COUPLING COMPONENT, METHOD OF MANUFACTURING HEAT SHRINKABLE TUBE, AND METHOD OF MANUFACTURING HEAT SHRINKABLE COUPLING COMPONENT
The heat shrinkable tube according to the present disclosure contains an ethylene-tetrafluoroethylene copolymer as a main component. The heat shrinkable tube has a melting point of 210° C. to 250° C. and a storage elastic modulus of 0.8 MPa to 2.8 MPa at 250° C. to 280° C.
An optical module according to one embodiment includes: an optical element having a first side, a second side, and a third side; a housing; a thermoelectric cooler with the optical element being mounted on the thermoelectric cooler; a driving circuit arranged on the side of the first side of the optical element; a first bonding pad arranged on the side of the second side of the optical element; and a first wiring pattern provided on the frame body of the housing and connected to the first bonding pad of the optical element through the first bonding wiring, wherein the thermoelectric cooler has a plurality of Peltier elements arranged with spacings. A spacing between the plurality of Peltier elements located on the side of the second side is narrower than a spacing between the plurality of Peltier elements located in the center of the optical element.
G02F 1/225 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence dans une structure de guide d'ondes optique
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
G02F 1/21 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur par interférence
A connector includes a terminal fitting and an upper housing and a lower housing slidable in a direction orthogonal to an overlapping direction while being overlapped to sandwich the terminal fitting. A resilient lock piece cantilevered in the overlapping direction with respect to the lower housing is formed on a side edge part of the upper housing. A lock projection to be locked by the resilient lock piece when the both housings are overlapped is formed on a side surface of the lower housing. A stopper for locking the resilient lock piece when the both housings are slid is formed on the side surface of the lower housing. The stopper is disposed at a position further separated from a base end portion of the resilient lock piece than the lock projection.
A method for installing a radio wave sensor configured to radiate a radio wave to a range including a target area that is set for detection of an object. The method includes: a step of installing a reference object; and a step of adjusting a radio wave radiation direction of the radio wave sensor, using the reference object as a reference. The reference object is installed at a first position outside the target area.
A light receiving device includes a semiconductor layer, and at least one electrode provided on a surface of the semiconductor layer and electrically connected to the semiconductor layer. A plurality of mesas are formed from the semiconductor layer. The plurality of mesas are arranged in a two-dimensional array. The at least one electrode includes a plurality of electrodes, and each of the plurality of mesas is provided with a corresponding one of the plurality of electrodes. A contact portion has a periphery forming a closed curved shape, the contact portion being a portion at which the plurality of electrodes and the semiconductor layer are in contact with each other.
A heater includes a base, a plurality of heating bodies, a plurality of terminals, and a cylindrical. The base has a first surface on which a heating target is placed, and a second surface opposite to the first surface. The plurality of heating bodies include an inside heating body disposed in a region including a center of the base, and a plurality of outside heating bodies disposed outside of the inside heating body to be concentric with the base. The inside heating body and the plurality of outside heating bodies are disposed to be spaced from each other in a thickness direction of the base. The inside heating body is disposed at a first layer located closest to the first surface in the thickness direction of the base. The plurality of outside heating bodies include a first outside heating body, and a second outside heating body.
A printed wiring board includes a base film having a main surface, a coil wiring formed on the main surface, and a first connection land and a second connection land connected to one end and another end of the coil wiring, respectively. The main surface includes a first main surface and a second main surface opposite to the first main surface. The coil wiring includes a first coil wiring formed in a spiral shape on the first main surface, and a second coil wiring formed in a spiral shape on the second main surface and electrically connected to the first coil wiring. The first connection land and the second connection land are formed on the second main surface. The number of turns of the first coil wiring is more than the number of turns of the second coil wiring.
An optical cable according to an embodiment of the present disclosure is an optical cable for installation in a microduct, the optical cable including one or more optical-fiber core wires, and a sheath layer covering an outer peripheral side of the one or more optical-fiber core wires. The sheath layer has a density of 2.0 g/cm3 or less. The sheath layer contains an olefin-based resin, a silicone, and a non-halogen flame retardant. A mass ratio of the non-halogen flame retardant to the olefin-based resin is 0.90 to 2.00. A mass ratio of the silicone to the olefin-based resin is 0.005 to 0.100. The olefin-based resin contains a polyethylene, and an ethylene-vinyl acetate copolymer or an ethylene-ethyl acrylate copolymer. The silicone has a weight-average molecular weight of 50,000 to 1,000,000.
An electronic unit includes: a case; a circuit board; and a cover, wherein a portion of a connector, which is provided on the circuit board, to be connected to a mating connector is exposed to the outside through a through hole of the cover, a first clearance portion and a second clearance portion are provided in at least one of a portion located between the cover and the case at a position of the opening and a portion located between the cover and the connector at a position of the through hole, a clearance in the first clearance portion is larger than a clearance in the second clearance portion, the second clearance portion is located on an inner side of the case relative to the first clearance portion, and the first clearance portion extends and reaches the second clearance portion while maintaining a constant clearance.
