Ebara Corporation

Japon

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Date
Nouveautés (dernières 4 semaines) 10
2024 juin (MACJ) 6
2024 mai 8
2024 avril 8
2024 mars 6
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Classe IPC
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe 224
C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir 37
C25D 7/12 - Semi-conducteurs 31
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet 29
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet 28
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1.

PLATING DEVICE

      
Numéro d'application JP2022045415
Numéro de publication 2024/122043
Statut Délivré - en vigueur
Date de dépôt 2022-12-09
Date de publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Seki, Masaya

Abrégé

The present invention suppresses sagging of a central section of a paddle in a cup-type plating device. The present invention includes: a plating bath 410 for accommodating a plating liquid; an anode disposed within the plating bath 410; a substrate holder configured so as to retain a substrate Wf in a state in which a surface to be plated Wf-a is facing downward; a paddle 460 disposed between the anode and the substrate Wf; a drive mechanism 462 configured so as to support a base section 460A of the paddle 460 and cause the paddle 460 to move reciprocally along the surface to be plated Wf-a of the substrate Wf; a first magnet 464 provided on the paddle 460; and a second magnet 468 provided so as to face the first magnet 464. The first magnet 464 and the second magnet 468 are configured so as to mutually exert magnetic force so that a central section 460C of the paddle 460 between the base section 460A and a tip section 460B approaches the surface to be plated Wf-a of the substrate Wf.

Classes IPC  ?

  • C25D 21/10 - Agitation des électrolytes; Déplacement des claies
  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 7/12 - Semi-conducteurs
  • H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique

2.

SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023041941
Numéro de publication 2024/122339
Statut Délivré - en vigueur
Date de dépôt 2023-11-22
Date de publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yamanobe Hokuto
  • Kobayashi Kenichi
  • Yazawa Akihiro
  • Ishikawa Sho

Abrégé

This substrate processing device comprises a plurality of polishing modules for polishing a substrate, and a transport unit for moving the substrate between the plurality of polishing modules. The plurality of polishing modules include a first module group and a second module group. In plan view, the transport unit is positioned between the first module group and the second module group. The first module group has a first upper-side lane and a first lower-side lane in which at least two polishing modules are arranged adjacent to one another. The second module group has a second upper-side lane and a second lower-side lane in which at least two polishing modules are arranged adjacent to one another.

Classes IPC  ?

  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 7/00 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet
  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail

3.

TRANSPORT DEVICE AND SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2022045030
Numéro de publication 2024/121960
Statut Délivré - en vigueur
Date de dépôt 2022-12-07
Date de publication 2024-06-13
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Seki, Masaya
  • Yamada, Nobuya
  • Tomita, Masaki

Abrégé

The present invention increases a transport speed of a substrate and suppress attachment of particles to a processed surface of the substrate. This transport device configured to transport the substrate in an elevation direction and a travel direction orthogonal to the elevation direction comprises a mounting member 710-1 that is fixed to a side surface of a first module frame 402A for installing a plating module having substrate loading/unloading ports 404-1 to 404-8. The mounting member 710-1 includes plurality of travel rails 714-1 to 714-3 disposed on both sides of the substrate loading/unloading ports 404-1 to 404-8 in the elevation direction and extending in the travel direction. The transport device includes an elevation rail 716 extending in the elevation direction crossing over the plurality of travel rails 714-1 to 714-3 and being movable along the plurality of travel rails 714-1 to 714-3 and a transport robot 718 capable of being elevated along the elevation rail 716 and having a hand for holding the substrate.

Classes IPC  ?

  • H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail

4.

SAFETY ASSISTANCE DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, SAFETY ASSISTANCE METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023037506
Numéro de publication 2024/116625
Statut Délivré - en vigueur
Date de dépôt 2023-10-17
Date de publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Murata Seiji

Abrégé

[Problem] To provide a safety assistance device that can improve operation efficiency of an operator while appropriately securing safety of the operator. [Solution] A safety assistance device 5 assists safety of an operator U who performs, with at least one portion of the body positioned within a prescribed movable range, a prescribed operation to a processing device that performs prescribed processing by moving a movable unit having the movable range. The safety assistance device 5 comprises: an image data acquisition unit 500 that acquires image data 110 captured by an image capturing unit 63 disposed so as to face the front of the operator U when the operator U wears an operator device 6; and an interlock information generation unit 501 that generates interlock information indicating an interlock state of the movable unit on the basis of the image data 110 acquired by the image data acquisition unit 500.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

5.

POLISHING INFORMATION PROCESSING DEVICE, PREDICTION DEVICE, AND MACHINE LEARNING DEVICE

      
Numéro d'application JP2023039383
Numéro de publication 2024/116700
Statut Délivré - en vigueur
Date de dépôt 2023-11-01
Date de publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Midorikawa, Shugo

Abrégé

The present invention relates to a polishing information processing device provided to a polishing device that polishes a peripheral edge section of a substrate. A polishing information processing device (112) comprises: an information acquisition unit (241) that acquires a polishing condition, and a profile before and after polishing of a peripheral edge section of a wafer (W); a state prediction unit (240b) that inputs, into a trained model, information including the newly acquired polishing condition and the profile of the peripheral edge section of a substrate before polishing, and predicts the profile of the peripheral edge section of the substrate after polishing; and a correction unit (242) that corrects the polishing condition on the basis of a target profile of the peripheral edge section of the wafer (W) and the profile of the peripheral edge section of the wafer (W) after polishing, as predicted by the state prediction unit (240b).

Classes IPC  ?

  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

6.

SUBSTRATE PROCESSING METHOD, PROCESSING HEAD, AND SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023039854
Numéro de publication 2024/116731
Statut Délivré - en vigueur
Date de dépôt 2023-11-06
Date de publication 2024-06-06
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kashiwagi, Makoto
  • Fujisawa, Mao

Abrégé

The present invention relates to a substrate processing method for processing a substrate. The substrate processing method includes processing a processed surface (5a) of a substrate (W) by rotating the substrate (W) about an axis thereof, pressing a processing tape (2A) against the processed surface (5a) of the substrate (W) by means of a pressing member (12) of a processing head (10A) while feeding the processing tape (2A) in a longitudinal direction thereof, in a state in which the pressing member (12) is inclined in a first direction (D1) relative to a prescribed pressing direction (CL), and then pressing the processing tape (2A) against the processed surface (5a) by means of the pressing member (12) in a state in which the pressing member (12) is inclined relative to the pressing direction (CL) in a second direction (D2) opposite to the first direction (D1), the first direction (D1) and the second direction (D2) being directions in the longitudinal direction of the processing tape (2A) on the pressing member (12).

Classes IPC  ?

  • B24B 21/06 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet pour meuler des surfaces planes munis d'organes à surface de contact limitée pour pousser la courroie contre la pièce à travailler, p.ex. munis de sabots qui balaient complètement la surface à meuler
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 21/08 - Sabots de pression; Bandes d'appui
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

7.

SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023039880
Numéro de publication 2024/106248
Statut Délivré - en vigueur
Date de dépôt 2023-11-06
Date de publication 2024-05-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Miyazaki, Mitsuru
  • Sotozaki, Hiroshi
  • Takebuchi, Kenichi
  • Inoue, Takuya
  • Takahashi, Shozo
  • Ishii, Ryohei

Abrégé

A substrate processing device comprises: a plurality of polishing modules (1A-1D) that are disposed in a polishing level and that polish a substrate; a post-processing lane (2A, 2B) that is disposed in a post-processing level and that performs post-processing, which includes washing and drying, on the polished substrate; and a lifting/lowering conveyance device (5) that extracts the polished substrate from one of the plurality of polishing modules (1A-1D) and conveys the substrate directly to the post-processing lane (2A, 2B). The post-processing level is an upper level positioned above the polishing level or a lower level positioned below the polishing level. The lifting/lowering conveyance device (5) is disposed equidistantly from the plurality of polishing modules (1A-1D). The lifting/lowering conveyance device (5) has a holding hand (40) that enables lifting/lowering between the polishing level and the post-processing level.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail

8.

POLISHING DEVICE

      
Numéro d'application JP2023039986
Numéro de publication 2024/106263
Statut Délivré - en vigueur
Date de dépôt 2023-11-07
Date de publication 2024-05-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kodera, Kenji
  • Hong, Kuo-Wei
  • Ohashi, Hirotaka
  • Yamanobe, Hokuto
  • Ishikawa, Sho

Abrégé

The present invention pertains to a polishing device. This polishing device comprises a sensor structure (100) for detecting a polishing amount of a peripheral edge section of a substrate (W). The sensor structure (100) comprises: a sensor head (102) having a contact surface (102a); and a displacement sensor (101) for detecting the polishing amount of the peripheral edge section of the substrate (W) by means of the displacement of the sensor head (102).

Classes IPC  ?

  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

9.

CULTIVATION MANAGEMENT DEVICE AND CULTIVATION MANAGEMENT SYSTEM

      
Numéro d'application JP2023032080
Numéro de publication 2024/100972
Statut Délivré - en vigueur
Date de dépôt 2023-09-01
Date de publication 2024-05-16
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tanaka Hideaki
  • Kato Masashi
  • Deguchi Tatsuya
  • Koyama Hirohisa

Abrégé

A cultivation management device 10 according to one aspect of the present invention manages the cultivation of aquatic organisms in a fish tank. This cultivation management device 10 comprises: a body length measurement unit for measuring the body length of an aquatic organism; and an activity estimation unit which estimates the activity of the aquatic organism on the basis of the measured body length.

Classes IPC  ?

  • A01K 61/10 - NÉCESSITÉS COURANTES DE LA VIE ÉLEVAGE; CHASSE; PIÉGEAGE; PÊCHE ÉLEVAGE; AVICULTURE; APICULTURE; PISCICULTURE; PÊCHE; OBTENTION D'ANIMAUX, NON PRÉVUE AILLEURS; NOUVELLES RACES D'ANIMAUX Élevage des animaux aquatiques des poissons
  • A01K 61/95 - Triage, classement, comptage ou marquage des animaux vivants, p.ex. identification de leur sexe spécialement adaptés aux poissons
  • A01K 63/04 - Agencements pour traiter l'eau spécialement conçus pour les récipients pour poissons vivants

10.

SUBSTRATE-CLEANING DEVICE AND SUBSTRATE-CLEANING METHOD

      
Numéro d'application JP2023037874
Numéro de publication 2024/101107
Statut Délivré - en vigueur
Date de dépôt 2023-10-19
Date de publication 2024-05-16
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Kashiwagi, Makoto

Abrégé

The present invention relates to a substrate-cleaning device and a substrate-cleaning method, in which a cleaning tool is brought into contact with the front or back surface of a substrate, e.g., a wafer, to clean the front or back surface of the substrate. This substrate-cleaning device comprises: a substrate-holding part (41) which holds and rotates a peripheral edge portion of a substrate (W); and at least one substrate-cleaning tool (42) which comes into contact with the front or back surface of the substrate (W) held by the substrate-holding part (41) and cleans the front or back surface of the substrate (W). The substrate-cleaning tool (42) comprises a Bernoulli chuck (55), which ejects a fluid to generate suction power for suction-holding the front or back surface of the substrate (W), and a cleaning member (56) attached to the Bernoulli chuck (55). The cleaning member (56) is pressed against the front or back surface of the substrate (W) in accordance with the suction power of the Bernoulli chuck (55).

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

11.

POLISHING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM

      
Numéro d'application JP2023039209
Numéro de publication 2024/095997
Statut Délivré - en vigueur
Date de dépôt 2023-10-31
Date de publication 2024-05-10
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Suzuki Yuta
  • Takahashi Taro
  • Otaki Hirofumi

Abrégé

This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the polishing device by inputting state-reflective information reflecting the state of the polishing pad of the polishing device, into a machine learning model that has learned, by machine learning, a correlation between state-reflective information reflecting the state of another polishing pad and the polishing index of the other polishing pad.

Classes IPC  ?

  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 37/015 - Commande de la température
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
  • B24B 53/12 - Outils à dresser; Leurs porte-outils
  • G05B 23/02 - Test ou contrôle électrique
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

12.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Numéro d'application JP2023036223
Numéro de publication 2024/090159
Statut Délivré - en vigueur
Date de dépôt 2023-10-04
Date de publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Uchida Takuma
  • Iwamoto Hideyuki

Abrégé

A data processing system according to the present invention comprises: a physical quantity measurement device that measures a physical quantity for each predetermined monitoring cycle; a data collection device that has a collection communication unit which is connected to the physical quantity measurement device and a collection control unit which causes the collection communication unit to provide an external notification of the physical quantity acquired via the collection communication unit; and a data management device that has a management communication unit which is connected to the data collection device, a management control unit which determines that an anomaly has occurred when the physical quantity acquired from the data collection device via the management communication unit has exceeded a predetermined threshold, and a management storage unit which, for each monitoring cycle, stores determination data indicative of the occurrence of the anomaly, wherein when the management storage unit has acquired determination data indicative of the occurrence of an anomaly a predetermined number of times or more consecutively, the management control unit yields a determination result and causes the management communication unit to notify a terminal device of the determination result.

Classes IPC  ?

13.

SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD

      
Numéro d'application JP2023038215
Numéro de publication 2024/090384
Statut Délivré - en vigueur
Date de dépôt 2023-10-23
Date de publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Satori, Hirotaka

Abrégé

Provided is a technology by which a chemical can be effectively fixed to the surface of a substrate. A substrate treatment device 1 comprises: an activating device 40 configured so that, in a state where a liquid is supplied to a surface of a substrate Wf and a glass plate 100 is disposed on the surface of the substrate, the activating device activates the surface of a substrate by projecting light onto the surface of the substrate from the side of the glass plate opposite the substrate; a liquid chemical supply device 50 that supplies a liquid chemical to the surface of the substrate in a state where the glass plate is removed from the surface of the substrate; and a chemical fixing device that fixes the chemical to the surface of the substrate by drying and heating the liquid chemical on the surface of the substrate. A flow path 110 through which liquid can flow is provided to an opposing surface of the glass plate, said surface facing the surface of the substrate.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides

14.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Numéro d'application JP2023036409
Numéro de publication 2024/090168
Statut Délivré - en vigueur
Date de dépôt 2023-10-05
Date de publication 2024-05-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Uchida Takuma

Abrégé

This data processing system comprises a terminal device and a data management device comprising: a management and communication unit which can connect to the terminal device; a management and storage unit which stores notification item data including specifications of at least one machine to serve as a target; and a management and control unit which causes a notification of the notification item data stored in the management and storage unit to be provided by the management and communication unit to the terminal device, acquires, from the management and communication unit, notification item data in which selection or non-selection has been indicated using the terminal device, and causes the notification item data to be stored in the management and storage unit.

Classes IPC  ?

15.

PUMP AND PUMP ASSEMBLY METHOD

      
Numéro d'application JP2023030303
Numéro de publication 2024/084798
Statut Délivré - en vigueur
Date de dépôt 2023-08-23
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kawabata, Junya
  • Miya, Kenta

Abrégé

The present invention relates to a pump for a liquid and particularly relates to a pump having a mechanical seal disposed on a rotating shaft. A pump (P) includes: a retainer (41) held by a spring (33) that presses a rotating ring (31) of a mechanical seal (20) against a stationary ring (32) thereof; and a retainer holder (50) attached to a back side of an impeller (2). The retainer holder (50) has: a peripheral wall (52) inside which the retainer (41) is fitted; and a bottom wall (53) that extends radially inward from the peripheral wall (52). The peripheral wall (52) protrudes from the bottom wall (53) toward the mechanical seal (20). The peripheral wall (52) has a tapered surface (54) formed at an edge thereof. The tapered surface (54) has a truncated cone shape in which the inner diameter of the peripheral wall (52) increases with increasing the distance from the bottom wall (53).

Classes IPC  ?

  • F04D 29/12 - Joints d'étanchéité pour arbre utilisant des bagues
  • F04D 29/08 - Joints d'étanchéité
  • F04D 29/60 - Montage; Assemblage; Démontage
  • F04D 29/62 - Montage; Assemblage; Démontage des pompes radiales ou hélicocentrifuges
  • F16J 15/34 - Joints d'étanchéité entre deux surfaces mobiles l'une par rapport à l'autre par bague glissante pressée contre la face plus ou moins radiale d'une des deux parties

16.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, AND DATA COLLECTION METHOD

      
Numéro d'application JP2023035401
Numéro de publication 2024/084917
Statut Délivré - en vigueur
Date de dépôt 2023-09-28
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Uchida Takuma

Abrégé

This data processing system: acquires processing data as new collection data from a processing data transmission source, which is an external device, at a predetermined monitoring cycle; when a collection communication unit is not connected to a management communication unit, stores the new collection data as storage data in a collection and storage unit; and, after the collection communication unit has been connected to the management communication unit, transmits, to a data management device, collection data which is a combination of new collection data that has been newly acquired from the processing data transmission source at the next monitoring cycle and the storage data stored in the collection and storage unit.

Classes IPC  ?

  • G05B 23/02 - Test ou contrôle électrique
  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps
  • H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou

17.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

      
Numéro d'application JP2023037016
Numéro de publication 2024/085061
Statut Délivré - en vigueur
Date de dépôt 2023-10-12
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Satake, Masayuki

Abrégé

The present invention relates to a substrate processing method and a substrate processing apparatus, with which cracking and chipping of a multilayer substrate obtained by bonding a plurality of substrates are suppressed, and more specifically to a technology for applying a filler to a gap formed between edge parts of the plurality of substrates that constitute the multilayer substrate. This substrate processing apparatus (1) is provided with: an application device (3) which applies a filler (F) to a gap (G) between an edge part (E1) of a first substrate (W1) and an edge part (E2) of a second substrate (W2); a thermographic camera (5) which produces a thermal image (40) from the infrared light irradiated from the filler (F) applied to the gap (G); and an image processing unit (30) which determines the state of the filler (F) applied to the gap (G) on the basis of the thermal image (40).

Classes IPC  ?

  • G01J 5/48 - Thermographie; Techniques utilisant des moyens entièrement visuels
  • G01N 25/72 - Recherche de la présence de criques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

18.

PUMP DEVICE FOR LIQUEFIED GAS

      
Numéro d'application JP2023037825
Numéro de publication 2024/085216
Statut Délivré - en vigueur
Date de dépôt 2023-10-19
Date de publication 2024-04-25
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Matake, Kozo

Abrégé

The present invention relates to a pump device for transferring an ultracold liquefied gas such as liquefied hydrogen or liquefied natural gas, and in particular to a pump device having an electric motor as a pump drive source. The pump device comprises a pump (1) having an impeller (2), a rotation shaft (5) to which the impeller (2) is fixed, and an electric motor (7) for rotating the rotation shaft (5) and the impeller (1). A rotor assembly (21) of the electric motor (7) comprises a motor rotor (40) fixed to the rotation shaft (5), a side ring (41) disposed on both sides of the motor rotor (40), and a sealed cover (42) fixed to the outer circumferential surface of the side ring (41). The sealed cover (42) is made of glass fiber.

Classes IPC  ?

  • H02K 1/22 - Parties tournantes du circuit magnétique
  • F04D 13/00 - Installations ou systèmes de pompage
  • F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
  • F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
  • F04D 29/00 - POMPES À DÉPLACEMENT NON POSITIF - Parties constitutives, détails ou accessoires
  • H02K 7/14 - Association structurelle à des charges mécaniques, p.ex. à des machines-outils portatives ou des ventilateurs

19.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD

      
Numéro d'application JP2023023776
Numéro de publication 2024/079949
Statut Délivré - en vigueur
Date de dépôt 2023-06-27
Date de publication 2024-04-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Uchida Takuma

Abrégé

This data processing system comprises a data collection device and a data management device. The data collection device has: a collection storage unit which stores specific information for identifying information pertaining to processing data generated by physical quantity measurement devices that measure physical quantities; a collection communication unit which is connected to the physical quantity measurement devices; and a collection control unit which collects, on the basis of the specific information, processing data for each of the physical quantity measurement devices. The data management device has: a management storage unit which stores the specific data and the processing data; and a management communication unit which transmits the specific information stored in the management storage unit to the data collection device and receives the processing data from the data collection device.

Classes IPC  ?

  • H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
  • G05B 23/02 - Test ou contrôle électrique
  • G08C 15/00 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune
  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps

20.

TOP RING AND SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2023036057
Numéro de publication 2024/080189
Statut Délivré - en vigueur
Date de dépôt 2023-10-03
Date de publication 2024-04-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Kashiwagi, Makoto

Abrégé

Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member having a substrate suctioning surface for suctioning a substrate and a pressure reducing part communicating with a pressure reducing means; and a first pressure assembly that is disposed between the base member and the substrate suctioning member and has a plurality of first pressure means disposed on the side of the substrate suctioning member opposite to the substrate suctioning surface, the first pressure assembly being configured such that the first pressure means are capable of applying a pressing force to the substrate suctioning member completely independently of each other.

Classes IPC  ?

  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

21.

DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, DATA PRESENTATION METHOD, AND DATA STRUCTURE

      
Numéro d'application JP2023031690
Numéro de publication 2024/075444
Statut Délivré - en vigueur
Date de dépôt 2023-08-31
Date de publication 2024-04-11
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing structure is made up of a plurality of physical quantity measurement devices and a data collection device. Upon accepting a data request including an object identification index from the data collection device, the physical quantity measurement devices transmit, to the data collection device, a physical quantity data array made up of physical quantity data associated with an index of which the measurement order is later than the object identification index and an index therefor, out of a plurality of physical quantity data and indices stored in a storage unit. When a predetermined collection condition is satisfied, the data collection device transmits a data request including the object identification index to the physical quantity measurement devices, receives a physical quantity data array as a response thereto, and identifies and manages an index of which the measurement order is last when receiving the physical quantity data array the previous time, as the object identification index.

Classes IPC  ?

  • G08C 19/00 - Systèmes de transmission de signaux électriques
  • G05B 23/02 - Test ou contrôle électrique
  • G06F 16/901 - Indexation; Structures de données à cet effet; Structures de stockage
  • G08C 15/00 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune

22.

DATA PROCESSING SYSTEM, PHYSICAL QUANTITY MEASURING DEVICE, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, DATA PROVISION METHOD, AND DATA COLLECTION METHOD

      
Numéro d'application JP2023023997
Numéro de publication 2024/070099
Statut Délivré - en vigueur
Date de dépôt 2023-06-28
Date de publication 2024-04-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing system includes a physical quantity measuring device and a data collection device. This physical quantity measuring device transmits a physical quantity data string constituted by a plurality of physical quantity data, which are obtained when the physical quantity is measured by a physical quantity sensor under sampling conditions, so that the measurement order thereof can be determined, and a time elapsed since the last measurement, which is obtained by measuring, with a timer count unit, the time elapsed after the physical quantity was measured last time by the physical quantity sensor, to the data collection device. The data collection device specifies a measurement time for each of the plurality of physical quantity data, which constitute the physical quantity data string, on the basis of the current time measured by a time measurement unit and the time elapsed since the last measurement.

Classes IPC  ?

  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps

23.

DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASURING DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD

      
Numéro d'application JP2023020803
Numéro de publication 2024/062690
Statut Délivré - en vigueur
Date de dépôt 2023-06-05
Date de publication 2024-03-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing device comprises: an arithmetic operation unit that repeatedly acquires the physical quantity to be measured, as physical quantity data, and performs a prescribed arithmetic operation on the physical quantity data so as to generate process data; and a communication processing unit that sequentially transmits process data each time process data is generated. The arithmetic operation unit executes a first arithmetic operation on the physical quantity data of a prescribed number of data points and generates first process data when a prescribed start condition is satisfied, and executes a second arithmetic operation until an end condition is satisfied, on physical quantity data for a number of data points comprising physical quantity data at the most recent time and physical quantity data at a past time and generates second process data after the elapse of a prescribed wait time when a prescribed end condition is not satisfied after executing the first arithmetic operation.

Classes IPC  ?

  • H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
  • G05B 23/02 - Test ou contrôle électrique
  • G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps

24.

DETECTION DEVICE

      
Numéro d'application JP2023031226
Numéro de publication 2024/062855
Statut Délivré - en vigueur
Date de dépôt 2023-08-29
Date de publication 2024-03-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sekiguchi Takashi
  • Yamada Yasumasa
  • Tamura Hiromi

Abrégé

This detection device (1) comprises: a detection unit (2) attached to an apparatus (100) to be measured; a power supply unit (3) that supplies power to the detection unit (2); and a cable (4) that connects the detection unit (2) and the power supply unit (3). The detection unit (2) has a detection part (10) that detects the state of the apparatus (100) to be measured, a communication part (11) that transmits a detection result of the detection part (10), and a substrate (12) on which the detection part (10) and the communication part (11) are both mounted.

Classes IPC  ?

  • G01D 11/30 - Supports spécialement adaptés à un instrument; Supports spécialement adaptés à un ensemble d'instruments
  • G01H 17/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores non prévue dans les autres groupes de la présente sous-classe
  • G01K 1/14 - Supports; Dispositifs de fixation; Dispositions pour le montage de thermomètres en des endroits particuliers

25.

GRAPH DISPLAY METHOD FOR POLISHING DEVICE, AND COMPUTER PROGRAM

      
Numéro d'application JP2023028049
Numéro de publication 2024/057749
Statut Délivré - en vigueur
Date de dépôt 2023-08-01
Date de publication 2024-03-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shimizu, Yuko
  • Watanabe, Hiromitsu
  • Sugita, Ryuji
  • Yanai, Akio
  • Watanabe, Daichi

Abrégé

The present invention enables data of interest to be found quickly from among multiple sets of measured data in a polishing device. Provided is a method for displaying measured data relating to a polishing device as a graph. The method includes: a step for acquiring, from the polishing device, a plurality of series of measured data measured in the polishing device; a step for creating graphs corresponding to each of the plurality of series of measured data; a step for classifying the plurality of created graphs into a plurality of groups on the basis of a similarity of the graph shapes; and a step for displaying the plurality of graphs in an overlaid manner, using a different display mode for each group.

Classes IPC  ?

  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B23Q 17/00 - Agencements sur les machines-outils pour indiquer ou mesurer
  • B23Q 17/24 - Agencements sur les machines-outils pour indiquer ou mesurer utilisant des moyens optiques
  • B24B 37/00 - Machines ou dispositifs de rodage; Accessoires
  • G06T 11/60 - Edition de figures et de texte; Combinaison de figures ou de texte
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

26.

