ASML Netherlands B.V.

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G03F 7/20 - Exposure; Apparatus therefor 1,907
G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically 316
H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma 261
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor 179
H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams 132
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1.

SOURCE MASK OPTIMIZATION BASED ON SYSTEMATIC EFFECTS ON A LITHOGRAPHIC APPARATUS

      
Application Number EP2023085228
Publication Number 2024/141256
Status In Force
Filing Date 2023-12-11
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Staals, Frank

Abstract

Source mask optimization (SMO) is described. The SMO comprises determining a source configuration (e.g., an illumination pupil) of the lithographic apparatus for first features in a first layer of a pattern based on systematic effects on the lithographic apparatus components that cause feature dependent imaging performance changes for second features in a second layer of the pattern. The systematic effects on the lithographic apparatus components comprise mirror heating, for example. Mirror heating based SMO is performed for a first layer's illumination pupil with a cost function for second layer's performance. For example, mirror heating based SMO may be performed to generate a metal layer illumination pupil that creates less mirror heating impact to a subsequent via layer exposure, and/or mirror heating based SMO may be performed to generate a via layer illumination pupil that is less sensitive to mirror heating caused by a prior metal layer exposure, as representative examples.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

2.

MASKING DEVICE AND CONTROLLING METHOD THEREOF

      
Application Number EP2023087655
Publication Number 2024/141487
Status In Force
Filing Date 2023-12-22
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • De Jong, Edwin
  • Everts, Frank

Abstract

Disclosed is a method for controlling an exposure dose at a substrate utilizing a masking device, which comprises a first blade and a second blade. The method comprises providing radiation pulses at the masking device for exposing the substrate, exposing an exposure area at the substrate by moving the first blade in a first direction relative to a slit center and by moving the second blade in a second 5 direction, with the second direction being opposite to the first direction, keeping an amount of radiation received at the exposure area constant, and wherein moving the first and second blade is defined by a velocity profile of a substrate support supporting the substrate.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

3.

APPARATUSES AND METHODS FOR EXTREME ULTRAVIOLET LIGHT SOURCE UTILIZING THERMALLY INDUCED BREAKUP OF TARGET MATERIAL STREAM

      
Application Number EP2023086722
Publication Number 2024/141345
Status In Force
Filing Date 2023-12-19
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Fareed, Farzad
  • Chikan, Viktor
  • Richards, Robert, Garrett

Abstract

A method includes producing a continuous stream of a material and periodically heating the stream by applying a varying light, a varying electrical current, or a varying electron beam to the stream to control a breakup of the stream into segments. The stream can be periodically heated at a single location proximate an orifice of the nozzle. The material can be a material adapted to emit EUV radiation when in a plasma state. A droplet generator implementing the method is also disclosed.

IPC Classes  ?

  • H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

4.

METHOD TO GENERATE AN ACCELERATION SETPOINT PROFILE FOR A MOVABLE OBJECT, SETPOINT GENERATOR AND LITHOGRAPHIC APPARATUS

      
Application Number EP2023083169
Publication Number 2024/141209
Status In Force
Filing Date 2023-11-27
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Butler, Hans
  • Kamidi, Ramidin, Izair

Abstract

The invention provides a method to generate an acceleration setpoint profile for a movable object, wherein the method comprises: providing a time domain acceleration curve with finite acceleration time length, providing a time domain jerk curve with finite jerk time length, calculating a time domain convolution of the time domain acceleration curve and the time domain jerk curve to generate the acceleration setpoint profile, wherein the time domain jerk curve has a zero value at a start and an end of the finite jerk time length, and wherein an amplitude profile of the time domain jerk curve, when Fourier transformed into 0 frequency domain, has an amplitude that decreases for higher frequencies with at least 60 dB per decade.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G05B 19/416 - Numerical control (NC), i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control of velocity, acceleration or deceleration

5.

MULTICHANNEL LOCK-IN CAMERA FOR MULTI-PARAMETER SENSING IN LITHOGRAPHIC PROCESSES

      
Application Number EP2023084624
Publication Number 2024/141235
Status In Force
Filing Date 2023-12-06
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Pellemans, Henricus, Petrus, Maria
  • Ramachandra Rao, Padmakumar

Abstract

A metrology system can include an illumination system, a camera, and an analyzer system. The illumination system transmits illumination toward a target. The illumination has a plurality of illumination parameters associated with a corresponding plurality of modulation frequencies. The camera receives scattered illumination from the target and generates, per pixel of the camera, a measurement signal encoded with signatures of the plurality of modulation frequencies. The analyzer system, per pixel of the camera, demodulates the measurement signal based on the plurality of modulation frequencies outputs a phase, an amplitude, or the phase and amplitude of demodulated components of the measurement signal corresponding to the modulation frequencies.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

6.

METHODS AND SYSTEMS FOR DETERMINING RETICLE DEFORMATION

      
Application Number EP2023084626
Publication Number 2024/141236
Status In Force
Filing Date 2023-12-06
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Karamnejad, Amin
  • Subramanian, Raaja Ganapathy
  • Moest, Bearrach
  • Danilin, Alexander, Alexandrovich

Abstract

Disclosed herein is a computer system configured to: model, using boundary conditions that are dependent on a first state of a reticle during a first time period, the deformation of the reticle during the first time period; model, using boundary conditions that are dependent on a second state of the reticle during a second time period, the deformation of the reticle during the second time period; and control the operation of a lithographic process in dependence on the modelled deformation of the reticle; wherein: the first state of the reticle is different from the second state of the reticle; and the modelled deformation of the reticle at the start of the second time period is based on the modelled deformation of the reticle at the end of the first time period.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

7.

PICK AND PLACE WITH DIE ACTUATORS FOR HETEROGENEOUS INTEGRATION

      
Application Number EP2023083950
Publication Number 2024/141220
Status In Force
Filing Date 2023-12-01
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • De Jager, Pieter, Willem, Herman
  • Van Zwet, Erwin, John
  • Van Riel, Martinus, Cornelius, Johannes, Maria
  • Van Der Lans, Marcus, Johannes
  • De Man, Hendrik

Abstract

A method for die placement is provided, comprising obtaining a plurality of target locations for a plurality of donor dies, measuring locations of the plurality of donor dies, the plurality of donor dies supported by a plurality of die actuators, adjusting the locations of the plurality of donors dies to correspond substantially to the plurality of target locations using the plurality of die actuators, and placing the plurality of donor dies on the plurality of target locations.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • B25J 7/00 - Micromanipulators
  • B25J 9/00 - Programme-controlled manipulators

8.

CHARGED PARTICLE APPARATUS WITH IMPROVED VACUUM CHAMBER

      
Application Number EP2023087440
Publication Number 2024/141423
Status In Force
Filing Date 2023-12-21
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Wang, Mingkang
  • Xi, Qingpo
  • Dong, Liang
  • Du, Zhidong
  • Gong, Zizhou
  • Yu, Le
  • Dou, Juying
  • Ren, Weiming
  • Hu, Xuerang
  • Zhang, Zhiming

Abstract

An electron beam source is configured in an ultra-high vacuum chamber. Gas molecules are prevented from reaching an emission tip of the electron source by a differential aperture system. The differential aperture system may comprise at least one aperture plate configured to seal a region of the vacuum chamber from an outgassing source so that gas molecules may only pass from the source to the region by holes in the at least one aperture plate.

IPC Classes  ?

  • H01J 37/09 - Diaphragms; Shields associated with electron- or ion-optical arrangements; Compensation of disturbing fields
  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams
  • H01J 37/317 - Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. ion implantation

9.

EUV LIGHT SOURCE TARGET GENERATOR WITH PRE-COALESCENCE DROPLET DETECTION MODULE

      
Application Number EP2023086738
Publication Number 2024/141348
Status In Force
Filing Date 2023-12-19
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Mckenzie, Paul, Alexander
  • Xie, Yong
  • Simmons, Rodney, D
  • Kambhampati, Murali, Krishna
  • Vohra, Quaid, Rafique
  • Binun, Paul, William

Abstract

An extreme ultraviolet (EUV) light source target generator includes an elongated passageway along which pre-coalescence droplets can travel, the passageway surrounded by a passageway wall; a window in the passageway wall; and a pre-coalescence droplet detection module positioned to receive light transmitted through the window, the pre-coalescence droplet detection module comprising a lens system configured to collect and transmit light received through the window, and a light detector configured to receive light transmitted by the lens system.

IPC Classes  ?

  • H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

10.

OBJECTIVE LENS COOLING SYSTEM

      
Application Number EP2023085458
Publication Number 2024/141262
Status In Force
Filing Date 2023-12-13
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Casucci, Paul
  • Ji, Xiaoyu
  • Yu, Le
  • Tao, Xingtian

Abstract

An improved magnetic lens cooling system is disclosed. A magnetic lens assembly can comprise a coil, a housing containing the coil, and a pole piece that is isolated from the housing such that there is a gap between the housing and the pole piece. Wherein the magnetic lens assembly can be configured to have a vacuum pressure in the gap.

IPC Classes  ?

11.

HYBRID DETECTORS FEATURING LOW TEMPERATURE SURFACE PASSIVATION

      
Application Number EP2023085457
Publication Number 2024/141261
Status In Force
Filing Date 2023-12-13
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Ramachandra Rao, Padmakumar
  • Sberna, Paolo, Maria

Abstract

Systems, apparatuses, and methods include a detector including a plurality of detection elements including a portion of a silicon substrate comprising: a front side of the portion of the silicon substrate including a PIN or NIP diode that comprises a p-type region and an n-type region; a back side of the portion of the silicon substrate, opposite of the front side, comprising a passivation layer deposited at low temperature that when a bias is applied the PIN or NIP diode is configured to detect an electron that enters the backside of the portion of the silicon substrate.

IPC Classes  ?

  • H01L 31/0216 - Coatings
  • H01L 31/115 - Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
  • H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

12.

A FLUID HANDLING SYSTEM AND METHOD

      
Application Number EP2023082905
Publication Number 2024/141208
Status In Force
Filing Date 2023-11-23
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Van Der Gaag, Marc, Léon
  • Gerritzen, Justin, Johannes, Hermanus
  • Nayak Kallarbail, Shruthi
  • Jovanovic, Milena

Abstract

Disclosed herein is a fluid handling system comprising a liquid confinement structure (12), a gas supply conduit (70) and a fluid transport conduit (80). The liquid confinement structure is configured to confine immersion fluid to a space between at least a part of the liquid confinement structure and a surface of a substrate. The gas supply conduit is configured to supply fluid to the space. The gas supply conduit has a flow controller (71) configured to control the supply of gas from the gas supply conduit. The fluid transport conduit is configured to transport fluid extracted from the space. The fluid transport conduit has a flow meter (81) configured to measure the flow of gas in the fluid transport conduit. Under a calibration mode, the gas supplied by the flow controller flows directly to the fluid transport conduit via a bypass conduit (90), wherein the bypass conduit bypasses the liquid confinement structure.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

13.

OBJECT HOLDER

      
Application Number EP2023082683
Publication Number 2024/141206
Status In Force
Filing Date 2023-11-22
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Schmidt, Volker

Abstract

An object holder configured to support an object, the object holder comprising a first conductive layer provided between a first insulating layer and a second insulating layer, a second conductive layer provided between the second insulating layer and a third insulating layer, a plurality of burls, each burl of the plurality of burls comprising an object receiving surface and a layer of resistive or conductive material provided on at least one or each burl of the plurality of burls such that the layer of resistive or conductive material electrically connects the object receiving surface of the at least one or each burl of the plurality of burls to the first conductive layer.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

14.

