Disclosed are: a thermosetting resin composition which contains an epoxy resin (component (A)), a (meth)acrylate compound (component (B)), an epoxy resin curing agent (component (C)) and a thermal radical polymerization initiator (component (D)), wherein the component (B) contains a poly(butadiene-CO-acrylonitrile) having acryloyloxy groups at both ends (component (B1)) and a multifunctional (meth)acrylate (component (B2)) other than the component (B1), and the component (C) contains a boron amine complex; a cured product of this thermosetting resin composition; a prepreg; a fiber-reinforced composite material; and a high-pressure gas container which comprises this fiber-reinforced composite material.
A deoxygenation agent composition which contains an iron powder, an activated carbon, water, a halide of an alkaline earth metal, and an alkaline substance, wherein: the content of the activated carbon is 20 parts by mass to 40 parts by mass relative to 100 parts by mass of the content of the iron powder; the content of the water is 230 parts by mass to 370 parts by mass relative to 100 parts by mass of the content of the activated carbon; and the content of the halide of an alkaline earth metal is 50 parts by mass to 65 parts by mass relative to 100 parts by mass of the content of the water.
B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
B01J 20/02 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
B01J 20/30 - Processes for preparing, regenerating or reactivating
3.
AMINO COMPOUND AND METHOD FOR PRODUCING SAME, EPOXY RESIN CURING AGENT, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME
Provided are: an amino compound represented by general formula (1); a method for producing the amino compound; an epoxy resin curing agent comprising the amino compound; an epoxy resin composition; and a cured product of the epoxy resin composition. (1): R1-NH-X-NH-R2(wherein R1and R2each independently represent a hydrogen atom, or a monovalent group represented by general formula (2), in which at least one of R1and R2222n22m222-, or a bivalent group represented by general formula (3) or (4); n represents 2 to 6; and m represents 1 or 2.) (In the formula, a broken line indicates the presence or absence of a π bond; R3to R5 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may have a hydroxy group; and * indicates a bonding hand.) (In the formula, * indicates a bonding hand.)
2222-NH-R1(wherein R1represents a monovalent group represented by general formula (2); and X represents a phenylene group) (in the formula, a broken line indicates the presence or absence of a π-bond; R2to R4each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may have a hydroxy group; and * indicates a bonding hand.) (3): R1222-NH-R1(wherein R1 and X are as defined above.)
A polyimide resin having a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A includes a structural unit (A1) derived from a compound represented by formula (a1), and the structural unit B includes a structural unit (B1) derived from a compound represented by formula (b1) and a structural unit (B2) derived from a compound represented by formula (b2) (Z is a diphenylfluorene structure or a hexafluoro diphenylpropane structure, and X1and X232322-.).
This method for producing a polyimide film comprises: a step 1 in which, at 50°C to 120°C, a solvent is removed from a varnish that contains the solvent and a polyimide precursor having a polyamic acid moiety, and the resulting varnish is dried; and a step 2 in which the resulting product is imidized by being held at 300°C to 400°C for 10 minutes to 120 minutes, and subsequently held at 420°C to 500°C. With respect to this method for producing a polyimide film, the polyamic acid moiety has a structural unit that is derived from a tetracarboxylic acid dianhydride and a structural unit that is derived from a diamine; and a diamine which enables the achievement of the structural unit derived from a diamine includes a diamine that has an ionization potential of 7.10 eV or more.
The present invention addresses the problem of providing: an aqueous composition which enables the manufacturing of thinned stainless steel; such stainless steel and a manufacturing method therefor; and a thinning processing method for stainless steel. The problem has been solved by using an aqueous composition for thinning stainless steel, the aqueous composition containing 0.01-10 mass% of hydrogen peroxide, 12.5-40 mass% of halide ions, and 0-3.0 mass% of copper ions. According to the present invention, the thinning of stainless steel can be achieved by a simple method.
The present invention makes it possible to provide an anti-glare laminate in which at least a base-material layer containing a polycarbonate resin (a1), a high-hardness resin layer containing a high-hardness resin (B), and a hard coat layer are disposed in the stated order, wherein the development surface area ratio (Sdr), arithmetic average height (Sa), and autocorrelation length (Sal) of the hard coat layer satisfy expressions (i) to (iii). (i): 0 ≤ Sdr ≤ 0.6. (ii): 0 ≤ Sa ≤ 0.16. (iii): 0 ≤ Sal ≤ 15.0.
The present invention provides: low-density stainless steel and a method for producing the same; a weight reduction processing method for stainless steel; and an aqueous composition, etc. that is useful in weight reduction of stainless steel. The above problem was solved by a method for producing stainless steel, etc. that includes a weight reduction processing step that reduces the weight of stainless steel using an aqueous composition, the density of the stainless steel that has undergone weight reduction processing being less than 7.4 g/cm3. Reduction of the weight and lowering of the density of stainless steel can be achieved by an easy method in accordance with the present invention.
This foamed-resin-formable composition is for obtaining a polyurea-based resin foam body, and contains a reactant (A) between a cyclic polyamine compound (a1) and carbon dioxide, a polyisocyanate compound (B), and an aromatic polyamine compound (C). This polyurea-based resin foam body is obtained by foaming and molding the foamed-resin-formable composition. This polyurea-based resin foam body production method comprises a step for foaming and molding the foamed-resin-formable composition. According to the present invention, it is possible to obtain a polyurea-based resin foam body which can reduce environmental load and which has improved foaming ability.
The present invention provides an anti-glare laminate comprising at least a substrate layer and an anti-glare layer. The anti-glare layer comprises at least a multifunctional (meth)acryloyl group-containing monomer (A), a (meth)acryloyl group-containing monomer (B), a photopolymerization initiator (C), and silica particles (D). The average particle diameter of the silica particles is 1 to 7 µm, and the silica particles have an oil absorption of 30 to 250 mL/100 g. The proportion of component (A) is 40 to 90 mass% and the proportion of component (B) is 10 to 60 mass% using 100 mass% for the total of component (A) and component (B). The double bond equivalent of component (B) is not greater than 400 g/mol.
The present invention makes it possible to provide an anti-glare laminate including at least a substrate layer and an anti-glare layer, wherein the haze (H) of the anti-glare laminate and the ten point average roughness (Rzjis) measured when the reference length of the anti-glare layer is set to 0.8 mm satisfy formula (1). Formula (1): H/Rzjis ≥ 4.0
The present invention provides: an adhesive film which exhibits excellent moldability; a heat molded body; and a method for producing an adhesive film. This adhesive film comprises a base material film that contains a polycarbonate, a primer layer that is arranged on at least one surface of the base material film, and an adhesive layer that is arranged on a surface on the reverse side of the primer layer from the base material film; and the primer layer is formed of a primer layer composition that contains an oligomer diol.
