Mitsubishi Gas Chemical Company, Inc.

Japan

Back to Profile

1-100 of 3,206 for Mitsubishi Gas Chemical Company, Inc. and 3 subsidiaries Sort by
Query
Aggregations
IP Type
        Patent 2,998
        Trademark 208
Jurisdiction
        World 1,949
        United States 1,175
        Canada 58
        Europe 24
Owner / Subsidiary
[Owner] Mitsubishi Gas Chemical Company, Inc. 3,194
MGC Filsheet Co., Ltd. 156
Japan Pionics Co., Ltd. 7
Eiwa Chemical Industry Co., Ltd. 4
Date
New (last 4 weeks) 21
2024 April (MTD) 11
2024 March 20
2024 February 16
2024 January 17
See more
IPC Class
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs 225
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics 212
H05K 1/03 - Use of materials for the substrate 209
B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters 167
C08J 5/18 - Manufacture of films or sheets 153
See more
NICE Class
01 - Chemical and biological materials for industrial, scientific and agricultural use 134
17 - Rubber and plastic; packing and insulating materials 62
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations 42
09 - Scientific and electric apparatus and instruments 22
05 - Pharmaceutical, veterinary and sanitary products 21
See more
Status
Pending 287
Registered / In Force 2,919
  1     2     3     ...     33        Next Page

1.

CARBON DIOXIDE ABSORBENT

      
Application Number 18267616
Status Pending
Filing Date 2021-12-14
First Publication Date 2024-04-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kouno, Kazuki
  • Kawashima, Yuki

Abstract

A carbon dioxide absorbent containing a polyamine compound (A) having an alicyclic hydrocarbon structure, wherein a content of the polyamine compound (A) is 60% by mass or more.

IPC Classes  ?

2.

RESIN COMPOSITION, AND PRINTING INK AND ELECTROCONDUCTIVE PASTE EACH USING SAME

      
Application Number 18276107
Status Pending
Filing Date 2022-02-10
First Publication Date 2024-04-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Goto, Toshihito
  • Ogawa, Noriyoshi

Abstract

According to the present invention, a resin composition can be provided, which comprises a solvent represented by general formula (1) and a polycarbonate resin containing a structural unit (a) represented by general formula (A) (provided that a polycarbonate homopolymer composed only of a structural unit represented by formula (i) is excluded). (In formula (1), Ra represents a hydrogen atom or the like; Rb represents an alkyl group having 1 to 20 carbon atoms which may have a substituent, or the like; Rc to Rf independently represent a hydrogen atom or the like; and n represents an integer of 1 to 10.) (In formula (A), R1 to R8 independently represent a hydrogen atom or the like; and X represents —O— or the like.)

IPC Classes  ?

  • C08G 64/06 - Aromatic polycarbonates not containing aliphatic unsaturation
  • C09D 7/63 - Additives non-macromolecular organic
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 169/00 - Coating compositions based on polycarbonates; Coating compositions based on derivatives of polycarbonates

3.

METHODS FOR PRODUCING POLYCARBONATE COPOLYMER AND POLYSILOXANE COMPOUND, POLYCARBONATE COPOLYMER, POLYSILOXANE COMPOUND, COMPOSITION, AND MOLDED BODY

      
Application Number 18515885
Status Pending
Filing Date 2023-11-21
First Publication Date 2024-04-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Uera, Kazuyoshi
  • Kamatani, Kohei
  • Tomita, Keisuke
  • Akimoto, Hisato

Abstract

A polycarbonate copolymer which has siloxane constituent units represented by any of formulae (1-1) to (1-4) and prescribed polycarbonate constituent units. A polycarbonate copolymer which has siloxane constituent units represented by any of formulae (1-1) to (1-4) and prescribed polycarbonate constituent units.

IPC Classes  ?

  • C08L 83/16 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
  • C08G 64/16 - Aliphatic-aromatic or araliphatic polycarbonates
  • C08G 64/38 - General preparatory processes using other monomers
  • C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
  • C08L 69/00 - Compositions of polycarbonates; Compositions of derivatives of polycarbonates

4.

POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION

      
Application Number 18273014
Status Pending
Filing Date 2022-01-11
First Publication Date 2024-04-11
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Matsuura, Kodai
  • Horiuchi, Junya
  • Okada, Yu
  • Omatsu, Tadashi
  • Echigo, Masatoshi

Abstract

A polymer having a constituent unit derived from a monomer represented by the following formula (0), wherein the polymer has sites in which the constituent units are linked by direct bonding between aromatic rings of the monomer represented by the formula (0): A polymer having a constituent unit derived from a monomer represented by the following formula (0), wherein the polymer has sites in which the constituent units are linked by direct bonding between aromatic rings of the monomer represented by the formula (0): A polymer having a constituent unit derived from a monomer represented by the following formula (0), wherein the polymer has sites in which the constituent units are linked by direct bonding between aromatic rings of the monomer represented by the formula (0): wherein R is a monovalent group, and m is an integer of 1 to 5, wherein at least one R is a hydroxyl group, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, or an amino group having 0 to 40 carbon atoms and optionally having a substituent.

IPC Classes  ?

  • C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
  • C08G 8/16 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with amino- or nitrophenols
  • C08G 8/22 - Resorcinol
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/22 - Exposing sequentially with the same light pattern different positions of the same surface
  • G03F 7/26 - Processing photosensitive materials; Apparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

5.

COMPOSITION FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number 18276480
Status Pending
Filing Date 2022-02-04
First Publication Date 2024-04-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Oie, Toshiyuki
  • Adaniya, Tomoyuki

Abstract

Provided is a composition for cleaning semiconductor substrates, having high removal rate of tungsten oxide with high Ti/W etching selectivity. Provided is a composition for cleaning semiconductor substrates, having high removal rate of tungsten oxide with high Ti/W etching selectivity. The composition for cleaning semiconductor substrates, comprising an oxidizing agent (A), a fluorine compound (B), a metallic tungsten corrosion inhibiter (C), and a tungsten oxide etching accelerator (D), wherein the addition ratio of the oxidizing agent (A) is from 0.0001 to 10% by mass relative to the total mass of the composition for cleaning semiconductor substrates; the addition ratio of the fluorine compound (B) is from 0.005 to 10% by mass relative to the total mass of the composition for cleaning semiconductor substrates; and the addition ratio of the metallic tungsten corrosion inhibiter (C) is from 0.0001 to 5% by mass relative to the total mass of the composition for cleaning semiconductor substrates.

IPC Classes  ?

  • C11D 3/24 - Organic compounds containing halogen
  • C11D 3/00 - Other compounding ingredients of detergent compositions covered in group
  • C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents

6.

ACID MATRIX APPLICATIONS: WELL STIMULATION AND COMPLETION FLUIDS USING VISCOELASTIC SURFACTANTS AND MODIFIED ADDITIVES

      
Application Number 17766977
Status Pending
Filing Date 2020-10-07
First Publication Date 2024-04-11
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Advincula, Rigoberto C.
  • Mimura, Kunitoshi
  • Ohno, Daisuke
  • Shimada, Masahiro

Abstract

A composition for an oil or gas well formation, containing a viscoelastic surfactant; and a modified nanomaterial and a producing method of the composition, and a forming method of the oil or gas well. The modified nanomaterial optionally contains a nanocellulose. The modified nanomaterial optionally has, on its surface, a sulfate group, a sulfite group, a carboxy group, an ethylene oxide chain, an amino group, an ester group, a silane group, a tertiary ammonium group or a mixture thereof.

IPC Classes  ?

  • C09K 8/20 - Natural organic compounds or derivatives thereof, e.g. polysaccharides or lignin derivatives

7.

MOLDED ARTICLE MANUFACTURING METHOD, RESIN IMPREGNATING APPARATUS, AND 3D PRINTER

      
Application Number 18039916
Status Pending
Filing Date 2021-10-29
First Publication Date 2024-04-11
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Matsumoto, Nobuhiko
  • Ikeuchi, Kousuke
  • Hashimoto, Ryoma

Abstract

Provided are a method for manufacturing a molded article consisting of a fiber-reinforced composite material containing a cured product of a thermosetting resin or a thermosetting resin composition and continuous reinforcing fibers, the method including, in this order, Steps (I) to (III) described below, a resin impregnating apparatus suitably used for the manufacturing method, and a 3D printer. Step (I): A coating step of coating a surface of a continuous reinforcing fiber bundle with a thermosetting resin or a thermosetting resin composition. Step (II): A resin impregnating step of twisting the continuous reinforcing fiber bundle after step (I) and obtaining a prepreg impregnated with the thermosetting resin or the thermosetting resin composition. Step (III): A heating and molding step of disposing the prepreg obtained in step (II) above and then heating the prepreg.

IPC Classes  ?

  • B29B 15/12 - Coating or impregnating of reinforcements of indefinite length
  • B33Y 70/10 - Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
  • B33Y 80/00 - Products made by additive manufacturing

8.

COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, COMPOSITION FOR OPTICAL MEMBER FORMATION, RESIN FOR UNDERLAYER FILM FORMATION, RESIST RESIN, RADIATION-SENSITIVE RESIN, AND RESIN FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY

      
Application Number 18013870
Status Pending
Filing Date 2021-07-08
First Publication Date 2024-04-11
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Yamamoto, Hiroaki
  • Matsuura, Kodai
  • Horiuchi, Junya
  • Iwasaki, Atsuko
  • Makinoshima, Takashi
  • Echigo, Masatoshi

Abstract

A composition for film formation containing a polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the formulas (1-0), (1A), and (1B), wherein the repeating units are linked by a direct bond between aromatic rings: A composition for film formation containing a polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the formulas (1-0), (1A), and (1B), wherein the repeating units are linked by a direct bond between aromatic rings:

IPC Classes  ?

  • C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
  • C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
  • C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

9.

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER

      
Application Number JP2023033282
Publication Number 2024/075480
Status In Force
Filing Date 2023-09-13
Publication Date 2024-04-11
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ikeuchi Kousuke
  • Wakahara Daiki
  • Matsumoto Nobuhiko

Abstract

Disclosed are: a thermosetting resin composition which contains an epoxy resin (component (A)), a (meth)acrylate compound (component (B)), an epoxy resin curing agent (component (C)) and a thermal radical polymerization initiator (component (D)), wherein the component (B) contains a poly(butadiene-CO-acrylonitrile) having acryloyloxy groups at both ends (component (B1)) and a multifunctional (meth)acrylate (component (B2)) other than the component (B1), and the component (C) contains a boron amine complex; a cured product of this thermosetting resin composition; a prepreg; a fiber-reinforced composite material; and a high-pressure gas container which comprises this fiber-reinforced composite material.

IPC Classes  ?

  • C08G 59/72 - Complexes of boron halides
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
  • F16J 12/00 - Pressure vessels in general
  • F17C 1/02 - Pressure vessels, e.g. gas cylinder, gas tank, replaceable cartridge involving reinforcing arrangements

10.

RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD, CIRCUIT PATTERN FORMATION METHOD AND METHOD FOR PURIFYING RESIN

      
Application Number 18277366
Status Pending
Filing Date 2022-01-28
First Publication Date 2024-04-04
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Horiuchi, Junya
  • Makinoshima, Takashi
  • Sato, Takashi
  • Echigo, Masatoshi

Abstract

An object of the present invention is to provide a novel resin that is useful as a film forming material for lithography and the like. The problem can be solved by a resin containing a constituent unit represented by the following formula (1) or (1)′: An object of the present invention is to provide a novel resin that is useful as a film forming material for lithography and the like. The problem can be solved by a resin containing a constituent unit represented by the following formula (1) or (1)′: An object of the present invention is to provide a novel resin that is useful as a film forming material for lithography and the like. The problem can be solved by a resin containing a constituent unit represented by the following formula (1) or (1)′: wherein the variables in the formulas are as described in the specification.

IPC Classes  ?

  • C08G 8/20 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/26 - Processing photosensitive materials; Apparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

11.

DEOXYGENATION AGENT COMPOSITION, METHOD FOR PRODUCING SAME, AND DEOXYGENATION AGENT PACKAGE

      
Application Number JP2023034309
Publication Number 2024/070891
Status In Force
Filing Date 2023-09-21
Publication Date 2024-04-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Sato Daiki

Abstract

A deoxygenation agent composition which contains an iron powder, an activated carbon, water, a halide of an alkaline earth metal, and an alkaline substance, wherein: the content of the activated carbon is 20 parts by mass to 40 parts by mass relative to 100 parts by mass of the content of the iron powder; the content of the water is 230 parts by mass to 370 parts by mass relative to 100 parts by mass of the content of the activated carbon; and the content of the halide of an alkaline earth metal is 50 parts by mass to 65 parts by mass relative to 100 parts by mass of the content of the water.

IPC Classes  ?