SYSTEM, METHODS, AND APPARATUSES WITH REDUCED NOISE CURRENT

      
Application Number EP2023085723
Publication Number 2024/141275
Status In Force
Filing Date 2023-12-13
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Ray, Valery
  • Benson, Donald
  • Dong, Zhonghua
  • Li, Li

Abstract

Systems and apparatuses may include at least three conductors including a first conductor that is electrically isolated from a chassis, the first conductor being electrically connected to a node of an AC power source, the node of the AC power source being electrically connected to a ground reference, and the first conductor configured to provide a path for noise current generated by the EMI filter to flow to the AC power source to enable the noise current to pass to the AC power source without passing through the chassis. Each conductor may include an inductor, the inductors being magnetically coupled such that a sum of currents flowing through the inductors is substantially zero. Systems may include shielded cables electrically connected to a chamber to provide a low-impedance path for noise currents to flow, wherein at a mechanical interface, a column is mechanically coupled to and electrically isolated from the chamber.

IPC Classes  ?

  • H02M 1/12 - Arrangements for reducing harmonics from ac input or output
  • H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
  • H02M 7/00 - Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams
  • H02M 7/04 - Conversion of ac power input into dc power output without possibility of reversal by static converters

15.

LITHOGRAPHIC APPARATUS AND INSPECTION SYSTEM FOR MEASURING WAFER DEFORMATION

      
Application Number EP2023083799
Publication Number 2024/141216
Status In Force
Filing Date 2023-11-30
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Pellemans, Henricus, Petrus, Maria

Abstract

A system for measuring deformation of a substrate includes an illuminator, a camera, a modulator system, and a controller. The illuminator directs two beams of radiation at each target of a plurality of targets disposed on the substrate to produce two beams of scattered radiation from the each target. The camera detects interference patterns of the two beams of scattered radiation from the plurality of targets and generates an interferogram based on the interference pattern. The modulator system adjusts the interference patterns by adjusting a relative phase of the two beams of radiation. The controller analyzes the measurement signal and to determine the deformation of the substrate based on the interferogram and the adjusting of the relative phase.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • G01B 11/16 - Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
  • G01B 11/24 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures

16.

METROLOGY SYSTEM BASED ON MULTIMODE OPTICAL FIBER IMAGING AND LITHOGRAPHIC APPARATUS

      
Application Number EP2023083793
Publication Number 2024/141215
Status In Force
Filing Date 2023-11-30
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Sonde, Aniruddha Ramakrishna
  • Ajgaonkar, Mahesh, Upendra
  • Shome, Krishanu

Abstract

An inspection system includes a radiation source, a multimode optical fiber, an optical structure, a two-dimensional detector array, and a computing device. The radiation source irradiates a target to generate scattered radiation from the target. The scattered radiation comprises a diffraction order pair. The multimode optical fiber receives the scattered radiation and outputs a mix of the diffraction order pair based on a propagation property of the multimode optical fiber. The optical structure combines the diffraction order pair at an input side of the multimode optical fiber. The two-dimensional detector array receives the mix of the diffraction order pair and generates a measurement signal corresponding to the mix of the diffraction order pair. The computing device analyzes the measurement signal based on the propagation property and discriminates intensities of the diffraction order pair based on the analyzing.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

17.

RECESS-BASED PICK AND PLACE FOR HETEROGENEOUS INTEGRATION

      
Application Number EP2023083949
Publication Number 2024/141219
Status In Force
Filing Date 2023-12-01
Publication Date 2024-07-04
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Venugopalan, Syam, Parayil
  • Warnaar, Patrick
  • De Jager, Pieter, Willem, Herman
  • Jansen, Bas
  • Janssens, Stef, Marten, Johan

Abstract

An apparatus for die placement comprising a first stage comprising a plurality of recesses, the plurality of recesses configured to accept a plurality of donor dies; a second stage comprising a support for one or more targets; and a measurement system, functionally coupled to the first stage, and configured to: obtain locations of the plurality of donor dies in the plurality of recesses of the first stage, and based at least on the obtained locations, provide output signals to adjust the locations of the plurality of donor dies supported by the first stage to correspond to locations of the one or more targets, and based at least in part on the adjusted locations, provide output signals to place the plurality of donor dies on the one or more targets supported by the second stage by relative movement between the first stage and the second stage.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations

18.

OBJECT TABLE

      
Application Number EP2023082548
Publication Number 2024/132337
Status In Force
Filing Date 2023-11-21
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Zhu, Jianqiang
  • Engelen, Johannes, Bernardus, Charles
  • Kruizinga, Matthias
  • Allsop, Nicholas, Alan
  • Koevoets, Adrianus, Hendrik
  • Galaktionov, Oleksiy, Sergiyovich
  • Van Der Wekken, Michael, Christiaan
  • Warming, Till

Abstract

An object table comprising a base having a planar surface, a substrate support or patterning device support comprising a clamp and a set of burls, the burls extending from the clamp and having distal ends adjacent to the planar surface of the base, wherein, the object table further comprises a compliant layer disposed between the burl distal ends and the planar surface of the base and a frictional layer which is in contact with the compliant layer.

IPC Classes  ?

  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • G03F 7/20 - Exposure; Apparatus therefor

19.

LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD

      
Application Number EP2023083065
Publication Number 2024/132381
Status In Force
Filing Date 2023-11-24
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Chaudhuri, Manis
  • Cloin, Christian, Gerardus, Norbertus, Hendricus, Marie
  • Yakunin, Andrei, Mikhailovich
  • Van De Kerkhof, Marcus, Adrianus

Abstract

Disclosed herein is a lithographic apparatus comprising: an illumination system for providing a beam of EUV radiation along a beam path; a holder for a patterning device configured to impart a pattern to the beam of radiation, the patterning device comprising a patterning surface with a pattern thereon; and an electron beam source configured to emit electrons toward the patterning surface and/or a part of the beam path adjacent the patterning surface.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

20.

A POD FOR A PATTERNING DEVICE

      
Application Number EP2023083405
Publication Number 2024/132408
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Wade, Robert, Jeffrey

Abstract

A system includes a first container and a second container. The first container receives a patterning device and maintains a predetermined environment inside the first container. The second container receives the first container and maintains a vacuum inside the second container. The second container includes a flange, a first end, and a second end. The flange is located on an exterior of the second container. The second container can be gripped and transported via the flange. The first end includes a vacuum valve and a purge valve. The vacuum valve facilitates removal of gas from the second container. The purge valve facilitates introduction of gas into the second container. The vacuum valve and the purge valve interface with a first external vacuum environment. The second end opposite the first end and the second end has an opening. The opening allows the removal of the first container from the second container.

IPC Classes  ?

  • G03F 1/66 - Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

21.

METHODS AND SYSTEMS FOR DETERMINING RETICLE DEFORMATIONS

      
Application Number EP2023083407
Publication Number 2024/132410
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Subramanian, Raaja Ganapathy
  • Moest, Bearrach
  • Paarhuis, Bart, Dinand
  • Danilin, Alexander, Alexandrovich

Abstract

Disclosed herein is a computer system configured to: control a lithographic process performed on a first substrate with a reticle that is in a cold state; determine one or more performance metrics of the lithographic process in dependence on an inspection of the first substrate; determine clamping-induced deformation modes of the reticle in dependence on the one or more performance metrics; and determine and control the application of process corrections to a lithographic process performed on a second substrate in dependence on the determined clamping-induced deformation modes.

IPC Classes  ?

22.

METHODS AND SYSTEMS FOR DETERMINING RETICLE DEFORMATIONS

      
Application Number EP2023083576
Publication Number 2024/132427
Status In Force
Filing Date 2023-11-29
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Subramanian, Raaja Ganapathy
  • Moest, Bearrach
  • Danilin, Alexander, Alexandrovich

Abstract

Disclosed herein is a computer system configured to use a reticle heating model to determine the shape and/or deformation of a reticle and control the operation of a lithographic process that uses the reticle in dependence on the modelled shape and/or deformation. The computer system is configured to determine, in dependence on generated reticle process data and known thermal properties of the reticle, that a long track hiccup has occurred and in response to determining that a long track hiccup has occurred, reconfigure the reticle heating model to the same state initialized states used at the start of performing lithographic processes on the lot of substrates.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

23.

METHODS AND SYSTEMS FOR DETERMINING RETICLE DEFORMATIONS

      
Application Number EP2023083783
Publication Number 2024/132446
Status In Force
Filing Date 2023-11-30
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Subramanian, Raaja Ganapathy
  • Moest, Bearrach
  • Danilin, Alexander, Alexandrovich
  • Schenkelaars, Thijs
  • Moharana, Neehar, Ranjan

Abstract

Disclosed herein is a computer system configured to perform, before performing a lithographic process on a first substrate in a lot of substrates, reticle alignment, RA, measurements with a first and second plurality of edge markers of the reticle. The reticle deformation model determines shape and/or deformation of the reticle in dependance on the RA measurements. A lithographic process performed on the first substrate is controlled in dependence on the determined shape and/or deformation. Before performing a lithographic process on a second substrate in the lot of substrates, further RA measurements are performed. The reticle deformation model determines the deformation of the reticle when performing a lithographic process on the second substrate in dependance on the further RA measurements and the previous RA measurements.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03B 27/68 - Introducing or correcting distortion, e.g. in connection with oblique projection
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

24.

METHODS AND SYSTEMS FOR DETERMINING RETICLE DEFORMATIONS

      
Application Number EP2023083786
Publication Number 2024/132447
Status In Force
Filing Date 2023-11-30
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Subramanian, Raaja Ganapathy
  • Moest, Bearrach
  • Danilin, Alexander, Alexandrovich
  • Meijerink, Rowin
  • Van Hooijdonk, Ivo, Gregor, Sebastian

Abstract

Disclosed herein is a computer system configured to: model the shape and/or deformation of a reticle; and control the operation of a lithographic process that uses the reticle in dependence on the modelled shape and/or deformation; wherein to model the shape and/or deformation of the reticle, the computer system is configured to: obtain initial reference shape data that represents a shape of a reticle; obtain reticle heating calibration, RHC, data that comprises reticle shape data and corresponding reticle alignment, RA, measurement data at different reticle temperatures; generate calibrated reference shape data in dependence on the initial reference shape data, the RHC data and an RA measurement; and model the shape and/or deformation of the reticle in dependence on the calibrated reference shape data.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

25.

METHODS AND SYSTEMS FOR DETERMINING RETICLE DEFORMATIONS

      
Application Number EP2023083787
Publication Number 2024/132448
Status In Force
Filing Date 2023-11-30
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Subramanian, Raaja Ganapathy
  • Moest, Bearrach
  • Paarhuis, Bart, Dinand
  • Danilin, Alexander, Alexandrovich
  • Johnson, Richard, John
  • Van Den Hanenberg, Stephan, Joan, Michel

Abstract

A computer system is configured to initialize a reticle heating model in dependence on reference data for a reticle in a cold state and a reticle alignment measurement of the reticle. States of the reticle heating model are updated as the lithographic processes are performed on the first lot of substrates. Current states of the reticle heating model are stored. Reticle handling data is generated. It is determined whether the reticle is in a hot state or a cold state in dependence on reticle handling data. If the reticle is determined to be in the hot state, the starting state for the reticle heating model is configured in dependence on the stored states. If the reticle is determined to be in the cold state, the reticle heating model is re-initialized in dependence on reference data for the reticle in a cold state and the reticle alignment measurement of the reticle.

IPC Classes  ?

26.

HIGH-THROUGHPUT LOAD LOCK CHAMBER

      
Application Number EP2023084631
Publication Number 2024/132539
Status In Force
Filing Date 2023-12-06
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Yu, Dongchi
  • Lin, Yi-Chen
  • Fu, Shao-Wei
  • Lin, Jun-Li
  • Chang, Huan-Yu

Abstract

An improved vacuum chamber for a system handling a wafer is provided. The vacuum chamber may comprise a top wall wherein at least a portion of an interior surface of the top wall is slanted relative to a side view of the top wall. The vacuum chamber may further comprise a gas vent port coupled to the top wall and a baffle coupled to the vacuum chamber and positioned below the gas vent port, wherein the baffle is configured to reduce turbulence of gas that enters the vacuum chamber via the gas vent port.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

27.

