Abrégé

A color control member includes a light control layer including quantum dots, a color filter layer disposed on the light control layer, and a low refractive layer disposed between the color filter layer and the light control layer. The low refractive layer includes a base resin, a plurality of non-hollow inorganic particles dispersed in the base resin and of which inner portions are filled. A weight percent of the base resin is in a range of about 40 wt % to about 45 wt % with respect to a total weight of the low refractive layer, and a weight percent of the non-hollow inorganic particles is in a range of about 40 wt % to about 45 wt % with respect to the total weight of the low refractive layer. The color control member including the low refractive layer has excellent reliability.

Classes IPC  ?

• G02B 5/20 - Filtres

Abrégé

A glass stress test method includes breaking a glass, analyzing a shape of a crack of a broken portion of the glass in a plan view, finding a breakage origin of the glass based on the shape of the crack in the plan view, analyzing a cross-section of the breakage origin, and calculating a stress of the glass based on a cross-sectional analysis result of the breakage origin. The stress of the glass is calculated as a value proportional to a floor constant defined by a condition of a floor surface disposed when the glass is broken.

Classes IPC  ?

• G01N 3/303 - Recherche des propriétés mécaniques des matériaux solides par application d'une contrainte mécanique en appliquant une force unique et brève engendrée uniquement par un poids en chute libre
• G01N 3/56 - Recherche de la résistance à l'usure ou à l'abrasion

Abrégé

A display apparatus includes a base substrate on which a display area and a non-display area are defined, a first via insulating layer on the base substrate, a first power supply wire in the non-display area on the first via insulating layer, a second power supply wire in the non-display area on the first via insulating layer spaced apart from the first power supply wire, a first dam on the base substrate, overlapping the first and second power supply wires, and extending along the non-display area, a first stacked structure on the first via insulating layer between the first dam and the display area, and having a height less than a height of the first dam, and an organic layer on the first stacked structure and the first dam to overlap a substantially entire portion of the first stacked structure and at least a portion of the first dam.

Classes IPC  ?

• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• H10K 50/844 - Encapsulations
• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
• H10K 71/00 - Fabrication ou traitement spécialement adaptés aux dispositifs organiques couverts par la présente sous-classe

Abrégé

A display device includes a substrate, a circuit layer, and a light emitting element layer. The circuit layer includes pixel drivers corresponding to emission areas of a display area of the substrate and electrically connected to light emitting elements of the light emitting element layer, data lines that transmit data signals to the pixel drivers, first dummy lines disposed in the display area and extending in a first direction intersecting the data lines, and second dummy lines extending in a second direction parallel to the data lines and neighboring the data lines on a side in the first direction. A subset of via holes among via holes through which the first dummy lines and the second dummy lines are electrically connected, overlaps one of the emission areas, and another subset via holes are disposed in a non-emission area between the emission areas.

Classes IPC  ?

• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
• G09G 3/3275 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] - Détails des circuits de commande pour les électrodes de données
• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• H10K 59/88 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure Éléments factices, c. à d. éléments ayant des caractéristiques non fonctionnelles

Abrégé

A display apparatus includes a light-emitting panel including a first substrate and a plurality of light-emitting devices disposed on the first substrate, and a color panel including a second substrate, a bank disposed on a lower surface of the second substrate in a direction to the first substrate and including a plurality of first openings each corresponding to emission areas of the plurality of light-emitting devices, a functional layer arranged in the plurality of first openings, a first protrusion pattern disposed on the bank, and a second protrusion pattern disposed on the bank. The first protrusion pattern is arranged between adjacent ones of the plurality of first openings, and the second protrusion pattern is spaced apart from the first protrusion pattern.

Classes IPC  ?

• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
• H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure

Abrégé

A display device includes: a display panel including a first light emitting area to emit a source light; a barrier wall on the display panel, and having a first opening corresponding to the first light emitting area; a first light control pattern in the first opening; and a light shielding pattern between the display panel and the barrier wall, and overlapping with the barrier wall and the first opening. The light shielding pattern overlaps with a portion of the first light control pattern.

Classes IPC  ?

• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure
• H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]

Abrégé

A display device includes: a substrate including a first non-folding portion, a second non-folding portion, and a folding portion therebetween; a support layer disposed under the substrate and including a plurality of first portions overlapping the first and second non-folding portions, respectively, and a second portion overlapping the folding portion; a plurality of transistors disposed on the substrate, and a plurality of light emitting elements disposed above the transistors and connected to the transistors. The second portion includes a plurality of rib portions disposed between recess portions defined in a lower surface of the second portion. The folding portion includes a plurality of first folding portions overlapping the recess portions and a plurality of second folding portions overlapping the rib portions in the plan view. The transistors are not disposed in the first folding portions.

Classes IPC  ?

• H10K 77/10 - Substrats, p. ex. substrats flexibles
• B32B 3/26 - Produits stratifiés caractérisés essentiellement par le fait qu'une des couches comporte des discontinuités ou des rugosités externes ou internes, ou bien qu'une des couches est de forme générale non plane; Produits stratifiés caractérisés essentiellement par des particularismes de forme caractérisés par une couche comportant des cavités ou des vides internes
• B32B 3/30 - Produits stratifiés caractérisés essentiellement par le fait qu'une des couches comporte des discontinuités ou des rugosités externes ou internes, ou bien qu'une des couches est de forme générale non plane; Produits stratifiés caractérisés essentiellement par des particularismes de forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p.ex. des gorges, des nervures
• B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
• B32B 17/06 - Produits stratifiés composés essentiellement d'une feuille de verre ou de fibres de verre, de scorie ou d'une substance similaire comprenant du verre comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
• H10K 59/121 - Affichages à OLED à matrice active [AMOLED] caractérisés par la géométrie ou la disposition des éléments de pixel

Abrégé

A display apparatus includes a substrate, a plurality of subpixels disposed over the substrate and including a red subpixel, a blue subpixel, and a green subpixel, an encapsulation layer over the plurality of subpixels, a light-blocking layer disposed over the encapsulation layer and including a plurality of openings respectively overlapping the plurality of subpixels, and a plurality of color filters disposed over the light-blocking layer and including a red color filter, a blue color filter, and a green color filter. The plurality of color filters include a repetitive arrangement structure of a color filter pattern unit block, the plurality of subpixels include a repetitive arrangement structure of a subpixel pattern unit block, and a size of the color filter pattern unit block is greater than a size of the subpixel pattern unit block.

Classes IPC  ?

• H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
• H10K 59/126 - Blindage, p. ex. moyens de blocage de la lumière sur les TFT
• H10K 59/35 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des sous-pixels rouge-vert-bleu [RVB]

Abrégé

A display device includes a display panel which displays an image, and a functional layer disposed below the display panel. The functional layer includes an adhesive layer disposed below the display panel, a first heat dissipation layer disposed below the adhesive layer, a cushion layer disposed below the first heat dissipation layer, and including a heat-conducting particle, and a second heat dissipation layer disposed below the cushion layer.

Classes IPC  ?

• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques

Abrégé

A display device includes: a first display area including a plurality of data lines extending in a first direction; a second display area at one side of the first display area, comprising a plurality of data lines shorter than the data lines of the first display area; a first non-display area adjacent to the first display area; and a second non-display area adjacent to the second display area, comprising a plurality of load matching units respectively connected to the plurality of data lines of the second display area and configured to compensate for load capacitance of the plurality of data lines of the second display area.

Classes IPC  ?

• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
• H10K 59/121 - Affichages à OLED à matrice active [AMOLED] caractérisés par la géométrie ou la disposition des éléments de pixel

Abrégé

A thin film transistor includes a substrate; an active layer including a channel area, a first conductive area, and a second conductive area; a gate insulating layer on a portion of the active layer; a first through hole penetrating through a portion of the first conductive area; a second through hole penetrating through a portion of the second conductive area; a gate electrode overlapping the channel area of the active layer; a first electrode electrically connected to the first conductive area; and a second electrode electrically connected to the second conductive area. One side of the first electrode adjacent to the first through hole is parallel to the one side of the first through hole, the first electrode including protrusion parts at both ends thereof and a groove part concavely recessed from the gate electrode.

Classes IPC  ?

• H10K 59/121 - Affichages à OLED à matrice active [AMOLED] caractérisés par la géométrie ou la disposition des éléments de pixel
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
• H10K 59/126 - Blindage, p. ex. moyens de blocage de la lumière sur les TFT
• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes

Abrégé

A display device includes a sub-pixel connected to a scan write line, a first data line, and a second data line. The sub-pixel includes a light emitting element, a first pixel driving unit configured to generate a control current according to a first data voltage of the first data line, a second pixel driving unit configured to generate a driving current applied to the light emitting element according to a second data voltage of the second data line, and a third pixel driving unit configured to apply the driving current to the light emitting element according to the control current of the first pixel driving unit. The first pixel driving unit includes a first transistor to generate the control current according to the first data voltage, a second transistor configured to apply the first data voltage of the first data line to a first electrode of the first transistor.

Classes IPC  ?

• G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
• G09G 3/00 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques

Abrégé

A display device includes a display panel, an input sensor disposed on the display panel and sensing an input during a sensing frame period, a display controller receiving a vertical synchronization signal and a horizontal synchronization signal and controlling driving of the display panel in response to the vertical synchronization signal and the horizontal synchronization signal, and a sensor controller providing a transmission signal including a plurality of sampling periods to the input sensor. The display controller provides frequency information of a display frame period to the sensor controller using at least one of the vertical synchronization signal and the horizontal synchronization signal, and the sensor controller controls the number of the sampling periods of the sensing frame period based on the frequency information.

Classes IPC  ?