C09J 7/50 - Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
Provided are a composition, and a resin composition and cured product using the composition. The composition includes an amino group and a cyclic ether structure, and contains a compound having a molecular weight of 1000 or less, and a less-hindered phenolic antioxidant.
Provided is a method for producing a polycarbonate resin molded product by molding a polycarbonate resin using an injection molding machine, comprising: a step for starve feeding polycarbonate resin particulates to an injection molding machine; a step for generating a plasticized resin by plasticizing the particulates inside the injection molding machine; and a step for producing a molded product from the plasticized resin. The water content of the particulates which are starve fed to the injection molding machine is not more than 0.3 wt%.
Provided are a resin composition, a molded article, and a method for producing cellulose fibers. When dyed by a dye, the cellulose fibers have a ratio (L'/L) of the skin layer brightness (L') and the core layer brightness (L) of 0.70 or less. The skin layer brightness (L') and the core layer brightness (L) of the cellulose fiber cross section are obtained by measuring the R, G, and B values of each of the layers, and calculating using the formula of [(maximum value of the R, G, and B values)/255] * 100 [%].
The present invention provides: a multilayer body wherein the occurrence of spring-back can be suppressed even if the multilayer body is subjected to hot forming; and a molded article. The multilayer body comprises a polycarbonate resin layer (X) which is formed of a resin composition (x) that contains a polycarbonate resin, and an acrylic resin layer (Y) which is formed of a resin composition (y) that contains an acrylic resin. With respect to the polycarbonate resin contained in the resin composition (x), the ratio Mw/Mn of the weight average molecular weight (Mw) in terms of polystyrene as determined by gel permeation chromatography to the number average molecular weight (Mn) is 2.80 to 4.40, and/or 60 to 93 parts by mass of a polycarbonate resin (x1) that have a viscosity-average molecular weight of 24,000 to 50,000 and 7 to 40 parts by mass of a polycarbonate oligomer (x2) that has a viscosity-average molecular weight of 2,000 to 10,000 are contained.
A polycarbonate resin provided according to one embodiment of the present invention comprises a constituent unit (A) derived from a monomer represented by formula (1), a constituent unit (B) derived from a monomer represented by formula (2), a constituent unit (C) derived from a monomer represented by formula (3), and/or a constituent unit (D) derived from a monomer represented by formula (4).
A method of manufacturing a polyimide resin varnish comprises step (A) described below and step (B) described below and is under a dry gas environment from the start time of step (A) to the end time of step (B). Step (A) is for polymerizing, in an organic solvent and at 100 to 210°C, a tetracarboxylic acid component including an aliphatic tetracarboxylic acid dianhydride mixture and a diamine component including an aromatic diamine, and obtaining a polymer, and step (B) is for reacting, at 60 to 130°C, an alkoxysilylamine compound with the polymer obtained in step (A).
METHOD FOR MANUFACTURING METAL FOIL CLAD LAMINATED SHEET, RESIN COMPOSITION, RESIN COMPOSITE SHEET, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The present invention provides a method for manufacturing a metal foil clad laminated sheet having excellent mass productivity and in which peeling of a resin composition layer and a metal foil is suppressed, as well as a resin composition, a resin composite sheet, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor device. A method for manufacturing a metal foil clad laminated sheet in which a resin composite sheet C including a metal foil and a resin composition layer disposed on one side of the metal foil is laminated on the surface of a circuit board A including an insulating layer and a conductor circuit layer, using a vacuum laminating device, the method for manufacturing a metal foil clad laminated sheet comprising the following steps. Step 1: A step for obtaining a circuit board B by reducing the content of moisture and/or a solvent included in the circuit board A. Step 2: A step for obtaining a laminated board D by placing, heating, and pressurizing in a reduced pressure or vacuum environment the circuit board B and the resin composite sheet C. Step 3: A step for obtaining a laminated board E by smoothing the surface of the resin composition layer of the laminated board D.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided is a multilayer body which has, on a surface of a thin polycarbonate film, a protection film that has an adhesive layer and in which an orange peel texture is unlikely to occur on the surface of the polycarbonate film when the protection film is peeled. A multilayer body according to the present invention has a polycarbonate film that has a thickness of 20-75 μm and a protection film that is provided on at least one surface of the polycarbonate film, wherein the protection film has an adhesive layer that can be peeled from the polycarbonate film and a layer that contains a resin, the adhesive layer is in contact with the polycarbonate film, and when the polycarbonate film is peeled from the multilayer body, the arithmetic mean undulation Ma of undulations in the adhesive layer, excluding undulations that have an undulation width of less than 500 μm or more than 3,000 μm, is 0.01-0.12 μm.
C09J 7/24 - Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
22.
RESIN COMPOSITION, FILM, POLARIZING SHEET, RESIN COMPOSITION PRODUCTION METHOD, AND FILM MANUFACTURING METHOD
Provided are: a resin composition which can suppress occurrence of stains on a molding roller, and with which foreign matter is unlikely to be formed in a film; a film; a polarizing sheet; a resin composition production method; and a film manufacturing method. This resin composition contains, with respect to 100 parts by mass of a polyamide resin, 0.05-10 parts by mass of a compound having 1-3 cyclic ether structures per molecule, and exhibits a haze of 10% or less when being formed into a 200 μm-thick film.
C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
After laminating an insulation layer (14) and an electrolytic copper foil (15) in this order on an inner layer board (13), a resist pattern (17B) is formed on the electrolytic copper foil (15). Next, using the resist pattern (17B) as an etching resist, the electrolytic copper foil (15) is etched using an etching liquid containing sulfuric acid and hydrogen peroxide, and a mask for via hole formation (18) is formed. Subsequently, the resist pattern (17B) is removed, the part of the insulation layer (14) not covered by the mask for via hole formation (18) is removed using a laser, and via holes (14A) are formed.
The present invention provides a resin composition which contains an acid-modified polyolefin at a ratio of 0.1 part by mass to 50 parts by mass relative to 100 parts by mass of a polyamide resin, wherein: the polyamide resin comprises a diamine unit and a dicarboxylic acid unit; the diamine unit contains 70% by mole or more of a constituent unit that is derived from a xylylenediamine; and the dicarboxylic acid unit contains 70% by mole or more of a constituent unit that is derived from an α, ω-linear aliphatic dicarboxylic acid having 11 to 20 carbon atoms.