  • B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
  • B01J 20/02 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
  • B01J 20/30 - Processes for preparing, regenerating or reactivating

12.

AMINO COMPOUND AND METHOD FOR PRODUCING SAME, EPOXY RESIN CURING AGENT, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME

      
Application Number JP2023033658
Publication Number 2024/063019
Status In Force
Filing Date 2023-09-15
Publication Date 2024-03-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ohno Yuma
  • Akai Yuka
  • Kouno Kazuki

Abstract

Provided are: an amino compound represented by general formula (1); a method for producing the amino compound; an epoxy resin curing agent comprising the amino compound; an epoxy resin composition; and a cured product of the epoxy resin composition. (1): R1-NH-X-NH-R2(wherein R1and R2each independently represent a hydrogen atom, or a monovalent group represented by general formula (2), in which at least one of R1and R2222n22m222-, or a bivalent group represented by general formula (3) or (4); n represents 2 to 6; and m represents 1 or 2.) (In the formula, a broken line indicates the presence or absence of a π bond; R3to R5 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may have a hydroxy group; and * indicates a bonding hand.) (In the formula, * indicates a bonding hand.)

IPC Classes  ?

  • C07D 307/52 - Radicals substituted by nitrogen atoms not forming part of a nitro radical
  • C08G 59/50 - Amines

13.

CARBON DIOXIDE ABSORBER

      
Application Number 18273103
Status Pending
Filing Date 2021-12-20
First Publication Date 2024-03-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kouno, Kazuki
  • Kawashima, Yuki
  • Asai, Ryo
  • Kirino, Tomoaki

Abstract

A carbon dioxide absorbent containing an amine compound (A) having a heterocyclic structure (X) selected from the group consisting of an oxygen-containing heterocyclic structure and a sulfur-containing heterocyclic structure, a content of the amine compound (A) being 65% by mass or more.

IPC Classes  ?

  • B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
  • C07D 295/13 - Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
  • C07D 307/14 - Radicals substituted by nitrogen atoms not forming part of a nitro radical
  • C07D 307/52 - Radicals substituted by nitrogen atoms not forming part of a nitro radical
  • C07D 309/04 - Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
  • C07D 333/20 - Radicals substituted by singly bound hetero atoms other than halogen by nitrogen atoms

14.

AMINO COMPOSITION AND METHOD FOR PRODUCING SAME, EPOXY RESIN CURING AGENT, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME

      
Application Number JP2023033656
Publication Number 2024/063018
Status In Force
Filing Date 2023-09-15
Publication Date 2024-03-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ohno Yuma
  • Akai Yuka
  • Kouno Kazuki

Abstract

2222-NH-R1(wherein R1represents a monovalent group represented by general formula (2); and X represents a phenylene group) (in the formula, a broken line indicates the presence or absence of a π-bond; R2to R4each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may have a hydroxy group; and * indicates a bonding hand.) (3): R1222-NH-R1(wherein R1 and X are as defined above.)

IPC Classes  ?

  • C07D 307/52 - Radicals substituted by nitrogen atoms not forming part of a nitro radical
  • C08G 59/50 - Amines

15.

BISIMIDE PHENOL COMPOUND

      
Application Number 18504785
Status Pending
Filing Date 2023-11-08
First Publication Date 2024-03-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Hikichi, Tatsuya
  • Wakahara, Daiki
  • Ohnishi, Nobuyoshi

Abstract

A bisimide phenyl ester acid dianhydride represented by the following formula (2): A bisimide phenyl ester acid dianhydride represented by the following formula (2): A bisimide phenyl ester acid dianhydride represented by the following formula (2): where R3 and R4 each independently represents a hydrogen atom or an organic group having 1 to 10 carbon atoms; each m is independently an integer of 1 to 4; and each A independently represents an aromatic ring or an alicyclic ring.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

16.

POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION

      
Application Number JP2023032770
Publication Number 2024/058061
Status In Force
Filing Date 2023-09-08
Publication Date 2024-03-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Abiko Yohei
  • Yasufuku Haruka
  • Yonehama Shinichi

Abstract

A polyimide resin having a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A includes a structural unit (A1) derived from a compound represented by formula (a1), and the structural unit B includes a structural unit (B1) derived from a compound represented by formula (b1) and a structural unit (B2) derived from a compound represented by formula (b2) (Z is a diphenylfluorene structure or a hexafluoro diphenylpropane structure, and X1and X232322-.).

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets
  • C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C09J 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

17.

METHOD FOR PRODUCING POLYIMIDE FILM

      
Application Number JP2023033284
Publication Number 2024/058194
Status In Force
Filing Date 2023-09-13
Publication Date 2024-03-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Hoshino Shun
  • Muraya Takahiro
  • Suzuki Kouji
  • Ishii Kentaro
  • Hatakeyama Takuro

Abstract

This method for producing a polyimide film comprises: a step 1 in which, at 50°C to 120°C, a solvent is removed from a varnish that contains the solvent and a polyimide precursor having a polyamic acid moiety, and the resulting varnish is dried; and a step 2 in which the resulting product is imidized by being held at 300°C to 400°C for 10 minutes to 120 minutes, and subsequently held at 420°C to 500°C. With respect to this method for producing a polyimide film, the polyamic acid moiety has a structural unit that is derived from a tetracarboxylic acid dianhydride and a structural unit that is derived from a diamine; and a diamine which enables the achievement of the structural unit derived from a diamine includes a diamine that has an ionization potential of 7.10 eV or more.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets

18.

AQUEOUS COMPOSITION, AND MANUFACTURING METHOD AND THINNING PROCESSING METHOD FOR STAINLESS STEEL USING SAME

      
Application Number JP2023033576
Publication Number 2024/058250
Status In Force
Filing Date 2023-09-14
Publication Date 2024-03-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sugimoto Takashi
  • Ikeda Kaduhiko
  • Tamai Satoshi

Abstract

The present invention addresses the problem of providing: an aqueous composition which enables the manufacturing of thinned stainless steel; such stainless steel and a manufacturing method therefor; and a thinning processing method for stainless steel. The problem has been solved by using an aqueous composition for thinning stainless steel, the aqueous composition containing 0.01-10 mass% of hydrogen peroxide, 12.5-40 mass% of halide ions, and 0-3.0 mass% of copper ions. According to the present invention, the thinning of stainless steel can be achieved by a simple method.

IPC Classes  ?

  • C23F 1/28 - Acidic compositions for etching iron group metals

19.

Miscellaneous Design

      
Application Number 1781686
Status Registered
Filing Date 2024-01-22
Registration Date 2024-01-22
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Chemicals used in industry; chemical substances for use to preserve foodstuffs, pharmaceuticals and medical instruments to prevent material from deteriorating by oxidation; oxygen absorbing agents; oxygen detecting agents.

20.

ANTI-GLARE LAMINATE AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2023032168
Publication Number 2024/057985
Status In Force
Filing Date 2023-09-04
Publication Date 2024-03-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Suzuki Yuto
  • Kokubu Hiroko
  • Takasaki Masato
  • Fukunaga Yasutaka

Abstract

The present invention makes it possible to provide an anti-glare laminate in which at least a base-material layer containing a polycarbonate resin (a1), a high-hardness resin layer containing a high-hardness resin (B), and a hard coat layer are disposed in the stated order, wherein the development surface area ratio (Sdr), arithmetic average height (Sa), and autocorrelation length (Sal) of the hard coat layer satisfy expressions (i) to (iii). (i): 0 ≤ Sdr ≤ 0.6. (ii): 0 ≤ Sa ≤ 0.16. (iii): 0 ≤ Sal ≤ 15.0.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 7/023 - Optical properties
  • G02B 5/02 - Diffusing elements; Afocal elements

21.

METHOD FOR PRODUCING STAINLESS STEEL, WEIGHT REDUCTION PROCESSING METHOD, STAINLESS STEEL AND AQUEOUS COMPOSITION

      
Application Number JP2023033575
Publication Number 2024/058249
Status In Force
Filing Date 2023-09-14
Publication Date 2024-03-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sugimoto Takashi
  • Ikeda Kaduhiko
  • Tamai Satoshi

Abstract

The present invention provides: low-density stainless steel and a method for producing the same; a weight reduction processing method for stainless steel; and an aqueous composition, etc. that is useful in weight reduction of stainless steel. The above problem was solved by a method for producing stainless steel, etc. that includes a weight reduction processing step that reduces the weight of stainless steel using an aqueous composition, the density of the stainless steel that has undergone weight reduction processing being less than 7.4 g/cm3. Reduction of the weight and lowering of the density of stainless steel can be achieved by an easy method in accordance with the present invention.

IPC Classes  ?

  • C23F 1/28 - Acidic compositions for etching iron group metals

22.

PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE

      
Application Number 18038574
Status Pending
Filing Date 2021-11-10
First Publication Date 2024-03-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sato, Yumi
  • Miyahara, Daichi
  • Umeki, Miho

Abstract

A photosensitive polyimide resin composition containing: a ring-closed polyimide resin (A) having a structure represented by Formula (1) and a weight average molecular weight of 70000 or less; and a polyfunctional radically polymerizable compound (B) having 4 or more and 100 or less radically polymerizable functional groups. A photosensitive polyimide resin composition containing: a ring-closed polyimide resin (A) having a structure represented by Formula (1) and a weight average molecular weight of 70000 or less; and a polyfunctional radically polymerizable compound (B) having 4 or more and 100 or less radically polymerizable functional groups.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

23.

PHOTOCURABLE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL MATERIAL CONTAINING SAID CURED PRODUCT

      
Application Number 18273244
Status Pending
Filing Date 2022-01-11
First Publication Date 2024-03-14
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Kinjo, Kota
  • Namiki, Kosuke
  • Furukawa, Kikuo
  • Koshiishi, Eiji

Abstract

According to the present invention, there can be provided a photocurable composition comprising a sulfur (a) having a cyclic structure represented by the following formula (1), an episulfide compound (b), and a photopolymerization initiator (c), wherein the content of the sulfur (a) is 1 to 28 parts by mass, with respect to the total mass (100 parts by mass) of the sulfur (a) and the episulfide compound (b): According to the present invention, there can be provided a photocurable composition comprising a sulfur (a) having a cyclic structure represented by the following formula (1), an episulfide compound (b), and a photopolymerization initiator (c), wherein the content of the sulfur (a) is 1 to 28 parts by mass, with respect to the total mass (100 parts by mass) of the sulfur (a) and the episulfide compound (b):

IPC Classes  ?

  • C08L 81/04 - Polysulfides
  • C08J 3/28 - Treatment by wave energy or particle radiation
  • C08K 5/375 - Sulfides containing six-membered aromatic rings
  • C08K 5/45 - Heterocyclic compounds having sulfur in the ring
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

24.

FOAMED-RESIN-FORMABLE COMPOSITION, POLYUREA-BASED RESIN FOAM BODY, AND POLYUREA-BASED RESIN FOAM BODY PRODUCTION METHOD

      
Application Number JP2023029901
Publication Number 2024/053366
Status In Force
Filing Date 2023-08-18
Publication Date 2024-03-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kawashima Yuki
  • Kouno Kazuki

Abstract

This foamed-resin-formable composition is for obtaining a polyurea-based resin foam body, and contains a reactant (A) between a cyclic polyamine compound (a1) and carbon dioxide, a polyisocyanate compound (B), and an aromatic polyamine compound (C). This polyurea-based resin foam body is obtained by foaming and molding the foamed-resin-formable composition. This polyurea-based resin foam body production method comprises a step for foaming and molding the foamed-resin-formable composition. According to the present invention, it is possible to obtain a polyurea-based resin foam body which can reduce environmental load and which has improved foaming ability.

IPC Classes  ?

  • C08G 18/00 - Polymeric products of isocyanates or isothiocyanates
  • C08G 18/32 - Polyhydroxy compounds; Polyamines; Hydroxy amines
  • C08G 101/00 - Manufacture of cellular products

25.

POLYESTER RESIN AND METHOD FOR PRODUCING POLYESTER RESIN

      
Application Number 18500152
Status Pending
Filing Date 2023-11-02
First Publication Date 2024-03-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Shinohara, Katsumi
  • Sato, Kazua
  • Ikarashi, Hiroki

Abstract

A polyester resin containing: a diol constituent unit containing a unit a1 derived from spiroglycol represented by formula (1) and a unit a2 derived from ethylene glycol; and a dicarboxylic acid constituent unit containing a unit b derived from terephthalic acid and/or an ester thereof. A content of the unit a1 is from 5 to 60 mol % and a content of the unit a2 is from 30 to 95 mol %, based on a total amount of the unit a1 and the unit a2. A content of the unit b is from 80 to 100 mol % based on a total amount of the dicarboxylic acid constituent unit. A polyester resin containing: a diol constituent unit containing a unit a1 derived from spiroglycol represented by formula (1) and a unit a2 derived from ethylene glycol; and a dicarboxylic acid constituent unit containing a unit b derived from terephthalic acid and/or an ester thereof. A content of the unit a1 is from 5 to 60 mol % and a content of the unit a2 is from 30 to 95 mol %, based on a total amount of the unit a1 and the unit a2. A content of the unit b is from 80 to 100 mol % based on a total amount of the dicarboxylic acid constituent unit.