• G09G 3/02 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques par traçage ou balayage d'un faisceau lumineux sur un écran

Abrégé

A display device includes a display panel including a plurality of pixels and that displays an image in each of a plurality of frames, a driving controller that drives the plurality of frames with a plurality of driving frequencies, respectively, and a voltage controller that provides a first voltage and a second voltage, and the driving controller drives one of the plurality of frames with a first driving frequency and drives another one of the plurality of frames with a second driving frequency, and the voltage controller provides the second voltage to be repeated in a first period in the one of the plurality of frames and provides the second voltage to be repeated in a second period in the another one of the plurality of frames.

Classes IPC  ?

• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent

Abrégé

A display device includes a light-emitting device disposed on a substrate and including an emission layer, and a light controller disposed on the light-emitting device. The light controller includes a plurality of main light blocking patterns extending in a first direction and spaced apart from each other in a second direction intersecting the first direction, and a plurality of sub-light blocking patterns disposed between adjacent ones of the plurality of main light blocking patterns, extending in the first direction, and spaced apart from each other in the second direction. Each of the plurality of main light blocking patterns has a first thickness in a thickness direction of the substrate, and each of the plurality of sub-light blocking patterns has a second thickness that is less than the first thickness in the thickness direction of the substrate.

Classes IPC  ?

• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure
• H10K 71/20 - Modification de la forme de la couche active dans les dispositifs, p. ex. mise en forme

Abrégé

A light emitting device may include a first electrode, a first light emitting stack disposed on the first electrode, a charge generation layer disposed on the first light emitting stack, a second light emitting stack disposed on the charge generation layer, and a second electrode disposed on the second light emitting stack. Each of the first light emitting stack and the second light emitting stack includes a hole transport layer. A hole mobility of the charge generation layer is lower than a hole mobility of the hole transport layer.

Classes IPC  ?

• H10K 50/13 - OLED ou diodes électroluminescentes polymères [PLED] caractérisées par les couches électroluminescentes [EL] spécialement adaptées à l'émission de lumière multicolore, p. ex. à l'émission de lumière blanche comprenant des couches EL empilées dans une unité EL
• H10K 50/15 - Couches de transport de trous
• H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure

Abrégé

A display device and a method of manufacturing the same are provided. The display device comprises a substrate comprising a display area in which emission areas are arranged, a main non-display area around the display area, a hole area surrounded by the display area, and an additional non-display area between the hole area and the display area; a circuit layer; a light emitting element layer; a sealing layer; a through portion in the hole area and penetrating at least the substrate; and sealing auxiliary structures in the additional non-display area and sequentially surrounding the hole area. Each of the sealing auxiliary structures comprises a first undercut portion in which a first cover layer protrudes from a first main layer; and a second undercut portion in which a second cover layer protrudes from a second main layer.

Classes IPC  ?

• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
• H10K 59/124 - Couches isolantes formées entre les éléments TFT et les éléments OLED

Abrégé

An apparatus for fabricating a display panel, including a film fixing module configured to fix a stretched film on which a plurality of light emitting elements are arranged, a film pressurizing module configured to pressurize the stretched film, a first thickness detection module configured to detect, at each pressurization step, a modulus of elasticity and a change in thickness of the stretched film that is pressurized and stretched by the film pressurizing module, a second thickness detection module configured to detect, at each pressurization step, a change in thickness of an adhesive applied in a front direction of the stretched film, an image detection module configured to photograph the plurality of light emitting elements arranged on the stretched film for each pressurization step and to detect a change in arrangement information of the light emitting elements, and a main processor configured to database feature change information.

Classes IPC  ?

• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

A display device includes: a display panel and an optical member positioned on the display panel. The optical member includes: a polarization layer positioned on the display panel; a first compensation layer positioned between the display panel and the polarization layer; a second compensation layer positioned between the display panel and the first compensation layer; a third compensation layer positioned between the display panel and the second compensation layer; and a fourth compensation layer positioned between the display panel and the third compensation layer. The first compensation layer is a positive C plate and a thickness direction phase delay value of the first compensation layer is about −65 nm to about −15 nm, and the second compensation layer is a positive A plate and an in-plane phase delay value of the second compensation layer is about 75 nm to about 125 nm.

Classes IPC  ?

• G02B 5/30 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques autres que les lentilles Éléments polarisants
• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure

Abrégé

A display device includes a substrate including a display area and a non-display area, a pixel located in the display area, a pad unit on one side of the non-display area, and a driver connected to the pixel. The pixel includes a first insulating layer, a first light emitting element on the first insulating layer, a second insulating layer on the first light emitting element and exposing one end portion and another end portion of the first light emitting element, a first contact electrode on the second insulating layer and connected to the one end portion of the first light emitting element, and a second contact electrode on the second insulating layer and connected to the other end portion of the first light emitting element. The pad unit includes a pad metal layer, a first pad insulating layer, a second pad insulating layer, and a pad electrode.

Classes IPC  ?

• H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
• G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
• H01L 33/20 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une forme particulière, p.ex. substrat incurvé ou tronqué
• H01L 33/38 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les électrodes ayant une forme particulière
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• H10K 59/179 - Interconnexions, p. ex. lignes de câblage ou bornes

Abrégé

A display device may include a display panel including first and second pixels respectively connected to first and second sensing lines, a sensing driver including a sensing channel shared by the first and the second sensing lines, and a controller configured to control the display panel and the sensing driver. The controller may be configured to, in a first time period, electrically disconnect the sensing channel from the first and the second sensing lines, and reflect electrical characteristics of the first and the second pixels in the first and the second sensing lines, respectively, as sensing voltages, and in a second time period, record the sensing voltages reflected in the first and the second sensing lines in the sensing channel by time-sharing.

Classes IPC  ?

• G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]

Abrégé

A driver includes first to Mth stages, where a first input signal and a second input signal are input to each of the first to Mth stages, and each of the first to Mth stages outputs a stage output signal, a first carry signal, and a second carry signal, where M is a natural number greater than or equal to 2. The first carry signal and the second carry signal output from a kth stage are the first input signal and the second input signal, which are input to a (k+1)th stage, respectively, where k is a natural number greater than or equal to 1 and less than M, and the first input signal and the second input signal, which are input to a first stage, are a first start signal and a second start signal which are alternately changed for predetermined frame times, respectively.

Classes IPC  ?

• G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice

Abrégé

A display device includes a display area, a non-display area, a pixel circuit including a thin film transistor, a gate driver in the non-display area for supplying a gate signal to the pixel circuit, a via layer above the pixel circuit and the gate driver, first and second electrodes above the via layer in the display area, and extending substantially in parallel with each other, a light-emitting element between the first electrode and the second electrode, a first contact electrode connected to one end of the light-emitting element, and a protective metal layer overlapping the gate driver, and including a first layer at a same layer as the first electrode and the second electrode, the first layer defining first holes, and a second layer at a same layer as the first contact electrode, at least partially filling the first holes, and contacting an upper surface of the via layer.

Classes IPC  ?

• H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
• H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides

Abrégé

A display device includes a substrate, a light emitting element layer disposed on the substrate and including a plurality of light emitting areas each including a light emitting element that emits light, an encapsulation layer disposed on the light emitting element layer, and a light control layer disposed on the encapsulation layer, wherein the light control layer includes a light transmitting film that transmits the light and a light blocking film that blocks the light, and the light transmitting film includes, a first light transmitting portion overlapping the light blocking film in a thickness direction of the substrate, and a plurality of second light transmitting portions each surrounded by the light blocking film, and a thickness of the light blocking film is greater than a thickness of the first light transmitting portion.

Classes IPC  ?

• H10K 59/65 - OLED intégrées avec des capteurs d'images inorganiques
• G06V 40/13 - Capteurs à cet effet
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
• H10K 59/126 - Blindage, p. ex. moyens de blocage de la lumière sur les TFT
• H10K 59/40 - OLED intégrées avec écrans tactiles

Abrégé

A thin-film transistor including an active layer disposed on a substrate and including a channel region, a source region connected to a side of the channel region, and a drain region connected to the other side of the channel region; a gate insulating layer on the channel region of the active layer; and a gate electrode on the gate insulating layer. A slope of each side surface of the gate electrode with respect to a boundary surface between the gate insulating layer and the gate electrode is an obtuse angle (a substantially obtuse angel). A slope of each side surface of the gate insulating layer with respect to the boundary surface between the gate insulating layer and the gate electrode is an obtuse angle (a substantially obtuse angel).

Classes IPC  ?

• H10K 59/124 - Couches isolantes formées entre les éléments TFT et les éléments OLED
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes

Abrégé

A display device includes a base layer, and a pixel layer disposed on the base layer. The pixel layer includes reference pixel units and photo-sensing elements. Each of the reference pixel units includes a first light-emitting element, a second light-emitting element, and a third light-emitting element. Each of the photo-sensing elements is interposed between two second light-emitting elements adjacent to each other in a first direction, and at least one of the first light-emitting element or the third light-emitting element includes a plurality of sub-light-emitting elements electrically connected to each other.

Classes IPC  ?

• H10K 59/65 - OLED intégrées avec des capteurs d'images inorganiques
• G06V 40/13 - Capteurs à cet effet
• H10K 59/35 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des sous-pixels rouge-vert-bleu [RVB]
• H10K 59/40 - OLED intégrées avec écrans tactiles

Abrégé

Provided are a light-emitting device including an organometallic compound represented by Formula 1, an electronic device including the light-emitting device, and the organometallic compound represented by Formula 1. The organometallic compound emits light having a maximum emission wavelength of about 500 nm to about 650 nm and has a 3MLCT (%) ratio greater than or equal to 16.0%. Provided are a light-emitting device including an organometallic compound represented by Formula 1, an electronic device including the light-emitting device, and the organometallic compound represented by Formula 1. The organometallic compound emits light having a maximum emission wavelength of about 500 nm to about 650 nm and has a 3MLCT (%) ratio greater than or equal to 16.0%.