A radar installation angle adjustment assistance apparatus includes: a display device; and a display control unit configured to cause the display device to display an assistance screen for assisting adjustment of an installation angle of an infrastructure radar. The assistance screen includes a target value display part configured to display a target value of the installation angle of the infrastructure radar, a detection angle display part configured to display the installation angle of the infrastructure radar detected by an angle sensor, and a determination result display part configured to display a determination result of determination as to whether or not an angle difference between the target value and the installation angle is included in a predetermined set range. When the angle difference is not included in the predetermined set range, the display control unit causes an angle based on the angle difference to be displayed on the assistance screen.
A resin coating device for coating a surface of a glass fiber, includes: a point having a point hole; a die disposed directly below the point and including a first alignment portion, a second alignment portion, and a first die hole; and a first resin supply path. The second alignment portion is disposed below the first alignment portion. The first alignment portion includes a first diameter-reduced portion, and a first land portion disposed, connected to the first diameter-reduced portion, and having a constant diameter in the traveling direction. The second alignment portion includes a second diameter-reduced portion, and a second land portion, connected to the second diameter-reduced portion, and having a constant diameter in the traveling direction. The first diameter-reduced portion, the first land portion, the second diameter-reduced portion, and the second land portion are each a part of the first die hole.
A printed circuit board includes: an insulating base film; and a plurality of wiring portions foamed on a surface of the base film. The wiring portions include a seed layer directly or indirectly layered on the surface of the base film and a metal layer layered on the seed layer. The base film has a wiring area including the plurality of wiring portions and a non-wiring area not including the wiring portions. The plurality of wiring portions include at least one outermost boundary wiring portion and a plurality of inner wiring portions. The outermost boundary wiring portion is formed on an outermost-side of the base film in the wiring area and at a boundary between the wiring area and the non-wiring area. An average thickness of the outermost boundary wiring portion is 40μm or more. An average width of the outermost boundary wiring portion is 30 μm or more.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
51.
OPTICAL APPARATUS, LIGHT EMITTING APPARATUS, OPTICAL CABLE, AND METHOD OF CONNECTING OPTICAL APPARATUS
Sumitomo Electric Device Innovations, Inc. (Japon)
Inventeur(s)
Ishii, Kuniyuki
Kurashima, Hiromi
Kamisugi, Hideaki
Sano, Tomomi
Nakanishi, Tetsuya
Nguyen, Hong
Arao, Hajime
Sasaki, Dai
Watanabe, Takuro
Abrégé
An optical apparatus includes a light emitting apparatus and a host apparatus. The light emitting apparatus includes a housing extending in a first direction, a light emitting device mounted in the housing, an optical connector including a first optical connection part provided at one end of the housing, and an electrical connector including a first electrical connection part provided at one end of the housing and receiving a voltage to drive the light emitting device. The host apparatus includes a host optical connector including a second optical connection part which faces the first optical connection part and is optically coupled thereto, a host electrical connector including a second electrical connection part facing the first electrical connection part and being electrically connected to the first electrical connection part, and a host board mounting the host optical connector and the host electrical connector thereon. The light emitting apparatus is connected to the host apparatus in the optical apparatus.
A vehicle-mounted apparatus includes a first processing unit that is connected to each of the plurality of vehicle-mounted ECUs and performs relay processing on the messages; a second processing unit that is connected to each of the plurality of vehicle-mounted ECUs and performs relay processing on the messages; a first routing table including a relay destination of each message to be processed at the first processing unit; and a second routing table including a relay destination of each message to be processed at the second processing unit. Each of the first processing unit and the second processing unit includes a connection unit to which wiring connected to the plurality of vehicle-mounted ECUs is connected, the first processing unit performs the relay processing based on the first routing table, and the second processing unit performs the relay processing based on the second routing table.
H04L 12/54 - Systèmes de commutation par mémorisation et restitution
H04L 67/12 - Protocoles spécialement adaptés aux environnements propriétaires ou de mise en réseau pour un usage spécial, p.ex. les réseaux médicaux, les réseaux de capteurs, les réseaux dans les véhicules ou les réseaux de mesure à distance
53.
INFORMATION PROVIDING SYSTEM, SERVER DEVICE AND INFORMATION PROVIDING METHOD
The information providing system includes a mobile terminal and a server device that communicates with the mobile terminal. The mobile terminal includes: a sensor that reads a facility ID used to identify at least one facility; and a communication device that transmits, to the server device, the facility ID read by the sensor and a user ID used to identify a user of the mobile terminal. The server device includes: a memory that stores a plurality of types of facility-related information; a processor that extracts, from the plurality of types of facility-related information stored in the memory, facility-related information corresponding to the facility ID and the user ID transmitted from the mobile terminal; and a communication device that transmits, to the mobile terminal, the facility-related information extracted by the processor. The mobile terminal includes a display on which the facility-related information transmitted from the server device is displayed.