IPC Classes  ?

  • C08G 63/672 - Dicarboxylic acids and dihydroxy compounds

26.

ANTI-GLARE LAMINATE

      
Application Number JP2023030442
Publication Number 2024/048406
Status In Force
Filing Date 2023-08-24
Publication Date 2024-03-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kamei Shota
  • Yamagishi Hiroaki
  • Kajimoto Chihiro

Abstract

The present invention provides an anti-glare laminate comprising at least a substrate layer and an anti-glare layer. The anti-glare layer comprises at least a multifunctional (meth)acryloyl group-containing monomer (A), a (meth)acryloyl group-containing monomer (B), a photopolymerization initiator (C), and silica particles (D). The average particle diameter of the silica particles is 1 to 7 µm, and the silica particles have an oil absorption of 30 to 250 mL/100 g. The proportion of component (A) is 40 to 90 mass% and the proportion of component (B) is 10 to 60 mass% using 100 mass% for the total of component (A) and component (B). The double bond equivalent of component (B) is not greater than 400 g/mol.

IPC Classes  ?

  • G02B 5/02 - Diffusing elements; Afocal elements
  • B32B 7/023 - Optical properties
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • G02B 1/11 - Anti-reflection coatings
  • G02B 5/28 - Interference filters

27.

ANTI-GLARE LAMINATE

      
Application Number JP2023030443
Publication Number 2024/048407
Status In Force
Filing Date 2023-08-24
Publication Date 2024-03-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kamei Shota
  • Yamagishi Hiroaki
  • Kajimoto Chihiro

Abstract

The present invention makes it possible to provide an anti-glare laminate including at least a substrate layer and an anti-glare layer, wherein the haze (H) of the anti-glare laminate and the ten point average roughness (Rzjis) measured when the reference length of the anti-glare layer is set to 0.8 mm satisfy formula (1). Formula (1): H/Rzjis ≥ 4.0

IPC Classes  ?

  • G02B 5/02 - Diffusing elements; Afocal elements
  • B32B 7/023 - Optical properties
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • G02B 1/11 - Anti-reflection coatings

28.

ADHESIVE FILM, HEAT MOLDED BODY AND METHOD FOR PRODUCING ADHESIVE FILM

      
Application Number JP2023030649
Publication Number 2024/048432
Status In Force
Filing Date 2023-08-25
Publication Date 2024-03-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Kakeya Fumiaki

Abstract

The present invention provides: an adhesive film which exhibits excellent moldability; a heat molded body; and a method for producing an adhesive film. This adhesive film comprises a base material film that contains a polycarbonate, a primer layer that is arranged on at least one surface of the base material film, and an adhesive layer that is arranged on a surface on the reverse side of the primer layer from the base material film; and the primer layer is formed of a primer layer composition that contains an oligomer diol.

IPC Classes  ?

  • C09J 7/50 - Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
  • C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
  • C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/04 - Homopolymers or copolymers of esters

29.

COMPOSITION, RESIN COMPOSITION, AND CURED PRODUCT

      
Application Number JP2023030852
Publication Number 2024/048481
Status In Force
Filing Date 2023-08-28
Publication Date 2024-03-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Asai Ryo
  • Kitamura Mitsuharu

Abstract

Provided are a composition, and a resin composition and cured product using the composition. The composition includes an amino group and a cyclic ether structure, and contains a compound having a molecular weight of 1000 or less, and a less-hindered phenolic antioxidant.

IPC Classes  ?

  • C09K 15/20 - Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing nitrogen and oxygen
  • C07D 307/14 - Radicals substituted by nitrogen atoms not forming part of a nitro radical
  • C08G 59/50 - Amines
  • C08K 5/13 - Phenols; Phenolates
  • C08K 5/17 - Amines; Quaternary ammonium compounds
  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
  • C08L 101/00 - Compositions of unspecified macromolecular compounds

30.

METHOD FOR PRODUCING POLYCARBONATE RESIN MOLDED PRODUCT

      
Application Number JP2023030865
Publication Number 2024/048485
Status In Force
Filing Date 2023-08-28
Publication Date 2024-03-07
Owner
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
  • MITSUBISHI GAS CHEMICAL TRADING, INC. (Japan)
Inventor Nagai Satoshi

Abstract

Provided is a method for producing a polycarbonate resin molded product by molding a polycarbonate resin using an injection molding machine, comprising: a step for starve feeding polycarbonate resin particulates to an injection molding machine; a step for generating a plasticized resin by plasticizing the particulates inside the injection molding machine; and a step for producing a molded product from the plasticized resin. The water content of the particulates which are starve fed to the injection molding machine is not more than 0.3 wt%.

IPC Classes  ?

  • B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor

31.

CELLULOSE FIBERS, RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING CELLULOSE FIBERS

      
Application Number JP2023031408
Publication Number 2024/048626
Status In Force
Filing Date 2023-08-30
Publication Date 2024-03-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kimura Ryutaro
  • Sugiyama Masahide
  • Miyahira Tetsurou

Abstract

Provided are a resin composition, a molded article, and a method for producing cellulose fibers. When dyed by a dye, the cellulose fibers have a ratio (L'/L) of the skin layer brightness (L') and the core layer brightness (L) of 0.70 or less. The skin layer brightness (L') and the core layer brightness (L) of the cellulose fiber cross section are obtained by measuring the R, G, and B values of each of the layers, and calculating using the formula of [(maximum value of the R, G, and B values)/255] * 100 [%].

IPC Classes  ?

  • D01F 2/00 - Monocomponent artificial filaments or the like of cellulose or cellulose derivatives; Manufacture thereof
  • C08B 16/00 - Regeneration of cellulose
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material

32.

MULTILAYER BODY AND MOLDED ARTICLE

      
Application Number JP2023029797
Publication Number 2024/043180
Status In Force
Filing Date 2023-08-18
Publication Date 2024-02-29
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Yamaguchi Madoka
  • Izumi Ryunosuke

Abstract

The present invention provides: a multilayer body wherein the occurrence of spring-back can be suppressed even if the multilayer body is subjected to hot forming; and a molded article. The multilayer body comprises a polycarbonate resin layer (X) which is formed of a resin composition (x) that contains a polycarbonate resin, and an acrylic resin layer (Y) which is formed of a resin composition (y) that contains an acrylic resin. With respect to the polycarbonate resin contained in the resin composition (x), the ratio Mw/Mn of the weight average molecular weight (Mw) in terms of polystyrene as determined by gel permeation chromatography to the number average molecular weight (Mn) is 2.80 to 4.40, and/or 60 to 93 parts by mass of a polycarbonate resin (x1) that have a viscosity-average molecular weight of 24,000 to 50,000 and 7 to 40 parts by mass of a polycarbonate oligomer (x2) that has a viscosity-average molecular weight of 2,000 to 10,000 are contained.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • C08L 33/10 - Homopolymers or copolymers of methacrylic acid esters
  • C08L 69/00 - Compositions of polycarbonates; Compositions of derivatives of polycarbonates
  • B32B 7/027 - Thermal properties

33.

POLYCARBONATE RESIN, RESIN SOLUTION, AND FILM

      
Application Number JP2023030291
Publication Number 2024/043270
Status In Force
Filing Date 2023-08-23
Publication Date 2024-02-29
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Goto Toshihito

Abstract

A polycarbonate resin provided according to one embodiment of the present invention comprises a constituent unit (A) derived from a monomer represented by formula (1), a constituent unit (B) derived from a monomer represented by formula (2), a constituent unit (C) derived from a monomer represented by formula (3), and/or a constituent unit (D) derived from a monomer represented by formula (4).

IPC Classes  ?

  • C08G 64/04 - Aromatic polycarbonates
  • C08J 5/18 - Manufacture of films or sheets
  • C08L 69/00 - Compositions of polycarbonates; Compositions of derivatives of polycarbonates

34.

SYSTEM FOR PRODUCING HYDROCARBON COMPOUND AND METHOD FOR PRODUCING HYDROCARBON COMPOUND

      
Application Number 18272425
Status Pending
Filing Date 2022-02-24
First Publication Date 2024-02-29
Owner
  • MITSUBISHI HEAVY INDUSTRIES, LTD. (Japan)
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Marushima, Shinya
  • Irie, Kenichi
  • Kamo, Takahiro
  • Tanioka, Tadateru
  • Ando, Yoshimasa
  • Tsutsumi, Atsushi

Abstract

Provided is a production system for producing a hydrocarbon compound, which is a hydrocarbon compound production system capable of managing an environmental load reducing effect derived from a raw material. The hydrocarbon compound production system includes a hydrogen production device that generates hydrogen, a carbon dioxide supply device that supplies a carbon dioxide, and a hydrocarbon compound production device that generates a hydrocarbon compound from each of the hydrogen generated by the hydrogen production device and the carbon dioxide supplied from the carbon dioxide supply device, wherein, on the basis of at least either one of respective environmental indicators of the hydrogen generated by the hydrogen production device and the carbon dioxide supplied from the carbon dioxide supply device, an environmental load level of the hydrocarbon compound generated by the hydrocarbon compound production device is categorized.

IPC Classes  ?

  • C10G 2/00 - Production of liquid hydrocarbon mixtures of undefined composition from oxides of carbon

35.

MANUFACTURING METHOD FOR POLYIMIDE RESIN VARNISH

      
Application Number JP2023029067
Publication Number 2024/034634
Status In Force
Filing Date 2023-08-09
Publication Date 2024-02-15
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Hatakeyama Takuro
  • Muraya Takahiro

Abstract

A method of manufacturing a polyimide resin varnish comprises step (A) described below and step (B) described below and is under a dry gas environment from the start time of step (A) to the end time of step (B). Step (A) is for polymerizing, in an organic solvent and at 100 to 210°C, a tetracarboxylic acid component including an aliphatic tetracarboxylic acid dianhydride mixture and a diamine component including an aromatic diamine, and obtaining a polymer, and step (B) is for reacting, at 60 to 130°C, an alkoxysilylamine compound with the polymer obtained in step (A).

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides

36.

COMPOSITION, AND OPTICAL MATERIAL AND LENS USING SAME

      
Application Number 18269091
Status Pending
Filing Date 2021-10-04
First Publication Date 2024-02-15
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Imagawa, Yousuke
  • Takemura, Kouhei
  • Sugihara, Ryosuke
  • Sado, Mariko

Abstract

A composition that includes Compound (a) and Compound (b). Compound (a) is represented by formula (1): A composition that includes Compound (a) and Compound (b). Compound (a) is represented by formula (1): A composition that includes Compound (a) and Compound (b). Compound (a) is represented by formula (1): where: Ar represents an aromatic ring; m represents an integer of 2 to 8; n represents an integer of 0 to 6, provided that m+n is the number of carbon atoms constituting the aromatic ring, or less; and R1 each independently represents an alkylthio group, a halogen group, a hydroxy group, a dialkylthiocarbamoyl group, or a dialkylcarbamoylthio group. Compound (b) is represented by formula (2): A composition that includes Compound (a) and Compound (b). Compound (a) is represented by formula (1): where: Ar represents an aromatic ring; m represents an integer of 2 to 8; n represents an integer of 0 to 6, provided that m+n is the number of carbon atoms constituting the aromatic ring, or less; and R1 each independently represents an alkylthio group, a halogen group, a hydroxy group, a dialkylthiocarbamoyl group, or a dialkylcarbamoylthio group. Compound (b) is represented by formula (2): A composition that includes Compound (a) and Compound (b). Compound (a) is represented by formula (1): where: Ar represents an aromatic ring; m represents an integer of 2 to 8; n represents an integer of 0 to 6, provided that m+n is the number of carbon atoms constituting the aromatic ring, or less; and R1 each independently represents an alkylthio group, a halogen group, a hydroxy group, a dialkylthiocarbamoyl group, or a dialkylcarbamoylthio group. Compound (b) is represented by formula (2): where p represents an integer of 0 to 4, and q represents an integer of 0 to 2.

IPC Classes  ?

  • C08G 75/08 - Polythioethers from cyclic thioethers from thiiranes
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

37.