Classes IPC  ?

• C07F 15/00 - Composés contenant des éléments des groupes 8, 9, 10 ou 18 de la classification périodique
• C09K 11/06 - Substances luminescentes, p.ex. électroluminescentes, chimiluminescentes contenant des substances organiques luminescentes
• H10K 50/11 - OLED ou diodes électroluminescentes polymères [PLED] caractérisées par les couches électroluminescentes [EL]
• H10K 50/16 - Couches de transport d'électrons
• H10K 50/18 - Couches de blocage des porteurs de charge
• H10K 50/82 - Cathodes
• H10K 85/30 - Composés de coordination

Abrégé

Provided are display panel manufacturing method and apparatus. The display panel manufacturing method includes detecting a machining target area of a bottom layer, removing an area, overlapping the machining target area, of a top layer, emitting a laser beam to the machining target area of the bottom layer to provide a bottom pattern from the machining target area, and providing a compensation pattern in the removed area of the top layer.

Classes IPC  ?

• H10K 71/60 - Formation de régions ou de couches conductrices, p. ex. d’électrodes
• B41M 5/00 - Procédés de reproduction ou méthodes de reproduction ou de marquage; Matériaux en feuilles utilisés à cet effet
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]

Abrégé

An apparatus for fabricating a display panel and a fabricating method of a display panel are provided. An apparatus for fabricating a display panel includes a loading module of a large-area fabricating substrate fabricated and separated into a plurality of display panels, a solvent application module configured to apply a metal bonding solvent onto the large-area fabricating substrate, and an element transfer module configured to transfer a plurality of light emitting elements or at least one integrated circuit onto the large-area fabricating substrate on which the metal bonding solvent is applied, and the loading module includes a groove type discharge path through which the metal bonding solvent applied by the solvent application module flows and is discharged.

Classes IPC  ?

• H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
• H01L 27/15 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants semi-conducteurs avec au moins une barrière de potentiel ou une barrière de surface, spécialement adaptés pour l'émission de lumière

Abrégé

A vapor chamber comprises a front surface member having a curvature, a rear surface member coupled to the front surface member, a wick disposed between the front surface member and the rear surface member, and a refrigerant at least partially filled between the front surface member and the rear surface member, wherein the rear surface member includes a plurality of bent areas.

Classes IPC  ?

• F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p.ex. tubes caloporteurs
• F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p.ex. tubes caloporteurs avec des tubes ayant une structure capillaire
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

An electronic device includes a sensor in which a sensing area and a peripheral area proximate to the sensing area are defined, and a sensor driver driving the sensor. The sensor includes first electrodes disposed in the sensing area and arranged along a first direction, and second electrodes arranged along a second direction intersecting the first direction. A boundary extending along the second direction is defined in the sensing area. The sensor driver simultaneously outputs a plurality of boundary transmit signals to a plurality of boundary electrodes disposed in a boundary area including the boundary among the plurality of first electrodes.

Classes IPC  ?

• G06F 3/044 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
• G06F 3/041 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction

Abrégé

A display device includes a data conductive layer including a first power line, a passivation layer with a first opening exposing the first power line, a via layer with a second opening partially overlapping the first opening, a pixel electrode on the via layer, a connection electrode in the first and second openings, a pixel-defining film with an opening overlapping the second opening, a light-emitting layer on the pixel-defining film, the pixel electrode and the connection electrode, and a common electrode connected to the first power line. The data conductive layer includes a data base layer, a data main metal layer, and a data capping layer, the first power line includes a wire connection structure, in which the data main metal layer is recessed from sides of the data capping layer, and the common electrode is connected to the data main metal layer in the wire connection structure.

Classes IPC  ?

• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords

Abrégé

A display device includes a substrate, first electrodes disposed on the substrate, a pixel defining film covering edges of the first electrodes, a spacer disposed on the pixel defining film and disposed between the first electrodes, an organic layer disposed on the first electrodes, the pixel defining film, and the spacer; and a second electrode disposed on the organic layer. The organic layer includes a first common layer and a second common layer continuously disposed on the first electrodes, and the first common layer, the second common layer, and the second electrode do not overlap the spacer.

Classes IPC  ?

• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
• H10K 59/00 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe
• H10K 59/12 - Affichages à OLED à matrice active [AMOLED]

Abrégé

A display device includes a substrate; an auxiliary electrode including metal layers stacked in an undercut structure; and a light-emitting element layer. The light-emitting element layer includes a second common layer; and a common electrode which extend to the non-emission area. A side surface of the auxiliary electrode includes a first bonding portion in contact with the second common layer, and a second bonding portion in contact with the common electrode. The auxiliary electrode includes a first side and a second side facing each other in one direction, and a third side and a fourth side facing each other in other direction crossing the one direction. The first bonding portion has a first width at a first point of the first side and has a second width smaller than the first width at a second point of the third side.

Classes IPC  ?

• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
• H10K 59/121 - Affichages à OLED à matrice active [AMOLED] caractérisés par la géométrie ou la disposition des éléments de pixel
• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure

Abrégé

A bonding apparatus includes: a chamber including a light transmission part configured to transmit light irradiated onto a substrate on which at least one chip is disposed; and a light generation part disposed on the chamber and configured to irradiate the light. The light transmission part may include an absorption prevention layer, in which a plurality of through-holes are defined, and a light diffusion layer that diffuses the light passing through the plurality of through-holes to reduce heat generation in the light transmission part and uniformly irradiate the light passing through the light transmission part onto the substrate on which at least one chip is disposed.

Classes IPC  ?

• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

A display device is provided. The display device includes a substrate including a display area and a pad area, which is disposed on one side of the display area, a plurality of conductive layers disposed on the substrate, in the display area and the pad area, a passivation layer disposed on the conductive layers, and a plurality of light-emitting elements disposed on the passivation layer, in the display area, and spaced apart from one another, wherein at least one of the conductive layers includes a first metal layer, a second metal layer, which is disposed on the first metal layer, and a third metal layer, which is disposed on the second metal layer, the first metal layer includes vanadium (V), the second metal layer includes aluminum (Al) or an Al alloy, and the third metal layer includes V or titanium (Ti).

Classes IPC  ?

• H10K 59/123 - Connexion des électrodes de pixel aux transistors à couches minces [TFT]
• H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
• H10K 59/121 - Affichages à OLED à matrice active [AMOLED] caractérisés par la géométrie ou la disposition des éléments de pixel

Abrégé

A display device is provided. The display device may include a substrate, a plurality of pixels, a first data line, a second data line, a defect sensing line, a first input pad, and a static electricity discharge element. The substrate may include a display area and a peripheral area neighboring each other. The plurality of pixels may be positioned on the display area and may include a first pixel and a second pixel. The first data line may be electrically connected to the first pixel. The second data line may be electrically connected to the second pixel and may be electrically isolated from the first data line. The defect sensing line may be positioned on the peripheral area. The first input pad may be electrically connected to the defect sensing line. The static electricity discharge element may be electrically connected through the defect sensing line to the first input pad.

Classes IPC  ?

• G09G 3/3258 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander la tension aux bornes de l'élément électroluminescent
• G09G 3/00 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques

Abrégé

A display device includes: a circuit layer including: demux circuits in a demux area of a non-display area and electrically connected between data lines and a display driving circuit; a first higher-priority output connection line electrically connected to a higher-priority output terminal of a first demux circuit from among the demux circuits, and extending to the display area; a first lower-priority output connection line electrically connected to a lower-priority output terminal of the first demux circuit, and extending to the display area; and a first input connection line electrically connected to an input terminal of the first demux circuit. One of the first higher-priority output connection line, the first lower-priority output connection line, or the first input connection line is included in the same conductive layer as that of the data lines, and the others are included in a conductive layer different from that of the data lines.

Classes IPC  ?

• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• H10K 59/88 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure Éléments factices, c. à d. éléments ayant des caractéristiques non fonctionnelles

Abrégé

A display device includes a substrate, a plurality of pixels positioned in a display area on the substrate, a plurality of transfer lines configured to transfer signals or voltages to the pixels, the plurality of transfer lines extending in a first direction and being spaced apart from each other in a second direction perpendicular to the first direction, and a plurality of auxiliary patterns in at least one of a plurality of gap spaces defined between ones of the transfer lines adjacent to each other in the second direction, wherein a group of at least two auxiliary patterns of the plurality of auxiliary patterns defines an auxiliary mark on the substrate.

Classes IPC  ?

• H10K 59/88 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure Éléments factices, c. à d. éléments ayant des caractéristiques non fonctionnelles
• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes

Abrégé

An input sensing device includes a sensor that includes a plurality of first electrodes and a plurality of second electrodes, and a sensor driver that operates in a first sensing mode and a second sensing mode. During the first sensing mode, the sensor driver generates a first sensing signal by transmitting transmission signals to the sensor and receiving reception signals from the sensor. During the second sensing mode, the sensor driver generates a second sensing signal by transmitting the transmission signals to the sensor and receiving the reception signals from the sensor. The sensor driver selects one of a plurality of compensation maps based on the first sensing signal, compensates for the second sensing signal based on the selected compensation map, and outputs the compensated sensing signal.

Classes IPC  ?

• G06F 3/041 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
• G06F 3/044 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs

Abrégé

A display apparatus includes: a first connection electrode layer on a substrate and comprising a horizontal connection line extending in a first direction; and a second connection electrode layer on the first connection electrode layer, comprising a vertical connection line extending in a second direction crossing the first direction and a driving voltage line extending in the second direction, the driving voltage line comprising a protrusion overlapping the horizontal connection line.

Classes IPC  ?

• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
• H10K 59/121 - Affichages à OLED à matrice active [AMOLED] caractérisés par la géométrie ou la disposition des éléments de pixel

Abrégé

A display device includes a pixel circuit on a substrate and including a transistor, a first pixel electrode on the pixel circuit and electrically connected to the pixel circuit, a bank on the first pixel electrode and including first, second, third, and fourth open parts, a first contact electrode on the bank and the first and second open parts and in contact with the first pixel electrode through the first open part, a second pixel electrode overlapping the second and third open parts, the second pixel electrode and the first pixel electrode formed as a same layer, a second contact electrode on the bank and the third and fourth open parts and in contact with the second pixel electrode through the third open part, and a common pixel electrode overlapping the fourth open part, the common pixel electrode and the second pixel electrode formed as a same layer.

Classes IPC  ?

• H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
• H10K 59/121 - Affichages à OLED à matrice active [AMOLED] caractérisés par la géométrie ou la disposition des éléments de pixel
• H10K 59/123 - Connexion des électrodes de pixel aux transistors à couches minces [TFT]
• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes

Abrégé

A display device includes first and second electrodes, light-emitting elements on the first and second electrodes, data lines extending from a pad area to a display area, connection wirings spaced apart from the data lines and extending from the pad area to a non-display area on respective sides of the display area, first pads overlapping the data lines in the pad area, and second pads overlapping the connection wirings, wherein the connection wirings include a first connection wiring overlapping a second pad, a second connection wiring not overlapping the second pad and overlapping the first connection wiring in the non-display area, and a third connection wiring overlapping the first connection wiring and electrically connected to the second pad, wherein the first and third connection wirings overlap each other in the pad area, and the first, second, and third connection wirings overlap each other in the non-display area.

Classes IPC  ?

• H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
• H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
• H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure

Abrégé

A pixel includes a first transistor coupled to a first node, a second transistor receiving a writing signal, a third transistor receiving a compensation signal, a first terminal coupled to the third node, and a second terminal coupled to a fourth node, a fourth transistor receiving an initialization signal, a first terminal coupled to the fourth node, and a second terminal coupled to an initialization voltage line, a fifth transistor receiving a first emission signal, a first terminal coupled to the first power supply voltage line, and a second terminal coupled to the second node, a light emitting element coupled to the third node and a second power supply voltage line, and an eighth transistor receiving a second emission signal, a first terminal coupled to the first node, and a second terminal coupled to the fourth node.

Classes IPC  ?

• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent

Abrégé

A window includes a window base with a groove having a recessed shape on an upper surface thereof, and a first blocking ink layer and a second blocking ink layer each disposed in the groove, where the first blocking ink layer and the second blocking ink layer are disposed in a same layer as each other, and the first blocking ink layer surrounds the second blocking ink layer in a plan view.

Classes IPC  ?

• G02B 5/00 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques autres que les lentilles

Abrégé

A pixel including: a light emitting element; a first transistor connected between a first power source and a second node; a first capacitor connected to a first node or a second node and a third node; a second transistor between the third node and a data line, the second transistor turned on by a first scan signal; a third transistor between the first and second nodes, the third transistor turned on by a second scan signal; a fifth transistor between the first power source and the first transistor, the fifth transistor turned on by a first emission control signal; a sixth transistor between the second node and the light emitting element, the sixth transistor turned on by a second emission control signal; and an eighth transistor between the second node and a second emission control line, the eighth transistor turned on by a fourth scan signal.

Classes IPC  ?

• G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
• G09G 3/3266 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] - Détails des circuits de commande pour les électrodes de balayage
• G09G 3/3275 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] - Détails des circuits de commande pour les électrodes de données

Abrégé

A display device includes: a display panel, a protective film disposed under a display panel, and an adhesive layer disposed between a display panel and the protective film. The adhesive layer includes: a base structure including a plurality of first unit structures and a plurality of second unit structures; and an adhesive material filling an inner space of a base structure. Each of first unit structures includes a first body, a second body in contact with a first body, and a first through-hole penetrating a side wall shared by a first body and a second body, and each of the second unit structures includes a third body, a fourth body in contact with a third body, and a second through-hole penetrating a side wall shared by a third body and a fourth body.

Classes IPC  ?

• H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure

Abrégé

A display device includes a display module, a support plate disposed under the display module and including a first support plate, a second support plate, and a plurality of support joints disposed between the first and second support plates, and a cover film disposed under the support plate and covering the support joints. The support joints are not attached to the cover film.

Classes IPC  ?

• G06F 1/16 - TRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES - Détails non couverts par les groupes et - Détails ou dispositions de structure
• H04M 1/02 - Caractéristiques de structure des appareils téléphoniques

Abrégé

A display panel includes a substrate including a display area and a peripheral area surrounding the display area, a display element arranged in the display area on the substrate, a voltage supply line arranged in the peripheral area on the substrate, where the voltage supply line is electrically connected to a portion of a common electrode of the display element extending to the peripheral area, and a conductive line embedded in the substrate and connected to the voltage supply line.

Classes IPC  ?

• H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes

Abrégé

Disclosed is an ultrasonic diagnostic apparatus including a probe including a plurality of elements provided to transmit an ultrasonic signal to an object and receive an echo signal reflected from the object, and at least one processor configured to modulate the echo signal based on comparing frequency characteristic data of the echo signal with pre-stored normal frequency characteristic data and amplify the modulated echo signal.

Classes IPC  ?

• A61B 8/08 - Détection de mouvements ou de changements organiques, p.ex. tumeurs, kystes, gonflements
• A61B 8/00 - Diagnostic utilisant des ondes ultrasonores, sonores ou infrasonores

Abrégé

Provided is an integrated circuit including a cell region in which a plurality of cells are arranged, and a peripheral region in which a circuit configured to control the plurality of cells is arranged, wherein the cell region further includes a plurality of first gate lines over a substrate, a plurality of first patterns in a first wiring layer above the plurality of first gate lines, a plurality of second patterns extending in a first horizontal direction in a backside wiring layer under the substrate, and a plurality of first vias, each of the plurality of first vias passing through the substrate in a vertical direction, wherein each of the plurality of first vias includes a top surface connected to a respective one of the plurality of first patterns and a bottom surface connected to a respective one of the plurality of second patterns.

Classes IPC  ?

• H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
• H10B 10/00 - Mémoires statiques à accès aléatoire [SRAM]

Abrégé

A method of a local bundle assistant (LBA) negotiating a certificate with a secondary platform bundle manager (SPBM) in a wireless communication system including: transmitting a request message requesting information of certificates supported by a secondary secure platform (SSP) to a secondary platform bundle loader (SPBL) of the SSP; receiving the information of certificates supported by the SSP including information of certificate issuers corresponding to a family identifier from the SPBL; transmitting the information of certificates supported by the SSP to the SPBM; and receiving a certificate of the SPBM for key agreement, information of public key identifiers of certificate issuers to be used by the SSP, and information of the family identifier from the SPBM.

Classes IPC  ?

• H04W 12/0431 - Distribution ou pré-distribution de clés; Mise en accord de clés
• H04L 9/08 - Répartition de clés
• H04L 9/32 - Dispositions pour les communications secrètes ou protégées; Protocoles réseaux de sécurité comprenant des moyens pour vérifier l'identité ou l'autorisation d'un utilisateur du système
• H04L 9/40 - Protocoles réseaux de sécurité
• H04W 12/06 - Authentification
• H04W 28/18 - Négociation des paramètres de télécommunication sans fil
• H04W 72/56 - Critères d’affectation ou de planification des ressources sans fil sur la base de critères de priorité

Abrégé

A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a lower electrode provided on a substrate, a buffer layer provided on the lower electrode and including first indium, an oxide semiconductor layer provided on the buffer layer and including second indium, a gate electrode provided apart from the oxide semiconductor layer, and an upper electrode provided on the oxide semiconductor layer, wherein a content of the first indium is greater than a content of the second indium.

Classes IPC  ?

• H01L 29/786 - Transistors à couche mince
• H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
• H01L 29/66 - Types de dispositifs semi-conducteurs

Abrégé

An electronic device including: a regulator circuit configured to output a regulated voltage based on a reference voltage and a feedback voltage; and an oscillator configured to generate an output frequency signal based on a reference frequency signal and the regulated voltage output from the regulator circuit, wherein the regulator circuit includes: a feedback loop configured to output the regulated voltage based on a difference between the reference voltage and the feedback voltage; a first capacitor; a precharge circuit connected to the feedback loop, and configured to charge the first capacitor with a second voltage which is based on a first voltage; a first switch configured to connect the precharge circuit with the first capacitor; and a second switch configured to connect the first capacitor with the feedback loop.

Classes IPC  ?

• G06F 1/26 - Alimentation en énergie électrique, p.ex. régulation à cet effet
• G05F 1/56 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final
• G06F 1/04 - Génération ou distribution de signaux d'horloge ou de signaux dérivés directement de ceux-ci
• H03K 3/037 - Circuits bistables

Abrégé

A stretchable strain sensor includes a light-emitting element, an optical structure, and a photo-detective element. The stretchable strain sensor is located in a path of light emitted from the light-emitting element. The optical structure is configured to have optical properties that change in response to stretching of at least a portion of the stretchable strain sensor. The photo-detective element is configured to detect light transmitted through the optical structure or reflected through the optical structure.

Classes IPC  ?

• G01L 1/24 - Mesure des forces ou des contraintes, en général en mesurant les variations des propriétés optiques du matériau quand il est soumis à une contrainte, p.ex. par l'analyse des contraintes par photo-élasticité
• G01B 11/16 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la déformation dans un solide, p.ex. indicateur optique de déformation
• G01L 11/02 - Mesure de la pression permanente, ou quasi permanente d'un fluide ou d'un matériau solide fluent par des moyens non prévus dans les groupes ou par des moyens optiques

Abrégé

The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transmission rate. A method and a device of measurement reporting related to user experience, and a method performed by a first node in a wireless communication network are provided. The method includes receiving, from a third node, third information, and receiving, from a second node, fifth information. The fifth information includes at least one of configuration information of a radio bearer, configuration information of a radio bearer carrying a measurement report, configuration information of a signaling radio bearer (SRB), configuration information related to a measurement, configuration information related to a duration, or information for requesting or indicating the duration. The third information includes information on at least one measured cell.