C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
C08L 23/26 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
A resin composition that contains reinforcing fibers in a proportion of 10-300 mass parts per 100 mass parts of a xylylenediamine polyamide resin, in which the xylylenediamine polyamide resin contains diamine units and dicarboxylic acid units, the diamine units contain 70 mol% or more of structural units derived from xylylenediamine, the dicarboxylic acid units contain 70 mol% or more of structural units derived from C11-20 α,ω-straight-chain aliphatic dicarboxylic acids, and the relative viscosity of the xylylenediamine polyamide resin is 1.6 to 2.4.
C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
Provided are: a resin composition comprising a heat-curable compound and a fluororesin filler and attaining low-dielectric properties and excellent moist heat resistance; and a cured object, a prepreg, a metal-foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition comprises a fluororesin filler (A) having an acidic group and/or a basic group, a thermoplastic elastomer (B) having a basic group and/or an acidic group, which is opposite to the acidic group and/or the basic group of the fluororesin filler (A), and a heat-curable compound (C) compatible with the thermoplastic elastomer (B).
C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/10 - Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
C08F 299/00 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
28.
RESIN OBTAINED FROM CYCLIC DIOL COMPOUND, AND OPTICAL LENS CONTAINING SAME
The present invention can provide a resin that contains a constitutional unit (A) derived from a monomer represented by general formula (1) and that is a polycarbonate resin or a polyester carbonate resin. [Compound 1] [In the formula, each R1is independently a hydrogen atom, a C1-4 alkyl group, or a phenyl group. X is a direct bond or a divalent group that is represented by formula (Y). [Compound 2] [In the formula, each R2and each R3is independently a hydrogen atom, an alkyl group, or an aryl group, or each R2and each R3 may bind to one another to form a ring together with an adjacent carbon atom, and the ring may be substituted by an alkyl group. n is 0 or 1. * represents a binding position.]]
C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
29.
SEMICONDUCTOR SUBSTRATE CLEANING COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE USING SAME
Provided is a semiconductor substrate cleaning composition that has a high Ti/W etching selectivity and can reduce damage to oxide films. The semiconductor substrate cleaning composition contains (A) an oxidizing agent and (B) a metal tungsten corrosion inhibitor. The semiconductor substrate cleaning composition does not contain (C) a fluorine compound, or further contains less than 0.005 mass% of a fluorine compound on the basis of the total mass of the semiconductor substrate cleaning composition, and has a pH of 7 or less.
[Problem] To provide a polarizing laminate having a reduced optical distortion when measured with MIL-DTL-43511D. [Solution] Provided is a polarizing laminate which comprises a polarizing film comprising a uniaxially stretched polyvinyl alcohol-based resin film and transparent protective layers respectively arranged on both surfaces of the polarizing film each through an adhesive layer, in which the difference between a maximum value and a minimum value of the width of a gap between two slits adjacent to the polarizing laminate (i.e., a slit interval) in an optical distortion measured with MIL-DTL-43511D is 1.05 mm or less.
According to one embodiment of the present invention, provided is a thermoplastic resin comprising a structural unit (A) derived from a monomer represented by general formula (1) and a structural unit (C) derived from a monomer represented by general formula (3).
C08G 64/00 - Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
C08G 63/00 - Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
32.
HARD COAT FILM AND RESIN MOLDED ARTICLE USING SAME
According to the present invention, it is possible to provide a hard coat film comprising: a base material layer which contains a thermoplastic resin; and a hard coat layer which is a cured coating film layer and is provided on at least one surface of the base material layer, wherein the hard coat layer contains a fluorine-containing leveling agent, the surface roughness of the surface of the hard coat layer is at most 10 nm, and the atomic concentration F(80º) of fluorine at an angle of 80º is at most 10 atomic% and the atomic concentration F(30º) of fluorine at an angle of 30º is at most 10 atomic%, as measured by angle resolved XPS.
The present invention provides a resist composition which contains a resin (A) and a solvent (B) containing a compound (B1) represented by general formula (b-1), and which contains an active ingredient in an amount of 45 mass% or less with respect to the total amount of the resist composition. (In the above formula (b-1), R0is a C1–C10 alkyl group, a C6–C10 aryl group, or a C1–C10 acyl group, and R1 is a hydrogen atom or a C1–C10 alkyl group.)
C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
B33Y 70/00 - Materials specially adapted for additive manufacturing
C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08L 101/00 - Compositions of unspecified macromolecular compounds
C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
35.
RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME
According to the present invention, it is possible to provide a resist auxiliary film composition containing a resin (A) and a solvent (B), the solvent (B) including a compound (B1) represented by general formula (b-1) below, wherein the content of an active ingredient is 45% by mass or less based on the total amount of the resist auxiliary film composition. (In formula (b-1) above, R0is an alkyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, or an acyl group having 1-10 carbon atoms; and R1 is a hydrogen atom or an alkyl group having 1-10 carbon atoms.)
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08L 57/00 - Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
C08L 61/08 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with monohydric phenols
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
C08L 101/00 - Compositions of unspecified macromolecular compounds
The present invention provides a thinner composition containing a solvent (B) that includes a compound (B1) represented by general formula (b-1) below. (In formula (b-1) above, R0is an alkyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, or an acyl group having 1-10 carbon atoms, and R1 is a hydrogen atom or an alkyl group having 1-10 carbon atoms.)
nn] (n-k)-mk-2mxx (M is boron, silicon, zirconium, antimony, niobium, aluminum, phosphorus, or titanium; k is the oxidation number for M; m is an integer from 0 to k/2; x is a positive integer; R is a hydrogen atom, alkali metal, or alkyl group; and n is the coordination number of fluoride ions to M.); component (C) : an oxidizing agent; and component (D) : water, wherein the α given by formula (I) is 0.2 to 1.1. ([F] is the molar concentration of fluoride ion in the composition, [M] is the molar concentration of M in the composition, and n(M) is the coordination number of fluoride ions to M.)
A film-forming composition for lithography which contains a polyphenol compound represented by formula (1). (In formula (1), A, Ar1, Ar2, X, P1, P2, j, k, l1, and l2 are as defined in the specification.)
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C07C 39/15 - Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings
C07C 69/21 - Acetic acid esters of hydroxy compounds with more than three hydroxy groups
According to the present invention, a method for producing methanol using carbon dioxide and hydrogen as starting materials includes a step (A) for combining the carbon dioxide and the hydrogen to obtain a makeup gas, a step (B) for combining the makeup gas, after the pressure thereof has been raised, with a recycled gas recovered from an outlet gas from a synthesis reactor to obtain a synthesis reactor supply gas, a step (C) for preheating the synthesis reactor supply gas by means of a heat exchange in which the outlet gas from the synthesis reactor serves as a heat source, and a step (D) for supplying the preheated synthesis reactor supply gas to a synthesis reactor and bringing the preheated synthesis reactor supply gas into contact with a catalyst to synthesize methanol.