THRESHOLD VALUE SETTING DEVICE, ABNORMALITY DETERMINATION DEVICE, THRESHOLD VALUE SETTING METHOD, AND ABNORMALITY DETERMINATION METHOD

      
Numéro d'application JP2023030527
Numéro de publication 2024/057864
Statut Délivré - en vigueur
Date de dépôt 2023-08-24
Date de publication 2024-03-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tamura Hiromi
  • Yamada Yasumasa

Abrégé

This threshold value setting device comprises: an input unit for inputting a period of data to be extracted from acquired data; a data extraction unit for extracting data for the period inputted by the input unit; a reference value determination unit for determining a reference value from the data extracted by the data extraction unit; and a threshold value calculation unit for calculating a threshold value from the reference value determined by the reference value determination unit.

Classes IPC  ?

  • G01M 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
  • G05B 23/02 - Test ou contrôle électrique

27.

DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD

      
Numéro d'application JP2023021022
Numéro de publication 2024/057635
Statut Délivré - en vigueur
Date de dépôt 2023-06-06
Date de publication 2024-03-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sakamaki Yuta
  • Yamada Yasumasa
  • Sekiguchi Takashi

Abrégé

This data processing device comprises: a data acquisition unit which acquires a sequence of physical quantity data individually measured at a prescribed sampling frequency and the number of sampling points; a first data generation unit which generates a first time data sequence by extracting physical quantity data of a first analysis point number continuously measured at the first analysis point of a number smaller than the number of sampling points; a first frequency analysis unit which converts the first time data sequence into a first frequency data sequence through a frequency analysis; a second data generation unit which generates a second time data sequence by thinning the physical quantity sequence into physical quantity data of a second analysis point number smaller than the number of sampling points; and a second frequency analysis unit which converts the second time data sequence into a second frequency data sequence through the frequency analysis.

Classes IPC  ?

  • G01H 17/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores non prévue dans les autres groupes de la présente sous-classe
  • G01M 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
  • G05B 23/02 - Test ou contrôle électrique

28.

INFORMATION PROCESSING DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023024292
Numéro de publication 2024/053221
Statut Délivré - en vigueur
Date de dépôt 2023-06-29
Date de publication 2024-03-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Murata Seiji
  • Sasaya Yusuke
  • Sakata Keisuke

Abrégé

[Problem] To provide an information processing device that enables the appropriate prediction of the effect of electromagnetic waves generated from an AC power line when substrate treatment is performed. [Solution] An information processing device 5 includes: a current value information generation unit 501 that generates current value information of AC current supplied to an AC device when substrate treatment is performed by a substrate treatment device which is provided with the AC device connected to an AC power supply via an AC power line, and which is provided with a control board that controls the AC device in order to perform substrate treatment for supplying a treatment fluid to a substrate or a treatment member while bringing the treatment member into contact with the substrate; and an electromagnetic wave effect information generation unit 502 that generates, on the basis of the current value information generated by the current value information generation unit 501, electromagnetic wave effect information indicating an effect of electromagnetic waves generated from the AC power line.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • G06N 20/00 - Apprentissage automatique
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

29.

SUBSTRATE STATE MEASUREMENT DEVICE, PLATING DEVICE, AND SUBSTRATE STATE MEASUREMENT METHOD

      
Numéro d'application JP2022032188
Numéro de publication 2024/042700
Statut Délivré - en vigueur
Date de dépôt 2022-08-26
Date de publication 2024-02-29
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shimoyama, Masashi
  • Masuda, Yasuyuki
  • Hiwatashi, Ryosuke

Abrégé

To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed layer, and rotate; at least one white confocal sensor for measuring the plate surface of the substrate supported by the stage; and a state measurement module for measuring the state of a power supply member contact region, which is a region of the substrate that comes into contact with a power supply member, on the basis of detection, by the white confocal sensor, of the power supply member contact region.

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 5/02 - Dépôt sur des surfaces déterminées
  • C25D 7/12 - Semi-conducteurs
  • H01L 21/66 - Test ou mesure durant la fabrication ou le traitement

30.

HEARTH COMPONENT, HEARTH COMPONENT PRODUCTION METHOD

      
Numéro d'application JP2023029843
Numéro de publication 2024/043187
Statut Délivré - en vigueur
Date de dépôt 2023-08-18
Date de publication 2024-02-29
Propriétaire
  • EBARA ENVIRONMENTAL PLANT CO., LTD. (Japon)
  • EBARA CORPORATION (Japon)
Inventeur(s)
  • Murasue So
  • Ishikawa Eiji
  • Koshima Masamitsu
  • Takigawa Shunsuke
  • Uyama Kenta
  • Fukushi Yusuke
  • Go Tetsu

Abrégé

This hearth component is provided with an in-incinerator exposed surface that is exposed to the inside of an incinerator. The in-incinerator exposed surface comprises a front surface and an upper surface, and at least the front surface is provided with a protective layer having grooves formed on the surface thereof.

Classes IPC  ?

  • F23H 17/12 - Barreaux à feu
  • B23K 26/342 - Soudage de rechargement
  • C22C 19/05 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel avec du chrome
  • C22C 30/02 - Alliages contenant moins de 50% en poids de chaque constituant contenant du cuivre

31.

PLATING DEVICE AND PLATING METHOD

      
Numéro d'application JP2022030375
Numéro de publication 2024/033999
Statut Délivré - en vigueur
Date de dépôt 2022-08-09
Date de publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Tsuji, Kazuhito

Abrégé

A plating device comprising: a plating tank configured so as to accommodate a plating solution; a substrate holder configured so as to hold a substrate to be plated; a rotating mechanism which rotates the substrate holder; a raising/lowering mechanism which raises/lowers the substrate holder; and a control unit. The substrate holder is equipped with: a contact member configured so as to come into contact with the substrate to enable power supply; a seal member configured so as to fill the gap between the substrate holder and the substrate; a liquid-holding part having the contact member inside and configured so as to hold a liquid when the gap between the substrate holder and the substrate is filled by the seal member; and an ejection port which is open to the liquid-holding part or to a space lying inside the substrate holder and communicating with the liquid-holding part or can be disposed on a lateral side of the substrate holder and which has been configured so that the liquid is ejected.

Classes IPC  ?

  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir

32.

SUBSTRATE HOLDER, PLATING DEVICE, AND SUBSTRATE POSITIONING METHOD

      
Numéro d'application JP2022030545
Numéro de publication 2024/034047
Statut Délivré - en vigueur
Date de dépôt 2022-08-10
Date de publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Tomita, Masaki

Abrégé

The present disclosure provides a substrate holder having a centering pin that does not push the substrate any farther toward the center than the design position even if a first holding member deviates from the design position with respect to a second holding member when positioning the substrate. The substrate holder according to the present disclosure has a first holding member and a second holding member. The second holding member has a positioning member for positioning the substrate at a predetermined position and a stopper. The positioning member has a centering pin that can move between a first position and a second position. The centering pin is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first holding member has a drive member configured to bias the centering pin to the first position when the substrate is held by the first holding member and second holding member. The stopper is configured to contact the centering pin and stop the centering pin at the first position.

Classes IPC  ?

  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir

33.

PRE-WET MODULE

      
Numéro d'application JP2022030266
Numéro de publication 2024/033966
Statut Délivré - en vigueur
Date de dépôt 2022-08-08
Date de publication 2024-02-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Yahagi, Mitsutoshi

Abrégé

The present invention achieves a small pre-wet module that is capable of performing different pre-processes. This pre-wet module 200 includes: a stage 220 configured so as to hold a rear surface of a substrate WF having a surface WF-a to be processed that faces upward; a rotating mechanism 224 configured so as to rotate the stage 220; a cleaning liquid supply member 260 that has nozzles 262 disposed above the stage 220 and is configured so as to supply a cleaning liquid in the direction of the stage 220 via the nozzles 262; and a degassed liquid supply member 250 that is configured so as to supply a degassed liquid to the surface WF-a to be processed of the base plate WF held on the stage 220, wherein the degassed liquid supply member 250 is configured so as to be able to move between a supply position between the nozzles 262 and the surface WF-a to be processed of the substrate WF and a retreat position to which to retreat between the nozzles 262 and the surface WF-a to be processed of the substrate WF.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • C25D 7/12 - Semi-conducteurs
  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique

34.

PLATING METHOD AND PLATING APPARATUS

      
Numéro d'application JP2022029628
Numéro de publication 2024/028973
Statut Délivré - en vigueur
Date de dépôt 2022-08-02
Date de publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tsuji, Kazuhito
  • Yamamoto, Kentaro

Abrégé

A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction, the plating method including: a step for rotating the substrate holder at a first rotation speed in a state in which the substrate holder is inclined; a step for discharging a liquid towards the substrate holder rotating at the first rotation speed so that the liquid is fed to the contact member; a step for stopping the discharging of the liquid; a step for beginning, before or within a prescribed time after the discharging of the liquid is stopped, to reduce the incline of the substrate holder towards a horizontal position; a step for rotating the substrate holder at a second rotation speed higher than the first rotation speed, in a state in which the substrate holder is in the horizontal position; and a step for performing the plating process on the substrate after the substrate has been mounted on the substrate holder.

Classes IPC  ?

  • C25D 21/00 - Procédés pour l'entretien ou la conduite des cellules pour revêtement électrolytique
  • C25D 7/12 - Semi-conducteurs
  • C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir

35.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023023932
Numéro de publication 2024/029236
Statut Délivré - en vigueur
Date de dépôt 2023-06-28
Date de publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Mitani, Ryuichiro

Abrégé

[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-point detection function for detecting that a chemical mechanical polishing process has reached the end point. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires reliability decrease cause state information during a chemical mechanical polishing process being performed on a substrate by a substrate processing device 2, the reliability decrease cause state information including at least one of wear state information indicating the state of wear of a constituent element of the substrate processing device 2, and processing state information indicating processing state during the polishing process; and a state prediction unit 501 that inputs the reliability decrease cause state information acquired by the information acquisition unit 500 into a learning model that has learned, by machine learning, the correlation between the reliability decrease cause state information and reliability information of a polishing end-point detection function indicating the reliability of an end-point detection function for detecting that the chemical mechanical polishing process has reached an end point, thereby predicting the reliability information of the polishing end-point detection function with respect to the reliability decrease cause state information.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques

36.

FILLER APPLICATION DEVICE

      
Numéro d'application JP2023024142
Numéro de publication 2024/029244
Statut Délivré - en vigueur
Date de dépôt 2023-06-29
Date de publication 2024-02-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Satake, Masayuki
  • Tajima, Kazuhiro

Abrégé

The present invention relates to a filler application device that applies a filler to a gap formed between the edge parts of a plurality of boards that constitute a laminated board. This filler application device (100) comprises: a board holding unit (33) that holds and rotates a laminated board (Ws) manufactured by joining a first board (W1) and a second board (W2); an application device (39) that is disposed away from the laminated board (Ws) held by the board holding unit (33), and discharges a filler (F) toward a gap (G) formed between the peripheral edge of the first board (W1) and the peripheral edge of the second board (W2); and a protector (12) that prevents the attachment of liquid splash (Fs) of the filler (F) that occurs when the filler (F) discharged from the application device (39) collides with the gap (G) on the top surface and/or the bottom surface of the laminated board (Ws).

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

37.

INFORMATION PROCESSING DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023024389
Numéro de publication 2024/024391
Statut Délivré - en vigueur
Date de dépôt 2023-06-30
Date de publication 2024-02-01
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Wakiyama, Takeshi
  • Murata, Seiji

Abrégé

The present invention relates to an information processing device, a machine learning device, an information processing method, and a machine learning method. An information processing device (5) comprises: a fluid supply information acquisition unit (500) for, in a substrate process performed by a substrate processing device provided with a processing member which is to be brought into contact with a substrate and which performs a prescribed substrate process thereon and a processing fluid supply unit for supplying a processing fluid to the substrate or to the processing member, acquiring fluid supply information that includes processing fluid state information indicating the supply state of the processing fluid to be supplied from the processing fluid supply unit; and a fluid distribution information generation unit (501) for generating, on the basis of the fluid supply information acquired by the fluid supply information acquisition unit (500), fluid distribution information indicating the distribution state when the processing fluid supplied from the processing fluid supply unit is distributed while passing through a position of contact between the substrate and the processing member.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • G06N 20/00 - Apprentissage automatique

38.

SUBSTRATE PRODUCTION METHOD AND SUBSTRATE PRODUCTION APPARATUS

      
Numéro d'application JP2023022221
Numéro de publication 2024/014221
Statut Délivré - en vigueur
Date de dépôt 2023-06-15
Date de publication 2024-01-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Satake, Masayuki

Abrégé

The present invention relates to a substrate production method and a substrate production apparatus. A substrate production method according to the present invention comprises: a step in which a filler (F) is applied to a space between a bevel part of a first substrate (W1) and a bevel part of a second substrate (W2); and a step in which air bubbles are removed from the filler (F) that has been applied to the space.

Classes IPC  ?

  • H01L 23/12 - Supports, p.ex. substrats isolants non amovibles

39.