Classes IPC  ?

• H04W 24/10 - Planification des comptes-rendus de mesures

Abrégé

The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transmission rate. A method performed by a user equipment (UE) in a wireless communication system is provided. The method includes receiving, from a base station, configuration information associated with a sidelink (SL) listen-before-talk (LBT) failure recovery, identifying a counter value associated with the SL LBT failure detection, based on an SL LBT failure indication received from a lower layer, and in a case where the counter value is greater than or equal to a threshold value, triggering the SL consistent LBT failure.

Classes IPC  ?

• H04W 74/08 - Accès non planifié, p.ex. accès aléatoire, ALOHA ou accès multiple par détection de porteuse [CSMA Carrier Sense Multiple Access]

Abrégé

To control tension of a string of a tension control apparatus, a target operation mode of the tension control apparatus may be received, a first tension value may be generated by measuring tension of a string connected to a sensor using the sensor, a first control signal for controlling a motor connected to the string may be generated based on the first tension value and the target operation mode, and tension of the string may be controlled by controlling the motor based on the first control signal.

Classes IPC  ?

• A63B 21/005 - Appareils de gymnastique pour développer ou fortifier les muscles ou les articulations du corps en surmontant des résistances, avec ou sans dispositifs de mesure utilisant des dispositifs résistants électromagnétiques ou électriques
• A63B 21/00 - Appareils de gymnastique pour développer ou fortifier les muscles ou les articulations du corps en surmontant des résistances, avec ou sans dispositifs de mesure
• A63B 24/00 - Commandes électriques ou électroniques pour les appareils d'exercice des groupes

Abrégé

The disclosure relates to a method for performing conditional handover (CHO) for a group of user equipment's (UE) connected to a moving node. The method comprises determining, by a source node, whether a conditional handover (CHO) is configured for the moving node, transmitting, by the source node, a conditional handover request message along with information to one or more target nodes based on the determination, wherein the information indicates a number of a plurality of user equipment (UEs) and the associated capability of each of the plurality of user equipments (UEs) in the group of UEs connected to the moving node, determining whether the one or more target nodes support the conditional handover for the moving node based on the received information, and performing the conditional handover for the moving node based on the determination, wherein performing the conditional handover for the moving node also comprises performing the handover for the group of UEs connected to the moving node.

Classes IPC  ?

• H04W 36/36 - Contrôle de resélection par un équipement d'abonné ou un équipement terminal
• H04W 36/00 - Dispositions pour le transfert ou la resélection
• H04W 36/08 - Resélection d'un point d'accès
• H04W 76/20 - Gestion de connexions établies

Abrégé

Apparatuses and methods for codebook subset restriction for coherent joint transmission in wireless networks. A method includes receiving information about a channel state information (CSI) report associated with NTRP>1 groups of antenna ports. The information indicates (i) a coherent joint transmission (CJT) codebook, (ii) a rank restriction, and (iii) NTRP codebook subset restrictions (CBSRs). The method further includes identifying, based on the rank restriction, a set S1 of one or more rank values allowed for the CSI report; identifying, based on the NTRP CBSRs, sets S2,1, . . . , S2,NTRP; determining the CSI report associated with the NTRP groups of antenna ports based on the CJT codebook, the set S1, and the sets S2,1, . . . , S2,NTRP; and transmitting the CSI report. For n=1, . . . , NTRP, the set S2,n is associated with n-th groups of antenna ports of the NTRP groups of antenna ports. The set S2,n includes spatial-domain (SD) basis vectors that are allowed for the CSI report.

Classes IPC  ?

• H04B 7/06 - Systèmes de diversité; Systèmes à plusieurs antennes, c. à d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission

Abrégé

A system and a method for determining semantic points in a human-to-human conversation is provided. The method includes identifying the human-to-human conversation including a plurality of dialogue turns and determining natural language (NL) attributes form each dialogue turn. Further, the method includes deriving a transient state, based on the one or more NL attributes. Further, the method includes deriving one or more conversation nuances associated with the human-to-human conversation based on the one or more NL attributes. Moreover, the method includes dynamically storing information associated with the human-to-human conversation based on the one or more NL attributes, the transient state, and the one or more conversation nuances associated with each dialogue turn and determining one or more semantic relations and associated dialogue timelines within the human-to-human conversation based on the dynamically stored information. Additionally, the method includes generating semantic points corresponding to the determined one or more semantic relations and the associated dialogue timelines within the human-to-human conversation.

Classes IPC  ?

• G06F 40/35 - Représentation du discours ou du dialogue
• G06F 40/166 - Traitement de texte Édition, p.ex. insertion ou suppression

Abrégé

A fine dust measurement module includes a fluid inlet through which a fluid including fine dust is introduced, a first channel through which first fine dust having at least a first diameter, among the fine dust introduced into the fluid inlet, passes, a second channel through which second fine dust having a second diameter that is less than the first diameter, among the fine dust introduced into the fluid inlet, passes, a fine dust detection sensor for sensing fine dust flowing into the second channel, a heater above the fine dust detection sensor, and an orifice upstream of a flow of the second fine dust from the fine dust detection sensor and the heater.

Classes IPC  ?

• G01N 15/02 - Recherche de la dimension ou de la distribution des dimensions des particules
• G01N 15/06 - Recherche de la concentration des suspensions de particules

Abrégé

A generalized low-density parity-check (G-LDPC) encoder, including a plurality of generalized constraint (GC) encoders configured to perform a plurality of GC encoding operations in parallel based on a GC code having a quasi-cyclic (QC) structure including information variable nodes, inner parity variable nodes, and super check nodes configured to perform multiple condition checks, wherein each GC encoder of the plurality of GC encoders includes a plurality of first logic circuits configured to perform a GC encoding operation of the plurality of GC encoding operations; and an LDPC encoder configured to perform an LDPC encoding operation based on an LDPC code having the QC structure, wherein the LDPC encoder includes a plurality of single check nodes configured to perform a single parity check, wherein the each GC encoder is configured to receive information bits, and to determine parity bits of a portion of inner parity bits corresponding to the information bits by enabling only a portion of the plurality of first logic circuits to perform the GC encoding operation, and wherein the LDPC encoder is configured to: obtain the inner parity bits by combining the parity bits obtained from the plurality of GC encoders, determine outer parity bits corresponding to the information bits and the inner parity bits by performing the LDPC encoding operation, and output the information bits, the inner parity bits, and the outer parity bits as a codeword.

Classes IPC  ?

• H03M 13/11 - Détection d'erreurs ou correction d'erreurs transmises par redondance dans la représentation des données, c.à d. mots de code contenant plus de chiffres que les mots source utilisant un codage par blocs, c.à d. un nombre prédéterminé de bits de contrôle ajouté à un nombre prédéterminé de bits d'information utilisant plusieurs bits de parité

Abrégé

An electronic device is provided. The electronic device includes a hinge housing extending in a direction of a rotational axis, a first housing connected to one side of the hinge housing in a direction perpendicular to the rotational axis to rotate about the rotational axis relative to the hinge housing, a second housing connected to an opposite side of the hinge housing in a direction perpendicular to the rotational axis to rotate about the rotational axis relative to the hinge housing, and a flexible display including a bending area at least partially disposed in the hinge housing and formed to be a flat surface or a curved surface, a first area extending from the bending area in one direction perpendicular to the rotational axis, and a second area extending from the bending area in an opposite direction perpendicular to the rotational axis.

Classes IPC  ?

• H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques
• H04M 1/02 - Caractéristiques de structure des appareils téléphoniques
• H04M 1/18 - Appareils téléphoniques spécialement adaptés à la marine, les mines ou d'autres endroits exposés aux dangers d'environnement
• H05K 5/02 - Enveloppes, coffrets ou tiroirs pour appareils électriques - Détails

Abrégé

A semiconductor package includes a package substrate, an interposer mounted on the package substrate via first conductive bumps; first and second semiconductor devices on the interposer and spaced apart from each other, mounted on the interposer via second conductive bumps and having concavo-convex patterns respectively formed in upper surfaces thereof; and a sealing member on the interposer covering the first and second semiconductor devices and exposing the concavo-convex patterns. The concavo-convex pattern of the first semiconductor device includes a plurality of first pillar structures provided in the upper surface of a first region of the first semiconductor device and having a first width, and a plurality of second pillar structures provided in the upper surface of a second region of the first semiconductor device and having a second width greater than the first width.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
• H01L 23/367 - Refroidissement facilité par la forme du dispositif
• H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

A semiconductor memory device may include a cell substrate; a mold structure including a plurality of gate electrodes stacked on the cell substrate; a channel structure penetrating the mold structure; a string select line on the mold structure; a string select channel structure penetrating the string select line and contacting the channel structure; an anti-arcing contact penetrating the mold structure; an insulating pattern between the anti-arcing contact and the plurality of gate electrodes; and an anti-arcing insulating pattern penetrating the string select line to be in contact with the anti-arcing contact.

Classes IPC  ?