C07C 29/152 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the reactor used
This thermoplastic resin composition contains component (A), which is at least one thermoplastic resin selected from the group consisting of (a1) a crystalline thermoplastic resin having a melting point of 270°C or more and (a2) an amorphous thermoplastic resin having a glass transition temperature of 200°C or more, and component (B), which is an inorganic filler including (b1) zirconium oxide, wherein the content of the component (b1) based on 100 parts by mass of the component (A) is 2-40 parts by mass, and the content of the component (B) based on 100 parts by mass of the component (A) is 2-60 parts by mass.
This composition comprises a compound (A) represented by formula (1) below and a compound (B) represented by formula (2) below. (The definitions of the elements in formula (1) are indicated in the description.) (In formula (2), the elements X, L1, Y, Ra, Rb, Rc, A, Z, p, m, n, and r are the same as those in formula (1), and k represents an integer from 0 to 2.)
C08F 12/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
C08F 246/00 - Copolymers in which the nature of only the monomers in minority is defined
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C07D 405/14 - Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
C08F 26/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containin
C08L 39/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocycli; Compositions of derivatives of such polymers
C07D 307/14 - Radicals substituted by nitrogen atoms not forming part of a nitro radical
The present invention provides a method for producing a polyimide varnish, the method comprising: a polycondensation step in which one or more tetracarboxylic acid dianhydrides and one or more diamine compounds are subjected to a polycondensation reaction, thereby obtaining a reaction product (x); a step in which an organic solvent is subjected to inert gas bubbling, thereby obtaining a solvent (y) for dilution; and a dilution step in which the reaction product (x) and the solvent (y) for dilution are mixed with each other, thereby obtaining a polyimide solution that has a dissolved oxygen concentration of 0.23 mg/L or less. Consequently, the present invention enables the achievement of a varnish which contains a solvent-soluble polyimide, while being free from coloring and exhibiting excellent colorlessness.
The present invention provides a method for producing a polyimide, the method comprising: a step 1 in which a diamine solution is obtained by dissolving a diamine in an organic solvent, and a tetracarboxylic acid dianhydride is added to and mixed with the diamine solution so as to obtain a homogeneous solution; and a step 2 in which the tetracarboxylic acid dianhydride and the diamine are polycondensed with each other. With respect to this method for producing a polyimide, in the step 1, it is regulated such that the diamine solution does not exceed 100°C from the time when the addition of the tetracarboxylic acid dianhydride is started to the time when the solution becomes homogeneous. Consequently, the present invention enables the achievement of: a varnish which has a viscosity sufficient for coating; and a polyimide which has excellent colorlessness.
The method for producing a polyimide varnish polycondenses one or more tetracarboxylic dianhydrides and one or more diamines in an organic solvent at a reaction temperature of 160-220°C to obtain a reaction solution and lowers the temperature of the reaction solution from the reaction temperature to 120°C at a rate of 4°C/min or more by introducing a diluting solvent to stop the reaction. A method for producing a polyimide varnish that contains a solvent-soluble polyimide, has no coloration, and can obtain a varnish having excellent colorlessness can be provided according to the present invention.
An aldehyde composition that contains an aldehyde represented by formula (1) and an aldehyde represented by formula (2), the mass ratio [(1)/(2)] of the aldehyde represented by formula (1) and the aldehyde represented by formula (2) being 97.00/3.00-99.999/0.001. An aldehyde composition that is useful as a fragrance due to having an exceptional balance of green, aldehyde, and floral scents. Additionally, a fragrance composition having exceptional diffusibility due to containing this aldehyde composition is obtained.
C07C 45/62 - Preparation of compounds having C=O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by reactions not involving the formation of C=O groups by hydrogenation of carbon-to-carbon double or triple bonds
C07C 47/228 - Unsaturated compounds having —CHO groups bound to acyclic carbon atoms containing six-membered aromatic rings, e.g. phenylacetaldehyde
The present invention provides: a polyacetal resin composition; a metal resin composition; and a method for producing a polyacetal resin composition. The present invention provides a polyacetal resin composition which contains 100 parts by weight of a polyacetal resin (A) and 0.1 to 0.9 part by weight of a fatty acid metal salt (B) having a weight loss rate of 20% by weight of more, the weight loss rate being the ratio of weight loss after the fatty acid metal salt is heated from room temperature to 200°C at a rate of 200°C/minute in the air at atmospheric pressure and is subsequently held at 200°C for 60 minutes.
The present invention provides an epoxy resin composition which contains an epoxy resin (A) and an epoxy resin curing agent (B), wherein: the epoxy resin (A) contains an epoxy resin (A1) that has a glycidyl group derived from resorcinol, and an epoxy resin (A2) that has a glycidyl group derived from bisphenol F, or the like; the epoxy resin curing agent (B) contains resorcinol (B1) or the like; and the content of the epoxy resin curing agent (B) is 7% by mass to 60% by mass.
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
Provided is a means with which trioxane can be continuously produced at a high yield. Provided is a composition that contains (A) 58.5-65.5 mass% of formaldehyde, (B) 0.7-4.5 mass% of methanesulfonic acid, and (C) less than 0.007 mass% of a metal salt. The total content of the formaldehyde (A) and the methanesulfonic acid (B) is less than 68 mass%. The metal salt (C) includes at least one type selected from the group consisting of a nitrate, a nitrite and a persulfate.
The present invention addresses the problem of providing a resin composition or the like that exhibits favorable oxygen barrier performance and a favorable color tone after oxygen absorption, and that is excellent in strength and shape retention as well as moldability. The problem can be solved by a resin composition containing a transition metal catalyst and a polyester compound having a prescribed structure.
C08L 67/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
A61J 1/05 - Containers specially adapted for medical or pharmaceutical purposes for collecting, storing or administering blood, plasma or medical fluids
A61M 5/28 - Syringe ampoules or cartridges, i.e. ampoules or cartridges provided with a needle
B65D 1/02 - Bottles or similar containers with necks or like restricted apertures, designed for pouring contents
B65D 65/40 - Applications of laminates for particular packaging purposes
B65D 77/00 - Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
B65D 81/24 - Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
B65D 81/26 - Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
Provided is a polyimide resin precursor comprising a repeating unit represented by general formula (1) below or a repeating unit represented by general formula (1) below and a repeating unit represented by general formula (2) below, wherein the total of the repeating unit represented by general formula (1) and the repeating unit represented by general formula (2) is 70 to 100 mol % inclusive based on all the repeating units of the polyimide resin precursor, and the ratio of the repeating unit represented by general formula (1) is 30 to 100 mol % based on the total of the repeating unit represented by general formula (1) and the repeating unit represented by general formula (2). This polyimide resin precursor has excellent heat resistance, and a polyimide resin having a low linear expansion coefficient as well as excellent elongation and mechanical strength can be obtained.