ADVANCED CHARGE CONTROLLER CONFIGURATION IN A CHARGED PARTICLE SYSTEM

      
Application Number EP2023085702
Publication Number 2024/132806
Status In Force
Filing Date 2023-12-13
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Zhang, Jian
  • Ye, Ning
  • Ji, Xiaoyu
  • Hu, Xuerang

Abstract

Systems, apparatuses, and methods for advanced charge controller configurations in a charged particle system. A system may include a light source configured to emit a light beam; and a mirror system configured to adjust an angle of incidence of the light beam on a sample during an inspection of the sample without substantially adjusting a position of the light beam on the sample.

IPC Classes  ?

  • H01J 37/02 - Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof - Details
  • H01J 37/22 - Optical or photographic arrangements associated with the tube

28.

CHARGED PARTICLE BEAM INSPECTION APPARATUS AND METHOD

      
Application Number EP2023085707
Publication Number 2024/132808
Status In Force
Filing Date 2023-12-13
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Ji, Xiaoyu
  • Zhang, Datong
  • Ren, Weiming
  • Zhu, Xuechen

Abstract

A charged particle beam inspection apparatus for inspecting a sample (550) and charged particle beam adjustment technology, and more particularly, a charged particle beam contactless electrical characterization technology (e.g. for defect detection) is disclosed. The charged particle beam apparatus comprises a charged particle source (503) configured to emit a primary charged particle beam (505); a first lens (526) configured to manipulate the primary charged particle beam to adjust a probe current of the primary charged particle beam; an objective lens (532) configured to focus the primary charged particle beam to a focal point substantially on a surface of the sample; a second lens (533d,e) configured to generate an electrostatic field that substantially overlaps with a magnetic field generated by the objective lens and also to compensate for a focus variation caused by a change in probe current without changing a focusing power of the objective lens, wherein the change in probe current is caused by the first lens; and a deflector (533a-e) configured to deflect the primary charged particle beam to scan a scan line of a field of view of the sample.

IPC Classes  ?

  • H01J 37/12 - Lenses electrostatic
  • H01J 37/145 - Combinations of electrostatic and magnetic lenses
  • H01J 37/147 - Arrangements for directing or deflecting the discharge along a desired path
  • H01J 37/21 - Means for adjusting the focus
  • H01J 37/24 - Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams

29.

A NEW DESIGN CONCEPT OF SCANNING ELECTRON MICROSCOPE WITH CHARGED PARTICLE SOURCE

      
Application Number EP2023086733
Publication Number 2024/133328
Status In Force
Filing Date 2023-12-19
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Krupin, Oleg
  • Gong, Zizhou
  • Ren, Weiming
  • Hu, Xuerang
  • Wang, Yongxin

Abstract

A particle beam inspection apparatus, and more particularly, a method of particle beam parameter variation compensation for image inspection and enhancement are disclosed. A primary beam emission current may be continuously monitored to compensate for an emission current fluctuation. The fluctuation may be compensated by adjusting a characteristic of the electron source or a sub-system within the charged particle system. An event-based detection system may be used to measure a number of electrons impacting a detector within a period of time with a location on a sample and normalize a generated image of the sample. A deflector may adjust a deflection speed of the primary beam across the sample to compensate for emission current fluctuation while maintaining a constant dose impacting a sample. Thus, image quality is improved, sources of error during sample inspection are minimized, metrology measurement accuracy is improved, and throughput is increased.

IPC Classes  ?

  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams
  • H01J 37/22 - Optical or photographic arrangements associated with the tube
  • H01J 37/244 - Detectors; Associated components or circuits therefor

30.

OBJECT TABLE

      
Application Number EP2023082029
Publication Number 2024/132310
Status In Force
Filing Date 2023-11-16
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Warming, Till

Abstract

An object table which may be used in a lithographic apparatus. The object table comprises an electrostatic clamp which comprises at least one electrode which is provided between insulating layers. The object table also comprises a second clamp which comprises an array of electrically connected burls, the burls comprising a layer of resistive material at an object receiving surface of the burls.

IPC Classes  ?

  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • G03F 7/20 - Exposure; Apparatus therefor

31.

METHOD TO INFER AND ESTIMATE RETICLE TEMPERATURE BASED ON RETICLE SHAPE MEASUREMENTS

      
Application Number EP2023082417
Publication Number 2024/132326
Status In Force
Filing Date 2023-11-20
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Subramanian, Raaja Ganapathy

Abstract

Embodiments herein describe systems, methods, and devices for determining reticle temperature based on reticle shape measurements. System can comprises an illumination path configured to direct radiation onto a patterning device and a detection path configured to direct a portion of the radiation, after interaction with the patterning device, onto a detector configured to output a signal representative of the portion of the radiation beam. A controller can to receive the signal, determine information about a physical characteristic or alignment of the patterning device, and use the information to estimate a load temperature of the patterning device. The controller or another controller can estimated load temperature to compensate for temperature-induced magnification of the patterning device. The controller or the another controller compensates by adjusting a positioning of a stage or lens of the system.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

32.

METHOD OF GENERATING A PROJECTION PATTERN OF A PLURALITY OF PROJECTIONS OF A SUBSTRATE TABLE

      
Application Number EP2023082427
Publication Number 2024/132327
Status In Force
Filing Date 2023-11-20
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Stein, Alexander
  • Lehberger, Ernst

Abstract

A pattern of projections in a surface portion of a substrate table for supporting a wafer is generated by steps of providing repulsive periphery potentials acting in the support plane and comprising outer periphery potentials being assigned to outer periphery points surrounding the surface portion; providing an initial distribution of projections, each having a variable projection position in the surface portion; providing repulsive projection potentials acting in the support plane and being assigned to the projections; calculating a local force acting on each of the projections, based on a superposition of the periphery and projection potentials at the position of the projection; and generating the projection pattern to be obtained by repeatedly shifting the projection positions and calculating the local force acting on each of the projections at the current position, until a predetermined optimization criterion is fulfilled. Furthermore, a substrate table and manufacturing the substrate table are described.

IPC Classes  ?

  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • G03F 7/20 - Exposure; Apparatus therefor

33.

EUV UTILIZATION SYSTEM AND METHOD

      
Application Number EP2023082904
Publication Number 2024/132367
Status In Force
Filing Date 2023-11-23
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Beckers, Jasper, Pierre
  • Van De Wiel, Hubertus, Johannes
  • Te Sligte, Edwin
  • Harrison, Kramer, Daniel
  • Van Drent, William, Peter

Abstract

A EUV utilization system comprising a radiation source comprising a drive laser configured to generate drive laser radiation for irradiating a fuel and thereby generating extreme ultraviolet radiation. The EUV utilization system comprises a EUV utilization apparatus configured to receive extreme ultraviolet radiation directed through an optical aperture located between the radiation source and the EUV utilization apparatus. The EUV utilization apparatus comprises a radiation shield configured to block at least a portion of the drive laser radiation that propagates through the optical aperture.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

34.

DETECTOR FOR DETECTING RADIATION

      
Application Number EP2023082908
Publication Number 2024/132368
Status In Force
Filing Date 2023-11-23
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Nihtianov, Stoyan

Abstract

A detector for detecting radiation is disclosed. In one arrangement, the detector has a sensing element that comprises a semiconducting sensor substrate (402) and is configured such that impingement of target radiation generates charge carriers in the sensor substrate. Readout circuitry provides an output responsive to charge carriers generated in the sensor substrate. The sensor substrate comprises a low bandgap layer (408) and a high bandgap portion (409).

IPC Classes  ?

  • H01L 31/115 - Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
  • H01L 31/028 - Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System
  • G01T 1/24 - Measuring radiation intensity with semiconductor detectors
  • H01J 37/04 - Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
  • H01J 37/12 - Lenses electrostatic

35.

LITHOGRAPHIC APPARATUS, METROLOGY SYSTEMS, ADAPTABLE PHASE ARRAY ILLUMINATION AND COLLECTOR DEVICES, AND METHOD THEREOF

      
Application Number EP2023083403
Publication Number 2024/132407
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Akbulut, Duygu
  • Van Engelen, Jorn, Paul
  • Setija, Irwan, Dani

Abstract

A system includes a radiation source, a phased array, and a detector. The phased array generates a radiation beam and directs the beam toward a target structure on a substrate. The phased array includes a plurality of optical elements and of waveguides. The plurality of optical elements transmits radiation waves. The plurality of waveguides guides radiation from the radiation source to the plurality of optical elements. A portion of each waveguide of the plurality of waveguides includes a material that adjusts a phase of the radiation waves such that the radiation waves accumulate to form the beam. The optical properties of the material in the waveguides are adjusted in a non-volatile and reversible way while monitoring the beam formed by the optical phased array until the desired beam profile is obtained. The detector receives radiation scattered by the target and generates a measurement signal based on the received radiation.

IPC Classes  ?

  • G02F 1/29 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
  • G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
  • H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
  • G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
  • G01S 7/481 - Constructional features, e.g. arrangements of optical elements
  • G02F 1/295 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection in an optical waveguide structure

36.

RETICLE HANDLER ISOLATION DAMPER ELEMENT

      
Application Number EP2023083406
Publication Number 2024/132409
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Chen, Lien-Sheng
  • Modaresahmadi, Sina
  • Pereira, Andrew, Charles
  • Pei, Yalu
  • Johnson, Richard, John

Abstract

A system includes first and second portions of a lithography system and a damping system located between the first and second portions. The damping system includes a damper holder that holds an X-direction set of dampers and a Y-direction set of dampers.

IPC Classes  ?

37.

AN ACTUATION STAGE, AN ELECTROMAGNET APPARATUS, AND METHOD OF FABRICATION

      
Application Number EP2023083409
Publication Number 2024/132412
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Del Puerto, Santiago E.
  • Burchfiel, Justin, Morrow
  • Chillara, Venkata, Siva, Chaithanya
  • Gaikwad, Bhushan, Shrikant

Abstract

A stage (500) for supporting and moving an object (502) includes an electromagnet (510), first and second support structures (504; 506), a target (508), and a target-side bumper structure. The electromagnet can comprise a core, a wire coil (512), and a core-side bumper affixed to the core. The core, disposed on the first support structure (506), is made from magnetically permeable material. The core is shaped to have poles facing a same direction. The wire coil generates a magnetic field. The second support structure (504) supports and moves the object relative to the first support structure. The target (508) is disposed on the second support structure (504) to actuate the second support structure in response to the magnetic field. The target-side bumper structure is affixed to the target and can collide with the core-side bumper structure to establish a collision avoidance gap between the core and the target. An uncertainty value of the collision avoidance gap is less than 20 microns.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

38.

CHARGED PARTICLE DEVICE AND CHARGED PARTICLE APPARATUS

      
Application Number EP2023084229
Publication Number 2024/132486
Status In Force
Filing Date 2023-12-05
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Smakman, Erwin, Paul
  • Veenstra, Roy, Ramon
  • Ren, Yan

Abstract

The present invention provides a charged particle device for projecting a multi-beam of charged particles towards a sample. The device comprises a plurality of sources configured to emit a respective source beam of charged particles along a respective path of a beam grid, comprising a plurality of charged particle beams, toward the sample. The device further comprises one or more elements in which an array of apertures is defined. The one or more elements respectively comprising a plurality of beam areas assigned to an individual source beam. The one or more elements is configured to operate on the charged particle beams in the beam grids of the individual source beam. Each element is separated from an adjoining element by a spacer, the spacer having at least one aperture positioned to correspond to the position of at least two beam areas.

IPC Classes  ?

  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams
  • H01J 37/12 - Lenses electrostatic

39.

IN-SITU CLEANING FOR LITHOGRAPHIC APPARATUS

      
Application Number EP2023086000
Publication Number 2024/132898
Status In Force
Filing Date 2023-12-15
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Koole, Max
  • Nikipelov, Andrey
  • Kvon, Vladimir

Abstract

A photoelectric plate (300) for use in place of a patterning device in a lithographic apparatus, the photoelectric plate comprising: a base layer (301); and a coating (302) provided on the base layer; wherein the coating is configured to convert impinging photons of EUV radiation into free electrons at a higher conversion efficiency than the base layer.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass

40.