SUBSTRATE HOLDING DEVICE, SUBSTRATE MANUFACTURING DEVICE, AND SUBSTRATE MANUFACTURING METHOD

      
Numéro d'application JP2023022255
Numéro de publication 2024/014223
Statut Délivré - en vigueur
Date de dépôt 2023-06-15
Date de publication 2024-01-18
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Satake, Masayuki
  • Nakanishi, Masayuki

Abrégé

The present invention relates to a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method. A substrate holding device (1) comprises a holding roller (51) and a fluid blowing device (60) that blows pressurized fluid out to a bevel section (B) held by the holding roller (51).

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

40.

PLATING APPARATUS AND PLATING METHOD

      
Numéro d'application JP2022025475
Numéro de publication 2024/003975
Statut Délivré - en vigueur
Date de dépôt 2022-06-27
Date de publication 2024-01-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Takahashi, Naoto
  • Hiwatashi, Ryosuke

Abrégé

The present invention improves the in-plane uniformity of a plating film that is formed on a polygonal substrate. A plating apparatus according to the present invention is provided with: a plating bath; a substrate holder which is configured so as to hold a polygonal substrate; an anode which is arranged within the plating bath so as to face the substrate that is held by the substrate holder; and an anode mask which delimits an opening that corresponds to the outer shape of the polygonal substrate. The anode mask comprises: a first mask member that delimits a first projection, which protrudes toward the center of the opening, at the central part of a first opening side of the opening, the first opening side corresponding to a first side of the polygonal substrate; and a second mask member that delimits a second projection, which protrudes toward the center of the opening, at the central part of a second opening side of the opening, the second opening side corresponding to a second side of the polygonal substrate. Meanwhile, the anode mask is configured such that the distance between the first mask member and the second mask member is able to be adjusted.

Classes IPC  ?

41.

WATER DETECTING DEVICE, WATER DETECTING SYSTEM, AND WATER DETECTING METHOD

      
Numéro d'application JP2023021150
Numéro de publication 2024/004553
Statut Délivré - en vigueur
Date de dépôt 2023-06-07
Date de publication 2024-01-04
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sugiyama Kazuhiko
  • Yamada Yasumasa
  • Sekiguchi Takashi
  • Sakamaki Yuta
  • Park Hyunwoo

Abrégé

This water detecting device, for detecting a state of generation of water present on a surface of a target object which is installed in an ambient environment and through the interior of which water flows, comprises: a target object temperature and humidity sensor for detecting a temperature and humidity of the target object; an environmental temperature and humidity sensor for detecting a temperature and humidity of the ambient environment; and a determining unit for determining whether or not water has been generated, and the cause of generation of the water, on the basis of target object temperature and humidity information indicating a change over time in the temperature and humidity detected by the target object temperature and humidity sensor, and ambient environment temperature and humidity information indicating a change over time in the temperature and humidity detected by the environmental temperature and humidity sensor.

Classes IPC  ?

42.

ANODE CHAMBER LIQUID MANAGEMENT METHOD, AND PLATING APPARATUS

      
Numéro d'application JP2022024506
Numéro de publication 2023/248286
Statut Délivré - en vigueur
Date de dépôt 2022-06-20
Date de publication 2023-12-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tomita, Masaki
  • Masuda, Yasuyuki

Abrégé

An anode chamber liquid management method comprising: a step for preparing a plating tank in which an anode and a diaphragm in contact with or attached firmly to the upper surface of the anode are arranged, and which is provided with a cathode chamber and an anode chamber partitioned above and below by the diaphragm, and an exhaust passage that is connected to the anode chamber and that is for discharging air bubbles from the anode chamber to the outside of the plating tank; a step for holding a plating liquid in the anode chamber and the cathode chamber such that the liquid level that is of the plating liquid in the exhaust passage and that is equal to the liquid level of the plating liquid in the anode chamber becomes lower than the liquid level of the plating liquid in the cathode chamber; a step for determining whether the height of the liquid level of the plating liquid in the exhaust passage is lower than a prescribed height, on the basis of an output of a liquid level sensor disposed in the exhaust passage; and a step for feeding pure water or an electrolytic solution to the anode chamber when the height of the liquid level of the plating liquid in the exhaust passage is determined as being lower than the prescribed height.

Classes IPC  ?

  • C25D 21/00 - Procédés pour l'entretien ou la conduite des cellules pour revêtement électrolytique

43.

PRE-WETTING MODULE AND PRE-WETTING METHOD

      
Numéro d'application JP2022025061
Numéro de publication 2023/248416
Statut Délivré - en vigueur
Date de dépôt 2022-06-23
Date de publication 2023-12-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Seki, Masaya
  • Kikuchi, Takeomi
  • Tsuji, Kazuhito

Abrégé

With the present invention, a pre-treatment of a substrate is efficiently performed, and also adhesion of air bubbles to a surface to be treated of the substrate is suppressed. This pre-wetting module 200 includes a deaeration tank 210 which is configured to accommodate a deaeration liquid, a cleaning device 260 which is disposed above the deaeration tank 210 and configured to supply a cleaning liquid downward, a substrate holder 220 which is disposed between the deaeration tank 210 and the cleaning device 260 and has a first holding member 222 configured to hold a first substrate WF-1 and a second holding member 224 configured to hold a second substrate WF-2, and a drive mechanism 230 which is configured to rotate and raise/lower the substrate holder 220, wherein the first holding member 222 and the second holding member 224 are configured to be able to hold the first substrate WF-1 and the second substrate WF-2 in such a manner that when a surface to be treated WF-1a of the first substrate WF-1 is tilted with respect to a horizontal plane to face the surface of the deaeration liquid in the deaeration tank 210, a surface to be treated WF-2a of the second substrate WF-2 horizontally faces the cleaning device 260 at the same time.

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

44.

PLATING DEVICE

      
Numéro d'application JP2022024316
Numéro de publication 2023/243079
Statut Délivré - en vigueur
Date de dépôt 2022-06-17
Date de publication 2023-12-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tomita, Masaki
  • Yamamoto, Kentaro

Abrégé

Provided is a plating device with which it is possible to clean a contact cleaning member. The plating device includes: a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate in which the surface to be plated is facing downwards, the substrate holder having a contact member for supplying power to the substrate; a contact cleaning member 482 for discharging a cleaning solution towards the contact member when at a cleaning position between the plating tank and the substrate holder; a drive mechanism 476 configured to move the contact cleaning member 482 between a cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover the upper part of the contact cleaning member 482 when the contact cleaning member 482 is at the retracted position.

Classes IPC  ?

45.

LEAKAGE DETERMINATION METHOD AND PLATING DEVICE

      
Numéro d'application JP2022024314
Numéro de publication 2023/243078
Statut Délivré - en vigueur
Date de dépôt 2022-06-17
Date de publication 2023-12-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tomita, Masaki
  • Seki, Masaya
  • Yamamoto, Kentaro

Abrégé

Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid to a contact member of a substrate holder, after a substrate held by the substrate holder is immersed in a plating liquid to perform plating; a measuring step 122 for measuring the electrical conductivity of the washing liquid after the contact member is washed; and a determination step 128 for determining the presence or absence of a plating liquid leak to the region where the contact member is disposed, on the basis of a comparison between a first electrical conductivity of the washing liquid, measured in advance for a reference substrate holder, and a second electrical conductivity of the washing liquid, measured in the measurement step 122.

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 7/12 - Semi-conducteurs
  • C25D 21/20 - Régénération des bains des solutions de rinçage

46.

PUMP OPERATION ASSISTANCE METHOD AND PUMP OPERATION ASSISTANCE DEVICE

      
Numéro d'application JP2023014340
Numéro de publication 2023/243193
Statut Délivré - en vigueur
Date de dépôt 2023-04-07
Date de publication 2023-12-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yamada, Yasumasa
  • Sakamaki, Yuta
  • Park, Hyunwoo

Abrégé

The present invention pertains to a pump operation assistance method and a pump operation assistance device. This pump operation assistance method comprises: a performance characteristic acquisition step for acquiring a flowrate-total head representative performance curve and a rated rotational speed during a rated operation as performance characteristics of a device to be assisted and identified by a model number of a pump device; an installation state acquisition step for acquiring a real head as an installation state of the device to be assisted; an operation state acquisition step for acquiring an operation frequency, suction pressure, and discharge pressure as an operation state of the device to be assisted; and a first operation assistance step for calculating an operation condition during a reference operation when the device to be assisted is operated in the installation state and the operation state. In the first operation assistance step, the flowrate and the total head during the reference operation are calculated on the basis of the performance characteristics, the installation state, and the operation state.

Classes IPC  ?

  • F04B 49/06 - Commande utilisant l'électricité
  • F04D 15/00 - Commande, p.ex.régulation de pompes, d'installations ou de systèmes de pompage

47.

PUMP DEVICE

      
Numéro d'application JP2023022219
Numéro de publication 2023/243680
Statut Délivré - en vigueur
Date de dépôt 2023-06-15
Date de publication 2023-12-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Kasatani, Tetsuji
  • Iwami, Mitsutaka
  • Wataji, Kei
  • Ikeda, Hayato

Abrégé

The present invention pertains to a pump device for raising the pressure of liquid hydrogen, and particularly, to a pump device comprising a thrust balance mechanism for canceling axial thrust applied to an impeller. This pump device comprises: a rotary shaft (1); a plurality of impellers (2a-2h) fixed to the rotary shaft (1); bearings (5, 6) which rotatably support the rotary shaft (1); a pump casing (7) which accommodates the plurality of impellers (2a-2h); and a first thrust balance mechanism (20) and a second thrust balance mechanism (40) which cancel the own weight of a rotary body including the rotary shaft (1) and the plurality of impellers (2a-2h), and the axial thrust acting on the plurality of impellers (2a-2h).

Classes IPC  ?

48.

PLATING DEVICE

      
Numéro d'application JP2022022275
Numéro de publication 2023/233571
Statut Délivré - en vigueur
Date de dépôt 2022-06-01
Date de publication 2023-12-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Nakahama, Shigeyuki

Abrégé

To provide a technology with which it is possible to suppress uneven film thickness of the outer edge of a substrate. This plating device 1 comprises a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a-60d, a bus bar 61 having a power supply portion 62 to which electricity is supplied and a plurality of connection portions 63 connected to the at least one auxiliary anode and arranged in the extending direction of the auxiliary anode, and at least one ion resistor 80a-80d. The ion resistor is configured such that the resistivity of the ion resistor increases with proximity to the power supply portion in the extending direction of the ion resistor.

Classes IPC  ?

49.

POLISHING DEVICE

      
Numéro d'application JP2023011153
Numéro de publication 2023/233769
Statut Délivré - en vigueur
Date de dépôt 2023-03-22
Date de publication 2023-12-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Suzuki, Yuta
  • Takahashi, Taro
  • Watanabe, Katsuhide
  • Takada, Nobuyuki

Abrégé

The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing head (1).

Classes IPC  ?

  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 37/32 - Bagues de retenue
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

50.

RESISTOR FOR PLATING APPARATUSES, AND PLATING APPARATUS

      
Numéro d'application JP2022021706
Numéro de publication 2023/228398
Statut Délivré - en vigueur
Date de dépôt 2022-05-27
Date de publication 2023-11-30
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Hiwatashi, Ryosuke
  • Masuda, Yasuyuki
  • Shimoyama, Masashi

Abrégé

The present invention provides: a resistor which makes it possible to improve the uniformity of a plating film that is formed on a substrate; and the like. The present invention provides a resistor for plating apparatuses for electric field control, the resistor being arranged between an anode and a holder, which holds an object to be plated, in a plating apparatus. This resistor for plating apparatuses comprises: a first resistive member which has a first surface and a plurality of first through holes that open to the first surface; and a second resistive member which has a second surface and a plurality of second through holes that open to the second surface. The first resistive member and the second resistive member are arranged such that the first surface and the second surface face each other; and this resistor for plating apparatuses is configured such that the size of overlappings of the plurality of first through holes and the plurality of second through holes is variable.

Classes IPC  ?

51.

MACHINE LEARNING METHOD, AND MACHINE LEARNING DEVICE

      
Numéro d'application JP2023017757
Numéro de publication 2023/228767
Statut Délivré - en vigueur
Date de dépôt 2023-05-11
Date de publication 2023-11-30
Propriétaire
  • EBARA CORPORATION (Japon)
  • UNIVERSITY OF FUKUI (Japon)
Inventeur(s)
  • Takatoh, Chikako
  • Nakamura, Yumiko
  • Sugiyama, Kazuhiko
  • Honda, Tomomi

Abrégé

This machine learning method includes performing: dataset splitting processing for dividing a period into a learning period and a validation period, and splitting a dataset into learning data and validation data; learning candidate period division processing for dividing a learning candidate period into a plurality of split learning periods; learning period evaluation processing for generating a learning period evaluation model for each split learning period, using a learning model corresponding to the split learning period, and using the verification data to calculate an evaluation index of the learning period evaluation model for each split learning period; learning period selection processing for repeating the learning candidate period division processing and the learning period evaluation processing until a predetermined end condition is satisfied, and when the end condition is satisfied, selecting a split learning period having a high evaluation index as a learning target period; and model output processing for outputting a learning model obtained by performing machine learning employing the learning data corresponding to the learning target period.

Classes IPC  ?

52.