A connector (10) is provided with a housing (11) and a terminal fitting (12) to be accommodated into the housing (11). The housing (11) includes a housing body (20), a pair of side walls (21), a lock arm (23) and a projection (24). The housing body (20) accommodates the terminal fitting (12). The pair of side walls (21) project from an outer surface of the housing body (20) and are arranged side by side in a width direction of the housing (11). The lock arm (23) is arranged between the pair of side walls (21) and supported on the pair of side walls (21) displaceably like a seesaw. The projection (24) is provided on a facing surface of the housing body (20) and the lock arm (23) and serves as a fulcrum of a seesaw movement of the lock arm (23).
An optical module according to the present disclosure includes a glass substrate having a first surface, a second surface opposite to the first surface, and a via hole connecting the first surface and the second surface each other; an optical element mounted on the first surface of the glass substrate and joined to the via hole of the glass substrate, the optical element being configured to consume an electricity and perform at least one of an input and an output of an optical signal; a temperature control element mounted on the second surface of the glass substrate and joined to the via hole of the glass substrate, the temperature control element being configured to regulate a temperature of the optical element; and a first housing attached to the first surface, the first housing being configured to hermetically seal the optical element.
The aluminum alloy in the cross-section of the surface layer region of the aluminum alloy plate contains a compound containing one or more elements selected from the group consisting of silicon, magnesium, iron, copper, manganese, chromium, zinc, zirconium, and titanium, and aluminum. The number of fields of view containing the compound having an equivalent circle diameter of 5 μm or more out of 10 fields of view extracted from the cross-section is 3 or less. In the cross-section, the number density of the compound having an equivalent circle diameter of 1.5 μm or more and less than 5.0 μm is 0.0010 per μm2 or less, and the area ratio of the compound having an equivalent circle diameter of 0.5 μm or more is 0.1% or more and less than 1.0%.
Provided is an in-vehicle apparatus including a first processing unit performing control processing for controlling the vehicle and is connected to a plurality of in-vehicle ECUs, a second processing unit, connected the plurality of in-vehicle ECUs, communicates with the first processing unit. A first reception table and a second reception table includes information indicating a type of a reception target message of the first processing unit second processing unit respectively. The second processing unit receives the reception target message of the second processing unit based on the second reception table and outputs information included in the received message to the first processing unit, and the first processing unit receives the reception target message of the first processing unit based on the first reception table and performs control processing based on at least one of information included in the received message and the information output from the second processing unit.
Provided is an on-board apparatus that is connected to an on-board device and communicates with the on-board device, and includes a control unit configured to control communication with the on-board device, and a communication line for communicating with the on-board device, and the control unit communicates with the on-board device via the communication line, detects a communication load on the communication line, and controls a communication speed of communication that is performed via the communication line, based on the detected communication load.
H04L 41/0816 - Réglages de configuration caractérisés par les conditions déclenchant un changement de paramètres la condition étant une adaptation, p.ex. en réponse aux événements dans le réseau
H04L 41/0896 - Gestion de la bande passante ou de la capacité des réseaux, c. à d. augmentation ou diminution automatique des capacités
H04W 4/48 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques pour les véhicules, p.ex. communication véhicule-piétons pour la communication dans le véhicule
A polarization-maintaining optical fiber includes at least one polarization maintaining core, a first cladding surrounding the at least one polarization maintaining core, and a second cladding surrounding the first cladding. The at least one polarization maintaining core includes a core and a pair of low-refractive-index portions each having a refractive index lower than a refractive index of the core. In a cross section, at least a portion of an outer periphery of each of the pair of low-refractive-index portions is in contact with the core, and an outer periphery of the core, excluding portions each being in contact with the low-refractive-index portions, has a circular shape. A maximum value of an absolute value of a residual stress in the cross section is 100 MPa or less. A mode-field flattening f is 0.05 to 0.40 at any wavelength within a range of 850 nm to 1625 nm.
A DC-DC converter includes a first capacitor and a second capacitor provided between one of a first conductive path and a second conductive path and a reference conductive path, a first switch and a second switch interposed between a first external power source and the first capacitor and between a second external power source and the second capacitor, and a control unit configured to switch the first switch and the second switch between an ON state and an OFF state, whereby the control unit, in the case of switching from shut-off control in which the first switch and the second switch are kept in the OFF state to energization control in which the first switch and the second switch are kept in the ON state, performs intermittent control in which the first switch and the second switch are intermittently switched to the ON state prior to the energization control.
H02M 1/32 - Moyens pour protéger les convertisseurs autrement que par mise hors circuit automatique
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
An optical module includes a base member including a first surface, a first semiconductor light-emitting element mounted on the first surface and configured to emit first light having a first wavelength, a first filter mounted on the first surface and including a first reflection surface configured to reflect the first light, a second semiconductor light-emitting element mounted on the first surface and configured to emit second light having a second wavelength differing from the first wavelength, and a second filter mounted on the first surface and including a second reflection surface configured to reflect the second light.