CHARGED PARTICLE APPARATUS, METHOD OF PROJECTING CHARGED PARTICLES, METHOD OF ASSESSING A SAMPLE

      
Application Number EP2023086970
Publication Number 2024/133468
Status In Force
Filing Date 2023-12-20
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Rodrigues Mansano, Andre, Luis
  • Slot, Erwin
  • Van Leeuwen, Richard, Michel

Abstract

The present disclosure relates to a charged particular apparatus for projecting a multi-beam of charged particles toward a sample. In one arrangement, a sample support supports a sample. A charged particle-optical device projects beams of a multi-beam of the charged particles along a plurality of paths toward the sample. The device comprises a plurality of charged particle-optical elements that define an objective lens and in which are defined a plurality of apertures along the paths of the beams. At least two of the charged particle-optical elements are configured to be set at different potentials and at least one of the charged particle-optical elements is set at ground potential.

IPC Classes  ?

  • H01J 37/02 - Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof - Details
  • H01J 37/12 - Lenses electrostatic
  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams

41.

OPTICAL SYSTEM

      
Application Number EP2023087162
Publication Number 2024/133608
Status In Force
Filing Date 2023-12-20
Publication Date 2024-06-27
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Van Goch, Bram, Paul, Theodoor
  • Van Kemenade, Johannes, Marinus
  • Van De Ruit, Kevin

Abstract

An optical system comprises at least one position sensor and adjustable optics and is arranged to receive a radiation beam and to direct the radiation beam to an illumination region. The at least one position sensor is operable to determine a position of part of the optical system. The adjustable optics is configured to control an optical path of the received radiation beam in dependence on the determined 5 position of the part of the optical system. The adjustable optics may be configured to at least partially correct for any variations in a spatial and/or angular distribution of the radiation at the illumination region that result from any deviations in the determined position from a nominal position. The optical system may comprise an illumination system for an imaging apparatus (for example a lithographic apparatus). A corresponding method of providing radiation to an illumination region via an optical 0 system is also claimed.

IPC Classes  ?

  • G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
  • G03F 7/20 - Exposure; Apparatus therefor

42.

VACUUM TABLE AND METHOD FOR CLAMPING WARPED SUBSTRATES

      
Application Number EP2023080912
Publication Number 2024/125891
Status In Force
Filing Date 2023-11-07
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • De Munck, Arjen, Franciscus, Johannes
  • Kramer, Gijs
  • Kamphuis, Arnoud, Gerhard
  • Gijsbertsen, Arjan
  • Broers, Rudolf, Cornelis, Henricus

Abstract

The disclosure provides a vacuum table, comprising: a table having a top surface for supporting a substrate, the top surface being provided with at least two pressure zones, each pressure zone connected to a respective vacuum connector for providing a reduced pressure, at least one of the pressure zones being provided with grooves extending in radial direction across the top surface. Respective pressure zones may comprise corresponding grooves connected to the respective vacuum connector and extending along the top surface, the grooves of each pressure zone at least extending in a circular direction along the top surface. The radial grooves may extend like fingers from a corresponding circular groove. The radial grooves of one pressure zone extend between radial grooves of another pressure zone.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

43.

FLUSHING SYSTEM AND METHOD FOR A LITHOGRAPHIC APPARATUS

      
Application Number EP2023082194
Publication Number 2024/125944
Status In Force
Filing Date 2023-11-17
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Van Den Akker, Emericus, Antoon, Theodorus
  • Dannenberg, Johan, Frederik
  • Linthorst, Mart, Willem
  • Kalkman, Ivo, Michel
  • Hazari, Syed Aaquib

Abstract

There is provided a flushing system for a lithographic apparatus, said flushing system including a gas outlet configured to choke a flow of gas passing through the gas outlet at a predetermined rate. Also provided is a method of flushing a lithographic apparatus, the method including providing a flow of gas through the lithographic apparatus and operating a gas outlet from the lithographic apparatus such that the flow of gas is choked through the gas outlet.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

44.

APPARATUS AND METHOD FOR ELECTROSTATICALLY CLAMPING A SUBSTRATE

      
Application Number EP2023082815
Publication Number 2024/125995
Status In Force
Filing Date 2023-11-23
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Jansen, Maarten, Mathijs, Marinus
  • Van Empel, Tjarko, Adriaan, Rudolf
  • Reijnen, Martinus, Cornelis
  • De Vries, Sjoerd, Frans

Abstract

The disclosure provides an apparatus comprising: at least one substrate table for holding a substrate, the substrate table being provided with an electrostatic clamp for electrostatically clamping the substrate; and at least one reflective surface for reflecting charged particles in a direction away from a front side of the substrate. A method of use comprises the steps of electrostatically clamping at least one substrate table on a substrate table; releasing the clamped substrate; lifting the substrate from the substrate table; and providing at least one reflective surface for reflecting charged particles in a direction away from a front side of the substrate.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

45.

PELLICLE MEMBRANE AND METHOD OF MANUFACTURE

      
Application Number EP2023080443
Publication Number 2024/125883
Status In Force
Filing Date 2023-11-01
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Houweling, Zomer, Silvester
  • Ghiasi Kabiri, Mahnaz
  • Giesbers, Adrianus, Johannes, Maria
  • Jain, Abhinav

Abstract

There is provided a pellicle membrane comprising thermally emissive crystals supported by a matrix, wherein the average thickness of the pellicle membrane is greater than the average grain size of the emissive crystals. Also provided is a pellicle assembly comprising such a pellicle membrane, and a lithographic apparatus comprising such a pellicle membrane or pellicle assembly. Also described is a method manufacturing a pellicle membrane including emissive crystals in a matrix, the method including controlling at least one of the chemical composition of the emissive crystals, morphology of the emissive crystals, and annealing conditions to provide a pellicle membrane having a thickness greater than the average grain size of the emissive crystals.

IPC Classes  ?

  • G03F 1/62 - Pellicles or pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
  • G03F 7/20 - Exposure; Apparatus therefor

46.

A CLAMP AND A METHOD FOR MANUFACTURING THE SAME

      
Application Number EP2023081766
Publication Number 2024/125915
Status In Force
Filing Date 2023-11-14
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Chieda, Michael, Andrew
  • Lipson, Matthew
  • Shemesh, Moshe

Abstract

A method includes bonding a first layer and a second layer of a clamp by heating the first layer and the second layer up to a holding temperature of a least 700 °C, maintaining the first layer and the second layer at the holding temperature during a holding time period, and cooling down the first layer and the second layer after the holding time has elapsed at a cooling rate of a maximum of 20 °C/hour for a cooling time period.

IPC Classes  ?

  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

47.

LITHOGRAPHIC APPARATUS THERMAL CONDITIONING SYSTEM AND METHOD

      
Application Number EP2023082505
Publication Number 2024/125973
Status In Force
Filing Date 2023-11-21
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Van De Meerendonk, Remco
  • Swinkels, Milo, Yaro
  • Wijckmans, Maurice, Willem, Jozef, Etiënne
  • Krabben, Ingmar, Gerrit, Willem
  • Van Giessen, Cornelis
  • Janssen, Gerardus, Arnoldus, Hendricus, Franciscus
  • Schapendonk, Markus, Josephus, Cornelis
  • Wu, Long
  • Arora, Sampann
  • Schimmel, Hendrikus, Gijsbertus
  • Feijts, Maurice, Wilhelmus, Leonardus, Hendricus
  • Hoeve, Gert-Jan
  • Pekelder, Sven
  • Vervoordeldonk, Michael, Johannes
  • De Laat, Kim, Johanna, Mechelina

Abstract

A thermal conditioning system is configured to thermally condition an object. The thermal conditioning system comprises a fluid duct configured to be connected to the object and configured to provide a flow of a thermal conditioning fluid to the object The fluid duct comprises a supply duct configured to be connected to the object and to supply the thermal conditioning fluid to the object and a discharging duct 5 configured to be connected to the object and to discharge the thermal conditioning fluid from the object. The supply duct and/or the discharging duct are each provided with at least two silencers arranged in series along the supply duct and along the discharging duct respectively.

IPC Classes  ?

  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G02B 7/18 - Mountings, adjusting means, or light-tight connections, for optical elements for mirrors
  • G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors

48.

MODULAR ASSEMBLY

      
Application Number EP2023083383
Publication Number 2024/126032
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Peijster, Jerry, Johannes, Martinus

Abstract

The present disclosure relates to modular assembly for engaging modules of an apparatus together. The assembly comprising two modules configured to be mutually engageable to adjoin each other. The modules each having a body (71; 72) and multiple engagers (81; 82) that are each configured to engage with a corresponding engager (82; 81) of another of the modules and to complete a corresponding verification circuit. Each verification circuit is configured to be closed on engagement of an engager of one of the modules with a corresponding engager of the other of the modules. The engager is configured to be electrically isolated from the body of the one of the two modules, and the corresponding engager is configured to be electrically connected to the body of the other of the two modules. The modules comprise complex elements which are configured to electron-optically or optically interact with other during operation of the apparatus.

IPC Classes  ?

  • H01J 37/02 - Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof - Details
  • H01J 37/15 - External mechanical adjustment of electron- or ion-optical components
  • H01J 37/16 - Vessels; Containers

49.

PROJECTION SYSTEM CONTROL

      
Application Number EP2023083818
Publication Number 2024/126079
Status In Force
Filing Date 2023-11-30
Publication Date 2024-06-20
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Kunnen, Johan, Gertrudis, Cornelis
  • Brouwer, Cornelis, Melchior
  • Smal, Pavel
  • Van Goch, Bram, Paul, Theodoor

Abstract

A method of controlling a projection system during exposure of a substrate by a lithographic apparatus, the method comprising obtaining a measurement signal of a change of a differential pressure across one or more lenses of a projection system of the lithographic apparatus, calculating an imaging error caused by movement of one or more lens elements of the projection system due to the change of measured differential pressure during the exposure, calculating lens element adjustments which compensate for the calculated imaging error, applying the lens element adjustments, identifying which exposure areas of the substrate were exposed during a delay between the change of differential pressure occurring and the lens element adjustments being applied, and storing information of the identified exposure areas together with the calculated imaging error.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

50.

CONTAMINATION CONTROL

      
Application Number EP2023080091
Publication Number 2024/120701
Status In Force
Filing Date 2023-10-27
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Nikipelov, Andrey
  • Van De Kerkhof, Marcus, Adrianus
  • Gool, Elmar, Leon
  • Kvon, Vladimir
  • Cloin, Christian, Gerardus, Norbertus, Hendricus, Marie
  • Hossain, Md Tahmid

Abstract

A lithographic patterning device contamination control system comprising a support structure configured to support a patterning device, and an electron beam source configured to emit a beam of electrons such that at least part of the beam is incident on a patterned face of a patterning device supported by the support structure during EUV exposure.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

51.

PHASE GENERATED CARRIER INTERROGATOR AND ASSOCIATED PHASE GENERATED CARRIER INTERROGATION METHOD

      
Application Number EP2023081311
Publication Number 2024/120734
Status In Force
Filing Date 2023-11-09
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Ikkink, Teunis, Jan

Abstract

Disclosed is a phase generated carrier interrogator comprising: one or more interferometers, each interferometer operable to receive modulated radiation and to generate a respective interferometer signal comprising a phase of interest induced by a measurand, each said interferometer signal also comprising a periodic phase modulation induced by said modulated radiation, wherein the periodic phase modulation comprises an amplitude described by a respective modulation index for each interferometer; at least one detector operable to detect each interferometer signal; and a signal processing module. The signal processing module is operable to: estimate the modulation index respectively for each interferometer, obtain a respective estimated modulation index for each interferometer; demodulate each interferometer signal using its respective estimated modulation index to estimate a respective phase of interest from each interferometer signal thereby obtaining a respective estimated phase of interest value for each interferometer.

IPC Classes  ?

  • G01B 9/02004 - Interferometers characterised by controlling or generating intrinsic radiation properties using two or more frequencies using frequency scans
  • G01B 9/02 - Interferometers

52.

