COVERS FOR ELECTRONIC DEVICES
Registre | Brevet USPTO |
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Numéro d'application | 17788361 |
Statut | En instance |
Date de dépôt | 2020-01-08 |
Date de la première publication | 2023-02-02 |
Date de publication | 2023-02-02 |
Propriétaire | Hewlett-Packard Development Company, L.P. (USA) |
Inventeur(s) |
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Abrégé
This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; a passivation layer or a micro-arc oxidation layer deposited on at least one surface of the substrate; a primer coating layer on the passivation layer or the micro-arc oxidation layer; an optional base coating layer on the primer coating layer; a top coating layer on the optional base coating layer or on the primer coating layer; and a hydrophobic coating layer.Classes IPC ?
- C25D 11/30 - Anodisation of magnesium or alloys based thereon
- H04M 1/02 - Constructional features of telephone sets
- C25D 11/02 - Anodisation
- C25D 11/24 - Chemical after-treatment