METHOD FOR MANUFACTURING METAL FOIL CLAD LAMINATED SHEET, RESIN COMPOSITION, RESIN COMPOSITE SHEET, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Application Number JP2023023658
Publication Number 2024/034276
Status In Force
Filing Date 2023-06-26
Publication Date 2024-02-15
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okumura Keisuke
  • Komatsu Kouki
  • Hasebe Keiichi
  • Hirano Shunsuke

Abstract

The present invention provides a method for manufacturing a metal foil clad laminated sheet having excellent mass productivity and in which peeling of a resin composition layer and a metal foil is suppressed, as well as a resin composition, a resin composite sheet, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor device. A method for manufacturing a metal foil clad laminated sheet in which a resin composite sheet C including a metal foil and a resin composition layer disposed on one side of the metal foil is laminated on the surface of a circuit board A including an insulating layer and a conductor circuit layer, using a vacuum laminating device, the method for manufacturing a metal foil clad laminated sheet comprising the following steps. Step 1: A step for obtaining a circuit board B by reducing the content of moisture and/or a solvent included in the circuit board A. Step 2: A step for obtaining a laminated board D by placing, heating, and pressurizing in a reduced pressure or vacuum environment the circuit board B and the resin composite sheet C. Step 3: A step for obtaining a laminated board E by smoothing the surface of the resin composition layer of the laminated board D.

IPC Classes  ?

  • H05K 3/46 - Manufacturing multi-layer circuits
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • H05K 1/03 - Use of materials for the substrate

38.

ROUGHENING TREATMENT METHOD FOR STAINLESS STEEL SURFACE, METHOD FOR MANUFACTURING ROUGHENED STAINLESS STEEL, AND AQUEOUS COMPOSITION USED IN SAID METHODS

      
Application Number 18266624
Status Pending
Filing Date 2021-12-13
First Publication Date 2024-02-08
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ikeda, Kazuhiko
  • Fujii, Tomoko
  • Matsunaga, Hiroshi

Abstract

The problem of the present invention is to provide a roughening treatment method in which the surface of stainless steel is sufficiently roughened in an efficient manner with few steps, while maintaining good surface quality of the stainless steel after treatment. The above problem is solved by a roughening treatment method for stainless steel, which comprises a roughening treatment step that uses a first aqueous composition, and a post-treatment step that uses a second aqueous composition. Namely, the roughening treatment step is to roughen the surface of stainless steel containing copper or a metal having an ionization tendency larger than copper by bringing the first aqueous composition into contact with the surface, wherein the first aqueous composition comprises 0.1% to 20% by mass of hydrogen peroxide based on the total amount of the first aqueous composition, 0.25% to 40% by mass of copper ions based on the total amount of the first aqueous composition, and 1% to 30% by mass of halide ions based on the total amount of the first aqueous composition, wherein the post-treatment step is to perform a post-treatment by bringing the second aqueous composition into contact, under acidic conditions, with the surface of the stainless steel that has been treated in the roughening treatment step, and wherein the second aqueous composition comprises at least a peroxide.

IPC Classes  ?

  • C23F 1/28 - Acidic compositions for etching iron group metals

39.

AQUEOUS COMPOSITION, STAINLESS STEEL SURFACE ROUGHENING METHOD USING SAME, AND METHOD FOR MANUFACTURING ROUGHENED STAINLESS STEEL

      
Application Number 18266888
Status Pending
Filing Date 2021-12-13
First Publication Date 2024-02-08
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ikeda, Kazuhiko
  • Fujii, Tomoko
  • Matsunaga, Hiroshi

Abstract

The problem of the present invention is to provide an aqueous composition with which the surface of stainless steel is sufficiently roughened in an efficient manner with few steps, while maintaining good quality (e.g., thickness) of the stainless steel after treatment. The above problem is solved by the following aqueous composition for roughening the surface of stainless steel. Namely, the aqueous composition comprises 0.1% to 10% by mass of hydrogen peroxide based on the total amount of the aqueous composition, 1% to 30% by mass of halide ions based on the total amount of the aqueous composition, and 0% to 3% by mass of copper ions based on the total amount of the aqueous composition.

IPC Classes  ?

  • C23F 1/28 - Acidic compositions for etching iron group metals

40.

MULTILAYER BODY

      
Application Number JP2023027853
Publication Number 2024/029473
Status In Force
Filing Date 2023-07-28
Publication Date 2024-02-08
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ishii Hiroki
  • Konomi Keisuke

Abstract

Provided is a multilayer body which has, on a surface of a thin polycarbonate film, a protection film that has an adhesive layer and in which an orange peel texture is unlikely to occur on the surface of the polycarbonate film when the protection film is peeled. A multilayer body according to the present invention has a polycarbonate film that has a thickness of 20-75 μm and a protection film that is provided on at least one surface of the polycarbonate film, wherein the protection film has an adhesive layer that can be peeled from the polycarbonate film and a layer that contains a resin, the adhesive layer is in contact with the polycarbonate film, and when the polycarbonate film is peeled from the multilayer body, the arithmetic mean undulation Ma of undulations in the adhesive layer, excluding undulations that have an undulation width of less than 500 μm or more than 3,000 μm, is 0.01-0.12 μm.

IPC Classes  ?

  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 7/023 - Optical properties
  • B32B 7/06 - Interconnection of layers permitting easy separation
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • C09J 7/24 - Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
  • C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds

41.

RESIN COMPOSITION, FILM, POLARIZING SHEET, RESIN COMPOSITION PRODUCTION METHOD, AND FILM MANUFACTURING METHOD

      
Application Number JP2023028063
Publication Number 2024/029515
Status In Force
Filing Date 2023-08-01
Publication Date 2024-02-08
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Kosaka Megumu

Abstract

Provided are: a resin composition which can suppress occurrence of stains on a molding roller, and with which foreign matter is unlikely to be formed in a film; a film; a polarizing sheet; a resin composition production method; and a film manufacturing method. This resin composition contains, with respect to 100 parts by mass of a polyamide resin, 0.05-10 parts by mass of a compound having 1-3 cyclic ether structures per molecule, and exhibits a haze of 10% or less when being formed into a 200 μm-thick film.

IPC Classes  ?

  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08J 5/18 - Manufacture of films or sheets
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • C08K 5/1515 - Three-membered rings
  • C08K 5/1525 - Four-membered rings
  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins

42.

RECESS ETCHING SOLUTION, RECESS ETCHING METHOD, AND SURFACE-TREATED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

      
Application Number 18255975
Status Pending
Filing Date 2021-12-06
First Publication Date 2024-02-08
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okabe, Satoshi
  • Oie, Toshiyuki
  • Adaniya, Tomoyuki
  • Hommo, Yoshihiro
  • Chen, Chung-Yi
  • Wang, Po-Hung

Abstract

A recess etching solution for recess etching a metal wiring in a semiconductor substrate manufacturing process; and a recess etching method employing the same. The recess etching solution is for applying recess etching to a surface of a cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate, and contains (A) an organic acid, one of or both of (B) a nitrogen-containing heterocyclic compound and (C) an organic solvent, and (D) water. The recess etching method includes applying recess etching to a surface of a cobalt-containing metal layer by bringing the recess etching solution into contact with the surface of the cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate.

IPC Classes  ?

  • H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
  • C09K 13/00 - Etching, surface-brightening or pickling compositions

43.

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

      
Application Number 18276539
Status Pending
Filing Date 2022-01-26
First Publication Date 2024-02-08
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ogashiwa, Takaaki
  • Miyahira, Tetsuro
  • Takamura, Tatsuro
  • Ito, Sayaka

Abstract

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTi4O9; (B) a filler different from the BaTi4O9 (A); and (C) a thermosetting resin; wherein a median particle size of the BaTi4O9 (A) is 0.10 to 1.00 μm, and a volume ratio of the BaTi4O9 (A) to the filler (B), the BaTi4O9(A):the filler (B), ranges from 15:85 to 80:20.

IPC Classes  ?

  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08K 7/18 - Solid spheres inorganic
  • C08K 3/22 - Oxides; Hydroxides of metals
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08J 5/18 - Manufacture of films or sheets
  • H05K 1/03 - Use of materials for the substrate

44.

METHOD FOR PRODUCING PRINTED WIRING BOARD

      
Application Number JP2023027476
Publication Number 2024/029431
Status In Force
Filing Date 2023-07-27
Publication Date 2024-02-08
Owner
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
  • MGC ELECTROTECHNO CO., LTD. (Japan)
  • YONEZAWA DIA ELECTRONICS CO.,INC. (Japan)
Inventor
  • Kaimori Yoshiyasu
  • Kitamura Shinya
  • Sato Toshinori
  • Muto Tomohiro
  • Nohara Kimiyuki

Abstract

After laminating an insulation layer (14) and an electrolytic copper foil (15) in this order on an inner layer board (13), a resist pattern (17B) is formed on the electrolytic copper foil (15). Next, using the resist pattern (17B) as an etching resist, the electrolytic copper foil (15) is etched using an etching liquid containing sulfuric acid and hydrogen peroxide, and a mask for via hole formation (18) is formed. Subsequently, the resist pattern (17B) is removed, the part of the insulation layer (14) not covered by the mask for via hole formation (18) is removed using a laser, and via holes (14A) are formed.

IPC Classes  ?

45.

RESIN COMPOSITION AND MOLDED ARTICLE

      
Application Number JP2023022541
Publication Number 2024/024329
Status In Force
Filing Date 2023-06-19
Publication Date 2024-02-01
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ishihara Tomita Eri
  • Shimada Nakamura Jin
  • Oda Takafumi

Abstract

The present invention provides a resin composition which contains an acid-modified polyolefin at a ratio of 0.1 part by mass to 50 parts by mass relative to 100 parts by mass of a polyamide resin, wherein: the polyamide resin comprises a diamine unit and a dicarboxylic acid unit; the diamine unit contains 70% by mole or more of a constituent unit that is derived from a xylylenediamine; and the dicarboxylic acid unit contains 70% by mole or more of a constituent unit that is derived from an α, ω-linear aliphatic dicarboxylic acid having 11 to 20 carbon atoms.

IPC Classes  ?

  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
  • C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
  • C08L 23/26 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment

46.

RESIN COMPOSITION AND MOLDED ARTICLE

      
Application Number JP2023022542
Publication Number 2024/024330
Status In Force
Filing Date 2023-06-19
Publication Date 2024-02-01
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ishihara Tomita Eri
  • Shimada Nakamura Jin
  • Oda Takafumi

Abstract

A resin composition that contains reinforcing fibers in a proportion of 10-300 mass parts per 100 mass parts of a xylylenediamine polyamide resin, in which the xylylenediamine polyamide resin contains diamine units and dicarboxylic acid units, the diamine units contain 70 mol% or more of structural units derived from xylylenediamine, the dicarboxylic acid units contain 70 mol% or more of structural units derived from C11-20 α,ω-straight-chain aliphatic dicarboxylic acids, and the relative viscosity of the xylylenediamine polyamide resin is 1.6 to 2.4.

IPC Classes  ?

  • C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
  • C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • C08K 7/02 - Fibres or whiskers

47.

RESIN COMPOSITION, CURED OBJECT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

      
Application Number JP2023026752
Publication Number 2024/024664
Status In Force
Filing Date 2023-07-21
Publication Date 2024-02-01
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kamata Yuji
  • Hasebe Keiichi

Abstract

Provided are: a resin composition comprising a heat-curable compound and a fluororesin filler and attaining low-dielectric properties and excellent moist heat resistance; and a cured object, a prepreg, a metal-foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition comprises a fluororesin filler (A) having an acidic group and/or a basic group, a thermoplastic elastomer (B) having a basic group and/or an acidic group, which is opposite to the acidic group and/or the basic group of the fluororesin filler (A), and a heat-curable compound (C) compatible with the thermoplastic elastomer (B).

IPC Classes  ?

  • C08L 27/12 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • C08J 5/10 - Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
  • C08L 21/00 - Compositions of unspecified rubbers
  • H05K 1/03 - Use of materials for the substrate

48.

RESIN COMPOSITION CONTAINING BIFUNCTIONAL PHENYLENE ETHER RESIN

      
Application Number JP2023027019
Publication Number 2024/024730
Status In Force
Filing Date 2023-07-24
Publication Date 2024-02-01
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Miyamoto Makoto
  • Arai Yuji
  • Iijima Takayuki

Abstract

188 is represented by general formula (3).

IPC Classes  ?

  • C08F 299/00 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers

49.

RESIN OBTAINED FROM CYCLIC DIOL COMPOUND, AND OPTICAL LENS CONTAINING SAME

      
Application Number JP2023026497
Publication Number 2024/024602
Status In Force
Filing Date 2023-07-20
Publication Date 2024-02-01
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato Noriyuki
  • Nishimori Katsushi
  • Motegi Atsushi
  • Ishihara Kentaro
  • Watanabe Takafumi
  • Harada Yutaro

Abstract

The present invention can provide a resin that contains a constitutional unit (A) derived from a monomer represented by general formula (1) and that is a polycarbonate resin or a polyester carbonate resin. [Compound 1] [In the formula, each R1is independently a hydrogen atom, a C1-4 alkyl group, or a phenyl group. X is a direct bond or a divalent group that is represented by formula (Y). [Compound 2] [In the formula, each R2and each R3is independently a hydrogen atom, an alkyl group, or an aryl group, or each R2and each R3 may bind to one another to form a ring together with an adjacent carbon atom, and the ring may be substituted by an alkyl group. n is 0 or 1. * represents a binding position.]]