• G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p.ex. FAMOS
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H10B 41/10 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la configuration vue du dessus
• H10B 41/27 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
• H10B 41/35 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région noyau de mémoire avec un transistor de sélection de cellules, p.ex. NON-ET
• H10B 41/40 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région de circuit périphérique
• H10B 43/10 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la configuration vue du dessus
• H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
• H10B 43/35 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région noyau de mémoire avec transistors de sélection de cellules, p.ex. NON-ET
• H10B 43/40 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région de circuit périphérique
• H10B 80/00 - Ensembles de plusieurs dispositifs comprenant au moins un dispositif de mémoire couvert par la présente sous-classe

Abrégé

A method of providing information related to placing an object in a space includes obtaining three-dimensional spatial data corresponding to the space and object-related data for first objects in the space, obtaining a spatial graph including positional relations between the first objects in the space, based on the three-dimensional spatial data and the object-related data, receiving a user input for changing an object placement in the space, based on the user input, adding, to the spatial graph, an empty node representing a second object to be placed in an empty region in the space in which the first objects are not placed, updating the spatial graph by applying, to a graph neural network (GNN), the spatial graph to which the empty node has been added, and outputting object placement change-related information for the space, based on the updated spatial graph.

Classes IPC  ?

• G06T 19/20 - Transformation de modèles ou d'images tridimensionnels [3D] pour infographie Édition d'images tridimensionnelles [3D], p.ex. modification de formes ou de couleurs, alignement d'objets ou positionnements de parties
• G06T 7/13 - Détection de bords
• G06T 7/73 - Détermination de la position ou de l'orientation des objets ou des caméras utilisant des procédés basés sur les caractéristiques

Abrégé

An electronic device includes: a hinge structure; a first housing connected to the hinge structure and including a first surface and a second surface; a second housing connected to the hinge structure and including a third surface and a fourth surface; a flexible display; a touch sensor; memory; and a processor, wherein the memory stores instructions configured to cause, when executed by the processor, the electronic device to, identify first coordinate information of at least one object on a first area of the flexible display and second coordinate information of the at least one object on a second area of the flexible display by using the touch sensor; and on the basis of the identified first coordinate information and the identified second coordinate information, identify three-dimensional coordinate information of the at least one object in the space formed by the first surface and the third surface.

Classes IPC  ?

• G06F 3/041 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
• G06F 1/16 - TRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES - Détails non couverts par les groupes et - Détails ou dispositions de structure

Abrégé

A semiconductor design optimization system that includes: a data base configured to store design data, a training data preprocessing unit configured to preprocess the design data and generate training data, a data learning unit configured to generate a physical property prediction model by training using the training data, a physical property prediction unit configured to generate predicted physical property data including information associated with predicted physical property values for each region of a semiconductor device to be fabricated, wherein the physical property prediction unit is configured to input, into the physical property prediction model, input data including information associated with design drawings of the semiconductor device to be fabricated, and a layout generator configured generate a design layout optimized to distribute the predicted physical property values for each region of the semiconductor device to be fabricated by modifying the design drawings based on the predicted physical property data.

Classes IPC  ?

• G06F 30/392 - Conception de plans ou d’agencements, p.ex. partitionnement ou positionnement
• G06N 20/00 - Apprentissage automatique

Abrégé

A semiconductor memory device according to the present inventive concept includes: a semiconductor substrate; a common source semiconductor layer doped with impurities of a first conductivity type on the semiconductor substrate; a plurality of insulating layers and a plurality of word line structures alternately stacked on the common source semiconductor layer; and a memory cell dielectric layer penetrating the plurality of insulating layers and the plurality of word line structures and covering an internal wall of a channel hole extending in a vertical direction, and a memory cell structure filling the channel hole. The memory cell structure includes a channel layer, which has the memory cell dielectric layer thereon and fills at least a portion of the channel hole, and a drain layer covering an upper surface of the channel layer, doped with impurities of a second conductivity type, and filling some of an upper portion of the channel hole.

Classes IPC  ?

• G11C 11/402 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors formant des cellules nécessitant un rafraîchissement ou une régénération de la charge, c. à d. cellules dynamiques avec régénération de la charge propre à chaque cellule de mémoire, c. à d. rafraîchissement interne
• G11C 11/39 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliers; Eléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des thyristors
• H01L 27/102 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration répétitive comprenant des composants bipolaires
• H01L 29/66 - Types de dispositifs semi-conducteurs
• H01L 29/749 - Dispositifs du type thyristor, p.ex. avec un fonctionnement par régénération à quatre zones amorcés par effet de champ

Abrégé

Disclosed is a method for programming a storage device including a nonvolatile memory device and a storage controller for storing multi-bit data, programming, by the storage controller, the multi-bit data into the nonvolatile memory device based on a pre-programming operation, reading state group data of the multi-bit data generated in the nonvolatile memory device based on a program result of the pre-programming operation, and performing, by the storage controller, error correction decoding on the state group data.

Classes IPC  ?

• G11C 29/52 - Protection du contenu des mémoires; Détection d'erreurs dans le contenu des mémoires
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 16/34 - Détermination de l'état de programmation, p.ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention

Abrégé

An apparatus including a receiver and a processor configured to generate a modulus switch ciphertext by performing modulus switching with respect to data received by the receiver, the modulus switching including mapping a component of an input ciphertext generated from the received data to an odd number, generate a blind rotated ciphertext by performing a blind rotation operation based on the modulus switched ciphertext, and generate encrypted data, as a homomorphic encryption operation result, by performing key switching based on the blind rotated ciphertext.

Classes IPC  ?

• H04L 9/00 - Dispositions pour les communications secrètes ou protégées; Protocoles réseaux de sécurité
• H04L 9/06 - Dispositions pour les communications secrètes ou protégées; Protocoles réseaux de sécurité l'appareil de chiffrement utilisant des registres à décalage ou des mémoires pour le codage par blocs, p.ex. système DES

Abrégé

An electronic device includes a display; a conductive plate supporting the display; a bracket including a surface and a structure at least partially removed from the surface, wherein the surface faces toward the conductive plate and is spaced apart from the conductive plate; a connecting member crossing the structure along the surface and connecting the conductive plate and the bracket, the connecting member including a first conductive portion and a second conductive portion; and a conductive tape between the connecting member and the bracket, wherein the first conductive portion overlaps with the structure when viewed from a first direction toward the display and is at least partially inserted into the structure, at least part of the first conductive portion contacts the conductive plate, and the second conductive portion extends from the first conductive portion along a surface of the bracket and has an end attached to the bracket through the conductive tape.

Classes IPC  ?

• G06F 1/16 - TRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES - Détails non couverts par les groupes et - Détails ou dispositions de structure

Abrégé

Method and apparatuses for channel state information (CSI) reporting based on a window of basis vectors are provided. A method includes receiving a configuration about a CSI report including information about NTRP non-zero power (NZP) CSI-reference signal (RS) resources, where NTRP≥1, and a parameter codebookType set to type-II-CJT-r18 or type-II-PortSelection-CJT-r18. The method further includes determining, for each layer l=1, . . . , v, an indicator for indicating an index of a strongest coefficient among KlNZ coefficients, where KlNZ is a total number of non-zero coefficients that are associated with Z NZP CSI-RS resources and Z≤NTRP, and a number of bits Pl for the indicator. The method further includes transmitting the CSI report including, for each layer, Pl bits for the indicator. When codebookType=type-II-CJT-r18, a value of Pl depends on a value of KlNZ or a value of Σr=1Z Lr. When codebookType=type-II-PortSelection-CJT-r18, the value of Pl depends on a value of 2Mv Σr=1Z Lr.

Classes IPC  ?

• H04L 5/00 - Dispositions destinées à permettre l'usage multiple de la voie de transmission
• H04B 7/06 - Systèmes de diversité; Systèmes à plusieurs antennes, c. à d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission

Abrégé

The disclosure provides a method of supporting communication by using a satellite in a wireless communication system including transmitting, by a user equipment (UE), a registration request message for accessing a public land mobile network (PLMN) to an access and mobility management function (AMF) through a satellite radio access network (RAN), receiving, by the UE, a registration reject message from the AMF through the satellite RAN in response to the transmitted registration request message, and storing the PLMN in a PLMN list not allowed in a current location of the UE based on a cause value included in the received registration reject message.

Classes IPC  ?

• H04W 60/04 - Rattachement à un réseau, p.ex. enregistrement; Suppression du rattachement à un réseau, p.ex. annulation de l'enregistrement utilisant des événements déclenchés
• H04W 48/16 - Exploration; Traitement d'informations sur les restrictions d'accès ou les accès

Abrégé

A method for manufacturing a semiconductor device, including forming a step key on a substrate, forming a mold layer on the step key covering the step key, forming a first mask layer on the mold layer, forming a transparent layer in the first mask layer overlapping the step key, forming a second mask layer on the first mask layer and the transparent layer, etching the mold layer using the second mask layer, wherein the first mask layer includes a metal material.

Classes IPC  ?

• H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques
• G03F 7/00 - Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
• H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p.ex. marques de repérage, schémas de test
• H10B 12/00 - Mémoires dynamiques à accès aléatoire [DRAM]
• H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U

Abrégé

An image sensor includes a substrate having a plurality of first pixel regions configured to generate image information and a plurality of second pixel regions configured to detect phase information, a grid pattern on the substrate and dividing a plurality of spaces corresponding to each of the plurality of first pixel regions and the plurality of second pixel regions. The image sensor also includes a plurality of color filters respectively in first spaces of the plurality of spaces, excluding second spaces corresponding to the plurality of second pixel regions, a plurality of polarization patterns respectively in the second spaces and partitioning the second spaces, and a microlens layer including a plurality of first microlenses respectively on the plurality of color filters.

Classes IPC  ?

• H01L 27/146 - Structures de capteurs d'images

Abrégé

Certain example embodiments relate to a method for selecting wireless ridelity (Wi-Fi) channel for mitigating and/or reducing interference, wherein the method may detect the presence of nearby access points and determine the number of access points by an access point detector module. The method may determine the minimum value of received signal strength indicator (RSSI) by the access point detector module, and may determine the congestion information from the nearby devices by a peer congestion observer module. Furthermore, the method may calculate at least one weighted parameter and select a preferred channel to create a hotspot for communication by a channel selector module.