An apparatus for producing a glass preform is an apparatus by pulling up a starting rod while the starting rod is rotated around an axis and glass fine particles generated by a burner are deposited in an axial direction of the starting rod. The apparatus for producing a glass preform includes an imaging device that acquires a deposition surface image by imaging a deposition surface of a glass fine particle deposit deposited on the starting rod, and an image processing unit that detects an edge shape of the deposition surface from the deposition surface image acquired using the imaging device to judge quality of the glass fine particle deposit by quantifying a degree of deformation of the edge shape.
G01B 11/16 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la déformation dans un solide, p.ex. indicateur optique de déformation
A voltage conversion device determines a usage duty based on the minimum value of candidates that include a first candidate duty and a second candidate duty if the direction of current flowing through at least one of a first conductive path and a second conductive path is a first current direction. The voltage conversion device determines a usage duty based on the maximum value of candidates that include the first candidate duty and a third candidate duty if the direction of current flowing through at least one of the conductive paths is a second current direction.
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p.ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H02M 1/00 - APPAREILS POUR LA TRANSFORMATION DE COURANT ALTERNATIF EN COURANT ALTERNATIF, DE COURANT ALTERNATIF EN COURANT CONTINU OU VICE VERSA OU DE COURANT CONTINU EN COURANT CONTINU ET EMPLOYÉS AVEC LES RÉSEAUX DE DISTRIBUTION D'ÉNERGIE OU DES SYSTÈMES D'ALI; TRANSFORMATION D'UNE PUISSANCE D'ENTRÉE EN COURANT CONTINU OU COURANT ALTERNATIF EN UNE PUISSANCE DE SORTIE DE CHOC; LEUR COMMANDE OU RÉGULATION - Détails d'appareils pour transformation
H02M 1/08 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques
An external connection bus bar to be connected to a storage element group having a plurality of storage elements and having an output electrode terminal for outputting electric power to an external circuit includes a main body portion to be connected to the output electrode terminal, an external connection terminal to be connected to an external circuit, and a circuit board connection portion to be soldered to a bus bar land provided on the circuit board. The external connection terminal is provided between the main body portion and the circuit board connection portion.
H01M 50/298 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par le câblage des blocs de batterie
H01B 5/02 - Barres, barreaux, fils ou rubans simples; Barres omnibus
H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
H01R 12/59 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
65.
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes a substrate; a semiconductor layer provided on the substrate; a source electrode and a drain electrode provided on the semiconductor layer; a first film including a first insulating film that is provided on the semiconductor layer and is located between the source electrode and the drain electrode; a gate electrode provided between the source electrode and the drain electrode; and a silicon carbide layer covering the gate electrode. The first film has an opening. The gate electrode includes a first portion that is located within the opening in a plan view, and a second portion that is connected to the first portion, is disposed on the first film, and is located closer to the drain electrode than the first portion is.
H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/778 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à deux dimensions, p.ex. transistors à effet de champ à haute mobilité électronique HEMT
A tape supply device that supplies a tape to an optical cable, the tape supply device includes: an accumulator unit of a multistage unit type divided into units, each of the units including a plurality of movable rollers and a plurality of fixed rollers, the units being connected in series; and a control unit configured to control a supply order of the tape from the units.
B65H 23/188 - Positionnement, tension, suppression des à-coups ou guidage des bandes longitudinal en commandant ou régulant le mécanisme d'avance de la bande, p.ex. le mécanisme agissant sur la bande courante en liaison avec la bande courante
A cutting tool including a substrate and a coating film disposed on the substrate, wherein the cutting tool includes: a rake face, a flank face contiguous to the rake face; and a cutting edge region composed of a boundary part between the rake face and the flank face, wherein the coating film includes a TiSiCN layer, the TiSiCN layer has: a first TiSiCN layer positioned in the rake face; and a second TiSiCN layer positioned in the cutting edge region, the first TiSiCN layer has a composition of Ti(1-Xr)SiXrCN, the second TiSiCN layer has a composition of Ti(1-Xe)SiXeCN, and the Xr and the Xe each represent 0.010 or more and 0.100 or less, and satisfy a relationship of Xr−Xe≥0.003.
B23B 27/16 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants interchangeables, p.ex. pouvant être fixés par des brides
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
In an optical fiber cable in which an optical fiber ribbon formed by parallelly arranging a plurality of optical fibers is packaged in an internal space, a core portion of each optical fiber is made of pure quartz and an effective cross-sectional area of the core portion at a wavelength of 1,550 nm is 110 μm2 or more and 150 μm2 or less. The optical fiber ribbon is an optical fiber ribbon in which the optical fibers are connected by continuously applying an adhesive resin between adjacent optical fibers. An occupation ratio of the optical fiber ribbon to the internal space calculated from a ratio of a cross-sectional area of the internal space to a cross-sectional area of the packaged optical fiber ribbon is 25% or more and 55% or less.