DRY-UP METHOD, COOL-DOWN METHOD, AND HEAT-UP METHOD FOR PUMP DEVICE

      
Numéro d'application JP2023019444
Numéro de publication 2023/228995
Statut Délivré - en vigueur
Date de dépôt 2023-05-25
Date de publication 2023-11-30
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Kasatani, Tetsuji
  • Ikeda, Hayato
  • Wataji, Kei
  • Kikuchi, Hyuga
  • Iwami, Mitsutaka
  • Suzuki, Asaki

Abrégé

This dry-up method introduces a purge gas into a suction container (2A) of a pump device (100A), causes the purge gas to pass through a flow path switching device (5A) within the suction container (2A) while causing the purge gas to bypass a submerged pump (1A) within the suction container (2A), introduces, into a suction container (2B) of a pump device (100B), the purge gas that has been passed through the flow path switching device (5A), and causes the purge gas to pass through a flow path switching device (5B) within the suction container (2B) while causing the purge gas to bypass a submerged pump (1B) within the suction container (2B).

Classes IPC  ?

  • F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
  • F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
  • F04D 13/14 - Combinaisons de plusieurs pompes les pompes étant toutes du type centrifuge
  • F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients

53.

START-UP METHOD AND STOPPING METHOD FOR PUMP DEVICES CONNECTED IN SERIES

      
Numéro d'application JP2023018086
Numéro de publication 2023/228792
Statut Délivré - en vigueur
Date de dépôt 2023-05-15
Date de publication 2023-11-30
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Kasatani, Tetsuji
  • Ikeda, Hayato
  • Wataji, Kei
  • Kikuchi, Hyuga
  • Iwami, Mitsutaka

Abrégé

The present invention relates to a start-up method for submerged pumps used for transferring liquefied gas. In the present method, a submerged pump (1A) disposed in an intake container (2A) of a pump device (100A) is started up, liquefied gas is transferred to an intake container (2B) of a pump device (100B) via a flow path switching device (5A) in the intake container (2A), the liquefied gas is made to bypass a submerged pump (1B) disposed in the intake container (2B) and to pass through a flow path switching device (5B) in the intake container (2B), and thereafter, the submerged pump (1B) is started up.

Classes IPC  ?

  • F04D 15/00 - Commande, p.ex.régulation de pompes, d'installations ou de systèmes de pompage
  • F04B 49/035 - Commande d'arrêt, de démarrage, de décharge ou de ralenti par clapets de dérivation
  • F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge

54.

SUBSTRATE POLISHING METHOD, PROGRAM, AND SUBSTRATE POLISHING DEVICE

      
Numéro d'application JP2023017893
Numéro de publication 2023/223959
Statut Délivré - en vigueur
Date de dépôt 2023-05-12
Date de publication 2023-11-23
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Saito, Ayumu

Abrégé

Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a polishing surface; a top ring for holding a substrate and pressing the substrate against the polishing surface; and a vertical movement mechanism for vertically moving the top ring. The method includes: an acquisition step for acquiring information relating to a thickness of the substrate; a position adjustment step for adjusting a height position of the top ring relative to the polishing table on the basis of the acquired information relating to the thickness of the substrate; and a polishing step for polishing the substrate by supplying a pressurized fluid to a pressure chamber of the top ring to press the substrate against the polishing surface.

Classes IPC  ?

  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

55.

SUBSTRATE CLEANING DEVICE, SUBSTRATE PROCESSING DEVICE, SUBSTRATE CLEANING METHOD, AND SUBSTRATE PROCESSING METHOD

      
Numéro d'application JP2023017651
Numéro de publication 2023/219118
Statut Délivré - en vigueur
Date de dépôt 2023-05-11
Date de publication 2023-11-16
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kajikawa Takayuki
  • Handa Naoyuki
  • Nishi Tomoya

Abrégé

The present invention makes it possible to clean the bottom surface of a substrate. Provided is a substrate cleaning device comprising: a first scrub-cleaning member that scrub-cleans the bottom surface of a substrate to be cleaned; a first single-tube nozzle that supplies a cleaning liquid to the vicinity of the center of the bottom surface of the substrate; and a first spray nozzle that supplies the cleaning liquid to the bottom surface of the substrate.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

56.

STATOR AND CANNED MOTOR

      
Numéro d'application JP2022045604
Numéro de publication 2023/210051
Statut Délivré - en vigueur
Date de dépôt 2022-12-12
Date de publication 2023-11-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Kuronuma, Takayuki

Abrégé

The present invention pertains to a stator and a canned motor. Provided is a stator (4) comprising a stator core (15), windings (26), potting members (27), and spacers (32) for closing slot opening parts (25). The spacers (32) are made from an insulating material and have a lower linear expansion coefficient than the potting members (27).

Classes IPC  ?

  • H02K 3/487 - Dispositifs de fermeture d'encoche
  • H02K 3/34 - Enroulements caractérisés par la configuration, la forme ou la réalisation de l'isolement entre conducteurs ou entre conducteur et noyau, p.ex. isolement d'encoches
  • H02K 5/128 - Enveloppes ou enceintes caractérisées par leur configuration, leur forme ou leur construction spécialement adaptées à un fonctionnement dans un liquide ou dans un gaz utilisant des manchons d'entrefer ou des disques à film d'air

57.

PUMP

      
Numéro d'application JP2022047062
Numéro de publication 2023/210060
Statut Délivré - en vigueur
Date de dépôt 2022-12-21
Date de publication 2023-11-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Maeda, Tsuyoshi
  • Noji, Takahiro
  • Ranade, Shrunali
  • Isono, Miho
  • Ishiwata, Tetsuya

Abrégé

The present invention relates to a pump for transferring liquid, and particularly relates to a pump for transferring liquid containing foreign substances that are stringy, fibrous, cloth-like, etc. The pump comprises an impeller (1) and an impeller casing (5) that houses the impeller (1), and the impeller (1) has a hub (13), a single swept vane (2) connected to the hub (13), and a shroud (25) to which the hub (13) and the swept vane (2) are connected.

Classes IPC  ?

58.

DEVICE FOR INITIALIZING ELASTIC FILM, POLISHING DEVICE, METHOD FOR INITIALIZING ELASTIC FILM, AND METHOD FOR ASSESSING SERVICE LIFE OF ELASTIC FILM

      
Numéro d'application JP2023001620
Numéro de publication 2023/210073
Statut Délivré - en vigueur
Date de dépôt 2023-01-20
Date de publication 2023-11-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Saito, Kenichiro
  • Murata, Seiji
  • Terada, Tetsuya
  • Asano, Kentaro

Abrégé

The present invention relates to a device for initializing an elastic film, a polishing device, a method for initializing an elastic film, and a method for assessing the service life of an elastic film. This device (50) for initializing an elastic film (10) comprises: a pressurizing device (55); an expansion amount detection device (58); and a control device (40) for comparing the expansion amount detected by the expansion amount detection device (58) and a prescribed target expansion amount and, if the expansion amount has reached the target expansion amount, determining that initialization of the elastic film (10) is complete.

Classes IPC  ?

  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

59.

PUMP INSTALLATION DEVICE, PUMP INSTALLATION METHOD, AND PUMP EXTRACTION METHOD

      
Numéro d'application JP2023015826
Numéro de publication 2023/210508
Statut Délivré - en vigueur
Date de dépôt 2023-04-20
Date de publication 2023-11-02
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Kasatani, Tetsuji
  • Ikeda, Hayato
  • Wataji, Kei
  • Kikuchi, Hyuga
  • Iwami, Mitsutaka

Abrégé

This pump installation device comprises: a working chamber (1) which forms a closed working space (15); an actuator-driven door (12) which covers a top opening (3a) of a pump column (3); a suspension cable (23) for suspending a submersible pump (2) in the pump column (3); and a crane (40) for lifting and lowering the suspension cable (23). The top opening (3a) of the pump column (3), the actuator-driven door (12) and the crane (40) are arranged in the working space (15).

Classes IPC  ?

  • F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
  • F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
  • F04D 29/60 - Montage; Assemblage; Démontage
  • F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients

60.

PLATING APPARATUS

      
Numéro d'application JP2022018410
Numéro de publication 2023/203720
Statut Délivré - en vigueur
Date de dépôt 2022-04-21
Date de publication 2023-10-26
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Omata, Shinji
  • Tomita, Masaki
  • Yamamoto, Kentaro
  • Masuda, Yasuyuki

Abrégé

The present invention provides a technology that makes it possible to prevent the deterioration in plating quality of a substrate due to the formation of air bubbles coming from an anode. A plating module 400 includes: a plating tank 10 that is so configured as to accommodate a plating solution therein; an anode 13 that is placed in the plating tank 10; a substrate holder 20 that is so configured as to hold a substrate Wf of which a surface to be plated is directed downward so as to face the anode 13; a membrane module 40 that has a first membrane 41 partitioning the inside of the plating tank 10 into an anode chamber 11 and a cathode chamber 12 and a second membrane 42 arranged between the first membrane 41 and the anode 13; and a tube member 31 that communicates a first region R1 positioned below the anode 13 in the plating tank 10 with a second region R2 positioned between the first membrane 41 and the second membrane 42.

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 7/12 - Semi-conducteurs

61.

SUBSTRATE CLEANING DEVICE, SUBSTRATE PROCESSING DEVICE, SUBSTRATE CLEANING METHOD, AND PROGRAM

      
Numéro d'application JP2023014402
Numéro de publication 2023/195537
Statut Délivré - en vigueur
Date de dépôt 2023-04-07
Date de publication 2023-10-12
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Ishii, Yu

Abrégé

This substrate cleaning device comprises: a cleaning module which includes a transfer mechanism for transferring a substrate in a first direction, and which performs cleaning by causing a cleaning member rotating around a rotation axis extending in a second direction not perpendicular to the first direction to abut on the substrate being transferred in the first direction; and a control device which, on the basis of information regarding at least one of the substrate and the cleaning module, changes a cleaning condition including at least one of the direction of the rotation axis, the rotational speed of the cleaning member, and the transfer speed of the substrate.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

62.

PLATING DEVICE AND PLATING METHOD

      
Numéro d'application JP2022016809
Numéro de publication 2023/188371
Statut Délivré - en vigueur
Date de dépôt 2022-03-31
Date de publication 2023-10-05
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Takahashi, Naoto

Abrégé

According to the present invention, a plating device comprises a plating tank for holding a plating liquid, an anode that is arranged inside the plating tank and has a plurality of through holes, a substrate holder that holds a substrate opposite the anode, a diaphragm that is arranged against a first surface of the anode that is on the substrate side, and a back surface plate that is arranged opposite a second surface of the anode that is on the reverse side from the first surface at a prescribed gap from the second surface and regulates the amount of bubbles that arise from the anode and accumulate on the second surface.

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique

63.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023007774
Numéro de publication 2023/189165
Statut Délivré - en vigueur
Date de dépôt 2023-03-02
Date de publication 2023-10-05
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Takebuchi, Kenichi
  • Saito, Kenichiro

Abrégé

An information processing device (5) comprises: an information acquisition unit (500) that acquires operating status information including top ring status information, polishing table status information, polishing fluid supply nozzle status information, dresser status information, and atomizer status information as operating states when a substrate processing device that performs a chemical-mechanical polishing treatment on a substrate is operated; and a status prediction unit (501) that predicts polishing pad status information for the operating status information by inputting the operating status information acquired by the information acquisition unit (500) into a learning model (10A) that has been trained by machine learning to learn correlations between the operating status information and the polishing pad status information.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 37/12 - Plateaux de rodage pour travailler les surfaces planes
  • B24B 49/00 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage
  • B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage

64.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE-LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD

      
Numéro d'application JP2023007808
Numéro de publication 2023/189170
Statut Délivré - en vigueur
Date de dépôt 2023-03-02
Date de publication 2023-10-05
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Takebuchi, Kenichi
  • Saito, Kenichiro

Abrégé

This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including substrate maintenance unit state information, cleaning fluid supplying unit state information, substrate cleaning unit state information, and cleaning tool cleaning unit state information as an operation state at the time of operation of a substrate processing device including a substrate maintenance unit that maintains a substrate, a cleaning fluid supplying unit that supplies a substrate cleaning fluid to a substrate, a substrate cleaning unit that supports the cleaning tool to be rotatable, brings the cleaning tool into contact with the substrate, and cleans the substrate, and a cleaning tool cleaning unit that cleans the cleaning tool with the cleaning tool cleaning fluid; and a state prediction unit (501) which predicts cleaning tool state information for the operation state information by inputting the operation state information acquired by the information acquisition unit (500) to a learning model which is trained through machine-learning with the correlation between the operation state information and the cleaning tool state information.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives

65.

COUPLING DEVICE FOR COUPLING ROTATING BODY TO ROTATING SHAFT, AND DEVICE FOR ATTACHING AND DETACHING ROTATING BODY

      
Numéro d'application JP2023003219
Numéro de publication 2023/181651
Statut Délivré - en vigueur
Date de dépôt 2023-02-01
Date de publication 2023-09-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Ito, Ban
  • Terada, Tetsuya

Abrégé

The present invention relates to a coupling device for coupling a rotating body such as such as a polishing head and dresser to a rotating shaft. The present invention further relates to a device for attaching and detaching the rotating body coupled to the rotating shaft via this coupling device. A coupling device (40) is used to couple a rotating body (7) to a rotating shaft (23). The coupling device (40) comprises: a flange (45) which is attached to the rotating body (7) and has a coupling shaft (45a); and a fastening structure (50) which fastens the rotating body (7) to the rotating shaft (23) via the coupling shaft (45a).