Classes IPC  ?

• H04W 28/02 - Gestion du trafic, p.ex. régulation de flux ou d'encombrement

Abrégé

Disclosed is a memory device that includes a memory cell array having a plurality of memory blocks, a sense amplifier connected to the plurality of memory blocks and configured to perform an offset compensating operation in response to an offset compensation signal, and an offset time adjustment circuit connected to the sense amplifier and configured to adjust an execution time of the offset compensating operation based on a comparison result of a voltage at an equalization voltage node and a reference offset voltage.

Classes IPC  ?

• G11C 7/06 - Amplificateurs de lecture; Circuits associés
• G11C 5/14 - Dispositions pour l'alimentation
• G11C 7/22 - Circuits de synchronisation ou d'horloge pour la lecture-écriture [R-W]; Générateurs ou gestion de signaux de commande pour la lecture-écriture [R-W]

Abrégé

An electronic device according to various embodiments of the present invention may comprise: a housing comprising a first surface facing in a first direction and a second surface facing in a second direction that is opposite to the first direction, the first surface comprising an at least partially transparent part and at least one opening formed adjacent to the at least partially transparent part; a camera positioned inside the housing, the camera comprising an image sensor facing in the first direction through the at least partially transparent part of the housing; and an acoustic component arranged between the first surface and the second surface, the acoustic component comprising a vibration plate configured to generate a sound such that the same moves in at least one direction selected from the first and second directions, a first passage formed in a third direction that is substantially perpendicular to the first direction such that the generated sound passes through the same, and a second passage formed along a fourth direction that is different from the third direction so as to connect the first passage and the at least one opening; a wireless communication circuit positioned inside the housing and electrically connected to the acoustic component so as to provide the acoustic component with a signal regarding the sound; a display exposed through the first surface and positioned adjacent to the camera; and a processor positioned inside the housing and electrically connected to the camera, the acoustic component, the wireless communication circuit, and the display. Various other embodiments are also possible.

Classes IPC  ?

• H04R 1/02 - Boîtiers; Meubles; Montages à l'intérieur de ceux-ci
• H04M 1/03 - Caractéristiques de structure des microphones ou écouteurs, p.ex. appareils téléphoniques portatifs
• H04N 23/54 - Montage de tubes analyseurs, de capteurs d'images électroniques, de bobines de déviation ou de focalisation
• H04R 1/34 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en utilisant un seul transducteur avec des moyens réfléchissant, diffractant, dirigeant ou guidant des sons
• H04R 3/00 - Circuits pour transducteurs

Abrégé

Apparatuses and methods for enhancement to standalone operation for higher frequency range in a wireless communication system. A method includes receiving a synchronization signals and physical broadcast channel (SS/PBCH) block and determining a set of configurations for a control resource set (CORESET#0) to receive a TypeO physical downlink control channel (Type0-PDCCH). The set of configurations includes a multiplexing pattern between the CORESET#0 and the SS/PBCH block; a number NRRBCORESET#0 of resource blocks (RBs) for the CORESET#0; a number NsymbolCORESET#0 of symbols for the CORESET#0; and a frequency offset between the CORESET#0 and the SS/PBCH block. For a first multiplexing pattern between the CORESET#0 and the SS/PBCH block, the frequency offset between the CORESET#0 and the SS/PBCH block is determined as one of 0, NRBCORESET#0−NRBSSB, or (NRBCORESET#0−NRBSSB)/2. The method further includes receiving the Type0-PDCCH based on the set of configurations for the CORESET#0 over a downlink channel.

Classes IPC  ?

• H04W 72/23 - Canaux de commande ou signalisation pour la gestion des ressources dans le sens descendant de la liaison sans fil, c. à d. en direction du terminal
• H04L 5/00 - Dispositions destinées à permettre l'usage multiple de la voie de transmission

Abrégé

A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a transparent substrate on the semiconductor chip, a dam structure between the semiconductor chip and the transparent substrate, a dummy pad on a lower side of the dam structure and to which no wiring is connected, a planarization film extending along an upper surface of the semiconductor chip and a passivation film on the planarization film, wherein the planarization film is spaced apart from the dam structure.

Classes IPC  ?

• H01L 27/146 - Structures de capteurs d'images
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

Provided is a method of updating a firmware of a vacuum cleaner including a station and a cleaner body. The method includes receiving, by the cleaner body, a firmware update condition check request from the station when a new version of the firmware exists, checking, by the cleaner body, whether firmware update conditions have been satisfied, transmitting, by the cleaner body, a result of the checking to the station, and when the firmware update conditions are satisfied and a user agrees to update the firmware, receiving, by the cleaner body, the new version of the firmware, and installing, by the cleaner body, the received new version of the firmware. The firmware update conditions include at least one of a communication condition, a location condition, or a battery condition of the cleaner body.

Classes IPC  ?

• G06F 8/65 - Mises à jour
• A47L 9/00 - LAVAGE OU NETTOYAGE DOMESTIQUE; ASPIRATEURS EN GÉNÉRAL - Parties constitutives ou accessoires des aspirateurs, p.ex. moyens mécaniques pour commander l'aspiration ou pour entraîner une action de battement; Dispositifs de rangement spécialement conçus pour les aspirateurs ou les pièces de ceux-ci; Véhicules porteurs spécialement conçus pour les aspirateurs
• A47L 9/28 - Montage de l'équipement électrique, p.ex. adaptation ou fixation à l'aspirateur; Commande des aspirateurs par des moyens électriques
• G06F 9/451 - Dispositions d’exécution pour interfaces utilisateur

Abrégé

An electronic apparatus includes: one or more processors are configured to: display a list comprising (i) a first group that includes one or more first graphic user interface (GUI) items and (ii) a second group that includes one or more second GUI items, display a title of the first group on at least one of an upper end or a lower end of a display of the one or more first GUI items on the display, display a title of the second group on at least one of an upper end or a lower end of a display of the second group on the display, and display a modified title of one of the first group and the second group by changing a title width of at least one of the first group or the second group on the display.

Classes IPC  ?

• G06F 3/0482 - Interaction avec des listes d’éléments sélectionnables, p.ex. des menus
• G06F 3/04845 - Techniques d’interaction fondées sur les interfaces utilisateur graphiques [GUI] pour la commande de fonctions ou d’opérations spécifiques, p.ex. sélection ou transformation d’un objet, d’une image ou d’un élément de texte affiché, détermination d’une valeur de paramètre ou sélection d’une plage de valeurs pour la transformation d’images, p.ex. glissement, rotation, agrandissement ou changement de couleur
• G06F 3/0485 - Défilement ou défilement panoramique

Abrégé

A substrate treating apparatus includes a chamber having a gate through which a substrate is loaded into the chamber and unloaded from the chamber, a gas supply unit in an upper portion in the chamber and configured to supply gas into the chamber, a spin coater in a lower portion in the chamber and including a spin chuck configured to support and rotate the substrate on an upper surface thereof and a cup portion extending around the substrate and configured to collect and discharge a chemical liquid from the substrate, a chemical liquid supply unit configured to supply a chemical liquid onto the substrate, and a heater between the substrate and the gas supply unit and configured to heat the substrate.

Classes IPC  ?

• G03F 7/16 - Procédés de couchage; Appareillages à cet effet

Abrégé

A system may include a receiver to receive a task. The task may include a portion of an algorithm, and may include a task power level and a task precision. The system may also include a circuit including a circuit power level and a circuit precision. The system may include first software to identify the circuit, and second software to assign the task to the circuit to reduce total power. The circuit precision may be greater than the task precision.

Classes IPC  ?

• G06F 9/50 - Allocation de ressources, p.ex. de l'unité centrale de traitement [UCT]
• G06F 1/3228 - Surveillance d’exécution de tâches, p.ex. par utilisation de temporisations d’attente, de commandes d’arrêt ou de commandes d’attente
• G06F 1/329 - Gestion de l’alimentation, c. à d. passage en mode d’économie d’énergie amorcé par événements Économie d’énergie caractérisée par l'action entreprise par planification de tâches
• G06F 9/30 - Dispositions pour exécuter des instructions machines, p.ex. décodage d'instructions
• G06F 9/38 - Exécution simultanée d'instructions
• G06F 9/48 - Lancement de programmes; Commutation de programmes, p.ex. par interruption

Abrégé

Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a base semiconductor chip, a chip structure on the base semiconductor chip, a connection terminal between the base semiconductor chip and the chip structure, and a molding layer surrounding the chip structure and the connection terminal. The chip structure includes a first semiconductor chip including a first frontside pad and a first backside pad, and a second semiconductor including a second frontside pad and a second backside pad. A lateral surface of the first semiconductor chip is aligned with that of the second semiconductor chip. The first backside pad and the second frontside pad partially overlap each other when viewed in plan while being in direct contact with each other. The first backside pad and the second frontside pad include the same metal and are formed into a single unitary piece.

Classes IPC  ?

• H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
• H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

A semiconductor device includes: a substrate including an upper surface and a lower surface opposite to the upper surface; an active pattern disposed on the upper surface of the substrate and extending in a first direction; a field insulating film disposed on the upper surface of the substrate and covering a sidewall of the active pattern; a power rail disposed on the lower surface of the substrate and extending in the first direction; a trench formed in the substrate and exposing a portion of the power rail; and a metal pattern filling at least a portion of the trench and connected to the power rail, wherein a bottom surface of the trench is substantially coplanar with the lower surface of the substrate, wherein a sidewall of the trench has a convex shape, and wherein at least a portion of the field insulating film is disposed in the trench.

Classes IPC  ?