A power supply control device is to be installed in a vehicle. The power supply control device controls power supply via a semiconductor switch and a fuse by turning the semiconductor switch ON or OFF. The semiconductor switch and the fuse are mounted on a circuit board. In the fuse, two long plate-shaped terminals are arranged in a row. The fusing portion and a part of the two terminals are covered with a housing having heat resistance. The two terminals are disposed in a current path of a current flowing through the semiconductor switch. The current flows through the fusing portion. If the temperature of the fusing portion exceeds a predetermined temperature, the fusing portion is fused.
H01H 85/02 - Dispositifs de protection dans lesquels le courant circule à travers un organe en matière fusible et est interrompu par déplacement de la matière fusible lorsqu'il devient excessif - Détails
H01H 85/143 - Contacts électriques; Fixation d'éléments fusibles sur de tels contacts
The installation angle of a radar for traffic monitoring can be easily adjusted. A radar installation-angle adjustment method is a radar installation-angle adjustment method of adjusting an installation angle of an infrastructure radio-wave radar configured to detect an object in a target area. The method includes first adjustment of adjusting an angle of a radar installed at an installation target without operating the radar; and second adjustment of operating the radar the angle of which has been adjusted in the first adjustment, and adjusting the angle of the radar based on a detection result of the radar.
A method of assembling an optical module according to the present disclosure includes disposing an input lens system at a position facing an input port, sensing a light intensity of divided light rays, adjusting the input lens system, and optically coupling the input lens system to the input port, and disposing a first output lens system and a second output lens system at positions facing a first output port and a second output port, respectively, and optically coupling the first output lens system and the second output lens system to the first output port and the second output port, respectively.
An optical module of one embodiment includes a semiconductor modulator having a rectangular planar shape, an input lens system facing the input port, a first output lens system facing the first output port, a second output lens system facing the second output port, a first monitor element facing the first monitor port, a second monitor element facing the second monitor port, a first polarizer disposed between the first monitor port and the first monitor element, and a second polarizer disposed between the second monitor port and the second monitor element.
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
An optical module according to one embodiment includes a package having an opening surrounded by side walls, and a lid mounted on the package to seal the opening. The lid has a plate-like shape and includes a welded portion fixed by welding to an upper surface of the side wall of the package having the opening formed thereon, an easily deformable portion formed at a position separated from the welded portion and deformed along with the welding, and a central portion having a flat shape.
An optical module according to one embodiment includes: a beam splitter having a first surface, a second surface facing the first surface, a third surface intersecting with the first surface, a fourth surface facing the third surface, and an inner surface formed within a region defined by the first surface, the second surface, the third surface, and the fourth surface; and a light receiving unit arranged at a position facing the third surface of the beam splitter. The beam splitter splits first incident light incident from the first surface into first split light transmitted through the inner surface and emitted from the second surface and second split light reflected on the inner surface and emitted from the third surface. The optical module includes a light absorbing/reflecting unit provided on the fourth surface.
An object is to provide a technique capable of increasing waterproofness of an electronic unit. An electronic unit includes: a case including an opening; a circuit board housed in the case through the opening; and a cover attached to the opening, wherein a protruding portion is provided on at least one side wall of the case, and the protruding portion includes a step that causes an opening side portion of the side wall to protrude further outward relative to a rear side portion of the side wall, and is provided so as to extend along the periphery of the opening.
A cemented carbide composed of a first hard phase, a second hard phase and a binder phase, in which the first hard phase is composed of tungsten carbide particles, the second hard phase is composed of at least one first compound selected from the group consisting of TiNbC, TiNbN and TiNbCN, the second hard phase has an average particle diameter of 0.25 μm or less, the second hard phase has a dispersity of more than 0.70 and 17.0 or less, the second hard phase has a content of 0.1 vol % or more and 15 vol % or less, the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, and the binder phase has a content of 0.1 vol % or more and 19.0 vol % or less.
C22C 29/02 - Alliages à base de carbures, oxydes, borures, nitrures ou siliciures, p.ex. cermets, ou d'autres composés métalliques, p.ex. oxynitrures, sulfures à base de carbures ou de carbonitrures
A method of manufacturing a photo detector includes preparing a substrate having a first main surface and a second main surface opposite to the first main surface, forming a semiconductor layer on the first main surface, forming a passivation layer having an opening on the semiconductor layer, forming an electrode on the semiconductor layer exposed through the opening, bringing the passivation layer into contact with an etchant after the electrode is formed, and inspecting characteristics after the bringing into contact with an etchant. In the method, the etchant has a higher etching rate for the semiconductor layer than the passivation layer.