Classes IPC  ?

  • B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
  • B23B 31/107 - Caractérisés par les dispositifs de maintien ou de serrage ou par leurs moyens d'action directe le maintien étant assuré par éléments mobiles, p.ex. des billes
  • B23B 31/11 - Caractérisés par les dispositifs de maintien ou de serrage ou par leurs moyens d'action directe le maintien étant assuré par liaison filetée
  • B23B 31/113 - Caractérisés par les dispositifs de maintien ou de serrage ou par leurs moyens d'action directe le maintien étant assuré par liaison du type à baïonnette
  • B23B 31/20 - Manchons fendus longitudinalement, p.ex. mandrins à pinces
  • B23Q 3/157 - Agencements pour insérer ou retirer automatiquement les outils les outils rotatifs
  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 45/00 - Moyens utilisés pour fixer les meules sur les arbres rotatifs
  • B24B 53/12 - Outils à dresser; Leurs porte-outils
  • F16D 1/00 - Accouplements pour établir une liaison rigide entre deux arbres coaxiaux ou d'autres éléments mobiles d'une machine
  • F16D 1/04 - Accouplements pour établir une liaison rigide entre deux arbres coaxiaux ou d'autres éléments mobiles d'une machine pour liaison bout à bout de deux arbres ou de deux pièces analogues avec moyeu et clavette longitudinale
  • F16D 1/06 - Accouplements pour établir une liaison rigide entre deux arbres coaxiaux ou d'autres éléments mobiles d'une machine pour montage d'un organe sur un arbre ou à l'extrémité d'un arbre
  • F16D 1/092 - Accouplements pour établir une liaison rigide entre deux arbres coaxiaux ou d'autres éléments mobiles d'une machine pour montage d'un organe sur un arbre ou à l'extrémité d'un arbre avec moyeu et clavette longitudinale à serrage radial, obtenu par une force axiale appliquée sur au moins deux surfaces coniques les deux surfaces coniques en prise étant placées sur le moyeu et sur l'arbre
  • F16D 1/093 - Accouplements pour établir une liaison rigide entre deux arbres coaxiaux ou d'autres éléments mobiles d'une machine pour montage d'un organe sur un arbre ou à l'extrémité d'un arbre avec moyeu et clavette longitudinale à serrage radial, obtenu par une force axiale appliquée sur au moins deux surfaces coniques utilisant une ou plusieurs bagues coniques, élastiques ou segmentées formant au moins une des surfaces coniques, les bagues étant dilatées ou contractées pour assurer le serrage
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

66.

POLISHING METHOD AND POLISHING DEVICE

      
Numéro d'application JP2023006211
Numéro de publication 2023/181756
Statut Délivré - en vigueur
Date de dépôt 2023-02-21
Date de publication 2023-09-28
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Hong, Victor
  • Yamamoto, Satoru

Abrégé

The present invention pertains to a polishing method and a polishing device for polishing a peripheral portion of a substrate such as a wafer. The polishing method includes: holding a substrate (W) and rotating the substrate (W) by means of a substrate-holding unit (5); and polishing a second polishing area in a peripheral portion of the substrate (W) by moving or tilting a second polishing head (10B) in a second direction (D2) in a state where a second polishing tape (2B) is pressed against the peripheral portion of the substrate (W) by the second polishing head (10B) while polishing a first polishing area in the peripheral portion of the substrate (W) by moving or tilting a first polishing head (10A) in a first direction (D1) in a state where a first polishing tape (2A) is pressed against the peripheral portion of the substrate (W) by the first polishing head (10A), wherein the first direction (D1) and the second direction (D2) are opposite directions.

Classes IPC  ?

  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

67.

SUBSTRATE POLISHING DEVICE, SUBSTRATE POLISHING METHOD, POLISHING DEVICE, AND POLISHING METHOD

      
Numéro d'application JP2023008724
Numéro de publication 2023/176611
Statut Délivré - en vigueur
Date de dépôt 2023-03-08
Date de publication 2023-09-21
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yoshida, Atsushi
  • Ishii, Yu
  • Nakanishi, Masayuki

Abrégé

This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the first grinding member are disposed, a polishing module including a polishing member, and a control device that controls the grinding module and the polishing module. The control device controls the grinding module so as to perform first grinding on a part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member, and controls the polishing module so as to polish the processing surface that has been subjected to the first grinding and the second grinding.

Classes IPC  ?

  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
  • B24B 7/00 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 37/32 - Bagues de retenue
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

68.

METHOD FOR POLISHING SUBSTRATE

      
Numéro d'application JP2023005648
Numéro de publication 2023/171312
Statut Délivré - en vigueur
Date de dépôt 2023-02-17
Date de publication 2023-09-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yamamoto, Satoru
  • Uchiyama, Keisuke
  • Kashiwagi, Makoto
  • Fujisawa, Mao

Abrégé

The present invention relates to a method for polishing a substrate such as a wafer. This method for polishing a substrate involves rotating a substrate (W) about the axis while moving the substrate(W) and a polishing head (10C) in a relative circular motion, pressing, with the polishing head (10C), a polishing tape (2B) against a surface (5a) to be polished while feeding the polishing tape (2B) in the longitudinal direction, and polishing a center region including a center (O1) of the substrate (W) and an outer region adjacent to the center region. The step for polishing the center region and the outer region includes at least two polishing steps that are performed under different polishing conditions. The at least two polishing steps include a low polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is lower than that of the outer region, and a high polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is higher than that of the outer region.

Classes IPC  ?

  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 21/06 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet pour meuler des surfaces planes munis d'organes à surface de contact limitée pour pousser la courroie contre la pièce à travailler, p.ex. munis de sabots qui balaient complètement la surface à meuler
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

69.

PUMP SYSTEM AND ENGINE SYSTEM

      
Numéro d'application JP2023007969
Numéro de publication 2023/171549
Statut Délivré - en vigueur
Date de dépôt 2023-03-03
Date de publication 2023-09-14
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Fujieda, Hideki
  • Ariyoshi, Yuya
  • Suzuki, Ryuji
  • Lokare, Tejas
  • Nakamura, Yoichi

Abrégé

The present invention relates to a pump system and an engine system. Provided is a pump system (PS) appliable to an engine system (ES) mounted in a space navigation body. The pump system (PS) is provided with: a motor (M); a first pump (P1) that includes a first impeller (IM1) fixed to a rotational shaft (RS) and supplies an oxidizing agent; and a second pump (P2) that includes a second impeller (IM2) fixed to the rotational shaft (RS) and supplies a fuel material.

Classes IPC  ?

  • F02K 9/46 - Alimentation en propergols utilisant des pompes
  • F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
  • F04D 29/58 - Refroidissement; Chauffage; Réduction du transfert de chaleur
  • H02K 7/14 - Association structurelle à des charges mécaniques, p.ex. à des machines-outils portatives ou des ventilateurs

70.

SUBSTRATE PRE-WET PROCESSING METHOD AND PRE-WET MODULE

      
Numéro d'application JP2022009350
Numéro de publication 2023/166697
Statut Délivré - en vigueur
Date de dépôt 2022-03-04
Date de publication 2023-09-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Takahashi, Naoto

Abrégé

Provided is a technique capable of improving the throughput of pre-wet processing. This substrate pre-wet processing method comprises: a step for placing a substrate Wf, in which a recess Wfb for wiring formation is formed on a surface Wfa, inside a chamber 10, and supplying a gas Ga having a higher solubility in water than air into the chamber 10 to replace the air inside the chamber with the gas; and a step for supplying a processing liquid PL containing water as a main component to the surface Wfa of the substrate after replacing the air inside the chamber with the gas to wet the surface with the processing liquid.

Classes IPC  ?

  • C25D 5/34 - Prétraitement des surfaces métalliques à revêtir de métaux par voie électrolytique

71.

FILTER STRUCTURE AND LIQUID CIRCULATION SYSTEM

      
Numéro d'application JP2023003158
Numéro de publication 2023/166902
Statut Délivré - en vigueur
Date de dépôt 2023-02-01
Date de publication 2023-09-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Fan, Xinshuai
  • Miyata, Hiromasa
  • Kawasaki, Hiroyuki

Abrégé

The present invention pertains to a filter structure and a liquid circulation system. This filter structure (10) comprises a filtering unit (11). The filtering unit (11) comprises a fine mesh filter (15), a coarse mesh filter (16), and a block frame (17). The block frame (17) comprises a first foreign substance reservoir (20) and a second foreign substance reservoir (21).

Classes IPC  ?

  • B01D 35/02 - Filtres adaptés à des endroits particuliers, p.ex. conduites, pompes, robinets
  • B01D 29/50 - Filtres à éléments filtrants stationnaires pendant la filtration, p.ex. filtres à aspiration ou à pression, non couverts par les groupes ; Leurs éléments filtrants à plusieurs éléments filtrants caractérisés par leur agencement relatif
  • F04D 29/70 - Grilles d'aspiration; Filtres; Séparateurs de poussière; Nettoyage
  • F04B 53/20 - Filtrage

72.

POLISHING HEAD AND POLISHING DEVICE

      
Numéro d'application JP2023005147
Numéro de publication 2023/166986
Statut Délivré - en vigueur
Date de dépôt 2023-02-15
Date de publication 2023-09-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kashiwagi, Makoto
  • Fujisawa, Mao

Abrégé

The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. A polishing head (10) comprises a pressing member (12) that presses a polishing tape (2) against a substrate (W), an actuator (15) that moves the pressing member (12) in a predetermined pressing direction (CL) and applies a pressing force to the pressing member (12), and a tilt adjusting mechanism (40) that adjusts the tilt of the pressing member (12) with respect to the pressing direction (CL). The tilt adjusting mechanism (40) is configured to tilt the pressing member (12) with respect to the pressing direction (CL) and keep the angle of the tilted pressing member (12).

Classes IPC  ?

  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 21/08 - Sabots de pression; Bandes d'appui
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

73.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023005241
Numéro de publication 2023/166991
Statut Délivré - en vigueur
Date de dépôt 2023-02-15
Date de publication 2023-09-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Takebuchi, Kenichi
  • Saito, Kenichiro

Abrégé

An information processing device (5) comprises: an information acquisition unit (500) for acquiring a finishing process condition including substrate holding unit state information indicating the state of a substrate holding unit for holding a substrate as well as finishing fluid supply unit state information indicating the state of a finishing fluid supply unit for supplying a substrate finishing fluid to the substrate in a substrate finishing process performed by a substrate processing device provided with the substrate holding unit and the finishing fluid supply unit; and a state prediction unit (501) for inputting the finishing process condition acquired by the information acquisition unit (500) into learning models (10A, 10B) that have been trained by machine learning with a correlation between the finishing process condition and substrate state information indicating a state of the substrate having been subjected to the finishing process under the finishing process condition, so as to predict substrate state information for the substrate having been subjected to the finishing process under the finishing process condition.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • G06N 20/20 - Techniques d’ensemble en apprentissage automatique

74.

POLISHING HEAD AND POLISHING DEVICE

      
Numéro d'application JP2023005452
Numéro de publication 2023/167001
Statut Délivré - en vigueur
Date de dépôt 2023-02-16
Date de publication 2023-09-07
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kashiwagi, Makoto
  • Fujisawa, Mao

Abrégé

The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) for polishing the substrate (W) comprises: a pressing member (12) for pressing the polishing tape (2) against the substrate (W); a pressing member holder (30) for holding the pressing member (12); and an actuator (15) connected to the pressing member holder (30) and imparting a pressing force to the pressing member (12). The pressing member (12) is formed in a rod-shape having both ends (12a), and the pressing member (12) is fitted to a groove (50) formed in a pressing surface (30a) of the pressing member holder (30).

Classes IPC  ?

  • B24B 21/08 - Sabots de pression; Bandes d'appui
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

75.

POLISHING DEVICE AND METHOD FOR DETECTING POLISHING END POINT IN POLISHING DEVICE

      
Numéro d'application JP2023000030
Numéro de publication 2023/162478
Statut Délivré - en vigueur
Date de dépôt 2023-01-05
Date de publication 2023-08-31
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yoshinari, Dai
  • Yamaguchi, Kuniaki

Abrégé

The present invention accurately detects the end point of polishing. This polishing device comprises: a polishing table for holding a polishing pad; a holder for holding an object to be polished so as to face the polishing pad; at least one of a motor for rotationally driving the polishing table, a motor for rotating the holder holding the object, and a motor for rocking the holder holding the object; one or more drivers that are configured so as to supply drive current to the at least one motor and further output a digital signal according to the load of the at least one motor; and an end point detection unit that detects a polishing end point, which indicates the end of polishing of the object, on the basis of the digital signal output from the drivers.

Classes IPC  ?

  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 37/32 - Bagues de retenue
  • B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

76.