This laminate for manufacturing a TFT substrate comprises: a support base material made of glass; a first inorganic film laminated on the support base material; a polyimide resin laminated on the first inorganic film; and a second inorganic film laminated on the polyimide resin, wherein the polyimide resin has a structural unit represented by general formula (1) or a structural unit represented by general formula (2), and the glass transition temperature is 400°C or higher. (X1is a group having an alicyclic structure or an aromatic ring, Y1is a single bond and the like, R1and R2are methyl groups and the like, h and i are integers of 0-4, at least one of which is an integer of 1-4, and n is 0, 1, or 2.) (X2includes a tetravalent group represented by general formula (3), Y2 is a single bond and the like, and m is 0, 1, or 2.) (R is a methyl group and the like, p is 1-4, and k is 1 or 2.)
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
H05B 33/14 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material
Provided are a resin composition having an excellent potential while maintaining excellent heat tolerance, as well as a cured substance, a sealing material, an adhesive, an insulating material, a coating material, a prepreg, a multilayer body, and a fiber-reinforced composite material. The resin composition contains a cyanic acid ester compound (A), an amine adduct compound (B), and boric acid ester (C).
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C09D 179/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups
C09J 179/00 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups
54.
NOVEL LACTIC ACID BACTERIA, AND COMPOSITION, FOOD/DRINK ITEM, AND PHARMACEUTICAL ITEM CONTAINING LACTIC ACID BACTERIA
The present invention provides: lactic acid bacteria that enhance IL-12p70 and IFN-λ production, thereby making it possible to increases resistance against infection by infectious microorganisms and viruses, relieve stress, and suppress excessive inflammatory response that causes symptoms to worsen; compositions such as a immunostimulation composition, a stress relief composition, and an inflammation suppression composition, containing said lactic acid bacteria; and food/drink and pharmaceutical items containing the compositions. Lactobacillus sakei strain MG-LAB279 (accession number: NITE BP-03645); compositions such as an immunostimulation composition, a stress relief composition, and an inflammation suppression composition containing, as an active ingredient, said strain or a bacterial cell component thereof; and food/drink and pharmaceutical items containing the compositions.
The present invention provides: [1] an oxygen absorbent material which comprises a base material (I), an inorganic layer (II) and a cured product layer (III) of an epoxy resin composition that contains an epoxy resin and an epoxy resin curing agent containing an amine-based curing agent, wherein the inorganic layer (II) and the cured product layer (III) are adjacent to each other; and [2] a method for storing an article, the method comprising one or more modes that are selected from among (1) a mode in which the article is contained in a packaging material in which the oxygen absorbent material described in [1] is sealed and (2) a mode in which the article is contained in a packaging material that at least partially comprises the oxygen absorbent material described in [1], and the packaging material has an oxygen transmission rate of 1 cc/(m2∙day∙atm) or less.
C08G 79/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
The present invention pertains to an epoxy resin composition and a cured product thereof. The epoxy resin composition contains an epoxy resin (A), an epoxy resin curing agent (B), a solvent (C), and an aromatic hydrocarbon formaldehyde resin (D). The mass ratio [(C+D)/(B+C+D)] of the total contained amount of component (C) and component (D) with respect to the total contained amount of components (B), (C), and (D) is 0.42-0.57, and the mass ratio C/D of component (C) with respect to component (D) is 1.00 or more.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
Provided are: a resin composition that can, when formed into a cured product, suppress backside exposure; and a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, a semiconductor device, and a printed wiring board manufacturing method, all using the resin composition. The resin composition contains a thermosetting compound. A cured product, of the resin composition, molded so as to have a thickness of 30 μm exhibits a transmission rate of 0.070% or less with respect to g-line (wavelength 436 nm), h-line (wavelength 405 nm), and i-line (wavelength 365 nm).
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 3/013 - Fillers, pigments or reinforcing additives
The present invention relates to oligomeric binaphtyl compounds of the formula (I) that are suitable as monomers for preparing thermoplastic resins, such as polycarbonate resins, which have beneficial optical and mechanical properties and can be used for producing optical devices. where X1and X2are independently selected from hydrogen, -Alk122-A222-OH, -Alk2-C(O)ORX22-A2-C(O)ORXand -C(O)-A2-C(O)ORX, where Rx144-alkyl; Y1and Y222-, -CHArY22ArY)-; A122-, -CHArA22ArA22ArA22-, a moiety of the formula (A), mono- or polycyclic arylene having from 6 to 26 carbon atoms as ring members or mono- or polycyclic hetarylene having a total of 5 to 26 atoms, which are ring members, alternatively, the moiety -Y1-A1-Y222- or -CHArY-, n is 1, 2 or 3; m, p, q and r are independently 0, 1 or 2; R1, R2, R3and R423s3-s22, C(O)R and CH=CHR", it being possible that R1, R2, R3or R4is identical or different if more than 1 of R1, R2, R3or R4 is present, where s on each occurrence is 0, 1 or 2.
C08G 64/16 - Aliphatic-aromatic or araliphatic polycarbonates
C07C 59/66 - Unsaturated compounds containing ether groups, groups, groups, or groups containing six-membered aromatic rings the non-carboxylic part of the ether containing six-membered aromatic rings
C08G 63/64 - Polyesters containing both carboxylic ester groups and carbonate groups
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
60.
EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER
22222 (wherein A represents a 1,2-phenylene group, a 1,3-phenylene group or a 1,4-phenylene group), in which the contents of the component (A-1) and the component (A-2) in the epoxy resin curing agent are 50 to 95% by mass and 5 to 50% by mass, respectively; an epoxy resin composition; a cured product of the epoxy resin composition; a fiber-reinforced composite material; and a high-pressure gas container comprising the fiber-reinforced composite material.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
H01B 1/10 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances sulfides
131131) for self-interaction of the copolyimide represented by formula (3) is less than 6.65×10-21J for γ-butyrolactone and more than 5.80×10-21J for methyl isobutyl ketone. (R1and R2 are organic groups, excluding monocyclic aromatic groups and fused polycyclic aromatic groups.)