A resin composition contains: a base resin including a polyolefin; a modified polyolefin obtained by grafting a polar group onto a polyolefin; and an inorganic filler including magnesium oxide and surface-treated with a silane coupling agent. A remaining rate R of the inorganic filler in a fractured frozen surface is 50% or more. The remaining rate R is calculated using the following expression (1). R=(Df/Dc)×100 . . . (1). Df represents a density of the inorganic filler remaining in a fractured surface of a sheet formed of the resin composition containing the base resin, the modified polyolefin, and the inorganic filler, when the sheet is immersed in liquid nitrogen for 1 hour and then fractured. Dc represents a reference density of the inorganic filler detected in a cut surface of the sheet formed of the resin composition, when the sheet is cut at 24° C. using a focused ion beam without being frozen.
H01B 3/44 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines acryliques
An optical fiber ribbon includes a plurality of optical fibers, and a connecting member configured to intermittently connect the plurality of optical fibers adjacent to each other. The connecting member is colorless and transparent to visible light, and is opaque to light in a specific wavelength band other than a visible light region.
A resin composition contains a base resin including a polyolefin and an inorganic filler including silicon dioxide and surface-treated with a silane coupling agent. A remaining rate R of the inorganic filler in a fractured frozen surface is 50% or more. The remaining rate R is calculated using the following expression (1). R=(Df/Dc)×100 . . . (1). Df represents a density of the inorganic filler remaining in a fractured surface of a sheet formed of the resin composition containing the base resin and the inorganic filler, when the sheet is immersed in liquid nitrogen for 1 hour and then fractured. Dc represents a reference density of the inorganic filler detected in a cut surface of the sheet formed of the resin composition, when the sheet is cut at 24° C. using a focused ion beam without being frozen.
H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
A wiring module is a wiring module that is mounted on a plurality of power storage elements. The wiring module includes busbars that are connected to electrode terminals of the plurality of power storage elements, flexible substrates that are connected to busbar-side connection parts provided at the busbars, a circuit substrate that is connected to the flexible substrates, and a protector on which the busbars, the flexible substrates, and the circuit substrate are placed. An upper surface of the circuit substrate is disposed above upper surfaces of the busbar-side connection parts.
H01M 50/298 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports caractérisés par le câblage des blocs de batterie
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p.ex. modules de barres omnibus
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentes; Interconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/271 - Couvercles des boîtiers secondaires, des bâtis ou des blocs
H01M 50/284 - Montures; Boîtiers secondaires ou cadres; Bâtis, modules ou blocs; Dispositifs de suspension; Amortisseurs; Dispositifs de transport ou de manutention; Supports comprenant l’insertion de cartes de circuits, p.ex. de cartes de circuits imprimés
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleurs; Agencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
It is aimed to enable a plurality of terminal fittings to be fixed to a sheet-like flexible conductive member while being positioned. A sheet-like conductive path is provided with a plurality of first terminal fittings (20), a plurality of second terminal fittings (30), a sheet-like flexible conductive member (11) to be fixed to the plurality of first terminal fittings (20) and the plurality of second terminal fittings (30), a positioning portion (41) for positioning the plurality of first terminal fittings (20) and the plurality of second terminal fittings (30) in a state where the plurality of first terminal fittings (20) and the plurality of second terminal fittings (30) are not fixed to the sheet-like flexible conductive member (11), and a housing (50) for accommodating the plurality of first terminal fittings (20) and the plurality of second terminal fittings (30) fixed to the sheet-like flexible conductive member (11).
H01R 43/20 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour assembler les pièces de contact avec le socle isolant, le boîtier ou le manchon ou pour les en désassembler
In a terminal unit, a male terminal includes a columnar connecting portion having a tapered shape, and a female terminal includes a tubular connecting portion and a resilient member. A facing gap between a first peripheral wall portion and a second peripheral wall portion constituting the tubular connecting portion becomes gradually smaller in an inserting direction of the columnar connecting portion. The first or second peripheral wall portion, includes a contact point portion. With the columnar connecting portion and the tubular connecting portion concentrically arranged, a tip part of the columnar connecting portion is insertable into the tubular connecting portion without contacting the contact point portion, and a press-fit region to be press-fit to the contact point portion is provided on a part of the columnar connecting portion closer to the base end side than the tip part.
The information providing system includes: a working terminal; and an instructing terminal that communicates with the working terminal. The working terminal includes: a working communication device that outputs imaging information including an image of the facility captured with a camera; and a working display that displays working information concerning the work carried out in the facility. The instructing terminal includes: an instructing display that displays the captured image based on the imaging information; an interface that receives instructing information serving to offer an instruction for the work carried out in the facility; and an instructing communication device that outputs the instructing information. The working terminal displays, on the working display, the captured image processed based on the imaging information and the instructing information, as the working information.