POLISHING ENDPOINT DETECTION METHOD, POLISHING ENDPOINT DETECTION SYSTEM, POLISHING DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM

      
Numéro d'application JP2023002674
Numéro de publication 2023/162579
Statut Délivré - en vigueur
Date de dépôt 2023-01-27
Date de publication 2023-08-31
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shimizu, Yuko
  • Mitani, Ryuichiro

Abrégé

The present invention pertains to a method and system for detecting the polishing endpoint of a workpiece which is used in the production of a semiconductor device such as a wafer, a substrate or a panel. This method involves: obtaining a polishing monitoring value which expresses the degree of workpiece (W) polishing progress when polishing a workpiece (W); generating time-series data which expresses a change in the polishing monitoring value which corresponds to the workpiece (W) polishing time; inputting polishing monitoring values (VF1, VF2) and polishing times (TF1, TF2), which constitute characteristic data points (FP1, FP2) included in the time-series data, into a trained model (34); and outputting a polishing endpoint prediction time from the trained model (34).

Classes IPC  ?

  • B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
  • B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

77.

SUBSTRATE POLISHING DEVICE

      
Numéro d'application JP2023004509
Numéro de publication 2023/162714
Statut Délivré - en vigueur
Date de dépôt 2023-02-10
Date de publication 2023-08-31
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Yazawa, Akihiro
  • Kobayashi, Kenichi
  • Ohashi, Hirotaka
  • Ishikawa, Sho
  • Kashiwagi, Makoto
  • Miyasawa, Yasuyuki

Abrégé

The present invention pertains to a substrate polishing device for polishing a substrate such as a wafer, and particularly to a substrate polishing device for polishing a notch section of the substrate, a bevel section of the substrate, a device surface of the substrate, and the back surface of the substrate. This substrate polishing device includes a first polishing module, a second polishing module, and a third polishing module, and the first polishing module, the second polishing module, and the third polishing module are polishing modules respectively polishing different areas of the substrate.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques

78.

PLATING APPARATUS AND PLATING METHOD

      
Numéro d'application JP2022006061
Numéro de publication 2023/157105
Statut Délivré - en vigueur
Date de dépôt 2022-02-16
Date de publication 2023-08-24
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Goto, Yusui
  • Tsuji, Kazuhito
  • Nagai, Mizuki

Abrégé

The present invention proposes a plating apparatus and the like that can improve uniformity of plated films formed on substrates. The plating apparatus comprises: a plating tank; a substrate holder for holding a substrate; and an anode holder that is disposed in the plating tank so as to face the substrate held on the substrate holder, and that is configured to hold a soluble anode; an anode mask that is attached to the anode holder and that has an opening through which electric current flowing between the anode and the substrate passes; an adjustment mechanism configured so as to adjust the dimension of the opening of the anode mask; and a controller for controlling the adjustment mechanism on the basis of the electrolyzed amount of the anode while the anode is being used.

Classes IPC  ?

79.

AM DEVICE

      
Numéro d'application JP2022041286
Numéro de publication 2023/157393
Statut Délivré - en vigueur
Date de dépôt 2022-11-07
Date de publication 2023-08-24
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Shinozaki, Hiroyuki

Abrégé

Provided is a technology for uniformly supplying powder as a material to a DED nozzle. An embodiment provides an AM device for manufacturing a molded product, the AM device comprising a DED nozzle. The DED nozzle includes: a powder opening for injecting a powder material, provided in a fore end of a DED nozzle body; and a powder channel for letting the powder material through the DED nozzle body, communicatively connected to the powder opening. The AM device further comprises: a first pipe; a separator wall extending from an end of the first pipe to an upstream side inside the first pipe; and a plurality of second pipes coupled to the end of the first pipe. The separator wall partitions the end of the first pipe into a plurality of regions. The plurality of second pipes are coupled respectively to the plurality of regions of the first pipe. The second pipes are coupled to the powder channel of the DED nozzle.

Classes IPC  ?

  • B22F 12/53 - Buses
  • B22F 10/25 - Dépôt direct de particules métalliques, p.ex. dépôt direct de métal [DMD] ou mise en forme par laser [LENS]
  • B33Y 30/00 - Appareils pour la fabrication additive; Leurs parties constitutives ou accessoires à cet effet

80.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023002243
Numéro de publication 2023/153208
Statut Délivré - en vigueur
Date de dépôt 2023-01-25
Date de publication 2023-08-17
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Yun, Seungho

Abrégé

An information processing device (5) includes: an information acquisition unit (500) that in a chemical mechanical polishing process of a substrate performed by a substrate processing apparatus including a polishing table rotatably supporting a polishing pad and a top ring for pushing the polishing pad against the substrate, acquires polishing process state information including top-ring vibration information indicating vibration of the top ring during polishing and top-ring sound information indicating sound generated from the top ring during polishing: and a state prediction unit (501) that inputs the polishing process state information acquired by the information acquisition unit (500) to a learning model (10A) that has learned, through machine learning, correlation between the polishing process state information and substrate slipping-out information indicating occurrence of slipping out of the substrate subjected to the chemical mechanical polishing process, to predict the substrate slipping-out information relative to the polishing process state information.

Classes IPC  ?

  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 37/32 - Bagues de retenue
  • G06N 20/10 - Apprentissage automatique utilisant des méthodes à noyaux, p.ex. séparateurs à vaste marge [SVM]
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

81.

PUMP UNIT

      
Numéro d'application JP2022045707
Numéro de publication 2023/153068
Statut Délivré - en vigueur
Date de dépôt 2022-12-12
Date de publication 2023-08-17
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Kawasaki, Hiroyuki

Abrégé

The present invention relates to a pump unit. A pump unit (PU) is provided with a connector (400) that connects a plurality of motor pumps (MP). The connector (400) connects a front-stage-side ejection casing (22) and a rear-stage-side suction casing (21).

Classes IPC  ?

  • F04D 29/62 - Montage; Assemblage; Démontage des pompes radiales ou hélicocentrifuges
  • F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
  • F04D 13/14 - Combinaisons de plusieurs pompes les pompes étant toutes du type centrifuge
  • F04D 29/22 - Rotors spécialement pour les pompes centrifuges

82.

POLISHING HEAD AND POLISHING DEVICE

      
Numéro d'application JP2023002698
Numéro de publication 2023/153243
Statut Délivré - en vigueur
Date de dépôt 2023-01-27
Date de publication 2023-08-17
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kashiwagi, Makoto
  • Fujisawa, Mao

Abrégé

The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) comprises: a pressing mechanism (12) which presses a polishing tape (2) against a substrate W; and a tape hook (40) which restricts the movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape-positioning surface (47) that faces the polishing surface of the edge of the polishing tape (2).

Classes IPC  ?

  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 21/06 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet pour meuler des surfaces planes munis d'organes à surface de contact limitée pour pousser la courroie contre la pièce à travailler, p.ex. munis de sabots qui balaient complètement la surface à meuler

83.

PLATING APPARATUS

      
Numéro d'application JP2022004589
Numéro de publication 2023/148950
Statut Délivré - en vigueur
Date de dépôt 2022-02-07
Date de publication 2023-08-10
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Wakuda, Yohei
  • Masuda, Yasuyuki
  • Shimoyama, Masashi

Abrégé

The present invention provides a plating apparatus having a shielding member, wherein the uniformity of the plating film thickness distribution is improved by arranging a resistor close to a surface to be plated of a substrate. A plating apparatus according to the present invention comprises: a plating bath 410 which is configured so as to contain a plating solution; a substrate holder 440 which holds a substrate Wf, with a surface Wf-a to be plated facing down; an anode 430 which is arranged within the plating bath 410; a resistor 450 which is arranged between the substrate Wf and the anode 430 and has a facing surface 450-a that faces the surface Wf-a to be plated, wherein the facing surface 450-a has a first facing surface 450-a1 and a second facing surface 450-a2 that is more distant from the surface Wf-a to be plated than the first facing surface 450-a1; and a shielding member 481 which is arranged in a recessed region β of the resistor 450 and is used for the purpose of shielding an electric field, the recessed region β being formed by the second facing surface 450-a2.

Classes IPC  ?

84.

MOTOR PUMP AND MOTOR PUMP ASSEMBLY

      
Numéro d'application JP2022032543
Numéro de publication 2023/149004
Statut Délivré - en vigueur
Date de dépôt 2022-08-30
Date de publication 2023-08-10
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Watanabe, Masaki
  • Kawasaki, Hiroyuki

Abrégé

The present invention relates to a motor pump and a motor pump assembly. The motor pump (MP) has a rotation-side grip structure (100) by which an impeller (1) can grip a rotation-side bearing structure (11).

Classes IPC  ?

  • F04D 29/046 - Paliers
  • F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité

85.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2023000378
Numéro de publication 2023/149162
Statut Délivré - en vigueur
Date de dépôt 2023-01-11
Date de publication 2023-08-10
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Miyazaki, Mitsuru
  • Kondo, Daichi

Abrégé

An information processing device (5) comprises: an information acquisition unit (500) that acquires substrate processing fluid supply information including substrate processing fluid supply state information which indicates the state of supply of a substrate processing fluid that is supplied from a substrate processing fluid supply unit (222, 242a, 245a), in processing of a substrate (W) which is performed by a substrate processing device (2); and a state prediction unit (501) that predicts substrate processing fluid supply position information corresponding to the substrate processing fluid supply information by inputting the substrate processing fluid supply information to a learning model which has learned, by machine learning, correlations between substrate processing fluid supply information and substrate processing fluid supply position information, said substrate processing fluid supply position information indicating the supply position of the fluid that is supplied by the substrate processing fluid supply unit when the substrate processing device operates.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 37/00 - Machines ou dispositifs de rodage; Accessoires
  • B24B 49/00 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives

86.

PLATING DEVICE AND DRYING METHOD

      
Numéro d'application JP2022004188
Numéro de publication 2023/148869
Statut Délivré - en vigueur
Date de dépôt 2022-02-03
Date de publication 2023-08-10
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Yamasaki, Gaku

Abrégé

The present disclosure provides a plating device and a drying method that make it possible to keep an electrical contact dry. This plating device comprises a blow module and a substrate holder that holds a substrate and has an electrical contact for supplying power to the substrate. The blow module has a substrate holder stage for supporting the substrate holder, a drying nozzle assembly that has a nozzle for spraying a gas at the substrate and the substrate holder, and an actuator for moving the drying nozzle assembly such that the nozzle moves in a plane along the surface of the substrate.

Classes IPC  ?

  • C25D 21/00 - Procédés pour l'entretien ou la conduite des cellules pour revêtement électrolytique

87.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE-LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD

      
Numéro d'application JP2023000371
Numéro de publication 2023/149161
Statut Délivré - en vigueur
Date de dépôt 2023-01-11
Date de publication 2023-08-10
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Miyazaki, Mitsuru
  • Kondo, Daichi

Abrégé

This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including an operation state when a substrate processing device (2) including a substrate holding unit (241) operates; and a state prediction unit (501) which predicts substrate holding mechanism part state information for the operation state information by inputting the operation state information to a training model for which a correlation between the operation state information and the substrate holding mechanism part state information is trained through machine learning, the substrate holding mechanism part state information indicating the states of substrate holding mechanism parts (241a, 241c, 241e) when the substrate processing device (2) operates in the operation state indicated by the operation state information.

Classes IPC  ?

  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 49/00 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives

88.

PLATING DEVICE AND PLATING METHOD

      
Numéro d'application JP2022003526
Numéro de publication 2023/145049
Statut Délivré - en vigueur
Date de dépôt 2022-01-31
Date de publication 2023-08-03
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Shimoyama, Masashi
  • Masuda, Yasuyuki
  • Hiwatashi, Ryosuke

Abrégé

The present invention enables specific parts of a substrate to be shielded at a desired timing and improves uniformity in plating film thickness. In this invention, a plating module includes: a plating bath 410 for accommodating a plating solution; an anode 430 disposed inside the plating bath 410; a substrate holder 440 for holding a substrate Wf with a surface Wf-a to be plated facing downward; a rotating mechanism 447 configured to cause the substrate holder 440 to rotate in a first direction and in a second direction which is opposite to the first direction; and a shielding mechanism 485 for causing a shielding member 481 to move to a position between the anode 430 and the substrate Wf in accordance with a rotation angle of the substrate holder 440.

Classes IPC  ?

89.

POWER CABLE FOR SUBMERSIBLE PUMP, PUMP CARRY-IN METHOD, AND PUMP PULL-UP METHOD

      
Numéro d'application JP2022045984
Numéro de publication 2023/136033
Statut Délivré - en vigueur
Date de dépôt 2022-12-14
Date de publication 2023-07-20
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Honda, Shuichiro
  • Kasatani, Tetsuji
  • Ikeda, Hayato
  • Wataji, Kei
  • Kikuchi, Hyuga
  • Iwami, Mitsutaka

Abrégé

The present invention relates to a power cable for supplying power to a submersible pump for raising the pressure of a liquefied gas such as liquefied ammonia, liquefied natural gas (LNG), or liquid hydrogen. The present invention further relates to: a method for carrying a submersible pump into a pump column by using such a power cable; and to a method for pulling up the submersible pump from the pump column. A power cable (36) is for supplying power to a submersible pump (2) disposed inside a pump column (3) in order to transfer liquefied gas, the power cable comprising: a plurality of split power cables (36A); and a plurality of cable connectors (36B) electrically connecting the plurality of split power cables (36A).

Classes IPC  ?

  • F17C 9/00 - Procédés ou appareils pour vider les gaz liquéfiés ou solidifiés contenus dans des récipients non sous pression
  • F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée

90.