Provided is a method for producing an optical material by hydrogenating an aromatic ring of an aromatic vinyl compound polymer (nuclear hydrogenation) to obtain an optical material having adequate heat resistance at a high nuclear hydrogenation rate. More specifically, provided is a method for producing an optical material by hydrogenating an aromatic ring of an aromatic vinyl compound polymer (nuclear hydrogenation), wherein the method is characterized by use of a mixed solvent containing at least one first solvent and at least one second solvent.
C08F 212/00 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
The present invention provides a method for hydrogenating (nucleus-hydrogenating) an aromatic ring of an aromatic vinyl compound-based polymer in order to obtain, at a high nucleus-hydrogen addition rate, a hydrogenated polymer having sufficient heat resistance. In more detail, provided is a method for manufacturing a hydrogenated polymer by hydrogenating (nucleus-hydrogenating) an aromatic ring of an aromatic vinyl compound-based polymer, the method being characterized by comprising reducing a hydrogenation catalyst before use.
C08F 212/00 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
65.
METHOD FOR PRODUCING HYDROGENATED POLYMER BY USING PLURALITY OF SOLVENTS
Provided is a hydrogenation method using a solvent that satisfactorily dissolves a polymer before and after hydrogenation. The present invention provides a method for producing a hydrogenated polymer by hydrogenating the aromatic ring of an aromatic vinyl compound-based polymer, the method comprising performing a hydrogenation reaction using the aromatic vinyl compound-based polymer, a solvent, and a hydrogenation catalyst, wherein the solvent is a mixed solvent containing at least one first solvent and at least one second solvent, and the Hansen solubility parameter (HSP) value of the mixed solvent 1) falls within a Hansen sphere on a three-dimensional space consisting of δd, δp, and δh axes of the aromatic vinyl compound-based polymer before hydrogenation, and 2) falls within a Hansen sphere on a three-dimensional space consisting of δd, δp, and δh axes of the aromatic vinyl compound-based polymer after hydrogenation.
A blowing agent for obtaining a polyurethane urea resin foam, said blowing agent including a reactant (a2) of carbon dioxide and an amine compound (a1) that includes at least one compound selected from the group consisting of xylylenediamines and derivatives thereof, and bis(aminomethyl)cyclohexanes and derivatives thereof, wherein the water content of the blowing agent is not more than 15 mass%.
C08J 9/02 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by the reacting monomers or modifying agents during the preparation or modification of macromolecules
The present invention provides a method for recovering a plastic film from a multilayer body, wherein: the multilayer body comprises a plastic film (I), an inorganic layer (II) which is composed of at least one substance that is selected from the group consisting of silicon oxides, aluminum and aluminum oxides, and a resin cured layer (III); and the resin cured layer (III) is composed of a cured product of an epoxy resin composition that contains an epoxy resin and an epoxy resin curing agent including an amine-based curing agent. This method comprises a step in which the multilayer body is brought into contact with an acid aqueous solution or an alkaline aqueous solution.
C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
C08G 63/187 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
C08G 63/64 - Polyesters containing both carboxylic ester groups and carbonate groups
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
69.
BLOWING AGENT, FOAMING RESIN COMPOSITION, POLYUREA RESIN FOAM, AND PRODUCTION METHOD FOR POLYUREA RESIN FOAM
A blowing agent for obtaining a polyurea resin foam containing polyurea that has repeating units represented by general formula (I), said blowing agent including a reaction product (a2) of carbon dioxide and a cyclic amine compound (a1). (In formula (I), R1is a divalent hydrocarbon group having a cyclic structure that may have a substituent, and R2 is a divalent hydrocarbon group that may have a substituent.)
C08J 9/02 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by the reacting monomers or modifying agents during the preparation or modification of macromolecules
C08G 18/00 - Polymeric products of isocyanates or isothiocyanates
70.
THERMOPLASTIC RESIN AND OPTICAL LENS INCLUDING SAME
C08G 63/193 - Hydroxy compounds containing aromatic rings containing two or more aromatic rings
C08G 63/64 - Polyesters containing both carboxylic ester groups and carbonate groups
C08G 64/06 - Aromatic polycarbonates not containing aliphatic unsaturation
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
This compound is represented by formula (1): (in the formula: RG is a group that includes at least one cyclic structure; I is an iodine atom; R1 moieties may be the same as, or different from, each other, and are each a monovalent functional group having 0-30 carbon atoms and not containing a polymerizable unsaturated bond; n is an integer between 1 and 5; and m is an integer between 1 and 5).
C07C 43/23 - Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing hydroxy or O-metal groups
C07C 35/52 - Alcohols with a condensed ring system
C07C 69/94 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a six-membered aromatic ring of polycyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of six-membered aromatic rings
An oxygen scavenger packaging material 1 comprises, in this order, an inner layer 10 including a thermoplastic resin, an intermediate layer 12 including greaseproof paper, and an outer layer 14 including a thermoplastic resin, the greaseproof paper not containing fluorine. The oxygen scavenger packaging material 1 has an internal ventilation hole H1 through the inner layer 10 and the intermediate layer 12, and an external ventilation hole H2 through the outer layer.
The purpose of the present invention is to provide: a resin composition that is suitable for use in the production of an insulating layer of a printed wiring board, the resin composition having a high dielectric constant, a low dielectric loss tangent, a high metal foil peel strength, excellent moisture absorption and heat resistance, and excellent thermal properties; and a prepreg, a resin sheet, a laminated plate, a metal foil-clad laminated plate, and a printed wiring board obtained using the resin composition. This resin composition contains a dielectric powder (A), an aromatic phosphorus compound (B), and a thermosetting resin (C).
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 3/013 - Fillers, pigments or reinforcing additives
Provided are: a resin composition exhibiting a high crystallization rate and little deterioration of physical properties; a molded article; and a method for manufacturing a molded article. The resin composition comprises 1-15 parts by mass of a polyamide resin B per 100 parts by mass in total of a polyamide resin A and the polyamide resin B, and the difference between the melting point Tmb of the polyamide resin B and the melting point Tma of the polyamide resin A is 35-110°C. In the polyamide resin A, a diamine-derived structural unit contains 100-50 mol% of a meta-xylylenediamine-derived structural unit, and 70 mol% or more of a dicarboxylic acid-derived structural unit is derived from an α,ω-linear aliphatic C7-16 dicarboxylic acid. In the polyamide resin B, a diamine-derived structural unit contains 100-95 mol% of a para-xylylenediamine-derived structural unit, and 70 mol% or more of a dicarboxylic acid-derived structural unit is derived from an α,ω-linear aliphatic C7-16 dicarboxylic acid.