It is aimed to reduce a size in an arrangement direction of a plurality of terminal groups. A connector (10) is provided with an inner module (11) including a plurality of terminal groups (22) each having a pair of terminals (60) to be respectively connected to a pair of conductive paths (71), and an outer housing (12) for accommodating the inner module (11). The inner module (11) includes an inner housing (21) integrally configured to support the plurality of terminal groups (22). The outer housing (12) includes one accommodation chamber (84) for accommodating the inner module (11).
H01R 13/514 - Socles; Boîtiers formés comme un bloc ou un assemblage modulaire, c. à d. composés de parties coopérantes pourvues de pièces de contact ou maintenant entre elles des pièces de contact
H01R 13/6463 - Moyens pour empêcher la diaphonie utilisant des paires torsadées de fils
A cable includes a core including a plurality of electrical wires and a first resin layer configured to cover the core. The plurality of electrical wires is twisted together. The first resin layer includes a resin material and a filler. The content of the filler in the first resin layer is 10% by mass or more and 40% by mass or less. The filler is a chemical substance produced from a biological material.
H01B 3/00 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques
A resin composition for primary coating of an optical fiber contains a photopolymerizable compound, a photopolymerization initiator, and a silane coupling agent, wherein the photopolymerizable compound contains a urethane (meth)acrylate and an ultraviolet curable polyrotaxane, and the content of the polyrotaxane is 0.05% by mass or more and 11% by mass or less based on the total amount of the photopolymerizable compound.
C09D 4/00 - Compositions de revêtement, p.ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09D 133/14 - Homopolymères ou copolymères d'esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
A method for manufacturing an optical fiber includes: melting an optical fiber preform and drawing a glass fiber; applying a resin composition to an outer periphery of the glass fiber; and curing the resin composition applied, wherein an amount of eccentricity of a central axis of the glass fiber, in a cross section perpendicular to the central axis of the glass fiber, from a central axis relative to an outer periphery of the resin composition or an outer periphery of a coating resin layer formed by curing the resin composition is measured at 50 points or more over a length range of 50 m or more of the glass fiber, and wherein the resin composition is applied such that a mean value a and a standard deviation a of the amount of eccentricity satisfy a+3σ≤10 μm.
C03B 37/025 - Fabrication de fibres ou de filaments de verre par étirage ou extrusion à partir de tubes, tiges, fibres ou filaments ramollis par chauffage
A plurality of fuses (F1, F2, . . . , and Fn) are respectively disposed on current paths for a plurality of currents branched from one end of a DC power source (10). In a blown fuse detection apparatus (11), ends on one side of a plurality of capacitors (C1, C2, . . . , Cn) are respectively connected to the ends on the downstream side of the plurality of fuses (F1, F2, . . . , and Fn). A plurality of currents that have flowed through the capacitors (C1, C2, . . . , Cn) are input to a circuit switch (30) and a circuit resistor (31). A microcomputer (37) instructs that the circuit switch (30) be switched on, obtains a detected value of a resistance voltage, and detects, based on the obtained detected value, whether or not there is a blown fuse among the fuses (F1, F2, . . . , and Fn).
H02H 3/04 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions électriques normales de travail avec ou sans reconnexion - Détails avec signalisation ou supervision additionnée à la déconnexion, p.ex. pour indiquer que l'appareil de protection a fonctionné
In a vehicle-mounted computer that includes a physical resource including a processor with a plurality of cores and a physical device with a register and generates a plurality of virtual devices by allocating the physical resource through time-division, the processor causes at least one virtual device of the plurality of virtual devices to operate on each of the plurality of cores periodically at a predetermined period and causes another virtual device of the plurality of virtual devices to operate non-periodically, stores the core on which the other virtual device operated, and determines the core on which the other virtual device is to operate, based on whether or not the core on which the other virtual device is to operate will be changed and a change amount of a register value of the physical device.
G06F 9/455 - Dispositions pour exécuter des programmes spécifiques Émulation; Interprétation; Simulation de logiciel, p.ex. virtualisation ou émulation des moteurs d’exécution d’applications ou de systèmes d’exploitation
G07C 5/00 - Enregistrement ou indication du fonctionnement de véhicules
91.
INSULATED ELECTRICAL WIRE AND PRODUCTION METHOD THEREFOR
An insulated wire comprising a conductor and an insulating layer covering the conductor, wherein: the insulating layer comprises a resin and a first filler; the resin comprises a polyimide; the first filler is present in the form of a primary particle or a secondary particle having a plurality of the primary particles aggregated; the primary particle is a silica or alumina particle; the secondary particle has a particle diameter of 0.03 μm or more and 5 μm or less; and the percentage of the total area of the secondary particles to the sum of the total area of the primary particles and the total area of the secondary particles in the cross section of the insulated wire is 50% or more.