IPC Classes  ?

  • C08G 64/02 - Aliphatic polycarbonates
  • C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

50.

SEMICONDUCTOR SUBSTRATE CLEANING COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE USING SAME

      
Application Number JP2023027299
Publication Number 2024/024811
Status In Force
Filing Date 2023-07-26
Publication Date 2024-02-01
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Oie Toshiyuki

Abstract

Provided is a semiconductor substrate cleaning composition that has a high Ti/W etching selectivity and can reduce damage to oxide films. The semiconductor substrate cleaning composition contains (A) an oxidizing agent and (B) a metal tungsten corrosion inhibitor. The semiconductor substrate cleaning composition does not contain (C) a fluorine compound, or further contains less than 0.005 mass% of a fluorine compound on the basis of the total mass of the semiconductor substrate cleaning composition, and has a pH of 7 or less.

IPC Classes  ?

  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

51.

METHOD FOR PRODUCING PATTERNED SUBSTRATE

      
Application Number 18038770
Status Pending
Filing Date 2021-11-10
First Publication Date 2024-01-25
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Miyahara, Daichi
  • Sato, Yumi
  • Umeki, Miho

Abstract

A method for producing a patterned substrate, including: step (a) of forming a film composed of a photosensitive polyimide resin composition on a substrate; step (b) of exposing the film; and step (c) of developing the exposed film using a developer to form a pattern formed of the film on the substrate, wherein a relative energy difference (RED) between the developer and the film before exposure is 0.50 or greater and 1.4 or less.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/40 - Treatment after imagewise removal, e.g. baking
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

52.

PRESSURE VESSEL AND METHOD FOR PRODUCING PRESSURE VESSEL

      
Application Number 18266100
Status Pending
Filing Date 2021-10-06
First Publication Date 2024-01-25
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Matsumoto, Nobuhiko
  • Ikeuchi, Kousuke
  • Mitadera, Jun

Abstract

Provided are a pressure vessel with excellent gas barrier properties, less likely to cause cracks, and excellent internal pressure fatigue properties, and a production method thereof. The pressure vessel includes a layer at least in the body part, and the layer includes a fiber-reinforced resin material that contains a resin component and a continuous reinforcing fiber. A ratio (inner region/outer region) of the continuous reinforcing fiber content (vol. %) in the inner region to a continuous reinforcing fiver content (vol. %) in the outer region is from 0.80 to 0.99, where the inner region is up to 0.1% from the inner side of the layer in the thickness direction, and the outer region is up to 0.1% from the outer side of the layer in the thickness direction, and the continuous reinforcing fiber content (vol. %) in the central region of the layer, which is between up to more than 0.1% from the inner side in the thickness direction and up to more than 0.1% from the outer side in the thickness direction, is from 40 to 60 vol. %.

IPC Classes  ?

  • F17C 1/06 - Protecting sheatings built-up from wound-on bands or filamentary material, e.g. wires
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

53.

POLARIZING SHEET

      
Application Number JP2023025922
Publication Number 2024/018992
Status In Force
Filing Date 2023-07-13
Publication Date 2024-01-25
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okazaki Kota
  • Matsuno Yuya
  • Akaki Masayuki
  • Kimura Hideaki

Abstract

[Problem] To provide a polarizing laminate having a reduced optical distortion when measured with MIL-DTL-43511D. [Solution] Provided is a polarizing laminate which comprises a polarizing film comprising a uniaxially stretched polyvinyl alcohol-based resin film and transparent protective layers respectively arranged on both surfaces of the polarizing film each through an adhesive layer, in which the difference between a maximum value and a minimum value of the width of a gap between two slits adjacent to the polarizing laminate (i.e., a slit interval) in an optical distortion measured with MIL-DTL-43511D is 1.05 mm or less.

IPC Classes  ?

  • G02B 5/30 - Polarising elements
  • G02C 7/10 - Filters, e.g. for facilitating adaptation of the eyes to the dark; Sunglasses
  • G02C 7/12 - Polarisers

54.

THERMOPLASTIC RESIN AND OPTICAL MEMBER

      
Application Number JP2023026186
Publication Number 2024/019028
Status In Force
Filing Date 2023-07-18
Publication Date 2024-01-25
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato Noriyuki
  • Nishimori Katsushi
  • Motegi Atsushi
  • Ishihara Kentaro
  • Murata Suzuki Shoko
  • Harada Yutaro

Abstract

According to one embodiment of the present invention, provided is a thermoplastic resin comprising a structural unit (A) derived from a monomer represented by general formula (1) and a structural unit (C) derived from a monomer represented by general formula (3).

IPC Classes  ?

  • C08G 64/00 - Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
  • C08G 63/00 - Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
  • C08G 63/672 - Dicarboxylic acids and dihydroxy compounds
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

55.

HARD COAT FILM AND RESIN MOLDED ARTICLE USING SAME

      
Application Number JP2023025387
Publication Number 2024/018938
Status In Force
Filing Date 2023-07-10
Publication Date 2024-01-25
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato Ryota
  • Wakayama Shota
  • Nakamura Hitomi
  • Sato Yoshimasa

Abstract

According to the present invention, it is possible to provide a hard coat film comprising: a base material layer which contains a thermoplastic resin; and a hard coat layer which is a cured coating film layer and is provided on at least one surface of the base material layer, wherein the hard coat layer contains a fluorine-containing leveling agent, the surface roughness of the surface of the hard coat layer is at most 10 nm, and the atomic concentration F(80º) of fluorine at an angle of 80º is at most 10 atomic% and the atomic concentration F(30º) of fluorine at an angle of 30º is at most 10 atomic%, as measured by angle resolved XPS.

IPC Classes  ?

  • G02B 1/14 - Protective coatings, e.g. hard coatings
  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • G02B 1/111 - Anti-reflection coatings using layers comprising organic materials

56.

EIJIRESU

      
Application Number 231694100
Status Pending
Filing Date 2024-01-22
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

(1) Chemicals used in industry; chemical substances for use to preserve foodstuffs, pharmaceuticals and medical instruments to prevent material from deteriorating by oxidation; oxygen absorbing agents; oxygen detecting agents.

57.

Miscellaneous Design

      
Serial Number 79391995
Status Pending
Filing Date 2024-01-22
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Chemicals used in industry, namely, oxygen absorbing chemicals for use to preserve foodstuffs, pharmaceuticals and medical instruments to prevent material from deteriorating by oxidation, oxygen absorbing chemicals, oxygen detecting chemicals

58.

RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME

      
Application Number JP2023024543
Publication Number 2024/014329
Status In Force
Filing Date 2023-07-03
Publication Date 2024-01-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okada Takumi
  • Hoshino Ryosuke
  • Sato Hideyuki
  • Katagiri Masayuki
  • Suzuki Shu
  • Echigo Masatoshi

Abstract

The present invention provides a resist composition which contains a resin (A) and a solvent (B) containing a compound (B1) represented by general formula (b-1), and which contains an active ingredient in an amount of 45 mass% or less with respect to the total amount of the resist composition. (In the above formula (b-1), R0is a C1–C10 alkyl group, a C6–C10 aryl group, or a C1–C10 acyl group, and R1 is a hydrogen atom or a C1–C10 alkyl group.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

59.

OXYGEN ABSORBING RESIN COMPOSITION, OXYGEN ABSORBING FILM, OXYGEN ABSORBING MULTI-LAYER FILM, AND COVER MATERIAL

      
Application Number 18038751
Status Pending
Filing Date 2021-11-15
First Publication Date 2024-01-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Watanabe, Keisuke
  • Itou, Yoshiki

Abstract

An oxygen absorbing resin composition containing a polyolefin, an iron powder, titanium oxide, and calcium oxide, a content of the iron powder being from 10 to 50 mass % in the oxygen absorbing resin composition, a mass ratio of the titanium oxide to the iron powder [titanium oxide/iron powder] being from 0.1 to 0.5, and a mass ratio of the calcium oxide to the iron powder [calcium oxide/iron powder] being from 0.1 to 0.5.

IPC Classes  ?

  • C08J 5/18 - Manufacture of films or sheets
  • C08K 3/22 - Oxides; Hydroxides of metals
  • C08K 3/08 - Metals
  • B65D 65/40 - Applications of laminates for particular packaging purposes
  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • B32B 15/085 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyolefins
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind

60.

THERMOPLASTIC RESIN COMPOSITION, MOLDED PRODUCT, METAL FOIL LAMINATED BOARD, BONDING SHEET, FILAMENT, AND MATERIAL FOR THREE-DIMENSIONAL FABRICATION

      
Application Number JP2023018691
Publication Number 2024/014123
Status In Force
Filing Date 2023-05-19
Publication Date 2024-01-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sakai Atsushi
  • Fujii Ryosuke
  • Sato Yuuki
  • Kaneko Naoki

Abstract

ABAB12122 are each independently a C6-C22 tetravalent group which comprises at least one aromatic ring.)

IPC Classes  ?

  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C09J 7/35 - Heat-activated
  • C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
  • C09J 179/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

61.

RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME

      
Application Number JP2023024544
Publication Number 2024/014330
Status In Force
Filing Date 2023-07-03
Publication Date 2024-01-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okada Takumi
  • Hoshino Ryosuke
  • Sato Hideyuki
  • Katagiri Masayuki
  • Suzuki Shu
  • Echigo Masatoshi

Abstract

According to the present invention, it is possible to provide a resist auxiliary film composition containing a resin (A) and a solvent (B), the solvent (B) including a compound (B1) represented by general formula (b-1) below, wherein the content of an active ingredient is 45% by mass or less based on the total amount of the resist auxiliary film composition. (In formula (b-1) above, R0is an alkyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, or an acyl group having 1-10 carbon atoms; and R1 is a hydrogen atom or an alkyl group having 1-10 carbon atoms.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08L 57/00 - Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C08L 61/08 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with monohydric phenols
  • C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • G03F 7/004 - Photosensitive materials
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

62.

THINNER COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THINNER COMPOSITION

      
Application Number JP2023024545
Publication Number 2024/014331
Status In Force
Filing Date 2023-07-03
Publication Date 2024-01-18
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Okada Takumi
  • Hoshino Ryosuke
  • Sato Hideyuki
  • Katagiri Masayuki
  • Suzuki Shu
  • Echigo Masatoshi

Abstract

The present invention provides a thinner composition containing a solvent (B) that includes a compound (B1) represented by general formula (b-1) below. (In formula (b-1) above, R0is an alkyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, or an acyl group having 1-10 carbon atoms, and R1 is a hydrogen atom or an alkyl group having 1-10 carbon atoms.)

IPC Classes  ?

  • G03F 7/42 - Stripping or agents therefor
  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

63.

SEMICONDUCTOR SUBSTRATE CLEANING COMPOSITION, METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATES, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATES

      
Application Number JP2023023715
Publication Number 2024/004980
Status In Force
Filing Date 2023-06-27
Publication Date 2024-01-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kawai Ryuichiro
  • Horie Hiroaki
  • Shigeta Mari
  • Shimada Kenji

Abstract

nn] (n-k)-mk-2mxx (M is boron, silicon, zirconium, antimony, niobium, aluminum, phosphorus, or titanium; k is the oxidation number for M; m is an integer from 0 to k/2; x is a positive integer; R is a hydrogen atom, alkali metal, or alkyl group; and n is the coordination number of fluoride ions to M.); component (C) : an oxidizing agent; and component (D) : water, wherein the α given by formula (I) is 0.2 to 1.1. ([F] is the molar concentration of fluoride ion in the composition, [M] is the molar concentration of M in the composition, and n(M) is the coordination number of fluoride ions to M.)

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

64.

POLYPHENOL COMPOUND, FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN

      
Application Number JP2023024419
Publication Number 2024/005194
Status In Force
Filing Date 2023-06-30
Publication Date 2024-01-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Iwasaki, Atsuko
  • Omatsu, Tadashi
  • Echigo, Masatoshi

Abstract

A film-forming composition for lithography which contains a polyphenol compound represented by formula (1). (In formula (1), A, Ar1, Ar2, X, P1, P2, j, k, l1, and l2 are as defined in the specification.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C07C 39/15 - Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings
  • C07C 69/21 - Acetic acid esters of hydroxy compounds with more than three hydroxy groups
  • G03F 7/26 - Processing photosensitive materials; Apparatus therefor

65.