CONTAINER, CONTAINER SYSTEM, MAINTENANCE SYSTEM, AND MAINTENANCE METHOD FOR LIQUID HYDROGEN PUMP

      
Numéro d'application JP2023000262
Numéro de publication 2023/136234
Statut Délivré - en vigueur
Date de dépôt 2023-01-10
Date de publication 2023-07-20
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kasatani Tetsuji
  • Takano Katsuyuki
  • Iwami Mitsutaka
  • Honda Shuichiro
  • Wataji Kei
  • Suzuki Asaki

Abrégé

The present invention provides a container capable of increasing the temperature of a liquid hydrogen pump during maintenance and a system including such a container. Provided is a maintenance system used for the maintenance of the liquid hydrogen pump, the maintenance system comprising: a hollow container main body which allows the liquid hydrogen pump to pass therethrough during maintenance and which has one or more inlets and one outlet; a circulation flow path connecting the outlet and the one or more inlets; a blower which is provided on the circulation flow path and which guides helium gas from the outlet into the one or more inlets to thereby circulate the helium gas in the circulation flow path; and a heat exchanger which increases, by the atmosphere, the temperature of the helium gas passing through the circulation flow path.

Classes IPC  ?

  • F17C 9/00 - Procédés ou appareils pour vider les gaz liquéfiés ou solidifiés contenus dans des récipients non sous pression
  • F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients

91.

CONTAINER AND PUMP SYSTEM

      
Numéro d'application JP2023000357
Numéro de publication 2023/136246
Statut Délivré - en vigueur
Date de dépôt 2023-01-11
Date de publication 2023-07-20
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kikuchi Hyuga
  • Kasatani Tetsuji
  • Honda Shuichiro
  • Wataji Kei
  • Iwami Mitsutaka
  • Tanaka Hideki

Abrégé

Provided is a container capable of preventing gas from leaking from a cable penetration hole. Hollow containers 3, 4 are provided above a hollow column 2 provided around a liquefied gas pump P. The center parts of the containers 3, 4 are penetrated from the bottom toward the top by a cable 8 for installing and pulling out the liquefied gas pump P. The containers 3, 4 comprise: lower plate members 5, 6 having, in center parts, cable through holes 9, 10 that can be penetrated by the cable 8; and stuffing box members 12 provided around the cable through holes 9, 10 in the center parts of the lower plate members 5, 6 and having center parts with cable insertion holes 13 through which the cable 8 is inserted. The stuffing box members 12 comprise opening diameter adjustment mechanisms 14, 20 that adjust the sizes of the opening diameters of the cable insertion holes 13.

Classes IPC  ?

  • F17C 13/12 - Aménagements ou montage de dispositifs pour prévenir ou atténuer les effets d'explosion
  • B65D 90/22 - Caractéristiques relatives à la sécurité

92.

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

      
Numéro d'application JP2022039674
Numéro de publication 2023/119847
Statut Délivré - en vigueur
Date de dépôt 2022-10-25
Date de publication 2023-06-29
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Kashiwagi, Makoto

Abrégé

The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in a circular motion by bringing rollers (11a, 11b), which are fixed to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b), into contact with a peripheral edge of the substrate (W) and moving the rollers (11a, 11b) in a circular motion, and a processing tool (201) is brought into contact with the substrate (W) to process the substrate (W). During the processing of the substrate (W), a rotation speed of the substrate (W) is calculated on the basis of a measured value of a notch detection sensor (77) for detecting passage of the notch (Nw) through the movable shaft (13b), and, if the rotation speed of the substrate (W) deviates from an allowable range set for a theoretical rotation speed of the substrate (W), an alert is given.

Classes IPC  ?

  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet comportant une table porte-pièce rotative
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

93.

MAINTENANCE METHOD FOR PLATING DEVICE

      
Numéro d'application JP2021046934
Numéro de publication 2023/119347
Statut Délivré - en vigueur
Date de dépôt 2021-12-20
Date de publication 2023-06-29
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Tomita, Masaki

Abrégé

Provided is a technology with which it is possible to inhibit deformation of a film disposed inside of a plating tank. This maintenance method for a plating device includes: returning an anolyte in an anodic chamber to an anolyte tank and then circulating the anolyte between the anolyte tank and the anodic chamber (step S10e); and returning a catholyte in a cathodic chamber to a catholyte tank and then circulating the catholyte between the catholyte tank and the cathodic chamber after the circulation of the anolyte between the anolyte tank and the anodic chamber has been initiated (step S10f).

Classes IPC  ?

  • C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
  • C25D 21/10 - Agitation des électrolytes; Déplacement des claies

94.

CONTAINER, PUMP SYSTEM, AND MAINTENANCE METHOD

      
Numéro d'application JP2022047184
Numéro de publication 2023/120591
Statut Délivré - en vigueur
Date de dépôt 2022-12-21
Date de publication 2023-06-29
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Kasatani Tetsuji
  • Honda Shuichiro
  • Iwami Mitsutaka
  • Wataji Kei
  • Kikuchi Hyuga
  • Suzuki Asaki

Abrégé

This hollow container (13) is provided above a hollow column (11) which surrounds a liquefied gas pump (P). The container (13) is equipped with: a lower plate member (22a, b) capable of opening and closing the lower section of the container (13); a manual opening/closing device (34a, b) operated in order to open and close the lower plate member (22a, b) inside the container (13); a glovebox (35a, b) configured in a manner such that a user can insert a hand therein from outside the container (13) in order to operate the manual opening/closing device (34a, b) inside the container (13); and an operation window (33a, b) positioned near the glovebox (35a, b) and the manual opening/closing device (34a, b) in a manner such that the glovebox (35a, b) and the manual opening/closing device (34a, b) are visible from outside the container (13).

Classes IPC  ?

  • F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients

95.

METHOD FOR POLISHING SUBSTRATE, SUBSTRATE POLISHING DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM IN WHICH PROGRAM IS RECORDED

      
Numéro d'application JP2022041493
Numéro de publication 2023/112548
Statut Délivré - en vigueur
Date de dépôt 2022-11-08
Date de publication 2023-06-22
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Fujiki, Masayuki
  • Kiyosawa, Nobuhito

Abrégé

The present invention relates to a method for polishing a substrate by pressing an abrasive tape against a substrate such as a wafer. This method for polishing a substrate: stores in a database (21a) an actual polishing condition for a substrate previously polished and an actual used amount of the abrasive tape in the actual polishing condition in association with each other; prior to polishing a substrate to be polished, searches from the database (21a) the actual polishing condition corresponding to a preset polishing condition for the substrate to be polished; determines the actual used amount of the abrasive tape associated with the actual polishing condition corresponding to the preset polishing condition as an estimated used amount of the abrasive tape necessary for polishing of the substrate to be polished; and compares a remaining amount of the abrasive tape used for polishing of the substrate to be polished and the determined estimated used amount, and polishes the substrate to be polished with polishing modules (4A, 4B) when the remaining amount of the abrasive tape is at least the estimated used amount.

Classes IPC  ?

  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B23Q 15/00 - Commande automatique ou régulation du mouvement d'avance, de la vitesse de coupe ou de la position tant de l'outil que de la pièce
  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

96.

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

      
Numéro d'application JP2022044173
Numéro de publication 2023/112680
Statut Délivré - en vigueur
Date de dépôt 2022-11-30
Date de publication 2023-06-22
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Ohashi, Hirotaka

Abrégé

This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the substrate (W); a static pressure plate (9) with a fluid supporting face (9a) opposed to the suction holding face (5a); and a fluid feeding line (10) connected to the static pressure plate (9) and feeding a fluid to a space between the fluid supporting face (9a) and a second face (2b) of the substrate (W). The second face (2b) is opposite to the first face (2a) of the substrate (W). The fluid supporting face (9a) is larger than the suction holding face (5a).

Classes IPC  ?

  • B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
  • B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
  • B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
  • B24B 55/06 - Equipement d'enlèvement des poussières sur les machines à meuler ou à polir
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

97.

INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2022045330
Numéro de publication 2023/112830
Statut Délivré - en vigueur
Date de dépôt 2022-12-08
Date de publication 2023-06-22
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Takebuchi, Kenichi
  • Saito, Kenichiro

Abrégé

An information processing device (5) comprises: an information acquisition unit (500) that acquires a polishing process condition including top ring state information, polishing table state information, and polishing fluid supply nozzle state information in a chemical mechanical polishing process carried out for a substrate by a substrate processing device comprising a polishing table that rotatably supports a polishing pad, a top ring that presses the substrate against the polishing pad, and a polishing fluid supply nozzle that supplies polishing fluid to the polishing pad; and a state prediction unit (501) that inputs the polishing process condition acquired by the information acquisition unit (500) into a learning model (10A) that has been trained by machine learning with a correlation between the polishing process condition and substrate state information indicating a state of the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition, to thereby predict substrate state information for the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition.

Classes IPC  ?

  • B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
  • B24B 37/00 - Machines ou dispositifs de rodage; Accessoires
  • B24B 37/015 - Commande de la température
  • B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
  • B24B 37/32 - Bagues de retenue
  • B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
  • B24B 49/14 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la température pendant le meulage
  • B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
  • B24B 55/03 - Dispositifs de sécurité pour machines de meulage ou de polissage; Accessoires adaptés aux machines à meuler ou à polir pour maintenir les outils ou les parties de machines en bon état de marche Équipement pour refroidir les surfaces abrasives, p.ex. dispositifs d'alimentation en agent de refroidissement conçus comme équipement complet d'alimentation en agent de refroidissement ou de clarification de celui-ci
  • H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

98.

DRAINAGE PUMP DEVICE, DRAINAGE PUMP MANAGEMENT SYSTEM, DRAINAGE PUMP SUPPORT PLAN CREATION DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, DRAINAGE PUMP SUPPORT PLAN CREATION METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD

      
Numéro d'application JP2022035642
Numéro de publication 2023/105891
Statut Délivré - en vigueur
Date de dépôt 2022-09-26
Date de publication 2023-06-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Sugiyama, Kazuhiko
  • Harada, Yosuke
  • Iwamoto, Hideyuki
  • Okamoto, Shigeru

Abrégé

A drainage pump device (2) comprises a pump control unit (20) that controls operation of a pump unit (25) on the basis of the water level detected by a water level detection unit (24). The pump control unit (20) comprises: a weather information acquisition unit (201) that acquires weather information of a monitoring location; an anomaly determination unit (202) that determines whether or not an anomaly has occurred in the water level detection unit (24) or the pump unit (25); a water level detection unit anomaly processing unit (203) that controls operation of the pump unit (25) on the basis of the weather information when it is determined that the anomaly has occurred in the water level detection unit (24); and a pump unit anomaly processing unit (204) that, when it is determined that the anomaly has occurred in the pump unit (25), outputs, on the basis of the water level detected by the water level detection unit (24) and/or the weather information, support request information for requesting support for drainage work performed by a drainage pump vehicle and a worker.

Classes IPC  ?

  • F04D 15/00 - Commande, p.ex.régulation de pompes, d'installations ou de systèmes de pompage
  • E03F 5/22 - Adaptations d'installations de pompage pour remonter les eaux d'égout

99.

PLATING METHOD AND PLATING APPARATUS

      
Numéro d'application JP2021044645
Numéro de publication 2023/105561
Statut Délivré - en vigueur
Date de dépôt 2021-12-06
Date de publication 2023-06-15
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s)
  • Tsuji, Kazuhito
  • Nagai, Mizuki

Abrégé

Provided is a technology that enables the removal of air bubbles that have adhered to holes of an ion resistor. A plating method comprises: stirring a plating liquid by driving a paddle disposed above an ion resistor in a state in which the ion resistor and an anode are immersed in the plating liquid (step S20); immersing a substrate, which serves as a cathode, into the plating liquid in a state in which the stirring of the plating liquid by the paddle is stopped (step S40); restarting, in a state in which the substrate is immersed in the plating liquid, the stirring of the plating liquid by the paddle which is disposed above the ion resistor and below the substrate (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state in which the stirring of the plating liquid by the paddle has been restarted (step S60).

Classes IPC  ?

  • C25D 7/12 - Semi-conducteurs
  • C25D 21/10 - Agitation des électrolytes; Déplacement des claies

100.

PUMP

      
Numéro d'application JP2022044661
Numéro de publication 2023/101030
Statut Délivré - en vigueur
Date de dépôt 2022-12-05
Date de publication 2023-06-08
Propriétaire EBARA CORPORATION (Japon)
Inventeur(s) Ikeda, Takuji

Abrégé

The present invention relates to a volute pump that does not have a rotating shaft coupled to an impeller. A casing (6) of a pump (1) comprises: at least three tongue portions (21A, 21B, 21C) arranged at equal intervals around an impeller (7); and at least three side walls (22A, 22B, 22C) connected respectively to the tongue portions (21A, 21B, 21C). The side walls (22A, 22B, 22C) form at least three flow passages (23A, 23B, 23C) for a fluid. Each of the side walls (22A, 22B, 22C) has a volute side surface (30A, 30B, 30C) which extends from one of the tongue portions (21A, 21B, 21C) to a position beyond another adjacent tongue portion. The pump (1) is not provided with a radial bearing for supporting the impeller (7).

Classes IPC  ?

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