• H01L 23/528 - Configuration de la structure d'interconnexion
• H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
• H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
• H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
• H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
• H01L 29/775 - Transistors à effet de champ avec un canal à gaz de porteurs de charge à une dimension, p.ex. FET à fil quantique

Abrégé

One embodiment provides a computer-implemented method that includes receiving content having a first resolution. The processor splits the content into most significant bits and least significant bits. The processor further performs processing of the most significant bits of the content while preserving the least significant bits. The processor additionally performs a linear combination of outputs of the processing of the most significant bits with the preserved least significant bits for improving quality of the content.

Classes IPC  ?

• G06T 5/00 - Amélioration ou restauration d'image
• G06T 3/40 - Changement d'échelle d'une image entière ou d'une partie d'image

Abrégé

Provided is a method, performed by a server, of providing a personalized spatial map, the method comprising: obtaining a first spatial map including first map features representing spatial information about a space; obtaining a second spatial map based on sensor data obtained by measuring the space, the second spatial map including second map features; identifying third map features for map alignment from among the first map features and the second map features; aligning the first spatial map and the second spatial map, based on the identified third map features; identifying local areas in the space where at least one difference exists between the first spatial map and the second spatial map; and generating the personalized spatial map by identifying pieces of spatial information about the local areas based on the second map features.

Classes IPC  ?

• G01C 21/00 - Navigation; Instruments de navigation non prévus dans les groupes
• G01C 21/20 - Instruments pour effectuer des calculs de navigation
• G01C 21/32 - Structuration ou formatage de données cartographiques

Abrégé

A vertical semiconductor device includes; a pattern structure including a plurality of insulation patterns and a plurality of gate electrodes that are alternately and repeatedly stacked on a substrate, wherein the pattern structure includes a first gate electrode serving as a gate electrode of an erase transistor, wherein the first gate electrode is one of the plurality of gate electrodes; and a channel structure in a channel hole passing through the pattern structure, wherein the channel structure includes a data storage structure, a first channel, an undoped semiconductor liner, a doped semiconductor pattern, a filling insulation pattern and a capping pattern, wherein the data storage structure, the first channel, the undoped semiconductor liner, and the doped semiconductor pattern are sequentially disposed on a sidewall of the first gate electrode.

Classes IPC  ?

• H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U

Abrégé

A method of controlling an electronic device by using spatial information and an electronic device using spatial information are provided. The method includes selecting, based on spatial information about a space including at least one object and a task that the electronic device is set to perform, an object that obstructs the task from among objects located in a space corresponding to the task, providing a user of the electronic device with object movement guide information corresponding to attribute information about the selected object, determining a movement path used to perform the task, based on a user's response corresponding to the object movement guide information, and driving the electronic device according to the determined movement path.

Classes IPC  ?

• G06T 7/20 - Analyse du mouvement
• B25J 9/16 - Commandes à programme
• G06T 7/70 - Détermination de la position ou de l'orientation des objets ou des caméras
• G06T 17/05 - Modèles géographiques

Abrégé

A vertical memory device includes a substrate, first and second sub-semiconductor patterns, first and second common source contacts, and first and second cell structures. The substrate includes a first region and a second region having a same length as the first region in a first direction, the first region having a first width in a second direction perpendicular to the first direction, and the second region having a second width in the second direction that is less than the first width. The first sub-semiconductor pattern covers the first region, and a portion of the first sub-semiconductor pattern has a first thickness. The second sub-semiconductor pattern covers the second region and has a second thickness that is less than the first thickness. The first and second common source contacts are disposed on edges in the second direction of the first and second patterns, respectively.

Classes IPC  ?

• H10B 41/27 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U
• H10B 41/10 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la configuration vue du dessus
• H10B 43/10 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la configuration vue du dessus
• H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p.ex. avec des canaux inclinés les canaux comprenant des parties verticales, p.ex. des canaux en forme de U

Abrégé

A method of generating a three-dimensional (3D) model and a device for generating a 3D model are provided. The method includes generating a base 3D model of an object, determining a first target 3D model similar to the base 3D model from a 3D model database storing a plurality of 3D models, generating a first synthesized 3D model, determining a first similarity between the first synthesized 3D model and the at least one object image, determining a component having a low similarity between the first synthesized 3D model and the at least one object image, determining, as a second target 3D model, a 3D model having a high similarity to the first synthesized 3D model with respect to the component having the low similarity, from the 3D model database, and generating a second synthesized 3D model.

Classes IPC  ?

• G06T 17/00 - Modélisation tridimensionnelle [3D] pour infographie
• G06T 7/50 - Récupération de la profondeur ou de la forme
• G06T 7/70 - Détermination de la position ou de l'orientation des objets ou des caméras
• G06T 19/20 - Transformation de modèles ou d'images tridimensionnels [3D] pour infographie Édition d'images tridimensionnelles [3D], p.ex. modification de formes ou de couleurs, alignement d'objets ou positionnements de parties
• G06V 10/764 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant la classification, p.ex. des objets vidéo

Abrégé

Provided are a heterocyclic compound represented by Formula 1, an organic light-emitting device including the same, and a diagnostic composition including the heterocyclic compound as described in the detailed description. Provided are a heterocyclic compound represented by Formula 1, an organic light-emitting device including the same, and a diagnostic composition including the heterocyclic compound as described in the detailed description.

Classes IPC  ?

• C07F 5/02 - Composés du bore
• C09K 11/06 - Substances luminescentes, p.ex. électroluminescentes, chimiluminescentes contenant des substances organiques luminescentes
• H10K 50/12 - OLED ou diodes électroluminescentes polymères [PLED] caractérisées par les couches électroluminescentes [EL] comprenant des dopants
• H10K 85/60 - Composés organiques à faible poids moléculaire

Abrégé

Provided are a level sensor configured to detect a height level of a substrate, and a substrate processing apparatus including the level sensor. The level sensor includes a measurement light source configured to radiate measurement light toward the substrate, a prism configured to split reflected light of the measurement light into first polarized light and second polarized light and generate a first optical path length difference between the first polarized light and the second polarized light, an optical path length modulator configured to keep constant an optical path length of the first polarized light and periodically change an optical path length of the second polarized light, and a detector configured to detect the first optical path length difference based on an interference signal between the first polarized light and the second polarized light.

Classes IPC  ?

• G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
• G01B 9/02 - Interféromètres

Abrégé

A semiconductor package includes a first redistribution structure, a first semiconductor device mounted on the first redistribution structure, a molding layer surrounding the first semiconductor device, a second redistribution structure disposed on the molding layer and the first semiconductor device, a plurality of vertical connection conductors vertically extending in the molding layer and electrically connecting the first redistribution pattern to the second redistribution pattern, a second semiconductor device mounted on the second redistribution structure, the second semiconductor device and the first semiconductor device vertically and partially overlapping each other, a heat dissipation pad structure contacting an upper surface of the first semiconductor device, and a heat dissipation plate disposed on the heat dissipation pad structure and spaced apart from the second semiconductor device along a first straight line extending in a horizontal direction that is parallel to the upper surface of the first semiconductor device.

Classes IPC  ?

• H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
• H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
• H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
• H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
• H10B 80/00 - Ensembles de plusieurs dispositifs comprenant au moins un dispositif de mémoire couvert par la présente sous-classe

Abrégé

Broadly speaking, embodiments of the present techniques provide a method for reducing errors in the outputs of machine learning, ML, models on a potential output of the models to resolve any inconsistencies before outputting a final result from the models. The final result respects a set of rules or constraints, which may include logical constraints. Advantageously, this reduces the risk of a model outputting a result which violates some rules associated with the overall task of the model, which could be dangerous or provide a poor user experience.

Classes IPC  ?

• G06V 10/776 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p.ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]; Séparation aveugle de source Évaluation des performances
• G06V 10/77 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p.ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]; Séparation aveugle de source

Abrégé

An outdoor unit of an air conditioner, including a housing including an inlet and an outlet, wherein a flow path is formed between the inlet and the outlet inside the housing; a heat exchanger positioned on the flow path inside the housing; and a blower fan inside the housing between the inlet and the heat exchanger, and configured to flow air along the flow path, from the inlet, through the heat exchanger, and toward the outlet, wherein the blower fan includes a hub configured to be rotatable, and a plurality of blades extending from the hub and arranged along a circumference of the hub, each blade among the plurality of blades includes a leading edge at a side of a rotation direction of the hub, a trailing edge opposite to the leading edge, and a blade surface between the leading edge and the trailing edge and inclined toward the inlet from the trailing edge to the leading edge.

Classes IPC  ?

• F24F 1/38 - Climatiseurs individuels pour le conditionnement de l'air, p.ex. éléments séparés ou monoblocs ou éléments recevant l'air primaire d'une station centrale Éléments extérieurs séparés, p.ex. élément extérieur à relier à un élément intérieur séparé comprenant un compresseur et un échangeur de chaleur - Parties constitutives des ventilateurs des éléments extérieurs, p.ex. orifices d'admission évasés ou supports des ventilateurs
• F24F 1/56 - Carters ou capots des éléments extérieurs séparés, p.ex. grilles de protection de ventilateurs

Abrégé

A meta-searching method, including determining a target metaverse for a current search using intent classification based on an inquiry text included in a searching request of a user; extracting a searching clue and a clue type; selecting a current search engine for performing the current search using the target metaverse and the clue type by prioritizing a search engine associated with the target metaverse; performing identity authentication using the user account information of the user in the target metaverse prior to the search based on determining that user account information is required to search for the searching clue for performing a search using the current search engine, and performing the search using the current search engine based on the searching clue; and providing the search results to the user.

Classes IPC  ?

• G06F 16/953 - Requêtes, p.ex. en utilisant des moteurs de recherche du Web
• G06F 16/951 - Indexation; Techniques d’exploration du Web
• G06F 21/31 - Authentification de l’utilisateur