METHANOL PRODUCTION METHOD AND METHANOL PRODUCTION DEVICE

      
Application Number JP2023019530
Publication Number 2024/004464
Status In Force
Filing Date 2023-05-25
Publication Date 2024-01-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Higashide, Hirofumi
  • Kakimi, Atsushi
  • Akiyoshi, Shuusuke
  • Abe, Takanori

Abstract

According to the present invention, a method for producing methanol using carbon dioxide and hydrogen as starting materials includes a step (A) for combining the carbon dioxide and the hydrogen to obtain a makeup gas, a step (B) for combining the makeup gas, after the pressure thereof has been raised, with a recycled gas recovered from an outlet gas from a synthesis reactor to obtain a synthesis reactor supply gas, a step (C) for preheating the synthesis reactor supply gas by means of a heat exchange in which the outlet gas from the synthesis reactor serves as a heat source, and a step (D) for supplying the preheated synthesis reactor supply gas to a synthesis reactor and bringing the preheated synthesis reactor supply gas into contact with a catalyst to synthesize methanol.

IPC Classes  ?

  • C07C 29/152 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the reactor used
  • C07C 31/04 - Methanol
  • C07B 61/00 - Other general methods

66.

THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, AND CONSTITUTING MEMBER OF IC SOCKET FOR INSPECTION

      
Application Number JP2023021667
Publication Number 2024/004602
Status In Force
Filing Date 2023-06-12
Publication Date 2024-01-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Sato Yuuki

Abstract

This thermoplastic resin composition contains component (A), which is at least one thermoplastic resin selected from the group consisting of (a1) a crystalline thermoplastic resin having a melting point of 270°C or more and (a2) an amorphous thermoplastic resin having a glass transition temperature of 200°C or more, and component (B), which is an inorganic filler including (b1) zirconium oxide, wherein the content of the component (b1) based on 100 parts by mass of the component (A) is 2-40 parts by mass, and the content of the component (B) based on 100 parts by mass of the component (A) is 2-60 parts by mass.

IPC Classes  ?

  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08K 3/013 - Fillers, pigments or reinforcing additives
  • C08K 3/22 - Oxides; Hydroxides of metals

67.

COMPOSITION, RESIN COMPOSITION, FILM FORMATION COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2023023917
Publication Number 2024/005049
Status In Force
Filing Date 2023-06-28
Publication Date 2024-01-04
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Omatsu, Tadashi
  • Kataoka, Kentaro
  • Matsumoto, Masahiro
  • Niimi, Yushi
  • Koguma, Takeru
  • Horiuchi, Junya
  • Yamamoto, Hiroaki
  • Iinuma, Masataka
  • Matsuura, Kodai
  • Sato, Takashi
  • Okada, Yu
  • Makinoshima, Takashi
  • Echigo, Masatoshi

Abstract

This composition comprises a compound (A) represented by formula (1) below and a compound (B) represented by formula (2) below. (The definitions of the elements in formula (1) are indicated in the description.) (In formula (2), the elements X, L1, Y, Ra, Rb, Rc, A, Z, p, m, n, and r are the same as those in formula (1), and k represents an integer from 0 to 2.)

IPC Classes  ?

  • C08F 12/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
  • C08F 246/00 - Copolymers in which the nature of only the monomers in minority is defined
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

68.

Compound and method for producing same

      
Application Number 18252821
Grant Number 11919833
Status In Force
Filing Date 2022-04-12
First Publication Date 2023-12-28
Grant Date 2024-03-05
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Yokoo Yamazoe, Aoi
  • Kanbara, Yutaka

Abstract

Provided is a method for producing a methyl-adduct compound, the method including methylating, in the presence of potassium carbonate and dimethyl carbonate, a dinitrile compound represented by Formula (1) below to obtain a methyl-adduct compound represented by Formula (2) below: 4 are each methyl.

IPC Classes  ?

  • C07C 211/27 - Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an unsaturated carbon skeleton containing at least one six-membered aromatic ring having amino groups linked to the six-membered aromatic ring by saturated carbon chains
  • C07C 209/48 - Preparation of compounds containing amino groups bound to a carbon skeleton by reduction of carboxylic acids or esters thereof in presence of ammonia or amines, or by reduction of nitriles, carboxylic acid amides, imines or imino-ethers by reduction of nitriles
  • C07C 253/30 - Preparation of carboxylic acid nitriles by reactions not involving the formation of cyano groups
  • C07C 255/33 - Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms having cyano groups bound to acyclic carbon atoms of a carbon skeleton containing at least one six-membered aromatic ring with cyano groups linked to the six-membered aromatic ring, or to the condensed ring system containing that ring, by saturated carbon chains

69.

RESIN COMPOSITION, COATING FILM USING SAME, AND ELECTROLYTE

      
Application Number 18276534
Status Pending
Filing Date 2022-02-18
First Publication Date 2023-12-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ogawa, Noriyoshi
  • Goto, Toshihito

Abstract

According to the present invention, there can be provided a resin composition, comprising: a polycarbonate resin comprising a constituent unit represented by the following general formula (1): According to the present invention, there can be provided a resin composition, comprising: a polycarbonate resin comprising a constituent unit represented by the following general formula (1): According to the present invention, there can be provided a resin composition, comprising: a polycarbonate resin comprising a constituent unit represented by the following general formula (1): wherein R1 to R4 and R11 to R14 each independently hydrogen, fluorine, chlorine, bromine or iodine, etc., a represents an integer of 1 to 1,000, and X represents —S—, etc.; and a carbonate-based organic solvent, wherein the content of the polycarbonate resin in the resin composition is 0.05% to 50% by mass; the content of the carbonate-based organic solvent in the resin composition is 50% to 99.5% by mass, and the total percentage of constituent units represented by the following formulae (2) to (4) in all of the constituent units represented by the general formula (1) is 0% to 75% at a molar percentage: According to the present invention, there can be provided a resin composition, comprising: a polycarbonate resin comprising a constituent unit represented by the following general formula (1): wherein R1 to R4 and R11 to R14 each independently hydrogen, fluorine, chlorine, bromine or iodine, etc., a represents an integer of 1 to 1,000, and X represents —S—, etc.; and a carbonate-based organic solvent, wherein the content of the polycarbonate resin in the resin composition is 0.05% to 50% by mass; the content of the carbonate-based organic solvent in the resin composition is 50% to 99.5% by mass, and the total percentage of constituent units represented by the following formulae (2) to (4) in all of the constituent units represented by the general formula (1) is 0% to 75% at a molar percentage:

IPC Classes  ?

  • C08G 64/06 - Aromatic polycarbonates not containing aliphatic unsaturation
  • C09D 169/00 - Coating compositions based on polycarbonates; Coating compositions based on derivatives of polycarbonates
  • C09D 7/20 - Diluents or solvents
  • H01M 10/0565 - Polymeric materials, e.g. gel-type or solid-type

70.

COMPOUND, COMPOSITION, CURED PRODUCT, AND COMPOUND MANUFACTURING METHOD

      
Application Number JP2023019051
Publication Number 2023/248675
Status In Force
Filing Date 2023-05-23
Publication Date 2023-12-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Fujii Shiki
  • Ohno Daisuke
  • Kitamura Mitsuharu

Abstract

22 or *-C=CH-, and * is bonded to the side close to the oxygen atom contained in the ring.

IPC Classes  ?

  • C07D 405/14 - Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
  • C08F 26/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containin
  • C08L 39/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocycli; Compositions of derivatives of such polymers
  • C07D 307/14 - Radicals substituted by nitrogen atoms not forming part of a nitro radical

71.

METHOD FOR PRODUCING POLYIMIDE VARNISH

      
Application Number JP2023022818
Publication Number 2023/249022
Status In Force
Filing Date 2023-06-20
Publication Date 2023-12-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Suenaga Shuya
  • Matsumaru Teruhisa
  • Sugito Ken

Abstract

The present invention provides a method for producing a polyimide varnish, the method comprising: a polycondensation step in which one or more tetracarboxylic acid dianhydrides and one or more diamine compounds are subjected to a polycondensation reaction, thereby obtaining a reaction product (x); a step in which an organic solvent is subjected to inert gas bubbling, thereby obtaining a solvent (y) for dilution; and a dilution step in which the reaction product (x) and the solvent (y) for dilution are mixed with each other, thereby obtaining a polyimide solution that has a dissolved oxygen concentration of 0.23 mg/L or less. Consequently, the present invention enables the achievement of a varnish which contains a solvent-soluble polyimide, while being free from coloring and exhibiting excellent colorlessness.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

72.

EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, PAINT, AND ADHESIVE

      
Application Number 18030844
Status Pending
Filing Date 2021-09-10
First Publication Date 2023-12-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Hanaoka, Takuma
  • Kouno, Kazuki
  • Ohno, Yuma

Abstract

Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains metaxylylenediamine and paraxylylenediamine at a mass ratio of 99/1 to 51/49, an epoxy resin composition, and a paint and an adhesive containing these.

IPC Classes  ?

73.

EPOXY RESIN COMPOSITION, GAS BARRIER LAMINATE, AND PACKAGING MATERIAL

      
Application Number 18036944
Status Pending
Filing Date 2021-10-06
First Publication Date 2023-12-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kobayashi, Naoko
  • Kouno, Kazuki
  • Hashimoto, Ryoma

Abstract

An epoxy resin composition containing an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and a polyalkylene glycol, as well as a gas barrier laminate and a packaging material in which the epoxy resin composition is used.

IPC Classes  ?

  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
  • C08K 5/544 - Silicon-containing compounds containing nitrogen
  • C08K 5/17 - Amines; Quaternary ammonium compounds
  • C08K 5/20 - Carboxylic acid amides

74.

METHOD FOR PRODUCING POLYIMIDE

      
Application Number JP2023022817
Publication Number 2023/249021
Status In Force
Filing Date 2023-06-20
Publication Date 2023-12-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Matsumaru Teruhisa
  • Suenaga Shuya
  • Sugito Ken

Abstract

The present invention provides a method for producing a polyimide, the method comprising: a step 1 in which a diamine solution is obtained by dissolving a diamine in an organic solvent, and a tetracarboxylic acid dianhydride is added to and mixed with the diamine solution so as to obtain a homogeneous solution; and a step 2 in which the tetracarboxylic acid dianhydride and the diamine are polycondensed with each other. With respect to this method for producing a polyimide, in the step 1, it is regulated such that the diamine solution does not exceed 100°C from the time when the addition of the tetracarboxylic acid dianhydride is started to the time when the solution becomes homogeneous. Consequently, the present invention enables the achievement of: a varnish which has a viscosity sufficient for coating; and a polyimide which has excellent colorlessness.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

75.

METHOD FOR PRODUCING POLYIMIDE VARNISH

      
Application Number JP2023022819
Publication Number 2023/249023
Status In Force
Filing Date 2023-06-20
Publication Date 2023-12-28
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Suenaga Shuya
  • Matsumaru Teruhisa
  • Sugito Ken

Abstract

The method for producing a polyimide varnish polycondenses one or more tetracarboxylic dianhydrides and one or more diamines in an organic solvent at a reaction temperature of 160-220°C to obtain a reaction solution and lowers the temperature of the reaction solution from the reaction temperature to 120°C at a rate of 4°C/min or more by introducing a diluting solvent to stop the reaction. A method for producing a polyimide varnish that contains a solvent-soluble polyimide, has no coloration, and can obtain a varnish having excellent colorlessness can be provided according to the present invention.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

76.

PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE

      
Application Number 18038245
Status Pending
Filing Date 2021-11-10
First Publication Date 2023-12-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Umeki, Miho
  • Sato, Yumi
  • Miyahara, Daichi

Abstract

A photosensitive polyimide resin composition containing: a ring-closed polyimide resin (A) having a structure represented by Formula (1); and a polyfunctional radically polymerizable compound (B) having radically polymerizable functional groups and oxyalkylene groups, wherein a number of the radically polymerizable functional groups in the polyfunctional radically polymerizable compound (B) is 3 or greater and 100 or less, and wherein a total number of moles of the oxyalkylene groups added in the polyfunctional radically polymerizable compound (B) is 5 or greater and 100 or less.

IPC Classes  ?

  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

77.

ALDEHYDE COMPOSITION

      
Application Number JP2023021085
Publication Number 2023/243499
Status In Force
Filing Date 2023-06-07
Publication Date 2023-12-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Hayashi Masaki
  • Matsuda Daiki
  • Nishiuchi Junya

Abstract

An aldehyde composition that contains an aldehyde represented by formula (1) and an aldehyde represented by formula (2), the mass ratio [(1)/(2)] of the aldehyde represented by formula (1) and the aldehyde represented by formula (2) being 97.00/3.00-99.999/0.001. An aldehyde composition that is useful as a fragrance due to having an exceptional balance of green, aldehyde, and floral scents. Additionally, a fragrance composition having exceptional diffusibility due to containing this aldehyde composition is obtained.