C09D 179/08 - Polyimides; Polyesterimides; Polyamide-imides; Polyamide-acides ou précurseurs similaires de polyimides
H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolant; Emploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H01B 13/06 - Isolation des conducteurs ou des câbles
C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide-acides ou précurseurs similaires de polyimides
A management device to be used in an in-vehicle network including a plurality of function units installed in a vehicle includes: a state information acquisition unit configured to acquire state information indicating a state of the vehicle; and an allocation unit configured to change allocation of transmission bands of a plurality of logical paths between the function units in accordance with the state of the vehicle indicated by the state information acquired by the state information acquisition unit.
A female terminal includes a tubular connecting portion including a first peripheral wall portion and a second peripheral wall portion and to be conductively connected to a columnar connecting portion, a pair of tip side plate portions projecting from circumferential end parts while being separated from each other, a resilient member for biasing the pair of tip side plate portions in directions approaching each other, and a stopper portion provided on a facing surface of the tip side plate portion. The stopper portion is provided at a position closer to the tubular connecting portion than a tip part of the tip side plate portion and limits displacements of the pair of tip side plate portions in the approaching directions. The pair of tip side plate portions and the first and second peripheral wall portions are separated and displaced against the biasing forces of the resilient member.
A method for manufacturing a colored optical fiber includes: a step of feeding colored resin into a die; a step of causing a coated optical fiber to pass through the inside of the die and applying the colored resin to a periphery of the coated optical fiber to form a colored optical fiber including a colored layer; a step of detecting a color of the colored layer; and a step of determining whether the detected color is good or bad.
G02B 6/44 - Structures mécaniques pour assurer la résistance à la traction et la protection externe des fibres, p.ex. câbles de transmission optique
G01N 21/952 - Inspection de la surface extérieure de corps cylindriques ou de fils
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
C03B 37/025 - Fabrication de fibres ou de filaments de verre par étirage ou extrusion à partir de tubes, tiges, fibres ou filaments ramollis par chauffage
An optical receiver according to one embodiment includes a transimpedance amplifier including a first pad, a second pad provided on an insulating layer, connected to a cathode wiring layer through a first via, arranged at a position interposing the first pad, and connected to a first cathode pad of a light-receiving element, and a third pad connected to the second cathode pad of the light-receiving element. The light-receiving element is connected to an anode pad mounted on the transimpedance amplifier and connected through an anode electrode and an anode wiring pattern provided on a surface facing the transimpedance amplifier and a first cathode pad and a second cathode pad connected through a cathode electrode and a cathode wiring pattern and arranged at positions interposing the anode pad.
Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion configured to come into thermal contact with an external heat-dissipation target; a case accommodating the heat-generating components and the metal plates, and having opening portions that expose the heat-dissipating portions of the metal plates to an outside; and an insulating film sealing the opening portions of the case and fixed to the case.
A method of manufacturing a light-receiving element of the present disclosure includes forming a first contact layer at one surface of a substrate, forming a light receiving layer on the first contact layer, forming a second contact layer on the light receiving layer, removing a portion of each of the second contact layer, the light receiving layer, and the first contact layer and forming a first groove at which the first contact layer is exposed, filling the first groove with a resin, and after filling the first groove with the resin, removing the second contact layer and forming a second groove separating pixels.
H01L 31/0232 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails - Détails Éléments ou dispositions optiques associés au dispositif
H01L 31/0392 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur structure cristalline ou par l'orientation particulière des plans cristallins comprenant des films minces déposés sur des substrats métalliques ou isolants
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
99.
OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE
An optical module includes an optical component, a substrate including a main surface, a mount portion provided on the main surface of the substrate, and at least one measurement reference portion provided on the main surface of the substrate at a position apart from the mount portion. The substrate mounts the optical component thereon. The mount portion is configured to mount the optical component thereon. The measurement reference portion includes a reference point that becomes a height reference when measuring a mount height of the optical component.
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
100.
VEHICLE-MOUNTED INFORMATION PROCESSING APPARATUS AND VEHICLE-MOUNTED INFORMATION PROCESSING METHOD
A vehicle-mounted information processing apparatus is mounted in a vehicle and includes: a plurality of processing units configured to execute processing in parallel; and a plurality of shared storage units that are accessible by the plurality of processing units, wherein the plurality of processing units exchange information via at least one of the shared storage units and change the at least one of the shared storage units used to exchange information, at predetermined timing. A detection unit configured to detect an abnormality for the shared storage units is also provided. The predetermined timing is the timing at which the detection unit has detected an abnormality occurred at the at least one of the shared storage units. When the detection unit has detected an abnormality occurred at the at least one of the shared storage units, the plurality of processing units may exchange information via a different shared storage unit.
G07C 5/08 - Enregistrement ou indication de données de marche autres que le temps de circulation, de fonctionnement, d'arrêt ou d'attente, avec ou sans enregistrement des temps de circulation, de fonctionnement, d'arrêt ou d'attente
G06F 21/78 - Protection de composants spécifiques internes ou périphériques, où la protection d'un composant mène à la protection de tout le calculateur pour assurer la sécurité du stockage de données
brevets