C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
One embodiment of the present invention provides a method for purifying a (meth)acrylic acid monomer and/or a (meth)acrylic acid ester monomer, the method comprising purification of a composition that contains a (meth)acrylic acid monomer and/or a (meth)acrylic acid ester monomer by means of distillation. With respect to this method for purifying a (meth)acrylic acid monomer and/or a (meth)acrylic acid ester monomer, oxygen is supplied from the start to the end of the distillation so that the molar ratio of the oxygen to the vapor derived from the (meth)acrylic acid monomer and/or the (meth)acrylic acid ester monomer in the vapor phase component in a distillation still is maintained at 1.50 × 10-3 or more.
This method for producing a polymer, the method comprising Step 1 for polymerizing diamine and tetracarboxylic dianhydride to obtain a polymer, wherein: the molar ratio of the diamine to the tetracarboxylic dianhydride (diamine/tetracarboxylic dianhydride) in Step 1 is 1.00 to 1.03 (exclusive of 1.03); Step 1 is a step for polymerizing diamine and tetracarboxylic dianhydride in the presence of tert-butanol and a solvent; and the polymer has, as a repeating unit, at least one selected from the group consisting of an amidic acid unit and an imide unit, and has a weight average molecular weight of at least 300,000.
The purpose of the present invention is to provide: a resin composition which is suitable for use in the production of an insulating layer of a printed wiring board, the insulating layer having a high dielectric constant and a low dielectric loss tangent, excellent moisture absorption and heat resistance, a high glass-transition temperature, and a low thermal-expansion coefficient; and a prepreg, a resin sheet, a laminated plate, a metal foil-clad laminated plate, and a printed wiring board, each of which is obtained using the resin composition. The resin composition according to the present invention contains a surface-coated titanium oxide (A) and a thermosetting compound (B) and has a water absorption rate as calculated by formula (i) of 0.40% or less. (i): Water absorption rate (%) = [(M2 - M1)/M1] × 100
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
This oxygen scavenger composition comprises iron, a metal salt, and water, wherein the content of water, per unit surface area of iron, present on the surface of the iron [content of water present on surface of iron (g)/{content of iron (g)×specific surface area of iron (m2/g)}] is 0.60 g/m2to 2.00 g/m2.
B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
B01J 20/02 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
B01J 20/28 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
B01J 20/30 - Processes for preparing, regenerating or reactivating
B65D 81/26 - Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
79.
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATED SHEET, METAL FOIL-CLAD LAMINATED SHEET, AND PRINTED WIRING BOARD
The purpose of the present invention is to provide a resin composition having a high dielectric constant and a low dielectric loss tangent and that can be suitably used to prepare an insulating layer on a printed wiring board having excellent heat resistance properties and moisture absorption/heat resistance properties, and to provide a prepreg, resin sheet, laminated sheet, metal foil-clad laminated sheet, and printed wiring board obtained using said resin composition. The resin composition of the present invention contains: surface-coated titanium oxide (A) having a mass loss ratio of 0.5 mass% or less when heated from 30°C to 300°C at a rate of 10°C per minute; and a thermosetting compound (B).
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
This oxygen scavenger composition comprises iron, a metal salt, and water, wherein the content of water, per unit surface area of iron, present on the surface of the iron [content of water present on surface of iron (g)/{content of iron (g)×specific surface area of iron (m2/g)}] is 2.00 to 3.50 g/m2(exclusive of 2.00 g/m2).
B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
B01J 20/02 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
B01J 20/28 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
B01J 20/30 - Processes for preparing, regenerating or reactivating
Provided is a means for preventing oxidation of a copper surface. This composition for protecting a copper surface contains a solvent and at least one copper surface protectant selected from the group consisting of compounds represented by formulas (1)-(3) and salts thereof. [Formula 1]
C23F 11/00 - Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
82.
METHOD FOR PRODUCING METHANOL AND APPARATUS FOR PRODUCING METHANOL
Provided is a method for producing methanol, the method comprising synthesis steps and separation steps. The method has a synthesis loop comprising two synthesis steps and two separation steps, and comprises: a source gas mixing step in which a portion of a final unreacted gas is supplied to a hydrogen recovery unit, and a hydrogen-rich gas is mixed with a source gas, which contains at least hydrogen and carbon dioxide and has an M value of 1 or less, to obtain a make-up gas; a distribution ratio adjusting step in which the distribution ratio of the make-up gas is adjusted such that more than 0 mol% and 100 mol% or less are supplied to a first mixing step, and 0 mol% or more and less than 100 mol% are supplied to a final mixing step; the first mixing step for obtaining a first mixed gas; a first synthesis step for synthesizing methanol; a first separation step for separating a first unreacted gas from a first reaction mixture; the final mixing step for obtaining a final mixed gas; a final synthesis step for synthesizing methanol; and a final separation step for separating a final unreacted gas from a final reaction mixture.
C07C 29/151 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases
The present invention provides: a resin composition which has excellent moldability and a low dielectric loss tangent (Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed wiring board; and a semiconductor device. A resin composition according to the present invention contains, per 100 parts by mass of a resin (A) that has an indane skeleton and an end group represented by formula (T1), 10 to 300 parts by mass of a polyphenylene ether compound (B) that has a carbon-carbon unsaturated double bond at an end and 10 to 300 parts by mass of a polymer that has a constituent unit represented by formula (V).
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
The present invention provides: a resin which has an indane skeleton and exhibits excellent heat resistance and excellent dielectric characteristics; a resin composition which uses this resin; a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed wiring board; and a semiconductor device. The present invention provides a resin which is represented by formula (T), wherein: the parameter α that indicates the ratio of a constituent unit having an indane skeleton is 0.55 to 1.00; and the parameter β that indicates the double bond ratio at ends is 0.20 to 3.00. In formula (T), R represents a group that comprises a constituent unit represented by formula (Tx).
C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided are: a resin composition having excellent moldability and a low dissipation factor (Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed circuit board; and a semiconductor device. A resin composition containing a resin (A) having a terminal group represented by formula (T1) and an indane skeleton and a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at an end, in which the mass ratio of the resin (A) and the polyphenylene ether compound (B) is resin (A)/polyphenylene ether compound (B)=5/95-70/30. In formula (T1), Mb each independently represent a C1-12 hydrocarbon group optionally substituted by a halogen atom, y represents an integer of 0-4, and * represents a bonding position with another site.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
Provided is a styrene resin which can give cured objects excellent in terms of low-dielectric characteristics (Dk and/or Df) and heat resistance. Also provided are a hydroxy resin, a method for producing the hydroxy resin, a method for producing the styrene resin, and a resin composition, a cured object, a prepreg, a metal-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device each including or obtained using the styrene resin. The hydroxy resin is represented by formula (T-OH) and has a number-average molecular weight of 850-4,000. In formula (T-OH), R is a group including constituent units represented by formula (Tx-OH).