IPC Classes  ?

  • C11B 9/00 - Essential oils; Perfumes
  • C07B 61/00 - Other general methods
  • C07C 45/62 - Preparation of compounds having C=O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by reactions not involving the formation of C=O groups by hydrogenation of carbon-to-carbon double or triple bonds
  • C07C 47/228 - Unsaturated compounds having —CHO groups bound to acyclic carbon atoms containing six-membered aromatic rings, e.g. phenylacetaldehyde

78.

POLYACETAL RESIN COMPOSITION

      
Application Number JP2023022073
Publication Number 2023/243658
Status In Force
Filing Date 2023-06-14
Publication Date 2023-12-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Michiba Kiyonori
  • Sunaga Daisuke

Abstract

The present invention provides: a polyacetal resin composition; a metal resin composition; and a method for producing a polyacetal resin composition. The present invention provides a polyacetal resin composition which contains 100 parts by weight of a polyacetal resin (A) and 0.1 to 0.9 part by weight of a fatty acid metal salt (B) having a weight loss rate of 20% by weight of more, the weight loss rate being the ratio of weight loss after the fatty acid metal salt is heated from room temperature to 200°C at a rate of 200°C/minute in the air at atmospheric pressure and is subsequently held at 200°C for 60 minutes.

IPC Classes  ?

  • C08L 59/00 - Compositions of polyacetals; Compositions of derivatives of polyacetals
  • C08G 2/24 - Copolymerisation of aldehydes or ketones with acetals
  • C08K 5/09 - Carboxylic acids; Metal salts thereof; Anhydrides thereof

79.

METHOD FOR PRODUCING FLUORENONE

      
Application Number 18251771
Status Pending
Filing Date 2021-11-04
First Publication Date 2023-12-21
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Watanabe, Yuki
  • Sumi, Hiroki
  • Fujita, Hideaki
  • Nakamura, Goh
  • Kumano, Tatsuyuki

Abstract

A method for producing fluorenone including a pretreatment step of heating fluorene in the presence of a lower aliphatic carboxylic acid, a bromine compound, and a metal catalyst, and an oxidation step of continuously supplying fluorene and oxygen to perform an oxidation reaction, in the order indicated.

IPC Classes  ?

  • C07C 45/36 - Preparation of compounds having C=O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by oxidation with molecular oxygen of CHx-moieties in unsaturated compounds in compounds containing six-membered aromatic rings
  • B01J 31/04 - Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing carboxylic acids or their salts
  • B01J 35/12 - Liquids or melts

80.

THERMOPLASTIC RESIN AND OPTICAL LENS INCLUDING SAME

      
Application Number 18033163
Status Pending
Filing Date 2021-10-25
First Publication Date 2023-12-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kato, Noriyuki
  • Ikeda, Shinya
  • Motegi, Atsushi
  • Ogata, Tatsunobu
  • Harada, Yutaro
  • Nishimori, Katsushi
  • Ishihara, Kentaro

Abstract

A thermoplastic resin including a constituent unit (A) derived from a monomer represented by general formula (1). In general formula (1), R1 and R11 each independently represent a hydrogen atom, an aryl group having 6-12 carbon atoms, or a linear or branched alkyl group having 1-4 carbon atoms, and X represents one of general formulas (a) to (d). In general formulas (a) to (d), R21 to R57 each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, a linear or branched alkyl group having 1-4 carbon atoms, or a linear or branched alkoxy group having 1-7 carbon atoms.

IPC Classes  ?

  • C08L 69/00 - Compositions of polycarbonates; Compositions of derivatives of polycarbonates
  • C08G 64/16 - Aliphatic-aromatic or araliphatic polycarbonates
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

81.

FILAMENT, MATERIAL, AND METHOD FOR PRODUCING THE MATERIAL

      
Application Number 18030472
Status Pending
Filing Date 2021-09-01
First Publication Date 2023-12-14
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Yamanaka, Masaki
  • Matsumoto, Nobuhiko

Abstract

Provided are a filament that does not impair the strength that is intrinsic to the filament and contains a disperse dye, and has excellent color fastness, a material using the filament, and a method for producing the material. The filament containing a polyamide resin having an aromatic ring and/or a hetero ring, and a disperse dye having an aromatic ring and/or a hetero ring.

IPC Classes  ?

  • D01F 6/60 - Monocomponent man-made filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products from polyamides
  • D06P 1/18 - Azo dyes
  • D06P 1/20 - Anthraquinone dyes
  • D06P 3/26 - Polyamides; Polyurethanes using dispersed dyestuffs
  • D01F 8/12 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the like; Manufacture thereof from synthetic polymers with at least one polyamide as constituent

82.

ALDEHYDE COMPOSITION

      
Application Number 18250238
Status Pending
Filing Date 2021-11-02
First Publication Date 2023-12-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Utamura, Tatsuya
  • Nishiuchi, Junya

Abstract

An aldehyde composition containing an aldehyde represented by Formula (1) and an aldehyde represented by Formula (2) is provided. A mass ratio [(1)/(2)] of the aldehyde represented by Formula (1) to the aldehyde represented by Formula (2) is from 96/4 to 99.97/0.03. An aldehyde composition containing an aldehyde represented by Formula (1) and an aldehyde represented by Formula (2) is provided. A mass ratio [(1)/(2)] of the aldehyde represented by Formula (1) to the aldehyde represented by Formula (2) is from 96/4 to 99.97/0.03.

IPC Classes  ?

  • C07C 47/228 - Unsaturated compounds having —CHO groups bound to acyclic carbon atoms containing six-membered aromatic rings, e.g. phenylacetaldehyde
  • C11B 9/00 - Essential oils; Perfumes

83.

BIOABSORBABLE FIBROUS MEDICAL MATERIAL

      
Application Number 18250383
Status Pending
Filing Date 2021-10-25
First Publication Date 2023-12-14
Owner
  • MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
  • National University Corporation Tokai National Higher Education and Research System (Japan)
Inventor
  • Maehara, Akira
  • Hirata, Hitoshi
  • Murayama, Atsuhiko
  • Nakagawa, Yasunobu

Abstract

An object of the present invention is to provide a bioabsorbable and stretchable fibrous medical material that enables formation of ligation which provides a small and hard-to-unravel knot even with a weak force. The present invention provides a fibrous medical material which is a fibrous material composed of a molded article provided by spinning and drawing a bioabsorbable aliphatic polymer, wherein an elongation at break is 75% or greater, an intermediate elastic modulus in tension at a strain ranging from 0.25% and 10% is lower than an initial elastic modulus in tension at a strain ranging from 0.05% to 0.25%, the intermediate elastic modulus in tension is 400 MPa or less, and a residual strain rate after 100% deformation is 70% or less.

IPC Classes  ?

  • A61L 17/10 - At least partly resorbable materials containing macromolecular materials

84.

EPOXY RESIN COMPOSITION

      
Application Number JP2023018273
Publication Number 2023/238615
Status In Force
Filing Date 2023-05-16
Publication Date 2023-12-14
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Wakahara Daiki
  • Ohnishi Nobuyoshi
  • Ikeuchi Kousuke
  • Okada Kana
  • Matsumoto Nobuhiko
  • Innan Susumu

Abstract

The present invention provides an epoxy resin composition which contains an epoxy resin (A) and an epoxy resin curing agent (B), wherein: the epoxy resin (A) contains an epoxy resin (A1) that has a glycidyl group derived from resorcinol, and an epoxy resin (A2) that has a glycidyl group derived from bisphenol F, or the like; the epoxy resin curing agent (B) contains resorcinol (B1) or the like; and the content of the epoxy resin curing agent (B) is 7% by mass to 60% by mass.

IPC Classes  ?

  • C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
  • C08G 59/62 - Alcohols or phenols
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C08K 7/02 - Fibres or whiskers
  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
  • C08L 101/00 - Compositions of unspecified macromolecular compounds
  • F17C 1/06 - Protecting sheatings built-up from wound-on bands or filamentary material, e.g. wires

85.

ALICYCLIC ALCOHOL, ALICYCLIC ALCOHOL COMPOSITION, AND PERFUME COMPOSITION

      
Application Number 18248899
Status Pending
Filing Date 2021-10-19
First Publication Date 2023-12-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Tomaki, Keisuke
  • Shirai, Shinyou

Abstract

An alicyclic alcohol of Formula (1) and a fragrance composition including the same is described. An alicyclic alcohol composition containing an alicyclic alcohol of Formula (1) and an alicyclic alcohol of Formula (2), is also described, and this composition may also include an alicyclic alcohol of Formula (3). The alicyclic alcohol composition may comprise Formula (1) at a content of 85 mass % to 98 mass %. An alicyclic alcohol of Formula (1) and a fragrance composition including the same is described. An alicyclic alcohol composition containing an alicyclic alcohol of Formula (1) and an alicyclic alcohol of Formula (2), is also described, and this composition may also include an alicyclic alcohol of Formula (3). The alicyclic alcohol composition may comprise Formula (1) at a content of 85 mass % to 98 mass %.

IPC Classes  ?

  • C07C 31/135 - Monohydroxylic alcohols containing saturated rings monocyclic with five- or six-membered rings; Naphthenic alcohols
  • C11B 9/00 - Essential oils; Perfumes

86.

COMPOSITION, AND METHOD FOR PRODUCING TRIOXANE USING SAME

      
Application Number JP2023020399
Publication Number 2023/234382
Status In Force
Filing Date 2023-06-01
Publication Date 2023-12-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor Okada Takuya

Abstract

Provided is a means with which trioxane can be continuously produced at a high yield. Provided is a composition that contains (A) 58.5-65.5 mass% of formaldehyde, (B) 0.7-4.5 mass% of methanesulfonic acid, and (C) less than 0.007 mass% of a metal salt. The total content of the formaldehyde (A) and the methanesulfonic acid (B) is less than 68 mass%. The metal salt (C) includes at least one type selected from the group consisting of a nitrate, a nitrite and a persulfate.

IPC Classes  ?

  • C07C 47/04 - Formaldehyde
  • C07C 309/04 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing only one sulfo group
  • C07D 323/06 - Trioxane

87.

SUZURANOL

      
Application Number 1765150
Status Registered
Filing Date 2023-10-27
Registration Date 2023-10-27
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
NICE Classes  ? 03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations

Goods & Services

Perfumery; synthetic perfumery; natural perfumery; perfumes for industrial purpose.

88.

TRIARYLMETHANE COMPOUNDS

      
Application Number 18231676
Status Pending
Filing Date 2023-08-08
First Publication Date 2023-12-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Reuter, Karl
  • Andrushko, Vasyl
  • Kantor, Mark
  • Stolz, Florian
  • Shiratake, Munenori
  • Ishihara, Kentaro
  • Hirose, Koji
  • Ikeda, Shinya
  • Kato, Noriyuki
  • Kondo, Mitsuteru
  • Murata, Shoko
  • Oshima, Kensuke

Abstract

The present invention relates to triarylmethane compounds of the formula (I), which suitable as monomers for preparing thermoplastic resins having beneficial optical properties and which can be used for producing optical devices. R1 , R2 are e.g. hydrogen; Y is an alkylene group having 2, 3 or 4 carbon atoms, Ar is selected from mono- or polycyclic aryl and mono- or polycyclic hetaryl; X1, X2, X3, X4 are CH, C—Rx or N, provided that in each ring at most two of X1, X2, X3, X4 are N; Rx is e.g. halogen, CN or CH═CH2. The invention also relates to thermoplastic resins comprising a polymerized unit of the compound of formula (I). The present invention relates to triarylmethane compounds of the formula (I), which suitable as monomers for preparing thermoplastic resins having beneficial optical properties and which can be used for producing optical devices. R1 , R2 are e.g. hydrogen; Y is an alkylene group having 2, 3 or 4 carbon atoms, Ar is selected from mono- or polycyclic aryl and mono- or polycyclic hetaryl; X1, X2, X3, X4 are CH, C—Rx or N, provided that in each ring at most two of X1, X2, X3, X4 are N; Rx is e.g. halogen, CN or CH═CH2. The invention also relates to thermoplastic resins comprising a polymerized unit of the compound of formula (I).

IPC Classes  ?

  • C07C 43/23 - Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing hydroxy or O-metal groups
  • C08G 64/06 - Aromatic polycarbonates not containing aliphatic unsaturation
  • C08G 64/30 - General preparatory processes using carbonates
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
  • C08G 63/193 - Hydroxy compounds containing aromatic rings containing two or more aromatic rings

89.

METHOD FOR PRODUCING FLUORENONE

      
Application Number 18249179
Status Pending
Filing Date 2021-10-21
First Publication Date 2023-12-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sumi, Hiroki
  • Watanabe, Yuki
  • Fujita, Hideaki
  • Nakamura, Goh
  • Kumano, Tatsuyuki

Abstract

Provided is a method for producing fluorenone comprising an oxidation step of oxidizing fluorene in the presence of an aliphatic carboxylic acid having 2 to 3 carbon atoms, a metal catalyst, a bromine compound, and oxygen, a solvent removal step of removing the aliphatic carboxylic acid, a heating step at 120 to 350° C., and a distillation step in the order indicated.

IPC Classes  ?

  • C07C 49/675 - Unsaturated compounds containing a keto group being part of a ring containing six-membered aromatic rings a keto group being part of a condensed ring system having three rings

90.

RESIN COMPOSITION

      
Application Number JP2023018075
Publication Number 2023/233984
Status In Force
Filing Date 2023-05-15
Publication Date 2023-12-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ogawa, Shun
  • Yoshimura, Yasuaki
  • Hasegawa, Hiroki
  • Arakawa, Shota
  • Sakuma, Yoshiko

Abstract

The present invention addresses the problem of providing a resin composition or the like that exhibits favorable oxygen barrier performance and a favorable color tone after oxygen absorption, and that is excellent in strength and shape retention as well as moldability. The problem can be solved by a resin composition containing a transition metal catalyst and a polyester compound having a prescribed structure.

IPC Classes  ?

  • C08L 67/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
  • A61J 1/05 - Containers specially adapted for medical or pharmaceutical purposes for collecting, storing or administering blood, plasma or medical fluids
  • A61M 5/28 - Syringe ampoules or cartridges, i.e. ampoules or cartridges provided with a needle
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B65D 1/02 - Bottles or similar containers with necks or like restricted apertures, designed for pouring contents
  • B65D 65/40 - Applications of laminates for particular packaging purposes
  • B65D 77/00 - Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
  • B65D 81/24 - Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
  • B65D 81/26 - Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
  • C08G 63/181 - Acids containing aromatic rings
  • C08G 63/189 - Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
  • C08G 63/199 - Acids or hydroxy compounds containing cycloaliphatic rings
  • C08G 63/88 - Post-polymerisation treatment
  • C08K 5/098 - Metal salts of carboxylic acids

91.

POLYIMIDE RESIN PRECURSOR AND POLYIMIDE RESIN

      
Application Number JP2023018858
Publication Number 2023/234085
Status In Force
Filing Date 2023-05-22
Publication Date 2023-12-07
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Abiko Yohei
  • Ishii Kentaro
  • Muraya Takahiro

Abstract

Provided is a polyimide resin precursor comprising a repeating unit represented by general formula (1) below or a repeating unit represented by general formula (1) below and a repeating unit represented by general formula (2) below, wherein the total of the repeating unit represented by general formula (1) and the repeating unit represented by general formula (2) is 70 to 100 mol % inclusive based on all the repeating units of the polyimide resin precursor, and the ratio of the repeating unit represented by general formula (1) is 30 to 100 mol % based on the total of the repeating unit represented by general formula (1) and the repeating unit represented by general formula (2). This polyimide resin precursor has excellent heat resistance, and a polyimide resin having a low linear expansion coefficient as well as excellent elongation and mechanical strength can be obtained.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets

92.

RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYERED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL

      
Application Number 18181472
Status Pending
Filing Date 2023-03-09
First Publication Date 2023-11-30
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Ikeda, Kousuke
  • Yasuda, Yoshihiro
  • Katagiri, Masayuki

Abstract

Provided is a resin composition comprises a cyanate ester compound (A), an amine adduct compound (B) and a borate ester (C).

IPC Classes  ?

  • C08G 18/58 - Epoxy resins
  • C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

93.

LAMINATE

      
Application Number JP2023019409
Publication Number 2023/228986
Status In Force
Filing Date 2023-05-24
Publication Date 2023-11-30
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Abiko Yohei
  • Hatakeyama Takuro
  • Muraya Takahiro

Abstract

This laminate for manufacturing a TFT substrate comprises: a support base material made of glass; a first inorganic film laminated on the support base material; a polyimide resin laminated on the first inorganic film; and a second inorganic film laminated on the polyimide resin, wherein the polyimide resin has a structural unit represented by general formula (1) or a structural unit represented by general formula (2), and the glass transition temperature is 400°C or higher. (X1is a group having an alicyclic structure or an aromatic ring, Y1is a single bond and the like, R1and R2are methyl groups and the like, h and i are integers of 0-4, at least one of which is an integer of 1-4, and n is 0, 1, or 2.) (X2includes a tetravalent group represented by general formula (3), Y2 is a single bond and the like, and m is 0, 1, or 2.) (R is a methyl group and the like, p is 1-4, and k is 1 or 2.)

IPC Classes  ?

  • H10K 77/10 - Substrates, e.g. flexible substrates
  • B32B 17/00 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
  • G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
  • H05B 33/02 - Electroluminescent light sources - Details
  • H05B 33/14 - Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material
  • H10K 59/12 - Active-matrix OLED [AMOLED] displays

94.

EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, AND USE OF AMINE COMPOSITION

      
Application Number 18025280
Status Pending
Filing Date 2021-08-19
First Publication Date 2023-11-30
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kouno, Kazuki
  • Ikeuchi, Kousuke
  • Ohno, Yuma
  • Ota, Emi
  • Yokoo, Aoi

Abstract

Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 0.01 to 2.0 parts by mass, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent, wherein R1 represents an alkyl group having 1 to 6 carbon atoms, and p is a number of 1 to 3. Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 0.01 to 2.0 parts by mass, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent, wherein R1 represents an alkyl group having 1 to 6 carbon atoms, and p is a number of 1 to 3.

IPC Classes  ?

95.

RESIN COMPOSITION, CURED SUBSTANCE, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYER BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL

      
Application Number JP2023008298
Publication Number 2023/228509
Status In Force
Filing Date 2023-03-06
Publication Date 2023-11-30
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Ikeda Kousuke
  • Yasuda Yoshihiro
  • Katagiri Masayuki

Abstract

Provided are a resin composition having an excellent potential while maintaining excellent heat tolerance, as well as a cured substance, a sealing material, an adhesive, an insulating material, a coating material, a prepreg, a multilayer body, and a fiber-reinforced composite material. The resin composition contains a cyanic acid ester compound (A), an amine adduct compound (B), and boric acid ester (C).

IPC Classes  ?

  • C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
  • C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • C09D 7/63 - Additives non-macromolecular organic
  • C09D 179/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 179/00 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups

96.

COMPOSITION, AND OPTICAL MATERIAL AND LENS USING SAME

      
Application Number 18030847
Status Pending
Filing Date 2021-09-10
First Publication Date 2023-11-23
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Imagawa, Yousuke
  • Takemura, Kouhei
  • Sugihara, Ryosuke
  • Sado, Mariko

Abstract

A composition containing: a compound (a) represented by Formula (1): A composition containing: a compound (a) represented by Formula (1): A composition containing: a compound (a) represented by Formula (1): wherein Ar represents an aromatic ring, m represents an integer of 2 to 8, n represents an integer of 0 to 6, provided that m+n is equal to or less than a number of carbon atoms that constitute the aromatic ring, and R1 each independently represents an alkylthio group, an epoxyalkylthio group, a thiol group, a halogen group, a hydroxy group, a dialkylthiocarbamoyl group, or a dialkylcarbamoylthio group; and 1,2,3,5,6-pentathiepane (b).

IPC Classes  ?

  • C08G 18/38 - Low-molecular-weight compounds having hetero atoms other than oxygen
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
  • G02C 7/02 - Lenses; Lens systems

97.

FILAMENT, STRUCTURE, RESIN COMPOSITION, AND METHOD FOR PRODUCING FILAMENT

      
Application Number 18030463
Status Pending
Filing Date 2021-09-01
First Publication Date 2023-11-23
Owner Mitsubishi Gas Chemical Company, Inc. (Japan)
Inventor
  • Yamanaka, Masaki
  • Matsumoto, Nobuhiko

Abstract

Provided are: a filament containing a polyamide resin, the filament having a high strength and a high retention percentage of mechanical properties after water absorption; a structure; a resin composition; and a method for producing the filament. The filament includes a polyamide resin containing diamine-derived structural units and dicarboxylic acid-derived structural units. 70 mol % or more of the diamine-derived structural units are derived from xylylenediamine, and 70 mol % or more of the dicarboxylic acid-derived structural units are derived from α,ω-linear aliphatic dicarboxylic acid having from 11 to 14 carbons. The content of a compound with a molecular weight of 310 or more and 1000 or less is 0.1 mass % or more and 1.5 mass % or less, and the content of a compound with a molecular weight of less than 310 is 0.1 mass % or less.

IPC Classes  ?

  • D01F 6/60 - Monocomponent man-made filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products from polyamides
  • C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
  • D01F 8/12 - Conjugated, i.e. bi- or multicomponent, man-made filaments or the like; Manufacture thereof from synthetic polymers with at least one polyamide as constituent

98.

COMPOSITION FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND CLEANING METHOD

      
Application Number 18246531
Status Pending
Filing Date 2021-09-22
First Publication Date 2023-11-16
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Horie, Hiroaki
  • Horita, Akinobu
  • Hamanaka, Makoto
  • Shimada, Kenji
  • Kikunaga, Takahiro

Abstract

A cleaning composition for semiconductor substrates. The cleaning composition comprises hydrogen peroxide, a hydrogen peroxide stabilizing agent, an alkaline compound, and water. The hydrogen peroxide stabilizing agent is oxalic acid, diethylenetriaminepentaacetic acid, hydroxyethyliminodiacetic acid, potassium oxalate, 5-phenyl-1H-tetrazole, triethylenetetraminehexaacetic acid, trans-1,2-cyclohexanediaminetetraacetic acid, 8-quinolinol, L(+)-isoleucine, DL-valine, L(-)-proline, hydroxyethylethylenediaminetriacetic acid, N,N-di(2-hydroxyethyl)glycine, glycine, L-tryptophan, 2,6-pyridinedicarboxylic acid, benzothiazole, or DL-alanine. The alkaline compound is a quaternary ammonium hydroxide or potassium hydroxide.

IPC Classes  ?

  • C11D 3/04 - Water-soluble compounds
  • C11D 3/39 - Organic or inorganic per-compounds
  • C11D 3/30 - Amines; Substituted amines
  • C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents

99.

NOVEL LACTIC ACID BACTERIA, AND COMPOSITION, FOOD/DRINK ITEM, AND PHARMACEUTICAL ITEM CONTAINING LACTIC ACID BACTERIA

      
Application Number JP2023015823
Publication Number 2023/218898
Status In Force
Filing Date 2023-04-20
Publication Date 2023-11-16
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Sugimoto, Atsushi
  • Nakamura, Tomoe
  • Chihama, Ryota
  • Takenaka, Yuto
  • Sato, Yuuki

Abstract

The present invention provides: lactic acid bacteria that enhance IL-12p70 and IFN-λ production, thereby making it possible to increases resistance against infection by infectious microorganisms and viruses, relieve stress, and suppress excessive inflammatory response that causes symptoms to worsen; compositions such as a immunostimulation composition, a stress relief composition, and an inflammation suppression composition, containing said lactic acid bacteria; and food/drink and pharmaceutical items containing the compositions. Lactobacillus sakei strain MG-LAB279 (accession number: NITE BP-03645); compositions such as an immunostimulation composition, a stress relief composition, and an inflammation suppression composition containing, as an active ingredient, said strain or a bacterial cell component thereof; and food/drink and pharmaceutical items containing the compositions.

IPC Classes  ?

100.

OXYGEN ABSORBENT MATERIAL AND METHOD FOR STORING ARTICLE

      
Application Number JP2023016897
Publication Number 2023/219016
Status In Force
Filing Date 2023-04-28
Publication Date 2023-11-16
Owner MITSUBISHI GAS CHEMICAL COMPANY, INC. (Japan)
Inventor
  • Kobayashi Naoko
  • Kouno Kazuki
  • Nohira Itsuki

Abstract

The present invention provides: [1] an oxygen absorbent material which comprises a base material (I), an inorganic layer (II) and a cured product layer (III) of an epoxy resin composition that contains an epoxy resin and an epoxy resin curing agent containing an amine-based curing agent, wherein the inorganic layer (II) and the cured product layer (III) are adjacent to each other; and [2] a method for storing an article, the method comprising one or more modes that are selected from among (1) a mode in which the article is contained in a packaging material in which the oxygen absorbent material described in [1] is sealed and (2) a mode in which the article is contained in a packaging material that at least partially comprises the oxygen absorbent material described in [1], and the packaging material has an oxygen transmission rate of 1 cc/(m2∙day∙atm) or less.

IPC Classes  ?

  • B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
  • A23L 3/3526 - Organic compounds containing nitrogen
  1     2     3     ...     33        Next Page