CONTROLLED DROPLET GENERATOR NOZZLE ENVIRONMENT TO IMPROVE RELIABILITY

      
Application Number EP2023082754
Publication Number 2024/120835
Status In Force
Filing Date 2023-11-22
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Rollinger, Bob
  • Newton, Eric, Lamar
  • Rajyaguru, Chirag
  • Govindaraju, Abhiram, Lakshmi Ganesh
  • Ershov, Alexander, Igorevich
  • Vaschenko, Georgiy, Olegovich

Abstract

Disclosed is an apparatus for and method of controlling an environment around the nozzle orifice of a droplet generator in a source system for generating extreme ultraviolet (EUV) radiation in which an amount of oxygen-containing gas in the nozzle orifice environment is controlled to reduce the formation of oxides that could potentially interfere with operation of the droplet generator.

IPC Classes  ?

  • H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

53.

VACUUM CHAMBERS FOR COLD FIELD EMISSION ELECTRON SOURCES

      
Application Number EP2023083239
Publication Number 2024/120878
Status In Force
Filing Date 2023-11-27
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Zhang, Shun
  • Fan, Zheng
  • Gao, Ru-Xuan

Abstract

An electron source assembly with an improved vacuum chamber for an electron source is provided. The electron source assembly includes an electron source having an emitter tip where electrons are generated. The electron source also includes a vacuum chamber which is configured to enclose the electron source and comprises an outgassing barrier coating layer on an interior surface of the vacuum chamber. The vacuum chamber has undergone a heat treatment in a hydrogen environment and a gas removal treatment under a high vacuum and a high temperature. The electron source assembly also includes a vacuum pump connected to the vacuum chamber and configured to pump down the vacuum chamber to a pressure lower than 1.0 × 10-11 Torr.

IPC Classes  ?

  • H01J 9/39 - Degassing vessels
  • H01J 7/18 - Means for absorbing or adsorbing gas, e.g. by gettering
  • H01J 37/16 - Vessels; Containers
  • H01J 3/02 - Electron guns
  • H01J 37/073 - Electron guns using field emission, photo emission, or secondary emission electron sources

54.

ELECTRON-OPTICAL STACK, MODULE, ASSESSMENT APPARATUS, METHOD OF MANUFACTURING AN ELECTRON-OPTICAL STACK

      
Application Number EP2023083379
Publication Number 2024/120896
Status In Force
Filing Date 2023-11-28
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • De Langen, Johannes, Cornelis, Jacobus
  • Looman, Bram, Albertus
  • Mudretsov, Dmitry
  • Del Tin, Laura

Abstract

The present disclosure relates to an electron-optical stack for manipulating one or more charged particle beams and associated apparatus and methods. In one arrangement, a plurality of electron-optical plates have major surfaces on opposite sides of the plates. The plates define a set of channels configured to be aligned along a beam path of a charged particle beam to allow the charged particle beam to pass through the plates via the channels. Each channel defines apertures in the two major surfaces of the plate that defines the channel. The apertures have different shapes from each other. The plates are oriented such that the apertures comprise one or more matching aperture pairs along the beam path. The or each matching aperture pair consists of apertures having the same shape defined in adjacent major surfaces of adjacent plates.

IPC Classes  ?

  • H01J 37/04 - Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
  • H01J 37/12 - Lenses electrostatic

55.

IMPROVED RETICLE AND RETICLE BLANK

      
Application Number EP2023080467
Publication Number 2024/120705
Status In Force
Filing Date 2023-11-01
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Jochemsen, Marinus
  • Rademaker, Justin
  • Bajonero Canonico, Emilio

Abstract

There is provided a reticle or a reticle blank comprising a low deformation material, wherein the reticle or reticle blank material has a Zero Crossing Temperature (ZCT) profile, and a ZCT slope profile, wherein at least one of the ZCT profile and the ZCT slope profile is non-uniform. Also provided is a method of mitigating non-correctable deformations in a reticle or reticle blank, the method including providing a reticle or reticle blank having at least one of a Zero Crossing Temperature (ZCT) profile and a ZCT slope profile which is non-uniform across the reticle or reticle blank.

IPC Classes  ?

  • G03F 1/22 - Masks or mask blanks for imaging by radiation of 100 nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
  • G03F 1/50 - Mask blanks not covered by groups ; Preparation thereof
  • G21K 1/06 - Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction, or reflection, e.g. monochromators
  • G03F 7/20 - Exposure; Apparatus therefor

56.

SUPERCONTINUUM RADIATION SOURCE

      
Application Number EP2023080777
Publication Number 2024/120709
Status In Force
Filing Date 2023-11-06
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Abdolvand, Amir
  • Travers, John, Colin
  • Ni, Yongfeng
  • Sajadi Hezaveh, Mohsen

Abstract

Disclosed is a broadband radiation source for generating output broadband radiation, comprising a plurality of supercontinuum generation stages arranged in series, each the supercontinuum generation stage comprising a respective nonlinear generation element. The plurality of supercontinuum generation stages comprises at least a first supercontinuum generation stage and a second supercontinuum generation stage, the second supercontinuum generation stage succeeding the first supercontinuum generation stage in the series. A damage tolerance of a first nonlinear generation element comprised within the first supercontinuum generation stage is greater than a damage tolerance of at least a second nonlinear generation element comprised within the second supercontinuum generation stage.

IPC Classes  ?

  • G02F 1/35 - Non-linear optics
  • G02F 1/365 - Non-linear optics in an optical waveguide structure

57.

SYSTEMS AND METHODS FOR SEQUENTIAL AND PARALLEL OPTICAL DETECTION OF ALIGNMENT MARKS

      
Application Number EP2023081365
Publication Number 2024/120738
Status In Force
Filing Date 2023-11-09
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Beukman, Arjan, Johannes, Anton
  • Bijnen, Franciscus, Godefridus, Casper

Abstract

A sensor apparatus includes a sensor array and a metrology stage coupled to the sensor array. The sensor array includes a plurality of sensors. Each sensor of the sensor array is configured to illuminate radiation to a diffraction target (204) on a substrate (202) and detect a signal beam (290) including diffraction order sub-beams reflected from the diffraction target. The metrology stage is configured to move the sensor array relative to the substrate. The sensor apparatus is configured to measure a plurality of diffraction targets on the substrate at a rate based on a density of the plurality of sensors relative to the plurality of diffraction targets.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

58.

DISPERSION ENGINEERED BEAM MODIFIER FOR A METROLOGY SYSTEM

      
Application Number EP2023081759
Publication Number 2024/120765
Status In Force
Filing Date 2023-11-14
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Jahani, Saman
  • Rezvani Naraghi, Roxana

Abstract

A metrology system is described. Metasurfaces are used to replace (or to augment) an existing objective lens to focus radiation such as light, tune a focal length, and/or correct aberrations in the metrology system. A metasurface is configured to receive a diffracted incident radiation beam from a radiation source, with the diffracted incident radiation beam having a known wavelength range, and transmit separate narrower band sub-beams of radiation having a modified amplitude, phase, and/or polarization in comparison to the diffracted incident radiation. The metasurface comprises different sub-portions configured to transmit the separate narrower band sub-beams of radiation. The different sub-portions are configured for different non-overlapping radiation wavelength bandwidths within the known wavelength range.

IPC Classes  ?

  • G02B 1/00 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements
  • G02B 27/10 - Beam splitting or combining systems
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

59.

DETERMINING A FOCUS POSITION FOR IMAGING A SUBSTRATE WITH AN INTEGRATED PHOTONIC SENSOR

      
Application Number EP2023081762
Publication Number 2024/120766
Status In Force
Filing Date 2023-11-14
Publication Date 2024-06-13
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Jahani, Saman
  • Rezvani Naraghi, Roxana
  • Guevara Torres, Raul, Andres
  • Granados-Baez, Marissa
  • Sahin, Ezgi

Abstract

The metrology system(s) and method(s) described herein eliminate the need for a separate focus branch often used in prior metrology systems to determine a focus position for imaging a substrate. Instead of using a separate focus branch, an integrated photonic sensor is used to determine the focus position. The integrated photonic sensor is based on apodized grating couplers where, by changing a grating period and/or duty cycle, the amplitude and the phase of the grating coupler mode is engineered to have an optimum coupling efficiency for a specific defocus (or initial / known focus position). A coupling efficiency is determined between an emitting grating and a receiving grating based on emitted radiation with a certain amplitude and phase configured for a known position relative to a substrate, and reflected radiation received from the substrate. A focus position is determined based on the coupling efficiency and the known position.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

60.

SYSTEMS AND METHODS OF ENERGY DISCRIMINATION OF BACKSCATTERED CHARGED-PARTICLES

      
Application Number EP2023080449
Publication Number 2024/115029
Status In Force
Filing Date 2023-11-01
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Ji, Xiaoyu
  • Ren, Weiming

Abstract

Systems and methods of imaging a sample using a charged-particle beam apparatus are disclosed. The charged-particle beam apparatus may include a charged-particle source configured to generate primary charged particles, the primary charged particles forming a primary charged-particle beam along a primary optical axis, and a charged-particle detector comprising a plurality of concentric segments of a charged-particle sensitive material configured to detect charged particles emitting from a sample after interaction of the primary charged-particle beam with the sample, wherein each segment of the plurality of concentric segments is configured to collect the emitted charged particles having a range of energy levels and a dominant energy level.

IPC Classes  ?

  • H01J 37/244 - Detectors; Associated components or circuits therefor

61.

ELECTROSTATIC CLAMP, GRIPPER ASSEMBLY INCLUDING THE CLAMP, LITHOGRAPHIC SYSTEM COMPRISING AN ELECTROSTATIC CLAMP, AND METHOD OF MAKING AN ELECTROSTATIC CLAMP

      
Application Number EP2023080515
Publication Number 2024/115033
Status In Force
Filing Date 2023-11-02
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Poiesz, Thomas
  • Stein, Alexander
  • Van Rooij, René, Adrianus

Abstract

The disclosure provides an electrostatic clamp for clamping an object, comprising: an electrode layer; a first isolating layer comprising an electrically isolating flexible material arranged on top of the electrode layer, the first isolating layer having a first thickness; a first shielding layer comprising an electrically conductive material arranged on top of the first isolating layer, the first shielding layer having a first shielding thickness and a cut-out pattern for exposing the electrode layer covered with the first isolating layer; and a number of burls of at least 1 µm tall arranged on top of the first shielding layer at the location of the cut-out pattern.

IPC Classes  ?

  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

62.

APPARATUS FOR AND METHOD OF COMBINED DISPLAY OF OPTICAL MEASUREMENT INFORMATION

      
Application Number EP2023080728
Publication Number 2024/115041
Status In Force
Filing Date 2023-11-03
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Huisman, Simon, Reinald
  • Goorden, Sebastianus, Adrianus

Abstract

Disclosed is an apparatus for and method of simultaneous capture and presentation of multiple types of alignment information in which a pupil is divided and the radiation from the pupil is spatially separated. In some versions the alignment information is first order diffraction information and polarization channel intensity information which are presented simultaneously in an image-based system.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

63.

DETERMINING A FOCUS POSITION BASED ON A FIELD IMAGE POSITION SHIFT

      
Application Number EP2023081205
Publication Number 2024/115066
Status In Force
Filing Date 2023-11-08
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Huang, Chien, Jung
  • Rezvani Naraghi, Roxana
  • Guevara Torres, Raul, Andres
  • Granados-Baez, Marissa

Abstract

The metrology system(s) and method(s) described herein eliminate the need for a separate focus branch (e.g., comprising an illumination source, several lenses, and many other optical components) often used in prior metrology systems to determine a focus position for imaging a substrate. Instead of using a separate focus branch, the present system(s) and method(s) use the position of a field image taken of the substrate in the ordinary course of a metrology measurement using existing sensing components to determine the focus position. A shift of the field image position from an expected field image position is determined, and the focus position for imaging the substrate is determined based on the shift.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

64.

A FLUID HANDLING SYSTEM, METHOD AND LITHOGRAPHIC APPARATUS

      
Application Number EP2023082607
Publication Number 2024/115207
Status In Force
Filing Date 2023-11-21
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Winkels, Koen, Gerhardus
  • Berendsen, Christianus, Wilhelmus, Johannes
  • Tukker, Teunis, Willem

Abstract

A fluid handling system comprising: a liquid confinement structure configured to confine immersion liquid to a space between at least a part of the liquid confinement structure and a surface of a substrate, the liquid confinement structure having an aperture formed therein for the passage therethrough of a radiation beam to irradiate the surface of the substrate by passing through the immersion liquid; and a diagnostic tool configured to detect an abnormal condition in the fluid handling system, the diagnostic tool comprising an acoustic system configured to measure acoustic characteristics of the liquid confinement structure and/or the immersion liquid, wherein the acoustic system comprises a transducer configured to emit and/or receive acoustic waves to/from the immersion liquid.

IPC Classes  ?

  • G03F 7/20 - Exposure; Apparatus therefor
  • G01N 29/032 - Analysing fluids by measuring attenuation of acoustic waves

65.

METHOD FOR LABELING TIME SERIES DATA RELATING TO ONE OR MORE MACHINES

      
Application Number EP2023080874
Publication Number 2024/115048
Status In Force
Filing Date 2023-11-06
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Gkorou, Dimitra
  • Gantapara, Anjan Prasad
  • Ypma, Alexander
  • Aydin, Yakup

Abstract

Disclosed is a method for labeling time series data relating to one or more machines. The method comprises obtaining said time series data; segmenting said time series data to obtain a plurality of patterns grouped according to pattern similarity; labeling a subset of said plurality of patterns to obtain a labeled subset of patterns, the remaining patterns of the plurality of patterns comprising unlabeled 5 patterns; defining a graph structure over said patterns, said graph structure describing similarity between the patterns; and classifying and/or labeling the unlabeled patterns to obtain labeled patterns using the graph structure and the labeled subset of patterns.

IPC Classes  ?

  • G06N 3/0895 - Weakly supervised learning, e.g. semi-supervised or self-supervised learning
  • G06N 5/022 - Knowledge engineering; Knowledge acquisition
  • G06N 5/04 - Inference or reasoning models

66.

CHARGED PARTICLE ASSESSMENT METHOD AND SYSTEM

      
Application Number EP2023082591
Publication Number 2024/115204
Status In Force
Filing Date 2023-11-21
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Dave, Dhara
  • Kuiper, Vincent, Sylvester

Abstract

A charged particle assessment method for identifying candidate defects in samples by scanning a charged particle beam across a sample; the method comprising: obtaining a first reference image from a first region of the sample and a second reference image from a second region of the sample using a charged particle assessment apparatus; obtaining a sample image from a third region of the sample using the charged particle assessment apparatus; and comparing the sample image to the first reference image and to the second reference image to identify any candidate defects in the third region; wherein the first reference image and/or the second reference image are obtained with a higher fidelity than the sample image.

IPC Classes  ?

  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams
  • G06T 7/00 - Image analysis
  • H01J 37/22 - Optical or photographic arrangements associated with the tube

67.

ACTUATOR ARRAY, PARTICULARLY FOR SUBSTRATE TABLE AND LITHOGRAPHIC APPARATUS, AND PIEZOELECTRIC ACTUATOR CONTROL CIRCUIT ARRANGEMENT

      
Application Number EP2023082790
Publication Number 2024/115254
Status In Force
Filing Date 2023-11-23
Publication Date 2024-06-06
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Butler, Hans
  • Steur, Michael, Marinus, Anna
  • Jansen, Bas
  • Van Duivenbode, Jeroen
  • Degasperi, Andrea

Abstract

PZrefref), wherein the actuator and the capacitor are at a location remote from their control circuit (CC, AMP).

IPC Classes  ?

  • H10N 30/80 - Constructional details
  • H02N 2/06 - Drive circuits; Control arrangements
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

68.

METHOD AND SOURCE MODUL FOR GENERATING BROADBAND RADIATION

      
Application Number EP2023078992
Publication Number 2024/110124
Status In Force
Filing Date 2023-10-18
Publication Date 2024-05-30
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Edward, Stephen
  • Abdolvand, Amir

Abstract

Method and apparatus for generating broadband radiation. The method comprises directing pulsed pump radiation through a moving nonlinear medium, and thereby generating, through spectral broadening, broadband radiation from the pulsed pump radiation inside the moving nonlinear medium. The power of the pump radiation inside the moving nonlinear medium is at least a critical power for initiating filamentation within the moving nonlinear medium.

IPC Classes  ?

  • G02F 1/35 - Non-linear optics
  • G02F 1/355 - Non-linear optics characterised by the materials used

69.

PHOTONIC INTEGRATED CIRCUIT FOR GENERATING BROADBAND RADIATION

      
Application Number EP2023079086
Publication Number 2024/110129
Status In Force
Filing Date 2023-10-19
Publication Date 2024-05-30
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Sahin, Ezgi
  • Akbulut, Duygu
  • Abdolvand, Amir

Abstract

A photonic integrated circuit comprises an optical input configured to receive pump radiation, and a plurality of nonlinear elements connected to the optical input. The plurality of nonlinear elements are configured to generate broadband radiation upon receiving the pump radiation. At least two of the plurality of nonlinear elements differ in at least a material and/or a dimension.

IPC Classes  ?

  • G02F 1/365 - Non-linear optics in an optical waveguide structure

70.

CURVILINEAR POLYGON RECOVERY FOR OPC MASK DESIGN

      
Application Number EP2023079845
Publication Number 2024/110141
Status In Force
Filing Date 2023-10-25
Publication Date 2024-05-30
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Hu, Chenyang
  • Hu, Weixuan
  • Jia, Ningning
  • Wang, Shulu

Abstract

Disclosed are methods, systems, and computer software for generating a mask design. A method can include obtaining an initial OPC pattern contour resulting from an OPC process and determining a set of selected points on the initial OPC pattern contour. Metrics can be calculated that describe arcs between the selected points along the initial OPC pattern contour and a recovery location can be determined based on the calculation of the metrics. A recovered OPC pattern can be generated based on the recovery location.

IPC Classes  ?

  • G03F 1/36 - Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
  • G03F 1/70 - Adapting basic layout or design of masks to lithographic process requirements, e.g. second iteration correction of mask patterns for imaging

71.

ELECTRON-OPTICAL ELEMENT AND METHOD OF ASSESSING AN ELECTRON-OPTICAL ELEMENT

      
Application Number EP2023082596
Publication Number 2024/110486
Status In Force
Filing Date 2023-11-21
Publication Date 2024-05-30
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor De Langen, Johannes, Cornelis, Jacobus

Abstract

The present disclosure relates to electron-optical elements and methods for assessing electron-optical elements. In one arrangement, an electron-optical element comprises a substrate defining at least one aperture extending through the substrate between two planar surfaces. At least one of the planar surfaces comprises a plurality of marks formed on or in the planar surface. A distance between centers of at least one pair of adjacent marks is: equal to or less than half of a largest dimension of one of the at least one aperture; and/or equal to or less than half of a distance between centers of at least one pair of adjacent apertures, in a case where the at least one aperture comprises a plurality of apertures.

IPC Classes  ?

  • H01J 37/04 - Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams

72.

CHARGED PARTICLE OPTICAL DEVICE, ASSESSMENT APPARATUS, METHOD OF ASSESSING A SAMPLE

      
Application Number EP2023082600
Publication Number 2024/110489
Status In Force
Filing Date 2023-11-21
Publication Date 2024-05-30
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Urbanus, Willem, Henk
  • De Langen, Johannes, Cornelis, Jacobus
  • Wieland, Marco, Jan-Jaco
  • Del Tin, Laura
  • Koning, Johan, Joost

Abstract

The present disclosure relates to charged particle devices for projecting charged particles towards a sample and methods of assessing a sample using charged particles. A charged particle optical element directs beams of charged particles towards a sample. The charged particle optical element comprising a plate in which is defined beam apertures and a plurality of vent apertures. A beam tube defines an inner tube volume comprising paths up-beam of the plate of charged particles of the beams, and an outer tube region that is outside of the beam tube. The beam apertures are for passage towards the sample of charged particles of the beams, from the inner tube volume to a down-beam volume on an opposite side of the plate to the inner tube volume. Vent apertures fluidically connect the down-beam volume to the outer tube region.

IPC Classes  ?

  • H01J 37/18 - Vacuum locks
  • H01J 37/04 - Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
  • H01J 37/26 - Electron or ion microscopes; Electron- or ion-diffraction tubes

73.

A BROADBAND RADIATION SOURCE

      
Application Number EP2023078696
Publication Number 2024/104676
Status In Force
Filing Date 2023-10-16
Publication Date 2024-05-23
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Sajadi Hezaveh, Mohsen
  • Abdolvand, Amir
  • Köhler, Johannes, Richard, Karl
  • Karpate, Tanvi

Abstract

A radiation device for generating broadband radiation upon receiving pump radiation, comprising: an optical waveguide having a hollow core along a longitudinal axis of the optical waveguide; wherein the optical waveguide is configured to substantially confine the pump radiation within the hollow core; a working medium comprising molecules having a permanent dipole moment comprised within the hollow core of the optical waveguide, wherein the working medium is configured to spectrally broaden the pump radiation to generate the broadband radiation; and an electric field generating device for generating an electric field across the working medium, wherein the electric field is configured to orient the molecules of the working medium.

IPC Classes  ?

  • G02F 1/35 - Non-linear optics
  • G02F 1/365 - Non-linear optics in an optical waveguide structure

74.

OPTICAL SYSTEM FOR METROLOGY

      
Application Number EP2023079452
Publication Number 2024/104730
Status In Force
Filing Date 2023-10-23
Publication Date 2024-05-23
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Cappelli, Douglas C.

Abstract

An optical system comprising a double quad mirror is described. The optical system is configured to reflect two quadrants of an incident radiation beam approaching from either side of the mirror, while allowing the opposite two quadrants to transmit incident radiation. The optical system has a body with at least one transmissive surface and at least one reflective surface for radiation incident on different sides of the body. The at least one reflective surface on the body is adjacent to a recess within the body that creates an air gap for total internal reflection of radiation incident on the reflective surface toward a first target or toward a sensor. The at least one transmissive surface on the body is configured to transmit incident radiation through the body toward a second target or toward the sensor.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

75.

A FIBER MANUFACTURING INTERMEDIATE PRODUCT AND METHOD OF PRODUCING PHOTONIC CRYSTAL FIBERS

      
Application Number EP2023080138
Publication Number 2024/104764
Status In Force
Filing Date 2023-10-27
Publication Date 2024-05-23
Owner
  • ASML NETHERLANDS B.V. (Netherlands)
  • MAX-PLANCK-GESELLSCHAFT ZUR FÖRDERUNG DER WISSENSCHAFTEN E.V. (Germany)
Inventor
  • Uebel, Patrick, Sebastian
  • Frosz, Michael, Henoch
  • Lagler, Josef

Abstract

Disclosed is a method of manufacturing an optical fiber and a fiber manufacturing intermediate product. The fiber manufacturing intermediate product comprising: an outer jacket; and a plurality of capillaries, wherein said capillaries comprise an intermediate level capillary diameter ratio of capillary inner diameter to outer capillary diameter greater than 0.90 and wherein a nominal wall thickness of each said capillary at said intermediate- level is greater than 1500nm. This intermediate product may be drawn to a fiber where the wall thickness in each capillary in the drawn fiber is less than 200nm.

IPC Classes  ?

  • C03B 37/012 - Manufacture of preforms for drawing fibres or filaments
  • C03B 37/027 - Fibres composed of different sorts of glass, e.g. fibre optics

76.

OBJECT HOLDER AND MANUFACTURING METHOD

      
Application Number EP2023080522
Publication Number 2024/104782
Status In Force
Filing Date 2023-11-02
Publication Date 2024-05-23
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Van Drent, William, Peter

Abstract

An object holder is configured to support an object. The object holder (20) comprises a core body (21) comprising a plurality of burls (22) having distal ends (23) in a support plane (24) for supporting the object. The object holder further comprises an electrostatic sheet (25) between the burls. The electrostatic sheet comprises an electrode (26) comprising a metal, and metal oxide layers (27, 28) comprising an oxide of the metal. The electrode is sandwiched between the metal oxide layers.

IPC Classes  ?

  • G03F 7/20 - Exposure; Apparatus therefor
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

77.

SIMULATING AN ELECTROMAGNETIC RESPONSE OF A SEMICONDUCTOR STRUCTURE FOR DIFFRACTION BASED OPTICAL METROLOGY

      
Application Number EP2023081103
Publication Number 2024/104854
Status In Force
Filing Date 2023-11-08
Publication Date 2024-05-23
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Bai, Shufeng
  • Wu, Jian
  • Buijnsters, Frank, Jaco
  • Whysong, David, Harold

Abstract

Simulating an electromagnetic response of a semiconductor structure for diffraction based optical metrology is described. The simulated electromagnetic response is used to determine an optical property of the semiconductor structure, such as a reflectivity coefficient. A rigorous coupled wave analysis (RCWA) is used to simulate reflectivity of the semiconductor structure layer by layer, and unit cell by unit cell. With a proper choice of a division point, the semiconductor structure can be separated into top and bottom portions that can be further sub-divided into smaller, identical unit cells in an X-Y plane. These unit cells can be simulated individually, and then the simulations can be combined together to obtain the reflection coefficient of the entire semiconductor structure. This RCWA + unit cell simulation approach decreases required simulation time, does not require calculation of a full scattering matrix, and/or has other advantages compared to prior approaches.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

78.

A METHOD OF PRODUCING PHOTONIC CRYSTAL FIBERS

      
Application Number EP2023080133
Publication Number 2024/104763
Status In Force
Filing Date 2023-10-27
Publication Date 2024-05-23
Owner
  • ASML NETHERLANDS B.V. (Netherlands)
  • MAX-PLANCK-GESELLSCHAFT ZUR FÖRDERUNG DER WISSENSCHAFTEN E.V. (Germany)
Inventor
  • Uebel, Patrick, Sebastian
  • Frosz, Michael, Henoch
  • Lagler, Josef

Abstract

Disclosed is a method of manufacturing an optical fiber, the optical fiber comprising an outer jacket and a plurality of capillaries defining a hollow core. The method comprises obtaining a fiber manufacturing intermediate product; and drawing a fiber from said fiber manufacturing intermediate product. Said drawing is such that the fiber-level capillary wall thickness of each capillary in the drawn fiber is less than 200nm and a tension applied during said drawing is larger than 20MPa.

IPC Classes  ?

  • C03B 37/027 - Fibres composed of different sorts of glass, e.g. fibre optics
  • C03B 37/012 - Manufacture of preforms for drawing fibres or filaments

79.

A DROPLET STREAM ALIGNMENT MECHANISM AND METHOD THEREOF

      
Application Number EP2023081067
Publication Number 2024/104842
Status In Force
Filing Date 2023-11-07
Publication Date 2024-05-23
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Duvall, Wyatt
  • Veber, Guy Du Motay
  • Swerdlow, Ethan, Marcus

Abstract

A system (600) includes first (604) and second (606) portions of an alignment mechanism. The first portion is coupled to a nozzle (602) within a droplet generation device. The second portion is coupled to an outside surface (608) of the droplet generation device. The second portion comprises a second adjustment mechanism (612) to adjust a first adjustment mechanism (610) of the first portion in order to align the nozzle such that droplets travel from the nozzle substantially along a droplet path (614).

IPC Classes  ?

  • H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

80.

CLEANING DEVICE AND METHOD FOR REMOVING CONTAMINATION PARTICLES FROM A SURFACE TO BE CLEANED

      
Application Number EP2023081109
Publication Number 2024/104855
Status In Force
Filing Date 2023-11-08
Publication Date 2024-05-23
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Chaudhuri, Manis
  • Cloin, Christian, Gerardus, Norbertus, Hendricus, Marie
  • Yakunin, Andrei, Mikhailovich
  • Van De Kerkhof, Marcus, Adrianus

Abstract

A cleaning device for removing contamination particles from a surface to be cleaned. The cleaning device comprises an oxygen source configured to emit oxygen and thereby oxidize the contamination particles and the surface to be cleaned. The cleaning device comprises an electron source configured to emit electrons and thereby negatively charge oxidized contamination particles and the surface to be cleaned. The cleaning device comprises a contamination particle collector configured to receive a positive electric charge and thereby attract negatively charged contamination particles ejected from the surface to be cleaned.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • B08B 6/00 - Cleaning by electrostatic means
  • H01J 37/317 - Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. ion implantation

81.

POSITION MEASUREMENT SYSTEM AND LITHOGRAPHIC APPARATUS

      
Application Number EP2023077948
Publication Number 2024/099660
Status In Force
Filing Date 2023-10-10
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Jones, Rachel, Ann
  • Bente, Erwin, Antonius, Josephus, Maria

Abstract

In an integrated displacement sensor, a light source beam is guided along a plane, and at least part of said beam is received at an emission grating and diffracted away from the plane to form an emission beam. A target grating arranged on an object of interest receives the emission beam, which is diffracted thereupon to form zero order, first order and minus first order diffraction beams. Two first order couplers form planar first and minus first order diffraction beams. A zero order coupler forms a planar zero order diffraction beam; a first and minus first order combining device generates at least one first diffraction order interference optical signal; a zero order combining device generates a zero diffraction order interference optical signal using the planar zero order diffraction beam and a reference part of the light source beam; optical sensors receive diffraction order interference optical signals and generate output signals.

IPC Classes  ?

  • G01B 11/00 - Measuring arrangements characterised by the use of optical techniques
  • G01D 5/38 - Forming the light into pulses by diffraction gratings

82.

CORRECTING SCAN DATA

      
Application Number EP2023078520
Publication Number 2024/099685
Status In Force
Filing Date 2023-10-13
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Calado, Victor, Emanuel
  • Amorese, Andrea
  • Van Rens, Jasper, Frans, Mathijs
  • Huisman, Thomas, Jarik

Abstract

A method for correcting scan data generated by scanning a sample with charged particles and detecting signal charged particles emitted from the sample, the method comprising: selecting at least one scan profile (50) for scanning the sample; and correcting (74) scan data generated by the scanning of the sample, based on at least one known distortion function f(x,y) associated with the at least one selected scan profile.

IPC Classes  ?

  • H01J 37/22 - Optical or photographic arrangements associated with the tube
  • H01J 37/26 - Electron or ion microscopes; Electron- or ion-diffraction tubes
  • H01J 37/28 - Electron or ion microscopes; Electron- or ion-diffraction tubes with scanning beams

83.

SYSTEMS, METHODS, AND SOFTWARE FOR OVERLAY MODEL BUILDING AND APPLICATION

      
Application Number EP2023078530
Publication Number 2024/099686
Status In Force
Filing Date 2023-10-13
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Fu, Jiyou
  • Zhang, Chenyu

Abstract

Systems, methods, and computer software are disclosed for determining overlays. One method can include performing a component analysis on a set of Scanning Electron Microscope (SEM) images to obtain coefficients of one or more selected components, where the set of SEM images comprises a multi-layer image. The overlay (OVL) can be determined for the multi-layer image based on the coefficients.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G01N 21/956 - Inspecting patterns on the surface of objects
  • G06T 7/00 - Image analysis
  • H01L 21/66 - Testing or measuring during manufacture or treatment

84.

METHOD AND APPARATUS FOR INSPECTION FOCUS MEASUREMENT

      
Application Number EP2023079327
Publication Number 2024/099740
Status In Force
Filing Date 2023-10-20
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Guevara Torres, Raul, Andres
  • Jenkins, Gregory, Warren

Abstract

Systems and methods of measuring a focus position in a metrology system include introducing an optical element into a measurement arm of the metrology system, the optical element being configured and arranged to modify a point spread function at least two different positions in an image plane of the metrology system by adding a positive defocus to a first position of the at least two different positions and a negative defocus to a second position of the at least two different positions, illuminating a substrate comprising features to be measured by the metrology system with a measurement beam of radiation that passes from the substrate to the image plane, and controlling a focal position of the substrate on the basis of a first spot size at the image plane at the first position to a second spot size at the image plane at the second position.

IPC Classes  ?

  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F 7/20 - Exposure; Apparatus therefor

85.

ALIGNMENT METHOD AND ASSOCIATED ALIGNMENT AND LITHOGRAPHIC APPARATUSES

      
Application Number EP2023079397
Publication Number 2024/099744
Status In Force
Filing Date 2023-10-23
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Thissen, Nick, Franciscus, Wilhelmus
  • Mathijssen, Simon, Gijsbert, Josephus

Abstract

Disclosed is a method for determining at least one set of correction weights to correct metrology data is disclosed. The method comprises obtaining first and second metrology data relating respectively to a first layer and a second layer. Each of the first and second metrology data is fitted to a model for representing the metrology data to determine a first set of fit residuals and second set of fit residuals. The at least one set of correction weights as at least one set of correction weights are determined to minimize a difference between said first set of fit residuals and said second set of fit residuals.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 9/00 - Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

86.

LINEAR MOTOR MOTION SYSTEM AND METHOD

      
Application Number EP2023080346
Publication Number 2024/099823
Status In Force
Filing Date 2023-10-31
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Mattaar, Thomas, Augustus
  • Schotman, Gerrit, Josephus, Cornélie
  • Vreugdewater, Patricia
  • Venugopalan, Naveen

Abstract

A linear motor motion system is configured to move an object and comprises: a magnetic track; a coil unit, including a plurality of coils wound about respective ferromagnetic cores, a bearing configured to guide the coil unit along the magnetic track, wherein the bearing is constructed and arranged to only allow substantial movement of the coil unit relative to the magnetic track in a first direction; and a commutation device configured to provide input signals to each of the coils in response to the setpoint signal representative of a desired position of the object. The commutation device is configured to provide the input signals to generate an actuation force in the first direction to move the object in the first direction and a compensation force in a second direction perpendicular to the first direction to at least partly compensate a disturbance force in the second direction.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • H02P 6/00 - Arrangements for controlling synchronous motors or other dynamo-electric motors using electronic commutation dependent on the rotor position; Electronic commutators therefor
  • H02K 41/035 - DC motors; Unipolar motors

87.

SUBSTRATE SUPPORT AND LITHOGRAPHIC APPARATUS

      
Application Number EP2023077321
Publication Number 2024/099640
Status In Force
Filing Date 2023-10-03
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Seeger, Thilo, Nils, Martin
  • Huang, Zhuangxiong
  • Roset, Niek, Jacobus, Johannes

Abstract

A substrate support configured to support a substrate in a lithographic apparatus comprising: a first circumferential (31) wall having a first height; a first drain (12) radially outwards of the first circumferential wall and configured to extract fluid; a second circumferential (32) wall having a second height and radially outwards of the first opening; a second drain (119) radially outwards of the second circumferential wall and configured to extract fluid; a flow restriction (33) having a third height and radially outwards of the second opening; and a third drain (10) radially outwards of the flow restriction and the substrate and configured to extract fluid; wherein the first opening, the second opening and the third opening are distributed around the circumference of the substrate support; and the third height is less than the first height and the second height.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

88.

CONTAMINATION CONTROL

      
Application Number EP2023078200
Publication Number 2024/099673
Status In Force
Filing Date 2023-10-11
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Chaudhuri, Manis
  • Cloin, Christian, Gerardus, Norbertus, Hendricus, Marie
  • Yakunin, Andrei, Mikhailovich

Abstract

A lithographic patterning device contamination control assembly comprising a support structure configured to support a patterning device floating with respect to ground, a masking apparatus configured to selectively mask the lithographic patterning device, the masking apparatus being connected to ground, a gas supply and an ionizer, the gas supply being configured to supply gas to the ionizer, and the ionizer being configured to convert the gas to a quasi-neutral plasma which is located in a region between the masking apparatus and the lithographic patterning device.

IPC Classes  ?

89.

CREATING A DENSE DEFECT PROBABILITY MAP FOR USE IN A COMPUTATIONAL GUIDED INSPECTION MACHINE LEARNING MODEL

      
Application Number EP2023078857
Publication Number 2024/099710
Status In Force
Filing Date 2023-10-17
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor Wang, Fuming

Abstract

An apparatus for training a machine learning model for inspecting a wafer includes a memory storing a set of instructions and at least one processor configured to execute the set of instructions to cause the apparatus to perform: inputting wafer characteristic data into the machine learning model for an Nth wafer, wherein N is an integer; generating a defect probability map based on the input data for the Nth wafer; and inputting wafer characteristic data into the machine learning model for an N+1th wafer and inputting a generated defect probability map for 1–N wafers into the machine learning model at a predetermined interval.

IPC Classes  ?

90.

METHODS AND SYSTEMS FOR CLEANING A PORTION OF A LITHOGRAPHY APPARATUS

      
Application Number EP2023080493
Publication Number 2024/099852
Status In Force
Filing Date 2023-11-01
Publication Date 2024-05-16
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Baheti, Ankur, Ramesh
  • Lipson, Matthew
  • Evans, Brandon, Adam

Abstract

Cleaning contamination particles from a clamp of a lithography apparatus is described. Used clamps have burl tops contaminated with contamination particles which need to be cleaned before returning to service. Currently, to fully clean the burl tops of such a clamp, a hard and electrically conductive coating that covers the burl tops is stripped and a fresh coating is applied. This requires disconnecting a clamp from a chuck, stripping various coatings from non-burl areas of the clamp, and removing high voltage connections. Thereafter, high voltage connections are rebuilt and, various coatings are reapplied, and the clamp is then qualified. Finally, the clamp is re-connected to the chuck, and manufacturing may continue. A new cleaning method enables the cleaning of the burl tops without needing to disconnect the clamp or take the caps off to perform the burl top refresh, which saves hours or weeks of downtime.

IPC Classes  ?

91.

POSITIONING SYSTEM AND METHOD FOR POSITIONING A MOVEABLE OBJECT USING A POSITIONING SYSTEM

      
Application Number EP2023076199
Publication Number 2024/094365
Status In Force
Filing Date 2023-09-22
Publication Date 2024-05-10
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Hermans, Rudolf, Michiel
  • Brummelhuis, Karst
  • De Jong, Adrianus, Constantijn

Abstract

The invention provides a positioning system for positioning a movable object, comprising: multiple actuators arranged to move the movable object in one or more degrees of freedom, wherein the multiple actuators comprise more actuators than the one or more degrees of freedom, a control system comprising a controller to provide control signals on the basis of a set-point and/or a control error, and a transformation matrix to transform the control signals into actuator inputs for the multiple actuators, wherein the transformation matrix comprises transformation values for each relationship between one of the control signals and one of the actuator inputs, wherein the transformation values are selected in dependence of an intended trajectory of the movable object and/or wherein, in use, the transformation values are adjustable in dependence of one or more actual performance related parameters of the positioning system.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G05B 19/19 - Numerical control (NC), i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path

92.

A COATED ASSEMBLY WITH A BRAZED FEATURE AND A CERAMIC CVD COATING; AND PROCESSES OF FABRICATING THE SAME

      
Application Number EP2023076438
Publication Number 2024/094370
Status In Force
Filing Date 2023-09-25
Publication Date 2024-05-10
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Carnevale, Chad, James
  • Kirsch, Alex, James
  • Scaffidi, Kyle, John
  • Tedrow, Jon, David

Abstract

Disclosed is a component having features attached to it by brazing with the component being subsequently provided with a protective coating using a CVD process. The body of the component may be made of metal and fabricated using an additive manufacturing process. Also disclosed is a process for making such a component.

IPC Classes  ?

  • B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
  • C23C 16/34 - Nitrides
  • B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered

93.

COOLING SYSTEM FOR A LINEAR ACTUATOR

      
Application Number EP2023077808
Publication Number 2024/094386
Status In Force
Filing Date 2023-10-07
Publication Date 2024-05-10
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Finney, Nathan, Robert
  • Roux, Stephen
  • Zordan, Enrico
  • Bustraan, Krijn, Frederik
  • Burbank, Daniel, Nathan

Abstract

A cooling system for a linear actuator is described. The system includes wound electrical coils and cooling plates. The electrical coils are configured to be energized to provide an electromagnetic force for the linear actuator. The electrical coils are configured to surround an armature of the linear actuator. The cooling plates are in thermal contact with the electrical coils and configured to cool the electrical coils. Individual cooling plates are configured to surround the armature and are positioned between adjacent individual coils such that the electrical coils and the cooling plates form an alternating series of plates and coils along a length of the armature.

IPC Classes  ?

  • H02K 9/22 - Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
  • H02K 41/03 - Synchronous motors; Motors moving step by step; Reluctance motors
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

94.

OPTICAL AMPLIFIER

      
Application Number EP2023078266
Publication Number 2024/094401
Status In Force
Filing Date 2023-10-11
Publication Date 2024-05-10
Owner
  • ASML NETHERLANDS B.V. (Netherlands)
  • TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING GMBH (Germany)
Inventor
  • Struycken, Alexander, Matthijs
  • Schulz, Joachim
  • Erhard, Steffen, Alfred

Abstract

An optical amplifier configured to amplify a laser beam, the optical amplifier comprising: an optical path of the laser beam, the optical path comprising a first part and a second part and a reflector configured to reflect the laser beam so as to direct the laser beam between the first and second parts of the optical path, the reflector being configured to reflect the laser beam such that the laser beam reflected by the reflector is parallel to the laser beam incident on the reflector.

IPC Classes  ?

  • H01S 3/23 - Arrangement of two or more lasers not provided for in groups , e.g. tandem arrangement of separate active media
  • H01S 3/07 - Construction or shape of active medium consisting of a plurality of parts, e.g. segments
  • H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

95.

DOSE CONTROL SYSTEM

      
Application Number EP2023076982
Publication Number 2024/094374
Status In Force
Filing Date 2023-09-28
Publication Date 2024-05-10
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Mcgrogan, Sean W.
  • Noordman, Oscar, Franciscus, Jozephus

Abstract

A control apparatus includes: a power controller configured to control an amount of energy in an exposure beam; and a tracking module configured to: determine an amount of accumulated energy of a region that moves through the exposure beam while the region is in the exposure beam; predict whether the accumulated energy of the region will exceed a dose limit prior to leaving the exposure beam; and if the accumulated energy of the region is predicted to exceed the dose limit, provide a control input to the power controller.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

96.

SOURCE OPTIMIZATION FOR MITIGATING MASK ERROR IMPACT

      
Application Number EP2023077802
Publication Number 2024/094385
Status In Force
Filing Date 2023-10-06
Publication Date 2024-05-10
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Hsu, Duan-Fu, Stephen
  • Tang, Jialei
  • Zhang, Youping

Abstract

Systems, methods, and computer software are disclosed for reducing wafer patterning errors caused by a mask device. One method (300) can include obtaining a first mask design (310) having a first portion (324) associated with an optimized pupil (322), where the optimized pupil results from a source-mask optimization process (320). An error can be located on the mask device and a second portion (330) of the mask device with the error can be identified. The method can also include performing source optimization (340) by utilizing the first portion (324) and the second portion (330) in combination to generate a reoptimized pupil (350).

IPC Classes  ?

  • G03F 1/36 - Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
  • G03F 1/70 - Adapting basic layout or design of masks to lithographic process requirements, e.g. second iteration correction of mask patterns for imaging
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor

97.

EXTREME ULTRAVIOLET LIGHT SOURCE OBSCURATION BAR AND METHODS

      
Application Number EP2023079073
Publication Number 2024/094431
Status In Force
Filing Date 2023-10-18
Publication Date 2024-05-10
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Ma, Yue
  • Battoei, Mohsen, Benjamin
  • Ridinger, Armin, Bernhard
  • Easo, Liza
  • Walker, Jonathan, Anthony

Abstract

An extreme ultraviolet (EUV) source includes a source vessel enclosing at least in part a volume in which, when in use, EUV light is transmitted by a collector from a primary focus to an intermediate focus along an optical axis; a shaft, the shaft having a length extending from a first end to a second end of the shaft, the shaft including a passage, the passage extending at least partially along the length of the shaft, the first end of the shaft attached to an interior surface of the source vessel and the second end positioned inside the source vessel; a head (130) connected to the second end of the shaft, the head intersecting the optical axis, the head having an exposed surface (134) exposed to the primary focus, the exposed surface having one or more apertures therein, the one or more apertures being in fluid communication with the passage.

IPC Classes  ?

  • H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma

98.

CHARGED PARTICLE BEAM DETECTOR WITH ADAPTIVE DETECTION AREA FOR MULTIPLE FIELD OF VIEW SETTINGS

      
Application Number EP2023080273
Publication Number 2024/094644
Status In Force
Filing Date 2023-10-30
Publication Date 2024-05-10
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Xia, Zhenyang
  • Wang, Yongxin
  • Ji, Xiaoyu
  • Jiang, Jun
  • Kanai, Kenichi
  • Zhou, Yongjian

Abstract

A charged particle beam detector may include a plurality of detector segments designed to accommodate a field of view (FOV) of a charged particle beam apparatus. A first detector segment may form a first detector region configured to capture emitted charged particles for a smaller FOV size. A second detector segment may surround the first detector segment to form a second detector region configured to capture emitted charged particles under larger FOV size. The first detector region may have a lower noise component due to reduced junction capacitance in the smaller detection surface area.

IPC Classes  ?

  • H01J 37/244 - Detectors; Associated components or circuits therefor

99.

METHOD OF TILT METROLOGY AND ASSOCIATED APPARATUSES

      
Application Number EP2023076109
Publication Number 2024/088663
Status In Force
Filing Date 2023-09-21
Publication Date 2024-05-02
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Anunciado, Roy
  • Dzafic, Harun
  • Ridane, Mohamed

Abstract

Disclosed is metrology method comprising: obtaining metrology data relating to a measurement of at least one target, each said at least one target comprising a plurality of features; said metrology data describing a placement error of one or more pairs of corresponding features of said at least one target, each one or more pairs of corresponding features comprising pairs of features which are substantially equidistant from a reference point on the target in a measurement direction of the target; determining an asymmetric component of said placement error from said metrology data; and determining a tilt parameter from said asymmetric component.

IPC Classes  ?

100.

TRAINING A MACHINE LEARNING MODEL TO PREDICT IMAGES REPRESENTATIVE OF DEFECTS ON A SUBSTRATE

      
Application Number EP2023076164
Publication Number 2024/088665
Status In Force
Filing Date 2023-09-21
Publication Date 2024-05-02
Owner ASML NETHERLANDS B.V. (Netherlands)
Inventor
  • Tao, Jun
  • Feng, Mu
  • Guo, Yunbo
  • Lu, Yen-Wen
  • Pu, Lingling
  • Xie, Xu
  • Spence, Christopher, Alan
  • Zhang, Chenji
  • Yu, Liangjiang
  • Cao, Yu
  • Kang, Daekwon
  • Liu, Jonathan
  • Zhang, Chen
  • Nam, Hongsuk

Abstract

A method for training a prediction model to generate a high-resolution image representing defects on a substrate from a low-resolution image of the substrate. The method includes inputting a first image and a reference image of defects on a substrate, which are representative of images captured using different image capture conditions, to a neural network. The neural network is executed to generate a predicted image in response to the first image. A loss function that is indicative of a difference between a defect distribution in the predicted image and a defect distribution in the reference image is calculated and the neural network is modified based on the loss function. The neural network may be trained until the loss function is minimized.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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