C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
The present invention provides a multilayer body and a multilayer container, each of which has excellent oxygen barrier properties, excellent delamination resistance and excellent transparency in a balanced manner. The present invention provides a multilayer body which comprises a layer that contains a polyester resin and a layer that contains a polyamide resin, wherein the polyamide resin is a copolymer which contains a constituent unit that is derived from a diamine and a constituent unit that is derived from a dicarboxylic acid, with 70% by mole or more of the constituent unit that is derived from a diamine being derived from a xylylenediamine, and 70% by mole or more of the constituent unit that is derived from a dicarboxylic acid being derived from an α, ω-linear aliphatic dicarboxylic acid having 4 to 8 carbon atoms and an α, ω-linear aliphatic dicarboxylic acid having 9 to 12 carbon atoms.
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
B65D 1/00 - Rigid or semi-rigid containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material or by deep-drawing operations p
Provided are: a resin composition having a low coefficient of thermal expansion (CTE) while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed circuit board; and a semiconductor device. The resin composition comprises a compound (M) represented by formula (M) and a polymer (V) having a constituent unit represented by formula (V). In formula (V), Ar represents an aromatic hydrocarbon linking group.
C08F 299/00 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
The present invention provides: a resin composition which exhibits excellent transparency, while maintaining excellent barrier properties; and a molded body and a multilayer body. The present invention provides a resin composition which contains 50 parts by mass to 99 parts by mass of a polyethylene terephthalate resin and 50 parts by mass to 1 part by mass of a polyamide resin. The polyamide resin is a copolymer which contains a constituent unit that is derived from a diamine and a constituent unit that is derived from a dicarboxylic acid, wherein: 70% by mole or more of the constituent unit that is derived from a diamine is derived from a xylylenediamine; 65.0% by mole to 95.0% by mole of the constituent unit that is derived from a dicarboxylic acid is derived from an α, ω-linear aliphatic dicarboxylic acid having 4 to 8 carbon atoms; and 35.0% by mole to 5.0% by mole of the constituent unit that is derived from a dicarboxylic acid is derived from an α, ω-linear aliphatic dicarboxylic acid having 9 to 12 carbon atoms. The polyamide resin has a relative viscosity of 1.7 to 2.5.
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
Provided are: a resin composition having excellent moisture absorption heat resistance while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed circuit board; and a semiconductor device. The resin composition comprises a compound (M) represented by formula (M), a polymer (V) having a constituent unit represented by formula (V), and a compound (M1) represented by formula (M1). In formula (V), Ar represents an aromatic hydrocarbon linking group.
C08F 299/00 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08L 25/02 - Homopolymers or copolymers of hydrocarbons
C08L 39/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocycli; Compositions of derivatives of such polymers
C08L 101/00 - Compositions of unspecified macromolecular compounds
122 independently represents an optionally substituted alkyl group having 1 to 20 carbon atoms or an optionally substituted aryl group having 6 to 30 carbon atoms.
C08G 64/00 - Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
C08K 5/524 - Esters of phosphorous acids, e.g. of H3PO3
C08K 5/549 - Silicon-containing compounds containing silicon in a ring
C08L 69/00 - Compositions of polycarbonates; Compositions of derivatives of polycarbonates
The present invention provides a production method for an episulfide compound that includes a step (A) for producing an episulfide compound that has at least two structures represented by formula (2) from an epoxy compound that has at least two structures represented by formula (1) and a step (B) for adding a mixed solvent of a protic polar solvent and an aprotic polar solvent to the reaction liquid from step (A). In formulas (1) and (2), R1represents a C0–10 hydrocarbon group, R2, R3, and R4 each independently represent a C1–10 hydrocarbon group or a hydrogen atom, Y represents O, S, Se, or Te, and n represents 0 or 1.
H10K 30/60 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation in which radiation controls flow of current through the devices, e.g. photoresistors
H10K 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group
C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08K 5/52 - Phosphorus bound to oxygen bound to oxygen only
Provided are an epoxy resin composition containing an epoxy resin, an epoxy resin curing agent containing a reaction composition (A) that contains a reaction product of xylylene diamine and an alkylene oxide, and a nonreactive diluent, and a cured product thereof.
The present invention relates to an etching composition for selectively etching a copper seed layer from a substrate that has a copper wiring pattern and the copper seed layer. An etching composition according to the present invention is used for the purpose of selectively etching a copper seed layer from a substrate that has a copper wiring pattern and the copper seed layer, and is characterized by containing (A) hydrogen peroxide, (B) sulfuric acid, (C) an azole or a salt thereof, (D) a glycol ether, (E) a halide ion and (F) water, while being also characterized in that: the content of the hydrogen peroxide (A) is 0.1 to 10% by mass based on the total amount of the etching composition; the content of the sulfuric acid (B) is 0.5 to 5% by mass based on the total amount of the etching composition; the ratio of the hydrogen peroxide (A) to the sulfuric acid (B) is 2 or more in terms of the molar ratio; and the content of the halide ion (E) is 0.01 to 3 ppm based on the total amount of the etching composition.
C23F 1/18 - Acidic compositions for etching copper or alloys thereof
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
97.
COMPOSITION, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND ETCHING METHOD USING SAME
Provided is a composition capable of selectively removing silicon while suppressing damage to silicon oxide. This composition contains: a quaternary ammonium compound; and at least one cationic surfactant selected from the group consisting of an aryl group-containing cationic surfactant and a heteroaryl group-containing cationic surfactant.
A curable resin comprising a structural unit represented by expression (1) (where R is a divalent group having an ethylenic double bond and/or an acetylenic triple bond), a structural unit represented by expression (2), and a structural unit represented by expression (3).
The present invention provides a curable resin containing a structural unit represented by formula (1), a structural unit represented by formula (2), and a structural unit represented by formula (3) (in formula (1), R1is a divalent group having one or more of at least one among an ethylenic double bond and an acetylenic triple bond, and in formula (2), R2 is a divalent group having an alicyclic structure).
The present invention provides a curable resin production method comprising: a step (A) for reacting a compound represented by formula (2) with at least one among a compound represented by formula (1) and a compound represented by formula (1'), the molar equivalents thereof being less than that of the compound represented by formula (2), by heating the same at normal pressure; and a step (B) for reacting the reaction product obtained from step (A) with a compound represented by formula (3) by heating the same at normal pressure.
C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers